Resin molding device and method for manufacturing resin molded product

Abstract

To efficiently store release films used in a plurality of molding dies in a storage box.SOLUTION: A resin molding device includes: a plurality of film supporters 3a to 3c that support both side portions of a used release film F; a film transport mechanism 20 that transports the used release film F from the plurality of molding dies 14a to 14c to the plurality of film supporters 3a to 3c; a film dropping mechanism 4 that pushes downward between both side portions of the used release film F supported by the plurality of film supporters 3a to 3c to drop the used release film F from the film supporters 3a to 3c; and a storage box 5 that is arranged below the plurality of film supporters 3a to 3c and stores the used release film F that has been dropped by the film dropping mechanism 4.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] As disclosed in Patent Document 1, a conventional resin sealing apparatus is considered to be equipped with a recovery mechanism that stores the release film used for resin sealing in a recovery container.

[0003] This recovery mechanism has a plate portion capable of adsorbing the used release film, an arm portion supporting the plate portion, and a drive portion connected to the arm portion and capable of driving the arm portion and the entire plate portion up and down. The plate portion of the recovery mechanism is configured to receive the used release film from the substrate transport portion that holds the used release film, and then invert the plate portion up and down to store it in a recovery container. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-302610 Summary of the Invention [Problem to be solved by the invention]

[0005] However, some resin molding devices have multiple molds arranged one above the other, and in these resin molding devices, a release film is placed on each mold. In a resin molding device configured to include the above-mentioned recovery mechanism, it is difficult to efficiently recover used release films from each mold.

[0006] Therefore, the present invention has been made to solve the above problems, and its main object is to efficiently store release films used in multiple molding dies in a storage box. [Means for solving the problem]

[0007] That is, the resin molding apparatus of the present invention is a resin molding apparatus having a plurality of molding dies arranged above and below, and which places a release film on the plurality of molding dies to perform resin molding, and is characterized by comprising a plurality of film support bodies arranged above and below and which support both side portions of the used release film, a film transport mechanism which transports the used release film from the plurality of molding dies to the plurality of film support bodies, a film detachment mechanism which pushes downward the portion between the both side portions of the used release film supported by the plurality of film support bodies, thereby causing the used release film to fall off from the film support bodies, and a storage box which is arranged below the plurality of film support bodies and which stores the used release film that has fallen off by the film detachment mechanism. [Effects of the Invention]

[0008] According to the present invention configured in this manner, release films used in a plurality of molding dies can be efficiently stored in the storage box. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating a configuration of a resin molding apparatus according to an embodiment of the present invention. [Figure 2] 2A and 2B are a front view and a side view, respectively, schematically illustrating the configuration of the resin molding module of the embodiment. [Figure 3] 3 is a schematic diagram showing the configuration of a film recovery section of the resin material transport mechanism (film transport mechanism) of the embodiment. FIG. [Figure 4] 3A and 3B are schematic diagrams showing the configurations of a film support, a film dropping mechanism, and a storage box of the embodiment. [Figure 5] 2A is a plan view, FIG. 2B is a front view, FIG. 2C is a side view, and FIG. 2D is a cross-sectional view taken along line XX, showing the configuration of the film support of the embodiment. [Figure 6]3 is a schematic diagram showing the configuration of a gap change mechanism of the embodiment. FIG. [Figure 7] 4 is a schematic diagram showing a state in which the gap change mechanism of the embodiment switches between a first state and a second state. FIG. [Figure 8] 5A and 5B are schematic diagrams showing a flat plate-shaped pressing portion and a rod-shaped pressing portion of the pressing member of the film dropping mechanism of the embodiment. [Figure 9] 3A and 3B are schematic diagrams showing the state before and after a release film is placed during film transport to the film support of the embodiment. [Figure 10] 1C is a schematic diagram showing a first state of the film support supporting a release film, and FIG. 1D is a schematic diagram showing a second state of the film support supporting a release film in the same embodiment. [Figure 11] 10(e) is a schematic diagram showing a state in which the pressing member of the film dropping mechanism has rotated to the pressing position, and FIG. 10(f) is a schematic diagram showing a state in which the film has been stored in the storage box by the pressing member in the same embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] The resin molding device of Technology 1 according to the present invention is a resin molding device that has a plurality of molding dies arranged above and below, and that places a release film on the plurality of molding dies to perform resin molding. The resin molding device is characterized by comprising a plurality of film support bodies arranged above and below to support both side portions of the used release film, a film transport mechanism that transports the used release film from the plurality of molding dies to the plurality of film support bodies, a film detachment mechanism that pushes downward the portion between the both side portions of the used release film supported by the plurality of film support bodies, thereby causing the used release film to fall off from the film support bodies, and a storage box that is arranged below the plurality of film support bodies and stores the used release film that has fallen off by the film detachment mechanism. With this resin molding device, after resin molding, the used release film is transported to multiple film support bodies by a film transport mechanism, and the used release film supported on the multiple film support bodies is dropped off by a film dropping mechanism and stored in a storage box, so that the release film used in multiple molding molds can be efficiently stored in the storage box.

[0012] In addition to the configuration of Technology 1 described above, the resin molding device of Technology 2 according to the present invention further includes a spacing change mechanism that narrows the spacing between the multiple film support bodies while the multiple film support bodies are supporting the used release film, and it is desirable that the film detachment mechanism detaches the used release film from the film support bodies after the spacing between the multiple film support bodies has been narrowed by the spacing change mechanism. With this configuration, the used release film is dropped after the spacing between the multiple film supports is narrowed, so the release films supported by each of the multiple film supports can be reliably stored in the storage box. Furthermore, by narrowing the spacing between the multiple film supports, the range of the dropping operation by the film dropping mechanism can be made compact, and the film dropping mechanism can be made smaller.

[0013] In addition to the configuration of the above-mentioned Technology 2, the resin molding device of Technology 3 according to the present invention is preferably configured such that the spacing change mechanism narrows the spacing between the plurality of film support bodies and moves the plurality of film support bodies closer to the storage box. With this configuration, the multiple film support bodies with narrower spacing approach the storage box, so that the used release film dropped by the film dropping mechanism can be reliably stored in the storage box.

[0014] In addition to the configuration of Technology 2 or 3 above, the resin molding device of Technology 4 according to the present invention desirably includes an upper and lower guide section that guides the upper and lower movement of the plurality of film supports, a support drive section that moves the uppermost film support of the plurality of film supports up and down, and a connecting section that connects two vertically adjacent film supports so as to change the distance between the vertically adjacent film supports as the uppermost film support moves up and down. This configuration can be simpler than a configuration in which a plurality of film supports are moved separately, and the distance changing mechanism can be made smaller.

[0015] In addition to the configuration of any one of the above-mentioned techniques 2 to 4, the resin molding device of technique 5 according to the present invention is preferably configured such that the spacing change mechanism changes the spacing between the plurality of film support bodies between a first state corresponding to the spacing between the plurality of molding dies and a second state in which the spacing is narrower than the spacing in the first state and the used release film is dropped off by the film dropping mechanism. With this configuration, by using the spacing change mechanism to set the spacing between the multiple film support bodies to a first state, the film conveying mechanism can convey the used release film to the multiple film support bodies while it is still in the state where it has been removed from the multiple molding dies.

[0016] As a specific embodiment of the film support, the resin molding device of Technology 6 according to the present invention, in addition to the configuration of any one of Technologies 1 to 5 above, desirably has a first support portion and a second support portion that support both sides of the release film, and a passage portion formed between the first support portion and the second support portion and through which the film detachment mechanism passes from top to bottom.

[0017] As a specific embodiment of the film dropping mechanism, the resin molding device of Technology 7 according to the present invention preferably includes, in addition to the configuration of any one of Technologies 1 to 6 above, a pressing member that presses downward the used release film supported on the film support, and a pressing member drive unit that moves the pressing member up and down relative to the film support. In this configuration, the pressing member presses downward between both sides of the release film supported by the film support, passing through the passage of the film support, thereby causing the used release film to fall off from the film support. Also, as the pressing member presses downward between both sides of the release film, the release film experiences air resistance and moves to the storage box while remaining in contact with the pressing member.

[0018] In addition to the configuration of the above-described Technology 7, the resin molding device of Technology 8 according to the present invention is preferably configured such that the press-down member is rotatable with respect to the press-down member drive unit between a press-down position where the press-down member presses down the used release film supported by the film support, and a retracted position where the press-down member is retracted from the press-down position and assumes a posture along the up-down direction. With this configuration, the pressing member moves from the pressing position to a retracted position in which it is positioned in a vertical direction, thereby preventing interference with the film conveying mechanism conveying the used release film to the film support.

[0019] In addition to the configuration of the above-mentioned Technology 7 or 8, the resin molding device of Technology 9 according to the present invention is preferably such that the pressing member has two rod-shaped pressing portions that press down the portion between the both side portions of the used release film, and the positions of the two pressing portions are each changeable. In a resin molding device, when the molding die is changed to change the size of the object to be molded, the size of the release film also changes. In the resin molding device of the present technology 9, the positions of the two push-down parts can be changed, so the positions of the two push-down parts can be changed to appropriate positions corresponding to the size of the release film.

[0020] In addition to the configuration of any one of the above-mentioned techniques 7 to 9, the resin molding device of technique 10 according to the present invention is configured such that a notch is formed in the side wall of the storage box, through which the pressing member that moves up and down passes, and it is desirable that the pressing member enters the notch and stores the used release film in the storage box. With this configuration, the release film can be moved into the storage box while being pressed downward by the pressing member, so that the release film can be reliably stored in the storage box.

[0021] In addition to the configuration of any one of the above-mentioned techniques 1 to 10, the resin molding device of technique 11 according to the present invention is preferably configured such that the film conveying mechanism has a plurality of suction holding sections that suction and hold the used release films from the plurality of molding dies. With this configuration, it is possible to simultaneously receive used release films from a plurality of molding dies and simultaneously transport the used release films to a plurality of film supports, thereby enabling efficient recovery of the used release films.

[0022] In addition to the configuration of the above-mentioned Technology 11, the resin molding device of Technology 12 according to the present invention desirably has a film releasing section in which the plurality of film support bodies contact the used release film held by the suction holding section and release the used release film from the suction holding section. With this configuration, the used release film can be reliably released from the suction holding portion and supported by the film support.

[0023] In addition to the configuration of the above-mentioned technique 11 or 12, the resin molding apparatus of technique 13 according to the present invention preferably includes a static eliminator that removes static electricity from the used release film held by the suction holding part. With this configuration, it is possible to prevent the release film from sticking to the adsorption / holding portion due to static electricity, and the release film can be reliably released and supported by the film support.

[0024] Furthermore, the manufacturing method of a resin molded product according to Technology 14 of the present invention is a manufacturing method of a resin molded product in which resin is molded onto a molding object using a resin molding device of any one of Technologies 1 to 13 above, and is characterized by comprising a resin molding process in which release films are placed on a plurality of molding dies and resin is molded onto the molding object, a film conveying process in which, after resin molding, the used release films are conveyed to the plurality of film support bodies by the film conveying mechanism, and a film storage process in which the used release films supported on the plurality of film support bodies are dropped off by the film dropping mechanism and stored in the storage box.

[0025] <One embodiment of the present invention> DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings. In addition, in all of the drawings shown below, for the sake of clarity, some parts are omitted or exaggerated as appropriate, and the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0026] <Overall configuration of resin molding equipment> The resin molding apparatus 100 of this embodiment manufactures a resin molded product P by resin-sealing a substrate W, which is a molding object having electronic components Wx fixed to one surface, through resin molding using a resin material J. In the following, the molding object (substrate W) before resin molding will be referred to as the "pre-molded substrate W," and the molding object (substrate W) after resin molding will be referred to as the "molded substrate W" or "resin molded product P."

[0027] Here, the substrate W has a rectangular shape in a plan view, and examples thereof include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. Alternatively, the substrate W may be a carrier without wiring.

[0028] Examples of the resin material J include powdered or granular resin (including granular resin), liquid resin, etc. Examples of the electronic component Wx include electronic elements such as semiconductor chips, resistor elements, and capacitor elements, or electronic components in which at least one of these electronic elements is sealed with resin.

[0029] 1, this resin molding apparatus 100 includes, as its components, a substrate supply / storage module A, two resin molding modules B, and a resin material supply module C. Each component (each of modules A to C) is detachable and replaceable relative to the other components.

[0030] The substrate supply / storage module A has a substrate receiving section 10a that receives pre-molded substrates W from the outside, a substrate storage section 10b that stores molded substrates W (resin molded products P), a substrate transport mechanism 11 that transports the pre-molded substrates W and the resin molded products P, and a transfer mechanism 12, such as a transport robot, that transports, i.e., transfers, the pre-molded substrates W and the resin molded products P to the substrate transport mechanism 11.

[0031] The substrate transport mechanism 11 transports the pre-molding substrate W from the substrate supply / storage module A to the resin molding module B, and supplies the pre-molding substrate W to the molding dies 14a to 14c in the resin molding module B. After the pre-molding substrate W has been resin molded, the substrate transport mechanism 11 receives a resin molded product P, which is the molded substrate W after resin molding, from the molding dies 14a to 14c in the resin molding module B, and transports it to the substrate supply / storage module A. In addition, the delivery mechanism 12 delivers the pre-molding substrate W from the substrate receiving unit 10a to the substrate transport mechanism 11, and delivers the resin molded product P from the substrate transport mechanism 11 to the substrate storage unit 10b.

[0032] 1, the substrate transport mechanism 11 has a substrate supply unit 111 that supplies a substrate W to an upper mold 141, and a substrate receiving unit 112 that receives a resin molded product P from the upper mold 141. The substrate supply unit 111 and the substrate receiving unit 112 are provided corresponding to the upper molds 141 of the multiple molding dies 14a to 14c described below, and are provided side by side in the left-right direction. The substrate transport mechanism 11 successively performs a receiving operation of the substrate receiving unit 112 and a supply operation of the substrate supply unit 111 with respect to the upper mold 141.

[0033] 2, each resin molding module B has a plurality of molding dies 14a-14c arranged vertically, and a mold clamping mechanism 15 that clamps the plurality of molding dies 14a-14c. Each resin molding module B of this embodiment is configured to have three molding dies 14a-14c, using two intermediate plates 16c, 16d arranged between a fixed platen 16a and a movable platen 16b that is raised and lowered by the mold clamping mechanism 15. The intermediate plates 16c, 16d are slidably supported by a pair of sidewall members 16e, 16f that support the fixed platen 16a, via an elevation slide mechanism (not shown) consisting of a linear rail and a slider.

[0034] Each of the forming molds 14a to 14c is composed of an upper mold 141 that adsorbs and holds the substrate W, and a lower mold 142 in which a cavity 142c is formed. In the top-tier forming mold 14a, the upper mold 141 is provided on the underside of the fixed platen 16a, and the lower mold 142 is provided on the upper surface of the upper intermediate plate 16c. In the second-tier forming mold 14b, the upper mold 141 is provided on the underside of the upper intermediate plate 16c, and the lower mold 142 is provided on the upper surface of the lower intermediate plate 16d. In the third-tier forming mold 14c, the upper mold 141 is provided on the underside of the lower intermediate plate 16d, and the lower mold 142 is provided on the upper surface of the movable platen 16b.

[0035] Furthermore, the upper mold 141 and the lower mold 142 of each of the molding dies 14a to 14c are configured to be slidable in a direction intersecting the mold clamping direction (specifically, the front-to-rear direction) by a moving mechanism (not shown). Specifically, the upper mold 141 and the lower mold 142 slide between a mold clamping position where they are clamped by the mold clamping mechanism 15 and an ejection position located outside the mold clamping mechanism 15 in the sliding direction. Here, the substrate W and the resin molded product P are transported by the substrate transport mechanism 11 to the upper mold 141 which is in the ejection position. Furthermore, a resin material J and a release film F are conveyed to the lower mold 142 at the protruding position by a resin material conveying mechanism 20, which will be described later.

[0036] The mold clamping mechanism 15 of this embodiment is of a linear motion type that raises and lowers a movable platen using a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement. Note that the mold clamping mechanism 15 may also be of a link type that transmits a power source such as a servo motor to the movable platen using a link mechanism such as a toggle link.

[0037] Furthermore, mold clamping mechanism 15 clamps the plurality of forming dies 14a-14c by linking the elevation of intermediate plates 16c, 16d with the elevation of movable platen 16b. By clamping the plurality of forming dies 14a-14c with mold clamping mechanism 15, resin molding is performed on the pre-molded substrate W in the plurality of forming dies 14a-14c. Specifically, mold clamping mechanism 15 has a pantograph mechanism 151 that expands and contracts as movable platen 16b rises and falls. One end 151b of this pantograph mechanism 151 is fixed to stationary platen 16a, and the other end 151c is fixed to movable platen 16b. Furthermore, two cross link portions 151a of pantograph mechanism 151 are connected to intermediate plates 16c, 16d, respectively.

[0038] 1, the resin material supply module C has a moving table 17, a resin material accommodation unit 18 placed on the moving table 17, a resin material supply mechanism 19 that measures and supplies resin material J to the resin material accommodation unit 18, and a resin material transport mechanism 20 that transports the resin material accommodation unit 18 and supplies resin material J to the cavity 142C of the lower mold 142. Here, the resin material accommodation unit 18 is configured using a holding frame that holds a release film F, and the resin material J is supplied by the resin material supply mechanism 19 onto the release film F held in the holding frame.

[0039] Within the resin material supply module C, the moving table 17 moves between a resin charging position using a resin material charging mechanism 19 and a transfer position for handing over the resin material accommodation unit 18 to the resin material transfer mechanism 20. The resin material transfer mechanism 20 also transfers the resin material accommodation unit 18 containing the resin material J from the resin material supply module C to the resin molding module B, where it supplies a release film F and the resin material J to the lower mold 142 of the multiple molding dies 14a to 14c. The resin material transfer mechanism 20 then transfers the resin material accommodation unit 18, after having been supplied with the resin material J, from the resin molding module B to the resin material supply module C. The release film F prevents the resin material J from adhering to the lower mold 142.

[0040] As shown in FIG. 1, the resin material conveying mechanism 20 includes a resin material supplying section 201 that supplies the resin material J and the release film F before use to the lower mold 142, and a film collecting section 202 that collects the used release film F from the lower mold 142. That is, the resin material conveying mechanism 20 also functions as a film conveying mechanism that conveys the used release film F. The resin material supplying section 201 and the film collecting section 202 are provided corresponding to the lower molds 142 of the multiple molding molds 14a to 14c arranged in the vertical direction. The resin material supplying section 201 and the film collecting section 202 are provided side by side in the horizontal direction. The resin material conveying mechanism 20 successively performs the collecting operation of the film collecting section 202 and the supply operation of the resin material supplying section 201 with respect to the lower mold 142. The resin material conveying mechanism 20 conveys the used release film F collected by the film collecting section 202 to the film supporters 3a to 3c, which will be described later.

[0041] Specifically, the film recovery unit 202 is a suction holding unit that sucks and holds used release film F from the multiple forming dies 14a to 14c. As shown in FIG. 3, the multiple film recovery units 202 are provided corresponding to the intervals between the lower dies 142 of the multiple opened forming dies 14a to 14c. Each film recovery unit 202 sucks and holds the peripheral edge of used release film F (the portion located outside cavity 142C). Each film recovery unit 202 has multiple suction pads 202a that suck and hold release film F, and a suction source (not shown) is connected to the multiple suction pads 202a.

[0042] <Specific configuration for recovering used release film F> The resin molding apparatus 100 of this embodiment has the function of recovering used release films F from each of the plurality of molding dies 14a to 14c, storing them in a storage box 5, and disposing of them.

[0043] Specifically, as shown in Figures 1 and 4, the resin material supply module C includes a plurality of film support bodies 3a to 3c arranged vertically and supporting used release films F, a film detachment mechanism 4 that detaches the used release films F supported by the plurality of film support bodies 3a to 3c from the film support bodies 3a to 3c, and a storage box 5 arranged below the plurality of film support bodies 3a to 3c.

[0044] <Film Supports 3a to 3c> The multiple film supporters 3a to 3c are arranged in the vertical direction and support both sides of a used release film F. Specifically, as shown in FIG. 5, each of the film supporters 3a to 3c has a first support portion 31a and a second support portion 31b that support a first end portion and a second end portion of the release film F, respectively, and a passing portion 32. The first end portion and the second end portion of the release film F face each other, and the first end portion and the second end portion correspond to both sides of the release film F. The first support portion 31a and the second support portion 31b support both sides of the release film F. The passing portion 32 is a space formed between the first support portion 31a and the second support portion 31b. The film dropping mechanism 4 passes through the passing portion 32 from top to bottom.

[0045] The release film F of this embodiment has a rectangular shape in a plan view. In this case, the first end of the release film F is one end in the longitudinal direction of the release film F, and the second end is the other end in the longitudinal direction of the release film F. Therefore, the first support portion 31a and the second support portion 31b support the opposing side portions of the release film F that face each other. Therefore, the release film F is placed so as to span across the first support portion 31a and the second support portion 31b.

[0046] Furthermore, the passage section 32 formed between the first support section 31a and the second support section 31b is, for example, a rectangular space in a plan view. A press-down member 41, which will be described later, passes through the passage section 32 without coming into contact with it. Furthermore, a return section 33 is formed at the front end of each of the film supporters 3a to 3c to prevent the release film F placed on the first support section 31a and the second support section 31b from leaking out. This return section 33 protrudes upward from the first support section 31a and the second support section 31b to an extent that it does not interfere with the conveyance of the release film F from the front by the resin material conveyance mechanism 20 (film conveyance mechanism) (see FIG. 5(c)).

[0047] Here, each of the multiple film supporters 3a to 3c has multiple film releasing sections 34 that come into contact with the release film F held by the film recovery section 202 (suction holding section) and release it from the film recovery section 202. As shown in FIGS. 5(b) and 5(c), each film releasing section 34 is provided facing the upper side of the first support section 31a and the second support section 31b of the film supporters 3a to 3c. Furthermore, the film releasing section 34 is provided at a position on the side of the suction pad 202a of the film recovery section 202 where it can come into contact with the release film F. Each suction pad 202a passes between the two film releasing sections 34. There are cases where the release film F does not separate from the suction pad 202a even when the suction of the suction pad 202a is released. In this case, when the suction pad 202a is moved upward, the suction pad 202a passes between the two film releasing portions 34, while the release film F attached to the suction pad 202a comes into contact with the film releasing portion 34. As a result, the release film F is released from the suction pad 202a.

[0048] <Spacing change mechanism> As shown in FIGS. 4, 6 and 7, the plurality of film support members 3a to 3c of this embodiment are configured so that the vertical intervals between them can be changed by an interval change mechanism 6.

[0049] The gap change mechanism 6 narrows the gap between the top and bottom of the plurality of film supporters 3a to 3c while the plurality of film supporters 3a to 3c are supporting the release film F. The gap change mechanism 6 also narrows the gap between the top and bottom of the plurality of film supporters 3a to 3c, and moves the plurality of film supporters 3a to 3c downward to move them closer to the storage box 5.

[0050] The spacing change mechanism 6 of this embodiment changes the vertical spacing of the multiple film supporters 3a-3c between a first state (see (first state) in Figures 5 and 7) that corresponds to the spacing of the multiple forming dies 14a-14c, and a second state (see (second state) in Figures 6 and 7) that is narrower than the spacing in the first state and causes the release film F to drop by the film dropping mechanism 4. Note that the second state is a state in which the bottommost film supporter 3c is closer to the storage box 5 than in the first state.

[0051] Specifically, as shown in Figures 6 and 7, the spacing change mechanism 6 includes an upper and lower guide section 61 that guides the vertical movement of the multiple film support members 3a to 3c, a support member drive section 62 that moves the topmost film support member 3a of the multiple film support members 3a to 3c up and down, and a connecting section 63 that connects the vertically adjacent film support members 3a to 3c in a manner that allows the spacing between them to be changed as the topmost film support member 3a moves up and down.

[0052] The vertical guide section 61 has a guide rail 611 extending in the vertical direction, and sliders (not shown) that move along the guide rail 611 and are connected to the multiple film supporters 3a-3c. In this embodiment, the guide rail 611 and sliders are provided on the rear end side (opposite the film feed side) of the multiple film supporters 3a-3c. Two guide rails 611 are provided, one on each side of the multiple film supporters 3a-3c.

[0053] The support drive unit 62 moves the uppermost film support 3a up and down along the vertical guide unit 61. The support drive unit 62 in this embodiment can be configured using, for example, a rodless cylinder. A slider 621 of this support drive unit 62 is connected to the uppermost film support 3a (see FIG. 7). Note that, in addition to a rodless cylinder, the support drive unit 62 may also be configured using, for example, a ball screw mechanism and a motor, a rack and pinion mechanism and a motor, or an air cylinder.

[0054] The connecting portions 63 connect the vertically adjacent film support members 3a to 3c, and when the vertically adjacent film support members 3a to 3c expand to a predetermined distance, they restrain the distance between them so that it does not expand any further. Specifically, as shown in Fig. 7, the connecting portions 63 can be composed of, for example, protrusions 63a provided on each of the film support members 3a to 3c, and frames 63b spanning the protrusions 63a provided on the vertically adjacent film support members 3a to 3c. Note that the connecting portions 63 may be configured to have protrusions 63a and frames 63b, or may have any other configuration in which the vertically adjacent film support members 3a to 3c can be hooked onto each other to prevent the distance between them from expanding any further.

[0055] In the first state, adjacent film support members 3a to 3c are constrained by connecting portions 63 to form a predetermined distance (see FIG. 7 (first state)). This predetermined distance is the same as the distance between adjacent lower molds 142 in the opened molds 14a to 14c.

[0056] When the topmost film support 3a is lowered from this first state, the second and third film support members 3b and 3c are also lowered. Then, the third film support member 3c is placed on the stopper member 64, narrowing the gap between the third film support member 3c and the second film support member 3b (see FIG. 7(1)). Note that the stopper member 64 is provided above the storage box 5. When the topmost film support member 3a is subsequently lowered, the second film support member 3b is also lowered. Then, the second film support member 3b is placed on the third film support member 3c, narrowing the gap between the second film support member 3b and the topmost film support member 3a (see FIG. 7(2)). Thereafter, the topmost film support member 3a is lowered until it is placed on the second film support member 3b. This places the multiple film support members 3a-3c in the second state (see FIG. 7 (second state)). Cushion members for absorbing shock may be provided between the film support members 3a to 3c.

[0057] On the other hand, when the topmost film support 3a is raised from the second state, the topmost film support 3a and the second-level film support 3b expand to a predetermined distance, the distance between them is constrained by the connecting portion 63, and the second-level film support 3b rises. When the topmost film support 3a is subsequently raised, the second-level film support 3b and the third-level film support 3c expand to a predetermined distance, the distance between them is constrained by the connecting portion 63, and the third-level film support 3c rises. This places the multiple film support members 3a-3c in the first state.

[0058] <Film drop mechanism 4> The film dropping mechanism 4 pushes downward between both sides of the used release film F supported by the multiple film supporters 3a to 3c, causing the used release film F to drop off from the film supporters 3a to 3c.

[0059] The film dropping mechanism 4 of this embodiment pushes downward the longitudinal center portion of the rectangular release film F, causing the used release film F to drop from the passing portion 32 of the film supporters 3a to 3c. After the spacing between the plurality of film supporters 3a to 3c is narrowed by the spacing change mechanism 6 (after the second state is reached), the film dropping mechanism 4 causes the used release film F to drop from the plurality of film supporters 3a to 3c all at once.

[0060] Specifically, as shown in Figures 4, 6 and 8, the film removal mechanism 4 includes a pressing member 41 that presses downward the used release film F supported by the film supporters 3a to 3c, and a pressing member drive unit 42 that moves the pressing member 41 up and down relative to the film supporters 3a to 3c.

[0061] 8(a), the pressing member 41 of this embodiment has a flat pressing portion 411 that presses down the space between both side portions (the center portion) of the used release film F. The flat pressing portion 411 has a size that allows it to pass through the passing portion 32 of the film supporters 3a to 3c.

[0062] The configuration of the press-down member 41 is not limited to a configuration having a flat press-down portion 411. For example, as shown in FIG. 8(b), the press-down member 41 may have a configuration having a plurality (two in this case) of rod-shaped press-down portions 411 that press down between both side portions (the center portion) of the used release film F. All of the rod-shaped press-down portions 411 are configured to be able to pass through the passage portions 32 of the film supporters 3a to 3c. When there are two rod-shaped press-down portions 411, the positions of the two press-down portions 411 are configured to be changeable. Specifically, the positions of the two press-down portions 411 are changeable in the left-right direction, i.e., the horizontal direction. This allows the left-right positions of the two press-down portions 411 to be changed to appropriate positions even when the sizes of the substrate W and the release film F are changed by changing the forming molds 14a to 14c.

[0063] As shown in FIG. 4, the presser member driving section 42 has a guide rail 421 that guides the presser member 41 in the up and down direction, and a driving actuator 422 that moves the presser member 41 up and down along the guide rail 421.

[0064] Guide rail 421 guides the base end of press-down member 41 in the up and down direction. This guide rail 421 is provided facing the multiple film supporters 3a to 3c. Furthermore, drive actuator 422 has a movable part 422a that comes into contact with the base end of press-down member 41, and uses movable part 422a to lift press-down member 41 along guide rail 421, thereby moving press-down member 41 up and down. This drive actuator 422 is, for example, one that uses a rodless cylinder, one that uses a ball screw mechanism and a motor, one that uses a rack and pinion mechanism and a motor, or one that uses an air cylinder.

[0065] 4, the press-down member 41 is configured to be rotatable relative to the press-down member driver 42 between a press-down position S where the press-down member 41 presses down the used release film F supported by the film supporters 3a to 3c, and a retracted position T where the press-down member 41 is retracted from the press-down position S and assumes a posture along the vertical direction. The press-down position S is a position where the plate-shaped press-down portion 411 or the rod-shaped press-down portion 411 assumes a posture along the horizontal direction. Specifically, a rotation unit 43 is provided at the base end of the press-down member 41, which rotates the press-down member 41 around a rotation axis along the horizontal direction (X direction). This rotation unit 43 can be configured using an actuator such as a motor, for example.

[0066] <Containment Box 5> 4, 6, and 7, the storage box 5 is disposed below the plurality of film supporters 3a to 3c, and stores the used release film F that has been dropped by the film dropping mechanism 4. This storage box 5 has an opening at the top, and the size of the opening in plan view is larger than the size of the used release film F in plan view.

[0067] 6, a notch 51a through which the pressing member 41 that moves up and down is formed in the side wall 51 of this storage box 5 (the side wall 51 on the film dropping mechanism 4 side). This notch 51a extends downward from the upper end of the side wall 51 of the storage box 5. This notch 51a allows the pressing member 41 to store the used release film F in the storage box 5 while entering the notch 51a.

[0068] <Recovery of used release film F> Next, the operation of collecting used release film F in the resin molding apparatus 100 of this embodiment will be described. The operation described below is performed by a control unit COM provided in, for example, the substrate supply / storage module A, controlling each unit of the resin molding apparatus 100. The control unit COM is a dedicated or general-purpose computer having a CPU, internal memory, an input / output interface, an AD converter, etc.

[0069] After the resin molding step, the used release film F is collected from the lower mold 142 of the multiple molding dies 14a to 14c that have been opened by the multiple film collection units 202 of the resin material transport mechanism 20 (film transport mechanism) (see FIG. 3). Then, the resin material transport mechanism 20 transports the used release film F to the multiple film supporters 3a to 3c (see FIG. 9(a), film transport step). At this time, the multiple film supporters 3a to 3c are in the first state.

[0070] Here, the resin material conveying mechanism 20 slides the multiple film recovery units 202 relative to the multiple film supporters 3a to 3c. Then, with the release film F positioned above the first support parts 31a and second support parts 31b of the film supporters 3a to 3c, the suction pad 202a is released from suction. As a result, the release film F falls onto the first support parts 31a and second support parts 31b of the film supporters 3a to 3c. The resin material conveying mechanism 20 also moves the multiple film recovery units 202 upward relative to the multiple film supporters 3a to 3c. Note that even if the suction of the suction pad 202a is released, the release film F may still stick to the suction pad 202a due to the pressure difference between the inside and outside of the suction pad 202a. In this case, when the multiple film recovery units 202 move upward relative to the multiple film supporters 3a to 3c, the suction pad 202a passes between the two film releasing units 34, while the release film F attached to the suction pad 202a comes into contact with the film releasing unit 34. This causes the release film F to be released from the suction pad 202a, and the release film F falls onto the first support unit 31a and the second support unit 31b of the film supporters 3a to 3c. As a result, both longitudinal side portions of the used release film F are supported by each of the film supporters 3a to 3c (see FIG. 9(b)).

[0071] Furthermore, in this embodiment, the static eliminator 7 is configured to remove static electricity charged on the release film F while the release film F is adsorbed to the suction pads 202a of the multiple film recovery units 202 (see FIG. 6). Note that the static eliminator 7 is omitted from FIGS. 4, 7, and 9 to 11. Specifically, a static eliminator 7 is provided corresponding to each of the multiple film recovery units 202. Each static eliminator 7 removes static electricity by spraying ions onto the release film F so that the release film F does not stick to the lower surface of the film recovery unit 202 due to static electricity. The timing for removing static electricity using the static eliminator 7 is before or during the release film F is stored in the film supporters 3a to 3c.

[0072] After transporting the used release film F to the film supporters 3a to 3c, the resin material transport mechanism 20 moves to a predetermined standby position retreated from between the film supporters 3a to 3c and the film dropping mechanism 4 (see Figure 10(c)).

[0073] Thereafter, the spacing between the film supporters 3a to 3c is narrowed by the spacing change mechanism 6 (see FIG. 10(d)). Specifically, the supporter driving unit 62 of the spacing change mechanism 6 moves the topmost film supporter 3a downward, thereby placing the film supporters 3a to 3c in the second state. Furthermore, by narrowing the spacing between the film supporters 3a to 3c by the spacing change mechanism 6, the film supporters 3a to 3c move closer to the storage box 5. Note that during the operation of conveying the release film F to the film supporters 3a to 3c and the operation of narrowing the spacing between the film supporters 3a to 3c, the pressing member 41 of the film dropping mechanism 4 is in the retracted position T.

[0074] After the spacing between the film supporters 3a to 3c is narrowed by the spacing change mechanism 6 (after the film supporters 3a to 3c are set in the second state), the presser member 41 of the film dropping mechanism 4 is rotated to the presser position S (see FIG. 11(e)). The presser member 41 in the presser position S is located above the film supporters 3a to 3c. Thereafter, the presser member drive unit 42 moves the presser member 41 downward, causing the used release film F to drop off from the film supporters 3a to 3c (see FIG. 11(f)). Specifically, the presser member 41 presses downward between both sides (the center) of the release film F supported by the film supporters 3a to 3c, and passes through the passage section 32 of the film supporters 3a to 3c, causing the used release film F to drop off from the passage section 32 of the film supporters 3a to 3c. At this time, the used release film F moves to the storage box 5 while remaining in contact with the presser member 41 due to air resistance. As a result, the used release film F is stored in the storage box 5 (film storing step).

[0075] In this embodiment, the base end of the press-down member 41 is placed on the movable part 422a of the drive actuator 422. When the base end of the press-down member 41 is placed on the movable part 422a, when the press-down member drive part 42 moves the movable part 422a in the vertical direction, the press-down member 41 also moves along with the movement of the movable part 422a. When the press-down member 41 is placed on an object other than the movable part 422a, the press-down member 41 does not move in the vertical direction even when the press-down member drive part 42 moves the movable part 422a in the vertical direction. In this embodiment, when the press-down member 41 of the film dropping mechanism 4 is rotated to the pressed position S, the base end of the press-down member 41 is placed on the movable part 422a. Then, when the press-down member driving unit 42 moves the movable part 422a downward, the press-down member 41 rests on the used release film F inside the storage box 5 while the movable part 422a is moving downward. Thereafter, the downward movement of the press-down member 41 stops, and only the movable part 422a moves downward. As a result, the movable part 422a of the driving actuator 422 and the press-down member 41 are separated, and the used release film F is pressed down from above by the weight of the press-down member 41. This prevents the release film F stored inside the storage box 5 from being pushed in and becoming bulky. Furthermore, excessive force is not applied to the used release film F inside the storage box 5.

[0076] After the press-down member driver 42 moves the movable part 422a downward, the movable part 422a is moved upward. While the movable part 422a is moving upward, the base end of the press-down member 41 is placed on the movable part 422a. Thereafter, the press-down member 41 moves upward together with the movement of the movable part 422a. As described above, the press-down member driver 42 moves the movable part 422a upward, thereby moving the press-down member 41 upward and removing the press-down member 41 from the storage box 5, and then moving the press-down member 41 and the movable part 422a to a height position (standby position) where the next film removal operation can be performed. Furthermore, after the press-down member 41 has moved to the standby position, the press-down member 41 is rotated to the retracted position T.

[0077] After the operation of the above-mentioned pressing member 41, the support driver 62 moves the uppermost film support 3a upward, and sets the plurality of film supports 3a to 3c at an interval (first state) that allows the next film collection operation.

[0078] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, after resin molding, the used release film F is transported to multiple film support bodies 3a to 3c by a film transport mechanism (resin material transport mechanism 20), and the used release film F supported by the multiple film support bodies 3a to 3c is dropped by a film dropping mechanism 4 and stored in a storage box 5, so that the release film F used in multiple molding molds 14a to 14c can be efficiently stored in the storage box 5.

[0079] Furthermore, since the film dropping mechanism 4 drops the used release film F from the film supporters 3a to 3c after the spacing between the multiple film supporters 3a to 3c has been narrowed by the spacing change mechanism 6, the release films F supported on each of the multiple film supporters 3a to 3c can be reliably stored in the storage box 5. Furthermore, by narrowing the spacing between the multiple film supporters 3a to 3c, the range of the dropping operation by the film dropping mechanism 4 (specifically, the stroke amount of the push-down member 41) can be made compact, and the film dropping mechanism 4 can be made smaller.

[0080] Furthermore, the spacing change mechanism 6 narrows the spacing between the multiple film supporters 3a to 3c and brings the multiple film supporters 3a to 3c closer to the storage box 5, so that the used release film F that has been dropped by the film dropping mechanism 4 can be reliably stored in the storage box 5.

[0081] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0082] For example, although the interval change mechanism 6 was configured to narrow the intervals between the plurality of film supporters 3a to 3c and move the plurality of film supporters 3a to 3c closer to the storage box 5, it is not necessary to be configured to move the plurality of film supporters 3a to 3c closer to the storage box 5. In this case, a height position adjustment mechanism that adjusts the height position of the storage box 5 may be provided, so that the storage box 5 can be moved closer to the plurality of film supporters 3a to 3c (the lowest film supporter 3c).

[0083] Furthermore, the film supporters 3a to 3c may be configured so that the distance between the first support portion 31a and the second support portion 31b (i.e., the width of the passing portion) is changeable. With this configuration, the distance between the first support portion 31a and the second support portion 31b can be adjusted depending on, for example, the type of release film F, and the release film F can be reliably supported.

[0084] Furthermore, the press-down member 41 may be configured to be changeable in width or spacing between the plurality of bar-shaped press-down portions 411. With this configuration, it is possible to adjust the configuration so that the release film F is reliably removed from the film supporters 3a to 3c depending on the type of release film F, for example.

[0085] In addition, in the above embodiment, one release film F is transported to each of the film supporters 3a to 3c and then stored in the storage box 5, but it is also possible to transport two or more release films F to each of the film supporters 3a to 3c and then store them in the storage box 5.

[0086] Although the release film F in the above embodiment has a rectangular shape in a plan view, it may have various shapes such as a circular shape in a plan view. When the release film F has a circular shape in a plan view, the two end portions of the release film F are two end portions of the release film F that are opposite to each other in the radial direction.

[0087] In the above embodiment, the resin molding apparatus 100 has been described in which one resin molding module B has three molding dies 14a to 14c, but the resin molding apparatus 100 may be configured so that one resin molding module B has two molding dies, or may have four or more molding dies. In these configurations, it is possible to match the number of suction holding units of the film transport mechanism and the number of film supports to the number of molding dies.

[0088] The film transport mechanism in the above embodiment is configured using the resin material transport mechanism 20, but may be provided separately from the resin material transport mechanism 20.

[0089] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0090] 100...Resin molding equipment W... Pre-molded substrate (molding target) P···Resin molded product (molded object) 14a to 14c: Multiple molding dies F···Release film 20 Film transport mechanism (resin material transport mechanism) 202: Adsorption holding section (film recovery section) 3a to 3c: Multiple film supports 4. Film removal mechanism 5. Storage box 6. Spacing change mechanism 61 Upper and lower guide section 62 Support drive unit 63...Connection part 31a...First support part 31b...Second support part 32...passing section 34 Film release section 41 Push-down member 42 Push-down member drive unit S Press position T...Evacuation position 411···Press section 51a Notch

Claims

1. A resin molding apparatus having a plurality of molding dies arranged above and below, in which release films are placed on the plurality of molding dies to perform resin molding, A plurality of film supports arranged above and below each other and supporting both side portions of the used release film; a film transport mechanism that transports the used release films from the plurality of molding dies to the plurality of film supports; a film dropping mechanism that pushes downward a portion between both side portions of the used release film supported by the plurality of film supports, causing the used release film to drop from the film supports; a storage box disposed below the plurality of film supports and configured to store the used release films that have been dropped by the film dropping mechanism.

2. The film support further includes a spacing change mechanism that narrows the spacing between the film support members while the film support members are supporting the used release film, The resin molding apparatus according to claim 1 , wherein the film dropping mechanism drops the used release film from the film support members after the interval between the plurality of film support members has been narrowed by the interval changing mechanism.

3. The resin molding device according to claim 2 , wherein the distance changing mechanism narrows the distance between the plurality of film support members and moves the plurality of film support members closer to the storage box.

4. The spacing change mechanism includes: a vertical guide portion for guiding the vertical movement of the plurality of film supports; a support driving unit that moves the uppermost film support among the plurality of film supports up and down; The resin molding device according to claim 2 or 3, further comprising a connecting portion that connects two adjacent film support members vertically so that the spacing between the adjacent film support members vertically can be changed as the topmost film support member moves vertically.

5. 5. The resin molding device according to claim 2, wherein the spacing change mechanism changes the spacing between the plurality of film support bodies between a first state corresponding to the spacing between the plurality of molding dies and a second state in which the spacing is narrower than the spacing in the first state and the used release film is dropped by the film dropping mechanism.

6. The film support is a first support portion and a second support portion that support both side portions of the release film; The resin molding device according to claim 1 , further comprising a passage formed between the first support portion and the second support portion, through which the film dropping mechanism passes from top to bottom.

7. The film dropping mechanism includes: a pressing member that presses downward the used release film supported by the film support; The resin molding apparatus according to claim 1 , further comprising a press-down member drive unit that moves the press-down member up and down relative to the film support member.

8. 8. The resin molding device according to claim 7, wherein the pressing member is configured to be rotatable relative to the pressing member drive unit between a pressing position where the pressing member presses down the used release film supported by the film support, and a retracted position where the pressing member is retracted from the pressing position and assumes a posture aligned in the vertical direction.

9. 9. The resin molding apparatus according to claim 7, wherein the pressing member has two rod-shaped pressing portions that press down the portion between the both side portions of the used release film, and the positions of the two pressing portions are changeable.

10. A notch is formed in the side wall of the storage box, through which the pressing member moves up and down; The resin molding apparatus according to claim 7 , wherein the pressing member stores the used release film in the storage box while entering the notch.

11. The resin molding apparatus according to claim 1 , wherein the film transport mechanism has a plurality of suction holding portions that suck and hold the used release films from the plurality of molding dies.

12. The resin molding apparatus according to claim 11 , wherein the plurality of film support bodies each have a film releasing section that comes into contact with the used release film held by the suction holding section to release the used release film from the suction holding section.

13. 13. The resin molding apparatus according to claim 11, further comprising a static eliminator for removing static electricity from the used release film held by the suction holding unit.

14. A method for manufacturing a resin molded product by molding a resin onto a molding object using the resin molding apparatus according to any one of claims 1 to 13, a resin molding step of placing release films on a plurality of molding dies and molding a resin into the molding object; a film conveying step of conveying the used release film after resin molding to the plurality of film support bodies by the film conveying mechanism; and a film storage step of dropping the used release film supported by the plurality of film support bodies using the film dropping mechanism and storing the film in the storage box.

Images