Display panel

Abstract

To provide a display panel and a display device configured to prevent electric charge from moving to another region through a substrate and causing problems such as display malfunction in the display panel.SOLUTION: The display panel includes a display region, an opening region, and at least one transition region located between the display region and the opening region. The display panel further includes: a substrate; and a charge collecting structure that is located on the substrate and in the transition region, surrounds the opening region at least partially, and is at least partially a conductive structure. According to the display panel, the charge collecting structure having a conductive function surrounds at least a part of the opening region, is at least partially a conductive structure, and collects electric charge introduced from the opening region.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] TECHNICAL FIELD The present disclosure relates to the field of display technology, and more particularly to display panels. [Background technology]

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices that have attracted attention due to their advantages such as simple manufacturing process, low cost, low power consumption, high brightness, wide viewing angle, high contrast, and flexible display. They are widely used in electronic display products. Summary of the Invention [Means for solving the problem]

[0003] A first aspect of the present disclosure provides a display panel including a display area, an aperture area, and at least one transition area located between the display area and the aperture area, and further including a substrate and a charge collection structure located on the substrate and in the transition area, at least partially surrounding the aperture area and at least a portion of which is a conductive structure.

[0004] According to the above solution, the charge collection structure with conductive function at least partially surrounds the opening area and collects the charges introduced from the opening area in an environment such as an electrostatic field test, thereby preventing these charges from migrating to other areas through the substrate and causing problems such as display malfunction in the display panel.

[0005] In one embodiment of the first aspect of the present disclosure, the substrate includes a base and a driving circuit layer located on the base, the driving circuit layer being at least partially located in the display area, and the charge collection structure being located on the base.

[0006] According to the above solution, since there is no layer related to the driving circuit between the charge collection structure and the base, the distance between the charge collection structure and the base is small, so that the charge collection structure directly collects charges close to the base, further reducing the risk of charges entering the base and migrating along the base to other regions.

[0007] In one embodiment of the first aspect of the present disclosure, the charge collection structure surrounds the aperture region.

[0008] In one embodiment of the first aspect of the present disclosure, the charge collection structure includes a plurality of sub-charge collection portions spaced apart from each other and sequentially surrounding the opening region in a direction away from the opening region, thereby increasing the design area of ​​the charge collection structure and improving the charge collection capability of the charge collection structure. Furthermore, the spaced apart sub-charge collection portions can reduce stress transfer between each other, thereby reducing the risk of stress concentration in the charge collection structure.

[0009] In one embodiment of the first aspect of the present disclosure, the charge collection structure further includes at least one conductive connection portion located between and connected to adjacent sub-charge collection portions, thereby making the sub-charge collection portions conductive with each other, further improving the charge collection ability of the charge collection structure and avoiding problems such as electrostatic breakdown caused by excessive charge concentration in a localized region of the charge collection structure.

[0010] In one embodiment of the first aspect of the present disclosure, the sub charge collector comprises a lattice structure, which can further contribute to stress relaxation and reduce the risk of stress concentration in the charge collection structure.

[0011] In one embodiment of the first aspect of the present disclosure, the number of sub charge collectors is 2-5.

[0012] In one embodiment of the first aspect of the present disclosure, the display panel further includes a first sealing layer, a second sealing layer, and a third sealing layer stacked in sequence on the substrate. The first sealing layer and the third sealing layer include an inorganic layer, and the second sealing layer includes an organic layer. The first sealing layer and the second sealing layer are located in the display region and the transition region, and the third sealing layer is located in the display region and the transition region. The third sealing layer covers the side of the charge collection structure away from the substrate and covers gaps between the sub-charge collection portions.

[0013] According to the above solution, the third sealing layer can be deposited in the gaps between the sub charge collecting portions, thereby more reliably fixing the third sealing layer to the substrate (directly or indirectly), thereby improving the sealing effect of the display panel.

[0014] In one embodiment of the first aspect of the present disclosure, the second encapsulation layer is located in the edge region of the transition region.

[0015] In one embodiment of the first aspect of the present disclosure, the first encapsulating layer covers at least a portion of the side of the charge collection structure that faces away from the substrate, thereby making the first encapsulating layer and the charge collection structure compatible with each other, and when a third encapsulating layer is subsequently formed, the third encapsulating layer is fixed to the charge collection structure through the first encapsulating layer, thereby further improving the encapsulation effect of the display panel.

[0016] In one embodiment of the first aspect of the present disclosure, the display panel may further include a pixel-defining layer located in the display region and the transition region, wherein the pixel-defining layer is located between the charge collection structure and the base, and the pixel-defining layer includes an inorganic layer.

[0017] In one embodiment of the first aspect of the present disclosure, the third sealing layer contacts the pixel defining layer in the gap between adjacent charge collection sub-units. This allows the third sealing layer to be fixed to the substrate via the pixel defining layer. Both the pixel defining layer and the third sealing layer are inorganic layers, and the bonding strength between them is strong, which reduces the risk of peeling off of the third sealing layer and further improves the sealing effect of the display panel.

[0018] In one embodiment of the first aspect of the present disclosure, the display panel may include at least one bank located between the display area and the charge collection structure and between the substrate and the pixel definition layer, The charge collection structure acts as a bank and can block fluid (used to manufacture the second encapsulation layer) that exceeds the bank during the manufacturing process of the display panel, thereby reducing the number of banks to be installed.

[0019] In one embodiment of the first aspect of the present disclosure, the display panel further includes a display functional layer and an isolation structure located on the substrate, the display functional layer including light-emitting units located in the display area, the isolation structure located in the display area and defining a plurality of isolation openings, and the light-emitting units at least partially located in the isolation openings.

[0020] In one embodiment of the first aspect of the present disclosure, the charge collection structure is at least partially in the same layer and made of the same material as the isolation structure.

[0021] According to the above solution, the isolation structure and at least a part of the charge collection structure can be fabricated simultaneously, thereby reducing or avoiding additional steps for providing the charge collection structure in the manufacturing process of the display panel, thereby reducing the manufacturing cost of the display panel.

[0022] In one embodiment of the first aspect of the present disclosure, the isolation structure is positioned such that the orthogonal projection on the substrate of the end facing the substrate is within the orthogonal projection on the substrate of the end facing away from the substrate.

[0023] According to the above solution, the isolation structure is generally wide at the top and narrow at the bottom, so that during the manufacturing process of the light-emitting unit, the deposition range of the related deposition layer can be limited to ensure the electrical performance of the light-emitting unit (for example, the connection of the second electrode described below), while also exerting a blocking effect on some layers in the light-emitting unit (for example, the first light-emitting functional layer described below).

[0024] In one embodiment of the first aspect of the present disclosure, the charge collection structure is positioned such that the orthogonal projection on the substrate of the end facing the substrate is within the orthogonal projection on the substrate of the end facing away from the substrate.

[0025] In one embodiment of the first aspect of the present disclosure, the isolation structure includes a first support and a first crown, the first support being located between the first crown and the substrate, and an orthogonal projection of the first support on the substrate being located within an orthogonal projection of the first crown, and the charge collection structure includes a second support and a second crown, the second support being located between the second crown and the substrate, and an orthogonal projection of the second support on the substrate being located within an orthogonal projection of the second crown.

[0026] In one embodiment of the first aspect of the present disclosure, the first support portion and the second support portion are at least partially conductive structures.

[0027] In one embodiment of the first aspect of the present disclosure, the first support portion and the second support portion are in the same layer and made of the same material, and / or the first crown portion and the second crown portion are in the same layer and made of the same material.

[0028] In one embodiment of the first aspect of the present disclosure, the light-emitting unit includes a first electrode, a first light-emitting functional layer, and a second electrode sequentially stacked on a substrate, the first light-emitting functional layer and the second electrode being located in an isolation opening, and the second electrode being connected to a first support.

[0029] In one embodiment of the first aspect of the present disclosure, the charge collection structure includes a plurality of sub-charge collection units spaced apart from one another and sequentially surrounding the opening region in a direction away from the opening region, the sub-charge collection units having a lattice structure. A second light-emitting functional layer and a third electrode are disposed in the lattice holes of the lattice structure of the sub-charge collection units, and the third electrode is connected to the second support. Thus, the lattice holes of the sub-charge collection units are covered by the third electrode, and the sub-charge collection units are connected to the third electrode, so that the third electrode participates in charge collection, further improving the charge collection capability around the opening region.

[0030] In one embodiment of the first aspect of the present disclosure, the charge collection structure further includes at least one conductive connection portion located between and connected to adjacent sub-charge collection portions.

[0031] In one embodiment of the first aspect of the present disclosure, the connection portion is in the same layer as the first support portion and / or the second electrode and is made of the same material.

[0032] In one embodiment of the first aspect of the present disclosure, the display panel further includes a first sealing layer covering the isolation structure and the charge collection structure, the first sealing layer including a plurality of sealing units spaced apart from each other, the sealing units corresponding to and covering the isolation openings and lattice holes, respectively.

[0033] In one embodiment of the first aspect of the present disclosure, two adjacent sealing units located on the same isolation structure are spaced apart.

[0034] In one embodiment of the first aspect of the present disclosure, the first support portion includes a first sub-support layer and a second sub-support layer, the first sub-support layer being located between the second sub-support layer and the substrate, the second sub-support layer being located between the first sub-support layer and the first crown portion, and an orthogonal projection of the second sub-support layer on the substrate being located within an orthogonal projection of the first sub-support layer.

[0035] In one embodiment of the first aspect of the present disclosure, the second support portion includes a third sub-support layer and a fourth sub-support layer, the third sub-support layer is located between the fourth sub-support layer and the substrate, the fourth sub-support layer is located between the third sub-support layer and the second crown portion, and the orthogonal projection of the fourth sub-support layer on the substrate is located within the orthogonal projection of the third sub-support layer.

[0036] According to the above solution, a portion of the first sub-support layer facing away from the substrate that is not covered by the second sub-support layer can be used to contact the second electrode, and the second electrode can have a thick deposition thickness on the first sub-support layer, thereby reducing the impedance of the connection between the second electrode and the first support. Correspondingly, a portion of the third sub-support layer facing away from the substrate that is not covered by the fourth sub-support layer can be used to contact the third electrode, and the third electrode can have a thick deposition thickness on the third sub-support layer, thereby reducing the impedance of the connection between the third electrode and the third sub-support layer.

[0037] In one embodiment of the first aspect of the present disclosure, the display panel may further include a pixel defining layer, the pixel defining layer being located in the display region and the transition region, between the isolation structure and the substrate, and between the charge collection structure and the substrate, and in the display region, the pixel defining layer defines a plurality of pixel openings, at least some of the pixel openings position light-emitting units, and the pixel openings and the isolation openings positioning the same light-emitting units communicate with each other.

[0038] In one embodiment of the first aspect of the present disclosure, the pixel defining layer comprises an inorganic layer.

[0039] According to the above solution, the pixel defining layer allows the first electrode to have a large design area, thereby increasing the light-emitting area of ​​the light-emitting unit.

[0040] A second aspect of the present disclosure provides a display panel. The display panel includes a display area, an aperture area, and at least one transition area located between the display area and the aperture area. The display panel includes a substrate, a charge collection structure, a display functional layer, and an isolation structure. The charge collection structure is located on the substrate and in the transition area, at least partially surrounds the aperture area, and at least a portion of the charge collection structure is a conductive structure. The display functional layer includes light-emitting units located on the substrate and in the display area. The isolation structure is located in the display area and on the substrate, defining a plurality of isolated openings, and at least some of the light-emitting units are located in the isolated openings.

[0041] A third aspect of the present disclosure provides a display device, which may include a display panel according to any one of the first and second aspects. [Brief explanation of the drawings]

[0042] [Figure 1] FIG. 1 is a schematic planar structure diagram of a display panel according to an embodiment of the present disclosure. [Figure 2A] FIG. 2A is an enlarged view of the S1 region of the display panel shown in FIG. [Figure 2B] FIG. 2B is an enlarged view of the transition region and the aperture region in one embodiment of the display panel shown in FIG. [Figure 3A] FIG. 3A is a cross-sectional view along M1-N1 of one design of the display panel shown in FIG. 2A. [Figure 3B] FIG. 3B is a cross-sectional view along M2-N2 of one design of the display panel shown in FIG. 2B. [Figure 4A] FIG. 4A is a structural schematic diagram of a further design of the display panel shown in FIG. 3A. [Figure 4B] FIG. 4B is a structural schematic diagram of a further design of the display panel shown in FIG. 3B. [Figure 5A] FIG. 5A is an enlarged view of the transition and aperture regions of another design of the display panel shown in FIG. [Figure 5B] FIG. 5B is a cross-sectional view of the display panel shown in FIG. 5A taken along line M3-N3. [Figure 6A] FIG. 6A is a cross-sectional view along M1-N1 of one design of the display panel shown in FIG. 2A. [Figure 6B] FIG. 6B is a cross-sectional view of another design of the display panel shown in FIG. 2B taken along line M2-N2. [Figure 7] FIG. 7 is a flow chart of a manufacturing method for forming the display panel shown in FIGS. 3A and 3B according to one embodiment of the present disclosure. [Figure 8] FIG. 8 is a flow chart of a manufacturing method for forming the display panel shown in FIGS. 3A and 3B according to one embodiment of the present disclosure. [Figure 9] FIG. 9 is a flow chart of a manufacturing method for forming the display panel shown in FIGS. 3A and 3B according to one embodiment of the present disclosure. [Figure 10] FIG. 10 is a flow chart of a manufacturing method for forming the display panel shown in FIGS. 3A and 3B according to one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0043] Hereinafter, the technical solutions in the embodiments of this specification will be described clearly and completely with reference to the drawings in the embodiments of this specification. Needless to say, the described embodiments are only some of the embodiments of this specification, not all of the embodiments. All other embodiments that a person skilled in the art can obtain based on the embodiments of this specification without any creative work fall within the scope of protection of this specification.

[0044] In the process of realizing the present invention, the inventor discovered that although an opening area is provided on a display panel to take into account functions such as imaging, the provision of the opening area in the related art poses a problem in that it causes a malfunction in the display function of the display panel.

[0045] At least one embodiment of the present disclosure provides a display panel and a display device to solve at least the above technical problems. The display panel includes a display area, an aperture area, and at least one transition area located between the display area and the aperture area. The display panel further includes a substrate and a charge collection structure located on the substrate, the charge collection structure being located on the substrate and in the transition area, at least partially surrounding the aperture area, and at least a portion of the charge collection structure being a conductive structure. In the display panel, the charge collection structure with a conductive function at least partially surrounds the aperture area. Therefore, even if charges enter the aperture area in an environment such as an electrostatic field test, these charges are induced by the charge collection structure, and the charges introduced from the aperture area can be collected by the charge collection structure. This prevents these charges from being transmitted to other areas via the substrate (e.g., a structure capable of transmitting charges, such as a base, included therein), thereby preventing problems such as display malfunction in the display panel.

[0046] The configuration, manufacture, etc. of the isolation structure are further described in PCT / CN2023 / 134518, CN202310759370.2, CN202310740412.8, CN202310707209.0, CN202311346196.5, CN202310771071.0, CN202311117143.6, CN202310692671.8, CN202410110015.7, and CN202310773656.6, which may be referenced.

[0047] The structure of a display panel according to at least one embodiment of the present disclosure will be described in detail below with reference to the accompanying drawings. In these drawings, a spatial Cartesian coordinate system is constructed with the substrate as a reference to more intuitively represent the positional relationships of related structures in the display panel. In the spatial Cartesian coordinate system, the X-axis and Y-axis are parallel to the plane on which the substrate is located, and the Z-axis is perpendicular to the plane on which the substrate is located.

[0048] As shown in FIGS. 1, 2B, 3A, and 3B, the planar area of ​​the display panel 10 may be divided into a display area 11a and a frame area 12 surrounding the display area 11a. An opening area 11b and a transition area 11c are provided inside the display area 11a, and the transition area 11c is located between the display area 11a and the opening area 11b and surrounds the opening area 11b. Subpixels (which may also be referred to as subpixels, etc.), such as R, G, and B subpixels, may be arranged in the display area 11a, and the actual structure of the subpixels may be a light-emitting unit. Adjacent subpixels that emit light of different colors constitute one pixel (which may also be referred to as a pixel unit, a large pixel, etc.), and the arrangement density of the pixels in the display area 11a refers to the pixel density (PPI).

[0049] Note that the frame region 12 does not necessarily completely surround the display region 11a, and in some embodiments of the present disclosure, some of the wiring in the frame region 12 may be arranged within the display region 11a. This allows the frame region 12 to be designed as a one-sided frame.

[0050] In the embodiments of the present disclosure, the position of the aperture area is not limited and can be designed according to the specific planar structure of the display panel, for example, the aperture area may be located on one side of the display area, i.e., the aperture area is not necessarily completely surrounded by the display area.

[0051] The physical structure of the display panel 10 may include a substrate 100 and a charge collection structure 300a located on the substrate 100. The charge collection structure 300a is located on the substrate 100 and in the transition region 11c, at least partially surrounds the opening region 11b, and is at least partially a conductive structure, such that when charges move downward from the opening region 11b, they are preferentially collected by the conductive charge collection structure 300a.

[0052] In at least one embodiment of the present disclosure, the charge collection structure 300a surrounds the open region 11b.

[0053] 3A and 3B , in at least one embodiment of the present disclosure, the substrate 100 includes a base 110 and a driving circuit layer located on the base 110, with at least a portion of the driving circuit layer located in the display region 11a, and the charge collection structure 300a located on the base 110. This reduces the distance between the charge collection structure 300a and the base 110 because no layers related to the driving circuit are interposed between the charge collection structure 300a and the base 110. This allows the charge collection structure 300a to directly collect charges approaching the base 110, further reducing the risk of charges entering the base 110 and migrating along the base 110 to other regions.

[0054] For example, the driving circuit layer includes a plurality of pixel driving circuits located in the display area 11a, and the display function layer is located on the driving circuit layer and includes light-emitting units. For example, the pixel driving circuits may include a plurality of transistors (TFTs), capacitors, etc., and may be formed in a number of ways, such as 2T1C (i.e., two transistors (TFTs) and one capacitor (C)), 3T1C, or 7T1C. The pixel driving circuits are connected to the light-emitting units in the display area 11a to control the on / off states and light-emitting brightness of the light-emitting units.

[0055] The drive circuit layer may include a buffer layer, an interlayer insulating layer, a gate insulating layer, a planarizing layer, and multiple metal layers. The interlayer insulating layer, gate insulating layer, and planarizing layer may each be provided in one or multiple layers. These layers may be located in the display area and extend to the transition area, but these layers may not be provided in the transition area near the opening area. This prevents cracks from occurring in these layers during the process of forming openings in the opening area (e.g., a cutting process), which may then extend into the display area 11a due to cutting stress, thereby damaging the layers in the display panel. The metal layers can be used to fabricate structures such as capacitors, signal lines, and gate electrodes and source / drain electrodes in TFT transistors.

[0056] In the embodiment of the present disclosure, the charge collection structure 300a only needs to surround the opening region and collect the charges therein, and the specific structure and shape thereof can be designed according to the needs of the actual process. Some design aspects of the charge collection structure 300a will be described below as examples.

[0057] In some embodiments of the present disclosure, the charge collection structure 300a may be an independent continuous structure (integrated structure). For example, as shown in Figures 2B and 3B, the orthogonal projection of the charge collection structure 300a on the base 110 is a closed ring. For example, the shape of the orthogonal projection of the charge collection structure 300a on the base 110 and the shape of the orthogonal projection of the transition region on the plane where the base 110 is located are the same, and further, for example, both shapes are annular.

[0058] In some embodiments of the present disclosure, as shown in FIGS. 5A and 5B , the charge collection structure 300a includes multiple sub-charge collectors (two sub-charge collectors 31a and 31b are shown in FIG. 5A ). The sub-charge collectors 31a and 31b are spaced apart from each other and surround the opening region 11b from the inside to the outside (starting from the opening region and moving away from the opening region). This increases the design area of ​​the charge collection structure 300a and improves the charge collection capability of the charge collection structure 300a. Furthermore, the spaced-apart sub-charge collectors 31a and 31b reduce stress transfer between them and reduce the risk of stress concentration in the charge collection structure 300a. For example, the sub-charge collectors 31a and 31b may have the shape of concentric rings as orthogonal projections on the plane where the base 110 is located.

[0059] In at least one embodiment of the present disclosure, as shown in FIG. 5A , the charge collection structure 300a further includes at least one conductive connection 313, which is located between and connected to adjacent sub-charge collectors 31a and 31b. This allows the sub-charge collectors 31a and 31b to be electrically connected to each other, further improving the charge collection capability of the charge collection structure 300a and preventing problems such as electrostatic discharge (ESD) breakdown caused by excessive charge concentration in a localized region of the charge collection structure 300a. For example, some of the charges collected in the sub-charge collector 31a are transferred to the sub-charge collector 31b, thereby reducing the voltage at the sub-charge collector 31a and reducing the risk of electrostatic discharge breakdown due to excessive voltage at the sub-charge collector 31a.

[0060] In some embodiments of the present disclosure, as shown in Figures 3A to 5B, the charge collection structure 300a may be designed to include a lattice structure, which can facilitate stress release and reduce the risk of stress concentration in the charge collection structure 300a. Specifically, as shown in Figures 5A and 5B, the sub charge collection portions 31a and 31b include a lattice structure.

[0061] In some other embodiments of the present disclosure, the charge collection structure or sub-charge collection portions may be provided as a continuous layer structure (without structures such as via holes, lattice holes, etc.).

[0062] 4A, 4B, and 5B, the display panel further includes a first encapsulating layer 510, a second encapsulating layer 520, and a third encapsulating layer 530 sequentially stacked on the substrate 100. The first encapsulating layer 510 and the third encapsulating layer 530 include an inorganic layer, and the second encapsulating layer 520 includes an organic layer. The first encapsulating layer 510 and the second encapsulating layer 520 are located in the transition region 11c and the display region 11a (e.g., cover the display region 11a), and the third encapsulating layer 530 is located in the display region 11a and the transition region 11c. The encapsulating layer 500, which is composed of the first encapsulating layer 510, the second encapsulating layer 520, and the third encapsulating layer 530, can encapsulate the display region and the transition region so as to maintain the sealing effect of the display panel even after an opening is formed in the opening region.

[0063] In at least one embodiment of the present disclosure, the second sealing layer 520 is located in the edge region of the transition region 11c, specifically, in the edge region of the transition region 11c that is closer to the display region 11a. Specifically, the size of the edge region can be set according to actual circumstances.

[0064] In at least one embodiment of the present disclosure, as shown in FIG. 5B , the third sealing layer 530 covers the side of the charge collection structure 300a that faces away from the substrate 100 and covers the gap (region indicated by S2) between the sub-charge collection units 31a and 31b. By depositing the third sealing layer 530 in the gap between the sub-charge collection units 31a and 31b, the third sealing layer 530 is securely fixed (including directly or indirectly) to the substrate 100 so as not to separate from the substrate, thereby preventing peeling from the substrate 100 and improving the sealing effect of the display panel. Furthermore, if a crack occurs in the third sealing layer 530, the gap between the sub-charge collection units 31a and 31b can block the crack and prevent it from spreading. The principle includes at least the following: the sub-charge collecting portions 31a and 31b form a groove space in the gap, which can change the direction of the crack extension within the groove space, increasing the difficulty of the crack extension and extending the path of the crack extension, thereby blocking the crack.

[0065] In the embodiments of the present disclosure, the number of sub-charge collectors is not limited and can be designed according to actual needs. For example, in some embodiments of the present disclosure, the number of sub-charge collectors may be 2 to 5, and may be 2, 3, 4, or 5. This ensures the charge collection effect of the charge collection structure and reduces the area occupied by the charge collection structure, thereby reducing the design area of ​​the transition region.

[0066] In some embodiments of the present disclosure, the charge collection structure may be disposed directly on the base of the substrate, i.e., the charge collection structure may directly contact the base, and thus the third encapsulation layer may contact the substrate in the gaps between the sub-charge collection portions.

[0067] It should be noted that in at least one embodiment of the present disclosure, the base may comprise an organic material such that it has a degree of flexibility, and accordingly, the insulating capability of the base is limited and charge may be conducted through the base after being collected on the base.

[0068] In some other embodiments of the present disclosure, the first encapsulating layer 510 covers at least a portion of the side of the charge collection structure 300a that faces away from the substrate 100. This allows the first encapsulating layer 510 and the charge collection structure 300a to be compatible with each other, and when the third encapsulating layer 530 is subsequently formed, the third encapsulating layer 530 is fixed to the charge collection structure 300a via the first encapsulating layer 510, thereby further improving the encapsulation effect of the display panel.

[0069] 5A and 5B, the display panel may further include a pixel-defining layer 330 located in the display area 11 a and the transition area 11 c. In the transition area 11 c, the pixel-defining layer 330 is located between the charge collection structure 300 a and the base 110, and the pixel-defining layer 330 includes an inorganic layer.

[0070] Note that "the pixel defining layer includes an inorganic layer" means that the pixel defining layer includes at least two layers, at least one of which is an inorganic layer, or that the pixel defining layer is an inorganic layer having a single-layer film structure or a laminated structure composed of multiple layers.

[0071] In at least one embodiment of the present disclosure, as shown in FIGS. 5A and 5B , the third encapsulation layer 530 contacts the pixel definition layer 330 in the gap between adjacent charge collection sub-units 31a and 31b. This allows the third encapsulation layer 530 to be fixed to the substrate 100 via the pixel definition layer 330. The pixel definition layer 330 and the third encapsulation layer 530 are both inorganic layers, providing a strong bond between them. This reduces the risk of peeling of the third encapsulation layer 530 and further improves the sealing effect of the display panel. In the transition region, the pixel definition layer 330 can be formed on the base 110 before forming the charge collection structure 300a, thereby increasing the bond strength between the pixel definition layer 330 and the base 110. This allows the third encapsulation layer 530 to be bonded to the pixel definition layer 330 after forming the charge collection structure 300a, providing a strong bond strength because both layers are made of the same inorganic material. Therefore, even if the charge collection structure 300a exists between the third encapsulation layer 530 and the base 110 and the bonding area is limited, the third encapsulation layer 530 is securely fixed onto the base via the pixel definition layer 330.

[0072] In at least one embodiment of the present disclosure, as shown in FIG. 5B , the display panel further includes at least one bank 350. The bank 350 is located between the charge collection structure 300a in the display area 11a and the transition area 11c, and between the substrate 100 and the pixel defining layer 330. The bank 350 increases the extension length of the pixel defining layer 330 and prevents cracks from extending if they occur in the pixel defining layer 330, thereby protecting the structure of the display area. Furthermore, when the second encapsulating layer 520 is fabricated, the bank 350 blocks the fluid used to fabricate the second encapsulating layer 520 (e.g., when forming the second encapsulating layer 520 by a method such as inkjet printing) to prevent the second encapsulating layer 520 from extending into the opening area. This allows the second encapsulating layer 520 to be completely covered by the third encapsulating layer 530, improving the sealing effect of the encapsulating layer 500. The charge collection structure 300a acts as a bank 350 and blocks fluid (used to manufacture the second sealing layer) from exceeding the bank 350 during the manufacturing process of the display panel, thereby reducing the number of banks 350 required.

[0073] In the embodiment of the present disclosure, the number of banks 350 is not limited and can be designed according to the needs of the actual process. For example, two banks 350 may be provided, or one bank may be provided as shown in FIG. 5B. This reduces the area occupied by the banks and the design area of ​​the transition region.

[0074] In at least one embodiment of the present disclosure, the bank 350 may be manufactured independently, or at least a portion of the bank 350 may be manufactured in the same process as the manufacturing process of the driving circuit layer, as shown in Fig. 5B. For example, the driving circuit layer may include a buffer layer, an interlayer insulating layer, a gate insulating layer, and a planarization layer, and the bank 350 is in the same layer as the buffer layer, the interlayer insulating layer, the gate insulating layer, and the planarization layer and is made of the same material as the buffer layer, the interlayer insulating layer, the gate insulating layer, and the planarization layer. That is, the bank 350 is formed in the same process as the manufacturing process of the buffer layer, the interlayer insulating layer, the gate insulating layer, and the planarization layer.

[0075] In addition, in the embodiment of the present disclosure, in the region between the charge collection structure 300a and the edge of the display area 11a, there is no organic layer or metal layer extending from the transition region 11c to the display area 11a, which can effectively ensure the sealing effect of the display panel and effectively improve the performance of the display panel.

[0076] In application scenarios of display panels, the display panel faces requirements such as a high PPI. In this case, isolation structures are provided in the display area, and light-emitting units in the display area are manufactured based on these isolation structures. This process allows the light-emitting units to be manufactured with high precision, resulting in a high PPI. Based on this application scenario, in at least one embodiment of the present disclosure, at least a portion of the charge collection structure can be manufactured in-process during the process of manufacturing the isolation structures, thereby reducing the manufacturing process flow of the display panel and controlling production costs.

[0077] The application needs of the isolation structure, specific installation methods, processes supporting the manufacture of the light-emitting unit, and principles for improving pixel PPI will be described below, along with specific installation methods for when the charge collection structure is manufactured together with the isolation structure.

[0078] In display panels, several functional layers in the light-emitting units are formed by vapor deposition. However, since the light-emitting units have multiple types of functional layers and the materials of the functional layers (e.g., light-emitting layers) in the light-emitting units that emit different types of light are different, multiple alignments are required when evaporating these functional layers using a mask plate (e.g., a high-definition mask plate). To solve the problem of misalignment due to alignment accuracy errors, it is necessary to ensure sufficient space (a safety margin related to alignment errors) between different light-emitting units to ensure that the actual position of the light-emitting area of ​​the light-emitting unit has a predetermined overlap rate with the designed position (design area). This is equivalent to compressing the designed area of ​​the light-emitting area of ​​the light-emitting unit, which not only limits the light-emitting area of ​​the light-emitting unit but also makes it impossible to increase the array density of the light-emitting units, making it difficult to further improve the PPI (pixel density) of the display panel.

[0079] In the embodiment of the present disclosure, an isolation structure is installed in the gap between the light-emitting units to separate the functional layers of adjacent light-emitting units. This allows the functional layer deposition process to be performed entirely on the display panel, eliminating the need to separately fabricate the functional layers of the light-emitting units using high-resolution masks. This process eliminates the need to consider alignment accuracy during deposition, allowing the gap between the light-emitting units to be designed to be smaller, thereby increasing PPI (see the related explanations in the embodiments related to Figures 7 to 10 below for the principle).

[0080] In at least one embodiment of the present disclosure, as shown in Figures 3A and 3B, the display functional layer includes light-emitting units 200 located in the display area 11a, which are the actual light-emitting structures of the R, G, and B subpixels described above. The isolation structures 300 are located in the display area 11a and define a plurality of isolation openings 301, i.e., the planar shape of the isolation structures 300 forms a grid pattern. At least a portion of the light-emitting units 200 is located within the isolation openings 301. The isolation structures 300 and at least a portion of the charge collection structures 300a may be in the same layer and made of the same material. This allows the isolation structures 300 and the charge collection structures 300a to be manufactured simultaneously.

[0081] In the embodiments of the present disclosure, "in the same layer and made of the same material" means that both are manufactured in at least one of the same layers in the same manufacturing process.

[0082] 3A , in at least one embodiment of the present disclosure, the orthogonal projection of the isolation structure 300 on the substrate 100 at the end facing the substrate 100 is located within the orthogonal projection of the end facing away from the substrate 100 on the substrate 100. In this manner, the isolation structure 300 is generally wide at the top and narrow at the bottom, and thus limits the deposition range of related deposition layers during the manufacturing process of the light-emitting unit 200, ensuring the electrical performance of the light-emitting unit 200 (e.g., connection of the second electrode 230 described below) while achieving a shielding effect for some layers in the light-emitting unit 200 (e.g., the first light-emitting functional layer 220 described below). For example, the charge collection structure 300a may have a shape that is generally wide at the top and narrow at the bottom, i.e., the orthogonal projection of the charge collection structure 300a on the substrate 100 at the end facing the substrate 100 is located within the orthogonal projection of the end facing away from the substrate 100 on the substrate 100.

[0083] 3A and 3B , an end of the isolation structure 300 facing the substrate 100 includes a first conductive portion (e.g., a first support portion in the following embodiments), the light-emitting unit 200 includes a first electrode 210, a first light-emitting functional layer 220, and a second electrode 230 sequentially stacked on the first electrode 210, the first light-emitting functional layer 220 and the second electrode 230 being located in the isolation opening 301, and the second electrode 230 being connected to the first conductive portion in the display area 11a. For example, an end of the charge collection structure 300a facing the substrate 100 includes a second conductive portion (e.g., a second support portion in the following embodiments), and the first conductive portion and the second conductive portion may be in the same layer and made of the same material.

[0084] In at least one embodiment of the present disclosure, as shown in FIGS. 3A and 3B , the display panel further includes a second light-emitting functional layer 220a and a third electrode 230a sequentially stacked on the substrate 100. In the transition region 11c, the second light-emitting functional layer 220a and the third electrode 230a are located within the lattice holes of the charge collection structure 300a, and the third electrode 230a is connected to the second conductive portion. In this manner, the third electrode 230a covers the lattice holes of the charge collection structure 300a, thereby improving the charge collection capability at the location where the charge collection structure 300a is located. The second light-emitting functional layer 220a may be in the same layer and made of the same material as the first light-emitting functional layer 220, and the third electrode 230a may be in the same layer and made of the same material as the second electrode 230. This allows the second light-emitting functional layer 220a and the third electrode 230a to be manufactured in the same process during the manufacturing of the light-emitting unit 200.

[0085] In at least one embodiment of the present disclosure, the first light-emitting functional layer 220 may further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223, which are sequentially stacked on the first electrode 210. The first functional layer 221 may include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer. The second functional layer 223 may include at least one of an electron injection layer, an electron transport layer, and a hole blocking layer. Note that, because carriers (holes and electrons) mainly crosstalk between adjacent light-emitting units 200 via the first functional layer 221, the first functional layers 221 of the light-emitting units 200 must be electrically isolated from each other in order to install the isolation structure 300. Because the isolation structure 300 has a shape that is wide at the top and narrow at the bottom, the first functional layer 221 is separated at the edge of the first crown portion 320 during deposition, i.e., the first functional layer 221 is connected to the conductive portion of the isolation structure 300 (e.g., the first support portion 310), thereby preventing crosstalk between adjacent light-emitting units 200. For example, the second light-emitting functional layer 220a may also include the above layers included in the first light-emitting functional layer 220.

[0086] In at least one embodiment of the present disclosure, the light emitting layer 222 and / or the second functional layer 223 can be connected to the second conductive portion within the lattice hole of the charge collection structure 300a, which can further improve the charge collection capability at the location where the charge collection structure 300a is located.

[0087] In the embodiments of the present disclosure, as long as it can be ensured that the isolation structure is wide at the top and narrow at the bottom, there is no further restriction on the specific structure of the isolation structure. Hereinafter, several installation methods of the isolation structure will be described in different embodiments.

[0088] 3A and 3B , the isolation structure 300 includes a first support portion 310 and a first crown portion 320, the first support portion 310 being located between the first crown portion 320 and the substrate 100, and the orthogonal projection of the first support portion 310 on the substrate 100 being located within the orthogonal projection of the first crown portion 320. The charge collection structure 300a includes a second support portion 310a and a second crown portion 320a, the second support portion 310a being located between the second crown portion 320a and the substrate 100, and the orthogonal projection of the second support portion 310a on the substrate 100 being located within the orthogonal projection of the second crown portion 320a. At least a portion of the first support portion 310 and the second support portion 310a may be a conductive structure.

[0089] For example, the first support portion 310 and the second support portion 310a may be in the same layer and made of the same material, and / or the first crown portion 320 and the second crown portion 320a may be in the same layer and made of the same material. The first support portion 310 may be a first conductive portion, and the second support portion 310a may be a second conductive portion.

[0090] For example, in the display panel shown in Figures 3A and 3B, the first support portion 310 is made of a conductive material such as metal, and based on this, the first crown portion 320 may be made of a conductive material such as metal, or the first crown portion 320 may be made of an insulating material.

[0091] 3A and 3B , in a cross section perpendicular to the substrate 100, the cross-sectional shape of the first support portion 310 located between adjacent isolation openings 301 is an isosceles trapezoid, the first support portion 310 is formed as a conductive structure, and the second electrode 230 is connected to the sidewall of the first support portion 310. This reduces the required difference in width between the first crown portion 320 and the first support portion 310, thereby reducing the designed width of the isolation structure 300 located between the two isolation openings and improving the pixel density (PPI) of the display panel. Correspondingly, when the isolation structure 300 and the charge collection structure 300a are fabricated in the same layer, the cross-sectional shape of the second support portion 310a is an isosceles trapezoid in a cross section perpendicular to the substrate 100. The second support portion 310a is formed as a conductive structure, and the third electrode 230a is connected to the sidewall of the second support portion 310a.

[0092] In at least one embodiment of the present disclosure, the above-mentioned connection portion 313 may be provided independently, or may be provided in the same layer and made of the same material as at least a portion of the first support portion 310, and / or may be provided in the same layer and made of the same material as the second electrode 230. This simplifies the manufacturing process of the display panel and controls costs.

[0093] In at least one embodiment of the present disclosure, as shown in Figures 6A and 6B, the first support portion 310 may further include a first sub-support layer 311 and a second sub-support layer 312, where the first sub-support layer 311 is located between the second sub-support layer 312 and the substrate 100, the second sub-support layer 312 is located between the first sub-support layer 311 and the first crown portion 320, and the orthogonal projection of the second sub-support layer 312 on the substrate 100 is located within the orthogonal projection of the first sub-support layer 311. The second support portion 310a may further include a third sub-support layer 311a and a fourth sub-support layer 312a, where the third sub-support layer 311a is located between the fourth sub-support layer 312a and the substrate 100, the fourth sub-support layer 312a is located between the third sub-support layer 311a and the second crown portion 320a, and the orthogonal projection of the fourth sub-support layer 312a on the substrate 100 is located within the orthogonal projection of the third sub-support layer 311a. In this manner, the portion of the surface of the first sub-support layer 311 facing away from the substrate 100 that is not covered by the second sub-support layer 312 can be used to contact the second electrode 230, and the second electrode 230 on the first sub-support layer 311 can have a large deposition thickness to reduce the impedance at the connection point between the second electrode 230 and the first support portion 310. Correspondingly, the portion of the surface of the third sub-support layer 311a facing away from the substrate 100 that is not covered by the fourth sub-support layer 312a can be used to contact the third electrode 230a, and the third electrode 230a on the third sub-support layer 311a can have a large deposition thickness to reduce the impedance at the connection point between the third electrode 230a and the third sub-support layer 311a.

[0094] In addition, when the connecting portion 313 is in the same layer as at least a portion of the first support portion 310 and is made of the same material, the connecting portion 313 may be in the same layer as one of the first sub-support layer 311 and the second sub-support layer 312 and made of the same material, or the connecting portion 313 may be in the same layer as the first sub-support layer 311 and the second sub-support layer 312 and made of the same material.

[0095] For example, the first sub-support layer 311, the second sub-support layer 312, and the first crown portion 320 are all made of different materials. For example, the first sub-support layer 311, the second sub-support layer 312, and the first crown portion 320 may be made of molybdenum, aluminum, and titanium, respectively, with aluminum, molybdenum, and titanium having increasing corrosion resistance. When etched, the layers made of these materials can form the isolation structure 300 shown in FIGS. 6A and 6B. Correspondingly, the third sub-support layer 311a, the fourth sub-support layer 312a, and the second crown portion 320a are all made of different materials. For example, the third sub-support layer 311a, the fourth sub-support layer 312a, and the second crown portion 320a are made of molybdenum, aluminum, and titanium, respectively, with aluminum, molybdenum, and titanium having increasing corrosion resistance. When etched, the layers made of these materials can form the charge collection structure 300a shown in FIGS. 6A and 6B.

[0096] 3A and 3B , when a pixel defining layer 330 is provided in a display panel, the pixel defining layer 330 is located between the isolation structure 300 and the substrate 100 in the display region, and the pixel defining layer 330 is located between the charge collection structure 300a and the substrate 100 in the transition region 11c. In the display region 11a, the pixel defining layer 330 defines a plurality of pixel openings 302, and the pixel openings 302 position the light-emitting units 200. The pixel openings 302 and the isolation openings 301 that position the same light-emitting unit 200 communicate with each other, for example, the orthogonal projection of the pixel opening 302 is located within the orthogonal projection of the corresponding isolation opening 301 on the substrate 100, and the first light-emitting functional layer 220 and the second electrode 230 fill the pixel openings 302 and extend to the surface of the pixel defining layer 330 facing away from the substrate 100.

[0097] It should be noted that in the transition region 11c, the pixel definition layer 330 may not have pixel openings 302 and may maintain a continuous planar structure, i.e., the orthogonal projection of the lattice holes in the charge collection structure 300a in the plane where the base 110 is located is located within the orthogonal projection of the pixel definition layer 330.

[0098] In at least one embodiment of the present disclosure, the pixel-defining layer 330 includes an inorganic layer, which has high density and strong resistance performance, allowing the design thickness of the display panel to be reduced. Furthermore, a thin pixel-defining layer 330 is advantageous for the continuity of the second electrode 230 and the third electrode 230a. For example, the first light-emitting functional layer 220 and the second electrode 230 of the light-emitting unit 200 can be formed by deposition based on the isolation structure 300, which can position the first light-emitting functional layer 220 and the second electrode 230. Therefore, the pixel-defining layer 330 does not need to be excessively thick to accommodate the first light-emitting functional layer 220, i.e., it is not necessary to manufacture the pixel-defining layer 330 using a thick organic material. Furthermore, since the pixel definition layer 330 has a small thickness when it is an inorganic layer, it can reduce the step at the edge of the pixel opening 302 and improve the layer continuity of the second electrode 230 there, thereby reducing the impedance at the connection point between the second electrode 230 and the isolation structure 300.

[0099] In at least one embodiment of the present disclosure, as shown in FIGS. 3A and 3B , the pixel defining layer 330 covers the edge of the first electrode 210. In this manner, the pixel defining layer 330 allows the first electrode 210 to have a larger design area, thereby increasing the light-emitting area of ​​the light-emitting unit 200. For example, when the pixel defining layer 330 is provided in a display panel, the first electrode 210 of the light-emitting unit 200 can be designed to have a larger area to avoid misalignment (errors due to process accuracy) between the first electrode 210 and the isolation structure 300 during the actual process, making it difficult to guarantee the actual light-emitting area of ​​the light-emitting unit. This can improve the aperture ratio (related to the light-emitting area of ​​the light-emitting unit) and brightness of the display image of the display panel. For example, if the pixel defining layer 330 is not provided, the design area of ​​the first electrode 210 is limited to prevent the first electrode 210 from being connected to the isolation structure 300. If the first electrode 210 is misaligned, the light-emitting area of ​​the light-emitting unit may be smaller than the designed area, resulting in reduced brightness.

[0100] In at least one embodiment of the present disclosure, referring again to Figures 4A and 4B, when the display panel includes a first sealing layer 510, the first sealing layer 510 is located on the side of the display function layer facing away from the substrate 100, and covers the light-emitting unit 200 to seal and protect the light-emitting unit 200.

[0101] 4A and 4B , in at least one embodiment of the present disclosure, the first encapsulating layer 510 includes a plurality of encapsulating units 511 spaced apart from one another, which cover the isolation openings 301 and the lattice holes of the charge collection structure 300a. The light-emitting units 200 are manufactured in batches, and during the manufacturing process of each batch, the encapsulating units 511 can protect the light-emitting units 200 already manufactured. Accordingly, during these manufacturing processes, the first encapsulating layer 510 is formed as a plurality of encapsulating units 511 spaced apart from one another, which correspond to the isolation openings 301 and the lattice holes of the charge collection structure 300a, respectively, to cover and protect the light-emitting units 200 positioned in the isolation openings 301 and the third electrodes located in the lattice holes. Optionally, two adjacent encapsulating units 511 located on the same isolation structure 300 are spaced apart from one another.

[0102] 3A and 3B, in consideration of at least improving the sealing effect, the sealing unit 511 may extend to the side of the crown portion (including the first crown portion and the second crown portion) facing away from the substrate 100, and the principle thereof can be referred to the related description of the embodiment shown in FIGS. 7 to 10. In this case, the portion of the sealing unit 511 overlapping with the crown portion forms an overhang portion 411a and is spaced apart from the crown portion.

[0103] For example, the light emitting units 200 are classified into light emitting units that emit red light (R), green light (G), and blue light (B), respectively, and the light emitting units R, G, and B are sequentially manufactured during the manufacturing process. When manufacturing the light emitting units R, the light emitting units R are formed in each isolation opening 301, and a first encapsulating layer 510 is manufactured on the display panel to cover the light emitting units R. After that, the first encapsulating layer 510, the second electrode, and the first light-emitting functional layer are removed from some of the isolation openings 301 (used to form the light emitting units G and B in the final product). During this process, the first encapsulating layer 510 is used to protect the light emitting units R in other isolation openings 301. The light emitting units G and B are further sequentially manufactured according to this method, and the first encapsulating layer 510 is finally formed. That is, the first encapsulating layer 510 for the entire display panel is manufactured in a multi-step process, and the first encapsulating layer 510 is also formed to include a plurality of encapsulating units 511 spaced apart from each other. In this process, the second light-emitting functional layer and the third electrode may be fabricated in the lattice holes of the charge collection structure 300a during the fabrication of any one of the light-emitting units R, G, and B, or the second light-emitting functional layer and the third electrode may be fabricated in different lattice holes of the charge collection structure 300a during the fabrication of each of the light-emitting units R, G, and B.

[0104] In at least one embodiment of the present disclosure, as shown in FIGS. 4A and 4B , when the display panel includes a second encapsulating layer 520 and a third encapsulating layer 530, the second encapsulating layer 520 is located between the first encapsulating layer 510 and the third encapsulating layer 530 in the display area to encapsulate and protect the light-emitting unit 200. The second encapsulating layer 520 serves as a planarizing layer, facilitating the placement of other elements on the encapsulating layer 500. For example, the second encapsulating layer 520 is an organic layer, which provides a certain degree of flexibility and relieves stress on the first encapsulating layer 510 and the third encapsulating layer 530, thereby improving the reliability of the display panel and further enhancing the application of the display panel to a flexible display area. Furthermore, the first encapsulating layer 510 and the third encapsulating layer 530, which are inorganic layers, are highly dense and have a high barrier effect against water, oxygen, and the like.

[0105] The structure of some elements in the display panel has been briefly described above. Below, a method for manufacturing a display panel will be described as an example, taking the display panel shown in FIGS. 3A and 3B as an example.

[0106] As shown in FIGS. 7 and 3B, a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100, with the first electrodes 210 being formed in the display area. An insulating material layer (e.g., an inorganic material layer) is deposited on the substrate 100 on which the first electrodes 210 have been formed. First support portions 310, first crown portions 320, second support portions 310a, and second crown portions 320a are formed on the display panel to obtain isolation structures 300 defining isolation openings and charge collection structures 300a having lattice holes. The insulating material layer is patterned to form pixel definition layers 330 (having a lattice-like planar shape in the display area), with the pixel definition layers 330 covering the gaps between adjacent first electrodes 210.

[0107] In the embodiments of the present disclosure, the patterning process may be a photolithography patterning process, for example, may include applying a photoresist to the structural layer that needs to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching (wet etching or dry etching) the structural layer using the photoresist pattern, and then selectively removing the photoresist pattern. Note that if the material of the structural layer (e.g., the photoresist pattern 600 described below) includes photoresist, the structural layer can be directly exposed through a mask plate to form a desired pattern.

[0108] As shown in FIGS. 8 and 3B, a first light-emitting functional layer 220 and a second electrode 230 are deposited on the substrate 100 to form light-emitting units 200 (e.g., light-emitting units R emitting red light) in the isolation openings 301 of the isolation structures 300. At this stage, a second light-emitting functional layer 220a and a third electrode 230a are also formed in the lattice holes. Because no mask plate is used for deposition in this process, the deposited material also deposits on the crown portions. In actual practice, the deposited material also deposits on the top surfaces and sidewalls (not shown) of the first and second crown portions 320 and 320a facing away from the substrate 100. Next, a first encapsulating thin film 510a is formed to cover the light-emitting units 200, the isolation structures 300, and the charge collecting structures 300a. For example, the light-emitting layer in the deposited first light-emitting functional layer 220 can emit red light.

[0109] 9 and 3B, a photoresist is formed (e.g., coated) on the substrate 100 on which the first encapsulating thin film 510a is formed, and then patterned to form a photoresist pattern 600, which covers only some of the isolation openings 301 of the isolation structure 300. If the third electrode 230a formed in the previous step is to be retained, the photoresist pattern 600 can be made to cover the lattice holes. On the other hand, if the third electrode 230a is to be fabricated again in a later process, the photoresist pattern 600 will not cover the lattice holes in that step.

[0110] Furthermore, if the light-emitting units formed in adjacent isolation openings in the final display panel have the same emission color, the above-mentioned photoresist pattern 600 needs to cover the two adjacent isolation openings and also cover the part of the isolation structure located between the two adjacent isolation openings.

[0111] As shown in Figures 10 and 3B, in the display area, the surface of the display panel is etched using the photoresist pattern 600 as a mask to remove the first sealing thin film 510a, the second electrode 230, and the first light-emitting functional layer 220 not covered by the photoresist pattern 600, and the remaining portions of the first sealing thin film 510a form the first sealing layer 510 (including the sealing units 511). The remaining photoresist pattern 600 is then removed. Note that if the third electrode in the lattice holes is selected for removal in this process, the photoresist pattern 600 does not cover the third electrode, and the second light-emitting functional layer and the third electrode are also removed in this etching process.

[0112] The above process steps are repeated to form the light emitting units 200 that emit green light and the light emitting units 200 that emit blue light in the other isolation openings 301, respectively, to form the display panel as shown in FIGS. 3A and 3B.

[0113] In some embodiments of the present disclosure, the charge collection structure is independently installed and only collects and distributes the charge, thereby avoiding the risk of static electricity concentrating and causing electrostatic breakdown. In this case, there is no need to extract the collected electrostatic charge. This design also reduces or eliminates wiring (e.g., the conductor wires described below) placed in the transition region, improving the sealing effect in the transition region.

[0114] In some other embodiments of the present disclosure, the display panel may further include a conductive wire extending to the transition region to be connected to the charge collection structure, thereby discharging the charges collected by the charge collection structure. For example, a ground wire may be provided on the display panel, and the conductive wire may be connected to the ground wire.

[0115] In some other embodiments of the present disclosure, the display panel may be provided with an electrostatic shielding layer and / or a structure for discharging static electricity (e.g., a structure such as a support frame (also called a housing) that is installed outside the display panel and fixes it), and the charge collection structure is electrically connected to the electrostatic shielding layer and / or the structure for discharging static electricity to dissipate the collected charges.

[0116] In at least one embodiment of the present disclosure, the display panel may further include structures such as a touch structure, an optical sheet (for example, a microlens, a polarizer), a color film, a cover plate, etc. located on the light-exiting side.

[0117] For example, when the display panel includes the above-mentioned third encapsulation layer, the touch structure may be located on the side of the third encapsulation layer facing away from the substrate and within the display area. For example, the touch structure may be formed directly on the third encapsulation layer, or a buffer layer may be formed on the third encapsulation layer and the touch structure may be formed on the buffer layer.

[0118] For example, the optical sheet may include a microlens located in the display area, and the microlens may be located on the side of the third sealing layer facing away from the substrate, or may be located between the first sealing layer and the third sealing layer.

[0119] For example, the color film located in the display area may be located on the side of the third sealing layer facing away from the substrate, or may be located between the first sealing layer and the third sealing layer.

[0120] At least one embodiment of the present disclosure provides another display panel, specifically referring to FIGS. 1 to 6. The display panel 10 includes a display area 11a, an opening area 11b, and at least one transition area 11c located between the display area 11a and the opening area 11b. The display panel 10 includes a substrate 100, a charge collection structure 300a, a display function layer, and an isolation structure 300. The charge collection structure 300a is located on the substrate 100 and in the transition area 11c, at least partially surrounds the opening area 11b, and at least a portion of the charge collection structure 300a is a conductive structure. The display function layer includes a light-emitting unit 200 located on the substrate 100 and in the display area 11a. The isolation structure 300 is located in the display area 11a and on the substrate 100, and defines a plurality of isolated openings 301, at least a portion of the light-emitting unit 200 being located in the isolated openings 301.

[0121] Alternatively, the isolation structure 300 may include a first support portion 310 and a first crown portion 320, the first support portion 310 being located between the first crown portion 320 and the substrate 100, and an orthogonal projection of the first support portion 310 being located within an orthogonal projection of the first crown portion 320 on the substrate 100. The charge collection structure 300a may include a second support portion 310a and a second crown portion 320a, the second support portion 310a being located between the second crown portion 320a and the substrate 100, and an orthogonal projection of the second support portion 310a being located within an orthogonal projection of the second crown portion 320a on the substrate 100.

[0122] Preferably, the first support portion 310 and the second support portion 310a are in the same layer and made of the same material, and / or the first crown portion 320 and the second crown portion 320a are in the same layer and made of the same material.

[0123] At least one embodiment of the present disclosure provides a display device. The display device may include the display panel of the above-described embodiment. For example, the display device may be any product or component having a display function, such as a television, a digital camera, a mobile phone, a wristwatch, a tablet PC, a laptop computer, or a navigation system.

[0124] The above description is merely a preferred embodiment of the present specification, and does not limit the present specification. Any modifications, equivalent replacements, etc. made within the spirit and principle of the present specification should be included in the protection scope of the present specification. [Explanation of symbols]

[0125] 10 Display panel 11a Display area 11b Opening area 11c transition region 12 Frame Area 100 boards 110 base 200 light-emitting units 210 1st electrode 220 First light-emitting functional layer 221 1st functional layer 222 Light-emitting layer 223 2nd functional layer 230 2nd electrode 220a Second light-emitting functional layer 230a 3rd electrode 300 Isolation structure 300a Charge collection structure 31a, 31b Sub-charge collectors 301 Isolation opening 301a Isolation opening 302 pixel aperture 310 1st support part 311 First Sub-Support Layer 312 Second Sub-Support Layer 313 Connection 320 First Crown Section 310a 2nd support part 311a Third sub-support layer 312a 4th sub-support layer 320a Second Crown Part 330 Pixel Definition Layer 500 sealing layer 510 First sealing layer 510a 1st sealing thin film 511 Sealing Unit 520 Second sealing layer 530 Third sealing layer 600 photoresist patterns.

Claims

1. A display panel, a display region, an aperture region, and at least one transition region located between the display region and the aperture region; The display panel includes: A substrate; a charge collection structure located on the substrate and within the transition region, the charge collection structure at least partially surrounding the opening region and at least a portion of which is a conductive structure; A display panel characterized by:

2. the substrate includes a base and a driving circuit layer disposed on the base, the driving circuit layer being at least partially disposed in the display area, and the charge collection structure being disposed on the base; the charge collection structure surrounds the aperture region; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

3. the charge collection structure includes a plurality of sub-charge collection portions spaced apart from each other and surrounding the opening region in order in a direction away from the opening region; 3. The display panel according to claim 1, wherein the first and second electrodes are electrically connected to each other.

4. the charge collection structure further includes at least one conductive connection portion located between and connected to adjacent sub-charge collection portions; 4. The display panel according to claim 3.

5. the sub-charge collectors include a grid structure; 4. The display panel according to claim 3.

6. The semiconductor device further includes a first sealing layer, a second sealing layer, and a third sealing layer sequentially stacked on the substrate; the first sealing layer and the third sealing layer include an inorganic layer, the second sealing layer includes an organic layer, the first sealing layer and the second sealing layer are located in the display area and the transition area, and the third sealing layer is located in the display area and the transition area; the third encapsulation layer covers a side of the charge collection structure away from the substrate and covers gaps between the sub-charge collection portions; the first encapsulation layer covers at least a portion of the side of the charge collection structure away from the substrate; 4. The display panel according to claim 3.

7. further comprising a pixel definition layer located in the display region and the transition region; in the transition region, the pixel-defining layer is located between the charge collection structure and the base, and the pixel-defining layer comprises an inorganic layer.

7. The display panel according to claim 6, wherein the first and second electrodes are arranged parallel to each other.

8. the third sealing layer contacts the pixel defining layer in the gap between the adjacent charge collection sub-units; 8. The display panel according to claim 7,

9. further comprising at least one bank located between the display area and the charge collection structure and between the substrate and the pixel defining layer.

8. The display panel according to claim 7,

10. a display function layer located on the substrate, the display function layer including a light-emitting unit located within the display area; an isolation structure located within the display area and on the substrate, the isolation structure defining a plurality of isolation openings; The light emitting unit is at least partially located within the isolation opening.

3. The display panel according to claim 1, wherein the first and second electrodes are electrically connected to each other.

11. the charge collection structure is at least partially in the same layer and made of the same material as the isolation structure; 11. The display panel according to claim 10.

12. the orthogonal projection of the end of the isolation structure facing the substrate on the substrate is located within the orthogonal projection of the end of the isolation structure facing away from the substrate on the substrate; and / or the charge collection structure has an end facing the substrate, the orthogonal projection of which is located on the substrate, within an orthogonal projection of an end facing away from the substrate, on the substrate; 12. The display panel according to claim 11.

13. the isolation structure includes a first support portion and a first crown portion, the first support portion is located between the first crown portion and the substrate, and an orthogonal projection of the first support portion on the substrate is located within an orthogonal projection of the first crown portion; the charge collection structure includes a second support portion and a second crown portion, the second support portion being located between the second crown portion and the substrate, and an orthogonal projection of the second support portion on the substrate being located within an orthogonal projection of the second crown portion; 13. The display panel according to claim 12.

14. the light-emitting unit includes a first electrode, a first light-emitting functional layer, and a second electrode sequentially stacked on the substrate, the first light-emitting functional layer and the second electrode being located in the isolation opening; the second electrode is connected to the first support portion; 14. The display panel according to claim 13.

15. the charge collection structure includes a plurality of sub-charge collection portions spaced apart from one another and surrounding the opening region in order in a direction away from the opening region; the sub-charge collectors include a grid structure; a second light-emitting functional layer and a third electrode are disposed in the lattice holes of the lattice structure of the sub charge collecting unit, and the third electrode is connected to the second supporting unit; 15. The display panel according to claim 14.

16. the charge collection structure further includes at least one conductive connection portion located between and connected to adjacent sub-charge collection portions; the connection portion is in the same layer as the first support portion and / or the second electrode and is made of the same material; 16. The display panel according to claim 15.

17. the display panel further includes a first encapsulation layer covering the isolation structure and the charge collection structure; the first sealing layer includes a plurality of sealing units spaced apart from one another; the sealing units respectively correspond to the isolation openings and the grid holes and cover the corresponding isolation openings and grid holes; 16. The display panel according to claim 15.

18. the first support portion includes a first sub-support layer and a second sub-support layer, the first sub-support layer is located between the second sub-support layer and the substrate, the second sub-support layer is located between the first sub-support layer and the first crown portion, and an orthogonal projection of the second sub-support layer on the substrate is located within an orthogonal projection of the first sub-support layer; the second support portion includes a third sub-support layer and a fourth sub-support layer, the third sub-support layer is located between the fourth sub-support layer and the substrate, the fourth sub-support layer is located between the third sub-support layer and the second crown portion, and an orthogonal projection of the fourth sub-support layer on the substrate is located within an orthogonal projection of the third sub-support layer; 14. The display panel according to claim 13.

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