Filler-containing film

Abstract

To disperse a filler-containing film where a fine solid matter is dispersed in an insulating resin layer and fillers are regularly arrayed, which suppresses disarray of the fillers when the filler-containing film is thermocompression-bonded to an article.SOLUTION: In a filler-containing film 1A where fillers 2 and a fine solid matter 3 are held in an insulating resin layer 10 and predetermined alignment of fillers 2 are repeated in plane view, a ratio of a repeated pitch of a filler after thermocompression bonding to before thermocompression bonding when the filler-containing film 1A is sandwiched on a smooth surface and is thermocompression-bonded at predetermined thermocompression conditions is within 300%. A method for manufacturing the filler-containing film 1A includes: a step of forming an insulating resin layer 11 on a peeling base material 20a; a step of pushing fillers 2 from a surface on an opposite side to the peeling base material 20a of the insulating resin layer 11; and a step of laminating the insulating resin layer 11 to which the fillers 2 have been pushed and an insulating resin layer 12 different from the insulating resin layer with the peeling base materials 20a and 20b facing outside.SELECTED DRAWING: Figure 1B

Description

[Technical Field]

[0001] The present invention relates to a filler-containing film. [Background technology]

[0002] Filler-containing films in which fillers are dispersed in a resin layer are used in a wide variety of applications, including matte films, capacitor films, optical films, label films, antistatic films, conductive films, and anisotropic conductive films (see Patent Documents 1, 2, 3, and 4). When filler-containing films are used by thermocompression bonding to articles, it is desirable to prevent the resin forming the filler-containing film from flowing unnecessarily during thermocompression bonding and to prevent uneven distribution of the filler, from the viewpoint of optical, mechanical, and electrical properties. In particular, when conductive particles are contained as a filler and the filler-containing film is used as an anisotropic conductive film for mounting electronic components, if the conductive particles are densely dispersed in the insulating resin layer to accommodate high-density mounting of electronic components, the resin flow during mounting of the electronic components can cause unwanted movement of the conductive particles and uneven distribution between terminals, which can lead to short circuits. Therefore, it is desirable to prevent such resin flow.

[0003] To address this issue, minute solid substances such as melt viscosity adjusters and thixotropic agents have been incorporated into the insulating resin layer (Patent Documents 5 and 6).

[0004] Furthermore, in order to achieve both improved capture of conductive particles at the terminals of electronic components and suppression of short circuits when conductive particles are dispersed at high density in an insulating resin layer, the conductive particles are arranged in a regular pattern (Patent Documents 5 and 6). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-15680 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-138904 [Patent Document 3] Japanese Patent Application Laid-Open No. 2013-103368 [Patent Document 4] Japanese Patent Application Laid-Open No. 2014-183266 [Patent Document 5] Patent No. 6187665 [Patent Document 6] Japanese Patent Application Laid-Open No. 2016-031888 Summary of the Invention [Problem to be solved by the invention]

[0006] An insulating resin layer containing fine solids is generally formed by coating and drying an insulating resin layer-forming composition in which the fine solids are dispersed. However, when an insulating resin layer containing a high concentration of fine solids is formed by coating and drying an insulating resin layer-forming composition, the dry surface of the insulating resin layer (i.e., the surface of the coating layer of the insulating resin layer-forming composition from which the solvent contained in the composition evaporates) is roughened by the fine solids, reducing the adhesiveness of the insulating resin layer, preventing uniform temporary pressure bonding during mounting of electronic components and resulting in an unstable adhesion state. Furthermore, the thermal compression bonding during final pressure bonding is also not uniform, causing the arrangement of conductive particles that were regularly arranged in the insulating resin layer to become disordered, which may adversely affect the improvement of the conductive particle capture ability in the terminals of the electronic components and the prevention of short circuits. This problem is particularly pronounced when the electronic components are small and the terminal size is narrowed. Furthermore, the problem of reduced adhesiveness of the filler-containing film surface may be more pronounced when the film thickness is thin than when it is thick.

[0007] In contrast, the present invention aims to suppress the disruption of the filler arrangement when a filler-containing film is thermocompressed to an article, in a filler-containing film in which fine solid particles are dispersed in an appropriate amount in an insulating resin layer and fillers such as conductive particles are regularly arranged in the insulating resin layer by repeating a predetermined arrangement. [Means for solving the problem]

[0008] The present inventors have discovered that when a filler-containing film in which a filler such as conductive particles and fine solid matter made of a different material than the filler are held in an insulating resin layer is produced by the steps of forming an insulating resin layer by applying an insulating resin layer-forming composition containing fine solid matter, and pressing the filler into the insulating resin layer, by preventing the dried surface of the insulating resin layer from appearing on the surface of the filler-containing film, the disruption of the filler arrangement when the filler-containing film is thermocompressed to an article can be reduced, and the present invention has been completed.

[0009] That is, the present invention provides a filler-containing film in which a filler and minute solid particles made of a material different from that of the filler are held in an insulating resin layer, and the filler is arranged in a predetermined repeated pattern in a planar view, Provided is a filler-containing film in which, when the filler-containing film is sandwiched between smooth surfaces and thermocompression-bonded under specified thermocompression bonding conditions, the ratio of the filler repeat pitch after thermocompression bonding to that before thermocompression bonding is within 300%. In particular, provided is an embodiment in which the insulating resin layer is formed from a laminate of two insulating resin layers, and an embodiment in which a low-viscosity resin layer having a lower minimum melt viscosity in the range of 30 to 200°C than the insulating resin layer is laminated on the insulating resin layer.

[0010] The present invention also provides a first method for producing the filler-containing film, which comprises the steps of applying a composition for forming an insulating resin layer containing fine solid matter onto a release substrate to form an insulating resin layer on the release substrate; a step of pushing a filler into the insulating resin layer from the surface opposite to the peeled substrate; a step of laminating an insulating resin layer into which a filler has been pressed and an insulating resin layer separate from the insulating resin layer, with their release substrates facing outwards; a method for producing a filler-containing film comprising: As a second manufacturing method, a step of applying an insulating resin layer-forming composition containing fine solid matter onto a release substrate to form an insulating resin layer on the release substrate; forming a laminate of insulating resin layers by laminating two insulating resin layers with their release substrates facing outward; a step of forcing a filler into the laminate of insulating resin layers; a method for producing a filler-containing film comprising: As a third manufacturing method, a step of applying an insulating resin layer-forming composition containing fine solid matter onto a release substrate to form an insulating resin layer on the release substrate; a step of applying a composition for forming a low-viscosity resin layer, the composition having a lower minimum melt viscosity in the range of 30 to 200°C than that of the insulating resin layer, to a release substrate to form a low-viscosity resin layer on the release substrate; a step of laminating the insulating resin layer and the low-viscosity resin layer with their release substrates facing outward to form a laminate of the insulating resin layer and the low-viscosity resin layer; a step of peeling off the release substrate of the insulating resin layer and pushing a filler into the surface of the insulating resin layer from which the release substrate has been peeled off; a method for producing a filler-containing film comprising: As a fourth manufacturing method, a step of applying an insulating resin layer-forming composition containing fine solid matter onto a release substrate to form an insulating resin layer on the release substrate; a step of applying a composition for forming a low-viscosity resin layer, the composition having a lower minimum melt viscosity in the range of 30 to 200°C than that of the insulating resin layer, to a release substrate to form a low-viscosity resin layer on the release substrate; a step of pushing a filler into the surface of the insulating resin layer opposite to the peeled substrate; a step of laminating the insulating resin layer into which the filler has been pressed and the low-viscosity resin layer formed on the release substrate, with the release substrate facing outward; The present invention provides a method for producing a filler-containing film having the following properties: [Effects of the Invention]

[0011] According to the method for producing a filler-containing film of the present invention, even though the insulating resin layer contains an appropriate amount of fine solid matter for viscosity adjustment, etc., the surface of the filler-containing film does not become rough, and the film surface has good adhesion to various articles. Therefore, the filler in the filler-containing film attached to an article by thermocompression bonding can maintain almost the predetermined arrangement before thermocompression bonding.

[0012] For example, when the filler of the filler-containing film of the present invention is conductive particles, using the filler-containing film of the present invention for anisotropic conductive connection between electronic components allows for good temporary pressure bonding, and since the arrangement of the conductive particles is less likely to be disturbed even during main pressure bonding, the predetermined arrangement before thermocompression bonding can be largely maintained. Therefore, even when the electronic components are small and the terminal size is narrowed, good anisotropic conductive connection can be achieved between the electronic components. [Brief explanation of the drawings]

[0013] [Figure 1A] FIG. 1A is a plan view showing the filler arrangement in a filler-containing film 1A of the example. [Figure 1B] FIG. 1B is a cross-sectional view of a filler-containing film 1A of the example. [Figure 2A] FIG. 2A is an explanatory diagram of a method for producing a filler-containing film 1A of the example. [Figure 2B] FIG. 2B is an explanatory diagram of a method for producing the filler-containing film 1A of the example. [Figure 2C] FIG. 2C is an explanatory diagram of a method for producing the filler-containing film 1A of the example. [Figure 2D] FIG. 2D is an explanatory diagram of a method for producing the filler-containing film 1A of the example. [Figure 2E] FIG. 2E is an explanatory diagram of a method for producing the filler-containing film 1A of the example. [Figure 2F] FIG. 2F is an explanatory diagram of a method for producing the filler-containing film 1A of the example. [Figure 3] FIG. 3 is a cross-sectional view of a filler-containing film 1B of the example. [Figure 4A] FIG. 4A is an explanatory diagram of a method for producing a filler-containing film 1B of the example. [Figure 4B] FIG. 4B is an explanatory diagram of a method for producing the filler-containing film 1B of the example. [Figure 4C] FIG. 4C is an explanatory diagram of a method for producing the filler-containing film 1B of the example. [Figure 5]FIG. 5 is a cross-sectional view of a filler-containing film 1C of the example. [Figure 6] FIG. 6 is an explanatory diagram of a method for producing a filler-containing film 1C of the example. [Figure 7] FIG. 7 is a cross-sectional view of a filler-containing film 1D of the example. [Figure 8A] FIG. 8A is an explanatory diagram of a method for producing a filler-containing film 1D of the example. [Figure 8B] FIG. 8B is an explanatory diagram of a method for producing the filler-containing film 1D of the example. [Figure 8C] FIG. 8C is an explanatory diagram of a method for producing the filler-containing film 1D of the example. [Figure 9] FIG. 9 is a cross-sectional view of a filler-containing film 1E of the example. [Figure 10A] FIG. 10A is an explanatory diagram of a method for producing a filler-containing film 1E of the example. [Figure 10B] FIG. 10B is an explanatory diagram of a method for producing the filler-containing film 1E of the example. [Figure 10C] FIG. 10C is an explanatory diagram of a method for producing a filler-containing film 1E of the example. [Figure 11] FIG. 11 is a perspective view of a sample for an adhesive strength test. [Figure 12] FIG. 12 is an explanatory diagram of the adhesive strength test method. DETAILED DESCRIPTION OF THE INVENTION

[0014] An example of the filler-containing film of the present invention will be described in detail below with reference to the drawings. In each drawing, the same reference numerals represent the same or equivalent components.

[0015] <Overall structure of filler-containing film 1A> FIG. 1A is a plan view showing the filler arrangement in a filler-containing film 1A according to an embodiment, and FIG. 1B is a cross-sectional view taken along the line XX. This filler-containing film 1A contains conductive particles as filler 2 and is used as an anisotropic conductive film. The conductive particles are held in a regular, repeating arrangement in an insulating resin layer 10. In addition to filler 2, insulating resin layer 10 contains minute solid particles 3. When a conventional filler-containing film is sandwiched between smooth surfaces and thermocompression-bonded as described below, the regular filler arrangement before thermocompression bonding spreads after thermocompression bonding, the repeat pitch of the arrangement becomes wider than before thermocompression bonding, and the repeat pitch also varies greatly, resulting in a disordered filler arrangement. However, in the filler-containing film of the present invention, the amount of filler movement and the disordered arrangement are small, and the ratio of the filler repeat pitch after thermocompression bonding to that before thermocompression bonding is within 300%, preferably within 250%, and more preferably within 200%. In other words, with the filler-containing film of the present invention, the relative positional relationship of the filler arrangement is maintained before and after thermocompression bonding, so that the center-to-center distance of the nearest fillers after thermocompression bonding can be made within 3 times, 2.5 times, or 2 times the center-to-center distance of the nearest fillers before thermocompression bonding.

[0016] The filler-containing film of the present invention has thermocompression bonding conditions that make the ratio of the repeat pitch before and after thermocompression bonding be below the above-mentioned value.This is because, according to the manufacturing method of the filler-containing film of the present invention, the surface of the filler-containing film 1A is the peeling surface from the peeling substrate, so even if the insulating resin layer 10 contains a large amount of fine solids 3, the surface of the filler-containing film 1A is not rough, it becomes a smooth surface, and when this smooth surface is attached to an article and heated and pressed, the filler-containing film is pressed uniformly, and the fine solids do not hinder the uniform application of pressure to the regularly arranged filler in the film, so that the arrangement of the filler is suppressed from being unevenly disturbed, and the arrangement of the filler after heating and pressing is uniformly extended from the original arrangement, and the part where the ratio of the repeat pitch of the filler before and after thermocompression bonding becomes locally large is reduced.

[0017] The reduction in the amount of filler movement and the disturbance of the arrangement due to thermocompression bonding becomes more pronounced when the thickness of the resin layer constituting the filler-containing film is reduced.

[0018] Furthermore, if thermocompression bonding is not performed on a smooth surface, the amount of filler movement and the disorder of the filler arrangement due to thermocompression bonding will be non-uniform. Therefore, when a filler-containing film is configured as an anisotropic conductive film, the disorder of the filler arrangement may be relatively large when a fine-pitch bump arrangement is thermocompression bonded to the anisotropic conductive film.

[0019] <Filler> In the present invention, the filler 2 is appropriately selected from known inorganic fillers (e.g., metal particles, metal oxide particles, metal nitride particles), organic fillers (e.g., resin particles, rubber particles), and fillers containing a mixture of organic and inorganic materials (e.g., particles with a resin core and a metal-plated surface (metal-coated resin particles)), conductive particles with insulating fine particles attached to the surface, and conductive particles with an insulating surface), depending on the intended use of the filler-containing film, depending on the hardness, optical performance, and other performance requirements. For example, for optical films and matte films, silica fillers, titanium oxide fillers, styrene fillers, acrylic fillers, melamine fillers, and various titanates can be used. For capacitor films, titanium oxide, magnesium titanate, zinc titanate, bismuth titanate, lanthanum oxide, calcium titanate, strontium titanate, barium titanate, barium zirconate titanate, lead zirconate titanate, and mixtures thereof can be used. For adhesive films, polymeric rubber particles, silicone rubber particles, and the like can be added. Conductive films and anisotropic conductive films contain conductive particles. Examples of conductive particles include metal particles such as nickel, cobalt, silver, copper, gold, and palladium, alloy particles such as solder, metal-coated resin particles, and metal-coated resin particles with insulating fine particles attached to their surfaces. Two or more types can also be used in combination. Among these, metal-coated resin particles are preferred because they facilitate maintaining contact with the terminal due to the repulsion of the resin particles after connection, thereby stabilizing electrical conductivity. Furthermore, the surfaces of the conductive particles may be subjected to an insulating treatment using known techniques that does not impair electrical conductivity.

[0020] <Filler particle size> In the present invention, the particle diameter of the filler 2 can be determined depending on the application of the filler-containing film. For example, when the filler-containing film is used as an anisotropic conductive film, the particle diameter is preferably 1 μm or more, more preferably 2.5 μm or more, to improve the filler pressing accuracy during the production of the filler-containing film. Furthermore, the particle diameter is preferably 200 μm or less, more preferably 50 μm or less, to suppress the influence of filler misalignment during the production of the filler-containing film. Here, particle diameter refers to the average particle diameter. The average particle diameter of the filler in the filler-containing film can be determined from a planar image or a cross-sectional image. Furthermore, the average particle diameter of the filler as raw material particles before being incorporated into the filler-containing film can be determined using a wet flow particle size and shape analyzer FPIA-3000 (Malvern Instruments). Note that if fine particles such as insulating fine particles adhere to the filler, the particle diameter is the diameter excluding the fine particles.

[0021] The variation in the particle diameter D of the filler in the filler-containing film is preferably such that the CV value (standard deviation / average) is 20% or less. This facilitates uniform pressure application to the filler-containing film when it is pressed onto an article, preventing localized concentration of pressure. Therefore, when the filler-containing film is configured as an anisotropic conductive film, the connection stability is improved, and the connection status can be accurately evaluated by observing the indentation and the sandwiched state of the filler after connection. Specifically, in an inspection after anisotropic conductive connection between electronic components using an anisotropic conductive film, the connection status can be accurately confirmed by observing the indentation and the sandwiched state of the conductive particles, regardless of whether the terminal size is relatively large (e.g., FOB) or relatively small (e.g., COG). This facilitates inspection after anisotropic connection, and is expected to improve the productivity of the connection process.

[0022] <Filler arrangement> In a plan view of the filler-containing film of the present invention, the filler particles are regularly arranged in a predetermined repeating sequence. In the filler-containing film 1A of the embodiment shown in FIG. 1A, the filler particles 2 are arranged in a hexagonal lattice pattern. Examples of regular filler arrangements in the present invention include lattice patterns such as square lattices, rectangular lattices, and orthorhombic lattices. A combination of multiple lattices of different shapes may also be used. Linear particle arrays of filler particles arranged at predetermined intervals may also be arranged parallel to each other at predetermined intervals. Areas where the filler particles are densely arranged and areas where they are sparsely arranged may also be regularly repeated. Units where filler particles are in contact with each other may constitute a regular repeating unit of the filler. When the filler-containing film is used as an anisotropic conductive film, it is more preferable to arrange the conductive particles in a regular, non-contacting pattern in order to achieve both capture stability and short-circuit prevention at the terminal. Whether the filler particles are regularly arranged can be determined, for example, by observing whether the predetermined filler arrangement is repeated in the longitudinal direction of the film (the winding direction when the filler-containing film is wound).

[0023] When the filler is arranged regularly, the lattice axis or arrangement axis of the arrangement may be parallel to or intersect with at least one of the longitudinal direction of the filler-containing film and a direction perpendicular to the longitudinal direction, and can be determined depending on the article to which the filler-containing film is to be pressed.

[0024] In filler-containing films, the distance between fillers can be determined depending on the connected items and application, and the filler density is usually 10 pieces / mm 2 More than 100000 pieces / mm 2 Less than 30 pieces / mm 2 More than 70000 pieces / mm 2It can be appropriately determined within the following ranges. For example, when the filler-containing film is used as an anisotropic conductive film, the interparticle distance of the conductive particles used as filler 2 can be appropriately determined depending on the size, shape, and terminal pitch of the terminals to be connected by the anisotropic conductive film. Furthermore, when the filler-containing film is used as an anisotropic conductive film, the number density of the conductive particles can be set to 30 particles / mm 2 Above this, 150 to 70,000 pieces / mm 2 In particular, in the case of fine pitch applications, the number of particles is preferably 6,000 to 42,000 particles / mm 2 , more preferably 10,000 to 40,000 pieces / mm 2 , and even more preferably 15,000 to 35,000 pieces / mm 2 In addition, when the particle diameter of the conductive particles is 10 μm or more, the number density of the conductive particles is 30 to 6000 particles / mm 2 is preferred.

[0025] Regarding the number density of the filler, the area occupancy of the filler calculated by the following formula is preferably 0.3% or more in order to realize the effect of including the filler. On the other hand, in order to suppress the thrust force required for the pressing jig to press-bond the filler-containing film to the article, the area occupancy of the filler is preferably 35% or less, and more preferably 30% or less. Filler area occupancy rate (%) = [number density of filler particles in plan view] x [average area of ​​one filler particle in plan view] x 100

[0026] The number density of the filler may be determined by observation using a metallurgical microscope, or by measuring an observed image using image analysis software (for example, WinROOF (Mitani Corporation) or Azokun (registered trademark) (Asahi Kasei Engineering Corporation)). The observation method and measurement technique are not limited to those described above.

[0027] On the other hand, in a cross-sectional view of the filler-containing film cut in the film thickness direction (FIG. 1B), it is preferable that the apex of each filler in the film thickness direction is flush with the surface of the insulating resin layer 10 or a plane parallel to that surface. This makes it easier to uniformly press-bond the filler-containing film to an article.

[0028] <Fine solids> The insulating resin layer 10 can contain various fine solid particles 3 made of materials different from those of the filler 2 in order to impart a different function to the filler-containing film 1A than that of the filler 2. For example, when the filler 2 is a conductive particle, the fine solid particles 3 can contain a viscosity modifier, a thixotropic agent, a polymerization initiator, a coupling agent, a flame retardant, etc. More specifically, examples of viscosity modifiers include silica powder and alumina powder.

[0029] Furthermore, with regard to the distinction between the filler 2 and the minute solid particles 3, when conductive particles are used as the filler 2 and the filler-containing film is made into an anisotropic conductive film, and the minute solid particles are kneaded into an insulating resin layer as described in Patent Document 5 and the conductive particles are pressed into the insulating resin layer to retain the conductive particles in the insulating resin layer, the conductive particles and the minute solid particles can be easily distinguished by the distribution state of both in the insulating resin layer.

[0030] The particle size of the fine solid particles 3 is preferably smaller than the particle size of the filler 2, and when the filler-containing film is to be an anisotropic conductive film, the fine solid particles contained as a viscosity adjuster can preferably have an average particle size of less than 1 μm, more preferably 5 nm to 0.3 μm, or preferably 1 / 3 to 1 / 2 of the average particle size of the conductive particles contained as a filler.

[0031] The content of the fine solid particles 3 in the insulating resin layer 10 is not particularly limited as long as the pressing of the conductive particles is not hindered when an anisotropic conductive film is produced by kneading the fine solid particles into the insulating resin layer and pressing the conductive particles into the insulating resin layer as described in the above-mentioned Patent Document 5. However, in order to ensure the precision of the conductive particle arrangement, the fine solid particles are preferably 3% by mass or more, more preferably 5% by mass or more. The fine solid particles 3 can be contained in the insulating resin layer 10 at such a high concentration that pressing in the anisotropic conductive connection requires two stages. On the other hand, in order to ensure the fluidity required for the film to connect electronic components, the content of the fine solid particles 3 is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 35% by mass or less, relative to the insulating resin layer 10.

[0032] <Insulating resin layer> In the present invention, the insulating resin layer may be composed of a single insulating resin layer or a laminate of multiple insulating resin layers. The insulating resin layer 10 of the filler-containing film 1A shown in FIGS. 1A and 1B is formed by applying a similar insulating resin layer-forming composition to a smooth release substrate and drying it using the filler-containing film manufacturing method described below. The insulating resin layers 11 and 12 are then laminated with their dried surfaces facing inward and their surfaces facing the release substrate facing outward. In the filler-containing film 1A, the interface between these two insulating resin layers 11 and 12 can be observed. The surface of the insulating resin layer-forming composition, after application and drying, is prone to roughness due to the fine solid particles contained in the composition. However, when the insulating resin layers 11 and 12 are stacked with their dried coated surfaces facing inward, as shown in FIG. 1B, the surface of the filler-containing film is the surface to which the smooth surface of the release substrate is transferred, which is believed to facilitate uniform thermocompression bonding of the filler-containing film to an article.

[0033] <Resin composition for forming insulating resin layer> The resin composition forming the insulating resin layer 10 is appropriately selected depending on the application of the filler-containing film and can be formed from a thermoplastic resin composition, a high-viscosity adhesive resin composition, or a curable resin composition. For example, when the filler-containing film is used as an anisotropic conductive film, a curable resin composition formed from a polymerizable compound and a polymerization initiator can be used, similar to the resin composition forming the insulating resin layer of the anisotropic conductive film described in Patent Document 5. In this case, the polymerization initiator may be a thermal polymerization initiator, a photopolymerization initiator, or a combination of these. For example, a cationic polymerization initiator is used as the thermal polymerization initiator, an epoxy resin is used as the thermally polymerizable compound, a photoradical polymerization initiator is used as the photopolymerization initiator, and an acrylate compound is used as the photopolymerizable compound. A thermal anionic polymerization initiator may also be used as the thermal polymerization initiator. As the thermal anionic polymerization initiator, a microencapsulated latent curing agent composed of an imidazole-modified compound as a core and its surface coated with polyurethane is preferably used.

[0034] <Minimum melt viscosity of insulating resin layer> The minimum melt viscosity of the insulating resin layer 10 is not particularly limited as long as it can compress the filler into the insulating resin layer. However, to prevent unwanted flow of the filler 2 when the filler-containing film 1A is thermocompression-bonded to an article, it is preferably 1500 Pa·s or higher, more preferably 2000 Pa·s or higher, even more preferably 3000 to 15,000 Pa·s, and particularly preferably 3000 to 10,000 Pa·s. This minimum melt viscosity can be determined, for example, using a rotational rheometer (manufactured by TA Instruments) with a constant measurement pressure of 5 g and an 8 mm diameter measurement plate. More specifically, it can be determined at a temperature range of 30 to 200°C, a heating rate of 10°C / min, a measurement frequency of 10 Hz, and a load fluctuation of 5 g on the measurement plate. The minimum melt viscosity can be adjusted by changing the type and amount of microsolid particles added as a melt viscosity modifier, or by changing the preparation conditions of the resin composition.

[0035] <Thickness of insulating resin layer> As described above, the insulating resin layer in the filler-containing film may be composed of a single insulating resin layer or a laminate of multiple insulating resin layers. In either case, in order to stably press the filler into the insulating resin layer during the manufacturing process of the filler-containing film, the thickness of the insulating resin layer is preferably 0.3 times or more, more preferably 0.6 times or more, even more preferably 0.8 times or more, and particularly preferably 1 time or more the particle diameter of the filler 2. There is no particular upper limit on the thickness of the insulating resin layer, and the thickness of the insulating resin layer may be adjusted appropriately depending on the article to which the filler-containing film is to be thermocompression-bonded. However, if the thickness of the insulating resin layer is too thick, the filler 2 may be unnecessarily susceptible to the influence of resin flow when the filler-containing film is thermocompression-bonded to the article. In addition, the absolute amount of fine solid matter contained in the insulating resin layer may increase, which may hinder thermocompression bonding of the article. Therefore, the thickness of the insulating resin layer is preferably 20 times or less, more preferably 15 times or less, the particle diameter of the filler 2 .

[0036] On the other hand, as will be described later, when the filler-containing film is a laminate of an insulating resin layer with an embedded filler and a low-viscosity resin layer, the thickness of the low-viscosity resin layer may be adjusted as appropriate depending on the application of the filler-containing film, but since an excessively thin layer results in relatively large variations in thickness, the thickness is preferably at least 0.2 times, and more preferably at least 1 time, the particle diameter of the filler 2. Furthermore, since an excessively thick low-viscosity resin layer increases the difficulty of laminating it with the insulating resin layer, the upper limit of the thickness of the low-viscosity resin layer is preferably at most 50 times, more preferably at most 15 times, and even more preferably at most 8 times the particle diameter of the filler 2.

[0037] Furthermore, when the filler-containing film is a laminate of an insulating resin layer embedded with filler and a low-viscosity resin layer, the total thickness of these resin layers is preferably thin in order to prevent unnecessary flow of the filler 2 when the filler-containing film is thermocompression-bonded to an article, to prevent resin overflow and blocking when the filler-containing film is wound, and to increase the film length per unit weight of the filler-containing film. However, if the thickness is too thin, the handleability of the filler-containing film is poor. Furthermore, it may be difficult to attach the filler-containing film to an article, which may result in insufficient adhesive strength during temporary thermocompression bonding of the filler-containing film to the article, and insufficient resin may result in insufficient adhesive strength during final thermocompression bonding. Therefore, the total thickness of the resin layers in the filler-containing film is preferably at least 0.6 times the particle diameter of the filler 2, more preferably at least 0.8 times, even more preferably at least 1 time, and particularly preferably at least 1.2 times.

[0038] On the other hand, there is no particular upper limit on the total thickness of the resin layer, which is the sum of the insulating resin layer and the low-viscosity resin layer, and it may be adjusted appropriately depending on the article to which the filler-containing film is thermocompression-bonded, but if the total thickness of the resin layer is too thick, the filler 2 will be unnecessarily susceptible to the influence of resin flow when the filler-containing film is thermocompression-bonded to the article, and the absolute amount of fine solid matter contained in the resin layer may be large, which may hinder thermocompression bonding of the article, so the total thickness of the resin layer is preferably 50 times or less, more preferably 15 times or less, and even more preferably 8 times or less, the particle diameter of the filler 2. It is believed that by making it 4 times or less, preferably 3 times or less, the influence of resin flow on the filler arrangement can be minimized.

[0039] When the filler-containing film is configured as an anisotropic conductive film, the conductive particles may be embedded in or exposed from the insulating resin layer. When the filler-containing film is configured as an anisotropic conductive film and an insulating resin layer and a low-viscosity resin layer are provided as resin layers, the total thickness of the resin layers can be within the above-mentioned range. However, in order to accommodate the reduction in the height of the bumps in the connected electronic components, it is preferable to make the total thickness of the resin layers thinner than the above. Furthermore, a thinner resin layer facilitates contact between the conductive particles and the bumps. From this perspective, the lower limit of the total thickness of the resin layers is preferably 0.6 times or more, more preferably 0.8 times or more, and even more preferably 1 time or more, of the conductive particle diameter. As for the upper limit, since a too high thickness results in excessively high thrust force during pressing, it can be set to 4 times or less, preferably 3 times or less, more preferably 2 times or less, even more preferably 1.8 times or less, and particularly preferably 1.5 times or less, of the conductive particle diameter. The thickness ratio of the insulating resin layer to the low-viscosity resin layer can be appropriately adjusted based on the relationship between the conductive particle diameter, the bump height, the desired adhesive strength, and the like.

[0040] <Adhesive strength of insulating resin layer> The insulating resin layer preferably has an adhesive strength that allows temporary bonding to an article to which the filler-containing film is to be thermocompression-bonded before thermocompression bonding. The adhesive strength of the filler-containing film can be measured in accordance with JIS Z 0237, and can also be measured as tack strength by a probe method in accordance with JIS Z 3284-3 or ASTM D 2979-01. Whether the filler-containing film has an insulating resin layer and a low-viscosity resin layer as resin layers, or has only an insulating resin layer, the tack strength of each of the front and back surfaces of the filler-containing film measured by the probe method is, for example, 1.0 kPa (0.1 N / cm) on at least one of the front and back surfaces when measured at a probe pressing speed of 30 mm / min, a pressure of 196.25 gf, a pressure time of 1.0 sec, a peeling speed of 120 mm / min, and a measurement temperature of 23°C ± 5°C. 2 ) or more, and can be 1.5kPa (0.15N / cm 2 ) or more, and 3 kPa (0.3 N / cm 2) is more preferable. In this case, one side of the filler-containing film may be attached to plain glass, and the tack strength of the other side may be measured. Instead of plain glass, the filler-containing film may be attached to a flexible thermoplastic resin film (for example, a PET film or silicone rubber having a thickness of 20 μm or less that has not been subjected to a release treatment) for measurement. By reversing the side to be attached of the filler-containing film, the tack strength of both sides of the filler-containing film can be measured under the same conditions.

[0041] In particular, when a filler-containing film has a release substrate on both sides, it is preferable to use the front and back sides of the filler-containing film so that the side opposite the side originally attached to the electronic component exhibits the above-mentioned tackiness. When a filler-containing film has a release substrate on one side, such as a wound filler-containing film, it is preferable that the side facing the release substrate exhibits the above-mentioned tackiness. Furthermore, when a filler-containing film has an insulating resin layer and a low-viscosity resin layer, it is preferable that the surface of the low-viscosity resin layer exhibits the above-mentioned tackiness. On the other hand, the side originally attached to the electronic component when a filler-containing film has a release substrate on both sides, the side without the release substrate when a filler-containing film has a release substrate on one side, and the side facing the insulating resin layer when a filler-containing film has an insulating resin layer and a low-viscosity resin layer do not necessarily have the above-mentioned tackiness, but it is desirable for them to have it. The reason why the preferred tackiness differs between the front and back sides of a filler-containing film is as follows. That is, when a filler-containing film is configured as an anisotropic conductive film, the anisotropic conductive film is generally used by attaching the surface opposite the release substrate to a second electronic component such as a substrate, then peeling off the release substrate, and mounting a first electronic component on the surface from which the release substrate has been peeled off (i.e., the surface facing the release substrate). This is because it is necessary to ensure adhesive performance that allows the mounted component to be fixed accurately.

[0042] When the mounted components are small, even slight misalignment during mounting cannot be tolerated, but it is assumed that the adhesive strength required for mounting can be tolerated even if it is relatively lower than that required for larger mounted components. Therefore, the required adhesive strength may be determined depending on the mounted components.

[0043] The adhesive strength of the filler-containing film can also be determined according to the adhesive strength test described in JP 2017-48358 A. In this adhesive strength test, for example, a filler-containing film is sandwiched between two glass plates, one of the glass plates is fixed, and the other glass plate is peeled off at a peeling speed of 10 mm / min and a test temperature of 50°C. By strengthening the adhesive state between the fixed glass plate and the filler-containing film, it becomes possible to measure the adhesive strength between the glass plate being peeled off and the surface of the filler-containing film attached to that glass plate. The adhesive strength measured in this way is preferably 1 N / cm 2 (10kPa) or more, more preferably 10N / cm 2 (100kPa) or more.

[0044] Alternatively, the adhesive strength of a filler-containing film can be determined by a test in which one end of the test piece is aligned and attached to another, and the other end is pulled up to separate the test piece. The adhesive strength measured by this test method is equivalent to that of the above-mentioned adhesive strength test (1 N / cm 2 (10 kPa) or more) is acceptable when the adhesive strength measured by the above adhesive strength test is sufficiently large (for example, 10 N / cm 2 (100 kPa or more), the adhesive strength in this test method can be 10% or more of the adhesive strength in the above-mentioned adhesive strength test.

[0045] Because the filler-containing film has the above-mentioned adhesive strength, the problem of misalignment during temporary pressure bonding can be eliminated even if the item to be thermocompressed is, for example, an electronic component with a maximum dimension of less than 0.8 mm, which is smaller than a typical IC chip, and stable adhesion can be achieved even for electronic components with a maximum dimension of approximately 450 cm, the same as a large TV.

[0046] Such adhesiveness can be imparted to the insulating resin layer by appropriately adjusting the resin composition constituting the insulating resin layer and by improving the smoothness of the insulating resin layer that forms the outer surface of the filler-containing film using the manufacturing method of the filler-containing film described below.

[0047] <Method for producing filler-containing film 1A> The filler-containing film 1A can be produced as follows: First, the insulating resin layer 11 is formed by applying the composition for forming an insulating resin layer containing the fine solid content to a release substrate 20a having a smooth surface, such as a PET film, and drying the composition (FIG. 2A).

[0048] Next, as in the manufacturing method of an anisotropic conductive film described in Patent Document 5, filler 2 is filled into the recesses of mold 21, which have been formed to correspond to the regular arrangement of filler 2 (Figure 2B), and transferred to the dry surface (the surface opposite to release substrate 20a) 11a of the above-mentioned insulating resin layer 11 (Figure 2C), and a process is performed in which the filler 2 is pressed into insulating resin layer 11 (Figure 2D).

[0049] On the other hand, an insulating resin layer 12 is formed on a release substrate 20b in the same manner as the insulating resin layer 11, and the insulating resin layer 12 and the insulating resin layer 11 with the filler pressed into them are placed opposite each other with the release substrates 20a and 20b facing outward (FIG. 2E), and then laminated together (FIG. 2F), thereby obtaining a filler-containing film 1A (FIG. 1A).

[0050] <Smoothness of the surface of filler-containing film and filler repeat pitch ratio before and after thermocompression bonding> The surfaces of the filler-containing film 1A produced as described above become the surfaces 11b and 12b of the insulating resin layer on the release substrates 20a and 20b side. The surfaces 11b and 12b are smooth due to the transfer of the smoothness of the surfaces of the release substrates 20a and 20b. Therefore, when the filler-containing film 1A is thermocompression-bonded to an article, the adhesiveness of the insulating resin layers 11 and 12 to the article is improved, and the filler-containing film can be uniformly pressed. This prevents the filler 2 from flowing unevenly during thermocompression bonding, and the initial regular arrangement of the filler 2 after thermocompression bonding is uniformly expanded. Therefore, when the filler-containing film 1A is sandwiched between smooth surfaces and thermocompression-bonded under predetermined heating and pressure conditions depending on the composition of the insulating resin layer, the ratio of the filler repeat pitch after thermocompression bonding to that before thermocompression bonding is within 300%, which is significantly smaller than when the dried surfaces 11a and 12a of the insulating resin layer form the surface of the filler-containing film.

[0051] The thermocompression bonding conditions under which the filler repeat pitch ratio is within 300% can be easily found because the temperature, pressure, and time can be appropriately selected from the usual heating and pressing conditions for the insulating resin layer.

[0052] When examining the ratio of the repeat pitch of the filler particles before and after thermocompression bonding, a glass plate or the like can be used as the smooth surface between which the filler-containing film is sandwiched. Alternatively, the smooth surface of the article to which the filler-containing film is to be thermocompressed can also be used. For example, when the filler-containing film is configured as an anisotropic conductive film, the smooth surface of the electrode, bump, or the like to be connected can be used. This allows the ratio of the repeat pitch of the conductive particles before and after thermocompression bonding in the electronic component to be connected to be evaluated.

[0053] The area of ​​the smooth surface when examining the ratio of the filler repeat pitch before and after thermocompression bonding should be the area where the filler arrangement can be confirmed. When the filler is arranged in a lattice pattern or forms a group having a specific shape, the area can be the area where at least one unit lattice or repeat unit of a specific shape is present. Preferably, when the filler is arranged in a lattice pattern, the area is the area where preferably three or more, more preferably five or more, and even more preferably ten or more unit lattices are present along the arrangement axis with the smallest filler pitch, and the distance between the repeat units at their centers (for example, the distance between particle centers in the case of a hexagonal lattice arrangement) is measured as the repeat pitch. Repeat units of a specific shape can also be determined in a similar manner. On the other hand, if the thermocompression bonding area is excessively large, measuring the repeat pitch will require unnecessary time, so the area should be the area where preferably 1,000 or fewer fillers are present, more preferably 500 or fewer, even more preferably 200 or fewer, and particularly preferably 50 or fewer.

[0054] To ensure such a smooth surface, the filler-containing film is configured as an anisotropic conductive film. When evaluating the ratio of the conductive particle repeat pitch before and after thermocompression bonding, the smooth surface can be, for example, an input terminal with a relatively large area of ​​an electronic component to be connected by COG. If the electronic component to be connected does not have a terminal with such an area, evaluation can be performed using an electronic component that does have a terminal with such an area. As an example, the smooth surface of a terminal with a minimum side length of 30 μm or more, preferably 40 μm or more, is used.

[0055] The number of measurements of the repeat pitch (N number) is preferably 50 or more, and more preferably 100 or more. However, since such an N number may be difficult depending on the filler number density, it may be less than this.

[0056] The repeat pitch is preferably measured in the direction in which the ratio of the repeat pitch before and after thermocompression bonding increases. This allows the actual repeat pitch ratio to be equal to or less than the measured pitch ratio, even if the repeat pitch ratio before and after thermocompression bonding varies depending on the measurement direction, making it possible to confirm the precision of the filler placement. On the other hand, when measuring the repeat pitch in multiple regions, measurement locations within each measurement region may be sampled. For example, 10% of the specified number N is measured in one region, and 10% of the number N is similarly measured in the other nine regions, and these are averaged. The number N and the number of regions in which it is measured can be adjusted appropriately depending on the object to be thermocompression bonded.

[0057] When examining the ratio of the repeat pitch of conductive particles before and after thermocompression bonding using the smooth surface of an electronic component, the amount of movement of conductive particles may differ between the direction of terminal arrangement and the direction perpendicular to the direction of resin flow. In this case, it is preferable to measure the pitch in the direction in which the amount of movement of conductive particles is greatest.

[0058] Furthermore, when terminals of different sizes coexist on the smooth surface of an electronic component, it is preferable to measure the pitch by selecting a location where the terminal size and inter-terminal distance are large and where the difference between the amount of conductive particle movement in the terminal arrangement direction and the amount of conductive particle movement in the direction perpendicular to the terminal arrangement is small. For example, in the case of a COG connection, the terminal size and inter-terminal distance are different between the input and output terminals. In this case, the pitch is measured for the input terminal, which has the larger terminal size and inter-terminal distance. This makes it easier to evaluate the amount of conductive particle movement and the disorder of the arrangement.

[0059] The above-mentioned pitch measurement direction and measurement location when examining the filler repeat pitch ratio before and after thermocompression bonding can be the same even if the filler-containing film is not an anisotropic conductive film. Furthermore, if the article to be connected does not have a smooth surface when examining the filler repeat pitch ratio before and after thermocompression bonding, smooth glass plates can be used instead. In this case, it is preferable to adjust the thermocompression bonding conditions to be equivalent to the thermocompression bonding conditions of the articles to be connected (such as the temperature, pressure, and bonding time applied to the filler-containing film).

[0060] Examples of means for measuring the pitch include known image observation devices such as optical microscopes, metallurgical microscopes, and electron microscopes, and measurement systems such as WinROOF and Azokun (registered trademark), which can be combined as appropriate.

[0061] The filler-containing film of the present invention has improved surface smoothness and adhesiveness to articles, which allows the ratio of the filler repeat pitch after thermocompression bonding to that before thermocompression bonding to be reduced to 300% or less, as described above. Therefore, when the filler-containing film 1A is configured as an anisotropic conductive film, the pre-compression bonding of the anisotropic conductive film to electronic components is improved, and even during final compression bonding, the ability to capture conductive particles at the terminals of the electronic components is improved, thereby suppressing short circuits. Therefore, even when the terminal size of the electronic component is narrowed, electrical continuity can be reliably achieved and short circuits can be suppressed. Furthermore, the improved adhesiveness allows for stable mounting of electronic components to be connected, whether large or small, facilitating the production of connected bodies and improving productivity. In particular, the filler-containing film of the present invention provides significant benefits for electronic components with narrow terminals, as precise alignment is increasingly required.

[0062] <Filler-containing film 1B> The filler-containing film of the present invention can take various forms. For example, the filler-containing film 1B shown in Fig. 3 differs from the filler-containing film 1A described above in that the position of the filler 2 on the film surface side and the surface of the filler-containing film 1B (surface 12b of the insulating resin layer 12 on the release substrate side) are flush with each other in the film thickness direction.

[0063] This filler-containing film 1B can be produced by carrying out the same manufacturing method as filler-containing film 1A, including the steps of forming insulating resin layers 11 and 12 on release substrates 20a and 20b, respectively (FIG. 4A), laminating these insulating resin layers 11 and 12 with the release substrates 20a and 20b facing outward to form a laminate of insulating resin layers (FIG. 4B), and peeling one of the release substrates 20b and pushing filler 2 into surface 12b of the insulating resin layer 12 after peeling (FIG. 4C).

[0064] This filler-containing film 1B also has smooth surfaces 11b, 12b of the insulating resin layer that forms its surface, due to the smoothness of the surfaces of the release substrates 20a, 20b being transferred thereto, and exhibits the same effects as the filler-containing film 1A.

[0065] <Filler-containing film 1C> The filler-containing film 1C shown in Figure 5 is obtained by laminating a low-viscosity resin layer 15 on the filler-pressed surface (surface 12b of the insulating resin layer on the release substrate side) (Figure 4C) of the filler-containing form 1B described above.

[0066] The low-viscosity resin layer 15 is a resin layer whose minimum melt viscosity in the range of 30 to 200°C is lower than that of the insulating resin layer 10. By laminating the low-viscosity resin layer 15 on the insulating resin layer 10, when two articles that face each other via the filler-containing film 1C are thermocompression-bonded, the adhesiveness between them can be improved. In particular, when the filler 2 is made of conductive particles and the filler-containing film 1C is used as an anisotropic conductive film to anisotropically conductively connect electronic components, the low-viscosity resin layer 15 can fill the spaces formed by the electrodes and bumps of the electronic components, improving the adhesiveness between the electronic components.

[0067] Furthermore, the greater the difference between the minimum melt viscosity of insulating resin layer 10 and the minimum melt viscosity of low-viscosity resin layer 15, the more easily the space between two articles connected via filler-containing film 1C will be filled with low-viscosity resin layer 15. Therefore, when filler 2 is made of conductive particles and filler-containing film 1C is used as an anisotropic conductive film, the space formed by the electrodes and bumps of electronic components will be more easily filled with low-viscosity resin layer 15, which will likely improve the adhesion between electronic components. Furthermore, the greater this difference, the smaller the amount of movement of insulating resin layer 10 holding filler 2 during thermocompression bonding will be relative to low-viscosity resin layer 15, which will likely improve the ability to capture conductive particles in the terminals.

[0068] The ratio (A1 / A2) of the minimum melt viscosity A1 of the insulating resin layer 10 to the minimum melt viscosity A2 of the low-viscosity resin layer 15 is preferably 2 or more, more preferably 5 or more, and even more preferably 8 or more, depending on the ratio of the thicknesses of the insulating resin layer 10 and the low-viscosity resin layer 15. On the other hand, if this ratio is too large, resin extrusion or blocking may occur when a long filler-containing film is wound into a roll, so in practice, it is preferably 30 or less, and more preferably 15 or less. More specifically, the minimum melt viscosity of the low-viscosity resin layer 15 preferably satisfies the above ratio and is 3000 Pa·s or less, more preferably 2000 Pa·s or less, and particularly preferably 100 to 2000 Pa·s.

[0069] The low-viscosity resin layer 15 can be formed by adjusting the viscosity of the same resin composition as that of the insulating resin layer 10. The low-viscosity resin layer 15 can also contain fine solid matter as needed.

[0070] 6, a method for laminating the low-viscosity resin layer 15 onto the insulating resin layer 10 into which the filler 2 has been pressed is to apply a low-viscosity resin layer-forming composition to a release substrate 20c such as a release film, dry it to form the low-viscosity resin layer 15, and then place the dried surface 15a opposite the filler 2-pressed surface of the insulating resin layer 10, thereby laminating the low-viscosity resin layer 15 onto the insulating resin layer 10. Alternatively, if the content of fine solid matter in the low-viscosity resin layer 15 is low and there is no substantial difference in the adhesiveness between the dried surface 15a of the low-viscosity resin layer 15 and the opposite surface 15b, the low-viscosity resin layer 15 may be formed by applying the low-viscosity resin layer-forming composition directly to the filler 2-pressed surface of the insulating resin layer 10.

[0071] <Filler-containing film 1D> The filler-containing film 1D shown in Figure 7 is a laminate in which the dry surfaces of the insulating resin layer 10 and the low-viscosity resin layer 15 face each other, and the tops of the fillers 2 are arranged flush with the outer surface of the insulating resin layer 10, and can be manufactured using the following steps.

[0072] That is, a process is performed in which an insulating resin layer-forming composition containing fine solid particles is applied to a release substrate 20a and dried to form an insulating resin layer 10, and a process is performed in which a low-viscosity resin layer-forming composition is applied to a release substrate 20c and dried to form a low-viscosity resin layer 15 (Figure 8A).Next, a process is performed in which the insulating resin layer 10 and the low-viscosity resin layer 15 are laminated with the release substrates 20a, 20c facing outwards (i.e., with the dry surfaces facing each other) to form a laminate of the insulating resin layer 10 and the low-viscosity resin layer 15 (Figure 8B).A process is then performed in which the release substrate 20a of the insulating resin layer 10 is peeled off from the laminate, and filler 2 is pushed into the surface of the insulating resin layer from which the release substrate has been peeled off (Figure 8C).

[0073] In this way, in the filler-containing film 1D obtained, the surface 10b of the insulating resin layer and the surface 15b of the low-viscosity resin layer 15 that form its surface are smooth due to the smoothness of the surfaces of the release substrates 20a and 20c being transferred, and the film exhibits the same effects as the filler-containing film 1A.

[0074] <Filler-containing film 1E> The filler-containing film 1E shown in Figure 9 is a laminate in which the dry surface of the insulating resin layer 10 and the dry surface of the low-viscosity resin layer 15 face each other, and the tops of the fillers 2 are aligned flush with the dry surface of the insulating resin layer 10, and can be manufactured using the following steps.

[0075] That is, similar to the manufacturing process of the filler-containing film 1D described above, first, a composition for forming an insulating resin layer containing fine solid particles is applied to a release substrate 20a and dried to form an insulating resin layer 10, and then a composition for forming a low-viscosity resin layer is applied to a release substrate 20c and dried to form a low-viscosity resin layer 15 (FIG. 8A). Next, filler 2 is pressed into the insulating resin layer 10 from the side opposite the release substrate 20a (dried surface 10a) (FIG. 10A), so that the tops of the filler 2 in the film thickness direction are flush with the dried surface 10a of the insulating resin layer 10 (FIG. 10B). The dried surface 10a is then laminated opposite the dried surface 15a of the low-viscosity resin layer (FIG. 10C).

[0076] The filler-containing film 1E obtained in this manner also has a surface 10b of the insulating resin layer and a surface 15b of the low-viscosity resin layer 15 that form its surface, and is smooth due to the smoothness of the surfaces of the release substrates 20a and 20c being transferred thereto, and exhibits the same effect as the filler-containing film 1A.

[0077] <Wound body of filler-containing film> The filler-containing film can be wound as a product. There is no particular limitation on the length of the wound body, but from the viewpoint of handling of the shipped product, it is preferably 5000 m or less, more preferably 1000 m or less, and even more preferably 500 m or less. On the other hand, from the viewpoint of mass production of the wound body, it is preferably 5 m or more.

[0078] The wound body may be formed by joining filler-containing films each having a length shorter than the entire length of the wound body. The joining points may be arranged regularly or randomly at a plurality of points.

[0079] Although there is no particular limitation on the film width in the wound body, the film width is preferably 0.3 mm or more in consideration of the lower limit of the slit width when a wide filler-containing film is slit to produce a wound body, and more preferably 0.5 mm or more in consideration of stabilizing the slit width. Although there is no particular limitation on the upper limit of the film width, from the viewpoint of portability and handling, it is preferably 700 mm or less, more preferably 600 mm or less.

[0080] Furthermore, when the filler-containing film is used as an anisotropic conductive film, it is preferable to select a film width between 0.3 and 400 mm depending on the connection object from the viewpoint of practical handling. That is, when the anisotropic conductive film is used at the edge of the electronic item to be connected, the film width is often set to about a few millimeters or less, but when it is used by being directly attached to a relatively large electronic component (such as a substrate with electrode wiring and mounting parts provided on one surface or a wafer before cutting), a film width of about 400 mm may be required. In general, anisotropic conductive films are often used with a film width of 0.5 to 5 mm.

[0081] <How to use filler-containing film> The filler-containing film of the present invention can be used by being attached to an article, similar to conventional filler-containing films, and there are no particular restrictions on the article to be attached. Therefore, various first and second components can be connected via the filler-containing film to obtain a connection between the first and second components. For example, when the filler-containing film is configured as an anisotropic conductive film, the anisotropic conductive film can be used using a thermocompression bonding tool to anisotropically conductively connect a first electronic component, such as a semiconductor device using a PN junction (power generating devices such as solar cells, image sensors such as CCDs, light-emitting devices, Peltier devices), other various semiconductor devices, IC chips, IC modules, or FPCs, to a second electronic component, such as an FPC, glass substrate, plastic substrate, rigid substrate, or ceramic substrate. Furthermore, this filler-containing film can also be used in electronic components for purposes other than anisotropic conductive connection. The surface of the article to which the filler-containing film is attached may be smooth or may have steps or convex shapes.

[0082] There are no particular limitations on the shape, size, or use of the first and second electronic components connected by the anisotropic conductive film. These electronic components may be small and have narrow terminal sizes, and high-precision alignment may be required for mounting the electronic components. For example, the bump area may be several tens of μm 2 ~several thousand μm 2 Even extremely small electronic components such as those listed above can be connected. Meanwhile, electronic components with large external dimensions can be mounted using an anisotropic conductive film. The mounted electronic components may also be divided into smaller pieces for use. When used in large TVs, the filler-containing film may be attached to one side with a length of 1 m or more, for example, 4.5 m or more. In this case, in addition to using the filler-containing film as an anisotropic conductive film, it may also be used as a spacer film with the filler as a spacer.

[0083] The anisotropic conductive film of the present invention may be used to stack IC chips or wafers to form a multilayer structure. The electronic components connected with the anisotropic conductive film of the present invention are not limited to the examples of electronic components described above. The film can be used for a variety of electronic components, which have become increasingly diverse in recent years. The present invention particularly includes film-attached articles in which the filler-containing film of the present invention is attached to various articles, and particularly includes connections in which a first electronic component and a second electronic component are connected via the anisotropic conductive film.

[0084] The filler-containing film can be attached to an article by pressure bonding, preferably thermocompression bonding, depending on the application of the filler-containing film, and light irradiation may be used during attachment.

[0085] A more specific method of using a filler-containing film as an anisotropic conductive film is, for example, when the first electronic component is an IC chip and the second electronic component is a substrate, generally by placing the first electronic component on a pressure tool and the second electronic component on a stage facing the first electronic component, attaching an anisotropic conductive film to the second electronic component in advance, and then thermocompression bonding the first and second electronic components using the pressure tool. In this case, the anisotropic conductive film may be attached to the first electronic component in advance, and the first electronic component is not limited to an IC chip.

[0086] When connecting a first electronic component and a second electronic component by thermocompression bonding, if necessary, the resin around the conductive particles may be removed beforehand and temporary bonding may be performed. This reduces the influence of resin flow that occurs when thermocompression bonding an anisotropic conductive film to an electronic item and suppresses unnecessary flow of the conductive particles. Specifically, during temporary bonding, one electronic component to be connected is attached to one side of the anisotropic conductive film, and the other electronic component is attached to the other side of the anisotropic conductive film. During this temporary bonding, the electronic components are pressed with a pressure tool to partially remove the resin between the electronic components, and then the electronic components are connected by thermocompression bonding (hereinafter, this connection method, in which pressure is applied not only during thermocompression bonding but also during temporary bonding, is referred to as a two-step pressing connection). WO2016 / 143789 describes a two-stage press-in connection using an anisotropic conductive film in which conductive particles are randomly dispersed. However, when connecting electronic components using an anisotropic conductive film in which conductive particles are regularly arranged, as in the present invention, such a two-stage press-in connection can significantly reduce unnecessary movement of conductive particles during thermocompression bonding.

[0087] When connecting the first electronic component and the second electronic component, the number of these is not limited to one to one, and for example, multiple first electronic components may be connected to one second electronic component. The present invention also includes a method for manufacturing a connection structure that connects the first electronic component and the second electronic component via an anisotropic conductive film. [Example]

[0088] The present invention will be specifically explained below by way of test examples. As filler-containing films, anisotropic conductive films of Comparative Example 1 and Examples 1 to 4 were produced. Comparative Example 1 (1) Formation of insulating resin layer A composition for forming an insulating resin layer was prepared according to the formulation shown in Table 1, applied to a PET film, and dried to obtain an insulating resin layer (hereinafter referred to as a high-viscosity resin layer) with the thickness shown in Table 2. The minimum melt viscosity of this high-viscosity resin layer (rotational rheometer (manufactured by TA Instruments), measurement pressure 5 g, temperature range 30 to 200°C, heating rate 10°C / min, measurement frequency 10 Hz, measurement plate diameter 8 mm, load fluctuation on the measurement plate 5 g) was 9000 Pa s.

[0089] (2) Pushing in conductive particles The conductive particles used were metal-coated resin particles (Sekisui Chemical Co., Ltd., AUL703, average particle diameter 3 μm) described in the examples of Patent Document 5. These conductive particles were attached to the dry surface of the high-viscosity resin layer (1) by the method described in the examples of Patent Document 5, and pressed (60°C, 0.5 MPa) to press the conductive particles into the dry surface of the high-viscosity resin layer (particle density 28,000 particles / mm 2 In this case, the conductive particles were arranged in a hexagonal lattice, with the tops in the film thickness direction flush with the dry surface of the high-viscosity resin layer.

[0090] Example 1 As in Comparative Example 1, a high-viscosity resin layer (layer thickness: 3 μm) was formed on a PET film. Separately, a composition for forming a low-viscosity resin layer was prepared according to the formulation shown in Table 1, and then coated on a PET film and dried to form a low-viscosity resin layer 3 μm thick. The minimum melt viscosity of this low-viscosity resin layer (rotational rheometer (manufactured by TA Instruments), measurement pressure 5 g, temperature range 30 to 200°C, heating rate 10°C / min, measurement frequency 10 Hz, measurement plate diameter 8 mm, load fluctuation on the measurement plate 5 g) was 300 Pa s.

[0091] A high-viscosity resin layer on a PET film and a low-viscosity resin layer on a PET film were bonded together with their dry surfaces facing each other to form a laminate of a high-viscosity resin layer and a low-viscosity resin layer, and the PET film on the high-viscosity resin layer side was peeled off.Conductive particles were attached and pressed into the surface of the high-viscosity resin layer from which the PET film had been peeled off, in the same manner as in Comparative Example 11.

[0092] Example 2 As in Comparative Example 1, a high-viscosity resin layer was formed on a PET film, and conductive particles were pressed into the dried surface. On the other hand, a low-viscosity resin layer was formed on a PET film in the same manner as in Example 1, and the dry surface of this layer was attached to the dry surface of the high-viscosity resin layer.

[0093] Example 3 As in Comparative Example 1, a high-viscosity resin layer (layer thickness: 3 μm) was formed on a PET film, and conductive particles were pressed into the dry surface. Separately, a high-viscosity resin layer (layer thickness: 3 μm) was formed on a PET film, and the dry surfaces of both high-viscosity resin layers were bonded together.

[0094] Example 4 A high-viscosity resin layer (3 μm thick) was formed on a PET film in the same manner as in Comparative Example 1. A similar high-viscosity resin layer was separately formed (3 μm thick), and the dried surfaces of these layers were bonded together to form a laminate with two high-viscosity resin layers. One of the PET films from this laminate was peeled off, and conductive particles were attached and pressed into the surface of the high-viscosity resin layer from which the PET film had been peeled off in the same manner as in Comparative Example 1.

[0095] evaluation The anisotropic conductive films of each example and comparative example were subjected to the following evaluation tests (1) to (4). The results of (1) to (4) are shown in Table 2. However, in comparative example 1, the evaluation result of (2) Film surface adhesion (temporary pressure-bonding test) was NG, so in (3) Conduction resistance test and (4) Conduction reliability test, those in which the evaluation connection was successfully manufactured were selected and used for evaluation.

[0096] (1) Ratio (%) of repeat pitch of particle arrangement before and after thermocompression bonding The following electronic components (a) and (b) were used as electronic components for evaluating the ratio of the repeat pitch of the particle arrangement before and after thermocompression bonding. The anisotropic conductive films produced in the examples and comparative examples were sandwiched between these electronic components (a) and (b), and a bump area (0.0024 mm2) containing at least 50 conductive particles was measured. 2) was thermocompression bonded at a temperature of 180°C and a pressure of 60 MPa for 5 seconds. In this case, in the film configuration shown in Table 2, the glass substrate of electronic component (b) was placed on the lower side in the figure, and the evaluation IC of electronic component (a) was placed on the upper side.

[0097] The repeat pitch P0 of the conductive particles before thermocompression bonding and the repeat pitch P1 of the conductive particles after thermocompression bonding (the center-to-center distance between conductive particles) (Figure 1) were measured at the center of the bump area along two axes for each bump. Specifically, the pre-thermocompression pitch P0 was measured along the axis (A) with the shallowest angle (closest to parallel) to the bump arrangement direction and resulting in the least amount of resin movement, and along the axis (B) with the deepest angle to the bump arrangement direction and resulting in the greatest amount of resin movement. This measurement was performed on more than 20 bumps arranged in parallel, with 50 measurements taken for each of the A and B axes, and the average of the pitch P0 was calculated for each axis. Similarly, the post-thermocompression pitch P1 was measured along each of the A and B axes, with 50 measurements taken, and the average of the pitch P1 was calculated for each axis. The ratio of the pre- to post-thermocompression pitch ((P1 / P0) x 100%) was then calculated for each of the A and B axes.

[0098] (a) Electronic components for evaluation: Evaluation IC External size: 0.7×20.0mm Thickness: 0.2mm Au-plated bump: size 40μm×60μm, distance between bumps 20μm, bump height 5μm,

[0099] (b) Electronic components for evaluation: Glass substrate (ITO wiring glass substrate) Thickness: 0.3mm

[0100] (2) Adhesion of the film surface (2-1) Temporary crimping test The anisotropic conductive film prepared in the Examples and Comparative Examples was attached to a non-alkali glass substrate for evaluation, either on the surface where the conductive particles were pressed or on the surface opposite thereto, and then temporarily bonded to a 50 μm thick buffer material (polytetrafluoroethylene) at a width of 1.5 mm, a length of 50 mm, a bonding temperature of 70°C, a bonding pressure of 1 MPa, and a bonding time of 1 second. The PET film on the side opposite the bonded surface was then peeled off with tweezers, and the anisotropic conductive film was observed to see if it peeled off from the glass substrate along with the PET film. This was repeated 100 times and evaluated according to the following criteria.

[0101] Evaluation criteria OK: The anisotropic conductive film did not peel off from the glass substrate in all 100 tests NG: The anisotropic conductive film peeled off from the glass substrate more than once in 100 tests.

[0102] In Examples 1 and 2, when the adhesive strength was checked with a finger after placing the adhesive strength on a flat surface, the adhesive strength of the low-viscosity resin layer side was greater than that of the high-viscosity resin layer side.

[0103] (2-2) Adhesion test 1 In accordance with the adhesive strength test described in JP 2017-48358 A, as shown in FIG. 11, two glass slides (26 mm × 76 mm × 1 mm) (Matsunami Glass Industry Co., Ltd.) 30, 31 were stacked alternately, and each anisotropic conductive film 1 prepared in the examples was sandwiched between them. In this case, each anisotropic conductive film was punched into a circle (10 mm diameter). First, the lower surface of the "film configuration" shown in Table 2 was overlapped with the lower glass slide 30. The lower glass slide 30 was then placed on a hot plate heated to 40 to 50°C, a typical stage temperature for temporary bonding during mounting, and heated and bonded together by pressing with a finger for 30 seconds, resulting in a so-called temporary bonding state between the lower glass slide 30 and the lower surface of the anisotropic conductive film. Then, the upper slide glass 31 was placed on the upper surface of the "film configuration" shown in Table 2 and bonded together, so that the upper slide glass 31 was adhered by the adhesive force of the upper surface of the anisotropic conductive film.

[0104] As described above, the anisotropic conductive film 1 was sandwiched between two glass slides 30 and 31. The lower glass slide 30 was fixed with a jig using an AGS-X series instrument manufactured by Shimadzu Corporation. At a temperature of 50°C, both ends of the upper glass slide 31 were pulled up vertically at 10 mm / min using a jig, as shown in FIG. 12 . The force at which the lower glass slide 30 and the upper glass slide 31 separated was measured, and this value was divided by the area of ​​the anisotropic conductive film 1 to obtain the adhesive strength of the upper surface in the "Film Configuration" section of Table 2. In this case, adhesive strength tests were performed twice for each example, and the minimum value is shown in Table 2. However, due to the difficulty of measurement, the measured values ​​for Examples 3 and 4 varied more significantly than those for Examples 1 and 2. The adhesive strength of Comparative Example 1 was weaker than those of Examples 3 and 4 when touched with a finger, so an adhesive strength test was not performed.

[0105] (2-3) Adhesion test 2 The adhesive strength (tackiness) was measured in an atmosphere of 22°C using a tackiness tester (TACII, Rhesca Corporation) as follows. First, each anisotropic conductive film (1 cm × 1 cm) prepared in the examples was bonded to plain glass (0.3 mm thick). In this case, the lower surface of the film configuration shown in Table 2 was bonded to the plain glass, and the upper surface was used as the tackiness measurement surface. The plain glass was placed on a silicone rubber support. Next, a cylindrical probe (stainless steel with a mirror finish) with a diameter of 5 mm was placed above the measurement surface. The probe was pressed against the measurement surface at a pressing rate of 30 mm / min, and a pressure of 196.25 gf was applied for 1.0 sec. The probe was then peeled off 2 mm from the measurement surface at a peeling rate of 120 mm / min. The resistance experienced by the probe due to the adhesive strength of the measurement surface was measured as the load value, and the maximum load required to peel the probe from the measurement surface was recorded as the adhesive strength (tackiness). The adhesive strength of each example was measured twice, and the minimum value is shown in Table 2. However, since measurements were difficult for Examples 3 and 4, the measured values ​​varied more than for Examples 1 and 2. For Comparative Example 1, the adhesive strength felt by touching with a finger was smaller than that of Examples 3 and 4, so no measurement was performed.

[0106] (3) Conduction resistance (initial conduction resistance) The anisotropic conductive film of each Example and Comparative Example was cut to an area sufficient for connection, sandwiched between an IC for evaluating the conductivity characteristics and a glass substrate, and heated and pressurized (180°C, 60 MPa, 5 seconds) to obtain each connection for evaluation. The electrical resistance of the obtained connection for evaluation was measured using the four-terminal method and evaluated according to the following criteria: As in (1), the lower side of the film configuration shown in Table 2 was attached to the glass substrate.

[0107] Conduction characteristic evaluation IC External size: 1.8×20.0mm Thickness: 0.3mm Au-plated bump: size 30μm x 85μm, distance between bumps 50μm, bump height 5μm

[0108] Glass substrate (ITO wiring glass substrate) Thickness: 0.3mm

[0109] Initial Conduction Resistance Evaluation Criteria OK: Less than 2.0 Ω NG:2.0Ω or more

[0110] (4) Conduction reliability (85℃, 85%RH, 500h) The connection product for evaluation prepared in (3) was placed in a thermostatic chamber at a temperature of 85°C and a humidity of 85% RH for 500 hours, after which the conduction resistance was measured in the same manner as the initial conduction resistance, and evaluated according to the following criteria. Ta.

[0111] Conduction reliability evaluation criteria OK: Less than 5.0 Ω NG: 5.0Ω or more

[0112] [Table 1]

[0113] [Table 2]

[0114] From Table 2, it can be seen that Examples 1 to 4 are superior to Comparative Example 1 in (2) adhesiveness of the film surface (temporary pressure bonding test). On the other hand, it is clear that in both Examples 1 to 4 and Comparative Example 1, there are no problems with (3) initial conduction resistance and (4) conduction reliability. Furthermore, in both Examples 1 to 4 and Comparative Example 1, the pitch ratio ((P1 / P0) × 100%) before and after thermocompression bonding was 300% or less on both the A axis and the B axis, confirming that there was little disorder in the arrangement before and after thermocompression bonding.

[0115] (5) Two-step push-in connection test In order to investigate the effect of two-stage pressing on the filler sandwiching in the filler-containing film of the present invention, a two-stage pressing connection was manufactured using the anisotropic conductive films of Examples 1 to 4, with the following evaluation IC chip and glass substrate as the connection targets, and the number of conductive particles sandwiched between the bumps of the connection was counted.

[0116] [Evaluation IC chip] Peripheral IC chip External size: 6×6mm, Bump specifications: φ36μm (circular bump), bump pitch: 300μm The bump height was more than 3 μm higher than the film thickness.

[0117] [Glass substrate] Raw glass External dimensions: 15 x 15 mm, thickness: 150 μm

[0118] The bumps and terminal patterns of the evaluation IC chip and glass substrate corresponded. Furthermore, when connecting the evaluation IC chip and glass substrate, the longitudinal direction of the anisotropic conductive film was aligned with the bump arrangement direction. The pre-bonding pressure in the two-stage pressing was performed at 80°C for 3 seconds, and the final bonding pressure was twice as high as the pre-bonding pressure at 180°C for 10 seconds. When advancing from pre-bonding to final bonding, the pressure on the evaluation IC chip was increased without releasing it. A flip-chip bonder (Panasonic FCB3 with a pal heater) was used, and the temperature and pressure were increased for 0.5 seconds for both pre-bonding and final bonding. For comparison, a connection body was also produced in which only the above-mentioned main pressure bonding was performed without pressing in the temporary pressure bonding.

[0119] When the conductive particles sandwiched between the bumps were measured after the final pressure bonding, it was confirmed that there were more conductive particles sandwiched between each bump in the connector that had been pressed in two stages (pressure was increased without releasing it after the pre-press bonding) compared to the connector that had not been pressed in the pre-press bonding. [Explanation of symbols]

[0120] 1, 1A, 1B, 1C, 1D, 1E Filler-containing film, anisotropic conductive film 2 Filler, conductive particles 3 Micro solids 10, 11, 12 Insulating resin layer 10a, 11a, 12a Dry surface 10b, 11b, 12b: Surface of insulating resin layer on the peelable substrate side 15 Low viscosity resin layer 15a Dry surface of low viscosity resin layer 15b The surface opposite to the dry surface of the low viscosity resin layer 20a, 20b, 20c release substrate 21-inch 30, 31 Slide glass D Filler particle size

Claims

1. A filler-containing film in which a filler and minute solid particles made of a material different from that of the filler are held in an insulating resin layer, and the filler is arranged in a predetermined repeated pattern in a planar view, A filler-containing film in which, when sandwiched between smooth surfaces and thermocompression-bonded under predetermined thermocompression conditions, the ratio of the filler repeat pitch after thermocompression-bonding to that before thermocompression-bonding is within 300%.

2. 2. The filler-containing film according to claim 1, wherein the insulating resin layer is formed from a laminate of two insulating resin layers.

3. 3. The filler-containing film according to claim 1, wherein a low-viscosity resin layer having a minimum melt viscosity in the range of 30 to 200° C. lower than that of the insulating resin layer is laminated on the insulating resin layer.

4. A method for producing the filler-containing film according to claim 1, comprising the steps of: applying a composition for forming an insulating resin layer containing fine solid matter onto a release substrate; and forming an insulating resin layer on the release substrate. a step of pushing a filler into the insulating resin layer from the surface opposite to the peeled substrate; a step of laminating an insulating resin layer into which a filler has been pressed and an insulating resin layer separate from the insulating resin layer, with their release substrates facing outwards; A method for producing a filler-containing film having the above structure.

5. A method for producing the filler-containing film according to claim 1, comprising the steps of: applying a composition for forming an insulating resin layer containing fine solid matter onto a release substrate; and forming an insulating resin layer on the release substrate. forming a laminate of insulating resin layers by laminating two insulating resin layers with their release substrates facing outward; a step of forcing a filler into the laminate of insulating resin layers; A method for producing a filler-containing film having the above structure.

6. A method for producing the filler-containing film according to claim 3, comprising the steps of: applying a composition for forming an insulating resin layer containing fine solid matter onto a release substrate; and forming an insulating resin layer on the release substrate. a step of applying a composition for forming a low-viscosity resin layer, the composition having a lower minimum melt viscosity in the range of 30 to 200°C than that of the insulating resin layer, to a release substrate to form a low-viscosity resin layer on the release substrate; a step of laminating the insulating resin layer and the low-viscosity resin layer with their release substrates facing outward to form a laminate of the insulating resin layer and the low-viscosity resin layer; a step of peeling off the release substrate of the insulating resin layer and pushing a filler into the surface of the insulating resin layer from which the release substrate has been peeled off; A method for producing a filler-containing film having the above structure.

7. A method for producing the filler-containing film according to claim 3, comprising the steps of: applying a composition for forming an insulating resin layer containing fine solid matter onto a release substrate; and forming an insulating resin layer on the release substrate. a step of applying a composition for forming a low-viscosity resin layer, the composition having a lower minimum melt viscosity in the range of 30 to 200°C than that of the insulating resin layer, to a release substrate to form a low-viscosity resin layer on the release substrate; a step of pushing a filler into the surface of the insulating resin layer opposite to the peeled substrate; a step of laminating the insulating resin layer into which the filler has been pressed and the low-viscosity resin layer formed on the release substrate, with the release substrate facing outward; A method for producing a filler-containing film having the above structure.

8. A film-attached article obtained by attaching the filler-containing film according to any one of claims 1 to 3 to an article.

9. A connection body in which a first article and a second article are connected via the filler-containing film according to any one of claims 1 to 3.

10. A connection structure in which a first electronic component and a second electronic component are connected via an anisotropic conductive film in which conductive particles are used as a filler in the filler-containing film according to any one of claims 1 to 3.

11. A method for producing a connection body in which a first article and a second article are connected via the filler-containing film according to any one of claims 1 to 3.

12. A method for producing a connector in which a first electronic component and a second electronic component are connected via an anisotropic conductive film in which conductive particles are used as a filler in the filler-containing film according to any one of claims 1 to 3.

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