Automatic scraping device, automatic scraping method, information processing device, method for generating processing instruction data, and processing instruction data generating program

Abstract

To provide a technique relating to an automatic scraping process that automatically scrapes a processing target surface of a workpiece, the technique being capable of inhibiting excessive or insufficient scraping of the processing target surface.SOLUTION: An automatic scraping device comprises: a scraper that has a cutting blade; and a control device that controls the scraper so as to divide a protruding portion on a processing target surface of a workpiece into a plurality of layers in a height direction, and cut the protruding portion in stages. The control device sets at least one of a total number of the plurality of layers and a cutting depth of each of the plurality of layers on the basis of a target area ratio, which is a target value for an area ratio of a removed area of the protruding portion with respect to a total area of the processing target surface.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a technique for automatically performing scraping. [Background technology]

[0002] One type of metal processing is scraping, which is performed to finish a sliding surface or the like into a highly accurate flat surface. For example, Patent Documents 1 and 2 disclose an automatic scraping device that performs scraping on the surface of a workpiece by automatically controlling the operation of a scraping tool (scraper). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 10-58285 [Patent Document 2] Japanese Patent Application Publication No. 05-123921 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional automatic scraping devices, when cutting the surface of a workpiece, the surface is likely to be over-scraped or left unscraped, leaving room for improvement.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a technology for automatic scraping that automatically scrapes the surface of a workpiece to be processed, making it less likely that the surface to be processed will be over-scraped or left unscraped. [Means for solving the problem]

[0006] (Aspect 1) In order to solve the above problems, the automatic scraping device according to aspect 1 of the present invention is an automatic scraping device comprising a scraper having a cutting blade and a control device that divides the convex portions of the workpiece surface to be processed into multiple layers in the height direction and controls the scraper to cut them in stages, and the control device sets at least one of the total number of layers and the cutting depth of each of the multiple layers based on a target area ratio, which is a target value for the area ratio of the removal area of ​​the convex portions to the total area of ​​the workpiece surface.

[0007] (Aspect 2) In the above-mentioned aspect 1, the automatic scraping device may include a three-dimensional shape measuring device that acquires surface height information of the surface to be processed, and the control device may acquire as flatness a value obtained by statistically calculating the difference in height between the convex portions and concave portions of the surface to be processed over the entire surface to be processed based on the surface height information, and may set the value of the target area ratio to be larger as the flatness increases.

[0008] (Aspect 3) In the above-mentioned first aspect, the control device may set the target area ratio based on the flatness of the surface to be processed and the angle formed between the surface to be processed and a surface of an ideal shape.

[0009] (Aspect 4) In the above-mentioned aspect 1, the control device controls the target area ratio so that the cutting depth of the layer to be cut last among the plurality of layers to be removed is smaller than the cutting depth of the layer to be cut first. The cutting depth of each of the plurality of layers may be set based on the above.

[0010] (Aspect 5) In the above-mentioned aspect 4, the control device may set the cutting depth of the layers to be removed from the first layer to a predetermined layer to be the same, and gradually decrease the cutting depth of each layer from the predetermined layer to the last layer to be cut.

[0011] (Aspect 6) In any one of the above aspects 1 to 5, the control device may set the cutting depth of each of the multiple layers so that the difference between the target total cutting depth, which is the total cutting depth of the convex portions that satisfies the target area ratio, and the sum of the cutting depths of each of the multiple layers is less than a predetermined threshold value.

[0012] (Aspect 7) In the above-mentioned aspect 5, the control device may set the target total cutting depth so that the difference between the target area ratio and the area ratio, which is the area ratio of the removed area of ​​the convex portion when cutting at the target total cutting depth to the total area of ​​the surface to be machined, is less than a predetermined threshold value.

[0013] (Aspect 8) In the above-mentioned aspect 2, the control device may select a first cutting depth, which is the cutting depth of the first layer to be cut among the multiple layers to be removed, from among multiple predetermined reference cutting depths based on the flatness, and set the number of layers to be cut at the first cutting depth based on the target area ratio.

[0014] (Aspect 9) In the above-mentioned aspect 8, the control device may select a second cutting depth, which is the cutting depth of a layer below the layer cut at the first cutting depth, from among the plurality of predetermined reference cutting depths so that the second cutting depth is smaller than the first cutting depth, and set the number of layers to be cut at the second cutting depth based on the target area ratio.

[0015] (Aspect 10) In any one of the above aspects 1 to 9, the control device may set the cutting depth of each of the multiple layers to a value between the maximum cutting depth and the minimum cutting depth determined based on the target area ratio.

[0016] (Aspect 11) An information processing device according to any one of aspects 1 to 10 of the present invention is an information processing device that generates processing instruction data for controlling the scraper, and is equipped with a processor that executes a processing instruction data generation process including acquiring the convex portions of the surface to be processed based on surface height information of the surface to be processed, setting multiple processing area layers by dividing the convex portions in the height direction, and setting a processing path for the scraper for each of the multiple processing area layers, and in the processing instruction data generation process, the processor sets at least one of the number of layers of the multiple layers and the cutting depth of each of the multiple layers based on the target area ratio.

[0017] (Aspect 12) A method for generating processing instruction data according to any one of aspects 1 to 10 of the present invention is a method for generating processing instruction data for controlling the scraper, the method comprising: acquiring the convex portion of the processing target surface based on surface height information of the processing target surface; dividing the convex portion in the height direction to set a plurality of processing area layers; and setting a processing path for the scraper for each layer, and in the processing instruction data generation process, setting at least one of the number of layers of the plurality of layers and the cutting depth of each of the plurality of layers based on the target area ratio.

[0018] (Aspect 13) A processing instruction data generation program according to any one of aspects 1 to 10 of the present invention causes a processor of an information processing device that generates processing instruction data for controlling the scraper to execute a processing instruction data generation process that includes acquiring the convex portions of the surface to be processed based on surface height information of the surface to be processed, dividing the convex portions in the height direction to set multiple processing area layers, and setting a processing path for the scraper for each of the multiple processing area layers, and in the processing instruction data generation process, setting at least one of the number of layers of the multiple layers and the cutting depth of each of the multiple layers based on the target area ratio.

[0019] (Aspect 14) In order to solve the above problem, the automatic scraping method according to aspect 14 of the present invention is an automatic scraping method executed when a control device of an automatic scraping device that automatically scrapes the surface of a workpiece controls a scraper having a cutting blade in accordance with processing instruction data, and includes a step of executing a flattening processing process in which the convex portions of the surface to be processed are divided into multiple layers in the height direction and cut in stages, and in the flattening processing process, at least one of the number of layers and the cutting depth of each of the multiple layers is set based on a target area ratio, which is a target value for the area ratio of the removed area of ​​the convex portions to the entire area of ​​the surface to be processed. [Effects of the Invention]

[0020] According to the present invention, it is possible to provide a technique for automatic scraping, which automatically scrapes the surface of a workpiece to be processed, that makes it difficult for over-scraping or incomplete scraping to occur on the surface to be processed. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of an automatic scraping device according to an embodiment. [Figure 2] FIG. 2 is a block diagram illustrating an example of a functional configuration of the control device. [Figure 3] FIG. 3 is a block diagram showing an example of the configuration of the control device. [Figure 4] FIG. 4 is a flowchart of the flattening process. [Figure 5] FIG. 5 is a diagram illustrating the processed region area ratio. [Figure 6] FIG. 6 is a table showing an example of a method for obtaining the target area ratio. [Figure 7] FIG. 7 is a table showing an example of a method for obtaining the target area ratio. [Figure 8] FIG. 8 is a flowchart of the processing area layer setting according to the first embodiment. [Figure 9] FIG. 9 is a diagram for explaining a method for setting the processing area layer. [Figure 10] FIG. 10 is a graph showing an example of cutting depth. [Figure 11] FIG. 11 is a graph showing another example of cutting depth. [Figure 12] FIG. 12 is a diagram illustrating the flow of reacquiring the cutting depth. [Figure 13] FIG. 13 is a flowchart of processing area layer setting according to the second embodiment. [Figure 14] FIG. 14 is a table showing an example of a method for obtaining the reference cutting depth and the target area ratio. [Figure 15] FIG. 15 is a diagram illustrating an example of setting a processing area layer according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0022] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that each configuration and their combinations in the embodiments are merely examples, and additions, omissions, substitutions, and other modifications of the configurations are possible as appropriate within the scope of the gist of the present invention. The present invention is not limited to the embodiments, but is limited only by the claims.

[0023] First Embodiment (Schematic configuration of processing device) FIG. 1 is a diagram showing a schematic configuration of an automatic scraping device 1 according to a first embodiment. As shown in FIG. 1, the automatic scraping device 1 includes a control device 100, a robot arm 200, a three-dimensional shape measuring device 300, and the like. When showing spatial coordinates in FIG. 1, a three-dimensional Cartesian coordinate system is used in which the height direction (vertical direction) is the Z axis, one direction in a horizontal plane is the X axis, and a direction in the horizontal plane perpendicular to the X axis is the Y axis. The horizontal plane is also referred to as the XY plane. The directions of the axes are merely examples and are not limited to these. The same applies to subsequent figures unless otherwise specified.

[0024] The automatic scraping device 1 is a device that automatically performs scraping on a surface to be processed (surface to be processed) 11 of a workpiece 10, which is an object to be processed (piece to be machined). Scraping is a type of metal processing in which a scraper, which is a scraping tool (cutting tool), is used to scrape off convex parts of the surface to be processed 11, thereby increasing the flatness Dp of the surface to be processed 11 (i.e., reducing the unevenness of the surface to be processed 11).

[0025] The robot arm 200 is, for example, a six-axis articulated robot arm, and is a processing robot controlled by the control device 100. The robot arm 200 has a robot hand 210 at its tip end, and is capable of detachably holding (grasping) the scraper 22 and the hand chuck 30 on the robot hand 210. In other words, the scraper 22 and the hand chuck 30 can be selectively attached to the robot hand 210 of the robot arm 200.

[0026] The scraping of the processing target surface 11 of the workpiece 10 is performed, for example, by fixing the workpiece 10 to a processing stand C1 shown in Fig. 1 and controlling a robot arm 200 with a scraper 22 held by a robot hand 210. The scraper 22 includes a flexible scraper body 23 and a cutting blade 24 attached to the tip side of the scraper body 23. The surface of the processing stand C1 is formed in a flat shape parallel to the XY plane.

[0027] In the scraping process, the cutting blade 24 is placed at an angle against the workpiece surface 11, and the robot hand 210 is driven in the -Z direction to press the cutting blade 24 against the workpiece surface 11, and then the robot hand 210 is stroked parallel to the XY plane to cut the workpiece surface 11 to a thickness on the order of microns or submicrons. The robot arm 200 adjusts the cutting depth and cutting width of the workpiece surface 11 cut per stroke of the scraper 22 by using, for example, the tool angle during scraping (the angle between the cutting blade 24 and the XY plane when cutting the workpiece surface 11) and the vertical push amount of the robot hand 210 (the amount of displacement in the -Z direction) as control parameters.

[0028] Next, we will explain the hand chuck 30. The hand chuck 30 is an attachment for gripping the workpiece 10 when transferring the workpiece 10 between the pedestals, and is detachable from the robot hand 210 of the robot arm 200. In the layout shown in Fig. 1, the hand chuck 30 is used, for example, when transferring the workpiece 10 between the processing pedestal C1 and the measurement pedestal C2.

[0029] The measurement stage C2 is a stage on which the workpiece 10 is placed when measuring the three-dimensional shape of the processing target surface 11 of the workpiece 10 using the three-dimensional shape measuring instrument 300. The surface of the measurement stage C2 is also formed into a plane parallel to the XY plane. When moving the workpiece 10 between the processing stage C1 and the measurement stage C2, for example, a hand chuck 30, which is a detachable attachment to a robot hand 210 for gripping the workpiece 10, can be used.

[0030] The three-dimensional shape measuring instrument 300 is, for example, a measuring instrument using a white light interferometer, and is a three-dimensional shape measuring device that can acquire three-dimensional shape data (uneven shape data) of the processing target surface 11 with high accuracy. However, the three-dimensional shape measuring instrument 300 is not particularly limited as long as it can measure the uneven shape data (height data, surface height information) of the processing target surface 11, and for example, a three-dimensional laser scanner or the like may be used. Furthermore, the three-dimensional shape measuring instrument 300 may be a "non-contact type" measuring instrument that acquires the uneven shape data of the processing target surface 11 without contact, or a "contact type" measuring instrument that acquires the uneven shape data of the processing target surface 11 by contacting a probe or the like with the processing target surface 11.

[0031] Additionally, the automatic scraping device 1 may include a tool mounting stand C3 for mounting the scraper unit 20, a hand chuck mounting stand C4 for mounting the hand chuck 30, etc. Furthermore, the robot arm 200 may include a force sensor 220 for detecting the load (resistance) acting on the scraper 22.

[0032] 2 is a block diagram illustrating an example of the functional configuration of the control device 100. The control device 100 functions as an information processing device (processing instruction data generating device) having a processing instruction data generating unit 110 that generates processing instruction data for controlling the robot arm 200, and a control unit 111 that controls the robot arm 200 in accordance with the processing instruction data to perform scraping on the processing target surface 11 of the workpiece 10. However, the processing instruction data may be generated by an information processing device separate from the control device 100. In this case, the control device 100 acquires the processing instruction data generated by the information processing device, and controls the robot arm 200 in accordance with the acquired processing instruction data. The processing instruction data may be transmitted from the information processing device to the control device 100 via either wired communication or wireless communication.

[0033] 3 is a block diagram showing an example of the configuration of the control device 100. The control device 100 is, for example, a general-purpose computer. The computer constituting the control device 100 includes a communication interface (communication I / F) 101, a storage device 102, an input / output device 103, and a processor 104, which are connected via a communication bus 105.

[0034] The communication I / F 101 may be, for example, a network card or a communication module, and communicates with other computers, devices, etc. based on a predetermined protocol. For example, the control device 100 receives three-dimensional shape information of the processing target surface 11 of the workpiece 10 from the three-dimensional shape measuring device 300 via the communication I / F 101.

[0035] The storage device 102 includes, for example, a main storage device and an auxiliary storage device (secondary storage device). The main storage device temporarily stores programs read by the processor 104 and information sent and received between other computers, and secures a work area for the processor 104. The auxiliary storage device stores programs executed by the processor 104 and information sent and received between other computers. The storage device 102 (for example, the auxiliary storage device) stores an operating system (OS), various programs, various information tables, and the like.

[0036] The input / output device 103 is a user interface, such as an input device such as a keyboard or a mouse, an output device such as a monitor, or an input / output device such as a touch panel.

[0037] The processor 104 is an arithmetic processing device that executes programs to perform various processes according to the present embodiment. For example, the processor 104 loads a program stored in the auxiliary storage device of the storage device 102 into the main storage device and executes the program, thereby realizing various processes such as a processing instruction data generation process for generating processing instruction data.

[0038] The control device 100 does not necessarily have to be realized by a single physical configuration, but may be configured by a plurality of computers that cooperate with each other.

[0039] (Flat surface processing) Next, a flattening process relating to scraping by the automatic scraping device 1 will be described. In this embodiment, in the flattening process, the convex portion of the surface 11 to be processed is divided into multiple layers (multiple processing area layers CR) in the height direction, and the convex portion is cut in stages from the top processing area layer CR to the bottom processing area layer CR.

[0040] The following describes the flow of the flattening process executed by the control device 100. Fig. 4 is a flowchart of the flattening process executed by the processor 104 of the control device 100. The flattening process flow is started, for example, when the control device 100 receives a flattening process start request from the user via the input device of the input / output device 103.

[0041] First, in step S101, the three-dimensional shape measuring instrument 300 measures three-dimensional shape data (convex and concave shape data) of the processing target surface 11. The acquired three-dimensional shape data is transmitted to the control device 100 via the communication I / F 101. The processing instruction data generating unit 110 acquires surface height information including convex portions of the processing target surface 11 based on the measurement data from the three-dimensional shape measuring instrument 300.

[0042] Next, in step S102, a target area ratio (hereinafter referred to as target area ratio Ks) for the processing region is acquired based on the three-dimensional shape data acquired in step S101. Specifically, the target area ratio Ks is a target value for the area ratio (processing region area ratio Rs) of the area to be removed of the convex portions to the entire area of ​​the processing target surface 11 in the flattening process.

[0043] In step S103, the convex portion is divided into a plurality of machining area layers CR in the height direction, and the machining area layers CR are set. In this embodiment, the machining area layers CR are set so that the convex portion is divided into a plurality of machining area layers CR, each having a set height, based on the target area ratio Ks obtained in step S102. The acquisition of the target area ratio Ks in step S102 and the setting of the machining area layers CR in step S103 will be described in detail later.

[0044] In step S104, the machining area layer CR is divided. Specifically, the machining area excluding the non-machining area of ​​the machining area layer CR is divided into the width and length of a single cutting range. That is, in dividing the machining area layer CR, the machining area layer CR is divided into each area that is removed by one stroke operation of the cutting blade 24. The division of the machining area layer CR is performed for each machining area layer CR.

[0045] In step S105, processing instruction data is generated. The processing instruction data includes control parameter information and processing point list data. In this embodiment, the processing instruction data generation unit 110 generates processing instruction data for each processing area layer CR.

[0046] The control parameter information includes control values ​​of each control parameter when the robot arm 200 of the automatic scraping device 1 cuts the convex portion of the workpiece surface 11 for each machining area layer CR, and can be generated for each machining area layer CR. The control parameter information includes, for example, each control value of the tool angle and vertical push-in amount, and machining point list data, and is generated for each machining area layer CR. The combination of the tool angle and vertical push-in amount correlates with the cutting depth and cutting width per stroke of the scraper 22. In this embodiment, the control value is determined so that the cutting depth matches the height of the machining area layer CR.

[0047] The machining point list data is data that lists data related to machining paths generated for each machining area layer CR. The data related to machining paths is data that specifies the machining start point and machining end point of the machining path, and may specify, for example, the machining start point coordinates (XY coordinates) at each machining point, the machining path direction, and the machining path length. Alternatively, for example, the data related to machining paths may specify the machining start point coordinates and machining end point coordinates of the machining path.

[0048] In step S106, flattening processing is performed, and cutting is performed in order from the uppermost machining area layer CR. The flattening processing is performed by the control unit 111 driving the robot arm 200, etc. based on the processing instruction data. After the flattening processing is completed, the shape of the processing target surface 11 is measured in step S107, and the control unit 111 acquires surface height information of the processing target surface 11 after the flattening processing.

[0049] In step S108, it is determined from the shape measurement results whether the flatness Dp of the processing target surface 11 after execution of the flattening process is equal to or less than a target value. In step S108, the control unit 111 determines whether the flatness Dp of the processing target surface 11 after the flattening process satisfies a predetermined target flatness, based on the surface height information of the processing target surface 11 acquired in step S107. The flatness Dp here refers to a value obtained by statistically calculating the height difference between convex and concave portions of the height information (Z coordinate) of the processing target surface obtained by three-dimensional shape measurement based on the median or mode of the height difference over the entire surface. Therefore, if the height difference of the uneven shape of the processing target surface 11 after the flattening process is equal to or less than a predetermined threshold, it may be determined that the flatness Dp of the processing target surface 11 satisfies the predetermined target flatness.

[0050] If the flatness Dp is equal to or less than the target value, i.e., if the answer is YES in step S108, the flattening process ends. On the other hand, if the flatness Dp is greater than the target value, i.e., if the answer is NO in step S108, the process returns to step S102, and the operations from step S102 to step S108 are executed again. In other words, the flattening process is continued until the flatness Dp of the processing target surface 11 satisfies the target flatness.

[0051] In the flattening process, it is not necessary to perform all the operations as described above, and the order and content of the operations can be changed as long as no technical contradictions arise. For example, in step S101, the results of shape measurement of the processing target surface 11 obtained in advance may be read.

[0052] (Obtaining target area ratio) Prior to explaining how to obtain the target area ratio Ks, the machining area ratio Rs will be described in detail. FIGS. 5(a) and 5(b) are diagrams illustrating the machining area ratio Rs. FIG. 5(a) shows an example of the shape of the convex portion S3 of the machining target surface 11 on Y=Y1 (Y1 is the coordinate on the Y axis), as well as multiple imaginary planes VPa-VPe parallel to the XY plane. In FIG. 5(a), the horizontal axis (X axis) indicates the horizontal direction (longitudinal direction) of the machining target surface 11, the vertical axis (Z axis) indicates the height direction of the machining target surface 11, and the solid line indicates the surface height of the machining target surface 11. For ease of understanding, the uneven shape of the machining target surface 11 in FIG. 5(a) is depicted such that the height of the convex portions is higher at both ends of the machining target surface 11 in the longitudinal direction and gradually becomes concave toward the center in the longitudinal direction. 5(b) shows the respective machining areas and machining area ratios Rs when the convex portion S3 is removed on the planes VPa to VPe (a predetermined depth). In FIG. 5(b), the blackened areas are the non-machined areas of the machining target surface 11 that are not machined, and the areas other than the blackened areas are the machining areas of the machining target surface 11 that are machined (removed).

[0053] In the example shown in Figures 5(a) and (b), for example, when flattening processing is performed with a target area ratio Ks of 85.5%, the target plane of the processing target surface 11 to be formed after the flattening processing will be equal to the plane VPd.

[0054] A method for obtaining the target area ratio Ks in step S102 in the above-described flattening processing flow will now be described in detail. Fig. 6 is a table showing an example of a method for obtaining the target area ratio Ks. Fig. 6 shows a table showing the relationship between the flatness Dp of the processing target surface 11 and the target area ratio Ks. In the first embodiment, the target area ratio Ks is set to be larger as the flatness Dp of the processing target surface 11 is larger.

[0055] In this example, a table storing the relationship between the flatness Dp and the target area ratio Ks is prepared in advance, and the target area ratio Ks is obtained based on the table, but the method is not limited to this. For example, the control device 100 may be configured to calculate the target area ratio Ks from the flatness Dp using a formula.

[0056] Furthermore, for example, the target area ratio Ks may be obtained not only by using the flatness Dp but also by using the taper deviation Dt, which is the angle (deg) between the surface 11 to be machined and the surface of the target shape (ideal shape). Fig. 7 is a table showing an example of a method for obtaining the target area ratio Ks. Fig. 7 shows a table showing the relationship between the flatness Dp of the surface 11 to be machined, the taper deviation Dt of the surface 11 to be machined, and the target area ratio Ks. In this example, the target area ratio Ks is set to be larger as the flatness Dp of the surface 11 to be machined is larger, and the target area ratio Ks is set to be larger as the taper deviation Dt is larger.

[0057] (Machining area layer setting) A method for setting the machining area layer CR in step S103 in the above-mentioned flattening processing flow will be described in detail. In the first embodiment, the control device 100 determines and sets the height of the part to be removed by the flattening processing, the number of machining area layers CR, and the height (cutting depth hn) based on the target area ratio Ks acquired in step S102. Fig. 8 is a flowchart of the machining area layer setting executed by the processor 104 of the control device 100. Fig. 9 is a diagram for explaining the method for setting the machining area layer CR.

[0058] 9 shows a method of dividing the convex portion S3 into four machining area layers CR as an example of setting the machining area layer CR. Symbol S1 shown in FIG. 9 is a virtual plane that passes through the highest position (Z coordinate) of the convex portion S3 on the machining target surface 11 and is parallel to the XY plane. Symbol S2 shown in FIG. 9 is a target plane (target shape) of the machining target surface 11 to be formed after the flattening processing. Symbol VP shown in FIG. 9 is a virtual machining plane that divides the convex portion S3 in the height direction. Machining planes VP1 to VP4 are set parallel to the virtual plane S1 and the target plane S2 (i.e., parallel to the XY plane) and between the planes S1 and S2.

[0059] In the example shown in Figure 9, the convex portion S3 is divided into four machining area layers CR1, CR2, CR3, and CR4, starting from the top, by four machining planes VP1, VP2, VP3, and VP4. The cutting depth hn is the depth to which the corresponding machining area layer CRn is cut, and corresponds to the height of the machining area layer CRn. Note that n is a number indicating the number of layers from the top of the machining area layer CR (the number of machining layers), and is a natural number. For example, the cutting depth of the topmost machining area layer CR1 is h1.

[0060] First, in step S201, a target total cutting depth H is determined. The target total cutting depth H is the total cutting depth (height) of the convex portion S3 to be removed by the flattening process to satisfy the target area ratio Ks, and is the depth (distance) from the virtual plane S1 to the target plane S2. Note that satisfying the target area ratio Ks does not necessarily require the machined region area ratio Rs to match the target area ratio Ks, but only requires that the machined region area ratio Rs when cutting with the target total cutting depth H be close to the target area ratio Ks. In the first embodiment, the target total cutting depth H is determined so as to satisfy the following equation 1.

number

[0061] In step S202, a function shape parameter Fc is initialized. The function shape parameter Fc is a parameter used to calculate the cutting depth hn. The cutting depth hn is calculated using a function whose value does not increase as the number of machined layers n increases. The function shape parameter Fc is a parameter that determines the rate of change with respect to the number of machined layers n, the positions of inflection points and dead zones, and the number of them, within a range in which the cutting depth hn does not become an increasing function.

[0062] In step S203, the cutting depth hn (h1, h2, ... hN) of each layer is acquired so that the sum of the cutting depths hn of each machining area layer CR (total cutting depth Hsum) approaches the target total cutting depth H. As the cutting depth hn is acquired, the total number of layers N, which is the number (total number) of machining area layers CR, is passively determined. The total number of layers N is equal to the maximum value of the number of machining layers n. In the first embodiment, five function shape parameters Fc = [Fc0, Fc1, Fc2, Fc3, Fc4] (Fck≧0, k=0 to 4) are used to determine the cutting depth hn of each layer so as to satisfy the following equations 2 and 3.

number

number

[0063] An exemplary method for obtaining the cutting depth hn in step S203 will be described below. Fig. 10 is a graph showing an example of the cutting depth hn calculated based on Equation 2. Fig. 10 shows a graph in which the vertical axis represents the cutting depth hn and the horizontal axis represents the number of processed layers n, and cutting depths hn (h1 to h10) are plotted for an example in which the total number of layers N is 10.

[0064] In the upper layer near the virtual plane S1 (the layer with a small value of the number of machining layers n), so that the cutting depth hn (cutting amount) is smaller for the layer closer to the target plane S2 and the total cutting depth Hsum approaches the target total cutting depth H, set max(n - Fc2, 0) = max(n - Fc4, 0) = 0. As a result, from Equation 2, hn = Fc0. Therefore, the cutting depth hn of the machining area layer CR in the upper layer is constant at Fc0. Thus, according to Equation 2, a certain dead zone (an area where the value of hn does not change) can be provided for the cutting depth hn. In this example, the number of machining area layers CR set as the dead zone is the same value as the natural number M that satisfies M ≤ Fc2 < M + 1. In the example shown in FIG. 10, Fc2 = 3, and three machining area layers CR become the dead zone, and the cutting depths h1, h2, and hz for the machining layer numbers n from 1 to 3 are set to Fc0.

[0065] When the number of machining layers n increases, set it so that max(n - Fc2, 0) = n - Fc2, and the cutting depth hn decreases exponentially. When the number of machining layers n further increases, set it so that max(n - Fc4, 0) = n - Fc4, and the cutting depth hn decreases significantly in a Gaussian function. In the example shown in FIG. 10, Fc4 = 5, and the cutting depth hn decreases most significantly from the 5th layer (n = 5) to the 6th layer (n = 6). After the cutting depth hn decreases significantly, the cutting depth hn gradually decreases so as to approach the lower limit threshold value hmin, and the cutting depth hn of the machining area layer CR in the lower layer is determined by the lower limit threshold value hmin or a value close thereto.

[0066] According to this method for obtaining the cutting depth hn, the cutting depth hn of each machining area layer CR is set to be the same from the first layer to a predetermined layer, and the cutting depth hn of each layer can be set to gradually decrease (monotonically decrease) from the predetermined layer to the last layer to be cut. For example, in the example shown in FIG. 10, the cutting depth hn of the machining area layers CR1 to CR3 is the same, and the cutting depth hn continuously decreases from the machining area layer CR3 to the machining area layer CR10. Therefore, the upper machining area layers CR can be cut with a large cutting depth hn, which leads to a reduction in machining time. Furthermore, since the cutting depth hn gradually decreases toward the lower layers, it is possible to machine the machining target surface 11 with high precision while bringing the total cutting depth Hsum closer to the target total cutting depth H. Therefore, by performing flattening processing so that the machining area area ratio Rs is close to the target area ratio Ks, over-cutting or incomplete cutting of the machining target surface is less likely to occur.

[0067] In the example shown in FIG. 10, a function in which a dead zone is provided and the cutting depth hn gradually decreases is used to calculate the cutting depth hn, but this configuration is not limited to this. For example, a monotonically decreasing function may be used to calculate the cutting depth hn without providing a dead zone. Even when using Equation 2, all cutting depths hn may be the same depending on the setting of the function shape parameter Fc. FIGS. 11(a) and 11(b) are graphs showing other examples of cutting depth hn. FIG. 11(a) is a diagram showing an example in which the cutting depth hn is always constant. Furthermore, for example, by using the function expressed by Equation 4 below, the cutting depth hn can be decreased in stages. FIG. 11(b) is a diagram showing an example in which the cutting depth hn decreases in stages based on Equation 4.

number

[0068] In step S204, a determination is made to check whether the cutting depth hn of each machining area layer CR obtained in step S203 is optimized, using the function shape parameter Fc. Specifically, a determination is made as to whether the function E(Fc|H) indicating the relationship between the function shape parameter Fc and the target total cutting depth H is less than a predetermined threshold value G2. If E(Fc|H) < G2, that is, if YES in step S204, the cutting depth hn of each layer is determined as that obtained in step S203, and the setting of the machining area layer CR is completed. On the other hand, if E(Fc|H) ≥ G2, that is, if NO in step S204, the process proceeds to step S205.

[0069] The function E(Fc|H) is represented by, for example, Equation 5 below.

Equation

[0070] That is, in the first embodiment, the cutting depth hn is determined and set so that the difference between the target total cutting depth H determined based on the target area ratio Ks and the total cutting depth Hsum is less than a predetermined threshold value according to Equation 5. That is, the cutting depth hn of each of the plurality of machining area layers CR is determined and set based on the target area ratio Ks.

[0071] Furthermore, the function E is multiplied by the total number of layers N of the processing region layers CR. As the total number of layers N increases, the number of processing steps increases, which may lead to an increase in processing time and an increase in power error in processing. Therefore, in the first embodiment, by including the total number of layers N in the function E, an excessive increase in the total number of layers N, which is proportional to the number of processing steps, is suppressed.

[0072] In the first embodiment, the function E is not limited to such a function, but may be any function that increases as the difference between the target total cutting depth H and the total cutting depth Hsum increases, and that can determine the difference and the total number of layers N by minimizing it.

[0073] In step S205, the function shape parameter Fc is updated. The function shape parameter Fc is updated using an optimization algorithm so as to minimize the function E. By determining the function shape parameter Fc so as to minimize the function E, a machining area layer CR is generated so that H≒Hsum is satisfied. After step S205 is executed, the process proceeds to step S203, and the cutting depth hn and the total number of layers N of each machining area layer CR are determined and set using the function shape parameter Fc updated in step S205.

[0074] In setting the machining area layer CR, the order and content of the operations can be changed as appropriate as long as no technical contradiction occurs. For example, step S201 and step S202 may be executed in parallel. Also, for example, the predetermined threshold G1 in step S204 may be determined based on the flatness Dp and the target area ratio Ks. Also, for example, the results of acquiring the function shape parameter Fc and the cutting depth hn may be trained in a machine learning model, and after the target total cutting depth H is determined, the machine learning model may determine the function shape parameter Fc based on the target total cutting depth H. It is also possible to configure the system so that c and cutting depth hn are acquired.

[0075] The flow of re-acquiring (re-calculating) the cutting depth h n by updating the function shape parameter F c according to the first embodiment will be described with reference to FIG. 12 . FIG. 12 is a diagram illustrating the flow of performing steps S203, S204, and S205 and then performing steps S203 and S204 again. In FIG. 12 , the vertical axis indicates the height direction of the workpiece 10, and a method of dividing the convex portion S3 of the machining target surface 11 into multiple machining region layers CR in the height direction is schematically shown. The top surface of the uppermost machining region layer CR shown in FIG. 12 corresponds to the virtual plane S1 passing through the highest position (Z coordinate) of the convex portion S3. The reference line shown in bold at the bottom of FIG. 12 corresponds to the target plane S2 of the machining target surface 11 to be formed after the flattening process when the target area ratio Ks is reached.

[0076] First, after steps S201 and S202, the cutting depth h n is obtained based on the initial function shape parameter F c (initial F c A) in step S203. In this example, as shown on the left side of FIG. 12, it is assumed that cutting depths h1 to h6 are obtained and six machining area layers CR are generated. The difference between the calculated target total cutting depth H and the total cutting depth HsumA (h1 + h2 + ⋅ ⋅ + h6) is substituted into Equation 5, and if it is determined in step S204 that E(F c | H) ≥ G2, the function shape parameter F c is updated in step S205. In other words, it is determined in step S204 that the cutting depths h1 to h6 determined based on the initial F c A are not sufficiently optimized.

[0077] After the update of the function shape parameter Fc, at step S203, the cutting depth hn is newly obtained based on the updated function shape parameter Fc (updated FcB). In this example, as shown on the right side of FIG. 12, it is assumed that the cutting depths h1 to h7 are obtained and seven machining area layers CR are generated. At this time, the difference component (H - HsumB) between the target total cutting depth H and the total cutting depth HsumB (h1 + h2 + ··· + h7) recalculated based on the newly obtained cutting depths h1 to h7 is substituted into Equation 5. If it is determined at step S204 that E(Fc|H) < G2, the setting of the machining area layer CR is completed.

[0078] Thus, according to the setting of the machining area layer CR of the first embodiment, the calculation of the cutting depth hn is repeatedly performed so that the total cutting depth Hsum becomes a value close to the target total cutting depth H, that is, |H - Hsum| approaches 0. Therefore, cutting can be performed with a machining area area ratio Rs close to the target area ratio Ks.

[0079] In the method for setting the machining area layer CR shown in FIGS. 10 and 11(a) and (b), the total number of layers N was automatically determined when determining the cutting depth hn, but such a configuration is not limited thereto. For example, a configuration may be adopted in which the total number of layers N is determined in advance and then the cutting depth hn is determined so that the function E becomes minimum. In any case, since it is confirmed at step S204 whether the difference component between the target total cutting depth H and the total cutting depth Hsum is less than a predetermined threshold value, machining can be performed so that the machining area area ratio Rs is close to the target area ratio Ks. As a result, it is less likely that the machining target surface will be overcut or undercut.

[0080] <Second Embodiment> Next, a second embodiment according to the present invention will be described. The second embodiment is different from the first embodiment in the method for setting the cutting depth hn. Hereinafter, in the description of the second embodiment, the same components as those in the first embodiment will be denoted by the same reference numerals and the description thereof will be omitted, and only the characteristic configuration of the second embodiment will be described.

[0081] (Setting of Machining Area Layer) A method for setting the processed area layer CR according to the second embodiment will be described. The setting of the area layer CR is performed, for example, in step S103 of Fig. 4 described in the first embodiment. In the second embodiment, the height of the part to be removed by the flattening process, the number of machining area layers CR, and the height (cutting depth) are determined and set based on the target area ratio Ks obtained in step S102. Fig. 13 is a flowchart of the machining area layer setting executed by the processor 104 of the control device 100.

[0082] First, in step S301, a reference cutting depth hri, a target area ratio Ks, and a natural number i are obtained. The reference cutting depth hri is the height of the machining area layer CR, and in the second embodiment, it is selected from a plurality of predetermined values. In step S301, a reference cutting depth hri corresponding to the height of the uppermost machining area layer CR to be cut first among the plurality of machining area layers CR is obtained. The natural number i is a value used in setting the machining area layer CR, and the value of the reference cutting depth hri is determined based on the natural number i, which is updated as appropriate, and setting of the machining area layer CR is terminated. In the second embodiment, the reference cutting depth hri, the target area ratio Ks, and the natural number i are obtained based on the flatness Dp of the machining target surface 11.

[0083] Fig. 14 is a table showing an example of a method for obtaining the reference cutting depth hri, the target area ratio Ks, and the natural number i. Fig. 14 shows a table showing the relationship between the flatness Dp of the workpiece surface 11, the reference cutting depth hri, the target area ratio Ks, and the natural number i. In the second embodiment, the reference cutting depth hri, the target area ratio Ks, and the natural number i are set to be larger as the flatness Dp increases. In this example, the maximum value of the natural number i is 5, and five reference cutting depths hr1 to hr5 are predefined. For example, if the flatness Dp of the workpiece surface 11 is 8.0 µm, then in step S301, hr3 = 2.5 µm, Ks = 70%, and i = 3 are obtained.

[0084] In this example, a table storing the relationships between flatness Dp, reference cutting depth hri, target area ratio Ks, and natural number i is prepared in advance, and the target area ratio Ks is obtained based on the table, but the method is not limited to this. For example, the control device 100 may be configured to calculate the target area ratio Ks from flatness Dp using a formula, or to obtain the reference cutting depth hri from the obtained natural number i.

[0085] In step S302, the total cutting depth Hsum is initialized to 0. Note that step S302 may be performed in parallel with step S301, or may be performed before step S301.

[0086] In step S303, the number of layers Ni is acquired. The number of layers Ni is the number of machining area layers CR whose layer height is set to the reference cutting depth hri. The reference cutting depth hri at this time is the value acquired in step S301 or a value determined based on the natural number i updated in step S306, which will be described later.

[0087] The number of layers Ni is determined so that when Ni machining area layers CR of the reference cutting depth hri are generated, the total cutting depth Hsum will be as large as possible without exceeding the target total cutting depth H. Specifically, the total cutting depth Hsum is updated by adding the value obtained by multiplying the reference cutting depth hri and the number of layers Ni to the total cutting depth Hsum. Then, the number of layers Ni is determined so that the maximum value of the machining area ratio Rs determined based on the updated total cutting depth Hsum does not exceed the target area ratio Ks. In other words, the number of layers Ni is determined so that the maximum positive integer value that satisfies the following equation 6 when the total cutting depth Hsum is updated to Hsum + Ni * hri.

number

[0088] In step S304, the total cutting depth Hsum is updated by adding the value obtained by multiplying the latest reference cutting depth hri by the number of layers Ni determined in step S303 to the total cutting depth Hsum.

[0089] In step S305, a machining area layer CR is generated based on the reference cutting depth hri and the number of layers Ni obtained so far. That is, Ni machining area layers CR of the reference cutting depth hri are generated here. In the second embodiment, the machining area layers CR are generated in order from the upper layer to the lower layer. Therefore, in the first step S305, machining area layers CR including the uppermost machining area layer CR are generated.

[0090] Next, in step S306, the natural number i is updated to a value (i-1) obtained by subtracting 1 from i. By updating the natural number i, the hri-1 of the next machining area layer CR is set to a value smaller than the reference cutting depth hri. For example, if the natural number i is updated from 3 to 2, the cutting depth hr of the next machining area layer CR to be generated is determined to be hr2 = 2.0 μm according to the table in FIG.

[0091] Next, in step S307, it is determined whether or not the setting of the machining area layer CR is completed using the natural number i. Specifically, it is determined whether or not the updated natural number i is 0. If i=0, that is, if step S307 is YES, the setting of the machining area layer CR is completed. On the other hand, if i≠0, that is, if step S307 is NO, the process proceeds to step S308.

[0092] In step S308, in order to determine whether to continue generating the machining area layer CR, it is determined whether the machining area area ratio Rs when cutting with the total cutting depth Hsum updated in step S304 is a value sufficiently close to the target area ratio Ks. Specifically, it is determined whether the difference between the target area ratio Ks and the machining area area ratio Rs is less than a predetermined threshold value G3. If |Ks - Rs| < G3, that is, if YES in step S308, the setting of the machining area layer CR is completed. On the other hand, if |Ks - Rs| ≥ G3, that is, if NO in step S308, the process proceeds to step S303. Thus, even when i ≠ 0, by setting it so that the setting of the machining area layer CR can be completed, it is possible to suppress an excessive increase in the total number of layers N proportional to the machining man-hours.

[0093] If NO in step S308, in step S303, based on the natural number i updated in step S306 and the reference cutting depth hri corresponding to the natural number i, a new number of layers Ni is obtained. Then, the total cutting depth Hsum is updated in step S304, and a new machining area layer CR is generated in step S305 for the number of layers Ni. In the second step S305, a machining area layer CR lower than the machining area layer CR generated in the first step S305 is generated. Since the reference cutting depth hri is set to decrease as the natural number i decreases, the height of the machining area layer CR decreases as it goes to the lower layer. After that, the natural number i is updated again in step S306. That is, in the second embodiment, the operations from step S303 to step S308 are repeatedly performed until |Ks - Rs| < G3 is satisfied, and the machining area layer CR is generated from the upper layer to the lower layer.

[0094] Thus, in the second embodiment, the cutting depth hn is selected based on the flatness Dp from among a plurality of predetermined cutting depths hri. And when setting the cutting depth hn and the total number of layers N, the comparison result between the machining area area ratio Rs determined by the cutting depth hn and the total number of layers N and the target area ratio Ks is used. That is, in the second embodiment, it can be said that the cutting depth hn and the total number of layers N are determined and set based on the target area ratio Ks.

[0095] In setting the machining area layer CR, the order and content of the operations can be changed as appropriate as long as no technical contradictions arise. For example, steps S304 and S305 may be executed in parallel. Also, for example, the reference cutting depth hri and the target area ratio Ks may be obtained based on the flatness Dp and taper deviation Dt of the machining target surface 11.

[0096] A method for setting a machining area layer CR according to the second embodiment will be described with reference to FIG. 15. FIG. 15 is a diagram illustrating an example of setting a machining area layer CR according to the second embodiment. In FIG. 15, the vertical axis indicates the height direction of the machining target surface 11, and a method for determining and setting multiple machining area layers CR that divide the convex portion S3 of the machining target surface 11 in the height direction, starting from the top, is schematically shown. FIG. 15 shows a virtual plane S1 that passes through the highest position in the height (Z coordinate) of the convex portion S3 as a plane passing through the top surface of the machining area layer CR of the top layer. In addition, the reference line shown in bold at the bottom of FIG. 15 corresponds to the target plane S2 of the machining target surface 11 to be formed after the flattening process when the target area ratio Ks is reached.

[0097] In this example, a case will be described where the flatness Dp of the processing target surface 11 is 8.0 μm. Since Dp=8.0 μm, in step S301, a reference cutting depth hr3 (2.5 μm) is acquired as the cutting depth hn (first cutting depth) of the layer to be generated according to the table shown in FIG. 14. Furthermore, the target area ratio Ks is acquired as 70%, and the natural number i is acquired as 3. At this time, the target plane S2 is determined based on Ks=70%.

[0098] Then, after the total cutting depth Hsum is initialized to 0 in step S302, the number of layers N3 is acquired in the first step S303 based on the reference cutting depth hr3 (2.5 μm) and the target area ratio Ks (70%). In this example, when N3 is 2 or less, the total cutting depth Hsum is less than the target total cutting depth H (the height from the target plane S2 to the virtual plane S1), and when N3 is 3 or more, the total cutting depth Hsum exceeds the target total cutting depth H. Therefore, in step S303, N3=2 is acquired as shown in FIG.

[0099] Next, in step S304, Hsum is updated to 2*hr3, and in step S305, machining area layers CR1 and CR2 with a reference cutting depth hr3 are generated. Then, in step S306, the natural number i is updated from 3 to 2, and a determination is made in step S307. At this point, since i=2, the determination in step S307 is NO, and the process returns to step S303 again.

[0100] In the second steps S303 to S305, a layer is generated in which the cutting depth hn (second cutting depth) is the reference cutting depth hr2 (2.0 μm) based on i=2. In step S303, the number of layers N2 is obtained based on the reference cutting depth hr2 (2.0 μm) and the target area ratio Ks (70%). In this example, N2=2 is obtained as shown in FIG. 15. Note that the target area ratio Ks is determined based on the flatness Dp of the machining target surface 11 before the setting of the machining area layer CR, and does not change depending on the value of the natural number i.

[0101] Next, in step S304, Hsum is updated to 2*hr3+2*hr2, and in step S305, machining area layers CR3 and CR4 with a reference cutting depth hr2 are generated. Then, in step S306, the natural number i is updated from 2 to 1, and a determination is made in step S307. At this point, since i=1, the determination in step S307 is NO, and the process returns to step S303 again.

[0102] In the third steps S303 to S305, a layer is generated in which the cutting depth hn (third cutting depth) is the reference cutting depth hr3 (1.5 μm) based on i=1. In step S303, the number of layers is determined based on the reference cutting depth hr1 (1.5 μm) and the target area ratio Ks (70%). N1 is acquired. In this example, N1=2 is acquired as shown in FIG.

[0103] Next, in step S304, Hsum is updated to 2*hr3+2*hr2+2*hr1, and in step S305, machining area layers CR5 and CR6 with a reference cutting depth hr1 are generated. Then, in step S306, the natural number i is updated from 1 to 0, and since i=0, the answer in step S307 is YES, and the setting of the machining area layer CR is completed.

[0104] Thus, according to the setting of the machining area layer CR of the second embodiment, the upper machining area layer CR can be cut with a large cutting depth hn, which leads to a reduction in machining time. Also, the lower machining area layer CR can be cut with a smaller cutting depth hn, which allows the machining target surface 11 to be machined with high precision and cut with a machining area ratio Rs close to the target area ratio Ks. As a result, over-machining and unmachined portions of the machining target surface are less likely to occur.

[0105] <Other embodiments> The above-described embodiment is merely an example, and the present disclosure may be modified as appropriate within the scope of the present disclosure. Furthermore, the processes and means described in the present disclosure may be freely combined and implemented as long as no technical contradiction occurs.

[0106] Furthermore, a process described as being performed by one device may be shared and executed by multiple devices. Alternatively, a process described as being performed by different devices may be executed by a single device. In a computer system, the hardware configuration that realizes each function can be flexibly changed.

[0107] The present disclosure can also be realized by supplying a computer program implementing the functions described in the above embodiments to a computer, and having one or more processors in the computer read and execute the program. Such a computer program may be provided to the computer via a non-transitory computer-readable storage medium connectable to the computer's system bus or via a network. Non-transitory computer-readable storage media include any type of medium suitable for storing electronic instructions, such as any type of disk, including magnetic disks (e.g., floppy disks, hard disk drives (HDDs), etc.), optical disks (e.g., CD-ROMs, DVDs, Blu-ray disks), read-only memory (ROM), random access memory (RAM), EPROM, EEPROM, magnetic cards, flash memory, or optical cards. [Explanation of symbols]

[0108] 1...automatic scraping device, 10...workpiece (object to be processed), 11...surface to be processed, 22...scraper, 100...control device

Claims

1. a scraper having a cutting blade; a control device that divides the convex portion of the processing surface of the workpiece into a plurality of layers in the height direction and controls the scraper to cut it in stages; An automatic scraping device comprising: the control device sets at least one of the total number of the plurality of layers and the cutting depth of each of the plurality of layers based on a target area ratio that is a target value for an area ratio of the removal area of ​​the convex portion to the entire area of ​​the processing surface. Automatic scraping processing equipment.

2. the automatic scraping device is equipped with a three-dimensional shape measuring device that acquires surface height information of the surface to be processed, the control device acquires a value obtained by statistically calculating the height difference between the convex portions and the concave portions of the processing target surface over the entire processing target surface based on the surface height information as flatness, and sets the value of the target area ratio to be larger as the flatness increases. The automatic scraping device according to claim 1.

3. the control device sets the target area ratio based on the flatness of the surface to be machined and the angle between the surface to be machined and a surface of an ideal shape. The automatic scraping device according to claim 1.

4. the control device sets the cutting depth of each of the plurality of layers based on the target area ratio so that the cutting depth of the layer to be cut last among the plurality of layers to be removed is smaller than the cutting depth of the layer to be cut first. The automatic scraping device according to claim 1.

5. the control device sets the cutting depth of each layer to be removed from the first cut layer to a predetermined layer to be the same, and gradually decreases the cutting depth of each layer from the predetermined layer to the last cut layer, The automatic scraping device according to claim 4.

6. the control device sets the cutting depth of each of the plurality of layers so that a difference between a target total cutting depth, which is a total cutting depth of the convex portions that satisfies the target area ratio, and a sum of the cutting depths of each of the plurality of layers is less than a predetermined threshold value. The automatic scraping device according to claim 1.

7. the control device sets the target total cutting depth so that a difference between the target area ratio and an area ratio, which is an area ratio of the removed area of ​​the convex portion when cutting with the target total cutting depth to the entire area of ​​the processing target surface, is less than a predetermined threshold value. The automatic scraping device according to claim 6.

8. the control device selects a first cutting depth, which is a cutting depth of a layer to be cut first among the plurality of layers to be removed, from a plurality of predetermined reference cutting depths based on the flatness, and sets the number of layers to be cut at the first cutting depth based on the target area ratio. The automatic scraping device according to claim 2.

9. the control device selects a second cutting depth, which is a cutting depth of a layer below the layer cut at the first cutting depth, from the plurality of predetermined reference cutting depths so as to be smaller than the first cutting depth, and sets the number of layers to be cut at the second cutting depth based on the target area ratio. The automatic scraping device according to claim 8.

10. the control device sets the cutting depth of each of the plurality of layers to a value between a maximum cutting depth and a minimum cutting depth determined based on the target area ratio. The automatic scraping device according to claim 1.

11. An information processing device that generates processing instruction data for controlling the scraper according to any one of claims 1 to 10, acquiring the convex portion of the processing target surface based on surface height information of the processing target surface, and dividing the convex portion in a height direction to set a plurality of processing region layers; Setting a machining path of the scraper for each of the plurality of machining area layers; a processor that executes a processing instruction data generation process including the processor sets at least one of a total number of the plurality of layers and a cutting depth of each of the plurality of layers based on the target area ratio in the processing instruction data generation process. Information processing device.

12. A processing instruction data generation method executed by a processor of an information processing device to generate processing instruction data for controlling the scraper according to any one of claims 1 to 10, acquiring the convex portion of the processing target surface based on surface height information of the processing target surface, and dividing the convex portion in a height direction to set a plurality of processing region layers; Setting a machining path of the scraper for each of the plurality of machining area layers; Execute a processing instruction data generation process including the In the processing instruction data generation process, at least one of the total number of the plurality of layers and the cutting depth of each of the plurality of layers is set based on the target area ratio. A method for generating processing instruction data.

13. A processor of an information processing device that generates processing instruction data for controlling the scraper according to any one of claims 1 to 10, acquiring the convex portion of the processing target surface based on surface height information of the processing target surface, and dividing the convex portion in a height direction to set a plurality of processing region layers; Setting a machining path of the scraper for each of the plurality of machining area layers; and in the processing instruction data generation process, setting at least one of a total number of the plurality of layers and a cutting depth of each of the plurality of layers based on the target area ratio. Processing instruction data generation program.

14. An automatic scraping method executed by a control device of an automatic scraping device that automatically scrapes a surface to be processed of a workpiece when controlling a scraper having a cutting blade in accordance with processing instruction data, comprising: a step of performing a flattening process in which the convex portion of the processing surface is divided into a plurality of layers in the height direction and cut in stages, In the flattening process, at least one of the total number of the plurality of layers and the cutting depth of each of the plurality of layers is set based on a target area ratio, which is a target value of an area ratio of the removal area of ​​the convex portion to the entire area of ​​the processing target surface. Automatic scraping method.

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