Laser processing device

Abstract

To provide a laser processing device that can perform laser processing to objects having different heights or different areas, without need for positioning the objects whenever putting in the objects.SOLUTION: A laser processing device is provided with: a translucent fixed stage 4 which has a contact surface 4k on which an object 3 is arranged in contact therewith and through which processing light 5 can be transmitted along a thickness direction which is a Z-direction crossing an XY plane, toward a processed surface 23a of the object positioned at a surface 35 to be irradiated with processing light disposed along the XY plane having a certain height from the contact surface; an object detecting part 30 that determines an object detection range 21 from detection information on the object on the contact surface; and a processing light emitting part 31 that emits processing light toward the processed surface of the object while transmitting the light through the stage, from the opposite side in the thickness direction of the contact surface side of the stage, on the basis of the object detection range, so as to perform laser processing.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laser processing device that performs laser processing such as surface treatment or peeling without a positioning operation, even when the height and area (or size or outer shape) of an object are different. [Background technology]

[0002] In laser processing, adjusting the focal length is directly linked to processing accuracy, so it is very important to adjust the stage to match the height and area of ​​the target object. In general production processes, the same type of target object is processed, so adjusting the focal length in advance eliminates the need for basic adjustment for each target object.

[0003] However, when objects of different heights or areas are mixed together (for example, in a recycling process), there is a possibility that variations in processing accuracy will occur if the processing is carried out under the same conditions.

[0004] A configuration that takes the above-mentioned problems into consideration has been proposed in a stage such as Patent Document 1.

[0005] In Figure 9, the XY stage 01 that holds the object can be moved in the X-axis or Y-axis direction to be positioned at any position. In addition, the focal length of the object can also be adjusted by adjusting the refractive index of the laser light with a movable beam expander. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 7325819 Summary of the Invention [Problem to be solved by the invention]

[0007] However, the configuration described in Patent Document 1 requires mechanical adjustment of the XY stage or the beam expander each time the type of object is changed, making it difficult to achieve continuous processing. For example, in a situation where a wide variety of objects are input, such as in a recycling process, using the conventional configuration requires mechanical adjustment to match the height and area of ​​each object each time. Therefore, when a variety of objects are input together, continuous processing is difficult.

[0008] The object of the present invention is to solve the above-mentioned conventional problems and to provide a laser processing device that can perform laser processing on objects of different heights or areas without the need to position them each time they are inserted. [Means for solving the problem]

[0009] In order to solve the above problems, a laser processing apparatus according to one aspect of the present invention includes: a light-transmitting fixed stage having a contact surface on which an object is placed in contact, and through which processing light can be transmitted along a thickness direction, which is a Z direction orthogonal to the XY plane, toward a processing surface of the object located on a processing light-planar irradiation target surface along an XY plane at a certain height from the contact surface; an object detection unit that determines an object detection range based on detection information of the object on the contact surface; The laser processing device is provided with a processing light irradiation unit that irradiates the processing light from the opposite side of the thickness direction from the contact surface side of the stage based on the object detection range, passing through the stage and toward the processing surface of the object, thereby performing laser processing. [Effects of the Invention]

[0010] As described above, according to the laser processing device of the above aspect of the present invention, even if the height and area (or size or outer shape) of the object varies, laser processing such as surface treatment or peeling is performed by irradiating the processing light through the stage toward the processing surface of the object located at a constant height relative to the stage on the processing light irradiation target surface based on the object detection range determined by the object detection unit. As a result, laser processing can be achieved without positioning operations, regardless of the height and area (or size or outer shape) of the object. [Brief explanation of the drawings]

[0011] [Figure 1] Schematic diagram of an apparatus according to first and second embodiments of the present invention. [Figure 2] 1 is a cross-sectional view of a laser processing unit according to a first embodiment of the present invention, as viewed from the front of the device; [Figure 3] FIG. 1 is a top view of a stage for explaining an irradiation range determination process for determining a laser irradiation range according to the first embodiment of the present invention. [Figure 4] FIG. 1 is a diagram showing the configuration of an object in first and second embodiments of the present invention; [Figure 5] FIG. 1 is a diagram showing the configuration of an object having a transmission part in first and second embodiments of the present invention; [Figure 6] 1 is a flowchart of the device operation according to the first embodiment of the present invention; [Figure 7] FIG. 10 is a cross-sectional view of the laser processing unit when a plurality of objects are inserted according to the second embodiment of the present invention, as viewed from the front of the device. [Figure 8] FIG. 10 is a top view of a stage for explaining an irradiation range determination process for determining a laser irradiation range when a plurality of objects are placed in the stage according to the second embodiment of the present invention. [Figure 9] An explanatory diagram showing a schematic diagram of the device described in Patent Document 1 DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of FIGS.

[0013] (Embodiment 1) 1 to 3 includes a stage 4, an object detection unit 30, and a processing light irradiation unit 31. This apparatus 1 is an apparatus that performs laser processing such as surface treatment or peeling by irradiating a laser beam onto a processing surface 23a of an object 3 that is positioned at a constant height relative to the stage 4, even if the height or area (or size or outer shape) of the object 3 varies, and does not require positioning relative to the object 3 each time.

[0014] 4, a cross-sectional view of a basic object 3a, which is an example of the object 3, is shown. The basic object 3a is composed of a base material 22 and a processing layer 23, which is an end portion of the base material 22 and is a portion to be processed by laser processing when irradiated with processing light 5. The lower surface of the processing layer 23 or any surface along the XY plane within the processing layer 23 is the processing surface 23a.

[0015] 5, a cross-sectional view of an object 3b with a transmitting object, which is an example of the object 3, is shown. The object 3b with a transmitting object is composed of a base material 22, a processing layer 23 which is an end of the base material 22 and is a portion to be processed by irradiating the processing light 5 and laser processing, and a transmitting object 24 adjacent to the processing layer 23. The lower surface of the processing layer 23 or any surface along the XY plane within the processing layer 23 is the processing surface 23a.

[0016] The substrate 22 is made of, for example, resin, metal, ceramic, or urethane foam, and must be adjacent to the processing layer 23 .

[0017] The processing layer 23 is made of, for example, organic and inorganic compounds, and is vapor-deposited, printed, or attached to the glass of the transparent object 24. However, since it must ultimately be altered by the processing light 5, it must contain a compound containing carbon atoms and an organic substance. Such materials may be, for example, a component of an organic coating that has an azo group, or a polycyclic organic compound such as a phthalocyanine or quinone compound.

[0018] The transparent object 24 is assumed to be made of, for example, a transparent acrylic resin or a glass material such as soda glass or borosilicate glass. The transparent object 24 may be colorless and transparent, but may also be colored as long as it can transmit most of the processing light 5.

[0019] The stage 4 is a translucent fixed stage 4 that has a contact surface 4k along, for example, the XY plane on which the object 3 is placed in contact, and that allows the processing light 5 to pass along the thickness direction, which is the Z direction perpendicular to the XY plane, toward the processing surface 23a of the object 3 that is located at a certain height along the XY plane and is the processing light-scheduled surface 35 along the XY plane from the contact surface 4k. In this specification, the Z direction refers to the up-down direction, for example, the vertical direction, and the XY plane refers to the plane along the lateral direction perpendicular to the up-down direction.

[0020] The object detection unit 30 determines an object detection range from detection information of the object 3 on the contact surface 4k.

[0021] The processing light irradiation unit 31 performs laser processing by irradiating processing light 5 from the opposite side of the thickness direction from the contact surface side of the stage 4, penetrating the stage 4 from bottom to top, toward the processing surface 23a of the object 3 based on the object detection range.

[0022] These configurations are described in detail below.

[0023] The processing light irradiation unit 31 includes a processing light scanning unit 6 that scans the processing light 5 in any direction to process the object 3 placed in contact with the stage 4, a processing light scanning unit movement unit 7 that moves the processing light scanning unit 6 to match the object detection range such as the area of ​​the object 3, an optical light path 8 for the processing light 5, and a light source 9 that generates the processing light 5.

[0024] In addition to the laser processing unit 2, which includes the stage 4, object detection unit 30, and processing light irradiation unit 31, the device also includes a control unit 10 that performs the necessary control for processing, a display unit 11 for operation and display, and an external control unit 12. The object 3 is inserted and removed through a device door 13. Furthermore, a light shielding unit 14 is disposed in the area related to the irradiation range of the processing light 5, and is installed to prevent light generated during processing from leaking to the outside. Here, the area related to the irradiation range of the processing light 5 refers to the area that can be irradiated by the processing light, including, for example, the XY galvanometer movement. The irradiation range refers to the area on the stage to be processed. However, if there is no object on the stage, the processing light will not converge on the surface to be irradiated with the processing light and will penetrate through it. Therefore, specifically, it can also be said to be the area that the processing light would hit if there was no object on the stage.

[0025] The laser processing unit 2 will be described in detail with reference to FIG.

[0026] First, as an example of the stage 4, it may be configured from one processing stage.

[0027] Preferably, as another example of the stage 4, the stage 4 has a two-layer structure consisting of a rectangular plate-shaped base stage 4b ​​and a rectangular plate-shaped processing stage 4a that is placed on top of the base stage 4b ​​and has a contact surface 4k with which the object 3 comes into contact. By configuring the stage 4 as a two-layer structure, even if the processing stage 4a is broken due to an impact when placing the object 3 on the processing stage 4a, the presence of the base stage 4b ​​can prevent broken glass from scattering beneath the device. However, when the stage 4 is configured as a two-layer structure, the transmittance of the processing light 5 tends to be low. To prevent such a decrease in transmittance, it is desirable that the processing stage 4a be thinner than the base stage 4b. While configuring the stage 4 as a two-layer structure improves the maintainability of the device, processing can also be performed without any problems with a single-layer structure.

[0028] Assume that a virtual processing light irradiation surface 35 is located along the XY plane at a certain height from the contact surface 4k of the processing stage 4a. Therefore, when the processing layer 23 including the processing surface 23a is located at the bottom of the object 3 (i.e., 3a) as shown in FIG. 4, placing the object 3 on the contact surface 4k will position the processing surface 23a on the processing light irradiation surface 35, which is zero height above the contact surface 4k. Therefore, as long as the object 3 (i.e., 3a) as shown in FIG. 4 is continuously fed into the apparatus 1, no adjustment of the heightwise positioning is required. Furthermore, as shown in FIG. 5, when the processing layer 23 including the processing surface 23a is located at a predetermined height above the bottom of the object 3 (i.e., 3b), placing the object 3 on the contact surface 4k will position the processing surface 23a on the processing light irradiation surface 35, which is a predetermined height above the contact surface 4k. Therefore, as long as the object 3 (i.e., 3b) as shown in FIG. 5 is continuously fed into the apparatus 1, no adjustment of the heightwise positioning is required.

[0029] The processing stage 4a and the base stage 4b ​​are each assumed to be made of, for example, a transparent acrylic resin or a glass material such as soda glass or borosilicate glass. The processing stage 3a and the base stage 4b ​​may each be colorless and transparent, or may be colored as long as they can transmit most of the processing light 5. For example, it is preferable that the light transmittance of the stage 4 be 80% or more and 100% or less, because this reduces energy loss of the processing light and because a light transmittance lower than 80% may cause the processing light to be absorbed by the stage itself, generating heat and potentially leading to deformation or cracking of the stage.

[0030] Furthermore, a processing stage anti-reflection film 4c may be disposed on a plane of the processing stage 4a that does not contact the object 3 (e.g., the underside of the processing stage 4a in FIG. 2) to suppress attenuation of the processing light 5. Furthermore, a substrate stage anti-reflection film 4d may be attached to both the top and bottom surfaces of the substrate stage 4b ​​in FIG. 2 for the same purpose. As an example, an anti-reflection film may be disposed on at least one of the following surfaces: the surface of the processing stage 4a facing the substrate stage (e.g., the underside of the processing stage 4a in FIG. 2), the surface of the substrate stage 4b ​​facing the processing stage (e.g., the top surface of the substrate stage 4b ​​in FIG. 2), and the surface of the substrate stage 4b ​​on the processing light incident side (e.g., the underside of the substrate stage 4b ​​in FIG. 2). The anti-reflection film is preferably an anti-reflection film with a heat resistance temperature of 140°C or higher to prevent deformation or deterioration due to heat absorption of the processing light.

[0031] The processing stage anti-reflection film 4c and the base stage anti-reflection film 4d are each assumed to be a resin film material with optical properties similar to those of the stage material, such as polyethylene terephthalate or triacetyl cellulose. From the viewpoint of processing, it is particularly preferable that most of the processing light 5 is transmitted, since a low transmittance of the processing light 5 increases the energy loss required for processing and prevents deterioration of the film and stage 4 due to heat absorption.

[0032] The object detection unit 30 has at least an object detection sensor light-projecting unit 15, an object detection sensor light-receiving unit 16, and an irradiation range determining unit 18, and is configured as follows.

[0033] The longitudinal direction of the stage 4 is the vertical direction, e.g., the Y direction, and the lateral direction is the horizontal direction, e.g., the X direction. To determine the irradiation range, which is the object detection range, at least a pair of detection sensors, an object detection sensor light-emitting unit 15 and an object detection sensor light-receiving unit 16, are installed according to the height and area (or outer shape) of the object 3. The irradiation range is determined by an irradiation range determination unit 18 based on the detection information of the pair of detection sensors. This will be explained later with reference to FIG. 3.

[0034] The processing light irradiation unit 31 includes at least a light source 9, a processing light scanning unit 6, and a processing light scanning unit moving unit 7, and is configured as follows.

[0035] The processing light 5 that contributes to the actual processing is emitted from a light source 9, passes through an optical path 8, and is scanned by a processing light scanning unit 6. The processing light 5 can be moved using the processing light scanning unit 6 and a processing light scanning unit moving unit 7 so as to irradiate the determined irradiation range.

[0036] The processing light 5 must pass through the stage 4. Since the wavelength range that can be transmitted through the glass or acrylic used in the stage 4 is 300 nm to 3 μm, it is preferable that the wavelength of the processing light 5 is 300 nm or more and 3 μm or less, and in practical terms, it is particularly preferable that the wavelength is 355 nm or more and 2 μm or less.

[0037] The optical path 8 is an optical system that propagates the processing light 5 emitted from the light source 9 to the processing light scanning unit 6, and is composed of optical components such as optical fibers, optical lenses, or a beam expander.

[0038] The processing light scanning unit 6 includes a mirror (not shown), a rotary shaft attached to the mirror, and a drive and control device for driving and controlling the rotary shaft. The processing light scanning unit 6 can freely deflect the light incident on the mirror in one dimension. That is, by combining two processing light scanning units 6, it is possible to deflect the processing light 5 in two dimensions, i.e., to a predetermined position on the processing area occupying a fixed planar area on the contact surface 4k of the stage 4 (i.e., a predetermined position on the processing light-to-be-irradiated surface 35 along the XY plane at a fixed height from the contact surface 4k).

[0039] The processing light scanning unit moving unit 7 is a mechanism that enables the position of the processing light scanning unit 6 to be moved vertically and horizontally on the XY plane, and is configured, for example, by a vacuum actuator or an electric slider. For example, the processing light scanning unit moving unit 7 is configured with a horizontal moving unit 7b that supports a moving base 17 having the processing light scanning unit 6 so that it can move laterally and performs scanning in the horizontal direction, and a vertical moving unit 7a that supports the horizontal moving unit 7b so that it can move vertically and performs scanning in the vertical direction. By integrating the moving base 17 with the processing light scanning unit moving unit 7, processing with the processing light 5 is possible even if the target object 3 is placed in a different arbitrary position on the contact surface 4k of the stage 4 each time.

[0040] FIG. 3 illustrates the detection sensor in detail using a top view of the stage 4. An object detection sensor light-projecting unit 15 and an object detection sensor light-receiving unit 16 are arranged facing each other around the rectangular contact surface 4k of the stage 4 to detect an object 3 placed on the contact surface 4k of the stage 4, and are also connected to an irradiation range determining unit 18. Specifically, multiple pairs of vertical object detection sensor light-projecting units 15a and vertical object detection sensor light-receiving units 16a are arranged in the vertical direction, and multiple pairs of horizontal object detection sensor light-projecting units 15b and horizontal object detection sensor light-receiving units 16b are arranged in the horizontal direction, and are assigned arbitrary channel numbers CH1, CH2, CH3, .... Light is emitted from the object detection sensor light-projecting unit 15 and received by the object detection sensor light-receiving unit 16. At that time, the object 3 placed on the stage 4 blocks the vertical object detection sensor optical path 19 and the horizontal object detection sensor optical path 20, thereby blocking light from entering the object detection sensor light receiving unit 16. The presence or absence of these transmissions and receptions of light is input as detection information to the irradiation range determination unit 18. Therefore, the irradiation range determination unit 18 determines the area between the channel just before the smallest blocked channel number and the channel just after the largest channel number as an irradiation range 21, which is an example of the object detection range. Information about the determined irradiation range 21 is sent to the control unit 10 and used for processing light scanning, etc.

[0041] It is assumed that the object detection sensor light-emitting unit 15 and the object detection sensor light-receiving unit 16 are sensors that have the function of switching on and off depending on whether or not light is received.

[0042] As another example of the object detection range, when it is only necessary to detect the presence or absence of the object 3, for example, when the size of the processed surface 2 of the object 3 is the same as that of the contact surface 4k, it is sufficient to arrange a pair of detection sensors, i.e., the object detection sensor light-emitting unit 15 and the object detection sensor light-receiving unit 16, in either the vertical or horizontal direction, instead of multiple pairs.

[0043] 6 is a flowchart according to embodiment 1. The following processing is performed under the control of the control unit 10 as necessary.

[0044] First, in step S01, the device door 13 is opened and the target object 3 is placed at an arbitrary position on the stage 4. After the placement is completed, the device door 13 is closed.

[0045] Next, in step S02, detection information of the channel number related to on / off from the object detection sensor light-emitting unit 15 and the object detection sensor light-receiving unit 16 detected by the placement of the object 3 is obtained and output to the irradiation range determination unit 18.

[0046] Next, in step S03, the coordinates and outer shape of the irradiation range 21 are determined by the irradiation range determination unit 18 as the object detection range from the channel number in which the object 3 was detected by the object detection sensor light-projecting unit 15 and the object detection sensor light-receiving unit 16 in step S02, and information on the determined irradiation range 21 is output to the control unit 10. Note that if the irradiation range 21 is larger than the scanning range, the irradiation range 21 may be divided into multiple irradiation ranges 21, and the scanning range may be moved to each irradiation range 21 for scanning. The scanning range is moved to the center position of the irradiation range 21, and scanning and irradiation are performed. At this point, the processing is completed.

[0047] Next, in step S06, the apparatus door 13 is opened, and the processed object 3 is removed and collected.

[0048] As described above, according to the laser processing apparatus of the first embodiment, even if the height and area (or size or outer shape) of the object 3 vary, laser processing such as surface treatment or peeling is performed by irradiating the processing light 5 from bottom to top through the stage 4 toward the processing surface 23a of the object 3 located on the processing light intended irradiation surface 35 at a constant height relative to the stage 4 based on the irradiation range 21 as the object detection range determined by the object detection unit 30. As a result, laser processing such as surface treatment or peeling can be performed regardless of the height and area (or size or outer shape) of the object 3 without going through a positioning operation (in other words, there is no need to adjust the positioning or the focal depth each time the object 3 is inserted).

[0049] In other words, in the first embodiment, to maintain a constant height of the processing surface 23a of the object 3 by positioning it at the processing light irradiation surface 35, a translucent fixed stage 3 that transmits the processing light 5 is installed, and the processing surface 23a is simply positioned close to the contact surface 4k of the stage 3. This eliminates the need for adjustments to maintain a constant work distance, and the processing light 5 is irradiated from below upward. To achieve this, the translucent stage 3 is constructed of a glass material with high transmittance and heat resistance to prevent attenuation of the laser output and to provide heat resistance during processing. However, since the processing surface 23a is close to the stage 3, there is a risk of contamination adhering to the stage surface during processing. Furthermore, since the object is placed directly on the transparent stage, there is a risk of damage to the transparent stage. For this reason, as an example, the transparent stage may be constructed of two layers, allowing only the top surface to be replaced for maintenance or in the event of damage. A transmittance-improving anti-reflection film may be attached to one of the remaining three surfaces, except for the contact surface 4k, to prevent deterioration due to the laser, and the bottom surface may have a shatterproof function.

[0050] (Embodiment 2) In embodiment 1, the object 3 is inserted through the device door 13, and for the object 3 placed in contact with the stage 4, the irradiation range determination unit 18 calculates the irradiation range 21 into which the processing light 5 is irradiated, and the processing light scanning unit movement unit 7 and the processing light scanning unit 6 are linked to irradiate the processing light 5 within the irradiation range 21, thereby achieving laser processing of the object 3.

[0051] However, the present invention is not limited to this, and even when there are multiple objects 3, it is possible to continuously process multiple objects 3 on the contact surface 4k without performing an insertion operation and an object detection operation for each object 3. That is, multiple objects 3 are placed in contact with the contact surface 4k of the stage 4, and then the irradiation range determination unit 18 calculates an irradiation range 21 that includes the multiple objects 3. By interlocking the processing light scanning unit movement unit 7 and the processing light scanning unit 6, the processing light 5 is irradiated into the irradiation range 21, thereby achieving continuous laser processing of the multiple objects 3.

[0052] 7, the laser processing unit 2 will be described in detail. The objects 3c and 3d are placed in contact with the contact surface 4k of the processing stage 4a so that the processing surfaces 23a of the objects 3c and 3d are positioned at a predetermined height on the same processing light irradiation target surface 35. Other elements are the same as those in the first embodiment.

[0053] The objects 3c and 3d do not have to be of the same type, but may have different areas or sizes as long as the processing surfaces 23a of the objects 3c and 3d are positioned on the same processing light irradiation surface 35 when the processing surfaces 23a are placed on the stage side.

[0054] 8, the illumination range determination unit 18 will be described in detail. As in the first embodiment, for the objects 3c and 3d placed on the stage 4, the light entering the object detection sensor light receiving unit 16 is blocked by turning on and off the light entering the object detection sensor light receiving unit 16. The illumination range 21 is determined to be the area between the channel just before the smallest blocked channel number and the channel just after the largest channel number. The illumination range determination unit 18 determines the area that includes all the light receiving units 16 that are turned off in the vertical and horizontal directions as the illumination range 21.

[0055] As described above, according to the laser processing apparatus of embodiment 2, the irradiation range determination unit 18 calculates the irradiation range 21 that includes the multiple objects 3c, 3d, and laser processing is performed based on the calculated irradiation range 21. Therefore, it is possible to laser process the multiple objects 3c, 3d continuously without performing positioning operations, regardless of the height or area of ​​the objects 3c, 3d.

[0056] It should be noted that any of the various embodiments or modifications described above can be appropriately combined to achieve the effects of each. In addition, combinations of embodiments, combinations of examples, or combinations of embodiments and examples are possible, and combinations of features from different embodiments or examples are also possible.

[0057] (Addendum) The above description of the embodiments discloses the following techniques.

[0058] (Technology 1) A light-transmitting fixed stage having a contact surface on which an object is placed in contact, and through which processing light can be transmitted along a thickness direction, which is a Z direction perpendicular to the XY plane, toward a processing surface of the object located on a processing light-planar irradiation surface along an XY plane at a certain height from the contact surface; an object detection unit that determines an object detection range based on detection information of the object on the contact surface; a processing light irradiation unit that irradiates the processing light from the opposite side of the thickness direction from the contact surface side of the stage based on the object detection range, passing through the stage and toward the processing surface of the object to perform laser processing. (Technology 2) The laser processing apparatus described in Technology 1, wherein the Z direction of the stage is a vertical direction, and the processing light passes through the stage from below upward along the vertical direction and is irradiated toward the processing surface of the object. (Technology 3) The object detection unit is a detection sensor that acquires detection information of the object on the contact surface of the stage along an XY plane; and an irradiation range determination unit that determines a laser irradiation range of the processing light to be irradiated toward the processing surface as the object detection range based on the detection information from the detection sensor. (Technology 4) The laser processing device described in Technology 3, wherein the irradiation range determination unit determines, based on the detection information, a single laser irradiation range that encompasses all of the objects when there are multiple objects, as the object detection range. (Technology 5) The laser processing device according to any one of Technologies 1 to 4, wherein the light transmittance of the stage is 80% or more and 100% or less. (Technology 6) A laser processing apparatus according to any one of technologies 1 to 5, wherein the stage has a two-layer structure consisting of a base stage and a processing stage that is placed on top of the base stage and has the contact surface with which the object comes into contact. (Technology 7) A laser processing apparatus according to Technology 6, in which an anti-reflection film having a heat resistance temperature of 140 degrees or higher is disposed on at least one of the surfaces of the stage facing the substrate stage, the surface of the substrate stage facing the substrate stage, and the surface of the substrate stage on which the processing light is incident.

[0059] According to each of these configurations, even if the height and area (or size or outer shape) of the object varies, laser processing such as surface treatment or peeling processing is performed by irradiating the processing light through the stage toward the processing surface of the object located on the processing light irradiation target surface at a constant height relative to the stage based on the object detection range determined by the object detection unit. As a result, laser processing can be achieved without positioning operations, regardless of the height and area (or size or outer shape) of the object. [Industrial Applicability]

[0060] The laser processing apparatus according to the above aspect of the present invention eliminates the need for adjustments to keep the height of the processing surface constant by simply installing a stage that transmits the laser and positioning the processing surface close to the object contact surface of the stage. This is useful, for example, when processing a wide variety of objects in a recycling process where the number of objects increases daily. [Explanation of symbols]

[0061] 1. Laser processing equipment 2 Laser processing section 3. Object 3a Basic object 3b Object with transparent object 3c Object a 3d object b 4 Stages 4a Processing stage 4b Foundation Stage 4c Processing stage anti-reflection film 4D base stage anti-reflective film 4k contact surface 5. Processing light 6 Processing light scanning unit 7 Processing light scanning unit moving unit 7a Vertical moving part 7b Lateral moving part 8 light path 9 light source 10 Control Unit 11 Display section 12 External control unit 13 Equipment door 14 Light shielding part 15 Object detection sensor light emitter 15a Vertical object detection sensor light projector 15b Lateral object detection sensor light projecting unit 16 Object detection sensor light receiving unit 16a Vertical object detection sensor light receiving part 16b Lateral object detection sensor light receiving part 17 Mobile Base 18 Irradiation range determination unit 19. Vertical object detection sensor optical path 20 Lateral object detection sensor optical path 21 Irradiation range 22 Base material 23 Processing layer 24 Transparent object 30 Object detection unit 31 Treatment light irradiation unit 35 Surface to be irradiated with treatment light 01 XY stage

Claims

1. a translucent fixed stage having a contact surface on which an object is placed in contact, and through which processing light can be transmitted along a thickness direction, which is a Z direction orthogonal to the XY plane, toward a processing surface of the object located on a processing light irradiation target surface along an XY plane at a certain height from the contact surface; an object detection unit that determines an object detection range based on detection information of the object on the contact surface; a processing light irradiation unit that irradiates the processing light from the opposite side of the thickness direction from the contact surface side of the stage based on the object detection range, passing through the stage and toward the processing surface of the object to perform laser processing.

2. 2. The laser processing apparatus according to claim 1, wherein the Z direction of the stage is a vertical direction, and the processing light passes through the stage from below upward along the vertical direction and is irradiated toward the processing surface of the object.

3. The object detection unit a detection sensor that acquires detection information of the object on the contact surface of the stage along an XY plane; 3. The laser processing device according to claim 1, further comprising an irradiation range determination unit that determines a laser irradiation range of the processing light to be irradiated toward the processing surface as the object detection range based on the detection information from the detection sensor.

4. 4. The laser processing device according to claim 3, wherein when there are a plurality of objects, the irradiation range determination unit determines, based on the detection information, one laser irradiation range that includes all of the objects as the object detection range.

5. 3. The laser processing apparatus according to claim 1, wherein the stage has a light transmittance of 80% or more and 100% or less.

6. 3. The laser processing device according to claim 1, wherein the stage has a two-layer structure including a base stage and a processing stage that is placed on top of the base stage and has the contact surface with which the object comes into contact.

7. The laser processing apparatus of claim 6, wherein an anti-reflection film having a heat resistance temperature of 140 degrees or higher is disposed on at least one of the surfaces of the stage facing the substrate stage, the surface of the stage facing the substrate stage, and the surface of the stage facing the processing light incident side.

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