Resin composition, adhesive member, and display device including adhesive member

Abstract

To provide a resin composition which exhibits low viscosity characteristics before curing, and exhibits low elastic modulus and high adhesive force after curing, an adhesive member composed of the resin composition, and a display device including the adhesive member.SOLUTION: In an embodiment, the resin composition can contain at least one monofunctional (meth)acrylate monomer, organopolysiloxane, and at least one photoinitiator containing a radical polymerization initiator. In an embodiment, the resin composition has shear viscosity measured at a temperature of 25°C according to JIS Z 8803 of 5 mPa s or more and 50 mPa s or less, a storage elastic modulus measured in a shear mode at a temperature of -20°C after photocuring and a frequency of 1 Hz by a dynamic viscoelasticity measurement method of 1 MPa or less, and a loss tangent measured in a shear mode at a temperature of -20°C after photocuring and a frequency of 1 Hz by a dynamic viscoelasticity measurement method of 2.0 or more, and can be optically transparent after photocuring.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a resin composition containing an organopolysiloxane, an adhesive member made of the resin composition, and a display device including the adhesive member. [Background technology]

[0002] Various display devices have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles, etc. In particular, recently, development has been underway regarding display devices that can be folded, bent, or rolled up using flexible display members to facilitate portability and improve user convenience. Adhesive resins used to form adhesive layers applied to display devices of various shapes are required to have excellent coating properties with respect to display device members of various shapes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent Publication No. 10-2019-0049521 [Patent Document 2] Korean Patent Registration No. 10-2315376 [Patent Document 3] US Patent Application Publication No. 2022 / 380591 [Patent Document 1] Korean Patent Publication No. 10-2023-0047164 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a resin composition that exhibits low viscosity characteristics before curing and a low elastic modulus and high adhesive strength after curing, an adhesive member made of the resin composition, and a display device that includes the adhesive member. [Means for solving the problem]

[0005] One embodiment provides a resin composition comprising at least one monofunctional (meth)acrylate monomer, an organopolysiloxane, and at least one photoinitiator including a radical polymerization initiator; the resin composition has a shear viscosity of 5 mPa s to 50 mPa s at 25°C as measured according to JIS Z8803, a storage modulus of 1 MPa or less as measured by dynamic viscoelasticity measurement in a shear mode at −20°C and a frequency of 1 Hz after photocuring, and a loss tangent (tan δ) of 2.0 or greater as measured by dynamic viscoelasticity measurement in a shear mode at −20°C and a frequency of 1 Hz after photocuring, and is optically transparent after photocuring.

[0006] The weight of the organopolysiloxane may be 5 wt % or more and less than 35 wt % based on the total weight of the resin composition (100 wt %).

[0007] The organopolysiloxane may have a weight average molecular weight of 500 or more and less than 50,000.

[0008] The organopolysiloxane may be free of radically polymerizable groups.

[0009] After photocuring, the resin composition may have a 180° peel strength of 300 gf / 25 mm or more at a temperature of 25° C. from at least one of a polymer substrate and a glass substrate.

[0010] The resin composition may be solvent-free.

[0011] The monofunctional (meth)acrylate monomer may include at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and 2-ethylhexyl-diglycol acrylate (EHDG-AT).

[0012] The weight of the monofunctional (meth)acrylate monomer may be 60 wt % or more and 85 wt % or less, based on 100 wt % of the total weight of the resin composition.

[0013] The resin composition may further contain a urethane (meth)acrylate oligomer.

[0014] The resin composition may further contain a silane coupling agent.

[0015] The resin composition may have a glass transition temperature of −46° C. or higher and −39° C. or lower after photocuring.

[0016] The resin composition can be applied by inkjet printing or dispensing.

[0017] One embodiment provides an adhesive member comprising a polymer derived from an optically transparent resin composition having a storage modulus of 1 MPa or less as measured by dynamic viscoelasticity measurement in shear mode at a temperature of −20°C and a frequency of 1 Hz, and a loss tangent (tanδ) of 2.0 or more as measured by dynamic viscoelasticity measurement in shear mode at a temperature of −20°C and a frequency of 1 Hz, wherein the resin composition comprises at least one monofunctional (meth)acrylate monomer, an organopolysiloxane, and at least one photoinitiator including a radical polymerization initiator, and the resin composition has a shear viscosity of 5 mPa s or more and 50 mPa s or less as measured in accordance with JIS Z8803 at 25°C.

[0018] The adhesive member may have a 180° peel strength of 300 gf / 25 mm or more at a temperature of 25° C. to at least one of a polymer substrate and a glass substrate.

[0019] The adhesive member may have a glass transition temperature of -46°C or higher and -39°C or lower.

[0020] One embodiment provides an electronic device comprising: a display panel; a window disposed on the display panel; and an adhesive member disposed between the display panel and the window, the adhesive member having a storage modulus of 1 MPa or less as measured by dynamic viscoelasticity measurement in a shear mode at a temperature of −20°C and a frequency of 1 Hz, a loss tangent (tanδ) of 2.0 or more as measured by dynamic viscoelasticity measurement in a shear mode at a temperature of −20°C and a frequency of 1 Hz, and comprising a polymer derived from a resin composition that is optically transparent; the resin composition comprises at least one monofunctional (meth)acrylate monomer, an organopolysiloxane, and at least one photoinitiator including a radical polymerization initiator; and the resin composition has a shear viscosity of 5 mPa s or more and 50 mPa s or less as measured in accordance with JIS Z8803 at 25°C.

[0021] The electronic device may further include an input sensing unit disposed between the display panel and the window, and the adhesive member may be disposed between the display panel and the input sensing unit or between the input sensing unit and the window. [Effects of the Invention]

[0022] The resin composition of one embodiment contains an organopolysiloxane and can exhibit low viscosity characteristics.

[0023] An adhesive member of one embodiment includes a polymer derived from the resin composition of one embodiment, and can exhibit excellent flexibility and excellent adhesive reliability.

[0024] An electronic device according to an embodiment includes the adhesive member according to an embodiment and can exhibit excellent reliability. [Brief explanation of the drawings]

[0025] [Figure 1a] 1 is a perspective view showing a display device according to an embodiment; [Figure 1b] 1 is a perspective view showing a display device according to an embodiment; [Figure 1c] 1 is a plan view illustrating a display device according to an embodiment. [Figure 1d]1 is a perspective view showing a display device according to an embodiment; [Figure 2] 1 is an exploded perspective view showing a display device according to an embodiment; [Figure 3] FIG. 3 is a cross-sectional view showing a portion corresponding to line II' in FIG. 2. [Figure 4] 1 is a cross-sectional view showing a part of a display device according to an embodiment. [Figure 5a] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment. [Figure 5b] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment. [Figure 5c] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment. [Figure 5d] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment. [Figure 6a] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment. [Figure 6b] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment. [Figure 6c] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment. [Figure 7] 1 is a cross-sectional view showing a display device according to an embodiment. [Figure 8] 1 is a cross-sectional view showing a display device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0026] Because the present invention can be modified in various ways and can take various forms, specific embodiments are shown by way of example in the drawings and described in detail herein, but it is to be understood that this is not intended to limit the invention to the particular disclosed form, but rather to include all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention.

[0027] As used herein, when a component (or region, layer, portion, etc.) is referred to as being "on" or "coupled" to another component, it means that it may be directly positioned, coupled, or connected to the other component, or that a third component may be disposed therebetween.

[0028] The same reference numerals refer to the same elements. In the drawings, the thickness, proportions, and dimensions of the elements are exaggerated for the purpose of effectively explaining the technical content. "And / or" includes all combinations of one or more elements defined by the associated elements.

[0029] Terms such as "first" and "second" are used to describe various components, but the components are not limited to these terms. These terms are used only to distinguish one component from another. For example, a first component may be designated as a "second component" without departing from the scope of the present invention, and similarly, a second component may be designated as a "first component." A singular expression includes a plural expression unless the context clearly dictates otherwise.

[0030] Furthermore, terms such as "under," "below," "on," and "above" are used to describe the relationship between components shown in the drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0031] It should be understood that the terms "comprise" or "have" and the like specify the presence of any feature, number, step, operation, component, part, or combination thereof set forth above in the specification, but do not preclude the presence or possible addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0032] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person skilled in the art to which the present invention belongs. Furthermore, terms that are the same as those defined in commonly used dictionaries should be interpreted to have a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an overly ideal or formal sense unless explicitly defined herein.

[0033] An adhesive member according to an embodiment of the present invention and a display device including the same will be described below with reference to the accompanying drawings, in which: Figure 1a is a perspective view of a display device DD in an unfolded state according to an embodiment of the present invention;

[0034] In one embodiment, the display device DD may be a device activated by an electrical signal. For example, the display device DD may be, but is not limited to, a mobile phone, a tablet, a car navigation system, a game console, or a wearable device. In FIG. 1a and other figures, the display device DD is exemplarily shown as a mobile phone. In this specification, the electronic device may be or include the display device DD.

[0035] The display device DD may include a first display surface FS defined by a first directional axis DR1 and a second directional axis DR2 intersecting the first directional axis DR1. The display device DD may provide an image IM to a user through the first display surface FS. The display device DD may display the image IM on the first display surface FS in the direction of a third directional axis DR3 parallel to each of the first directional axis DR1 and the second directional axis DR2.

[0036] In this specification, the first directional axis DR1 and the second directional axis DR2 are perpendicular to each other, and the third directional axis DR3 may be a normal direction to a plane defined by the first directional axis R1 and the second directional axis DR2. The thickness direction of the display device DD may be aligned with the third directional axis DR3. The front (or top) and rear (or bottom) surfaces are opposed to each other along the third directional axis DR3, and the normal directions of the front (or top) and rear (or bottom) surfaces may be parallel to the third directional axis DR3. The front (or top) surface refers to a surface adjacent to the first display surface FS, and the rear (or bottom) surface refers to a surface spaced apart from the first display surface FS. Alternatively, the rear (or bottom) surface refers to a surface close to the second display surface RS (described later). The upper side refers to a direction approaching the first display surface FS, and the lower side refers to a direction away from the first display surface FS.

[0037] The cross section refers to a surface aligned with the thickness direction DR3, and the plane refers to a surface perpendicular to the thickness direction DR3. The plane refers to a plane defined by the first direction axis DR1 and the second direction axis DR2.

[0038] The directions indicated by the first to third directional axes DR1, DR2, and DR3 described herein are relative concepts and may be converted into other directions. Furthermore, the directions indicated by the first to third directional axes DR1, DR2, and DR3 may be referred to as the first to third directions, and the same reference numerals may be used.

[0039] The display device DD may detect external inputs applied from the outside. The external inputs may include various types of inputs provided from outside the display device DD. For example, the external inputs may include contact with a part of the user's body, such as a hand, as well as external inputs applied in close proximity to the display device DD or adjacent at a predetermined distance (e.g., hovering). The external inputs may also have various forms, such as force, pressure, temperature, and light.

[0040] The display device DD may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be defined as a surface opposite to at least a portion of the first display surface FS. In other words, the second display surface RS may be defined as a portion of the rear surface of the display device DD.

[0041] The first active area F-AA may be an area activated by an electrical signal, where an image IM is displayed and where various types of external inputs can be sensed.

[0042] The first peripheral area F-NAA may be adjacent to the first active area F-AA. The first peripheral area F-NAA may have a predetermined color. The first peripheral area F-NAA may surround the first active area F-AA. As a result, the shape of the first active area F-AA may be substantially defined by the first peripheral area F-NAA. However, this is merely an example, and the first peripheral area F-NAA may be disposed on only one side of the first active area F-AA or may be omitted.

[0043] Various electronic modules may be arranged in the electronic module area EMA. For example, the electronic module may include at least one of a camera, a speaker, a light sensor, and a heat sensor. The electronic module area EMA may detect an external object received via the display surfaces FS and RS, or provide an audio signal such as a voice to the outside via the display surfaces FS and RS. The electronic module may include multiple components and is not limited to any one embodiment.

[0044] The electronic module area EMA may be surrounded by a first peripheral area F-NAA. However, this is merely an example and is not limited to any one embodiment. For example, the electronic module area EMA may be surrounded by a first active area F-AA and a first peripheral area F-NAA, and the electronic module area EMA may be disposed within the first active area F-AA.

[0045] In one embodiment, the display device DD may be a flexible display device. The display device DD may include at least one folding area FA and multiple non-folding areas NFA1 and NFA2 extending from the folding area FA. For example, a first non-folding area NFA1, a folding area FA, and a second non-folding area NFA2 may be defined along the second direction DR2. In one embodiment, the display device DD may include the first non-folding area NFA1 and the second non-folding area NFA2 spaced apart from each other in the second direction DR2 with the folding area FA interposed therebetween. For example, the first non-folding area NFA1 may be disposed on one side of the folding area FA along the second direction DR2, and the second non-folding area NFA2 may be disposed on the other side of the folding area FA along the second direction DR2.

[0046] 1a and other figures illustrate an embodiment of a display device DD including one folding area FA, but the illustrative example is not limited to this, and multiple folding areas may be defined in the display device DD. For example, a display device according to an embodiment may include three or more folding areas, and may also include two or more non-folding areas sandwiched between folding areas.

[0047] Figure 1b is a perspective view showing a folding operation of the display device DD according to an embodiment, Figure 1c is a plan view of the display device DD in a folded state according to an embodiment, and Figure 1d is a perspective view showing a folding operation of the display device DD according to an embodiment.

[0048] 1b, a display device DD according to an embodiment may be folded about a first folding axis FX1 extending in a first direction DR1. When the display device DD is folded, the folding area FA may have a predetermined curvature and radius of curvature. When the display device DD is folded about the first folding axis FX1, the first non-folding area NFA1 and the second non-folding area NFA2 face each other, and the display device DD may be transformed into an in-folding state so that the first display surface FS is not exposed to the outside.

[0049] 1c, when the display device DD according to an embodiment is folded inward, a second display surface RS may be visible to a user. In this case, the second display surface RS may include a second active area R-AA that displays an image. The second active area R-AA may be an area activated by an electrical signal. The second active area R-AA may be an area where an image is displayed and where various types of external inputs may be sensed.

[0050] The second peripheral region R-NAA may be adjacent to the second active region R-AA. The second peripheral region R-NAA may have a predetermined color. The second peripheral region R-NAA may surround the second active region R-AA. Meanwhile, although not shown, the display device DD may further include an electronic module region on the second display surface RS where electronic modules having various configurations are arranged, and the present invention is not limited to any one embodiment.

[0051] 1d, the display device DD according to an embodiment may be folded about a second folding axis FX2 extending in a first direction DR1. The display device DD may be folded about the second folding axis FX2 to transform into an out-folding state such that the first display surface FS is exposed to the outside. In an embodiment, the display device DD may be configured to alternate between being unfolded and being folded inward or outward, but is not limited thereto.

[0052] 1a to 1d illustrate folding based on a folding axis FX1 or FX2, but the number of folding axes and the corresponding number of non-folding regions are not limited thereto. For example, folding based on multiple folding axes may be performed such that a portion of the first display surface FS and a portion of the second display surface RS face each other. Also, while the first and second folding axes FX1 and FX2 are shown aligned with the long side of the display device DD, the present embodiment is not limited thereto, and the first and second folding axes FX1 and FX2 may be aligned with the short side of the display device DD.

[0053] In the display device DD, the first non-folding area NFA1 and the second non-folding area NFA2 may be defined as portions having display surfaces FS and RS aligned with the plane defined by the first directional axis DR1 and the second directional axis DR2 in the folded state as shown in Fig. 1c, and the folding area FA may be defined as the area between the first non-folding area NFA1 and the second non-folding area NFA2. The folding area FA may include a curved surface portion that is bent to have a predetermined curvature in the folded state.

[0054] 2 is an exploded perspective view showing a display device DD according to an embodiment. Referring to FIG. 2, the display device DD according to an embodiment may include a display module DM, a window WP disposed on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. The display device DD may further include a support member SM disposed below the display module DM, a protective layer PF disposed on the window WP, and a housing HAU that houses the display module DM, the support member SM, etc.

[0055] The housing HAU may include a material having a relatively high rigidity. For example, the housing HAU may include a plurality of frames and / or plates made of glass, plastic, or metal. The housing HAU may provide a predetermined storage space. The display module DM may be stored in the storage space and protected from external impacts.

[0056] The support member SM may include a metal material or a polymer material. For example, the support member SM may be formed of stainless steel, aluminum, or an alloy thereof. Alternatively, the support member SM may be made of carbon fiber reinforced plastic (CFRP). However, the embodiment is not limited thereto, and the support member SM may include a non-metallic material, plastic, glass fiber reinforced plastic, or glass. Unlike the illustration, the support member SM may be omitted.

[0057] Although not shown, the display device DD may further include a cushioning layer, a shielding layer, etc., disposed under the support member SM. The cushioning layer may include sponge, foam, or an elastomer such as urethane resin. The shielding layer may be an electromagnetic wave shielding layer or a heat dissipation layer.

[0058] The display module DM may be activated by an electrical signal. When activated, the display module DM may display an image IM (FIG. 1a) on a display surface FS (FIG. 1a) of the display device DD. A display area AA-DM and a non-display area NAA-DM may be defined in the display module DM. The display area AA-DM may be an area activated by an electrical signal. The non-display area NAA-DM may be an area located adjacent to at least one side of the display area AA-DM. Circuits and wiring for driving the display area AA-DM may be arranged in the non-display area NAA-DM.

[0059] An adhesive member AP may be disposed on the display module DM. The display module DM and the window WP may be bonded together by the adhesive member AP. The adhesive member AP may be optically transparent. Optically transparent means that the adhesive member AP has a transmittance of 80% or more for light in the visible wavelength range. For example, the adhesive member AP may have a transmittance of 80% or more for light in the wavelength range of 400 nm to 800 nm.

[0060] An adhesive member AP according to one embodiment may contain a polymer derived from a resin composition RC according to one embodiment (FIGS. 5a and 6a) described below. The adhesive resin AP may be composed of a resin composition RC according to one embodiment (FIGS. 5a and 6a). An adhesive member AP composed of a resin composition RC according to one embodiment (FIGS. 5a and 6a) may exhibit excellent flexibility and excellent adhesive strength. In one embodiment, a display device DD including an adhesive member AP composed of a resin composition RC (FIGS. 5a and 6a) may exhibit excellent reliability.

[0061] The window WP may include a glass substrate. The window WP may protect the display module DM and the like. An image IM (FIG. 1a) generated by the display panel DM may be transmitted through the window WP and provided to a user. For example, the window WP may include UTG (Ultra Thin Glass).

[0062] The window WP may include a transparent area TA and a bezel area BZA. The transparent area TA may overlap at least a portion of the display area AA-DM of the display module DM. The transparent area TA may be an optically transparent area. An image IM (FIG. 1a) may be provided to a user through the transparent area TA.

[0063] The bezel region BZA may be a region having a relatively low light transmittance compared to the transmissive region TA. The bezel region BZA may define the shape of the transmissive region TA. The bezel region BZA may be adjacent to the transmissive region TA and surround the transmissive region TA.

[0064] The bezel area BZA may have a predetermined color. The bezel area BZA may cover the non-display area NAA-DM of the display module DM and block the non-display area NAA-DM from being viewed from the outside. However, the embodiment is not limited thereto, and the bezel area BZA may be disposed adjacent to only one side of the transmissive area TA, or at least a portion of the bezel area BZA may be omitted.

[0065] The protective layer PF may be a functional layer that protects one surface (e.g., the top surface) of the window WP. The protective layer PF may include an anti-fingerprint coating agent, a hard coating agent, an anti-static agent, etc. Although not shown, an auxiliary adhesive may be disposed between the window WP and the protective layer PF. Unlike the illustration, the protective layer PF may be omitted.

[0066] Fig. 3 is a cross-sectional view showing a portion corresponding to line II' in Fig. 2. Fig. 3 is a cross-sectional view showing a display device DD according to one embodiment. For convenience of explanation, Fig. 3 omits the housing HAU and shows a support member SM, a display module DM, an adhesive member AP, a window WP, and a protective layer PF.

[0067] 3, the support plate SM may include a first support portion MP1 overlapping the first non-folding area NFA1 and a second support portion MP2 overlapping the second non-folding area NFA1. The first support portion MP1 and the second support portion MP2 may be spaced apart from the folding area FA. The first support portion MP1 and the second support portion MP2 may not overlap the folding area FA. Unlike the illustration, at least a portion of the first support portion MP1 and at least a portion of the second support portion MP2 may overlap the folding area FA.

[0068] The display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display panel DP may include a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and a sealing layer TFE covering the display element layer DP-EL. An adhesive member AP may be disposed between the display panel DP and the window WP.

[0069] 3 is merely an example, and the configuration of the display panel DP is not limited thereto. For example, the display panel DP may include a liquid crystal display element, in which case the sealing layer TFE may be omitted.

[0070] The base substrate BS may provide a base surface on which the circuit layers DP-CL are disposed. The base substrate BS may be a flexible substrate that can be bent, folded, rolled, etc. The base substrate BS may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiment is not limited thereto, and the base substrate BS may include an inorganic layer, an organic layer, or a composite material layer.

[0071] The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. For example, the circuit layer DP-CL may include a switching transistor and a driving transistor for driving the light-emitting element ED (FIG. 4) of the display element layer DP-EL.

[0072] The display element layer DP-EL may include a light-emitting element ED (FIG. 4) that emits light. For example, the light-emitting element ED (FIG. 4) may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0073] The encapsulating layer TFE may be disposed on the display element layer DP-EL. The encapsulating layer TFE may protect the light-emitting element layer DP-EL from foreign substances such as moisture, oxygen, and / or dust particles. The encapsulating layer TFE may include at least one inorganic layer. Alternatively, the encapsulating layer TFE may include at least one organic layer and at least one inorganic layer. For example, the encapsulating layer TFE may include an inorganic layer, an organic layer, and an inorganic layer that are stacked in sequence.

[0074] The input sensing unit TP may be disposed on the display panel DP, for example, directly on the encapsulation layer TFE of the display panel DP.

[0075] In this specification, when one component is directly disposed / provided on another component, it means that there is no third component disposed / provided between the one component and the other component. In other words, when one component is "disposed / provided" directly on another component, it means that the one component and the other component "contact" each other.

[0076] The input sensing unit TP may sense an external input, convert it into a predetermined input signal, and provide the input signal to the display panel DP. For example, in one embodiment of the display device DD, the input sensing unit TP may be a touch sensing unit that senses a touch. The input sensing unit TP may recognize a direct touch by a user, an indirect touch by a user, a direct touch by an object, or an indirect touch by an object.

[0077] The input sensing unit TP may sense at least one of the position and intensity (pressure) of an externally applied touch. In an embodiment, the input sensing unit TP may have various structures or be made of various materials and is not limited to any one embodiment. For example, the input sensing unit TP may sense an external input using a capacitive method. The display panel DP may receive an input signal from the input sensing unit TP and generate an image corresponding to the input signal.

[0078] The window WP may include a base layer BL and a print layer BM. Although not shown, the window WP may further include at least one functional layer (not shown) provided on the base layer BL. For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but the embodiment is not limited thereto.

[0079] The base layer BL may be a glass substrate or a plastic substrate, such as polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof.

[0080] The print layer BM may be disposed on one surface of the base layer BL. The print layer BM may be provided on the lower surface of the base layer BL adjacent to the display module DM. The print layer BM may be disposed in an edge region of the base layer BL. The print layer BM may be an ink print layer. The print layer BM may also be a layer formed containing a pigment or dye. For example, the print layer BM may be a layer formed containing a black pigment or black dye. In the window WP, the bezel region BZA may be a portion where the print layer BM is provided.

[0081] A step SP-a may exist between the print layer BM and a portion of the base layer BL where the print layer BM is not provided. The adhesive member AP made of the resin composition RC according to one embodiment (FIGS. 5a and 6a) has excellent flexibility and adhesive strength, and therefore can be attached to the window WP without lifting at the step SP-a.

[0082] An adhesive member AP may be disposed between the display panel DP and the window WP. An adhesive member AP may be disposed between the input sensing unit TP disposed on the display panel DP and the window WP.

[0083] The thickness T0 of the adhesive member AP may be 10 μm or more and 500 μm or less, or 50 μm or more and 200 μm or less. For example, the thickness T0 of the adhesive member AP may be 50 μm or more and 100 μm or less. However, this is merely an example, and the thickness T0 of the adhesive member AP is not limited to this.

[0084] In one embodiment, the adhesive member AP may have a storage modulus of more than 0 MPa and 1 MPa or less, as measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of −20° C. and a frequency of 1 Hz. For example, the adhesive member AP may have a storage modulus of 0.04 MPa or more and 1 MPa or less, as measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of −20° C. and a frequency of 1 Hz.

[0085] Adhesive members having a storage modulus of more than 1 MPa as measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of -20°C and a frequency of 1 Hz are vulnerable to external impact and have very little flexibility, making them unsuitable for use in display devices. In contrast, an adhesive member AP according to one embodiment having a storage modulus of 1 MPa or less as measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of -20°C and a frequency of 1 Hz can exhibit excellent impact resistance and excellent flexibility. In one embodiment, a display device DD including the adhesive member AP can exhibit excellent reliability.

[0086] In one embodiment, the adhesive member AP may have a loss tangent (tanδ) of 2.0 or more when measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of -20°C and a frequency of 1 Hz. The loss tangent (tanδ) is the ratio (G" / G') of the loss modulus (G") to the storage modulus (G'). For example, the adhesive member AP may have a loss tangent of 2.4 or less when measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of -20°C and a frequency of 1 Hz.

[0087] Adhesive members with a loss tangent of less than 2.0 measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of -20°C and a frequency of 1 Hz have poor bending properties and are not suitable for use in flexible displays. In contrast, an adhesive member AP according to one embodiment with a loss tangent of 2.0 or more measured by dynamic viscoelasticity measurement in shear (torsion) mode at a temperature of -20°C and a frequency of 1 Hz can exhibit excellent flexibility. In one embodiment, a display device DD including the adhesive member AP can exhibit excellent reliability.

[0088] In one embodiment, the adhesive member AP may have a 180° peel strength of 300 gf / 25 mm or more from at least one of the glass substrate and the polymer substrate at 25° C. The adhesive member AP may have a 180° peel strength of 900 gf / 25 mm or less from at least one of the glass substrate and the polymer substrate at 25° C. For example, the polymer substrate may include polyethylene terephthalate (PET). An adhesive member AP having a 180° peel strength of 300 gf / 25 mm or more from at least one of the glass substrate and the polymer substrate at 25° C. may exhibit excellent adhesive reliability. A display device DD including an adhesive member AP having a 180° peel strength of 300 gf / 25 mm or more from at least one of the glass substrate and the polymer substrate at 25° C. may exhibit excellent reliability. In contrast, an adhesive member having a 180° peel strength of less than 300 gf / 25 mm from at least one of the glass substrate and the polymer substrate at 25° C. may have low adhesive strength and may peel from the display device components (e.g., display module and / or window) when included in the display device.

[0089] In one embodiment, the adhesive member AP may have a glass transition temperature (Tg) of -46°C or higher and -39°C or lower. Adhesives with a glass transition temperature exceeding -39°C have very high cohesive strength of the polymer constituting the adhesive member, making them vulnerable to external impact and unsuitable for use in display devices. In one embodiment, an adhesive member AP with a glass transition temperature of -46°C or higher and -39°C or lower may exhibit good cohesive strength of the polymer constituting the adhesive member AP and thus exhibit excellent impact resistance. In addition, an adhesive member AP with a glass transition temperature of -39°C or lower may exhibit the property of being easily repeatedly folded and unfolded in a relatively low temperature environment. In one embodiment, a display device DD including an adhesive member AP with a glass transition temperature of -46°C or higher and -39°C or lower may exhibit excellent reliability.

[0090] In one embodiment, the adhesive resin AP may be composed of the resin composition RC (FIGS. 5a and 6a) of one embodiment, whereby the adhesive member AP of one embodiment may satisfy the storage modulus, 180° peel force, and glass transition temperature described above.

[0091] Fig. 4 is a cross-sectional view specifically showing the display module DM shown in Fig. 3. The configuration of the display module DM shown in Fig. 4 is an example, and the embodiment is not limited thereto.

[0092] In FIG. 4, the base substrate BS may include a single layer or multiple layers. For example, the base substrate BS may include a first synthetic resin layer, a multilayer or single layer inorganic layer, and a second synthetic resin layer disposed on the multilayer or single layer inorganic layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin. Each of the first synthetic resin layer and the second synthetic resin layer may also include at least one of an acrylic-based resin, a methacrylic-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In this specification, "XX-based" resin means that the resin contains the functional group "XX."

[0093] The display panel DP may include a transistor TR and a light-emitting element ED. The transistor TR and the light-emitting element ED may be disposed on a base substrate BS. Although one transistor TR is shown in FIG. 4, the display panel DP may actually include a plurality of transistors and at least one capacitor for driving the light-emitting element ED.

[0094] The circuit layer DP-CL may be disposed on a base substrate BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connecting electrode CNE, and a plurality of insulating layers BFL and INS1 to INS6. The plurality of insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first to sixth insulating layers INS1 to INS6. However, the stacked structure of the circuit layer DP-CL shown in FIG. 4 is merely an example, and the stacked structure of the circuit layer DP-CL may be changed depending on the configuration of the display panel DP and the processes of the circuit layer DP-CL, etc.

[0095] The shielding electrode BML may be disposed on the base substrate BS. The shielding electrode BML may overlap the transistor TR. The shielding electrode BML may protect the transistor TR by blocking light incident on the transistor TR from below the display panel DP. The shielding electrode BML may include a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed above the shielding electrode BML may be maintained. However, the embodiment is not limited thereto, and the shielding electrode BML may be a floating electrode. The shielding electrode BML may be omitted.

[0096] The buffer layer BFL may be disposed on the base substrate BS to cover the light-shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL may improve the bonding strength between the semiconductor pattern or conductive pattern disposed on the buffer layer BFL and the base substrate BS.

[0097] The transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, the channel C1, and the drain D1 of the transistor TR may be made of a semiconductor pattern. The semiconductor pattern of the transistor TR may include polysilicon, amorphous silicon, or metal oxide, but is not limited to any one of them and may be applied without limitation as long as it has semiconductor properties.

[0098] The semiconductor pattern may include multiple regions separated by the degree of conductivity. Regions of the semiconductor pattern that are doped with dopants or have reduced metal oxides may have high conductivity and may essentially serve as the source and drain electrodes of the transistor TR. The highly conductive regions of the semiconductor pattern may correspond to the source S1 and drain D1 of the transistor TR. Regions of the semiconductor pattern that are undoped or doped at a low concentration or have low conductivity because the metal oxide has not been reduced may correspond to the channel C1 (or active) of the transistor TR.

[0099] A first insulating layer INS1 may be disposed on the buffer layer BFL while covering the semiconductor pattern of the transistor TR. A gate G1 of the transistor TR may be disposed on the first insulating layer INS1. In a plan view, the gate G1 may overlap the channel C1 of the transistor TR. The gate G1 may function as a mask in a process of doping the semiconductor pattern of the transistor TR.

[0100] A second insulating layer INS2 may be disposed on the first insulating layer INS1 while covering the gate G1. A third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0101] The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2 for electrically connecting the transistor TR and the light emitting element ED. However, the configuration of the connecting electrode CNE for electrically connecting the transistor TR and the light emitting element ED is not limited thereto, and one of the first and second connecting electrodes CNE1 and CNE2 may be omitted, or an additional connecting electrode may be further included.

[0102] The first connecting electrode CNE1 may be disposed on the third insulating layer INS3. The first connecting electrode CNE1 may be connected to the first drain D1 through a first contact hole CH1 penetrating the first to third insulating layers INS1 to INS3. The fourth insulating layer INS4 may be disposed on the third insulating layer INS3 while covering the first connecting electrode CNE1. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0103] The second connecting electrode CNE1 may be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 through a second contact hole CH2 that penetrates the fourth and fifth insulating layers INS4 and INS5. The sixth insulating layer INS6 may be disposed on the fifth insulating layer INS5 while covering the second connecting electrode CNE2.

[0104] Each of the first to sixth functional layers INS1 to INS6 may include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and ferrylene resin.

[0105] The display element layer DP-EL may include a pixel defining layer PDL and a light emitting element ED. The light emitting element ED may include a first electrode AE, a hole control layer HCL, an emitting layer EML, an electron control layer TCL, and a second electrode CE.

[0106] The first electrode AE ​​may be disposed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connecting electrode CNE2 through a third contact hole CH3 penetrating the sixth insulating layer INS6. The first electrode AE ​​may be electrically connected to the drain D1 of the transistor TR through the first and second connecting electrodes CNE1 and CNE2.

[0107] The first electrode AE ​​may be made of a metal material, a metal alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode. However, embodiments are not limited thereto. The first electrode AE ​​may also be a pixel electrode. The first electrode AE ​​may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. The first electrode AE ​​may include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound of two or more selected from these elements, a mixture of two or more selected from these elements, or an oxide thereof.

[0108] If the first electrode AE ​​is a transmissive electrode, it may include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). If the first electrode AE ​​is a semi-transmissive or reflective electrode, it may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca (a laminated structure of LiF and Ca), LiF / Al (a laminated structure of LiF and Al), Mo, Ti, W, or a compound or mixture thereof (e.g., a mixture of Ag and Mg). Alternatively, the first electrode AE ​​may have a multi-layer structure including a reflective or semi-transmissive film made of the above materials and a transparent conductive film made of ITO, IZO, ZnO, ITZO, or the like. For example, the first electrode AE ​​may have a triple-layer structure of ITO / Ag / ITO, but is not limited thereto. Furthermore, the embodiment is not limited to this, and the first electrode AE ​​may contain the above-mentioned metal material, a combination of two or more metal materials selected from the above-mentioned metal materials, or an oxide of the above-mentioned metal material.

[0109] A pixel defining layer PDL may be disposed on the sixth insulating layer INS6. A light emitting opening PX_OP exposing a portion of the first electrode AE ​​may be defined in the pixel defining layer PDL. The portion of the first electrode AE ​​exposed by the light emitting opening PX_OP may be defined as a light emitting area LA.

[0110] The display area AA-DM of the display module DM may include a light-emitting area LA and a light-shielding area NLA. The area where the pixel defining film PDL is disposed may correspond to the light-shielding area NLA. The light-shielding area NLA may surround the light-emitting area LA within the display area AA-DM.

[0111] The hole control layer HCL may be disposed on the first electrode AE ​​and the pixel defining layer PDL. The hole control layer HCL may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. Alternatively, the hole control layer HCL may be provided only in the area corresponding to the light emitting opening PX-OP. The hole control layer HCL may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer HCL may include a known hole injection material and / or a known hole transport material.

[0112] The emitting layer EML may be disposed on the hole controlling layer HCL. The emitting layer EML may be disposed in a region corresponding to the light emitting opening PX_OP. Alternatively, the emitting layer EML may be provided as a common layer. The emitting layer EML may include an organic light emitting material and / or an inorganic light emitting material. The emitting layer EML may emit any one of red, green, and blue light. For example, the emitting layer EML may emit blue light.

[0113] The electron control layer TCL may be disposed on the light-emitting layer EML. The electron control layer TCL may be provided as a common layer overlapping the light-emitting region LA and the light-shielding region NLA. Alternatively, the electron control layer TCL may be provided only in the region corresponding to the light-emitting aperture PX-OP. The electron control layer TCL may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electron control layer TCL may include a known electron injection material and / or a known electron transport material.

[0114] The second electrode CE may be disposed on the electronic control layer TCL. The second electrode CE may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA.

[0115] The second electrode CE may be a common electrode. The second electrode CE may be a cathode or an anode, but the embodiment is not limited thereto. For example, if the first electrode AE ​​is an anode, the second electrode may be a cathode, and if the first electrode AE ​​is a cathode, the second electrode CE may be an anode.

[0116] The second electrode CE may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. If the second electrode CE is a transmissive electrode, the second electrode CE may be made of a transparent metal oxide such as ITO, IZO, ZnO, or ITZO.

[0117] If the second electrode CE is a semi-transmissive electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, Yb, W, or a compound or mixture containing any of these (e.g., AgMg, AgYb, or MgYb). Alternatively, the second electrode CE may have a multi-layer structure including a reflective or semi-transmissive film made of the above material and a transparent conductive film made of ITO, IZO, ZnO, ITZO, or the like. For example, the second electrode CE may include any of the above-mentioned metal materials, a combination of two or more metal materials selected from the above-mentioned metal materials, or oxides of the above-mentioned metal materials.

[0118] The encapsulation layer TFE may be disposed on the second electrode CE to cover the light-emitting element ED. The encapsulation layer TFE may include multiple thin films. For example, the encapsulation layer TFE may include an inorganic film disposed on the second electrode CE and an organic film disposed between the inorganic films. The inorganic film may protect the light-emitting element ED from moisture / oxygen, and the organic film may protect the light-emitting element ED from foreign matter such as dust particles.

[0119] The input sensing unit TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing unit TP may include at least one conductive layer disposed on the sensing insulating layer. The input sensing unit TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0120] The first sensing insulating layer IL1 may be disposed on the sealing layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the sealing layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, in which case the first conductive layer CD1 may be in contact with the sealing layer TFE.

[0121] The first conductive layer CDL1 may be disposed on the first sense insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sense insulating layer IL1. The second sense insulating layer IL2 may be disposed on the first sense insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0122] The second conductive layer CDL2 may be disposed on the second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of conductive patterns may be disposed on the second sensing insulating layer IL2. Each of the plurality of second conductive patterns may be connected to the plurality of first conductive patterns through a contact hole formed in the second sensing insulating layer IL2.

[0123] The plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may be arranged corresponding to the light-shielding region NLA, and the plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may be mesh patterns.

[0124] The third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and cover the second conductive layer CDL2. Each of the second sensing insulating layer IL2 and the third sensing insulating layer IL3 may include an inorganic insulating layer or an organic insulating layer.

[0125] The first conductive layer CDL1 and the second conductive layer CDL2 may each have a single-layer structure or a multi-layer structure stacked along the third direction DR3. The single-layer conductive layers CDL1 and CDL2 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (ITO). The transparent conductive layer may also include a conductive polymer such as PEDOT, metal nanowires, graphene, or the like.

[0126] The multilayer conductive layers CDL1 and CDL2 may include a metal layer. The metal layer may have a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti). The multilayer conductive layers CDL1 and CDL2 may include at least one metal layer and at least one transparent conductive layer.

[0127] 5a to 5d are schematic diagrams illustrating a method for manufacturing an adhesive member AP (FIG. 3) from a resin composition RC according to one embodiment. For example, the method for manufacturing the adhesive member AP (FIG. 3) may include providing a resin composition RC on a substrate CF, applying a first light UV-1 to the resin composition RC to form a preliminary adhesive member P-AP, and applying a second light UV-2 to the preliminary adhesive member P-AP to form the adhesive member AP (FIG. 3). In the following description of FIGS. 5a and 5d, overlapping content with that described with reference to FIGS. 1 to 4 will not be repeated, and the differences will be focused on.

[0128] Referring to FIG. 5a, in one embodiment, a resin composition RC may be provided on a substrate CF. The resin composition RC may be provided on the substrate CF through a nozzle NZ. For example, the substrate CF on which the resin composition RC is provided may include polyethylene terephthalate (PET). The substrate CF is a temporary substrate used to form an adhesive member AP (FIG. 3) from the resin composition RC, and may be any substrate that can be easily removed after the resin composition RC is cured. A release treatment may be applied to one side of the substrate CF on which the resin composition RC is provided.

[0129] In one embodiment, the resin composition RC may be provided by an inkjet printing method or a dispensing method. When the resin composition RC is provided by an inkjet printing method or a dispensing method, it may exhibit properties that make it easy to apply to various components included in the device DD (FIG. 1a).

[0130] In one embodiment, the liquid resin composition RC may be dispensed in a uniform amount and / or at a uniform rate. Although Fig. 5a shows the resin composition RC being dispensed through a nozzle NZ, the device for dispensing the resin composition RC is not limited thereto.

[0131] In one embodiment, the resin composition may have a shear viscosity of 5 mPa·s or more and 50 mPa·s or less, as measured according to JIS Z8803 at 25°C. A resin composition RC having a shear viscosity of 5 mPa·s or more and 50 mPa·s, as measured according to JIS Z8803 at 25°C, exhibits low viscosity characteristics and can be applied by inkjet printing or dispensing. A resin composition having a shear viscosity of less than 5 mPa·s, as measured according to JIS Z8803 at 25°C, may sag when applied. "Sagging" refers to the phenomenon in which the resin composition flows away from the component to which it is applied. A resin composition having a shear viscosity of more than 50 mPa·s, as measured according to JIS Z8803 at 25°C, is difficult to dispense from equipment such as a nozzle NZ, and is not applied in a uniform amount and / or thickness.

[0132] In one embodiment, the resin composition RC may include at least one monofunctional (meth)acrylate monomer, an organopolysiloxane, and at least one photoinitiator including a radical polymerization initiator. The resin composition RC may further include a urethane (meth)acrylate oligomer and / or a silane coupling agent. In this specification, the term "(meth)acryloyl group" refers to an acryloyl group or a methacryloyl group, and the term "(meth)acrylic" refers to an acrylic or methacrylic group.

[0133] In one embodiment, the resin composition RC may include at least one photoinitiator. The photoinitiator may include a radical polymerization initiator. For example, the resin composition RC may include Omnirad 819 (manufactured by IGM Resin) as the photoinitiator.

[0134] When the resin composition RC includes multiple photoinitiators, the different photoinitiators may be activated by ultraviolet light with different center wavelengths. For example, the photoinitiators may include at least one of 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexylphenylketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)-benzyl]phenyl}-2-methylpropan-1-one.

[0135] Also, the photoinitiator may be 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl(2,4,6-trimethylbenzoyl)phenyl phosphinate, phenylbis(2,4,6-trimethylbenzoyl)-phosphine oxide, [1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrryl)phenyl]titanium(IV).

[0136] The resin composition RC may include at least one monofunctional (meth)acrylate monomer. For example, the weight of the monofunctional (meth)acrylate monomer may be 60 wt% or more and 85 wt% or less, based on 100 wt% (weight percent) of the total weight of the resin composition RC. A resin composition RC satisfying the above-mentioned weight of the monofunctional (meth)acrylate monomer may exhibit low shear viscosity before curing and excellent flexibility and adhesive strength after curing.

[0137] In the resin composition RC, the monofunctional (meth)acrylate monomer may include at least one of an alicyclic (meth)acrylate, a (meth)acrylate containing a hydroxy group, an alkyl (meth)acrylate, and an aromatic (meth)acrylate. For example, the monofunctional (meth)acrylate monomer may include at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and 2-ethylhexyl-diglycol acrylate (EHDG-AT).

[0138] In one embodiment, the resin composition RC may contain an organopolysiloxane. In this resin composition, the weight-average molecular weight (Mw) of the organopolysiloxane may be 500 or greater but less than 50,000. For example, the weight-average molecular weight of the organopolysiloxane may be 1,000 or greater but less than 5,000. In this resin composition RC, the organopolysiloxane may include at least one of KR510 (a product of Shin-Etsu Chemical Co., Ltd.) and X-48-1501 (a product of Shin-Etsu Chemical Co., Ltd.). In one embodiment, the resin composition RC containing an organopolysiloxane having a weight-average molecular weight of 500 or greater but less than 50,000 may satisfy the shear viscosity described above (i.e., 5 mPa·s or greater but less than 50 mPa·s). Furthermore, the resin composition RC of one embodiment containing an organopolysiloxane having a weight-average molecular weight of 500 or more and less than 50,000 can exhibit excellent optical transparency, excellent flexibility, and excellent adhesive strength after curing.

[0139] In one embodiment, the weight of the organopolysiloxane may be 5 wt% or more but less than 35 wt%, based on the total weight of the resin composition RC (100 wt%). Resin compositions containing 35 wt% or more of organopolysiloxane, based on the total weight of the resin composition (100 wt%), exhibit reduced optical transparency and poor adhesive strength after curing. Decreased optical transparency prevents transmission of images generated by the display module DM (Figure 2), resulting in poor display quality. Resin compositions containing less than 5 wt% of organopolysiloxane, based on the total weight of the resin composition (100 wt%), exhibit a high storage modulus after curing and insufficient flexibility, making them unsuitable for flexible display devices.

[0140] Alternatively, in one embodiment, a resin composition RC containing 5 wt% or more but less than 35 wt% of organopolysiloxane, based on 100 wt% of the total weight of the resin composition RC, may have a storage modulus of 1 MPa or less after curing, as measured by dynamic viscoelasticity measurement in shear mode at a temperature of -20°C and a frequency of 1 Hz, and a 180° peel strength of 300 gf / 25 mm or more from at least one of a polymer substrate and a glass substrate at a temperature of 25°C. Therefore, a resin composition RC containing 5 wt% or more but less than 35 wt% of organopolysiloxane, based on 100 wt% of the total weight of the resin composition RC, may exhibit excellent flexibility and excellent adhesion after curing, and may exhibit properties suitable for flexible display devices DD (FIG. 1a).

[0141] In one embodiment, the organopolysiloxane does not contain a radically polymerizable group. The radically polymerizable group refers to a group that can be polymerized by the action of a radical. For example, the radically polymerizable group is a group containing an unsaturated bond, and may include an alkenyl group, a vinyl group, a (meth)acryloyl group, an allyl group, an isopropenyl group, a styryl group, a vinyloxy group, a vinyloxycarbonyl group, a vinylcarbonyl group, an N-vinylamino group, etc.

[0142] In one embodiment, the organopolysiloxane may contain a moisture-curable siloxane without a radical polymerizable group. This allows for excellent curing even in areas where the amount of light provided to form the adhesive member AP (FIG. 3) from the resin composition RC is insufficient. A preliminary adhesive member P-AP (FIG. 5c) may be formed from the resin composition RC. The second light UV-2 provided to form the adhesive member AP (FIG. 3) from the preliminary adhesive member P-AP (FIG. 5c) may not easily penetrate the printed layer BM (FIG. 5d). The printed layer BM (FIG. 5d) may prevent the second light UV-2 from being sufficiently irradiated onto a portion of the preliminary adhesive member P-AP (FIG. 5d) (i.e., the portion overlapping with the printed layer BM). However, in one embodiment, an adhesive member AP (FIG. 3) made from a resin composition RC containing an organopolysiloxane without a radical polymerizable group may exhibit excellent curing even in areas overlapping with the printed layer BM (FIG. 5d).

[0143] In one embodiment, the resin composition RC may further include a urethane (meth)acrylate oligomer. For example, the weight-average molecular weight of the urethane (meth)acrylate oligomer in the resin composition RC may be 10,000 or more and 40,000 or less. In the resin composition RC, the urethane (meth)acrylate oligomer may include at least one of UF-C051 (urethane acrylate, manufactured by Kyoeisha Chemical Co., Ltd.), UF-C052 (urethane acrylate, manufactured by Kyoeisha Chemical Co., Ltd.), and UN6304 (urethane acrylate, manufactured by Negami Chemical Industrial Co., Ltd.). However, this is merely an example, and the urethane (meth)acrylate oligomer contained in the resin composition RC is not limited thereto.

[0144] In one embodiment, the resin composition RC may further include a silane coupling agent. For example, the resin composition RC may include KBM403 (a product of Shin-Etsu Chemical Co., Ltd.) as a silane coupling agent. However, this is merely an example, and the silane coupling agent included in the resin composition RC is not limited thereto.

[0145] In one embodiment, the resin composition RC may be solvent-free. A solvent refers to a liquid for dissolving the constituent materials of the composition (e.g., monomers, oligomers, etc.). A resin composition that includes a solvent requires a drying period after application. In contrast, the solvent-free resin composition RC of one embodiment does not require a drying period after application and can be applied by an inkjet printing method or a dispensing method, thereby exhibiting excellent manufacturing efficiency.

[0146] Referring to Figure 5b, a first light UV-1 may be applied to a resin composition RC applied to a substrate CF with a uniform thickness. The liquid resin composition RC may be cured by the first light UV-1 to form a preliminary adhesive member P-AP (Figure 5c). The first light UV-1 may be ultraviolet light. Although Figure 5b shows that the resin composition RC applied to the substrate CF is directly irradiated with the first light UV-1 to form the preliminary adhesive member P-AP (Figure 5c), embodiments are not limited thereto. A carrier film (not shown) may be disposed on the resin composition RC applied to a uniform thickness, and the carrier film (not shown) may be transparent to ultraviolet light.

[0147] 5c and 5d, the preliminary adhesive member P-AP formed by irradiating the resin composition RC with the first light UV-1 (FIG. 5b) can be detached from the substrate CF and provided on one side of the window WP or one side of the display module DM. One side of the preliminary adhesive member P-AP can be laminated on one side of the window WP or one side of the display module DM, and the remaining side of the preliminary adhesive member P-AP can be attached to the unattached side of the window WP or one side of the display module DM. Next, the preliminary adhesive member P-AP can be irradiated with the second light UV-2 to form the adhesive member AP. The second light UV-2 can be ultraviolet light. The second light UV-2 can be provided from above the window WP, and the window WP can be transparent to the second light UV-2. The second light UV-2 can be provided to the preliminary adhesive member P-AP through the window WP.

[0148] 5a to 5d, the adhesive member AP (FIG. 3) is formed by curing the resin composition RC twice (i.e., by applying light twice), but the embodiment is not limited thereto. For example, the adhesive member AP (FIG. 3) may be formed by curing the resin composition RC (FIG. 5a) once, or may be formed by curing it three or more times.

[0149] In one embodiment, the resin composition RC (FIG. 5a) can be cured by UV-1 or UV-2 light. For example, the resin composition RC (FIG. 5a) can be cured by ultraviolet light to form the adhesive member AP (FIG. 3). In one embodiment, the resin composition RC (FIG. 5a) can be optically transparent after being cured by light. Being optically transparent after curing can mean having excellent miscibility after curing. Being optically transparent can mean having a transmittance of 80% or more for light in the visible light wavelength range.

[0150] In one embodiment, resin composition RC (FIG. 5a) may have a storage modulus of 1 MPa or less after being cured by light, as measured by dynamic viscoelasticity measurement in shear mode at a temperature of −20°C and a frequency of 1 Hz. In one embodiment, resin composition RC (FIG. 5a) may have a 180° peel strength of 300 gf / 25 mm or more at 25°C from at least one of a polymer substrate and a glass substrate. In one embodiment, resin composition RC (FIG. 5a) may have a glass transition temperature of −46°C or more and −39°C or less after being cured by light. In one embodiment, resin composition RC includes a monofunctional (meth)acrylate monomer, an organopolysiloxane, and a radical polymerization initiator, and may satisfy the above-described shear viscosity before curing and the above-described storage modulus, 180° peel strength, and glass transition temperature after curing.

[0151] 6a to 6c are diagrams schematically illustrating another method for manufacturing an adhesive member AP (FIG. 3) from a resin composition RC according to one embodiment. In the following description of FIGS. 6a and 6c, overlapping content with that described with reference to FIGS. 1 to 5d will not be repeated, and differences will be mainly described.

[0152] The method for manufacturing the adhesive member AP shown in Figures 6a to 6c may include the steps of providing a resin composition RC on a display module DM, applying a first light UV-1 to the resin composition RC to form a preliminary adhesive member P-AP, and applying a second light UV-2 to the preliminary adhesive member P-AP to form the adhesive member AP (Figure 3). Compared to the manufacturing method shown in Figures 5a to 5d, the manufacturing method shown in Figures 6a to 6c differs in that the resin composition RC is provided on the display module DM.

[0153] The resin composition RC can be provided directly on one side of the display module DM or on one side of the window WP. Figure 6a shows that the resin composition RC is provided directly on one side of the display module DM.

[0154] Resin compositions RC with a shear viscosity of 5 mPa·s to 50 mPa·s, as measured according to JIS Z8803 at 25°C, can be applied while covering the curve of the step SP-b portion of the display module DM. Because the resin composition RC has a low viscosity of 50 mPa·s or less, it can be applied without leaving any empty spaces in curved portions such as the step SP-b portion. Furthermore, resin compositions RC with a shear viscosity of 5 mPa·s or more can be applied uniformly to a predetermined thickness without dripping beyond the area where the resin composition RC is to be applied, i.e., the display module DM.

[0155] Referring to Figure 6b, a first light UV-1 may be applied to the uniformly applied resin composition RC. By applying the first light UV-1 to the resin composition RC, a preliminary adhesive member P-AP (Figure 6c) may be formed. Referring to Figure 6c, a window WP may be provided on the preliminary adhesive member P-AP. A second light UV-2 may be transmitted through the window WP and applied to the preliminary adhesive member P-AP. The preliminary adhesive member P-AP may be cured by the second light UV-2, thereby forming the adhesive member AP (Figure 3).

[0156] 7 is a cross-sectional view showing a display device DD-a according to another embodiment of the present invention. In the following description of the display device shown in FIG. 7, the same content as that described with reference to FIGS. 1 to 6c will not be described again, and the differences will be mainly described.

[0157] 2 and 3, the display device DD-a shown in Fig. 7 may further include a light control layer PP and an optical adhesive layer AP-a. The display device DD-a of one embodiment may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP. The light control layer PP may include a polarizer or a color filter layer.

[0158] The optical adhesive layer AP-a may be made of one embodiment of the resin composition RC (FIGS. 5A and 6A). The optical adhesive layer AP-a containing the polymer derived from one embodiment of the resin composition RC (FIGS. 5A and 6A) may have a storage modulus of 1 MPa or less, as measured by dynamic viscoelasticity measurement in shear mode at a temperature of -20°C and a frequency of 1 Hz. The optical adhesive layer AP-a containing the polymer derived from one embodiment of the resin composition RC (FIGS. 5A and 6A) may be optically transparent. The optical adhesive layer AP-a containing the polymer derived from one embodiment of the resin composition RC (FIGS. 5A and 6A) may have a 180° peel strength of 300 gf / 25 mm or more from at least one of a glass substrate and a polymer substrate at a temperature of 25°C. The optical adhesive layer AP-a containing the polymer derived from one embodiment of the resin composition RC (FIGS. 5A and 6A) may exhibit excellent flexibility and excellent adhesion reliability.

[0159] 8 is a cross-sectional view showing a display device DD-b according to another embodiment of the present invention. In the following description of the display region DD-b according to the embodiment shown in FIG. 8, the same content as that described with reference to FIGS. 1 to 7 will not be repeated, and the differences will be mainly described.

[0160] 2 and 3, the display device DD-b of an embodiment shown in Fig. 8 may further include a light control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB. Like the display device DD-a of an embodiment shown in Fig. 7, the display device DD-b of an embodiment shown in Fig. 8 may further include a light control layer PP arranged between the adhesive member AP and the window WP, and an optical adhesive layer AP-a arranged between the light control layer PP and the window WP.

[0161] In one embodiment of the display device DD-b, an adhesive member AP may be provided between the display panel DP and the input sensing unit TP. That is, the input sensing unit TP may not be disposed directly on the display panel DP, but may be bonded to the display panel DP by the adhesive member AP. For example, the adhesive member AP may be disposed between the sealing layer TFE ( FIG. 3 ) of the display panel DP and the input sensing unit TP.

[0162] An interlayer adhesive layer PIB may be provided below the light control layer PP. The interlayer adhesive layer PIB is disposed between the input sensing unit TP and the light control layer PP and may be made of an adhesive material with excellent moisture-proofing properties. For example, the interlayer adhesive layer PIB may be formed of polyisobutylene. The interlayer adhesive layer PIB is disposed on the input sensing unit TP and may prevent corrosion of the sensing electrodes of the input sensing unit TP. A display device DD-b according to one embodiment includes an optical adhesive layer AP-a and an adhesive member AP made of a resin composition RC according to one embodiment (FIGS. 5a and 6a). The display device DD-b including the optical adhesive layer AP-a and the adhesive member AP may exhibit excellent reliability.

[0163] The resin composition according to one embodiment of the present invention and the adhesive member made of the resin composition will be described in detail below with reference to examples and comparative examples. Note that the examples shown below are merely illustrative examples to aid in understanding the present invention, and the scope of the present invention is not limited thereto. [Example]

[0164] 1. Production and evaluation of resin compositions The resin compositions of the examples and comparative examples were prepared using the materials listed in Table 1. The materials listed in Table 1 were measured in their respective amounts (g, gram) in light-shielding glass vials and stirred on a roll mill at room temperature for 12 hours.

[0165] <Measurement of shear viscosity of resin composition> In Table 1, the shear viscosity of the resin composition was measured at a temperature of 25°C according to JIS Z8803. The shear viscosity of the resin composition was measured at a speed of 10 rpm using a viscometer TVE-25L (manufactured by TOKI SANGYO Co., LTD.).

[0166] <Measurement of molecular weight of organopolysiloxane> The molecular weight of organopolysiloxane was measured using a gel permeation chromatography (GPC) analyzer, HLC-8420GPC, manufactured by TOSOH Corporation. A TSKgel SUPER HZM-N column was used, and tetrahydrofuran (THF) was used as the measurement solvent. The weight-average molecular weight was obtained in terms of standard polystyrene (PS) from the size exclusion chromatography (SEC) curve detected with a refractive index (RI) detector. The molecular weights obtained are listed in the material data in Table 1 below.

[0167] [Table 1]

[0168] <Information on the materials in Table 1> 4-HBA: 4-hydroxybutyl acrylate (Osaka Organic Chemical Industry Ltd. product) 2-EHA: 2-ethylhexyl acrylate (Toagosei Co., Ltd.) THF-A: Tetrahydrofurfuryl acrylate (Kyoeisha Chemical Co., Ltd. product) EHDG-AT: 2-Ethylhexyl-diglycol acrylate (Kyoeisha Chemical Co., Ltd.) UF-C051: Urethane acrylate (weight average molecular weight 35,000, manufactured by Kyoeisha Chemical Co., Ltd.) UF-C052: Urethane acrylate (weight average molecular weight 10,000, manufactured by Kyoeisha Chemical Co., Ltd.) UN6034: Urethane acrylate (weight average molecular weight 10,000, manufactured by Negami Chemical Industrial Co., Ltd.) Omnirad 819: phenylbis(2,4,6-trimethylbenzoyl)-phosphine oxide (IGM Resins) KR510: Organopolysiloxane (product of Shin-Etsu Chemical Co., Ltd., weight-average molecular weight 2100) X-48-1501: Organopolysiloxane (product of Shin-Etsu Chemical Co., Ltd., weight-average molecular weight 3100) D-26: Titanium-containing catalyst (product of Shin-Etsu Chemical Co., Ltd.) KBM403: Silane coupling agent (product of Shin-Etsu Chemical Co., Ltd.)

[0169] In Table 1, D-26 is a catalyst provided to accelerate the cure of organopolysiloxanes and contains titanium.

[0170] Referring to Table 1, it can be seen that the resin compositions of Examples 1-2 to 1-5 have shear viscosities of 5 mPa s or more and 50 mPa s or less as measured according to JIS Z8803 at a temperature of 25°C. Therefore, it can be seen that the resin compositions of Examples 1-2 to 1-5 can be provided by an inkjet printing method or a dispensing method.

[0171] The resin compositions of Examples 1-2 to 1-5 are resin compositions according to one embodiment. The resin compositions of Examples 1-2 to 1-5 contain a monofunctional (meth)acrylate monomer, an organopolysiloxane, and a radical polymerization initiator. It can be seen that the shear viscosity of the resin compositions containing the monofunctional (meth)acrylate monomer, the organopolysiloxane, and the radical polymerization initiator measured at 25°C according to JIS Z8803 is 5 mPa s or more and 50 mPa s or less.

[0172] In the resin compositions of Examples 1-2 to 1-5, the weight-average molecular weight of the organopolysiloxane was 2100 or 3100, which is within the range of the weight-average molecular weight of the organopolysiloxane described above (500 or more and less than 50,000). In addition, in the resin compositions of Examples 1-2 to 1-5, the organopolysiloxanes KR510 and X-48-1501 may not contain a radically polymerizable group.

[0173] The resin compositions of Examples 1-2 to 1-5 contain 5 wt% or more but less than 35 wt% of organopolysiloxane, based on 100 wt% of the total weight of the resin composition. For example, the resin composition of Example 1-2 contains 20 g of organopolysiloxane for a total weight of 125.1 g, and when 125.1 g is converted to 100 wt%, 20 g corresponds to approximately 16 wt%.

[0174] The resin compositions of Examples 1-2 to 1-5 contain 60 wt% to 85 wt% of monofunctional (meth)acrylate monomers based on 100 wt% of the total weight of the resin composition. For example, the resin composition of Example 1-2 contains 89 g of monofunctional (meth)acrylate monomers for a total weight of 125.1 g, and when 125.1 g is converted to 100 wt%, 89 g corresponds to approximately 71 wt%.

[0175] The resin compositions of Comparative Examples 1-1 and 1-6 contain organopolysiloxane. The resin composition of Comparative Example 1-1 contains approximately 4.5 wt% of organopolysiloxane, based on 100 wt% of the total weight of the resin composition. The resin composition of Comparative Example 1-6 contains approximately 36.3 wt% of organopolysiloxane, based on 100 wt% of the total weight of the resin composition. In other words, the resin compositions of Comparative Examples 1-1 and 1-6 do not satisfy the weight range of organopolysiloxane according to one embodiment (5 wt% or more and less than 35 wt%). The resin composition of Comparative Example 1-7 does not contain organopolysiloxane.

[0176] 2. Evaluation of adhesive materials Table 2 below shows the miscibility, storage modulus, glass transition temperature, and 180° peel strength of adhesive members made from the resin compositions of Examples and Comparative Examples. The adhesive members of Examples 2-2 to 2-5 were made from the resin compositions of Examples 1-2 to 1-5, respectively. The adhesive members of Comparative Examples 2-1, 2-6, and 2-7 were made from the resin compositions of Examples 1-1, 1-6, and 1-7, respectively. The evaluation methods are explained in more detail below.

[0177] <Measurement of storage modulus, loss tangent, and glass transition temperature of adhesive materials> A 500 μm thick silicone rubber sheet with an 8 mm inner diameter hole was placed on the release-treated PET film, and approximately 28 μL of the resin composition of the Examples and Comparative Examples was poured into the hole. Next, LED lamps with peak wavelengths of 365 nm and 395 nm were used, and a total light intensity of 800 mJ / cm was applied to each. 2 , 400mJ / cm 2 Next, a PET film identical to the above PET film was provided, and a glass substrate with a thickness of approximately 1 mm was provided on the PET film. An LED lamp with a peak at a wavelength of 395 nm was used above the glass substrate, and a total amount of light was irradiated to 4000 mJ / cm. 2 A circular sample with a diameter of 8 nm and a thickness of 500 μm was obtained.

[0178] The obtained samples were subjected to viscoelasticity measurements. Measurements were performed using an MCR302 (manufactured by Anton-Paar) at a frequency of 1 Hz, in shear mode, at temperatures from -50 to 80°C, and at a heating rate of 2°C / min. The storage modulus at -20°C, loss tangent (tanδ) at -20°C, and glass transition temperature confirmed by the measurements are recorded in Table 2. The glass transition temperature is the temperature at which the loss tangent (tanδ) value reaches its peak.

[0179] <Evaluation of adhesive compatibility> The miscibility of the 500 μm thick samples prepared for evaluation of storage modulus, loss tangent, and glass transition temperature was evaluated with the naked eye. In Table 2, "Good" indicates uniform optical transparency. In Table 2, "Poor" indicates non-uniform transparency, with at least a portion being optically opaque.

[0180] <Evaluation of 180° peel strength of adhesive materials> The resin compositions of the Examples and Comparative Examples were applied to a 26 mm x 76 mm soda-lime glass (manufactured by Central Glass Co., Ltd.) using a bar coater to a thickness of 50 μm. LED lamps with peaks at wavelengths of 365 nm and 395 nm were used to irradiate the soda-lime with the resin compositions, with total light intensities of 800 mJ / cm2 and 400 mJ / cm2, respectively. 2 A 20mm x 150mm PET film (A4360, manufactured by TOYOBO Co., Ltd., thickness 50µm) was placed on the irradiated resin composition and bonded under a bonding pressure of 0.15MPa. After bonding, an LED lamp with a peak wavelength of 395nm was used to irradiate the PET film with a total light intensity of 4000J / cm2. 2 The sample was obtained by irradiating the sample with light so that the

[0181] The peel strength of the obtained samples was measured using a Universal Testing Machine (Instron Corporation, Model 5965) at a constant temperature of 25°C at a speed of 300 mm / min to a peel angle of 180°. The average value for a peel of approximately 50 mm was calculated, and the obtained value was multiplied by 1.25 to record the peel strength for a width of 25 mm in Table 2.

[0182] [Table 2]

[0183] Referring to Table 2, it can be seen that the adhesive members of Examples 2-2 to 2-5 are uniformly optically transparent, and have a storage modulus of 1 MPa or less and a loss tangent of 2.0 or more, as measured by dynamic viscoelasticity measurement in shear mode at a temperature of -20°C and a frequency of 1 Hz. It can also be seen that the adhesive members of Examples 2-2 to 2-5 have a 180° peel strength of 300 gf / 25 mm or more at a temperature of 25°C. It can also be seen that the adhesive members of Examples 2-2 to 2-5 have a glass transition temperature of -46°C or more and -39°C or less.

[0184] The adhesive members of Examples 2-2 to 2-5 are adhesive members according to an embodiment, formed by photocuring the resin compositions of Examples 1-2 to 1-5 in Table 1. It can be seen that the adhesive members made of the resin compositions according to an embodiment exhibit excellent flexibility and excellent adhesive strength. It can also be seen that the adhesive members made of the resin compositions according to an embodiment exhibit high adhesive strength and properties suitable for flexible display devices.

[0185] Referring to Table 2, it can be seen that the loss tangent of the adhesive member of Comparative Example 2-1, measured by dynamic viscoelasticity measurement in shear mode at a temperature of -20°C and a frequency of 1 Hz, is less than 2.0. The adhesive member of Comparative Example 2-1 is formed by curing the resin composition of Comparative Example 1-1 in Table 1, and as mentioned above, the resin composition of Comparative Example 1-1 contains less than 5 wt% of organopolysiloxane. As a result, the adhesive member of Comparative Example 2-1 exhibits poor bending properties, and the adhesive member of Comparative Example 2-1 with poor bending properties is not suitable for flexible display devices.

[0186] It can be seen that at least a portion of the adhesive members of Comparative Examples 2-6 was optically opaque, and the 180° peel strength at a temperature of 25°C was less than 300 gf / 25 mm. The adhesive members of Comparative Examples 2-6 were formed by curing the resin compositions of Comparative Examples 1-6 in Table 1, and as described above, the resin compositions of Comparative Examples 1-6 contained excessive amounts of organopolysiloxane. As a result, it can be seen that the resin compositions of Comparative Examples 1-6 containing excessive amounts of organopolysiloxane had poor optical transparency after curing and low adhesive strength.

[0187] Referring to Table 2, the adhesive members of Comparative Examples 2-7 had loss tangents of less than 2.0 as measured by dynamic viscoelasticity measurement in shear mode at a temperature of -20°C and a frequency of 1 Hz, and had relatively high 180° peel strength at a temperature of 25°C. The adhesive members of Comparative Examples 2-7 were formed by curing the resin compositions of Comparative Examples 1-7 in Table 1, and as described above, the resin compositions of Comparative Examples 1-7 did not contain excessive amounts of organopolysiloxane. As a result, the adhesive members of Comparative Examples 2-7 exhibited poor flexural properties and excessively high adhesive strength, and the adhesive members of Comparative Examples 2-7 exhibiting poor flexural properties and excessively high adhesive strength were not suitable for flexible display devices.

[0188] A display device according to an embodiment includes an adhesive member disposed between a display panel and a window, and the adhesive member may include a polymer derived from the resin composition according to an embodiment. The adhesive resin may be formed by curing the resin composition according to an embodiment.

[0189] A resin composition according to an embodiment may include a monofunctional (meth)acrylate monomer, an organopolysiloxane, and a radical polymerization initiator. As a result, the resin composition according to an embodiment may exhibit excellent low viscosity characteristics before curing and excellent flexibility and excellent adhesive reliability after curing. An adhesive member made of the resin composition according to an embodiment and a display device including the adhesive member may exhibit excellent reliability.

[0190] Although the present invention has been described above with reference to preferred embodiments, it will be understood by those skilled in the art or those with ordinary knowledge in the art that various modifications and changes can be made to the present invention without departing from the spirit and technical scope of the present invention as set forth in the claims below.

[0191] Therefore, the technical scope of the present invention should be determined by the claims, not by the contents of the detailed description of the specification. [Explanation of symbols]

[0192] RC: Resin composition AP: Adhesive material DD: Display device DP: Display panel WP:Window

Claims

1. at least one monofunctional (meth)acrylate monomer; an organopolysiloxane; at least one photoinitiator comprising a radical polymerization initiator; The shear viscosity measured at a temperature of 25°C according to JIS Z8803 is 5 mPa s or more and 50 mPa s or less, After photocuring, the storage modulus is 1 MPa or less as measured by a dynamic viscoelasticity measurement method in a shear mode at a temperature of −20° C. and a frequency of 1 Hz; After photocuring, the loss tangent (tanδ) measured by dynamic viscoelasticity measurement in shear mode at a temperature of −20° C. and a frequency of 1 Hz is 2.0 or more. A resin composition that is optically clear after photocuring.

2. The resin composition according to claim 1 , wherein the weight of the organopolysiloxane is 5 wt % or more and less than 35 wt % based on 100 wt % of the total weight of the resin composition.

3. 2. The resin composition according to claim 1, wherein the organopolysiloxane has a weight average molecular weight of 500 or more and less than 50,000.

4. The resin composition according to claim 1 , wherein the organopolysiloxane does not contain any radically polymerizable group.

5. The resin composition according to claim 1, which, after photocuring, has a 180° peel strength of 300 gf / 25 mm or more at 25° C. from at least one of a polymer substrate and a glass substrate.

6. The resin composition according to claim 1, which does not contain a solvent.

7. The resin composition according to claim 1, wherein the monofunctional (meth)acrylate monomer comprises at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and 2-ethylhexyl-diglycol acrylate (EHDG-AT).

8. The resin composition according to claim 1 , wherein the weight of the monofunctional (meth)acrylate monomer is 60 wt % or more and 85 wt % or less, based on 100 wt % of the total weight of the resin composition.

9. The resin composition according to claim 1 , further comprising a urethane (meth)acrylate oligomer.

10. The resin composition according to claim 1 , further comprising a silane coupling agent.

11. The resin composition according to claim 1, wherein the glass transition temperature after photocuring is −46° C. or higher and −39° C. or lower.

12. The resin composition according to claim 1, which is provided by an inkjet printing method or a dispensing method.

13. 13. An adhesive member having a storage modulus of 1 MPa or less as measured by dynamic viscoelasticity measurement in a shear mode at a temperature of −20° C. and a frequency of 1 Hz, a loss tangent (tanδ) of 2.0 or more as measured by dynamic viscoelasticity measurement in a shear mode at a temperature of −20° C. and a frequency of 1 Hz, and being optically transparent, the adhesive member comprising a polymer derived from the resin composition according to any one of claims 1 to 12.

14. A display panel; a window disposed above the display panel; an adhesive member that is optically transparent, has a storage modulus of 1 MPa or less as measured by dynamic viscoelasticity measurement at a temperature of -20°C and a frequency of 1 Hz in shear mode, has a loss tangent (tanδ) of 2.0 or more as measured by dynamic viscoelasticity measurement at a temperature of -20°C and a frequency of 1 Hz in shear mode, and contains a polymer derived from the resin composition according to any one of claims 1 to 12, and is disposed between the display panel and the window.

15. further comprising an input sensing unit disposed between the display panel and the window; The electronic device according to claim 14 , wherein the adhesive member is disposed between the display panel and the input sensing unit or between the input sensing unit and the window.

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