Optical scanning system for nondestructively acquiring three-dimensional structure of object

Abstract

To provide an optical scanning system for nondestructively acquiring three-dimensional structure of an object.SOLUTION: An optical scanning system comprises: an optical image processing device disposed so as to generated luminous flux along a first light axis direction; and an optical scanning device that converts luminous flux along the first light axis direction to luminous flux along a second light axis direction and is disposed so as to scan an inspection object by using luminous flux along the second light axis direction. Provided is the optical scanning system for nondestructively acquiring three-dimensional structure of an object in which the optical image processing device scans an inspection object along the X-axis direction and the Y-axis direction by the optical scanning device, acquires a YZ sectional structure image and an XZ sectional structure image that are continuous in different positions, and reconstructs a three-dimensional structure image. Accordingly, problems in which the inside of three-dimensional structure cannot be observed nondestructively and costs of an inspection device are high can be solved.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to an optical scanning system, and more particularly to an optical scanning system for non-destructively acquiring the three-dimensional structure of an object. [Background technology]

[0002] In the field of semiconductors, a technology has been developed that enables vertical electrical connection between chips by forming through-holes (Through Glass Via, TGV) in glass substrates and forming fine metal wiring inside and outside the through-holes. By reducing the hole diameter and increasing the depth of the TGV, it is possible to increase the electrode density and number of layers in semiconductor devices, thereby enabling the miniaturization of semiconductor devices.

[0003] However, defects are often discovered after the TGV has been manufactured, which is why inspections of the TGV's quality are necessary.

[0004] The current inspection method for TGVs involves cutting the glass substrate and examining the resulting cross section with an optical microscope to confirm the quality of the TGV. However, this inspection method is destructive and increases the manufacturing cost of TGVs.

[0005] Another method is to observe the surface structure of the TGV using an optical microscope. However, this method does not allow for observation of the internal structure of the TGV, and inspection in the Z-axis direction is difficult. Another method is to cut the glass substrate and obtain images of the TGV using a scanning electron microscope, but the high cost of a scanning electron microscope can be a burden for many TGV manufacturers. Summary of the Invention [Problem to be solved by the invention]

[0006] As described above, the current inspection method for TGVs has problems such as an increase in the manufacturing cost of TGVs, an inability to observe the internal structure of TGVs non-destructively, and high costs for inspection equipment. [Means for solving the problem]

[0007] In order to solve the above problem, the present invention provides an optical scanning system for non-destructively acquiring a three-dimensional structure of an object, comprising: an optical image processing device arranged to generate a light beam along a first optical axis direction; and an optical scanning device connected to the optical image processing device and arranged to convert the light beam along the first optical axis direction into a light beam along a second optical axis direction and scan an object under inspection using the light beam along the second optical axis direction, wherein the optical image processing device, when scanning the object under inspection along a Y-axis direction to acquire a corresponding Y-Z cross-sectional structure image, scans the object under inspection along an X-axis direction to acquire the corresponding Y-Z cross-sectional structure image by the optical scanning device; and, when scanning the object under inspection along the X-axis direction to acquire a corresponding X-Z cross-sectional structure image by the optical scanning device, scans the object under inspection along a Y-axis direction to acquire the corresponding X-Z cross-sectional structure image by the optical scanning device; and the optical image processing device reconstructs a three-dimensional structure image corresponding to the object under inspection based on successive Y-Z cross-sectional structure images at different positions or successive X-Z cross-sectional structure images at different positions.

[0008] In one embodiment of the present invention, the optical scanning device further includes a collimator arranged to convert a light beam along the first optical axis direction into a light beam parallel to the first optical axis direction; a light beam scanner arranged at the intersection of the first optical axis direction and the second optical axis direction and arranged to convert the light beam parallel to the first optical axis direction into a light beam parallel to the second optical axis direction; a first lens set arranged in the second optical axis direction and arranged to diverge or converge the light beam parallel to the second optical axis direction; a visible light camera module arranged in the second optical axis direction and arranged to acquire a two-dimensional structure image corresponding to the object to be inspected; a second lens set arranged in the second optical axis direction and arranged to diverge or converge the light beam parallel to the second optical axis direction; and an object mirror module arranged on the side of the second lens set in the second optical axis direction and arranged to converge the light beam parallel to the second optical axis direction and irradiate the object to be inspected.

[0009] In one embodiment of the present invention, the visible light camera module comprises a camera, a visible light source, and a spectrometer, and the spectrometer is disposed in the direction of the second optical axis.

[0010] In one embodiment of the present invention, the camera and the visible light source are respectively installed on either side of the spectrometer.

[0011] In one embodiment of the present invention, a visible light source is located adjacent to the object mirror module and is used to illuminate the object under inspection.

[0012] In one embodiment of the present invention, a visible light source is disposed adjacent to the bottom surface of the inspection object and is used to illuminate the inspection object.

[0013] In one embodiment of the present invention, the object mirror module has an adjustable focus magnification.

[0014] In one embodiment of the present invention, the optical scanning system for non-destructively acquiring the three-dimensional structure of the object further comprises a turning device connected to the optical scanning device for tilting the optical scanning device at a predetermined angle from the second optical axis direction.

[0015] In one embodiment of the present invention, the optical image processing device obtains the thickness of the inspection object based on the YZ cross-sectional structure image or the XZ cross-sectional structure image.

[0016] In one embodiment of the present invention, when the object to be inspected is a glass substrate having a plurality of through holes, the optical image processing device checks whether there is blocking and / or defects in the through holes from successive XY cross-sectional structure images at different positions in the Z-axis direction. [Effects of the Invention]

[0017] According to the above configuration, in the optical scanning system for non-destructively acquiring the three-dimensional structure of an object according to the present invention, the optical scanning device scans the inspection object with a light beam to acquire an optical signal. The optical image processing device then converts the acquired optical signal to generate an image of the three-dimensional structure of the inspection object. This makes it possible to easily inspect the exterior and interior of the inspection object simultaneously. Therefore, with the above configuration, by taking a magnified image of the surface of the sample as with a conventional optical microscope, only the surface condition of the sample can be analyzed from the acquired surface image, but the problem of not being able to observe the inside of the sample can be solved. Furthermore, optical scanning devices, which are far simpler in configuration and less expensive than scanning electron microscopes, can solve the problem of high costs of inspection devices in the prior art and reduce the cost of inspecting objects. Furthermore, by tilting the optical scanning device at a predetermined angle, structural images of the object being inspected can be acquired in a specific direction, thereby expanding the measurement options of the optical scanning system. [Brief explanation of the drawings]

[0018] [Figure 1A] 1 is a block diagram illustrating a first embodiment of an optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to the present invention. [Figure 1B] FIG. 2 is a block diagram illustrating a second embodiment of an optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to the present invention. [Figure 1C] FIG. 2 is a block diagram illustrating a third embodiment of an optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to the present invention. [Figure 1D] FIG. 10 is a block diagram illustrating a fourth embodiment of an optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to the present invention. [Figure 2] 3A and 3B are diagrams showing a YZ cross-sectional structure image and an XZ cross-sectional structure image according to the first embodiment of the present invention. [Figure 3] 3A and 3B are diagrams illustrating the inclination of the optical scanning device according to the first embodiment of the present invention. [Figure 4]The image is obtained by scanning the inspection object with the optical scanning device of the embodiment of FIG. 3 tilted at a predetermined angle θ. [Figure 5] 1 is a YZ cross-sectional structure image of the first embodiment of the present invention. [Figure 6A] 10 is an XY cross-sectional structure image of the top surface acquired in the Z-axis direction in the first embodiment of the present invention. [Figure 6B] 1 is an XY cross-sectional structure image of the waist acquired in the Z-axis direction in the first embodiment of the present invention. [Figure 6C] 10 is an XY cross-sectional structure image of the bottom surface acquired in the Z-axis direction in the first embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] In the embodiments of the present invention, the term "optical signal" refers to a light beam, a parallel light beam, and a convergent light beam. The light beam includes visible light and invisible light (e.g., near-infrared light). The term "consecutive different positions" refers to a target coordinate position and its adjacent coordinate positions in the same axis direction, for example, X1, X2, X3... on the X axis, Y1, Y2, Y3... on the Y axis, and Z1, Z2, Z3... on the Z axis.

[0020] Please refer to Fig. 1A. Fig. 1A is a block diagram showing a first embodiment of an optical scanning system 100 for non-destructively acquiring a three-dimensional structure of an object according to the present invention. The optical scanning system 100 for non-destructively acquiring a three-dimensional structure of an object includes an optical image processing device 10 and an optical scanning device 20.

[0021] The optical image processing device 10 is arranged to generate a parallel light beam 25 along a first optical axis direction 30. The optical image processing device 10 is composed of, but is not limited to, a light source module, an interferometer, a spectrum analyzer, an optical coherence tomography (OCT), and a computer. In a first embodiment of the present invention, a three-dimensional structural image of an inspection object 40 can be acquired using the optical image processing device 10 and the optical scanning device 20. The three-dimensional structural image includes tomographic image data and is therefore used to detect and confirm whether there are any defects in the internal structure of a TGV, thereby solving the problem of not being able to observe the internal structure of a TGV as in the prior art.

[0022] The optical scanning device 20 is connected to the optical image processing device 10. The optical scanning device 20 is arranged to convert a parallel light beam 25 along a first optical axis direction 30 into a parallel light beam 25 along a second optical axis direction 32, and to scan an inspection object 40 using the parallel light beam 25 along the second optical axis direction 32. The "conversion" mentioned above refers to converting the traveling direction of the light beam 25 from a first angle to a second angle. For example, the first angle is 0°, and the second angle is 90°. In this embodiment, the first optical axis direction 30 is approximately perpendicular to the second optical axis direction 32.

[0023] The optical signals generated by the light beam 25 reflected and / or scattered on the surface and inside of the inspection object 40 are reflected by the first object mirror OL1 and returned along the outgoing optical path to the optical image processing device 10 for signal-to-image conversion. The outgoing optical path can be represented in the following order: optical image processing device 10 → collimator C → light beam scanner S → first lens set LP1 → spectrometer BS → second lens set LP2 → first object mirror OL1. Meanwhile, the return optical path is in the order: first object mirror OL1 → second lens set LP2 → spectrometer BS → first lens set LP1 → light beam scanner S → collimator C → optical image processing device 10. In another embodiment, when the first object mirror OL1 is switched to the second object mirror OL2, the light beam is caused to travel along the outgoing and return optical paths using the second object mirror OL2 instead of the first object mirror OL1.

[0024] The optical scanning device 20 includes a collimator C, a light beam scanner S, a first lens set LP1, a visible light camera module 22a, a second lens set LP2, a first object mirror OL1, and a second object mirror OL2. In this embodiment, the first object mirror OL1 and the second object mirror OL2 may be combined to form an object mirror module. The object mirror module is configured to allow adjustment of the focus magnification. For example, the focus magnification of the first object mirror OL1 may be set to be different from that of the second object mirror OL2. The focus magnification of the first object mirror OL1 may be set to be larger or smaller than that of the second object mirror OL2. In other embodiments, the number of object mirrors in the object mirror module may be increased or decreased according to design needs.

[0025] The collimator C is positioned to receive the light beam 25 along the first optical axis direction 30 generated by the optical image processing device 10 and convert the light beam 25 along the first optical axis direction 30 into a light beam 25 parallel to the first optical axis direction 30. Here, "conversion" refers to converging the light beam 25 into a light beam 25 parallel to the first optical axis direction 30.

[0026] The light beam scanner S is disposed at the intersection of the first optical axis direction 30 and the second optical axis direction 32. The light beam scanner S is disposed so as to receive the light beam 25 parallel to the first optical axis direction 30 via the collimator C, and convert the light beam 25 parallel to the first optical axis direction 30 into a light beam 25 parallel to the second optical axis direction 32.

[0027] The first lens set LP1 is disposed in the second optical axis direction 32. The first lens set LP1 is disposed so as to diverge or converge the light beam 25 parallel to the second optical axis direction 32. In this embodiment, the first lens set LP1 is disposed so as to diverge the light beam 25 parallel to the second optical axis direction 32.

[0028] The visible light camera module 22a is installed in the second optical axis direction 32. The visible light camera module 22a is positioned to acquire a two-dimensional (XY) structural image corresponding to the object 40 under inspection.

[0029] The visible light camera module 22a is composed of a camera CAM, a visible light source VIS, and a spectrometer BS. The spectrometer BS may be installed in the second optical axis direction 32. The camera CAM and the visible light source VIS may be installed on either side of the spectrometer BS. More specifically, the camera CAM is installed on the right side of the second optical axis direction 32, and the visible light source VIS is installed on the left side of the second optical axis direction 32, and the orientation of the lens of the camera CAM of the visible light camera module 22a is approximately perpendicular to the second optical axis direction 32.

[0030] The operation of the visible light camera module 22a is described below. The spectrometer BS bends visible light generated by the visible light source VIS by 90 degrees and makes it incident on the second lens set LP2. The visible light that passes through the second lens set LP2 is converged onto the inspection object 40 by the first object mirror OL1. The visible light reflected from the inspection object 40 is then bent by 90 degrees again by the spectrometer BS and directed to the camera CAM, where it is imaged to obtain a two-dimensional (XY) structural image corresponding to the inspection object 40. This allows the optical scanning device 20 to directly obtain a two-dimensional (XY) structural image corresponding to the inspection object 40 using the visible light camera module 22a, improving the convenience of inspecting the inspection object 40.

[0031] It is worth noting that optical microscopes can only inspect the surface of a sample, not the interior of the sample. In contrast, scanning electron microscopes require the sample to be destroyed as a pre-processing step for imaging, making it impossible to perform non-destructive overall inspection of the sample. Therefore, optical scanning device 20, which is simpler in configuration and less expensive than conventional scanning electron microscopes, solves the problem of the high cost of inspection devices in the prior art and can reduce the inspection costs for object 40.

[0032] Please refer to FIG. 1B. FIG. 1B is a block diagram showing a second embodiment of an optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to the present invention. The difference from the embodiment shown in FIG. 1A is that the positions of the camera CAM and the visible light source VIS of the visible light camera module 22b in the embodiment of FIG. 1B are different from those of the visible light camera module 22a in the embodiment of FIG. 1A. Other components are the same as those in the embodiment of FIG. 1A, and therefore will not be described again here.

[0033] The visible light camera module 22b is composed of a camera CAM, a visible light source VIS, and a spectrometer BS. The spectrometer BS may be disposed in the second optical axis direction 32. The camera CAM and the visible light source VIS may be disposed on either side of the spectrometer BS. More specifically, the camera CAM is disposed on the left side of the second optical axis direction 32, and the visible light source VIS is disposed on the right side of the second optical axis direction 32.

[0034] Please refer to FIG. 1C. FIG. 1C is a block diagram showing a third embodiment of an optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to the present invention. The difference from the embodiment shown in FIG. 1B is that the positions of the camera CAM and the visible light source VIS of the visible light camera module 22c in the embodiment of FIG. 1C are different from those of the visible light camera module 22b in the embodiment of FIG. 1B. Other components are the same as those in the embodiment of FIG. 1B, and therefore will not be described again here.

[0035] The visible light camera module 22c is composed of a camera CAM, a visible light source VIS, and a spectrometer BS. The spectrometer BS may be disposed in the second optical axis direction 32. The visible light source VIS may be disposed adjacent to the first object mirror OL1. The visible light source VIS is used to illuminate the inspection object 40. More specifically, the camera CAM is disposed on the left side of the second optical axis direction 32, and the visible light source VIS is disposed on the right side of the second optical axis direction 32, adjacent to the first object mirror OL1.

[0036] Please refer to FIG. 1D. FIG. 1D is a block diagram showing a fourth embodiment of an optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to the present invention. The difference from the embodiment shown in FIG. 1C is that the positions of the camera CAM and the visible light source VIS of the visible light camera module 22d in the embodiment of FIG. 1D are different from those of the visible light camera module 22c in the embodiment of FIG. 1C. Other components are the same as those in the embodiment of FIG. 1C, and therefore will not be described again here.

[0037] The visible light camera module 22d is composed of a camera CAM, a visible light source VIS, and a spectrometer BS. The spectrometer BS may be installed in the second optical axis direction 32. The visible light source VIS may be installed adjacent to the bottom surface of the inspection object 40. The visible light source VIS is used to illuminate the inspection object 40. More specifically, the camera CAM is installed on the left side of the second optical axis direction 32, and the visible light source VIS is installed on the right side of the second optical axis direction 32, adjacent to the bottom surface of the inspection object 40.

[0038] For the sake of convenience, the configuration of the first embodiment of the present invention will be exemplified below, but the same or similar effects can be obtained even when the configurations of the second to fourth embodiments of the present invention are adopted.

[0039] Please refer to Fig. 2. Fig. 2 is a diagram showing a YZ cross-sectional structure image and an XZ cross-sectional structure image according to the first embodiment of the present invention.

[0040] The optical scanning device 20 can acquire a corresponding optical signal by scanning the inspection object 40 along the Y-axis direction. The optical scanning device 20 can achieve scanning along the Y-axis direction using a driving device (not shown). The driving device may be, for example, a linear motor, but is not limited to this. The optical signal is transmitted by the optical scanning device 20 to the optical image processing device 10, which performs a signal-to-image conversion process to acquire successive YZ cross-sectional structure images 12 at different positions of the inspection object 40. The optical scanning device 20 can then acquire a corresponding optical signal by scanning the inspection object 40 along the X-axis direction. The optical signal is transmitted by the optical scanning device 20 to the optical image processing device 10, which performs a signal-to-image conversion process to acquire successive YZ cross-sectional structure images 12 at different positions of the inspection object 40.

[0041] Similarly, the optical scanning device 20 can acquire corresponding optical signals by scanning the inspection object 40 along the X-axis direction. The optical scanning device 20 can achieve scanning along the X-axis direction by a driving device. The optical signals are transmitted by the optical scanning device 20 to the optical image processing device 10, which performs signal-to-image conversion processing, thereby acquiring successive X-Z cross-sectional structure images at different positions of the inspection object 40 (illustrations showing the X-Z cross-sectional structure images are omitted for simplicity in FIG. 2 ). Then, the optical scanning device 20 can acquire corresponding optical signals by scanning the inspection object 40 along the Y-axis direction. The optical signals are transmitted by the optical scanning device 20 to the optical image processing device 10, which performs signal-to-image conversion processing, thereby acquiring successive X-Z cross-sectional structure images at different positions of the inspection object 40.

[0042] The optical image processing device 10 can combine successive YZ cross-sectional structure images at different positions or successive XZ cross-sectional structure images at different positions to obtain successive XY cross-sectional structure images 14 at different depths (Z-axis direction). This allows the optical image processing device 10 to reconstruct a three-dimensional structure image of the inspection object 40. The three-dimensional structure image may include, but is not limited to, successive YZ cross-sectional structure images 12 at different positions, successive XZ cross-sectional structure images at different positions, and successive XY cross-sectional structure images 14 at different depths.

[0043] The optical scanning device 20 can acquire optical signals in the Z-axis direction by scanning the inspection object 40. Therefore, there is no need to change the Z-axis position of the optical scanning device 20 using a driving device. This improves the convenience of inspecting the inspection object 40 and shortens the time required to scan the inspection object 40.

[0044] Please refer to Figure 3. Figure 3 is a diagram showing the tilt of the optical scanning device of the first embodiment of the present invention.

[0045] To acquire a structural image of the object 40 in a specific direction (e.g., a sidewall or a shape), the optical scanning device 20 may be tilted at a predetermined angle θ by the deflecting device 21. For example, the optical scanning device 20 scans the object 40 along the second optical axis direction 32. To acquire a structural image of the object 40 in a specific direction, the deflecting device 21 may tilt the optical scanning device 20 in a third optical axis direction 34 that forms a predetermined angle θ with the second optical axis direction 32. The predetermined angle θ may be, for example, in the range of 20° to 70°, but is preferably 45°. This allows the optical scanning system 100 to expand the measurement items that can be measured by non-destructively acquiring the three-dimensional structure of an object. In another embodiment, to acquire a structural image of the object 40 in a specific direction (e.g., a sidewall or a shape), the optical scanning device 20 may be stationary and the object 40 may be tilted at a specific angle θ by another deflecting device (not shown).

[0046] Please refer to Figure 4. Figure 4 shows an image obtained by scanning an object to be inspected with the optical scanning device of the embodiment of Figure 3 tilted at a predetermined angle θ.

[0047] In this embodiment, the inspection object 40 is a glass substrate having multiple TGVs. As shown in FIG. 4, a 3D structural image of each TGV along the X-axis direction can be confirmed. By observing the 3D structural image from the top 42 to the waist 44 and bottom 46 of each TGV, the presence or absence of defects in the TGV can be confirmed, and information such as the shape of the TGV, waist depth, cone angle, and size of each part can be obtained. The information can be used as a reference for adjusting or correcting parameters in the TGV manufacturing process.

[0048] Please refer to Figure 5. Figure 5 is a YZ cross-sectional structure image of the first embodiment of the present invention.

[0049] In this embodiment, the top 47 and the bottom 48 may be identified from the YZ cross-sectional structure image 12 based on their respective image features, and the distance between the top 47 and the bottom 48 (also referred to as the optical path difference) may be calculated. Then, the calculated distance value may be divided by the refractive index of the inspection object 40, thereby obtaining the thickness of the inspection object 40. In another embodiment, the top 47 and the bottom 48 may be identified from the XZ cross-sectional structure image based on their respective image features, and the distance between the top 47 and the bottom 48 (also referred to as the optical path difference) may be calculated. Then, the calculated distance value may be divided by the refractive index of the inspection object 40, thereby obtaining the thickness of the inspection object 40.

[0050] From the YZ cross-sectional structure image 12, it is confirmed that there is a defect (the part indicated by the arrow) at position 41 of the TGV. As a result, in the embodiment of the present invention, the internal structure and defects of the TGV can be easily and clearly observed, solving the problem of not being able to observe the internal structure of the TGV as in the prior art. Furthermore, because the embodiment of the present invention is not a destructive inspection method, it also solves the problem of increased manufacturing costs of TGVs caused by destructive inspection methods in the prior art.

[0051] Please refer to Figures 6A to 6C, which are successive XY cross-sectional structure images at different positions in the Z-axis direction in the first embodiment of the present invention.

[0052] In this embodiment, the inspection target 40 is a glass substrate having a plurality of TGVs. An optical reflector (not shown) is installed below the inspection target 40 to check the quality and minimum hole diameter of the TGVs. The optical reflector is a material that easily generates optical reflection, such as a reflective mirror, aluminum sheet, or glass.

[0053] When the scanning beam passes through the TGV and reaches the optical reflector below, the optical reflector reflects the scanning beam to the optical image processing device 10. The optical image processing device 10 can generate successive XY cross-sectional structure images 14 at different positions in the Z-axis direction. As shown in FIG. 6A, the TGV is shown as a black circle in the XY cross-sectional structure image of the top surface. As shown in FIG. 6B, the TGV is shown as a white circle in the XY cross-sectional structure image of the waist. The white circle is formed by reflection. The white part (or bright part) represents the hole of the TGV that is penetrated. As shown in FIG. 6C, the TGV is shown as a black circle in the XY cross-sectional structure image of the bottom surface.

[0054] If there is blocking or a defect in the TGV, it will affect the shape of the white circle (for example, the white circle in the square frame in Figure 6B). Therefore, by detecting the area and shape of the white circle, it is possible to confirm whether there is blocking or a defect in the TGV. In this way, in this embodiment, it is possible to confirm whether there is a blocking problem in the TGV from consecutive XY cross-sectional structure images at different positions in the Z-axis direction.

[0055] Furthermore, the area of ​​the white circle formed when the scanning beam is incident on the TGV and reflected corresponds to the waist, which is the narrowest part of the TGV, and therefore any reflected scanning beam wider than the waist is blocked and cannot pass through the TGV and return to the optical image processing device 10. Therefore, the area of ​​the reflected circle can be considered to be the same as the area of ​​the hole diameter of the TGV's waist. As a result, in this embodiment, the area of ​​the hole diameter of the TGV's waist can be obtained from successive XY cross-sectional structure images 14 taken at different positions in the Z-axis direction, further expanding the measurement items of the TGV.

[0056] In another embodiment, the optical image processing device 10 may mark the XY cross-sectional structure image with defects to easily obtain information about the location and quantity of defects in the TGV, which can be used as a reference for adjusting or correcting parameters in the manufacturing process of the TGV.

[0057] According to the above configuration, in the optical scanning system for non-destructively acquiring the three-dimensional structure of an object according to the present invention, the optical scanning device scans the inspection object with a light beam to acquire an optical signal. The optical image processing device then converts the acquired optical signal to generate an image of the three-dimensional structure of the inspection object. This makes it possible to easily inspect the exterior and interior of the inspection object simultaneously. Therefore, with the above configuration, by taking a magnified image of the surface of the sample as with a conventional optical microscope, only the surface condition of the sample can be analyzed from the acquired surface image, but the problem of not being able to observe the inside of the sample can be solved. Furthermore, optical scanning devices, which are far simpler in configuration and less expensive than scanning electron microscopes, can solve the problem of high costs of inspection devices in the prior art and reduce the cost of inspecting objects. Furthermore, by tilting the optical scanning device at a predetermined angle, structural images of the object being inspected can be acquired in a specific direction, thereby expanding the measurement options of the optical scanning system. [Explanation of symbols]

[0058] 10 Optical image processing device 12 YZ cross-sectional structure image 14 XY cross-sectional structure image 20 Optical scanning device 21 Turning device 22a Visible light camera module 22b Visible light camera module 22c Visible Light Camera Module 22d visible light camera module 25 luminous flux 30 First optical axis direction 32 Second optical axis direction 34 3rd optical axis direction 40 Inspection object Location of 41 TGV 42 Top 44 Waist 46 Bottom 100 Optical scanning system for non-destructively acquiring the 3D structure of an object C Collimator CAM camera BS spectrometer LP1 1st Lens Set LP2 2nd Lens Set OL1 First Object Mirror OL2 Second Object Mirror S Beam Scanner VIS visible light source X-axis direction Y-axis direction Z axis direction θ angle

Claims

1. an optical image processor arranged to generate a light beam along a first optical axis; an optical scanning device coupled to the optical image processing device, configured to convert a light beam along the first optical axis direction into a light beam along a second optical axis direction, and scan an inspection object using the light beam along the second optical axis direction; When the optical image processing device scans the inspection object along the Y-axis direction to acquire a corresponding YZ cross-sectional structure image, the optical image processing device scans along the X-axis direction to acquire a corresponding YZ cross-sectional structure image, When the optical image processing device scans the inspection object along the X-axis direction to acquire a corresponding XZ cross-sectional structure image, the optical scanning device scans the inspection object along the Y-axis direction to acquire a corresponding XZ cross-sectional structure image, The optical image processing device is an optical scanning system that non-destructively acquires the three-dimensional structure of an object, and reconstructs a three-dimensional structure image corresponding to the object to be inspected based on successive YZ cross-sectional structure images at different positions or successive XZ cross-sectional structure images at different positions.

2. The optical scanning device further comprises: a collimator arranged to convert a light beam along the first optical axis direction into a light beam parallel to the first optical axis direction; a light beam scanner disposed at an intersection of the first optical axis direction and the second optical axis direction, and installed to convert a light beam parallel to the first optical axis direction into a light beam parallel to the second optical axis direction; a first lens set disposed in the second optical axis direction so as to diverge or converge a light beam parallel to the second optical axis direction; a visible light camera module disposed in the second optical axis direction and arranged to acquire a two-dimensional structural image corresponding to the inspection object; a second lens set disposed in the second optical axis direction so as to diverge or converge a light beam parallel to the second optical axis direction; 2. An optical scanning system for non-destructively acquiring the three-dimensional structure of an object as described in claim 1, comprising: an object mirror module installed on the side of the second lens set in the second optical axis direction and arranged to converge a light beam parallel to the second optical axis direction and irradiate the object to be inspected.

3. 3. The optical scanning system for non-destructively acquiring the three-dimensional structure of an object as described in claim 2, wherein the visible light camera module is composed of a camera, a visible light source, and a spectrometer, and the spectrometer is installed in the direction of a second optical axis.

4. The optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to claim 3 , wherein the camera and the visible light source are respectively installed on both sides of the spectrometer.

5. 4. The optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to claim 3, wherein the visible light source is disposed adjacent to the object mirror module and is used to illuminate an object to be inspected.

6. 4. The optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to claim 3, wherein the visible light source is disposed adjacent to a bottom surface of the inspection object and is used to illuminate the inspection object.

7. The optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to claim 2 , wherein the object mirror module has an adjustable focus magnification.

8. 2. The optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to claim 1, further comprising a turning device coupled to the optical scanning device for tilting the optical scanning device at a predetermined angle from the second optical axis direction.

9. The optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to claim 1 , wherein the optical image processing device acquires a thickness of the object to be inspected based on the YZ cross-sectional structure image or the XZ cross-sectional structure image.

10. 2. The optical scanning system for non-destructively acquiring a three-dimensional structure of an object according to claim 1, wherein, when the object to be inspected is a glass substrate having a plurality of through-glass vias (TGVs), the optical image processing device checks whether there is blocking and / or defects in the TGVs from successive XY cross-sectional structure images taken at different positions in the Z-axis direction.

Images