Radiographic imaging apparatus and radiographic imaging system

Abstract

To provide a radiographic imaging apparatus that suppresses an increase in the thickness to promote miniaturization while enabling efficient and sufficient air cooling.SOLUTION: In a radiographic imaging apparatus 100, a housing 200 that accommodates a sensor panel 131, a support base 132, an electrical board 133, an integrated circuit 134 serving as a heat source, and a heat transfer member 135 thermally connected to the integrated circuit 134 has, on a rear-side portion 140 of a radiation incident surface of the housing 200, a first surface portion 141 and a second surface portion 142, the inner surface of the second surface portion 142 being in contact with the heat transfer member 135, and the distance between the outer surface of the second surface portion 142 and the sensor panel 131 being smaller than the distance between the outer surface of the first surface portion 141 and the sensor panel 131.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a radiographic apparatus and a radiographic system. [Background technology]

[0002] Radiography devices, which irradiate an object with radiation and detect the intensity distribution of the radiation that has passed through the object to obtain a radiation image of the object, are widely used in industrial non-destructive testing and medical diagnosis. In recent years, the amount of heat generated by radiation imaging devices has increased as the resolution of images acquired by the devices has increased and the speed of video capture has increased, making the cooling capabilities of conventional radiation imaging devices insufficient. Insufficient cooling can cause heat generated primarily in integrated circuits on circuit boards that control the behavior of the radiation imaging device and the acquisition of images. When heat is transferred to electronic components or radiation detection units, the components can exceed their heat resistance temperature, resulting in damage and image distortion.

[0003] Water cooling is one method for cooling a radiographic imaging device, but water cooling requires refrigerants, hoses, and other components, which increases the design load and requires the time and effort of replacing the refrigerant. Therefore, air cooling has attracted attention as a cooling method for radiographic imaging devices. For example, Patent Document 1 proposes a configuration in which a heat sink is provided on the outside of the radiographic imaging device, and the heat sink extends into the housing and comes into contact with the heat-generating components. Patent Document 2 proposes that the inner wall of the exterior of the radiographic imaging device protrudes toward the integrated circuit or other heat source, thereby directly transferring heat to the exterior for cooling. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-88152 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-43390 Summary of the Invention [Problem to be solved by the invention]

[0005] For portable radiography devices, the thinner they are, the easier they are to carry and the easier they are to insert and remove from under the patient's body. Furthermore, for stationary radiography devices to be installed in larger radiography systems, the smaller the external dimensions of the radiography device, the smaller the space required for installation, which is preferable from the standpoint of design flexibility and miniaturization of the entire system.

[0006] The radiographic imaging device of Patent Document 1 has a heat sink protruding from the outside of the housing, which impairs portability. Even in the case of a stationary type, the size of the radiographic imaging device increases by the size of the heat sink, requiring additional space to accommodate the system. Furthermore, in Patent Document 2, the thermal resistance increases by the distance between the protruding inner wall and the outer wall, leaving room for improvement in terms of efficient cooling.

[0007] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide a radiographic imaging device that suppresses an increase in thickness and promotes miniaturization, while enabling efficient and sufficient air cooling. [Means for solving the problem]

[0008] The radiographic imaging device of the present disclosure includes a radiation detector that detects radiation, a heat source arranged on the side opposite the radiation incident surface of the radiation detector, a heat transfer member thermally connected to the heat source, and a housing that contains the radiation detector, the heat source, and the heat transfer member, and the housing has a first surface portion on the back side of the radiation incident surface of the housing, and a second surface portion whose inner surface is in contact with the heat transfer member and whose distance from the outer surface to the radiation detector is smaller than the distance from the outer surface of the first surface portion to the radiation detector. [Effects of the Invention]

[0009] According to the present disclosure, a radiographic imaging apparatus is realized that can suppress an increase in thickness and promote miniaturization, while still allowing efficient and sufficient air cooling. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram showing an example of the schematic configuration of a radiation imaging apparatus according to a first embodiment. [Figure 2] 2 is a cross-sectional view of the radiation imaging apparatus taken along the dashed line AA in FIG. 1. [Figure 3] FIG. 10 is a schematic diagram illustrating an example of the schematic configuration of a radiation imaging apparatus according to a second embodiment. [Figure 4] FIG. 10 is a schematic diagram showing an example of the schematic configuration of a radiation imaging apparatus according to a third embodiment. [Figure 5] 5 is a cross-sectional view of the radiation imaging apparatus taken along the dashed line AA in FIG. 4. [Figure 6] 10A and 10B are schematic diagrams illustrating the behavior of the radiation imaging apparatus according to the third embodiment in a specific application. [Figure 7] FIG. 10 is a cross-sectional view showing another example of the radiation imaging apparatus according to the third embodiment. [Figure 8] FIG. 10 is a schematic diagram showing an example of the schematic configuration of a radiation imaging apparatus according to a fourth embodiment. [Figure 9] 9 is a cross-sectional view of the radiation imaging apparatus taken along the dashed line AA in FIG. 8. [Figure 10] FIG. 10 is a schematic diagram showing a schematic configuration of a radiation imaging system 300 according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Preferred embodiments will be described in detail below with reference to the drawings. In the following description, components common to multiple drawings are assigned common reference numerals. Therefore, the common components will be described with mutual reference to multiple drawings, and descriptions of components assigned common reference numerals will be omitted as appropriate. The details of dimensions and structures shown in each embodiment are not limited to those shown in the text and drawings. Note that in this specification, radiation includes not only X-rays but also α-rays, β-rays, γ-rays, particle rays, cosmic rays, etc.

[0012] -First embodiment- The first embodiment will be described in detail below with reference to the drawings.

[0013] [Configuration of Radiation Imaging Apparatus 100] 1A and 1B are schematic diagrams showing an example of the general appearance of a radiation imaging apparatus 100 according to this embodiment, where (a) is a plan view and (b) is a side view. Connectors (connecting portions) 110 for connecting cables to establish electrical connection with the outside are provided on the exterior of the radiation imaging apparatus 100. Note that, although two connectors 110 protruding outward are illustrated in Fig. 1, there may be one or three or more connectors 110, and there may also be connectors that protrude into the inside of the radiation imaging apparatus 100 rather than being protruding.

[0014] Fig. 2 is a cross-sectional view taken along the dashed line AA of the radiation imaging apparatus 100 in Fig. 1. The structure of the radiation imaging apparatus 100 according to this embodiment will be described below with reference to Fig. 2. The radiation imaging apparatus 100 includes a phosphor 130, a sensor panel 131, a support base 132, an electric board 133, and a housing 200 which is an exterior member that encloses these components.

[0015] The phosphor 130 is a scintillator layer onto which radiation 211 that has passed through the front surface 120 of the housing 200 is incident and which converts the radiation 211 into light. The sensor panel 131 is a radiation detector that detects light from the phosphor 130, and has a large number of photoelectric conversion elements (sensors) arranged in a matrix. The support base 132 supports and fixes the phosphor 130 and the sensor panel 131, and suppresses the effects of deformation due to bending stress and vibration. The electric board 133 is electrically connected to the sensor panel 131, and reads out electrical signals from the sensor panel 131 and converts them into image information. The electric board 133 is not limited to a single member as shown in the figure, but may be divided into multiple parts.

[0016] The electrical board 133 is provided with a connector 110 for wired connection to the outside, and can be electrically connected to an external device or the like via a cable (not shown) connected to the connector 110. The electrical board 133 can transmit image information and receive power via the connector 110. The electrical board 133 is provided with an integrated circuit 134 on the side opposite the radiation incident surface, and the integrated circuit 134 controls the behavior of the radiation imaging apparatus 100, such as image processing and communication. In the radiation imaging apparatus 100, the integrated circuit 134 serves as a heat source that generates a large amount of heat when driven. The integrated circuit 134 is in thermal contact with the inner surface of the rear portion 140 of the housing 200 via a heat transfer member 135. The heat transfer member 135 is made of a material with excellent thermal conductivity, such as heat-dissipating rubber or metal. The heat transfer member 135 need not be a single component as shown in the figure, but may be a composite component in which multiple components of the same material are appropriately joined together.

[0017] The housing 200 has a flat front portion 120 having a radiation incident surface through which radiation 211 enters and passes, and a back portion 140 that is combined with the front portion 120 to form a closed internal space containing the sensor panel 131 and the like. A connector 110, which is a predetermined member having one end protruding outward from the housing 200 and the other end protruding inward from the housing 200, is disposed on one side of the back portion 140. The connector 110 is electrically connected to an electric board 133 inside the housing 200 (inside the internal space). To achieve both portability and strength, the housing 200 is preferably made of a magnesium alloy, an aluminum alloy, a fiber-reinforced resin, a resin, or the like, but is not limited to these.

[0018] The rear surface portion 140 of the housing 200 has, at a surface portion (rear surface portion) facing the front surface portion 120, a first rear surface portion 141 that is a first surface portion having a flat outer surface, and a second rear surface portion 142 that is a second surface portion having a flat outer surface. The first rear surface portion 141 is a portion where the connector 110 is disposed in a location corresponding to at least a portion below the first rear surface portion 141. The second rear surface portion 142 includes a portion that faces the integrated circuit 134, which is a heat source, on its inner surface. A heat transfer member 135 that is thermally connected to the integrated circuit 134 is in contact with the inner surface of the second rear surface portion 142. As a result, the integrated circuit 134 is thermally connected to the second rear surface portion 142 via the heat transfer member 135. In the rear surface portion 140, the distance between the outer surface and the sensor panel 131 is shorter than the distance between the outer surface of the first rear surface portion 141 and the sensor panel 131. Specifically, in this embodiment, the rear surface portion 140 has a shape in which there is only one step 151 between the first rear surface portion 141 and the second rear surface portion 142 on the outer surface. The distance from the sensor panel 131 to the entire outer surface of the planar second rear surface portion 142 is the same. The integrated circuit 134 is thermally connected to the inner surface of the second rear surface portion 142 via a heat transfer member 135 arranged in contact with the upper surface of the integrated circuit 134. The number of integrated circuits 134 and the number of heat transfer members 135 are not limited to one each, and multiple integrated circuits 134 and multiple heat transfer members 135 may be arranged in a region included below the second rear surface portion 142.

[0019] In a radiographic imaging device, the amount of heat generated increases as the resolution of acquired images and the speed of video imaging increase, and cooling of the heat source becomes insufficient across the entire device, for example, if the thickness is equivalent to the thickness of the first rear portion 141. If cooling is insufficient, when heat generated mainly in the integrated circuits of the electrical board that controls the behavior of the radiographic imaging device and the acquisition of images is transmitted to the sensor panel or the like, the heat resistance temperature of the parts is exceeded, leading to damage and image irregularities.

[0020] For a heat source such as the integrated circuit 134, the closer it is to the heat dissipation member, the more efficient the heat dissipation from the heat source. On the other hand, the integrated circuit 134 is generally smaller than the components used in the connector 110 for external electrical connection. Therefore, the second rear section 142 of the rear section 140, which corresponds to the integrated circuit 134, can be placed closer to the electrical board 133 than the first rear section 141, which corresponds to the vicinity of the connector 110. In this manner, the first rear section 141 of the housing 200 includes a predetermined component, such as the connector 110, that is larger than the integrated circuit 134, below it, ensuring an appropriate thickness for the housing 200. On the other hand, the second rear section 142, which includes the integrated circuit 134, a heat source, below it, can be made thinner than the first rear section 141 of the housing 200, thereby improving heat dissipation efficiency and miniaturizing the radiographic imaging device 100. This configuration reduces thermal resistance from the integrated circuit 134 to the external environment of the radiographic imaging device 100 without increasing the overall size.

[0021] As described above, according to this embodiment, it is possible to realize a radiation imaging apparatus 100 that can suppress an increase in thickness and promote miniaturization, while still allowing efficient and sufficient air cooling.

[0022] In this embodiment, an indirect conversion type radiation imaging device 100 that converts radiation into light and then converts the light into electric charges is exemplified, using a phosphor 130 and a sensor panel 131. However, the present invention is not limited to such a radiation imaging device, and a direct conversion type radiation imaging device that directly converts radiation into electric charges may also be applied.

[0023] -Second embodiment- The second embodiment will be described in detail below with reference to the drawings. In this embodiment, a radiographic apparatus similar to the first embodiment will be disclosed, but detailed descriptions of components identical to those in the first embodiment will be omitted.

[0024] 3A and 3B are schematic diagrams showing a radiographic apparatus 100 according to a second embodiment, in which (a) is a plan view and (b) is a cross-sectional view of the radiographic apparatus 100 taken along the dashed line AA in (a). In the present embodiment, in the radiographic imaging apparatus 100, as in the first embodiment, the rear surface 140 has a shape in which there is only one step 151 between the first rear surface 141 and the second rear surface 142 on the outer surface. Furthermore, the distance from the sensor panel 131 to the entire outer surface of the planar second rear surface 142 is the same. Furthermore, in the present embodiment, a plurality of heat dissipation fins 150 are provided on the outer surface of the second rear surface 142 of the housing 200. The plurality of heat dissipation fins 150 (six in the illustrated example) are provided in a striped pattern, approximately parallel to the longitudinal direction of the first rear surface 141, and are made of a metal material or the like with excellent heat dissipation properties. By providing the heat dissipation fins 150, heat transferred from the integrated circuit 134 to the second rear surface 142 can be more efficiently transported to the surrounding air.

[0025] In this embodiment, when viewed from the incident direction of the radiation 211, at least one (two in the illustrated example) heat dissipation fin 150 overlaps the position of the integrated circuit 134, which is the heat source, more specifically, the position of the heat transfer member 135 in contact with the inner surface of the second rear portion 142. With this configuration, heat is more reliably dissipated by the heat dissipation fin 150 in the overlapping portion, thereby achieving excellent heat dissipation.

[0026] Furthermore, in this embodiment, the position of the tip of the heat dissipation fin 150 is substantially the same height as the outer surface of the first rear portion 141. This configuration enables efficient heat dissipation without unnecessarily increasing the thickness (size) of the radiation imaging apparatus 100. If the tip of the heat dissipation fin 150 does not protrude outward from the first rear portion 141, the outer shape of the radiation imaging apparatus 100 does not need to be increased. On the other hand, depending on the amount of heat generated, it may be necessary to extend the heat dissipation fin 150 to the outside of the first rear portion 141 to improve heat dissipation efficiency. Even in such a case, the length of the heat dissipation fin 150 is increased by the distance between the first rear portion 141 and the second rear portion 142 compared to when the second rear portion 142 is not brought closer to the sensor panel 130, and improved heat dissipation performance is expected.

[0027] Furthermore, improved heat transport by radiation can be expected by applying a coating or surface treatment that improves the thermal emissivity to the heat dissipation fins 150. Furthermore, the heat dissipation fins 150 contribute to improving the rigidity of the second rear portion 142, and therefore also contribute to suppressing image quality abnormalities caused by vibrations.

[0028] -Third embodiment- The third embodiment will be described in detail below with reference to the drawings. In this embodiment, a radiographic apparatus similar to the first embodiment will be disclosed, but detailed descriptions of components identical to those in the first embodiment will be omitted.

[0029] 4A and 4B are schematic diagrams showing a radiation imaging apparatus 100 according to a third embodiment, in which (a) is a plan view and (b) is a side view. Fig. 5 is a cross-sectional view of the radiation imaging apparatus 100 taken along the dashed dotted line AA of Fig. 4. In the present embodiment, in the radiation imaging apparatus 100, as in the first embodiment, the first rear surface 141 of the rear surface 140 of the housing 200 is a portion where the connector 110 is disposed in a location corresponding to at least a portion of the lower side thereof. The second rear surface 142 of the rear surface 140 includes a portion that faces the integrated circuit 134, which is a heat source, on its inner surface. A heat transfer member 135 that is thermally connected to the integrated circuit 134 is in contact with the inner surface of the second rear surface 142. The distance from the outer surface to the sensor panel 131 is shorter than the distance from the outer surface of the first rear surface 141 to the sensor panel 131.

[0030] Specifically, in this embodiment, the second rear portion 142 is recessed and has a continuous outer surface region 142a extending from at least the middle of the rear portion 140 to one end, in this case from the one end to the opposite end, at a constant distance from the sensor panel 131. In the second rear portion 142, the heat transfer member 135, which is thermally connected to the integrated circuit 134 as described above, contacts the inner surface below the region 142a. The housing 200 has a first side surface portion 101 that intersects with the rear portion 140 and a second side surface 102 that extends along the first side surface portion 101. In FIG. 4, the rear portion 140 is substantially perpendicular to the first side surface portion 101 and the second side surface 102, and the first side surface portion 101 and the second side surface 102 are substantially parallel to each other. Region 142a is continuously and integrally formed at one end and the other end with first side surface 101 and second side surface 102, respectively, and is formed into a groove shape with open ends that are substantially parallel to each other and extend along first side surface portion 101 and second side surface 102. This configuration allows air to pass through region 142a in the longitudinal direction, thereby efficiently dissipating heat from integrated circuit 134.

[0031] As shown in FIG. 5 , the width of region 142a of second rear portion 142 in the short-side direction is L, and the distance between first rear portion 141 and second rear portion 142 along the incident direction of radiation 211 (the difference in height between them) is H. Furthermore, the portion of rear portion 140 where second rear portion 142 is formed and where the outer surface is convex together with first rear portion 141 is defined as third rear portion 143. In this case, it is desirable to have a long distance from the position of region 142a facing integrated circuit 134 to third rear portion 143. If wind flows along the longitudinal direction of second rear portion 142, the temperature of the wind flowing directly above integrated circuit 134 increases as the third rear portion 143 approaches due to the temperature gradient from the surface temperature of third rear portion 143. Furthermore, the closer the third rear portion 143 is, the slower the wind speed becomes due to the velocity gradient. In other words, if L is small, heat dissipation from integrated circuit 134 becomes inefficient. Furthermore, if wind flows along the short side of the second rear portion 142, if H is small compared to L, the wind will not be able to reach the surface of the second rear portion 142, which will also have a negative effect on the heat dissipation efficiency of the integrated circuit 134. For these reasons, in the second rear portion 142, specifically, in order to make the value of H / L small, H / L≦1 It is desirable to satisfy the following relationship.

[0032] 5, in the housing 200, an opening 103a through which the connector 110 is inserted is formed in a third side surface portion 103, which is a side surface that is substantially perpendicular to the first side surface portion 101 and the second side surface portion 102. The longitudinal direction of the region 142a of the second rear surface portion 142 and the normal direction of the third side surface portion 103 intersect, or are substantially perpendicular in this case. In other words, in this embodiment, the longitudinal direction intersects, or are substantially perpendicular in this case, with the direction along the opening 103a.

[0033] FIG. 6 is a schematic diagram showing the behavior of the radiation imaging apparatus 100 in a specific application. For example, there is a case where the radiographic imaging device 100 is rotated with the third side surface 103 on which the connector 110 is disposed facing the center of rotation while repeatedly capturing radiological video. At this time, the multiple images obtained are reconstructed to obtain a tomographic image or a three-dimensional image of the subject. In this application, a high imaging speed is required for the radiographic imaging device 100 in order to reduce the influence of the subject's movement and shorten the examination time. On the other hand, a high imaging speed tends to increase the amount of heat generated by the integrated circuit 134. At this time, as shown in FIG. 6, there is a case where the radiographic imaging device 100 is rotated with the same surface (the third side surface 103 on which the connector 110 is disposed) facing the center of rotation.

[0034] In this embodiment, as described above, the second rear surface portion 142 has a continuous outer surface region 142a extending from one end of the rear surface portion 140 to the opposite end, the region 142a being the same distance from the sensor panel 131, and is concave with both ends open. Radiography is performed by rotationally driving the radiographic imaging device 100 so that the longitudinal direction of the region 142a and the tangential direction of the rotational drive are substantially parallel. With this configuration, air blows through the region 142a in the longitudinal direction, allowing heat dissipation from the integrated circuit 134 to be performed extremely efficiently.

[0035] In this embodiment, similarly to the second embodiment, heat dissipation fins 150 may be provided on the outer surface of the second rear surface portion 142.

[0036] FIG. 7 is a cross-sectional view showing another example of the radiation imaging apparatus 100 according to the third embodiment. A plurality of heat dissipation fins 150 (four in the illustrated example) are provided in a striped pattern, extending substantially parallel to the longitudinal direction of the region 142a. In this case, air can blow through the region 142a along the longitudinal direction of the heat dissipation fins 150, thereby efficiently dissipating heat from the integrated circuit 134. Furthermore, even when performing radiography by rotationally driving the radiographic imaging apparatus 100 so that the longitudinal direction of the heat dissipation fins 150 and the tangential direction of the rotational drive are substantially parallel, heat dissipation from the integrated circuit 134 can be performed extremely efficiently.

[0037] -Fourth embodiment- The fourth embodiment will be described in detail below with reference to the drawings. In this embodiment, a radiographic apparatus similar to the third embodiment is disclosed, but detailed descriptions of components identical to those in the third embodiment will be omitted.

[0038] 8A and 8B are schematic diagrams showing a radiation imaging apparatus 100 according to a fourth embodiment, in which (a) is a plan view and (b) is a side view. Fig. 9 is a cross-sectional view of the radiation imaging apparatus 100 taken along the dashed line AA of Fig. 8. In this embodiment, an integrated circuit 134 and a heat dissipation member 135 that serve as a heat source are arranged on the electric substrate 133 alongside another integrated circuit 134 and a heat dissipation member 135 that serve as a heat source.

[0039] As in the third embodiment, a recessed second rear surface portion 142 is formed on the rear surface portion 140 of the housing 200. The recessed second rear surface portion 142 has a continuous outer surface region 142a extending from one end of the rear surface portion 140 to the opposite end of the rear surface portion 140, the region 142a being the same distance from the sensor panel 131. In this embodiment, a recessed second rear surface portion 144 is further formed along the longitudinal direction of the second rear surface portion 142, extending substantially parallel thereto from the middle of the rear surface portion 140 to one end of the rear surface portion 140. Having at least one end of the rear surface portion 140 open, as in the second rear surface portion 144, can achieve a desired heat dissipation efficiency. This structure of the second rear surface portion 144 is suitable for use in cases where the other end of the recessed groove needs to be closed midway through the rear surface portion 140, for example, to accommodate specific components inside or outside the housing 200.

[0040] Below the second rear surface portion 142, an integrated circuit 134, which is a heat source, is arranged via a heat dissipation member 135 so as to face the region 142a and be contained within the region 142a (the heat dissipation member 135 is in contact with the inner surface of the region 142a). Below the third rear surface portion 144, another integrated circuit 134, which is a heat source, is arranged via a heat dissipation member 135 so as to face the region 144a and be contained within the region 144a (the heat dissipation member 135 is in contact with the inner surface of the region 144a).

[0041] In this way, a plurality of second rear portions may be provided to bring the outer surface closer to the sensor panel 131 in accordance with the size (thickness) and number of heat sources provided inside the housing 200, and the dimensions such as the distance between the heat source and the sensor panel 131 may also differ for each second rear portion. Figure 9 illustrates an example in which the height from the sensor panel 131 of the region 144a is higher than that of the region 142a.

[0042] The radiation imaging apparatus 100 of this embodiment can efficiently dissipate heat from each of the multiple integrated circuits 134. This realizes a radiation imaging apparatus 100 that can suppress an increase in thickness and promote miniaturization, while still allowing for efficient and sufficient air cooling.

[0043] -Fifth embodiment- The fifth embodiment will be described in detail below with reference to the drawings. In this embodiment, a radiation imaging system 300 including any one of the radiation imaging apparatuses 100 shown in the first to fourth embodiments will be disclosed.

[0044] FIG. 10 is a schematic diagram showing the general configuration of a radiation imaging system 300 according to this embodiment. The radiation imaging system 300 includes a radiation source 210, a control device, and a storage device 220 in addition to any one of the radiation imaging devices 100 described in the first to fourth embodiments. While FIG. 10 illustrates an example in which an imaging target (subject) 230 is located inside the radiation imaging system 300, this is not limited to this example depending on the application. Radiation 211 emitted from the radiation source 210 passes through the imaging target 210 and enters the radiation imaging device 100. The control device 220 controls the movement of the radiation source 210, as well as the energy, irradiation time, timing, and irradiation range of the emitted radiation 211. The control device 220 also controls the imaging mode, timing, and movement of the radiation imaging device 100. Depending on the application, the imaging target 230 may be moved by the control device 220. The incident radiation 211 is converted into a digital electrical signal by the radiation imaging device 100 and stored in the storage device 220.

[0045] 10, the radiation imaging apparatus 100 and the control device 220 are electrically connected to each other by a cable 240 via a connector 110 of the radiation imaging apparatus 100, enabling communication between them. Generally, such a configuration is often used, but for example, communication may be performed wirelessly, and the cable 240 may be connected for other purposes such as charging.

[0046] As described above, according to this embodiment, a radiation imaging system 300 is realized that includes a radiation imaging apparatus 100 that can suppress an increase in thickness and promote miniaturization, while enabling efficient and sufficient air cooling.

[0047] The disclosure of this embodiment includes the following configuration. (Configuration 1) a radiation detector for detecting radiation; a heat source disposed on the opposite side of the radiation detector to the radiation incident surface; a heat transfer member thermally connected to the heat source; a housing containing the radiation detector, the heat source, and the heat transfer member; It is equipped with The housing includes: On the rear surface of the radiation incident surface of the housing, A first surface portion; a second surface portion having an inner surface in contact with the heat transfer member and an outer surface of the second surface portion spaced apart from the radiation detector by a distance smaller than a distance between the outer surface of the first surface portion and the radiation detector; having Radiography equipment. (Configuration 2) a predetermined member is disposed at a location corresponding to at least a portion below the first surface portion in the contained space of the housing; 2. The radiographic apparatus according to claim 1. (Configuration 3) The predetermined member is a connection portion for obtaining an electrical connection with the outside. 3. The radiographic apparatus according to claim 2. (Configuration 4) a height of the predetermined member in the direction of incidence of radiation is greater than a height of the heat source in the direction of incidence of radiation; 4. The radiographic apparatus according to claim 2 or 3. (Configuration 5) the heat source is an integrated circuit; The radiographic imaging apparatus according to any one of the first to fourth aspects. (Configuration 6) The back portion has an outer surface, There is only one step between the first surface portion and the second surface portion. 6. The radiographic imaging apparatus according to any one of configurations 1 to 5. (Configuration 7) When the width of the second surface portion in the short side direction is L and the distance between the first surface portion and the second surface portion along the incident direction of the radiation is H, H / L≦1 Satisfy the relationship of The radiographic imaging apparatus according to any one of the first to sixth aspects. (Configuration 8) The second surface portion is a continuous outer surface area at a constant distance from the radiation detector to at least one end of the rear surface; The radiographic imaging apparatus according to any one of configurations 1 to 7. (Configuration 9) The housing includes: a first side portion intersecting the back portion and a second side portion extending along the first side portion; The region is continuously and integrally formed with the first side portion and the second side portion, respectively. The radiographic imaging apparatus according to configuration 8. (Configuration 10) The housing includes: a third side surface portion on which a predetermined member is disposed, The longitudinal direction of the region intersects with the normal direction of the third side surface portion. 10. The radiographic apparatus according to configuration 9. (Configuration 11) capturing a radiographic video while rotating in a direction along the longitudinal direction of the region; 11. The radiographic apparatus according to claim 10. (Configuration 12) At least one heat dissipation fin is provided on the outer surface of the second surface portion. 12. The radiographic imaging apparatus according to any one of configurations 1 to 11. (Configuration 13) The position of the tip of the heat dissipation fin is the same as the height position of the outer surface of the first surface portion. 13. The radiographic apparatus according to claim 12. (Configuration 14) When viewed from the incident direction of the radiation, at least one of the heat dissipation fins overlaps the position of the heat transfer member. 14. The radiographic apparatus according to claim 12 or 13. (Configuration 15) At least one heat dissipation fin is provided on the outer surface of the second surface portion, The heat dissipation fins extend along the first side surface portion and the second side surface portion. 12. The radiographic imaging apparatus according to any one of configurations 9 to 11. (Configuration 16) a plurality of the heat sources, the housing has a plurality of second surface portions, the distances of which from the outer surface to the radiation detector correspond to the plurality of heat sources, respectively; 16. The radiographic apparatus according to any one of configurations 1 to 15. (Configuration 17) a radiation source that irradiates a subject with radiation; A radiographic imaging apparatus according to any one of configurations 1 to 16, a control device that controls the radiation source and the radiation imaging device; A radiation imaging system comprising: [Explanation of symbols]

[0048] 100: Radiography device, 110: Connector, 120: Front portion, 130: Phosphor, 131: Sensor panel, 132: Support base, 133: Electrical board, 134: Integrated circuit, 135: Heat dissipation member, 140: Rear portion, 141: First rear portion, 142: Second rear portion

Claims

1. a radiation detector for detecting radiation; a heat source disposed on the opposite side of the radiation detector to the radiation incident surface; a heat transfer member thermally connected to the heat source; a housing containing the radiation detector, the heat source, and the heat transfer member; It is equipped with The housing includes: On the rear surface of the radiation incident surface of the housing, A first surface portion; a second surface portion having an inner surface in contact with the heat transfer member and an outer surface of the second surface portion spaced apart from the radiation detector by a distance smaller than a distance between the outer surface of the first surface portion and the radiation detector; having Radiography equipment.

2. a predetermined member is disposed at a location corresponding to at least a portion below the first surface portion in the contained space of the housing; The radiographic apparatus according to claim 1 .

3. The predetermined member is a connection portion for obtaining an electrical connection with the outside. The radiographic imaging apparatus according to claim 2 .

4. a height of the predetermined member in the direction of incidence of radiation is greater than a height of the heat source in the direction of incidence of radiation; The radiographic imaging apparatus according to claim 2 .

5. the heat source is an integrated circuit; The radiographic apparatus according to claim 1 .

6. The back portion has an outer surface, There is only one step between the first surface portion and the second surface portion. The radiographic apparatus according to claim 1 .

7. When the width of the second surface portion in the short side direction is L and the distance between the first surface portion and the second surface portion along the incident direction of radiation is H, H / L≦1 Satisfy the relationship of The radiographic apparatus according to claim 1 .

8. The second surface portion is a continuous outer surface area at a constant distance from the radiation detector to at least one end of the rear surface; The radiographic apparatus according to claim 1 .

9. The housing includes: a first side portion intersecting the back portion and a second side portion extending along the first side portion; The region is continuously and integrally formed with the first side portion and the second side portion, respectively. The radiographic imaging apparatus according to claim 8 .

10. The housing includes: a third side surface portion on which a predetermined member is disposed, The longitudinal direction of the region intersects with the normal direction of the third side surface portion. The radiographic apparatus according to claim 9 .

11. capturing a radiographic video while rotating in a direction along the longitudinal direction of the region; The radiographic imaging apparatus according to claim 10.

12. At least one heat dissipation fin is provided on the outer surface of the second surface portion. The radiographic apparatus according to claim 1 .

13. The position of the tip of the heat dissipation fin is the same as the height position of the outer surface of the first surface portion. The radiographic imaging apparatus according to claim 12.

14. When viewed from the incident direction of the radiation, at least one of the heat dissipation fins overlaps the position of the heat transfer member. The radiographic imaging apparatus according to claim 12.

15. At least one heat dissipation fin is provided on an outer surface of the second surface portion, The heat dissipation fins extend along the first side surface portion and the second side surface portion. The radiographic apparatus according to claim 9 .

16. a plurality of the heat sources, the housing has a plurality of second surface portions, the distances of which from the outer surface to the radiation detector correspond to the plurality of heat sources, respectively; The radiographic apparatus according to claim 1 .

17. a radiation source that irradiates a subject with radiation; The radiographic imaging apparatus according to any one of claims 1 to 16, a control device that controls the radiation source and the radiation imaging device; A radiation imaging system comprising:

Images