Sensor and automatic fire warning system

Abstract

To achieve miniaturization.SOLUTION: A sensor 1 includes a substrate 2, heat detection elements 30, and a housing 5. The housing 5 stores the substrate 2. The housing 5 includes: a flow channel 6 arranged in an internal space SP1 to allow gas to flow therethrough; and an opening part 7 for connecting the flow channel 6 to an outer space SP2 of the housing 5. The heat detection element 30 is a chip thermistor mounted on the substrate 2 so as to detect heat of the gas flow-in from the opening part 7.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure generally relates to a detector and an automatic fire alarm system, and more particularly to a detector that detects heat generated by, for example, a fire, and an automatic fire alarm system including the detector. [Background technology]

[0002] As a conventional example, the combined heat and smoke detector described in Patent Document 1 is exemplified. This detector comprises a heat detection means for detecting heat and a smoke detection unit for detecting smoke that has flowed into the dark box. The heat detection means comprises a lead wire connected to a circuit board and protruding upward from the circuit board, and a heat-sensitive element such as a thermistor attached to the upper end of the lead wire. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-014330 Summary of the Invention [Problem to be solved by the invention]

[0004] In the detector of Patent Document 1, the heat-sensitive element is provided at the upper end of the lead wire, which may make it difficult to reduce the size (especially the thickness) of the detector as a whole, depending on the length of the lead wire.

[0005] The present disclosure has been made in view of the above-mentioned circumstances, and aims to provide a detector and an automatic fire alarm system that can be made smaller. [Means for solving the problem]

[0006] A detector according to one aspect of the present disclosure includes a substrate, a heat detection element, and a housing. The housing accommodates the substrate. The housing has a flow path provided in its internal space through which gas flows, an opening connecting the flow path to an external space of the housing, and a smoke detection unit disposed in the internal space and configured to detect smoke. The heat detection element is a chip thermistor mounted on the substrate and configured to detect the heat of the gas flowing in through the opening. The smoke detection unit is disposed on a different plane from the surface of the substrate on which the chip thermistor is mounted. A detector according to one aspect of the present disclosure includes a substrate, a thermal detection element, and a housing. The housing accommodates the substrate. The housing has a flow path provided in its internal space through which gas flows, an opening connecting the flow path to an external space of the housing, and a smoke detection unit disposed in the internal space to detect smoke. The thermal detection element is a chip thermistor mounted on the substrate and detects the heat of the gas flowing in through the opening. The housing has one or more walls in the internal space that guide the gas to the thermal detection element or the smoke detection unit. A sensor according to one aspect of the present disclosure includes a substrate, a thermal detection element, and a housing. The housing accommodates the substrate. The housing has a flow path provided in its internal space through which gas flows, an opening connecting the flow path to an external space of the housing, and a smoke detection unit disposed in the internal space and detecting smoke. The thermal detection element is a chip thermistor mounted on the substrate and detecting the heat of the gas flowing in through the opening. The housing has an installation surface facing a structure to which the sensor is attached. The smoke detection unit has an optical element that emits light, a light-receiving element that receives the light emitted from the optical element, and a labyrinth portion in which the optical element and the light-receiving element are arranged so as not to face each other. In the thickness direction of the substrate, the center of the internal space of the labyrinth portion is between the chip thermistor and the installation surface. A sensor according to one aspect of the present disclosure includes a substrate, a thermal detection element, and a housing. The housing accommodates the substrate. The housing has a flow path provided in its internal space through which gas flows, an opening connecting the flow path to an external space of the housing, and a smoke detector disposed in the internal space for detecting smoke. The thermal detection element is a chip thermistor mounted on the substrate and detects the heat of the gas flowing in through the opening. The housing has an installation surface facing a structure to which the sensor is attached. The substrate has a first surface facing the installation surface and a second surface opposite the first surface. The chip thermistor is mounted on the first surface or the second surface, which is a mounting surface of the substrate. The chip thermistor has a rectangular shape when viewed perpendicularly to the mounting surface of the substrate and has one surface facing the substrate in the thickness direction of the substrate. An automatic fire alarm system according to one aspect of the present disclosure includes the above-described sensor and a receiver that communicates with the sensor. [Effects of the Invention]

[0007] The present disclosure has the advantage of enabling miniaturization. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view of a sensor according to the first embodiment. [Figure 2] FIG. 2 is a perspective view of the sensor as viewed from below. [Figure 3] Fig. 3A is a partially see-through plan view of the sensor, and Fig. 3B is an enlarged plan view of a main part of Fig. 3A. [Figure 4] FIG. 4 is a schematic block diagram of the sensor. [Figure 5] FIG. 5 is an enlarged front view of the opening of the sensor. [Figure 6] FIG. 6 is a schematic cross-sectional view of a first modification of the sensor. [Figure 7] FIG. 7 is a schematic cross-sectional view of a second modification of the sensor. [Figure 8] Fig. 8A is a perspective view of the sensor according to the third modification seen from below, and Fig. 8B is a partially see-through plan view of the sensor according to the third modification. [Figure 9] 9A is a perspective view of the fourth modification of the sensor as viewed from below, and FIG. 9B is a partially see-through plan view of the fourth modification of the sensor. [Figure 10] Fig. 10A is a perspective view of the fifth modified example of the sensor as viewed from below, and Fig. 10B is a partially see-through plan view of the fifth modified example of the sensor. [Figure 11] FIG. 11 is a perspective view of another modified example of the sensor as viewed from below. [Figure 12] Fig. 12A is a side view of a main part of a sensor according to embodiment 2. Fig. 12B is a cross-sectional view of the main part of the sensor taken along the horizontal direction. [Figure 13] Fig. 13A is a side view of a main part of the sensor according to the first modification, Fig. 13B is a cross-sectional view of the main part of the sensor according to the first modification taken along the horizontal direction, and Fig. 13C is a cross-sectional view of the main part of another example of the sensor according to the first modification taken along the horizontal direction. [Figure 14] 14A is a side view of a main part of the sensor according to the second modification, FIG. 14B is a cross-sectional view of the main part of the sensor according to the second modification taken along the horizontal direction, and FIG. 14C is a perspective view of the main part of the sensor according to the second modification. [Figure 15] FIG. 15 is an exploded perspective view of a main part of the second modified example. [Figure 16] FIG. 16 is a side view of a main part of a third modification of the sensor. [Figure 17] Fig. 17A is a side view of a main part of the sensor according to Variation 4, and Fig. 17B is a cross-sectional view of the main part of Variation 4 taken along the horizontal direction. [Figure 18]Fig. 18A is a perspective view from below of a sensor according to embodiment 3. Fig. 18B is a partially see-through plan view of the sensor. Fig. 18C is a vertical cross-sectional view of a main part of the sensor near the inlet. [Figure 19] Fig. 19A is a diagram showing a state in which the above-mentioned sensor installed in a structure is subjected to a heating inspection using a tester, and Fig. 19B is a schematic cross-sectional view of the tester in a state in which the above-mentioned sensor is covered with the tester. [Figure 20] FIG. 20 is a perspective view of a modified example of the sensor as viewed from below. [Figure 21] Fig. 21A is a perspective view showing a state in which a main body of a sensor according to embodiment 4 is directly attached to a structure using a mounting base, and Fig. 21B is an exploded perspective view of the main body of the sensor and the mounting base. [Figure 22] Fig. 22A is a perspective view showing the state in which the main body of the sensor is embedded in a structure using an embedding base, and Fig. 22B is an exploded perspective view of the main body of the sensor and the embedding base. [Figure 23] Figure 23A is a partial cross-sectional view showing the same embedded base being attached to a structure using a first mounting bracket, and Figure 23B is a partial cross-sectional view showing the same embedded base being attached to a structure using a second mounting bracket. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Embodiment 1) (1) Overview The drawings described in the following embodiments are schematic drawings, and the ratios of sizes and thicknesses of components in the drawings do not necessarily reflect the actual dimensional ratios.

[0010] The detector 1 of this embodiment is, for example, a fire detector, and is equipped with a heat detection element 30 that detects heat generated by a fire or the like. In other words, the detector 1 is a detector that has at least the function of detecting heat. In the following, as an example, the detector 1 is assumed to be a so-called combined fire detector (see FIGS. 1 to 5) that also includes a smoke detector 4 (see FIG. 1). The detector 1 may be equipped with a detector that detects flames, gas leaks, or the generation of CO (carbon monoxide) due to incomplete combustion, instead of or in addition to the smoke detector 4.

[0011] As shown in FIG. 2, the sensor 1 is installed on a structure X1 (ceiling in the illustrated example) which is a construction material such as a ceiling or wall of a building.

[0012] 1 to 3A, the sensor 1 includes a substrate 2, one or more thermal detection elements 30, and a housing 5. Here, as an example, the sensor 1 includes four thermal detection elements 30.

[0013] The housing 5 accommodates the substrate 2. As shown in Fig. 1, the housing 5 has a flow path 6 provided in its internal space SP1 through which gas flows, and an opening 7 connecting the flow path 6 to an external space SP2 of the housing 5. In Fig. 1, the flow path 6 is schematically shown by an arrow line to make the flow of gas easier to understand, but the gap around the smoke detection unit 4 in the internal space SP1 can roughly correspond to the flow path 6. Also, here, as an example, the housing 5 has six openings 7 (only three are shown in Fig. 2).

[0014] Here, the heat detection element 30 in this embodiment is a chip thermistor that is mounted on the substrate 2 and detects the heat of the gas that has flowed in through the opening 7, as shown in FIG.

[0015] According to this configuration, the thermal detection element 30 is a chip thermistor mounted on the substrate 2, and therefore the entire sensor 1 can be made smaller (particularly thinner) than, for example, the configuration in Patent Document 1 in which the thermal element is provided at the upper end of the lead wire.

[0016] (2)Details (2.1) Overall structure The overall configuration of the detector 1 according to this embodiment will be described in detail below. As described above, the detector 1 is a so-called combined fire detector that detects heat and smoke.

[0017] In the following, it is assumed that the detector 1 is installed on the ceiling surface (one surface of the structure X1) as in the example of Figure 2. Accordingly, the up / down, left / right, and front / rear directions of the detector 1 will be explained using the up / down, left / right, and front / rear arrows shown in Figure 2. These arrows are merely provided to assist in the explanation and have no substance. Furthermore, these directions are not intended to limit the direction in which the detector 1 can be used.

[0018] The detector 1 is equipped with a heat detection unit 3 having the four heat detection elements 30 described above. In addition to the substrate 2, heat detection unit 3, smoke detection unit 4, and housing 5, the detector 1 further comprises a display unit 8 and a control unit 9 (see FIG. 4). The detector 1 also comprises a mounting unit 10 for mounting to the structure X1 (see FIG. 1). In FIG. 1, the mounting structure (e.g., a disk-shaped mounting base) on the side of the structure X1 to which the mounting unit 10 is fixed is not shown. The detector 1 is detachably mounted to the mounting base fixed to the structure X1.

[0019] The detector 1 includes a communication unit 11 that transmits a signal notifying an occurrence of a fire to an external alarm device or the like (not shown) when it detects a fire, and receives a signal from the alarm device or the like.

[0020] The detector 1 may be supplied with power from a commercial power source, or may be supplied with power from a battery provided inside the housing 5.

[0021] (2.2) Housing The housing 5 accommodates the circuit board 2, the heat detection unit 3, the smoke detection unit 4, the light source 81 of the display unit 8, the control unit 9, the communication unit 11, other circuit modules, etc. The housing 5 also supports the guide unit 82 of the display unit 8 so that one surface of the guide unit 82 is exposed to the outside (see FIG. 2).

[0022] The housing 5 is made of synthetic resin, for example, flame-retardant ABS resin. The housing 5 is formed as a whole in the shape of a cylinder that is flat in the vertical direction. As shown in FIG. 1, the housing 5 has a cylindrical front cover 51 with one open surface (the top surface in the illustrated example), and a disk-shaped back cover 52. The housing 5 has an installation surface 55 (see FIG. 1) that faces the structure X1 to which the sensor 1 is attached. In this example, one surface (the top surface) of the back cover 52 corresponds to the installation surface 55. The housing 5 is constructed by assembling the back cover 52 to the front cover 51 from the open surface side.

[0023] As described above, the housing 5 has the flow path 6 provided in its internal space SP1 through which the gas flows, and six side openings (horizontal holes) 7A as six openings 7 connecting the flow path 6 with the external space SP2. In other words, the openings 7 have side openings 7A. There is no particular limitation on the number of openings 7, but considering the flow of gas in and out of the housing 5, it is preferable that two or more openings be provided.

[0024] Here, six openings 7 (six side openings 7A) are provided in the front cover 51. Specifically, as shown in FIGS. 1 and 2, the front cover 51 is composed of a flat cylindrical body 510 with both upper and lower ends open, a disk-shaped base 511 below the cylindrical body 510, and a plurality of (e.g., six) crosspieces 512 connecting the cylindrical body 510 and the base 511. The cylindrical body 510, the base 511, and the six crosspieces 512 are integrally formed. The six crosspieces 512 are arranged at approximately equal intervals along the circumferential direction on the peripheral edge of the base 511 and protrude from the peripheral edge toward the open lower edge of the cylindrical body 510. The six crosspieces 512 maintain a specified distance between the cylindrical body 510 and the base 511. The six openings 7 are arranged at approximately equal intervals along the circumferential direction on the peripheral wall of the front cover 51 configured in this manner.

[0025] Each opening 7 (each side opening 7A) is a substantially rectangular through-hole that penetrates the peripheral wall of the front cover 51 in the radial direction, and serves as a port that connects the flow path 6 with the external space SP2.

[0026] The front cover 51 has a positioning structure on the upper surface of the base 511 for positioning the board 2. As an example of the positioning structure, a positioning recess may be provided on the upper surface of the base 511, and a tab protruding from the board 2 may be fitted into the recess. As shown in FIG. 3A, the base 511 has a diameter slightly larger than that of the board 2.

[0027] Furthermore, the front cover 51 has a pair of holes 513 (see FIG. 3A) in the base 511 for exposing one surface (lower surface) of the guide portion 82 of the display unit 8 to the external space SP2.

[0028] The pair of holes 513 are located near the peripheral edge of the base 511 when the base 511 is viewed from below. The pair of holes 513 are arranged so as to be equally spaced apart in the circumferential direction of the base 511. In other words, the pair of holes 513 are arranged so that an imaginary line connecting them passes through the center of the base 511. The arrangement direction of the pair of holes 513 corresponds to the front-rear direction in this disclosure.

[0029] Each hole 513 penetrates the base 511 in its thickness direction (vertical direction). The opening of each hole 513 is substantially rectangular. A corresponding guide portion 82 is fitted into each hole 513. Therefore, light emitted from the pair of light sources 81 is guided to the outside of the housing 5 via the pair of guide portions 82, respectively.

[0030] The rear cover 52 has a plurality of insertion holes 520 into which a plurality of (e.g., four) connection pieces 101 of the mounting portion 10 fixed to the substrate 2 are inserted (see FIG. 1). The connection pieces 101 are electrically connected to the circuit module provided on the substrate 2. The connection pieces 101 are inserted to such an extent that their tips sufficiently protrude from the rear surface (the installation surface 55 side) of the rear cover 52. The connection pieces 101 can be mechanically and electrically connected to contact portions of a mounting base (not shown) fixed to the structure X1. In other words, the mounting portion 10 is a part that not only provides a mechanical connection to the mounting base, but also electrically connects to the electric wires (power supply lines and signal lines) on the rear side of the structure X1 and stably positions the substrate 2 relative to the rear cover 52. This positioning includes not only radial positioning of the substrate 2 but also vertical positioning of the substrate 2.

[0031] Furthermore, rear cover 52 has, on one surface (lower surface) facing board 2, a storage recess 521 (see FIG. 1) for storing the upper part of smoke detection unit 4 mounted on board 2. That is, smoke detection unit 4 is stably positioned by storage recess 521.

[0032] Furthermore, the rear cover 52 has, on one surface (lower surface) facing the substrate 2, a plurality of control plates (walls) 522 (see FIG. 3A : four in the illustrated example) that control the flow of gas in the flow path 6. Each control plate 522 is formed in a substantially arc shape when viewed from the substrate 2 side. Each control plate 522 protrudes in a direction (downward) approaching the base 511 of the front cover 51. The four control plates 522 are arranged at substantially equal intervals along the circumferential direction of the rear cover 52 near the peripheral edge of the rear cover 52 when viewed from the substrate 2 side. The four control plates 522 control (guide) the airflow in the internal space SP1 of the housing 5 so that the gas flowing through the flow path 6 more easily flows toward the heat detection element 30 or the smoke detection unit 4. The number of control plates 522 is not particularly limited and may be one.

[0033] (2.3) Substrate The substrate 2 is a printed circuit board. A heat detection unit 3, a smoke detection unit 4, a display unit 8, a control unit 9, a communication unit 11, and other circuit modules (not shown) are mounted on the substrate 2. The other circuit modules include a lighting circuit that lights up the light source 81 of the display unit 8 and the optical element 41 of the smoke detection unit 4, and a power supply circuit that generates operating power for various circuits using power supplied from a commercial power source or the like.

[0034] As shown in Fig. 3A, the substrate 2 is formed in a generally circular shape as a whole. Fig. 3A is a plan view of the sensor 1 as seen from below, with some parts (substrate 2, control panel 522, and smoke detection unit 4) being see-through.

[0035] In this embodiment, at least four thermal detection elements 30 of the thermal detection unit 3 are surface-mounted on the first surface 21 (front surface) of the substrate 2. The first surface 21 is the upper surface (see FIG. 1). Here, as an example, the smoke detection unit 4 is also arranged on the same plane as the first surface 21 of the substrate 2. The smoke detection unit 4 is mounted on the first surface 21 of the substrate 2. The labyrinth portion 43 (described later) of the smoke detection unit 4 has an engagement claw on the underside of its bottom, and is fixed by engaging the engagement claw with an engagement hole formed in the substrate 2. The light source 81 of the display unit 8 is also mounted on the first surface 21 of the substrate 2.

[0036] The control unit 9 and the multiple electronic components that make up the circuit module are mounted on the first surface 21 or the second surface 22 of the substrate 2. The control unit 9 and the multiple electronic components that make up the circuit module do not have to be mounted only on the substrate 2; for example, another mounting substrate may be disposed around the substrate 2, and some or all of the components may be mounted on that mounting substrate.

[0037] Hereinafter, the surface of the substrate 2 opposite to the first surface 21 (top surface) may be referred to as the second surface 22 (bottom surface). In FIG. 3A, the substrate 2 is shown in a see-through manner, and the second surface 22 is visible. The thermal detection element 30, light source 81, and smoke detection unit 4 are actually mounted on the first surface 21 behind the second surface 22, but for ease of explanation, these are also shown in a see-through manner in FIG. 3A. In particular, in FIG. 3A, the optical element 41 and the light receiving element 42 arranged in the labyrinth portion 43 of the smoke detection unit 4 are shown simplified by dots.

[0038] Of the first surface 21 and the second surface 22, the first surface 21 corresponds to the surface closer to the installation surface 55. Therefore, it can be said that the heat detection element 30 and the smoke detection unit 4 are both arranged on the surface of the substrate 2 closer to the installation surface 55.

[0039] The following describes in detail the structure of the substrate 2. As shown in Fig. 3A, the substrate 2 has a circular main body 200 and a plurality of (eight in the illustrated example) extending portions that extend from the edge of the main body 200 in a direction away from the center of the main body 200. Hereinafter, the eight extending portions will be referred to as a pair of first extending portions 201, a pair of second extending portions 202, a pair of third extending portions 203, and a pair of fourth extending portions 204.

[0040] The smoke detection unit 4 is disposed on the top surface of the main body 200. On the other hand, the four heat detection elements 30 and the two light sources 81 are disposed on the six extensions (201, 202, 203), respectively.

[0041] The pair of first extending portions 201 extend away from each other from the left and right edges of the main body 200. A corresponding connecting piece 101 is disposed on the top surface of each first extending portion 201. Each first extending portion 201 also has a narrower small piece Y1 at its tip. A corresponding thermal detection element 30 is disposed on the top surface of each small piece Y1.

[0042] The pair of second extending portions 202 extend away from each other from the front and rear edges of the main body 200. The extension amount of the second extending portion 202 is smaller than the extension amounts of the other extending portions. A corresponding light source 81 is disposed on the upper surface of each second extending portion 202.

[0043] The pair of third extension portions 203 extend away from each other from positions slightly offset counterclockwise from the front and rear edges of the main body portion 200 when viewed from the underside of the substrate 2. Specifically, the front third extension portion 203 is disposed to the left of the front second extension portion 202, and the rear third extension portion 203 is disposed to the right of the rear second extension portion 202. Like the first extension portion 201, each third extension portion 203 has a narrower small piece portion Y1 at its tip. A corresponding thermal detection element 30 is disposed on the upper surface of each small piece portion Y1.

[0044] The pair of fourth extension portions 204 extend in directions away from each other from positions slightly offset in the clockwise direction from the front and rear edges of the main body portion 200 when viewed from the underside of the substrate 2. Specifically, the front fourth extension portion 204 is disposed to the right of the front second extension portion 202, and the rear fourth extension portion 204 is disposed to the left of the rear second extension portion 202. A corresponding connecting piece 101 is disposed on the upper surface of each fourth extension portion 204.

[0045] In short, the substrate 2 has a shape that is two-fold symmetrical, that is, when rotated 180 degrees around its center as an axis, it becomes symmetrical.

[0046] Incidentally, a pair of first extension portions 201 and a pair of third extension portions 203, on which four thermal detection elements 30 are arranged, each have a through hole 31 (see FIG. 3B) with a rectangular opening. FIG. 3B is an enlarged view of the circle surrounded by the dotted line (imaginary line) in FIG. 3A, as an example. The through hole 31 is arranged inside the thermal detection elements 30 (toward the center of the internal space SP1). The thermal detection elements 30 and the through hole 31 are arranged adjacent to each other. By providing such through holes 31 near each thermal detection element 30, the area occupied by the substrate 2 around the thermal detection element 30 can be reduced, and heat from the thermal detection element 30 can be prevented from being transferred through the substrate 2 and becoming lower. In other words, the through holes 31 improve thermal insulation. It is desirable that the opening area of ​​the through hole 31 be larger than the surface area of ​​the thermal detection element 30 (for example, the surface area of ​​the substrate 2 as viewed from above).

[0047] (2.4) Heat and smoke detectors As described above, the thermal detection unit 3 has four thermal detection elements 30 mounted on the first surface 21 of the substrate 2 (only one is shown in FIG. 4). The number of thermal detection elements 30 is not particularly limited and may be one, but is preferably at least two or more. In this embodiment, the thermal detection elements 30 are chip thermistors that detect the heat of the gas flowing in through the openings 7, and are surface-mounted on the substrate 2. Each thermal detection element 30 is arranged to face a different opening 7. The positional relationship of the thermal detection elements 30 with respect to the flow path 6 and the openings 7 will be explained in detail in the section "(2.7) Arrangement structure of the thermal detection unit" below.

[0048] The heat detection unit 3 is electrically connected to the control unit 9 via pattern wiring or the like formed on the substrate 2. Each heat detection element 30 outputs an electric signal (detection signal) to the control unit 9. In other words, the control unit 9 monitors the resistance value of each heat detection element 30, which may change depending on the temperature rise, through the electric signal output from each heat detection element 30.

[0049] In addition to the thermal detection element 30, the thermal detection unit 3 may further include an amplifier circuit that amplifies the electrical signal from the thermal detection element 30 and a conversion circuit that performs analog-to-digital conversion, or the amplification and conversion may be performed on the circuit module side.

[0050] The smoke detection unit 4 is disposed in the center of the internal space SP1 and is configured to detect smoke. Specifically, the smoke detection unit 4 is disposed on the upper surface of the main body 200 of the substrate 2, and its upper portion is housed in the accommodation recess 521 of the rear cover 52. The smoke detection unit 4 is, for example, a photoelectric sensor that detects smoke. As shown in FIG. 4 , the smoke detection unit 4 has an optical element 41 that emits light, a light-receiving element 42 that receives the light emitted from the optical element 41, and a labyrinth portion 43. The optical element 41 is, for example, an LED (Light Emitting Diode). The light-receiving element 42 is, for example, a photodiode. The labyrinth portion 43 is formed inside a case having a flat, approximately cylindrical outer shell. The case of the smoke detection unit 4 has multiple openings on its outer periphery that introduce gas into the labyrinth portion 43 and has a structure that prevents external light from entering the inside.

[0051] The optical element 41 and the light receiving element 42 are arranged so as not to face each other in the labyrinth portion 43. In other words, the light receiving surface of the light receiving element 42 is arranged so as to deviate from the optical axis C1 (see FIG. 3A) of the light emitted by the optical element 41.

[0052] In the event of a fire or the like, smoke may enter the housing 5 through the opening 7 of the housing 5 and be introduced into the labyrinth portion 43. If there is no smoke in the labyrinth portion 43, almost no light emitted by the optical element 41 reaches the light-receiving surface of the light-receiving element 42. On the other hand, if there is smoke in the labyrinth portion 43, the light emitted by the optical element 41 is scattered by the smoke, and some of the scattered light reaches the light-receiving surface of the light-receiving element 42. In other words, the smoke detection unit 4 receives the light emitted by the optical element 41 that has been scattered by the smoke with the light-receiving element 42.

[0053] The light receiving element 42 of the smoke detection unit 4 is electrically connected to the control unit 9. The smoke detection unit 4 transmits to the control unit 9 an electrical signal (detection signal) indicating a voltage level corresponding to the amount of light received by the light receiving element 42. The control unit 9 converts the amount of light in the detection signal received from the smoke detection unit 4 into a smoke density and determines whether or not a fire has occurred. The control unit 9 may use the amount of light directly for threshold determination. The smoke detection unit 4 may also convert the amount of light received by the light receiving element 42 into a smoke density and then transmit a detection signal indicating a voltage level corresponding to the smoke density to the control unit 9.

[0054] The smoke detection unit 4 may further include an amplifier circuit for amplifying the electrical signal from the light receiving element 42 and a converter circuit for analog-to-digital conversion, or the amplification and conversion may be performed on the circuit module side. The number of optical elements 41 for smoke detection is not limited to one, and may be multiple.

[0055] (2.5)Display section The display unit 8 has a pair of light sources 81 and a pair of guide portions 82. Each light source 81 is configured as a packaged LED in which at least one LED chip is mounted in the center of the mounting surface of a flat mounting substrate, for example. As described above, each light source 81 is mounted on the substrate 2. Each guide portion 82 is a translucent portion formed in a substantially L-shape. Each guide portion 82 faces the corresponding light source 81 on the substrate 2 and has an incident surface onto which light emitted from the light source 81 is incident. Each guide portion 82 has an exit surface from which light incident from the incident surface is emitted to the outside of the guide portion 82. The exit surface of each guide portion 82 is exposed through a corresponding hole 513 in the front cover 51.

[0056] The display unit 8 is an operating light that notifies the outside of the operating state of the detector 1. Under normal circumstances (when monitoring for a fire), the lighting circuit of the circuit module turns off the light source 81 under the control of the control unit 9. When it is determined that a fire has occurred, the lighting circuit of the circuit module starts flashing or lighting the light source 81 under the control of the control unit 9. In FIG. 4, the lighting circuit between the control unit 9 and the display unit 8 is not shown.

[0057] (2.6) Control Unit The control unit 9 is configured, for example, by a microcontroller mainly composed of a CPU (Central Processing Unit) and a memory. In other words, the control unit 9 is realized by a computer having a CPU and a memory, and the computer functions as the control unit 9 by the CPU executing a program stored in the memory. Here, the program is pre-recorded in the memory, but it may also be provided via a telecommunications line such as the Internet, or recorded on a recording medium such as a memory card.

[0058] The control unit 9 is configured to control the communication unit 11 and the circuit modules (lighting circuits, power supply circuits, etc.).

[0059] The control unit 9 is also configured to receive detection signals from the heat detection unit 3 and the smoke detection unit 4 and determine whether a fire has occurred. Specifically, the control unit 9 individually monitors the detection signals from the four heat detection elements 30 of the heat detection unit 3, and determines that a fire has occurred if it finds any one heat detection element 30 whose signal level (corresponding to a resistance value) included in the detection signal exceeds (or falls below) a threshold. The control unit 9 also monitors the detection signal from the smoke detection unit 4, and determines that a fire has occurred if the signal level (corresponding to the amount of light received by the light receiving element 42 or smoke concentration) included in the detection signal exceeds a threshold.

[0060] When the control unit 9 determines that a fire has occurred based on heat detection or smoke detection, it transmits a signal notifying the occurrence of a fire to the receiver, fire alarm, etc. of the automatic fire alarm system via the communication unit 11. The communication unit 11 is a communication interface for communicating with the receiver, fire alarm, etc., for example, via a wire. The communication unit 11 is communicatively connected to the receiver, fire alarm, etc., via the connection piece 101 of the mounting unit 10, the connector portion of the mounting base, and a signal line wired on the back side of the structure X1. Furthermore, when the control unit 9 determines that a fire has occurred, it outputs a control signal to the lighting circuit of the circuit module to blink or light the light source 81 of the display unit 8 (operation light).

[0061] (2.7) Heat detection unit layout Here, the layout structure of the heat detection unit 3 of this embodiment will be described.

[0062] In this embodiment, as described above, the thermal detection element 30 of the thermal detection unit 3 is a chip thermistor mounted on the first surface 21 of the substrate 2. This allows for miniaturization (particularly thinning) of the entire sensor 1. Furthermore, compared to lead-type thermistors, the cost of the thermistor itself and its mounting cost can be kept low.

[0063] Furthermore, in this embodiment, at least a portion of the first surface 21 (surface) of the substrate 2 is exposed to the flow path 6. Here, the smoke detection unit 4 is disposed in the center of the first surface 21, and the central portion of the internal space SP1 of the housing 5 is mostly occupied by the smoke detection unit 4. The flow path 6 essentially corresponds to the space surrounding the central portion (smoke detection unit 4) of the internal space SP1. In other words, the flow path 6 is roughly donut-shaped. Therefore, in this embodiment, of the entire area of ​​the first surface 21 of the substrate 2, the peripheral area other than the mounting area of ​​the smoke detection unit 4 is exposed to the flow path 6. The peripheral area also includes the upper surfaces of the total of eight extension portions (201 to 204) described above.

[0064] In this way, by exposing the peripheral area of ​​the first surface 21 of the substrate 2 to the flow path 6, the four thermal detection elements 30 in the first extension portion 201 and the third extension portion 203, even though they are chip thermistors, are more likely to be exposed to the gas flowing through the flow path 6.

[0065] That is, when heated gas rises from below due to the outbreak of a fire, for example, it is introduced into the housing 5 through the multiple openings 7 and flows through the flow path 6. At that time, the heat detection element 30 detects heat at a temperature equivalent to that of a fire, and the detector 1 can quickly determine that a fire has occurred. As a result, the detector 1 can be made smaller while still improving its heat detection performance.

[0066] Here, the detector 1 of this embodiment also includes a smoke detection unit 4, which is located in the center of the internal space SP1 at the back of the flow path 6. In other words, the flow path 6 is a common flow path through which both heat and smoke can pass. Therefore, if the gas introduced into the housing 5 through the multiple openings 7 has a smoke concentration above a specified level, smoke can also be detected. This allows the detector 1 as a whole to be made smaller while improving its fire detection performance.

[0067] In this embodiment, each thermal detection element 30, which is a chip thermistor, is disposed to face a different opening 7. In FIG. 1 , the thermal detection element 30 on the left side is disposed to face one opening 7 on the left side, and the thermal detection element 30 on the right side is disposed to face another opening 7 on the right side. Each thermal detection element 30 is disposed to fit within the substantially rectangular opening area 70 when the opening area 70 of the corresponding opening 7 is viewed from the external space SP2 side (see FIGS. 1 and 5 ). In other words, the area of ​​the thermal detection element 30 projected onto the opening area 70 is contained within the opening area 70. Therefore, the possibility that at least a portion of the thermal detection element 30 will be exposed to gas entering through the opening 7 can be increased compared to when the thermal detection element 30 is disposed outside the opening area 70, i.e., hidden behind the cylindrical body 510 or the crosspiece 512 of the housing 5.

[0068] In particular, in this embodiment, as shown in FIG. 5, each thermal detection element 30, which is a chip thermistor, is located at the center of the opening region 70 in the direction (vertical direction) perpendicular to the first surface 21 when viewing the opening region 70 from the external space SP2 side. In other words, the positional relationship between the opening 7 and the substrate 2 is defined so that each thermal detection element 30 is located at the center of the opening region 70. This positional relationship is adjusted, for example, by the protrusion amount of the rib 514 (see FIG. 1) that protrudes from the back side of the base 511 of the front cover 51 and contacts the substrate 2, and the insertion amount of the connecting piece 101 of the mounting portion 10. This positional relationship can further increase the possibility that the thermal detection element 30 will be exposed to gas that has entered through the opening 7, compared to when the thermal detection element 30 is located closer to one end (closer to the upper end or the lower end) of the opening region 70.

[0069] Furthermore, in this embodiment, each thermal detection element 30 is not simply disposed to the side of the smoke detection unit 4, but is disposed near the opening 7. In other words, if the flow path 6 is divided into a first path 61 located on the side of the opening 7 and a second path 62 connected to the first path 61 and located on the central side of the internal space SP1, each thermal detection element 30, which is a chip thermistor, is located within the first path 61 (see FIG. 1). Therefore, the responsiveness of the detector 1 in terms of heat detection can be improved compared to, for example, a case in which the chip thermistor is located within the second path 62. As described above, while the flow path 6 is schematically illustrated by arrows in FIG. 1, in reality, the first path 61 corresponds to the outer half of the gap around the smoke detection unit 4 in the internal space SP1, and the second path 62 corresponds to the inner half of the gap.

[0070] Incidentally, in the thickness direction (vertical direction) of the substrate 2, the center P1 of the internal space of the labyrinth portion 43 is preferably located between the thermal detection element 30, which is a chip thermistor, and the installation surface 55 in the vertical direction (see FIG. 1). In other words, the thermal detection element 30 is located below the center P1 in the vertical direction. In FIG. 3A, the optical element 41 and the light receiving element 42 arranged in the labyrinth portion 43 are schematically illustrated by dots. In this embodiment, the heights of the optical element 41 and the light receiving element 42 are the same, and the intersection of the optical axis C1 of the optical element 41 and the optical axis C2 of the light receiving element 42 approximately coincides with the center P1, for example.

[0071] The height positions of the optical element 41 and the light-receiving element 42 and the orientations of the optical axes C1 and C2 are not particularly limited as long as the optical axis C1 does not intersect with the light-receiving surface of the light-receiving element 42. For example, the height of one of the optical element 41 and the light-receiving element 42 may be lower than the height of the other. Furthermore, the optical axes C1 and C2 do not have to intersect with each other. In this case, the midpoint between the optical axes C1 and C2 may approximately coincide with the center P1 when viewed from the side of the smoke detection unit 4.

[0072] In this way, since center P1 is located between heat detection element 30 and installation surface 55, an ascending air current occurs when heated gas flows through flow path 6 inside housing 5, and smoke (gas) that passes through heat detection element 30 can be effectively guided to smoke detection unit 4. Therefore, in detector 1 that detects not only heat but also smoke, the fire detection performance can be further improved while the detector 1 as a whole can be made smaller.

[0073] (3) Variations The above embodiment is merely one of various embodiments of the present disclosure. The above embodiment can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Furthermore, functions similar to those of the sensor 1 according to the above embodiment may be embodied in a control method for the sensor 1, a computer program, a non-transitory recording medium on which a computer program is recorded, or the like.

[0074] Modifications of the above embodiment are listed below. The modifications described below can be applied in appropriate combinations. Note that the above embodiment may also be referred to as a "basic example" below.

[0075] The control unit 9 of the sensor 1 according to the present disclosure includes a computer system. The computer system is primarily composed of a processor and memory as hardware. The processor executes a program stored in the memory of the computer system to realize the functions of the control unit 9 of the sensor 1 according to the present disclosure. The program may be pre-stored in the memory of the computer system, provided via a telecommunications line, or provided in a non-transitory recording medium such as a memory card, optical disk, or hard disk drive that is readable by the computer system. The processor of the computer system is composed of one or more electronic circuits, including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits, such as ICs and LSIs, are referred to by different names depending on the degree of integration, and include integrated circuits called system LSIs, very large-scale integrations (VLSIs), or ultra-large-scale integrations (ULSIs). Furthermore, field-programmable gate arrays (FPGAs), which are programmed after the LSI is manufactured, or logic devices that allow the reconfiguration of internal connections or internal circuit partitions of the LSI, can also be used as processors. The electronic circuits may be integrated into one chip or distributed across multiple chips. The chips may be integrated into one device or distributed across multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0076] Furthermore, it is not essential for the sensor 1 that multiple functions of the control unit 9 of the sensor 1 are concentrated in one housing, and the components of the sensor 1 may be distributed across multiple housings. Furthermore, at least some of the functions of the sensor 1, for example, some of the functions of the sensor 1 may be realized by the cloud (cloud computing) or the like. Conversely, as in the basic example, multiple functions of the sensor 1 may be concentrated in one housing.

[0077] (3.1) Variation 1 The sensor 1A of this modified example (modified example 1) will be described below with reference to Fig. 6. Components that are generally common to the sensor 1 of the basic example will be given the same reference numerals, and their description may be omitted as appropriate. Fig. 6 shows a schematic cross-sectional view of the sensor 1A.

[0078] The detector 1A differs from the basic example in that it is provided with an airflow adjustment unit Z1 within the internal space SP1. The airflow adjustment unit Z1 extends from the lower edge of the cylindrical body 510 in the front cover 51 of the housing 5 toward the smoke detection unit 4. The airflow adjustment unit Z1 is a plate member that is roughly doughnut-shaped when viewed from the top and bottom. The airflow adjustment unit Z1 may be formed integrally with the front cover 51, or may be a separate member from the front cover 51 that is fixed to the front cover 51 by screws or the like.

[0079] The airflow adjustment section Z1 extends straight along the substrate 2 for a certain distance from the edge of the opening 7 toward the inside of the housing 5. However, the airflow adjustment section Z1 is inclined in a direction approaching the installation surface 55 from the middle toward the center of the internal space SP1.

[0080] That is, in the sensor 1A, the airflow adjustment unit Z1 is provided, and therefore the opening cross-sectional area of ​​the first path 61 is set smaller than the opening cross-sectional area of ​​the second path 62. Therefore, the gas that has entered the flow path 6 through the opening 7 can be encouraged to flow from the first path 61, which is a narrow space, toward the second path 62, which is a wide space.

[0081] In particular, because the airflow adjustment section Z1 is inclined from the middle in a direction approaching the installation surface 55, the second path 62 widens in a direction approaching the installation surface 55 as it moves from the first path 61 toward the central section. Therefore, when heated gas flows through the flow path 6 in the housing 5, an ascending air current is generated, and smoke (gas) that has passed through the thermal detection element 30 can be effectively guided to the smoke detection section 4.

[0082] (3.2) Variation 2 The sensor 1B of this modified example (modified example 2) will be described below with reference to Fig. 7. Components that are generally common to the sensor 1 of the basic example will be given the same reference numerals, and their description may be omitted as appropriate. Fig. 7 shows a schematic cross-sectional view of sensor 1B.

[0083] Detector 1B differs from the basic example in that smoke detection unit 4 is mounted on second surface 22 of substrate 2, not on first surface 21. Note that heat detection element 30 is mounted on first surface 21, as in the basic example.

[0084] In the housing 5 of this sensor 1B, the smoke detection unit 4 is mounted on the second surface 22 (bottom surface), and therefore the front cover 51 has a storage recess 515 for storing the smoke detection unit 4. Specifically, the base 511 of the front cover 51 is formed so that its center is convex downward. In the basic example, the back cover 52 has a storage recess 521 for storing the upper part of the smoke detection unit 4 (see FIG. 1).

[0085] The base 511 has a hole 5111 on the peripheral wall of the protruding portion 5110 thereof, through which gas (smoke) is introduced into the housing 5.

[0086] The flow path 6 is configured to be divided into two paths, an upper flow path 6X and a lower flow path 6Y, with the substrate 2 as the boundary. The heated gas passing through the upper flow path 6X passes through the thermal detection element 30. A portion of the gas passing through the lower flow path 6Y passes through the through-hole 31 (see FIG. 3B) in the substrate 2, rises to the upper flow path 6X, and passes through the thermal detection element 30. The remaining gas passing through the lower flow path 6Y heads directly toward the smoke detection unit 4 in the center.

[0087] (3.3) Variation 3 The sensor 1C of this modified example (modified example 3) will be described below with reference to Figures 8A and 8B. Components that are generally common to sensor 1 of the basic example will be given the same reference numerals, and their description may be omitted as appropriate. Note that Figure 8A is a perspective view of sensor 1C seen from below, and Figure 8B is a plan view of sensor 1C seen from below, with part (only substrate 2) made transparent.

[0088] Detector 1C is, as an example, a P-type heat detector that transmits a fire signal to the outside using a so-called P-type (Proprietary-type) communication method. Like the basic example, detector 1C is equipped with a heat detection unit 3, but unlike the basic example, it does not have a smoke detection unit 4. In other words, detector 1C determines the occurrence of a fire or the like solely by detecting heat.

[0089] Detector 1C also differs from the basic example in that the number of heat detecting elements 30 is three (four in the basic example).

[0090] As shown in FIG. 8B, the substrate 2 of the detector 1C has a generally diamond shape when viewed from below. Two of the three thermal detection elements 30 are surface-mounted on the first surface 21 (top surface) of the diamond-shaped substrate 2. The two thermal detection elements 30 are respectively arranged at diagonal positions in the left-right direction on the first surface 21 (top surface). Specifically, the substrate 2 has a pair of protrusions 23 on both edges at diagonal positions that protrude outward (at a slight angle with respect to the left-right direction). A corresponding thermal detection element 30 is arranged on the top surface of each protrusion 23. The other thermal detection element 30 is arranged on the top surface of the central part of the substrate 2.

[0091] As in the basic example, through holes 31 are provided near each thermal detection element 30 to improve thermal insulation. However, for the thermal detection element 30 located in the center of the substrate 2, two semicircular through holes 31 are arranged to sandwich the thermal detection element 30 therebetween.

[0092] The front cover 51 of the sensor 1C has, in its base 511, one inlet (vertical hole) 7B and two auxiliary ports (vertical holes) 56. The two auxiliary ports 56 are located near both left and right edges of the base 511, and the inlet 7B is located in the center of the base 511. The inlet 7B and the two auxiliary ports 56 each penetrate the base 511 of the front cover 51 in its thickness direction. The two auxiliary ports 56 located near both left and right edges of the base 511 have approximately crescent-shaped openings, and the inlet 7B located in the center of the base 511 has a approximately circular opening. The pair of protrusions 23 of the substrate 2 face each other in a one-to-one correspondence with the two auxiliary ports 56, and the center of the substrate 2 faces the central inlet 7B. As a result, the protrusion 23 and the center of the substrate 2 are exposed from the two auxiliary ports 56 and the inlet port 7B, respectively, as shown in Fig. 8B. Therefore, rising heated gas enters the housing 5 through the two auxiliary ports 56 and the inlet port 7B, and then flows into the first surface 21 (upper surface) through the through-hole 31. Therefore, the heat detection element 30 is easily exposed not only to the gas flowing in from the opening 7 (side port 7A: horizontal hole), but also to the gas flowing in from the two auxiliary ports 56 and the inlet port 7B.

[0093] Even in this configuration, the fire detection performance can be further improved, while the detector 1C as a whole can be made smaller (particularly thinner).

[0094] (3.4) Variation 4 A sensor 1D of this modified example (modified example 4) will be described below with reference to Figures 9A and 9B. Components that are generally common to sensor 1 of the basic example will be given the same reference numerals, and their description may be omitted as appropriate. Note that Figure 9A is a perspective view of sensor 1D seen from below, and Figure 9B is a plan view of sensor 1D seen from below, with part (only substrate 2) made transparent.

[0095] As an example, detector 1D is an R-type heat detector that transmits a fire signal to the outside using a so-called R-type (Record-type) communication method. Like the basic example, detector 1D is equipped with a heat detection unit 3, but unlike the basic example, it does not have a smoke detection unit 4. In other words, like detector 1C of modified example 3, detector 1D determines the occurrence of a fire or the like by detecting heat alone.

[0096] Detector 1D also differs from the basic example in that the number of heat detecting elements 30 is five (compared to four in the basic example).

[0097] As shown in Fig. 9B, the substrate 2 of sensor 1D has a shape somewhat similar to that of the substrate 2 of the basic example. Specifically, the substrate 2 of sensor 1D has a circular main body 200 and multiple (six in the illustrated example) extension portions that extend from the edges of the main body 200 in a direction away from the center of the main body 200. Hereinafter, the six extension portions will be referred to as a pair of first extension portions 201, a pair of second extension portions 202, and a pair of third extension portions 203. One of the five thermal detection elements 30 is disposed in the center of the main body 200, and the remaining four thermal detection elements 30 and two light sources 81 are disposed on the six extension portions (201, 202, 203), respectively.

[0098] The pair of first extension portions 201 extend away from each other from the left and right edges of the main body portion 200. Each first extension portion 201 has a narrower small piece portion Y1 at its tip. A corresponding heat detection element 30 is disposed on the upper surface of each small piece portion Y1.

[0099] The pair of second extending portions 202 extend away from each other from the front and rear edges of the main body 200. The extension amount of the second extending portion 202 is smaller than the extension amounts of the other extending portions. A corresponding light source 81 is disposed on the upper surface of each second extending portion 202.

[0100] The pair of third extension portions 203 extend away from each other from positions slightly offset counterclockwise from the front and rear edges of the main body portion 200 when viewed from the underside of the substrate 2. Specifically, the front third extension portion 203 is disposed to the left of the front second extension portion 202, and the rear third extension portion 203 is disposed to the right of the rear second extension portion 202. Like the first extension portion 201, each third extension portion 203 has a narrower small piece portion Y1 at its tip. A corresponding thermal detection element 30 is disposed on the upper surface of each small piece portion Y1.

[0101] In short, the substrate 2 of the sensor 1D has, for example, a two-fold symmetric shape that becomes symmetric when rotated 180 degrees around its center.

[0102] As in the basic example, through holes 31 are provided near each thermal detection element 30 to improve thermal insulation. However, for the thermal detection element 30 located in the center of the substrate 2, two semicircular through holes 31 are arranged to sandwich the thermal detection element 30. As in the basic example, a pair of guide portions 82 of the display unit 8 are exposed on the front cover 51 of the sensor 1D.

[0103] The front cover 51 of the sensor 1D has one inlet (vertical hole) 7B and two auxiliary ports (vertical holes) 57 in its base 511. The two auxiliary ports 57 are located near the left and right edges of the base 511, and the inlet 7B is located in the center of the base 511. The two auxiliary ports 57 and the inlet 7B each penetrate the base 511 of the front cover 51 in its thickness direction. The two auxiliary ports 57 located near the left and right edges of the base 511 have substantially rectangular openings, and the inlet 7B located in the center of the base 511 has a substantially circular opening. The tips of the small piece portions Y1 of the pair of first extension portions 201 of the substrate 2 face the two auxiliary ports 57 on the left and right in a one-to-one correspondence, and the center of the substrate 2 faces the central inlet 7B. As a result, the tip of the small piece Y1 and the center of the substrate 2 are exposed from the two auxiliary ports 57 and the inlet port 7B, respectively, as shown in Fig. 9B. Therefore, rising heated gas enters the housing 5 through the two auxiliary ports 57 and the inlet port 7B, and then flows into the first surface 21 (upper surface) through the through-hole 31. Therefore, the heat detection element 30 is easily exposed not only to the gas flowing in from the opening 7 (side port 7A: horizontal hole), but also to the gas flowing in from the two auxiliary ports 57 and the inlet port 7B.

[0104] Even in this configuration, the fire detection performance can be further improved, while the detector 1D as a whole can be made smaller (particularly thinner).

[0105] (3.5) Variation 5 The sensor 1E of this modified example (modified example 5) will be described below with reference to Figures 10A and 10B. Components that are generally common to sensor 1 of the basic example will be given the same reference numerals, and their description may be omitted as appropriate. Note that Figure 10A is a perspective view of sensor 1E seen from below, and Figure 10B is a plan view of sensor 1E seen from below, with part (only substrate 2) being see-through.

[0106] Detector 1E is, for example, a fire alarm that outputs a sound such as an alarm when a fire occurs. Like the basic example, detector 1E is equipped with a heat detection unit 3, but unlike the basic example, it does not have a smoke detection unit 4. In other words, detector 1E determines the occurrence of a fire or the like solely by detecting heat, similar to detector 1C of modified example 3 and detector 1D of modified example 4.

[0107] The detector 1E also differs from the basic example in that it is equipped with a speaker that outputs sounds such as an alarm, an acoustic circuit, etc. The detector 1E is, as an example, a battery-powered fire alarm. Therefore, the detector 1E has a battery and a storage space for the battery, etc. In the detector 1E, the operating unit U1 is exposed on the front of the front cover 51.

[0108] The operation unit U1 accepts external operations. The operation unit U1 can be pushed upward by a user's finger or other pressing operation. The operation unit U1 is a translucent, disc-shaped member. The operation unit U1 is disposed opposite an operation light inside the housing 5. The operation unit U1 is also configured to press a push button switch inside the housing 5 when pressed. For example, if the operation unit U1 is pressed while an alarm sound is being sounded, the output of the alarm sound will be stopped. Furthermore, the operation unit U1 lights up when the detector 1E is in operation or when the battery runs out, etc. Furthermore, operation tests, etc. can also be performed by operating the operation unit U1.

[0109] The detector 1E also differs from the basic example in that the number of heat detecting elements 30 is three (four in the basic example).

[0110] 10B, the substrate 2 of the sensor 1E has an inverted Y shape when viewed from below. In the sensor 1E, components with relatively large volumes, such as a speaker, a battery, and an operation unit U1, are housed or supported within the housing 5, and to avoid these components, the substrate 2 has an inverted Y shape that saves space.

[0111] Specifically, the substrate 2 of the sensor 1E has a circular main body 200 with a notched left side, and a plurality of (three in the illustrated example) extending portions that extend from the edge of the main body 200 in a direction away from the center of the main body 200. Hereinafter, the three extending portions will be referred to as extending pieces 205. Three thermal detection elements 30 are arranged on the three extending pieces 205, respectively.

[0112] Of the three extension pieces 205, the front extension piece 205 extends from the front edge of the main body 200, and a corresponding thermal detection element 30 is disposed on the upper surface of the tip of the extension piece 205. Of the three extension pieces 205, the rear two extension pieces 205 extend from positions slightly shifted to the left and right from the rear edge of the main body 200, and two corresponding thermal detection elements 30 are disposed on the upper surfaces of the tips of the extension pieces 205.

[0113] As in the basic example, through holes 31 (three in total) are provided in the vicinity of the inner side of each thermal detection element 30 to improve thermal insulation.

[0114] The front cover 51 of the detector 1E has one auxiliary port (vertical hole) 58 in its base 511. The auxiliary port 58 is located near the front edge of the base 511. The auxiliary port 58 penetrates the base 511 of the front cover 51 in the thickness direction. The auxiliary port 58 has a substantially rectangular opening. The tip of the front extension piece 205 of the three extension pieces 205 faces the auxiliary port 58. As a result, the tip of the front extension piece 205 is exposed from the auxiliary port 58, as shown in FIG. 10B . Therefore, rising heated gas enters the housing 5 through the auxiliary port 58 and further flows through the through-hole 31 to the first surface 21 (top surface) side. Therefore, the heat detection element 30 is easily exposed not only to the gas flowing in from the opening 7 (side port 7A: horizontal hole) but also to the gas flowing in from the auxiliary port 58.

[0115] Even in this configuration, the fire detection performance can be further improved, while the detector 1E as a whole can be made smaller (particularly thinner).

[0116] (3.6) Other Modifications Unlike Modifications 3 to 5, the detector 1 (combined fire detector) of the basic example does not have a vertical hole in the front cover 51. However, similar to Modifications 3 to 5, the detector 1 (combined fire detector) may have one or more auxiliary ports (vertical holes) 59 (two in the illustrated example) in the front cover 51, as shown in FIG. 11 .

[0117] In the basic example, the thermal detection element 30 is mounted on the first surface 21 (top surface) of the substrate 2. However, the thermal detection element 30 may also be mounted on the second surface 22 (bottom surface) of the substrate 2. Alternatively, some of the multiple thermal detection elements 30 may be mounted on the first surface 21 and the rest on the second surface 22. Furthermore, for example, both the thermal detection element 30 and the smoke detector 4 may be mounted on the second surface 22 (bottom surface) of the substrate 2.

[0118] In the basic example, one thermal detection element 30 is adjacent to one through-hole 31, but as shown in Modifications 3 and 4, there may be two or more through-holes 31. For example, a plurality of through-holes 31 may be provided so as to surround one thermal detection element 30.

[0119] In the basic example, the thermal detection element 30 is mounted on the first surface 21 of the substrate 2, and the through-hole 31 is arranged adjacent to the thermal detection element 30. However, even if the thermal detection element 30 is mounted on the second surface 22 of the substrate 2, it is desirable that the through-hole 31 be arranged adjacent to the thermal detection element 30.

[0120] In the basic example, the substrate 2 is composed of one printed circuit board. However, the substrate 2 may be divided into two or more printed circuit boards. However, it is preferable that the divided printed circuit boards are arranged on the same plane.

[0121] In the basic example, the opening 7 is a horizontal hole formed in the peripheral wall of the housing 5. However, the opening 7 referred to in the present disclosure may not be a horizontal hole, but may correspond to the inlet (vertical hole) 7B, the auxiliary ports (vertical holes) 56 to 58, and the auxiliary port (vertical hole) 59 described above in Modifications 3 to 5.

[0122] (Embodiment 2) A sensor 1F according to this embodiment will be described below with reference to Figures 12A and 12B. The sensor 1F according to this embodiment differs from the sensors (1, 1A to 1E) of embodiment 1 (including modifications) in that it further includes a shielding portion V1. Hereinafter, components substantially similar to those of embodiment 1 will be assigned common reference numerals and descriptions thereof will be omitted as appropriate. The shielding portion V1 of this embodiment may also be applied to the sensors (1, 1A to 1E) of embodiment 1 as appropriate.

[0123] 12A and 12B is, as an example, a P-type heat detector, similar to the detector 1C (FIGS. 8A and 8B) of Modification 3 in Embodiment 1. Similarly to the detector 1C of Modification 3 in Embodiment 1, the detector 1F is a heat detector that does not include a smoke detection unit 4 and determines the occurrence of a fire or the like by detecting heat only.

[0124] In this embodiment as well, the thermal detection element 30 (chip thermistor) is arranged so as to fit within the opening area 70 when viewed from the external space SP2 side of the opening 7 (side opening 7A: horizontal hole). The shielding portion V1 is configured to block a part of the opening area 70 on the external space SP2 side of the thermal detection element 30 (chip thermistor).

[0125] The shielding portion V1 has a pair of pillars V11. Here, the shielding portion V1 is composed of a pair of pillars V11. Each pillar V11 is long in the vertical direction (here, for example, the thickness direction of the substrate 2). Each pillar V11 is formed integrally with the front cover 51 of the housing 5. Specifically, a first end (upper end) of each pillar V11 is connected to the cylindrical body 510 of the housing 5, and a second end (lower end) of each pillar V11 is connected to the base 511. As a result, each pillar V11 extends from the upper edge to the lower edge of the opening 7 (side opening 7A).

[0126] When viewing the opening area 70 from the external space SP2 side, the pair of pillars V11 are arranged with a predetermined distance L1 between them in a direction D1 (here, the left-right direction) perpendicular to the arrangement direction of the rear cover 52 and the front cover 51. Hereinafter, as an example, the rear cover 52 corresponds to the first cover and the front cover 51 corresponds to the second cover, but the reverse may also be true, with the rear cover 52 corresponding to the second cover and the front cover 51 corresponding to the first cover.

[0127] Here, as an example, the predetermined distance L1 is a distance specified so that a test finger cannot be inserted. The test finger is, for example, a dummy finger specified in Appendix 4, Section 1(2)(H) of the Electrical Appliance and Material Safety Act of Japan.

[0128] When the opening region 70 is viewed from the external space SP2 side, the heat detection element 30 is disposed between the pair of pillars V11 in the direction D1 (see FIG. 12A). In other words, the heat detection element 30 is exposed from between the pair of pillars V11.

[0129] In this way, by further providing the shielding portion V1, the sensor 1F is less likely to be obstructed from the inflow of heat from the opening 7, while reducing the possibility of, for example, a person's finger or a tool unintentionally coming into contact with the chip thermistor.

[0130] 12B, each pillar V11 has a guide surface V2 that guides the airflow from the external space SP2 toward the thermal detection element 30 (chip thermistor). Here, the cross section of each pillar V11 cut along the horizontal direction has a substantially semi-elliptical shape, and the curved surface corresponds to the guide surface V2. The tip of the semi-elliptical shape faces the thermal detection element 30. This further reduces the possibility that the shielding portion V1 will block heat inflow from the opening 7.

[0131] Next, a first modification of this embodiment will be described. In the example of Fig. 12A and Fig. 12B described above, the number of pillars V11 of the shielding portion V1 is two, but the number of pillars of the shielding portion V1 is not particularly limited. Fig. 13A and Fig. 13B show a sensor 1G of the first modification. The sensor 1G of the first modification differs from the sensor 1F in that the number of pillars of the shielding portion V1 is three.

[0132] As an example, sensor 1G of modified example 1 is a P-type heat sensor. Note that, while convex portion 23 of substrate 2 of sensor 1F protrudes slightly obliquely relative to the radial direction of housing 5 when viewed in the up-down direction (see FIG. 12B), convex portion 23 of substrate 2 of sensor 1G protrudes outward in the radial direction of housing 5 (see FIG. 13B).

[0133] The shielding section V1 of the sensor 1G has three pillars (a pair of first pillars V12 on the left and right and a second pillar V13 in the middle). Here, the shielding section V1 is composed of three pillars. Each of the pair of first pillars V12 and second pillars V13 is elongated in the vertical direction (here, for example, the thickness direction of the substrate 2). Each of the pair of first pillars V12 and second pillars V13 is formed integrally with the front cover 51 of the housing 5. Specifically, a first end (upper end) of each pillar is connected to the cylindrical body 510 of the housing 5, and a second end (lower end) of each pillar is connected to the base 511. As a result, each pillar extends from the upper edge to the lower edge of the opening 7.

[0134] When viewing the opening area 70 from the external space SP2 side, each of the pair of first pillars V12 and the second pillar V13 is disposed with a predetermined distance L2 between them in the direction D1 (here, the left-right direction). Here, as an example, the predetermined distance L2 is also a distance specified so that a test finger cannot be inserted.

[0135] The heat detection element 30 is disposed between the pair of first pillars V12 in direction D1 when viewing the opening area 70 from the external space SP2 side (see FIG. 13A). However, when viewing the opening area 70 from the external space SP2 side, the heat detection element 30 is positioned so as to overlap with the second pillar V13. In other words, the heat detection element 30 is positioned so as to be hidden behind the second pillar V13 and cannot be seen.

[0136] In this way, the sensor 1G is provided with a shielding portion V1 having three pillars, which makes it difficult for heat to flow in from the opening 7, while further reducing the possibility of a person's finger or tool coming into contact with the chip thermistor.

[0137] As shown in FIG. 13B, each of the pair of first columns V12 has a guide surface V2 that guides the airflow from the external space SP2 toward the thermal detection element 30 (chip thermistor). Here, the cross section of each of the pair of first columns V12 taken along the horizontal direction has a long, approximately racetrack shape that follows the outer edge of the housing 5, and has semicircular curved surfaces on both the left and right sides as the guide surfaces V2. This further reduces the possibility that the shielding portion V1 will block the inflow of heat from the opening 7. Note that the cross section of the second column V13 taken along the horizontal direction has a substantially rectangular shape, but it may also have a substantially racetrack shape like the first column V12 and have the guide surface V2.

[0138] FIG. 13C shows another example of the detector 1G of the first modification. In this example, each of the pair of first pillars V12 has a substantially trapezoidal cross section cut along the horizontal direction. Each first pillar V12 is configured so that the shorter side of the two parallel sides of the trapezoid faces the thermal detection element 30 and the longer side faces the external space SP2. In particular, each first pillar V12 has a first surface V121 facing the middle second pillar V13 and a second surface V122 opposite the first surface V121, which are inclined toward the thermal detection element 30. The inclination angle of the second surface V122 with respect to the radial direction of the housing 5 is larger than the inclination angle of the first surface V121. The cross section of the middle second pillar V13 cut along the horizontal direction has a bullet shape that is elongated in the radial direction of the housing 5, and the side facing the thermal detection element 30 is semicircular. In this example, the first surface V121, the second surface V122, and the end surface having a semicircular cross section correspond to the guide surface V2. In other words, in this example, each of the pair of first columns V12 has the guide surface V2. In this example, the provision of the guide surface V2 further reduces the possibility that the shielding portion V1 will block heat inflow from the opening 7.

[0139] Next, a second modification of this embodiment will be described. Figures 14A to 14C and 15 show a sensor 1H of the second modification. The sensor 1H of the second modification is an R-type heat sensor, for example. The protrusion 23 of the substrate 2 of the sensor 1H protrudes outward along the radial direction of the housing 5.

[0140] The shielding portion V1 in the sensor 1H of the second modification has a pair of first protrusions V14 and one second protrusion V15. Here, the shielding portion V1 is composed of the pair of first protrusions V14 and the second protrusion V15. Each of the pair of first protrusions V14 protrudes from a rear cover 52 (first cover) that covers the substrate 2 from one direction (here, from above) in the thickness direction of the substrate 2 toward a front cover 51 (second cover). The front cover 51 covers the substrate 2 from a direction (here, from below) opposite to the one direction in the thickness direction of the substrate 2. The second protrusion V15 protrudes from the front cover 51 toward the rear cover 52. Each of the pair of first protrusions V14 and second protrusions V15 is elongated in the up-and-down direction (here, for example, the thickness direction of the substrate 2).

[0141] 15, the pair of first protrusions V14 are formed integrally with the rear cover 52. Specifically, the pair of first protrusions V14 protrude downward continuously from the peripheral edge of the lower surface of the rear cover 52. Note that the tip of each of the pair of first protrusions V14 is not in contact with the front cover 51, and a gap is provided between them.

[0142] The pair of first protrusions V14 are arranged at a predetermined distance L3 from each other in the direction D1 when the opening region 70 is viewed from the external space SP2 side. Here, as an example, the predetermined distance L3 is also a distance defined so that a test finger cannot be inserted. The heat detecting element 30 is arranged between the pair of first protrusions V14 in the direction D1 when the opening region 70 is viewed from the external space SP2 side (see FIG. 14A).

[0143] The second protrusion V15 is disposed in the center between the pair of first protrusions V14 in the direction D1. In other words, each of the pair of first protrusions V14 is disposed offset from the second protrusion V15 in the direction D1 when the opening region 70 is viewed from the external space SP2 side. This further reduces the possibility that the shielding portion V1 will block heat inflow from the opening 7.

[0144] The second protrusion V15 is formed integrally with the front cover 51. Specifically, the second protrusion V15 protrudes upward continuously from the peripheral edge of the upper surface of the front cover 51. The tip of the second protrusion V15 does not contact the upper edge of the opening 7, leaving a gap between it and the upper edge.

[0145] As shown in FIG. 14A, the second protrusion V15 is located at the same position as the chip thermistor in direction D1 when viewing the opening region 70 from the external space SP2 side. However, the protrusion amount of the second protrusion V15 is set so that at least a portion of the chip thermistor is exposed. Specifically, the protrusion amount is set so that the tip of the second protrusion V15 does not extend beyond the upper surface of the chip thermistor. Note that, as an example, the tip of the second protrusion V15 is located below the lower surface of the substrate 2, and the thermal detection element 30 is exposed between the pair of first protrusions V14 without being hidden behind the second protrusions V15.

[0146] By specifying the amount of protrusion of the second protrusion V15 so that at least a portion of the chip thermistor is exposed in this manner, it is possible to further prevent heat from flowing in through the opening 7, while reducing the possibility of a person's finger or tool coming into contact with the chip thermistor.

[0147] Incidentally, each of the pair of first protrusions V14 also has a guide surface V2, as shown in Fig. 14B. Here, each of the pair of first protrusions V14 has a cross-sectional shape cut along the horizontal direction that is elongated along the radial direction of the housing 5, and has curved surfaces on both the left and right sides as the guide surfaces V2. This further reduces the possibility that the shielding portion V1 will block the inflow of heat from the opening 7. In particular, the relatively small width dimension of each first protrusion V14 further reduces the possibility that the inflow of heat will be blocked.

[0148] On the other hand, as shown in FIG. 14C, the second protrusion V15 also has a guide surface V2. The second protrusion V15 is formed in a substantially triangular shape when viewed along the direction in which the pair of first protrusions V14 are aligned. In particular, the second protrusion V15 has a curved surface V150 that is concave and inclined in a substantially arc shape on the side of the internal space SP1 when viewed along the direction in which the pair of first protrusions V14 are aligned. This curved surface V150 also corresponds to the guide surface V2. When the hot air current collides with the guide surface V2, it can be guided toward the chip thermistor located above the second protrusion V15.

[0149] In this way, the sensor 1H is provided with a shielding portion V1 having three protrusions, which makes it difficult for heat to flow in from the opening 7, while further reducing the possibility of a person's finger or tool coming into contact with the chip thermistor.

[0150] The shielding portion V1 may have, for example, another first protrusion V14 between a pair of first protrusions V14. The other first protrusion V14 and the second protrusion V15 may protrude so that their tips face each other. In this case, as with the second protrusion V15, it is desirable that the protrusion amount of the other first protrusion V14 be specified so that at least a portion of the chip thermistor is exposed.

[0151] Next, a third modification of this embodiment will be described. Fig. 16 shows a sensor 1I of the third modification. The sensor 1I of the third modification is an R-type heat sensor, for example.

[0152] The shielding portion V1 of the sensor 1I has a pair of first protrusions V16 formed integrally with the rear cover 52, similar to the pair of first protrusions V14 of the sensor 1H of Modification 2. The pair of first protrusions V16 protrude from the rear cover 52 toward the front cover 51. The heat detecting element 30 is disposed between the pair of first protrusions V16 in the direction D1 when the opening area 70 is viewed from the external space SP2 side.

[0153] The shielding portion V1 of the sensor 1I further has a pair of second protrusions V17. Like the second protrusions V15 of the sensor 1H of Modification 2, each of the pair of second protrusions V17 is formed integrally with the front cover 51. The pair of second protrusions V17 protrude from the front cover 51 toward the rear cover 52. However, the pair of second protrusions V17 protrude such that their tips face the tips of the pair of first protrusions V16 in a one-to-one relationship. In other words, a gap is provided between each first protrusion V16 and the opposing second protrusion V17.

[0154] The shielding portion V1 of the detector 1I further includes a pillar V18. Like the second pillar V13 of the detector 1G of the first modification, the pillar V18 is formed integrally with the front cover 51 of the housing 5. The heat detecting element 30 is located so as to overlap with the pillar V18 when the opening region 70 is viewed from the external space SP2 side. In other words, the heat detecting element 30 is hidden behind the pillar V18 and is in an invisible position.

[0155] When viewing the opening region 70 from the external space SP2 side, each of the pair of first protrusions V16 and the pillar V18 are disposed at a predetermined distance L4 in the direction D1. Here, as an example, the predetermined distance L4 is also a distance defined so that a test finger cannot be inserted.

[0156] In this way, the sensor 1I is provided with a shielding portion V1 having four protrusions and one pillar, which makes it difficult for heat to flow in from the opening 7, while further reducing the possibility of a person's finger or tool coming into contact with the chip thermistor.

[0157] Although not shown, it is desirable that the shielding portion V1 of the sensor 1I also has a guiding surface V2.

[0158] Next, a fourth modification of this embodiment will be described. Figures 17A and 17B show a sensor 1J of the fourth modification. The sensor 1J of the fourth modification is an R-type heat sensor, for example.

[0159] The shielding portion V1 of the sensor 1J has only one pillar V19. Like the second pillar V13 of the sensor 1G of the first modification, the pillar V19 is formed integrally with the front cover 51 of the housing 5. The heat detection element 30 is located so as to overlap with the pillar V19 when the opening area 70 is viewed from the external space SP2 side. In other words, the heat detection element 30 is hidden behind the pillar V19 and is in an invisible position.

[0160] As shown in Fig. 17B, the pillar V19 has a guide surface V2. Here, the cross section of the pillar V19 cut along the horizontal direction has a tapered shape that points toward the internal space SP1, and this tapered surface corresponds to the guide surface V2. The cross section of the pillar V19 has a semicircular arc shape on both the left and right sides, and these left and right surfaces also correspond to the guide surface V2.

[0161] In this way, even though sensor 1J has only one pillar V19, it is possible to reduce the possibility of a person's finger or tool coming into contact with the chip thermistor while making it difficult for heat to be blocked from the opening 7. If priority is placed on reducing the possibility of a person's finger or tool coming into contact with the chip thermistor, it is desirable that the number of protrusions or pillars on shielding portion V1 be two or more, as in sensors 1F to 1I.

[0162] (Embodiment 3) A detector 1K according to this embodiment will be described below with reference to FIGS. 18A to 18C. Hereinafter, components substantially similar to those of the first embodiment will be assigned common reference numerals and will not be described again. The detector 1K according to this embodiment differs from the detectors (1, 1A to 1E) of the first embodiment (including modifications) in that the outer surface 53 has a tapered first surface 531, as will be described later. The tapered first surface 531 of this embodiment may also be applied to the detectors (1, 1A to 1E) of the first embodiment or the detectors (1F to 1J) of the second embodiment. The detector 1K shown in FIGS. 18A to 18C is an R-type heat detector, for example. Similar to the detector 1C of the third modification of the first embodiment, the detector 1K is a heat detector that does not include a smoke detector 4 and determines the occurrence of a fire or the like by detecting heat alone. Similar to the detector 1H of the second modification of the second embodiment, the detector 1K includes multiple sets of shielding portions V1.

[0163] The opening 7 of the sensor 1K according to this embodiment has an inlet 7B, similar to the sensor 1C (see FIGS. 8A and 8B) and the sensor 1D (see FIGS. 9A and 9B) described in the first embodiment. That is, the opening 7 has the inlet 7B in addition to six side openings (horizontal holes) 7A. The inlet 7B is provided on the outer surface 53 (the underside of the front cover 51) of the housing 5, on the side opposite to the structure X1 to which the sensor 1K is attached. Here, for example, the inlet 7B is provided in the center of the outer surface 53. The inlet 7B penetrates the front cover 51 in its thickness direction. The inlet 7B has a substantially circular opening.

[0164] In the sensor 1K, as shown in FIG. 18B, a portion of the substrate 2 is exposed from the inlet 7B. Specifically, the substrate 2 has a hole 25 penetrating through its center in the thickness direction. The hole 25 has a substantially circular opening. The hole 25 is disposed so as to roughly overlap with the inlet 7B. The substrate 2 has a pair of protrusions 26 protruding toward each other at the opening edge of the hole 25. The tips of the pair of protrusions 26 are exposed from the inlet 7B. A thermal detection element 30 (chip thermistor) is also provided on the upper surface of each of the protrusions 26 of the substrate 2. In short, the sensor 1K has a plurality of thermal detection elements 30 (six in the illustrated example) provided near the side opening (horizontal hole) 7A, as well as two thermal detection elements 30 near the inlet 7B. In addition, the substrate 2 has approximately triangular through holes 31 near each thermal detection element 30 to prevent heat from the thermal detection element 30 from being transmitted through the substrate 2 and causing the temperature of the thermal detection element 30 to drop.

[0165] The opening 7 of the detector 1K has the inlet 7B, and therefore can detect the heat of the gas that flows in from the inlet 7B, thereby improving the response in relation to heat detection.

[0166] Here, the outer surface 53 of the sensor 1K of this embodiment has a first surface 531 around the inlet 7B and a second surface 532 located outside the first surface 531. In particular, as shown in FIG. 18C , the first surface 531 is formed in a tapered shape at an inclination angle different from that of the second surface 532, tapering in a direction (upward) toward the structure X1 as it approaches the inlet 7B. Note that here, as an example, the outer surface 53 further has a third surface 533. The third surface 533 is located outside the first surface 531 and inside the second surface 532. The first surface 531 to the third surface 533 all have a doughnut shape when the outer surface 53 is viewed from the front. Regarding the radial dimensions of the outer surface 53, for example, the second surface 532 is the largest, the third surface 533 is next largest, and the first surface 531 is the smallest, but this is not particularly limited.

[0167] The inclination angle θ1 of first surface 531 with respect to the horizontal plane is, for example, 23°. The inclination angle θ2 of second surface 532 with respect to the horizontal plane is, for example, 0° to 1°. The inclination angle θ3 of third surface 533 with respect to the horizontal plane is, for example, 8°.

[0168] In this way, in detector 1K according to this embodiment, outer surface 53 has first surface 531 and second surface 532, and therefore, in the event of a fire, the inflow of heat into inlet 7B can be further promoted (see the arrow in FIG. 18C). In particular, in detector 1K, outer surface 53, including third surface 533, is inclined in two stages, and therefore, the inflow of heat into inlet 7B can be more effectively promoted.

[0169] Incidentally, this type of detector is required by law to be inspected periodically to check whether it is operating normally (for example, once every six months). As shown in Fig. 19A, an inspection worker 600 uses a predetermined (heating) tester 900 to perform a heating inspection on the thermal detection element 30 of a detector 1K installed on a structure X1 (the ceiling in the illustrated example).

[0170] Tester 900 has a heat source 910 such as a hand warmer, a main body 920 that is roughly cylindrical with an open top and houses heat source 910 inside, and a support rod 930 that supports main body 920. During inspection, main body 920 is positioned so that it covers base 511 and opening 7 of front cover 51 of detector 1K from below. If the heat detection element 30 and the like are normal, detector 1K will receive heat flow from heat source 910 and operate in the same way as when it detects a fire.

[0171] As explained in the first embodiment, the thermal detection element 30 is a chip thermistor mounted on the substrate 2, which allows the sensor (1, 1A to 1K) to be made smaller (particularly thinner) as a whole. However, as the sensor becomes smaller, there is a possibility that the stability of the position of the tester 900 relative to the sensor may be lost during inspection.

[0172] Therefore, the housing 5 of the sensor 1K according to this embodiment has a plurality of (e.g., six) protrusions W1 (see FIGS. 18A and 18B; however, only four are shown in FIG. 18A). The plurality of protrusions W1 protrude from the edge (here, the upper edge) of the opening 7 in a direction (e.g., downward) away from the side of the structure X1 to which the sensor 1K is attached. The plurality of protrusions W1 are arranged at equal intervals along the circumferential direction of the housing 5, for example, when viewed from below.

[0173] The multiple protrusions W1 are configured to come into contact with a peripheral edge 901 (see FIG. 19B ) of a tester 900 for performing a heating inspection of the thermal detection element 30 when the tester 900 is arranged to cover the housing 5. By providing the multiple protrusions W1 in this manner, the tester 900 is stably arranged with respect to the housing 5. That is, the protrusions W1 are more likely to come into point contact with the peripheral edge 901, and rattle can be suppressed compared to when the housing 5 comes into surface contact with the peripheral edge 901 without the protrusions W1.

[0174] Here, the multiple protrusions W1 protrude downward from the periphery of the lower end of the cylindrical body 510. The multiple protrusions W1 are located at the same positions along the circumferential direction of the housing 5 so as to correspond one-to-one with the multiple crosspieces 512. Specifically, each protrusion W1 is formed integrally with a part (upper part) of the corresponding crosspiece 512. In other words, each protrusion W1 also functions as a portion that reinforces the corresponding crosspiece 512. However, each protrusion W1 does not necessarily have the function of reinforcing the crosspiece 512. Each protrusion W1 may be located at a position offset from the crosspiece 512 in the circumferential direction of the housing 5.

[0175] The number of protrusions W1 is not particularly limited and may be, for example, 1. Even if the number of protrusions W1 is 1, the housing 5 can be positioned more stably than when the housing 5 is in surface contact with the peripheral edge 901 of the tester 900.

[0176] FIG. 20 also shows a sensor 1L that is a modification of the third embodiment. The sensor 1L of this modification also has a first surface 531 in which the outer surface 53 is tapered. The sensor 1L is a P-type heat sensor, for example. In particular, like the sensor 1G of the first modification of the second embodiment, the sensor 1L has two sets of shielding portions V1 each having three pillars (a pair of first pillars V12 on the left and right and a second pillar V13 in the middle). In FIG. 20, only one of the two sets of shielding portions V1 is shown, and the shielding portion V1 of the remaining set is located on the back side.

[0177] The sensor 1L also has multiple (e.g., four) protrusions W1 (see FIG. 20; only three are shown) configured to come into contact with the peripheral edge 901 (see FIG. 19B) of the tester 900. At least one of the four protrusions W1 is integrally formed with a portion (upper portion) of the second pillar V13 in the middle of the shielding portion V1 so as to function as a portion that reinforces the second pillar V13. In other words, the four protrusions W1 of the sensor 1L are located at the same positions along the circumferential direction of the housing 5 as the two crosspieces 512 and the two second pillars V13 (including the second pillar V13 of the shielding portion V1 on the opposite side from the illustrated shielding portion V1) so as to correspond one-to-one to each other.

[0178] (Embodiment 4) A detector 1M according to this embodiment will be described below with reference to Figures 21A and 21B. Hereinafter, components substantially similar to those in embodiment 1 will be assigned the same reference numerals and descriptions thereof will be omitted where appropriate. The detector 1M shown in Figures 21A and 21B is an R-type heat detector, as an example. Similar to detector 1C of modification 3 in embodiment 1, detector 1M is a heat detector that does not include a smoke detector 4 and determines the occurrence of a fire or the like by detecting heat only. Detector 1M also includes multiple sets of shielding units V1 each having three pillars.

[0179] The sensor 1M further includes a mounting base 100B for mounting the main body 100A on the structure X1 (the ceiling in the illustrated example). The mounting base 100B may also be applied to the sensors of the first embodiment (1, 1A to 1E), the second embodiment (1F to 1J), or the third embodiment (1K, 1L) as appropriate.

[0180] The mounting base 100B is formed as a flat cylinder with an open bottom. The mounting base 100B is fixed to the surface of the structure X1 by screws or the like. The structure X1 has holes for leading out the electric wires (power supply lines, signal lines, etc.) on the back side thereof. The mounting base 100B has a through-hole 103 (see FIG. 21B) in its bottom 106 for passing the electric wires leading out from the holes in the structure X1 toward the main body 100A.

[0181] The mounting base 100B also has an outer peripheral wall 104 and a flange 105 that protrudes outward from the outer peripheral wall 104. The outer peripheral wall 104 is configured to fit into a recess formed by a cylindrical body 510 and a rear cover 52 (see FIG. 1) on the upper side of the main body 100A. Although a detailed description will be omitted, for example, an engaged portion that engages with an engaging portion of the rear cover 52 is provided on the mounting base 100B when the outer peripheral wall 104 is fitted into the recess of the main body 100A and then rotated clockwise about the axial direction. The main body 100A is fixed to the mounting base 100B by the engaging portion of the rear cover 52 engaging with the engaged portion.

[0182] As shown in FIG. 21A, when the main body 100A is fixed to the mounting base 100B, the outer surface of the flange portion 105 and the outer surface of the cylindrical body 510 are approximately flush with each other, so that the sensor 1M can be provided as a sensor with a good appearance.

[0183] The above-described mounting base 100B is a type of base unit that directly mounts the sensor 1M on the surface of the structure X1. In contrast, as a modification of this embodiment, instead of the mounting base 100B, the sensor 1M may be provided with an embedded base 100C, as shown in Figures 22A and 22B. The embedded base 100C is a type of base unit that embeds the sensor 1M in the structure X1.

[0184] The embedded base 100C has a base body 107 that is inserted into an embedding hole in the structure X1, and a decorative portion 108 that is formed integrally with the base body 107.

[0185] The base body 107 is formed in a flat cylindrical shape with an open bottom. The embedded base 100C also has, for example, a mounting bracket (a first mounting bracket T1 or a second mounting bracket T2 described below) for fixing the embedded base 100C to the structure X1 when inserted into the hole in the structure X1. The base body 107 has a through-hole 110 (see FIG. 22B) in its bottom 109 for passing the electric wires on the back side of the structure X1 toward the main body 100A.

[0186] Base main body 107 has recess 111 with an inner diameter slightly larger than the outer diameter of main body 100A. That is, main body 100A can be accommodated in recess 111. Here, recess 111 has a depth such that approximately half of cylindrical body 510 in the vertical direction can be accommodated within recess 111.

[0187] The decorative portion 108 protrudes outward in a flange-like shape from the lower end of the base body 107. When the base body 107 is inserted into the hole of the structure X1, the decorative portion 108 is located below the surface of the structure X1 and is exposed.

[0188] Although a detailed description will be omitted, for example, when the main body 100A is fitted into the recess 111 of the base main body 107 and rotated clockwise about the axial direction, an engaged portion that engages with the engaging portion of the rear cover 52 is provided on the embedded base 100C. The main body 100A is fixed to the embedded base 100C by the engaging portion of the rear cover 52 engaging with the engaged portion.

[0189] As shown in FIG. 22A, when the main body 100A is fixed to the embedded base 100C, the sensor 1M can be provided as a sensor with a good appearance because the amount of protrusion from the surface of the structure X1 can be reduced.

[0190] Here, a method for attaching the embedded base 100C to the structure X1 using a pair of first mounting brackets T1 will be described with reference to FIG. 23A. The embedded base 100C has a pair of first mounting brackets T1. For ease of explanation, FIG. 23A shows only the structure X1 in cross section. Each first mounting bracket T1 has a fixing screw T11 and a fixing piece T12 in the shape of a partially bent leaf spring. The fixing piece T12 has a threaded hole into which the fixing screw T11 is screwed. The fixing piece T12 is temporarily fixed to the fixing screw T11 on the upper side of the base main body 107, with the fixing screw T11 inserted from below into a through-hole in the bottom 109 of the base main body 107. In other words, the bottom 109 is sandwiched between the flat portion T120 of the fixing piece T12 and the head of the fixing screw T11.

[0191] When attaching the embedded base 100C to the structure X1, first loosen the fixing screws T11 with a tool such as a screwdriver to release the clamped state. In this state, the fixing pieces T12 can tilt inward together with the fixing screws T11 (see the imaginary lines in FIG. 23A ). The fixing pieces T12 are tilted inward, and the base body 107 is inserted into the hole X11 of the structure X1 while maintaining this state. Then, by tightening the fixing screws T11 with a tool such as a screwdriver, the fixing pieces T12 tilt outward, using the flat portions T120 in contact with the base body 107 as a fulcrum, and their tips T121 (point of application) come into contact with the back surface of the structure X1. Further tightening the fixing screws T11 causes the structure X1 to be clamped vertically between the tips T121 of the fixing pieces T12 and the decorative portion 108, thereby fixing the embedded base 100C to the structure X1.

[0192] Next, a method for attaching the embedded base 100C to the structural body X1 using a pair of second mounting brackets T2 will be described with reference to FIG. 23B. The embedded base 100C has a pair of second mounting brackets T2. For ease of explanation, FIG. 23B shows only the structural body X1 in cross section. Each second mounting bracket T2 has a fixing screw T21 and a fixing piece T22 in the shape of a flat, rectangular plate. The fixing piece T22 has a threaded hole into which the fixing screw T21 is screwed. The fixing piece T22 is temporarily fixed to the fixing screw T21 on the upper side of the decorative part 108, with the fixing screw T21 inserted from below into a through hole in the decorative part 108.

[0193] When attaching the embedded base 100C to the structure X1, first loosen each of the fixing screws T21 with a tool such as a screwdriver and rotate them so that the tips of the fixing pieces T22 face inward. While maintaining this state, insert the base body 107 into the hole X11 of the structure X1. Then, tighten each of the fixing screws T21 with a tool such as a screwdriver, so that the tips of the fixing pieces T22 face outward, and the fixing pieces T22 descend toward the back surface of the structure X1, making general surface contact. Then, by further tightening each of the fixing screws T21, the structure X1 is sandwiched between the fixing pieces T22 and the decorative portion 108 in the vertical direction, and as a result, the embedded base 100C is fixed to the structure X1.

[0194] The first mounting bracket T1 and the second mounting bracket T2 described above are merely examples, and the mounting brackets for fixing the embedded base 100C to the structure X1 are not limited to these. Furthermore, the mounting method described above is also merely an example, and is not limited to these.

[0195] (4) Summary As described above, the sensor (1, 1A to 1M) according to the first aspect includes a substrate (2), a heat detection element (30), and a housing (5). The housing (5) houses the substrate (2). The housing (5) has a flow path (6) provided in its internal space (SP1) through which gas flows, and an opening (7) connecting the flow path (6) to an external space (SP2) of the housing (5). The heat detection element (30) is a chip thermistor mounted on the substrate (2) and detects the heat of the gas that flows in through the opening (7). According to the first aspect, because the heat detection element (30) is a chip thermistor mounted on the substrate (2), the entire sensor (1, 1A to 1M) can be made smaller.

[0196] With respect to the sensor (1, 1A to 1M) according to the second aspect, in the first aspect, it is preferable that at least a part of the surface (e.g., the first surface 21) of the substrate (2) is exposed to the flow path (6). According to the second aspect, it is possible to further increase the possibility that the thermal detection element (30) is exposed to the gas flowing through the flow path (6), thereby further improving the heat detection performance and achieving miniaturization.

[0197] With respect to the sensor (1, 1A-1M) according to the third aspect, in the first or second aspect, the chip thermistor is preferably arranged so as to fit within the opening area (70) when the opening area (70) of the opening portion (7) is viewed from the external space (SP2) side. According to the third aspect, the possibility that the heat detection element (30) is exposed to the gas flowing through the flow path (6) can be increased, thereby further improving the heat detection performance and achieving miniaturization.

[0198] With respect to the sensor (1, 1A-1M) according to the fourth aspect, in the third aspect, the chip thermistor is preferably located in the following position. That is, when the opening area (70) is viewed from the external space (SP2) side, the chip thermistor is preferably located within the opening area (70) at the center of the opening area (70) in a direction perpendicular to the surface (e.g., first surface 21) of the substrate (2). According to the fourth aspect, the possibility that the thermal detection element (30) will be exposed to the gas flowing through the flow path (6) can be further increased compared to, for example, when the chip thermistor is located closer to one end of the opening area (70) in the above direction.

[0199] With respect to the sensor (1, 1A-1M) according to the fifth aspect, in any one of the first to fourth aspects, the flow path (6) includes a first path (61) on the side of the opening (7) and a second path (62) connected to the first path (61) and on the side of the center of the internal space (SP1). The chip thermistor is preferably located within the first path (61). According to the fifth aspect, the response to heat detection can be improved compared to, for example, when the chip thermistor is located within the second path (62).

[0200] Regarding the sensor (1, 1A-1M) according to the sixth aspect, in any one of the first to fifth aspects, the flow path (6) includes a first path (61) on the opening (7) side and a second path (62) connected to the first path (61) and on the central side of the internal space (SP1). The cross-sectional area of ​​the opening of the first path (61) is preferably smaller than the cross-sectional area of ​​the opening of the second path (62). According to the sixth aspect, gas that has entered the flow path (6) through the opening (7) can be encouraged to flow from the first path (61) toward the second path (62).

[0201] With respect to the sensor (1, 1A to 1M) according to the seventh aspect, in the sixth aspect, it is preferable that the housing (5) has an installation surface (55) facing the structure (X1) to which the sensor (1, 1A to 1M) is attached. It is preferable that the second path (62) widens in a direction approaching the installation surface (55) from the first path (61) toward the central portion. According to the seventh aspect, it is possible to more effectively generate an airflow from the first path (61) toward the second path (62).

[0202] The detector (1, 1A to 1M) according to the eighth aspect is preferably any one of the first to seventh aspects, further comprising a smoke detector (4) arranged in the center of the internal space (SP1) and configured to detect smoke. According to the eighth aspect, since the detector detects not only heat but also smoke, the detector (1, 1A to 1M) as a whole can be made smaller while improving its fire detection performance.

[0203] With respect to the detector (1, 1A to 1M) according to the ninth aspect, in the eighth aspect, it is preferable that the smoke detection unit (4) is arranged on the same plane as the surface (e.g., first surface 21) of the substrate (2) on which the chip thermistor is mounted. According to the ninth aspect, the detector (1, 1A to 1M) as a whole can be made smaller while further improving fire detection performance.

[0204] Regarding the sensor (1, 1A to 1M) according to the tenth aspect, in the eighth or ninth aspect, it is preferable that the housing (5) has an installation surface (55) facing the structure (X1) to which the sensor (1, 1A to 1M) is attached. The smoke detection unit (4) is preferably disposed on one of the surface (e.g., the first surface 21) and the surface opposite to the surface (e.g., the second surface 22) of the substrate (2), which is closer to the installation surface (55). According to the tenth aspect, it is possible to achieve further miniaturization compared to, for example, a case in which the smoke detection unit (4) is disposed on the surface farther from the installation surface (55).

[0205] With respect to the detector (1, 1A-1M) according to the eleventh aspect, in any one of the eighth to tenth aspects, the housing (5) preferably has one or more walls (control plates 522) in the internal space (SP1). The one or more walls (control plates 522) preferably guide gas to the heat detection element (30) or the smoke detection section (4). According to the eleventh aspect, the fire detection performance can be further improved.

[0206] Regarding the sensor (1, 1A to 1M) according to the twelfth aspect, in any one of the eighth to eleventh aspects, the housing (5) preferably has an installation surface (55) facing the structure (X1) to which the sensor (1, 1A to 1M) is attached. The smoke detection unit (4) has an optical element (41) that emits light, a light-receiving element (42) that receives the light emitted from the optical element (41), and a labyrinth unit (43). Within the labyrinth unit (43), the optical element (41) and the light-receiving element (42) are arranged so as not to face each other. In the thickness direction (vertical direction) of the substrate (2), the center (P1) of the internal space of the labyrinth unit (43) is preferably located between the chip thermistor and the installation surface (55). According to the twelfth aspect, in a detector (1, 1A to 1M) that detects not only heat but also smoke, the fire detection performance can be further improved and the detector (1, 1A to 1M) as a whole can be made smaller.

[0207] With respect to the sensor (1, 1A-1M) according to the thirteenth aspect, in any one of the first to twelfth aspects, the chip thermistor is preferably arranged so as to fit within the opening region (70) of the opening (7) when the opening region (70) is viewed from the external space (SP2) side. The sensor (1, 1A-1M) preferably further includes a shielding portion (V1) that blocks a portion of the opening region (70) on the external space (SP2) side of the chip thermistor. According to the thirteenth aspect, the provision of the shielding portion (V1) makes it difficult to block the inflow of heat from the opening (7) while reducing the possibility of, for example, a person's finger or a tool unintentionally touching the chip thermistor.

[0208] With respect to the sensor (1, 1A-1M) according to the fourteenth aspect, in the thirteenth aspect, it is preferable that the shielding portion (V1) has a guide surface (V2) that guides the airflow from the external space (SP2) toward the chip thermistor. According to the fourteenth aspect, the possibility that the shielding portion (V1) will block the inflow of heat from the opening (7) can be further reduced.

[0209] Regarding the sensor (1, 1A to 1M) according to the fifteenth aspect, in the thirteenth or fourteenth aspect, it is preferable that the housing (5) has a first cover (for example, one of the front cover 51 and the back cover 52) and a second cover (the other). The first cover covers the substrate (2) from one direction in the thickness direction of the substrate (2). The second cover covers the substrate (2) from the direction opposite to the one direction in the thickness direction. It is preferable that the shielding portion (V1) has a first protrusion (V14, V16) protruding from the first cover toward the second cover and a second protrusion (V15, V17) protruding from the second cover toward the first cover. According to the fifteenth aspect, it is possible to further prevent heat from flowing in through the opening (7) while reducing the possibility of a person's finger or a tool coming into contact with the chip thermistor.

[0210] With respect to the sensor (1, 1A-1M) according to the sixteenth aspect, in the fifteenth aspect, it is preferable that the first protrusion (V14) is disposed as follows. That is, when the opening region (70) is viewed from the external space (SP2) side, it is preferable that the first protrusion (V14) is disposed offset from the second protrusion (V15) in a direction perpendicular to the arrangement direction of the first cover and the second cover. According to the sixteenth aspect, it is possible to further reduce the possibility that the shielding portion (V1) will block heat inflow from the opening (7).

[0211] Regarding the sensor (1, 1A to 1M) according to the seventeenth aspect, in the fifteenth aspect, it is preferable that the first protrusion (V16) and the second protrusion (V17) protrude so that their tips face each other. According to the seventeenth aspect, the possibility of a person's finger or a tool coming into contact with the chip thermistor can be further reduced.

[0212] With respect to the sensor (1, 1A-1M) according to the eighteenth aspect, in any one of the fifteenth to seventeenth aspects, at least one of the first protrusions (V14, V16) and the second protrusions (V15, V17) (here, the second protrusion V15) is preferably as follows. That is, when the opening region (70) is viewed from the external space (SP2) side, the at least one is preferably located at the same position as the chip thermistor in a direction perpendicular to the arrangement direction of the first cover and the second cover. Furthermore, when the opening region (70) is viewed from the external space (SP2) side, the protrusion amount of the at least one is preferably specified so that at least a portion of the chip thermistor is exposed. According to the eighteenth aspect, it is possible to further reduce the possibility of a person's finger or tool coming into contact with the chip thermistor while making it difficult for heat to flow in through the opening (7).

[0213] With regard to the sensor (1, 1A to 1M) according to the nineteenth aspect, in any one of the first to eighteenth aspects, it is preferable that the opening (7) has an inlet (7B). The inlet (7B) is provided on the outer surface (53) of the housing (5) on the side opposite to the structure (X1) to which the sensor (1, 1A to 1M) is attached. According to the nineteenth aspect, the heat of the gas flowing in through the inlet (7B) can be detected, thereby improving the responsiveness in heat detection.

[0214] With respect to the sensor (1, 1A to 1M) according to the twentieth aspect, in the 19th aspect, it is preferable that the outer surface (53) has a first surface (531) around the inlet (7B) and a second surface (532) located outside the first surface (531). It is preferable that the first surface (531) is tapered at an inclination angle different from that of the second surface (532) in a direction approaching the inlet (7B) and approaching the structure (X1). According to the 20th aspect, it is possible to further promote heat flow into the inlet (7B).

[0215] With respect to the detector (1, 1A-1M) according to the 21st aspect, in any one of the first to 20th aspects, the housing (5) preferably has one or more protrusions (W1). The one or more protrusions (W1) protrude from the edge of the opening (7) in a direction away from the side of the structure (X1) to which the detector (1, 1A-1M) is attached. The one or more protrusions (W1) are preferably configured to contact a peripheral edge (901) of a tester (900) for performing a heating inspection of the thermal detection element (30) when the tester (900) is arranged to cover the housing (5). According to the 21st aspect, the provision of the protrusions (W1) ensures that the tester (900) is stably arranged relative to the housing (5). That is, the protrusions (W1) are more likely to make point contact with the peripheral edge (901), which can reduce rattling compared to surface contact.

[0216] The configurations according to the second to twelfth aspects are not essential for the sensors (1, 1A to 1E) and can be omitted as appropriate. [Explanation of symbols]

[0217] 1, 1A~1M sensor 2 boards 30 Thermal detection element 4 Smoke detector 41 Optical Elements 42 Photodetector 43 Labyrinth Club 5. Cabinet 51 Front cover (second cover) 52 Back cover (first cover) 53 Outer surface 531 1st surface 532 2nd surface 55 Installation surface 522 Control Panel (Wall) 6 Flow path 61 Route 1 62 2nd road 7 Openings 7B Inlet 70 aperture area P1 center SP1 interior space SP2 External space V1 shielding part V14, V16 1st protrusion V15, V17 2nd protrusion V2 induction surface W1 convex part X1 structure 900 Tester 901 Periphery

Claims

1. A substrate; A thermal detection element; a housing that houses the substrate; Equipped with The housing includes: a flow path provided in the internal space through which a gas flows; an opening that connects the flow path and an external space of the housing; a smoke detection unit disposed in the internal space and configured to detect smoke; and the heat detection element is a chip thermistor mounted on the substrate and configured to detect the heat of the gas flowing in through the opening, the smoke detector is disposed on a plane different from the surface of the substrate on which the chip thermistor is mounted. sensor.

2. A substrate; A thermal detection element; a housing that houses the substrate; Equipped with The housing includes: a flow path provided in the internal space through which a gas flows; an opening that connects the flow path and an external space of the housing; a smoke detection unit disposed in the internal space and configured to detect smoke; and the heat detection element is a chip thermistor mounted on the substrate and configured to detect the heat of the gas flowing in through the opening, The housing has an internal space, and the gas is guided to the heat detection element or the smoke detection unit. having one or more walls leading therethrough; sensor.

3. A substrate; A thermal detection element; a housing that houses the substrate; A sensor comprising: The housing includes: a flow path provided in the internal space through which a gas flows; an opening that connects the flow path and an external space of the housing; a smoke detection unit disposed in the internal space and configured to detect smoke; and the heat detection element is a chip thermistor mounted on the substrate and configured to detect the heat of the gas flowing in through the opening, the housing has an installation surface facing a structure to which the sensor is attached, The smoke detection unit an optical element that emits light; a light receiving element that receives light emitted from the optical element; a labyrinth portion in which the optical element and the light receiving element are arranged so as not to face each other; and the center of the internal space of the labyrinth portion in the thickness direction of the substrate is between the chip thermistor and the installation surface; sensor.

4. A substrate; A thermal detection element; a housing that houses the substrate; A sensor comprising: The housing includes: a flow path provided in the internal space through which a gas flows; an opening that connects the flow path and an external space of the housing; a smoke detection unit disposed in the internal space and configured to detect smoke; and the heat detection element is a chip thermistor mounted on the substrate and configured to detect the heat of the gas flowing in through the opening, the housing has an installation surface facing a structure to which the sensor is attached, the substrate has a first surface facing the installation surface and a second surface opposite to the first surface, the chip thermistor is mounted on the first surface or the second surface, which is a mounting surface of the substrate, the chip thermistor has a rectangular shape when viewed from a direction perpendicular to the mounting surface of the substrate, and has one surface facing the substrate in a thickness direction of the substrate. sensor.

5. the smoke detector is disposed on the same plane as the surface of the substrate on which the chip thermistor is mounted. A sensor according to any one of claims 2 to 4.

6. the housing has an installation surface facing a structure to which the sensor is attached, The smoke detection unit is disposed on a surface of the substrate and a surface opposite to the surface, the surface being closer to the installation surface. A sensor according to any one of claims 1 to 5.

7. An automatic fire alarm system comprising the detector according to any one of claims 1 to 6 and a receiver that communicates with the detector.

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