Semiconductor manufacturing device, inspection device, and semiconductor device manufacturing method

Abstract

To provide a technique capable of reducing the influence of mutual interference of illumination light.SOLUTION: A semiconductor manufacturing device includes an optical system including at least a first optical system having a first camera and a first illumination system, and a second optical system having a second camera and a second illumination system, and a control device configured to, for image processing, when the first optical system acquires a reference image of a reference member, photograph the reference member with the first camera for each illumination state of the second illumination system, acquire and register the reference image.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and is applicable to, for example, a die bonder equipped with multiple optical systems. [Background technology]

[0002] As one step in the manufacturing process of a semiconductor device, a semiconductor manufacturing device (e.g., a die bonder) picks up dies separated from a wafer and bonds the picked-up dies to a substrate. An optical system may be provided in each of the wafer supply unit, preform unit, and bonding unit of the die bonder (e.g., JP 2017-147258 A). Here, the optical system includes an imaging device having a camera and a lens, and an illumination device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-147258 Summary of the Invention [Problem to be solved by the invention]

[0004] The illumination light from the illumination devices in the optical systems of the various parts may interfere with each other.

[0005] The present disclosure aims to provide a technique capable of reducing the influence of mutual interference of illumination light. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] A brief summary of representative aspects of this disclosure is as follows. That is, the semiconductor manufacturing apparatus comprises an optical system including at least a first optical system having a first camera and a first illumination system, and a second optical system having a second camera and a second illumination system, and a control device configured to, for image processing, when the first optical system acquires a reference image of a reference member, photograph the reference member with the first camera for each illumination state of the second illumination system, acquire and register the reference image. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to reduce the influence of mutual interference of illumination light. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a top view showing an outline of a die bonder according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in FIG. [Figure 3] FIG. 3 is a side view showing an outline of the preform part shown in FIG. [Figure 4] FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 5] FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 6] FIG. 6 is a diagram illustrating an example of interference light from a bonding illumination system in a preform optical system. [Figure 7] FIG. 7 is a diagram illustrating an example of interference light from a preform illumination system in a bonding optical system. [Figure 8] FIG. 8 is a flow diagram illustrating the model image registration during teaching in this embodiment. [Figure 9] FIG. 9 is a flowchart illustrating model matching during production in this embodiment. [Figure 10] FIG. 10 is a flow diagram for explaining registration of an image for differential inspection during teaching in this embodiment. [Figure 11] FIG. 11 is a flow chart for explaining the differential processing during production in this embodiment. [Figure 12] FIG. 12 is a flow diagram illustrating difference processing using images acquired during production in this embodiment. [Figure 13] FIG. 13 is a flow chart illustrating a continuation of the flow chart shown in FIG. [Figure 14] FIG. 14 is a flowchart illustrating the model image registration during teaching in the modified example. [Figure 15] FIG. 15 is a flowchart illustrating model matching during production in the modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. However, in the following description, the same components will be given the same reference numerals, and repeated description may be omitted. Note that, to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present disclosure.

[0010] The configuration of a die bonder as one aspect of semiconductor manufacturing equipment will be described with reference to Figures 1 and 2. Figure 1 is a top view showing an outline of the die bonder in an embodiment. Figure 2 is a diagram illustrating the outline of the configuration as seen from the direction of arrow A in Figure 1.

[0011] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a preform unit 90, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (controller) 80. The Y2-Y1 direction is the front-to-rear direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-to-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0012] The wafer supply unit 10 includes a wafer cassette lifter 11 , a wafer holder 12 , and a peeling unit 13 .

[0013] A wafer cassette lifter 11 moves a wafer cassette (not shown) storing multiple wafer rings WR up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0014] A wafer W is adhered (attached) to a dicing tape DT, and the wafer W is divided into a plurality of dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D are semiconductor chips, glass chips, or MEMS (Micro Electro Mechanical Systems).

[0015] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by an XY table and a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the Z1-Z2 directions by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0016] The pickup unit 20 has a pickup head 21, a Y drive unit 23, and a wafer recognition camera 24. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 has various drive units (not shown) that raise and lower the pickup head 21, rotate it, and move it in the X1-X2 direction. The wafer recognition camera 24 determines the pickup position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0017] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes that suck the placed die D. The placed die D is temporarily held on the intermediate stage 31.

[0018] The preform unit 90 has a preform head 91, a drive unit 93, a preform camera 94 as an imaging device, and a preform stage 96. The preform head 91 is composed of a syringe 92 with a nozzle. The syringe 92 stores a resin paste (hereinafter simply referred to as "paste") as an adhesive, and the paste is discharged from the nozzle. The preform head 91 applies the paste to a substrate S that has been transported to the preform stage 96 by the transport unit 50. The drive unit 93 moves the preform head 91 in the X1-X2 direction, the Y1-Y2 direction, and the Z1-Z2 direction. The substrate S is, for example, a wiring board, a lead frame formed from a thin metal plate, a glass substrate, etc.

[0019] The preform camera 94 uses the preform head 91 to confirm the surface to which the paste is to be applied and grasps the application position. The preform stage 96 rises when applying the paste to the substrate S and supports the substrate S from below. The preform stage 96 has suction holes (not shown) for vacuum-adsorbing the substrate S, making it possible to fix the substrate S in place.

[0020] The bonding unit 40 includes a bond head 41, a Y-axis drive unit 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds a die D at its tip. The Y-axis drive unit 43 moves the bond head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) in a package area P of the substrate S to determine the bond position. The substrate S has multiple product areas (hereinafter referred to as package areas P) that will ultimately become a single package. A position recognition mark is provided for each package area P. The bond stage 46 is raised when the die D is placed on the substrate S and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-suctioning the substrate S, allowing the substrate S to be fixed in place. The bond stage 46 also has a heating unit (not shown) for heating the substrate S. The bonding section 40 has driving sections (not shown) for raising and lowering the bond head 41, rotating it, and moving it in the X1-X2 direction and the Y1-Y2 direction.

[0021] With this configuration, the bond head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, based on the imaging data of the substrate recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the package area P of the transported substrate S, to which paste has been applied.

[0022] The transport unit 50 has transport claws 51 that grip and transport the substrate S, and a pair of transport lanes (chutes) 52 along which the substrate S moves. The substrate S moves in the X1-X2 direction by driving a nut (not shown) of the transport claws 51 provided on the transport lane 52 by a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading unit 70 and hands the substrate S over to the substrate unloading unit 70.

[0023] The substrate supply unit 60 removes the substrate S, which has been stored in a transport jig and carried in, from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 stores the substrate S, which has been carried in by the transport unit 50, in the transport jig.

[0024] The control system of the die bonder 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing a schematic configuration of the control system of the die bonder shown in Fig. 1.

[0025] The control system 8 comprises a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 broadly comprises a control and arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 comprises a main storage unit 82a and an auxiliary storage unit 82b. The main storage unit 82a is composed of RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage unit 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, and the like required for control.

[0026] The input / output device 83 includes a monitor 83a that displays the device status and information of the die bonder 1, a touch panel 83b that inputs operator instructions, a pointing device such as a mouse 83c that operates the monitor 83a, and an image capture device 83d that captures image data from an optical system 88. The input / output device 83 also includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls a drive unit 86, such as the XY table of the wafer supply unit 10 and the XYZ drive axes of the bond head table of the bonding unit 40. The I / O signal control device 83f receives signals from and controls a signal unit 87. The signal unit 87 includes various sensors, switches and volumes that control the brightness of lighting devices, etc. The control / arithmetic unit 81 receives and calculates necessary data via a bus line 84, controls the pickup head 21, etc., and sends information to the monitor 83a, etc.

[0027] The control and arithmetic unit 81 stores image data captured by the optical system 88 in the storage device 82 via the image capture device 83d. The optical system 88 includes the wafer recognition camera 24, the stage recognition camera 34, the substrate recognition camera 44, the preform camera 94, and an illumination device. The cameras used in the optical system 88 digitize light intensity and color. Using software programmed based on the stored image data, the control and arithmetic unit 81 positions the die D and the substrate S, inspects the paste application pattern, and inspects the surfaces of the die D and the substrate S. Based on the calculated positions of the die D and the substrate S, the control and arithmetic unit 81 drives the driver 86 via the motor control device 83e using software. Through this process, the control and arithmetic unit 81 positions the die D on the wafer holder 12 and the intermediate stage 31, and the substrate S on the preform stage 96 and the bond stage 46, and operates the drivers of the wafer supply unit 10, the pickup unit 20, and the bonding unit 40 to bond the die D onto the package area P of the substrate S.

[0028] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0029] (Wafer loading: process S1) A wafer cassette containing wafer rings WR is loaded into wafer cassette lifter 11. Wafer rings WR are supplied (carried in) to wafer holder 12 from the loaded wafer cassette.

[0030] (Substrate loading: Process S2) The transport jig storing the substrate S is loaded into the substrate supply section 60. In the substrate supply section 60, the substrate S stored in the transport jig is taken out of the transport jig. Then, the substrate S is supplied (carried in) to the preform section 90 via the transport section 50.

[0031] (Pickup: Process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 24, and the die D is positioned and its surface inspected based on the image data acquired by the photograph. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die is positioned accordingly. Note that the die position reference point is previously set to a predetermined position on the wafer holder 12 as the initial setting for the device. The image data is processed to inspect the surface of the die D.

[0032] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0033] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0034] After transporting the die D to the intermediate stage 31, the pickup head 21 is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, the dies D are peeled off one by one from the dicing tape DT following the same procedure.

[0035] (Preform: Process S4) After step S2, the substrate S is transported to the preform stage 96 by the transport unit 50. The surface of the substrate S before application is photographed by the preform camera 94, and the application surface is confirmed based on the image data acquired by photographing, and the position where the paste should be applied is determined. If there are no problems with the surface to be applied, the position where the paste should be applied on the substrate S supported by the preform stage 96 is confirmed and positioned.

[0036] The applied paste is photographed by the preform camera 94. Whether the paste has been applied accurately is confirmed based on the image obtained by photographing, and an inspection (visual inspection) of the applied paste is performed. That is, in the visual inspection, it is confirmed whether the applied paste has been applied in a predetermined amount in a predetermined shape at a predetermined position on the substrate S. The inspection contents include, for example, the presence or absence of paste, the applied area, and the applied shape (excess or shortage, overflow).

[0037] (Bond: Process S5) If there are no problems with the coating, the substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is photographed by the substrate recognition camera 44, and image data is acquired by the photograph. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device.

[0038] The suction position of the bond head 41 is corrected based on the amount of deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds the die D to a predetermined position on the substrate S supported by the bond stage 46. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by photographing to determine whether the die D has been bonded to the desired position, etc.

[0039] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to all the package areas P of the substrate S.

[0040] (Substrate unloading: Process S6) The transfer section 50 transfers the substrate S with the die D bonded thereto from the bonding section 40 to the substrate transfer section 70. In the substrate transfer section 70, the substrate S is taken out and stored in a transfer jig, and then the substrate S is transferred out. The transfer jig storing the substrate S is transferred out of the die bonder 1.

[0041] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0042] It is desirable to arrange attachment points such as the bonding unit 40 and the preform unit 90 close to each other to shorten transportation time. The optical system at each attachment point has its own optimized illumination system (e.g., a coaxial illumination device, an oblique illumination device, etc.). Furthermore, the light emitted by each illumination system diverges outside the field of view as leakage light, which can become disturbance light for other nearby optical systems. The optical system 88 shown in FIG. 4 includes a pickup optical system and a stage optical system in addition to the preform optical system 110 and bonding optical system 120 described below. The pickup optical system includes a wafer recognition camera 24 and an illumination system used therefor. The stage optical system includes a stage recognition camera 34 and an illumination system used therefor.

[0043] For example, the preform optical system 110 and the bonding optical system 120 arranged on the same chute (transport lane 52) will be described with reference to Figures 6 and 7. Figure 6 is a diagram illustrating an example of interference light from the bonding illumination system in the preform optical system. Figure 7 is a diagram illustrating an example of interference light from the preform illumination system in the bonding optical system.

[0044] The preform optical system 110 includes a preform camera 94 and a preform illumination system 111. The preform illumination system 111 includes a coaxial illumination device 95 and an oblique illumination device 97. The substrate S held on the transport lane 52 is positioned below the preform optical system 110. In addition, the preform head 91 is disposed below the coaxial illumination device 95. In the preform optical system 110, for example, an illumination setting (P1) for positioning the substrate S, an illumination setting (P2) for visual inspection of scratches on the substrate S, and an illumination setting (P3) for visual inspection of the application area after application of the paste PA are performed.

[0045] The bonding optical system 120 includes a substrate recognition camera 44 and a bonding illumination system 121. The bonding illumination system 121 includes a coaxial illumination device 45 and an oblique illumination device 47. The substrate S held on the transport lane 52 is positioned below the bonding optical system 120. The bond head 41 is also disposed below the coaxial illumination device 45. In the bonding optical system 120, for example, an illumination setting (B1) for positioning the substrate S, an illumination setting (B2) for inspecting the state (bond position) of the die D after bonding, and an illumination setting (B3) for inspecting the state (flaws) of the die D after bonding are performed.

[0046] The positioning process (positioning algorithm) by P1, B1, and B2 uses model matching (template matching). Model matching includes the teaching operation of reference learning and the production operation shown in Figure 5.

[0047] In the inspection algorithms using P2 and B3, a reference image (reference image) is stored in advance and a differential algorithm is performed. In other words, differential processing is performed using the image acquired during teaching operation and the image acquired during production operation.

[0048] In the P3 inspection algorithm, images are saved before the coating process during production, and a difference algorithm is used to compare the images captured after coating. In other words, difference processing is performed using images captured during runtime (production).

[0049] As shown in Fig. 6, leakage light LBC from the coaxial illuminator 45 of the bonding illumination system 121 and leakage light LBO from the oblique illuminator 47 can become disturbance light (interference light) to the preform optical system 110. As shown in Fig. 7, leakage light LPC from the coaxial illuminator 95 of the preform illumination system 111 and leakage light LPO from the oblique illuminator 97 can become disturbance light (interference light) to the bonding optical system 120. In this way, mutual interference between the illumination systems can occur. This can affect image processing in the illumination settings of the optical systems described above.

[0050] Next, positioning model matching (P1, B1, B2) will be described with reference to Fig. 8 and Fig. 9. Fig. 8 is a flow chart for explaining model image registration during teaching in this embodiment. Fig. 9 is a flow chart for explaining model matching during production in this embodiment.

[0051] First, the teaching operation will be explained using Fig. 8. For example, as shown in Fig. 6, a reference member (substrate S or die D bonded to substrate S) is transported to a predetermined position and the following operations are performed. During the following operations, the relative positions of the imaging device and the reference member are fixed.

[0052] (Step S11) The control unit 80 turns off the illumination (illumination system) of other optical systems that may cause interference. For example, at P1, the coaxial illumination device 45 and the oblique illumination device 47 of the bonding illumination system 121 are turned off. At B1 and B2, the coaxial illumination device 95 and the oblique illumination device 97 of the preform illumination system 111 are turned off.

[0053] (Step S12) The control unit 80 turns on the illumination devices for model matching. For example, at P1, the coaxial illumination device 95 of the preform illumination system 111 is turned on. At B1 and B2, the coaxial illumination device 45 of the bonding illumination system 121 is turned on.

[0054] (Step S13) The control unit 80 acquires and registers (saves in the storage device 82) an image for model matching (hereinafter referred to as a "model image" or "reference image") using an imaging device. For example, at P1, the preform camera 94 acquires a model image by photographing a reference member (substrate S). At B1 and B2, the substrate recognition camera 44 acquires a model image by photographing a reference member (substrate S, die D bonded to substrate S).

[0055] (Step S14) The control unit 80 selects image processing functions (illumination settings) of other optical systems that may overlap in terms of timing. For example, for P1, an image processing function (one of B1, B2, and B3, e.g., B1) of the bonding optical system 120 is selected. For B1 and B2, an image processing function (one of P1, P2, and P3, e.g., P1) of the preform optical system 110 is selected.

[0056] (Step S15) The control unit 80 turns on the illumination systems of the other optical systems in the settings used in the image processing selected in step S14. For example, in P1, in a setting (e.g., B1) used in the image processing of the bonding optical system 120, which may overlap in timing, the control unit 80 turns on the bonding illumination system 121 (e.g., coaxial illumination device 45). In B1 and B2, in a setting (e.g., P1) used in the image processing of the preform optical system 110, which may overlap in timing, the control unit 80 turns on the preform illumination system 111 (e.g., coaxial illumination device 95). Note that the illumination device for model matching is kept turned on.

[0057] (Step S16) The control unit 80 photographs the reference member using the imaging device without moving the field of view, acquires a model image, and registers (stores in the storage device 82). For example, at P1, the preform camera 94 photographs the reference member (substrate S) and acquires a model image. At B1 and B2, the substrate recognition camera 44 photographs the reference member (substrate S, die D bonded to substrate S) and acquires a model image.

[0058] The control unit 80 repeats steps S14 to S16 for the number of types of interfering image processing functions. For example, in P1, steps S14 to S16 are repeated for the B2 illuminator (coaxial illuminator 45) and the B3 illuminator (oblique illuminator 47), which may interfere. In B1 and B2, steps S14 to S16 are repeated for the P2 illuminator (oblique illuminator 97) and the P3 illuminator (coaxial illuminator 95), which may interfere. As a result, for example, model images such as those shown in (a) to (c) below are acquired.

[0059] (a) In P1, a model image is registered with all lighting devices of the bonding illumination system 121 turned off and lighting devices B1, B2, and B3 turned on. The model images registered in each state are called P1-0, P1-1, P1-2, and P1-3.

[0060] (b) In B1, a model image is registered with all lighting devices of the preform illumination system 111 turned off and with the lighting devices P1, P2, and P3 turned on. The model images registered in each state are called B1-0, B1-1, B1-2, and B1-3.

[0061] (c) In B2, a model image is registered with all lighting devices of the preform illumination system 111 turned off and with the lighting devices P1, P2, and P3 turned on. The model images registered in each state are called B2-0, B2-1, B2-2, and B2-3.

[0062] The operations during production will be described with reference to Fig. 9. For example, as shown in Fig. 6, the following operations are performed in a state where a production member (substrate S or die D bonded to substrate S) is transported to a predetermined position.

[0063] (Step S21) The control unit 80 turns on the lighting devices for model matching. For example, at P1, the coaxial lighting device 95 of the preform optical system 110 is turned on. At B1 and B2, the coaxial lighting device 45 of the bonding optical system 120 is turned on.

[0064] (Step S22) The control unit 80 starts monitoring the state of the illumination systems of the other optical systems (i.e., the on / off state of the illumination devices). For example, at P1, it starts monitoring the state of the bonding illumination system 121. At B1 and B2, it starts monitoring the state of the preform illumination system 111.

[0065] (Step S23) The control unit 80 captures images using an imaging device. For example, at P1, the preform camera 94 captures an image of the production member (substrate S). At B1 and B2, the substrate recognition camera 44 captures an image of the production member (substrate S, die D bonded to the substrate S).

[0066] (Step S24) The control unit 80 ends monitoring the states of the illumination systems of the other optical systems. For example, at P1, monitoring the state of the bonding illumination system 121 ends. At B1 and B2, monitoring the state of the preform illumination system ends.

[0067] If there is a change in the state of the illumination system of another optical system during step S23, the control unit 80 also monitors when the change occurred in the exposure timing of the imaging device using an I / O signal, etc. For example, if there is a change in the state of the bonding illumination system 121 at P1, it monitors when the change occurred in the exposure timing of the preform camera 94. If there is a change in the state of the preform illumination system 111 at B1 and B2, it monitors when the change occurred in the exposure timing of the board recognition camera 44.

[0068] (Step S25) The control unit 80 turns off the illumination devices for model matching. For example, at P1, the coaxial illumination device 95 of the preform illumination system 111 is turned off. At B1 and B2, the coaxial illumination device 45 of the bonding illumination system 121 is turned off. This prevents interference with other optical systems. If model matching is to be performed subsequently, the illumination devices do not need to be turned off.

[0069] (Step S26) The control unit 80 selects a model image that matches the state of the illumination system of the other optical system. For example, in P1, a model image (one of P1-0, P1-1, P1-2, and P1-3) of the preform optical system 110 that matches the state of the bonding illumination system 121 is selected. In B1, a model image (one of B1-0, B1-1, B1-2, and B1-3) of the bonding optical system 120 that matches the state of the preform illumination system 111 is selected. In B2, a model image (one of B2-0, B2-1, B2-2, and B2-3) of the bonding optical system 120 that matches the state of the preform illumination system 111 is selected.

[0070] If there is a change in the state of the illumination system of the other optical system during step S23, the control unit 80 creates (regenerates) a mixed image of the two types of model images in accordance with the ratio of the exposure time. For example, assume that in P1, the exposure time of the preform camera 94 is 10 ms and the bonding illumination system 121 changes from an off state to an on state 6 ms from the start. In this case, a model image is created by combining 60% of the grayscale value of the model image when the bonding illumination system 121 is off and 40% of the grayscale value of the model image when the bonding illumination system 121 is on. In B1 and B2, a combined model image is created and used in the same way as in P1. Note that the brightness of the illumination is adjusted so that the combined model image does not exceed the maximum brightness.

[0071] (Step S27) The control unit 80 performs the positioning process using the model image selected or regenerated as follows.

[0072] When P1 is executed during production, a model image is selected according to the state of the bonding illumination system 121. When all illumination devices in the bonding illumination system 121 are turned off, the model image P1-0 is used. When the illumination devices used in B1 are turned on, the model image P1-1 is used. When the illumination devices used in B2 are turned on, the model image P1-2 is used. When the illumination devices used in B3 are turned on, the model image P1-3 is used.

[0073] If there is a change in the state of the bonding illumination system 121 during step S23, a model image reconstructed by mixing the model image of P1-0 with the model image of P1-1, the model image of P1-2, or the model image of P1-3 based on the ratio with the exposure time is used.

[0074] When B1 is executed during production, a model image is selected according to the state of the preform illumination system 111. When all illumination devices in the preform illumination system 111 are turned off, the model image B1-0 is used. When the illumination device used in P1 is turned on, the model image B1-1 is used. When the illumination device used in P2 is turned on, the model image B1-2 is used. When the illumination device used in P3 is turned on, the model image B1-3 is used.

[0075] If there is a change in the state of the illumination device of the preform illumination system 111 during step S23, a model image reproduced by mixing the model image of B1-0 with the model image of B1-1, the model image of B1-2, or the model image of B1-3 based on the ratio with the exposure time is used.

[0076] When B2 is executed during production, a model image is selected according to the state of the lighting devices in the preform lighting system 111. When all lighting devices in the preform lighting system 111 are turned off, the model image B2-0 is used. When the lighting devices used in P1 are turned on, the model image B2-1 is used. When the lighting devices used in P2 are turned on, the model image B2-2 is used. When the lighting devices used in P3 are turned on, the model image B2-3 is used.

[0077] If there is a change in the state of the preform illumination system 111 during step S23, a model image reproduced by mixing the model image of B2-0 with the model image of B2-1, the model image of B1-2, or the model image of B2-3 based on the ratio with the exposure time is used.

[0078] Next, the difference processing for flaw appearance inspection (P2, B3) will be described with reference to Fig. 10 and Fig. 11. Fig. 10 is a flow chart for explaining the registration of images for difference inspection during teaching in this embodiment. Fig. 11 is a flow chart for explaining the difference processing during production in this embodiment.

[0079] First, the teaching operation will be explained using Fig. 10. For example, as shown in Fig. 6, a reference member (a substrate or a die bonded to a substrate) is transported to a predetermined position and the following operations are performed. During the following operations, the relative positions of the imaging device and the reference member are fixed.

[0080] (Step S31) The control unit 80 turns off the illumination of other optical systems that may cause interference. For example, at P2, the coaxial illuminator 45 and the oblique illuminator 47 of the bonding illumination system 121 are turned off. At B3, the coaxial illuminator 95 and the oblique illuminator 97 of the preform illumination system 111 are turned off.

[0081] (Step S32) The control unit 80 turns on the illumination devices for differential inspection. For example, at P2, the oblique illumination device 47 of the preform optical system 110 is turned on. At B3, the oblique illumination device 47 of the bonding optical system 120 is turned on.

[0082] (Step S33) The control unit 80 photographs the reference member using an imaging device to obtain an image for differential inspection (hereinafter referred to as a "standard image" or "reference image") and registers (stores in the storage device 82). For example, at P2, the reference member is photographed using the preform camera 94 to obtain the standard image. At B3, the reference member is photographed using the board recognition camera 44 to obtain the standard image.

[0083] (Step S34) The control unit 80 selects image processing functions of other optical systems that may overlap in terms of timing. For example, in P2, an image processing function (one of B1, B2, and B3, e.g., B1) of the bonding optical system 120 is selected. In B3, an image processing function (one of P1, P2, and P3, e.g., P1) of the preform optical system 110 is selected.

[0084] (Step S35) The control unit 80 turns on the illumination of other optical systems in the settings used in the image processing selected in step S34. For example, in P2, in a setting (e.g., B1) used in the image processing of the bonding optical system 120, which may overlap in timing, the bonding illumination system 121 (e.g., coaxial illumination device 45) is turned on. In B3, in a setting (e.g., P1) used in the image processing of the preform optical system 110, which may overlap in timing, the preform illumination system 111 (e.g., coaxial illumination device 95) is turned on. Note that the illumination device for differential inspection is kept turned on.

[0085] (Step S36) The control unit 80 photographs the reference member using an imaging device to obtain a reference image and registers (stores in the storage device 82). For example, at P2, the reference member is photographed using the preform camera 94 to obtain a reference image. At B3, the reference member is photographed using the board recognition camera 44 to obtain a reference image.

[0086] The control unit 80 repeats steps S34 to S36 for the number of types of interfering image processing functions. For example, at P2, steps S34 to S36 are repeated for the lighting devices B2 and B3 that may be interfering. At B3, steps S34 to S36 are repeated for the lighting devices P2 and P3 that may be interfering. As a result, for example, at P2, the preform camera 94 photographs the reference member to obtain a reference image. At B3, the board recognition camera 44 photographs the reference member to obtain a reference image. As a result, for example, the following reference images (a) and (b) are obtained.

[0087] (a) At P2, a reference image is registered with all illumination devices of the bonding illumination system 121 turned off and illumination devices B1, B2, and B3 turned on. The reference images registered in each state are called P2-0, P2-1, P2-2, and P2-3.

[0088] In (b) B3, a reference image is registered with all illumination devices of the preform illumination system 111 turned off and with the illumination devices P1, P2, and P3 turned on. The reference images registered in each state are called B3-0, B3-1, B3-2, and B3-3.

[0089] The operations during production will be described with reference to Fig. 11. For example, the following operations are performed in a state where the production substrate is transported to a predetermined position as shown in Fig. 6.

[0090] (Step S41) The control unit 80 turns on the illumination devices for differential inspection. For example, the oblique illumination device 97 of the preform optical system is turned on at P2. The oblique illumination device 47 of the bonding optical system is turned on at B3.

[0091] (Step S42) The control unit 80 starts monitoring the state of the illumination systems of the other optical systems (i.e., the on / off state of the illumination device). For example, at P2, monitoring of the state of the bonding illumination system 121 starts. At B3, monitoring of the state of the preform illumination system 111 starts.

[0092] (Step S43) The control unit 80 captures (obtains) an image using an imaging device. For example, at P2, the preform camera 94 captures an image of the production member (substrate S). At B3, the substrate recognition camera 44 captures an image of the production member (substrate S, die D bonded to the substrate S).

[0093] (Step S44) The control unit 80 ends monitoring the states of the illumination systems of the other optical systems. For example, at P2, monitoring the state of the bonding illumination system 121 ends. At B3, monitoring the state of the preform illumination system 111 ends.

[0094] If there is a change in the state of the illumination system of another optical system during step S43, the control unit 80 also monitors when the change occurred in the exposure timing of the imaging device using an I / O signal, etc. For example, if there is a change in the state of the bonding illumination system 121 in P2, it monitors when the change occurred in the exposure timing of the preform camera 94. If there is a change in the state of the preform illumination system 111 in B3, it monitors when the change occurred in the exposure timing of the board recognition camera 44.

[0095] (Step S45) The control unit 80 turns off the illumination devices for differential inspection. For example, at P2, the oblique illumination device 97 of the preform optical system is turned off. At B3, the oblique illumination device 47 of the bonding optical system is turned off. This prevents interference with other optical systems. If differential inspection is to be performed subsequently, the illumination devices do not need to be turned off.

[0096] (Step S46) The control unit 80 selects a reference image that matches the state of the illumination system of the other optical system. For example, at P2, a reference image (one of P2-0, P2-1, P2-2, and P2-3) of the preform optical system 110 that matches the state of the bonding illumination system 121 is selected. At B3, a reference image (one of B3-0, B3-1, B3-2, and B3-3) of the bonding optical system 120 that matches the state of the preform illumination system 111 is selected.

[0097] If there is a change in the state of the illumination system of the other optical system during step S43, the control unit 80 creates (regenerates) a mixed image of the two types of reference images in accordance with the ratio of the exposure time. For example, assume that the exposure time of the preform camera 94 is 10 ms in P2, and the bonding illumination system 121 changes from an off state to an on state 6 ms after the start. In this case, a reference image is created by combining 60% of the grayscale value of the reference image when the bonding illumination system 121 is off and 40% of the grayscale value of the reference image when the bonding illumination system 121 is on. In B3, a combined reference image is created and used in the same way as in P2.

[0098] (Step S47) The control unit 80 performs subtraction processing using the reference image selected or regenerated as follows.

[0099] When P2 is executed during production, a reference image is selected according to the state of the bonding illumination system 121. When all illumination devices of the bonding illumination system 121 are turned off, the reference image P2-0 is used. When the illumination devices used in B1 are turned on, the reference image P2-1 is used. When the illumination devices used in B2 are turned on, the reference image P2-2 is used. When the illumination devices used in B3 are turned on, the reference image P2-3 is used.

[0100] If there is a change in the state of the bonding illumination system 121 during step S43, a reference image reconstructed by mixing the model image of P2-0 with the model image of P2-1, P2-2, or P2-3 based on the ratio with the exposure time is used.

[0101] When B3 is executed during production, a reference image is selected according to the state of the preform illumination system 111. When all illumination devices in the preform illumination system 111 are turned off, the reference image B3-0 is used. When the illumination device used in P1 is turned on, the reference image B3-1 is used. When the illumination device used in P2 is turned on, the reference image B3-2 is used. When the illumination device used in P3 is turned on, the reference image B3-3 is used.

[0102] If there is a change in the state of the preform illumination system 111 during step S43, a reference image reconstructed by mixing the model image of B3-0 with the model image of B3-1, the model image of B3-2, or the model image of B3-3 based on the ratio with the exposure time is used.

[0103] Next, the differential processing (P3) for visual inspection of the coating area will be described with reference to Figures 12 and 13. Figure 12 is a flow diagram explaining the differential processing during production in this embodiment. Figure 13 is a flow diagram explaining the continuation of the flow diagram shown in Figure 12. For example, the following operations are performed with the production member (substrate) transported to a predetermined position as shown in Figure 6.

[0104] (Step S51) The control unit 80 turns on the illumination device for differential inspection. For example, at P3, the coaxial illumination device 95 of the preform optical system 110 is turned on.

[0105] (Step S52) The control unit 80 starts monitoring the state of the illumination systems of the other optical systems (i.e., the on / off state of the illumination device). For example, at P3, monitoring of the state of the bonding illumination system 121 starts. The control unit 80 performs timing locking with respect to the illumination of the other optical systems so that there is no change in the state of the illumination systems of the other optical systems. The control unit 80 also records the monitored state of the bonding illumination system 121.

[0106] (Step S53) The control unit 80 captures (obtains) an image using the imaging device. For example, at P3, an image of the production member (substrate S) captured by the preform camera 94 is captured.

[0107] (Step S54) The control unit 80 ends monitoring the states of the illumination systems of the other optical systems. For example, at P3, monitoring the state of the bonding illumination system 121 ends.

[0108] (Step S55) The control unit 80 turns off the illumination devices used for differential inspection. For example, at P3, the oblique illumination device 97 of the preform optical system 110 is turned off. This prevents interference with other optical systems. If differential inspection is to be performed subsequently, the illumination devices do not need to be turned off. The control unit 80 also releases the timing lock performed in step S52.

[0109] (Step S56) The control unit 80 performs an attachment process. For example, paste is applied to the substrate S at P3.

[0110] (Step S57) The control unit 80 turns on the illumination device for differential inspection. For example, at P3, the coaxial illumination device 95 of the preform optical system 110 is turned on.

[0111] (Step S58) The control unit 80 sets the illumination systems of the other optical systems to the same states as those during step S53.

[0112] (Step S59) The control unit 80 captures (obtains) an image using the imaging device. For example, at P3, an image of the paste applied to the production member (substrate S) captured by the preform camera 94 is captured.

[0113] (Step S60) The control unit 80 turns off the illumination devices used for differential inspection. For example, at P3, the coaxial illumination device 95 of the preform optical system 110 is turned off. This prevents interference with other optical systems. If differential inspection is to be performed subsequently, the illumination devices do not need to be turned off.

[0114] (Step S61) The control unit 80 performs a differential process between the image acquired in step S53 (reference image) and the image acquired in step S59.

[0115] In P3, the state of the bonding illumination system 121 is recorded when an image is acquired before application (before attachment processing) at runtime, and when an image is acquired after application, the state is restored to that of the bonding illumination system 121. In contrast to the case where exclusive control is performed to always turn off the bonding illumination system 121 before and after application when acquiring an image in P3, image acquisition before application does not depend on the state of the bonding illumination system 121, and therefore the degree of freedom in timing is improved accordingly.

[0116] The effects of this embodiment will be described below.

[0117] It is possible to prevent mutual interference of illumination light by exclusively controlling the exposure timing of multiple optical systems. However, exclusive control creates waiting times and increases takt time. Furthermore, exclusive control repeatedly turns the illumination device on and off, causing fluctuations in the illumination duty cycle and resulting in an inconsistent amount of heat generated by the illumination device. If the temperature of a coaxial illumination device becomes unstable, thermal deformation can cause optical axis misalignment.

[0118] It is possible to prevent mutual interference of illumination light by arranging multiple optical systems at a distance. However, this arrangement requires the attachment points to be farther apart, which increases the takt time. It also makes the equipment larger.

[0119] In this embodiment, multiple model images used in the positioning algorithm or multiple differential inspection images used in the differential algorithm are prepared, with and without interference from the illumination of other optical systems.The model image to be used is selected based on the illumination state of the other optical systems during exposure.Alternatively, the model image to be used is modified (regenerated, processed) based on the illumination state of the other optical systems during exposure.

[0120] According to this embodiment, at least one of the following effects (a) to (h) is obtained.

[0121] (a) During teaching, multiple model images or differential inspection images are prepared to match the lighting conditions (states) of other optical systems, so positioning accuracy or inspection accuracy can be maintained even if there is interference from lighting from other optical systems.

[0122] (b) Multiple model images or differential inspection images are taught within the same positional conditions, and the mutual offset is zero, so that positioning accuracy or inspection accuracy can be maintained.

[0123] (c) During positioning processing or difference processing, a model image or a difference inspection image is selected or processed to match the execution conditions, so that positioning accuracy or inspection accuracy can be maintained.

[0124] (d) Since it is possible to reduce the influence of interference of illumination from a plurality of optical systems, it is possible to arrange the attachment points close to each other.

[0125] (e) Since it is possible to reduce the influence of interference of illumination from a plurality of optical systems, it is possible to improve robustness against disturbance light caused within the device.

[0126] (f) Since no exclusive control is performed, it is possible to give more freedom to the timing design of the operation sequence.

[0127] (g) Since no exclusive control is performed, productivity can be improved by improving takt time.

[0128] (h) Because there is no exclusive control, it is possible to keep each lighting device turned on, which stabilizes the heat generation of the lighting devices. This also stabilizes the bonding accuracy.

[0129] <Modification> Below, several representative modified examples of the embodiment are given. In the following description of the modified examples, the same reference numerals as those in the above-described embodiment may be used for parts having the same configurations and functions as those described in the above-described embodiment. Furthermore, the description of such parts may be appropriately cited within the scope of not being technically inconsistent. Furthermore, a part of the above-described embodiment and all or part of the multiple modified examples may be appropriately applied in a composite manner within the scope of not being technically inconsistent.

[0130] The positioning model matching (P1, B1, B2) in the modified example will be described with reference to Fig. 14 and Fig. 15. Fig. 14 is a flow chart explaining model image registration during teaching in the modified example. Fig. 15 is a flow chart explaining model matching during production in the modified example.

[0131] First, the teaching operation will be described with reference to Fig. 14. Steps S11 to S13 and S14 in the modified example are the same as steps S11 to S13 and S14 in the embodiment.

[0132] (Step S71) After step S13, the control unit 80 turns off the illumination devices for model matching. For example, at P1, the coaxial illumination device 95 of the preforming optical system 110 is turned off. At B1 and B2, the coaxial illumination device 45 of the bonding optical system 120 is turned off.

[0133] (Step S75) After step S14, similar to the embodiment, the control unit 80 turns on the illumination systems of the other optical systems in the settings used in the image processing selected in step S14. However, unlike the embodiment, the illumination device for model matching is kept turned off.

[0134] (Step S76) After step S75, the control unit 80 acquires an interference image using the imaging device and registers it (saves it in the storage device 82). For example, at P1, the preform camera 94 acquires an interference image by photographing the reference member (substrate S). At B1 and B2, the substrate recognition camera 44 acquires an interference image by photographing the reference member (substrate S, die D bonded to substrate S).

[0135] The control unit 80 repeats steps S14 to S15 and S76 for the number of types of interfering image processing functions. For example, for P1, steps are repeated for the lighting devices B2 and B3 that may be interfering. For B1 and B2, steps are repeated for the lighting devices P2 and P3 that may be interfering. As a result, for example, the following model images and interference images such as those shown in (a) to (c) are acquired.

[0136] (a) In P1, a model image is registered with all illumination devices of the bonding illumination system 121 turned off, and interference images are registered with the illumination devices B1, B2, and B3 turned on. The model image registered in each state is called P1-0, and the interference images are called P1-K1, P1-K2, and P1-K3.

[0137] (b) In B1, a model image is registered with all illumination devices of the preform illumination system 111 turned off, and interference images are registered with the illumination devices P1, P2, and P3 turned on. The model image registered in each state is called B1-0, and the interference images are called B1-K1, B1-K2, and B1-K3.

[0138] In (c) B2, a model image is registered with all illumination devices of the preform illumination system 111 turned off, and interference images are registered with the illumination devices P1, P2, and P3 turned on. The model image registered in each state is called B2-0, and the interference images are called B2-K1, B2-K2, and B2-K3.

[0139] The operation during production will be described with reference to Fig. 15. Steps S21 to S25 in the modified example are the same as steps S21 to S25 in the embodiment.

[0140] (Step S86) The control unit 80 generates a model image that matches the state of the illumination system of the other optical system.

[0141] For example, at P1, a model image of the preform optical system 110 matching the state of the bonding illumination system 121 is generated based on the model image of P1-0 and the interference images of P1-K1, P1-K2, and P1-K3.

[0142] When the B1 lighting device is on, the P1-1 model image is generated by adding the P1-K1 interference image to the P1-0 model image.When the B2 lighting device is on, the P1-0 model image is added to the P1-K2 interference image to generate the P1-2 model image.When the B3 lighting device is on, the P1-0 model image is added to the P1-K3 interference image to generate the P1-3 model image.

[0143] This section explains how to generate a model image when the B1 illumination device switches from on to off during exposure of P1, and the B2 illumination device switches from off to on. Based on the timing ratio of when the illumination device states switch during exposure, an image showing the absolute amount of interference between the illumination light from the B1 illumination device and the illumination light from the B2 illumination device is generated based on the interference images of P1-K1 and P1-K2. Then, an image addition process is performed on the model image of P1-0 to generate an interference model image.

[0144] Switching between the lighting device B2 and the lighting device B3, and switching between the lighting device B3 and the lighting device B1 also generate model images in the same way.

[0145] In B1, similar to P1, a model image of the bonding optical system 120 that matches the state of the preform illumination system 111 is generated based on the model image of B1-0 and the interference images of B1-K1, B1-K2, and B1-K3.

[0146] In B2, similar to P1, a model image of the bonding optical system 120 that matches the state of the preform illumination system 111 is generated based on the model image of B2-0 and the interference images of B2-K1, B2-K2, and B2-K3.

[0147] (Step S87) The control unit 80 performs positioning processing using the generated model image.

[0148] By generating a model image in this manner, even if the illumination system of another optical system is switched during exposure of the model match, the model match can be positioned without being affected at all by the timing of the lighting control of the illumination system of the other optical system.

[0149] Although the modified example has been described with respect to model matching, it can also be applied to difference processing for flaw appearance inspection.

[0150] In the embodiment, the interference between the preforming optical system and the bonding optical system has been described, but the present invention can also be applied to the interference between at least two optical systems, including the optical system of the wafer supply unit 10 and the optical system of the intermediate stage unit 30. Furthermore, if the bonding unit 40 has multiple attachment points, the present invention can also be applied to the interference between those multiple optical systems.

[0151] The present disclosure can be applied to semiconductor manufacturing equipment that is equipped with multiple optical systems with independent illumination and performs image processing such as positioning processing using stored images, including model matching.

[0152] The disclosure made by the present inventor has been specifically described above based on embodiments and modified examples, but it goes without saying that the present disclosure is not limited to the above embodiments and modified examples, and various modifications are possible.

[0153] For example, in the embodiment, an example has been described in which one illumination system includes a plurality of illumination devices, but one illumination system may include only one illumination device.

[0154] In the embodiment, the preform unit 90 has been described as a mechanism for applying paste to a substrate, but the preform unit 90 may be a mechanism for cleaning a substrate, for example.

[0155] In the embodiment, an example has been described in which an intermediate stage unit 30 is provided between the wafer supply unit 10 and the bonding unit 40, a die D picked up from the wafer supply unit 10 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to a transported substrate S. It is also possible to bond a die D picked up from the wafer supply unit 10 to a substrate S by the bond head 41. [Explanation of symbols]

[0156] 1. Die bonder (semiconductor manufacturing equipment) 44 Circuit board recognition camera 94···Preform Camera 80... Control unit (control device) 110···Preform optical system 111 Preform lighting system 120 Bonding Optical System 121 Bonding Lighting System

Claims

1. an optical system including at least a first optical system having a first camera and a first illumination system, and a second optical system having a second camera and a second illumination system; a control device configured to, when the first optical system acquires a reference image of a reference member for image processing, capture an image of the reference member using the first camera for each illumination state of the second illumination system, and acquire and register the reference image; A semiconductor manufacturing apparatus comprising:

2. 2. The semiconductor manufacturing apparatus of claim 1, The control device irradiating the reference member with illumination light from the first illumination system and capturing an image of the reference member with the first camera without irradiating the reference member with illumination light from the second illumination system to obtain a first reference image; irradiating the reference member with illumination light from the first illumination system and irradiating the reference member with illumination light from the second illumination system, and capturing an image of the reference member with the first camera to obtain a second reference image; A semiconductor manufacturing apparatus configured to register the first reference image and the second reference image as the reference images.

3. 3. The semiconductor manufacturing apparatus according to claim 2, When the first optical system processes an image of a production member, the control device irradiating the production member with illumination light from the first illumination system, photographing the production member with the first camera to obtain a first image, and monitoring the state of the second illumination system; a semiconductor manufacturing device configured to perform image processing based on the reference image and the first image that match the state of the second illumination system;

4. 4. The semiconductor manufacturing apparatus according to claim 3, the control device is configured to select one of the first reference image and the second reference image as the reference image based on the state of the second illumination system when there is no change in the state of the second illumination system while the first camera is exposing the production member.

5. 4. The semiconductor manufacturing apparatus according to claim 3, the control device is configured to, when there is a change in the state of the second illumination system while the first camera is exposing the production member, reproduce a mixed image of the first reference image and the second reference image based on the on-period and off-period of the second illumination system, and use the mixed image as the reference image.

6. 2. The semiconductor manufacturing apparatus of claim 1, The control device irradiating the reference member with illumination light from the first illumination system and capturing an image of the reference member with the first camera without irradiating the reference member with illumination light from the second illumination system to obtain a first reference image; irradiating the reference member with first illumination light from the second illumination system without irradiating the reference member with illumination light from the first illumination system, and capturing an image of the reference member with the first camera to obtain a first interference image; irradiating the reference member with second illumination light from the second illumination system without irradiating the reference member with illumination light from the first illumination system, and capturing an image of the reference member with the first camera to obtain a second interference image; A semiconductor manufacturing apparatus configured to register at least the first reference image, the first interferogram, and the second interferogram.

7. 7. The semiconductor manufacturing apparatus according to claim 6, When the first optical system processes an image of a production member, the control device irradiating the production member with illumination light from the first illumination system, photographing the production member with the first camera to obtain a first image, and monitoring the state of the second illumination system; a semiconductor manufacturing apparatus configured to generate a reference image that matches a state of the second illumination system, and to perform image processing based on the reference image and the first image;

8. 8. The semiconductor manufacturing apparatus according to claim 7, the control device is configured to, when a change occurs in the state of the second optical system while the first camera is exposing the production member, generate a mixed image of the first reference image, the first interference image, and the second interference image based on an illumination period of the first illumination light and an illumination period of the second illumination light of the second illumination system, and use the mixed image as the reference image.

9. 2. The semiconductor manufacturing apparatus of claim 1, the first illumination system includes coaxial illumination and oblique illumination; The semiconductor manufacturing apparatus, wherein the second illumination system includes coaxial illumination and oblique illumination.

10. 2. The semiconductor manufacturing apparatus of claim 1, The reference image is a model image for positioning model matching of a semiconductor manufacturing device.

11. 2. The semiconductor manufacturing apparatus of claim 1, The reference image is a reference image for differential inspection of a semiconductor manufacturing device.

12. an optical system including at least a first optical system having a first camera and a first illumination system, and a second optical system having a second camera and a second illumination system; a control device configured to monitor an illumination state of the second illumination system when the first optical system acquires a reference image of the production member before the attachment process; A semiconductor manufacturing apparatus comprising:

13. 13. The semiconductor manufacturing apparatus of claim 12, The control device is configured to set the state of the second illumination system to the state at the time the reference image was acquired when the first camera acquires an inspection image of the production part after the attachment process.

14. an optical system including at least a first optical system having a first camera and a first illumination system, and a second optical system having a second camera and a second illumination system; a control device configured to, when the first optical system acquires a reference image of a reference member for image processing, capture an image of the reference member using the first camera for each illumination state of the second illumination system, and acquire and register the reference image; An inspection device comprising:

15. a step of carrying in production members to a semiconductor manufacturing device that includes an optical system including at least a first optical system having a first camera and a first illumination system, and a second optical system having a second camera and a second illumination system, and a control device that photographs a reference member with the first camera for each illumination state of the second illumination system, acquires reference images, and registers the reference images; a step of irradiating the production member with illumination light from the first illumination system, photographing the production member with the first camera to obtain a first image, and monitoring the state of the second illumination system; performing image processing based on a reference image that matches the state of the second illumination system and the first image; A method for manufacturing a semiconductor device comprising:

Images