Ultrasonic diagnostic equipment

Abstract

To enable an increase in the number of probe connection terminal parts without upsizing the whole equipment, and facilitate insertion / extraction of an ultrasonic probe.SOLUTION: Ultrasonic diagnostic equipment according to the present embodiment comprises the whole equipment. In the whole equipment, a plurality of probe connection terminal parts, which are connected to a connector of an ultrasonic probe, are arranged in one direction on the front side. At least one of the plurality of probe connection terminal parts is arranged in a position to deviate in another direction intersecting with the one direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The embodiments disclosed in the present specification and drawings relate to an ultrasound diagnostic device. [Background technology]

[0002] There is known an ultrasonic diagnostic device that generates an ultrasonic image of a subject by a user performing an ultrasonic scan using an ultrasonic probe during an examination of the subject. In the ultrasonic diagnostic device, a plurality of probe connection terminals are provided on the front side of the device body. The plurality of probe connection terminals are connectors on the device body to which connectors of the ultrasonic probes are connected. Typically, the plurality of probe connection terminals are arranged in a row, for example, horizontally or vertically.

[0003] Due to the variety of examinations, the number of probe connection terminals mounted on ultrasound diagnostic devices tends to increase. Here, if the number of probe connection terminals is increased horizontally or vertically, the multiple probe connection terminals are densely packed, narrowing the spacing between the probe connection terminals. In this case, it becomes difficult for users to insert and remove the connector of the ultrasound probe into and from the probe connection terminal, resulting in poor usability for users. Furthermore, narrowing the spacing between the probe connection terminals complicates the wiring on the board on which the probe connection terminals are mounted. Increasing the width and height of the device body to avoid the complicated wiring results in a larger overall device size. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-026046 [Patent Document 2] Patent No. 5230768 Summary of the Invention [Problem to be solved by the invention]

[0005] One of the problems to be solved by the embodiments disclosed in this specification and the drawings is to increase the number of probe connection terminals without increasing the size of the entire device, thereby making it easier to insert and remove ultrasound probes. However, the problems solved by the embodiments disclosed in this specification and the drawings are not limited to the above problem. Problems corresponding to the effects of each configuration shown in the embodiments described below can also be positioned as other problems. [Means for solving the problem]

[0006] The ultrasound diagnostic apparatus according to the present embodiment includes an apparatus main body, in which a plurality of probe connection terminals to which connectors of ultrasound probes are connected are arranged in one direction, and at least one of the plurality of probe connection terminals is arranged at a position offset in another direction intersecting the one direction. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing the appearance of an ultrasonic diagnostic apparatus according to this embodiment. [Figure 2] FIG. 2 is a block diagram showing an example of the configuration of an ultrasonic diagnostic apparatus according to this embodiment. [Figure 3A] FIG. 3A is a front view of a housing in which a plurality of probe connection terminals are arranged in the main body of the ultrasound diagnostic apparatus according to this embodiment. [Figure 3B] FIG. 3B is a front view of the circuit board portion inside the device main body of FIG. 3A with the housing removed. [Figure 4A] FIG. 4A is a front view of a housing in which a plurality of probe connection terminals are arranged in the main body of an ultrasonic diagnostic apparatus according to a first modified example of this embodiment. [Figure 4B] FIG. 4B is a front view of the circuit board portion inside the device main body of FIG. 4A with the housing removed. [Figure 5A] FIG. 5A is a front view of a housing in which a plurality of probe connection terminals are arranged in the main body of an ultrasonic diagnostic apparatus according to a second modification of this embodiment. [Figure 5B]FIG. 5B is a front view of the circuit board portion inside the device main body of FIG. 5A with the housing removed. [Figure 6A] FIG. 6A is a front view of a housing in which a plurality of probe connection terminals are arranged in the main body of an ultrasonic diagnostic apparatus according to a third modification of this embodiment. [Figure 6B] FIG. 6B is a front view of the circuit board portion inside the device main body of FIG. 6A with the housing removed. [Figure 7A] FIG. 7A is a diagram for explaining an example of the arrangement of a plurality of probe connection terminal units, and is a front view of a housing in the main body of an ultrasound diagnostic device in which a plurality of probe connection terminal units are arranged. [Figure 7B] FIG. 7B is a front view of the circuit board portion inside the device main body of FIG. 7A with the housing removed. DETAILED DESCRIPTION OF THE INVENTION

[0008] An ultrasound diagnostic apparatus according to an embodiment will be described below with reference to the accompanying drawings. Note that the embodiment is not limited to the following embodiment. Furthermore, the content described in one embodiment is, in principle, also applicable to other embodiments.

[0009] Fig. 1 is a schematic diagram showing the appearance of an ultrasonic diagnostic device 1 according to this embodiment. Fig. 2 is a block diagram showing an example of the configuration of the ultrasonic diagnostic device 1 according to this embodiment. Here, Fig. 1 does not show the ultrasonic probe 101 shown in Fig. 2. Fig. 2 does not show the casters 104, probe head holding unit 105, and probe connection terminal unit 200 shown in Fig. 1.

[0010] As shown in FIG. 1, the ultrasound diagnostic apparatus 1 according to this embodiment includes an apparatus main body 100, an input device 102, a display 103, casters 104, a probe head holder 105, and a plurality of probe connection terminals 200.

[0011] Casters 104, which are wheels, are provided at the bottom of device main body 100, and casters 104 enable device main body 100 to be movable. An input device 102, which is an operation panel, is provided at the top of device main body 100, and a display 103 is placed above device main body 100.

[0012] A probe head holding section 105 for holding the head of an ultrasonic probe is provided on the side of the input device 102. Furthermore, a plurality of probe connection terminal sections 200 are provided on the front side of the device main body 100. The plurality of probe connection terminal sections 200 are connectors on the device main body 100 side to which connectors of the ultrasonic probes are connected. Details of the arrangement of the plurality of probe connection terminal sections 200 will be described later.

[0013] 2, the ultrasonic diagnostic apparatus 1 according to this embodiment further includes an ultrasonic probe 101. The ultrasonic probe 101, the input device 102, and the display 103 are each connected to the apparatus main body 100.

[0014] The ultrasonic probe 101 transmits and receives ultrasonic waves (ultrasound scan). For example, the ultrasonic probe 101 is brought into contact with the body surface of the subject P (e.g., the abdomen of a pregnant woman) and transmits and receives ultrasonic waves to and from a region including at least a portion of a fetus in the pregnant woman's uterus. The ultrasonic probe 101 has multiple piezoelectric transducers. The multiple piezoelectric transducers are piezoelectric elements that have a piezoelectric effect of converting between an electrical signal (pulse voltage) and mechanical vibration (sound vibration), and generate ultrasonic waves based on a drive signal (electrical signal) supplied from the device main body 100. The generated ultrasonic waves are reflected by an acoustic impedance mismatch surface within the subject P and received by the multiple piezoelectric transducers as reflected wave signals (electrical signals) including components scattered by scatterers within tissue. The ultrasonic probe 101 sends the reflected wave signals received by the multiple piezoelectric transducers to the device main body 100.

[0015] In this embodiment, the ultrasonic probe 101 may be a 1D array probe having a plurality of piezoelectric vibrators arranged one-dimensionally in a predetermined direction, or a 2D array probe in which a plurality of piezoelectric vibrators are arranged two-dimensionally in a lattice pattern. Also, the ultrasonic probe 101 may be any type of ultrasonic probe, such as a mechanical 4D probe in which a plurality of piezoelectric vibrators arranged one-dimensionally are mechanically oscillated to scan a three-dimensional region.

[0016] The input device 102 includes a mouse, keyboard, buttons, panel switches, a touch command screen, a foot switch, a wheel, a trackball, a joystick, etc. The input device 102 receives various setting requests from the operator of the ultrasound diagnostic apparatus 1 and transfers the received setting requests to the apparatus main body 100.

[0017] The display 103 displays a GUI (Graphical User Interface) that allows the operator of the ultrasound diagnostic apparatus 1 to input various setting requests using the input device 102, and displays ultrasound image data and the like generated in the device main body 100. The display 103 also displays various messages to notify the operator of the processing status of the device main body 100.

[0018] The device main body 100 is a device that generates ultrasound image data based on reflected wave signals received by the ultrasound probe 101. The ultrasound image data generated by the device main body 100 may be two-dimensional ultrasound image data generated based on two-dimensional reflected wave signals, or may be three-dimensional ultrasound image data generated based on three-dimensional reflected wave signals.

[0019] 2, the device main body 100 includes, for example, a transmission / reception circuitry 110, a B-mode processing circuitry 120, a Doppler processing circuitry 130, an image processing circuitry 140, an image memory 150, a storage circuitry 160, and a control circuitry 170. The transmission / reception circuitry 110, the B-mode processing circuitry 120, the Doppler processing circuitry 130, the image processing circuitry 140, the image memory 150, the storage circuitry 160, and the control circuitry 170 are communicatively connected to one another. The device main body 100 is also connected to an in-hospital network 2.

[0020] The transmission / reception circuit 110 controls the transmission of ultrasound waves by the ultrasound probe 101. For example, the transmission / reception circuit 110 applies the above-mentioned drive signal (drive pulse) to the ultrasound probe 101 at a timing to which a predetermined transmission delay time is added for each transducer, based on instructions from the control circuit 170. As a result, the transmission / reception circuit 110 causes the ultrasound probe 101 to transmit an ultrasound beam, in which ultrasound waves are focused into a beam shape. The transmission / reception circuit 110 also controls the reception of a reflected wave signal by the ultrasound probe 101. The reflected wave signal is a signal obtained when ultrasound waves transmitted from the ultrasound probe 101 are reflected by the body tissue of the subject P.

[0021] The B-mode processing circuit 120 performs various signal processing on the reflected wave data generated from the reflected wave signal by the transmission / reception circuit 110. The B-mode processing circuit 120 performs logarithmic amplification, envelope detection processing, etc. on the reflected wave data received from the transmission / reception circuit 110 to generate data (B-mode data) in which the signal strength for each sample point (observation point) is expressed as luminance brightness. The B-mode processing circuit 120 sends the generated B-mode data to the image processing circuit 140.

[0022] The Doppler processing circuit 130 extracts motion information based on the Doppler effect of a moving object from the reflected wave data generated by the transmission / reception circuit 110 at each sample point within the scanning region, and generates the extracted data as Doppler data. Here, the motion information of the moving object is information such as the average velocity, variance, and power value of the moving object, and the moving object is, for example, blood flow, tissue such as the heart wall, or a contrast agent. The Doppler processing circuit 130 sends the generated Doppler data to the image processing circuit 140. For example, if the moving object is blood flow, the motion information of the blood flow is information such as the average velocity, variance, and power of the blood flow (blood flow information). The blood flow information can be obtained, for example, by color Doppler.

[0023] The image processing circuit 140 generates image data (ultrasound image data) and performs various image processing operations on the image data. For example, the image processing circuit 140 generates two-dimensional B-mode image data, which represents the intensity of reflected waves as brightness, from the two-dimensional B-mode data generated by the B-mode processing circuit 120. The image processing circuit 140 also generates two-dimensional Doppler image data, which visualizes blood flow information, from the two-dimensional Doppler data generated by the Doppler processing circuit 130. The two-dimensional Doppler image data is velocity image data representing the average velocity of blood flow, variance image data representing the variance of blood flow, power image data representing the power of blood flow, or image data that combines these. The image processing circuit 140 generates color Doppler image data, in which blood flow information such as the average velocity, variance, and power of blood flow is displayed in color, or generates Doppler image data in which one piece of blood flow information is displayed in grayscale.

[0024] The B-mode data and Doppler data are ultrasound image data before scan conversion processing, and the data generated by the image processing circuit 140 is ultrasound image data for display after scan conversion processing. Note that the B-mode data and Doppler data are also called raw data. The image processing circuit 140 generates two-dimensional ultrasound image data for display from the two-dimensional ultrasound image data before scan conversion processing.

[0025] The image processing circuit 140 also generates three-dimensional B-mode image data by performing coordinate transformation on the three-dimensional B-mode data generated by the B-mode processing circuit 120. The image processing circuit 140 also generates three-dimensional Doppler image data by performing coordinate transformation on the three-dimensional Doppler data generated by the Doppler processing circuit 130.

[0026] Furthermore, the image processing circuit 140 performs rendering processing on the volume image data to generate various types of two-dimensional image data for displaying the volume image data on the display 103. Rendering processing performed by the image processing circuit 140 includes, for example, processing for performing multi-planar reconstruction (MPR) to generate MPR image data from the volume image data. Rendering processing performed by the image processing circuit 140 also includes, for example, volume rendering (VR) processing for generating two-dimensional image data that reflects information of a three-dimensional image. Rendering processing performed by the image processing circuit 140 also includes, for example, surface rendering (SR) processing for generating two-dimensional image data in which only surface information of a three-dimensional image is extracted.

[0027] The image processing circuit 140 stores the generated image data and image data that has undergone various image processing in the image memory 150. The image processing circuit 140 may also generate information indicating the display position of each image data, various information for assisting the operation of the ultrasound diagnostic device 1, and additional information related to diagnosis such as patient information together with the image data, and store these in the image memory 150.

[0028] The image memory 150 and the storage circuit 160 are, for example, semiconductor memory elements such as RAM (Random Access Memory) and flash memory, or storage devices such as hard disks and optical disks.

[0029] The image memory 150 is a memory that stores image data such as B-mode image data and Doppler image data generated by the image processing circuit 140 as ultrasound image data. The image memory 150 can also store image data such as B-mode data generated by the B-mode processing circuit 120 and Doppler data generated by the Doppler processing circuit 130 as ultrasound image data. The ultrasound image data stored in the image memory 150 can be called up by the operator after diagnosis, for example, and becomes ultrasound image data for display via the image processing circuit 140.

[0030] The memory circuitry 160 stores control programs for transmitting and receiving ultrasound waves, processing images, and displaying images, as well as various data such as diagnostic information (e.g., patient ID, doctor's findings, etc.), diagnostic protocols, and various body marks. The data stored in the memory circuitry 160 can be transferred to an external device via an interface (not shown). Examples of external devices include a personal computer (PC) used by a doctor performing image diagnosis, a storage medium such as a CD or DVD, or a printer. The memory circuitry 160 does not have to be built into the ultrasound diagnostic device 1, as long as it is accessible from the ultrasound diagnostic device 1 over the network 2.

[0031] The control circuit 170 controls the overall processing of the ultrasound diagnostic apparatus 1. Specifically, the control circuit 170 controls the processing of the ultrasound probe 101, the transmission / reception circuit 110, the B-mode processing circuit 120, the Doppler processing circuit 130, the image processing circuit 140, etc., based on various setting requests input by the operator via the input device 102 and various control programs and various data read from the storage circuitry 160.

[0032] The overall configuration of the ultrasonic diagnostic apparatus 1 according to this embodiment has been described above. Here, an example of the arrangement of a plurality of probe connection terminal sections will be described.

[0033] Fig. 7A is a diagram for explaining an example of the arrangement of a plurality of probe connection terminal units, and is a front view of a housing 1000a in the main body of an ultrasound diagnostic device in which a plurality of probe connection terminal units 1200 are arranged. Fig. 7B is a front view of a circuit board portion inside the main body of the device in Fig. 7A when the housing 1000a is removed.

[0034] Typically, the plurality of probe connection terminals are arranged in a row, for example, in the horizontal or vertical direction. For example, as shown in Fig. 7A, on the front side of the housing 1000a, which is the device main body, the plurality of probe connection terminals 1200 are arranged in a row in the X-axis direction (horizontal direction) as probe connection terminals 1200a to 1200e.

[0035] Due to the variety of examinations, the number of probe connection terminal units mounted on an ultrasound diagnostic device tends to increase. Here, if the number of probe connection terminal units 1200 is increased in the X-axis direction, the probe connection terminal units 1200 are crowded together, and the distance between the probe connection terminal units 1200 becomes narrow. In this case, it becomes difficult for the user to insert or remove the connector of the ultrasound probe 101 into or from the probe connection terminal unit 1200, resulting in poor usability for the user. On the other hand, if the width or height of the device body is increased, the entire device becomes larger.

[0036] Furthermore, narrowing the intervals between the probe connection terminal units 1200 complicates the wiring of the substrate on which the probe connection terminal units 1200 are mounted. For example, Fig. 7B shows the substrate 1210 inside the device main body when the housing 1000a is removed, and narrowing the intervals between the probe connection terminal units 1200 increases the number of layers of the substrate 1210.

[0037] 7B, the substrate 1210 is mounted with probe connection terminal units 1200a to 1200e, which are the plurality of probe connection terminal units 1200, and a plurality of switching circuits 1300. The plurality of switching circuits 1300 output switching signals indicating whether or not the connector of the ultrasonic probe 101 is connected to the probe connection terminal units 1200a to 1200e to the control circuit 170. In addition, in response to a control signal from the control circuit 170, the plurality of switching circuits 1300 cause the ultrasonic probe 101 to transmit and receive ultrasonic waves (ultrasonic scan) via the probe connection terminal unit 1200, among the probe connection terminal units 1200a to 1200e, to which the connector of the ultrasonic probe 101 is connected.

[0038] Here, a single layered substrate is mounted inside the device body. For example, multiple switching circuits 1300 are wired on two layers 1210 of a layered substrate 1210. Specifically, probe connection terminal sections 1200a to 1200e and switching circuits 1300a and 1300b are wired on the first layer 1210a of the substrate 1210, and switching circuits 1300c and 1300d are wired on the second layer 1210b of the substrate 1210.

[0039] For example, the connector of the ultrasonic probe 101 is provided with a plurality of pins. In this embodiment, it is assumed in Fig. 7B that the connector of the ultrasonic probe is provided with six pins (male side). In this case, the probe connection terminal units 1200a to 1200e are provided with six terminals (female side) for connecting the six pins, respectively, and the six terminals are connected to the switching circuit 1300 via six wires. In the example shown in Fig. 7B, the probe connection terminal units 1200a and 1200e at both ends of the plurality of probe connection terminal units 1200 are connected to the switching circuits 1300a and 1300b via six wires on the first layer 1210a of the substrate 1210.

[0040] However, since the multiple probe connection terminal portions 1200 are closely spaced, the distance between the probe connection terminal portions 1200 is narrow. For this reason, in the probe connection terminal portions 1200b, 1200c, and 1200d other than the probe connection terminal portions 1200a and 1200e at both ends, all six wires cannot be arranged on the first layer 1210a of the substrate 1210.

[0041] For example, probe connection terminal sections 1200b and 1200d are connected to switching circuits 1300a and 1300b via four of the six wires on first layer 1210a of substrate 1210. However, in the leftmost and rightmost circled regions in FIG. 7B, the remaining two of the six wires cannot be arranged on first layer 1210a of substrate 1210 because the spacing between probe connection terminal sections 1200 is too narrow. Therefore, probe connection terminal sections 1200b and 1200d are connected to switching circuits 1300c and 1300d via the remaining two wires on second layer 1210b of substrate 1210.

[0042] Furthermore, switching circuits 1300a and 1300b are connected to probe connection terminal section 1200c via two of the six wires on first layer 1210a of substrate 1210. However, in the two central regions circled in Fig. 7B, the remaining four of the six wires cannot be arranged on first layer 1210a of substrate 1210 because the spacing between probe connection terminal sections 1200 is too narrow. For this reason, switching circuits 1300c and 1300d are connected to probe connection terminal section 1200c via the remaining four wires on second layer 1210b of substrate 1210.

[0043] In this way, when multiple probe connection terminal units 1200 are closely spaced, the distance between the probe connection terminal units 1200 becomes narrower, and the wiring of the substrate on which the probe connection terminal units 1200 are mounted becomes complex. Specifically, when the wiring becomes complex and dense, it becomes a multi-layer structure, which increases the thickness of the substrate, and when the thickness of the substrate increases, the entire device needs to be made larger.

[0044] Therefore, the ultrasonic diagnostic device 1 according to this embodiment has the following configuration so that the number of probe connection terminal units can be increased without increasing the size of the entire device and so that the ultrasonic probe can be easily inserted and removed. In the ultrasonic diagnostic device 1 according to this embodiment, a plurality of probe connection terminal units 200 to which connectors of the ultrasonic probes 101 are connected are arranged in the X-axis direction (horizontal direction) on the front surface of the device main body 100, and at least one of the plurality of probe connection terminal units 200 is arranged at a position shifted in the Y-axis direction (vertical direction) that intersects with the X-axis direction. Here, the X-axis direction is an example of "one direction," and the Y-axis direction is an example of "another direction."

[0045] The arrangement of the multiple probe connection terminal sections 200 in the ultrasonic diagnostic apparatus 1 according to this embodiment will be described in detail below.

[0046] Fig. 3A is a front view of the housing 100a in which multiple probe connection terminal units 200 are arranged in the device main body 100 of the ultrasound diagnostic device 1 according to this embodiment. Fig. 3B is a front view of the circuit board portion inside the device main body 100 of Fig. 3A with the housing 100a removed. Here, in this embodiment, the X-axis direction and the Y-axis direction in Fig. 3A and Fig. 3B are orthogonal to each other.

[0047] 3A, the plurality of probe connection terminal portions 200 are arranged in the X-axis direction as probe connection terminal portions 200a to 200e on the front side of the housing 100a, which is the device main body 100. For example, the plurality of probe connection terminal portions 200a to 200e are arranged at intervals from one another in the X-axis direction.

[0048] The plurality of probe connection terminal units 200 are, for example, rectangular when viewed from the front, with the short side direction of the probe connection terminal unit 200 being the X-axis direction and the long side direction of the probe connection terminal unit 200 being the Y-axis direction. The orientation and direction (Z-axis direction orthogonal to the X-axis direction and Y-axis direction in FIG. 1 ) of the plurality of probe connection terminal units 200 for inserting and removing the connector of the ultrasonic probe 101 are predetermined. For example, the connector of the ultrasonic probe 101 and the plurality of probe connection terminal units 200 are processed into a structure that prevents them from being connected in the wrong direction.

[0049] 3A, the center positions (or the position of one end in the longitudinal direction) of the two probe connection terminal portions 200a, 200e at both ends of the plurality of probe connection terminal portions 200a-200e are the same in the Y-axis direction. Furthermore, the center position of at least one probe connection terminal portion among the probe connection terminal portions 200b, 200c, 200d other than the two probe connection terminal portions 200a, 200e at both ends is different in the Y-axis direction from the center positions of the probe connection terminal portions 200a, 200e.

[0050] 3A, the center positions of probe connection terminal portions 200b and 200d are different in the Y-axis direction from the center positions of probe connection terminal portions 200a, 200c, and 200e. That is, among the multiple probe connection terminal portions 200a to 200e, the center positions of adjacent probe connection terminal portions are different in the Y-axis direction.

[0051] 3A, at least one of the multiple probe connection terminal units 200 is disposed at a position shifted in the Y-axis direction, so the multiple probe connection terminal units 200 are not crowded together and the intervals between the probe connection terminal units 1200 are not narrowed. This makes it easier for the user to insert and remove the connector of the ultrasonic probe 101 into and from the probe connection terminal unit 200, improving usability for the user.

[0052] Furthermore, in the example shown in FIG. 3A, because there is space between the probe connection terminal units 200, the wiring of the substrate on which the probe connection terminal units 200 are mounted is not complicated. A single layered substrate is mounted inside the device main body 100. For example, FIG. 3B shows the substrate 210 inside the device main body 100 when the housing 100a is removed. Because there is space between the probe connection terminal units 200, the number of layers of the substrate 210 can be reduced compared to the examples shown in FIGS. 7A and 7B. Specifically, when the wiring becomes complex and dense, a multi-layered structure is required, which increases the thickness of the substrate, and when the thickness of the substrate increases, the overall device needs to be larger. However, in the example shown in FIG. 3A, the number of layers of the substrate 210 can be reduced, so there is no need to increase the overall device size.

[0053] 3B, the multiple switching circuits 300 are wired on one layer of a substrate 210 having a layered structure. Specifically, the substrate 210 is wired with probe connection terminal units 200a-200e, which are the multiple probe connection terminal units 200, and switching circuits 300a-300e, which are the multiple switching circuits 300. The multiple switching circuits 300 output switching signals indicating whether or not the connector of the ultrasonic probe 101 is connected to the probe connection terminal units 200a-200e to the control circuit 170. In response to a control signal from the control circuit 170, the multiple switching circuits 300 cause the ultrasonic probe 101 to transmit and receive ultrasonic waves (ultrasonic scan) via the probe connection terminal unit 200, among the probe connection terminal units 200a-200e, to which the connector of the ultrasonic probe 101 is connected.

[0054] For example, a plurality of pins are provided on the connector of the ultrasonic probe 101. In this embodiment, as shown in FIG. 3B, the connector of the ultrasonic probe 101 is provided with six pins (male side). In this case, six terminals (female side) for connecting the six pins respectively are provided on the probe connection terminal units 200a to 200e, and the six terminals are connected to the switching circuit 300 via six wires. In the example shown in FIG. 3B, spaces are provided between the probe connection terminal units 200, so that the switching circuit 300 is connected to the plurality of probe connection terminal units 200 on the substrate 210 via six wires.

[0055] For example, switching circuits 300a and 300b are connected to probe connection terminal section 200a via six wires on substrate 210. Switching circuits 300a to 300c are connected to probe connection terminal section 200b via six wires on substrate 210. Switching circuits 300b to 300d are connected to probe connection terminal section 200c via six wires on substrate 210. Switching circuits 300c to 300e are connected to probe connection terminal section 200d via six wires on substrate 210. Switching circuits 300d and 300e are connected to probe connection terminal section 200e via six wires on substrate 210.

[0056] In this way, in the ultrasonic diagnostic device 1 according to this embodiment, the number of layers of the substrate 210 can be reduced compared to the example shown in Figures 7A and 7B because there is space between the probe connection terminal units 200. Furthermore, in the ultrasonic diagnostic device 1 according to this embodiment, the space between the probe connection terminal units 200 prevents the wiring of the substrate on which the probe connection terminal units 200 are mounted from becoming complicated, and there is no need to increase the size of the entire device.

[0057] As explained above, in the ultrasonic diagnostic device 1 according to this embodiment, a plurality of probe connection terminal units 200 to which connectors of the ultrasonic probes 101 are connected are arranged in the X-axis direction on the front surface of the device main body 100, and at least one of the plurality of probe connection terminal units 200 is disposed at a position shifted in the Y-axis direction that intersects with the X-axis direction. Therefore, in the ultrasonic diagnostic device 1 according to this embodiment, the number of probe connection terminal units can be increased without increasing the size of the entire device, making it easier to insert and remove the ultrasonic probes.

[0058] (First Modification) Fig. 4A is a front view of the housing 100a in which a plurality of probe connection terminal units 200 are arranged in the device main body 100 of the ultrasound diagnostic device 1 according to a first modification of this embodiment. Fig. 4B is a front view of the circuit board portion inside the device main body 100 of Fig. 4A when the housing 100a is removed. Here, in this embodiment, the X-axis direction and the Y-axis direction in Fig. 4A and Fig. 4B are orthogonal to each other.

[0059] In the example shown in FIG. 4A, the center positions of the probe connection terminal portions 200b, 200c, and 200d other than the two probe connection terminal portions 200a and 200e at both ends are different in the Y-axis direction from the center positions of the two probe connection terminal portions 200a and 200e at both ends.

[0060] Specifically, the center positions of the probe connection terminal portions 200b, 200c, and 200d are the same in the Y-axis direction, and the center positions of the probe connection terminal portions 200a and 200e and the center positions of the probe connection terminal portions 200b, 200c, and 200d are different in the Y-axis direction.

[0061] 4A, as in the example shown in Fig. 3A, at least one of the plurality of probe connection terminal portions 200 is disposed at a position shifted in the Y-axis direction, so the plurality of probe connection terminal portions 200 are not crowded together, and the intervals between the probe connection terminal portions 1200 are not narrowed. This makes it easier for the user to insert and remove the connector of the ultrasonic probe 101 into and from the probe connection terminal portion 200, improving usability for the user.

[0062] In addition, in the example shown in FIG. 4A, space is provided in the longitudinal direction of the probe connection terminal unit 200, so the wiring of the substrate on which the probe connection terminal unit 200 is mounted is not complicated. A substrate having a single layer structure is mounted inside the device main body 100. For example, FIG. 4B shows the substrate 210 inside the device main body 100 when the housing 100a is removed. Since space is provided in the longitudinal direction of the probe connection terminal unit 200, the number of layers of the substrate 210 can be reduced, as in the example shown in FIG. 3A. Specifically, when the wiring becomes complex and dense, a multi-layer structure is required, so the thickness of the substrate increases, and when the thickness of the substrate increases, the overall device needs to be made larger. However, in the example shown in FIG. 4A, the number of layers of the substrate 210 can be reduced, so there is no need to make the overall device larger.

[0063] 4B, for example, the multiple switching circuits 300 are wired on one layer of a layered substrate 210. Specifically, on the substrate 210, the multiple probe connection terminal units 200, that is, probe connection terminal units 200a to 200e, and the multiple switching circuits 300, that is, switching circuits 300a and 300b, are wired.

[0064] For example, the connector of the ultrasonic probe 101 is provided with a plurality of pins. In this embodiment, it is assumed in Fig. 4B that the connector of the ultrasonic probe 101 is provided with six pins (male side). In this case, the probe connection terminal units 200a to 200e are provided with six terminals (female side) for connecting the six pins, respectively, and the six terminals are connected to the switching circuit 300 via six wires. In the example shown in Fig. 4B, a space is created in the longitudinal direction of the probe connection terminal unit 200 in the circled region in the figure, so that the probe connection terminal units 200a to 200e are connected to the switching circuits 300a and 300b via six wires on the substrate 210.

[0065] In this way, in the ultrasonic diagnostic device 1 according to the first modification of this embodiment, space is provided in the longitudinal direction of the probe connection terminal unit 200, so that the wiring of the board on which the probe connection terminal unit 200 is mounted does not become complicated, and there is no need to increase the size of the entire device. Therefore, also in the first modification of this embodiment, the number of probe connection terminal units can be increased without increasing the size of the entire device, making it easier to insert and remove the ultrasonic probe 101.

[0066] (Second Modification) Fig. 5A is a front view of a housing 100a in which a plurality of probe connection terminal units 200 are arranged in a device main body 100 of an ultrasound diagnostic device 1 according to a second modification of this embodiment. Fig. 5B is a front view of a circuit board portion inside the device main body 100 of Fig. 5A when the housing 100a is removed. Here, in this embodiment, the X-axis direction and the Y-axis direction in Figs. 5A and 5B are orthogonal to each other.

[0067] In the example shown in FIG. 5A, the center positions of the probe connection terminal portions 200b, 200c, and 200d other than the two probe connection terminal portions 200a and 200e at both ends are different in the Y-axis direction from the center positions of the two probe connection terminal portions 200a and 200e at both ends.

[0068] Specifically, the multiple probe connection terminals 200a-200e are arranged in a V-shape when viewed from the front. For example, among the multiple probe connection terminals 200a-200e, the probe connection terminals 200a and 200e that are symmetrical with respect to the probe connection terminal 200c at the center of the arrangement have the same center position in the Y-axis direction, and the probe connection terminals 200b and 200d have the same center position in the Y-axis direction. Furthermore, the probe connection terminals 200a and 200d that are asymmetrical with respect to the center of the arrangement have different center positions in the Y-axis direction, and the probe connection terminals 200b and 200e have different center positions in the Y-axis direction.

[0069] 5A, as in the example shown in Fig. 3A, at least one of the plurality of probe connection terminal portions 200 is disposed at a position shifted in the Y-axis direction, so the plurality of probe connection terminal portions 200 are not crowded together and the intervals between the probe connection terminal portions 200 are not narrowed. This makes it easier for the user to insert and remove the connector of the ultrasonic probe 101 into and from the probe connection terminal portion 200, improving usability for the user.

[0070] Furthermore, in the example shown in FIG. 5A, because there is space between the probe connection terminal units 200, the wiring of the substrate on which the probe connection terminal units 200 are mounted is not complicated. A single layered substrate is mounted inside the device main body 100. For example, FIG. 5B shows the substrate 210 inside the device main body 100 when the housing 100a is removed. Because there is space between the probe connection terminal units 200, the number of layers of the substrate 210 can be reduced, as in the example shown in FIG. 3A. Specifically, when the wiring becomes complex and dense, a multi-layered structure is required, which increases the thickness of the substrate, and when the thickness of the substrate increases, the overall device size needs to be increased. However, in the example shown in FIG. 5A, the number of layers of the substrate 210 can be reduced, so there is no need to increase the size of the overall device.

[0071] 5B, the multiple switching circuits 300 are wired on one layer of a layered substrate 210. Specifically, the multiple probe connection terminal units 200, ie, probe connection terminal units 200a to 200e, and the multiple switching circuits 300, ie, switching circuits 300a to 300e, are wired on the substrate 210.

[0072] For example, a plurality of pins are provided on the connector of the ultrasonic probe 101. In this embodiment, as shown in FIG. 5B, the connector of the ultrasonic probe 101 is provided with six pins (male side). In this case, six terminals (female side) for connecting the six pins respectively are provided on the probe connection terminal units 200a to 200e, and the six terminals are connected to the switching circuit 300 via six wires. In the example shown in FIG. 5B, spaces are provided between the probe connection terminal units 200, so that the switching circuit 300 is connected to the plurality of probe connection terminal units 200 on the substrate 210 via six wires.

[0073] For example, switching circuits 300a and 300b are connected to probe connection terminal section 200a via six wires on substrate 210. Switching circuits 300a to 300c are connected to probe connection terminal section 200b via six wires on substrate 210. Switching circuits 300b to 300d are connected to probe connection terminal section 200c via six wires on substrate 210. Switching circuits 300c to 300e are connected to probe connection terminal section 200d via six wires on substrate 210. Switching circuits 300d and 300e are connected to probe connection terminal section 200e via six wires on substrate 210.

[0074] In this way, in the ultrasonic diagnostic device 1 according to the second modification of this embodiment, by providing spaces between the probe connection terminal units 200, the wiring of the board on which the probe connection terminal units 200 are mounted does not become complicated, and there is no need to increase the size of the entire device, as in the example shown in Fig. 3A. Therefore, also in the second modification of this embodiment, the number of probe connection terminal units can be increased without increasing the size of the entire device, making it easier to insert and remove the ultrasonic probe 101.

[0075] (Third Modification) Fig. 6A is a front view of the housing 100a in which a plurality of probe connection terminal units 200 are arranged in the device main body 100 of the ultrasound diagnostic device 1 according to a third modification of this embodiment. Fig. 6B is a front view of the circuit board portion inside the device main body 100 of Fig. 6A when the housing 100a is removed. Here, in this embodiment, the X-axis direction and the Y-axis direction in Fig. 6A and Fig. 6B are orthogonal to each other.

[0076] In the example shown in FIG. 6A, at least two of the plurality of probe connection terminal portions 200a to 200e are located at the same position in the X-axis direction and at different positions in the Y-axis direction.

[0077] Specifically, of the multiple probe connection terminals 200a-200e, the two probe connection terminals 200a, 200d at both ends have the same center position in the Y-axis direction. Also, the two probe connection terminals 200b, 200e at both ends have the same center position in the Y-axis direction. Also, the center position of the probe connection terminals 200c other than the probe connection terminals 200a, 200b, 200d, 200e at both ends is different in the Y-axis direction from the center positions of the probe connection terminals 200a, 200b, 200d, 200e at both ends.

[0078] 6A, as in the example shown in Fig. 3A, at least one of the plurality of probe connection terminal portions 200 is disposed at a position shifted in the Y-axis direction, so the plurality of probe connection terminal portions 200 are not crowded together, and the intervals between the probe connection terminal portions 1200 are not narrowed. This makes it easier for the user to insert and remove the connector of the ultrasonic probe 101 into and from the probe connection terminal portion 200, improving usability for the user.

[0079] In addition, in the example shown in FIG. 6A, because there is space between the probe connection terminal units 200, the wiring of the substrate on which the probe connection terminal units 200 are mounted is not complicated. A single layered substrate is mounted inside the device main body 100. For example, FIG. 6B shows the substrate 210 inside the device main body 100 when the housing 100a is removed. Because space is created in the longitudinal direction of the probe connection terminal units 200, the number of layers of the substrate 210 can be reduced, as in the example shown in FIG. 3A. Specifically, when the wiring becomes complex and dense, a multi-layered structure is required, which increases the thickness of the substrate, and when the thickness of the substrate increases, the overall device size needs to be increased. However, in the example shown in FIG. 6A, the number of layers of the substrate 210 can be reduced, so there is no need to increase the size of the overall device.

[0080] 6B, for example, the multiple switching circuits 300 are wired on one layer of a layered substrate 210. Specifically, on the substrate 210, the multiple probe connection terminal units 200, that is, probe connection terminal units 200a to 200e, and the multiple switching circuits 300, that is, switching circuits 300a and 300b, are wired.

[0081] For example, the connector of the ultrasonic probe 101 is provided with a plurality of pins. In this embodiment, it is assumed in Fig. 6B that the connector of the ultrasonic probe 101 is provided with six pins (male side). In this case, the probe connection terminal units 200a to 200e are provided with six terminals (female side) for connecting the six pins, respectively, and the six terminals are connected to the switching circuit 300 via six wires. In the example shown in Fig. 6B, since there is space in the longitudinal direction of the probe connection terminal unit 200, the probe connection terminal units 200a to 200e are connected to the switching circuit 300 via six wires on the substrate 210.

[0082] For example, the probe connection terminals 200a and 200d are connected to the switching circuit 300a via six wires on the substrate 210. The probe connection terminals 200b and 200e are connected to the switching circuit 300b via six wires on the substrate 210. The probe connection terminal 200c is connected to the switching circuits 300a and 300b via six wires on the substrate 210.

[0083] In this way, in the ultrasonic diagnostic device 1 according to the third modification of this embodiment, by providing spaces between the probe connection terminal units 200, the wiring of the board on which the probe connection terminal units 200 are mounted does not become complicated, and there is no need to increase the size of the entire device, as in the example shown in Fig. 3A. Therefore, also in the third modification of this embodiment, the number of probe connection terminal units can be increased without increasing the size of the entire device, making it easier to insert and remove the ultrasonic probe 101.

[0084] According to at least one of the embodiments described above, the number of probe connection terminals can be increased without increasing the size of the entire device, and the ultrasonic probe can be easily inserted and removed.

[0085] In this embodiment and each modified example, the "one direction" is the X-axis direction and the "other direction" is the Y-axis direction, but this is not limited to this. For example, the "one direction" may be the Y-axis direction and the "other direction" may be the X-axis direction. In this case, in this embodiment and each modified example, on the front surface of the device main body 100, multiple probe connection terminal units 200 to which connectors of the ultrasonic probe 101 are connected are arranged in the Y-axis direction (vertical direction), and at least one of the multiple probe connection terminal units 200 is disposed at a position shifted in the X-axis direction (horizontal direction). Even in this case, in this embodiment and each modified example, as described above, the number of probe connection terminal units can be increased without increasing the size of the entire device, making it easier to insert and remove the ultrasonic probe 101.

[0086] Furthermore, in this embodiment and each modified example, the "one direction" and the "other direction" are orthogonal to each other, but this is not limiting. For example, the multiple probe connection terminal units 200 may be diamond-shaped when viewed from the front, and the "one direction" and the "other direction" may not be orthogonal to each other. Even in this case, in this embodiment and each modified example, as described above, the number of probe connection terminal units can be increased without increasing the size of the entire device, making it easier to insert and remove the ultrasonic probe 101.

[0087] Although several embodiments have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations of embodiments can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0088] 1. Ultrasound diagnostic equipment 100 Device body 200 Probe connection terminal 200a~200e Probe connection terminal

Claims

1. a device body in which a plurality of probe connection terminals to which connectors of an ultrasonic probe are connected are arranged in one direction; Equipped with At least one of the plurality of probe connection terminal portions is disposed at a position shifted in another direction intersecting the one direction. Ultrasound diagnostic equipment.

2. the plurality of probe connection terminal portions are arranged at intervals from one another in the one direction, the positions of two probe connection terminal portions at both ends of the plurality of probe connection terminal portions are the same in the other direction; a position of at least one of the probe connection terminals other than the two probe connection terminals at both ends is different from the positions of the two probe connection terminals at both ends in the other direction; The ultrasonic diagnostic apparatus according to claim 1 .

3. the positions of the probe connection terminals other than the two probe connection terminals at both ends are the same in the other direction; the positions of the two probe connection terminals at both ends are different from the positions of the probe connection terminals other than the two probe connection terminals at both ends in the other direction; The ultrasonic diagnostic apparatus according to claim 2 .

4. Among the probe connection terminal portions other than the two probe connection terminal portions at both ends, the positions of adjacent probe connection terminal portions are different in the other direction. The ultrasonic diagnostic apparatus according to claim 2 .

5. the plurality of probe connection terminal portions are arranged at intervals from one another in the one direction, Among the plurality of probe connection terminal portions, positions of adjacent probe connection terminal portions are different in the other direction. The ultrasonic diagnostic apparatus according to claim 1 .

6. Among the plurality of probe connection terminal portions, positions of the probe connection terminal portions that are symmetrical with respect to the center of arrangement are the same in the other direction, and positions of the probe connection terminal portions that are asymmetrical with respect to the center of arrangement are different in the other direction. The ultrasonic diagnostic apparatus according to claim 2 .

7. The plurality of probe connection terminal portions are arranged in a V-shape.

10. The ultrasonic diagnostic apparatus according to claim 2 or 6.

8. At least two of the plurality of probe connection terminal portions are located at the same position in the one direction and at different positions in the other direction. The ultrasonic diagnostic apparatus according to claim 1 .

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