UTG diaphragm speaker and microphone

Abstract

To provide a speaker and a microphone having a UTG diaphragm.SOLUTION: The UTG diaphragm speaker includes: a magnetic assembly for generating a magnetic flux; a diaphragm 100 including UTG glass and having a thickness of 0.01 to 0.1 mm; and a voice coil disposed to correspond to the diaphragm 100, the voice coil cooperating with the magnetic assembly to generate a driving force to vibrate the diaphragm 100. The thickness of the diaphragm is reduced to as thin as 0.01 mm. The diaphragm 100 includes at least one of an upper layer film 110 and a lower layer film 150.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to speakers and microphones, and more particularly to UTG diaphragm speakers and microphones. [Background technology]

[0002] A speaker is a device that converts electrical signals into sound, and has a history of development spanning over 100 years since the 19th century. Audio signal output devices, such as typical speakers and earphones, have a diaphragm structure inside. When an audio signal is output, the diaphragm structure vibrates, achieving the effect of audio transmission. To ensure that the diaphragm structure can vibrate effectively in response to audio signals of different frequencies, it is optimal to select a material for the diaphragm structure that has high rigidity, low density, and appropriate damping characteristics.

[0003] Generally, a speaker mainly consists of a magnet, a coil corresponding to the magnet, and a diaphragm. It also usually includes other supporting members, such as a diaphragm surround, a spider or suspension, and a frame. The speaker uses an alternating current in the coil and a magnetic field to generate vibrations in the diaphragm based on the interaction of Fleming's law. Because sound transmission and absorption (attenuation) are frequency-related and nonlinear, sound is generated based on the vibration of the diaphragm. Therefore, the characteristics of the diaphragm, such as its material, manufacturing method, and shape, affect the quality of the speaker. Summary of the Invention [Problem to be solved by the invention]

[0004] With the rapid development of electronic information technology, more and more sound generating devices are being applied to various electronic products. In particular, for the widely used portable communication devices, not only are miniaturization and multi-functions of the devices attracting attention, but high quality sound effects and distortion-free sound are also required. Meanwhile, as a core component of the sound generating device, the quality of the diaphragm design has a direct impact on the performance of the sound generating device. [Means for solving the problem]

[0005] According to an aspect of the present invention, there is provided a UTG diaphragm speaker including a magnetic assembly that generates magnetic lines of force, a diaphragm used to emit sound, the diaphragm including UTG glass and having a thickness of 0.01 to 0.1 mm, and a voice coil disposed corresponding to the UTG diaphragm and cooperating with the magnetic assembly to generate a driving force to vibrate the UTG diaphragm. The UTG diaphragm speaker further includes a surround that joins the diaphragm to a frame.

[0006] UTG manufacturing methods can be divided into one-shot and two-shot methods. For one-shot manufacturing, a non-contact, continuous slit downdraw process can be used, which can consistently produce thicknesses of 30 micrometers or less. An overflow downdraw process can also be used. This eliminates external contact throughout the process, resulting in a flat, clean glass plate surface, eliminating the need for grinding or polishing. To successfully draw ultra-thin glass, the viscosity of the raw material and the drawing speed must be precisely controlled, and thickness variations, breakage, and even fractures during the glass drawing process must be avoided. UTG diaphragms can be made of, for example, but not limited to, aluminosilicate, borosilicate, aluminoborosilicate, soda lime, or other suitable glasses. In some embodiments, the UTG layer is formed by forming a raw glass sheet into the UTG layer 130 through a unit cutting and thinning process.

[0007] In another embodiment, the diaphragm includes at least an upper or lower film having a thickness of 1 micrometer to 15 micrometers. The upper or lower film is made of aluminum, nickel, copper, diamond, resin, or polymer. The UTG diaphragm is a planar UTG diaphragm or a three-dimensional UTG diaphragm. UTG diaphragm shapes include a flat elongated shape, a flat rectangular shape, a flat circular shape, a flat elliptical shape, a flat oval shape, a 3D elongated shape with a band-like structure, a 3D concave circular shape, a 3D protruding circular shape (dome), a cup shape, a bowl shape, a dome shape, and a pyramidal shape. The UTG diaphragm is applied to audio equipment, earphones, mobile phones, laptops, tablets, and televisions.

[0008] In another embodiment, the UTG diaphragm microphone includes a UTG glass diaphragm. The thickness of the UTG diaphragm is 0.01 to 0.1 mm. The diaphragm includes at least an upper or lower film having a thickness of 1 to 15 micrometers. The upper or lower film is made of aluminum, nickel, copper, diamond, resin, or polymer. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 shows a cross-sectional structural diagram of a diaphragm according to one embodiment of the present invention. [Figure 2A] FIG. 2A shows a schematic cross-sectional view of a diaphragm according to an embodiment of the present invention. [Figure 2B] FIG. 2B shows a schematic cross-sectional view of a diaphragm according to an embodiment of the present invention. [Figure 2C] FIG. 2C shows a schematic cross-sectional view of a diaphragm according to an embodiment of the present invention. [Figure 2D] FIG. 2D shows a schematic cross-sectional view of a diaphragm according to an embodiment of the present invention. [Figure 2E] FIG. 2E shows a diaphragm structure applied to an earphone according to an embodiment of the present invention, including a plan view and a cross-sectional view. [Figure 3A] FIG. 3A shows a schematic diagram of a partial structure of a speaker according to an embodiment of the present invention. [Figure 3B]FIG. 3B shows a schematic diagram of a partial structure of a speaker according to another embodiment of the present invention. [Figure 3C] FIG. 3C shows a schematic diagram of a part of the structure of a loudspeaker according to a further embodiment of the present invention. [Figure 4] FIG. 4 shows a schematic diagram of a UTG diaphragm microphone assembly according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] Here, the present invention will be described in detail with respect to specific embodiments and aspects of the invention. These descriptions are intended to interpret the structure, steps, and flow of the present invention and are for illustrative purposes only, and are not intended to limit the scope of the claims of the present invention. Therefore, in addition to the specific and preferred embodiments described in the specification, the present invention can be widely implemented in other different embodiments. Below, specific embodiments will be described to illustrate the present invention. Those familiar with the art will be able to easily understand the effects and advantages of the present invention from the contents disclosed herein. Furthermore, the present invention can also be implemented and practiced in other specific embodiments. The details described in this specification can be adapted to different needs, and various supplements or modifications can be made without departing from the spirit of the present invention.

[0011] When sound or vibration is transmitted from a first medium to a second medium, energy loss occurs, especially when the two media have different sound velocities or acoustic impedances, even if the two media have the same density. On the other hand, appropriate energy loss is beneficial to the quality of the generated sound. With the rapid development of electronic information technology, more and more sound generating devices are being applied to various electronic products. In particular, for portable communication devices widely used by people, not only are there concerns about miniaturization and multi-functionality, but high-quality sound effects and distortion-free sound are also required. Therefore, in order to apply the diaphragm having the above-mentioned ultra-thin glass to micro-speakers, small speakers, and microphones (e.g., earphones and mobile phone microphones), the thickness of the UTG diaphragm 100 should preferably be controlled to a range of 0.01 to 0.1 mm, as shown in FIG. 1 .

[0012] The present invention provides a speaker having a UTG diaphragm 100. Referring now to FIG. 1, the material used for the UTG diaphragm 100 is UTG homogeneous glass. While ordinary glass is hard and prone to breakage, glass with a thickness of 100 micrometers or less is soft and flexible, making it suitable for use as the diaphragm of the present invention. UTG glass has a thickness of 0.01 to 0.1 mm and is produced using a tempering process to enhance toughness and durability. UTG glass can be manufactured through one-step and two-step molding. For one-step molding, a non-contact slit continuous downdraw method can be used, which can consistently produce thicknesses of 30 micrometers or less. An overflow downdraw method can also be used. This eliminates external contact throughout the process, resulting in a flat and clean glass plate surface, eliminating the need for grinding or polishing. To successfully draw ultra-thin glass, it is necessary to precisely control the viscosity of the raw material and the drawing speed, as well as to avoid uneven thickness, breakage, and even fracture during the glass drawing process. Other key factors include controlling the rollers and pressure used to transport the glass and ensuring surface flatness. In one embodiment, the raw UTG glass plate may be cut during the manufacturing process after it is produced to a total thickness of less than 30 micrometers. The UTG treatment process of the present invention includes the following steps: The UTG material to be treated is immersed in an HF solution for etching. The HF solution has a concentration of 1 to 4 mol / L, and the etching time is 8 to 30 minutes. Next, the acid remaining on the surface is washed away, and the UTG is preheated to 350 to 400°C. The preheated UTG is then immersed in a strengthening solution and annealed. In another embodiment, because CPI (transparent polyimide) has the flexibility of a plastic material, a CPI material may be used and a UTG material may be layered on top of it using a transparent adhesive. In this case, UTG, optical adhesive, CPI, and a curing layer are laminated in this order, with UTG as the bottom layer and supporting the relatively flexible CPI above.

[0013] 1 illustrates the structure of a UTG diaphragm 100. The UTG layer 130 of the UTG diaphragm 100 may be, for example, but not limited to, aluminosilicate, borosilicate, aluminoborosilicate, soda lime, or other suitable glass. In some embodiments, the UTG layer 130 is formed by a unit cutting process using raw glass to form the UTG layer 130, and may also be subjected to a shatter-resistant coating process.

[0014] In some alternative embodiments, the thickness d2 of the UTG layer 130 is preferably approximately 10 to 50 micrometers. According to embodiments of the present invention, the damping of the UTG diaphragm 100 may be enhanced by coating, growing, or sputtering an aluminum, nickel, copper, diamond, resin, or polymer film on part or all of the upper or lower surfaces of the UTG diaphragm 100. In alternative embodiments, after the UTG blank is fabricated, an ultrathin diamond, aluminum, nickel, or copper film is grown during the manufacturing process. This not only modulates the damping but also enhances toughness, and the thickness is less than 50 micrometers. In one embodiment, an ultrathin film, such as a diamond film, may be grown and coated on at least one of the two sides of the UTG layer 130. Each thickness is less than 15 μm, e.g., the upper layer 110 and the lower layer 150. The thickness d1 of the upper layer 110 is preferably approximately 1 to 15 micrometers, and similarly, the thickness d1 of the lower layer 150 is preferably approximately 1 to 15 micrometers. The ultra-thin diamond glass film is grown using a panel manufacturing process, with diamond-level UTG. This eliminates the need for additional chemical strengthening manufacturing processes. It also offers break-resistance, and while its surface is as flexible as paper, it retains diamond-level hardness. The most important feature is its break-resistance.

[0015] As more and more sound generating devices are being applied to various electronic products, the UTG diaphragm 100 of the present invention can be applied to speakers in various electronic devices, including, but not limited to, audio equipment, earphones, mobile phones, laptops, tablets, televisions, etc. The UTG diaphragm of the present invention can also be applied to diaphragms in microphones in mobile communication devices. According to an embodiment of the present invention, the manufacturing method of the UTG diaphragm 100 includes manufacturing using fusion drawing technology. Based on the above structure, the present invention eliminates the need for chemical treatment to enhance toughness or etching to reduce thickness. Furthermore, it is not necessary to process the diaphragm layer by layer. In another aspect, using the above-described diaphragm structure and material properties, an embodiment of a new diaphragm provided by the present invention will be described based on the cross-sectional shape of the diaphragm.

[0016] Please refer to FIGS. 2A-2D, which are schematic diagrams of cross sections based on an embodiment of the present invention. These are completed using the technique shown in FIG. 1. The cross-sectional shape of a diaphragm manufactured using the above structure can be various shapes, such as the flat, planar UTG diaphragm 200a shown in FIG. 2A, the dome-shaped UTG diaphragm 200b shown in FIG. 2B, and the dome-shaped UTG diaphragms (200c, 200d) with added blade structures shown in FIGS. 2C-2D. Therefore, the planar shapes manufactured using the above structure can be circular, rectangular, oval, oblong, etc. Furthermore, three-dimensional shapes include cup-shaped, bowl-shaped, dome-shaped, pyramidal, etc.

[0017] FIG. 2E shows a UTG diaphragm 200e applied to earphones, including a plan view and a cross-sectional view. The UTG diaphragm 200e includes a central dome region 200-1 and a surround 200-2 surrounding the central dome region 200-1. The annular folds of the surround 200-2 may be grooves of different shapes. In one embodiment, multiple grooves form a spiral radial pattern. Based on the principle of energy conversion, the position where the diaphragm receives force is the position of the coil, and the edges of the diaphragm are suspended from the frame. The amount of vibration of the diaphragm relative to the gas significantly affects the amount of low-frequency waves. Therefore, the annular region, the surround 200-2, generally needs to have sufficient flexibility to allow large deformation, while also having a certain degree of elasticity to allow the diaphragm to return to its original position. The design of the dome region described above aims to reduce high-frequency distortion associated with split vibration by improving the rigidity of the diaphragm in this area. On the other hand, the corrugated area around the periphery of the diaphragm requires a certain degree of flexibility and elasticity, and prevents the amplification of sound waves by the spiral radial corrugations or groove-like structure.

[0018] Please refer to FIG. 3A, which is a schematic diagram of a portion of the structure of a speaker according to one embodiment of the present invention. The planar UTG diaphragm 200a shown in FIG. 2A can be used for the speaker 30a. FIG. 3A shows the relative positional relationship between the planar diaphragm 200a and other components of the speaker 30a. As shown in FIG. 3A, the speaker 30a mainly includes a yoke 300 serving as a bottom plate, a top plate 310, a permanent magnet 320, a frame 330, a surround 340, a surround ring 340a, a voice coil 350, and the UTG diaphragm 200a. The UTG diaphragm 200a covers the permanent magnet 320. The UTG diaphragm 200a does not contact any stationary parts of the speaker 30a, such as the yoke 300, top plate 310, permanent magnets 320, and frame 330, but only contacts the moving parts of the speaker, such as the surround 340. There is also an air gap 360 between the yoke 300 and the frame 330.

[0019] According to an embodiment of the present invention, the permanent magnet 320 is an annular magnet disposed inside the voice coil 350. The upper plate 310 also has a similar annular shape to the permanent magnet 320. The permanent magnet 320 is disposed within a U-shaped yoke 300 having a through-hole at the bottom. The permanent magnet 320 and the upper plate 310 also have hollow portions aligned with the yoke 300. This configuration reduces the weight of the speaker assembly and provides a vent for airflow behind the speaker. According to an embodiment of the present invention, the planar diaphragm 200a is coupled to the frame 330 via a surround 340 and a surround ring 340a. The surround 340 is an elastic film that can vibrate together with the coupled planar diaphragm 200a. The surround ring 340a can be used to position the surround 340.

[0020] FIG. 3B is a schematic diagram of a partial structure of a speaker according to another embodiment of the present invention. Speaker 30b uses UTG diaphragm 200d with a dome-shaped blade structure as shown in FIG. 2D. FIG. 3B shows the relative positional relationship between the dome-shaped blade structure diaphragm 200d and other components of speaker 30b. As shown in FIG. 3B, speaker 30b mainly includes a yoke 300 serving as a bottom plate, an upper plate 310, a permanent magnet 320, a frame 330, a surround 340, a surround ring 340a, a voice coil 350, and a dome-shaped blade structure UTG diaphragm 200d. The dome-shaped blade structure UTG diaphragm 200d completely covers the permanent magnet 320. The dome-shaped UTG diaphragm 200d with a blade structure does not contact the fixed parts of the speaker 30b, such as the yoke 300, the upper plate 310, the permanent magnet 320, and the frame 330, but only the moving parts of the speaker, such as the surround 340 and the voice coil 350. An air gap 360 is provided between the yoke 300 and the frame 330.

[0021] According to an embodiment of the present invention, the UTG diaphragm 200d having a dome-shaped wing structure is coupled to the frame 330 via a surround 340 and a surround ring 340a. The surround 340 is an elastic film that can vibrate together with the UTG diaphragm 200d having a dome-shaped wing structure coupled thereto. The surround ring 340a can also be used to fix the surround 340.

[0022] Similarly, FIG. 3C is a schematic diagram of a portion of a speaker structure according to a further embodiment of the present invention. Speaker 30c uses the dome-shaped, blade-added UTG diaphragm 200d' shown in FIG. 2D. The dome-shaped, blade-added UTG diaphragm 200d' is integrally molded with surround 340. FIG. 3C also shows the relative positional relationship between the dome-shaped, blade-added UTG diaphragm 200d' and other components of speaker 30c. As shown in FIG. 3C, speaker 30c mainly includes a yoke 300 serving as a bottom plate, an upper plate 310, a permanent magnet 320, a frame 330, a surround 340, a voice coil 350, and the dome-shaped, blade-added UTG diaphragm 200d'. The dome-shaped, blade-added UTG diaphragm 200d' completely covers the permanent magnet 320. The UTG diaphragm 200d' having a dome-shaped wing structure does not contact fixed components of the speaker 30c, such as the yoke 300, upper plate 310, permanent magnet 320, and frame 330, but only contacts movable components of the speaker, such as the surround 340 and voice coil 350. The yoke 300 is provided inside the frame 330, and an air gap 360 is formed between the yoke 300 and the frame 330. According to an embodiment of the present invention, the UTG diaphragm 200d' having a dome-shaped wing structure is coupled to the frame 330 via the surround 340. The surround 340 has elasticity.

[0023] 3A to 3C, the vibration assembly of the speakers (30a, 30b, 30c) includes the UTG diaphragm (200a, 200d, 200d'), the surround 340, a frame 330 serving as a support member, and a voice coil 350. In addition to the vibration assembly, the speakers (30a, 30b, 30c) further include a yoke 300, an upper plate 310, a permanent magnet 320, and the frame 330. The yoke 300 is used to accommodate the permanent magnet 320 provided in the hollow center of the voice coil 350 as a magnetic assembly. The upper plate 310 fixes the magnetic assembly to the yoke 300. The voice coil 350 is coupled to the UTG diaphragm (200a, 200d, 200d'). An AC current flows through the voice coil 350, and a driving force is supplied by interaction with the magnetic field lines generated by the permanent magnet 320, causing the UTG diaphragms (200a, 200d, 200d') to vibrate.

[0024] The present invention can be applied to microphone diaphragms. The sound collection principle of both moving coil microphones and condenser microphones is via a diaphragm. The microphone diaphragm receives sound pressure from the front. A coil is connected to the backside, and the coil is wound around a magnet. When sound pressure is received from the front of the diaphragm, the vibration of the diaphragm moves the coil, generating electricity through electromagnetic induction with the magnet. Furthermore, the degree of movement of the diaphragm varies depending on the strength of the sound pressure. Furthermore, the microphone's electrical circuit amplifies the generated current. Furthermore, compared to moving coil microphones, condenser microphones require an additional power source to operate the microphone.

[0025] Referring to FIG. 4, the microphone assembly includes a UTG diaphragm 400. The UTG diaphragm 400 vibrates in response to sound waves and converts their physical kinetic energy into an electronic signal. This vibration generates electromagnetic induction in a coil 410. Typically, a microphone also includes a top iron 420 and a magnet yoke 430. The assembly also includes a surround 440 and a connection terminal head 450. When sound waves enter the microphone, the UTG diaphragm 400 vibrates due to the pressure of the sound waves. According to Faraday's law of electromagnetic induction, the coil 410 connected to the UTG diaphragm 400 generates an induced current in a magnetic field. Ribbon microphones are also a type of moving-coil microphone, but their main difference is that they use a very thin metal plate instead of a diaphragm and coil. The present invention is applicable to the various microphones described above.

[0026] The shape of the UTG diaphragm 400 manufactured using the UTG of the present invention may be various shapes, such as circular, rectangular, elliptical, or oblong. The thickness of the UTG diaphragm 400 in a microphone should preferably be controlled to a range of 0.01 to 0.1 mm. The material used for the UTG diaphragm 400 is UTG homogeneous glass. As mentioned above, fusion drawing technology can be used for UTG glass. Microphones using the UTG diaphragm 400 can be applied to mobile phones, tablets, computers, laptops, game consoles, local telephones, public telephones, vehicles, karaoke, and the like.

[0027] The shape of the diaphragm may be a flat elongated shape, a flat rectangular shape, a flat circular shape, a flat elliptical shape, a flat oblong shape, or a three-dimensional shape including various shapes such as a 3D elongated shape with a band-like structure, a 3D concave circular shape, a 3D protruding circular shape (dome), a cup shape, a bowl shape, a dome shape, a pyramid shape, etc.

[0028] The above description is a preferred embodiment of the present invention. Those skilled in the art should understand that the above is merely illustrative of the present invention and should not be construed as limiting the scope of the rights claimed by the present invention. The scope of protection of the rights is determined based on the scope of the claims set forth below and their equivalent fields. Any modifications or additions made by those skilled in the art without departing from the spirit or scope of the patent are considered equivalent changes or designs made under the spirit of the disclosure of the present invention and are intended to be included in the scope of the claims set forth below. [Explanation of symbols]

[0029] 100 UTG diaphragm structure 110 Upper membrane 130 UTG layer 150 Lower layer membrane 200a flat UTG diaphragm 200b Dome-shaped UTG diaphragm 200c, 200d, 200d' UTG diaphragm with dome-shaped blade structure 200e UTG diaphragm 200-1 Dome Area 200-2 Surround 30a, 30b, 30c Speakers 300 York 310 Upper Plate 320 Permanent Magnet 330 frames 340 Surround 340a Surround Ring 350 voice coil 360 Air Gap 400 UTG diaphragm 410 coil 420 Upper Iron 430 Magnetic Yoke 440 Surround 450 Connection terminal head

Claims

1. a magnetic assembly for generating magnetic field lines; A diaphragm used to transmit sound, comprising UTG glass, having a thickness of 0.01 to 0.1 mm, and including at least an upper film or a lower film; and A UTG diaphragm speaker including a voice coil disposed to correspond to the diaphragm and cooperating with the magnetic assembly to generate a driving force to vibrate the diaphragm.

2. 2. The UTG diaphragm speaker according to claim 1, wherein the thickness of the upper layer film is 1 micrometer or more and 15 micrometers or less, and the upper layer film is made of aluminum, nickel, copper, diamond, resin, or polymer.

3. 2. The UTG diaphragm speaker according to claim 1, wherein the thickness of the lower layer film is 1 micrometer or more and 15 micrometers or less, and the lower layer film is made of aluminum, nickel, copper, diamond, resin, or polymer.

4. 2. The UTG diaphragm speaker according to claim 1, wherein the shape of the diaphragm includes a flat square, a flat circle, a flat ellipse, a flat oval, a 3D concave circle, a 3D protruding circle (dome), a cup shape, a bowl shape, a dome shape, and a pyramid shape.

5. The UTG diaphragm speaker according to claim 1, wherein the diaphragm is applied to audio equipment, earphones, mobile phones, laptops, tablets, and televisions.

Images