Manufacturing method of LED display usable indoors and outdoors, with improved thickness, weight and brightness through PCB drilling step and LED element duplication
A dual LED structure with a sub-LED backup and through-holed substrate manufacturing addresses weight and brightness issues in LED displays, enhancing versatility and reducing power consumption.
Patent Information
- Application Number
- JP2024048709
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-07
- Filing Date
- 2024-03-25
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2044-03-25
AI Technical Summary
Conventional LED display modules face issues with increased weight due to thick printed circuit boards, difficulty in maintaining visibility with defective pixels, and limited versatility in applications such as drone transportation, necessitating improved manufacturing techniques for lightweight and bright LED displays.
A dual LED structure is implemented with a main LED and a sub-LED in each dot area, connected via a common terminal, allowing the sub-LED to operate as a backup in case of main LED failure, and the substrate is manufactured with through-holes to minimize weight and thickness using PCB drilling and laser etching processes.
The solution results in a lightweight, bright, and versatile LED display that maintains visibility and reduces power consumption, enabling applications like air transportation and outdoor use by minimizing the impact of defective pixels and reducing weight without compromising rigidity.
Smart Images

Figure 2025137302000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a manufacturing technology for a lightweight LED display substrate that has a dual LED structure in the same dot area and minimizes weight. Specifically, when a defective LED pixel occurs in the same dot area, a spare LED element is driven to maintain operating characteristics, and brightness is generally improved compared to the same power, minimizing the weight of the substrate and reducing power consumption. [Background technology]
[0002] In an LED display module, LED elements that are powered and driven are mounted on a board. The size of the board and the number of LED elements mounted are determined according to the size of the display, and each LED element displays a specific color based on the power supply and color signal input via a video control signal, thereby realizing the image of the LED display module.
[0003] An LED display module mounts LED elements on a circuit designed on a board, and after the LED elements are electrically connected to the board, the LEDs are driven by a control signal (voltage) given to the board, and the driving of the LED elements on the dots where each LED is installed is combined across the entire area to create a specific image.
[0004] The LED element mounted on the LED display module is a three-color LED package that embodies the three colors of RGB, and as shown in Patent Document 1, it consists of three RGB side terminals, one common terminal, and two spare terminals.
[0005] In the above environment, if the LED element of a particular dot is damaged during the LED operation, a defective pixel occurs, which reduces visibility and causes fatigue to the user.
[0006] As a solution to this problem, Patent Document 2 provides a technology that configures an LED element module that operates by applying dual RGB signals to a unit dot, and when one dot is damaged and stops working while both LEDs are driven simultaneously, it precisely controls the driving characteristics of both LEDs to minimize the decrease in visibility despite the dot being defective.
[0007] However, this technique has the problem that all RGB LEDs included in a unit dot must be controlled as a whole, which means that in order to minimize the decrease in visibility, the RGB signals constituting both LEDs of one dot must be controlled as a whole, which requires additional unnecessary control.
[0008] Meanwhile, conventional technologies including Patent Document 1 mount LEDs on a specific board, but in this case, the weight of the board increases depending on the size, which makes it difficult to apply to boards that output images while transporting an LED display using a drone or the like. [Prior art documents] [Patent documents]
[0009] [Patent Document 1] Korean Patent Registration No. 10-1484915 [Patent Document 2] Korean Patent Publication No. 10-2023-0127125 Summary of the Invention [Problem to be solved by the invention]
[0010] The present invention has been made to solve the above problems, and an object of the present invention is to provide a technology that, when a defective pixel occurs in one LED dot in the implementation of dot-by-dot dual LEDs, can eliminate problems in driving the dot area of the LED where the defective pixel occurs in a very simple manner.
[0011] Another object of the present invention is to provide a technology that can realize a mesh or perforated transparent LED by removing unnecessary portions of a substrate on which an LED is mounted, and also maximize the weight of the substrate, improve the brightness of the product, make it visible in both indoor and outdoor environments, and enable the LED display to be transported in the air, thereby maximizing its versatility. [Means for solving the problem]
[0012] To achieve the above object, an LED display that can be used indoors and outdoors and has improved thickness, weight, and brightness through a PCB drilling process and LED element duplication according to one embodiment of the present invention includes a substrate having a through-hole area in which a circuit for supplying power and control signals to LEDs installed in each dot area of the LED display is designed and a portion of the designed circuit pattern is removed; a main LED mounted in each dot area of the substrate; and a sub-LED installed in each dot area of the substrate in pair with the main LED, with at least one terminal of the main LED connected to another terminal of the main LED, so that the sub-LED is driven by the control signal applied to the main LED in the event of a driving failure of the main LED.
[0013] The substrate is manufactured through the following steps: a first step in which a circuit pattern printing step is carried out with a masking tape for printing a circuit pattern on the substrate in its initial form; a second step in which, after the first step is completed, the area where the masking tape is applied is recognized as a first area using a vision sensor, and a part of the recognized first area is determined to be a second area based on a predetermined penetration area setting standard; a third step in which the second area determined in the second step is removed using a laser etching device; and a fourth step in which the second area is penetrated by a post-processing step including at least a masking removal step, completing the manufacture of a substrate with a printed circuit pattern.
[0014] The substrate is manufactured through the following steps: a fifth step in which a circuit pattern printing step is carried out with a masking tape for printing a circuit pattern on the substrate in its initial form; a sixth step in which, after the first step is completed, the area where the masking is taped is recognized as a first area by a vision sensor, and a part of the recognized first area is determined as a second area based on a predetermined penetration area setting standard; a seventh step in which the second area determined in the second step is penetrated and removed using a penetration cutting device; and an eighth step in which the second area is penetrated by a post-processing step including at least a masking removal step, completing the manufacture of a substrate with a printed circuit pattern.
[0015] The through-area setting criterion is a criterion for determining a portion of the first area as the second area so that the second area is formed at a distance greater than a predetermined first critical distance from the circuit pattern, the mutual spacing between the first areas is greater than a predetermined second critical distance, and the difference in weight between both sides, centered at least on a line on the substrate plane passing through the center of the substrate, is less than a predetermined first critical percentage.
[0016] The main LED and the sub LED are three-color chip LED elements, and the main LED and the backup common terminal of the sub LED are connected to each other, so that even if the driving of the main LED is interrupted, the sub LED operates in the same manner as the normal operating state of the main LED by the voltage applied to the RGB3 terminal and the voltage bypassed from the main LED through the backup common terminal of the main LED.
[0017] The main LED and the sub LED are three-color chip LED elements, and the sub LED normally operates in the same manner as the main LED by connecting the main LED, a backup common terminal, and a main common terminal to each other. Even if the driving of the main LED is interrupted, the sub LED operates in the same manner as the normal operating state of the main LED by the voltage applied to the RGB3 terminal and the voltage bypassed from the main LED through the backup common terminal.
[0018] The LED driver further includes a signal sending unit that detects a voltage bypassed through a backup common terminal of the main LED and sends a notification signal to a control terminal when it detects that the main LED is stopped being driven.
[0019] The LED further includes a switching circuit connected between a main common terminal of the sub-LED and a signal application line that applies a voltage to the main common terminal of the main LED, and that uses the voltage applied from the backup common terminal of the main LED as a switching condition. When the driving of the main LED is stopped and the switching circuit is activated by the voltage bypassed from the main LED through the backup common terminal of the main LED, the signal application line and the main common terminal of the sub-LED are connected, so that the sub-LED operates in the same manner as the main LED in its normal operating state.
[0020] The LED driver further includes a signal sending unit that detects a voltage bypassed by a backup common terminal of the main LED and sends a notification signal to a control terminal when it detects that the main LED is stopped being driven. [Effects of the Invention]
[0021] According to the present invention, in an LED display substrate using three-color LEDs, a main LED and a sub-LED are provided in each dot area, and an LED display substrate is manufactured by removing areas of the substrate other than the area where the circuit pattern is formed according to a predetermined circuit pattern, to the extent that the rigidity of the substrate and the circuit pattern are not damaged.
[0022] Conventionally, thick printed circuit boards have been used in double-sided printing of circuits, but according to the present invention, the thickness of the printed circuit board is minimized to realize the printed circuit. As a result, it is possible to manufacture a board that is as lightweight as possible while maintaining the rigidity and circuit characteristics of the board, and therefore it is possible to maximize the range of uses due to the light weight, such as transporting the LED display board in the air or attaching it to a wall.
[0023] In addition, while implementing a dual LED structure by implementing a main LED and a sub LED for each dot area, the LED driving characteristics of the main common voltage and backup common voltage for controlling the six terminals are used to simply connect the main LED and the sub LED, or a very simple switching circuit is used to operate the sub LED with the same operating characteristics as the main LED while consuming minimal power energy even if the main LED fails, minimizing the possibility of defective pixels occurring.
[0024] In addition, by connecting the common terminal of the main LED and sub LED, the brightness of each dot area can be made very bright relative to the power consumption, significantly reducing power consumption compared to conventional LED displays and significantly increasing output efficiency. Even in the event of a malfunction, the brightness only decreases to a slightly dim level, allowing the operating characteristics of conventional LEDs to be maintained to a large extent. [Brief explanation of the drawings]
[0025] [Figure 1] FIG. 1 is a partial side perspective view of a substrate illustrating a PCB drilling process according to an embodiment of the present invention and the structure of an LED display that can be used indoors and outdoors and has improved thickness, weight, and brightness due to dual LED elements. [Figure 2] FIG. 2 is a partial plan view of a substrate for explaining an example of the second region of the present invention. [Figure 3] FIG. 3 is a partial plan view of a substrate for explaining an example of the second region of the present invention. [Figure 4] FIG. 4 is a diagram illustrating the structure and function of the main LED and the sub-LED according to each embodiment of the present invention. [Figure 5] FIG. 5 is a diagram illustrating the structure and function of the main LED and the sub-LED according to each embodiment of the present invention. [Figure 6] FIG. 6 is a partial cross-sectional side view of a substrate for explaining a manufacturing process of a substrate according to each embodiment of the present invention. [Figure 7]FIG. 7 is a diagram for explaining an example in which LEDs are mounted on a substrate manufactured according to each embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0026] Various embodiments and / or aspects are described below with reference to the drawings. In the following description, for purposes of explanation, numerous specific details are set forth in order to facilitate a general understanding of one or more aspects. However, those skilled in the art will recognize that these aspects may be practiced without such specific details. The following description and the accompanying drawings set forth certain exemplary aspects of one or more aspects in detail. However, such aspects are illustrative, and only a portion of various methods may be utilized in accordance with the principles of the various aspects, and the description is intended to include all such aspects and their equivalents.
[0027] As used herein, "embodiments," "examples," "aspects," "exemplary," and the like may not be construed as constituting any described aspect or design as being better or advantageous over other aspects or designs.
[0028] Additionally, the terms "comprise" and / or "comprising" should be understood to mean that the feature and / or component is present, but not to exclude the presence or addition of one or more other features, components and / or groups thereof.
[0029] Furthermore, terms including ordinal numbers, such as "first," "second," etc., are used to describe various components, but the components are not limited by these terms. These terms are used only to distinguish one component from another. For example, a first component can be referred to as a "second component," and similarly, a second component can be referred to as a "first component," without departing from the scope of the present invention. The term "and / or" includes a combination of multiple related listed items or any of multiple related listed items.
[0030] Furthermore, in the embodiments of the present invention, unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted as idealized or overly formal unless explicitly defined in the embodiments of the present invention.
[0031] Meanwhile, in the following description, the matters depicted in the drawings are shown with some components omitted or enlarged or reduced in size in order to explain the function of each component of the present invention, but it will be understood that the illustrated matters do not limit the technical features and scope of the present invention.
[0032] In the following description, multiple drawings will be simultaneously referenced to explain one technical feature or component of the invention.
[0033] FIG. 1 is a partial side perspective view of a substrate to explain the structure of an LED display that can be used indoors and outdoors, which has improved thickness, weight, and brightness due to the PCB drilling process and doubling of LED elements according to one embodiment of the present invention; FIGS. 2 and 3 are partial plan views of a substrate to explain an example of the second region of the present invention; FIGS. 4 and 5 are structural diagrams to explain the structure and function of the main LED and sub LED according to each embodiment of the present invention; FIG. 6 is a partial side cross-sectional view of a substrate to explain the manufacturing process of a substrate according to each embodiment of the present invention; and FIG. 7 is a diagram to explain an example of LEDs mounted on a substrate manufactured according to each embodiment of the present invention.
[0034] In the following description, one or more of the drawings mentioned above will be jointly referenced to explain the technical features of various embodiments and detailed technical elements of the present invention.
[0035] In addition, in the following description, the specific parts are descriptions of the core essential components in each embodiment of the present invention, and other descriptions of the basic specifications, general function execution and features of LED displays and 3-color 6-terminal type LED elements, etc., are well-known technologies and may be omitted.
[0036] Referring to the drawings, first, as shown in FIG. 1, an LED display that can be used indoors and outdoors and has improved thickness, weight, and brightness through a PCB drilling process and LED element duplication according to one embodiment of the present invention includes a substrate 10, a main LED 20, and a sub LED 30.
[0037] 2 and 7, the substrate 10 refers to a circuit board such as a PCB having a through-hole area (A) formed by removing a portion of the designed circuit pattern 100, with a circuit 100 designed to provide power and control signals to LEDs installed in each dot area of the LED display. The circuit patterns 100 define dot areas (areas marked with dotted lines) described below, and the main LEDs 20 and sub LEDs 30, which are electrically and mechanically connected by a soldering process, are installed in the designated installation areas, thereby functioning as an LED display substrate. For this purpose, the substrate 10 is formed with external power connection terminals, signal input terminals, and status information output terminals, and a power supply device and a processor (control terminal) that provide power and control signals for driving the LED display substrate are connected to the external power connection terminals and each input terminal.
[0038] The through region (A) is set as a region where a circuit pattern is not printed and which may be removed to reduce weight without affecting the rigidity of the substrate 10. The through region (A) is processed so that a large number of the through regions (A) are formed continuously or discontinuously in various shapes using the circuit pattern or the like, as shown in Figures 2 and 6.
[0039] In particular, in the present invention, while conventional printed circuit boards use a thick printed circuit board when printing circuits on both sides, the board 10 according to each embodiment of the present invention is characterized by minimizing the thickness of the printed circuit board and implementing the printed circuit by minimizing the thickness of the printed circuit board.
[0040] The processing steps for such a substrate 10 can be embodied as follows: As shown in Fig. 6, in the first embodiment, for example, after the step of preparing the substrate (S10) is completed, a masking 200 for printing a circuit pattern is taped onto the substrate in its initial form (S20), and in this state, a first step (S30) of printing a circuit pattern 300 is performed.
[0041] For example, the printed circuit board is manufactured by masking the area except for the area where the circuit pattern 300 is to be printed, and then performing a sputtering process or the like on the top surface of the area where the masking is taped to coat and harden a conductive material, thereby forming a circuit on the pattern except for the area where the masking is taped.
[0042] Here, after the masking formation process is performed, a process such as etching can be performed on the area where the circuit pattern 300 is to be printed, so that the masking is taped off except for the area where the circuit pattern 300 is to be printed.
[0043] Alternatively, a material to which a conductive object can be fixed can be applied to the pattern on which the circuit is to be printed without being masked, and then sputtering or the like can be performed to form a conductive material on the circuit pattern 300, thereby completing the circuit pattern 300.
[0044] Thereafter, with the first step (S30) completed, the area where the masking is taped is recognized as the first area by a vision sensor, and a second step (S40) is carried out in which a part of the recognized first area is determined as the second area 400 based on a predetermined penetration area setting criterion.
[0045] In the present invention, the circuit pattern 300 differs from that shown in the drawings in that the main LEDs 20 and sub-LEDs 30 installed in each dot region are installed on the substrate 10 in the same shape, and power supply and signal control can be performed for each dot region by column, row, or grid region, and it is preferable that the circuit pattern 300 is printed in a relatively regular and uniform pattern, for example, as shown in Fig. 3. However, depending on the design pattern of the substrate 10, the circuit pattern 300 may vary, and the through region (A) removed from the substrate 10 may be set irregularly depending on the required rigidity of the substrate 10 and, in particular, the point where a load is applied.
[0046] Therefore, in step S40, the through-area setting criteria are stored in advance as the criteria for determining the second area 400, i.e., the area to be removed from the substrate 10 as described above, and after the vision sensor detects the first area where the circuit pattern 300 is not printed as a result of recognition, only the area of the first area that meets the through-area setting criteria is determined as the second area 400 and the final removal area.
[0047] In the present invention, the vision sensor for recognizing the first area refers to a sensor that captures images of planar areas of the substrate 10 and recognizes the masking taping area among them based on color, reflectivity, etc. In step S40, if information about the circuit pattern 300 is previously stored in a terminal (preferably the control terminal, etc.) that performs the process for setting the second area in addition to the detection by the vision sensor, the first area can be automatically calculated and stored using the circuit pattern design data without recognition by the vision sensor, and the second area 400 can be pre-designed based on this.
[0048] In the present invention, the above-mentioned through region setting criteria refers to a criterion for determining a part of the first region as the second region, for example, so that the first region is formed beyond a predetermined first critical distance from the circuit pattern 300, the mutual spacing between the first regions exceeds a predetermined second critical distance, and the weight difference between both sides of at least a line on the substrate plane passing through the center of the substrate is less than a predetermined first critical percentage.
[0049] The first critical distance is determined based on removal precision and is a distance that does not damage or electrically affect the circuit pattern 300, and is set differently depending on the thickness and complexity of the circuit pattern 300. The second critical distance is set differently to a limit that does not cause damage to a narrow area depending on the strength (hardness) of the substrate 10, the load applied to the substrate 10, etc. The distance less than the first critical percentage is, for example, a percentage that is nearly symmetrical on both sides of the center point of the substrate 10 as described above, and does not cause bias when suspended in the air due to its weight, and is set to, for example, 5%.
[0050] After the S40 step is completed, a third step (S50) is performed in which the determined second region 400 is removed using a laser etching device to form a through-hole region 500, and a fourth step (S60) is performed in which a post-processing step including at least a masking removal step is performed to form a through-hole region 500 through which the second region penetrates, thereby completing the manufacture of the substrate 10 on which the circuit pattern 300 is printed, thereby completing the manufacture of the substrate 10 in a state in which an LED can be installed.
[0051] In the present invention, the fourth step (S60) specifically implements an embodiment in which, after the masking is removed, a transparent resin is dispensed onto the penetration area 500 to provide waterproofing, and then the resin penetrates the penetration area 500 in the same manner as the predetermined penetration area 500, thereby ensuring waterproofing. This is particularly effective in implementing a product for an electronic signboard to be installed outdoors, and can also be understood as an embodiment that can be effectively applied to implementing a product for an electronic signboard to be installed indoors where humidity is high, such as in a swimming pool or sauna.
[0052] It will be understood that the explanations regarding the above embodiment apply not only to step S50 but also to the seventh step described below, or are commonly applicable to the manufacturing process related to the through-hole region referred to in the present invention.
[0053] The laser etching apparatus can produce perforated regions on the substrate 10 using laser machining techniques with great precision.
[0054] Meanwhile, a second embodiment is included which is different from the first embodiment in that step S50 is implemented differently while performing the same steps as the above embodiment.
[0055] That is, once the step of preparing the substrate (S10) is completed, a masking 200 for printing a circuit pattern is taped onto the substrate in its initial form (S20), and in this state, the fifth step is carried out in which the circuit pattern 300 is printed.
[0056] When the fifth step is completed, as described above, the vision sensor recognizes the area where the masking is taped as the first area, and then a sixth step is performed in which a part of the recognized first area is determined as the second area 400 based on a predetermined penetration area setting criterion. In performing the sixth step, the penetration area setting criterion described above can be similarly applied to the second embodiment.
[0057] Once the sixth step is completed, in the second embodiment, unlike the first embodiment, a seventh step (S50) is carried out in which a through-cutting tool is used to perform through-cutting to form a through-hole region 500, and an eighth step is carried out in which a post-processing step including at least a masking removal step is carried out to form a through-hole region 500 through which the second region is penetrated, thereby completing the manufacture of a substrate 10 on which a circuit pattern 300 is printed, thereby completing the manufacture of the substrate 10 in a state in which an LED can be installed.
[0058] The through-cutting equipment includes, for example, equipment used to precisely cut samples (piezoelectric elements, polymers, acoustic stacks, etc.) using a dicing saw with a thickness in the micrometer range, and includes all equipment that can physically cut the work area, excluding laser cutters, such as ultrasonic cutters.
[0059] As described above, the main LED 20 and the sub LED 30 are mounted on the substrate 10 manufactured in this manner. As shown in Fig. 1 and other figures, the main LED and the sub LED are mounted in pairs based on the area where each dot is formed (the dotted line area in Fig. 1 and other figures) in the LED display device, and are operated in response to a control signal to emit light having a predetermined illuminance, saturation, and brightness.
[0060] As described above, as shown in Figures 1, 3 and 4, the main LED 20 is mounted (placed) in each dot area of the substrate 10, and the sub-LED 30 is placed in each dot area of the substrate 10 in pairs with the main LED 20. At least one terminal 24 and one terminal 34 of the main LED 20 are connected, so that when the main LED 20 fails to operate, a control signal is applied to the main LED 20 to drive it.
[0061] Specifically, when a defective pixel occurs due to a driving failure of the main LED 20, a control signal is transmitted or applied to the main LED 20, and the main LED 20 is controlled to operate in the same manner as its original operation, i.e., to emit light having a predetermined illuminance, saturation, and brightness.
[0062] In the present invention, the LEDs 20 and 30 are configured as a three-chip SMD LED in which RGB that realizes three colors is included in one LED 20 and 30, and the size is set variously according to the resolution, such as 5050, 5450, etc.
[0063] The LED is configured to have a total of six terminals, and the terminals are electrically or mechanically connected to the circuit pattern by, for example, connecting terminals 21, 31 to connecting regions 23, 33 of the circuit pattern by connecting lines 22, 32 with solder or wire, as shown in FIG.
[0064] In a 3-chip SMD LED, for example, each anode of the three RGB chips forms a separate terminal 1, 2, 3, and the common cathode forms terminal 4, 5, 6, or vice versa (i.e., separate cathode and common anode configuration), where the shared terminals 4, 5, 6 are composed of a main shared terminal and a backup shared terminal. In this case, each RGB color is driven by a voltage applied to terminals 1, 2, 3, 4 to emit a specific color. If the LED element does not emit light due to damage, the control signal is bypassed through the backup shared terminal.
[0065] In the above-described embodiment, for example, as shown in FIG. 1, when the main LED 20 and the sub LED 30 are implemented as three-color chip six-terminal LED elements as described above, the driving of the sub LED 30 is controlled as follows.
[0066] First, in one embodiment, the sub LED 30 is connected to the main LED 20 through the backup common terminals 25 and 35, so that even if the driving of the main LED 20 is interrupted (F), the sub LED 30 can operate in the same manner as the main LED 20 is operating normally, as the voltage applied to the RGB3 terminal and the voltage bypassed from the main LED through the backup common terminal 25 of the main LED 20, i.e., the control signal (D), are applied to the backup common terminal 35 of the sub LED 30.
[0067] Alternatively, the backup common terminal 25 of the main LED 20 can be connected to the main common terminal of the sub-LED 30, and the control signal (voltage) bypassed from the backup common terminal 25 of the main LED 20 can be directly given as a control signal to the main common terminal of the sub-LED 30 to drive it.
[0068] The above embodiment refers to an embodiment in which only the main LED 20 operates when one dot is normally driven, and when the main LED 20 fails, only the sub-LED 30 is driven.
[0069] Alternatively, in another embodiment as shown in FIG. 4(a), the sub-LED 30 is connected to the main LED 20 via the backup common terminals 25 and 35 and the main common terminals 24 and 34, and normally operates in the same manner as the main LED 20. Even if the driving of the main LED 20 is interrupted, the sub-LED 30 continues to operate in the same manner as the main LED 20 in its normal operating state due to the voltage applied to the RGB3 terminal and the voltage bypassed from the main LED 20 via the backup common terminal 24.
[0070] This is an embodiment in which, during normal operation, the main LED 20 and the sub-LED 30 are driven simultaneously, and when the main LED 20 fails, only the sub-LED 30 is driven, thereby preventing the occurrence of defective pixels, even though the brightness is reduced.
[0071] 4(b) shows an embodiment implemented as a three-color chip four-terminal LED element. That is, although the above description has been based on an embodiment implemented as a three-color chip six-terminal LED element, a four-terminal LED element can also be used depending on the LED element specifications.
[0072] In this case, the sub LED 30 is connected to the main LED 20 through the backup common terminals 25-1 and 35-1, and normally operates in the same manner as the main LED 20. Even if the driving of the main LED 20 is interrupted, the sub LED 30 can be implemented to operate in the same manner as the normal operating state of the main LED 20 through the voltage applied to the RGB3 terminal and the voltage bypassed from the main LED 20 through the backup common terminal 24-1.
[0073] When the common terminals 24, 34 of the main LED 20 and the sub LED 30 are connected in this manner, the brightness of each dot area becomes brighter in comparison with the conventional technology, the power consumption is significantly reduced compared with the conventional LED, and the output efficiency is significantly increased. Even in the event of a malfunction, the brightness decreases only slightly, so that the operating characteristics of the conventional LED can be maintained.
[0074] In this embodiment, bypassing the control signal through the backup common terminal of the main LED 20 means that the driving of the main LED 20 is interrupted, as described above, and when this is detected, a malfunction of the main LED 20 can be detected.
[0075] In view of this, an LED display board according to another embodiment of the present invention further includes a signal sending unit (not shown) that detects the voltage bypassed through the backup common terminal 25 of the main LED 20 and sends a notification signal to the control terminal when it detects that the driving of the main LED 20 has been interrupted.
[0076] According to this, the control terminal installed in the LED display module can immediately determine whether or not a defect is detected among the LEDs controlled by the control terminal, and when the control terminal transmits the corresponding signal to a remote control terminal, an error due to an LED defect can be immediately dealt with.
[0077] Meanwhile, an LED display board according to another embodiment of the present invention as shown in FIG. 5 is implemented in the same manner as the above embodiment, but further includes a switching circuit 50.
[0078] As shown in FIG. 5, the switching circuit is connected between a signal application line that applies a voltage from a control point 40 to the main common terminal 34 of the sub LED 30 and the main common terminal 24 of the main LED 20, and is a circuit that is driven under switching conditions by a voltage applied from a backup common terminal 25 of the main LED 20, and can be implemented using elements such as BJTs or MOSFETs.
[0079] In this case, the driving of the main LED 20 is interrupted (F), and the switching circuit 50 is activated by the voltage (D1) bypassed from the main LED 20 through the backup common terminal 25 of the main LED 20, thereby connecting the signal application line to the main common terminal 34 of the sub LED 30, and the control signal voltage (D2) transmitted from the signal application line is applied to the main common terminal 34 of the sub LED 30, making it possible to operate the main LED 20 in the same way as in its normal operating state.
[0080] Here, similar to the above-described embodiment, the LED display board according to another embodiment of the present invention further includes a signal sending unit (not shown) that detects the voltage bypassed through the backup common terminal 25 of the main LED 20 and sends a notification signal to the control terminal when it detects that the driving of the main LED 20 has been interrupted.
[0081] According to this embodiment, it is possible to manufacture a substrate that is as lightweight as possible while maintaining the rigidity and circuit characteristics of the substrate, thereby maximizing the range of uses due to the light weight, such as transporting the LED display substrate in the air or attaching it to a wall.
[0082] In addition, by using the LED driving characteristics of the main common voltage and backup common voltage for controlling the 6th terminal, which is the connection point in a 3-chip SMD LED element, the main LED and sub LED can be easily connected, or a very simple switching circuit can be used to operate the sub LED with the same operating characteristics as the main LED while consuming minimal power energy, even if the main LED fails, minimizing the possibility of defective pixels occurring.
[0083] Although the embodiments have been described above using limited examples and drawings, those skilled in the art will understand that various modifications and variations are possible from the above description. The terms "comprise," "constitute," or "have" used above mean that elements not specifically described to the contrary may be present, and should be interpreted as including other elements, not excluding other elements. The scope of protection of the present invention should be interpreted based on the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.
Claims
1. a substrate having a through-hole region in which a circuit for supplying power and control signals to LEDs disposed in each dot region of the LED display is designed, and a portion of the designed circuit pattern is removed; a main LED mounted in each dot area of the substrate; The LED display, which can be used indoors and outdoors and has improved thickness, weight, and brightness due to the PCB drilling process and LED element duplication, is manufactured using a lightweight processing process, and includes a sub-LED that is installed in pairs with the main LED in each dot area of the substrate, and is driven by applying a control signal given to the main LED in the event of a driving failure of the main LED by connecting at least one terminal of the main LED to another terminal of the main LED.
2. The substrate is a first step in which a circuit pattern printing step is carried out in a state in which a masking tape for printing a circuit pattern is attached to an initial form of a substrate; a second step of recognizing the area where the masking is taped as a first area by a vision sensor after the first step is completed, and determining a part of the recognized first area as a second area based on a predetermined penetration area setting criterion; a third step of removing the second region determined by the second step using a laser etching device; 10. The LED display according to claim 1, which can be used indoors and outdoors and has improved thickness, weight, and brightness due to the PCB drilling process and the doubling of LED elements, and is manufactured by a fourth process in which the second region is perforated through a post-processing process including at least a masking removal process and a circuit pattern is printed on the substrate to complete the manufacturing process.
3. The substrate is a fifth step in which a circuit pattern printing step is carried out in a state in which a masking tape for printing a circuit pattern is attached to the substrate in an initial form; a sixth step of recognizing the area where the masking is taped as a first area by a vision sensor after the first step is completed, and determining a part of the recognized first area as a second area based on a predetermined penetration area setting criterion; a seventh step of penetrating and removing the second region determined by the second step using a penetrating cutting tool; and an eighth process of completing the substrate manufacturing process by perforating the second region and printing a circuit pattern through a post-processing step including at least a masking removal step. The LED display according to claim 1, characterized in that the thickness, weight, and brightness are improved by the PCB drilling process and the doubling of the LED elements, and that can be used indoors and outdoors.
4. the through-area setting criterion is a criterion for determining a part of the first area as the second area such that the second area is formed at a distance exceeding a predetermined first critical distance from the circuit pattern, the mutual interval between the first areas exceeds a predetermined second critical distance, and a difference in weight between both sides of a line on the substrate plane that passes through at least the center of the substrate is less than a predetermined first critical ratio; The fourth process is characterized in that after waterproofing by discharging a transparent resin, the transparent resin penetrates the same area as the predetermined penetration area to ensure waterproofing. This is an LED display that can be used indoors and outdoors and has improved thickness, weight, and brightness due to the PCB drilling process and doubling of LED elements as described in claim 2 or 3.
5. the main LED and the sub-LED are three-color chip LED elements, The sub-LED is The main LED, the backup common terminal, and the main common terminal are connected to each other, 2. An LED display that can be used indoors and outdoors and has improved thickness, weight, and brightness due to the PCB drilling process and LED element duplication as set forth in claim 1, wherein the LED normally operates in the same manner as the main LED to supplement brightness, and even if the driving of the main LED is interrupted, the LED operates in the same manner as the normal operating state of the main LED by the voltage applied to the RGB3 terminal and the voltage bypassed from the main LED through the backup common terminal.
6. The main LED and the sub LED are three-color chip LED elements, The sub-LED is The main LED and the backup common terminal are connected to each other, 2. An LED display that can be used indoors and outdoors and has improved thickness, weight, and brightness due to the PCB drilling process and LED element duplication as set forth in claim 1, wherein even if the driving of the main LED is interrupted, the main LED continues to operate in the same manner as in a normal operating state due to the voltage applied to the RGB3 terminal and the voltage bypassed from the main LED through the backup common terminal of the main LED.
7. 7. The LED display according to claim 5, further comprising a signal sending unit that detects a voltage bypassed through the backup common terminal of the main LED and sends a notification signal to a control terminal when it detects that the main LED is stopped from being driven.
8. further comprising a switching circuit connected between a signal application line for applying a voltage to the main common terminal of the sub LED and the main common terminal of the main LED, and setting a voltage applied from the backup common terminal of the main LED as a switching condition; When the driving of the main LED is interrupted, the backup common terminal of the main LED is 2. An LED display that can be used indoors and outdoors, with improved thickness, weight, and brightness achieved by the PCB drilling process and LED element duplication as set forth in claim 1, wherein the signal application line and the main common terminal of the sub-LED are connected as the switching circuit is operated by the voltage bypassed from the main LED, so that the sub-LED operates in the same manner as the main LED in a normal operating state.
9. 10. The LED display according to claim 8, further comprising a signal sending unit that detects a voltage bypassed by a backup common terminal of the main LED and sends a notification signal to a control terminal when it detects that the main LED is stopped.
Citation Information
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