Film for package and package

Abstract

To provide a film for a package having excellent barrier properties and high processing suitability.SOLUTION: The film for a package includes a sealant material, a substrate positioned on one surface of the sealant material, and a coating material positioned between the sealant material and the substrate. The substrate includes a base layer of a resin, an inorganic vapor-deposited layer positioned on one surface of the base layer, and a protective layer positioned on the inorganic vapor-deposited layer and facing the sealant material. The inorganic vapor-deposited layer is a vapor-deposited layer containing SiOx, the protective layer is an acrylic resin layer, and the coating material contains a thermoplastic styrenic elastomer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a packaging film and a packaging body. [Background technology]

[0002] BACKGROUND ART Packaging films having barrier properties such as oxygen barrier properties and water vapor barrier properties are widely used as packaging materials for foods, medicines, and the like. For example, Patent Document 1 proposes a barrier laminate film comprising a gas barrier coating film provided on an unstretched polyolefin resin film and an aluminum vapor-deposited layer provided on the gas barrier coating film. The invention of Patent Document 1 has oxygen barrier properties, water vapor barrier properties, light-shielding properties, and glossiness equivalent to those of aluminum vapor-deposited polyethylene terephthalate (aluminum vapor-deposited PET), and also has improved adhesion and heat-sealing properties. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-22918 Summary of the Invention [Problem to be solved by the invention]

[0004] In certain applications, packaging films are required to have even higher barrier properties (especially water vapor barrier properties). If aluminum vapor deposition is replaced with silica vapor deposition to improve water vapor barrier properties, the barrier properties will decrease after the bags are made (poor processability).

[0005] The present invention has been made in view of the above circumstances, and aims to provide a packaging film that has excellent barrier properties and is highly adaptable to processing. [Means for solving the problem]

[0006] As a result of extensive investigations, the present inventors have made the following findings. Inorganic vapor-deposited layers (particularly silica vapor-deposited layers) are more rigid and brittle than resin films. Therefore, when packaging films are made into bags, if mechanical force is applied to the packaging film or the film becomes overheated, the silica vapor-deposited layer cannot keep up with the expansion and contraction or bending of the resin film, resulting in detachment or cracking. The present inventors discovered that providing a protective layer made of a specific material on the silica vapor-deposited layer can prevent detachment and cracking of the silica vapor-deposited layer, leading to the completion of the present invention. The packaging film of the present invention has the following configuration. <1> The adhesive tape includes a sealant material, a substrate disposed on one side of the sealant material, and a coating material disposed between the sealant material and the substrate, the substrate has a resin base layer, an inorganic vapor deposition layer located on one surface of the base layer, and a protective layer located on the inorganic vapor deposition layer and facing the sealant material; The inorganic vapor deposition layer is SiO x a vapor deposition layer comprising: the protective layer is an acrylic resin layer, The film for packaging, wherein the covering material is a resin layer containing a thermoplastic styrene elastomer. <2> The thickness of the coating material is 1 to 5 μm. <1> The film for packaging according to claim 1. <3> The coating material further comprises paraffin. <1> or <2> The film for packaging according to claim 1.

[0007] <4> <1> ~ <3> A packaging body produced by forming a bag from the packaging film according to any one of the above items. [Effects of the Invention]

[0008] The packaging film of the present invention has excellent barrier properties and improved processability. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view of a packaging film according to one embodiment of the present invention. [Figure 2] FIG. 3 is a cross-sectional view of a packaging film according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] (Packaging film) The packaging film of the present invention comprises a sealant, a substrate positioned on one side of the sealant, and a covering material positioned between the sealant and the substrate. The packaging film may be distributed in the form of a rolled body or a laminate of sheets cut into rectangular shapes or the like.

[0011] A packaging film according to one embodiment of the present invention will be described with reference to the drawings. The packaging film 1 in FIG. 1 is formed by laminating a substrate 10, a covering material 20, and a sealant material 30 in this order. In this embodiment, the substrate 10, the coating material 20, and the sealant material 30 are in close contact with each other.

[0012] The thickness T1 of the packaging film 1 is determined appropriately taking into consideration the intended use (for example, the size and capacity of the package after bag production). The thickness T1 is, for example, preferably 30 to 120 μm, more preferably 40 to 80 μm. When the thickness T1 is equal to or greater than the above lower limit, the strength and rigidity of the packaging film 1 can be further increased. When the thickness T1 is equal to or less than the above upper limit, the flexibility of the packaging film 1 can be further increased, making it easier to handle. In this paper, the thickness is, for example, the average value of the thickness measured with a thickness gauge at 10 randomly selected points.

[0013] The oxygen permeability of the packaging film 1 is 2.0 mL / (m 2 ·day) or less is preferable, and 1.5mL / (m 2 ·day) or less is more preferable, and 1.0mL / (m 2·day) or less is even more preferable. When the oxygen transmission rate of the film 1 for packaging is equal to or less than the above upper limit, deterioration of the contents can be more effectively suppressed. The lower the oxygen transmission rate of the film 1 for packaging, the more preferable it is, and the lower limit of the oxygen transmission rate is 0 mL / (m 2 ·day) is preferred. In this paper, oxygen permeability can be measured in accordance with the test method for oxygen gas permeability using an electrolytic sensor described in Appendix A of JIS K7126-2:2006. The oxygen permeability of the packaging film 1 can be adjusted by the material and thickness of the substrate 10, the material and thickness of the covering material 20, the type and thickness of the inorganic vapor deposition layer 14 described below, and a combination of these.

[0014] The water vapor permeability of the packaging film 1 is 1.0 g / (m 2 ·day) or less is preferable, and 0.6g / (m 2 ·day) or less is more preferable, and 0.3g / (m 2 ·day) or less is more preferable. When the water vapor permeability of the substrate 10 is equal to or less than the above upper limit, deterioration of the contents can be more effectively suppressed. The lower the water vapor permeability, the more preferable it is, and the lower limit of the water vapor permeability is 0 g / (m 2 ·day) is preferred. The water vapor permeability can be measured according to the test method described in the moisture sensor method of JIS K7129:2008 under test condition 1 described in Table A.1. The water vapor permeability can be adjusted by the material of the substrate 10, the material and thickness of the coating material 20, the type and thickness of the inorganic vapor deposition layer 14 described below, and a combination of these.

[0015] <Base material> The substrate 10 has a base layer 12 , an inorganic vapor deposition layer 14 disposed on one surface of the base layer 12 , and a protective layer 16 disposed on the inorganic vapor deposition layer 14 . In this embodiment, the base layer 12, the inorganic vapor deposition layer 14, and the protective layer 16 are in close contact with each other. The layers of the substrate 10 are, from the coating material 20 side (i.e., the sealant material side), the protective layer 16, the inorganic vapor deposition layer 14, and the base layer 12, positioned in this order. That is, the protective layer 16 faces the sealant material 30.

[0016] The thickness T10 of the substrate 10 is determined taking into consideration the material and configuration, and is, for example, preferably 10 to 30 μm, more preferably 10 to 20 μm. When the thickness T10 of the substrate 10 is equal to or greater than the above-mentioned lower limit, the strength and rigidity of the packaging film 1 can be further increased. In addition, when the thickness T10 of the substrate 10 is equal to or greater than the above-mentioned lower limit, the water vapor barrier property of the packaging film 1 can be further improved. When the thickness T10 of the substrate 10 is equal to or less than the above-mentioned upper limit, the flexibility of the packaging film 1 can be increased, making it easier to handle. The thickness T10 of the substrate 10 is determined by observing a cross section of the packaging film 1 cut in the thickness direction under a microscope (for example, at 200x magnification) and averaging the thickness at 10 randomly selected points.

[0017] ≪Base layer≫ The base layer 12 is a resin film. Examples of materials for the base layer 12 include polyester film, polyolefin film, polyamide (PA) film, cellophane, and laminates thereof. Examples of polyester films include polyethylene terephthalate (PET), biaxially oriented PET, and polybutylene terephthalate (PBT). Examples of polyolefin films include polypropylene (PP), biaxially oriented polypropylene (OPP), non-oriented polypropylene (CPP), high density polyethylene (HDPE), and medium density polyethylene (MDPE). An example of a polyamide (PA) film is biaxially oriented nylon (ONy). Examples of the laminate include a laminate of the above-mentioned resin films. The base layer 12 is preferably made of PET, biaxially oriented PET, PP, OPP, or PA, and more preferably made of biaxially oriented PET or ONy, as these materials can further increase the strength of the packaging film 1.

[0018] The thickness T12 of the base layer 12 is preferably 10 to 30 μm, more preferably 10 to 20 μm. When the thickness T12 is equal to or greater than the above-mentioned lower limit, the strength and rigidity of the packaging film 1 can be further increased. In addition, when the thickness T12 is equal to or greater than the above-mentioned lower limit, the water vapor barrier property of the packaging film 1 can be further improved. When the thickness T12 is equal to or less than the above-mentioned upper limit, the flexibility of the packaging film 1 can be increased, making it easier to handle. The thickness T12 of the base layer 12 is determined by observing a cross section of the packaging film 1 cut in the thickness direction under a microscope (for example, at 200x magnification) and averaging the values ​​at 10 randomly selected points.

[0019] The base layer 12 may have a single layer structure or a multi-layer structure. The base layer 12 may be printed on its surface or between layers.

[0020] ≪Inorganic vapor deposited layer≫ The inorganic vapor-deposited layer 14 is a layer in which an inorganic substance is vapor-deposited on the surface of the base layer 12 . The inorganic vapor deposition layer 14 is SiO x The inorganic vapor deposition layer 14 is a vapor deposition layer containing SiO x Deposition layer or SiO x and other metal oxides (e.g., Al2O3). That is, the inorganic vapor deposition layer 14 may be, for example, a silica vapor deposition layer or a silica-alumina (SiO x -Al2O3) vapor-deposited layer is preferred. When the inorganic vapor deposition layer 14 is a binary vapor deposition layer, the ratio of SiO to the total mass of the inorganic vapor deposition layer 14 x The content of SiO in the inorganic vapor deposition layer 14 is preferably 40 to 90 mass %, more preferably 50 to 80 mass %, and even more preferably 60 to 70 mass %. x The content can be measured according to JIS K1150-1994.

[0021] The thickness T14 of the inorganic vapor deposition layer 14 is preferably 20 to 100 nm, more preferably 35 to 85 nm, and even more preferably 50 to 70 nm. When the thickness T14 is equal to or greater than the above lower limit, the oxygen barrier property and water vapor barrier property of the packaging film 1 can be further improved. When the thickness T14 is equal to or less than the above upper limit, the occurrence of delamination due to cohesive failure can be suppressed. As a result, the impact resistance of the packaging film 1 can be further improved. The thickness T14 is determined, for example, by observing a cross section of the packaging film 1 cut in the thickness direction under a microscope (for example, at 200x magnification) and averaging the thickness at 10 randomly selected points.

[0022] ≪Protective layer≫ The protective layer 16 is an acrylic resin layer that covers the surface of the inorganic vapor deposition layer 14. In this embodiment, the protective layer 16 is in close contact with the inorganic vapor deposition layer 14. Examples of acrylic resins include polymers of acrylic acid esters (polyacrylic acid), polymers of methacrylic acid esters (polymethacrylic acid), polymers of acrylamide (polyacrylamide), and copolymers of acrylic acid esters and methacrylic acid esters.

[0023] Examples of the acrylic acid ester include acrylic acid esters having an alkyl group having 1 to 5 carbon atoms, such as methyl acrylate, ethyl acrylate, and butyl acrylate; sodium acrylate, and potassium acrylate.

[0024] Examples of the methacrylic acid ester include methacrylic acid esters having an alkyl group having 1 to 5 carbon atoms, such as methyl methacrylate, ethyl methacrylate, and butyl methacrylate.

[0025] The acrylic resin constituting the protective layer 16 is preferably sodium polyacrylate, polymethacrylate, polyacrylamide, or the like.

[0026] The molecular weight of the acrylic resin constituting the protective layer 16 is preferably 7,000 to 30,000.

[0027] The acrylic resin constituting the protective layer 16 may contain structural units other than acrylic acid ester, methacrylic acid ester, and acrylamide (collectively referred to as (meth)acrylic acid). However, the content of (meth)acrylic acid is preferably 50 mol % or more, more preferably 80 mol % or more, and even more preferably 90 mol % or more, relative to the total number of structural units of the acrylic resin constituting the protective layer 16, and may be 100 mass % or more.

[0028] The thickness T16 of the protective layer 16 is, for example, preferably 0.5 to 2.0 μm, and more preferably 0.7 to 2.0 μm. When the thickness T16 is equal to or greater than the above lower limit, the barrier properties can be further improved. When the thickness T16 is equal to or greater than the above lower limit, the permeated water vapor is further reduced and water is retained, thereby significantly improving the water vapor barrier properties in particular. When the thickness T16 is equal to or less than the above upper limit, the adhesion can be further improved. The thickness T16 is determined, for example, by observing a cross section of the packaging film 1 cut in the thickness direction under a microscope (for example, at 200x magnification) and averaging the thickness at 10 randomly selected points.

[0029] <Coating material> The covering material 20 is a resin layer containing thermoplastic styrene elastomer (TPS, thermoplastic styrene elastomer). The inclusion of the covering material 20 in the packaging film 1 increases the toughness and heat resistance of the inorganic vapor deposition layer 14 and protects the inorganic vapor deposition layer 14 from mechanical forces or heat applied to the packaging film 1 during bag formation. This increases the toughness and heat resistance of the inorganic vapor deposition layer 14, further improving the barrier properties of the packaging film 1.

[0030] Examples of TPS include styrene-isoprene-styrene polymer (SIS), styrene-butadiene-styrene polymer (SBS), styrene-ethylene-butadiene-styrene polymer (SEBS), and styrene-ethylene-propylene-styrene polymer (SEPS).

[0031] The MFR (melt flow rate) of the TPS is preferably 0.5 to 10.0.

[0032] The content of TPS in the coating material 20 is preferably 50% by mass or more, more preferably 80% by mass or more, and even more preferably 90% by mass or more, relative to the total mass of the resins constituting the coating material 20, and may be 100% by mass.

[0033] Among the resins constituting the covering material 20, examples of resins other than TPS include polystyrene and polyolefin.

[0034] The coating material 20 may contain paraffin. By including paraffin, the coating material 20 can further improve the water vapor barrier properties. The paraffin is preferably a chain saturated hydrocarbon having 20 to 100 carbon atoms, more preferably a chain saturated hydrocarbon having 100 to 700 carbon atoms. When the carbon number is equal to or greater than the above lower limit, the water vapor barrier property can be further improved. When the carbon number is equal to or less than the above upper limit, the adhesiveness can be further improved.

[0035] When the covering material 20 contains paraffin, the paraffin content is preferably 3 to 30 mass %, more preferably 5 to 20 mass %, relative to 100 mass % of the total of the paraffin and resin. When the paraffin content is equal to or greater than the lower limit, the water vapor barrier property can be further improved. When the paraffin content is equal to or less than the upper limit, the adhesion can be further improved.

[0036] The thickness T20 of the covering material 20 is, for example, preferably 1 to 5 μm, more preferably 2 to 3 μm. When the thickness T20 is equal to or greater than the above lower limit, the barrier properties can be further improved. The thickness T20 is determined, for example, by observing a cross section of the packaging film 1 cut in the thickness direction under a microscope (for example, at 200x magnification) and averaging the thickness at 10 randomly selected points.

[0037] <Sealant material> The sealant material 30 is not particularly limited as long as it is a material that can be heat-sealed. Examples of the sealant material 30 include resin sheets containing polyolefin. Examples of polyolefin resins contained in the sealant material 30 include polypropylene (PP), polyethylene (PE), ethylene / vinyl acetate copolymer (EVA), ethylene / acrylic acid copolymer (EAA), ethylene / methacrylic acid copolymer (EMAA), ethylene / methyl acrylate copolymer (EMA), ethylene / methyl methacrylate copolymer (EMMA), ethylene / ethyl acrylate copolymer (EEA), and ionomer resins. Examples of polyethylene (PE) include low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). Of these, PP and PE are preferred as polyolefins for the sealant material 30. These polyolefin resins may be used alone or in combination of two or more.

[0038] The sealant material 30 may contain resins other than polyolefin, additives, etc. These may be used alone or in combination of two or more.

[0039] The thickness T30 of the sealant 30 is, for example, preferably 10 to 80 μm, more preferably 20 to 50 μm. When the thickness 30 is equal to or greater than the above lower limit, the seal strength can be increased. When the thickness 30 is equal to or less than the above upper limit, the flexibility of the packaging film 1 can be further increased. The thickness T30 of the sealant material 30 is determined by observing a cross section of the packaging film 1 cut in the thickness direction under a microscope (for example, at 200x magnification) and averaging the values ​​at 10 randomly selected points.

[0040] The sealant material 30 may be a single layer or may have a multi-layer structure of 2 to 4 layers.

[0041] <Manufacturing method> The packaging film 1 of the present invention can be produced by a conventionally known method for producing a multilayer film. For example, a substrate 10 is obtained, a coating material 20 is provided on the surface of the protective layer 16 of the substrate 10, and then a sealant material 30 is provided on the surface of the coating material 20 to form a film for packaging 1.

[0042] The substrate 10 may be a commercially available laminate having a base layer 12, an inorganic vapor deposition layer 14, and a protective layer 16, or may be a laminate having a base layer 12 and an inorganic vapor deposition layer 14 (hereinafter, a laminate having an inorganic vapor deposition layer provided on a base layer may be referred to as a "vapor deposition film") with a protective layer 16 made of an acrylic resin or the like provided thereon, which may be used as the substrate 10.

[0043] The coating material 20 may be applied to the surface of the protective layer 16 by gravure printing or the like. As a method for providing the sealant material 30 on the surface of the coating material 20, a method of adhering a previously prepared sealant material 30 to the coating material 20 can be mentioned. Alternatively, a method of melting the resin that constitutes the sealant material 30 and applying it onto the coating material 20 using a T-die can be mentioned.

[0044] (packaging) The packaging material of the present invention is a bag made from the packaging film of the present invention. The packaging body may be, for example, a bag made by heat-sealing the sealant materials 30 of the packaging film 1 together. Examples of the form of the package include a palm-sealed bag, a three-side sealed bag, a four-side sealed bag, a gusset bag, a stand-up bag, and bags with zippers of these. Examples of the package also include a vertical pillow packaging bag and a vertical pillow packaging bag.

[0045] <Manufacturing method of packaging body> The method for manufacturing the package is determined appropriately depending on the shape of the package. An example of a method for manufacturing a pillow packaging bag will be described.

[0046] Using a pillow packaging machine, the packaging film 1 is unwound from the roll, and the contents are wrapped in the packaging film while the back and both ends are heat sealed. When the packaging film 1 is unwound, a mechanical force is applied to the packaging film 1 due to pulling by the guide rolls of the pillow packaging machine, etc. In addition, when the packaging film 1 is unwound, heat is applied to the packaging film 1 due to friction with the guide rolls. Furthermore, when heat sealing is performed, the packaging film 1 becomes overheated. In the packaging film 1 of this embodiment, the covering material 20 covers the inorganic vapor deposition layer 14 and the protective layer 16, adheres strongly to the protective layer 16, and conforms to these layers, thereby preventing damage (detachment, cracks, etc.) to the inorganic vapor deposition layer 14 due to mechanical force or heat.

[0047] (Other embodiments) In the packaging film of the above embodiment, the covering material and the sealant are in close contact with each other, but the present invention is not limited to this, and other layers may be provided between the covering material and the sealant, such as a vapor-deposited film or a resin layer similar to the base layer. 2 is an example of a packaging film having the other layers described above. The packaging film 100 will be described below, but the same components as those in the packaging film 1 will be assigned the same reference numerals and their description will be omitted. As shown in FIG. 2, the packaging film 100 has a second substrate 110 between the covering material 20 and the sealant material 30 . The second substrate 110 may consist of only a base layer, or may be a vapor-deposited film consisting of a base layer (second base layer) and an inorganic vapor-deposited layer (second inorganic vapor-deposited layer). Among these, from the viewpoint of further improving the barrier properties, the second substrate 110 is preferably a vapor-deposited film. The second substrate 110 may also have a protective layer (second protective layer) similar to the protective layer 16 of the substrate 10.

[0048] The thickness T110 of the second base material 110 is the same as the thickness T10. The thickness T110 and the thickness T10 may be the same or different. When the second substrate 110 is a vapor-deposited film having a second inorganic vapor-deposited layer, the second inorganic vapor-deposited layer is not particularly limited, and examples thereof include a silica vapor-deposited layer, an alumina vapor-deposited layer, and a silica-alumina vapor-deposited layer. The thickness of the second inorganic vapor deposition layer is the same as the thickness T14 of the inorganic vapor deposition layer 14. The thickness of the second inorganic vapor deposition layer and the thickness T14 may be the same or different. The second inorganic vapor deposition layer may face either the sealant material 30 or the coating material 20 .

[0049] (effect) As described above, the packaging film of the present invention has a protective layer and a covering material at specific positions, which can prevent damage to the inorganic vapor deposition layer in the packaging film. Therefore, the packaging film of the present invention has excellent barrier properties and excellent processability, and the resulting package has excellent barrier properties. [Example]

[0050] (Materials used) <Base material> Substrate 1: 12 μm thick PET base layer and SiO x A two-phase structure in which a 0.5 μm thick protective layer of sodium polyacrylate is provided on a vapor deposition film having a vapor deposition layer (0.7 μm). Substrate 2: 15 μm thick polyamide (15 μNy) base layer and SiO x A two-phase structure in which a 0.5 μm thick protective layer of sodium polyacrylate is provided on a vapor deposition film having a vapor deposition layer (0.7 μm). Substrate 3: 12 μm thick PET base layer and SiO x -A vapor-deposited film having an Al2O3 vapor-deposited layer (0.8 μm) and a 0.5 μm thick polyacrylamide protective layer in a two-layer structure. Substrate 4: 18 μm thick OPP base layer and SiO x A two-phase structure in which a 0.5 μm thick protective layer of sodium polyacrylate is provided on a vapor deposition film having a vapor deposition layer (0.7 μm). Substrate 5: 12 μm thick PET base layer and SiO x A two-layer structure consisting of a vapor-deposited film with a vapor-deposited layer (0.7 μm) and a protective layer of polymethacrylic acid 0.5 μm thick.

[0051] <Comparison of base materials> Substrate 1': 12 μm thick PET base layer and SiO x It has a vapor-deposited layer (0.7 μm) (no protective layer). Substrate 2': A vapor-deposited film having a 12 μm thick PET base layer and an Al2O3 vapor-deposited layer (0.6 μm), with a 0.5 μm thick polyacrylamide protective layer in a two-layer structure.

[0052] <Sealant material> · 30μPE: Low density polyethylene film (LDPE), 30μm thick. · 30μPP: Unstretched polypropylene film (CPP), 30μm thick.

[0053] <Coating material> ·SIS: Styrene-isoprene-styrene polymer, Kraton D, SIS. · SBS: Styrene-butadiene-styrene polymer, Kraton D, SBS. · SEPS: Styrene-ethylene-propylene-styrene polymer, manufactured by Kuraray Co., Ltd., Septon 2002. Paraffin: Artience KH FRPW F58N.

[0054] (Evaluation method) <Water Vapor Barrier Resilience Evaluation (WVTR)> The vapor transmission rate of the vapor-deposited film used in each example, the film for packaging immediately after curing and immediately after the Gelbo test, and the packaging was measured under test condition 1 in Table A.1 in accordance with the test method described in the moisture sensor method of JIS K7129:2008, and the results are shown in the table.

[0055] <Oxygen Barrier Evaluation (O2TR)> The oxygen permeability of the vapor-deposited film used in each example, the film for packaging immediately after curing and immediately after the Gelbo test, and the packaging was measured in accordance with the test method for oxygen gas permeability using an electrolytic sensor described in Appendix A of JIS K7126-2:2006, and the results are shown in the table.

[0056] <Gelbo test> The Gelbo test was performed using a Gelbo Flex Tester (MIL-B131H, manufactured by Rigaku Kogyosha). Using the Gelbo Flex Tester, a 21 cm x 29 cm packaging film was twisted 400° with a stroke of 3 inches (7.62 cm) at 23°C and 65% relative humidity. This reciprocating motion was repeated 100 times at a speed of 40 times per minute (40 times / min).

[0057] <Bag making> Using a horizontal pillow packaging machine (NSW type, manufactured by Omori Machinery Co., Ltd.), the packaging film of each example was made into a bag to obtain a package (50 mm x 100 m x 20 mm back panel).

[0058] (Experimental Examples 1 to 3, 5, and 6, Comparative Examples 2 and 5) According to the specifications in Tables 1 and 2, a packaging film similar to packaging film 1 in FIG. 1 was produced. A coating material was provided by gravure printing on the protective layer of the substrate (or on the inorganic vapor deposition layer when no protective layer was provided). Next, a sealant material was placed on the covering material, adhered with an adhesive, and cured at room temperature for 24 hours to obtain a packaging film of each example. The water vapor barrier property and oxygen barrier property were evaluated for the packaging film immediately after curing, the packaging film immediately after the Gelpo test, and the packaging body, and the results are shown in the table.

[0059] (Example 4, Comparative Example 4) A packaging film similar to packaging film 100 in FIG. 2 was obtained in the same manner as in Example 1, except that a second substrate was provided according to the specifications in Tables 1 and 2. The water vapor barrier property and oxygen barrier property were evaluated for the packaging film immediately after curing, the packaging film immediately after the Gelpo test, and the packaging body, and the results are shown in the table.

[0060] Example 7 A film for packaging was obtained in the same manner as in Example 1, except that a mixture of 90 parts by mass of SIS and 10 parts by mass of paraffin was used as the coating material. The water vapor barrier property and oxygen barrier property were evaluated for the packaging film immediately after curing, the packaging film immediately after the Gelpo test, and the packaging body, and the results are shown in the table.

[0061] (Comparative Examples 1 and 3) A packaging film was obtained in the same manner as in Example 1, except that no covering material was provided. The water vapor barrier property and oxygen barrier property were evaluated for the packaging film immediately after curing, the packaging film immediately after the Gelpo test, and the packaging body, and the results are shown in the table.

[0062] [Table 1]

[0063] [Table 2]

[0064] As shown in Tables 1 and 2, in Examples 1 to 7 in which the present invention was applied, the WVTR of the package was 0.55 g / (m 2 The increase in WVTR of the packaging material is 0.15g / (m2) or less compared to the WVTR of the packaging material film immediately after curing (the packaging material film before processing). 2 In addition, in Examples 1 to 7, the O2TR of the package was 1.30 mL / (m 2 The increase in O2TR of the packaging film compared to the O2TR of the packaging film immediately after curing was 0.48 mL / (m 2 day) or less. Comparative Example 1 is an example without a coating material. Comparative Example 2 is an example without a protective layer. Comparative Example 3 is an example in which the protective layer is polyacrylamide and without a coating material. Comparative Example 4 is an example with a second substrate and without a coating material. Comparative Example 5 is an example in which a polymethacrylate layer is used instead of a coating material. In Comparative Examples 1 to 5, the WVTR of the package was 1.15 g / (m 2The increase in WVTR of the packaging film is 0.32 to 0.75 g / (m) compared to the WVTR of the packaging film immediately after curing. 2 In addition, in Examples 1 to 7, the O2TR of the package was 1.50 mL / (m 2 day) or more, and the increase in O2TR of the packaging film compared to the O2TR of the packaging film immediately after curing is 0.35 to 0.63 mL / (m 2 day) or less. From these results, it was confirmed that application of the present invention can provide excellent barrier properties and improve processability. [Explanation of symbols]

[0065] 1,100 Packaging film 10 Base material 12 Base layer 14 Inorganic vapor deposition layer 16 Protective layer 20 Covering material 30 Sealant

Claims

1. The adhesive tape includes a sealant material, a substrate disposed on one side of the sealant material, and a coating material disposed between the sealant material and the substrate, the substrate has a resin base layer, an inorganic vapor deposition layer located on one surface of the base layer, and a protective layer located on the inorganic vapor deposition layer and facing the sealant material; The inorganic vapor deposition layer is made of SiO ｘ a vapor deposition layer comprising: the protective layer is an acrylic resin layer, The film for packaging, wherein the covering material is a resin layer containing a thermoplastic styrene elastomer.

2. 2. The packaging film according to claim 1, wherein the thickness of the coating material is 1 to 5 μm.

3. The packaging film according to claim 1 , wherein the coating material further comprises paraffin.

4. A packaging body produced by forming a bag from the packaging film according to any one of claims 1 to 3.

Images