Laminated electronic component

Abstract

To realize a desired characteristic while suppressing problem occurrence due to a shield conductor.SOLUTION: An electronic component 1 comprises a laminated body 50, a shield conductor 80 integrated with the laminated body 50, a second inductor L22, and two columnar conductors T5a connected to a ground. The second inductor L22 includes two columnar conductors T2a, two columnar conductors T2b, and a conductor layer 692 for the inductor that connects the two columnar conductors T2a and the two columnar conductors T2b. The shield conductor 80 includes a first conductor portion 80E provided on a side surface 50E of the laminated body 50, and a second conductor portion 80F provided on a side surface 50F of the laminated body 50. The two columnar conductors T5a are arranged between the second inductor L22 and the first conductor portion 80E.SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component having a shield conductor integrated into the laminate. [Background technology]

[0002] In small mobile communication devices, a common configuration is to provide an antenna that is shared by multiple applications with different systems and operating frequency bands, and to separate the multiple signals transmitted and received by this antenna using a duplexer.

[0003] In general, a duplexer that separates a first signal having a frequency within a first frequency band from a second signal having a frequency within a second frequency band higher than the first frequency band includes a common port, a first signal port, a second signal port, a first filter provided in the first signal path from the common port to the first signal port, and a second filter provided in the second signal path from the common port to the second signal port. The first and second filters are, for example, LC resonators configured using inductors and capacitors.

[0004] In recent years, the market has demanded smaller and more space-saving compact mobile communication devices, which has also led to a demand for smaller duplexers used in such communication devices. A known duplexer suitable for miniaturization is a multilayer duplexer that uses a laminate including multiple dielectric layers and multiple conductor layers stacked together. A known inductor used in a multilayer duplexer is an inductor that is composed of a conductor layer and a columnar conductor extending in the stacking direction of the multiple dielectric layers. Such an inductor is disclosed, for example, in Patent Document 1.

[0005] Furthermore, as small mobile communication devices become smaller and more space-saving, the mounting density of electronic components used in communication devices is increasing. As a result, the spacing between multiple electronic components mounted on a mounting board is becoming smaller. As the spacing between multiple electronic components becomes smaller, electromagnetic interference between the multiple electronic components becomes more likely to occur. To suppress electromagnetic interference, it is possible to provide a shield on the main body of the electronic component. Patent Document 2 discloses an electronic component in which an external electrode is provided on the bottom surface of the laminate of the multilayer electronic component and a shield electrode is provided on the surface other than the bottom surface of the laminate of the multilayer electronic component. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent Publication No. 2021-121110 [Patent Document 2] Japanese Patent Application Publication No. 2017-076796 Summary of the Invention [Problem to be solved by the invention]

[0007] When an inductor composed of a conductor layer and a columnar conductor as disclosed in Patent Document 1 is applied to an electronic component having a shield as disclosed in Patent Document 2, when the laminate is made smaller, the coupling between the columnar conductor and the shield becomes stronger, and as a result, it may not be possible to achieve the desired characteristics.

[0008] The above problem is not limited to multilayer duplexers, but applies to all multilayer electronic components that include a shield and an inductor formed of a conductor layer and a columnar conductor.

[0009] The present invention has been made in view of the above problems, and its object is to provide a multilayer electronic component that includes a shielding conductor integrated with a laminate and an inductor formed of a conductor layer and a columnar conductor, and that is capable of achieving desired characteristics while suppressing the occurrence of problems caused by the shielding conductor. [Means for solving the problem]

[0010] A multilayer electronic component according to a first aspect of the present invention includes a laminate including a plurality of stacked dielectric layers, a shielding conductor integrated with the laminate, an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in the stacking direction of the plurality of dielectric layers, and an inductor conductor layer connecting the at least one first columnar conductor and the at least one second columnar conductor, and at least one third columnar conductor extending in the stacking direction and connected to ground. The laminate has a first surface and a second surface located at both ends in the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite each other. The third side surface and the fourth side surface face opposite each other.

[0011] The shield conductor includes a first conductor portion provided on the first side surface and a second conductor portion provided on the second side surface. The inductor conductor layer extends from the first side surface to the second side surface and has a first end and a second end located at opposite ends in the longitudinal direction. At least one first columnar conductor is connected to a portion of the inductor conductor layer near the first end. At least one second columnar conductor is connected to a portion of the inductor conductor layer near the second end. At least one third columnar conductor is disposed between the inductor and the first conductor portion.

[0012] A multilayer electronic component according to a second aspect of the present invention includes a laminate including a plurality of stacked dielectric layers, a shielding conductor integrated with the laminate, an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in the stacking direction of the plurality of dielectric layers, and an inductor conductor layer connecting the at least one first columnar conductor and the at least one second columnar conductor, and a ground conductor layer connected to ground. The laminate has a first surface and a second surface located at both ends in the stacking direction. The shielding conductor includes a conductor portion provided on the first surface. The ground conductor layer is disposed between the inductor and the conductor portion. [Effects of the Invention]

[0013] In a multilayer electronic component according to a first aspect of the present invention, at least one third columnar conductor is disposed between the inductor and the first conductor portion. In a multilayer electronic component according to a second aspect of the present invention, the ground conductor layer is disposed between the inductor and the conductor portion. This makes it possible to achieve desired characteristics while suppressing problems caused by the shield conductor. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a circuit diagram showing an example of a circuit configuration of a multilayer electronic component according to an embodiment of the present invention. [Figure 2] 1 is a perspective view showing the appearance of a multilayer electronic component according to an embodiment of the present invention; [Figure 3] 1 is a perspective view showing a laminate of a multilayer electronic component according to an embodiment of the present invention; [Figure 4] FIG. 2 is an explanatory diagram showing the pattern-forming surfaces of the first to third dielectric layers in the laminate of the multilayer electronic component according to the embodiment of the present invention. [Figure 5] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of fourth to sixth dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 6]FIG. 2 is an explanatory diagram showing pattern-forming surfaces of seventh to eleventh dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 7] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of twelfth to fourteenth dielectric layers in a laminate of a multilayer electronic component according to an embodiment of the present invention. [Figure 8] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of 15th to 17th dielectric layers in a laminate of a multilayer electronic component according to an embodiment of the present invention. [Figure 9] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of the 18th to 20th dielectric layers in the laminate of the multilayer electronic component according to one embodiment of the present invention. [Figure 10] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of 21st to 23rd dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 11] FIG. 2 is an explanatory diagram showing a pattern-forming surface of a 24th dielectric layer in a laminate of a multilayer electronic component according to an embodiment of the present invention. [Figure 12] 1 is a perspective view showing the inside of a laminate of a multilayer electronic component according to an embodiment of the present invention; [Figure 13] 1 is a perspective view showing a part of the interior of a laminate of a multilayer electronic component according to an embodiment of the present invention. [Figure 14] 1 is a plan view showing a part of the interior of a multilayer electronic component according to an embodiment of the present invention. [Figure 15] 1 is a perspective view showing a part of the interior of a laminate of a multilayer electronic component according to an embodiment of the present invention. [Figure 16] FIG. 10 is a characteristic diagram showing frequency characteristics of isolation of the model of the example and the model of the comparative example obtained by simulation. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, with reference to FIG. 1, a schematic configuration of a multilayer electronic component (hereinafter simply referred to as electronic component) 1 according to an embodiment of the present invention will be described. FIG. 1 is a circuit diagram showing the circuit configuration of the electronic component 1. FIG. 1 shows a branching filter (diplexer) as an example of the electronic component 1. The electronic component 1 includes a common terminal 2, a first signal terminal 3, a second signal terminal 4, a first filter 10, and a second filter 20.

[0016] In terms of the circuit configuration, the first filter 10 is provided between the common terminal 2 and the first signal terminal 3. The second filter 20 is provided between the common terminal 2 and the second signal terminal 4. In this application, the expression "in terms of the circuit configuration" is used to refer to the arrangement on a circuit diagram, not the arrangement in a physical configuration.

[0017] The first filter 10 is a filter that selectively passes signals with frequencies within a first pass band. The second filter 20 is a filter that selectively passes signals with frequencies within a second pass band that is higher than the first pass band. Each of the first and second filters 10 and 20 is formed by an LC filter circuit including at least one inductor and at least one capacitor. The first filter 10 corresponds to the "first circuit" in the present invention. The second filter 20 corresponds to the "second circuit" in the present invention.

[0018] A first signal having a frequency within a first passband that is input to the common terminal 2 selectively passes through the first filter 10 and is output from the first signal terminal 3. A second signal having a frequency within a second passband that is input to the common terminal 2 selectively passes through the second filter 20 and is output from the second signal terminal 4. In this way, the electronic component 1 separates the first and second signals.

[0019] Next, an example of the configuration of the first and second filters 10 and 20 will be described with reference to Fig. 1. First, the configuration of the first filter 10 will be described. The first filter 10 includes inductors L11, L12, and L13, and capacitors C11, C12, and C13.

[0020] One end of the inductor L11 is connected to the common terminal 2. One end of the inductor L12 is connected to the other end of the inductor L11. One end of the inductor L13 is connected to the other end of the inductor L12. The other end of the inductor L13 is connected to the first signal terminal 3.

[0021] One end of the capacitor C11 is connected to the connection point between the inductors L11 and L12. One end of the capacitor C12 is connected to the connection point between the inductors L12 and L13. The other ends of the capacitors C11 and C12 are connected to ground. The capacitor C13 is connected in parallel to the inductor L12.

[0022] Next, we will explain the configuration of the second filter 20. The second filter 20 includes a first inductor L21, a second inductor L22, a third inductor L23, a fourth inductor L24, and capacitors C21, C22, C23, C24, C25, C26, C27, and C28.

[0023] One end of the capacitor C21 is connected to the common terminal 2. One end of the capacitor C22 is connected to the other end of the capacitor C21.

[0024] One end of the first inductor L21 is connected to the connection point between the capacitors C21 and C22. The other end of the first inductor L21 is connected to ground. One end of the capacitor C23 is connected to one end of the first inductor L21. The other end of the capacitor C23 is connected to ground.

[0025] One end of the capacitor C24 is connected to the other end of the capacitor C22. One end of the second inductor L22 is connected to the other end of the capacitor C24. The other end of the second inductor L22 is connected to ground. One end of the capacitor C25 is connected to one end of the second inductor L22. The other end of the capacitor C25 is connected to ground.

[0026] One end of the fourth inductor L24 is connected to the connection point between the capacitors C22 and C24. The capacitor C28 is connected in parallel to the fourth inductor L24.

[0027] One end of the capacitor C26 is connected to the other end of the fourth inductor L24. The other end of the capacitor C26 is connected to the second signal terminal 4. One end of the third inductor L23 is connected to the other end of the capacitor C26. The other end of the third inductor L23 is connected to ground. One end of the capacitor C27 is connected to one end of the third inductor L23. The other end of the capacitor C27 is connected to ground.

[0028] The second filter 20 further includes a parallel resonant circuit 21. In Fig. 1, symbol P denotes a node between one end of the first inductor L21 and one end of the second inductor L22 in the circuit configuration. The parallel resonant circuit 21 is provided on a path 22 connecting the node P and one end of the third inductor L23. In the example shown in Fig. 1, the parallel resonant circuit 21 includes a fourth inductor L24 and a capacitor C28.

[0029] Next, other configurations of the electronic component 1 will be described with reference to Figures 2 and 3. Figure 2 is a perspective view showing the appearance of the electronic component 1. Figure 3 is a perspective view showing the laminate of the electronic component 1.

[0030] The electronic component 1 includes a laminate 50. The laminate 50 includes a plurality of laminated dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through holes). The common terminal 2, the first signal terminal 3, the second signal terminal 4, the first filter 10, and the second filter 20 are integrated into the laminate 50.

[0031] The laminate 50 has a first surface 50A and a second surface 50B located at both ends of the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. The side surfaces 50C and 50D face in opposite directions from each other, and the side surfaces 50E and 50F also face in opposite directions from each other. The side surfaces 50C to 50F may be perpendicular to the first surface 50A and the second surface 50B.

[0032] Here, the X direction, Y direction, and Z direction are defined as shown in FIGS. 2 and 3. The X direction, Y direction, and Z direction are perpendicular to each other. In this embodiment, a direction parallel to the stacking direction T is defined as the Z direction. The direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. The expression "when viewed from a predetermined direction (e.g., stacking direction T)" means that the object is viewed from a position away from the predetermined direction or a direction parallel to the predetermined direction.

[0033] As shown in FIG. 3, the first surface 50A is located at the end of the stack 50 in the Z direction. The first surface 50A is also the top surface of the stack 50. The second surface 50B is located at the end of the stack 50 in the -Z direction. The second surface 50B is also the bottom surface of the stack 50. The side surface 50C is located at the end of the stack 50 in the -X direction. The side surface 50D is located at the end of the stack 50 in the X direction. The side surface 50E is located at the end of the stack 50 in the -Y direction. The side surface 50F is located at the end of the stack 50 in the Y direction.

[0034] As shown in FIGS. 2 and 3 , the electronic component 1 further includes electrodes 111, 112, and 113 provided on the second surface 50B of the laminate 50. The electrode 111 is located closer to the side surface 50F than to the side surface 50E. The electrodes 112 and 113 are located closer to the side surface 50E than to the side surface 50F. The electrode 112 is located near the corner where the side surface 50C intersects with the side surface 50E, and the electrode 113 is located near the corner where the side surface 50D intersects with the side surface 50E. The electrode 111 corresponds to the common terminal 2, the electrode 112 corresponds to the first signal terminal 3, and the electrode 113 corresponds to the second signal terminal 4. Therefore, the common terminal 2 and the first and second signal terminals 3 and 4 are provided on the second surface 50B of the laminate 50.

[0035] The electronic component 1 further includes electrodes 114, 115, and 116 provided on the second surface 50B of the laminate 50. The electrode 114 is disposed between the electrode 112 and the electrode 113. The electrode 115 is disposed between the electrode 111 and the side surface 50D. The electrode 116 is disposed between the electrode 111 and the side surface 50C. Each of the electrodes 114, 115, and 116 is connected to ground.

[0036] The electronic component 1 further includes a shielding conductor 80 made of a conductor and integrated with the laminate 50. The shielding conductor 80 includes a first conductor portion 80E provided on the side surface 50E of the laminate 50 and a second conductor portion 80F provided on the side surface 50F of the laminate 50. In this embodiment in particular, the first conductor portion 80E covers the entirety or almost the entirety of the side surface 50E. The second conductor portion 80F covers the entirety or almost the entirety of the side surface 50F.

[0037] The shield conductor 80 further includes a conductor portion 80A provided on the first surface 50A of the laminate 50, a conductor portion 80C provided on the side surface 50C of the laminate 50, and a conductor portion 80D provided on the side surface 50D of the laminate 50. In particular, in this embodiment, the conductor portion 80A covers the entire first surface 50A. The conductor portion 80C covers the entire or almost the entire side surface 50C. The conductor portion 80D covers the entire or almost the entire side surface 50D.

[0038] The shield conductor 80 may include multiple laminated metal layers. In this case, the first conductor portion 80E, the second conductor portion 80F, and the conductor portions 80A, 80C, and 80D are preferably continuous. That is, the first and second conductor portions 80E and 80F are preferably connected to the conductor portions 80A, 80C, and 80D, respectively.

[0039] The shielding conductor 80 is electrically connected to the electrodes 114, 115, and 116. The laminate 50 includes a plurality of conductors that electrically connect the shielding conductor 80 and the electrodes 114, 115, and 116.

[0040] Next, an example of the plurality of dielectric layers and the plurality of conductors constituting the laminate 50 will be described with reference to Figures 4(a) to 11. In this example, the laminate 50 includes 24 laminated dielectric layers. Hereinafter, these 24 dielectric layers will be referred to as the 1st to 24th dielectric layers, in order from the bottom up. The 1st to 24th dielectric layers will be denoted by reference numerals 51 to 74.

[0041] In Figures 4(a) to 10(b), multiple circles represent multiple through holes. Multiple through holes are formed in each of the dielectric layers 51 to 72. The multiple through holes are formed by filling holes for the through holes with conductive paste. Each of the multiple through holes is connected to an electrode, a conductive layer, or another through hole. In the following explanation, the connection relationship between each of the multiple through holes and the electrodes, conductive layers, or other through holes is explained in terms of the connection relationship when the first to twenty-fourth dielectric layers 51 to 74 are stacked. Also, in Figures 4(a) to 10(b), multiple specific through holes among the multiple through holes are each assigned a reference symbol.

[0042] 4(a) shows the pattern-formed surface of the first dielectric layer 51. On the pattern-formed surface of the dielectric layer 51, electrodes 111 to 116 are formed.

[0043] 4(a), the two through holes marked with the reference numeral 51T6 are connected to the electrode 114. In the following description, the through holes marked with the reference numeral 51T6 will be simply referred to as the through holes 51T6. Furthermore, through holes marked with reference numerals other than the through hole 51T6 will also be referred to in the same manner as the through hole 51T6.

[0044] The two through holes 51T7 shown in Fig. 4(a) are connected to the electrode 115. The two through holes 51T8 shown in Fig. 4(a) are connected to the electrode 116.

[0045] 4(b) shows the pattern-formed surface of the second dielectric layer 52. Conductor layers 521, 522, 523, and 524 are formed on the pattern-formed surface of the dielectric layer 52. Two through holes 51T6 and two through holes 51T8, and two through holes 52T6 and two through holes 52T8 shown in FIG. 4(b), are connected to the conductor layer 521. Two through holes 51T7 and two through holes 52T7 shown in FIG. 4(b) are connected to the conductor layer 524.

[0046] 4(c) shows the pattern-formed surface of the third dielectric layer 53. Conductor layers 531, 532, 533, and 534 are formed on the pattern-formed surface of the dielectric layer 53. Two through holes 52T6, two through holes 52T7, and two through holes 52T8, and two through holes 53T1a, two through holes 53T2b, two through holes 53T5a, and through hole 53T5b shown in FIG. 4(c) are connected to the conductor layer 534.

[0047] 5(a) shows the pattern-formed surface of the fourth dielectric layer 54. Two through holes 53T1a, two through holes 53T2b, two through holes 53T5a, and a through hole 53T5b are connected to two through holes 54T1a, two through holes 54T2b, two through holes 54T5a, and a through hole 54T5b shown in FIG.

[0048] FIG. 5(b) shows the pattern-formed surface of the fifth dielectric layer 55. Conductor layers 551, 552, 553, and 554 are formed on the pattern-formed surface of the dielectric layer 55. Two through holes 54T1a, two through holes 54T2b, two through holes 54T5a, and a through hole 54T5b are connected to two through holes 55T1a, two through holes 55T2b, two through holes 55T5a, and a through hole 55T5b shown in FIG. 5(b), respectively. Two through holes 55T2a shown in FIG. 5(b) are connected to a conductor layer 553. Two through holes 55T3b shown in FIG. 5(b) are connected to a conductor layer 554.

[0049] FIG. 5(c) shows the pattern-formed surface of the sixth dielectric layer 56. Conductor layers 561 and 562 are formed on the pattern-formed surface of the dielectric layer 56. Two through holes 55T1a, two through holes 55T2a, two through holes 55T2b, two through holes 55T3b, two through holes 55T5a, and a through hole 55T5b are respectively connected to two through holes 56T1a, two through holes 56T2a, two through holes 56T2b, two through holes 56T3b, two through holes 56T5a, and a through hole 56T5b shown in FIG. 5(c). Two through holes 56T1b shown in FIG. 5(c) are connected to a conductor layer 561. A through hole 56T4b shown in FIG. 5(c) is connected to a conductor layer 562.

[0050] FIG. 6(a) shows the pattern-formed surface of the seventh dielectric layer 57. A conductor layer 571 is formed on the pattern-formed surface of the dielectric layer 57. Two through holes 56T1a, two through holes 56T1b, two through holes 56T2a, two through holes 56T2b, two through holes 56T3b, through hole 56T4b, two through holes 56T5a, and through hole 56T5b are respectively connected to two through holes 57T1a, two through holes 57T1b, two through holes 57T2a, two through holes 57T2b, two through holes 57T3b, through hole 57T4b, two through holes 57T5a, and through hole 57T5b shown in FIG. 6(a). The through hole 57T4a shown in FIG. 6(a) is connected to the conductor layer 571.

[0051] 6(b) shows the pattern-formed surface of the eighth dielectric layer 58. Conductor layers 581, 582, 583, and 584 are formed on the pattern-formed surface of the dielectric layer 58. The conductor layer 581 is connected to the first conductor portion 80E (see FIG. 2) of the shielding conductor 80. The conductor layer 583 is connected to the second conductor portion 80F (see FIG. 2) of the shielding conductor 80. The conductor layer 584 is connected to the second conductor portion 80F and the conductor portion 80C (see FIG. 2) of the shielding conductor 80.

[0052] The two through holes 57T1a and the two through holes 57T5a, and the two through holes 58T1a, the two through holes 58T3a, and the two through holes 58T5a shown in FIG. 6(b), are connected to the conductor layer 581. The two through holes 57T1b, the two through holes 57T2a, the two through holes 57T3b, the through hole 57T4b, and the through hole 57T5b are connected to the two through holes 58T1b, the two through holes 58T2a, the two through holes 58T3b, the through hole 58T4b, and the through hole 58T5b shown in FIG. 6(b), respectively. The two through holes 57T2b and the two through holes 58T2b shown in FIG. 6(b) are connected to the conductor layer 583. The through hole 57T4a and the through hole 58T4a shown in FIG. 6(b) are connected to the conductor layer 582.

[0053] 6(c) shows the pattern-formed surfaces of the ninth through eleventh dielectric layers 59-61. Two through holes 58T1a, two through holes 58T1b, two through holes 58T2a, two through holes 58T2b, two through holes 58T3a, two through holes 58T3b, two through holes 58T5a, and through hole 58T5b are respectively connected to two through holes 59T1a, two through holes 59T1b, two through holes 59T2a, two through holes 59T2b, two through holes 59T3a, two through holes 59T3b, two through holes 59T5a, and through hole 59T5b formed in the dielectric layer 59. The through holes 58T4a and 58T4b are respectively connected to through holes 59T4a and 59T4b formed in the dielectric layer 59. In addition, in the dielectric layers 59 to 61, through holes with the same reference numerals that are connected above and below are connected to each other.

[0054] 7A shows the pattern-formed surface of the twelfth dielectric layer 62. Two through holes 59T1a, two through holes 59T1b, two through holes 59T2a, two through holes 59T2b, two through holes 59T3a, two through holes 59T3b, two through holes 59T5a, and through hole 59T5b formed in the dielectric layer 61 are connected to two through holes 62T1a, two through holes 62T1b, two through holes 62T2a, two through holes 62T2b, two through holes 62T3a, two through holes 62T3b, two through holes 62T5a, and through hole 62T5b shown in FIG. 7A, respectively. Through holes 59T4a and 59T4b formed in the dielectric layer 61 are connected to through holes 62T4a and 62T4b shown in FIG. 7A, respectively.

[0055] 7(b) shows the pattern formation surface of the 13th dielectric layer 63. Conductor layers 631 and 632 for inductors are formed on the pattern formation surface of the dielectric layer 63. Two through holes 62T1a, two through holes 62T1b, two through holes 62T2a, two through holes 62T2b, two through holes 62T3a, two through holes 62T3b, two through holes 62T5a, and through hole 62T5b are connected to two through holes 63T1a, two through holes 63T1b, two through holes 63T2a, two through holes 63T2b, two through holes 63T3a, two through holes 63T3b, two through holes 63T5a, and through hole 63T5b shown in FIG. The through holes 62T4a and 62T4b are connected to the through holes 63T4a and 63T4b shown in FIG. 7(b), respectively.

[0056] 7(c) shows the pattern-formed surface of the 14th dielectric layer 64. Two through holes 63T1a, two through holes 63T1b, two through holes 63T2a, two through holes 63T2b, two through holes 63T3a, two through holes 63T3b, two through holes 63T5a, and through hole 63T5b are respectively connected to two through holes 64T1a, two through holes 64T1b, two through holes 64T2a, two through holes 64T2b, two through holes 64T3a and two through holes 64T3b, and two through holes 64T5a and through hole 64T5b shown in FIG. 7(c). Through holes 63T4a and 63T4b are respectively connected to through holes 64T4a and 64T4b shown in FIG.

[0057] 8(a) shows the pattern formation surface of the 15th dielectric layer 65. A conductor layer 651 for an inductor is formed on the pattern formation surface of the dielectric layer 65. The conductor layer 651 has a first end and a second end located at both ends of the conductor layer 651 in the longitudinal direction. A through-hole 64T4a is connected to a portion of the conductor layer 651 near the first end. A through-hole 64T4b is connected to a portion of the conductor layer 651 near the second end.

[0058] Two through holes 64T1a, two through holes 64T1b, two through holes 64T2a, two through holes 64T2b, two through holes 64T3a, two through holes 64T3b, two through holes 64T5a and through hole 64T5b are respectively connected to two through holes 65T1a, two through holes 65T1b, two through holes 65T2a, two through holes 65T2b, two through holes 65T3a, two through holes 65T3b, two through holes 65T5a and through hole 65T5b shown in Figure 8(a).

[0059] 8(b) shows the pattern formation surface of the 16th dielectric layer 66. A conductor layer 661 for an inductor and a conductor layer 664 are formed on the pattern formation surface of the dielectric layer 66. The conductor layer 664 is connected to the second conductor portion 80F and the conductor portion 80C of the shield conductor 80 (see FIG. 2).

[0060] Two through holes 65T1a, two through holes 65T1b, two through holes 65T2a, two through holes 65T2b, two through holes 65T3a, two through holes 65T3b, two through holes 65T5a and through hole 65T5b are respectively connected to two through holes 66T1a, two through holes 66T1b, two through holes 66T2a, two through holes 66T2b, two through holes 66T3a, two through holes 66T3b, two through holes 66T5a and through hole 66T5b shown in Figure 8(b).

[0061] 8(c) shows the pattern-formed surface of the 17th dielectric layer 67. Two through holes 66T1a, two through holes 66T1b, two through holes 66T2a, two through holes 66T2b, two through holes 66T3a, two through holes 66T3b, two through holes 66T5a, and through hole 66T5b are respectively connected to two through holes 67T1a, two through holes 67T1b, two through holes 67T2a, two through holes 67T2b, two through holes 67T3a, two through holes 67T3b, two through holes 67T5a, and through hole 67T5b shown in FIG.

[0062] 9(a) shows the pattern-formed surface of the 18th dielectric layer 68. Conductor layers 681 and 683 are formed on the pattern-formed surface of the dielectric layer 68. The conductor layer 681 is connected to a first conductor portion 80E (see FIG. 2) of the shield conductor 80. The conductor layer 683 is connected to a second conductor portion 80F (see FIG. 2) of the shield conductor 80.

[0063] The two through holes 67T1a, the two through holes 67T3a, and the two through holes 67T5a, and the two through holes 68T1a, the two through holes 68T3a, and the two through holes 68T5a shown in FIG. 9(a), are connected to the conductor layer 681. The two through holes 67T1b, the two through holes 67T2a, the two through holes 67T3b, and the through hole 67T5b are connected to the two through holes 68T1b, the two through holes 68T2a, the two through holes 68T3b, and the through hole 68T5b shown in FIG. 9(a), respectively. The two through holes 67T2b and the two through holes 68T2b shown in FIG. 9(a) are connected to the conductor layer 683.

[0064] FIG. 9(b) shows the pattern-formed surface of the 19th dielectric layer 69. Inductor conductor layers 691, 692, and 693 are formed on the pattern-formed surface of the dielectric layer 69. The conductor layer 691 has a first end 691a and a second end 691b located at both ends of the conductor layer 691 in the longitudinal direction. The conductor layer 692 has a first end 692a and a second end 692b located at both ends of the conductor layer 692 in the longitudinal direction. The conductor layer 693 has a first end 693a and a second end 693b located at both ends of the conductor layer 693 in the longitudinal direction. Each of the first ends 691a, 692a, and 693a is located closer to the first conductor portion 80E of the shield conductor 80 than to the second conductor portion 80F of the shield conductor 80 (upper positions in FIG. 9(b)). Each of the second ends 691b, 692b, 693b is located closer to the second conductor portion 80F of the shield conductor 80 than to the first conductor portion 80E of the shield conductor 80 (lower position in FIG. 9(b)).

[0065] The two through holes 68T1a and the two through holes 69T1a shown in FIG. 9(b) are connected to a portion near a first end 691a of the conductor layer 691. The two through holes 68T1b and the two through holes 69T1b shown in FIG. 9(b) are connected to a portion near a second end 691b of the conductor layer 691. The two through holes 68T2a and the two through holes 69T2a shown in FIG. 9(b) are connected to a portion near a first end 692a of the conductor layer 692. The two through holes 68T2b and the two through holes 69T2b shown in FIG. 9(b) are connected to a portion near a second end 692b of the conductor layer 692. The two through holes 68T3a and the two through holes 69T3a shown in FIG. 9(b) are connected to a portion near a first end 693a of the conductor layer 693. The two through holes 68T3b and the two through holes 69T3b shown in Fig. 9(b) are connected to a portion near the second end 693b of the conductor layer 693. The two through holes 68T5a and the through hole 68T5b are connected to the two through holes 69T5a and the through hole 69T5b shown in Fig. 9(b), respectively.

[0066] FIG. 9(c) shows the pattern-formed surface of the 20th dielectric layer 70. Inductor conductor layers 701, 702, and 703 are formed on the pattern-formed surface of the dielectric layer 70. The conductor layer 701 has a first end 701a and a second end 701b located at both ends of the conductor layer 701 in the longitudinal direction. The conductor layer 702 has a first end 702a and a second end 702b located at both ends of the conductor layer 702 in the longitudinal direction. The conductor layer 703 has a first end 703a and a second end 703b located at both ends of the conductor layer 703 in the longitudinal direction. Each of the first ends 701a, 702a, and 703a is located closer to the first conductor portion 80E of the shield conductor 80 than to the second conductor portion 80F of the shield conductor 80 (upper positions in FIG. 9(c)). Each of the second ends 701b, 702b, 703b is located closer to the second conductor portion 80F of the shield conductor 80 than to the first conductor portion 80E of the shield conductor 80 (lower position in FIG. 9(c)).

[0067] The two through holes 69T1a are connected to a portion near the first end 701a of the conductor layer 701. The two through holes 69T1b are connected to a portion near the second end 701b of the conductor layer 701. The two through holes 69T2a are connected to a portion near the first end 702a of the conductor layer 702. The two through holes 69T2b are connected to a portion near the second end 702b of the conductor layer 702. The two through holes 69T3a are connected to a portion near the first end 703a of the conductor layer 703. The two through holes 69T3b are connected to a portion near the second end 703b of the conductor layer 703. The two through holes 69T5a and 69T5b are connected to the two through holes 70T5a and 70T5b shown in FIG. 9(c), respectively.

[0068] 10(a) shows the pattern-formed surface of the 21st dielectric layer 71. A conductor layer 711 is formed on the pattern-formed surface of the dielectric layer 71. The conductor layer 711 is connected to the second conductor portion 80F (see FIG. 2) of the shield conductor 80. The two through holes 70T5a and 70T5b are connected to the two through holes 71T5a and 71T5b shown in FIG. 10(a), respectively.

[0069] Fig. 10(b) shows the patterned surface of the 22nd dielectric layer 72. The two through holes 71T5a and 71T5b are respectively connected to the two through holes 72T5a and 72T5b shown in Fig. 10(b).

[0070] FIG. 10(c) shows the pattern-formed surface of the 23rd dielectric layer 73. A conductor layer 731 is formed on the pattern-formed surface of the dielectric layer 73. The conductor layer 731 has a first end 731a and a second end 731b located at both ends of the conductor layer 731 in the longitudinal direction. The first end 731a is located closer to the first conductor portion 80E of the shield conductor 80 than the second conductor portion 80F of the shield conductor 80 (upper position in FIG. 10(c)). The second end 731b is located closer to the second conductor portion 80F of the shield conductor 80 than the first conductor portion 80E of the shield conductor 80 (lower position in FIG. 10(c)).

[0071] The two through holes 72T5a are connected to a portion of the conductor layer 731 near the first end 731a. The through hole 72T5b is connected to a portion of the conductor layer 731 near the second end 731b.

[0072] 11 shows the pattern-formed surface of the 24th dielectric layer 74. On the pattern-formed surface of the dielectric layer 74, a mark 741 is formed.

[0073] The laminate 50 shown in Figure 2 is constructed by stacking the first to twenty-fourth dielectric layers 51 to 74 so that the pattern-forming surface of the first dielectric layer 51 becomes the second surface 50B of the laminate 50, and the surface opposite the pattern-forming surface of the twenty-fourth dielectric layer 74 becomes the first surface 50A of the laminate 50.

[0074] Fig. 12 shows the inside of the laminate 50, which is formed by stacking the 1st to 24th dielectric layers 51 to 74. As shown in Fig. 12, the multiple conductor layers and multiple through holes shown in Figs. 4(a) to 10(c) are stacked inside the laminate 50. Note that the mark 741 is omitted in Fig. 12.

[0075] The following describes the correspondence between the components of the circuit of the electronic component 1 shown in Figure 1 and the components inside the laminate 50 shown in Figures 4(a) to 11. First, the first filter 10 will be described.

[0076] The inductor L11 is formed by an inductor conductor layer 661. The inductor L12 is formed by an inductor conductor layer 631. The inductor L13 is formed by an inductor conductor layer 632.

[0077] Capacitor C11 is composed of conductor layers 521 and 531 and a dielectric layer 52 between these conductor layers. Capacitor C12 is composed of conductor layers 532 and 551 and a dielectric layer 53 between these conductor layers. Capacitor C13 is composed of conductor layers 531 and 551 and a dielectric layer 53 between these conductor layers.

[0078] Next, a description will be given of the components of the second filter 20. The first inductor L21 is formed by inductor conductor layers 691 and 701 and through holes 53T1a, 54T1a, 55T1a, 56T1a, 56T1b, 57T1a, 57T1b, 58T1a, 58T1b, 59T1a, 59T1b, 62T1a, 62T1b, 63T1a, 63T1b, 64T1a, 64T1b, 65T1a, 65T1b, 66T1a, 66T1b, 67T1a, 67T1b, 68T1a, 68T1b, 69T1a, and 69T1b.

[0079] The second inductor L22 is composed of inductor conductor layers 692, 702 and through holes 53T2b, 54T2b, 55T2a, 55T2b, 56T2a, 56T2b, 57T2a, 57T2b, 58T2a, 58T2b, 59T2a, 59T2b, 62T2a, 62T2b, 63T2a, 63T2b, 64T2a, 64T2b, 65T2a, 65T2b, 66T2a, 66T2b, 67T2a, 67T2b, 68T2a, 68T2b, 69T2a, 69T2b.

[0080] The third inductor L23 is composed of inductor conductor layers 693, 703 and through holes 55T3b, 56T3b, 57T3b, 58T3a, 58T3b, 59T3a, 59T3b, 62T3a, 62T3b, 63T3a, 63T3b, 64T3a, 64T3b, 65T3a, 65T3b, 66T3a, 66T3b, 67T3a, 67T3b, 68T3a, 68T3b, 69T3a, 69T3b.

[0081] The fourth inductor L24 is composed of an inductor conductor layer 651, a conductor layer 582, and through holes 56T4b, 57T4a, 57T4b, 58T4a, 58T4b, 59T4a, 59T4b, 62T4a, 62T4b, 63T4a, 63T4b, 64T4a, and 64T4b.

[0082] Capacitor C21 is composed of conductor layers 522 and 533 and a dielectric layer 52 between these conductor layers. Capacitor C22 is composed of conductor layers 561 and 571 and a dielectric layer 56 between these conductor layers. Capacitor C23 is composed of conductor layers 534, 552, and 561 and dielectric layers 53 to 55 between these conductor layers. Capacitor C24 is composed of conductor layers 553 and 571 and dielectric layers 55 and 56 between these conductor layers. Capacitor C25 is composed of conductor layers 534 and 553 and dielectric layers 53 and 54 between these conductor layers.

[0083] Capacitor C26 is formed by conductor layers 554 and 562 and a dielectric layer 55 between these conductor layers. Capacitor C27 is formed by conductor layers 534 and 554 and a dielectric layer 53 between these conductor layers. Capacitor C28 is formed by conductor layers 562 and 571 and a dielectric layer 56 between these conductor layers.

[0084] Next, structural features of the electronic component 1 according to this embodiment will be described with reference to FIGS. 1 to 15. FIG. 13 is a perspective view showing a portion of the interior of the electronic component 1. Among the components of the electronic component 1 shown in FIG. 1, FIG. 13 shows first to fourth inductors L21 to L24 of the second filter 20. FIG. 14 is a plan view showing a portion of the interior of the electronic component 1. FIG. 14 shows the interior of the laminate 50 as seen from the first surface 50A side of the laminate 50. In FIG. 14, the conductor portion 80A of the shield conductor 80 (see FIG. 2) is omitted. FIG. 15 is a perspective view showing a portion of the interior of the electronic component 1. In FIG. 15, the second inductor L22 and a ground structure, which will be described later, are also shown.

[0085] First, we will explain the features related to the first to third inductors L21, L22, and L23 of the second filter 20. As shown in Figures 13 and 14, the second inductor L22 is arranged between the first inductor L21 and the third inductor L23. The first to third inductors L21, L22, and L23 are lined up in this order from the side surface 50C of the laminate 50 toward the side surface 50D of the laminate 50.

[0086] The first to third inductors L21, L22, and L23 are all inductors wound around an axis extending in a direction perpendicular to the stacking direction T. Here, a columnar structure formed by connecting multiple through holes in series is called a columnar conductor. The columnar conductor extends in a direction parallel to the stacking direction T. Each of the first to third inductors L21, L22, and L23 includes at least one conductor layer and multiple columnar conductors.

[0087] Each of the first to third inductors L21, L22, and L23 is also a rectangular or nearly rectangular winding. In a rectangular or nearly rectangular winding, when the winding is considered to be a rectangle, the number of turns may be counted as 1 / 4 turns per side of the rectangle. In this embodiment, the number of turns of each of the first to third inductors L21, L22, and L23 is 3 / 4 turns.

[0088] The first inductor L21 includes two columnar conductors T1a and two columnar conductors T1b each extending in the stacking direction T, and an inductor conductor layer 691 connecting the two columnar conductors T1a and the two columnar conductors T1b. The conductor layer 691 extends along a plane intersecting the stacking direction T, i.e., along the pattern formation surface of the dielectric layer 69. In this embodiment, the conductor layer 691 extends from the side surface 50E toward the side surface 50F. The two columnar conductors T1a are connected to a portion of the conductor layer 691 near a first end 691a. The two columnar conductors T1b are connected to a portion of the conductor layer 691 near a second end 691b.

[0089] The two columnar conductors T1a are configured by connecting through holes 53T1a, 54T1a, 55T1a, 56T1a, 57T1a, 58T1a, 59T1a, 62T1a, 63T1a, 64T1a, 65T1a, 66T1a, 67T1a, and 68T1a in series. The two columnar conductors T1b are configured by connecting through holes 56T1b, 57T1b, 58T1b, 59T1b, 62T1b, 63T1b, 64T1b, 65T1b, 66T1b, 67T1b, and 68T1b in series.

[0090] The two columnar conductors T1a are connected to the first conductor portion 80E of the shield conductor 80 via the conductor layers 581 and 681. The two columnar conductors T1a are also connected to the electrodes 114, 115, and 116, which are connected to ground, via the conductor layer 534, through holes 52T6, 52T7, and 52T8, conductor layers 521 and 524, and through holes 51T6, 51T7, and 51T8.

[0091] The first inductor L21 is wound around a first axis perpendicular to the stacking direction T so as to form a first opening surrounded by the conductor layer 691, the two columnar conductors T1a, and the two columnar conductors T1b. The first axis may extend in a direction parallel to the X direction.

[0092] The first inductor L21 further includes a conductor layer 701, and through holes 69T1a and 69T1b that electrically connect the conductor layer 691 and the conductor layer 701. The conductor layer 701 extends from the side surface 50E toward the side surface 50F.

[0093] The second inductor L22 includes two columnar conductors T2a and two columnar conductors T2b that extend in the stacking direction T, and a conductor layer 692 that connects the two columnar conductors T2a and T2b. The conductor layer 692 extends along a plane that intersects with the stacking direction T, i.e., along the pattern formation surface of the dielectric layer 69. In this embodiment, the conductor layer 692 extends from the side surface 50E to the side surface 50F. The two columnar conductors T2a are connected to a portion of the conductor layer 692 near a first end 692a. The two columnar conductors T2b are connected to a portion of the conductor layer 692 near a second end 692b.

[0094] The two columnar conductors T2a are configured by connecting through holes 55T2a, 56T2a, 57T2a, 58T2a, 59T2a, 62T2a, 63T2a, 64T2a, 65T2a, 66T2a, 67T2a, and 68T2a in series. The two columnar conductors T2b are configured by connecting through holes 53T2b, 54T2b, 55T2b, 56T2b, 57T2b, 58T2b, 59T2b, 62T2b, 63T2b, 64T2b, 65T2b, 66T2b, 67T2b, and 68T2b in series.

[0095] The two columnar conductors T2b are connected to the second conductor portion 80F of the shield conductor 80 via the conductor layers 583 and 683. The two columnar conductors T2b are also connected to the electrodes 114, 115, and 116 connected to ground via the conductor layer 534, through holes 52T6, 52T7, and 52T8, conductor layers 521 and 524, and through holes 51T6, 51T7, and 51T8.

[0096] The second inductor L22 is wound around a second axis perpendicular to the stacking direction T so as to form a second opening surrounded by the conductor layer 692, the two columnar conductors T2a, and the two columnar conductors T2b. The second axis may extend in a direction parallel to the X direction.

[0097] The second inductor L22 further includes a conductor layer 702 and through holes 69T2a and 69T2b that electrically connect the conductor layer 692 and the conductor layer 702. The conductor layer 702 extends from the side surface 50E toward the side surface 50F.

[0098] The third inductor L23 includes two columnar conductors T3a and two columnar conductors T3b that extend in the stacking direction T, and a conductor layer 693 that connects the two columnar conductors T3a and the two columnar conductors T3b. The conductor layer 693 extends along a plane that intersects with the stacking direction T, i.e., along the pattern formation surface of the dielectric layer 69. In this embodiment, the conductor layer 693 extends from the side surface 50E to the side surface 50F. The two columnar conductors T3a are connected to a portion of the conductor layer 693 near a first end 693a. The two columnar conductors T3b are connected to a portion of the conductor layer 693 near a second end 693b.

[0099] The two columnar conductors T3a are configured by connecting through holes 58T3a, 59T3a, 62T3a, 63T3a, 64T3a, 65T3a, 66T3a, 67T3a, and 68T3a in series. The two columnar conductors T3b are configured by connecting through holes 55T3b, 56T3b, 57T3b, 58T3b, 59T3b, 62T3b, 63T3b, 64T3b, 65T3b, 66T3b, 67T3b, and 68T3b in series.

[0100] The two columnar conductors T3a are connected to the first conductor portion 80E of the shield conductor 80 via the conductor layers 581 and 681. The two columnar conductors T3a are also connected to the electrodes 114, 115, and 116, which are connected to ground, via the conductor layer 534, through holes 52T6, 52T7, and 52T8, conductor layers 521 and 524, and through holes 51T6, 51T7, and 51T8.

[0101] The third inductor L23 is wound around a third axis perpendicular to the stacking direction T so as to form a third opening surrounded by the conductor layer 693, the two columnar conductors T3a, and the two columnar conductors T3b. The third axis may extend in a direction parallel to the X direction.

[0102] The third inductor L23 further includes a conductor layer 703, and through holes 69T3a and 69T3b that electrically connect the conductor layer 693 and the conductor layer 703. The conductor layer 703 extends from the side surface 50E toward the side surface 50F.

[0103] Here, the winding direction of an inductor is defined as the direction from one end of the inductor to the other end. One end of the inductor is the end farther from ground in the circuit configuration, and the other end of the inductor is the end closer to ground in the circuit configuration. The winding direction of the first inductor L21 is from the two through holes 56T1b to the two columnar conductors T1b, the conductor layer 691, and the two columnar conductors T1a, and then to the two through holes 53T1a. The winding direction of the second inductor L22 is from the two through holes 55T2a to the two columnar conductors T2a, the conductor layer 692, and the two columnar conductors T2b, and then to the two through holes 53T2b. The winding direction of the third inductor L23 is from the two through holes 55T3b to the two columnar conductors T3b, the conductor layer 693, and the two columnar conductors T3a, and then to the two through holes 58T3a.

[0104] The first to third inductors L21, L22, and L23 are arranged such that, when viewed from a direction parallel to the X direction, the first opening of the first inductor L21, the second opening of the second inductor L22, and the third opening of the third inductor L23 overlap. When viewed from the X direction, the winding direction of the third inductor L23 is the same as the winding direction of the first inductor L21. When viewed from the X direction, the winding direction of the second inductor L22 is opposite to the winding directions of the first and third inductors L21 and L23.

[0105] Next, features related to the first to third inductors L21, L22, and L23 and the shield conductor 80 will be described. As described above, the first end 692a of the conductor layer 692 of the second inductor L22 is located closer to the first conductor portion 80E of the shield conductor 80 than to the second conductor portion 80F of the shield conductor 80, and the second end 692b of the conductor layer 692 of the second inductor L22 is located closer to the second conductor portion 80F of the shield conductor 80 than to the first conductor portion 80E of the shield conductor 80. In FIG. 14, an arrow labeled D1 represents the distance between the first end 692a of the conductor layer 692 and the first conductor portion 80E. An arrow labeled D2 represents the distance between the second end 692b of the conductor layer 692 and the second conductor portion 80F. The distance D1 is greater than the distance D2.

[0106] 14, the distance D1 is larger than the distance between the first end 691a of the conductor layer 691 of the first inductor L21 and the first conductor portion 80E and the distance between the first end 693a of the conductor layer 693 of the third inductor L23 and the first conductor portion 80E. The distance D2 is the same as or approximately the same as the distance between the second end 691b of the conductor layer 691 of the first inductor L21 and the second conductor portion 80F and the distance between the second end 693b of the conductor layer 693 of the third inductor L23 and the second conductor portion 80F. Therefore, the conductor layer 692 is shorter than each of the conductor layers 691 and 693.

[0107] The shapes and arrangement of the conductor layers 701 to 703 are the same as or nearly the same as those of the conductor layers 691 to 693, except for their positions in the stacking direction T. The above explanation of the intervals D1 and D2 also applies to the conductor layers 701 to 703. If the conductor layers 691 to 693 in the above explanation of the intervals D1 and D2 are replaced with the conductor layers 701 to 703, respectively, the explanation becomes as to the intervals D1 and D2 relating to the conductor layers 701 to 703.

[0108] The two columnar conductors T1a of the first inductor L21, the two columnar conductors T2a of the second inductor L22, and the two columnar conductors T3a of the third inductor L23 are located closer to the first conductor portion 80E than to the second conductor portion 80F. The two columnar conductors T1b of the first inductor L21, the two columnar conductors T2b of the second inductor L22, and the two columnar conductors T3b of the third inductor L23 are located closer to the second conductor portion 80F than to the first conductor portion 80E.

[0109] Next, features related to the shield conductor 80 and ground will be described. The shield conductor 80 is connected to electrodes 114, 115, and 116, which are connected to ground, via multiple conductors provided within the laminate 50. That is, the second conductor portion 80F and the conductor portion 80C of the shield conductor 80 are connected to conductor layers 584 and 664. The conductor layer 664 is connected to the conductor layer 584 via multiple through holes. The conductor layer 584 is connected to the conductor layer 532 via multiple through holes. The conductor layer 532 is connected to the conductor layer 521 via multiple through holes. The conductor layer 521 is connected to the electrode 114 via two through holes 51T6 and to the electrode 116 via two through holes 51T8. The conductor layer 521 is also connected to the conductor layer 534 via two through holes 52T6 and two through holes 52T8. The conductor layer 534 is connected to the electrode 115 via two through holes 52T7, the conductor layer 524, and two through holes 51T7.

[0110] The first conductor portion 80E of the shield conductor 80 is connected to the conductor layers 581 and 681. The conductor layers 581 and 681 are connected to the two columnar conductors T1a of the first inductor L21 and the two columnar conductors T3a of the third inductor L23. The two columnar conductors T1a and the two columnar conductors T3a are connected to the electrodes 114, 115, and 116 via the conductor layer 534, through holes 52T6, 52T7, and 52T8, the conductor layers 521 and 524, and through holes 51T6, 51T7, and 51T8.

[0111] The second conductor portion 80F of the shield conductor 80 is connected to the conductor layers 583 and 683. The conductor layers 583 and 683 are connected to the two pillar-shaped conductors T2b of the second inductor L22. The two pillar-shaped conductors T2b are connected to the electrodes 114, 115, and 116 via the conductor layer 534, through holes 52T6, 52T7, and 52T8, the conductor layers 521 and 524, and through holes 51T6, 51T7, and 51T8.

[0112] The two columnar conductors T1a of the first inductor L21 are electrically connected to the first conductor portion 80E without passing through the conductor layer 691 and the two columnar conductors T1b of the first inductor L21. The two columnar conductors T2b of the second inductor L22 are electrically connected to the second conductor portion 80F without passing through the conductor layer 692 and the two columnar conductors T2a of the second inductor L22. The two columnar conductors T3a of the third inductor L23 are electrically connected to the first conductor portion 80E without passing through the conductor layer 693 and the two columnar conductors T3b of the third inductor L23.

[0113] Next, features relating to the first to third inductors L21, L22, and L23, the shield conductor 80, and the ground will be described. As shown in Fig. 14 and Fig. 15, the electronic component 1 further includes a ground structure 30 that is provided within the laminate 50 and connected to the ground. The ground structure 30 has a shape that surrounds the second inductor L22.

[0114] The ground structure 30 includes at least one columnar conductor that extends in the stacking direction T and is connected to the ground. In the present embodiment, the ground structure 30 includes two columnar conductors T5a and one columnar conductor T5b as the at least one columnar conductor.

[0115] The two columnar conductors T5a are formed by connecting through holes 53T5a, 54T5a, 55T5a, 56T5a, 57T5a, 58T5a, 59T5a, 62T5a, 63T5a, 64T5a, 65T5a, 66T5a, 67T5a, 68T5a, 69T5a, 70T5a, 71T5a, and 72T5a in series. The columnar conductor T5b is formed by connecting through holes 53T5b, 54T5b, 55T5b, 56T5b, 57T5b, 58T5b, 59T5b, 62T5b, 63T5b, 64T5b, 65T5b, 66T5b, 67T5b, 68T5b, 69T5b, 70T5b, 71T5b, and 72T5b in series.

[0116] The ground structure 30 further includes ground conductor layers 534 and 731 disposed within the laminate 50 and connected to the two columnar conductors T5a and one columnar conductor T5b. Each of the conductor layers 534 and 731 extends along a plane intersecting the stacking direction T.

[0117] The two columnar conductors T5a and one columnar conductor T5b are connected to the electrodes 114, 115, and 116 connected to ground via the conductor layer 534, through holes 52T6, 52T7, and 52T8, conductor layers 521 and 524, and through holes 51T6, 51T7, and 51T8. The two columnar conductors T5a are connected to the first conductor portion 80E of the shield conductor 80 via the conductor layers 581 and 681.

[0118] The two columnar conductors T5a are arranged between the two columnar conductors T2a of the second inductor L22 and the first conductor portion 80E of the shield conductor 80. The two columnar conductors T5a are arranged so as not to overlap with the first and third inductors L21 and L23 when viewed from a direction perpendicular to the side surface 50E. The one columnar conductor T5b is arranged at a position closer to the side surface 50F than to the side surface 50E and closer to the two columnar conductors T2b of the second inductor L22 than to each of the side surfaces 50C and 50D.

[0119] The conductor layer 534 is disposed between the second inductor L22 and the second surface 50B. The conductor layer 731 is disposed between the second inductor L22 and the first surface 50A. A portion of the conductor layer 731 overlaps with at least a portion of the second inductor L22 when viewed from the stacking direction T. In this embodiment, as shown in FIG. 14 , a portion of the conductor layer 731 overlaps with a portion of the second inductor L22 when viewed from the stacking direction T. The conductor layer 731 is interposed between the second inductor L22 and the conductor portion 80A.

[0120] 14, a portion of the inductor conductor layer 692 of the second inductor L22 does not overlap with the conductor layer 731 when viewed from the stacking direction T. Similarly, a portion of the inductor conductor layer 702 of the second inductor L22 does not overlap with the conductor layer 731 when viewed from the stacking direction T.

[0121] Moreover, when viewed from the lamination direction T, the conductor layer 731 is arranged so as not to overlap with the first and third inductors L21 and L23.

[0122] The conductor layer 711 is connected to the second conductor portion 80F of the shield conductor 80. When viewed from the stacking direction T, the conductor layer 711 overlaps a portion of the second inductor L22. The conductor layer 711 is interposed between the second inductor L22 and the conductor portion 80A. When viewed from the stacking direction T, the conductor layer 711 is arranged so as not to overlap with the conductor layer 731.

[0123] Next, features related to the fourth inductor L24 of the second filter 20 will be described. The fourth inductor L24 includes a conductor layer 651, a pillar-shaped conductor T4a connected to a portion of the conductor layer 651 near a first end, and a pillar-shaped conductor T4b connected to a portion of the conductor layer 651 near a second end. The pillar-shaped conductor T4a is formed by connecting through holes 58T4a, 59T4a, 62T4a, 63T4a, and 64T4a in series. The pillar-shaped conductor T4b is formed by connecting through holes 56T4b, 57T4b, 58T4b, 59T4b, 62T4b, 63T4b, and 64T4b in series.

[0124] The fourth inductor L24 further includes a conductor layer 582 and a through-hole 57T4a connected to the conductor layer 582. The fourth inductor L24 is wound around a fourth axis perpendicular to the stacking direction T so as to form a fourth opening surrounded by the through-hole 57T4a, the conductor layers 582 and 641, the columnar conductors T4a and T4b. The fourth axis may extend in a direction parallel to the Y direction.

[0125] Next, the operation and effect of the electronic component 1 according to this embodiment will be described. In this embodiment, two pillar-shaped conductors T5a connected to ground are disposed between the second inductor L22 and the first conductor portion 80E. This allows the coupling between the second inductor L22 and the first conductor portion 80E to be weakened.

[0126] Furthermore, in this embodiment, a ground conductor layer 731 connected to the two pillar-shaped conductors T5a is disposed between the second inductor L22 and the conductor portion 80A, thereby weakening the coupling between the second inductor L22 and the conductor portion 80A.

[0127] In the present embodiment, the electronic component 1 includes a first filter 10 and a second filter 20. The second filter 20 includes a second inductor L22. According to the present embodiment, the coupling between the second inductor L22 and the shield conductor 80 can be weakened, and therefore, the first filter 10 and the second filter 20 can be prevented from being coupled via the second inductor L22 and the shield conductor 80. As a result, the isolation characteristics between the first filter 10 and the second filter 20 can be prevented from deteriorating.

[0128] Furthermore, in this embodiment, the first filter 10 is provided between the common terminal 2 and the first signal terminal 3 in terms of the circuit configuration, and the second filter 20 is provided between the common terminal 2 and the second signal terminal 4. The first signal terminal 3, i.e., the electrode 112, is disposed closer to the first conductor portion 80E than the second conductor portion 80F. According to this embodiment, by weakening the coupling between the second inductor L22 and the first conductor portion 80E, it is possible to prevent the second inductor L22 and the electrode 112 from being coupled via the first conductor portion 80E, and as a result, it is possible to prevent the isolation characteristics between the first signal terminal 3 and the second signal terminal 4 from deteriorating.

[0129] Next, the effects of this embodiment will be described with reference to the results of a simulation. In the simulation, a model of an example and a model of a comparative example are used. The model of the example is a model of the electronic component 1 according to this embodiment.

[0130] The comparative example model is a model of a comparative electronic component. The comparative electronic component does not include a ground structure 30. That is, the comparative example does not include the conductor layer 731 and the two columnar conductors T5a and T5b of the ground structure 30. The other configurations of the comparative electronic component are the same as those of the electronic component 1 according to the present embodiment.

[0131] In the simulation, the frequency characteristics of the isolation between the first signal terminal 3 and the second signal terminal 4 are obtained for each of the model of the example and the model of the comparative example.

[0132] The definition of isolation between the first signal terminal 3 and the second signal terminal 4 is as follows: When a high-frequency signal with power P1 is input to the first signal terminal 3, the power of the signal output from the second signal terminal 4 is defined as P2. Isolation I is defined by the following equation (1).

[0133] I=-10log(P2 / P1) …(1)

[0134] Fig. 16 is a characteristic diagram showing the frequency characteristics of isolation for the model of the embodiment and the model of the comparative example. In Fig. 16, the horizontal axis represents frequency and the vertical axis represents isolation. In Fig. 16, the curve labeled 91 represents the frequency characteristics of isolation for the model of the embodiment. The curve labeled 92 represents the frequency characteristics of isolation for the model of the comparative example.

[0135] 16, it can be seen that the isolation of the model of the example is greater than that of the model of the comparative example in the frequency range including the frequency range of 7737 MHz or more and 8237 MHz or less. As can be seen from this result, according to this embodiment, it is possible to achieve desired characteristics while suppressing the occurrence of problems caused by the shield conductor 80.

[0136] Next, other effects of the present embodiment will be described. In the present embodiment, the distance D1 between the first end 682a of the conductor layer 682 of the second inductor L22 and the first conductor portion 80E of the shield conductor 80 is larger than the distance D2 between the second end 682b of the conductor layer 682 and the second conductor portion 80F of the shield conductor 80. As a result, according to the present embodiment, the two pillar-shaped conductors T2a of the second inductor L22 can be spaced apart from the first conductor portion 80E, and the coupling between the two pillar-shaped conductors T2a and the first conductor portion 80E can be weakened.

[0137] Furthermore, in the present embodiment, the distance D1 is larger than both the distance between the first end 691a of the conductor layer 691 of the first inductor L21 and the first conductor portion 80E and the distance between the first end 693a of the conductor layer 693 of the third inductor L23 and the first conductor portion 80E. As a result, according to the present embodiment, the two columnar conductors T5a of the ground structure 30 can be disposed between the first end 682a of the conductor layer 682 and the first conductor portion 80E without increasing the size of the laminate 50.

[0138] The present invention is not limited to the above-described embodiment, and various modifications are possible. The present invention is not limited to the electronic component having the circuit configuration shown in Fig. 1, but can be applied to electronic components having various circuit configurations as long as they satisfy the requirements of the claims.

[0139] The number of the columnar conductors of the second inductor L22 may be two or five or more. The number of the columnar conductors of the ground structure 30 may be two or three or more. However, among the columnar conductors of the ground structure 30, the number of columnar conductors arranged between the second inductor L22 and the first conductor portion 80E is preferably equal to or greater than the number of columnar conductors connected near the first end 692a of the conductor layer 692 of the second inductor L22. Among the columnar conductors of the ground structure 30, the number of columnar conductors arranged between the second inductor L22 and the first conductor portion 80E is preferably greater than the number of columnar conductors arranged between the second inductor L22 and the second conductor portion 80F.

[0140] As described above, a multilayer electronic component according to a first aspect of the present invention includes a laminate including a plurality of stacked dielectric layers, a shielding conductor integrated with the laminate, an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in the stacking direction of the plurality of dielectric layers, and an inductor conductor layer connecting the at least one first columnar conductor and the at least one second columnar conductor, and at least one third columnar conductor extending in the stacking direction and connected to ground. The laminate has a first surface and a second surface located at both ends in the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite each other. The third side surface and the fourth side surface face opposite each other.

[0141] The shield conductor includes a first conductor portion provided on the first side surface and a second conductor portion provided on the second side surface. The inductor conductor layer extends from the first side surface to the second side surface and has a first end and a second end located at opposite ends in the longitudinal direction. At least one first columnar conductor is connected to a portion of the inductor conductor layer near the first end. At least one second columnar conductor is connected to a portion of the inductor conductor layer near the second end. At least one third columnar conductor is disposed between the inductor and the first conductor portion.

[0142] The multilayer electronic component according to the first aspect of the present invention may further include a ground conductor layer disposed within the multilayer body and connected to at least one third columnar conductor. The ground conductor layer may be disposed between the inductor and the first surface. A portion of the ground conductor layer may overlap at least a portion of the inductor when viewed from a direction parallel to the stacking direction. The shield conductor may further include a third conductor portion provided on the first surface. The multilayer electronic component according to the first aspect of the present invention may further include another inductor including two columnar conductors each extending in the stacking direction and a conductor layer connecting the two columnar conductors. The ground conductor layer may not overlap the other inductor when viewed from a direction parallel to the stacking direction.

[0143] Furthermore, the multilayer electronic component according to the first aspect of the present invention may further include another inductor including two columnar conductors each extending in the stacking direction and a conductor layer connecting the two columnar conductors. The at least one third columnar conductor may not overlap with the other inductors when viewed from a direction perpendicular to the first side surface.

[0144] In the multilayer electronic component according to the first aspect of the present invention, the at least one first columnar conductor may be disposed between the first side surface and the at least one second columnar conductor, and the number of the at least one third columnar conductor may be equal to or greater than the number of the at least one first columnar conductor.

[0145] In the multilayer electronic component according to the first aspect of the present invention, the first end of the inductor conductor layer may be closer to the first conductor portion than to the second conductor portion. The second end of the inductor conductor layer may be closer to the second conductor portion than to the first conductor portion. The distance between the first end of the inductor conductor layer and the first conductor portion may be greater than the distance between the second end of the inductor conductor layer and the second conductor portion.

[0146] In the multilayer electronic component according to the first aspect of the present invention, at least one first columnar conductor may be disposed closer to the first side surface than to the second side surface. At least one second columnar conductor may be disposed closer to the second side surface than to the first side surface. At least one second columnar conductor may be connected to the second conductor portion.

[0147] The multilayer electronic component according to the first aspect of the present invention may further include a common terminal, a first signal terminal, and a second signal terminal provided on the second surface of the laminate, a first circuit provided between the common terminal and the first signal terminal in terms of circuit configuration, and a second circuit provided between the common terminal and the second signal terminal in terms of circuit configuration. The second circuit may include an inductor. The first signal terminal may be located closer to the first conductor portion than the second conductor portion.

[0148] Furthermore, the multilayer electronic component according to the first aspect of the present invention may further include at least one fourth columnar conductor extending in the stacking direction and connected to ground. The at least one fourth columnar conductor may be disposed closer to the second side surface than to the first side surface and closer to the inductor than to each of the third and fourth side surfaces. The number of the at least one third columnar conductor may be greater than the number of the at least one fourth columnar conductor.

[0149] A multilayer electronic component according to a second aspect of the present invention includes a laminate including a plurality of stacked dielectric layers, a shielding conductor integrated with the laminate, an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in the stacking direction of the plurality of dielectric layers, and an inductor conductor layer connecting the at least one first columnar conductor and the at least one second columnar conductor, and a ground conductor layer connected to ground. The laminate has a first surface and a second surface located at both ends in the stacking direction. The shielding conductor includes a conductor portion provided on the first surface. The ground conductor layer is disposed between the inductor and the conductor portion.

[0150] REFERENCE SIGNS LIST 1... multilayer electronic component, 2... common terminal, 3... first signal terminal, 4... second signal terminal, 10... first filter, 20... second filter, 21... parallel resonant circuit, 30... ground structure, 50... laminate, 50A... first surface, 50B... second surface, 50C to 50F... side surface, 80... shield conductor, 80A, 80C, 80D... conductor portion, 80E... first conductor portion, 80F... second conductor portion, 11 1 to 116...electrodes, 691 to 693, 701 to 703...conductor layers for inductors, T1a, T1b, T2a, T2b, T3a, T3b, T4a, T4b, T5a, T5b...columnar conductors, C11 to C13, C21 to C28...capacitors, L11 to L13...inductors, L21...first inductor, L22...second inductor, L23...third inductor, L24...fourth inductor.

Claims

1. a laminate including a plurality of stacked dielectric layers; a shield conductor integrated with the laminate; an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in a stacking direction of the plurality of dielectric layers, and an inductor conductor layer connecting the at least one first columnar conductor and the at least one second columnar conductor; at least one third columnar conductor extending in the stacking direction and connected to ground; the laminate has a first surface and a second surface located at both ends in the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface, the first side and the second side face opposite each other; the third side and the fourth side face opposite each other; the shield conductor includes a first conductor portion provided on the first side surface and a second conductor portion provided on the second side surface; the inductor conductor layer extends from the first side surface to the second side surface and has a first end and a second end located at both ends in the longitudinal direction thereof; the at least one first columnar conductor is connected to a portion of the inductor conductor layer near the first end, the at least one second columnar conductor is connected to a portion of the inductor conductor layer near the second end, The multilayer electronic component is characterized in that the at least one third columnar conductor is disposed between the inductor and the first conductor portion.

2. 2. The multilayer electronic component according to claim 1, further comprising a ground conductor layer disposed within the multilayer body and connected to the at least one third columnar conductor.

3. 3. The multilayer electronic component according to claim 2, wherein the ground conductor layer is disposed between the inductor and the first surface.

4. 4. The multilayer electronic component according to claim 3, wherein a portion of the ground conductor layer overlaps at least a portion of the inductor when viewed from a direction parallel to the stacking direction.

5. 4. The multilayer electronic component according to claim 3, wherein the shield conductor further includes a third conductor portion provided on the first surface.

6. further comprising another inductor including two pillar-shaped conductors each extending in the stacking direction and a conductor layer connecting the two pillar-shaped conductors; 4. The multilayer electronic component according to claim 3, wherein the ground conductor layer does not overlap with the other inductors when viewed from one direction parallel to the stacking direction.

7. further comprising another inductor including two pillar-shaped conductors each extending in the stacking direction and a conductor layer connecting the two pillar-shaped conductors; 2. The multilayer electronic component according to claim 1, wherein the at least one third columnar conductor does not overlap with the other inductors when viewed in a direction perpendicular to the first side surface.

8. the at least one first columnar conductor is disposed between the first side surface and the at least one second columnar conductor; 2. The multilayer electronic component according to claim 1, wherein the number of said at least one third columnar conductor is equal to or greater than the number of said at least one first columnar conductor.

9. the first end of the inductor conductor layer is located closer to the first conductor portion than to the second conductor portion; the second end of the inductor conductor layer is located closer to the second conductor portion than to the first conductor portion; 2. The multilayer electronic component according to claim 1, wherein the distance between the first end of the inductor conductive layer and the first conductor portion is greater than the distance between the second end of the inductor conductive layer and the second conductor portion.

10. the at least one first columnar conductor is disposed closer to the first side surface than to the second side surface; the at least one second columnar conductor is disposed closer to the second side surface than to the first side surface; 2. The multilayer electronic component according to claim 1, wherein the at least one second columnar conductor is connected to the second conductor portion.

11. a common terminal, a first signal terminal, and a second signal terminal provided on the second surface of the laminate; a first circuit provided between the common terminal and the first signal terminal in a circuit configuration; a second circuit provided between the common terminal and the second signal terminal in terms of circuit configuration; the second circuit includes the inductor; 2. The multilayer electronic component according to claim 1, wherein the first signal terminal is disposed closer to the first conductor portion than to the second conductor portion.

12. further comprising at least one fourth columnar conductor extending in the stacking direction and connected to the ground; 2. The multilayer electronic component according to claim 1, wherein the at least one fourth columnar conductor is disposed at a position closer to the second side surface than to the first side surface and closer to the inductor than to each of the third side surface and the fourth side surface.

13. 13. The multilayer electronic component according to claim 12, wherein the number of said at least one third columnar conductor is greater than the number of said at least one fourth columnar conductor.

14. a laminate including a plurality of stacked dielectric layers; a shield conductor integrated with the laminate; an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in a stacking direction of the plurality of dielectric layers, and an inductor conductor layer connecting the at least one first columnar conductor and the at least one second columnar conductor; a ground conductor layer connected to the ground, the laminate has a first surface and a second surface located at both ends in the stacking direction, the shield conductor includes a conductor portion provided on the first surface; The multilayer electronic component is characterized in that the ground conductor layer is disposed between the inductor and the conductor portion.

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