Tape applicator

Abstract

To provide a tape applicator capable of preventing an adhesive from being peeled off from a sticking surface of a tape.SOLUTION: A tape applicator is provided with a sticking part for pressing and sticking a tape to a surface to be stuck, and an application part for applying an adhesive to the sticking surface of the tape facing the surface to be stuck, and is further provided with a sticking surface processing mechanism for forming irregularities on the sticking surface before the adhesive is applied by the application part.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a tape application device that applies tape to a surface of a workpiece. [Background technology]

[0002] In order to manufacture high-performance fiber-reinforced plastic parts required in industrial fields such as aircraft and automobiles, a tape made of fiber bundles such as carbon fiber impregnated with resin is applied to the surface of the workpiece (plastic part) using a tape application device, thereby improving the strength of the workpiece while preventing it from becoming too heavy.

[0003] Such a tape application device includes a transport unit that transports the tape to be applied to the surface to be applied, an application unit that presses the tape transported from the transport unit onto the surface to be applied, and an applicator unit that applies adhesive to the application surface of the tape facing the surface to be applied. The tape, whose application surface has been coated with adhesive by the applicator unit, is transported by the transport unit to the application unit, and is pressed onto the surface to be applied by the application unit. In this way, the tape is applied to the surface to be applied (for example, see Patent Document 1 below). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-151326 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with the above-mentioned tape application device, when the tape deforms due to expansion or contraction caused by temperature changes, the adhesive cannot follow the deformation of the tape, and the adhesive may peel off from the application surface. When the adhesive peels off from the application surface, the tape peels off from the surface to which it is applied, resulting in a problem of reduced strength of the workpiece.

[0006] The present invention has been made in view of the above problems, and has as its object to provide a tape application device that can prevent adhesive from peeling off from the application surface of the tape. [Means for solving the problem]

[0007] The tape application device of the present invention, which solves the above-mentioned problems, is a tape application device comprising an application unit that presses the tape to apply it to the surface to be applied, and an application unit that applies adhesive to the application surface of the tape facing the surface to be applied, and is characterized in that it further comprises an application surface processing mechanism that forms irregularities on the application surface before the application of the adhesive by the application unit.

[0008] According to the tape application device, by forming irregularities on the application surface of the tape using the application surface processing mechanism, when convex portions are formed on the application surface, the adhesive hardens with the convex portions digging into the adhesive, and when concave portions are formed on the application surface, the adhesive enters the concave portions and hardens, thereby making it possible to strengthen the adhesive strength between the application surface and the adhesive compared to when the application surface is not formed with irregularities, and therefore preventing the adhesive from peeling off from the application surface of the tape.

[0009] The application surface processing mechanism may also have a convexity forming section that inserts short fibers into the application surface to form convexities on the application surface using the short fibers.

[0010] According to this configuration, the short fibers are inserted into the application surface by the protrusion forming section, thereby forming protrusions on the application surface.

[0011] The convex portion forming portion may be configured such that the short fibers are blown onto the attachment surface and then inserted therein.

[0012] According to this configuration, the convex portion forming section can form convex portions on the application surface by blowing short fibers onto the application surface and inserting them into the application surface.

[0013] The adhesive tape may further include a heating section for heating and softening the application surface.

[0014] According to this configuration, the application surface is heated and softened by the heating section, making it easier to form irregularities on the application surface.

[0015] The tape may further include a cooling section positioned so as to sandwich the tape between the heating section and the cooling section, for cooling the back side of the tape to be applied.

[0016] According to this configuration, by cooling the backside of the adhesive surface of the tape with the cooling unit, it is possible to prevent the entire tape from being softened by the heating unit, thereby softening only the adhesive surface where the irregularities are formed.

[0017] The attachment surface processing mechanism may also be configured to have an attachment section that attaches short fibers to the attachment surface, and an ultrasonic application section that is pressed against the attachment surface to which the short fibers have been attached by the attachment section and applies ultrasonic vibrations to the attachment surface.

[0018] According to this configuration, by pressing the ultrasonic application unit against the application surface to which the short fibers have been attached by the attachment unit to apply ultrasonic vibrations to the application surface, the application surface is softened by frictional heat between the application surface and the short fibers, and the short fibers can be inserted into the application surface, thereby forming convex portions made of the short fibers on the application surface.

[0019] The application surface processing mechanism may have a recess forming portion having a protrusion formed on a contact surface that comes into contact with the application surface.

[0020] According to this configuration, by bringing the contact surface of the recess forming portion into contact with the attachment surface, the protrusions can be caused to bite into the attachment surface, thereby forming recesses on the attachment surface.

[0021] The apparatus may further include a heating section for heating the recess forming section.

[0022] According to this configuration, by heating the recess forming portion with the heating section, the protrusions can be caused to bite into the attachment surface while softening the attachment surface, making it easier to form recesses in the attachment surface.

[0023] The short fibers may be carbon fibers.

[0024] According to this configuration, the convex portions are formed on the adhesive surface using carbon fibers that have high rigidity and strength, making the adhesive less likely to peel off from the adhesive surface than when the convex portions are formed on the adhesive surface using other fibers.

[0025] The configuration may also include a surface treatment mechanism for forming irregularities on the surface to be stuck.

[0026] According to this configuration, by forming irregularities on the surface to which the tape is applied using the surface treatment mechanism, if convex portions are formed on the surface to be applied, the adhesive hardens with the convex portions digging into the adhesive, and if concave portions are formed on the surface to be applied, the adhesive enters the concave portions and hardens, so the adhesive strength between the surface to be applied and the adhesive can be made stronger than when no irregularities are formed on the surface to be applied, making the adhesive less likely to peel off from the surface to be applied. As a result, the tape is less likely to peel off from the surface to be applied than when irregularities are formed only on the application surface. [Effects of the Invention]

[0027] According to the tape application device of the present invention, it is possible to prevent the adhesive from peeling off from the applied surface of the tape. [Brief explanation of the drawings]

[0028] [Figure 1] 1 is a diagram showing a tape applying device according to a first embodiment of the present invention; [Figure 2] 5A to 5C are diagrams illustrating the operation of forming convex portions on the tape applying surface and applying adhesive in the tape applying device according to the first embodiment of the present invention. [Figure 3] FIG. 10 is a diagram showing a tape application device according to a second embodiment of the present invention. [Figure 4] 10A and 10B are diagrams illustrating the operation of forming a convex portion on the tape applying surface in the tape applying device according to the second embodiment of the present invention. [Figure 5] FIG. 10 is a diagram showing a tape applying device according to a third embodiment of the present invention. [Figure 6] 10A to 10C are diagrams illustrating the operation of forming a recess on the tape applying surface and applying an adhesive thereto in the tape applying device according to the third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0029] First Embodiment The tape application device of this embodiment will be described with reference to the drawings. In the following description, the three axes of an orthogonal coordinate system are designated as X, Y, and Z, the horizontal direction is referred to as the X-axis direction and the Y-axis direction, and the direction perpendicular to the XY plane (i.e., the vertical direction) is referred to as the Z-axis direction.

[0030] Fig. 1 is a diagram showing a tape application device 100 in a first embodiment of the present invention. Fig. 2 is a diagram illustrating the operation of forming convex portions 22 on the application surface 21 of the tape 2 and applying adhesive 51 to the application surface 21 in the tape application device in the first embodiment of the present invention, where (a) shows a state in which short fibers 71 are being inserted into the application surface 21 by the convex portion forming unit 72, and (b) shows a state in which adhesive 51 is being applied to the application surface 21 by the application unit 5. Arrow A shown in Figs. 2(a) and 2(b) indicates the feed direction of the tape 2.

[0031] 1, the tape application device 100 includes a transport unit 3 that transports the tape 2 to the application surface 11 of the workpiece 1, an application unit 4 that presses the tape 2 against the application surface 11, an applicator unit 5 that applies adhesive 51 to the application surface 21 of the tape 2 that faces the application surface 11, and a work table (not shown) that holds the workpiece 1. The application unit 5 applies adhesive 51 to the application surface 21 of the tape 2 that is transported to the application surface 11 by the transport unit 3, and the application unit 4 presses the tape 2 against the application surface 11 of the workpiece 1 held on the work table, thereby applying the tape 2 to the application surface 11.

[0032] The workpiece 1 is, for example, an injection-molded product made of thermoplastic resin, and the tape 2 is attached to its surface, which is the attachment surface 11. The tape 2 is formed by impregnating a bundle of carbon fibers with thermoplastic resin, and in this embodiment has a strip-like shape. The tape 2 is attached to the attachment surface 11, thereby reinforcing the workpiece 1. The shape of the workpiece 1, the position where the tape 2 is attached, and the length of the attached tape 2 are predetermined by design.

[0033] The adhesive 51 is used to bond the attachment surface 11 and the attachment surface 21. The adhesive 51 is, for example, an epoxy-based, urethane-based, polyester-based, or other thermosetting adhesive, and bonds the attachment surface 11 and the attachment surface 21 by hardening while in contact with each other.

[0034] The transport unit 3 is for transporting the tape 2 to the surface 11 to be stuck. The transport unit 4 has a pair of transport rollers 31 that grip the tape 2 from the sticking surface 21 and its back surface, and the pair of transport rollers 31 are driven to rotate to feed the tape 2 toward the surface 11 to be stuck.

[0035] The application unit 4 is for pressing the tape 2 conveyed by the conveyance unit 3 against the surface 11 to be applied. The application unit 4 has a pressure roller 41 that presses the tape 2 against the surface 11 to be applied, and a roller support unit 42 that supports the pressure roller 41. A drive unit 43 (e.g., an air cylinder) that applies pressure to the pressure roller 41 is provided inside the roller support unit 42, and by operating this drive unit 43, the force with which the pressure roller 41 presses the tape 2 against the surface 11 to be applied can be controlled. The operation of the drive unit 43 is controlled by a control unit (not shown), which is a general-purpose computer device.

[0036] The application unit 4 is attached to the tip of an arm 61 of an articulated robot 6. The articulated robot 6 is a general-purpose industrial robot, and the posture (tilt) of the application unit 4 is controlled by operating the articulated robot 6. The operation of the articulated robot 6 is controlled by the control unit described above.

[0037] The control unit controls the operation of the articulated robot 6 and the drive unit 43 to control the attitude of the joining unit 4 so that the pressure roller 41 presses the surface 11 to be joined from a direction perpendicular to the tangent direction of the surface 11 to be joined (the normal direction), and the magnitude of the force with which the pressure roller 41 presses the tape 2 against the surface 11 to be joined, thereby keeping the pressing state of the pressure roller 41 against the tape 2 constant. The attitude control of the joining unit 4 with respect to the workpiece 1 is performed based on the three-dimensional design data of the workpiece 1 stored in the control unit.

[0038] The applicator 5 is for applying adhesive 51 to the application surface 21 of the tape 2 transported by the transport unit 3. As shown in Figure 2(b), the applicator 5 has a nozzle 52 that dispenses adhesive 51, a tank (not shown) that stores the adhesive 51, a supply path 53 that connects the nozzle 52 to the tank, and a pump (not shown) that sends the adhesive 51. In other words, the adhesive 51 stored in the tank is supplied to the nozzle 52 through the supply path 53 by the pump, and is dispensed from the nozzle 52.

[0039] The nozzle 52 is formed long along the width direction (the Y-axis direction shown in FIG. 2(b)) perpendicular to the transport direction of the tape 2 in the in-plane direction of the tape 2. As shown in FIG. 1, the nozzle 52 is disposed between the transport section 3 and the bonding section 4 in the transport path of the tape 2, at a predetermined distance from the bonding surface 21 so that the longitudinal direction of the nozzle 52 and the width direction of the tape 2 are parallel.

[0040] Nozzle 52 is also composed of discharge port 54 for discharging adhesive 51 and a slit (not shown) that is wide in the width direction and connects supply path 53 and discharge port 54, with discharge port 54 opening to the same length as the slit. Adhesive 51 is supplied to the slit through supply path 53 and discharged from discharge port 54, and applied across the width direction of bonding surface 21.

[0041] Furthermore, a holding section 55 is provided at the position where the tape 2 is sandwiched between the discharge port 54 and the tape 2, which holds the tape 2 from the back side of the application surface 51 by the principle of electrostatic adsorption. That is, with the tape 2 held by the holding section 55, the adhesive 51 is applied to the application surface 51 by the applicator 5. This makes it possible to make the distance between the application surface 51 and the discharge port 54 uniform across the width, and therefore makes it possible to apply the adhesive 51 evenly across the width of the application surface 51.

[0042] The tape application device 100 having the above configuration can apply the tape 2 to the surface 11 to be applied.

[0043] 1 and 2(a), the tape application device 100 further includes a applying surface processing mechanism 7 that forms irregularities on the applying surface 21. The applying surface processing mechanism 7 is disposed upstream of the application unit 5 in the transport path of the tape 2, and forms irregularities on the applying surface 21 before the adhesive 51 is applied by the application unit 5. This makes it possible to strengthen the adhesive strength between the applying surface 21 and the adhesive 51 compared to when irregularities are not formed on the applying surface 21.

[0044] Specifically, when protrusions 22 (see FIG. 2(a)) are formed on the sticking surface 21 by forming irregularities on the sticking surface 21 using the sticking surface processing mechanism 7, the adhesive 51 hardens with the protrusions 22 biting into the adhesive 51 as shown in FIG. 2(b), and when recesses 23 (see FIG. 6(a)) are formed on the sticking surface 21, the adhesive 51 enters the recesses 23 and hardens as shown in FIG. 6(b). This makes it possible to strengthen the adhesive force between the sticking surface 21 and the adhesive 51 compared to when the sticking surface 21 and the adhesive 51 are bonded solely by the adhesive force of the adhesive 51 itself without forming irregularities on the sticking surface 21. This makes it possible to prevent the adhesive 51 from peeling off from the sticking surface 21.

[0045] Here, the application surface processing mechanism 7 in this embodiment has a convex portion forming section 72 that inserts short fibers 71 into the application surface 21 to form convex portions 22 on the application surface 21 by the short fibers 71 .

[0046] The short fibers 71 in this embodiment are carbon fibers having a length of 1 to 2 mm. These short fibers 71 are inserted into the attachment surface 21 formed of a thermoplastic resin by the convex portion forming portion 72, so that convex portions 22 made of the short fibers 71 are formed on the attachment surface 21.

[0047] The convex portion forming portion 72 is formed long in the width direction. As shown in Fig. 1, the convex portion forming portion 72 is disposed upstream of the application portion 5 in the transport path of the tape 2, at a predetermined distance from the application surface 21 so that the longitudinal direction of the convex portion forming portion 72 and the width direction of the tape 2 are parallel.

[0048] The convex portion forming section 72 is composed of an outlet 73 that blows out the short fibers 71, a storage section (not shown) that stores the short fibers 71, and a pressurizing section (not shown) that pressurizes the storage section, and the outlet 73 is open long in the width direction. The storage section is provided inside the convex portion forming section 72 so as to communicate with the outlet 73, and by blowing gas into this storage section by the pressurizing section, the storage section is pressurized and the short fibers 71 stored in the storage section are blown out from the outlet 73 and inserted across the width direction of the application surface 21. As a result, the short fibers 71 are inserted into the application surface 21, and convex portions 22 made of the short fibers 71 are formed on the application surface 21, as shown in Figure 2(a).

[0049] Then, when the convex portions 22 made of short fibers 71 are formed on the attachment surface 21, and adhesive 51 is applied to the attachment surface 21 by the application unit 5 as shown in Figure 2(b), the adhesive 51 hardens with the convex portions 22 biting into the adhesive 51, thereby making it possible to strengthen the adhesive strength between the attachment surface 21 and the adhesive 51 compared to when the convex portions 22 are not formed on the attachment surface 21.

[0050] 2(a), the direction in which the short fibers 71 are inserted into the attachment surface 21 is varied irregularly by the convex portion forming portion 72. As a result, the adhesive 51 hardens with each of the convex portions 22 formed to extend in multiple directions from the attachment surface 21 biting into the adhesive 51, making the adhesive 51 less likely to peel off from the attachment surface 21 than when all of the convex portions 22 are formed to extend in the same direction from the attachment surface 21.

[0051] 1, the tape application device 100 further includes a heating unit 81 that heats and softens the application surface 21. The heating unit 81 is located upstream of the application surface processing mechanism 7 in the transport path of the tape 2, at a predetermined distance from the application surface 21. This heating unit 81 is, for example, an electric heater such as an induction heater or a heat medium heater, and softens the application surface 21, which is made of a thermoplastic resin, by heating the application surface 21. As a result, with the application surface 21 in a softened state, the short fibers 71 can be sprayed onto the application surface 21 by the convex portion forming unit 72, making it easier to insert the short fibers 71 into the application surface 21. This makes it easier to form convex portions 22 on the application surface 21.

[0052] 1, the tape application device 100 further includes a cooling unit 82 that cools the back side of the application surface 21 of the tape 2 (hereinafter referred to as the back side of the tape 2). The cooling unit 82 is arranged so as to sandwich the tape 2 between it and the heating unit 81. The cooling unit 82 is a water-passing roll through which cooling water flows, and by bringing its outer circumferential surface into contact with the back side of the tape 2 to cool the back side of the tape 2, it prevents the entire tape 2 from being softened by the heating unit 81. In this way, the heating unit 81 can soften only the application surface 21 on which the convex portions 22 are formed, thereby preventing sagging of the tape 2 that may occur when the entire tape 2 softens.

[0053] The tape application device 100 is also provided with a receiving surface processing mechanism that forms irregularities on the receiving surface 11. The receiving surface processing mechanism is for forming irregularities on the receiving surface 11. In this embodiment, the receiving surface processing mechanism is composed of a scraping portion (e.g., sandpaper) (not shown) that scrapes the receiving surface 11 and an arm (not shown) that rubs the scraping portion against the receiving surface 11. The arm rubs the scraping portion against the receiving surface 11 to scrape the receiving surface 11, thereby forming recesses (not shown) in the receiving surface 11. As a result, the adhesive 51 penetrates and hardens into the recesses formed in the receiving surface 11, which strengthens the adhesive strength between the receiving surface 11 and the adhesive 51 compared to when irregularities are not formed on the receiving surface 11, making the adhesive 51 less likely to peel off from the receiving surface 11. Therefore, the tape 2 is less likely to peel off from the receiving surface 11 than when irregularities are formed only on the applying surface 21.

[0054] As described above, according to the tape application device 100 of the above embodiment, by forming unevenness on the application surface 21 using the application surface processing mechanism 7, when convex portions 22 are formed on the application surface 21, the adhesive 51 hardens with the convex portions 22 biting into the adhesive 51, and when concave portions 23 are formed on the application surface 21, the adhesive 51 enters the concave portions 23 and hardens, thereby making it possible to strengthen the adhesive force between the application surface 21 and the adhesive 51 compared to when unevenness is not formed on the application surface 21. Therefore, it is possible to prevent the adhesive 51 from peeling off from the application surface 21 of the tape 2.

[0055] Furthermore, in the above embodiment, carbon fibers with high rigidity and strength are used as the short fibers 71 that are inserted into the attachment surface 21 by the convexity forming portion 72 to form the convexities 22, so the short fibers 71 are less likely to break even if deformation occurs in the tape 2. This makes it more difficult for the adhesive 51 to peel off from the attachment surface 21 than when the convexities 22 are formed on the attachment surface 21 using other fibers.

[0056] Second Embodiment Next, a tape application device 100 in a second embodiment of the present invention will be described with reference to Figures 3 and 4. The tape application device 100 in this embodiment differs from the first embodiment in that the application surface processing mechanism 7 has an application unit 74 that applies short fibers 71 to the application surface 21, and an ultrasonic application unit 75 that applies ultrasonic vibrations to the application surface 21. In the following explanation, a detailed explanation of the same points as in the first embodiment will be omitted, and the explanation will focus on the differences.

[0057] Fig. 3 is a diagram showing the tape application device 100 in this embodiment. Fig. 4 is a diagram illustrating the operation of forming convex portions 22 on the application surface 21 in the tape application device 100 in this embodiment, and shows a state in which short fibers 71 are inserted into the application surface 21 by the ultrasonic wave application unit 75. Arrow A in Fig. 4 indicates the transport direction of the tape 2.

[0058] As shown in Figure 3, the application surface processing mechanism 7 in this embodiment has an attachment section 74 that attaches short fibers 71 to the application surface 21, and an ultrasonic application section 75 that is pressed against the application surface 21 to which the short fibers 71 have been attached by the attachment section 74 and applies ultrasonic vibrations to the application surface 21.

[0059] The adhesion section 74 has a configuration similar to that of the convex portion forming section 72 described above, and is configured so that the short fibers 71 accommodated in the accommodation section are blown from the blowout outlet 73 across the width direction of the application surface 21 by pressurizing the accommodation section with the pressurizing section. Here, it is preferable that the pressurizing section in the adhesion section 74 applies a pressure to the accommodation section that is at least sufficient to adhere the short fibers 71 to the application surface 21. In this way, by blowing the short fibers 71 onto the application surface 21 with the adhesion section 74, the short fibers 71 adhere to the application surface 21, as shown in FIG. 4 .

[0060] As shown in Fig. 4, the ultrasonic wave application unit 75 is a roller having a rotation axis parallel to the width direction of the tape 2, and is provided inside the roller with an ultrasonic generator (not shown) having a piezoelectric element for transmitting and applying ultrasonic vibrations to the application surface 21. As shown in Fig. 3, the ultrasonic wave application unit 75 is provided downstream of the attachment unit 74 in the transport path of the tape 2, and applies ultrasonic vibrations to the application surface 21 while being pressed against the application surface 21 to which the short fibers 71 have been attached by the attachment unit 74. This allows the application surface 21 to be softened by frictional heat between the application surface 21 and the short fibers 71, while the short fibers 71 can be inserted into the application surface 21. Therefore, protrusions 22 made of the short fibers 71 can be formed on the application surface 21.

[0061] The tape application device 100 in this embodiment is also provided with an auxiliary roller 78 that sandwiches the tape 2 between itself and the ultrasonic wave application unit 75. The rotation axis of the auxiliary roller 78 is parallel to the rotation axis of the ultrasonic wave application unit 75, and the ultrasonic wave application unit 75 and the auxiliary roller 78 rotate with the tape 2 sandwiched between them. By sandwiching the tape 2 between the ultrasonic wave application unit 75 and the auxiliary roller 78 in this way, the short fibers 71 can be firmly inserted into the application surface 21, making it easier to form the convex portions 22 on the application surface 21.

[0062] Third Embodiment Next, a tape application device 100 in a third embodiment of the present invention will be described with reference to Figures 5 and 6. The tape application device 100 in this embodiment differs from the first and second embodiments in that the application surface processing mechanism 7 has a recess forming section 76 that forms a recess 23 in the application surface 21. In the following explanation, a detailed explanation of the similarities with the first and second embodiments will be omitted, and the explanation will focus on the differences.

[0063] Figure 5 is a diagram showing the tape application device 100 of this embodiment. Figure 6 is a diagram illustrating the operation of forming the recess 23 on the application surface 21 and applying the adhesive 51 to the application surface 21 in the tape application device 100 of this embodiment, where (a) shows the state in which the recess 23 is being formed on the application surface 21 by the recess forming section 76, and (b) shows the state in which the adhesive 51 is being applied to the application surface 21 by the application section 5. Note that arrow A shown in Figures 6(a) and 6(b) indicates the feed direction of the tape 2.

[0064] As shown in Figures 5 and 6, the application surface processing mechanism 7 in this embodiment has a recess forming portion 76 having a convex portion 77 formed on the contact surface that comes into contact with the application surface 21, and by bringing the contact surface (outer peripheral surface) of this recess forming portion 76 into contact with the application surface 21, a recess 23 is formed on the application surface 21.

[0065] Specifically, the recess forming portion 76 is a roller having a rotation axis parallel to the width direction of the tape 2, and has protrusions 77 formed on its outer peripheral surface. The protrusions 77 have a tapered shape whose cross-sectional area decreases with increasing distance from the outer peripheral surface of the recess forming portion 76, and a plurality of protrusions 77 are formed along the axial direction of the recess forming portion 76. The recess forming portion 76 is arranged so that its outer peripheral surface comes into contact with the attachment surface 21, and when the attachment surface 21 comes into contact with the outer peripheral surface of the recess forming portion 76, the protrusions 77 bite into the attachment surface 21, and recesses 23 corresponding to the shape of the protrusions 77 are formed across the width direction of the attachment surface 21.

[0066] Furthermore, the tape application device 100 in this embodiment is provided with an auxiliary roller 78 that sandwiches the tape 2 between itself and the recess forming portion 76. The rotation axis of the auxiliary roller 78 is parallel to the rotation axis of the recess forming portion 76, and the recess forming portion 76 and the auxiliary roller 78 rotate with the tape 2 sandwiched between them. By sandwiching the tape 2 between the recess forming portion 76 and the auxiliary roller 78 in this way, the protrusions 77 can be firmly inserted into the application surface 21, making it easier to form the recesses 23 on the application surface 21.

[0067] 5 and 6, the tape application device 100 of this embodiment further includes a heating unit 79 that heats the recess forming portion 76. The heating unit 79 is, for example, an electric heater or a heat medium heater such as an induction heater, and is configured to heat the outer peripheral surface of the recess forming portion 76. By heating the outer peripheral surface of the recess forming portion 76 with this heating unit 79, the application surface 21 in contact with the outer peripheral surface of the recess forming portion 76 is heated and softened, and the protrusions 77 can be caused to bite into the application surface 21. This makes it easier to form the recesses 23 on the application surface 21.

[0068] Although the embodiments of the present invention have been described above in detail with reference to the drawings, the configurations and combinations thereof in each embodiment are merely examples, and additions, omissions, substitutions, and other modifications of the configurations are possible without departing from the spirit of the present invention. For example, in the above embodiment, the short fibers 71 are carbon fibers, but they may be glass fibers or aramid fibers, or may contain one or more of these carbon fibers, glass fibers, and aramid fibers. Furthermore, the length of the short fibers 71 is not limited to 1 to 2 mm and can be changed as appropriate.

[0069] Furthermore, in the above embodiment, an example has been described in which the tape 2 is pressed against the tape-receiving surface 11 by the pressure roller 41, but the invention is not limited to this, and for example, a pressure shoe or the like may also be used.

[0070] In the first embodiment, the short fibers 71 are inserted into the attachment surface 21 by the convex portion forming portion 72 spraying the short fibers 71 onto the attachment surface 21, but this is not limiting. For example, the short fibers 71 may be inserted into the attachment surface 21 by pressing a stamp holding the short fibers 71 against the attachment surface 21.

[0071] In the second embodiment, the short fibers 71 are adhered to the attachment surface 21 by the adhesion unit 74 spraying the short fibers 71 onto the attachment surface 21, but the invention is not limited to this. For example, the short fibers 71 may be adhered to the attachment surface 21 by pressing a stamp holding the short fibers 71 against the attachment surface 21.

[0072] In the third embodiment, an example in which the recess forming portion 76 is a roller has been described, but this is not limiting. For example, a stamp may be used. Specifically, a protrusion 77 may be provided on the contact surface of the stamp that comes into contact with the attachment surface 21, and the contact surface of the stamp may be pressed against the attachment surface 21 to form a recess in the attachment surface 21.

[0073] Furthermore, in the third embodiment, an example has been described in which the heating unit 79 heats the outer peripheral surface of the recess forming unit 76, but this is not limiting. For example, the joining surface 21 may be heated. In this case, the heating unit 79 is disposed so as to heat the joining surface 21 upstream of the recess forming unit 76 in the transport path of the tape 2. Furthermore, the heating unit 79 may be provided inside the recess forming unit 76, and the recess forming unit 76 may be heated from the inside by the heating unit 79.

[0074] Furthermore, in the above embodiment, an example has been described in which recesses are formed on the receiving surface 11 by the receiving surface processing mechanism, but protrusions may also be formed. [Explanation of symbols]

[0075] 100 Tape application device 1 Work 11. Surface to be attached 2 Tape 21 Attachment surface 22 Convex part 23 Recess 3. Conveyor 31 Conveyor roller 4. Attachment section 41 Pressure roller 42 Roller support part 43 Drive unit 5. Application section 51 Adhesive 52 nozzles 53 Supply route 54 Discharge port 55 Holding part 6 Articulated robots 61 Arm 7. Surface treatment mechanism 71 Short Fiber 72 Convex forming section 73 Air outlet 74 Attachment 75 Ultrasonic wave application unit 76 Recessed portion 77 Convex part 78 Auxiliary part 79 Heating section 81 Heating section 82 Cooling section

Claims

1. an application unit that presses the tape to apply it to a surface; a tape application unit that applies adhesive to an application surface of the tape facing the application surface, A tape applying device further comprising a applying surface processing mechanism for forming irregularities on the applying surface before the applying section applies the adhesive.

2. 2. The tape application device according to claim 1, wherein the application surface processing mechanism has a convexity forming section that inserts short fibers into the application surface to form convexities on the application surface made of the short fibers.

3. 3. The tape application device according to claim 2, wherein the convex portion forming section blows the short fibers onto the application surface and inserts them into the application surface.

4. 4. The tape application device according to claim 1, further comprising a heating section for heating and softening the application surface.

5. 5. The tape application device according to claim 4, further comprising a cooling section positioned so as to sandwich the tape between said heating section and said cooling section, for cooling the back side of said application surface of the tape.

6. The application surface processing mechanism includes an application unit that applies short fibers to the application surface; 2. The tape application device according to claim 1, further comprising an ultrasonic application section that is pressed against the application surface to which the short fibers are applied by the application section to apply ultrasonic vibrations to the application surface.

7. 2. The tape applying device according to claim 1, wherein the applying surface processing mechanism has a recess forming portion having a protrusion formed on a contact surface that comes into contact with the applying surface.

8. 8. The tape application device according to claim 7, further comprising a heating section for heating the recess forming section.

9. 4. The tape application device according to claim 1, wherein the short fibers are carbon fibers.

10. 4. The tape applying device according to claim 1, further comprising a surface treatment mechanism for forming irregularities on the surface to be applied.

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