Radiation conversion unit and method for manufacturing radiation conversion unit

Abstract

To provide a radiation conversion unit capable of sufficiently securing moisture resistance of a scintillator layer, and method for manufacturing the radiation conversion unit.SOLUTION: A radiation detector 10 comprises a sensor panel 11 and a scintillator panel 1 disposed on the sensor panel 11. The scintillator panel 1 includes: a support layer 4; a scintillator layer 5 disposed on the sensor panel 11 side relative the support layer 4; an adhesive layer 6 disposed on the sensor panel 11 side relative to the scintillator layer 5 and in contact with the sensor panel 11; and a first moisture-proof layer 3 integrally covering an outer edge 51 of the scintillator layer 5 and an outer edge 61 of the adhesive layer 6. An edge 31 of the first moisture-proof layer 3 in the sensor panel 11 side includes at least one of an inner portion 311 disposed between the sensor panel 11 and the adhesive layer 6 in the inside relative to the edge 31 of the adhesive layer 6, and an outer portion disposed on the sensor panel 11 in the outside relative to the outer edge 61 of the adhesive layer 6.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a radiation conversion unit and a method for manufacturing the radiation conversion unit. [Background technology]

[0002] As a conventional radiation conversion unit (radiation detector), Patent Document 1 describes a configuration in which a scintillator panel that converts radiation into light and a sensor panel that detects the converted light are bonded together via an adhesive layer. In the configuration described in Patent Document 1, the columnar crystal layer (scintillator layer) is covered with a moisture-proof protective layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-172511 Summary of the Invention [Problem to be solved by the invention]

[0004] In the radiation conversion unit described above, it is extremely important to ensure that the scintillator layer is moisture-proof.

[0005] An object of the present invention is to provide a radiation conversion unit capable of ensuring sufficient moisture resistance of the scintillator layer, and a method for producing such a radiation conversion unit. [Means for solving the problem]

[0006] The radiation conversion unit of the present invention is [1] "a radiation conversion unit comprising: a light receiving unit; and a scintillator panel arranged on the light receiving unit, wherein the scintillator panel includes: a support layer; a scintillator layer arranged on the light receiving unit side of the support layer and including a plurality of columnar crystals; an adhesive layer arranged on the light receiving unit side of the scintillator layer and in contact with the light receiving unit; and a first moisture-proof layer integrally covering an outer edge portion of the scintillator layer and an outer edge portion of the adhesive layer, wherein the edge portion of the first moisture-proof layer on the light receiving unit side includes at least one of an inner portion arranged between the light receiving unit and the adhesive layer on the inner side of the outer edge portion of the adhesive layer, and an outer portion arranged on the light receiving unit on the outer side of the outer edge portion of the adhesive layer."

[0007] In the radiation conversion unit described in [1] above, the first moisture-proof layer integrally covers the outer edge of the scintillator layer and the outer edge of the adhesive layer. This prevents moisture from penetrating through the outer edge of the scintillator layer, the outer edge of the adhesive layer, and the interface between the scintillator layer and the adhesive layer. Furthermore, the edge of the first moisture-proof layer on the light-receiving unit side includes an inner portion disposed between the light-receiving unit and the adhesive layer on the inner side of the outer edge of the adhesive layer, and an outer portion disposed on the light-receiving unit on the outer side of the outer edge of the adhesive layer. This increases the contact area between the edge of the first moisture-proof layer and the light-receiving unit, preventing moisture from penetrating through the interface between the edge of the first moisture-proof layer and the light-receiving unit. As a result, the radiation conversion unit described above can sufficiently ensure moisture-proofness of the scintillator layer.

[0008] The radiation conversion unit of the present invention may be [2] "the radiation conversion unit according to the above [1], wherein the edge of the first moisture proof layer on the light receiving section side includes the inner portion." According to the radiation conversion unit according to [2], the area on the light receiving section that is outside the outer edge of the scintillator panel can be effectively utilized, and wiring, IC circuits, etc. can be arranged in this area.

[0009] The radiation conversion unit of the present invention may be [3] "the radiation conversion unit according to the above [1] or [2], wherein the edge of the first moisture proof layer on the light receiving unit side includes the outer portion." According to the radiation conversion unit according to [3], the first moisture proof layer is not present in the area on the light receiving unit where the light receiving unit and the adhesive layer are in contact with each other, so that a wide light receiving area of ​​the light receiving unit can be ensured.

[0010] The radiation conversion unit of the present invention may be [4] "the radiation conversion unit according to any one of the above [1] to [3], wherein the width of each of the inner portion and the outer portion is 0.5 μm or more and 300 μm or less." The radiation conversion unit according to [4] can reliably ensure the moisture resistance of the scintillator layer while preventing the light-receiving region from becoming narrower than necessary.

[0011] The radiation conversion unit of the present invention may be [5] "the radiation conversion unit according to any one of the above [1] to [4], wherein the first moisture proof layer further integrally covers the outer edge of the support layer and the surface of the support layer opposite to the scintillator layer." According to the radiation conversion unit described in [5], the first moisture proof layer further integrally covers the outer edge of the support layer and the surface of the support layer opposite to the scintillator layer, so that the support layer and the interface between the scintillator layer and the support layer are not exposed to the outside. This makes it possible to suppress moisture penetration from the support layer and the interface between the scintillator layer and the support layer, and further improve the moisture proofness of the scintillator layer.

[0012] The radiation conversion unit of the present invention may be [6] "the radiation conversion unit according to any one of the above [1] to [5], further comprising a second moisture-proof layer disposed between the scintillator layer and the adhesive layer." The radiation conversion unit according to [6] can more sufficiently ensure the moisture-proofness of the scintillator layer.

[0013] The radiation conversion unit of the present invention may be [7] "the radiation conversion unit according to any one of the above [1] to [6], wherein, when viewed from the thickness direction of the support layer, the outer edge of the support layer, the outer edge of the scintillator layer, and the outer edge of the adhesive layer are aligned." The radiation conversion unit according to [7] facilitates alignment of the scintillator panel with the light-receiving section when attaching the scintillator panel to the light-receiving section.

[0014] The radiation conversion unit for a radiation detector of the present invention may be [8] "the radiation conversion unit according to any one of the above [1] to [7], wherein the light receiving section is a sensor panel." According to the radiation conversion unit according to [8], by including a sensor panel, it is possible to obtain a radiation conversion unit with a highly moisture-proof scintillator layer that can operate as a radiation detector.

[0015] The method for manufacturing a radiation conversion unit of the present invention is [9] "a method for manufacturing a radiation conversion unit, comprising the steps of: preparing a scintillator panel including a support layer, a scintillator layer disposed on the support layer and including a plurality of columnar crystals, an adhesive layer disposed on the scintillator layer, a release layer disposed on the adhesive layer, and a moisture-proof layer integrally covering an outer edge of the scintillator layer, an outer edge of the adhesive layer, an outer edge of the release layer, and a surface of the release layer opposite to the adhesive layer; removing a portion of the moisture-proof layer covering the surface of the release layer together with the release layer; and attaching the scintillator panel to a light-receiving unit via the adhesive layer."

[0016] In the method for producing a radiation conversion unit described in [9], a scintillator panel is prepared, including a moisture-proof layer integrally covering the outer edge of the scintillator layer, the outer edge of the adhesive layer, the outer edge of the release layer, and the surface of the release layer opposite the adhesive layer. This ensures the moisture-proof properties of the scintillator layer, including a plurality of columnar crystals, even when the scintillator panel is unused. Furthermore, in the method for producing a radiation conversion unit described in [8], the portion of the moisture-proof layer covering the surface of the release layer is removed together with the release layer. As a result, the edge of the moisture-proof layer covering the outer edge of the release layer protrudes from the outer edge of the adhesive layer toward the light-receiving unit. In this state, the scintillator panel is attached to the light-receiving unit via the adhesive layer. This results in the edge of the first moisture-proof layer including at least one of an inner portion disposed between the light-receiving unit and the adhesive layer on the inner side of the outer edge of the adhesive layer and an outer portion disposed on the light-receiving unit on the outer side of the outer edge of the adhesive layer. Therefore, the method for producing a radiation conversion unit described in [8] can provide a radiation conversion unit that ensures sufficient moisture-proof properties of the scintillator layer. [Effects of the Invention]

[0017] According to the present invention, it is possible to provide a radiation conversion unit that can ensure sufficient moisture resistance of the scintillator layer, and a method for manufacturing a radiation detector that can obtain such a radiation conversion unit. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a cross-sectional view of a scintillator panel according to an embodiment. [Figure 2] 2 is a cross-sectional view of a radiation detector including the scintillator panel shown in FIG. 1. FIG. [Figure 3] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 4] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 5] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 6] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 7] 3A to 3C are diagrams illustrating a method for manufacturing the radiation detector shown in FIG. 2. [Figure 8] FIG. 10 is a cross-sectional view of a radiation detector according to a modified example. [Figure 9] FIG. 10 is a cross-sectional view of a modified scintillator panel. [Figure 10] FIG. 10 is a cross-sectional view of a radiation detector including the scintillator panel shown in FIG. [Figure 11] 10A to 10C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 12] 10A to 10C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 13] 11A to 11C are diagrams illustrating a method for manufacturing the radiation detector shown in FIG. 10. [Figure 14] FIG. 10 is a cross-sectional view of a modified scintillator panel. [Figure 15] FIG. 10 is a cross-sectional view of a modified scintillator panel. [Figure 16] FIG. 16 is a plan view of the scintillator panel shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each drawing, the same or corresponding parts are designated by the same reference numerals, and duplicated explanations will be omitted. [Scintillator panel configuration]

[0020] As shown in FIG. 1 , the scintillator panel 1 includes a scintillator unit 2 and a first moisture-proof layer 3. The first moisture-proof layer 3 covers the scintillator unit 2. The scintillator unit 2 includes a support layer 4, a scintillator layer 5, an adhesive layer 6, a release layer 7, and a second moisture-proof layer 8. The scintillator layer 5 is disposed on the support layer 4. The adhesive layer 6 is disposed on the scintillator layer 5. The release layer 7 is disposed on the adhesive layer 6. In other words, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the release layer 7 are stacked on the support layer 4 in this order in the thickness direction of the support layer 4 (hereinafter, "direction A"). In other words, the second moisture-proof layer 8 is disposed between the scintillator layer 5 and the adhesive layer 6. When viewed from direction A, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 8a of the second moisture-proof layer 8, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are aligned. In other words, the outer edges 4a, 5a, 8a, 6a, and 7a are flush with each other.

[0021] The first moisture-proof layer 3 integrally covers the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 81 of the second moisture-proof layer 8, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, the surface 7b of the release layer 7, and the surface 4b of the support layer 4. The surface 7b of the release layer 7 is the surface of the release layer 7 opposite the adhesive layer 6. The surface 4b of the support layer 4 is the surface of the support layer 4 opposite the scintillator layer 5. That is, the first moisture-proof layer 3 integrally covers the scintillator unit 2 continuously and seamlessly. Therefore, in the scintillator panel 1, the interfaces between the first moisture-proof layer 3 and each layer are not exposed to the outside. The first moisture-proof layer 3 functions to prevent moisture from penetrating into the scintillator unit 2 from the outside. In the scintillator panel 1, the thickness of the first moisture-proof layer 3 is uniform over the entire surface of the scintillator unit 2 and is 0.5 μm or more and 40 μm or less. The material of the first moisture proof layer 3 is, for example, parylene (polyparaxylene).

[0022] The support layer 4 includes a first support layer 401 and a second support layer 402. The second support layer 402 is disposed on the first support layer 401, positioned on the scintillator layer 5 side of the first support layer 401. The outer edge of the first support layer 401 and the outer edge of the second support layer 402 form the outer edge 41 of the support layer 4. When viewed from direction A, the outer edge of the first support layer 401 and the outer edge of the second support layer 402 are aligned.

[0023] The first support layer 401 has a function of preventing moisture from entering the scintillator unit 2 from the outside and a function of preventing light from entering the scintillator unit 2 from the outside. The material of the first support layer 401 is, for example, a composite material combining a resin material and a metal material. As an example, the material of the first support layer 401 is a composite material of PET (polyethylene terephthalate) and Al. The resin material contained in the first support layer 401 may be PEN (polyethylene naphthalate), PI (polyimide), PP (polypropylene), PE (polyethylene), PU (polyurethane), PMMA (polymethyl methacrylate), etc. The metal material contained in the first support layer 401 may be Cu, Ti, Fe, SUS (stainless steel), etc.

[0024] The second support layer 402 has a function of reflecting light emitted from the scintillator layer 5 in response to incidence of radiation (e.g., X-rays). The material of the second support layer 402 is, for example, a composite material in which a resin material and a white inorganic material are combined. As an example, the material of the second support layer 402 is a composite material of PET and a white inorganic material. In addition to PET, examples of the resin material include PEN, PI, PP, PE, PU, ​​and PMMA. Examples of the white inorganic material include TiO2, ZnO, and LAS (lithium aluminum silicate).

[0025] The thickness of the first support layer 401 is, for example, not less than 30 μm and not more than 250 μm. The thickness of the second support layer 402 is, for example, not less than 10 μm and not more than 250 μm. The support layer 4 is flexible. The support layer 4 can be bent to have a radius of curvature of, for example, not less than 30 mm and not more than 120 mm.

[0026] The scintillator layer 5 is disposed on the surface of the second support layer 402 opposite to the first support layer 401. The scintillator layer 5 includes a plurality of columnar crystals 50. The columnar crystals 50 are aligned along a plane perpendicular to direction A. Each columnar crystal 50 extends in direction A and has a substantially uniform height (thickness) over the entire region. Each columnar crystal 50 includes a first end 50a on the side opposite to the support layer 4 and a second end 50b on the support layer 4 side. Each first end 50a tapers toward the side opposite to the support layer 4. Examples of the material for scintillator layer 5 include CsI:Tl (cesium iodide containing thallium as an activator), CsI:Na (cesium iodide containing sodium as an activator), CsI:Ce (cesium iodide containing cerium as an activator), CsI:Tl,Eu (cesium iodide containing thallium and europium as activators), etc. The thickness of scintillator layer 5 is, for example, 50 μm or more and 1000 μm or less (preferably, 100 μm or more and 300 μm or less when resolution is required, and 400 μm or more and 700 μm or less when sensitivity is required).

[0027] The second moisture-proof layer 8 covers the first end portions 50a. The second moisture-proof layer 8 has a function of preventing moisture from migrating from the adhesive layer 6 to the scintillator layer 5 even if the adhesive layer 6 absorbs moisture. The material of the second moisture-proof layer 8 is, for example, parylene (polyparaxylene). The thickness of the second moisture-proof layer 8 is smaller than that of the first moisture-proof layer 3. The thickness of the second moisture-proof layer 8 is, for example, half or less of the thickness of the first moisture-proof layer 3. Here, the thickness of the second moisture-proof layer 8 refers to, for example, the distance between a plane and the surface 8b of the second moisture-proof layer 8 opposite the scintillator layer 5 when the tips of the first end portions 50a are aligned along the plane. The thickness of the second moisture-proof layer 8 is 0.5 μm or more and 40 μm or less.

[0028] The adhesive layer 6 is disposed on the second moisture-proof layer 8. The adhesive layer 6 is in contact with the surface 8b of the second moisture-proof layer 8. The adhesive layer 6 functions as an adhesive layer for bonding the scintillator panel 1 to the sensor panel 11. The material of the adhesive layer 6 is an organic material having optical transparency, such as OCA (Optical Clear Adhesive). The thickness of the adhesive layer 6 is, for example, 0.5 μm or more and 50 μm or less.

[0029] The release layer 7 is in contact with the surface 6b of the adhesive layer 6 opposite the scintillator layer 5. The release layer 7 has releasability relative to the surface 6b of the adhesive layer 6. The release layer 7 is, for example, a release film and can be easily peeled off from the surface 6b. The release layer 7 is peeled off from the surface 6b of the adhesive layer 6 when the scintillator panel 1 is in use. The release layer 7 protects the adhesiveness of the adhesive layer 6 and prevents unwanted substances from adhering to the adhesive layer 6 when the scintillator panel 1 is not in use. The material of the release layer 7 is, for example, PET, PE, PP, etc. The surface of the release layer 7 facing the adhesive layer 6 may be coated with a silicone-based release agent. This allows the release layer 7 to be easily peeled off from the surface 6b of the adhesive layer 6. The first moisture-proof layer 3 has a peel trigger 32 (weak portion) in the outer peripheral region 3a of the release layer 7 on the surface 7b opposite the adhesive layer 6 to facilitate peeling by the user. The peel trigger 32 has a lower strength in the outer edge region 3a than in the central region 3b on the surface 7b side of the release layer 7. For example, in a scintillator panel 1 that is rectangular when viewed from direction A, the peel trigger 32 may be provided in at least one of the four corners on the surface 7b side of the first moisture proof layer 3. As shown in FIG. 1, the peel trigger 32 may be a notch provided in a corner of the first moisture proof layer 3. Alternatively, the peel trigger 32 may be a notch provided around the entire periphery of the outer edge region 3a including the corner of the first moisture proof layer 3, a notch provided in a direction parallel to the surface 7b of the release layer 7, or a notch provided in a direction parallel to the outer edge 7a of the release layer 7 in direction A (a direction perpendicular to the surface 7b). The thickness of the release layer 7 is 5 μm or more and 300 μm or less. [Radiation detector configuration]

[0030] As shown in FIG. 2, the radiation detector (radiation conversion unit) 10 includes the scintillator panel 1 described above and a sensor panel (light-receiving section) 11. The sensor panel 11 has a light-receiving surface 11a. The scintillator panel 1 is disposed on the light-receiving surface 11a with the scintillator layer 5 positioned on the sensor panel 11 side with respect to the support layer 4. The scintillator panel 1 is adhered to the sensor panel 11 by an adhesive layer 6. A plurality of photoelectric conversion elements (not shown) are provided on the sensor panel 11 along the light-receiving surface 11a. Each photoelectric conversion element forms a pixel and outputs an electrical signal in response to incident light. In the radiation detector 10, light emitted from the scintillator layer 5 of the scintillator panel 1 in response to incident radiation is detected by the sensor panel 11. The radiation detector 10 is used as a radiation imaging device, for example, in a medical radiation image diagnostic device, a non-destructive testing device, etc.

[0031] The radiation detector 10 is manufactured by peeling the release layer 7 from the adhesive layer 6, removing the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7, and then attaching the scintillator panel 1 to the sensor panel 11 via the adhesive layer 6. When the scintillator panel 1 is attached to the sensor panel 11, the edge 31 of the first moisture-proof layer 3 on the sensor panel 11 side includes an inner portion 311. The inner portion 311 is a portion that is located between the sensor panel 11 and the adhesive layer 6, on the inside of the outer edge 61 of the adhesive layer 6. The inner portion 311 may be a portion where the edge 31 is folded back on the inside of the outer edge 61 of the adhesive layer 6. The inner portion 311 covers the surface 6b of the adhesive layer 6 and also covers the light-receiving surface 11a of the sensor panel 11, on the inside of the outer edge 61 of the adhesive layer 6. In other words, the inner portion 311 is disposed at the outer edge 61 of the adhesive layer 6 between the surface 6b of the adhesive layer 6 and the light receiving surface 11a of the sensor panel 11.

[0032] The width D1 of the inner portion 311 varies along the outer edge 6a of the adhesive layer 6. Here, the width D1 of the inner portion 311 is the length from the outer edge 6a to the end face 31a of the edge portion 31 in a direction perpendicular to the direction A. The width D1 is 0.5 μm or more and 300 μm or less, and more preferably 5 μm or more and 200 μm or less. When the width D1 varies, the width D1 being 5 μm or more and 200 μm or less means that the maximum and minimum values ​​of the width D1 are within the range of 5 μm or more and 200 μm or less.

[0033] The radiation detector 10 further includes a sealing member 12. The sealing member 12 extends in a frame shape in a region of the surface of the sensor panel 11 that surrounds the light receiving surface 11a, and covers the side surfaces of the scintillator panel 1. The sealing member 12 has the function of preventing moisture from penetrating through the interface between the first moisture-proof layer 3 and the sensor panel 11. The material of the sealing member 12 is, for example, epoxy, silicone, fluorine, urethane, acrylic, etc. The material of the sealing member 12 may contain a filler made of an inorganic material such as glass. [Scintillator panel manufacturing method]

[0034] A method for manufacturing the scintillator panel 1 described above will be described. First, as shown in FIG. 3(a), a second support layer 402 bonded to a carrier substrate 13 is prepared. The carrier substrate 13 and the second support layer 402 may be bonded together using an adhesive or double-sided tape. The material of the carrier substrate 13 is, for example, a glass substrate. To improve smoothness and releasability, the surface of the carrier substrate 13 may be coated with a release agent. The thickness of the carrier substrate 13 is, for example, 0.1 mm or more and 1.5 mm or less. Next, as shown in FIG. 3(b), a scintillator layer 5 is formed on the second support layer 402 by a vapor deposition method. In this embodiment, the scintillator layer 5 is formed on the second support layer 402 by a vapor deposition method. As a result, in the plurality of columnar crystals 50, the plurality of second end portions 50b are located on the second support layer 402 side, and the plurality of first end portions 50a are located on the opposite side from the second support layer 402. An example of a vapor phase deposition method other than the vapor deposition method is the sputtering method.

[0035] Next, as shown in FIG. 4(a), the carrier substrate 13, the second support layer 402, and the scintillator layer 5 are covered with the second moisture-proof layer 8. In the example of FIG. 4(a), the surface of the carrier substrate 13 opposite the second support layer 402, both ends of the carrier substrate 13, both ends of the second support layer 402, both ends of the scintillator layer 5, and the plurality of first end portions 50a of the scintillator layer 5 are integrally covered with the second moisture-proof layer 8. Next, as shown in FIG. 4(b), the carrier substrate 13 is removed from the second support layer 402. In the example of FIG. 4(b), the portions of the second moisture-proof layer 8 that covered the surface of the carrier substrate 13 and the portions that covered both ends of the carrier substrate 13 are removed together with the carrier substrate 13. As a result, the surface of the second support layer 402 opposite the scintillator layer 5 is exposed to the outside.

[0036] Next, as shown in FIG. 5(a), a first support layer 401 is bonded to the surface of the second support layer 402 opposite the scintillator layer 5. An adhesive layer 6 is prepared with a release layer 7 bonded to its surface 6b, and the adhesive layer 6 is placed on the scintillator layer 5 with a second moisture-proof layer 8 interposed therebetween. In the example of FIG. 5(a), a surface 6c of the adhesive layer 6 opposite the release layer 7 is bonded to the surface 8b of the second moisture-proof layer 8. Next, as shown in FIG. 5(b), the first support layer 401, the second support layer 402, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the release layer 7 are cut to a predetermined size in direction A. For example, a laminate composed of the support layer 4, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the release layer 7 is cut from the state shown in FIG. 5(a) so as to obtain a plurality of scintillator units 2 having the same dimensions and shape (e.g., rectangular). Alternatively, for example, a single scintillator unit 2 may be obtained by cutting the respective edges of the support layer 4, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the release layer 7. As a result, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 8a of the second moisture-proof layer 8, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are aligned. These outer edges then constitute the outer edge of the scintillator unit 2. Note that a blade whose tip gradually becomes thinner in direction A may be used as the blade used for cutting. When cutting with such a blade, the outer edge of the scintillator unit 2 may gradually become larger in direction A. The manufacturing steps described above in FIGS. 4(a) to 5(b) correspond to the step of preparing the scintillator unit 2, and the cutting step described in FIG. 5(b) is included in the step of preparing the scintillator unit 2.

[0037] 6, the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, the outer edge 81 of the second moisture-proof layer 8, and the surface 7b of the release layer 7 opposite the adhesive layer 6 are covered integrally with the first moisture-proof layer 3 (a step of covering integrally with the first moisture-proof layer 3). As a result, the entire surface of the scintillator unit 2 is completely surrounded by the first moisture-proof layer 3. As a result, the interfaces between the layers of the scintillator unit 2 and the interfaces between the layers and the first moisture-proof layer 3 are covered by the first moisture-proof layer 3 and are not exposed to the outside. In this way, the scintillator panel 1 is manufactured. [Radiation detector manufacturing method]

[0038] A method for manufacturing the radiation detector 10 described above will be described. First, as shown in FIG. 7(a), the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7 is removed together with the release layer 7 (a step of removing the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7 together with the release layer 7). Because the release layer 7 has releasability with respect to the surface 6b of the adhesive layer 6, the release layer 7 is easily peeled off from the surface 6b. If a peeling trigger is provided at a corner of the release layer 7, the user may grasp the peeling trigger and peel off the release layer 7. When the release layer 7 is peeled off, the surface 6b is exposed to the outside.

[0039] As a result of the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7 being removed together with the release layer 7, the portion of the first moisture-proof layer 3 that covered the outer edge 71 of the release layer 7 protrudes from the outer edge 61 of the adhesive layer 6 toward the sensor panel 11. This protruding portion becomes the edge 31 of the first moisture-proof layer 3. At this time, burrs are formed on the edge 31. For example, the end face 31a of the edge 31 has an irregular uneven shape (e.g., a sawtooth shape) when viewed from the thickness direction of the first moisture-proof layer 3.

[0040] 7(b), the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 (a step of attaching the scintillator panel 1 to the sensor panel 11 via the adhesive layer 6). At this time, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 in a state in which the edge 31 of the first moisture-proof layer 3 protrudes from the outer edge 61 of the adhesive layer 6 toward the sensor panel 11. As a result, the edge 31 includes a portion that is folded inward relative to the outer edge 61 of the adhesive layer 6. This results in the edge 31 including an inner portion 311.

[0041] Finally, as shown in Fig. 2, the side surfaces of the scintillator panel 1 are covered with a sealing member 12. In this way, the radiation detector 10 is manufactured. [Action and effect]

[0042] In the radiation detector 10, the first moisture proof layer 3 integrally covers the outer edge 51 of the scintillator layer 5 and the outer edge 61 of the adhesive layer 6. This prevents moisture from penetrating through the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, and the interface between the scintillator layer 5 and the adhesive layer 6. Furthermore, the edge 31 of the first moisture proof layer 3 on the sensor panel 11 side includes an inner portion 311 that is located between the sensor panel 11 and the adhesive layer 6, on the inner side of the outer edge 61 of the adhesive layer 6. This increases the contact area between the edge 31 of the first moisture proof layer 3 and the sensor panel 11, preventing moisture from penetrating through the interface between the edge 31 of the first moisture proof layer 3 and the sensor panel 11. As a result, the radiation detector described above can ensure sufficient moisture proofness of the scintillator layer.

[0043] The edge 31 of the first moisture-proof layer 3 on the sensor panel 11 side includes an inner portion 311. This allows for effective use of the area on the sensor panel 11 that is outside the outer edge 1a of the scintillator panel 1, and allows for the placement of, for example, wiring, IC circuits, etc. Furthermore, in the inner portion 311, the end face 31a of the edge 31 is folded inward and positioned to enclose the outer edge 61 of the adhesive layer 6, thereby further preventing moisture from entering from the outside via the outer edge 61 of the adhesive layer 6.

[0044] The width D1 of the inner portion 311 is not less than 0.5 μm and not more than 300 μm, which can reliably ensure the moisture resistance of the scintillator layer 5 while preventing the light receiving region from becoming narrower than necessary.

[0045] The first moisture-proof layer 3 further integrally covers the outer edge 41 of the support layer 4 and the surface 4b of the support layer 4 opposite to the scintillator layer 5. With this, the first moisture-proof layer 3 further integrally covers the outer edge 41 of the support layer 4 and the surface 4b of the support layer 4 opposite to the scintillator layer 5, so that the support layer 4 and the interface between the scintillator layer 5 and the support layer 4 are not exposed to the outside. This makes it possible to prevent moisture from penetrating through the support layer 4 and the interface between the scintillator layer 5 and the support layer 4, further improving the moisture-proof property of the scintillator layer 5.

[0046] The radiation detector 10 further includes a second moisture-proof layer 8 disposed between the scintillator layer 5 and the adhesive layer 6. This ensures more sufficient moisture-proof properties of the scintillator layer 5. In addition, since the adhesive layer 6 does not come into direct contact with the scintillator layer 5, damage to the tips of the first ends 50a of the columnar crystals 50 can be prevented when the adhesive layer 6 and the release layer 7 are bonded together. In this case, since the second moisture-proof layer 8 is harder (has a higher hardness) than the adhesive layer 6, the second moisture-proof layer 8 protects the tips of the first ends 50a, while the cushioning properties of the adhesive layer 6 can reduce the force applied to the tips of the first ends 50a when bonding them together.

[0047] When viewed in the thickness direction (direction A) of the support layer 4, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are all aligned. This makes it easy to align the scintillator panel 1 with another member (e.g., a sensor panel 11) when attaching the scintillator panel 1 to that other member. Furthermore, because the side surfaces of the scintillator panel 1 are flat, uneven thickness is less likely to occur when the first moisture-proof layer 3 is formed, allowing the formation of a first moisture-proof layer 3 with higher moisture resistance.

[0048] The radiation detector 10 includes a sensor panel 11. This makes it possible to obtain a radiation detector 10 in which the scintillator layer 5 has high moisture resistance.

[0049] In the method for manufacturing the radiation detector 10, a scintillator panel 1 is prepared, which includes a first moisture-proof layer 3 that integrally covers the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, and the surface 7b of the release layer 7 opposite the adhesive layer 6. This ensures the moisture-proof properties of the scintillator layer 5, which includes a plurality of columnar crystals 50, even when the scintillator panel 1 is unused. Furthermore, in the manufacturing method, the portion of the first moisture-proof layer 3 that covers the surface 7b of the release layer 7 is removed together with the release layer 7. As a result, the edge 31 of the first moisture-proof layer 3 that covered the outer edge 71 of the release layer 7 protrudes from the outer edge 61 of the adhesive layer 6 toward the sensor panel 11. In this state, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6. This results in the edge 31 of the first moisture-proof layer 3 including an inner portion 311 that is located between the sensor panel 11 and the adhesive layer 6 and on the inner side of the outer edge 61 of the adhesive layer 6. Therefore, according to the above manufacturing method, it is possible to obtain a radiation detector 10 in which the moisture resistance of the scintillator layer 5 can be sufficiently ensured. [Variations]

[0050] The present invention is not limited to the above-described embodiment. As shown in Fig. 8 , when the scintillator panel 1 is adhered to the sensor panel 11, the edge 31 of the first moisture-proof layer 3 on the sensor panel 11 side may include an outer portion 312 instead of the inner portion 311. The outer portion 312 is a portion disposed on the sensor panel 11 outside the outer edge 61 of the adhesive layer 6. The outer portion 312 may be a portion where the edge 31 is folded back outside the outer edge 61 of the adhesive layer 6. In the example of Fig. 8 , the outer portion 312 covers the light receiving surface 11a of the sensor panel 11 outside the outer edge 61 of the adhesive layer 6. The outer portion 312 is disposed in the region on the light receiving surface 11a of the sensor panel 11, between the outer edge 1a of the scintillator panel 1 and the outer edge 11b of the sensor panel 11.

[0051] The width D2 of the outer portion 312 varies along the outer edge 6a of the adhesive layer 6. Here, the width D2 of the outer portion 312 is the length from the outer edge 6a to the end face 31a of the edge portion 31 in a direction perpendicular to the direction A. The width D2 is 0.5 μm or more and 300 μm or less, and more preferably 5 μm or more and 200 μm or less. When the width D2 varies, the width D2 being 5 μm or more and 200 μm or less means that the maximum and minimum values ​​of the width D2 are within the range of 5 μm or more and 200 μm or less.

[0052] In the method of manufacturing the radiation detector 10 including the outer portion 312, similar to the radiation detector 10 including the inner portion 311, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6, with the edge portion 31 of the first moisture proof layer 3 protruding from the outer edge portion 61 of the adhesive layer 6 toward the sensor panel 11. As a result, the edge portion 31 includes a portion that is folded back outward from the outer edge portion 61 of the adhesive layer 6. This results in the edge portion 31 including the outer portion 312.

[0053] By including the outer portion 312, the first moisture barrier layer 3 is not present in the area on the sensor panel 11 where the sensor panel 11 and the adhesive layer 6 are in contact, thereby ensuring a wide light-receiving area of ​​the sensor panel 11. In addition, when the edge 31 includes the outer portion 312, as shown in FIG. 8 , the entrance of the interface between the first moisture barrier layer 3 and the sensor panel 11 (the contact point between the end face 31 a and the light-receiving surface 11 a) is spaced away from the scintillator layer 5. This further prevents moisture from penetrating through the interface between the edge 31 of the first moisture barrier layer 3 and the sensor panel 11. By setting the width of the outer portion 312 to be 0.5 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less, it is possible to reliably ensure the moisture barrier properties of the scintillator layer 5 while avoiding an unnecessary narrowing of the light-receiving area. In the method for manufacturing the radiation detector 10 including the outer portion 312, similar to the radiation detector 10 including the inner portion 311, it is possible to obtain a radiation detector 10 that can ensure sufficient moisture resistance of the scintillator layer 5.

[0054] The edge portion 31 may include the inner portion 311 or the outer portion 312, or may include both the inner portion 311 and the outer portion 312. In other words, the edge portion 31 may include at least one of the inner portion 311 and the outer portion 312.

[0055] As shown in FIG. 9 , the scintillator panel 1A does not have to include the second moisture proof layer 8. The scintillator panel 1A differs from the scintillator panel 1 in that the second moisture proof layer 8 is not disposed between the scintillator layer 5 and the adhesive layer 6. In the scintillator panel 1A, the adhesive layer 6 is in contact with and covers the first end portions 50a. In the scintillator panel 1A, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, and the surface 7b of the release layer 7 opposite to the adhesive layer 6 are integrally covered by the first moisture proof layer 3.

[0056] 10, in a radiation detector 10A including a scintillator panel 1A, the distance between the plane including the multiple tips of the multiple first ends 50a and the sensor panel 11 is smaller than in the radiation detector 10. This reduces scattering and attenuation of light converted in the scintillator layer 5 in the radiation detector 10A, and makes it possible to suppress a decrease in resolution due to the presence of the second moisture-proof layer 8. Note that even in this case, it is sufficient that the edge portion 31 includes at least one of the inner portion 311 and the outer portion 312.

[0057] Next, a method for manufacturing the scintillator panel 1A will be described. First, as in the scintillator panel 1, as shown in FIGS. 3A and 3B, a scintillator layer 5 is formed on a second support layer 402 bonded to a carrier substrate 13. Next, as shown in FIG. 11A, the carrier substrate 13 is removed from the second support layer 402. Then, as shown in FIG. 11B, a first support layer 401 is bonded to the surface of the second support layer 402 opposite to the scintillator layer 5. At the same time, the surface of the adhesive layer 6 opposite to the release layer 7 is directly bonded to the plurality of first end portions 50a of the scintillator layer 5. Next, as shown in FIG. 12A, the first support layer 401, the second support layer 402, the scintillator layer 5, the adhesive layer 6, and the release layer 7 are cut to a predetermined size in direction A. For example, a laminate including a support layer 4, a scintillator layer 5, an adhesive layer 6, and a release layer 7 is cut from the state shown in FIG. 11(b) to obtain multiple scintillator units 2A of the same size and shape (e.g., rectangular). Alternatively, for example, a single scintillator unit 2A may be obtained by cutting the ends of each of the support layer 4, the scintillator layer 5, the adhesive layer 6, and the release layer 7. This causes the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 to coincide. Next, as shown in FIG. 12(b), the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, and the surface 7b of the release layer 7 opposite to the adhesive layer 6 are integrally covered with the first moisture-proof layer 3.

[0058] Next, a method for manufacturing the radiation detector 10A will be described. As with the radiation detector 10, as shown in FIG. 13(a), the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7 is removed together with the release layer 7. Next, as shown in FIG. 13(b), the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6, with the edge portion 31 of the first moisture-proof layer 3 protruding from the outer edge portion 61 of the adhesive layer 6 toward the sensor panel 11. This results in the edge portion 31 including at least one of the inner portion 311 and the outer portion 312. Finally, as shown in FIG. 10, the side surface of the scintillator panel 1A is covered with the sealing member 12.

[0059] The peel trigger included in the first moisture-proof layer 3 does not have to be a notch. As shown in FIG. 14 , the peel trigger 32A may be a portion where at least one of the four corners on the surface 7b of the first moisture-proof layer 3 has been rounded off. The peel trigger 32A may also be a portion where a corner of the first moisture-proof layer 3 has been scraped off with a polishing member. The polishing member is, for example, a blade such as a hand lapper or a cutter. A hand lapper is a brush-like tool with a grinding stone at the tip. Alternatively, the peel trigger 32A may be a portion where a corner of the first moisture-proof layer 3 has been scraped off by laser processing. The peel trigger 32A may also be provided around the entire periphery 3a of the first moisture-proof layer 3, including the corners.

[0060] The first moisture-proof layer 3 does not have to cover the surface 7b of the release layer 7 opposite the scintillator layer 5. As shown in FIG. 15 , the first moisture-proof layer 3 may integrally cover the surface 4b of the support layer 4 opposite the scintillator layer 5, the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 81 of the second moisture-proof layer 8, the outer edge 61 of the adhesive layer 6, and the outer edge 71 of the release layer 7. The end face 31a of the edge 31 of the first moisture-proof layer 3 facing the sensor panel 11 may be flush with the surface 7b. In this case, the surface 7b and the end face 31a are exposed to the outside. Alternatively, a tape may be attached to the surface 7b as a peeling trigger 72 for the release layer 7, rather than to the first moisture-proof layer 3. As shown in FIG. 16 , the peeling trigger 72 may be attached to the surface 7b at at least one of the four corners of the first moisture-proof layer 3 so as to face the center of the surface 7b. The number of peeling triggers 72 is not limited to one, and may be more than one. The peeling triggers 72 may be provided on at least one of the four sides of the first moisture-proof layer 3.

[0061] In the scintillator panel 1, the thickness of the first moisture-proof layer 3 may be less than 0.5 μm or more than 40 μm. The thickness of the first moisture-proof layer 3 may not be uniform across the entire surface of the scintillator unit 2, but may vary. The thickness of the release layer 7 may be less than 5 μm or more than 200 μm. The width D1 of the inner portion 311 and the width D2 of the outer portion 312 may each be less than 5 μm or more than 200 μm. The widths D1 and D2 may each be constant along the outer edge 6 a of the adhesive layer 6. Even when the widths D1 and D2 are constant, each of the widths D1 and D2 is preferably 5 μm or more and 200 μm or less, but may be less than 5 μm or more than 200 μm. The second support layer 402 may have the function of absorbing light emitted from the scintillator layer 5 in response to incident radiation (e.g., X-rays). In this case, as an example, the material of the second support layer 402 is a composite material of PET and a black inorganic material. The black inorganic material is, for example, carbon black, iron oxide, etc. Furthermore, the light receiving section on which the scintillator panel 1 is disposed is not limited to the sensor panel 11, and may be, for example, a light guiding member such as an FOP (fiber optics plate). [Explanation of symbols]

[0062] 1,1A...scintillator panel, 2,2A...scintillator unit, 3...first moisture-proof layer, 4...support layer, 10,10A...radiation detector (radiation conversion unit), 11...sensor panel (light-receiving portion), 31...edge, 311...inner portion, 312...outer portion, 41...outer edge of support layer, 4a...outer edge of support layer, 4b...surface of support layer, 5...scintillator layer, 50...columnar crystals, 51...outer edge of scintillator layer, 5a...outer edge of scintillator layer, 6...adhesive layer, 61...outer edge of adhesive layer, 6a...outer edge of adhesive layer, 6b...surface of adhesive layer, 7...peeling layer, 71...outer edge of peeling layer, 7a...outer edge of peeling layer, 7b...surface of adhesive layer, 8...second moisture-proof layer, A...direction, D1...width of inner portion, D2...width of outer portion.

Claims

1. A light receiving unit; a scintillator panel disposed on the light receiving section, The scintillator panel comprises: The supporters and a scintillator layer disposed on the light receiving portion side of the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the light receiving portion side of the scintillator layer and in contact with the light receiving portion; a first moisture-proof layer integrally covering an outer edge portion of the scintillator layer and an outer edge portion of the adhesive layer, a radiation conversion unit, wherein the edge portion of the first moisture-proof layer on the light-receiving unit side includes at least one of an inner portion disposed between the light-receiving unit and the adhesive layer on the inside of the outer edge portion of the adhesive layer, and an outer portion disposed on the light-receiving unit on the outside of the outer edge portion of the adhesive layer.

2. The radiation conversion unit according to claim 1 , wherein the edge of the first moisture-proof layer on the light-receiving portion side includes the inner portion.

3. The radiation conversion unit according to claim 1 , wherein the edge of the first moisture proof layer on the light receiving unit side includes the outer portion.

4. The radiation conversion unit according to claim 1 or 2, wherein the width of each of the inner portion and the outer portion is 0.5 μm or more and 300 μm or less.

5. The radiation conversion unit according to claim 1 or 2, wherein the first moisture-proof layer further integrally covers an outer edge portion of the support layer and a surface of the support layer opposite to the scintillator layer.

6. The radiation conversion unit according to claim 1 , further comprising a second moisture-proof layer disposed between the scintillator layer and the adhesive layer.

7. The radiation conversion unit according to claim 1 , wherein an outer edge of the support layer, an outer edge of the scintillator layer, and an outer edge of the adhesive layer are aligned when viewed in a thickness direction of the support layer.

8. The radiation conversion unit according to claim 1 , wherein the light receiving section is a sensor panel.

9. a step of preparing a scintillator panel including a support layer, a scintillator layer disposed on the support layer and including a plurality of columnar crystals, an adhesive layer disposed on the scintillator layer, a release layer disposed on the adhesive layer, and a moisture-proof layer integrally covering an outer edge portion of the scintillator layer, an outer edge portion of the adhesive layer, an outer edge portion of the release layer, and a surface of the release layer opposite to the adhesive layer; removing a portion of the moisture barrier layer covering the surface of the release layer together with the release layer; and attaching the scintillator panel to a light receiving section via the adhesive layer.

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