Display device

Abstract

To reduce display defects of a display device and to improve display quality of the display device.SOLUTION: A display device comprises: a display panel; and a first conductive layer. The display panel comprises a display element having a pair of electrodes. Constant potential is supplied to an electrode close to one surface of the display panel, of the pair of electrodes. Constant potential is supplied to the first conductive layer. Constant potential is supplied also to a second conductive layer due to a fact that the second conductive layer provided on the other surface of the display panel contacts with the first conductive layer. The second conductive layer has a portion that is not fixed to the first conductive layer.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] One embodiment of the present invention relates to a display device, a module, and an electronic device. In particular, electroluminescence (EL The present invention relates to a display device, a module, and an electronic device that utilizes the phenomenon.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the semiconductor device include a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, an electronic device, a lighting device, Input devices (e.g., touch sensors), input / output devices (e.g., touch panels), etc. These driving methods or manufacturing methods can be cited as examples. [Background technology]

[0003] In recent years, display devices are expected to be used in a variety of applications, and diversification is being demanded.

[0004] For example, in the case of a display device for a portable device, it is important that the display device is thin, lightweight, and resistant to breakage. It is required to be difficult to do things like that.

[0005] Light-emitting elements that utilize the EL phenomenon (also referred to as EL elements) are easy to make thin and lightweight. It has features such as high speed response to signals and the ability to be driven using a low voltage DC power supply. , and its application to display devices is being considered.

[0006] For example, Patent Document 1 discloses a flexible light-emitting device to which an organic EL element is applied. There are. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-197522 Summary of the Invention [Problem to be solved by the invention]

[0008] When the thickness of a display panel is reduced to make it lighter or more flexible, the display panel becomes noisy. become more susceptible to the effects of

[0009] One of the causes of noise is parasitic capacitance between the display panel and the housing or the human body.

[0010] For example, by deforming the display panel, at least a part of the display panel is attached to the housing. This can cause parasitic changes between the display panel and the housing. If the capacitance changes, the brightness of the pixel may change locally, possibly resulting in a display defect.

[0011] An object of one embodiment of the present invention is to reduce display defects in a display device. An object of one embodiment of the present invention is to improve the display quality of a display device. An object of one embodiment of the present invention is to provide a display device having a curved surface. An object of one embodiment of the present invention is to provide a flexible display device. An object of one embodiment of the present invention is to provide a lightweight display device. An object of one embodiment of the present invention is to provide a thin display device. Another object of the present invention is to provide a highly reliable display device. One of the objects of the present invention is to provide a novel display device, electronic device, or the like.

[0012] The description of these problems does not preclude the existence of other problems. It is not necessary for the embodiments to solve all of these problems. It is possible to extract other problems from the description of the claim. [Means for solving the problem]

[0013] A display panel according to one embodiment of the present invention includes a flexible substrate, a transistor, a light-emitting element, and a conductive layer. The transistor and the light-emitting element are each located on a flexible substrate. A first electrode on a flexible substrate and a layer containing a light-emitting substance on the first electrode (hereinafter referred to as an EL layer) and a second electrode on the EL layer. The first electrode is the source or The second electrode is electrically connected to the drain. A constant potential is applied to the second electrode. The transistor and the light-emitting element are electrically insulated from the conductive layer. Each of the flexible substrates overlaps a conductive layer, and a constant potential is applied to the conductive layer.

[0014] A display device according to one embodiment of the present invention includes a display panel and a first conductive layer. The display panel has flexibility. The transistor and the light-emitting element are each located on a flexible substrate. a first electrode on a flexible substrate, an EL layer on the first electrode, and a second electrode on the EL layer; The first electrode is electrically connected to the source or drain of the transistor. The L layer contains a light-emitting material. A constant potential is applied to the second electrode. The transistor and the light-emitting element are electrically insulated from the second conductive layer. Each of the electrodes overlaps the second conductive layer via the flexible substrate. The second conductive layer has a portion that is in contact with the first conductive layer. The second conductive layer has a portion that is not fixed to the first conductive layer. A constant potential is applied to the first conductive layer.

[0015] The first conductive layer is in contact with a wiring to which a constant potential is supplied in a portion that does not overlap with the display panel. is preferred.

[0016] The area where the second conductive layer and the display area of ​​the display panel overlap each other is 80% or more of the area of ​​the display area. It is preferable that the ratio is 100% or less.

[0017] The area of ​​the second conductive layer is preferably larger than the area of ​​the display region of the display panel.

[0018] The area where the first conductive layer and the display panel overlap each other is 80% or more and 100% or less of the area of ​​the display panel. % or less is preferable.

[0019] The area of ​​the first conductive layer is preferably larger than the area of ​​the display panel.

[0020] The display device preferably has an insulating layer overlapping the display panel with the first conductive layer interposed therebetween. For example, the insulating layer preferably contains a resin. The film or sheet may have a laminated structure including a conductive layer and a conductive layer. The thickness is preferably 20 μm or more and 100 μm or less. The insulating layer preferably has a Rockwell hardness of M60 or more and M120 or less.

[0021] The thickness of the display panel is preferably 50 μm or more and 100 μm or less.

[0022] When the light emitting element emits light toward the flexible substrate side, the first conductive layer and the second conductive layer are Each of them has a function of transmitting visible light. The light emitting element emits light to the side opposite to the flexible substrate side. In this case, the first conductive layer preferably comprises a metal or an alloy.

[0023] One aspect of the present invention is a display device having the above-described configuration, flexible printed circuit (hereinafter referred to as FPC) or TCP Modules with connectors such as Tape Carrier Package or COG (Chip On Glass) or COF (Chip On It is a module in which an integrated circuit (IC) is mounted using a film method or the like. .

[0024] In one embodiment of the present invention, the above structure is not a display device, but a light-emitting device or an input / output device (touch The present invention may be applied to a panel, etc.

[0025] One aspect of the present invention includes the above-mentioned module and a sensor, and the sensor is It is an electronic device that overlaps with the display panel.

[0026] One aspect of the present invention is a device including the above module, an antenna, a battery, a housing, a camera, and a speaker. , a microphone, or an operation button. [Effects of the Invention]

[0027] According to one embodiment of the present invention, display defects of a display device can be reduced. According to one embodiment of the present invention, the display quality of a display device can be improved. In this way, a display device having a curved surface can be provided. A flexible display device can be provided. Alternatively, according to one embodiment of the present invention, a thin display device can be provided. According to one embodiment of the present invention, a highly reliable display device can be provided. Alternatively, according to one embodiment of the present invention, a novel display device, electronic device, or the like can be provided. can be provided.

[0028] The description of these effects does not preclude the existence of other effects. The embodiments do not necessarily have all of these effects. From the description of the section, it is possible to extract other effects. [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a cross-sectional view showing an example of a display panel. [Figure 2] FIG. 1 is a cross-sectional view showing an example of a display device. [Figure 3] 1A and 1B are a circuit diagram of a pixel and a cross-sectional view showing an example of a display panel. [Figure 4] FIG. 1 is a cross-sectional view showing an example of a display panel. [Figure 5] 3A and 3B are a top view and a bottom view showing an example of a display panel. [Figure 6] 1A and 1B are a top view and a cross-sectional view illustrating an example of a display device. [Figure 7] FIG. 1 is a side view showing an example of a display device. [Figure 8] FIG. 1 is a cross-sectional view showing an example of a display panel. [Figure 9] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display panel. [Figure 10] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display panel. [Figure 11] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display panel. [Figure 12] FIG. 1 is a cross-sectional view showing an example of a display panel. [Figure 13] FIG. 1 is a cross-sectional view showing an example of a display panel. [Figure 14] FIG. 1 is a perspective view showing an example of a touch panel. [Figure 15] FIG. 1 is a cross-sectional view showing an example of a touch panel. [Figure 16] 1A and 1B are a cross-sectional view illustrating an example of a touch panel, and a top view and a cross-sectional view of a transistor. [Figure 17] FIG. 1 is a cross-sectional view showing an example of a touch panel. [Figure 18] FIG. 1 is a cross-sectional view showing an example of a touch panel. [Figure 19] FIG. 1 is a cross-sectional view showing an example of a touch panel. [Figure 20] FIG. 1 is a perspective view showing an example of a touch panel. [Figure 21] FIG. 1 is a cross-sectional view showing an example of a touch panel. [Figure 22] FIG. 1 is a cross-sectional view showing an example of a touch panel. [Figure 23] FIG. 1 is a perspective view showing an example of an electronic device. [Figure 24] 1A and 1B are a top view and a bottom view showing an example of an electronic device. [Figure 25] FIG. 1 is a top view illustrating an example of an electronic device. [Figure 26] FIG. 1 is a perspective view showing an example of an electronic device. [Figure 27] FIG. 1 is a perspective view showing an example of an electronic device. [Figure 28] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 29] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 30] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 31] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 32] 10 is a photograph illustrating a display device according to an embodiment of the present invention. [Figure 33] 10 is a display photograph of the display device of the embodiment. [Figure 34] FIG. 10 is a diagram illustrating the measurement results of the XRD spectrum of a sample. [Figure 35]TEM image of a sample and a diagram illustrating an electron beam diffraction pattern. [Figure 36] FIG. 1 is a diagram illustrating EDX mapping of a sample. DETAILED DESCRIPTION OF THE INVENTION

[0030] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in the form and details thereof without departing from the spirit and scope of the present invention. It will be readily understood by those skilled in the art that the present invention can be achieved by the following embodiments. It should not be construed as being limited to the contents described.

[0031] In the configuration of the invention described below, the same parts or parts having similar functions are designated by the same reference numerals. The same reference numerals are used in common among different drawings, and the repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be added.

[0032] In addition, the position, size, range, etc. of each component shown in the drawings are not necessarily the same as in reality for ease of understanding. Therefore, the disclosed invention may not necessarily represent the position, size, range, etc. Furthermore, the present invention is not limited to the position, size, range, etc. disclosed in the drawings.

[0033] The words "film" and "layer" may be used interchangeably depending on the situation. For example, the term "conductive layer" can be used interchangeably with the term "conductive film." Alternatively, for example, the term "insulating film" can be changed to " The term "insulating layer" may be changed to "insulating layer."

[0034] In this specification, the term "substrate" refers to at least one of a functional circuit, a functional element, a functional film, etc. It is preferable that the "substrate" has a function of supporting one of them. For example, the function of protecting the surface of the device or panel, or Even if it has a function of sealing at least one of the functional circuit, functional element, and functional film, etc. In this specification, a substrate having flexibility will be referred to as a "flexible substrate."

[0035] (Embodiment 1) In this embodiment, a display device according to one embodiment of the present invention will be described with reference to FIGS.

[0036] In this embodiment, the case where an organic EL element is mainly used will be described as an example. is preferable because it can be easily made flexible.

[0037] FIG. 1 is a cross-sectional view of a display panel according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view of a display device according to one embodiment of the present invention. FIG. 3(A) is a circuit diagram showing an example of a pixel circuit of a display panel. 3(B) and 4 are cross-sectional views of comparative display panels.

[0038] The pixel circuit shown in FIG. 3A includes a light emitting element 31, a transistor 32, a transistor 33, and and a capacitor element 34. The transistor 32 functions as a drive transistor. The transistor 33 functions as a selection transistor.

[0039] The first electrode of the light emitting element 31 is electrically connected to the first wiring 11. The second electrode of the transistor 32 is electrically connected to the first electrode of the transistor 32. A second electrode of the transistor 32 is electrically connected to the second wiring 12. The gate is electrically connected to a first electrode of the transistor 33 and a first electrode of the capacitor 34. The second electrode of the transistor 33 is electrically connected to the third wiring 13. The gate of the transistor 33 is electrically connected to the fourth wiring 14. The second electrode of 34 is electrically connected to the fifth wiring 15 .

[0040] The comparative display panel 16 shown in FIG. 3B includes a flexible substrate 51, a layer 20 including transistors, and a , a light emitting element 31 , an insulating layer 53 , an adhesive layer 55 , and a flexible substrate 57 .

[0041] The transistor-containing layer 20 includes the gate, source, and drain of the transistor, as well as the wiring. In FIG. 3B, the layer 20 including the transistor has a conductive layer. One of the layers, conductive layer 21, is shown.

[0042] The light emitting element 31 has an electrode 41, an EL layer 43, and an electrode 45. The light emitting element 31 is flexible. The device is sealed by a flexible substrate 51 , an adhesive layer 55 , and a flexible substrate 57 .

[0043] One of the electrodes 41 and 45 functions as an anode, and the other functions as a cathode. When a voltage higher than the threshold voltage of the light-emitting element 31 is applied between the electrode 41 and the electrode 45, E Holes are injected into the L layer 43 from the anode side, and electrons are injected from the cathode side. The holes recombine in the EL layer 43, causing the luminescent material contained in the EL layer 43 to emit light.

[0044] The electrode 41 functions as a pixel electrode and is provided for each light emitting element 31. The electrode 41 is electrically insulated by an insulating layer 53. The electrode 45 serves as a common electrode. The electrode 45 functions as a light emitting element and is provided across the plurality of light emitting elements 31. The electrode 45 corresponds to an electrode electrically connected to the first wiring 11. A constant potential is supplied to the electrode 45. can be.

[0045] The thinner the display panel 16, the lighter and more flexible the display panel 16 can be. On the other hand, the display panel 16 becomes more susceptible to noise.

[0046] As shown in FIG. 3B, there is a capacitance between the finger 99 of the user of the display panel 16 and the conductive layer 21. The finger 99 moves relative to the conductive layer 21, and the finger 99 and the conductive layer 21 are connected to each other. The distance between the capacitor 39 and the conductive layer 21 changes, and the size of the capacitor 39 also changes.

[0047] FIG. 4A shows an example in which the display panel 16 is disposed on a conductive housing 98. A portion of the display panel 16 is in contact with the housing 98, and another portion is separated from the housing 98. 4(B) is an enlarged view of the area 22C where the display panel 16 is in contact with the housing 98 in FIG. 4(C) shows a larger view of the display panel 16 in FIG. 4(A) when it is not in contact with the housing 98. 10 shows an enlarged view of a region 22D.

[0048] The capacitance 39 between the housing 98 and the conductive layer 21 is The capacitance C3 in FIG. 4B differs from the capacitance C4 in FIG. 4C when the capacitors are not in contact. In Figure 4(B) and (C), C3>C4.

[0049] Even if the display panel 16 is disposed on the housing 98, a part of the display panel 16 may be separated from the housing 98. In addition, by deforming the display panel 16, the display panel 16 is partially removed from the housing 98. Therefore, when the display panel 16 is in use, the gap between the housing 98 and the conductive layer 21 may become loose. The size of the capacitance 39 may vary.

[0050] As shown in FIG. 3A, the capacitor 39 affects the potential of the node N. The closer the distance to the conductive layer 21, the larger the capacitance 39. The shorter the distance between the housing or the human body and the conductive layer 21, the more likely it is that a large capacitance will occur. That is, the range of change in the capacitance 39 increases, and the range of change in the potential of the node N also increases. This can cause large local variations in pixel brightness, resulting in display defects.

[0051] In view of this, in one embodiment of the present invention, a conductive layer to which a constant potential is supplied is provided in a display panel. The potentials include power supply potentials such as low power supply potential (VSS) and high power supply potential (VDD), and ground potential ( GND potential), common potential, reference potential, etc.

[0052] The display panel 10 shown in FIG. 1A includes a conductive layer 21 overlapping with a flexible substrate 51 therebetween. 3A in that it has a display panel 71. 16, so a detailed explanation will be omitted.

[0053] The conductive layer 71 is electrically connected to the wiring 19 that supplies a constant potential. The conductive layer 71 is electrically insulated from the conductive layer 21 of the transistor-containing layer 20. Since the conductive layer 71 is located on the surface of the display panel 10, a constant voltage is applied to the conductive layer 71 from the viewpoint of safety. In this embodiment, the GND potential is applied to the conductive layer 71. Here are some examples that can be obtained:

[0054] A capacitance C1 is generated between the conductive layer 21 and the conductive layer 71. As shown in FIGS. Even if the display panel 10 is bent, the relative position of the conductive layer 21 with respect to the conductive layer 71 does not change. FIG. 1(C) is an enlarged view of region 22 in FIG. 1(B). In the region 22, the distance between the conductive layer 21 and the conductive layer 71 is equal, and the distance between the conductive layer 21 and the conductive layer 71 is equal. The capacitance C1 between them is also equal.

[0055] Furthermore, a capacitance C2 is formed between the finger 99 and the conductive layer 71. The distance between the finger 99 and the conductive layer 71 As the capacitance C2 approaches the potential of the conductive layer 71, the capacitance C2 increases. On the other hand, in one embodiment of the present invention, the potential of the conductive layer 21 may change. Since a constant potential is applied to the layer 71, even if the magnitude of the capacitance C2 changes, the potential of the conductive layer 21 does not change. The position does not change.

[0056] The display panel 10 also has an electrode 45 to which a constant potential is supplied. Even when a human body or a housing is located on the side of 57, the capacitance between the human body or the housing and the electrode 45 is The change in amount does not affect the potential of the conductive layer 21 .

[0057] As described above, in the display panel of one embodiment of the present invention, the upper layer and the lower layer of the transistor are A conductive layer to which a constant potential is applied is disposed on both of the lower layers. The potential of the conductive layer included in the layer including the transistor can be prevented from changing due to noise. It is possible to reduce display defects on the display panel.

[0058] A display panel to which one aspect of the present invention is applied is less susceptible to noise even when its thickness is reduced. The thickness of the display panel 10 can be, for example, 30 μm or more and 300 μm or less. Preferably, the thickness is 50 μm or more and 200 μm or less, more preferably 50 μm or more and 150 μm or less, It is more preferable that the thickness is 0 μm or more and 100 μm or less. In addition, the thickness of the display panel 10 is preferably 50 μm or more. In order to increase the flexibility of the display panel 10, the thickness of the display panel 10 is set to 200 μm or less, and further set to 100 μm or less. For example, if the thickness is 100 μm or less, the radius of curvature is 1 mm. The bending motion at the screen or the display surface alternately goes from flat to bent (for example, This makes it possible to realize a display panel that can be bent and stretched with a curvature radius of 5 mm (more than 100,000 times).

[0059] FIG. 2A is a cross-sectional view of a display device having a display panel 10 and a conductive layer 73. The module 10 has the same configuration as that of the configuration example 1 (FIG. 1(A)), and therefore a detailed description thereof will be omitted.

[0060] The conductive layer 71 has a portion that contacts the conductive layer 73. The conductive layer 73 is a wiring that supplies a constant potential. 19. A constant potential is supplied to the conductive layer 71 via the conductive layer 73. The conductive layer 71 does not have to be fixed to the conductive layer 73. When in contact with conductive layer 73, conductive layer 71 is supplied with a constant potential.

[0061] A capacitance C1 is generated between the conductive layer 21 and the conductive layer 71. As shown in FIGS. Even if the display panel 10 is bent, the relative position of the conductive layer 21 with respect to the conductive layer 71 does not change. stomach.

[0062] In FIG. 2B, a part of the display panel 10 is in contact with the conductive layer 71, and the other part is in contact with the conductive layer 72. 2(C) shows the display panel 10 in FIG. 2(B) in contact with the conductive layer 71. 2(D) shows the area 22A where the display panel 10 in FIG. 2(B) is In the region 22A and the region 22B, the conductive layer 21 The distance between the conductive layer 21 and the conductive layer 71 is equal, and the magnitude of the capacitance C1 generated between the conductive layer 21 and the conductive layer 71 is also equal.

[0063] Furthermore, a capacitance C2 is formed between the finger 99 and the conductive layer 73. The distance between the finger 99 and the conductive layer 73 As the capacitance C2 changes, the conductive layer 73 and the conductive The potential of the conductive layer 71 may change, and the potential of the conductive layer 21 may also change. In this embodiment, a constant potential is applied to the conductive layer 73 and the conductive layer 71, so that the size of the capacitance C2 Even if the potential of the conductive layer 21 changes, the potential of the conductive layer 21 does not change.

[0064] In this way, the conductive layer 73 to which a constant potential is applied and the conductive layer 10 located on the surface of the display panel 10 By contacting the conductive layer 71 at at least one point, a constant potential can be applied to the conductive layer 71. Cut.

[0065] 5A and 5B are a top view and a bottom view of the display panel 10 shown in FIG. 1A etc. .

[0066] FIG. 5A is a diagram of the front surface (display surface) of the display panel 10 (also referred to as a top view of the display panel 10). 5B is a diagram of the rear surface (the surface opposite to the display surface) of the display panel 10 ( 10. It can also be said to be a bottom view of the display panel 10.

[0067] The display panel 10 has a display area 81 and a scanning line driving circuit 82. The display area 81 includes a plurality of The image display device has a number of pixels, a number of signal lines, and a number of scanning lines, and has the function of displaying an image. The line driving circuit 82 has a function of outputting a scanning signal to the scanning lines of the display area 81 .

[0068] In this embodiment, an example in which the display panel 10 has a scanning line driving circuit is shown. The display panel 10 includes one of a scanning line driving circuit and a signal line driving circuit. Alternatively, the display panel 10 may have both, or may not have both. When the display panel 10 has a function as a touch sensor, the display panel 10 has a sensor driving circuit. That's fine.

[0069] In the display panel 10, the IC 84 is mounted on the flexible substrate 51 by a mounting method such as the COF method. The IC 84 is equipped with, for example, a signal line driving circuit, a scanning line driving circuit, and a sensor driving circuit. The side of IC84 is covered with resin such as epoxy resin. This increases the mechanical strength of the connection between the display panel 10 and the IC 84. This makes it more difficult for cracks to occur even when the display panel 10 is bent, and improves the reliability of the display panel 10. As the resin, for example, a resin used as various adhesives can be used. You can be there.

[0070] Further, the display panel 10 is electrically connected to an FPC 83. Signals are supplied to the IC 84 and the scanning line driving circuit from the outside. This allows signals to be output from IC84 to the outside.

[0071] An IC may be mounted on the FPC 83. For example, the FPC 83 may include a signal line drive circuit. An IC having one or more of a scanning line driver circuit, a scanning line driver circuit, and a sensor driver circuit is mounted. For example, a COF method or a TAB (Tape Automated Board) method may be used. ICs can be mounted on FPC83 using mounting methods such as the riveting method.

[0072] The conductive layer 71 is provided on the rear surface of the display panel 10. The conductive layer 71 is provided in the display area 81. The area where the conductive layer 71 and the display area 81 overlap each other is 80% of the area of ​​the display area 81. It is preferable that the ratio is 90% or more and 100% or less, and more preferable that the ratio is 90% or more and 100% or less. The area of ​​the conductive layer 71 is preferably 95% or more and 100% or less. It is preferable that the area of ​​the conductive layer 71 is larger than the area of ​​the display region 81. The smaller the area without noise, the less susceptible the display panel 10 is to noise, which is preferable.

[0073] As shown in FIG. 5C, the conductive layer 71 may overlap with the scanning line driving circuit 82.

[0074] 5A to 5C show an example in which a conductor 74 is connected to the conductive layer 71. The conductor 74 is a wiring (also referred to as a GND line) to which a GND potential is supplied. The conductor 74 electrically connects the conductive layer 71 to the conductive tape, conductive wire, etc. For example, the GND line of a power supply such as a battery or a power supply circuit and the conductive layer 71 are connected. The electrical connection may be made via the body 74.

[0075] As shown in FIGS. 5(A) to 5(C), when the light emitting element 31 emits light toward the flexible substrate 57, The conductive layer 71 is located on the rear surface of the display panel (the surface opposite to the display surface). If a conductive tape or a lead wire is directly connected, the conductive tape or the lead wire will not be attached to the display panel 10. The thinner the display panel 10, the more likely it is that these steps will occur. The smoother the display area is, the less large steps there are. Therefore, the connection between the conductive layer 71 and the conductor 74 is It is preferable that they do not overlap.

[0076] Fig. 6(A) is a top view of the display device shown in Fig. 2(A) etc. Fig. 6(A) is a top view of the display device shown in Fig. 2(A) etc. 6(B) is a diagram of the front surface (display surface) of the device shown in FIG. 6(A). The display panel 10 has the same configuration as that shown in FIGS. Detailed explanations will be omitted.

[0077] In FIG. 6B, the display panel 10 is shown as a composite of the layers between the flexible substrate 51 and the flexible substrate 57. Specifically, the element layer 72 is a transistor layer shown in FIG. The light-emitting element 31 includes a layer 20 containing a photoresist, an insulating layer 53, an adhesive layer 55, and the like.

[0078] 6A and 6B show an example in which a conductor 74 is connected to a conductive layer 73. The conductor 74 is , is an example of a conductor that electrically connects the GND line and the conductive layer 73. D potential is supplied.

[0079] As shown in FIGS. 6A and 6B, the connection between the conductive layer 73 and the conductor 74 is The step along the shape of the connection portion is located at a position away from the display area 81. Therefore, it is possible to prevent a step from occurring in the display area 81.

[0080] As described above, the conductive layer 71 of the display panel 10 and the wiring that supplies a constant potential are electrically connected. It is preferable that the connection portion of the conductors that are electrically connected does not overlap the display area 81. It is more preferable that the display area 81 does not overlap with the pixel value 0. This prevents a step from occurring in the display area 81. This can improve the display quality of the display area 81.

[0081] The area where the conductive layer 73 and the display panel 10 overlap each other is 80% of the area of ​​the display panel 10. % or more and 100% or less. The thinner the display panel 10, the greater the area of ​​the rear surface of the display device. A step that follows the shape of another component arranged next to the conductive layer 73 is likely to occur in the display area 81. By overlapping the entire display area 81, the step occurring in the display area 81 can be reduced.

[0082] FIG. 6(C) is a top view of a display device different from the above-mentioned configurations. 6(D) is a diagram of the front surface (display surface) of the device, and FIG. 6(D) is a diagram of the dashed line CD in FIG. 6(C). The display panel 10 has the same structure as that shown in FIGS. 5(A) and 5(B), and therefore the details are not shown. A detailed explanation will be omitted.

[0083] In FIGS. 6A and 6B, the conductive layer 73 overlaps (and even contacts) the entire surface of the conductive layer 71. 6C and 6D, a constant potential is applied to a part of the conductive layer 71. The conductive layers may be in contact with each other.

[0084] The display device shown in FIGS. 6C and 6D includes a display panel 10, a conductive layer 73a, and a conductive layer 73b. The conductive layer 73a has a portion in contact with the conductive layer 71. The conductive layer 73b has a conductive The conductive layer 71 has a portion in contact with the conductive layer 71 .

[0085] In this way, by providing a plurality of conductive layers in contact with the conductive layer 71, a highly flexible display device can be provided. The curved portion, such as the connection portion between the FPC 83 and the display panel 10, can be provided. By providing the conductive layer 73a so as to overlap the particularly weak region, the flexibility of the region weak to bending is reduced. When the display panel 10 is deformed, the flexible portion on which the conductive layers 73a and 73b are not provided is deformed. It is easier to bend in high areas, preventing areas that are weak to bending from being bent at large curvatures. This makes it possible to improve the reliability of the display device.

[0086] The conductive layer 73a is connected to a conductor 74a. The conductor 74a is connected to the GND line and the conductive layer Similarly, the conductive layer 73b has a conductor 74b. is connected.

[0087] As shown in FIGS. 6(C) and 6(D), the connection between the conductive layer 73a and the conductor 74a and the conductive layer 73b The connection portions of the conductors 74b and 74c are located in areas that do not overlap with the display panel 10. The step along the shape of the connecting portion occurs at a position away from the display area 81. This can reduce the occurrence of steps in 81.

[0088] If the conductive layer 73 and the display panel 10 are completely fixed, the display device may be deformed. In this case, compressive stress or tensile stress is applied to the display panel 10, which may cause damage to the display panel 10. be.

[0089] Therefore, in one embodiment of the present invention, the conductive layer 71 of the display panel 10 is fixed to the conductive layer 73. This allows the display panel to bend or unfold without any gaps. The relative position of at least a portion of the panel 10 changes with respect to the conductive layer 73. Since a vertical surface can be formed in the display panel 10, a force is applied to the display panel 10, and the display panel 1 The conductive layer 71 can be prevented from being damaged by the portion fixed to the conductive layer 73. The conductive layer 73 may have a thickness of 100 μm or may not be fixed to the conductive layer 73 at all. Even if the conductive layer 73 is thick, it can form a neutral plane in the display panel 10. The allowable thickness range is expanded.

[0090] The neutral plane is the plane of stress due to compressive stress or tensile stress that occurs in response to deformation such as bending. It is a surface that does not generate distortion and does not expand or contract.

[0091] 7A shows the developed display device. The display device includes a conductive layer 73, a display panel 10, and Here, the side to which the FPC 83 is connected is the display surface of the display device. FIG. 7B shows a state in which the display panel 10 is bent inward (hereinafter referred to as inward bending). In the area surrounded by the dotted line in FIG. 7(A), the conductive layer 73 and the display panel 10 In contrast, in the area surrounded by the dotted line in FIG. 7(B), the conductive layer 73 and the display panel This is because the edge of the display panel 10 is bent outward. The same applies to FIG. 7(C) showing a display device (hereinafter referred to as outward bending).

[0092] The display device may be bent at one or more positions. It is a tri-folded display device with one part and one part.

[0093] The conductive layers 71 and 73 are made of aluminum, titanium, chromium, nickel, Copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Any metal or alloy containing this metal as the main component can be used as a single layer structure or a laminated structure. The conductive layer 71 and the conductive layer 73 are formed of indium oxide and indium stannate, respectively. Indium tin oxide (ITO), indium oxide containing tungsten oxides, indium zinc oxides containing tungsten, indium oxides containing titanium, titanium Indium tin oxide containing gallium, indium zinc oxide, zinc oxide, zinc oxide containing gallium A light-transmitting conductive material such as lead or silicon-containing indium tin oxide may be used. In addition, polycrystalline silicon or oxide that has been made low-resistance by including impurity elements, etc. Alternatively, a semiconductor such as a nickel silicide or a nickel silicide may be used. A film containing graphene may also be used. The film containing graphene may be formed into a film shape, for example. The film containing graphene oxide can be formed by reducing the impurity element. Alternatively, a semiconductor such as an oxide semiconductor may be used. Conductive paste such as silver, carbon, or copper, or conductive paste such as polythiophene, The conductive paste may be used as the conductive layer because it is inexpensive. Rimers are preferred because they are easy to apply.

[0094] When the conductive layer 71 and the conductive layer 73 are located on the display surface side of the display panel 10, the conductive layer 7 The display surface and the conductive layer 73 are conductive layers that transmit visible light. When the conductive layer 71 and the conductive layer 73 are located on the opposite side, the conductive layer 71 and the conductive layer 73 The transparency of the material is not important.

[0095] When the conductive layer 71 is formed directly on the surface of the display panel 10, the thickness of the conductive layer 71 is 1 nm. The thickness is preferably 1 nm or more and 1000 nm or less, more preferably 1 nm or more and 100 nm or less, and even more preferably 1 nm or more and 50 nm or less. The thickness of the conductive layer 71 is preferably 1 nm or more and more preferably 25 nm or less. The thinner the conductive layer 71, the smaller the internal stress of the conductive layer 71, and the less likely the display panel 10 is to warp. preferable.

[0096] The conductive layer 73 may be made of a metal foil, a metal plate, or the like. When overlapping with the bending portion of the panel 10, the thickness and hardness of the conductive layer 73 are set to be sufficient to provide flexibility. The degree.

[0097] Alternatively, a film or sheet having a laminated structure of an insulating layer and a layer containing a conductive material may be used. The layer containing the insulating material functions as the conductive layer 71 or the conductive layer 73. The film or sheet having a laminated structure of layers is a resin film or a resin sheet having a conductive material thereon. Examples of the conductive film and conductive sheet include a layer containing a poly Ethylene terephthalate (PET) film or polyethylene naphthalate (PEN) film Films with copper, ITO, graphene or carbon nanotubes deposited on them, or Also, a sheet formed by solidifying graphite may be used. Graphite and graphene can each be formed into a thin film and are electrically conductive. is high, so it is preferred.

[0098] The thickness of the conductive film or conductive sheet is preferably 20 μm or more and 200 μm or less. Preferably, the thickness is 20 μm or more and 150 μm or less, more preferably 20 μm or more and 100 μm or less. In addition, when flexibility of the conductive sheet is not an issue, a thickness of more than 200 μm is preferable. Good too.

[0099] When pressure is applied locally to the display panel 10 by contact with a fingernail, a stylus, or the like, The display panel 10 may be scratched or even broken. The harder the material, the more the deformation of the display panel 10 is suppressed, and the less pinholes are generated in the display panel 10. This is preferable because it can prevent damage to the display panel 10. For example, A layer containing a conductive material (corresponding to the conductive layer 73) is formed on a resin layer having a viscosity of 60 or more and M120 or less. It is preferable to use a film with a Rockwell hardness of M60 or more and M120 or less. One example of the resin layer is a PET film.

[0100] The housing of the display device may also function as the conductive layer 73 .

[0101] The flexible substrate 51 and the flexible substrate 57 are each made of glass having a thickness sufficient to provide flexibility. Materials such as glass, quartz, resin, metal, alloy, and semiconductor can be used. The substrate on the light extraction side is made of a material that transmits the light. For example, the thickness of the flexible substrate is , preferably 1 μm or more and 200 μm or less, more preferably 1 μm or more and 100 μm or less, More preferably, the thickness is 0 μm or more and 50 μm or less, and even more preferably, 10 μm or more and 25 μm or less. The thickness and hardness of the flexible substrate are set within a range that satisfies both mechanical strength and flexibility. The substrate may have a single layer structure or a multilayer structure.

[0102] Since resin has a smaller specific gravity than glass, using resin as a flexible substrate is much easier than using glass. This is preferable because it allows the display panel to be lighter than when the display panel is mounted.

[0103] It is preferable to use a highly tough material for the substrate. This makes it superior in impact resistance and breakage resistance. For example, a display panel made of a resin substrate, a thin metal substrate, or By using an alloy substrate, it is lighter and less likely to break than when using a glass substrate. This makes it possible to realize a high-quality display panel.

[0104] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it ideal for display panels. It is preferable to use a metal material or an alloy material because it can suppress a local temperature rise in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to have one.

[0105] The material for forming the metal substrate or alloy substrate is not particularly limited, but for example, aluminum Preferably, the material is a metal alloy such as aluminum, copper, nickel, or an aluminum alloy or stainless steel. The semiconductor substrate can be suitably used. Examples of materials that form the semiconductor substrate include silicon. .

[0106] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the display panel can be prevented from rising. Therefore, damage to the display panel and a decrease in reliability can be suppressed. The thickness of a layer with high thermal emissivity (for example, a metal oxide or ceramic material can be used) It may also have a layered structure.

[0107] Examples of flexible and light-transmitting materials include polyester resins such as PET and PEN. , polyacrylonitrile resin, acrylic resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polya Mido resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, poly Styrene resin, polyamide-imide resin, polyurethane resin, polyvinyl chloride resin, polychloride Polyvinylidene fluoride resin, polypropylene resin, polytetrafluoroethylene (PTFE), A BS resin, etc. In particular, it is preferable to use a material with a low linear expansion coefficient, for example Polyamide-imide resin, polyimide resin, polyamide resin, PET, etc. are preferably used. In addition, a substrate in which a fiber body is impregnated with resin (also called a prepreg) and an inorganic fiber It is also possible to use a substrate in which a filler is mixed into the resin to reduce the linear expansion coefficient.

[0108] As for the flexible substrate, a layer using the above material is used as a hard cover to protect the surface of the device from scratches. a layer of a material that can disperse pressure (e.g., aramid) The insulating layer may be laminated with at least one of a resin layer, etc.

[0109] When the flexible substrate has a glass layer, the barrier properties against water and oxygen are improved. This makes it possible to provide a highly reliable display panel.

[0110] For example, a flexible substrate is used in which a glass layer, an adhesive layer, and a resin layer are laminated from the side closer to the light emitting element. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness of the glass layer is 25 μm or more and 100 μm or less. A glass layer with such a thickness is resistant to water and oxygen. It is possible to simultaneously achieve high barrier properties and flexibility. The thickness of the resin layer is set to 200 μm or less, preferably 20 μm or more and 50 μm or less. By doing so, it is possible to suppress breakage and cracks in the glass layer and improve the mechanical strength. By applying such a composite material of glass and resin to the substrate, extremely reliable This makes it possible to provide a highly reliable and flexible display panel.

[0111] The adhesive layer can be made of a variety of adhesives, including UV-curable and other light-curable adhesives, reactive-curable adhesives, heat-curable adhesives, and adhesives containing Various curing adhesives such as vapor-curing adhesives can be used. Good too.

[0112] The adhesive layer may also contain a desiccant. For example, an alkaline earth metal oxide (oxide Use substances that adsorb moisture by chemical adsorption, such as calcium oxide and barium oxide. Alternatively, moisture can be absorbed by physical adsorption, such as with zeolite or silica gel. If a desiccant is included, impurities such as moisture can be absorbed into the functional element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the display panel.

[0113] Furthermore, by including a filler or a light scattering material with a high refractive index in the adhesive layer, the light emitted from the light emitting element can be It is possible to improve the light extraction efficiency. For example, titanium oxide, barium oxide, zeolite For example, tungsten, zirconium, etc. can be used.

[0114] The light emitting element can be a self-luminous element, and the brightness can be controlled by a current or a voltage. This category includes devices that are controlled by light emitting diodes (LEDs), organic An EL element, an inorganic EL element, or the like can be used in the display device of one embodiment of the present invention. Various display elements can be used. For example, liquid crystal elements, electrophoretic elements, MEMS (microelectromechanical systems), Display elements using microelectromechanical systems may also be used.

[0115] The light emitting elements are top emission type, bottom emission type, and dual emission type. For the electrode on the light extraction side, a conductive film that transmits visible light is used. It is also preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. .

[0116] The conductive film that transmits visible light is, for example, indium oxide, ITO, indium zinc oxide, It can be formed using zinc oxide (ZnO), zinc oxide containing gallium, etc. , gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, Metallic materials such as ballast, copper, palladium, or titanium, alloys containing these metallic materials, or Nitrides of these metal materials (for example, titanium nitride) can also be formed thin enough to have translucency. Furthermore, a laminated film of the above materials can be used as a conductive film. For example, by using a laminated film of an alloy of silver and magnesium and ITO, the conductivity can be increased. Graphene or the like may also be used.

[0117] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, or tungsten. Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, or palladium, or Alloys containing these metal materials can be used. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloy, aluminum-nickel alloy, aluminum-neodymium alloy, aluminum Aluminum-containing alloys, such as aluminum, nickel, and lanthanum alloys (Al-Ni-La) (aluminum alloy), silver-copper alloy, silver-palladium-copper alloy (Ag-Pd-Cu, A silver-copper alloy, such as an alloy of silver and magnesium, may also be used. The alloy containing aluminum is preferable because it has high heat resistance. By laminating a metal oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. The conductive film that transmits visible light may be laminated with a film made of a metal material. For example, a film made of silver and I A laminated film of TO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used.

[0118] The electrodes can be formed by vapor deposition or sputtering. or by using a discharge method such as an ink jet method, a printing method such as a screen printing method, or a plating method. It can be formed by

[0119] The EL layer 43 has at least a light-emitting layer. The EL layer 43 may have a plurality of light-emitting layers. The EL layer 43 is made of a material having a high hole injection property and a material having a high hole transport property as a layer other than the light-emitting layer. materials, hole blocking materials, materials with high electron transport properties, materials with high electron injection properties, or bipolar The insulating layer may further include a layer containing a substance having high electron transporting and hole transporting properties. .

[0120] The EL layer 43 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 43 may each be formed by a vapor deposition method (vacuum vapor deposition method). The layer can be formed by a method such as a transfer method, a printing method, an ink jet method, or a coating method.

[0121] The light emitting element 31 may contain two or more kinds of luminescent materials. For example, it is possible to realize a light-emitting element in which the light emissions of two or more kinds of luminescent materials are complementary. White light can be obtained by selecting luminescent materials that have the same color relationship. For example, luminescent materials that emit light such as R (red), G (green), B (blue), Y (yellow), or O (orange) or a luminescent material that emits light containing spectral components of two or more of the colors R, G, and B. For example, a light-emitting material that emits blue light and a light-emitting material that emits yellow light can be used. In this case, the emission spectrum of the luminescent material that emits yellow light is composed of green and red spectral components. The light emitting element 31 preferably has an emission spectrum of wavelengths in the visible region (e.g., For example, within the range of 350 nm to 750 nm, or 400 nm to 800 nm. It is preferable that the spectrum has two or more peaks.

[0122] The light-emitting element 31 may be a single element having one EL layer, or may be a single element having one charge generating layer. The device may be a tandem device having a plurality of EL layers stacked with an intervening layer.

[0123] In one embodiment of the present invention, a light-emitting element using an inorganic compound such as quantum dots may be used. The quantum dot materials include colloidal quantum dot materials, alloy quantum dot materials, and Examples of quantum dot materials include core-shell type quantum dot materials. Cd, selenium (Se), zinc (Zn), sulfur (S), phosphorus (P), indium (In), tellurium (Te), lead (Pb), gallium (Ga), arsenic (As), aluminum It may also contain elements such as aluminum (Al).

[0124] The structure of the transistor included in the display panel is not particularly limited. It may be a staggered transistor, or an inverse staggered transistor. The transistor may be either a top gate type or a bottom gate type. Alternatively, gate electrodes may be provided above and below the channel.

[0125] The crystallinity of the semiconductor material used in the transistor is not particularly limited. Semiconductors with crystallinity (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with partially crystalline regions) When a semiconductor having crystallinity is used, the transistor This is preferable because it can suppress deterioration of the star characteristics.

[0126] The semiconductor material used for the transistor is not particularly limited, and may be, for example, a group 14 element, a compound semiconductor, or the like. A conductor or an oxide semiconductor can be used for the semiconductor layer. A conductor, a semiconductor containing gallium arsenide, or an oxide semiconductor containing indium can be used. .

[0127] In particular, it is preferable to use an oxide semiconductor as a semiconductor in which a channel of a transistor is formed. It is particularly preferable to use an oxide semiconductor having a larger band gap than silicon. It is desirable to use a semiconductor material with a wider band gap and lower carrier density than silicon. This is preferable because it can reduce the current in the off state of the transistor.

[0128] For example, the oxide semiconductor may contain at least indium (In) or zinc (Zn). More preferably, the oxide contains In-M-Zn (wherein M is Al, Ti, Ga). , Ge, Y, Zr, Sn, La, Ce, Hf or Nd) nothing.

[0129] As a semiconductor material used for transistors, CAAC-OS (C Axis Alignment d Crystalline Oxide Semiconductor) Unlike amorphous materials, CAAC-OS has few defect levels and is therefore suitable for transistor reliability. CAAC-OS has the advantage that no grain boundaries are visible. Therefore, it is possible to form a stable and uniform film over a large area, and the surface is flexible. The CAAC-OS film is less likely to crack due to stress caused when the display device is bent.

[0130] CAAC-OS is a crystalline oxide semiconductor whose c-axis is aligned approximately perpendicular to the film surface. Another example of the crystalline structure of oxide semiconductors is nanoscale microcrystalline aggregates. There are various structures that differ from single crystals, such as nanocrystals (nc). It has been confirmed that CAAC-OS has lower crystallinity than single crystals and has a higher crystallinity than nc. High crystallinity.

[0131] In addition, the CAAC-OS has a c-axis orientation and multiple pellets in the ab-plane direction. The CAAC-OS is a composite of nanocrystals (nanocrystals) that are interconnected and have a distorted crystal structure. , CAA crystal(c-axis-aligned ab-plane-an It can also be called an oxide semiconductor having a chord crystal.

[0132] An insulating layer included in the display panel can be made of an organic insulating material or an inorganic insulating material. Examples of resins include acrylic resin, epoxy resin, polyimide resin, and polyamide resin. , polyimide amide resin, siloxane resin, benzocyclobutene resin, phenolic resin Examples of inorganic insulating films include silicon oxide films, silicon oxynitride films, and silicon nitride oxide films. Silicon film, silicon nitride film, aluminum oxide film, hafnium oxide film, yttrium oxide film film, zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, Examples of the thin film include a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film.

[0133] The conductive layers of the display panel can be used for the conductive layer 71 and the conductive layer 73 described above. Various materials that can be used can be used.

[0134] As described above, the display device of this embodiment can display an external image even if the thickness of the display panel is made very thin. The present invention suppresses a change in the potential of a conductive layer included in a layer including a transistor due to noise from the This makes it possible to reduce display defects on the display panel. The display panel is flexible and will not be damaged by bending. This makes it possible to achieve a configuration that is difficult to achieve.

[0135] This embodiment mode can be combined with other embodiment modes as appropriate.

[0136] (Embodiment 2) In this embodiment, a structure and a manufacturing method of a display panel according to one embodiment of the present invention will be described with reference to FIGS. In this embodiment, a display panel using an EL element as a display element is described. This will be explained using the following example.

[0137] In this embodiment, the display panel displays, for example, three colors of R (red), G (green), and B (blue). A structure in which one color is expressed by a sub-pixel, and one color is expressed by four sub-pixels of R, G, B, and W (white). A configuration in which one color is expressed by four sub-pixels of R, G, B, and Y (yellow) is suitable. There are no particular limitations on the color elements, and colors other than RGBWY may be used. For example, , cyan, magenta, etc. may also be used.

[0138] <Configuration example 1> FIG. 8 shows a top-emission display panel 370 using a color filter system. A cross-sectional view is shown.

[0139] The display panel 370 includes a conductive layer 390, a flexible substrate 371, an adhesive layer 377, an insulating layer 378, A plurality of transistors, a capacitor 305, a conductive layer 307, an insulating layer 312, an insulating layer 313, an insulating layer 314, an insulating layer 315, an insulating layer 316, an insulating layer 317, an insulating layer 318, an insulating layer 319, an insulating layer 320, an insulating layer 321, an insulating layer 322, an insulating layer 323, an insulating layer 324, an insulating Edge layer 314, insulating layer 315, light emitting element 304, conductive layer 355, spacer 316, adhesive layer 3 17, a coloring layer 325, a light-shielding layer 326, a flexible substrate 372, an adhesive layer 375, and an insulating layer 37 It has 6.

[0140] The conductive layer 390 is provided at least in the display section 381. The conductive layer 390 is provided in the drive circuit section 3 The conductive layer 390 may be provided on the opposite side of the display surface of the display panel 370. Since the film is located on the side surface, the transparency to visible light is not an issue.

[0141] The driver circuit portion 382 includes a transistor 301. The display portion 381 includes a transistor 302. and a transistor 303.

[0142] Each transistor has a gate, a gate insulating layer 311, a semiconductor layer, a source, and a drain. The gate and the semiconductor layer overlap with each other via a gate insulating layer 311. A part of the capacitor 305 functions as a dielectric. The conductive layer functioning as the drain also serves as one electrode of the capacitor 305 .

[0143] 8 shows a bottom-gate transistor. The transistor structures may be different. Each of them may have multiple types of transistors.

[0144] The capacitor 305 has a pair of electrodes and a dielectric between them. The conductive layer is made of the same material and formed in the same process as the gate of the transistor. The source and drain have a conductive layer formed of the same material and in the same process.

[0145] The insulating layer 312, the insulating layer 313, and the insulating layer 314 each cover the transistors and the like. The number of insulating layers covering the transistors and the like is not particularly limited. The insulating layer 312, the insulating layer 313, and the insulating layer 314 each have a function as a smoothing layer. At least one layer is preferably made of a material that is difficult for impurities such as water or hydrogen to diffuse into. This makes it possible to effectively prevent external impurities from diffusing into the transistor. This can improve the reliability of the display panel.

[0146] When an organic material is used for the insulating layer 314, the insulating layer 314 exposed at the edge of the display panel is There is a risk that impurities such as moisture may enter the light emitting elements 304 and the like from the outside of the display panel through the insulating film. If the light emitting element 304 deteriorates due to the intrusion of impurities, it will lead to deterioration of the display panel. Therefore, as shown in FIG. 8, an opening is formed in the insulating layer 314 that reaches the inorganic film (the insulating layer 313 in this example). Even if impurities such as moisture enter from the outside of the display panel, they will not reach the light emitting element 304. A pile structure is preferable.

[0147] FIG. 12A shows a cross-sectional view of the insulating layer 314 when the opening is not provided. When the insulating layer 314 is provided over the entire surface of the display panel as in the configuration of 2(A), This is preferable because it can increase the yield in the peeling step described below.

[0148] FIG. 12B shows a cross-sectional view in which the insulating layer 314 is not located at the edge of the display panel. In the configuration of FIG. 12(B), the insulating layer using an organic material is not positioned at the edge of the display panel. Therefore, it is possible to prevent impurities from entering the light emitting element 304 .

[0149] The light-emitting element 304 includes an electrode 321, an EL layer 322, and an electrode 323. The light emitting element 304 may have an optical adjustment layer 324. The light emitting element 304 emits light toward the colored layer 325. It is a top emission structure.

[0150] By arranging the transistor, the capacitor, the wiring, etc. so as to overlap with the light emitting region of the light emitting element 304, As a result, the aperture ratio of the display section 381 can be increased.

[0151] One of the electrodes 321 and 323 functions as an anode, and the other functions as a cathode. A voltage higher than the threshold voltage of the light emitting element 304 is applied between the electrode 321 and the electrode 323. As a result, holes are injected into the EL layer 322 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 322, and the luminescent material contained in the EL layer 322 It glows.

[0152] The electrode 321 is electrically connected to the source or drain of the transistor 303. The electrodes 321 may be connected directly or through another conductive layer. The electrodes 321 function as element electrodes and are provided for each light emitting element 304. are electrically isolated by an insulating layer 315.

[0153] The EL layer 322 is a layer containing a light-emitting substance.

[0154] The electrode 323 functions as a common electrode and is provided across the plurality of light-emitting elements 304. A constant potential is applied to the electrode 323 .

[0155] The light emitting element 304 overlaps the colored layer 325 via the adhesive layer 317. The spacer 316 8, the light emitting element 304 and the light blocking layer 326 overlap with each other through the adhesive layer 317. Although the figure shows a case where there is a gap between the spacers, they may be in contact with each other. Although the configuration in which the light-shielding film 316 is provided on the flexible substrate 371 side has been shown, it is also possible to provide the light-shielding film 316 on the flexible substrate 372 side (for example, Alternatively, the layer 326 may be provided on the flexible substrate 371 side.

[0156] A combination of a color filter (colored layer 325) and a microcavity structure (optical adjustment layer 324) By combining these, light with high color purity can be extracted from the display panel. The thickness of the layer 324 varies depending on the color of each pixel.

[0157] The colored layer is a colored layer that transmits light in a specific wavelength band, for example, red, green, blue, or A color filter that transmits light in the yellow wavelength range can be used. The materials that can be used include metal materials, resin materials, and resin materials containing pigments or dyes. Examples include:

[0158] Note that one embodiment of the present invention is not limited to the color filter method, but may be a color-coded method, a color conversion method, Alternatively, a quantum dot method or the like may be applied.

[0159] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer, and the colored layer is formed on the edge of the light-shielding layer, thereby suppressing color mixing between adjacent light-emitting elements. By providing the light-shielding layer so that it overlaps with the light-shielding layer, it is possible to suppress light leakage. A material that blocks light emitted from the optical element can be used, for example, a metal material, a pigment, or Alternatively, the black matrix can be formed using a resin material containing a dye. If the optical layer is provided in an area other than the pixel area, such as a driving circuit, unintended light leakage due to guided light etc. This is preferable because it can suppress this.

[0160] An overcoat may be provided to cover the colored layer and the light-shielding layer. The overcoat can prevent impurities and the like from diffusing into the light emitting element. It is made of a material that transmits light emitted from the molecule, such as a silicon nitride film or a silicon oxide film. An inorganic insulating film or an organic insulating film such as an acrylic film or a polyimide film can be used. A laminated structure of an insulating film and an inorganic insulating film may also be used.

[0161] In addition, when the material for the adhesive layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the adhesive layer. As the substrate, an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to be transparent is used. It is preferred to use a membrane.

[0162] By using a material for the overcoat that has high wettability with respect to the adhesive layer material, adhesion is improved. This allows the layer material to be applied uniformly, eliminating the need for air bubbles when bonding a pair of substrates together. This can prevent bubbles from being mixed in, and can prevent display defects.

[0163] The insulating layer 378 and the flexible substrate 371 are bonded together by an adhesive layer 377. The edge layer 376 and the flexible substrate 372 are bonded together by an adhesive layer 375. It is preferable to use a highly moisture-proof film for the insulating layer 378. By disposing the light emitting element 304 and the transistors between the layers, these elements are protected from impurities such as water. This is preferable because it can prevent impurities from entering and improve the reliability of the display panel.

[0164] Highly moisture-proof insulating films include silicon nitride films and silicon nitride oxide films containing nitrogen and silicon. and films containing nitrogen and aluminum, such as aluminum nitride films. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0165] For example, the water vapor permeability of a highly moisture-proof insulating film is 1×10 -5 [g / (m 2 ·day)] Less than 1 × 10 -6 [g / (m 2 ·day)] or less, more preferably 1 × 10 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·da y)] or less.

[0166] The connection portion 306 includes a conductive layer 307 and a conductive layer 355. The conductive layer 307 is electrically connected to the source and drain of the transistor. The conductive layer 355 can be formed using the same material and in the same process. The external input terminal is electrically connected to the external input terminal, which transmits signals and potentials from the outside. 3 shows an example in which an FPC 373 is provided as an input terminal. and the conductive layer 355 are electrically connected.

[0167] The connector 319 may be made of various anisotropic conductive films (ACF). Conductive Film) and Anisotropic Conductive Paste (ACP) Pic Conductive Paste) can be used.

[0168] <Example of manufacturing method for configuration example 1> An example of a method for manufacturing the configuration example 1 will be described with reference to FIGS. 9 to 11. 3A and 3B are cross-sectional views illustrating a method for manufacturing a display unit 381 of the display unit 370.

[0169] First, as shown in FIG. 9(A), a release layer 403 is formed on a fabrication substrate 401. A layer to be peeled is formed on the release layer 403. Here, the layer to be peeled formed on the release layer 403 is 8, from the insulating layer 378 to the light emitting element 304.

[0170] The substrate 401 to be fabricated is a substrate having heat resistance that can withstand at least the processing temperature during the fabrication process. The substrate 401 may be, for example, a glass substrate, a quartz substrate, a sapphire substrate, a semiconductor substrate, or the like. It is possible to use a solid substrate, a ceramic substrate, a metal substrate, a resin substrate, a plastic substrate, etc. Cut.

[0171] In order to improve mass productivity, a large glass substrate may be used as the substrate 401. For example, 3rd generation (550mm x 650mm) or higher and 10th generation (2950mm) It is preferable to use a glass substrate of 3400 mm or less or a larger size. Desirable.

[0172] When a glass substrate is used as the formation substrate 401, a lower layer is formed between the formation substrate 401 and the peeling layer 403. As the base film, a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film Forming an insulating film such as a chrome film is preferable because it can prevent contamination from the glass substrate.

[0173] The release layer 403 may be made of tungsten, molybdenum, titanium, tantalum, niobium, nickel, or copper. Baltic, Zirconium, Zinc, Ruthenium, Rhodium, Palladium, Osmium, Iridium an element selected from aluminum and silicon, an alloy material containing the element, or a compound material containing the element The crystal structure of the silicon-containing layer may be amorphous, microcrystalline, or polycrystalline. Also, aluminum oxide, gallium oxide, zinc oxide, titanium dioxide, oxide Indium, indium tin oxide, indium zinc oxide, In-Ga-Zn oxide, etc. The peeling layer 403 may be formed of a metal oxide such as tungsten, titanium, or molybdenum. The use of a high melting point metal material is preferable because it increases the degree of freedom in the process of forming the peeled layer.

[0174] The peeling layer 403 can be formed by, for example, sputtering, plasma CVD, or coating (spin coating). The peeling layer 4 can be formed by a method such as a coating method, a droplet discharging method, a dispensing method, or the like, a printing method, or the like. The thickness of O3 is, for example, 1 nm or more and 200 nm or less, preferably 10 nm or more and 100 nm or less. Let's say.

[0175] When the release layer 403 has a single layer structure, it is made of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten oxide. a layer containing an oxide or oxynitride of molybdenum, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten A layer containing an oxide or oxynitride of a mixture of stainless steel and molybdenum may also be formed. The mixture of tungsten and molybdenum is, for example, an alloy of tungsten and molybdenum. is equivalent to

[0176] The peeling layer 403 may be a stack of a layer containing tungsten and a layer containing tungsten oxide. When forming a layer structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on the layer. By forming an insulating film, the interface between the tungsten layer and the insulating film contains tungsten oxide. It is also possible to utilize the fact that a layer containing tungsten is formed. Treatment, oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, ozone water, etc. Alternatively, a layer containing tungsten oxide may be formed by treating the surface with a solution containing tungsten. The treatment and heating process may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a gas atmosphere. By changing the state, it is possible to control the adhesion between the peeling layer 403 and the insulating film to be formed later. It is possible.

[0177] Note that if separation can be achieved at the interface between the formation substrate and the layer to be peeled, a peeling layer does not have to be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. An organic resin such as olefin, polyamide, polycarbonate, or acrylic is formed. By performing laser irradiation or heat treatment, the adhesion between the substrate and the organic resin is improved. Then, insulating films and transistors are formed on the organic resin. Laser irradiation is performed at a high energy density, or heat treatment is performed at a higher temperature than the previous heat treatment. By doing so, it is possible to separate the substrate and the organic resin at the interface. Separation may also be achieved by allowing a liquid to penetrate into the interface between the substrate and the organic resin.

[0178] The organic resin may be used as a substrate for constituting a device, or the organic resin may be removed, Another substrate may be attached to the exposed surface of the layer to be peeled using an adhesive.

[0179] Alternatively, a metal layer is provided between the substrate and the organic resin, and a current is passed through the metal layer. The metal layer may be heated to separate the organic resin at the interface between the metal layer and the organic resin.

[0180] The insulating layer 378 is a silicon nitride film, a silicon oxynitride film, a silicon oxide film, or a nitride oxide film. It is preferable to form the insulating film 11 by using a silicon film or the like in a single layer or a laminated layer.

[0181] The insulating layer 378 is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, it is possible to form a film at a temperature of 250°C or higher by plasma CVD. By forming the film at a temperature of 0°C or below, a dense and highly moisture-proof film can be obtained. The thickness of the insulating layer 378 is 10 nm or more and 3000 nm or less, and further 200 nm or more and 150 0 nm or less is preferable.

[0182] 9(B), a peeling layer 413 is formed on the formation substrate 411. A layer to be peeled is formed on the release layer 413. Here, the layer to be peeled formed on the release layer 413 is 8, the insulating layer 376, the light-shielding layer 326, and the colored layer 325.

[0183] The formation substrate 411, the release layer 413, and the insulating layer 376 are formed by the formation substrate 401, the release layer 413, and the insulating layer 376, respectively. Materials that can be used for the release layer 403 and the insulating layer 378 can be applied.

[0184] Next, as shown in FIG. 9(C), the fabrication substrate 401 and the fabrication substrate 411 are bonded together with the adhesive layer 317. Use it to attach it.

[0185] Next, as shown in FIG. 10(A), the manufacturing substrate 401 and the insulating layer 378 are separated. Either the fabrication substrate 401 or the fabrication substrate 411 may be separated first.

[0186] Before separating the substrate 401 from the insulating layer 378, the insulating layer 378 is cut with laser light or a sharp blade. It is preferable to form a starting point for peeling. Cracks are formed in a part of the insulating layer 378 (film cracks). For example, by irradiating the surface with laser light, the starting point of peeling can be formed. This can cause portions of the insulating layer 378 to melt, vaporize, or thermally break down.

[0187] Then, from the formed peeling starting point, physical force (peel-off process by human hand or jig, The insulating layer 378 is formed by a process such as separating the plate by rotating a roller that is in close contact with the plate. The peeling layer 401 is separated from the insulating layer 378 at the bottom of FIG. 10(A), the exposed insulating layer 3 78 and a flexible substrate 371 are bonded together using an adhesive layer 377 .

[0188] In addition, a film that can be suitably used as the flexible substrate 371 has peeling films on both sides. In many cases, a separate film (also called a release film) is provided. When the flexible substrate 371 and the insulating layer 378 are bonded together, one of the insulating layers provided on the flexible substrate 371 is It is preferable to peel off only one release film and leave the other release film in place. This makes it easier to transport and process in the subsequent steps. An example in which a release film 398 is provided on one surface of 371 is shown.

[0189] Next, as shown in FIG. 10(B), the manufacturing substrate 411 and the insulating layer 376 are separated. The upper part of (B) shows the release layer 413 separated from the insulating layer 376 and the fabrication substrate 411. Then, the exposed insulating layer 376 and the flexible substrate 372 are bonded together using an adhesive layer 375. In FIG. 10(B), a release film 399 is provided on one surface of the flexible substrate 372. Here is an example:

[0190] Next, as shown in FIG. 11(A), the release film 398 is peeled off to expose the flexible substrate 3. A conductive layer 390 is formed on the surface of 71 .

[0191] Thereafter, as shown in FIG. 11(B), the release film 399 is peeled off. It is preferable that the conductive layer 390 is peeled off after the conductive layer 390 is formed. If the conductive layer 390 is formed in this state, the display panel will bend due to the internal stress of the conductive layer 390. This can be suppressed.

[0192] As described above, in one embodiment of the present invention, all of the functional elements constituting the display panel are formed on a substrate. Therefore, even when manufacturing a high-definition display panel, the flexible substrate Therefore, high alignment accuracy is not required, and the flexible substrate can be easily attached. In addition, functional elements can be fabricated at high temperatures, which allows for the realization of highly reliable display panels. can.

[0193] <Configuration example 2> FIG. 13(A) shows a cross-sectional view of a display panel to which a color filter method is applied. In the following configuration examples, detailed description of the same configuration as the previous configuration example will be omitted.

[0194] The display panel shown in FIG. 13(A) includes a conductive layer 380, a flexible substrate 371, an adhesive layer 377, an insulating layer 378, and a conductive film 380a. an edge layer 378, a plurality of transistors, a conductive layer 307, an insulating layer 312, an insulating layer 313, an insulating layer 314, insulating layer 315, light-emitting element 304, conductive layer 355, adhesive layer 317, coloring layer 325, It has a flexible substrate 372 and an insulating layer 376 .

[0195] The conductive layer 380 is provided at least in the display section 381. The conductive layer 380 is provided in the drive circuit section 3 The conductive layer 380 may be provided on the display surface of the display panel. , and is formed using a material that transmits visible light.

[0196] The driver circuit portion 382 includes a transistor 301. The display portion 381 includes a transistor 303. It has.

[0197] Each transistor comprises two gates, a gate insulating layer 311, a semiconductor layer, a source, and a drain. The two gates overlap the semiconductor layer via a gate insulating layer 311. In Figure 13(A), a structure in which a semiconductor layer is sandwiched between two gates is applied to each transistor. This type of transistor is superior to other transistors in field-effect transfer. This increases the mobility and on-current, resulting in high-speed operation. Furthermore, the area occupied by the circuit can be reduced. By using transistors with large on-state current, it is possible to increase the size of display panels or improve the resolution. Even if the number of lines increases, the signal delay in each line can be reduced, and the brightness of the display can be kept constant. In FIG. 13A, the same material and process as those of the electrode 321 are used. An example of fabricating one of the gates will be shown below.

[0198] The light emitting element 304 has a bottom emission structure that emits light to the colored layer 325 side.

[0199] The light emitting element 304 overlaps with the coloring layer 325 via the insulating layer 314. It is disposed between the element 304 and the flexible substrate 371. In FIG. 13(A), the colored layer 325 is 13A shows an example in which the light-shielding layer and the spacer are not provided. Shows.

[0200] <Configuration example 3> FIG. 13B shows a cross-sectional view of a display panel to which the separate coloring method is applied.

[0201] The display panel shown in FIG. 13(B) includes a conductive layer 390, a flexible substrate 371, an adhesive layer 377, an insulating layer 378, and a conductive film 390a. an edge layer 378, a plurality of transistors, a conductive layer 307, an insulating layer 312, an insulating layer 313, an insulating layer 314, insulating layer 315, spacer 316, light emitting element 304, adhesive layer 317, flexible substrate 3 72 and an insulating layer 376.

[0202] FIG. 13B shows an example in which the conductive layer 390 is provided over the entire surface of the flexible substrate 371.

[0203] The driver circuit portion 382 includes a transistor 301. The display portion 381 includes a transistor 302. , a transistor 303, and a capacitor 305.

[0204] Each transistor comprises two gates, a gate insulating layer 311, a semiconductor layer, a source, and a drain. The two gates overlap the semiconductor layer via a gate insulating layer 311. In FIG. 13(B), a structure in which a semiconductor layer is sandwiched between two gates is applied to each transistor. In FIG. 13B, one of the gate electrodes is disposed between the insulating layer 313 and the insulating layer 314. An example of how to make a card is shown below.

[0205] The light emitting element 304 has a top emission structure that emits light toward the flexible substrate 372. FIG. 13B shows an example in which the light-emitting element 304 does not have an optical adjustment layer. The insulating layer 376 , which functions as a sealing layer for the light emitting element 304 .

[0206] The connection portion 306 has a conductive layer 307. The conductive layer 307 is connected to the FPC 3 via a connector 319. 73 and electrically connected.

[0207] <Application example> In one embodiment of the present invention, a display device equipped with a touch sensor (hereinafter also referred to as a touch panel) ) can be produced.

[0208] There is no limitation on the detection elements (also referred to as sensor elements) included in the touch panel of one embodiment of the present invention. Various sensors that can detect the proximity or contact of a sensing object such as a finger or stylus, It can be used as a sensing element.

[0209] For example, the sensor types include capacitance type, resistive film type, surface acoustic wave type, and infrared type. Various methods can be used, such as optical methods and pressure-sensitive methods.

[0210] In this embodiment, a touch panel having a capacitance type detection element will be described as an example. .

[0211] The capacitance type includes a surface capacitance type, a projected capacitance type, etc. The capacitance type includes the self-capacitance type and the mutual capacitance type. This is preferable because it enables simultaneous multipoint detection.

[0212] The touch panel according to one embodiment of the present invention is formed by bonding a display panel and a sensing element that are separately manufactured. The display element is supported by a substrate supporting the display element and / or an opposing substrate. Various configurations can be applied, such as a configuration in which a pole or the like is provided.

[0213] <Configuration Example 4> FIG. 14(A) is a perspective schematic diagram of the touch panel 300. FIG. 14(B) is a perspective schematic diagram of the touch panel 300. ) is an exploded perspective schematic diagram. For clarity, only representative components are shown. In FIG. 14B, some components (flexible substrate 330, flexible substrate 372, etc.) are indicated by dashed lines. Only the outline is shown.

[0214] The touch panel 300 includes an input device 310 and a display panel 370, which are overlapped. It is provided.

[0215] The input device 310 includes a flexible substrate 330, electrodes 331, electrodes 332, a plurality of wirings 341, and and a plurality of wirings 342. The FPC 350 has a plurality of wirings 341 and a plurality of wirings 342. The FPC350 is electrically connected to each of the IC351.

[0216] The display panel 370 includes a flexible substrate 371 and a flexible substrate 372 that face each other. The display panel 370 includes a display section 381 and a driving circuit section 382. Wiring 383 and the like are provided on the FPC 373. The FPC 373 is electrically connected to the wiring 383. FPC373 is equipped with IC374.

[0217] The wiring 383 has a function of supplying signals and power to the display portion 381 and the driver circuit portion 382 . The signal and power are input to the wiring 383 from the outside or IC 374 via the FPC 373. will be done.

[0218] 15 shows an example of a cross-sectional view of the touch panel 300. In FIG. The cross-sectional structure of the circuit part 382, ​​the area including the FPC 373, the area including the FPC 350, etc. is shown. Furthermore, in Figure 15, the wiring formed by processing the same conductive layer as the transistor gate is and wiring formed by processing the same conductive layer as the source and drain of the transistor. The cross-sectional structure of the intersecting portion 387 is shown.

[0219] The flexible substrate 371 and the flexible substrate 372 are bonded together by an adhesive layer 317 . Flexible substrate 372 and flexible substrate 330 are attached together by adhesive layer 396 . Here, each layer from the flexible substrate 371 to the flexible substrate 372 corresponds to the display panel 370. Each layer from the flexible substrate 330 to the electrode 334 corresponds to the input device 310. In other words, the adhesive layer 396 can be said to bond the display panel 370 and the input device 310 together. Alternatively, each layer from the flexible substrate 371 to the insulating layer 376 corresponds to the display panel 370. Each layer from the flexible substrate 330 to the flexible substrate 372 corresponds to the input device 310. That is, the adhesive layer 375 bonds the display panel 370 and the input device 310 together. It can also be said that...

[0220] The configuration of the display panel 370 shown in FIG. 15 is the same as that of the display panel shown in FIG. , detailed explanation will be omitted.

[0221] <Input Device 310> An electrode 331 and an electrode 332 are provided on the flexible substrate 372 side of the flexible substrate 330. Here, an example is shown in which the electrode 331 has an electrode 333 and an electrode 334. As shown at the intersection 387 in FIG. 15, the electrodes 332 and 333 are formed on the same plane. The insulating layer 395 is provided to cover the electrode 332 and the electrode 333. The electrode 334 is provided so as to sandwich the electrode 332 through an opening provided in the insulating layer 395. The electrode 333 is electrically connected to the two electrodes 333 .

[0222] A connecting portion 308 is provided in an area near the end of the flexible substrate 330. The wiring 342 and the conductive layer obtained by processing the same conductive layer as the electrode 334 are laminated to form a functional layer. The connecting portion 308 is electrically connected to an FPC 350 via a connecting member 309 .

[0223] The flexible substrate 330 is bonded to the insulating layer 393 by an adhesive layer 391. As in the manufacturing method of the input device 310, the elements are manufactured on a manufacturing substrate, and then the manufacturing substrate is peeled off. After that, the element can be transferred onto a flexible substrate 330. The insulating layer 393, elements, and the like may be formed directly on the conductive substrate 330 (see FIG. 16(A)).

[0224] <Configuration example 5> The touch panel shown in FIG. 16(A) does not have an adhesive layer 391 and has a transistor. 15 in that the configurations of the capacitors 301, 302, 303 and the capacitance element 305 are different. It is different from Chipanel.

[0225] FIG. 16A shows a transistor with a top-gate structure.

[0226] Each transistor has a gate, a gate insulating layer 311, a semiconductor layer, a source, and a drain. The gate and the semiconductor layer overlap with each other via a gate insulating layer 311. The semiconductor layer has a low resistance. The low resistance region 348 may be a transistor solenoid. It functions as a source and drain.

[0227] The conductive layer provided over the insulating layer 313 functions as a lead wiring. 313, the insulating layer 312, and the gate insulating layer 311 through openings formed therein. is electrically connected to.

[0228] In FIG. 16A, the capacitor 305 is a layer formed by processing the same semiconductor layer as the semiconductor layer. The gate insulating layer 311 and the gate insulating layer 312 are laminated together to form a layer formed by processing the same conductive layer as the gate. Here, a channel of a transistor is formed in a part of the semiconductor layer of the capacitor 305. It is preferable that a region 349 having a higher conductivity than the region 347 is formed.

[0229] Regions 348 and 349 are regions 34 where the channel of the transistor is formed. 7, regions containing more impurities, regions with high carrier concentration, regions with low crystallinity, etc. It is possible.

[0230] The transistor 848 shown in FIGS. 16B to 16D is used in the display device of one embodiment of the present invention. You can also do this.

[0231] 16B shows a top view of the transistor 848. FIG. 16C shows one embodiment of the present invention. 16C is a cross-sectional view of the transistor 848 in the display device in the channel length direction. The transistor 848 corresponds to the cross section taken along the dashed line X1-X2 in FIG. 16(B). FIG. 16D shows a cross-sectional view of the transistor 848 in the channel width direction of the display device of one embodiment of the present invention. 16B. The transistor 848 shown in FIG. 16D is a cross-sectional view of the transistor 848 shown in FIG. This corresponds to the cross section between the chain lines Y1 and Y2.

[0232] The transistor 848 is a type of top-gate transistor having a back gate. .

[0233] In the transistor 848, the semiconductor layer 742 is formed on a protrusion provided in an insulating layer 772. By providing the semiconductor layer 742 on the protrusions provided in the insulating layer 772, the semiconductor layer 74 The second side of the transistor 848 can also be covered by the gate 743. The semiconductor layer 742 can be electrically surrounded by the electric field of the semiconductor layer 743. In this way, the electric field of the conductive film electrically attracts the semiconductor film in which the channel is formed. The structure of the surrounding transistor is called the surrounded channel (s-channel A transistor with an s-channel structure is called an "s-cha" structure. It is also called an "s-channel transistor" or "s-channel transistor."

[0234] In the s-channel structure, a channel is formed in the entire (bulk) of the semiconductor layer 742. The s-channel structure allows the drain current of the transistor to be increased. Furthermore, the electric field of the gate 743 can As a result, the entire channel formation region formed in the semiconductor layer 742 can be depleted. Therefore, in the s-channel structure, the off-state current of the transistor can be further reduced. It is possible.

[0235] The back gate 723 is provided on the insulating layer 378 .

[0236] The conductive layer 744a provided over the insulating layer 729 is a gate insulating layer 311, an insulating layer 728, and a and an opening 747c formed in the insulating layer 729, which is electrically connected to the semiconductor layer 742. The conductive layer 744b provided over the insulating layer 729 is a gate insulating layer 311 and an insulating layer 312. The semiconductor layer 742 and the electrode 747 are electrically connected through an opening 747d formed in the insulating layer 729 and the insulating layer 728. are electrically connected.

[0237] The gate 743 provided on the gate insulating layer 311 is connected to the gate insulating layer 311 and the insulating layer 77. 2, the back gate 723 is electrically connected to the opening 747a and the opening 747b. Therefore, the same potential is supplied to the gate 743 and the back gate 723. In addition, it is not necessary to provide either the opening 747a or the opening 747b. It is not necessary to provide both the opening 747a and the opening 747b. When neither of the back gate 723 and the gate 743 is provided, different potentials are applied to the back gate 723 and the gate 743. It is possible.

[0238] As a semiconductor used for a transistor having an s-channel structure, an oxide semiconductor Conductor, or polycrystalline silicon, or single crystal silicon transferred from a single crystal silicon substrate, etc. Examples include silicon such as kon.

[0239] <Configuration Example 6> The touch panel shown in FIG. 17 is a touch panel that connects a bottom emission type display panel and an input device. This is an example of bonding with adhesive layer 396.

[0240] In FIG. 17, the conductive layer 380 is not only provided in the display section 381 but also in the drive circuit section 382 and 3 shows an example in which the flexible substrate 371 is provided up to the end portion overlapping with the FPC 373.

[0241] The display panel in FIG. 17 differs from the configuration in FIG. 13(A) in that it has an insulating layer 376. 17 does not have an insulating layer 393, and the electrodes 331 are directly formed on the flexible substrate 330. 16 in that an electrode 332 and the like are provided.

[0242] <Configuration Example 7> The touch panel shown in FIG. 18 comprises a display panel to which a color-coded display method is applied and an input device. This is an example of bonding with an adhesive layer 375.

[0243] The display panel in FIG. 18 has the same configuration as that in FIG. 13(B).

[0244] The input device of FIG. 18 has an insulating layer 376 on a flexible substrate 392, and an electrode The electrodes 334 and the wiring 342 are covered with an insulating layer 395. The insulating layer 395 has an electrode 332 and an electrode 333 on it. It is bonded to the flexible substrate 392 by an adhesive layer 396 .

[0245] <Configuration Example 8> FIG. 19 shows a touch panel between a pair of flexible substrates (flexible substrate 371 and flexible substrate 372). This is an example having a sensor and a light emitting element 304. By using two flexible substrates, This makes it possible to make the panel thinner, lighter, and more flexible.

[0246] The structure of FIG. 19 is a structure in which a peeled layer is formed on a fabrication substrate 411 in the fabrication method example of the structure example 1. In the example of the manufacturing method of the configuration example 1, the substrate 4 As the layers to be peeled off on the substrate 11, an insulating layer 376, a colored layer 325, and a light-shielding layer 326 were formed ( Figure 9(B)).

[0247] When fabricating the configuration shown in FIG. 19, an insulating layer 376 is formed, and then an electrode is formed on the insulating layer 376. 332, an electrode 333, and a wiring 342 are formed. Next, an insulating layer 395 is formed to cover these electrodes. Next, an electrode 334 is formed on the insulating layer 395. Next, an insulating film covering the electrode 334 is formed. An edge layer 327 is formed. Then, a coloring layer 325 and a light-shielding layer 326 are formed on the insulating layer 327. Then, the substrates are bonded to the fabrication substrate 401, and the fabrication substrates are peeled off, and a flexible substrate is bonded. By combining these, a touch panel having the configuration shown in FIG. 19 can be produced.

[0248] <Configuration Example 9> 20(A) and 20(B) are schematic perspective views of the touch panel 320. FIG.

[0249] In FIGS. 20A and 20B, the input device 318 is a flexible substrate of a display panel 379. The wiring 341 and wiring 342 of the input device 318 are provided on the surface 372. The display panel 379 is electrically connected to an FPC 373 provided thereon.

[0250] By adopting such a configuration, the FPC connected to the touch panel 320 is located on one of the substrate sides ( In this case, it can be arranged only on the flexible substrate 371 side. Two or more FPCs may be attached, but as shown in Figures 20(A) and (B), The touch panel 320 is provided with one FPC 373, and the FPC 373 is connected to the display panel 37 9 and the input device 318, the configuration can be further simplified. preferable.

[0251] The IC 374 may have a function to drive the input device 318, or may Alternatively, an IC for driving the input device 318 may be mounted on the flexible substrate. It may be implemented on 371.

[0252] FIG. 21 shows the area including the FPC 373 in FIG. 20, the connection section 385, the drive circuit section 382, 3 is a cross-sectional view of the display unit 381. FIG.

[0253] The connection portion 385 is connected to one of the wirings 342 (or wirings 341) and one of the conductive layers 307. Electrical connection is made via connector 386.

[0254] The connector 386 may be, for example, a conductive particle. The surface of particles of organic resin or silica coated with a metal material can be used. It is preferable to use nickel or gold as the metal material because it can reduce the contact resistance. The particles are coated with layers of two or more metal materials, such as nickel coated with gold. It is also preferable to use a material that can be elastically or plastically deformed as the connector 386. At this time, the conductive particles are crushed in the vertical direction as shown in FIG. This may result in contact between the connector 386 and the conductive layer to which it is electrically connected. The increased area reduces contact resistance and prevents problems such as poor connections.

[0255] The connector 386 is preferably disposed so as to be covered with the adhesive layer 317. For example, the adhesive layer 3 After applying the paste or the like that will become 17, the connector 386 may be sprayed onto the connecting portion 385. By disposing the connection portion 385 in the portion where the adhesive layer 317 is to be provided, the adhesive layer 3 17 on the light emitting element 304 (also called a solid sealing structure), The adhesive layer 317 is used around the periphery of a hollow sealed light-emitting panel, a liquid crystal display panel, etc. can be applied in the same way.

[0256] FIG. 21 shows an example in which the optical adjustment layer 324 does not cover the edge of the electrode 321. An example is shown in which the spacer 316 is also provided in the drive circuit section 382.

[0257] <Configuration Example 10> The touch panel shown in FIG. 22(A) includes electrodes constituting a touch sensor and a flexible substrate 37. 2, a light-shielding layer 326 is provided between the insulating layer 376 and the insulating layer 328. A light-shielding layer 326 is provided between the insulating layer 328. An electrode 332, an electrode 333, and a wiring Conductive layers such as wires 342, an insulating layer 395 covering these, and electrodes 334 on the insulating layer 395 are is provided. Also, an insulating layer 327 is provided on the electrode 334 and the insulating layer 395, and a coloring layer 325 is provided on the insulating layer 327.

[0258] The insulating layer 327 and the insulating layer 328 have a function as a planarizing film. Note that the insulating layer 327 and the insulating layer 328 may not be provided if they are not necessary respectively.

[0259] With such a configuration, the light shielding layer 326 provided on the flexible substrate 372 side rather than the electrodes and the like constituting the touch sensor can suppress the electrodes and the like from being visually recognized by the user. Therefore, it is possible to realize a touch panel that not only has a thin thickness but also has improved display quality.

[0260] Also, as shown in FIG. 22(B), the touch panel may have a light shielding layer 326a between the insulating layer 376 and the insulating layer 328, and may have a light shielding layer 326b between the insulating layer 327 and the adhesive layer 317. By providing the light shielding layer 326b, light leakage can be more reliably suppressed.

[0261] This embodiment can be appropriately combined with other embodiments.

[0262] (Embodiment 3) <Configuration of CAC-OS> Hereinafter, the configuration of CAC (Cl oud Aligned Complementary)-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

[0263] In this specification and the like, a metal oxide is an oxide of a metal in a broad sense. Metal oxides include oxide insulators, oxide conductors (including transparent oxide conductors), ​ , oxide semiconductors (also called "OS"), For example, when a metal oxide is used in the active layer of a transistor, the metal oxide In other words, when describing an OS FET, In other words, the transistor can be a transistor including a metal oxide or an oxide semiconductor.

[0264] In this specification, the metal oxide has a region having a function of a conductor and a region having a function of a dielectric. When the metal oxide as a whole functions as a semiconductor, it is called CAC (Cloud Accumulation Coupling). Aligned Complementary)-OS(Oxide Semicond uctor), or CAC-metal oxide.

[0265] In other words, CAC-OS is a type of oxide semiconductor in which the elements constituting the oxide semiconductor are separated by a distance of 0.5 nm or more. 0 nm or less, preferably 0.5 nm to 3 nm or less, or a size unevenly distributed in the vicinity thereof In the following, in the oxide semiconductor, one or more The element is unevenly distributed, and the region containing the element is 0.5 nm or more and 10 nm or less, preferably 0.5 A mixture of particles with sizes between 1000 and 3000 nm or in the vicinity is called a mosaic or patch. It is also called chip-shaped.

[0266] The physical properties of the region where a specific element is unevenly distributed are determined by the properties of the element. For example, In this region, elements that tend to be insulating among the elements that make up metal oxides are concentrated. On the other hand, among the elements that make up metal oxides, the The region where the element with the tendency is unevenly distributed becomes a conductive region. The regions are mixed in a mosaic pattern, and the material functions as a semiconductor.

[0267] That is, the metal oxide in one embodiment of the present invention is a matrix in which materials with different physical properties are mixed. matrix composite, or metal matrix composite (metal matrix composite).

[0268] Note that the oxide semiconductor preferably contains at least indium. In addition to these, it is preferable to contain an element M (M is gallium, aluminum, Ni, silicon, boron, yttrium, copper, vanadium, beryllium, titanium, iron, Nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, One selected from hafnium, tantalum, tungsten, magnesium, etc., may contain multiple types).

[0269] For example, CAC-OS made of In-Ga-Zn oxide (In-Ga-Zn oxide among CAC-OS) α-Zn oxide may be specifically referred to as CAC-IGZO. (Hereinafter, InO X1 (X1 is a real number greater than 0) or indium zinc oxide compound (hereinafter referred to as In X2 Zn Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0) ) and gallium oxide (hereinafter referred to as GaO X3 (X3 is a real number greater than 0). ), or gallium zinc oxide (Ga X4 Zn Y4 O Z4 (X4, Y4, and Z4 is a real number greater than 0). ) and so on, the material separates into a mosaic shape, Mosaic InO X1 , or In X2 Zn Y2 O Z2 is uniformly distributed in the film (Hereinafter, this will also be referred to as cloud-like.)

[0270] In other words, CAC-OS is X3 The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 A composite oxide semiconductor having a structure in which a region in which In this specification, for example, the atomic ratio of In to the element M in the first region is is greater than the atomic ratio of In to the element M in the second region. Compared to region 2, the concentration of In is higher.

[0271] IGZO is a common name and refers to a compound of In, Ga, Zn, and O. A typical example is InGaO3(ZnO) m1 (m1 is a natural number), or In (1 +x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is an arbitrary number) Examples of such crystalline compounds include:

[0272] The crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure. The CAAC structure is a structure in which multiple IGZO nanocrystals have a c-axis orientation and are aligned in the ab plane. is a non-oriented connected crystal structure.

[0273] On the one hand, CAC-OS relates to the material composition of an oxide semiconductor. CAC-OS refers to a material composition containing In, G a, Zn, and O, in which nanoparticle-like regions with Ga as the main component are observed in part, and nanoparticle-like regions with In as the main component are observed, each in a mosaic randomly dispersed configuration. Therefore, in CAC-OS, the crystal structure is a secondary element.

[0274] Note that CAC-OS does not include a laminated structure of two or more types of films with different compositions. For example, a structure composed of two layers, a film with In as the main component and a film with Ga as the main component, is not included.

[0275] Note that GaO X3 as the main component region and In X2 Zn Y2 O Z2 , or InO X1 as the main component region may not have a clear boundary observable.

[0276] Note that when one or more selected from aluminum, silicon, boron, yttrium, copper, vana dium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum , lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium ium, etc. are included, CAC-OS refers to a configuration in which nanoparticle-like regions with the element as the main component are observed in part, and nanoparticle -like regions with In as the main component are observed, each in a mosaic randomly dispersed configuration.

[0277] <Analysis of CAC-OS> Subsequently, as a result of measuring the oxide semiconductor formed on the substrate using various measurement methods This article explains:

[0278] <Sample structure and preparation method> Nine samples according to one embodiment of the present invention will be described below. Each sample contains an oxide semiconductor. The samples were fabricated under different conditions of substrate temperature and oxygen gas flow rate ratio during film formation. The structure includes a substrate and an oxide semiconductor on the substrate.

[0279] The preparation method for each sample will be explained below.

[0280] First, a glass substrate is used as the substrate. Then, a sputtering device is used to deposit the glass A 100 nm thick In-Ga-Zn oxide was formed on the substrate as an oxide semiconductor. The film conditions were a pressure in the chamber of 0.6 Pa, and an oxide target ( In:Ga:Zn=4:2:4.1 [atomic ratio]) is used. An AC power of 2500 W is supplied to an oxide target placed inside the furnace.

[0281] As a condition for forming an oxide film, the substrate temperature is set to a temperature at which the substrate is not intentionally heated (hereinafter, Also called room temperature or RT.) 130 °C, or 170 °C. Also, Ar and oxygen The flow rate ratio of oxygen gas to the mixed gas (hereinafter also referred to as oxygen gas flow rate ratio) is 10%, Nine samples are prepared by setting the ratio at 30% or 100%.

[0282] <X-ray diffraction analysis> In this section, X-ray diffraction (XRD) was performed on nine samples. The results of the measurements will be explained below. The XRD equipment used was a Bruker D 8 ADVANCE was used. The conditions were θ / 2 In θ scan, the scanning range is 15° to 50°, and the step width is 0.02 deg. g., and the scanning speed was 3.0 deg. / min.

[0283] FIG. 34 shows the results of measuring the XRD spectrum using the out-of-plane method. In addition, in FIG. 34, the upper part shows the measurement results for a sample where the substrate temperature during film formation was 170°C. As a result, the middle row shows the measurement results for a sample with a substrate temperature of 130°C during film formation, and the bottom row shows the measurement results for a sample with a substrate temperature of 130°C during film formation. The left column shows the measurement results for samples with a substrate temperature of RT. The center column shows the measurement results for the sample with a flow rate ratio of 10%. The center column shows the measurement results for the sample with a flow rate ratio of 3%. The right column shows the measurement results for the sample with a 0% oxygen gas flow rate, and the right column shows the measurement results for the sample with a 100% oxygen gas flow rate. The measurement results are shown below.

[0284] The XRD spectrum shown in FIG. 34 shows that the increase in the substrate temperature during film formation or the decrease in the amount of oxygen during film formation Increasing the gas flow rate ratio increases the peak intensity around 2θ=31°. The peak at 2θ=31° indicates that the c-axis is oriented in the direction approximately perpendicular to the surface on which the film is formed or the upper surface. crystalline IGZO compound (CAAC(c-axis aligned crystall It is also called ine)-IGZO. ) is known to be derived from the fact that

[0285] In addition, the XRD spectrum shown in FIG. 34 shows that the substrate temperature during film formation was low or the oxygen gas flow The smaller the ratio of the amount of SiO2, the less clear the peak. In the case of a sample with a small oxygen gas flow rate, the orientation of the ab plane direction and the c axis direction of the measurement area is I know I can’t see it.

[0286] <Analysis by electron microscope> In this section, the samples were prepared at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. HAADF(High-Angle Annular Dark Field)-STE M(Scanning Transmission Electron Microsc The results of the observation and analysis using HAADF-STE are described below (hereafter referred to as HAADF-STE). Images obtained by M are also called TEM images.

[0287] Planar images obtained by HAADF-STEM (hereinafter also referred to as planar TEM images), and The results of image analysis of the cross-sectional image (hereinafter also referred to as the cross-sectional TEM image) will be explained. The TEM images were observed using a spherical aberration correction function. The images were taken using an atomic resolution analytical electron microscope JEM-ARM200F manufactured by JEOL Ltd. The electron beam was irradiated at an acceleration voltage of 200 kV with a beam diameter of approximately 0.1 nmφ.

[0288] FIG. 35(A) shows a sample fabricated at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. FIG. 35(B) shows the change in the substrate temperature RT and oxygen gas flow rate during film formation. This is a cross-sectional TEM image of a sample prepared at a ratio of 10%.

[0289] <Electron diffraction pattern analysis> In this section, the sample was prepared at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. By irradiating an electron beam with a probe diameter of 1 nm (also called a nanobeam electron beam), The results of obtaining the diffraction patterns will now be described.

[0290] As shown in FIG. 35(A), the film was formed at a substrate temperature of RT and an oxygen gas flow rate of 10%. In the planar TEM image of the sample, black spots a1, a2, a3, a4, and a5 The electron beam diffraction pattern shown in the figure is observed. The sunspot a1 is moved from the 0-second position to the 35-second position at a constant speed while shooting. The results of black point a2 are shown in Figure 35(D), and the results of black point a3 are shown in Figure 35(E). The results for black point a4 are shown in FIG. 35(F), and the results for black point a5 are shown in FIG. 35(G).

[0291] From Figure 35(C), Figure 35(D), Figure 35(E), Figure 35(F), and Figure 35(G), A bright area can be observed that resembles a ring. Spots can be observed.

[0292] Also, as shown in FIG. 35(B), the film was formed at a substrate temperature of RT and an oxygen gas flow rate of 10%. In the cross-sectional TEM image of the prepared sample, black spots b1, b2, b3, b4, and Observe the electron diffraction pattern indicated by point b5. The results for black point b1 are shown in Figure 35(H), and the results for black point b2 are shown in Figure 35(H). The results of black point b3 are shown in Figure 35(J), and the results of black point b4 are shown in Figure 35(K). The results for black point b5 are shown in Figure 35(L).

[0293] From Figure 35(H), Figure 35(I), Figure 35(J), Figure 35(K), and Figure 35(L), A ring-shaped area with high brightness can be observed. Also, multiple spots can be observed in the ring-shaped area. Cut.

[0294] Here, for example, for a CAAC-OS having InGaZnO4 crystals, When an electron beam with a probe diameter of 300 nm is incident on the InGaZnO4 crystal, ) planes. It is clear that the film has a c-axis orientation, and the c-axis is oriented in a direction substantially perpendicular to the surface on which the film is formed or the upper surface. On the other hand, an electron beam with a probe diameter of 300 nm is incident perpendicularly to the sample surface. In other words, CAAC-OS has a ring-shaped diffraction pattern. It can be seen that the film has no orientation.

[0295] In addition, oxide semiconductors having microcrystals (nano crystalline oxide semiconductor. Hereafter referred to as nc-OS.) For example, when electron diffraction is performed using an electron beam of 50 nm or more, a halo pattern is observed. In addition, a small probe diameter electron beam (e.g. When nanobeam electron diffraction is performed using a material with a thickness of less than 50 nm, bright spots are observed. In addition, when nanobeam electron diffraction is performed on nc-OS, a circular (ring-shaped) structure is observed. ) A bright area may be observed. In addition, multiple bright spots may be observed in a ring-shaped area. This may be the case.

[0296] The electron diffraction pattern of the sample prepared at the substrate temperature RT and oxygen gas flow rate ratio of 10% during film formation. The ring has a ring-shaped area with high brightness and multiple bright spots in the ring area. The sample fabricated at a substrate temperature of RT and an oxygen gas flow rate of 10% during deposition had an electron diffraction pattern. The layer becomes nc-OS, and has no orientation in the planar direction or cross-sectional direction.

[0297] From the above, an oxide semiconductor formed at a low substrate temperature or a low oxygen gas flow rate ratio has the following properties: It is clearly different from both an oxide semiconductor film with an amorphous structure and an oxide semiconductor film with a single crystal structure. It can be assumed that it has the properties.

[0298] ≪Elemental analysis≫ In this article, we will discuss energy dispersive X-ray spectroscopy (EDX). EDX mapping was obtained and evaluated using X-ray spectroscopy. By doing so, the sample was fabricated at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. The results of elemental analysis of the material are explained below. An energy dispersive X-ray analyzer JED-2300T manufactured by JEOL Ltd. is used. A Si drift detector is used to detect the X-rays emitted from the sample.

[0299] In EDX measurement, each point in the analysis area of ​​the sample is irradiated with an electron beam, and the resulting The energy and frequency of characteristic X-rays of the material are measured, and an EDX spectrum corresponding to each point is obtained. In this embodiment, the peaks in the EDX spectrum at each point are determined as electron transitions to the L shell of the In atom. , electron transition to the K shell of Ga atom, electron transition to the K shell of Zn atom, and electron transition to the K shell of O atom The ratio of each atom at each point is calculated. By performing EDX analysis on a region, it is possible to obtain EDX mapping that shows the distribution of the ratio of each atom. This can be done.

[0300] Figure 36 shows the cross section of a sample fabricated at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. FIG. 36(A) shows EDX mapping of Ga atoms (all The ratio of Ga atoms to Ga atoms is in the range of 1.18 to 18.64 [atomic%]. ) Figure 36(B) shows the EDX mapping of In atoms (the ratio of In atoms to all atoms). The ratio is in the range of 9.28 to 33.74 [atomic%]. ) shows EDX mapping of Zn atoms (ratio of Zn atoms to total atoms is 6.69 to 24 0.99 [atomic%] range.) Also, Figure 36(A) and Figure 36(B) 36(C) and 36(D) are fabricated at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. The cross section of the sample shows the same area. The more the measured element, the brighter it becomes, and the less the measured element, the darker it becomes. The magnification of the EDX mapping shown in Figure 36 is 7.2 million times. do.

[0301] In the EDX mapping shown in Figures 36(A), 36(B), and 36(C), The film was formed at a substrate temperature of RT and an oxygen gas flow rate of 10%. In the prepared sample, it can be seen that each atom exists with its own distribution. 36(A), 36(B), and 36(C) are enclosed by solid lines and dashed lines. Pay attention.

[0302] In Figure 36(A), the area enclosed by the solid line contains many relatively dark areas, and the area enclosed by the dashed line contains many relatively dark areas. , and contains many relatively bright areas. In addition, the area enclosed by the solid line in Figure 36(B) is relatively The area surrounded by the dashed line contains many bright areas, while the area surrounded by the dashed line contains many relatively dark areas.

[0303] In other words, the area surrounded by the solid line is the area where the In atoms are relatively abundant, and the area surrounded by the dashed line is the area where the In atoms are relatively abundant. In FIG. 36(C), the area surrounded by the solid line is The right side is a relatively bright area, and the left side is a relatively dark area. The range is In X2 Zn Y2 O Z2 , or InO X1 This is the area where the main components are:

[0304] The area surrounded by the solid line is the area where the number of Ga atoms is relatively small, and the area surrounded by the dashed line is the area where the number of Ga atoms is relatively small. In Figure 36(C), the area surrounded by the dashed line is the upper left area. The area at the bottom right is a relatively bright area, and the area at the bottom right is a relatively dark area. The area enclosed by the line is GaO X3 , or Ga X4 Zn Y4 O Z4 In the area where the main components are be.

[0305] 36(A), 36(B), and 36(C), the distribution of In atoms is similar to that of Ga atoms. The distribution is relatively uniform compared to the InO X1 The region where is the main component is In X2 Z n Y2 O Z2 It appears to be connected to each other through the area where In this way, X2 Zn Y2 O Z2 , or InO X1 The region where is the main component is the cluster. It is formed in a bamboo-like shape.

[0306] Thus, GaO X3 The region where In is the main component. X2 Zn Y2 O Z2 , or I nO X1 In-Ga-Zn The oxide can be referred to as CAC-OS.

[0307] The crystal structure of CAC-OS is an nc structure. The structure is IGZO, including single crystal, polycrystalline, and CAAC structures, in the electron diffraction pattern. In addition to the bright spot caused by the problem, there are several other bright spots. In addition to several bright spots, a ring-shaped area of ​​high brightness appears, indicating a crystal structure. The structure is defined.

[0308] Also, from Figures 36(A), 36(B), and 36(C), GaO X3 The main ingredients are In a certain area, and X2 Zn Y2 O Z2 , or InO X1 The size of the region where is the principal component The size is preferably 0.5 nm to 10 nm, or 1 nm to 3 nm. Preferably, in EDX mapping, the diameter of the region where each element is the main component is 1 nm or more and 2 nm or less. nm or less.

[0309] From the above, it can be seen that CAC-OS has a structure different from that of IGZO compounds in which metal elements are uniformly distributed. CAC-OS has properties different from those of IGZO compounds. X3 etc. The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 The region where is the principal component The phases are separated into two, and the regions containing each element as the main component are arranged in a mosaic pattern.

[0310] Here, In X2 Zn Y2 O Z2 , or InO X1The region where is the main component is GaO X3 This region has higher conductivity than the region where In is the main component. X2 Zn Y 2O Z2 , or InO X1 The carriers flow through the region where the main component is oxidized. Therefore, the conductivity of In is expressed as a semiconductor. X2 Zn Y2 O Z2 , or InO X The cloud-like distribution of the region where 1 is the main component in the oxide semiconductor results in a high field effect. Mobility (μ) can be achieved.

[0311] On the other hand, GaO X3 The region where the main components are In X2 Zn Y2 O Z2 , or InO X This region has higher insulating properties than the region where GaO is the main component. X3 etc. The distribution of the main component in the oxide semiconductor suppresses leakage current and provides good switching. Switching operation can be realized.

[0312] Therefore, when CAC-OS is used in a semiconductor device, GaO X3 Insulation caused by In X2 Zn Y2 O Z2 , or InO X1 The conductivity caused by the This results in a high on-state current (I on ) and high field-effect mobility (μ). Cut.

[0313] Furthermore, semiconductor devices using CAC-OS are highly reliable. It is ideal for a variety of semiconductor devices, including displays.

[0314] This embodiment mode can be combined with other embodiment modes as appropriate.

[0315] (Fourth embodiment) In this embodiment, electronic devices and lighting devices according to one embodiment of the present invention will be described with reference to drawings. .

[0316] An electronic device with reduced display defects can be realized by using the display device of one embodiment of the present invention. A curved or flexible electronic device can be realized by using the display device of one embodiment of the present invention. Lightweight or thin electronic devices can be realized by using the display device of one embodiment of the present invention. It is possible.

[0317] Examples of electronic devices include television sets, wristband displays, and goggle displays. Wearable displays such as head-mounted displays, computers For monitors, digital cameras, digital video cameras, digital photo cameras, etc. Frames, mobile phones, portable game machines, personal digital assistants, sound players, pachinko machines, etc. Examples include large game consoles.

[0318] The electronic device according to one embodiment of the present invention is flexible, and therefore can be attached to the interior or exterior walls of a house or building, or It is also possible to incorporate it along the curved surfaces of the interior or exterior of a vehicle.

[0319] The electronic device of one embodiment of the present invention may include a secondary battery. It is preferable to be able to charge the secondary battery.

[0320] As the secondary battery, for example, a lithium polymer battery (lithium ion battery) using a gel electrolyte is used. Lithium-ion secondary batteries such as lithium polymer batteries, nickel-metal hydride batteries, nickel-cadmium batteries, organic Examples include nickel-zinc batteries, lead-acid batteries, air secondary batteries, nickel-zinc batteries, and silver-zinc batteries. .

[0321] The electronic device according to one embodiment of the present invention may include an antenna. By doing so, it is possible to display images and information on the display unit. If present, the antenna may be used for contactless power transfer.

[0322] 23A to 23E show examples of electronic devices having a flexible display portion 7001. .

[0323] The display portion 7001 is manufactured using a display device of one embodiment of the present invention. Display devices that can be bent between 0.01 mm and 150 mm can be used. The display unit 7001 may be provided with a touch sensor, and when the display unit 7001 is touched with a finger or the like, Able to operate electronic devices.

[0324] According to one embodiment of the present invention, an electronic device having a flexible display portion in which display defects are reduced can be provided. We can provide it.

[0325] 23(A) to 23(C) show an example of a foldable electronic device. In FIG. 23(A), In the unfolded state, Fig. 23(B) shows the unfolded or folded state. FIG. 23C shows electronic device 7600 in a folded state, which is a state in the process of changing. The Electronics 7600 is highly portable when folded and has a seam-free design when unfolded. The wide display area provides excellent visibility.

[0326] The display unit 7001 is supported by three housings 7601 connected by hinges 7602. By bending the two housings 7601 via the hinge 7602, the electronic device 7 600 can be reversibly transformed from an unfolded state to a folded state.

[0327] 23(D) and (E) show an example of a foldable electronic device. In FIG. 23(D), FIG. 23(E) shows the electronic device 7650 in an inwardly bent state, and FIG. 23(F) shows the electronic device 7650 in an outwardly bent state. The child device 7650 has a display portion 7001 and a non-display portion 7651. When not in use, the display unit 7001 can be folded inward. It can prevent dirt and scratches.

[0328] The electronic device 7600 and the electronic device 7650 can be used as a portable information terminal. The portable information terminal exemplified in this embodiment may be, for example, a telephone, a notebook, or an information browsing device. Specifically, it has one or more functions selected from the following: The portable information terminal can be used for, for example, mobile phone calls, e-mails, document browsing, and Various applications such as computer games, music playback, internet communication, etc. You can perform the operation.

[0329] The foldable electronic device will be described in more detail with reference to FIGS. 24 to 27, a touch panel 300 (see FIGS. 14 and 15) is used as the display panel. Here is an example using

[0330] The electronic devices shown in FIGS. 24 to 27 have a band-shaped highly flexible region and a band-shaped less flexible region. The electronic device can be folded by bending it at the highly flexible region. The electronic device is highly portable when folded, and has a seam-free design when unfolded. The wide display area allows for excellent visibility. The highly flexible area can be bent inwards or outwards. It can also be folded.

[0331] When using electronic devices, you can unfold them to use the entire seamless display area. Alternatively, by bending the display panel so that the display surface faces outward, it is possible to use a portion of the display area. By folding the display area that is not visible to the user as a non-display area, The power consumption of child devices can be reduced.

[0332] Figures 24(A) to (D) show two band-shaped highly flexible regions and three band-shaped less flexible regions. 24(A) and (C) show an electronic device 90 that can be folded into three. 24(B) and (D) are plan views of the display surface side of the electronic device 90. FIG.

[0333] There is no particular limitation on the number of high flexibility regions and low flexibility regions. A folded sheet having one band-shaped highly flexible region and two band-shaped less flexible regions. Also, Fig. 25(B) shows a possible electronic device with three strip-shaped highly flexible regions and four 25(C) shows an electronic device having a strip-shaped low-flexibility region. 1 shows an electronic device having a highly flexible region and five strip-shaped less flexible regions.

[0334] The electronic device 90 shown in FIGS. 24(A) to 24(D) includes a flexible touch panel 300, a protective layer 93, conductive layer 73, a plurality of support panels 95a, and a plurality of support panels 95b. Each of the support panels 95a and 95b has a lower flexibility than the touch panel 300. The panels 95a are spaced apart from one another, and the plurality of support panels 95b are spaced apart from one another.

[0335] As shown in FIG. 24(A), the electronic device 90 has a region E1 that is highly flexible in one direction and a region E2 that is highly flexible in one direction. The high flexibility region and the low flexibility region are each formed as a strip ( In this embodiment, a plurality of highly flexible regions and a plurality of less flexible regions are formed. Although an example is shown in which the regions are parallel to each other, the regions do not have to be arranged in parallel.

[0336] The highly flexible region E1 in the electronic device 90 includes at least a flexible display panel. In particular, display panels using organic EL elements are highly flexible and shock-resistant, as well as thin. This is preferable because it allows for a reduction in the weight of the mold.

[0337] The less flexible region E2 in the electronic device 90 is at least a flexible display panel. The display panel has a support panel, which is less flexible than the display panel, stacked thereon.

[0338] FIG. 26(A) shows the electronic device 90 shown in FIG. 24(A) in an unfolded state. Electronic device 90 in the process of changing from one of the unfolded state and the folded state to the other FIG. 26(C) shows the electronic device 90 in a folded state.

[0339] FIG. 27 is a perspective view showing each component of the electronic device 90 shown in FIG. 24(A).

[0340] When the electronic device 90 is folded, the end portion of the touch panel 300 (the folded portion, the folded portion) The ends of the support panels 95a and 95b are located outside the ends of the support panels 95a and 95b. If the touch panel 300 is positioned in a position other than the above, the touch panel 300 may be damaged or the elements included in the touch panel 300 may be damaged. may be destroyed.

[0341] The electronic device 90 in the folded state shown in FIG. 26(C) has an edge of the touch panel 300 and a tab. The ends of the support panels 95a and 95b located above and below the switch panel 300 are aligned. This may damage the touch panel 300 or destroy the elements included in the touch panel 300. This can prevent things from happening again.

[0342] Furthermore, when the electronic device 90 shown in FIG. 24(C) is folded, the edge of the touch panel 300 The touch panel is positioned inside the ends of the support panels 95a and 95b. This can prevent the touch panel 300 from being damaged, and the elements included in the touch panel 300 from being destroyed. Cut.

[0343] In FIG. 24(C), the high flexibility region and the low flexibility region are The lengths in the direction in which the lines are arranged are indicated by length W1 to length W3.

[0344] The region with low flexibility preferably includes an external connection electrode of the display panel. The external connection electrode corresponds to, for example, the conductive layer 355 shown in FIG.

[0345] In FIG. 24(C), an external connection electrode is included in the region with low flexibility having a length W1. The length W1 of the less flexible area A that overlaps with the external connection electrode is the length W2 of the most flexible area closest to area A. It is longer than the length W3 of the lower region B.

[0346] In the electronic device 90, the length W1 of the region A having low flexibility that overlaps with the external connection electrode is set to be the shortest in the region A. It is preferable that the length W3 of the region A is longer than the length W4 of the region B, which is closest to the region A and has low flexibility. 1. The length W3 of the region B and the length W2 of the region C with low flexibility that is farthest from the region A, It is preferable that the length W1 be the longest and the length W2 be the second longest.

[0347] Similarly, in the electronic device shown in FIG. 25(B), among the lengths W1 to W4, the length W1 is the shortest. Length W3 and length W4 are the shortest. may have different values.

[0348] In the electronic device shown in FIG. 25(C), the length W1 is the longest among the lengths W1 to W5. Length W2 is the second longest, and lengths W3, W4, and W5 are the shortest. , length W4, and length W5 may each have a different value.

[0349] The support panel is provided on at least one of the display surface side and the surface side opposite to the display surface of the display panel. can be done.

[0350] The support panels 95a and 95b are provided on the display surface side and the surface opposite to the display surface of the display panel. When both sides have support panels, the display panel is sandwiched between the pair of support panels, This is preferable because it increases the mechanical strength of the less flexible area and makes the electronic device 90 less susceptible to damage.

[0351] The highly flexible region E1 and the less flexible region E2 are different from the display panel and the support panel. It is preferable that a highly flexible protective layer is provided on top of the electronic device 90. The highly flexible region E1 is a region that has flexibility and high mechanical strength, and the electronic device 90 Therefore, the flexible area as well as the less flexible area can be made more resistant to breakage. The electronic device 90 is configured to be resistant to deformation caused by external force, etc., even in a highly sensitive region. can be done.

[0352] For example, the thickness of the display panel, the support panel, and the protective layer is the thickest. It is preferable that the display panel is the thinnest. Alternatively, for example, the display panel, the support panel, the protection panel, etc. The flexibility of each of the layers is such that the support panel is the least flexible and the display panel is the most flexible. By adopting such a configuration, it is possible to separate the highly flexible region and the less flexible region. The difference in flexibility between the two regions becomes large. This can prevent bending in areas with low flexibility, thereby improving the reliability of electronic devices. It also prevents electronic devices from bending unintentionally.

[0353] When a protective layer is provided on both the display surface side and the surface side opposite to the display surface of the display panel, a pair of protective layers is formed. The display panel is sandwiched between layers, which increases the mechanical strength of the electronic device and makes it easier to use. This is preferable as it is less likely to break.

[0354] In this embodiment mode, an example in which the conductive layer 73 functions as a protective layer is shown. By connecting the support panel 95b and a battery, a constant potential is applied.

[0355] For example, as shown in FIG. 24(A) and FIG. 27, in the region E2 having low flexibility, the protective layer 9 3 and the conductive layer 73 are located between a pair of support panels 95a and 95b, and the touch panel 300 is preferably located between the protective layer 93 and the conductive layer 73 .

[0356] If a protective layer is provided only on the display surface side or the surface side opposite to the display surface of the display panel, the electronic device 90 For example, the protective layer 93 is not used, and the conductive The electronic device 90 may include only the layer 73 .

[0357] Furthermore, if the protective layer 93 on the display surface side of the display panel is a light-shielding film, the non-display area of ​​the display panel may be This can prevent external light from being irradiated. This is preferable because it can suppress light deterioration of transistors and the like.

[0358] By providing the touch panel 300 with a portion that is not fixed to the conductive layer 73, the electronic device 9 When bending or unfolding the touch panel 300, the relative position of at least a portion of the touch panel 300 changes. , changes with respect to the conductive layer 73. In addition, since a neutral plane can be formed in the touch panel 300, Therefore, it is possible to prevent force from being applied to the touch panel 300 and damage to the touch panel 300.

[0359] The protective layer and the support panel can be made of plastic, metal, alloy, rubber, etc. By using plastic or rubber, a lightweight, damage-resistant protective layer or support panel can be obtained. For example, the protective layer 93 may be made of silicone rubber, and the conductive layer 73 may be made of conductive material. Stainless steel or aluminum can be used for the film and support panel. For example, a film made by laminating ITO and PET films can be used. can.

[0360] It is also preferable to use a highly tough material for the protective layer and the support panel. It is possible to realize electronic devices that are highly resistant to impact and are difficult to break. For example, resin and thin metal materials By using aluminum or alloy materials, it is possible to realize electronic devices that are lightweight and resistant to breakage. For the same reason, it is preferable to use a highly tough material for the substrate that constitutes the display panel. stomach.

[0361] The protective layer and support panel located on the display surface side are The protective layer or the support panel located on the display surface side is transparent to at least a part of the display. When the display area overlaps with the display area, it is preferable to use a material that transmits light emitted by the light emitting element. The light transmittance of the protective layer and support panel located on the surface opposite to the surface does not matter.

[0362] When bonding any two of the protective layer, support panel, and display panel together, various adhesives are used. For example, resins that harden at room temperature, such as two-component mixed resins, photo-curable resins, Resins such as thermosetting resins can be used. Also, sheet-type adhesives can be used. In addition, screws that penetrate two or more of the protective layer, support panel, and display panel, or clamping screws, Each component of the electronic device may be fixed using pins, clips, etc. The rod 300 has a portion that is not fixed to the conductive layer 73 .

[0363] The electronic device 90 has one display panel (one display area) divided into two parts, each separated by a folded part. For example, you can collapse it to hide the hidden area and expose the exposed area. This reduces the power consumed by areas not in use by the user. It is possible.

[0364] The electronics 90 includes sensors to determine whether each highly flexible region is folded. For example, a switch, a MEMS pressure sensor, a pressure sensor, or the like may be used. It can be configured as follows.

[0365] In the electronic device 90, one display panel can be folded one or more times. The radius of curvature can be, for example, 1 mm or more and 150 mm or less.

[0366] 28(A) to 28(D) show examples of wrist-worn electronic devices and wristwatch-type electronic devices. An example in which a touch panel 300 (see FIGS. 14 and 15) is used as the display panel will be described below. vinegar.

[0367] There is no particular limitation on how to use the electronic device of one embodiment of the present invention. It can be used as a part of the body such as an arm, waist, or leg, or as a robot (factory robot, humanoid robot, etc.). It can also be attached to poles (building poles, utility poles, sign poles), tools, etc. good.

[0368] FIG. 28(A) shows a top view of a wrist-worn electronic device 60. A cross-sectional view of the touch panel 30 along the line XY is shown in FIG. The arrow indicates the direction in which light emitted from the light emitting element 0 is extracted.

[0369] The electronic device 60 has a housing 61 and a band 65. Inside the housing 61, a touch panel 300, a conductive layer 73, a circuit, a power storage device 67, etc. The housing 61 and the band 65 are connected. The housing 61 and the band 65 may be connected in a detachable manner.

[0370] The touch panel 300 has a conductive layer 390 shown in FIG. 3 and is applied with a constant potential. The conductive layer 73 may be connected to the power storage device 67 or the housing 61. For example, The layer 73 is electrically connected to the GND line of the housing 61 or the battery, and thus serves as the GND voltage. The rank is given.

[0371] The conductive layer 73 may function as a shield for electrostatic shielding of the power storage device 67. It is suitable as a shield for secondary batteries (solid-state batteries, etc.) that do not require an exterior body. 3 may function as a shield for electrostatic shielding of various sensors included in the electronic device 60. stomach.

[0372] The band may be a belt-like band or a chain-like band.

[0373] FIG. 28(C) is an example having a chain-like band 68. In FIG. 28(C), a circular housing 6 1 shows a wrist-worn electronic device having a circular display area 81.

[0374] The band to be worn on the arm etc. is made of one or more materials such as metal, resin, or natural material. The metals used include stainless steel, aluminum, and titanium alloys. In addition, acrylic resin, polyimide resin, etc. can be used as the resin. In addition, natural materials such as wood, stone, bone, leather, paper, and processed cloth can be used. It is possible.

[0375] FIG. 28(D) shows an example of a wristwatch-type electronic device. The electronic device 7800 has a band 7801. , a display unit 7001, an input / output terminal 7802, an operation button 7803, etc. The electronic device 7800 has a flexible battery. The battery 7805 can be mounted on the display unit 7001 and the band 7002. It may be arranged overlapping with 801.

[0376] The band 7801, the display portion 7001, and the battery 7805 are flexible. The electronic device 7800 can be easily bent into a desired shape.

[0377] The electronic device 7800 can be used as a portable information terminal.

[0378] The operation button 7803 is used to set the time, turn the power on and off, and turn wireless communication on and off. It has various functions such as operation, silent mode activation and deactivation, power saving mode activation and deactivation, etc. For example, the operating system embedded in the electronic device 7800 The functions of the operation buttons 7803 can be freely set by the system.

[0379] In addition, by touching an icon 7804 displayed on the display unit 7001 with a finger or the like, the application You can launch the application.

[0380] The electronic device 7800 is also capable of performing standardized short-range wireless communication. For example, by communicating with a wireless headset, you can make hands-free calls. You can also do this.

[0381] The electronic device 7800 may also have an input / output terminal 7802. If the device has a connector, it can directly exchange data with other information terminals via the connector. Charging can also be performed via the input / output terminal 7802. Charging may be performed by contactless power transmission without using a power supply.

[0382] 29(A), (B), (C1), (C2), (D), and (E) show a curved display unit 700. 7 shows an example of an electronic device having a display unit 7000. The display surface of the display unit 7000 is curved, and The display can be made along the curved display surface. It's fine.

[0383] The display portion 7000 is manufactured using the display device of one embodiment of the present invention.

[0384] According to one aspect of the present invention, an electronic device having a curved display portion in which display defects are reduced can be provided. Cut.

[0385] An example of a mobile phone is shown in FIG. 29A. The mobile phone 7100 includes a housing 7101, a display unit 7000, operation button 7103, external connection port 7104, speaker 7105, microphone 7 It has 106 etc.

[0386] A mobile phone 7100 shown in FIG. 29A includes a touch sensor in a display portion 7000. All operations, such as talking or entering text, can be performed by touching the display with your finger or a stylus. This can be done by touching 7000.

[0387] In addition, by operating the operation button 7103, the power can be turned on and off, and the display unit 7000 can be You can change the type of image displayed. For example, from the email creation screen, you can change the main image. You can switch to the menu screen.

[0388] FIG. 29B shows an example of a television device. The television device 7200 includes a housing 72 The display unit 7000 is built into the housing 72. This shows a configuration that supports 01.

[0389] The television device 7200 shown in FIG. 29B is operated by an operation switch provided in the housing 7201. This can be done by a separate remote control 7211 or the display unit 700. The display unit 7000 may be provided with a touch sensor, and the operation may be performed by touching the display unit 7000 with a finger or the like. The remote control unit 7211 displays the information output from the remote control unit 7211. The remote control 7211 may have an operation key or a touch panel. The channel and volume can be controlled by the control panel, and the image displayed on the display unit 7000 can be controlled by the control panel. You can manipulate the statue.

[0390] The television device 7200 is configured to include a receiver, a modem, etc. It is possible to receive more general television broadcasts. It is also possible to receive wired or wireless signals via a modem. By connecting to a communication network, it is possible to communicate in one direction (from sender to receiver) or two directions ( It is also possible to communicate information between a sender and a receiver, or between receivers.

[0391] Examples of portable information terminals are shown in Figures 29(C1), (C2), (D), and (E). The terminal includes a housing 7301 and a display portion 7000. Further, an operation button, an external connection port, The display unit 7000 may include a speaker, a microphone, an antenna, a battery, etc. The mobile information terminal is operated by touching the display 7000 with a finger or a stylus. This can be done by touching the

[0392] FIG. 29(C1) is a perspective view of the portable information terminal 7300, and FIG. 29(C2) is a perspective view of the portable information terminal 7300. FIG. 29(D) is a perspective view of the mobile information terminal 7310. 29(E) is a perspective view of the portable information terminal 7320.

[0393] The mobile information terminals 7300, 7310, and 7320 are used for displaying characters and images. Information can be displayed on multiple surfaces, for example, as shown in Figure 29 (C1) and (D). As shown, three operation buttons 7302 are displayed on one side, and information 7303 shown as a rectangle is displayed on the other side. In Figures 29(C1) and 29(C2), information is displayed on the top side of the mobile information terminal. 29(D) shows an example in which information is displayed on the side of the mobile information terminal. In addition, information may be displayed on three or more surfaces of the mobile information terminal. 04, information 7305, and information 7306 are displayed on different sides.

[0394] Examples of such information include notifications from social networking services (SNS), Displays notifying you of incoming e-mails, phone calls, etc., the subject or sender name of e-mails, etc., Date and time, battery level, antenna reception strength, etc. Instead of information, operation buttons, icons, etc. may be displayed at the position where the information is displayed.

[0395] For example, the user of the mobile information terminal 7300 may carry the mobile information terminal 7300 in the breast pocket of his / her clothes. When it is stored, the display (information 7303 in this example) can be confirmed.

[0396] Specifically, the telephone number or name of the caller of the incoming call is displayed on the mobile information terminal 7300. The user takes the mobile information terminal 7300 out of his pocket and You can check the display and decide whether to answer the call without having to pick up the phone.

[0397] 29(F) to (H) show an example of an illumination device having a curved light-emitting portion.

[0398] The light-emitting portion of each of the lighting devices shown in FIGS. 29(F) to 29(H) is a display device according to one embodiment of the present invention. It is produced using

[0399] According to one aspect of the present invention, it is possible to provide a lighting device having a curved light-emitting portion in which light emission defects are reduced. Cut.

[0400] The lighting device 7400 shown in FIG. 29(F) includes a light-emitting unit 7402 having a wavy light-emitting surface. This makes it a highly designed lighting device.

[0401] The light-emitting portion 7412 of the lighting device 7410 shown in FIG. 29(G) has two convexly curved The light emitting units are arranged symmetrically. It can illuminate the direction.

[0402] The lighting device 7420 shown in FIG. 29(H) has a light-emitting portion 7422 that is curved in a concave shape. Therefore, in order to collect light emitted from the light emitting portion 7422 onto the front surface of the lighting device 7420, It is suitable for brightly lighting an area.

[0403] In addition, the light-emitting units of the lighting devices 7400, 7410, and 7420 The light emitting unit may be fixed by a member such as a plastic member or a movable frame. The light emitting surface of the light emitting portion may be configured to be freely curved depending on the application.

[0404] The lighting device 7400, the lighting device 7410, and the lighting device 7420 each have an operation switch. The light emitting unit has a base 7401 having a light emitting element 7403 and a light emitting element supported by the base 7401.

[0405] Here, the illumination device in which the light emitting unit is supported by the base is exemplified. The housing can be fixed to the ceiling or can be hung from the ceiling. The surface can be curved, so the light-emitting surface can be curved concavely to brighten a specific area. It can also be used to illuminate a room, or the light-emitting surface can be curved convexly to brightly illuminate an entire room.

[0406] A flexible display device according to one embodiment of the present invention is used to fold a display portion (see FIG. 23). It is also possible to create electronic devices other than electronic devices.

[0407] 30(A) to 30(D) show an example of a portable information terminal having a flexible display portion 7001. show.

[0408] FIG. 30(A) is a perspective view showing an example of a portable information terminal, and FIG. 30(B) is a perspective view showing an example of a portable information terminal. The mobile information terminal 7500 includes a housing 7501, a display unit 7001, and a side view of an example of the mobile information terminal. , a drawer member 7502, an operation button 7503, etc.

[0409] The portable information terminal 7500 includes a flexible display unit 7 wound in a roll shape in a housing 7501. 001.

[0410] In addition, the mobile information terminal 7500 can receive video signals using a built-in control unit. The portable information terminal 7500 can display the image on the display unit 7001. The housing 7501 is also provided with a terminal section for connecting a connector, and the video signal Alternatively, the signal and power may be supplied directly from the outside via a wire.

[0411] In addition, the operation button 7503 can be used to turn the power on and off and to switch the displayed image. 30(A) to 30(C), the side of the mobile information terminal 7500 7503 is arranged in the mobile information terminal 7500. It may be placed on the same surface as the display surface (front surface) or on the back surface.

[0412] FIG. 30C shows the portable information terminal 7500 with the display portion 7001 pulled out. In this state, an image can be displayed on the display unit 7001. The display unit 7001 is in the rolled state shown in FIG. 30(A) and is pulled out by a pull-out member 7502. The portable information terminal 7500 is configured to display different images when it is in the pulled-out state shown in FIG. 30(C) or when it is in the unfolded state shown in FIG. For example, in the state shown in FIG. 30A, the display unit 7001 may be wound in a roll. By hiding the part, the power consumption of the mobile information terminal 7500 can be reduced.

[0413] The display unit 7001 is fixed so that the display surface of the display unit 7001 is flat when the display unit 7001 is pulled out. To secure the display unit 7001 in place, a reinforcing frame may be provided on the side of the display unit 7001.

[0414] In addition to this configuration, a speaker is provided on the housing, and the sound is transmitted by the audio signal received together with the video signal. The audio may be output by the audio input.

[0415] An example of a flexible portable information terminal is shown in FIG. 30(D). The device has a housing 7701 and a display portion 7001. It also has a button 7703a as an input means, 7703b, speakers 7704a and 7704b as audio output means, and an external connection port 77 05, a microphone 7706, etc. The portable information terminal 7700 may be flexible. The battery 7709 may be mounted on the display unit 70. It may be placed on top of 01.

[0416] The housing 7701, the display portion 7001, and the battery 7709 are flexible. The portable information terminal 7700 can be bent into a desired shape or twisted. For example, the display portion 7001 of the portable information terminal 7700 can be mounted on the inside or outside. Alternatively, the mobile information terminal 7700 can be folded to the side. In this way, the housing 7701 and the display unit 700 can be used in a rolled-up state. Since the mobile information terminal 7700 can freely deform, if it is dropped, Another advantage is that it is less likely to be damaged even if an unintended external force is applied.

[0417] In addition, since the portable information terminal 7700 is lightweight, the upper part of the housing 7701 can be held with a clip or the like. Or, the housing 7701 can be fixed to the wall with a magnet or the like. It can be conveniently used in a variety of situations.

[0418] FIG. 31(A) shows the exterior of the automobile 9700. FIG. 31(B) shows the driver's seat of the automobile 9700. The automobile 9700 includes a body 9701, wheels 9702, a dashboard 9703, a light fixture, and a The display device of one embodiment of the present invention is used for a display portion of an automobile 9700 or the like. For example, the display portions 9710 to 9715 shown in FIG. A display device according to one aspect of the invention can be provided.

[0419] The display portion 9710 and the display portion 9711 are display devices provided on a windshield of an automobile. In the display device of one embodiment of the present invention, electrodes and wirings are formed using a light-transmitting conductive material. This allows the opposite side to be seen through, creating a so-called see-through state. If the display unit 9710 and the display unit 9711 are in a see-through state, the display unit 9710 and the display unit 9711 can be used even when driving the car 9700. Therefore, the display device of one embodiment of the present invention can be mounted on the front of the automobile 9700. It can be installed on windshields. When providing the above, organic transistors using organic semiconductor materials or oxide semiconductors are used. A light-transmitting transistor such as a light-transmitting transistor may be used.

[0420] The display unit 9712 is a display device provided in a pillar part. By displaying an image from the imaging means on the display unit 9712, the view blocked by the pillars can be compensated for. The display unit 9713 is a display device provided in the dashboard. For example, an image captured by an imaging means provided on the vehicle body is displayed on the display unit 9713. This allows the driver to compensate for the obstructed view of the dashboard. By projecting images from the installed imaging means, blind spots can be compensated for and safety can be improved. In addition, by projecting images that complement the invisible parts, it is possible to make the sense of incongruity appear more natural. Safety checks can be performed without any hassle.

[0421] FIG. 31(C) shows the interior of a car with bench seats for the driver and passenger seats. The display unit 9721 is a display device provided in the door section. By displaying the image from the imaging means on the display unit 9721, the view blocked by the door can be cleared. The display unit 9722 is a display device provided on the handle. The display unit 9723 is a display device provided in the center of the seat surface of the bench seat. The display device is installed on the seat or backrest, and the heat generated by the display device is It can also be used as a seat heater using the heat source.

[0422] The display unit 9714, the display unit 9715, or the display unit 9722 displays navigation information, odometer, tachometer, mileage, fuel level, gear status, air conditioning settings, etc. It is possible to provide various information. In addition, it is possible to change the display items and layout displayed on the display unit. The above information can be displayed on the display unit 9. 710 to 9713, 9721, and 9723. In addition, the display units 9710 to 9715 and the display units 9721 to 9723 are illuminated. The display units 9710 to 9715 and the display unit The display portions 9721 to 9723 can also be used as a heating device.

[0423] The display unit to which the display device of one embodiment of the present invention is applied may be flat. The display device of this embodiment may not have a curved surface or flexibility. By applying the display device, it is possible to reduce the weight and thickness of electronic devices.

[0424] The portable game machine shown in FIG. 31(D) includes a housing 9801, a housing 9802, a display portion 9803, Display unit 9804, microphone 9805, speaker 9806, operation keys 9807, It has Iras 9808 etc.

[0425] The portable game machine shown in FIG. 31(D) has two display portions (display portion 9803 and display portion 9804). Note that the number of display units included in the electronic device of one embodiment of the present invention is not limited to two. It may be one or three or more. When an electronic device has multiple display units, at least Each display unit includes the display device of one embodiment of the present invention.

[0426] FIG. 31(E) shows a notebook personal computer, which includes a housing 9821, a display portion 9822, and a , a keyboard 9823, a pointing device 9824, and the like.

[0427] This embodiment mode can be combined with other embodiment modes as appropriate. [Example]

[0428] In this example, a display device of one embodiment of the present invention is manufactured and the results of display are described. .

[0429] The display device of this embodiment will be described with reference to FIG. 6(B). The display panel 10 is a top-emission touch panel using a color filter method. The touch panel includes a light-emitting element and a touch sensor between a pair of flexible substrates. The thickness of the display panel 10 is 100 μm or less. It can be bent either inwards or outwards.

[0430] The display panel 10 is manufactured by the same method as in the first structural example described in the second embodiment, using two manufacturing substrates. After forming a peelable layer on each substrate, the two substrates are bonded together and then peeled off. The layer to be peeled was transferred between a pair of flexible substrates. A resin film was used for the flexible substrate 51 and the flexible substrate 57. Transistor The semiconductor material used was CAAC-OS. The light-emitting element used was an organic EL element. For 71, a titanium film with a thickness of 50 nm was used.

[0431] A conductive film was placed under the display panel 10. The conductive film had a thickness of 127 μm. The ITO film has a thickness of 100 nm on a PET film of 100 mm. Equivalent.

[0432] 32(A) and (B) show the conductive film placed on the housing. A conductor 74 (copper foil tape) is connected to the conductive layer 73. The connection portion 74 is provided at a position that does not overlap with the display panel 10. The conductor 74 is soldered with a conductor wire. The conductive wire is routed to the GND of the power supply. By contacting the conductive layer 71 of 0, the conductive layer 71 can be given a GND potential.

[0433] 32(C) shows a photograph of the back surface (the surface opposite to the display surface) of the display panel 10. Conductive layer The conductive layer 71 is provided on the flexible substrate 51. The conductive layer 71 is a layer that covers the display area of ​​the display panel 10. They overlap and are formed in an area wider than the display area.

[0434] 33(A) and (B) show photographs of the display device. In the device, the display panel 10 can be folded into three by the housing, and the radius of curvature at that time is The display panel 10 is provided with a conductive layer 73 and a conductive layer 71 so that the conductive layer 71 is in contact with the conductive layer 73. As shown in Figures 33(A) and (B), the surface of this example The display device can provide good display in both the unfolded and bent states. Even when the conductive layer 71 was formed on the rear surface of the display panel 10, no display problems occurred. Furthermore, even if the display panel 10 is touched or bent, the display is not affected. It was.

[0435] In this embodiment, a conductive layer 71 is provided on the rear surface of the display panel 10, and a GND potential is applied to the conductive layer 71. This allows the thickness of the display panel 10 to be thin enough to allow repeated bending and stretching. Even if the display panel 10 is turned on, it is difficult for the display panel 10 to receive external noise, and a good display can be achieved. In addition, since the conductive layer 71 and the conductive layer 73 are not fixed, the flexible display panel 10 In addition, the connection between the conductive layer 73 and the conductor 74 is prevented from being deteriorated. By providing the connection portion at a position where it does not overlap with the display area, a step due to the connection portion does not occur in the display area, and the display quality is improved. The decline was suppressed. [Explanation of symbols]

[0436] 10 Display panel 11 First Wire 12 Second wiring 13 Third Wire 14 Fourth Wire 15 The fifth wire 16 Display panel 19 Wiring 20 Layer containing transistors 21 Conductive layer 22 areas 22A area 22B area 22C area 22D area 31 Light-emitting element 32 transistors 33 Transistor 34 Capacitor element 39 capacity 41 electrode 43 EL layer 45 electrode 51 Flexible substrate 53 Insulating layer 55 Adhesive layer 57 Flexible substrate 60 Electronic equipment 61 Case 65 bands 67 Energy storage device 68 bands 71 Conductive layer 72 Device Layer 73 Conductive Layer 73a Conductive layer 73b Conductive layer 74 Conductor 74a Conductor 74b Conductor 81 Display area 82 Scanning line driving circuit 83 FPC 84 IC 90 Electronic equipment 93 Protective layer 95a Support Panel 95b Support panel 98 Case 99 fingers 300 touch panel 301 Transistor 302 Transistor 303 Transistor 304 Light-emitting element 305 Capacitor 306 Connection 307 Conductive Layer 308 Connection 309 Connections 310 Input Device 311 Gate insulating layer 312 Insulating layer 313 Insulating Layer 314 Insulating Layer 315 Insulating Layer 316 Spacer 317 Adhesive layer 318 Input Device 319 Connections 320 Touch Panel 321 Electrode 322 EL layer 323 Electrode 324 Optical adjustment layer 325 Colored layer 326 Light blocking layer 326a Light blocking layer 326b Light blocking layer 327 Insulating Layer 328 Insulating Layer 330 Flexible substrate 331 Electrode 332 Electrode 333 Electrode 334 Electrode 341 Wiring 342 Wiring 347 areas 348 areas 349 areas 350 FPC 351 IC 355 Conductive Layer 370 Display Panel 371 Flexible substrate 372 Flexible substrate 373 FPC 374 IC 375 Adhesive layer 376 Insulating Layer 377 Adhesive layer 378 Insulating Layer 379 Display Panel 380 Conductive Layer 381 Display section 382 Drive circuit section 383 Wiring 385 Connection 386 Connectors 387 Intersection 390 Conductive Layer 391 Adhesive layer 392 Flexible substrate 393 Insulating Layer 395 Insulating Layer 396 Adhesive layer 398 Peel-off film 399 Peel-off film 401 Fabricated substrate 403 Peeling layer 411 Fabrication substrate 413 Peeling layer 723 Back Gate 728 Insulation Layer 729 Insulation Layer 742 Semiconductor layer Gate 743 744a conductive layer 744b Conductive layer 747a aperture 747b aperture 747c aperture 747d aperture 772 Insulation Layer 848 transistors 7000 Display 7001 Display section 7100 Mobile Phone 7101 Housing 7103 Operation button 7104 External connection port 7105 Speaker 7106 Microphone 7200 Television Equipment 7201 Case 7203 Stand 7211 Remote control device 7300 Mobile Information Terminal 7301 Housing 7302 Operation button 7303 Information 7304 Information 7305 Information 7306 Information 7310 Mobile Information Terminals 7320 Mobile Information Terminal 7400 Lighting Equipment 7401 Daibu 7402 Light-emitting part 7403 Operation switch 7410 Lighting equipment 7412 Light-emitting part 7420 Lighting equipment 7422 Light-emitting part 7500 Mobile Information Terminal 7501 Case 7502 Materials 7503 Operation button 7600 Electronic equipment 7601 Case 7602 Hinge 7650 Electronic equipment 7651 Hidden part 7700 Personal Digital Assistant 7701 Housing 7703a Button 7703b Button 7704a Speaker 7704b Speaker 7705 External connection port 7706 Mike 7709 Battery 7800 Electronic equipment 7801 band 7802 Input / output terminal 7803 Operation button 7804 Icons 7805 Battery 9700 Automobiles 9701 Body 9702 wheels 9703 Dashboard 9704 Light 9710 Display section 9711 Display section 9712 Display section 9713 Display section 9714 Display section 9715 Display section 9721 Display section 9722 Display section 9723 Display section 9801 Case 9802 Case 9803 Display section 9804 Display section 9805 Microphone 9806 Speaker 9807 Operation key 9808 Stylus 9821 Case 9822 Display section 9823 Keyboard 9824 Pointing Device

Claims

[Claim 1] a display panel and a first conductive layer; the display panel is flexible; the display panel includes a flexible substrate, a transistor, a light-emitting element, and a second conductive layer; the transistor and the light-emitting element are each located on the flexible substrate; The light-emitting element includes a first electrode on the flexible substrate, a layer containing a light-emitting substance on the first electrode, and a second electrode on the layer containing the light-emitting material, the first electrode is electrically connected to the source or drain of the transistor; A constant potential is applied to the second electrode; the transistor and the light-emitting element are each electrically insulated from the second conductive layer; and each overlapping the second conductive layer via the flexible substrate; the second conductive layer has a portion in contact with the first conductive layer and a portion not fixed to the first conductive layer; A display device, wherein a constant potential is supplied to the first conductive layer.

Images