Resin card medium and method for manufacturing the same

Abstract

To provide a resin card medium capable of laminating a substrate mounted with an electronic component by hot-pressing at a temperature lower than a melting point of a used resin material, and a method for manufacturing the same.SOLUTION: The resin card medium comprises: an electronic substrate mounted with the electronic component; and an upper vegetable fiber-containing resin layer that contains vegetable fibers, has a cavity for accommodating the electronic component, and is laminated on the electronic substrate on a side where the electronic component is mounted. A space is formed between a lateral face of the electronic component and an inner wall face of the cavity.SELECTED DRAWING: Figure 1E

Description

[Technical Field]

[0001] The present invention relates to a resin card medium and a manufacturing method thereof, and more particularly to a resin card medium and a manufacturing method thereof in which an electronic substrate having electronic components mounted thereon is laminated with a plant fiber-containing resin layer containing plant fibers, thereby enabling heat pressing at a temperature lower than the melting point of the resin material used. [Background technology]

[0002] Due to recent demands for higher functionality, more functionality, and improved security, cards are increasingly incorporating substrates equipped with electronic components such as IC (Integrated Circuit) chips as large-capacity variable information recording media, batteries for supplying power, antenna circuits for receiving signals from the outside, displays for displaying information, and sensors for detecting fingerprints, etc. Furthermore, because electronic components come in a variety of shapes, complex irregularities are formed on the surface of the substrate on which the electronic components are mounted.

[0003] As a method for incorporating a substrate carrying electronic components into a card, for example, as described in JP 2005-332304 A (Patent Document 1), a method is known in which a plastic substrate with openings pre-formed in positions that align with the electronic components is laminated onto the substrate carrying the electronic components, and the substrate is heat-pressed at a temperature higher than the melting point of the plastic material to absorb the unevenness of the electronic components, thereby producing a card medium.

[0004] Furthermore, as a method for manufacturing a card medium by absorbing the unevenness of electronic components without providing openings or recesses, a method is known in which, as described in, for example, JP-A-5-229293 (Patent Document 2), a long-fiber reinforced thermosetting resin prepreg in which long fibers are impregnated with a thermosetting resin is laminated onto a substrate carrying electronic components, and then heat-pressed at a mold temperature of 160°C to manufacture a card medium. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-332304 [Patent Document 2] Japanese Patent Application Publication No. 5-229293 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the methods for manufacturing card media described in Patent Documents 1 and 2, the resin materials for impregnation or injection, resin films or resin fibers that are laminated onto the substrate carrying electronic components generally must be resin materials with a melting point of 100°C or higher, such as PET (polyethylene terephthalate) resin, PET-G (glycol-modified polyethylene terephthalate) resin or PVC (polyvinyl chloride) resin. As a result, the heat press also reaches a high temperature that can melt the resin material, causing thermal damage to the electronic components mounted on the substrate, and there are problems such as limitations on the electronic components that can be mounted on the substrate due to their heat resistance temperature.

[0007] Furthermore, a known method for manufacturing a card medium without substantially using a heat press involves preparing a resin film with openings formed in positions that align with the electronic components, and laminating these films with an adhesive to incorporate a substrate carrying the electronic components. However, methods that use an adhesive result in card media that are significantly lower in strength, water resistance, and durability than methods that use a heat press, and also have poor flatness, making them unsuitable for manufacturing high-performance cards equipped with electronic components such as IC chips.

[0008] Furthermore, a method for laminating a substrate equipped with electronic components at low temperatures can be considered, for example, by preparing a molded body made of a resin material that has been heat-pressed at a temperature higher than the melting point of the resin material to memorize (mold) the shape of the substrate equipped with electronic components, and then laminating the molded body onto the substrate equipped with electronic components by heat-pressing the molded body at a temperature near the softening point of the resin material, which is lower than the melting point, using a hot melt adhesive or the like.

[0009] However, when resin materials that do not generally contain plant fibers are heat-pressed at temperatures higher than the melting point, due to the principle of constant volume of resin materials and because plant fibers cannot restrain the flow of molten resin material in any direction other than the pressing direction (thickness direction), the molten or softened resin material contracts and compresses, expanding outward, and in cavities (openings) created in the resin material, expanding inward.

[0010] Therefore, even if an attempt is made to form a molded body having a cavity for accommodating an electronic component by heat-pressing a plant fiber-free resin material at a temperature higher than its melting point, the cavity after heat-pressing becomes irregularly small and unable to accommodate the electronic component, or even if it can be accommodated, a large gap (defect) is formed between the electronic component and the cavity. Also, even if an attempt is made to form a cavity for accommodating the electronic component by incorporating a pseudo-substrate with an electronic component mounted thereon into a plant fiber-free resin material and then heat-pressing it at a temperature higher than the melting point of the resin material, the shrinkage effect of the cavity described above makes it impossible to separate the pseudo-substrate from the resin material after heat-pressing.

[0011] Therefore, the present invention aims to provide a resin card medium and a manufacturing method thereof that can laminate a substrate equipped with electronic components by heat pressing at a temperature lower than the melting point of the resin material used. [Means for solving the problem]

[0012] As a result of extensive research into the structure of a resin card medium having a substrate mounted with electronic components and a method for manufacturing the same, the inventors discovered that if a resin-mixed paper made of plant fibers and resin fibers is heat-pressed, even if the heat-pressing temperature is higher than the melting point of the resin fibers, the resin-mixed paper and the cavities formed in the resin-mixed paper will be maintained in a constant arrangement and shape with almost no change in any direction other than the pressing direction (thickness direction).

[0013] Therefore, by using a resin-mixed paper made of plant fibers and resin fibers, it is possible to form a molded body that maintains the shape and arrangement of cavities that have been pre-formed in the resin-mixed paper to mimic the electronic components on an electronic board, even when the molded body is heat-pressed at a temperature higher than the melting point of the resin fibers.As a result, it was discovered that by heat-pressing the molded body using a hot-melt adhesive or the like at a temperature lower than the melting point of the resin fibers, it is possible to laminate even a board equipped with electronic components that are not highly heat-resistant, and this led to the completion of the present invention.

[0014] That is, according to the present invention, there is provided a method for manufacturing a resin card medium, which includes the steps of: preparing an upper resin-mixed paper made of plant fibers and resin fibers, the upper resin-mixed paper having a cavity with an opening larger than the planar shape of the electronic component at a position where the electronic component will be placed on the electronic board; and forming an upper molded body having a cavity capable of accommodating the electronic component on the electronic board by subjecting the resin-mixed paper to a primary heat press at a temperature above the melting point of the resin fibers.

[0015] Furthermore, the manufacturing method of the present invention may further include a step of setting the formed upper molded body on the electronic substrate on which the electronic components are mounted via a hot melt adhesive, and a step of laminating the upper molded body on the electronic substrate by secondary heat pressing at a temperature below the melting point of the resin fiber.

[0016] In order to achieve the objectives of the resin card medium and its manufacturing method of the present invention more effectively, a plant fiber-containing resin layer containing plant fibers may be laminated on the underside of an electronic board on which electronic components are mounted by hot pressing a lower resin-mixed paper made of plant fibers and resin fibers.

[0017] Therefore, the manufacturing method of the present invention may further include the steps of setting a lower resin-mixed paper made of plant fibers and resin fibers under the upper resin-mixed paper, performing a first heat press on the resin-mixed paper at a temperature above the melting point of the resin fibers, separating the lower molded body from the upper molded body, setting the separated lower molded body under the electronic board via a hot melt adhesive film, and laminating the lower molded body under the electronic board by performing a second heat press on the lower molded body at a temperature below the melting point of the resin fibers.

[0018] In addition, in the manufacturing method of the present invention, a dummy board on which dummy components having the same shape as the electronic components and electronic board to be mounted may be used during the first heat pressing, in order to form cavities more accurately (with high precision) and to prevent the plant fibers in the resin-blended paper from protruding into the cavities.

[0019] That is, according to the present invention, there is provided a method for manufacturing a resin card medium, which includes the steps of: preparing a simulated substrate on which a simulated component is mounted; setting an upper resin-mixed paper made of plant fibers and resin fibers on the simulated substrate, the upper resin-mixed paper having a cavity with an opening larger than the planar shape of the simulated component at a position opposite the simulated component on the simulated substrate; forming an upper molded body onto which the upper surface shape of the simulated substrate (if the simulated substrate has a simulated component mounted on the upper side, the upper surface shape including the simulated component) is transferred by performing a primary heat press on the resin-mixed paper at a temperature above the melting point of the resin fibers; and separating the upper molded body from the simulated substrate.

[0020] In addition, the manufacturing method of the present invention may further include a step of setting the separated upper molded body on an electronic board having an electronic component mounted thereon and having the same shape as the simulated component and simulated board via a hot melt adhesive, and a step of laminating the upper molded body on the electronic board by secondary heat pressing at a temperature below the melting point of the resin fiber.

[0021] In order to achieve the objectives of the resin card medium and its manufacturing method of the present invention more effectively, a plant fiber-containing resin layer containing plant fibers may be laminated on the underside of an electronic board on which electronic components are mounted by hot pressing a lower resin-mixed paper made of plant fibers and resin fibers.

[0022] Therefore, the manufacturing method of the present invention may include the steps of setting a lower resin-mixed paper made of plant fibers and resin fibers under the dummy board, forming a lower molded body onto which the underside shape of the dummy board (if the dummy board has a dummy component attached to the underside, the underside shape including the dummy component) is transferred by first heat-pressing the resin-mixed paper at a temperature above the melting point of the resin fibers, separating the lower molded body from the dummy board, setting the lower molded body under the electronic board via a hot-melt adhesive, and laminating the lower molded body under the electronic board by second heat-pressing at a temperature below the melting point of the resin fibers.

[0023] As a result, the resin card medium obtained by the manufacturing method of the present invention comprises an electronic substrate on which an electronic component is mounted, and an upper plant fiber-containing resin layer that contains plant fibers and has a cavity for accommodating the electronic component, and that is laminated on the side of the electronic substrate on which the electronic component is mounted. The resin card medium is characterized in that a gap is formed between the side of the electronic component and the inner wall surface of the cavity. The upper plant fiber-containing resin layer may also be laminated on the electronic substrate via an upper hot-melt adhesive layer. The upper plant fiber-containing resin layer is formed by hot-pressing a resin-mixed paper made of plant fibers and resin fibers, as described above, using the manufacturing method of the present invention.

[0024] Furthermore, the gap in the planar direction between the side surface of the electronic component and the inner wall surface of the cavity is preferably greater than 0 mm and less than 2.0 mm to facilitate ease of manufacturing during secondary heat pressing and to obtain excellent flatness of the card medium, and since there are no restrictions on the position in the planar direction (thickness direction), the gap greater than 0 mm and less than 2.0 mm may be formed in a horizontal plane of any height (thickness). Furthermore, the resin card medium of the present invention is characterized in that the radius of curvature of the upper edge of the cavity is formed at a substantially right angle, with a radius of curvature of 0.1 mm or less.

[0025] Thus, according to the resin card medium and its manufacturing method of the present invention, even when a resin-mixed paper made of plant fibers and resin fibers is heat-pressed at a temperature higher than the melting point of the resin fibers, it is possible to form a molded product that maintains the shape and arrangement of cavities previously provided in the resin-mixed paper for accommodating electronic components. As a result, even at a temperature lower than the melting point of the resin fibers of the molded product, by using a hot-melt adhesive, it is possible to laminate the molded product onto a substrate mounted with electronic components that do not have high heat resistance, thereby making it possible to manufacture a resin card medium.

[0026] In the manufacturing method of the present invention, the upper resin-mixed paper may be set on the lower resin-mixed paper, the simulated board, or the simulated component via a release film to improve separation from the lower resin-mixed paper, the simulated board, or the simulated component. In the manufacturing method of the present invention, the temperature of the first heat press is preferably 160°C or lower, and the temperature of the second heat press is preferably 90°C or lower. The opening area of ​​the cavity formed in the upper molded body is preferably the same as or larger than the opening area of ​​the corresponding cavity formed in the resin-mixed paper before the first heat press. When the lower molded body also has a cavity for accommodating an electronic component, the opening area of ​​the cavity formed in the lower molded body is preferably the same as or larger than the opening area of ​​the corresponding cavity formed in the resin-mixed paper before the first heat press.

[0027] As a result, the resin card medium obtained by the manufacturing method of the present invention may have a lower plant fiber-containing resin layer containing plant fibers laminated via a lower hot-melt adhesive layer on the electronic substrate on the side opposite to the side on which the upper plant fiber-containing resin is laminated. In this invention, the "upper side" of the electronic substrate on which each layer of the resin-mixed paper or the like is laminated and the opposite "lower side" mean "one side" of the electronic substrate and the opposite "other side," and the electronic substrates may be stacked upside down so that the upper side becomes the "lower side" and the lower side becomes the "upper side." [Effects of the Invention]

[0028] According to the present invention, even when resin-mixed paper made of plant fibers and resin fibers is heat-pressed at a temperature higher than the melting point of the resin fibers, it is possible to form a molded product that maintains the shape and arrangement of cavities previously provided in the resin-mixed paper for accommodating electronic components. Therefore, by using a hot-melt adhesive and heat-pressing at a temperature lower than the melting point of the resin fibers of the molded product, it is possible to laminate the molded product onto a substrate equipped with electronic components that do not have high heat resistance, thereby enabling the production of a resin card medium.

[0029] As a result, according to the present invention, a resin card medium can be obtained that is free from heat damage even for electronic components that are not highly heat-resistant, and that includes an electronic substrate on which an electronic component is mounted, and an upper plant fiber-containing resin layer that contains plant fibers and has a cavity for accommodating the electronic component and is laminated on the electronic substrate on the side on which the electronic component is mounted, with a gap of more than 0 mm and not more than 2.0 mm formed between the side of the electronic component and the inner wall surface of the cavity. The upper plant fiber-containing resin layer may also be laminated on the electronic substrate via an upper hot-melt adhesive layer. [Brief explanation of the drawings]

[0030] [Figure 1A]FIG. 2 is a schematic diagram showing a process before the first heat press in the manufacturing process of a resin card medium according to a first embodiment of the present invention, which does not use a dummy board on which dummy components are mounted. [Figure 1B] 3 is a schematic diagram showing a process after the first heat press and a molded body in the manufacturing process of the resin card medium according to the first embodiment. FIG. [Figure 1C] 3A to 3C are schematic views showing a step of separating an upper molded body from a lower molded body or a step of separating a molded body from a simulation substrate, among the steps of manufacturing a resin card medium according to the first embodiment. [Figure 1D] FIG. 2 is a schematic diagram showing a step before a secondary heat press in the manufacturing process of the resin card medium according to the first embodiment. [Figure 1E] 3 is a schematic diagram showing a process after the secondary heat press and the resin card medium in the manufacturing process of the resin card medium according to the first embodiment. FIG. [Figure 2A] FIG. 10 is a schematic diagram showing the process before the first heat press in the manufacturing process of a resin card medium according to the second embodiment of the present invention, using a dummy substrate mounted with a dummy component according to the second embodiment. [Figure 2B] FIG. 10 is a schematic diagram showing a process after the first heat press and a molded body in the manufacturing process of the resin card medium according to the second embodiment. [Figure 2C] FIG. 10 is a schematic diagram showing a step of separating a molded body from a simulation substrate in the manufacturing process of a resin card medium according to the second embodiment. [Figure 2D] FIG. 10 is a schematic diagram showing a process before the secondary heat press in the manufacturing process of the resin card medium according to the second embodiment. [Figure 2E] FIG. 10 is a schematic diagram showing a process after the secondary heat press and the resin card medium in the manufacturing process of the resin card medium according to the second embodiment. [Figure 3] FIG. 1 is a schematic diagram showing the main dimensions of a test card for checking the state of deformation due to heat pressing. [Figure 4]1 is a photograph showing the state of deformation of a card and a cavity made of PET resin mixed paper before and after hot pressing. [Figure 5] 10 is a photograph showing the deformation state of a card and a cavity made of PET-G resin before and after heat pressing. [Figure 6] 10 is a photograph showing the state of deformation of a card and a cavity made of PVC resin before and after heat pressing. [Figure 7] 1 is a photograph showing the deformation state (radius of curvature) of the upper edge of a cavity in a card made of PET resin-blended paper before and after heat pressing. [Figure 8] 10 is a photograph showing the deformation state (radius of curvature) of the upper edge of the cavity in a card made of PET-G resin before and after heat pressing. [Figure 9] 10 is a photograph showing the deformation state (radius of curvature) of the upper edge of a cavity in a card made of PVC resin before and after heat pressing. [Figure 10] 1 is a schematic diagram showing the deformation state of a card made of PET resin mixed paper before and after hot pressing. FIG. [Figure 11] 1A and 1B are schematic diagrams showing the deformation state of a card made of PET-G resin before and after heat pressing. DETAILED DESCRIPTION OF THE INVENTION

[0031] A resin card medium and a method for manufacturing the same according to one embodiment of the present invention will be described in detail below with reference to the drawings. Note that the present invention is not limited to the examples shown below, and various modifications are possible within the scope of the technical concept of the present invention. [Example]

[0032] <Resin card medium and its manufacturing method> 1. First embodiment In the manufacturing process of the resin card medium 1 according to the first embodiment of the present invention, which does not use a simulated substrate on which simulated components are mounted, Fig. 1A shows a process before the first heat press, Fig. 1B shows a process after the first heat press and the molded bodies 30, 30a, and Fig. 1C shows a process of separating the upper molded body 30 and the lower molded body 30a. In addition, Fig. 1D shows a process before the second heat press in the manufacturing process of the resin card medium 1, and Fig. 1E shows a process after the second heat press and the resin card medium 1.

[0033] As shown in FIG. 1A, in this embodiment, the upper and lower laminates are formed by laminating predetermined films, such as resin-mixed papers 3 and 3a, made of plant fibers and resin fibers. The upper resin-mixed paper (layer) 3 in the upper laminate has a cavity 32, the opening of which is larger than the planar shape of the electronic component 20, at the position where the electronic component 20 will be placed on the electronic substrate 2 (described later). The depth of the cavity 32 decreases in proportion to the compression rate of the press. Therefore, the initial depth can be calculated by dividing the height of the electronic component 20 by the compression rate of the first heat press (described later). For example, in this embodiment, the resin card medium 1 is compressed to approximately two-thirds its original thickness (the thickness of the laminate before the first heat press, FIG. 1A) (FIG. 1B). Therefore, if the height of a given electronic component 20 is d, the depth of the cavity 32 in the upper resin-mixed paper (layer) 3 can be calculated by dividing d by 2 / 3.

[0034] In this way, the shape and size of the cavity 32 provided in the upper resin-mixed paper (layer) 3 of the upper laminate before the first heat press are determined based on the shape and size of the electronic component 20, such as an IC chip or battery, to be mounted on the electronic board 2, so that the planar shape is an opening larger than the planar shape of the electronic component 20, and the depth is the initial depth calculated by dividing the height of the electronic component 20 by the compression rate due to the first heat press.

[0035] On the other hand, the upper resin-mixed paper (layer) 3a in the lower laminate does not have a cavity 32 like the upper laminate, because the lower surface of the electronic board 2, opposite to the upper surface on which the electronic components 20 are mounted, is generally flat with few irregularities. However, if electronic components are mounted on the lower surface of the electronic board 2 and irregularities similar to those on the upper surface occur, a cavity (not shown) similar to that in the upper laminate can be provided in the lower resin-mixed paper (layer) 3a of the lower laminate to absorb or accommodate the irregularities of the electronic components.

[0036] Next, the upper laminate and the lower laminate, which are formed by laminating predetermined films such as the upper resin-mixed paper 3 and the lower resin-mixed paper 3a, respectively, are subjected to a primary heat press from above and below at a predetermined temperature to form the upper molded body 30 and the lower molded body 30a, each having a cavity 32 for accommodating the electronic component 20.

[0037] Specifically, to obtain the upper component (molded body), an upper resin-mixed paper 3 is laminated with a transparent resin film 5 made of PET-G. The upper resin-mixed paper 3 used in this embodiment is a PET resin-mixed paper made of plant fibers and PET resin fibers. In this embodiment, after the first heat press, the height of each electronic component 20 can be accommodated, and three layers are laminated to form a dense upper plant fiber-containing resin layer 31 (see Figures 1B to 1E). In this embodiment, a PET resin-mixed paper (product name "SC-01," thickness 0.2 mm, melting point of PET resin [softening point of PET resin-mixed paper] 130°C, manufactured by Tomoegawa Corporation) is used as the upper resin-mixed paper 3 and the lower resin-mixed paper 3a described below. In addition, a PET-G resin film (product name "Diafix PG-CHI-FG", thickness 0.05 mm, melting point: gradually begins to soften from approximately 60°C, manufactured by Mitsubishi Chemical) was used as the upper resin film 5 and the lower resin film 5a described below.

[0038] Furthermore, in order to accommodate the electronic component 20, a cavity 32 is provided in the upper resin-mixed paper 3 at a position on the electronic board 2 where the electronic component 20 will be placed. The opening of the cavity 32 is made larger than the planar shape of the electronic component 20 so as to form a gap between the electronic component 20 and the cavity 32 that is greater than 0 mm and not greater than 2.0 mm. The reason for this is that the present invention surprisingly found that when a resin-mixed paper made of plant fibers and resin fibers is heat-pressed, the resin-mixed paper and the cavities provided in the resin-mixed paper are maintained in a constant arrangement and shape with almost no change in any direction other than the pressing direction (thickness direction), even if the heat-pressing temperature is higher than the melting point of the resin fibers.

[0039] Furthermore, in the present invention, if the opening of the cavity 32 in the upper resin-mixed paper 3 is made larger than the planar shape of the electronic component 20 in advance, a cavity 32 having an opening of approximately the same size will be formed in the upper molded body 30 (see Figures 1B to 1D) consisting of the upper plant fiber-containing resin layer 31 after the first heat press, so that an electronic board 2 equipped with an electronic component 20 of the same size and shape can be easily incorporated and the second heat press can be performed at a low temperature (see Figures 1D to 1E).

[0040] The gap of greater than 0 mm and equal to or less than 2.0 mm in the planar direction does not necessarily need to be uniformly formed over the entire height direction (thickness direction) between the side surface 200 of the electronic component 20 and the inner wall surface 320 of the cavity 32, but may be formed so as to be offset over all or part of the height direction (thickness direction). In other words, the gap of greater than 0 mm and equal to or less than 2.0 mm in the planar direction only needs to be formed between the side surface 200 of the electronic component 20 and the inner wall surface 320 of the cavity 32 at a certain height (thickness), and there may be a portion where the side surface 200 of the electronic component 20 and the inner wall surface 320 of the cavity 32 are in contact within the same plane.

[0041] Furthermore, since the depth of the cavity 32 in the upper resin-mixed paper 3 decreases in proportion to the compression rate of the press as described above, the initial depth can be determined by dividing the height of the electronic component 20 by the compression rate of the primary heat press. Specifically, in this embodiment, the thickness of the laminate for forming the resin card medium 1 (FIG. 1A) is compressed to about two-thirds of its original thickness by the primary heat press (FIG. 1B), so if the height of a certain electronic component 20 is d, the depth of the cavity 32 provided in the upper resin-mixed paper (layer) 3 can be determined by the value [d÷(2 / 3)].

[0042] In this embodiment, a lower resin-mixed paper 3a and a transparent resin film 5a made of PET-G are laminated below the lower side of the upper resin-mixed paper 3. The lower resin-mixed paper 3a is a PET resin-mixed paper made of plant fibers and PET resin fibers, just like the upper resin-mixed paper 3, and only one layer is laminated below the lower side of the electronic board 2 where the electronic components 20 are to be mounted, because there are few irregularities.

[0043] In this embodiment, unlike the upper side, the lower side of the electronic substrate 2 is not intended to have electronic components that form irregularities (FIG. 1E), and therefore no cavity 32 is provided in the lower resin-mixed paper 3a. However, electronic components may also be mounted on the lower side of the electronic substrate 2. In that case, a cavity for accommodating the electronic components is provided in the lower resin-mixed paper 3a, similar to the upper resin-mixed paper 3. In this embodiment, the lower resin-mixed paper 3a is laminated below the upper resin-mixed paper 3 via a release film 4a. The release film 4a does not necessarily have to be disposed over the entire laminate surface of the lower resin-mixed paper 3a, and lamination of the release film 4a may be omitted if separability from the upper resin-mixed paper 3 after the primary heat press can be ensured. In this embodiment, the release film 4a used is a product named "PACOTHANE (registered trademark) HT1500" manufactured by Pacothane Technologies.

[0044] Other details such as the structure of the laminate including the lower resin-mixed paper 3a and the method of creating a cavity in the lower resin-mixed paper 3a when electronic components are mounted are the same as those described for the structure of the upper laminate, so detailed explanations will be omitted here.

[0045] In the process shown in Figures 1A and 1B, an upper laminate formed by laminating an upper resin-mixed paper (layer) 3 having a cavity 32 and a transparent resin film 5, and a lower laminate formed by laminating a lower resin-mixed paper 3a and a transparent resin film 5a are superimposed on each other and subjected to a primary heat press, thereby forming a cavity 32 capable of accommodating an electronic component 20 on an electronic board 2 and integrating the resin-mixed papers 3, 3a and the transparent resin films 5, 5a.

[0046] The primary heat pressing is carried out at a temperature of 150-160°C and a pressure of 0.8-1.0 MPa. In this embodiment, the melting point of the PET resin (fiber) that makes up the upper and lower resin mixed papers 3, 3a is 118°C, so the upper and lower resin mixed papers 3, 3a are subjected to the primary heat pressing at a temperature equal to or higher than the melting point of the PET resin (fiber), and are compressed (FIG. 1B) to a thickness of about two-thirds of their original thickness (FIG. 1A).

[0047] The upper resin-mixed paper 3 and transparent resin film 5, and the lower resin-mixed paper 3a and transparent resin film 5a, which are integrated by the first heat press, form an upper molded body 30 and a lower molded body 30a, respectively, as shown in Figure 1C, and the upper molded body 30 and the lower molded body 30a are separated.

[0048] At this time, a cavity 32 capable of accommodating the electronic component 20 on the electronic substrate 2 is formed in the upper molded body 30. The cavity 32 formed in the upper resin-mixed paper (layer) 3 changes little in any direction other than the pressing direction (thickness direction) even after the first heat press, and therefore has an opening of the same size and shape as before the first heat press. Therefore, like the cavity 32 before the first heat press, the cavity 32 after the first heat press has a gap of more than 0 mm and not more than 2.0 mm between the inner wall surface 320 of the cavity 32 and the side surface 200 of the electronic component 20 (FIG. 1B), so that the electronic component 20 on the electronic substrate 2 to be laminated can be easily accommodated (FIG. 1C).

[0049] In this embodiment, transparent resin films 5, 5a made of PET-G are laminated on the upper side of the upper resin-mixed paper 3 and the lower side of the lower resin-mixed paper 3a, but this configuration is not limited to this. In the present invention, as long as the resin-mixed paper 3, 3a is used as the material to be laminated on the electronic board 2 on which the electronic components 20 are mounted, there are no limitations on the type of material laminated on the side of the resin-mixed paper 3, 3a opposite to the side that comes into contact with the electronic board 2, the lamination method such as hot press lamination or coating, the number of layers, etc., and films made of resins other than PET-G or two or more resin films may be laminated.

[0050] Next, in this embodiment, as shown in Figure 1D, an electronic board 2 is prepared that is equipped with electronic components 20 that will actually be incorporated into the card medium 1, and an upper molded body 30 and a lower molded body 30a, as well as other laminated films, are laminated on the upper and lower sides thereof via hot melt adhesive, and then a secondary heat press is performed from the upper and lower sides at a predetermined temperature to form the resin card medium 1 (Figure 1E) of the present invention.

[0051] Specifically, an upper molded body 30 is laminated on the upper side of the electronic substrate 2 and electronic component 20 via a hot melt adhesive film 6 so that the cavity 32 is aligned with the electronic component 20, and a printing sheet 7 is laminated on top of that via the hot melt adhesive film 6. Also, a lower molded body 30a is laminated on the lower side of the electronic substrate 2 via a hot melt adhesive film 6a so that the recess of the lower molded body 30a is aligned with the electronic substrate 2, and a printing sheet 7a is laminated below that via the hot melt adhesive film 6a, and then a secondary heat press is performed. In this embodiment, a polyester hot melt adhesive film (product name "Aronmelt (registered trademark) PES070EW0.05", melting point 72°C, manufactured by Toagosei) is used as the hot melt adhesive films 6, 6a. As the printing sheets 7, 7a, a PET-G resin film (product name "Diafix PG-WHI-FG", thickness 0.2 mm, melting point: gradually begins to soften from about 60°C, manufactured by Mitsubishi Chemical) was used.

[0052] If, after the first heat press, for example, a depression occurs in the transparent resin film (layer) 5 covering the cavity 32, impairing the overall flatness of the transparent resin film (layer) 5 of the upper molded body 30, the flatness of the surface (printing layer 7) of the resin card medium 1 after the second heat press can be ensured by using, instead of the PET-G resin film of the printing sheet 7 laminated on the upper molded body 30, another film or sheet made of PET resin, polycarbonate resin, metal, paper, or the like, which has heat resistance, hardness, and flatness that does not easily deform at the bonding temperature (80 to 90°C) of the hot melt adhesive films 6, 6a. Furthermore, in order to ensure the flatness of the back surface (printing layer 7a) of the resin card medium 1, the above-mentioned configuration can also be adopted for the printing sheet 7a of the lower molded body 30a, just as in the case of the printing sheet 7 of the upper molded body 30.

[0053] During the secondary heat pressing, the cavity 32 formed in the upper molded body 30 has a gap between it and the electronic component 20 that is greater than 0 mm and less than 2.0 mm, so that the upper molded body 30 can be easily stacked on the electronic substrate 2 on which the electronic component 20 is mounted (Figure 1D).

[0054] In this embodiment, thermosetting hot melt adhesive films 6, 6a are laminated as the hot melt adhesive, with an emphasis on the smoothness of the card medium 1 and ease of manufacture, but the present invention is not limited to this, and for example, a liquid thermosetting hot melt adhesive, or a two-component curing, ultraviolet curing, or moisture curing hot melt adhesive may be applied. Furthermore, there are no particular limitations on the adhesive temperature of the hot melt adhesive such as the thermosetting hot melt adhesive films 6, 6a used in the present invention, as long as it is a temperature below the melting point of the resin fiber that is the raw material of the molded bodies 30, 30a.

[0055] In addition, in this embodiment, printing sheets 7, 7a made of PET-G are laminated on the upper side of the upper molded body 30 and the lower side of the lower molded body 30a, but the type of material, the lamination method such as lamination by hot press or coating, the number of layers, etc. are not limited to the configuration of this embodiment.

[0056] In this embodiment, the melting point of the PET resin that makes up the upper and lower resin mixed papers 3, 3a is 118°C, so the secondary heat pressing is carried out using hot melt adhesive films 6, 6a that heat cure and bond at temperatures below 118°C, specifically, at a temperature of 80-90°C and a pressure of 0.8-1.0 MPa. Therefore, unlike the primary heat pressing described above, the thicknesses of the upper molded body 30, lower molded body 30a, and printing sheets 7, 7a do not change much before and after the secondary heat pressing, and the shape of the cavity 32 formed in the upper molded body 30 also changes little in the pressing direction (thickness direction) or in any other direction.

[0057] By secondary heat pressing, the integrated upper molded body 30 and printing sheet 7, and the lower molded body 30a and printing sheet 7a form the resin card medium 1 of the present invention as shown in Figure 1E, and the resin card medium 1 contains an electronic board 2 on which electronic components 20 are mounted, and on the side of the electronic board 2 on which the electronic components 20 are mounted, an upper plant fiber-containing resin layer 31 containing plant fibers and a printing layer 7 formed thereon, and on the side of the electronic board 2 opposite the side on which the upper plant fiber-containing resin 31a is laminated, a lower plant fiber-containing resin layer 31a containing plant fibers and a printing layer 7a formed thereon.

[0058] In this embodiment, hot melt layers 6, 6a formed by hardening the hot melt adhesive 6, 6a by secondary heat pressing may be formed on the lower surface of the upper plant fiber-containing resin 31 and the upper surface of the lower plant fiber-containing resin 31a. Hot melt layers 6, 6a may also be formed between the upper plant fiber-containing resin 31 and the printed layer 7 and between the lower plant fiber-containing resin 31 and the printed layer 7a.

[0059] Thus, according to the manufacturing method of the present invention, by using resin-mixed paper 3, 3a made of plant fibers and resin fibers, the cavity 32 formed in the resin-mixed paper 3 maintains the same size and shape in all directions other than the pressing direction (thickness direction), in other words, the same planar shape, in the molded body 30 and the plant fiber-containing resin layer 31 of the resin card medium 1, even after the first heat pressing at a temperature higher than the melting point of the resin fibers of the resin-mixed paper 3, 3a, and after the second heat pressing at a temperature lower than the melting point of the resin fibers.

[0060] Therefore, in the present invention, the upper and lower molded bodies 30, 30a, which are molded to the shape of an electronic component 20 or the like, are subjected to a secondary heat pressing at a low temperature using hot melt adhesives 6, 6a that bond (thermosetting) at a temperature lower than the melting point of the resin fibers, thereby making it possible to manufacture a resin card medium 1 at a low temperature, thereby preventing thermal damage to the electronic component 20 and making it possible to use even electronic components 20 with low heat resistance.

[0061] Furthermore, in the present invention, the opening of the cavity 32, which is larger than the planar shape of the electronic component 20 and is provided to create a gap between the inner wall surface 320 of the cavity 32 and the side surface 200 of the electronic component 20, remains in the plant fiber-containing resin layer 31 after heat pressing with its original shape and size, so that the resin card medium 1 obtained by the manufacturing method of the present invention also has a feature in which a gap is formed between the inner wall surface 320 of the cavity 32 and the side surface 200 of the electronic component 20. Therefore, if a gap of more than 0 mm and not more than 2.0 mm is formed between the inner wall surface 320 of the cavity 32 and the side surface 200 of the electronic component 20 in the resin-mixed paper 3 before the first heat pressing (FIG. 1B), a gap of more than 0 mm and not more than 2.0 mm is also formed between the inner wall surface 320 of the cavity 32 and the side surface 200 of the electronic component 20 in the plant fiber-containing resin layer 31 of the resin card medium 1 after the first heat pressing (FIG. 1E).

[0062] 2. Second embodiment In one embodiment of the present invention, in the manufacturing process of the resin card medium 1, Fig. 2A schematically shows the process before the first heat press, Fig. 2B schematically shows the process after the first heat press and the molded bodies 30, 30a, and Fig. 2C schematically shows the process of separating the molded bodies 30, 30a from the simulated substrates 2a, 20a, etc. Fig. 2D also schematically shows the process before the second heat press in the manufacturing process of the resin card medium 1, and Fig. 2E schematically shows the process after the second heat press and the resin card medium 1.

[0063] As shown in FIG. 2A , in this embodiment, a mock board 2a is prepared that simulates the electronic board 2 that will actually be incorporated into the card medium 1. Each mock component 20a to be mounted on the mock board 2a has the same size and shape as the electronic components 20, such as IC chips and batteries, that will be mounted on the electronic board 2, and is mounted in the same arrangement as the electronic board 2 on the mock board 2a, which has the same size and shape as the electronic board 2. Furthermore, the mock board 2a and mock components 20a are preferably made of a heat-resistant material, such as metal, that can withstand repeated use in a primary heat press at 150 to 300°C. However, in consideration of the ease of manufacturing boards with the same shape and arrangement, the electronic board 2 and electronic components 20 that will actually be incorporated into the card medium 1 may be used as the mock boards 2a and 20a.

[0064] Next, a predetermined film such as resin-mixed paper 3, 3a is laminated on the upper and lower sides of the simulated substrate 2a on which the above-mentioned simulated component 20a is mounted, and a primary heat press is performed from the upper and lower sides at a predetermined temperature to form an upper molded body 30 onto which the upper surface shape of the simulated substrate 2a has been transferred, and a lower molded body 30a onto which the lower surface shape of the simulated substrate 2a has been transferred.

[0065] Specifically, an upper resin-mixed paper 3 is laminated on the upper side of the simulated substrate 2a and simulated component 20a, and a transparent resin film 5 made of PET-G is laminated on top of it. The upper resin-mixed paper 3 used in this embodiment is a PET resin-mixed paper made of plant fibers and PET resin fibers. In this embodiment, after the first heat press, the height of each simulated component 20a can be accommodated, and three layers are laminated so that the matrix can form a dense upper plant fiber-containing resin layer 31 (see Figures 2B to 2E). In this embodiment, PET resin-mixed paper (product name "SC-01", thickness 0.2 mm, melting point of PET resin [softening point of PET resin-mixed paper] 130°C, manufactured by Tomoegawa Corporation) is used as the upper resin-mixed paper 3 and the lower resin-mixed paper 3a described below. In addition, a PET-G resin film (product name "Diafix PG-CHI-FG", thickness 0.05 mm, melting point: gradually begins to soften from approximately 60°C, manufactured by Mitsubishi Chemical) was used as the upper resin film 5 and the lower resin film 5a described below.

[0066] Furthermore, a cavity 32 is provided in the upper resin-mixed paper 3 at a position facing the simulated component 20a on the simulated substrate 2a to accommodate the electronic component 20 by molding the shape of the simulated component 20a. The opening of the cavity 32 is larger than the planar shape of the simulated component 20a so as to form a gap between the simulated component 20a and the cavity 32 that is greater than 0 mm and less than 2.0 mm. The reason for this is that the present inventors have surprisingly found that when a resin-mixed paper made of plant fibers and resin fibers is heat-pressed, the resin-mixed paper and the cavity provided in the resin-mixed paper maintain a constant arrangement and shape with almost no change in any direction other than the pressing direction (thickness direction), even if the heat-pressing temperature is higher than the melting point of the resin fibers.

[0067] Therefore, in the present invention, if one wishes to maintain the shape of the cavity 32 after the first heat press in a direction other than the press direction (thickness direction) of the upper resin-mixed paper 3, it is essentially not necessary to set the dummy component 20a in the cavity 32. However, the upper resin-mixed paper 3 contains insoluble vegetable fibers, and after the first heat press, the vegetable fibers may protrude into the cavity 32 and interfere with the installation of the electronic component 20, which will be described later. Therefore, it is preferable to set a dummy component 20a of approximately the same shape in the cavity 32.

[0068] Furthermore, in the present invention, if the opening of the cavity 32 in the upper resin-mixed paper 3 is made larger than the planar shape of the simulated component 20a, a cavity 32 having an opening of approximately the same size will be formed in the upper molded body 30 (see Figures 2B to 2D) consisting of the upper plant fiber-containing resin layer 31 after the first heat press, so that an electronic board 2 equipped with an electronic component 20 of the same size and shape can be easily incorporated and the second heat press can be performed at a low temperature (see Figures 2D to 2E).

[0069] The gap of greater than 0 mm and equal to or less than 2.0 mm in the planar direction does not necessarily have to be uniformly formed over the entire height direction (thickness direction) between the side surface 200a of the simulated part 20a and the inner wall surface 320 of the cavity 32, but may be formed so as to be offset over all or part of the height direction (thickness direction). In other words, the gap of greater than 0 mm and equal to or less than 2.0 mm in the planar direction only needs to be formed between the side surface 200a of the simulated part 20a and the inner wall surface 320 of the cavity 32 at a certain height (thickness), and there may be a portion in the same plane where the side surface 200a of the simulated part 20a and the inner wall surface 320 of the cavity 32 are in contact with each other.

[0070] Furthermore, the depth of the cavity 32 in the upper resin-mixed paper 3 is preferably such that no gap is formed between the upper part of the dummy board 2a and dummy component 20a and the laminate after the first heat press, but there are no particular limitations on this depth.

[0071] In this embodiment, the upper resin-mixed paper 3 is laminated on the simulated substrate 2a and simulated component 20a via a release film 4. The release film 4 does not necessarily have to be disposed on the entire laminated surface of the upper resin-mixed paper 3, and lamination of the release film 4 may be omitted if separability between the simulated substrate 2a, simulated component 20a, and lower resin-mixed paper 3a after the primary heat press can be ensured.

[0072] In this embodiment, a lower resin-mixed paper 3a is laminated on the underside of the simulated substrate 2a, with a transparent resin film 5a made of PET-G underneath. The lower resin-mixed paper 3a is a PET resin-mixed paper made of plant fibers and PET resin fibers, just like the upper resin-mixed paper 3. Only one layer is laminated on the underside of the simulated substrate 2a because there are few irregularities.

[0073] In this embodiment, unlike the upper side, the lower side of the electronic substrate 2 is not intended to have electronic components 20 that form irregularities (FIG. 2E), and therefore no cavity 32 is provided in the lower resin-mixed paper 3a. However, electronic components may also be mounted on the lower side of the electronic substrate 2. In that case, a cavity for accommodating the electronic components is provided in the lower resin-mixed paper 3a, similar to the upper resin-mixed paper 3. In this embodiment, the lower resin-mixed paper 3a is laminated under the simulated substrate 2a via a release film 4a, but the release film 4a does not necessarily have to be disposed over the entire laminate surface of the lower resin-mixed paper 3a, as is the case with the upper release film 4. In this embodiment, the release films 4, 4a used are those manufactured by Pacothane Technologies under the product name "PACOTHANE (registered trademark) HT1500."

[0074] Other details such as the structure of the laminate including the lower resin-mixed paper 3a, the method of making the dummy board and dummy components that mimic an electronic board when electronic components are mounted, and the method of making a cavity in the lower resin-mixed paper 3a when electronic components are mounted are the same as those explained for the structure of the upper side of the dummy board 2a, so detailed explanations will be omitted here.

[0075] In the process shown in Figures 2A and 2B, an upper laminate consisting of an upper resin-mixed paper 3 having a cavity 32 and a transparent resin film 5, and a lower laminate consisting of a lower resin-mixed paper 3a and a transparent resin film 5a are superimposed on the upper and lower sides of a simulated substrate 2a on which a simulated component 20a is mounted, and a primary heat press is performed to memorize (mold) the shape of the simulated substrate 2a on which the simulated component 20a is mounted, and the resin-mixed papers 3, 3a and the transparent resin films 5, 5a are integrated together.

[0076] The primary heat pressing is performed under conditions of a temperature of 150 to 160°C and a pressure of 0.8 to 1.0 MPa, preferably until there are no voids in the upper and lower laminates except for between the side surface 200a of the simulated part 20a and the inner wall surface 320 of the cavity 32. In this embodiment, the melting point of the PET resin (fiber) that makes up the upper and lower resin-mixed papers 3, 3a is 118°C, so the upper and lower resin-mixed papers 3, 3a are subjected to the primary heat pressing at a temperature equal to or higher than the melting point of the PET resin (fiber) and are compressed to a thickness of approximately two-thirds of their original thickness (FIG. 2A) (FIG. 2B).

[0077] The upper resin-mixed paper 3 and transparent resin film 5, and the lower resin-mixed paper 3a and transparent resin film 5a, which are integrated by the first heat press, form an upper molded body 30 and a lower molded body 30a, respectively, as shown in Figure 2C, and are separated from the simulated board 2a on which the simulated component 20a is mounted.

[0078] At this time, the shape of the simulated substrate 2a with the simulated component 20a attached is transferred (molded) to the upper molded body 30 and the lower molded body 30a. In particular, the cavity 32 formed in the upper resin-mixed paper 3 remains almost unchanged in any direction other than the pressing direction (thickness direction) even after the first heat press, and therefore retains the same size and shape of opening as before the first heat press. Therefore, the cavity 32 after the first heat press maintains a gap of more than 0 mm and not more than 2.0 mm between the inner wall surface 320 of the cavity 32 and the side surface 200a of the simulated component 20a, just like the cavity 32 before the first heat press (FIG. 2B). This allows the upper molded body 30 to be easily removed from the simulated substrate 2a with the simulated component 20a attached (FIG. 2C).

[0079] In this embodiment, transparent resin films 5, 5a made of PET-G are laminated on the upper side of the upper resin-mixed paper 3 and the lower side of the lower resin-mixed paper 3a, but this configuration is not limited to this. In the present invention, as long as the resin-mixed paper 3, 3a is used as the material to be laminated on the simulated board 2a on which the simulated component 20a is mounted, there are no limitations on the type of material laminated on the side of the resin-mixed paper 3, 3a opposite to the side that contacts the simulated board 2a, the lamination method such as hot press lamination or coating, the number of layers, etc., and films made of resins other than PET-G or two or more resin films may be laminated.

[0080] Next, in this embodiment, as shown in Figure 2D, an electronic board 2 is prepared that is equipped with electronic components 20 that will actually be incorporated into the card medium 1, and an upper molded body 30 and a lower molded body 30a, as well as other laminated films, are laminated on the upper and lower sides thereof via hot melt adhesive, and then a secondary heat press is performed from the upper and lower sides at a predetermined temperature to form the resin card medium 1 (Figure 2E) of the present invention.

[0081] Specifically, an upper molded body 30 is laminated on the upper side of the electronic substrate 2 and electronic component 20 via a hot melt adhesive film 6 so that the cavity 32 is aligned with the electronic component 20, and a printing sheet 7 is laminated on top of that via the hot melt adhesive film 6. Also, a lower molded body 30a is laminated on the lower side of the electronic substrate 2 via a hot melt adhesive film 6a so that the recess of the lower molded body 30a is aligned with the electronic substrate 2, and a printing sheet 7a is laminated below that via the hot melt adhesive film 6a, and then a secondary heat press is performed. In this embodiment, a polyester hot melt adhesive film (product name "Aronmelt (registered trademark) PES070EW0.05", melting point 72°C, manufactured by Toagosei) is used as the hot melt adhesive films 6, 6a. As the printing sheets 7, 7a, a PET-G resin film (product name "Diafix PG-WHI-FG", thickness 0.2 mm, melting point: gradually begins to soften from about 60°C, manufactured by Mitsubishi Chemical) was used.

[0082] If, after the first heat press, for example, a depression occurs in the transparent resin film (layer) 5 covering the cavity 32, impairing the overall flatness of the transparent resin film (layer) 5 of the upper molded body 30, the flatness of the surface (printing layer 7) of the resin card medium 1 after the second heat press can be ensured by using, instead of the PET-G resin film of the printing sheet 7 laminated on the upper molded body 30, another film or sheet made of PET resin, polycarbonate resin, metal, paper, or the like, which has heat resistance, hardness, and flatness that does not easily deform at the bonding temperature (80 to 90°C) of the hot melt adhesive films 6, 6a. Furthermore, in order to ensure the flatness of the back surface (printing layer 7a) of the resin card medium 1, the above-mentioned configuration can also be adopted for the printing sheet 7a of the lower molded body 30a, just as in the case of the printing sheet 7 of the upper molded body 30.

[0083] During the second heat press, the cavity 32 formed in the upper molded body 30 maintains a gap of more than 0 mm and less than 2.0 mm between it and the electronic component 20, which has the same shape and size as the simulated component 20a, so that the upper molded body 30 can be easily stacked on the electronic substrate 2 on which the electronic component 20 is mounted (Figure 2D).

[0084] In this embodiment, thermosetting hot melt adhesive films 6, 6a are laminated as the hot melt adhesive, with an emphasis on the smoothness of the card medium 1 and ease of manufacture, but the present invention is not limited to this, and for example, a liquid thermosetting hot melt adhesive, or a two-component curing, ultraviolet curing, or moisture curing hot melt adhesive may be applied. Furthermore, there are no particular limitations on the adhesive temperature of the hot melt adhesive such as the thermosetting hot melt adhesive films 6, 6a used in the present invention, as long as it is a temperature below the melting point of the resin fiber that is the raw material of the molded bodies 30, 30a.

[0085] In addition, in this embodiment, printing sheets 7, 7a made of PET-G are laminated on the upper side of the upper molded body 30 and the lower side of the lower molded body 30a, but the type of material, the lamination method such as lamination by hot press or coating, the number of layers, etc. are not limited to the configuration of this embodiment.

[0086] In this embodiment, the melting point of the PET resin that makes up the upper and lower resin mixed papers 3, 3a is 118°C, so the secondary heat pressing is carried out using hot melt adhesive films 6, 6a that heat cure and bond at temperatures below 118°C, specifically, at a temperature of 80-90°C and a pressure of 0.8-1.0 MPa. Therefore, unlike the primary heat pressing described above, the thicknesses of the upper molded body 30, lower molded body 30a, and printing sheets 7, 7a do not change much before and after the secondary heat pressing, and the shape of the cavity 32 formed in the upper molded body 30 also changes little in the pressing direction (thickness direction) or in any other direction.

[0087] By secondary heat pressing, the integrated upper molded body 30 and printing sheet 7, and the lower molded body 30a and printing sheet 7a form the resin card medium 1 of the present invention as shown in Figure 2E, and the resin card medium 1 includes an electronic board 2 on which electronic components 20 are mounted, and on the side of the electronic board 2 on which the electronic components 20 are mounted, an upper plant fiber-containing resin layer 31 containing plant fibers and a printing layer 7 formed thereon, and on the electronic board 2a on the side opposite to the side on which the upper plant fiber-containing resin 31a is laminated, a lower plant fiber-containing resin layer 31a containing plant fibers and a printing layer 7a formed thereon.

[0088] In this embodiment, hot melt layers 6, 6a formed by hardening the hot melt adhesive 6, 6a by secondary heat pressing may be formed on the lower surface of the upper plant fiber-containing resin 31 and the upper surface of the lower plant fiber-containing resin 31a. Hot melt layers 6, 6a may also be formed between the upper plant fiber-containing resin 31 and the printed layer 7 and between the lower plant fiber-containing resin 31 and the printed layer 7a.

[0089] Thus, according to the manufacturing method of the present invention, by using resin-mixed paper 3, 3a made of plant fibers and resin fibers, the cavity 32 formed in the resin-mixed paper 3 maintains the same size and shape in all directions other than the pressing direction (thickness direction), in other words, the same planar shape, in the molded body 30 and the plant fiber-containing resin layer 31 of the resin card medium 1, even after the first heat pressing at a temperature higher than the melting point of the resin fibers of the resin-mixed paper 3, 3a, and after the second heat pressing at a temperature lower than the melting point of the resin fibers.

[0090] Therefore, in the present invention, the upper and lower molded bodies 30, 30a onto which the shape of the electronic component 20 or the like has been transferred (molded) are subjected to a secondary heat pressing at a low temperature using hot melt adhesive 6, 6a which bonds (thermosetting) at a temperature lower than the melting point of the resin fiber, thereby making it possible to manufacture the resin card medium 1 at a low temperature, thereby preventing thermal damage to the electronic component 20 and enabling the use of even electronic components 20 with low heat resistance.

[0091] Furthermore, in the present invention, the gap between the inner wall surface 320 of the cavity 32 provided in the resin-mixed paper 3 and the side surface 200a of the dummy component 20a remains intact in the plant fiber-containing resin layer 31 after heat pressing, so the resin card medium 1 obtained by the manufacturing method of the present invention also has a feature in which a gap is formed between the inner wall surface 320 of the cavity 32 and the side surface 200 of the electronic component 20. Therefore, when a gap of more than 0 mm and not more than 2.0 mm is provided between the inner wall surface 320 of the cavity 32 and the side surface 200a of the dummy component 20a in the resin-mixed paper 3 (FIG. 2B), a gap of more than 0 mm and not more than 2.0 mm is also formed in the plant fiber-containing resin layer 31 of the resin card medium 1 between the inner wall surface 320 of the cavity 32 and the side surface 200 of the electronic component 20 (FIG. 2E).

[0092] <Resin-blended paper> Resin-mixed paper (which forms a "plant fiber-containing resin layer" after molding) is preferred because it can absorb the unevenness of the electronic board caused by electronic components, etc., thereby achieving excellent flatness and smoothness of the resin card medium. Examples of plant fibers that can be used in resin-blended paper include chemical pulps such as high-yield unbleached softwood kraft pulp (HNKP; N wood), bleached softwood kraft pulp (NBKP; N wood, NB wood), unbleached hardwood kraft pulp (LUKP; L wood), and bleached hardwood kraft pulp (LBKP, L wood); mechanical pulps such as ground wood pulp (GP), pressurized ground wood pulp (PGW), and thermomechanical pulp (TMP); wood pulps such as deinking pulp (DIP) and waste pulp (WP), and semi-chemical pulp (CP); and non-wood pulps such as cotton, straw, bamboo, esparto, kenaf, cotton, Manila hemp (bagasse), flax, hemp, jute, and gampi.

[0093] These plant fibers may be used singly or in combination of two or more. Among these, NBKP, hemp, and Manila hemp pulp are preferred because pulp with an appropriate fiber length is available and strong paper can be easily produced, and NBKP is particularly preferred because it has high whiteness and is easily available.

[0094] In addition, in the present invention, resin materials suitable for the resin fibers blended into the resin-blended paper described above include polyvinyl chloride (PVC), polyethylene terephthalate (PET), polyethylene terephthalate copolymer (PET-G), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), etc. In particular, it is preferable to use PET resin as the resin material for the resin fibers blended into the resin-blended paper, because it is easy to mold and process when mixed with plant fibers.

[0095] <Resin film> Suitable resin materials for resin films, such as transparent resin films and printing sheets (which form a "printing layer" after molding), used to improve the flatness and smoothness of card surfaces as well as printability, gloss, and scratch resistance, include polyvinyl chloride (PVC), polyethylene terephthalate (PET), polyethylene terephthalate copolymer (PET-G), polycarbonate (PC), and acrylonitrile butadiene styrene (ABS).

[0096] <Hot melt adhesive> The hot melt adhesive used in the present invention is not particularly limited as long as it melts and bonds at a temperature below the melting point of the resin fibers contained in the resin-blended paper used in combination, the transparent resin film such as PVC or PET-G used in the middle layer, and the plastic sheet such as PVC or PET-G used in the outermost layer. Therefore, the hot melt adhesive can contain a resin that melts or softens when heated to develop adhesive properties, such as vinyl resins such as polyvinyl acetate, polyvinyl butyral (PVB), ethylene-vinyl acetate copolymer, and vinyl chloride-vinyl acetate copolymer, polyolefin resins such as polyethylene (PE) and polypropylene (PP), polyester resins such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), polyamide resins, polyimide resins, (meth)acrylic resins such as polyacrylate, polymethacrylate, and polymethyl methacrylate, cellulose resins such as cellulose diastase, and polyurethane resins.

[0097] <Release film> The release film used in the present invention may be a resin film made of polyester resins such as PET, PBT, PEN, 1,4-polycyclohexylene dimethylene terephthalate, and terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer; polyamide resins such as nylon 6 and nylon 6,6; polyolefin resins such as PE, PP, and polymethylpentene; polyvinyl chloride, polyvinyl alcohol (PVA), (meth)acrylic resins; polyimide resins such as polyimide and polyetherimide; cellulose resins such as cellophane, cellulose acetate, nitrocellulose, cellulose acetate propionate (CAP), and cellulose acetate butyrate (CAB); polystyrene resins such as polystyrene; polycarbonate resins; and ionomer resins.

[0098] <Characteristics testing of resin-blended paper, etc.> 1. Preparation of test cards Figure 3 shows the main dimensions of a test card 8 for checking the state of deformation due to heat pressing. To examine the characteristics of the test card 8, such as changes in shape before and after heat pressing, resin cards 8 of Test Examples 1 to 3 described below were produced.

[0099] <Test Example 1> Three sheets of 0.3 mm thick PET resin-blended paper (product name "SC-01," manufactured by Tomoegawa Corporation; melting point of PET resin [softening point of PET resin-blended paper] 130°C) composed of copolymer polyester resin (PET resin) fiber and plant fiber were laminated and cut into a 90.5 mm x 140.5 mm rectangle. The laminate was softened by heating to 120°C in a heat press and pre-laminated by applying a pressure of 0.7 MPa for 5 minutes. Four 4 mm x 12 mm long holes (cavities 32) were punched at the predetermined positions shown in Figure 3 to prepare the laminate. The laminate was then heated to 150°C in a heat press to melt the paper, applied a pressure of 0.8 MPa for 8 minutes, and cooled to room temperature while maintaining the pressure of 0.8 MPa. This produced Card 8 for Test Example 1.

[0100] <Test Example 2> One sheet of 0.36 mm thick PET-G resin film (product name "PG-700" manufactured by Taihei Chemical Industry Co., Ltd.) made of polyethylene terephthalate copolymer and two sheets of 0.125 mm thick white PET-G resin film (product name "Diafix PG-WHI-FG" manufactured by Mitsubishi Chemical Co., Ltd., melting point: gradually begins to soften from approximately 60°C) were laminated and cut into a rectangle measuring 90.5 mm long x 140.5 mm wide. For collation, the heat-press laminate was heated to 90°C in a heat press to soften it, and pre-laminated by pressing it to a pressure of 0.7 MPa and holding it for 5 minutes. Four elongated holes (cavities 32) measuring 4 mm long x 12 mm wide were then punched in the designated locations shown in Figure 3 to prepare a heat-press laminate. Next, the mixture was heated to 130°C in a heat press to melt it, pressurized to a pressure of 0.8 MPa and held for 8 minutes, and then cooled to room temperature while maintaining the pressure of 0.8 MPa to produce Card 8 of Test Example 2.

[0101] <Test Example 3> One sheet of a 0.36 mm thick PVC resin film made of polyvinyl chloride (product name "RCC3M," melting point 140°C, manufactured by CPPC) and one sheet of a 0.28 mm thick PVC resin film made of polyvinyl chloride (product name "RCC3M," melting point 140°C, manufactured by CPPC) were laminated together and cut into a rectangle measuring 90.5 mm long x 140.5 mm wide. For collation, the heat-press laminate was softened by heating to 90°C in a heat press, pressurized at 0.7 MPa and held for 5 minutes to form a pre-laminated laminate. Four 4 mm long x 12 mm wide slots (cavities 32) were punched in the predetermined locations shown in Figure 3 to prepare a heat-press laminate. The laminate was then heated to 150°C in a heat press to melt it, pressurized at 0.8 MPa and held for 8 minutes, and then cooled to room temperature while maintaining the 0.8 MPa pressure, thereby producing Card 8 of Test Example 3.

[0102] 2. Measurement of test card characteristics FIG. 4 shows photographs of the card 8 made of PET resin mixed paper of Test Example 1 according to the present invention and the deformation state of the slot (cavity 32) before and after hot pressing, as well as the area (mm 2 ) are shown. In Fig. 5, photographs are shown of the card 8 made of PET-G resin in Test Example 2 according to the comparative example, and the deformation state of the slot (cavity 32) before and after hot pressing, as well as the area (mm 2 ) are shown, and FIG. 6 shows photographs of the card 8 using PVC resin and the deformation state of the slot (cavity 32) before and after hot pressing in Test Example 3, as well as the area (mm 2 ) is shown.

[0103] The outer dimensions (mm) and the distance (mm) between the opposing slots of cards 8 of test examples 1 to 3 before and after the heat press shown in Figure 3 were measured using a projector (product name "V-12B", manufactured by Nikon Solutions). Also, the area (mm) of each slot of cards of test examples 1 to 3 before and after the heat press shown in Figures 4 to 6 was measured. 2 The measurement results of the outer dimensions (mm) and the distance (mm) between opposing slots of cards 8 of test examples 1 to 3 before and after the heat press are shown in Table 1 below. The area (mm) of each slot (cavity) of cards 8 of test examples 1 to 3 before and after the heat press are also shown in Table 1. 2 The measurement results are shown in Table 2 below.

[0104] [Table 1]

[0105] [Table 2]

[0106] From Table 1, it can be seen that, in the case of card 8 of test example 1 according to the present invention, the outer shape of card 8 and the relative positional relationship between opposing elongated holes (cavities 32) formed within card 8 do not change substantially before and after heat pressing, whereas, in the case of cards 8 of test examples 2 and 3 according to the comparative examples, the outer shape of card 8 expands outward after heat pressing compared to before heat pressing, and the relative positions of opposing elongated holes formed within card 8 either do not change much or shrink slightly and become shorter.

[0107] Furthermore, it was found from Table 2 that the (opening) area of ​​each slot provided in card 8 of Test Example 1 according to the present invention was the same before and after heat pressing, or that after heat pressing it deformed, even if only slightly, in an expanding direction compared to before heat pressing, and at least did not deform in a contracting direction. On the other hand, it was found that the (opening) area of ​​each slot provided in card 8 of Test Examples 2 and 3 according to the comparative examples deformed, even if slightly, in a contracting direction compared to before heat pressing, and at least did not deform in an expanding direction.

[0108] Next, the deformation state (radius of curvature R) of the upper edge of the long hole (cavity 32) in the card 8 of test examples 1 to 3 before and after the heat pressing shown in Figures 4 to 6 was measured using a 3D shape measuring machine (product name "VR-5000", manufactured by Keyence).

[0109] Fig. 7 shows photographs illustrating the deformation (radius of curvature R) of the upper edge of a slot (cavity 32) in card 8 made with PET resin-blended paper of Test Example 1 according to the present invention before and after hot pressing. Fig. 7 shows photographs illustrating the deformation (radius of curvature R) of the upper edge of a slot (cavity 32) in card 8 made with PET-G resin of Test Example 2 according to the comparative example before and after hot pressing. Fig. 9 shows photographs illustrating the deformation (radius of curvature R) of the upper edge of a slot (cavity 32) in card 8 made with PVC resin of Test Example 3 according to the comparative example before and after hot pressing. Note that the X, Y, and Z axes in the photographs in Figs. 7 to 9 represent scales (mm), and the shading represents the scale (mm) in the thickness (Z-axis) direction.

[0110] 7, it was found that the shape of the upper edge 321 of the slot (cavity 32) provided in the card 8 of Test Example 1 according to the present invention did not change substantially before and after the heat pressing. That is, the upper edge 321 of the slot (cavity 32) in the card 8 of Test Example 1 forms a sharp corner formed by the surface of the card 8 and the inner wall surface of the slot (cavity 32) intersecting at a substantially right angle, and it was found that even after the heat pressing, the shape of the corner before the pressing was maintained so that the radius of curvature R of the upper edge 321 of the slot (cavity 32) was 0.1 mm or less.

[0111] On the other hand, as shown in Figures 8 and 9, in the cards 8 of test examples 2 and 3 relating to the comparative examples, after heat pressing, the corners of the upper edge 321 of the elongated hole (cavity 32) formed in the card 8 were rounded so that it had a larger R compared to before heat pressing, and the radius of curvature R of the upper edge 321 of the elongated hole (cavity 32) was rounded to 0.6 mm in the case of card 8 using PET-G resin in test example 2, and 0.2 mm in the case of card 8 using PVC resin in test example 3.

[0112] As described above, the mechanism by which only card 8 in Test Example 1, which uses PET resin-blended paper, behaves differently before and after heat pressing than card 8 in Test Examples 2 and 3, which use common resins such as PET and PVC, is not entirely clear.

[0113] However, in the case of card 8 in test example 1, which uses PET resin-blended paper, there are gaps between the plant fibers and the resin fibers, so when the resin-blended paper is heat-pressed at a temperature above the melting point of the resin fibers, the molten or softened resin fibers enter the gaps between the unmelted plant fibers, and the paper is compressed with almost no change in shape in any direction other than the press direction (thickness direction). On the other hand, in the case of card 8 in test examples 2 and 3, which does not contain plant fibers, when the card is heat-pressed at a temperature above the melting point of the resin material, due to the principle of constant volume of the resin material and the inability of the plant fibers to restrain the flow of the molten resin material in any direction other than the press direction (thickness direction), the molten or softened resin material expands outward, and in the long holes (cavities 32) made in the resin material, the resin material contracts and expands inward, which is presumably the main cause of compression.

[0114] Figure 10 shows a schematic diagram of the deformation state of a card made of PET resin mixed paper before and after heat pressing, and Figure 11 shows a schematic diagram of the deformation state of a card made of PET-G resin before and after heat pressing.

[0115] As shown in Figure 10, when a card is made using PET resin mixed paper 3, 3a as in Test Example 1 of the present invention, the PET resin mixed paper 3, 3a can be compressed with almost no change in shape in any direction other than the press direction (thickness direction) because the melted or softened resin fibers penetrate into the gaps between the unmelted plant fibers.

[0116] Therefore, if a cavity 32 of the same planar shape and size as the electronic component 20 is formed using PET resin mixed paper 3, 3a, after the plant fiber-containing resin layer 31, 31a is formed by heat pressing at a temperature above the melting point of the resin fiber, the electronic component 20 will fit tightly into the cavity 32 of the same planar shape and size and will not be able to be separated from the cavity 32, so it will be thermally damaged or it will be impossible to separate the electronic component 32 and make a mold.

[0117] However, as in the present invention, if a cavity 32 having a planar shape larger than the electronic component 20 is formed using PET resin-blended paper 3, 3a so that a gap is formed between the electronic component 20 and the cavity 32, the same size gap is maintained between the electronic component 20 and the cavity 32 even after the plant fiber-containing resin layer 31, 31a is formed by heat pressing at a temperature equal to or higher than the melting point of the resin fiber, making it possible to easily separate the electronic component 20 from the cavity 32. Therefore, in the present invention, the plant fiber-containing resin layer 31, 31a molded into the shape of the electronic component 20 or the electronic board 2 is heat-pressed at a low temperature using a hot-melt adhesive that bonds (thermosetting) at a temperature lower than the melting point of the resin fiber, thereby enabling the production of cards at a low temperature, preventing thermal damage to the electronic component 20 and enabling the use of electronic components 20 with low heat resistance.

[0118] 11 , when a card is fabricated using a general resin film 9 such as PET-G resin, as in Test Example 2 of the comparative example, even if cavity 32 having a planar shape larger than electronic component 20 is provided so as to form a gap between electronic component 20 and cavity 32, after heat-pressing at a temperature above the melting point of the resin material to form resin layer 90, due to the principle of constant volume of the resin material and the lack of constraint on the flow of the molten resin material in any direction other than the pressing direction (thickness direction), the resin contracts and expands inward. Electronic component 20 is tightly fitted into cavity 32, with upper edge 321 sagging inward with a large R, and cannot be separated from cavity 32. This results in heat damage, or it becomes impossible to separate electronic component 20 for mold formation. Therefore, when fabricating a card using a general resin film 9, it is also impossible to fabricate a resin molded body to which the shape of electronic component 20 or the like is precisely transferred (molded) or a shape slightly larger than the shape of electronic component 20 or the like, and then heat-press it at a low temperature using a hot-melt adhesive. [Explanation of symbols]

[0119] 1. Card media 2. Electronic board 20. Electronic Components 200...Side 2a...Mock board 20a····Dummy parts 200a···Side 3. Upper resin-mixed paper 30... Upper molded body 31. Upper plant fiber-containing resin layer 32. Cavity 320...Inner wall surface 321.....Upper edge 3a...Bottom resin mixed paper 30a Lower molding body 31a...Lower plant fiber-containing resin layer 4,4a···Release film 5,5a···Transparent resin film 6, 6a···Hot melt adhesive (hot melt adhesive layer) 7, 7a Printing sheet (printing layer) 8. Test card 80.....long hole (cavity) 9. Resin film 90 Resin layer a. Card length b. Card width a1: Distance between opposing oblong holes (cavities) in the vertical direction b1: Distance between opposing slots (cavities) in the horizontal direction R: Radius of curvature of the upper edge of the slot (cavity)

Claims

1. an electronic board on which electronic components are mounted; An upper plant fiber-containing resin layer containing plant fibers, having a cavity for accommodating the electronic component, and laminated on the electronic board on the side where the electronic component is mounted, A resin card medium, characterized in that a gap is formed between the side surface of the electronic component and the inner wall surface of the cavity.

2. 2. The resin card medium according to claim 1, wherein the gap in the planar direction is greater than 0 mm and equal to or less than 2.0 mm.

3. 2. The resin card medium according to claim 1, wherein the radius of curvature of the upper edge of the cavity is 0.1 mm or less.

4. 2. The resin card medium according to claim 1, wherein the upper plant fiber-containing resin layer is laminated on the electronic substrate via an upper hot-melt adhesive layer.

5. A resin card medium as described in claim 1, characterized in that a lower plant fiber-containing resin layer containing plant fibers is laminated on the electronic substrate on the side opposite to the side on which the upper plant fiber-containing resin is laminated, via a lower hot melt adhesive layer.

6. 2. The resin card medium according to claim 1, wherein the upper plant fiber-containing resin layer is formed by heat pressing a resin-mixed paper made of plant fibers and resin fibers.

7. A resin card medium as described in claim 6, characterized in that the opening area of ​​the cavity formed in the upper plant fiber-containing resin layer is the same as or larger than the opening area of ​​the corresponding cavity formed in the upper resin-mixed paper before heat pressing.

8. preparing an upper resin-mixed paper made of plant fibers and resin fibers, the upper resin-mixed paper having a cavity with an opening larger than the planar shape of an electronic component at a position where the electronic component is to be disposed on an electronic substrate; and forming an upper molded body having a cavity capable of accommodating the electronic components on the electronic board by subjecting the resin-mixed paper to a primary heat press at a temperature above the melting point of the resin fibers.

9. a step of setting the formed upper molded body on the electronic board on which the electronic components are mounted via a hot melt adhesive; and The method for manufacturing a resin card medium according to claim 8, further comprising a step of laminating the upper molded body onto the electronic substrate by secondary heat pressing at a temperature below the melting point of the resin fibers.

10. a step of setting a lower resin-mixed paper made of plant fibers and resin fibers under the upper resin-mixed paper; a step of subjecting the resin-mixed paper to a primary heat press at a temperature equal to or higher than the melting point of the resin fibers; Separating the lower compact from the upper compact; a step of setting the separated lower molded body under the electronic substrate via a hot melt adhesive film; and The method for manufacturing a resin card medium according to claim 9, further comprising a step of laminating the lower molded body under the electronic board by secondary heat pressing at a temperature below the melting point of the resin fibers.

11. preparing a simulated board on which simulated components are mounted; a step of setting an upper resin-mixed paper made of plant fiber and resin fiber on the dummy substrate, the upper resin-mixed paper having a cavity with an opening larger than the planar shape of the dummy component at a position facing the dummy substrate; a step of forming an upper molded body onto which the shape of the upper surface of the simulant substrate is transferred by primarily heat-pressing the resin-mixed paper at a temperature equal to or higher than the melting point of the resin fiber; and a step of separating the upper molded body from the simulation substrate.

12. a step of setting the separated upper molded body on an electronic board on which electronic components having the same configuration as the mock component and the mock board are mounted via a hot melt adhesive; and The method for manufacturing a resin card medium according to claim 11, further comprising a step of laminating the upper molded body onto the electronic substrate by secondary heat pressing at a temperature below the melting point of the resin fibers.

13. a step of placing a lower resin-mixed paper made of plant fibers and resin fibers under the simulated substrate; a step of forming a lower molded body onto which the lower surface shape of the simulative substrate is transferred by primarily heat-pressing the resin-mixed paper at a temperature equal to or higher than the melting point of the resin fiber; Separating the lower molded body from the simulated substrate; a step of setting the separated lower molded body under the electronic substrate via a hot melt adhesive film; and 13. The method for manufacturing a resin card medium according to claim 12, further comprising a step of laminating the lower molded body under the electronic board by secondary heat pressing at a temperature lower than the melting point of the resin fibers.

14. 14. The method for manufacturing a resin card medium according to claim 10, wherein the upper resin-mixed paper is set on the lower resin-mixed paper via a release film.

15. The temperature of the first heat press is 160°C or less, and 14. The method for manufacturing a resin card medium according to claim 10, wherein the temperature of the secondary heat press is 90[deg.] C. or less.

16. A method for manufacturing a resin card medium as described in claim 9 or 12, characterized in that the opening area of ​​the cavity formed in the upper molded body is the same as or larger than the opening area of ​​the corresponding cavity formed in the resin-mixed paper before the first heat press.

Images