Electronic device

Abstract

To provide an electronic device in which cracks are unlikely to occur in a laminate.SOLUTION: An electronic device includes a frame 10 having a plurality of openings 11 and a plurality of laminates 20, each having an electrode film and at least one functional film laminated on the electrode film. Each of the plurality of laminates 20 is suspended across the frame 10 along a first direction perpendicular to the stacking direction so as to partially overlap one of the plurality of openings 11 when viewed from the stacking direction of the respective laminate 20. The frame 10 is positioned between the plurality of openings 11 adjacent to each other in the first direction and has a pair of first inner frame portions 13_1 and 13_2 that support the plurality of laminates adjacent to each other in the first direction. A division portion 15 is formed between the pair of first inner frame portions 13_1 and 13_2, separating the pair of first inner frame portions 13_1 and 13_2.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] The present disclosure relates to an electronic device that can be used as an antenna or the like. [Background technology]

[0002] Known examples of functional materials capable of converting mechanical energy into electrical (magnetic) energy include piezoelectric materials and magnetostrictive materials. Piezoelectric materials are materials that exhibit the piezoelectric effect, converting external forces into electrical power in response to the application of external forces. Magnetostrictive materials are materials that exhibit the magnetostrictive effect, converting external magnetic fields into distortion in response to the application of external magnetic fields. These functional materials are made into thin films and incorporated into electronic devices such as pressure sensors, magnetic sensors, antennas, and energy conversion devices.

[0003] For example, in the electronic device of Patent Document 1, a thin film made of a functional material (hereinafter referred to as a functional film) is laminated on a conductive electrode film to form a laminate together with the electrode film. The laminate is placed in a frame with an opening and forms a vibrating body that can vibrate based on the piezoelectric effect and the magnetostrictive effect. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2021-64733 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when tensile stress occurs in the laminate due to distortion or residual stress of the laminate, or vibration of the laminate, there is a risk of cracks occurring in the laminate, and there is a demand for a technology to prevent this.

[0006] The present disclosure provides an electronic device in which cracks are less likely to occur in the laminate. [Means for solving the problem]

[0007] An electronic device according to an embodiment of the present disclosure includes: a frame having a plurality of openings; a plurality of laminates each having an electrode film and at least one functional film laminated on the electrode film; each of the plurality of stacked bodies is bridged across the frame along a first direction perpendicular to the stacking direction so as to partially overlap one of the plurality of openings when viewed from the stacking direction of the respective stacked bodies; the frame is positioned between the plurality of openings adjacent to each other in the first direction and has a pair of first inner frame portions that support the plurality of stacks adjacent to each other in the first direction; A division portion is formed between the pair of first inner frame portions, separating the pair of first inner frame portions.

[0008] Each of the plurality of laminates may have at least one of a piezoelectric film and a magnetostrictive film as the at least one functional film.

[0009] Each of the plurality of laminates may have, as at least one of the functional films, the piezoelectric film and the magnetostrictive film, and the electrode film, the piezoelectric film, and the magnetostrictive film may be laminated in this order.

[0010] The split portion may have a cavity formed between the pair of first inner frame portions.

[0011] In the first direction, the pair of first inner frame portions may be in contact with each other at the split portion.

[0012] The plurality of stacked bodies may be arranged in a second direction perpendicular to the stacking direction and the first direction, and gaps may be formed between the plurality of stacked bodies in the second direction.

[0013] The frame may not be disposed between the plurality of stacks in the second direction.

[0014] The multiple laminates are arranged in a second direction perpendicular to the stacking direction and the first direction, and the frame has a second inner frame portion located between one of the laminates and another of the laminates that are adjacent to each other in the second direction when viewed from the stacking direction, and gaps may be formed between one of the laminates and the second inner frame portion and between the other laminate and the second inner frame portion.

[0015] The laminate may further include a conductive pattern electrically connected to the plurality of laminates, the conductive pattern bridging the pair of first inner frame portions in the first direction, and at least a portion of the conductive pattern overlapping the pair of first inner frame portions when viewed from the stacking direction of the plurality of laminates.

[0016] The semiconductor device may further include a conductive pattern electrically connected to the plurality of laminates, the conductive pattern being bent along an in-plane direction of the plurality of laminates.

[0017] The laminate may further include a conductive pattern electrically connected to a plurality of the laminates, the plurality of laminates being arranged in a second direction perpendicular to the stacking direction and the first direction, and the conductive pattern extending along the pair of first inner frame portions and electrically connecting the plurality of laminates arranged in the second direction to each other.

[0018] The laminate may further include a plurality of conductive patterns electrically connected to a plurality of the laminates, the plurality of laminates being arranged in the first direction and a second direction perpendicular to the stacking direction and the first direction, the plurality of laminates arranged in the second direction being electrically connected in parallel by the plurality of conductive patterns so that the plurality of laminates form a plurality of parallel circuits, and the plurality of parallel circuits being electrically connected in series.

[0019] The laminate may further include a plurality of conductive patterns electrically connected to a plurality of the laminates, the plurality of laminates being arranged in the first direction and a second direction perpendicular to the stacking direction and the first direction, the plurality of laminates arranged in the first direction being electrically connected in series by the plurality of the conductive patterns so that the plurality of laminates form a plurality of series circuits, and the plurality of series circuits being electrically connected in parallel. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a perspective view of an element used in the electronic device of the first embodiment. [Figure 2A] FIG. 2A is a plan view of the device shown in FIG. [Figure 2B] FIG. 2B is a plan view in which the conductive patterns are omitted from FIG. 2A. [Figure 2C] FIG. 2C is an enlarged plan view of a portion of the element shown in FIG. 2A. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. 2A. [Figure 4] FIG. 4 is a conceptual diagram showing an example of application of the electronic device of the first embodiment to an electronic device. [Figure 5A] FIG. 5A is a plan view of an element used in an electronic device according to a second embodiment. [Figure 5B] FIG. 5B is a partially enlarged plan view of the element shown in FIG. 5A. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI shown in FIG. 5A. [Figure 7] FIG. 7 is a plan view of an element used in the electronic device of the third embodiment. [Figure 8] FIG. 8 is a plan view of an element used in the electronic device of the fourth embodiment. [Figure 9] FIG. 9 is a plan view of an element used in the electronic device of the fifth embodiment. [Figure 10] FIG. 10 is a plan view of an element used in the electronic device of the sixth embodiment. [Figure 11]FIG. 11 is a plan view of an element used in the electronic device of the seventh embodiment. [Figure 12] FIG. 12 is a cross-sectional view of an element used in the electronic device of the eighth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the contents shown in the drawings are merely shown schematically and exemplarily to facilitate understanding of the present disclosure, and the appearance and dimensional ratios may differ from the actual product. Furthermore, the present disclosure is not limited to the following embodiments.

[0022] First embodiment The element 1 of the first embodiment shown in Fig. 1 has a function of converting mechanical energy and electrical (magnetic) energy into each other, and is incorporated into electronic devices such as pressure sensors, magnetic sensors, antennas, and energy conversion devices. These electronic devices are also incorporated into electronic devices such as wearable terminals, hearable terminals, and cardiac pacemakers. The element 1 has a frame 10, a plurality of laminates 20, and a plurality of conductive patterns 30. In this embodiment, the conductive pattern 30 is, for example, composed of a plurality of first conductive patterns 40a to 40g.

[0023] The frame 10 is a flat, plate-like structure, and is made of, for example, an insulating material. The material that makes up the frame 10 is not particularly limited, but may be, for example, silicon (Si), glass, magnesium oxide (MgO), strontium titanate (SrTiO3), or lithium niobate (LiNbO3). The Young's modulus of the frame 10 is not particularly limited, but may be, for example, 50 to 500 GPa.

[0024] As shown in FIG. 2B , the frame 10 has multiple openings 11, a main body 12, and at least one horizontal frame 13. In the example shown in FIG. 2B , the number of horizontal frames 13 is multiple, but it may be single. The horizontal frame 13 has at least a first inner frame portion 13_1, a first inner frame portion 13_2, and a split portion 15. The frame 10 further has at least one second inner frame portion (vertical frame) 14, and the horizontal frame 13 further has at least one intersection portion 16. However, as described below, the second inner frame portion 14 and the intersection portion 16 are not required. Furthermore, in the example shown in FIG. 2B , the number of second inner frame portions 14 is multiple, but it may be single.

[0025] 2B, the conductive pattern 30 (FIG. 1) is omitted in order to clearly show the structure of the frame 10. Below, the configuration of the main body 12 and the plurality of openings 11 of the frame 10 will be described, and the configurations of the first inner frame portion 13_1, the first inner frame portion 13_2, and the second inner frame portion 14 will be described later.

[0026] The main body 12 is the annular portion of the frame 10 excluding the horizontal frames 13 and the second inner frame portions 14. The widths of the main body 12 in the X-axis direction and the Y-axis direction are not particularly limited, but are, for example, 1 to 10 mm. The width of the main body 12 in the Z-axis direction is not particularly limited, but is, for example, 0.1 to 1 mm.

[0027] 1, the main body 12 has a first surface 10a, a second surface 10b, a third surface 10c, a fourth surface 10d, a fifth surface 10e, and a sixth surface 10f. The first surface 10a and the second surface 10b are opposite each other, the third surface 10c and the fourth surface 10d are opposite each other, and the fifth surface 10e and the sixth surface 10f are opposite each other.

[0028] In the following description, the axis along the direction in which the third surface 10c and the fourth surface 10d face each other is referred to as the X-axis, the axis along the direction in which the fifth surface 10e and the sixth surface 10f face each other is referred to as the Y-axis, and the axis along the direction in which the first surface 10a and the second surface 10b face each other is referred to as the Z-axis. The Z-axis corresponds to the stacking direction of the laminate 20. The X-axis, Y-axis, and Z-axis are perpendicular to each other. In the following description, the positive side of the Z-axis is referred to as the upper side, and the negative side of the Z-axis is referred to as the lower side. However, the upper side in the Z-axis direction does not necessarily coincide with the upper side in the vertical direction. Furthermore, the lower side in the Z-axis direction does not necessarily coincide with the lower side in the vertical direction.

[0029] In the example shown in FIG. 1, opening 11 is configured as a through-hole extending from first surface 10a to second surface 10b of main body 12. However, the configuration of opening 11 is not limited to a through-hole, and opening 11 may be, for example, a recess with a bottom recessed downward from first surface 10a. In this case, a lid-shaped substrate (see lower substrate 90 in FIG. 3) that closes opening 11 from below may be attached to second surface 10b of frame 10. Furthermore, a lid-shaped substrate (see upper substrate 100 in FIG. 3) that covers opening 11 from above may be attached to first surface 10a of frame 10.

[0030] The shape of opening 11 is a square in plan view, but may be a rectangle, another polygon, or another shape (circle, ellipse, etc.). When opening 11 has an n-sided shape (n is 3 or more) in plan view, at least one of the n corners of opening 11 may be rounded in plan view.

[0031] Each of the multiple laminates 20 is two-dimensionally arranged at a position that partially overlaps one of the multiple openings 11 when viewed from the stacking direction of the respective laminates 20 (in the stacking direction of the laminates 20). When viewed from the stacking direction of the laminates 20, the positions of the multiple laminates 20 and the positions of the multiple openings 11 correspond one-to-one. The multiple laminates 20 are arranged in a matrix of n rows and m columns (n ​​and m are natural numbers) along the X-axis direction and the Y-axis direction. In the example shown in FIG. 1 , the values ​​of n and m are both 6. However, the values ​​of n and m may both be natural numbers other than 6 (except when both the values ​​of n and m are 1). The values ​​of n and m may also be different values, in which case one of n and m may be 1.

[0032] For ease of explanation, in FIG. 2A and other figures, the multiple (six in this embodiment) stacks 20 arranged along the Y-axis on the most negative side of the X-axis are referred to as the stacks 20 in the first row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the first row are referred to as the stacks 20 in the second row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the second row are referred to as the stacks 20 in the third row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the third row are referred to as the stacks 20 in the fourth row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the fourth row are referred to as the stacks 20 in the fifth row. The multiple stacks 20 arranged along the Y-axis on the most positive side of the X-axis are referred to as the stacks 20 in the sixth row.

[0033] Furthermore, the multiple (six in this embodiment) openings 11 arranged along the Y-axis on the most negative side of the X-axis are referred to as the first row of openings 11. The multiple openings 11 arranged along the Y-axis on the positive side of the X-axis of the openings 11 in the first row are referred to as the second row of openings 11. The multiple openings 11 arranged along the Y-axis on the positive side of the X-axis of the openings 11 in the second row are referred to as the third row of openings 11. The multiple openings 11 arranged along the Y-axis on the positive side of the X-axis of the openings 11 in the third row are referred to as the fourth row of openings 11. The multiple openings 11 arranged along the Y-axis on the positive side of the X-axis of the openings 11 in the fourth row are referred to as the fifth row of openings 11. The multiple openings 11 arranged along the Y-axis on the most positive side of the X-axis are referred to as the sixth row of openings 11.

[0034] Furthermore, the plurality of stacks 20 (six in this embodiment) arranged along the X-axis on the most negative side of the Y-axis are referred to as the first row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the first row of stacks 20 on the Y-axis are referred to as the second row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the second row of stacks 20 on the Y-axis are referred to as the third row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the third row of stacks 20 on the Y-axis are referred to as the fourth row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the fourth row of stacks 20 on the Y-axis are referred to as the fifth row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the most positive side of the Y-axis are referred to as the sixth row of stacks 20.

[0035] Furthermore, the multiple (six in this embodiment) openings 11 arranged along the X-axis on the most negative side of the Y-axis are referred to as the first row of openings 11. The multiple openings 11 arranged along the X-axis on the positive side of the first row of openings 11 on the Y-axis are referred to as the second row of openings 11. The multiple openings 11 arranged along the X-axis on the positive side of the second row of openings 11 on the Y-axis are referred to as the third row of openings 11. The multiple openings 11 arranged along the X-axis on the positive side of the third row of openings 11 on the Y-axis are referred to as the fourth row of openings 11. The multiple openings 11 arranged along the X-axis on the positive side of the fourth row of openings 11 on the Y-axis are referred to as the fifth row of openings 11. The multiple openings 11 arranged along the X-axis on the most positive side of the Y-axis are referred to as the sixth row of openings 11.

[0036] As shown in FIG. 2C, the laminate 20 has an electrode film 21 and at least one functional film laminated on the electrode film 21. In the present disclosure, a functional film refers to a film made of a material (hereinafter, functional material) that has at least one of the following functions: converting electrical energy into mechanical energy, converting magnetic energy into mechanical energy, converting mechanical energy into electrical energy, and converting mechanical energy into magnetic energy. Examples of functional films include a piezoelectric film made of a piezoelectric material, a magnetostrictive film made of a magnetostrictive material, and a film that constitutes an electrostatically driven vibrator such as a silicon vibrator.

[0037] The laminate 20 has at least one functional film, a piezoelectric film 22 and a magnetostrictive film 23. The piezoelectric film 22 exhibits a piezoelectric effect that converts an external force into electric power in response to the application of external force. The piezoelectric film 22 also exhibits an inverse piezoelectric effect that converts electric power into strain in response to the application of electric power. The magnetostrictive film 23 exhibits a magnetostrictive effect that converts an external magnetic field into strain in response to the application of external magnetic field. The magnetostrictive film 23 also exhibits an inverse magnetostrictive effect that converts an external force into a magnetic field in response to the application of external force. The laminate 20, which combines the piezoelectric film 22 and the magnetostrictive film 23, exhibits a magnetoelectric effect that converts an external magnetic field into electric power due to the interaction between the magnetostrictive film 23 and the piezoelectric film 22, thereby forming a vibrating body.

[0038] More specifically, when an external magnetic field is applied to the laminate 20, the magnetostrictive film 23 converts the external magnetic field into strain due to the magnetostrictive effect. The strain of the magnetostrictive film 23 is propagated to the piezoelectric film 22, and when an external force is applied to the piezoelectric film 22, the piezoelectric film 22 converts the external force into electric power due to the piezoelectric effect. When the external magnetic field applied to the laminate 20 is an AC magnetic field, the magnetostrictive film 23 vibrates together with the piezoelectric film 22 and the electrode film 21, and the piezoelectric film 22 outputs AC power.

[0039] Furthermore, the laminate 20, which combines the piezoelectric film 22 and the magnetostrictive film 23, can convert electric power into a magnetic field through the interaction between the magnetostrictive film 23 and the piezoelectric film 22, and can radiate the magnetic field or electromagnetic waves to the outside. In this case, the laminate 20 also constitutes a vibrating body. More specifically, when electric power (electric field) is applied to the piezoelectric film 22 of the laminate 20, the piezoelectric film 22 converts the electric power into strain due to the inverse piezoelectric effect. The strain of the piezoelectric film 22 is propagated to the magnetostrictive film 23, and when an external force is applied to the magnetostrictive film 23, the magnetostrictive film 23 converts the external force into a magnetic field due to the inverse magnetostrictive effect. When the electric power (electric field) applied to the piezoelectric film 22 is AC power (AC electric field), the piezoelectric film 22 vibrates together with the magnetostrictive film 23 and the electrode film 21, and the magnetostrictive film 23 radiates an AC magnetic field (electromagnetic waves). In this case, an electronic device having the laminate 20 can be used, for example, as a transmitting antenna.

[0040] In this disclosure, the term "laminated body" refers not only to (1) the portion in the Z-axis direction where all functional films overlap the electrode film, but also to (2) the portion in the Z-axis direction where at least one functional film does not overlap the electrode film, and (3) the portion in the Z-axis direction where at least one functional film does not overlap the electrode film.

[0041] For example, in FIG. 2C, the laminate 20 is made up of the following parts (i) to (iii). (i) A portion where the piezoelectric film 22 and the magnetostrictive film 23 overlap the electrode film 21 in the Z-axis direction. (ii) In the Z-axis direction, the portion where the piezoelectric film 22 overlaps the electrode film 21 but the magnetostrictive film 23 does not overlap. (iii) A portion in the Z-axis direction where neither the piezoelectric film 22 nor the magnetostrictive film 23 overlaps the electrode film 21.

[0042] In addition, in FIG. 5B, the laminate 20 is composed of the following parts (i) to (v). (i) A portion where the piezoelectric film 22 and the magnetostrictive film 23 overlap the electrode film 21 in the Z-axis direction. (ii) In the Z-axis direction, the portion where the piezoelectric film 22 overlaps the electrode film 21 but the magnetostrictive film 23 does not overlap. (iii) A portion in the Z-axis direction where neither the piezoelectric film 22 nor the magnetostrictive film 23 overlaps the electrode film 21. (iv) A portion in the Z-axis direction where the electrode film 21 does not overlap the piezoelectric film 22 and the magnetostrictive film 23. (v) A portion in the Z-axis direction where the electrode film 21 does not overlap the piezoelectric film 22.

[0043] Although detailed illustration is omitted, in another embodiment, if there is a portion in the Z-axis direction where the magnetostrictive film 23 overlaps the electrode film 21 but the piezoelectric film 22 does not overlap, that portion constitutes a part of the laminate 20. Also, if there is a portion in the Z-axis direction where the electrode film 21 does not overlap the magnetostrictive film 23, that portion constitutes a part of the laminate 20.

[0044] The width of the laminate 20 in the X-axis direction is not particularly limited, but is, for example, 100 μm to 1000 μm. The width of the laminate 20 in the Y-axis direction is not particularly limited, but is, for example, 50 μm to 1000 μm.

[0045] As shown in Figure 3, the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 are laminated in this order. In this embodiment, there are multiple functional films, but there may be only one functional film. For example, the functional film may be either the piezoelectric film 22 or the magnetostrictive film 23. A laminate 20 made up of the electrode film 21 and the piezoelectric film 22 is incorporated into an electronic device such as a pressure sensor. A laminate 20 made up of the electrode film 21 and the magnetostrictive film 23 is also incorporated into an electronic device such as a magnetic sensor.

[0046] The electrode film 21 is located in the lowest layer of the laminate 20, and the lower main surface (hereinafter referred to as the bottom surface) of the electrode film 21 is exposed to the outside. The height position of the electrode film 21 is not particularly limited, but is approximately equal to the height position of the first surface 10a (FIG. 1) of the frame 10. However, the term "approximately equal" is used to refer not only to cases where these height positions are perfectly aligned, but also to cases where there is a deviation of ±5% or less between these height positions. As shown in FIG. 2C, the shape of the electrode film 21 is rectangular in plan view, but may also be a square, another polygon, or another shape.

[0047] The electrode film 21 is a conductive film (metal film) made of a metal such as Pt, Ir, Ag, Cu, Au, or Al. The electrode film 21 may be an oxide conductor film with a perovskite structure such as SrRuO3 (SRO) or LaNiO3. The thickness (average thickness) of the electrode film 21 is not particularly limited, but is, for example, 10 to 300 nm.

[0048] Note that another film such as an SiO2 film may be formed below the electrode film 21. In this case, in the manufacturing process of the device 1, when the opening 11 (FIG. 1) is formed in the film-formation substrate that serves as the base of the frame 10, the film below the electrode film 21 functions as an etching stopper. The thickness (average thickness) of the etching stopper layer is not particularly limited, but is, for example, 5 to 100 nm.

[0049] As shown in FIG. 3, the piezoelectric film 22 is laminated on the electrode film 21. The thickness (average thickness) of the piezoelectric film 22 is not particularly limited, but is, for example, 0.1 to 10 μm. The piezoelectric film 22 overlaps with the electrode film 21 in the Z-axis direction and is disposed on the electrode film 21. The piezoelectric film 22 is sandwiched between the electrode film 21 and the magnetostrictive film 23. The piezoelectric film 22 is disposed directly on the electrode film 21 so as to be in contact with the electrode film 21, but another film may be disposed between the electrode film 21 and the piezoelectric film 22.

[0050] As shown in FIG. 2C, the shape of the piezoelectric film 22 is rectangular in plan view, but may be square, another polygon, or another shape. The area of ​​the main surface of the piezoelectric film 22 is smaller than the area of ​​the main surface of the electrode film 21, but may be equal to or larger than the area of ​​the main surface of the electrode film 21. The center position of the piezoelectric film 22 is offset to one side in the X-axis direction with respect to the center position of the electrode film 21. This is to ensure space for connecting the conductive pattern 30 (first conductive pattern 40e or 40f in the example shown in FIG. 2C) to the other side in the X-axis direction of the electrode film 21.

[0051] The piezoelectric material constituting the piezoelectric film 22 is not particularly limited, but may be, for example, quartz crystal, lithium niobate, aluminum nitride (AlN), zinc oxide (ZnO), lead zirconate titanate (PZT: Pb(Zr,Ti)O3), potassium sodium niobate (KNN: (K,Na)NbO3), or barium calcium zirconate titanate (BCZT: (Ba,Ca)(Zr,Ti)O3). From the viewpoint of ensuring excellent piezoelectric properties and high reliability, piezoelectric materials having a perovskite structure such as PZT, KNN, or BCZT may be used, and other elements may be added to the above piezoelectric materials.

[0052] As shown in Fig. 3, the magnetostrictive film 23 is laminated on the piezoelectric film 22. The magnetostrictive film 23 is disposed directly on the piezoelectric film 22 so as to be in contact with the piezoelectric film 22, but another film (e.g., a conductive film) may be disposed between the piezoelectric film 22 and the magnetostrictive film 23. The thickness (average thickness) of the magnetostrictive film 23 is not particularly limited, but is, for example, 0.1 to 10 µm. In Fig. 3, the thickness of the magnetostrictive film 23 is shown to be equal to the thickness of the piezoelectric film 22, but it may be thinner or thicker.

[0053] 2C, the shape of the magnetostrictive film 23 is rectangular in plan view, but it may be square, another polygon, or another shape. The area of ​​the main surface of the magnetostrictive film 23 is smaller than the area of ​​the main surface of the piezoelectric film 22, but may be equal to or larger than the area of ​​the main surface of the piezoelectric film 22.

[0054] The magnetostrictive material constituting the magnetostrictive film 23 is not particularly limited, but may be, for example, an iron (Fe)-cobalt (Co)-silicon (Si)-boron (B) alloy, an Fe-Si-B alloy, an Fe-Co-B alloy, an Fe-chromium (Cr)-Si-B alloy, an Fe-nickel (Ni)-molybdenum (Mo)-B alloy, an Fe-Si-B-copper (Cu)-niobium (Nb) alloy, or a Co-Fe-Ni-Si-B-Mo alloy.

[0055] As shown in FIG. 2B , multiple (five in this embodiment) horizontal frames 13 are formed inside the main body 12 and extend along the Y-axis. The multiple horizontal frames 13 are located at least between the openings 11 in the first to sixth rows and extend along the Y-axis between the openings 11 in the first to sixth rows. In the example shown in FIG. 2B , the first horizontal frame 13 is located at least between the openings 11 in the first row and the openings 11 in the second row and extends along the Y-axis between the openings 11 in the first row and the openings 11 in the second row. The second horizontal frame 13 is located at least between the openings 11 in the second row and the openings 11 in the third row and extends along the Y-axis between the openings 11 in the second row and the openings 11 in the third row. The third horizontal frame 13 is located at least between the openings 11 in the third row and the openings 11 in the fourth row and extends along the Y-axis between the openings 11 in the third row and the openings 11 in the fourth row. Furthermore, the fourth horizontal frame 13 is located at least between the openings 11 in the fourth row and the openings 11 in the fifth row, and extends along the Y axis between the openings 11 in the fourth row and the openings 11 in the fifth row. Furthermore, the fifth horizontal frame 13 is located at least between the openings 11 in the fifth row and the openings 11 in the sixth row, and extends along the Y axis between the openings 11 in the fifth row and the openings 11 in the sixth row.

[0056] One end of the horizontal frame 13 in the extension direction (Y-axis direction) is connected to the main body 12 (the inner wall of the main body 12) on the fifth surface 10e side. The other end of the horizontal frame 13 in the extension direction is connected to the main body 12 (the inner wall of the main body 12) on the sixth surface 10f side. The horizontal frame 13 is configured integrally with the main body 12. As shown in FIG. 2C, the width W1 of the horizontal frame 13 in the direction perpendicular to the extension direction (hereinafter referred to as the horizontal width of the horizontal frame 13) is equal to the distance between one opening 11 and the other opening 11 adjacent to each other in the X-axis direction.

[0057] As shown in Fig. 2B, first inner frame portions 13_1 and 13_2 are formed inside main body 12 and are located between a plurality of openings 11 adjacent to each other in the X-axis direction (one opening 11 and the other opening 11 adjacent to each other in the X-axis direction). First inner frame portion 13_1 and first inner frame portion 13_2 form a pair. The shape of first inner frame portion 13_1 is the same as the shape of first inner frame portion 13_2, but may be different.

[0058] Between the openings 11 in the first row and the openings 11 in the second row, multiple pairs (six pairs in this embodiment) of first inner frame portions 13_1 and 13_2 are arranged at a predetermined interval (the arrangement interval of the openings 11 in the first row) along the Y axis. Between the openings 11 in the second row and the openings 11 in the third row, multiple pairs of first inner frame portions 13_1 and 13_2 are arranged at a predetermined interval along the Y axis. Between the openings 11 in the third row and the openings 11 in the fourth row, multiple pairs of first inner frame portions 13_1 and 13_2 are arranged at a predetermined interval along the Y axis. Between the openings 11 in the fourth row and the openings 11 in the fifth row, multiple pairs of first inner frame portions 13_1 and 13_2 are arranged at a predetermined interval along the Y axis. Between the openings 11 in the fifth row and the openings 11 in the sixth row, a plurality of pairs of first inner frame portions 13_1 and 13_2 are arranged at predetermined intervals along the Y axis.

[0059] Between the plurality of openings 11 in the first row, one end of the first inner frame portion 13_1 in the extension direction (Y-axis direction) is connected to the main body 12 (the inner wall of the main body 12) on the fifth surface 10e side. The other end of the first inner frame portion 13_1 in the extension direction is connected to an intersection 16. At the intersection 16, a plurality of second inner frame portions 14 adjacent in the X-axis direction intersect with the horizontal frame 13, and the intersection 16 is sandwiched between these second inner frame portions 14. Between the plurality of openings 11 in the second row (similarly for the third to fifth rows), both ends of the first inner frame portion 13_1 in the extension direction are connected to a plurality of intersections 16 adjacent in the Y-axis direction. Between the plurality of openings 11 in the sixth row, one end of the first inner frame portion 13_1 in the extension direction is connected to the intersection 16. The other end of the first inner frame portion 13_1 in the extending direction is connected to the main body 12 (the inner wall of the main body 12) on the sixth surface 10f side.

[0060] Similarly, between the plurality of openings 11 in the first row, one end of the first inner frame portion 13_2 in the extension direction (Y-axis direction) is connected to the main body 12 (the inner wall of the main body 12) on the fifth surface 10e side. The other end of the first inner frame portion 13_2 in the extension direction is connected to the intersection 16. Between the plurality of openings 11 in the second row (similarly for the third to fifth rows), both ends of the first inner frame portion 13_2 in the extension direction are connected to the plurality of intersections 16 adjacent to each other in the Y-axis direction. Between the plurality of openings 11 in the sixth row, one end of the first inner frame portion 13_2 in the extension direction is connected to the intersection 16. The other end of the first inner frame portion 13_2 in the extension direction is connected to the main body 12 (the inner wall of the main body 12) on the sixth surface 10f side.

[0061] The first inner frame portions 13_1 and 13_2 extend linearly along the Y axis, but may be bent or curved. The first inner frame portions 13_1 and 13_2 are arranged parallel to each other, but may also be arranged non-parallel. The first inner frame portions 13_1 and 13_2 are not connected in the X axis direction between the openings 11 adjacent to each other in the X axis direction, and are separated from each other by a separation portion 15. The top surfaces (first surface 10a) of the first inner frame portions 13_1 and 13_2 are flush with the top surface (first surface 10a) of the main body 12, although this is not particularly limited.

[0062] The width of first inner frame portion 13_1 or 13_2 in the extension direction (Y-axis direction) corresponds to the width of opening 11 in the Y-axis direction. In the example shown in Fig. 2B, the width of first inner frame portion 13_1 or 13_2 in the extension direction is equal to the width of opening 11 in the Y-axis direction. The width of first inner frame portion 13_1 or 13_2 in a direction perpendicular to the extension direction (hereinafter referred to as the horizontal width of first inner frame portion 13_1 or 13_2) is narrower than the width between the inner wall and outer wall of main body 12 (the width in the X-axis direction or Y-axis direction).

[0063] 2C, the width W2 of the first inner frame portion 13_1 or 13_2 is approximately equal to the distance between adjacent stacks 20 in the X-axis direction, but may be narrower or wider than this. However, the term "approximately equal" is used to refer not only to cases where these widths and distances are completely the same, but also to cases where there is a deviation of ±5% or less between these widths and distances.

[0064] The width W2 of the first inner frame portion 13_1 or 13_2 is narrower than the width W1 of the horizontal frame 13 and narrower than half the width W1 of the horizontal frame 13. The width W2 of the first inner frame portion 13_1 or 13_2 is equal to or greater than the width W3 (hereinafter referred to as the width of the conductive pattern 30) in a direction perpendicular to the extension direction of the conductive pattern 30 (first conductive pattern 40e or 40f, etc.). The width W2 of the first inner frame portion 13_1 or 13_2 is not particularly limited, but is, for example, 10 to 150 μm. The width W2 of the first inner frame portion 13_1 may be different from the width W2 of the first inner frame portion 13_2.

[0065] As shown in FIG. 3, the first inner frame portions 13_1 and 13_2 extend downward along the Z axis. The first inner frame portions 13_1 and 13_2 extend linearly along the Z axis, but may be bent or curved. In the example shown in FIG. 3, the length L1 of the first inner frame portions 13_1 and 13_2 in the Z axis direction is longer than the thickness of the laminate 20 and is equal to or shorter than the length L2 of the main body 12 in the Z axis direction. In the example shown in FIG. 3, the height position of the lower ends of the first inner frame portions 13_1 and 13_2 is located higher than the height position of the lower end of the main body 12 (i.e., the height position of the second surface 10b). In the example shown in FIG. 3, the length L1 of the first inner frame portion 13_1 or 13_2 in the Z axis direction is equal to or longer than half the length L2 of the main body 12 in the Z axis direction, but may be less than half the length L2. The length L1 of the first inner frame portion 13_1 or 13_2 in the Z-axis direction is not particularly limited, but is, for example, 0.05 to 0.7 mm.

[0066] As shown in FIG. 2B , a split portion 15 is formed at least between the first inner frame portion 13_1 and the first inner frame portion 13_2. The split portion 15 separates the first inner frame portion 13_1 and the first inner frame portion 13_2 in the X-axis direction. The split portion 15 is located at least between one opening 11 and the other opening 11 that are adjacent in the X-axis direction. The split portion 15 extends continuously from one end of the horizontal frame 13 to the other end in the Y-axis direction. However, as will be described later, multiple split portions 15 may be formed locally in the horizontal frame 13 along the Y-axis.

[0067] As shown in FIG. 3, the split portion 15 is formed by a through hole extending from the top surface to the bottom surface of the horizontal frame 13, and has a cavity formed between a pair of first inner frame portions 13_1 and 13_2. The split portion 15 extends continuously from one end to the other end of the horizontal frame 13 in the Z-axis direction. The split portion 15 is an air gap. As shown in FIG. 2C, neither the laminate 20 nor the conductive pattern 30 overlaps with the split portion 15 when viewed from the stacking direction of the laminate 20.

[0068] The width W4 of the split portion 15 in the X-axis direction (hereinafter referred to as the horizontal width of the split portion 15) is equal to the distance between the first inner frame portion 13_1 and the first inner frame portion 13_2. The horizontal width W4 of the split portion 15 is narrower than half the horizontal width W1 of the horizontal frame 13. In the example shown in FIG. 2C, the horizontal width W4 of the split portion 15 is approximately equal to the horizontal width W2 of the first inner frame portion 13_1 or 13_2, but may be narrower than the horizontal width W2 or wider than the horizontal width W2. The horizontal width W4 of the split portion 15 is wider than the horizontal width W3 of the conductive pattern 30, but may be equal to the horizontal width W3 or narrower than the horizontal width W3. The horizontal width W4 of the split portion 15 is not particularly limited, but is, for example, 10 to 300 μm.

[0069] The width W4 of the split portion 15 is constant from one end of the split portion 15 in the Y-axis direction to the other, but the split portion 15 may have a relatively narrow portion and a relatively wide portion. The width (total length) of the split portion 15 in the Y-axis direction is not particularly limited, but is, for example, 3000 to 6000 μm. As shown in FIG. 3, the length of the split portion 15 in the Z-axis direction is equal to the length L1 of the first inner frame portions 13_1 and 13_2 in the Z-axis direction.

[0070] 2A, first inner frame portions 13_1 and 13_2 support a plurality of adjacent laminate bodies 20 in the X-axis direction so that the laminate bodies 20 can vibrate. More specifically, first inner frame portion 13_1 supports the end portion of one of the adjacent laminate bodies 20 in the X-axis direction, on the positive X-axis side, so that the laminate bodies 20 can vibrate. First inner frame portion 13_2 supports the end portion of the other adjacent laminate body 20 in the X-axis direction, on the negative X-axis side, so that the vibrating body 20 can vibrate.

[0071] 3, all of the films that make up the laminate 20, i.e., the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23, are laminated on the first inner frame portion 13_1. Then, a first conductive pattern 40f is connected on top of the conductive magnetostrictive film 23, and the magnetostrictive film 23 and the first conductive pattern 40f are electrically connected. However, as long as the first conductive pattern 40f is configured to be electrically connected to the magnetostrictive film 23, not all of the films that make up the laminate 20 need to be laminated on the first inner frame portion 13_1.

[0072] Of the laminate 20, only the electrode film 21 is laminated on the first inner frame portion 13_2. The first conductive pattern 40e is connected to the top of the conductive electrode film 21, and the conductive film 21 and the first conductive pattern 40e are electrically connected to each other.

[0073] 2A , each of the multiple laminates 20 is bridged across the frame 10 along the X-axis direction so as to partially overlap one of the multiple openings 11 when viewed from the stacking direction of the respective laminates 20. When viewed from the stacking direction of the laminates 20, one end of each of the laminates 20 in the X-axis direction overlaps with the main body 12. When viewed from the stacking direction of the laminates 20, the other end of each of the laminates 20 in the X-axis direction overlaps with the first inner frame portion 13_1. In other words, each of the laminates 20 in the first row is bridged between the main body 12 and the first inner frame portion 13_1 in the X-axis direction so that a portion of each laminate 20 other than its end in the X-axis direction overlaps with the opening 11 when viewed from the stacking direction of the laminates 20.

[0074] When viewed from the stacking direction of the laminates 20, one end in the X-axis direction of the laminates 20 in the second to fifth rows overlaps with the first inner frame portion 13_2. Also, when viewed from the stacking direction of the laminates 20, the other end in the X-axis direction of the laminates 20 in the second to fifth rows overlaps with the first inner frame portion 13_1. In other words, when viewed from the stacking direction of the laminates 20, each of the laminates 20 in the second to fifth rows bridges between the first inner frame portion 13_1 and the first inner frame portion 13_2 in the X-axis direction so that a portion of each laminate 20 other than the end in the X-axis direction overlaps with the opening 11.

[0075] When viewed from the stacking direction of the laminates 20, one end in the X-axis direction of the laminate 20 in the sixth row overlaps with the first inner frame portion 13_2. When viewed from the stacking direction of the laminates 20, the other end in the X-axis direction of the laminate 20 in the sixth row overlaps with the main body 12. In other words, when viewed from the stacking direction of the laminates 20, each of the laminates 20 in the sixth row bridges between the first inner frame portion 13_2 and the main body 12 in the X-axis direction so that a portion of each laminate 20 other than the end in the X-axis direction overlaps with the opening 11.

[0076] As shown in FIG. 2B , multiple second inner frame portions 14 are formed inside the main body 12 and spaced apart along the Y axis. The multiple second inner frame portions 14 are spaced apart along the Y axis at predetermined intervals (the spacing between the multiple openings 11 arranged along the Y axis). The second inner frame portions 14 extend along the X axis. The second inner frame portions 14 extend linearly along the X axis, but may be bent or curved. The second inner frame portions 14 are configured integrally with the main body 12. The top surface (first surface 10a) of the second inner frame portions 14 is flush with the top surface of the main body 12, although this is not particularly limited.

[0077] The second inner frame portion 14 is positioned between the multiple laminates 11 in the Y-axis direction when viewed from the stacking direction of the laminate 20. The second inner frame portion 14 is also positioned between one opening 11 and the other opening 11 that are adjacent in the Y-axis direction. Between the multiple openings 11 in the first row, one end of the second inner frame portion 14 in the extension direction (X-axis direction) is connected to the main body 12 (the inner wall of the main body 12) on the fourth surface 10d side. The other end of the second inner frame portion 14 in the extension direction is connected to an intersection 16 (the inner wall of the horizontal frame 13). Between the multiple openings 11 in the second row (similarly for the third to fifth rows), both ends of the second inner frame portion 14 in the extension direction are connected to the multiple intersections 16 (the inner wall of the horizontal frame 13) that are adjacent in the X-axis direction. Between the plurality of openings 11 in the sixth row, one end in the extension direction of the second inner frame portion 14 is connected to the intersection portion 16 (the inner wall of the horizontal frame 13). The other end in the extension direction of the second inner frame portion 14 is connected to the main body 12 (the inner wall of the main body 12) on the third surface 10c side.

[0078] As shown in FIG. 2C , the width W5 of the second inner frame portion 14 in a direction perpendicular to the extension direction (X-axis direction) (hereinafter referred to as the horizontal width of the second inner frame portion 14) is wider than the horizontal width W2 of the first inner frame portion 13_1 or 13_2 and narrower than the horizontal width W1 of the horizontal frame 13. However, the horizontal width W5 of the second inner frame portion 14 may be equal to or narrower than the horizontal width W2 of the first inner frame portion 13_1 or 13_2. Furthermore, the horizontal width W5 of the second inner frame portion 14 may be wider than or equal to the horizontal width W1 of the horizontal frame 13.

[0079] 2B, the laminate 20 does not overlap with the second inner frame portion 14 when viewed from the stacking direction of the laminate 20. Therefore, a gap 70 is formed between the laminate 20 and the second inner frame portion 14 in the Y-axis direction. Furthermore, the laminate 20 does not overlap with a portion of the main body 12 that extends longitudinally along the X-axis direction when viewed from the stacking direction of the laminate 20. Therefore, a gap 70 is formed between the laminate 20 and the main body 12 in the Y-axis direction.

[0080] 2A, the first conductive patterns 40a-40g are made of a conductive film and are physically and electrically connected to the laminate 20. The thickness (average thickness) of the first conductive pattern 40a (similarly for the first conductive patterns 40b-40g) is not particularly limited, but is, for example, 3-500 nm. The material constituting the first conductive patterns 40a-40g is not particularly limited, but is, for example, Au, Pt, Ag, Cu, or Al.

[0081] The width in the direction perpendicular to the extension direction of the first conductive pattern 40a (the same applies to the first conductive patterns 40b to 40g) within the plane of the laminate 20 (hereinafter referred to as the horizontal width of the first conductive pattern 40a) is narrower than the width of the laminate 20 in the Y-axis direction. The horizontal width of the first conductive pattern 40a is not particularly limited, but is, for example, 10 to 50 μm. The horizontal width of the first conductive pattern 40a is not particularly limited, but may be 20% or less, or 10% or less, of the width of the laminate 20 in the Y-axis direction.

[0082] The first conductive pattern 40a is physically and electrically connected to the laminate 20 in the first row. The first conductive pattern 40b is physically and electrically connected to the laminate 20 in the sixth row. The first conductive patterns 40a and 40b are conductive patterns for supplying input power to the multiple laminates 20 or obtaining output power from the multiple laminates 20.

[0083] The first conductive pattern 40a has a connection portion 41a and a lead portion 42a. The first conductive pattern 40a is composed of a single conductive pattern, but may be composed of multiple conductive patterns. The first conductive pattern 40b has a connection portion 41b and a lead portion 42b. The first conductive pattern 40b is composed of a single conductive pattern, but may be composed of multiple conductive patterns.

[0084] The connection portion 41a overlaps the laminates 20 in the first row and the first surface 10a of the main body 12 when viewed from the stacking direction of the laminates 20, and physically and electrically connects the laminates 20 in the first row. The connection portion 41a extends along the Y axis while contacting the end portion of the laminates 20 in the first row (the electrode film 21 in FIG. 3) on the negative side of the X axis. However, the position where the connection portion 41a is connected to the laminate 20 is not limited to the end portion of the electrode film 21 on the negative side of the X axis. The connection portion 41a extends linearly along the Y axis, but may be bent or curved. The connection portion 41a connects between the multiple laminates 20 (between one laminate 20 and the other laminate 20 adjacent in the Y axis direction).

[0085] That is, for the laminates 20 in the first row, the connection portions 41a connect the laminates 20 in the first column to the laminates 20 in the second column, connect the laminates 20 in the second column to the laminates 20 in the third column, connect the laminates 20 in the third column to the laminates 20 in the fourth column, connect the laminates 20 in the fourth column to the laminates 20 in the fifth column, and connect the laminates 20 in the fifth column to the laminates 20 in the sixth column. Therefore, the laminates 20 in the first row are electrically connected via the connection portions 41a.

[0086] The connecting portion 41b overlaps the laminate 20 in the sixth row and the first surface 10a of the main body 12 when viewed from the stacking direction of the laminates 20, and physically and electrically connects the laminates 20 in the sixth row. The connecting portion 41b extends along the Y-axis while contacting the end of the laminate 20 in the sixth row (the magnetostrictive film 23 in FIG. 3) on the positive side of the X-axis. However, the position where the connecting portion 41b is connected to the laminate 20 is not limited to the end of the magnetostrictive film 23 on the positive side of the X-axis. The connecting portion 41b extends linearly along the Y-axis, but may be bent or curved. The connecting portion 41b connects between multiple laminates 20 (between one laminate 20 and the other laminate 20 adjacent in the Y-axis direction).

[0087] That is, for the laminates 20 in the sixth row, the connection portions 41b connect the laminates 20 in the first column to the laminates 20 in the second column, connect the laminates 20 in the second column to the laminates 20 in the third column, connect the laminates 20 in the third column to the laminates 20 in the fourth column, connect the laminates 20 in the fourth column to the laminates 20 in the fifth column, and connect the laminates 20 in the fifth column to the laminates 20 in the sixth column. Therefore, the laminates 20 in the sixth row are electrically connected via the connection portions 41b.

[0088] The first conductive patterns 40c to 40g have connecting portions 41c_1 to 41g_1, connecting portions 41c_2 to 41g_2, and folded portions 43c to 43g. The connecting portions 41c_1 to 41g_1 extend in the Y-axis direction along the multiple first inner frame portions 13_1. The connecting portions 41c_2 to 41g_2 extend in the Y-axis direction along the multiple first inner frame portions 13_2. The connecting portions 41c_1 to 41g_1, 41c_2, and 41g_2 extend linearly along the Y-axis, but may be bent or curved.

[0089] The connection portion 41c_1 physically and electrically connects the ends of the laminates 20 in the first row on the positive side of the X-axis along the Y-axis. The connection portion 41c_2 physically and electrically connects the ends of the laminates 20 in the second row on the negative side of the X-axis along the Y-axis. The connection portion 41d_1 physically and electrically connects the ends of the laminates 20 in the second row on the positive side of the X-axis along the Y-axis. The connection portion 41d_2 physically and electrically connects the ends of the laminates 20 in the third row on the negative side of the X-axis along the Y-axis. The connection portion 41e_1 physically and electrically connects the ends of the laminates 20 in the third row on the positive side of the X-axis along the Y-axis. The connection portion 41e_2 physically and electrically connects the ends of the laminates 20 in the fourth row on the negative side of the X-axis along the Y-axis. The connection portion 41f_1 physically and electrically connects the ends of the laminates 20 in the fourth row on the positive side of the X-axis along the Y-axis. The connection portion 41f_2 physically and electrically connects the ends of the laminates 20 in the fifth row on the negative side of the X-axis along the Y-axis. The connection portion 41g_1 physically and electrically connects the ends of the laminates 20 in the fifth row on the positive side of the X-axis along the Y-axis. The connection portion 41g_2 physically and electrically connects the ends of the laminates 20 in the sixth row on the negative side of the X-axis along the Y-axis.

[0090] As shown in FIG. 3 , the connection portion 41f_1 (similarly to the connection portions 41b, 41c_1, 41d_1, 41e_1, and 41g_1) is physically and electrically connected to the magnetostrictive film 23 of the laminate 20. Another film (e.g., a conductive film) may be disposed between the connection portion 41f_1 (similarly to the connection portions 41b, 41c_1, 41d_1, 41e_1, and 41g_1) and the magnetostrictive film 23. The connection portion 41e_2 (similarly to the connection portions 41a, 41c_2, 41d_2, 41f_2, and 41g_2) is physically and electrically connected to the electrode film 21 of the laminate 20. Another film may be disposed between the connection portion 41e_2 (similarly to the connection portions 41a, 41c_2, 41d_2, 41f_2, and 41g_2) and the electrode film 21.

[0091] 2A, connecting portion 41a is disposed directly on first surface 10a, but another film may be disposed between connecting portion 41a and first surface 10a. Also, connecting portion 41b is disposed directly on first surface 10a, but another film may be disposed between connecting portion 41b and first surface 10a.

[0092] The folded portions 43c to 43g extend along the X-axis. The folded portions 43c to 43g extend linearly along the X-axis, but may be bent or curved. The folded portion 43c is continuous with the connecting portion 41c_1 and the connecting portion 41c_2. The folded portion 43d is continuous with the connecting portion 41d_1 and the connecting portion 41d_2. The folded portion 43e is continuous with the connecting portion 41e_1 and the connecting portion 41e_2. The folded portion 43f is continuous with the connecting portion 41f_1 and the connecting portion 41f_2. The folded portion 43g is continuous with the connecting portion 41g_1 and the connecting portion 41g_2.

[0093] The laminates 20 in the first row are electrically connected in parallel by connecting portions 41a and 41c_1 to form a first parallel circuit. The laminates 20 in the second row are electrically connected in parallel by connecting portions 41c_2 and 41d_1 to form a second parallel circuit. The laminates 20 in the third row are electrically connected in parallel by connecting portions 41d_2 and 41e_1 to form a third parallel circuit. The laminates 20 in the fourth row are electrically connected in parallel by connecting portions 41e_2 and 41f_1 to form a fourth parallel circuit. The laminates 20 in the fifth row are electrically connected in parallel by connecting portions 41f_2 and 41g_1 to form a fifth parallel circuit. The laminates 20 in the sixth row are electrically connected in parallel by connecting portions 41g_2 and 41b to form a sixth parallel circuit. That is, a plurality of laminates 20 arranged in 6 rows and 6 columns are electrically connected by connecting portion 41a, connecting portions 41c_1 to 41g_1, connecting portions 41c_2 to 41g_2, and connecting portion 41b so as to form first to sixth parallel circuits.

[0094] The first parallel circuit and the second parallel circuit are electrically connected in series via the folded portion 43c. The second parallel circuit and the third parallel circuit are electrically connected in series via the folded portion 43d. The third parallel circuit and the fourth parallel circuit are electrically connected in series via the folded portion 43e. The fourth parallel circuit and the fifth parallel circuit are electrically connected in series via the folded portion 43f. The fifth parallel circuit and the sixth parallel circuit are electrically connected in series via the folded portion 43g. In other words, the first to sixth parallel circuits are electrically connected in series by the folded portions 43c to 43g.

[0095] The lead portion 42a is continuous with the connection portion 41a and extends along the X-axis. The lead portion 42a extends linearly along the X-axis, but may be bent or curved. The lead portion 42a is continuous with the terminal 80a. The terminal 80a is an input terminal or an output terminal and is connected to an external circuit by, for example, wire bonding.

[0096] The lead-out portion 42b is continuous with the connection portion 41b and extends along the X-axis. The lead-out portion 42b extends linearly along the X-axis, but may be bent or curved. The lead-out portion 42b is continuous with the terminal 80b. The terminal 80b is an input terminal or an output terminal and is connected to an external circuit by, for example, wire bonding.

[0097] 4, the element 1 is incorporated into an electronic device 2 and used as an antenna in, for example, a contactless power supply system 3. In the contactless power supply system 3, a transmitting antenna 7 is a dipole antenna, a monopole antenna, a loop antenna, or the like, and transmits an AC magnetic field to the electronic device 2. In addition to the element 1, the electronic device 2 also has a power management IC 4, a capacitor 5, and a plurality of power consumption units 6.

[0098] When the element 1 receives an AC magnetic field transmitted from the transmitting antenna 7, the laminate 20 (FIG. 3) vibrates due to the magnetoelectric effect and outputs power. The output power of the laminate 20 is supplied to the power management IC 4 from the laminate 20 via the first conductive patterns 40a-40g (FIG. 2A) and the like. The power management IC 4 stores the power supplied from the laminate 20 in the capacitor 5 and supplies the power stored in the capacitor 5 to the power consumption unit 6 as needed. The power consumption unit 6 operates based on the power supplied from the power management IC 4. If the electronic device 2 is an in-ear type earphone, for example, the power consumption unit 6 may be a piezoelectric speaker, a piezoelectric microphone, a pressure sensor, an audio IC, a storage device, or the like.

[0099] Next, a method for manufacturing the element 1 shown in FIG. 1 will be described. First, a film-forming substrate, such as a silicon substrate, which will serve as the base of the frame 10, is prepared. Next, an electrode film is formed on the film-forming substrate and patterned. Next, a piezoelectric film and a magnetostrictive film are formed in this order on the electrode film, forming a laminate of these films. Examples of film-forming methods include vapor deposition, sputtering, sol-gel, CVD, and PLD.

[0100] Next, the piezoelectric film and the magnetostrictive film are patterned to form the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 shown in Figures 1 and 2C. The patterning is performed by, for example, an etching method (photoetching, laser dry etching, etc.) or a lift-off method. As a result, a plurality of laminates 20, each having the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23, are formed on the film-formation substrate.

[0101] Next, a conductive film is formed on the film-formation substrate by vapor deposition, sputtering, or the like so as to cover the multiple laminated bodies 20. The conductive film is a film that serves as the base of the first conductive patterns 40a-40g. Next, the conductive film is subjected to a patterning process such as lift-off, to form the first conductive patterns 40a-40g shown in FIGS. 1 and 2A.

[0102] Next, a portion of the film-forming substrate is removed by, for example, dry etching (such as deep-RIE) or anisotropic wet etching to form the frame 10 shown in Fig. 2A, which has a main body 12, multiple horizontal frames 13 (first inner frame portions 13_1 and 13_2), multiple second inner frame portions 14, multiple openings 11, and multiple division portions 15. In this manner, the element 1 shown in Fig. 1 can be manufactured.

[0103] As shown in FIG. 2A, in the element 1 of this embodiment, the frame 10 is located between a plurality of openings 11 adjacent to each other in the X-axis direction and has a pair of first inner frame portions 13_1 and 13_2 that support a plurality of laminates 20 adjacent to each other in the X-axis direction. A separation portion 15 that separates the pair of first inner frame portions 13_1 and 13_2 is formed between the pair of first inner frame portions 13_1 and 13_2. That is, one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction (hereinafter simply referred to as "one laminate 20 and the other laminate 20") are supported by separate first inner frame portions 13_1 and 13_2. Therefore, when one laminate 20 vibrates, the first inner frame portion 13_1 supporting the one laminate 20 is displaced (vibrates) mainly in response to the vibration of the one laminate 20. Furthermore, when the other laminate 20 vibrates, the first inner frame portion 13_2 supporting the other laminate 20 is displaced (vibrates) mainly in response to the vibration of the other laminate 20. In other words, the first inner frame portion 13_1 supporting one laminate 20 is less affected by the displacement of the first inner frame portion 13_2 supporting the other laminate 20 and displaces independently. Therefore, tensile stress caused by the vibration of the laminate 20 is less likely to occur between the one laminate 20 and the other laminate 20 via the first inner frame portions 13_1 and 13_2 (the one laminate 20 and the other laminate 20 are less likely to pull on each other via the first inner frame portions 13_1 and 13_2). This makes it possible to prevent problems such as cracks occurring between the one laminate 20 and the other laminate 20. Furthermore, even if tensile stress occurs due to distortion or residual stress present in the laminate 20, one laminate 20 and the other laminate 20 are less likely to pull on each other via the first inner frame portions 13_1 and 13_2, thereby preventing the occurrence of cracks between the one laminate 20 and the other laminate 20.

[0104] Furthermore, each of the plurality of laminates 20 includes at least one functional film, which is at least one of a piezoelectric film 22 and a magnetostrictive film 23. In particular, in this embodiment, each of the plurality of laminates 20 includes at least one functional film, which is a piezoelectric film 22 and a magnetostrictive film 23, and the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 are stacked in this order. By configuring the laminate 20 with the electrode film 21 and the piezoelectric film 22 and applying the laminate 20 to an electronic device such as a pressure sensor, the electronic device can be made smaller. By configuring the laminate 20 with the electrode film 21 and the magnetostrictive film 23 and applying the laminate 20 to an electronic device such as a magnetic sensor, the electronic device can be made smaller. Furthermore, by configuring the laminate 20 with the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23, a magnetoelectric effect is obtained, converting an external magnetic field into electric power, due to the interaction between the magnetostrictive film 23 and the piezoelectric film 22. By incorporating such a laminate 20 of the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 into an electronic device such as an antenna, it is possible to reduce the size of the electronic device.

[0105] The split portion 15 is configured as a cavity formed between the pair of first inner frame portions 13_1 and 13_2. Therefore, a cavity (through hole or through groove) that physically separates the first inner frame portions 13_1 and 13_2 in the X-axis direction is formed between the first inner frame portions 13_1 and 13_2. This cavity blocks the displacement transmission path between the first inner frame portion 13_1 supporting one of the laminated bodies 20 and the first inner frame portion 13_2 supporting the other laminated body 20 in the X-axis direction. Therefore, the displacement of the first inner frame portion 13_1 supporting one of the laminated bodies 20 is less likely to propagate to the first inner frame portion 13_2 supporting the other laminated body 20, and tensile stress is less likely to occur between the one laminated body 20 and the other laminated body 20. This effectively prevents defects such as cracks caused by tensile stress from occurring between the one laminated body 20 and the other laminated body 20.

[0106] 2B , the frame 10 has a second inner frame portion 14 located between adjacent stacks 20 in the Y-axis direction when viewed from the stacking direction of the stacks 20. A gap 70 is formed between one stack 20 and the second inner frame portion 14, and between the other stack 20 and the second inner frame portion 14. In this case, the multiple stacks 20 are less likely to be constrained by the frame 10 in the Y-axis direction, and can freely expand and contract in the Y-axis direction while spanning the frame 10 along the X-axis direction. This increases the power output from the multiple stacks 20, enabling the electronic device to have a higher output.

[0107] As shown in FIG. 2A , the element 1 also has a conductive pattern 30 electrically connected to the multiple laminates 20. The multiple laminates 20 are arranged in the Y-axis direction. The conductive pattern 30 (first conductive patterns 40c to 40g) extends along the pair of first inner frame portions 13_1 and 13_2 and electrically connects the multiple laminates 20 arranged in the Y-axis direction to one another. In this case, the multiple laminates 20 supported by the first inner frame portions 13_1 and 13_2 can be electrically connected to the conductive pattern 30 on the first inner frame portions 13_1 and 13_2. This allows the multiple laminates 20 arranged in the Y-axis direction to be electrically connected in parallel by the conductive pattern 30.

[0108] The element 1 also has a plurality of conductive patterns 30 electrically connected to the plurality of laminates 20. The plurality of laminates 20 are arranged in the X-axis direction and the Y-axis direction. The plurality of laminates 20 (six in this embodiment) arranged in six rows and six columns constitute a plurality of parallel circuits. The plurality of laminates 20 (six in this embodiment) arranged in the Y-axis direction are electrically connected in parallel by a plurality of conductive patterns 30 (first conductive patterns 40a to 40g). The plurality of parallel circuits are electrically connected in series. In this case, power can be efficiently supplied to the plurality of laminates 20. A fail-safe circuit is also formed, so that even if an abnormality occurs in one of the plurality of laminates 20, the influence of the abnormality can be minimized and the operation of the electronic device can continue. In the example shown in FIG. 2A, the plurality of parallel circuits are electrically connected in series by a plurality of conductive patterns 30. However, the means for electrically connecting the plurality of parallel circuits in series is not limited to the plurality of conductive patterns 30 and may be, for example, wire bonding.

[0109] Second embodiment 5A has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0110] As shown in FIG. 5A, the element 101 has a conductive pattern 130. The conductive pattern 130 has a plurality of second conductive patterns 50 in addition to the first conductive patterns 40a and 40b. The length of the second conductive pattern 50 along the X-axis is not particularly limited, but is, for example, 50 to 300 μm. The thickness (average thickness) of the second conductive pattern 50 is equal to the thickness (average thickness) of the first conductive pattern 40a or 40b, but may be thicker or thinner. The material constituting the second conductive pattern 50 is the same as the material constituting the first conductive patterns 40a and 40b, but may be different.

[0111] The width of the second conductive pattern 50 in the plane of the laminate 20 in a direction perpendicular to the extension direction (hereinafter referred to as the horizontal width of the second conductive pattern 50) is equal to the horizontal width of the first conductive pattern 40a or 40b, but may be narrower or wider than this.

[0112] The elastic modulus (Young's modulus) or rigidity of the second conductive pattern 50 is smaller than that of the laminate 20. The elastic modulus (Young's modulus) or rigidity of the second conductive pattern 50 is also smaller than that of the frame 10. The Young's modulus of the second conductive pattern 50 is not particularly limited, but is, for example, less than 100 GPa. The Young's modulus of the laminate 20 is not particularly limited, but is, for example, 100 to 500 GPa. However, the Young's modulus of the laminate 20 is the average value of the Young's moduli of the electrode film 21 and at least one functional film (in this embodiment, the piezoelectric film 22 and the magnetostrictive film 23) that constitute the laminate 20. The elastic modulus (Young's modulus) of the second conductive pattern 50 may be smaller than that of the electrode film 21, the piezoelectric film 22, or the magnetostrictive film 23.

[0113] The elastic modulus (Young's modulus) or stiffness of the first conductive patterns 40a and 40b is equal to, but may be greater than, or less than, the elastic modulus (Young's modulus) or stiffness of the second conductive pattern 50.

[0114] The second conductive patterns 50 physically and electrically connect the laminates 20 adjacent to each other in the X-axis direction. The laminates 20 in the first row are electrically connected in series by a plurality of (five in this embodiment) second conductive patterns 50 arranged in the first row. The laminates 20 in the second row are electrically connected in series by a plurality of second conductive patterns 50 arranged in the second row. The laminates 20 in the third row are electrically connected in series by a plurality of second conductive patterns 50 arranged in the third row. The laminates 20 in the fourth row are electrically connected in series by a plurality of second conductive patterns 50 arranged in the fourth row. The laminates 20 in the fifth row are electrically connected in series by a plurality of second conductive patterns 50 arranged in the fifth row. The laminates 20 in the sixth row are electrically connected in series by a plurality of second conductive patterns 50 arranged in the sixth row.

[0115] Although the element 101 is provided with a plurality of second conductive patterns 50, the number of second conductive patterns 50 may be single. For example, if the number of laminates 20 provided in the element 101 is two, the element 101 may be provided with one second conductive pattern 50 that physically and electrically connects the two laminates 20.

[0116] 5B, the second conductive pattern 50 has a bent portion 54. The bent portion 54 is bent in an S-shape (crank-like or meander-like) along the in-plane direction of the laminate 20. In the example shown in FIG. 5B, the bent portion 54 is located between one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction, and is bent between the one laminate 20 and the other laminate 20.

[0117] At least a portion of the bent portion 54 overlaps the split portion 15 when viewed from the stacking direction of the laminate 20. In the example shown in Fig. 5B, a portion of the bent portion 54 overlaps with the first inner frame portions 13_1 and 13_2 when viewed from the stacking direction of the laminate 20. However, the bent portion 54 may overlap only with the split portion 15 when viewed from the stacking direction of the laminate 20, without overlapping with the first inner frame portions 13_1 and 13_2.

[0118] The second conductive pattern 50 bridges between the first inner frame portion 13_1 and the first inner frame portion 13_2 in the X-axis direction. The second conductive pattern 50 also bridges between the laminates 20 adjacent to each other in the X-axis direction. As described above, the frame 10 is not disposed between the first inner frame portion 13_1 and the first inner frame portion 13_2, and a through-hole is formed at the position of the division portion 15. Therefore, a gap is formed between the first inner frame portion 13_1 and the first inner frame portion 13_2. The gap is located at a position that does not overlap with the second conductive pattern 50 (bent portion 54) when viewed from the stacking direction of the laminate 20.

[0119] The bending width W7 of the bent portion 54 is not particularly limited, but is, for example, 1.5 times or more the width of the second conductive pattern 50. The bending shape of the bent portion 54 is not limited to an S-shape, and may be a C-shape, a ring shape, or any other shape. Note that the second conductive pattern 50 may extend linearly along the X-axis.

[0120] As shown in FIG. 5A, the second conductive pattern 50 connects one laminate 20 and the other laminate 20 that are adjacent in the X-axis direction. In the example shown in FIG. 6, the bent portion 54 extends parallel to the electrode film 21, but may extend non-parallel to the electrode film 21. The height position of the bottom surface of the bent portion 54 is not particularly limited, but is approximately equal to the height position of the bottom surface of the electrode film 21. However, the term "approximately equal" is intended to encompass not only the case where these height positions are completely aligned, but also the case where there is a deviation of ±5% or less between these height positions.

[0121] As shown in FIG. 6 , the piezoelectric film 22 has a laminated portion 220 and an end portion 221. The laminated portion 220 overlaps the electrode film 21 in the Z-axis direction and is disposed on top of the electrode film 21. The laminated portion 220 is sandwiched between the electrode film 21 and the magnetostrictive film 23. The laminated portion 220 is disposed directly on top of the electrode film 21 so as to be in contact with the electrode film 21, although other films may be disposed between the electrode film 21 and the laminated portion 220. The end portion 221 does not overlap the electrode film 21 in the Z-axis direction and is located outside the electrode film 21 in the X-axis direction. The end portion 221 covers the end of the electrode film 21 on the negative X-axis direction side.

[0122] One end of the second conductive pattern 50 in the extension direction is connected to the end on the positive X-axis direction of one of the laminates 20 adjacent to it in the X-axis direction. More specifically, one end of the second conductive pattern 50 in the extension direction overlaps in a stepped manner on the upper surface of the electrode film 21 so as to cover a part of the end of the electrode film 21 on the positive X-axis direction side. This electrically connects the second conductive pattern 50 to the electrode film 21 of one of the laminates 20 adjacent to it in the X-axis direction. One end of the second conductive pattern 50 in the extension direction is disposed directly on the electrode film 21, but another film may be disposed between the electrode film 21 and one end of the second conductive pattern 50 in the extension direction.

[0123] The other end of the second conductive pattern 50 in the extension direction is connected to the end on the negative X-axis direction side of the other laminate 20 adjacent to it in the X-axis direction. More specifically, the other end of the second conductive pattern 50 in the extension direction is overlapped in a stepped manner on the upper surface of the magnetostrictive film 23 so as to cover part of the ends of the piezoelectric film 22 and the magnetostrictive film 23 on the negative X-axis direction side. This allows the second conductive pattern 50 to be electrically connected to the magnetostrictive film 23 of the other laminate 20 adjacent to it in the X-axis direction. The other end of the second conductive pattern 50 in the extension direction is disposed directly on the magnetostrictive film 23, but another film (e.g., a conductive film) may be disposed between the other end of the second conductive pattern 50 in the extension direction and the magnetostrictive film 23.

[0124] Between the first inner frame portion 13_1 and the first inner frame portion 13_2, the bottom surface of the bent portion 54 is exposed downward, but another film (e.g., an etching stopper layer) may be disposed on the bottom surface of the bent portion 54. The upper main surface (hereinafter referred to as the top surface) of the bent portion 54 is exposed upward, but may be covered with, for example, an insulating resin film (protective film). The material constituting the resin film is not particularly limited, but may be an organic material such as polyimide, polyethylene terephthalate, polyethylene, polypropylene, polyester, polyamideimide, or epoxy resin. The thickness (average thickness) of the resin film is not particularly limited, but is 0.1 to 10 μm.

[0125] As shown in FIG. 5A, each end of the second conductive pattern 50 in the extension direction is disposed at the center of the laminate 20 in the Y-axis direction, but the position of each end of the second conductive pattern 50 in the extension direction in the Y-axis direction is not particularly limited.

[0126] As described above, the laminates 20 in the first column are connected in series by the plurality of second conductive patterns 50 to form the first series circuit. Similarly, the laminates 20 in the second column form the second series circuit, the laminates 20 in the third column form the third series circuit, the laminates 20 in the fourth column form the fourth series circuit, the laminates 20 in the fifth column form the fifth series circuit, and the laminates 20 in the sixth column form the sixth series circuit. The connection portions 41a and 41b electrically connect the first to sixth series circuits in parallel. In other words, the plurality of laminates 20 arranged in six rows and six columns are electrically connected by the plurality of second conductive patterns 50 to form the first to sixth series circuits. The first to sixth series circuits are then electrically connected in parallel by the connection portions 41a and 41b.

[0127] This embodiment also achieves the same effects as the first embodiment. Additionally, in this embodiment, the element 101 has a plurality of second conductive patterns 50 electrically connected to a plurality of laminates 20. The plurality of laminates 20 are arranged in the X-axis direction and the Y-axis direction. The plurality of laminates 20 (six in this embodiment) arranged in six rows and six columns constitute a plurality of series circuits (six in this embodiment). The plurality of series circuits are electrically connected in parallel. This allows power to be efficiently supplied to the plurality of laminates 20. Furthermore, a fail-safe circuit is configured, so that even if an abnormality occurs in one of the plurality of laminates 20, the electronic device can continue to operate while minimizing the impact. In the example shown in FIG. 5A, the plurality of series circuits are electrically connected in parallel by a plurality of first conductive patterns 40a and 40b. However, the means for electrically connecting the plurality of series circuits in parallel is not limited to a plurality of conductive patterns, and may be, for example, wire bonding.

[0128] Furthermore, the second conductive pattern 50 bridges the pair of first inner frame portions 13_1 and 13_2 in the X-axis direction, and at least a portion of the second conductive pattern 50 overlaps the pair of first inner frame portions 13_1 and 13_2 when viewed from the stacking direction of the multiple laminates 20. Therefore, the second conductive pattern 50 is fixed to the first inner frame portions 13_1 and 13_2, and disconnection of the second conductive pattern 50 can be prevented.

[0129] The element 101 also has a second conductive pattern 50 electrically connected to the plurality of laminates 20. The second conductive pattern 50 is bent along the in-plane direction of the plurality of laminates 20. Therefore, the second conductive pattern 50 has elasticity that allows it to expand and contract in response to vibration of the plurality of laminates 20. Since the second conductive pattern 50 expands and contracts in response to vibration of the plurality of laminates 20, disconnection of the second conductive pattern 50 can be prevented.

[0130] Third embodiment 7 has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0131] As shown in FIG. 7, the element 201 has a frame 210. Unlike the frame 10 of the first embodiment, the frame 210 does not have a plurality of second inner frame portions 14 (FIG. 2B). On the other hand, the frame 210 has a main body 212. The main body 212 has a plurality of (two in this embodiment) split portions 215_1 and 215_2. The split portions 215_1 and 215_2 have the same configuration as the split portion 15. Either the split portions 215_1 or 215_2 may be omitted.

[0132] The split portion 215_1 is formed in a first outer frame portion 212a of the main body 212, which extends along the Y axis on the negative X axis side. The split portion 215_2 is formed in a second outer frame portion 212b of the main body 212, which extends along the Y axis on the positive X axis side.

[0133] The split portion 215_1 extends along the Y-axis at a position adjacent to the first row of laminates 20. The end portion of the first row of laminates 20 on the negative X-axis direction side is located between the split portion 215_1 and the first row of openings 11. Furthermore, when viewed from the stacking direction of the laminates 20, the end portion of the first row of laminates 20 on the negative X-axis direction side does not overlap with the split portion 215_1 but overlaps with the first outer frame portion 212a.

[0134] The split portion 215_2 extends along the Y-axis at a position adjacent to the stack 20 in the sixth row. The end portion of the stack 20 in the sixth row on the positive side of the X-axis is located between the split portion 215_2 and the opening portion 11 in the sixth row. Furthermore, when viewed from the stacking direction of the stacks 20, the end portion of the stack 20 in the sixth row on the positive side of the X-axis does not overlap with the split portion 215_2 but overlaps with the second outer frame portion 212b.

[0135] As described above, the frame 210 does not have a plurality of second inner frame portions 14 (FIG. 2B). Therefore, in the Y-axis direction, the frame 210 is not disposed between the plurality of laminates 20, and gaps 70 are formed. The openings 11 in the first row are constituted by a single opening located between the first outer frame portion 212a and the first inner frame portion 13_1. The openings 11 in the second row (similarly for the third to fifth rows) are constituted by a single opening located between the first inner frame portion 13_1 and the first inner frame portion 13_2. The openings 11 in the sixth row are constituted by a single opening located between the second outer frame portion 212b and the first inner frame portion 13_2.

[0136] The laminates 20 in the first row are arranged in the single opening 11 in the first row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the second row are arranged in the single opening 11 in the second row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the third row are arranged in the single opening 11 in the third row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the fourth row are arranged in the single opening 11 in the fourth row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the fifth row are arranged in the single opening 11 in the fifth row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the sixth row are arranged in the single opening 11 in the sixth row, spaced apart along the Y axis by a plurality of gaps 70.

[0137] In this embodiment, the same effects as in the first embodiment can be obtained. In addition, in this embodiment, the multiple laminates 20 are arranged in the Y-axis direction. Then, gaps 70 are formed between the multiple laminates 20 in the Y-axis direction. Therefore, the multiple laminates 20 are less likely to be constrained by the frame 210 in the Y-axis direction, and can freely expand and contract in the Y-axis direction while being spanned across the frame 210 in the X-axis direction. This increases the power output from the multiple laminates 20, enabling the electronic device to have a higher output.

[0138] Furthermore, no frame 210 is disposed between the multiple laminates 20 in the Y-axis direction. Therefore, the first inner frame portion 13_1 supporting one of the laminates 20 adjacent to each other in the X-axis direction is likely to be displaced (vibrated) in the X-axis direction. Similarly, the first inner frame portion 13_2 supporting the other of the laminates 20 adjacent to each other in the X-axis direction is likely to be displaced (vibrated) in the X-axis direction. This further weakens the tensile stress between the one laminate 20 and the other laminate 20, which is caused by vibration of the one laminate 20 and the other laminate 20, and effectively prevents the occurrence of cracks between the one laminate 20 and the other laminate 20.

[0139] Fourth embodiment 8 has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0140] 8, the element 301 has a frame 310. The frame 310 has a main body 312. The main body 312 has a first outer frame portion 312a extending along the Y axis on the negative side of the X axis. The main body 312 also has a second outer frame portion 312b extending along the Y axis on the positive side of the X axis.

[0141] The width W8 of the first outer frame portion 312a in a direction perpendicular to the extension direction (hereinafter referred to as the horizontal width of the first outer frame portion 312a) is approximately equal to the horizontal width W2 (FIG. 2C) of the first inner frame portion 13_1 or 13_2. The same is true for the horizontal width of the second outer frame portion 312b. However, the term "approximately equal" is used to refer not only to cases where these horizontal widths are completely identical, but also to cases where there is a deviation of ±5% or less between these horizontal widths. The horizontal width of the first outer frame portion 312a is the same as the horizontal width of the second outer frame portion 312b, but they may be different.

[0142] This embodiment also achieves the same effects as the first embodiment. Additionally, in this embodiment, the first outer frame portion 312a has a width substantially equal to that of the first inner frame portion 13_1 or 13_2. Furthermore, the second outer frame portion 312b has a width substantially equal to that of the first inner frame portion 13_1 or 13_2. Therefore, the first outer frame portion 312a is more likely to be displaced (vibrated) in response to the vibration of the laminate 20 in the first row. Furthermore, the second outer frame portion 312b is more likely to be displaced (vibrated) in response to the vibration of the laminate 20 in the sixth row. Furthermore, the laminates 20 in the first and sixth rows can vibrate in the same vibration mode as the laminates 20 in the second to fifth rows. This increases the power output from the laminate 20, enabling the electronic device to achieve higher output.

[0143] Fifth embodiment 9 has the same configuration as the element 101 of the second embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 101 of the second embodiment, and detailed descriptions thereof will be omitted.

[0144] 9, the element 401 has a frame 410. Like the frame 210 of the third embodiment, the frame 410 does not have a plurality of second inner frame portions 14 (FIG. 2B). Therefore, gaps 70 are formed between the plurality of laminates 20 in the Y-axis direction.

[0145] The laminates 20 in the first row are arranged in the single opening 11 in the first row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the second row are arranged in the single opening 11 in the second row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the third row are arranged in the single opening 11 in the third row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the fourth row are arranged in the single opening 11 in the fourth row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the fifth row are arranged in the single opening 11 in the fifth row, spaced apart along the Y axis by a plurality of gaps 70. The laminates 20 in the sixth row are arranged in the single opening 11 in the sixth row, spaced apart along the Y axis by a plurality of gaps 70.

[0146] In this embodiment, the same effects as in the second embodiment can be obtained. In addition, in this embodiment, gaps 70 are formed between the plurality of laminates 20 in the Y-axis direction. Furthermore, frames 410 are not disposed between the plurality of laminates 20 in the Y-axis direction. Therefore, in this embodiment, the same effects as in the third embodiment can be obtained.

[0147] Sixth embodiment 10 has the same configuration as the element 101 of the second embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 101 of the second embodiment, and detailed descriptions thereof will be omitted.

[0148] As shown in FIG. 10 , the element 501 has a frame 510. The frame 510 has a horizontal frame 513. The horizontal frame 513 has a plurality of split portions 15 (six in this embodiment). The plurality of split portions 15 are locally formed on the horizontal frame 513 along the Y axis. More specifically, the plurality of split portions 15 are locally formed at positions corresponding to the second conductive pattern 50 or at positions corresponding to the first inner frame portions 13_1 and 13_2.

[0149] The multiple divisions 15 are located between the multiple openings 11 in the X-axis direction (between one opening 11 and the other opening 11 adjacent in the X-axis direction). In the example shown in FIG. 10, the width of the divisions 15 in the Y-axis direction is equal to the width of the openings 11 in the Y-axis direction, but may be narrower or wider than this. However, the width of the divisions 15 in the Y-axis direction is equal to or greater than the bending swing width W7 (FIG. 5B) of the bending portion 54 so that the second conductive pattern 50 overlaps with the divisions 15 when viewed from the stacking direction of the laminate 20.

[0150] Between the openings 11 in the first row and the openings 11 in the second row, a plurality of split portions 15 are arranged at a predetermined interval (the arrangement interval of the openings 11 in the first row) along the Y axis. Between the openings 11 in the second row and the openings 11 in the third row, a plurality of split portions 15 are arranged at a predetermined interval along the Y axis. Between the openings 11 in the third row and the openings 11 in the fourth row, a plurality of split portions 15 are arranged at a predetermined interval along the Y axis. Between the openings 11 in the fourth row and the openings 11 in the fifth row, a plurality of split portions 15 are arranged at a predetermined interval along the Y axis. Between the openings 11 in the fifth row and the openings 11 in the sixth row, a plurality of split portions 15 are arranged at a predetermined interval along the Y axis.

[0151] This embodiment can also achieve the same effects as those of the second embodiment. In addition, in this embodiment, multiple split portions 15 are locally formed on the horizontal frame 513 along the Y axis. This can increase the strength of the frame 510.

[0152] Seventh embodiment 11 has the same configuration as the element 401 of the fifth embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 401 of the fifth embodiment, and detailed descriptions thereof will be omitted.

[0153] 11, the element 601 has a frame 610. As in the sixth embodiment, the frame 610 has a horizontal frame 513. In the horizontal frame 513, a plurality of (six in this embodiment) split portions 15 are locally formed along the Y axis. More specifically, the plurality of split portions 15 are locally formed at positions corresponding to the second conductive pattern 50 or at positions corresponding to the first inner frame portions 13_1 and 13_2.

[0154] This embodiment can also achieve the same effects as those of the fifth embodiment. In addition, in this embodiment, multiple split portions 15 are locally formed on the horizontal frame 513 along the Y axis. This can increase the strength of the frame 610.

[0155] Eighth embodiment 12 has the same configuration as the element 101 of the second embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 101 of the second embodiment, and detailed descriptions thereof will be omitted.

[0156] As shown in FIG. 12 , the frame 710 has a horizontal frame 713. A recess 16 is formed on the upper surface of the horizontal frame 713. When viewed from the stacking direction of the laminates 20, the recess 16 is located between one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction, and is recessed downward from the upper surface of the horizontal frame 713 (first inner frame portions 13_1 and 13_2). When viewed from the stacking direction of the laminates 20, the bent portion 54 is located at a position overlapping with the recess 16. The bottom surface of the bent portion 54 does not contact the upper surface of the horizontal frame 713, and a gap 17 is formed between the bottom surface of the bent portion 54 and the bottom surface of the recess 16. The second conductive pattern 50 is suspended between one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction, bridging the one laminate 20 and the other laminate 20. Furthermore, the second conductive pattern 50 is suspended between the first inner frame portion 13_1 and the first inner frame portion 13_2, and bridges the first inner frame portion 13_1 and the first inner frame portion 13_2. Note that the recess 16 is not essential and may be omitted from the horizontal frame 713.

[0157] 12, the depth of the recess 16 is shallower than the thickness of the second conductive pattern 50. However, the depth of the recess 16 may be equal to or deeper than the thickness of the second conductive pattern 50.

[0158] In the X-axis direction, the first inner frame portions 13_1 and 13_2 are in contact with each other. Therefore, no gap is formed between the first inner frame portions 13_1 and 13_2. The split portion 15 is a crack formed between the first inner frame portions 13_1 and 13_2, and is formed from the upper surface of the horizontal frame 713 (the bottom surface of the recess 16) to the bottom surface of the horizontal frame 713. The split portion 15 extends linearly from the bottom surface of the recess 16 to the bottom surface of the horizontal frame 713, but may be bent or curved.

[0159] The first inner frame portions 13_1 and 13_2 maintain contact in the X-axis direction unless an external force acts on the first inner frame portions 13_1 and 13_2 to separate them from each other. When an external force acts on the first inner frame portions 13_1 and 13_2 to separate them from each other, the first inner frame portions 13_1 and 13_2 separate from each other in the X-axis direction. In other words, the first inner frame portions 13_1 and 13_2 are configured to be able to separate from each other in the X-axis direction.

[0160] This embodiment also achieves the same effects as the second embodiment. Additionally, in this embodiment, the pair of first inner frame portions 13_1 and 13_2 are in contact with each other at a separation portion 15 in the X-axis direction. That is, the separation portion 15 is a crack formed between the first inner frame portions 13_1 and 13_2. This crack blocks the path of displacement transmission between the first inner frame portion 13_1 supporting one stack body 20 and the first inner frame portion 13_2 supporting the other stack body 20 in the X-axis direction. Therefore, the displacement of the first inner frame portion 13_1 supporting one stack body 20 is less likely to propagate to the first inner frame portion 13_2 supporting the other stack body 20, and tensile stress is less likely to occur between the one stack body 20 and the other stack body 20. This effectively prevents cracks caused by tensile stress from occurring between the one stack body 20 and the other stack body 20.

[0161] The present invention is not limited to the above-described embodiment and can be variously modified within the scope of the present invention. As shown in FIG. 2A, the connection portion 41a is configured with a single conductive pattern extending continuously along the Y-axis, but it may also be configured with multiple conductive patterns. For example, the connection portion 41a may be divided into a conductive pattern bridging between the first and second row stacks 20, a conductive pattern bridging between the second and third row stacks 20, a conductive pattern bridging between the third and fourth row stacks 20, a conductive pattern bridging between the fourth and fifth row stacks 20, and a conductive pattern bridging between the fifth and sixth row stacks 20. The same applies to the connection portion 41b, the connection portions 41c_1 to 41g_1, and the connection portions 41c_2 to 41g_2.

[0162] The techniques of the first to eighth embodiments may be applied to each other. For example, the technique of the sixth embodiment may be applied to the first embodiment. That is, a plurality of split sections 15 may be locally provided on the horizontal frame 13 shown in FIG. 2A. Furthermore, the technique of the seventh embodiment may be applied to the third, fourth, fifth, and eighth embodiments. That is, a plurality of split sections 15 may be locally provided on the horizontal frame 13 shown in FIGS. 7 to 9 and the horizontal frame 713 shown in FIG. 12.

[0163] Also, for example, the technique of the third embodiment may be applied to the second, fifth, sixth, seventh, and eighth embodiments. That is, the split portions 215_1 and / or 215_2 may be provided in the frame 10 (FIG. 5A), the frame 410 (FIG. 9), the frame 510 (FIG. 10), the frame 610 (FIG. 11), and the frame 710 (FIG. 12).

[0164] Furthermore, for example, the technology of the fourth embodiment may be applied to the second, fifth, sixth, seventh, and eighth embodiments. That is, the main body 12 may be provided with first outer frame portions 312a and / or 312b.

[0165] Furthermore, for example, the technique shown in the eighth embodiment may be applied to the first, third to seventh embodiments. That is, the split portion 15 may be configured so that the first inner frame portions 13_1 and 13_2 shown in Fig. 2A contact each other. Furthermore, the split portion 15 may be configured so that the first inner frame portions 13_1 and 13_2 shown in Figs. 7 to 11 contact each other.

[0166] The laminate 20 shown in FIG. 2B has two functional films (a piezoelectric film 22 and a magnetostrictive film 23) as at least one functional film, but may have one or three or more functional films. For example, the laminate 20 may have a piezoelectric film 22 or a magnetostrictive film 23 as one functional film. The laminate 20 made up of the electrode film 21 and the piezoelectric film 22 forms a vibrating body that can vibrate due to the inverse piezoelectric effect of the piezoelectric film 22. Furthermore, the laminate 20 made up of the electrode film 21 and the magnetostrictive film 23 forms a vibrating body that can vibrate due to the magnetostrictive effect of the magnetostrictive film 23.

[0167] As shown in FIG. 2A, the shape of the laminate 20 is rectangular in plan view, but it may be square, circular, elliptical, or any other shape.

[0168] As shown in FIG. 1, the plurality of laminates 20 are arranged in a matrix, but may also be arranged in a concentric or radial pattern, for example.

[0169] The positional relationship between the piezoelectric film 22 and the magnetostrictive film 23 shown in Figure 3 or Figure 6 may be reversed upside down, and in the laminate 20, the electrode film 21, the magnetostrictive film 23, and the piezoelectric film 22 may be stacked in this order. [Explanation of symbols]

[0170] 1,101,201,301,401,501,601,701...elements 2…Electronic equipment 3. Wireless power supply system 4...Power management IC 5...Capacitor 6…Power consumption part 7...Transmitting antenna 10,210,310,410,510,610,710…frame 10a~10f…1st side~6th side 11...Opening 12,212,312...Main body 212a, 312a...First outer frame portion 212b, 312b...Second outer frame part 13,513,713...Horizontal frame 13_1, 13_2...First inner frame section 14...Second inner frame part 15,215_1,215_2…Division part 16...Recess 17...Gap 20...Laminate 21...electrode film 22...Piezoelectric film 220...Laminated section 221...End 23...Magnetostrictive film 30,130...Conductive pattern 40a~40g...First conductive pattern 41a, 41b, 41c_1~41g_1, 41c_2~41g_2...Connection parts 42a, 42b...Drawer part 43c~43g...Folded part 50...Second conductive pattern 54...Bend 70...Void 80a, 80b...Terminals 90...Lower board 100...Upper board

Claims

1. a frame having a plurality of openings; a plurality of laminates each having an electrode film and at least one functional film laminated on the electrode film; each of the plurality of stacked bodies is bridged across the frame along a first direction perpendicular to the stacking direction so as to partially overlap one of the plurality of openings when viewed from the stacking direction of the respective stacked bodies; the frame is located between the plurality of openings adjacent to each other in the first direction and has a pair of first inner frame portions that support the plurality of stacks adjacent to each other in the first direction; An electronic device in which a split portion is formed between the pair of first inner frame portions, separating the pair of first inner frame portions.

2. 2. The electronic device according to claim 1, wherein each of the plurality of laminates has at least one of a piezoelectric film and a magnetostrictive film as the at least one functional film.

3. Each of the plurality of laminates has the piezoelectric film and the magnetostrictive film as at least one of the functional films, The electronic device according to claim 2 , wherein the electrode film, the piezoelectric film, and the magnetostrictive film are laminated in this order.

4. 4. The electronic device according to claim 1, wherein the split portion has a cavity formed between the pair of first inner frame portions.

5. 4. The electronic device according to claim 1, wherein the pair of first inner frame portions are in contact with each other at the split portion in the first direction.

6. The plurality of stacked bodies are arranged in a second direction perpendicular to the stacking direction and the first direction, 4. The electronic device according to claim 1, wherein a gap is formed between the plurality of laminates in the second direction.

7. The electronic device according to claim 6 , wherein the frame is not disposed between the plurality of laminated bodies in the second direction.

8. The plurality of stacked bodies are arranged in a second direction perpendicular to the stacking direction and the first direction, the frame has a second inner frame portion located between one of the stacked bodies and the other of the stacked bodies adjacent to each other in the second direction when viewed from the stacking direction, An electronic device according to any one of claims 1 to 3, wherein a gap is formed between one of the laminates and the second inner frame portion, and between the other of the laminates and the second inner frame portion.

9. Further, a conductive pattern is electrically connected to a plurality of the laminated bodies, the conductive pattern bridges the pair of first inner frame portions in the first direction, 4. The electronic device according to claim 1, wherein at least a portion of the conductive pattern overlaps with the pair of first inner frame portions when viewed in the stacking direction of the plurality of laminates.

10. Further, a conductive pattern is electrically connected to a plurality of the laminated bodies, 4. The electronic device according to claim 1, wherein the conductive pattern is bent along an in-plane direction of the plurality of laminated bodies.

11. Further, a conductive pattern is electrically connected to a plurality of the laminated bodies, The plurality of stacked bodies are arranged in a second direction perpendicular to the stacking direction and the first direction, The electronic device according to any one of claims 1 to 3, wherein the conductive pattern extends along the pair of first inner frame portions and electrically connects the plurality of laminates arranged in the second direction to each other.

12. Further, the laminate further includes a plurality of conductive patterns electrically connected to the plurality of laminates, The plurality of stacked bodies are arranged in the first direction and a second direction perpendicular to the stacking direction and the first direction, the plurality of laminates arranged in the second direction are electrically connected in parallel by the plurality of conductive patterns so that the plurality of laminates form a plurality of parallel circuits; 4. The electronic device according to claim 1, wherein the plurality of parallel circuits are electrically connected in series.

13. Further, the laminate further includes a plurality of conductive patterns electrically connected to the plurality of laminates, The plurality of stacked bodies are arranged in the first direction and a second direction perpendicular to the stacking direction and the first direction, the plurality of laminates arranged in the first direction are electrically connected in series by the plurality of conductive patterns so that the plurality of laminates form a plurality of series circuits; 4. The electronic device according to claim 1, wherein a plurality of the series circuits are electrically connected in parallel.

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