Liquid crystal display device

Abstract

To provide a liquid crystal display device that can prevent peeling-off of an end of a sealing layer caused by a liquid crystal layer.SOLUTION: A liquid crystal display device comprises: a TFT substrate having a base material and an insulating layer; an opposing substrate having a base material, a black matrix, an overcoat layer; a liquid crystal layer arranged between the TFT substrate and the opposing substrate; and a sealing layer provided at a peripheral part of the TFT substrate and the opposing substrate to seal the liquid crystal layer. At least either one of the TFT substrate or the opposing substrate is in contact with the sealing layer, and has a slit surrounding an outer edge part. The slit is arranged only in an area on the outside of the center in a width direction of the sealing layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The following disclosure relates to a liquid crystal display device. [Background technology]

[0002] A liquid crystal display device is a display device that uses a liquid crystal composition for display, and a typical display method thereof is to apply a voltage to a liquid crystal layer containing a liquid crystal composition sealed between a pair of substrates, and to control the amount of light transmission by changing the orientation state of the liquid crystal molecules in the liquid crystal composition in response to the applied voltage. Such liquid crystal display devices are used in a wide range of fields, taking advantage of their features such as thinness, light weight, and low power consumption.

[0003] A liquid crystal display device has a structure in which a liquid crystal layer is sealed between a TFT substrate and a counter substrate. A sealing layer is provided between the TFT substrate and the counter substrate at the periphery of the liquid crystal display device to seal the liquid crystal layer and prevent oxygen and moisture from entering from the outside. Meanwhile, an alignment film is provided on the surfaces of the TFT substrate and the counter substrate that contact the liquid crystal layer, aligning the liquid crystal in a predetermined direction when no voltage is applied. Because the alignment film is often made of a low-viscosity resin, the resin applied during the formation of the alignment film can penetrate into the region of the substrate where the sealing layer is formed (hereinafter referred to as the sealing region). The penetration of the alignment film resin into the sealing region can reduce the sealing strength of the sealing layer formed thereon, or, if the resin reaches the electrodes of the external connection terminals, can cause electrical conduction problems. To address this issue, a method has been proposed in which grooves are formed in the sealing layer regions of the TFT substrate and the counter substrate, and then an alignment film is formed to prevent the intrusion of the alignment film. For example, Patent Document 1 discloses a liquid crystal panel having multiple grooves formed in the insulating layer of the sealing region along the length of the sealing region. Furthermore, Patent Document 2 discloses a liquid crystal display device having a groove provided at the outer edge of the interlayer insulating film so that the underlying layer of the interlayer insulating film is exposed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2016 / 157399 [Patent Document 2] Japanese Patent Application Laid-Open No. 2004-53815 Summary of the Invention [Problem to be solved by the invention]

[0005] However, although the LCD devices described in Patent Documents 1 and 2 are able to prevent the intrusion of the alignment film by using grooves, when the ODF method is used, the liquid crystal layer may creep (insert) into the interface between the uncured sealing layer and the TFT substrate or the opposing substrate at the edge of the sealing layer on the liquid crystal layer side, causing the sealing layer to peel off.

[0006] The present invention has been made in view of the above-mentioned current situation, and has as its object to provide a liquid crystal display device that can prevent peeling of the liquid crystal layer at the end of the sealing layer. [Means for solving the problem]

[0007] The present invention is comprised of the following Disclosures 1 to 4. The present invention will be described in detail below. [Disclosure 1] a TFT substrate having a base material and an insulating layer; an opposing substrate having a substrate, a black matrix, and an overcoat layer; a liquid crystal layer disposed between the TFT substrate and the opposing substrate; a sealing layer provided on the peripheral portions of the TFT substrate and the counter substrate to seal the liquid crystal layer, At least one of the TFT substrate and the opposing substrate is in contact with the sealing layer and has a slit surrounding an outer edge portion. The slits are arranged only in the outer region of the sealing layer from the center in the width direction. [Disclosure 2] The liquid crystal display device according to Disclosure 1, wherein the slits are provided on both the TFT substrate and the counter substrate. [Disclosure 3] The liquid crystal display device according to Disclosure 1 or 2, wherein the bottom surface of the slit is a base material of the TFT substrate or the counter substrate. [Disclosure 4] The liquid crystal display device according to any one of Disclosures 1 to 3, wherein the opposing substrate has the slit penetrating the overcoat layer and the black matrix, and the entire surface of the black matrix facing the slit is covered with the overcoat layer. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a liquid crystal display device that can prevent the liquid crystal layer from peeling off the edge of the sealing layer. [Brief explanation of the drawings]

[0009] [Figure 1] 2 is a schematic diagram showing an example of a cross-sectional structure of a peripheral portion of the liquid crystal display device of the present embodiment. FIG. [Figure 2] 1 is a top view schematically illustrating a liquid crystal display device according to an embodiment of the present invention. [Figure 3A] FIG. 1 is a cross-sectional view showing a state in which a TFT substrate and an opposing substrate are bonded together in a conventional liquid crystal display device having a slit. [Figure 3B] FIG. 1 is a cross-sectional view showing a state in which a TFT substrate and an opposing substrate are bonded together in a conventional liquid crystal display device having a slit. [Figure 3C] FIG. 1 is a cross-sectional view showing a state in which a TFT substrate and an opposing substrate are bonded together in a conventional liquid crystal display device having a slit. [Figure 3D] FIG. 1 is a cross-sectional view showing a state in which a TFT substrate and an opposing substrate are bonded together in a conventional liquid crystal display device having a slit. [Figure 4A] 10 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in a liquid crystal display device having a slit in an area inside a sealing layer. FIG. [Figure 4B]10 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in a liquid crystal display device having a slit in an area inside a sealing layer. FIG. [Figure 4C] 10 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in a liquid crystal display device having a slit in an area inside a sealing layer. FIG. [Figure 4D] 10 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in a liquid crystal display device having a slit in an area inside a sealing layer. FIG. [Figure 5A] 2 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in the liquid crystal display device of the present embodiment. FIG. [Figure 5B] 2 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in the liquid crystal display device of the present embodiment. FIG. [Figure 5C] 2 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in the liquid crystal display device of the present embodiment. FIG. [Figure 5D] 2 is a cross-sectional view schematically illustrating how a TFT substrate and a counter substrate are bonded together in the liquid crystal display device of the present embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] The liquid crystal display device of this embodiment includes a TFT substrate having a base material and an insulating layer, a counter substrate having a base material, a black matrix, and an overcoat layer, a liquid crystal layer disposed between the TFT substrate and the counter substrate, and a sealing layer provided around the periphery of the TFT substrate and the counter substrate to seal the liquid crystal layer. Here, Fig. 1 is a schematic diagram showing an example of the cross-sectional structure of the peripheral portion of the liquid crystal display device of this embodiment, and Fig. 2 is a schematic top view of the liquid crystal display device of this embodiment. For simplification, Fig. 1 omits components that are included in general liquid crystal display devices, such as various electrodes, wiring, alignment films, and semiconductor layers. For clarity, Fig. 2 omits the structure above the liquid crystal layer, and the sealing layer is shown with a thicker line width than in reality. As shown in FIG. 1, the liquid crystal display device of this embodiment includes a TFT substrate 1, a counter substrate 2 facing the TFT substrate 1, a liquid crystal layer 3 disposed between the TFT substrate 1 and the counter substrate 2, and a sealing layer 4 for sealing the liquid crystal layer 3. The TFT substrate 1 has a structure in which a semiconductor layer, a gate electrode, a source electrode, a pixel electrode, an alignment film, and the like (none of which are shown) are disposed on a base material 11, with an insulating layer 12 between each electrode and a photospacer 13 for maintaining a constant thickness of the liquid crystal layer. The counter substrate 2 has a structure in which a color resist layer 22, a black matrix 23, an overcoat layer 24, a common electrode, an alignment film (none of which are shown), and a photospacer 25 are laminated below a base material 21. Note that, at the terminal side of the liquid crystal display device, there is an area for bundling the source bus lines, so the sealing layer 4 and the active area (the area where the color resist layer is disposed) are farther apart than at the other three sides. Therefore, at the terminal side of the liquid crystal display device, a band pattern 26 is arranged under the black matrix 23 at the peripheral edge so that the thickness of the peripheral edge does not become too thin, and further an overcoat layer 24 and a photospacer 25 are arranged. In Figure 1, the terminal side of the liquid crystal display device is shown, so the band pattern 26 and photospacer 25 are arranged, but at sides other than the terminal side of the liquid crystal display device, the sealing layer 4 and the active area are close to each other, so the band pattern 26 and photospacer 25 are often not provided.

[0011] In the liquid crystal display device of this embodiment, at least one of the TFT substrate and the counter substrate is in contact with the sealing layer and has a slit surrounding the outer edge. As shown in Figures 1 and 2, by providing slits 5 surrounding the outer edge of the sealing layer 4 along the longitudinal direction in the sealing region of at least one of the TFT substrate 1 and the counter substrate 2, it is possible to prevent the alignment film from entering the sealing region. It also makes it difficult for moisture and oxygen in the atmosphere to enter through the interface between the sealing layer 4 and the TFT substrate 1 or the counter substrate 2. Furthermore, by adjusting the number and width of the slits 5, it is possible to make the line width of the sealing layer 4 uniform. While there may be one or more slits 5, it is preferable that at least one slit 5 be entirely in contact with the sealing layer 4, i.e., be located within the sealing region. The slits 5 can be formed, for example, by coating various photosensitive resin resist materials, such as insulating layers and overcoat layers, in the substrate using a slit coater or spin coater, followed by development using a method such as photolithography, and then baking to form a patterned thin film.

[0012] The slits are arranged only in the region outside the center in the width direction of the sealing layer. (Hereinafter, the region inside and the region outside the center in the width direction of the sealing layer will be simply referred to as the inner region of the sealing layer and the outer region of the sealing layer, respectively.) In this specification, "outside" refers to the direction toward the peripheral edge of the liquid crystal display device. As shown in Fig. 1, in the liquid crystal display device of this embodiment, the slits 5 are arranged only in the sealing region of the TFT substrate 1 and the counter substrate 2 and in the region outside the sealing layer 4. By arranging the slits 5 only outside the sealing region, peeling of the sealing layer 4 due to insertion of the liquid crystal layer 3 into the sealing layer 4 can be suppressed.

[0013] Here, Figures 3A to 3D are cross-sectional schematic diagrams showing how a TFT substrate and a counter substrate are bonded together in a conventional liquid crystal display device having a slit, Figures 4A to 4D are cross-sectional schematic diagrams showing how a TFT substrate and a counter substrate are bonded together in a liquid crystal display device having a slit in the region inside the sealing layer, and Figures 5A to 5D are cross-sectional schematic diagrams showing how a TFT substrate and a counter substrate are bonded together in the liquid crystal display device of this embodiment. The ODF (One Drop Fill) method is commonly used in the process of bonding a TFT substrate and a counter substrate in the manufacture of liquid crystal displays. As shown in Figures 3A, 4A, and 5A, in the ODF method, liquid crystal is first evenly dispensed onto the area inside the sealing resin of TFT substrate 1, which has already been coated with sealing resin. Then, TFT substrate 1 and counter substrate 2 are bonded together under vacuum. Note that with the ODF method, multiple TFT substrates or counter substrates are formed on a single large panel, and multiple liquid crystal displays are manufactured by bonding them together at once. Therefore, to minimize thickness variations between panels, a peripheral seal 6 is placed between each liquid crystal display (at a position further outside in Figure 2). Next, as shown in Figures 3B, 4B, and 5B, the vacuum is released and the assembly is returned to atmospheric pressure. This allows the liquid crystal and sealing resin to spread out due to atmospheric pressure. Finally, as shown in Figures 3C, 4C, and 5C, the sealing resin and liquid crystal come into contact, forming a liquid crystal layer 3 and a sealing layer 4. Then, as shown in Figures 3D, 4D, and 5D, by cutting between the sealing layer 4 and the peripheral seal 6, the multiple liquid crystal display devices formed on the panel are cut into individual liquid crystal display devices, and the unnecessary peripheral seal 6 is removed.

[0014] When the ODF method is applied to a TFT substrate 1 and a counter substrate 2 with slits, the slits act as resistance, and a force opposite to the expansion direction of the sealing resin acts around the slits. Therefore, in a liquid crystal display device in which slits 5 are arranged inside the sealing layer 4 as shown in Figures 3B and 3C and 4B and 4C, the expansion force of the sealing layer 4 at the interface between the TFT substrate 1 and the counter substrate 2 is weaker than that of the liquid crystal layer 3. On the other hand, since there are no slits on the liquid crystal layer 3 side, the expansion force of the sealing layer 4 is not reduced. Therefore, when the liquid crystal layer 3 comes into contact with the sealing layer 4, the liquid crystal layer 3 is inserted into the interfaces between the TFT substrate 1 and the counter substrate 2 and the sealing layer 4, causing the sealing layer 4 to peel off.

[0015] In the liquid crystal display device of this embodiment, as shown in FIGS. 5B and 5C , the slits 5 are located only in the outer region of the sealing layer 4. This prevents the expansion force of the sealing layer 4 from decreasing in the inner region of the sealing layer 4. Therefore, when the sealing layer 4 and the liquid crystal layer 3 come into contact with each other, the liquid crystal layer 3 is less likely to penetrate into the interfaces between the TFT substrate 1 and the opposing substrate 2 and the sealing layer 4, thereby preventing peeling of the sealing layer 4. Furthermore, in the liquid crystal display device of this embodiment, the slits 5 are located in the outer region of the sealing layer 4. This not only prevents the alignment film from penetrating the sealing region, but also makes the sealing layer line width uniform and prevents atmospheric moisture and oxygen from penetrating through the sealing layer interface. Furthermore, in liquid crystal display devices without slits, peeling of the sealing layer occurs mainly from the outer edge. However, in the liquid crystal display device of this embodiment, the sealing layer 4 is embedded in the slits 5 located outside the sealing region, thereby increasing the sealing strength of the outer portion of the sealing layer 4 and preventing peeling of the outer portion of the sealing layer 4.

[0016] The slit may be located on at least one of the TFT substrate or the counter substrate, but it is preferable to have the slit on both the TFT substrate and the counter substrate, as this prevents the sealing layer from peeling off (inserting) due to the liquid crystal layer at the interface between both substrates.

[0017] The slit preferably penetrates at least one of the insulating layer and the overcoat layer, and the bottom surface of the slit is more preferably the base material of the TFT substrate or the counter substrate, i.e., the slit more preferably penetrates all layers up to the base material of the TFT substrate or the counter substrate. The resin constituting the sealing layer contains acrylic and epoxy groups and hardens through radical polymerization and epoxy bonding. The TFT substrate and the counter substrate are often made of glass substrates for strength and transparency reasons. Glass substrates with a high silicon content and minimal irregularities provide strong adhesion to the functional groups and bonds of the resin constituting the sealing layer. On the other hand, organic resin layers such as overcoat layers, insulating layers, and black matrices are primarily made of acrylic resins, which are not as tightly bonded as glass (no intermolecular forces are present) and therefore do not have the same adhesive strength as glass substrates. Therefore, the sealing strength of the sealing layer can be further enhanced by penetrating slits all the way to the substrate of the TFT substrate or counter substrate and bringing the sealing layer into contact with the substrate.

[0018] It is preferable that the slits arranged in the counter substrate penetrate the overcoat layer and the black matrix, and that the entire surface of the black matrix on the slit side is covered with the overcoat layer. As mentioned above, the sealing strength of the sealing resin increases when it comes into contact with the substrate. Therefore, it is preferable that the slits on the opposing substrate penetrate the overcoat layer and black matrix. However, when the ODF process is performed on slits that penetrate the overcoat layer and black matrix, carbon particles in the black matrix appear irregularly on the sides of the slits. When the sealing resin is applied using a dispenser, these particles collide with the carbon particles irregularly, hindering the resin's elongation and causing the sealing layer to meander. A meandering sealing layer can lead to uneven contact with the liquid crystal layer, potentially leading to delamination of the sealing layer. Therefore, by covering the entire slit-side surface of the black matrix 23 with an overcoat layer 24 as shown in Figure 1, the sides of the slit 5 become smooth, thereby preventing meandering and delamination of the sealing layer 4. As a method for covering the entire surface of the black matrix on the slit side with an overcoat layer, for example, a method can be mentioned in which a slit is first formed in the black matrix by photolithography or the like, an overcoat layer is formed thereon, and then a slit having a width smaller than that of the slit in the black matrix is ​​formed.

[0019] When the entire surface of the black matrix on the slit side is covered with the overcoat layer, the thickness of the overcoat layer is preferably 6 μm or more. By setting the coating thickness of the overcoat layer to 6 μm or more, it is possible to further prevent coating defects of the overcoat layer. From the viewpoint of further preventing coating defects of the overcoat layer, of making the frame appear wider by reducing the amount of black matrix to be removed and improving light-blocking properties, and of increasing the degree of freedom in slit arrangement, the coating thickness of the overcoat layer is more preferably 6 μm or more, and is preferably 24 μm or less, and more preferably 12 μm or less.

[0020] The number of slits may be one or more, but from the viewpoint of further suppressing peeling of the outer region of the sealing layer and making the line width of the sealing layer more uniform, the number is preferably two or more, more preferably three or more, and preferably six or less, and more preferably four or less. Note that the number of slits is the number of slits completely covered by the sealing layer, and if a portion of a slit protrudes from the sealing layer (half-extends), the number is the proportion of the slits covered by the sealing layer, so the number of slits may not be an integer.

[0021] Furthermore, when a slit is formed in the inner region of the sealing layer as in Figures 3 and 4, if part of the slit overlaps the inner edge of the sealing layer (the edge on the liquid crystal layer side), the sealing layer will shrink and harden as it hardens (hardening shrinkage), causing the glass to bend inward (towards the liquid crystal layer) using the slit as a fulcrum, resulting in uneven cell thickness. 1 and 5, even if a part of the slit is half-open, the glass bends outward (toward the opposite side from the liquid crystal layer), and therefore, cell thickness unevenness does not occur. In other words, in the liquid crystal display device of this embodiment, even if the entire slit is not enclosed within the sealing layer (even if the slit is half-open at the outer edge of the sealing layer), cell thickness unevenness does not occur, and therefore, a margin can be provided for variations in the line width and position of the sealing layer.

[0022] The width of the slit is preferably 10 μm or more, more preferably 30 μm or more, from the viewpoint of further suppressing peeling of the outer region of the sealing layer and making the line width of the sealing layer more uniform, and is preferably 400 μm or less, more preferably 40 μm or less.

[0023] The depth of the slit is preferably 1 μm or more, more preferably 1.5 μm or more, from the viewpoint of further suppressing peeling of the outer region of the sealing layer and making the line width of the sealing layer more uniform, and is preferably 5 μm or less, more preferably 4 μm or less.

[0024] The planar shape of the slit may be any shape as long as it can function as a slit, and examples thereof include a linear shape, a lattice shape, a dot shape, and the like. Of these, a linear shape is preferred because the shape obtained by photolithography is stable and can prevent the line width of the sealing layer from being distorted due to shape distortion. The cross-sectional shape of the slit may also be any shape as long as it can function as a slit, and examples thereof include a rectangular shape, a wedge shape, an arc shape, a stepped shape, and the like. Of these, a rectangular shape is preferred because it is easy to control the shape by photolithography and can prevent the line width of the sealing layer from being distorted due to shape distortion.

[0025] Examples of the sealing resin include a solvent-free resin including a hybrid resin having an acrylic group and an epoxy group, and a mixture of an acrylic resin and an epoxy resin.

[0026] The viscosity of the sealing resin is preferably 200,000 mPa·s or more, more preferably 300,000 mPa·s or more, and is preferably 600,000 mPa·s or less, and more preferably 500,000 mPa·s or less, in order to improve the applicability using a dispenser.

[0027] The sealing resin preferably contains a spacer. By including spacers in the sealing resin, the thickness of the sealing layer formed can be made more uniform. Examples of the spacers include glass beads having a diameter of 2 to 6 μm. The content of the spacers can be, for example, 0.5% by weight or more and 3% by weight or less.

[0028] The overcoat layer and insulating layer may be those used in conventional liquid crystal display devices, but a photosensitive resist made of a transparent acrylic base material is preferred because slits can be formed therein by photolithography.

[0029] The layers other than the sealing layer, the insulating layer and the overcoat layer on the TFT substrate and the counter substrate, and the liquid crystal layer may be the same as those in conventional liquid crystal display devices.

[0030] The present embodiment will be described in more detail below with reference to examples, but the present embodiment is not limited to these examples.

[0031] (1) Preparation of the substrate A 3.6 μm-thick insulating layer made of an acrylic resin-based photosensitive resist was formed on a glass substrate. Next, photolithography was performed on the formed insulating layer to form three 25 μm-wide slits, spaced 35 μm apart, penetrating the insulating layer so as to surround the periphery of the glass substrate (hereinafter, the substrate on which the insulating layer is formed is referred to as the TFT substrate). The openings were designed to ensure a 30% or higher transmission efficiency for ultraviolet light with a wavelength of 365 nm in the sealing region, including the slits. Next, a 1.45 μm-thick black matrix was formed on another glass substrate by photolithography, and a 1.8 μm-thick overcoat layer was then formed on the black matrix. Next, photolithography was performed on the formed black matrix and overcoat layer to form four 30 μm-wide slits, spaced 15 μm apart, penetrating the overcoat layer and black matrix so as to surround the periphery of the glass substrate (hereinafter, the substrate on which the black matrix and overcoat layer are formed is referred to as the counter substrate). The resulting combination of the TFT substrate and the counter substrate was designated as substrate A. Next, by changing the number of slits formed in the same manner as for substrate A, substrate B was fabricated, in which the TFT substrate had two slits and the opposing substrate had three slits, and substrate C was fabricated, in which the TFT substrate had three slits and the opposing substrate had three slits.

[0032] Example 1 (1) Preparation of measurement samples A encapsulation resin consisting of a photothermosetting resin (a mixture of acrylic and epoxy resins (acrylic-epoxy hybrid resin) with a viscosity of 400,000 mPa·s and 1% glass bead-shaped spacers (average particle size 4 μm)) was applied to the slits on the TFT substrate of Substrate A, and liquid crystal was evenly dispensed within the area surrounded by the encapsulation resin. The opposing substrate of Substrate A was then bonded to the TFT substrate under a vacuum of 3 Pa. The substrate was then returned to atmospheric pressure, and the liquid crystal and encapsulation resin were compressed at atmospheric pressure to form an encapsulation layer and liquid crystal layer. The encapsulation area was then irradiated with 12 J of ultraviolet light at a wavelength of 365 nm through the opening on the TFT substrate surface, and the encapsulation layer was cured by heating it in a bake oven at 130°C for 40 minutes to obtain an evaluation sample. The resulting evaluation sample had 3.5 slits on the outside of the encapsulation layer on the TFT substrate and 4 on the opposing substrate, with no slits inside the encapsulation layer. In the examples, when the number of slits is not an integer, this means that only a portion of the slit is in contact with the sealing layer area, or that the slit is located across the center of the sealing layer in the width direction, and there are inner and outer portions within the same slit.

[0033] (2) Evaluation of sealing layer peeling (insertion of liquid crystal layer) The interface between the liquid crystal layer and the sealing layer of the obtained evaluation sample was observed using an optical microscope, and peeling of the sealing layer was evaluated as follows: "○" if there was no insertion of the liquid crystal layer; "×" if the insertion of the liquid crystal layer was more than 0 μm but less than 150 μm; and "XX" if the insertion of the liquid crystal layer was 150 μm or more.

[0034] (Examples 2 and 3, Comparative Examples 1 to 6) An evaluation sample was prepared in the same manner as in Example 1, except that the type of substrate was as shown in Table 1 and the number of slits on the outside and inside of the sealing layer was as shown in Table 1 by changing the application position of the sealing resin, and the insertion of the liquid crystal layer was evaluated.

[0035] [Table 1] [Explanation of symbols]

[0036] 1: TFT substrate 11: Base material 12: Insulating layer 13: Photo spacer 2: Opposing substrate 21: Base material 22: Color resist layer 23: Black Matrix 24: Overcoat layer 25: Photo spacer 26: Belt pattern 3: Liquid crystal layer 4: Sealing layer 5: Slit 6: Periphery seal

Claims

1. a TFT substrate having a base material and an insulating layer; an opposing substrate having a substrate, a black matrix, and an overcoat layer; a liquid crystal layer disposed between the TFT substrate and the opposing substrate; a sealing layer provided on the peripheral portions of the TFT substrate and the opposing substrate to seal the liquid crystal layer, at least one of the TFT substrate and the counter substrate is in contact with the sealing layer and has a slit surrounding an outer edge thereof; The slits are arranged only in the outer region of the sealing layer from the center in the width direction.

2. 2. The liquid crystal display device according to claim 1, wherein the slits are provided on both the TFT substrate and the counter substrate.

3. 3. The liquid crystal display device according to claim 1, wherein the bottom surface of said slit is a base material of said TFT substrate or said counter substrate.

4. 3. The liquid crystal display device according to claim 1, wherein the counter substrate has the slits penetrating the overcoat layer and the black matrix, and the entire surface of the black matrix on the slit side is covered with the overcoat layer.

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