Display device

Abstract

To provide a display device capable of displaying high-quality images.SOLUTION: A display device includes a first conductive layer, a second conductive layer, a light-emitting layer, and a lens. The light-emitting layer is provided on the first conductive layer, the second conductive layer is provided on the light-emitting layer, and the lens is provided on the second conductive layer. The lens includes a material with photosensitivity. An end part of the lens exists on the outside relative to an end part of the light-emitting layer and an end part of the second conductive layer. The display device includes an insulating layer. The insulating layer includes a region in contact with an upper surface of the lens, a region in contact with a side surface of the second conductive layer, and a region in contact with a side surface of the light-emitting layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] BACKGROUND OF THE INVENTION 1. Field of the Invention One embodiment of the present invention relates to a display device, a manufacturing method of a display device, and an electronic device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, driving methods thereof, and manufacturing methods thereof. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics. [Background technology]

[0003] In recent years, there has been a demand for higher resolution display panels. Devices requiring high-resolution display panels, such as devices for virtual reality (VR) or augmented reality (AR), have been actively developed in recent years.

[0004] Furthermore, examples of display devices that can be applied to display panels include light-emitting devices that include light-emitting elements such as organic EL (Electro Luminescence) elements or light-emitting diodes (LEDs: Light Emitting Diodes).

[0005] For example, the basic structure of an organic EL element is a layer containing a light-emitting organic compound sandwiched between a pair of electrodes. By applying a voltage to this element, light can be emitted from the light-emitting organic compound. A display device using such an organic EL element does not require a backlight, which is necessary in liquid crystal display devices and the like, and therefore can realize a thin, lightweight, high-contrast, and low-power display device. For example, an example of a display device using an organic EL element is described in Patent Document 1. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-324673 Summary of the Invention [Problem to be solved by the invention]

[0007] As pixels become smaller and the pixel density increases, so-called crosstalk may occur, in which light emitted by a light-emitting element enters a colored layer provided in an adjacent pixel, which may result in a deterioration in the quality of the image displayed on the display device.

[0008] An object of one embodiment of the present invention is to provide a display device that can display a high-quality image.Another object of one embodiment of the present invention is to provide a high-resolution display device.Another object of one embodiment of the present invention is to provide a display device that can be manufactured by a simple method.Another object of one embodiment of the present invention is to provide a low-cost display device.Another object of one embodiment of the present invention is to provide a highly reliable display device.Another object of one embodiment of the present invention is to provide a novel display device.

[0009] Another object of one embodiment of the present invention is to provide a manufacturing method of a display device that can display a high-quality image.Another object of one embodiment of the present invention is to provide a manufacturing method of a high-resolution display device.Another object of one embodiment of the present invention is to provide a simple manufacturing method of a display device.Another object of one embodiment of the present invention is to provide a manufacturing method of a low-cost display device.Another object of one embodiment of the present invention is to provide a manufacturing method of a highly reliable display device.Another object of one embodiment of the present invention is to provide a manufacturing method of a novel display device.

[0010] Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not necessarily solve all of these problems. Note that problems other than these can be extracted from the description of the specification, drawings, claims, etc. [Means for solving the problem]

[0011] One embodiment of the present invention is a display device including a first conductive layer, a second conductive layer, a light-emitting layer, and a lens, in which the light-emitting layer is provided over the first conductive layer, the second conductive layer is provided over the light-emitting layer, and the lens is provided over the second conductive layer, the lens contains a photosensitive material, and an edge of the lens is located outside an edge of the light-emitting layer and an edge of the second conductive layer.

[0012] Alternatively, in the above aspect, the lens may include an acrylic resin.

[0013] Alternatively, in the above embodiment, a first insulating layer may be provided, and the first insulating layer may have a region in contact with the upper surface of the lens, a region in contact with the side surface of the second conductive layer, and a region in contact with the side surface of the light-emitting layer.

[0014] Alternatively, in the above aspect, a second insulating layer may be provided between the second conductive layer and the lens, and an end of the second insulating layer may be located inside the end of the lens.

[0015] Alternatively, one embodiment of the present invention includes a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, a first light-emitting layer, a second light-emitting layer, a first lens, a second lens, a first colored layer, and a second colored layer, in which the first light-emitting layer is provided over the first conductive layer, the second conductive layer is provided over the first light-emitting layer, the first lens is provided over the second conductive layer, the first colored layer is provided over the first lens, the second light-emitting layer is provided over the third conductive layer, and the fourth conductive layer is provided over the second light-emitting layer, A second lens is provided on the fourth conductive layer, and a second colored layer is provided on the second lens, the first lens and the second lens contain a photosensitive material, an end of the first lens is located outside an end of the first light-emitting layer and an end of the second conductive layer, and an end of the second lens is located outside an end of the second light-emitting layer and an end of the fourth conductive layer, the first light-emitting layer and the second light-emitting layer have the function of emitting light of the same color, and the first colored layer and the second colored layer have the function of transmitting light of different colors.

[0016] Alternatively, in the above aspect, the first lens and the second lens may contain an acrylic resin.

[0017] Alternatively, in the above aspect, the first insulating layer may have a region in contact with the top surface of the first lens, a region in contact with the top surface of the second lens, a region in contact with a side surface of the second conductive layer, a region in contact with a side surface of the fourth conductive layer, a region in contact with the first light-emitting layer, and a region in contact with a side surface of the second light-emitting layer.

[0018] Alternatively, in the above aspect, the semiconductor device may have a second insulating layer and a third insulating layer, the second insulating layer being provided between the second conductive layer and the first lens, the third insulating layer being provided between the fourth conductive layer and the second lens, and an end of the second insulating layer being located inside an end of the first lens, and an end of the third insulating layer being located inside an end of the second lens.

[0019] An electronic device including the display device of one embodiment of the present invention and an operation button is also one embodiment of the present invention.

[0020] Alternatively, one embodiment of the present invention is a method for manufacturing a display device using the resist mask as a lens, including forming a first conductive layer over a substrate, depositing a film to be a light-emitting layer over the first conductive layer, depositing a film to be a second conductive layer over the film to be the light-emitting layer, forming a resist mask over the film to be the second conductive layer so as to have a region overlapping with the first conductive layer, etching the film to be the second conductive layer and the film to be the light-emitting layer using the resist mask as a mask to form the second conductive layer and the light-emitting layer, and heating the substrate.

[0021] Alternatively, in the above embodiment, the first insulating layer may be formed after the lens is formed.

[0022] Alternatively, in the above embodiment, the first insulating layer may be formed by the ALD method.

[0023] Alternatively, in the above embodiment, after forming the film that will become the second conductive layer and before forming the resist mask, a film that will become the second insulating layer may be formed, and after forming the resist mask, the film that will become the second insulating layer, the film that will become the second conductive layer, and the film that will become the light-emitting layer may be etched using the resist mask as a mask, thereby forming the second insulating layer, the second conductive layer, and the light-emitting layer. [Effects of the Invention]

[0024] According to one embodiment of the present invention, a display device capable of displaying a high-quality image can be provided. According to one embodiment of the present invention, a high-resolution display device can be provided. According to one embodiment of the present invention, a display device that can be manufactured by a simple method can be provided. According to one embodiment of the present invention, a low-cost display device can be provided. According to one embodiment of the present invention, a highly reliable display device can be provided. According to one embodiment of the present invention, a novel display device can be provided.

[0025] According to one embodiment of the present invention, a method for manufacturing a display device capable of displaying a high-quality image can be provided. According to one embodiment of the present invention, a method for manufacturing a high-resolution display device can be provided. According to one embodiment of the present invention, a simple method for manufacturing a display device can be provided. According to one embodiment of the present invention, a method for manufacturing a low-cost display device can be provided. According to one embodiment of the present invention, a method for manufacturing a highly reliable display device can be provided. According to one embodiment of the present invention, a novel method for manufacturing a display device can be provided.

[0026] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these can be extracted from the description in the specification, drawings, claims, etc. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a cross-sectional view showing an example of the configuration of a display device. [Figure 2] 2A to 2D are cross-sectional views showing an example of a method for manufacturing a display device. [Figure 3] 3A to 3D are cross-sectional views showing an example of a method for manufacturing a display device. [Figure 4] FIG. 4 is a cross-sectional view showing an example of the configuration of a display device. [Figure 5] 5A and 5B are block diagrams showing configuration examples of a display device. [Figure 6] 6A and 6B are perspective views showing examples of the configuration of a touch panel. [Figure 7] 7A1 to 7C1 and 7A2 to 7C2 are cross-sectional views showing examples of the structure of a transistor. [Figure 8] 8A1 to 8A3, 8B1, 8B2, 8C1, and 8C2 are cross-sectional views showing examples of the configuration of a transistor. [Figure 9] 9A to 9F are diagrams showing configuration examples of electronic devices. [Figure 10] 10A and 10B are diagrams showing an example of the configuration of a display module. [Figure 11] 11A and 11B are diagrams showing configuration examples of electronic devices. [Figure 12] 12A to 12E are diagrams showing configuration examples of electronic devices. [Figure 13] 13A to 13G are diagrams showing configuration examples of electronic devices. [Figure 14] 14A to 14D are diagrams showing configuration examples of electronic devices. DETAILED DESCRIPTION OF THE INVENTION

[0028] Hereinafter, embodiments will be described with reference to the drawings. However, it will be readily understood by those skilled in the art that the embodiments can be implemented in many different ways and that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the following description of the embodiments.

[0029] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations thereof will be omitted. In addition, when referring to similar functions, the same hatch pattern may be used and no particular reference numeral may be assigned.

[0030] In the drawings described in this specification, the size of each component, the thickness of a layer, or an area may be exaggerated for clarity, and therefore, the drawings are not necessarily limited to the scale.

[0031] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components and do not limit the number.

[0032] In the following description, expressions indicating directions such as "up" and "down" are basically used in accordance with the directions in the drawings. However, for purposes such as facilitating explanation, the directions indicated by "up" or "down" in the specification may not match those in the drawings. For example, when explaining the stacking order (or formation order) of a laminate, etc., even if the surface on which the laminate is provided in the drawing (the surface to be formed, the supporting surface, the adhesive surface, the flat surface, etc.) is located above the laminate, the direction toward that surface may be expressed as "down" and the opposite direction as "up."

[0033] In this specification and the like, the term "metal oxide" refers to an oxide of a metal in a broad sense. Metal oxides are classified into oxide insulators, oxide conductors (including transparent oxide conductors), oxide semiconductors (also referred to as "oxide semiconductors" or simply as "OSs"). For example, when a metal oxide is used in an active layer of a transistor, the metal oxide may be referred to as an oxide semiconductor. That is, when a metal oxide can form a channel formation region of a transistor having at least one of an amplifying function, a rectifying function, and a switching function, the metal oxide can be referred to as a metal oxide semiconductor. Furthermore, when the term "OS FET" or "OS transistor" is used, it can be rephrased as a transistor having a metal oxide or an oxide semiconductor.

[0034] In this specification, etc., a device fabricated using a metal mask or FMM (fine metal mask, high-resolution metal mask) may be referred to as a device with an MM (metal mask) structure. Also, in this specification, etc., a device fabricated without using a metal mask or FMM may be referred to as a device with an MML (metal maskless) structure.

[0035] (Embodiment 1) In this embodiment, a structural example of a display device according to one embodiment of the present invention and an example of a manufacturing method of the display device according to one embodiment of the present invention will be described.

[0036] One embodiment of the present invention relates to a display device having a light-emitting element such as an organic EL element as a display element, and a manufacturing method thereof. To manufacture the display device of one embodiment of the present invention, first, a first conductive layer is formed over a first substrate. Next, a film to be a light-emitting layer is formed over the first conductive layer. After that, a film to be a second conductive layer is formed over the film to be a light-emitting layer.

[0037] Next, a resist mask is formed on the film that will become the second conductive layer so as to have an area that overlaps with the first conductive layer. Then, the film that will become the second conductive layer and the film that will become the light-emitting layer are etched using the resist mask as a mask. This results in the formation of an island-shaped second conductive layer and light-emitting layer. The light-emitting element has a structure in which the light-emitting layer is provided between the first conductive layer and the second conductive layer. The first conductive layer becomes one electrode of the light-emitting element, and the second conductive layer becomes the other electrode of the light-emitting element.

[0038] Next, for example, the first substrate on which the light-emitting element is formed is heated. This causes the resist mask to deform into a convex shape, which functions as a lens. After that, an insulating layer is formed so as to have regions in contact with the resist mask, the side surfaces of the second conductive layer, and the side surfaces of the light-emitting layer.

[0039] Next, a colored layer is formed over a second substrate, and the colored layer and the insulating layer are attached to each other with an adhesive layer. This is an example of the method for manufacturing a display device according to one embodiment of the present invention.

[0040] In the display device manufactured by the above method, the light-emitting layer can be separated between pixels, and the electrode provided on the light-emitting layer (the other electrode of the light-emitting element) can be separated between pixels. This makes it possible to suppress crosstalk caused by an oblique electric field generated by one electrode of the light-emitting element. Therefore, a high-quality image can be displayed. Furthermore, even if the pixel density is increased by miniaturizing the pixels, crosstalk can be suppressed. Therefore, the display device of one embodiment of the present invention can be a high-resolution display device.

[0041] In addition, in the above manufacturing method, the second conductive layer and the light-emitting layer are formed by etching using a resist mask, and then the lens is formed by heating the resist mask. Therefore, the manufacturing process can be simplified compared to, for example, forming a lens by removing the resist mask. As described above, a display device can be manufactured by a simple method using the above method, and therefore, the display device of one embodiment of the present invention can be a low-cost display device.

[0042] In this specification and the like, the term "element" may be interchangeably referred to as "device." For example, a light-emitting element may be referred to as a light-emitting device.

[0043] In this specification and the like, for example, when it is said that "B is on A" or "B is below A," A and B do not necessarily have to have an area where they contact each other.

[0044] [Configuration example 1] FIG. 1 is a cross-sectional view showing an example of the configuration of a display device 10, which is a display device according to one embodiment of the present invention. The display device 10 includes a pixel 15R, a pixel 15G, and a pixel 15B. The pixels 15R, 15G, and 15B are provided on a display surface of the display device 10. The display surface can be configured such that the pixels 15R, 15G, and 15B are arranged in a matrix. Note that the pixels 15R, 15G, and 15B constitute one pixel, and the pixels can be said to be arranged in a matrix on the display surface of the display device 10. In this case, the pixels 15R, 15G, and 15B can be said to be subpixels.

[0045] The display device 10 includes a substrate 11, a transistor 52, an insulating layer 13, a light-emitting element 30, a partition wall 14, an insulating layer 63, a lens 29, an insulating layer 21, an adhesive layer 33, a coloring layer 25R, a coloring layer 25G, a coloring layer 25B, a light-shielding layer 45, and a substrate 12. The coloring layers 25R, 25G, and 25B are collectively referred to as the coloring layers 25. One light-emitting element 30 and one lens 29 are provided for each of the pixels 15R, 15G, and 15B. The insulating layer 63 is provided separately for each pixel. The coloring layer 25R is provided for the pixel 15R, the coloring layer 25G is provided for the pixel 15G, and the coloring layer 25B is provided for the pixel 15B.

[0046] In the display device 10 shown in FIG. 1, pixel 15G is adjacent to pixel 15R and pixel 15B. Here, it can be said that the light-emitting elements 30, colored layers, or lenses 29 provided in adjacent pixels are adjacent to each other. For example, it can be said that the light-emitting element 30 provided in pixel 15R and the light-emitting element 30 provided in pixel 15G shown in FIG. 1 are adjacent to each other. It can also be said that the colored layer 25R and the colored layer 25G shown in FIG. 1 are adjacent to each other. It can also be said that the lens 29 provided in pixel 15R and the lens 29 provided in pixel 15G shown in FIG. 1 are adjacent to each other. Note that, although pixel 15R and pixel 15B are not adjacent to each other in FIG. 1, pixel 15R and pixel 15B may be adjacent to each other.

[0047] The insulating layer 13 and the transistor 52 are provided on the substrate 11. The light-emitting element 30 is provided on the insulating layer 13. The insulating layer 63 is provided on the light-emitting element 30. The lens 29 is provided on the insulating layer 63. The insulating layer 21 is provided on the lens 29 and on the partition wall 14. The adhesive layer 33 is provided on the insulating layer 21. The coloring layer 25R, the coloring layer 25G, the coloring layer 25B, and the light-shielding layer 45 are provided on the adhesive layer 33. The substrate 12 is provided on the coloring layer 25R, the coloring layer 25G, the coloring layer 25B, and the light-shielding layer 45.

[0048] The substrate 11 can be an insulating substrate such as a glass substrate, a quartz substrate, a sapphire substrate, or a ceramic substrate, or a semiconductor substrate such as a single crystal semiconductor substrate made of silicon, silicon carbide, or the like, a polycrystalline semiconductor substrate, a compound semiconductor substrate such as silicon germanium, or an SOI substrate. The substrate 12 can be, for example, a substrate that is transparent to visible light. The substrate 12 can be, for example, a glass substrate, a quartz substrate, or a sapphire substrate. Furthermore, by using flexible substrates for the substrates 11 and 12, the display device 10 can be a flexible display device.

[0049] For example, an organic insulating film is preferably used as the insulating layer 13. Examples of organic insulating films include acrylic resins, polyimide resins, epoxy resins, polyamide resins, polyimideamide resins, siloxane resins, benzocyclobutene resins, phenolic resins, and precursors of these resins. For example, an inorganic insulating film is preferably used as the insulating layer 63 and the insulating layer 21. Examples of inorganic insulating films that can be used include an aluminum oxide film, an aluminum nitride film, a silicon nitride film, a silicon oxynitride film, a silicon oxide film, and a silicon nitride oxide film. Other examples include a hafnium oxide film, a hafnium oxynitride film, a hafnium nitride oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film. Two or more of the above insulating films may be stacked. The insulating layer 13 may be an inorganic insulating film, and the insulating layer 63 and the insulating layer 21 may be organic insulating films. The other insulating layers of the display device 10 can also be made of the same materials as those that can be used as the insulating layer 13, the insulating layer 63, or the insulating layer 21.

[0050] In this specification and the like, silicon oxynitride refers to a material having a higher oxygen content than nitrogen, and silicon nitride oxide refers to a material having a higher nitrogen content than oxygen.

[0051] 1, the colored layer 25R, the colored layer 25G, and the colored layer 25B are provided on different light-emitting elements 30 and lenses 29, respectively. Therefore, the light-emitting element 30, the lens 29, and the colored layer 25R are provided so as to have overlapping regions with each other. Also, the light-emitting element 30, the lens 29, and the colored layer 25G are provided so as to have overlapping regions with each other. Furthermore, the light-emitting element 30, the lens 29, and the colored layer 25B are provided so as to have overlapping regions with each other.

[0052] The light-emitting element 30 has a configuration in which a conductive layer 42, a light-emitting layer 31, and a conductive layer 60 are stacked. Here, the conductive layer 42 can be one electrode of the light-emitting element 30, and the conductive layer 60 can be the other electrode of the light-emitting element 30. Specifically, the conductive layer 42 can be, for example, a pixel electrode of the light-emitting element 30.

[0053] The light-emitting element 30 can emit, for example, white light. Specifically, white light can be emitted from the light-emitting layer 31. As the light-emitting element 30, an EL element such as an OLED (Organic Light Emitting Diode) or a QLED (Quantum-dot Light Emitting Diode) can be used. Alternatively, as the light-emitting element 30, a micro LED can be used.

[0054] When a white-emitting light-emitting element is used as the light-emitting element 30, it is preferable that the light-emitting layer 31 contains two or more types of light-emitting materials. For example, white light can be obtained by selecting light-emitting materials such that the respective emissions of the two or more light-emitting materials have a complementary color relationship. For example, it is preferable to contain two or more light-emitting materials that emit light of R (red), G (green), B (blue), Y (yellow), O (orange), etc. Alternatively, it is preferable to contain a light-emitting material that emits light containing spectral components of two or more colors of R, G, and B. It is also preferable to use a light-emitting element whose emission spectrum has two or more peaks within the wavelength range of the visible light region (e.g., 350 nm to 750 nm). It is also preferable that the emission spectrum of a material that has a peak in the yellow wavelength region also contains spectral components in the green and red wavelength regions.

[0055] The light-emitting layer 31 is preferably configured by stacking a light-emitting layer containing a light-emitting material that emits one color and a light-emitting layer containing a light-emitting material that emits another color. For example, the multiple light-emitting layers in the light-emitting layer 31 may be stacked in contact with each other, or may be stacked via a region that does not contain any light-emitting material. For example, a region that contains the same material (e.g., host material, assist material) as the fluorescent or phosphorescent light-emitting layer but does not contain any light-emitting material may be provided between the fluorescent or phosphorescent light-emitting layer. This facilitates fabrication of the light-emitting device and reduces the driving voltage. Note that when the light-emitting element 30 is configured by stacking multiple light-emitting layers 31, the multiple light-emitting layers 31 may be stacked via a charge-generating layer.

[0056] The conductive layer 42 can be electrically connected to the transistor 52 through an opening provided in the insulating layer 13 that reaches the transistor 52. For example, the conductive layer 42 can be electrically connected to the source or drain of the transistor 52.

[0057] For example, a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium, or an alloy material containing any of these as a main component, can be used for the conductive layer 42. Furthermore, it is preferable to use, for example, a three-layer stacked film of a titanium film, an aluminum film provided on the titanium film, and a titanium film provided on the aluminum film, or a three-layer stacked film of a molybdenum film, an aluminum film provided on the molybdenum film, and a molybdenum film provided on the aluminum film, for the conductive layer 42. Of course, a single-layered film, a two-layered film, or a four- or more-layered film may also be used as the metal conductive film.

[0058] The partition wall 14 has a function of electrically insulating (also referred to as electrically separating) the conductive layers 42 included in different light-emitting elements 30. Ends of the conductive layers 42 are covered with the partition wall 14.

[0059] It is preferable to use an inorganic insulating film as the partition wall 14. For example, the same material as that which can be used for the insulating layer 63 can be used for the partition wall 14. Note that an organic insulating film may also be used for the partition wall 14. The partition wall 14 is a layer that transmits visible light. Instead of the partition wall 14, a partition wall that blocks visible light may be provided.

[0060] Furthermore, a material that is transparent to visible light, for example, can be used as the conductive layer 60. For example, an indium tin oxide (ITO) film made by mixing indium oxide with tin oxide, an indium tin silicon oxide (ITSO) film made by mixing indium tin oxide (ITO) with silicon oxide, an indium zinc oxide (IZO (registered trademark)) film made by mixing indium oxide with zinc oxide, a zinc oxide film, or a tin oxide film can be used. In addition, oxide conductors or metal oxides such as oxides having indium and tin (In-Sn oxide), oxides having indium and tungsten (In-W oxide), oxides having indium, tungsten, and zinc (In-W-Zn oxide), oxides having indium and titanium (In-Ti oxide), oxides having indium, titanium, and tin (In-Ti-Sn oxide), oxides having indium and zinc (In-Zn oxide), oxides having indium, tin, and silicon (In-Sn-Si oxide), and oxides having indium, gallium, and zinc (In-Ga-Zn oxide) can be used as materials for the conductive layer 60.

[0061] Here, oxide conductors will be explained. For example, when hydrogen is added to a metal oxide in which oxygen vacancies have been formed, a donor level is formed near the conduction band. As a result, the metal oxide becomes more conductive and becomes an electric conductor. A metal oxide that has become an electric conductor is called an oxide conductor. Generally, metal oxides have a large energy gap and are therefore transparent to visible light. On the other hand, oxide conductors are metal oxides that have a donor level near the conduction band. Therefore, oxide conductors are less affected by absorption due to the donor level and have the same level of transparency to visible light as metal oxides.

[0062] The conductive layer 60 may also have a laminated structure of a semi-transmissive and semi-reflective conductive film and a transparent conductive film. Specifically, the conductive layer 60 may have a structure in which a transparent conductive film is provided on a semi-transmissive and semi-reflective conductive film. The semi-transmissive and semi-reflective conductive film in the conductive layer 60 provides a so-called microcavity structure, thereby enhancing light of a specific wavelength among the light emitted by the light-emitting layer 31. It is preferable to vary the optical path length of the light emitted by the light-emitting layer 31 depending on the color of the light extracted from the pixel. In other words, it is preferable to vary the optical path length of the light emitted by the light-emitting layer 31 in the pixel 15R, the light-emitting layer 31 in the pixel 15G, and the light-emitting layer 31 in the pixel 15B. In order to vary the optical path length of the light emitted from the light emitting layer 31, the conductive layer 42 may have a laminated structure of a material that reflects visible light, such as a metal material, and a material that transmits visible light.

[0063] Examples of semi-transmissive / semi-reflective conductive films include metal materials such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, and palladium, as well as alloys containing these metal materials. Lanthanum, neodymium, germanium, or the like may be added to the above metal materials or alloys. Alloys containing titanium, nickel, or neodymium and aluminum (aluminum alloys) may also be used. Alloys containing copper, palladium, magnesium, and silver may also be used. Silver-copper alloys are preferred because of their high heat resistance. Furthermore, stacking a metal film or metal oxide film in contact with an aluminum film or aluminum alloy film can suppress oxidation. Examples of materials for such metal films and metal oxide films include titanium and titanium oxide. The above-mentioned conductive film that transmits visible light may also be stacked with a film made of a metal material. For example, a stacked film of silver and indium tin oxide, or a stacked film of an alloy of silver and magnesium and indium tin oxide may be used.

[0064] 1, the insulating layer 63 is provided on the conductive layer 60, and the lens 29 is provided on the insulating layer 63. This makes it possible to prevent substances contained in the lens 29 from being mixed into the light-emitting layer 31, for example, via the conductive layer 60. This makes it possible to prevent impurities from being mixed into the light-emitting layer 31, thereby improving the reliability of the light-emitting element 30. As described above, the insulating layer 63 functions as a protective layer for the light-emitting element 30. Note that if the conductive layer 60 functions as a protective layer, for example, if the conductive layer 60 has low permeability to impurities, the display device 10 does not need to be provided with the insulating layer 63.

[0065] The lens 29 has the function of focusing light emitted by the light-emitting layer 31 in the front direction of the display surface of the display device 10. The lens 29 contains a photosensitive material, such as an acrylic resin. As will be described in detail later, the lens 29 is formed by modifying a resist mask used as a mask in photolithography, for example. For example, a material containing an acrylic resin can function as both a resist mask and a lens. Here, it is preferable that the lens 29 has high transparency to visible light, since this allows the light emitted by the light-emitting layer 31 to be efficiently extracted.

[0066] The lens 29 may be configured so that the convex portion faces the substrate 12. Therefore, the convex portion of the lens 29 may be the upper surface of the lens 29. The convex portion of the lens 29 may be, for example, spherical.

[0067] Here, the end of the lens 29 is located outside the end of the light-emitting layer 31, the end of the conductive layer 60, and the end of the insulating layer 63. The end of the lens 29 is referred to as end 32 (end 32a and end 32b in FIG. 1 etc.).

[0068] The insulating layer 21 can prevent substances contained in the adhesive layer 33 from being mixed into, for example, the light-emitting layer 31. Therefore, the insulating layer 21 functions as a protective layer for the light-emitting element 30. Here, in order for the insulating layer 21 to fully function as a protective layer, it is preferable that the insulating layer 21 has regions in contact with the lens 29, specifically the upper surface of the lens 29, as well as the side surfaces of the insulating layer 63, the conductive layer 60, and the light-emitting layer 31.

[0069] The substrate 11 and the substrate 12 can be bonded together by the adhesive layer 33. Specifically, for example, the insulating layer 21 can be bonded to the colored layer 25R, the colored layer 25G, and the colored layer 25B. Here, it is preferable that the refractive index of the adhesive layer 33 is lower than the refractive index of the lens 29, because this allows the light emitted by the light-emitting layer 31 to be condensed.

[0070] The adhesive layer 33 can be made of epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, or the like. A two-component resin may also be used. The adhesive layer 33 may not necessarily contain resin. For example, the adhesive layer 33 may be a vacuum layer.

[0071] The coloring layer 25R has a function of transmitting, for example, red light. The coloring layer 25G has a function of transmitting, for example, green light. The coloring layer 25B has a function of transmitting, for example, blue light. In this case, red light is emitted from the pixel 15R, green light is emitted from the pixel 15G, and blue light is emitted from the pixel 15B. The coloring layer 25R, the coloring layer 25G, or the coloring layer 25B may also have a function of transmitting light of cyan, magenta, yellow, etc. Although FIG. 1 shows three types of coloring layers, the display device 10 may have four or more types of coloring layers. Although FIG. 1 shows that the thicknesses of the coloring layer 25R, the coloring layer 25G, and the coloring layer 25B are equal, they may be different.

[0072] The colored layers 25R, 25G, and 25B may be made of a metal material, a resin material, a resin material containing a pigment or a dye, or the like.

[0073] The light-shielding layer 45 is provided between the coloring layers. FIG. 1 shows an example in which the light-shielding layer 45 is provided between the coloring layer 25R and the coloring layer 25G, and between the coloring layer 25G and the coloring layer 25B. The light-shielding layer 45 functions to block light emitted from adjacent pixels. The light-shielding layer 45 may be made of a metal, a resin containing a black pigment, carbon black, a metal oxide, or a composite oxide containing a solid solution of multiple metal oxides. The display device 10 may be configured without the light-shielding layer 45. For example, by configuring adjacent coloring layers to partially overlap, the overlapping portions can function as a light-shielding layer.

[0074] 1, the display device 10 can separate the light-emitting layer 31 and the conductive layer 60 between pixels. This can suppress the occurrence of crosstalk caused by the oblique electric field generated by the conductive layer 42. Therefore, the display device 10 can display high-quality images. Furthermore, even if the pixels provided in the display device 10 are miniaturized to increase the pixel density, the occurrence of crosstalk can be suppressed, so the display device 10 can be a high-definition display device.

[0075] [Example of manufacturing method] An example of a method for manufacturing the display device 10 will be described below with reference to the drawings.

[0076] The thin films (insulating films, semiconductor films, conductive films, etc.) that make up the display device can be formed using methods such as sputtering, chemical vapor deposition (CVD), vacuum evaporation, pulsed laser deposition (PLD), and atomic layer deposition (ALD). The CVD method may be plasma enhanced chemical vapor deposition (PECVD) or thermal CVD. An example of a thermal CVD method is metal organic chemical vapor deposition (MOCVD).

[0077] Furthermore, thin films constituting the display device can be formed by methods such as spin coating, dipping, spray coating, ink jetting, dispensing, screen printing, offset printing, doctor knife, slit coating, roll coating, curtain coating, and knife coating.

[0078] When processing a thin film that constitutes a display device, it can be processed using, for example, a photolithography method. Alternatively, an island-shaped thin film may be formed by a film formation method using a masking mask. Alternatively, the thin film may be processed by a nanoimprint method, a sandblasting method, a lift-off method, or the like. There are, for example, the following two photolithography methods. One is a method in which a photosensitive resist material is applied to the thin film to be processed, exposed to light through a photomask, and developed to form a resist mask, and the thin film is processed by, for example, etching, and the resist mask is then removed. The other is a method in which a photosensitive thin film is formed, and then exposed and developed to process the thin film into a desired shape.

[0079] When light is used in photolithography, the light used for exposure may be, for example, i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or a mixture of these. Other examples include ultraviolet light, KrF laser light, and ArF laser light. Exposure may also be performed by immersion exposure technology. Extreme ultraviolet (EUV) light or X-rays may also be used as light for exposure. An electron beam may also be used instead of light for exposure. Extreme ultraviolet light, X-rays, or an electron beam are preferred because they enable extremely fine processing. When exposure is performed by scanning a beam such as an electron beam, a photomask is not required.

[0080] The thin film can be etched by dry etching, wet etching, sandblasting, or the like.

[0081] First, the transistor 52 is formed on the substrate 11. Next, the insulating layer 13 is formed on the substrate 11 and the transistor 52. After that, an opening reaching the transistor 52 is formed in the insulating layer 13. Next, a conductive film that will become the conductive layer 42 is formed on the insulating layer 13, and part of the conductive film is etched to form the conductive layer 42.

[0082] Thereafter, the partition wall 14 is formed so as to cover the end portion of the conductive layer 42 (FIG. 2A). Next, a film 31A to become the light-emitting layer 31, a film 60A to become the conductive layer 60, and a film 63A to become the insulating layer 63 are formed in this order (FIG. 2B).

[0083] The film 31A can be formed by a method such as a vapor deposition method, a coating method, a printing method, or a discharge method. For example, a vapor deposition method that does not use a fine metal mask can be used. The film 60A can be formed by a method such as a vapor deposition method or a sputtering method. The film 63A can be formed by a method such as an ALD method, a CVD method, or a sputtering method.

[0084] Thereafter, a resist 29A is applied onto the film 63A (FIG. 2C). The resist 29A can be applied using a spin coating method, a spray coating method, or the like.

[0085] Next, the resist 29A is exposed to light and processed, thereby forming a resist mask 29B (FIG. 2D). The resist mask 29B has a region that overlaps with the conductive layer 42.

[0086] Thereafter, the film 63A, the film 60A, and the film 31A are etched using the resist mask 29B as a mask, thereby forming an island-shaped insulating layer 63, a conductive layer 60, and a light-emitting layer 31 (FIG. 3A). The etching can be, for example, wet etching or dry etching.

[0087] Here, the films 63A, 60A, and 31A are etched not only vertically but also horizontally. Therefore, the end of the insulating layer 63, the end of the conductive layer 60, and the end of the light-emitting layer 31 can be configured to be located inside the end of the resist mask 29B. Note that at least one of the end of the insulating layer 63, the end of the conductive layer 60, and the end of the light-emitting layer 31 may be located outside the end of the resist mask 29B. For example, the end of the light-emitting layer 31 may be located outside the end of the resist mask 29B.

[0088] Next, the substrate 11 is heated, which softens the resist mask 29B and causes it to deform into a convex shape. The convex shape of the resist mask 29B forms the lenses 29 (FIG. 3B).

[0089] Thereafter, the insulating layer 21 is formed on the lenses 29 and the partition walls 14 (FIG. 3C). As described above, the insulating layer 21 is preferably formed so as to have regions in contact with the upper surfaces of the lenses 29 as well as the side surfaces of the insulating layer 63, the conductive layer 60, and the light-emitting layer 31. Meanwhile, as described above, the end 32 of the lens 29 is located outside the end of the insulating layer 63, the conductive layer 60, and the light-emitting layer 31. For these reasons, the insulating layer 21 is preferably an insulating film with high coverage. Therefore, the insulating layer 21 is preferably formed by, for example, an ALD method.

[0090] Next, the colored layer 25R, the colored layer 25G, the colored layer 25B, and the light-shielding layer 45 are formed on the substrate 12 (FIG. 3D). Thereafter, the insulating layer 21, the colored layer 25R, the colored layer 25G, the colored layer 25B, and the light-shielding layer 45 are bonded together with an adhesive layer 33. The adhesive layer 33 can be formed by a screen printing method, a dispensing method, or the like. In this manner, the display device 10 shown in FIG. 1 can be fabricated.

[0091] In the manufacturing method of the display device of one embodiment of the present invention, the island-shaped insulating layer 63, the conductive layer 60, and the light-emitting layer 31 are formed by etching using the resist mask 29B as a mask, and then the substrate 11 is heated to form the lens 29. Therefore, the manufacturing process can be simplified compared to, for example, the case where the lens 29 is formed by removing the resist mask 29B. As described above, the manufacturing method of the display device of one embodiment of the present invention enables the display device to be manufactured by a simple method. Therefore, the display device of one embodiment of the present invention can be a low-cost display device.

[0092] [Configuration example 2] Fig. 4 is a cross-sectional view showing an example of the configuration of the display device 10. Fig. 4 shows a more specific example of the configuration of the display device 10 shown in Fig. 1. Fig. 4 shows an example of the configuration of the display unit 215, the drive circuit 201, etc.

[0093] 4 includes an electrode 4015, which is electrically connected to a terminal of an FPC 4018 via an anisotropic conductive layer 4019. In addition, in FIG. 4, the electrode 4015 is electrically connected to a wiring 4014 in an opening formed in the insulating layer 4112, the insulating layer 4111, and the insulating layer 4110.

[0094] The electrode 4015 is formed using the same conductive layer as the conductive layer 42 , and the wiring 4014 is formed using the same conductive layer as the source electrode and drain electrode of the transistor 52 and the transistor 4011 .

[0095] The display portion 215 and the driver circuit 201 provided over the substrate 11 each include a plurality of transistors, and Fig. 4 illustrates a transistor 52 included in the display portion 215 and a transistor 4011 included in the driver circuit 201. Note that although Fig. 4 illustrates bottom-gate transistors as the transistors 52 and 4011, they may also be top-gate transistors.

[0096] 4, an insulating layer 4112 is provided over the transistor 52 and the transistor 4011. In addition, a partition wall 14 is formed over the insulating layer 4112.

[0097] The transistor 52 and the transistor 4011 are provided over an insulating layer 4102. The transistor 52 and the transistor 4011 each include an electrode 4017 formed over an insulating layer 4111. The electrode 4017 can function as a backgate electrode.

[0098] 4 also includes a capacitor 4020. The capacitor 4020 includes an electrode 4021 formed in the same process as the gate electrode of the transistor 52 and electrodes formed in the same process as the source and drain electrodes of the transistor 52. The electrodes overlap with each other with an insulating layer 4103 interposed therebetween.

[0099] 4 includes an insulating layer 4111 and an insulating layer 4102. Insulating layers that do not easily transmit impurity elements are used as the insulating layer 4111 and the insulating layer 4102. By sandwiching the transistor between the insulating layer 4111 and the insulating layer 4102, it is possible to prevent impurities from entering the semiconductor layer from the outside.

[0100] 4 shows a configuration in which the display unit 215 and the driver circuit 201 are sealed with a sealant 4005 and a substrate 12. The sealant 4005 can be made of a glass material such as glass frit, a curable resin that cures at room temperature such as a two-component mixed resin, a photocurable resin, or a thermosetting resin. The sealant 4005 may also contain a desiccant.

[0101] If necessary, an optical film such as a polarizing plate, a circular polarizing plate (including an elliptical polarizing plate), or a retardation plate (λ / 4 plate, λ / 2 plate) may be provided on the light-emitting surface of the light-emitting element 30. An anti-reflection film may also be provided on the polarizing plate or circular polarizing plate. For example, an anti-glare treatment can be applied to the surface, which diffuses reflected light by using unevenness to reduce glare.

[0102] 5A and 5B are diagrams showing an example of the configuration of the display device 10. In the display device 10 having the configuration shown in FIG.

[0103] In the display unit 215, the pixels 15 (pixels 15R, 15G, and 15B) shown in FIG. 1 and the like are arranged in a matrix.

[0104] 5A, each of the driver circuits 221, 231, 232, and 241 includes a plurality of integrated circuits 4042 provided on a printed circuit board 4041. The integrated circuits 4042 are formed using a single crystal semiconductor or a polycrystalline semiconductor. Here, the driver circuit 201 shown in FIG. 4 can be the driver circuit 221, the driver circuit 231, the driver circuit 232, the driver circuit 241, or the like.

[0105] Various signals and potentials are supplied to the drive circuits 221 , 241 , 231 , and 232 via an FPC (Flexible Printed Circuit) 4018 .

[0106] The integrated circuits 4042 included in the driver circuits 221 and 241 have a function of supplying selection signals to the display portion 215. The integrated circuits 4042 included in the driver circuits 231 and 232 have a function of supplying image signals to the display portion 215. The integrated circuits 4042 are mounted in a region on the substrate 11 that is different from the region surrounded by the sealant 4005.

[0107] The method for connecting the integrated circuit 4042 is not particularly limited, and methods such as wire bonding, COG (Chip On Glass), TCP (Tape Carrier Package), and COF (Chip On Film) can be used.

[0108] 5B shows an example in which the integrated circuits 4042 included in the driver circuits 231 and 232 are mounted by the COG method. In addition, a part or the whole of the driver circuits can be integrally formed on the same substrate as the display unit 215 to form a system-on-panel.

[0109] 5B shows an example in which the driving circuit 221 and the driving circuit 241 are formed on the same substrate as the display unit 215. By forming the driving circuit simultaneously with the pixel circuit in the display unit 215, the number of components can be reduced, thereby improving productivity.

[0110] 5B, a sealant 4005 is provided so as to surround the display unit 215, the drive circuit 221, and the drive circuit 241, which are provided on the substrate 11. Furthermore, a substrate 12 is provided on the display unit 215, the drive circuit 221, and the drive circuit 241. Therefore, the display unit 215, the drive circuit 221, and the drive circuit 241 are sealed together with the light-emitting elements by the substrate 11, the sealant 4005, and the substrate 12.

[0111] 5B shows an example in which the drive circuits 231 and 232 are formed separately and mounted on the substrate 11, but the present invention is not limited to this configuration. For example, the drive circuit 221 may be formed separately and mounted.

[0112] Furthermore, the display device 10 may include a panel in which light-emitting elements are sealed, and a module in which an IC including a controller is mounted on the panel, for example.

[0113] An input device can also be provided on the substrate 12. The configuration in which an input device is provided on the display device 10 shown in Fig. 5A or 5B can function as a touch panel.

[0114] There is no limitation on the type of sensing element (also referred to as a sensor element) included in the touch panel of one embodiment of the present invention. Various sensors that can detect the proximity or contact of a sensed object such as a finger or a stylus can be used as the sensing element.

[0115] As the sensor type, various types can be used, such as a capacitance type, a resistive film type, a surface acoustic wave type, an infrared type, an optical type, and a pressure sensitive type.

[0116] In the following, a touch panel having a capacitance type detection element will be described as an example.

[0117] The capacitance type includes a surface capacitance type and a projected capacitance type. The projected capacitance type includes a self-capacitance type and a mutual capacitance type. The mutual capacitance type is preferable because it enables simultaneous multi-point detection.

[0118] The touch panel of one embodiment of the present invention can have various configurations, such as a configuration in which a display device and a detector element that are separately manufactured are attached to each other, or a configuration in which an electrode that constitutes a detector element is provided on one or both of a substrate that supports a light-emitting element and an opposing substrate.

[0119] Figures 6A and 6B show an example of a touch panel. Figure 6A is a perspective view of a touch panel 4210. The touch panel 4210 has an input device 4200. Figure 6B is a schematic perspective view of the input device 4200. For clarity, only representative components are shown.

[0120] The touch panel 4210 has a configuration in which a display device and a sensing element that are separately manufactured are bonded together.

[0121] The touch panel 4210 has an input device 4200 and a display device 10, which are provided one on top of the other. Note that the display device 10 is not shown in Fig. 6A.

[0122] The input device 4200 includes a substrate 4263, an electrode 4227, an electrode 4228, a plurality of wirings 4237, a plurality of wirings 4238, and a plurality of wirings 4239. For example, the electrode 4227 can be electrically connected to the wiring 4237 or the wiring 4239. Furthermore, the electrode 4228 can be electrically connected to the wiring 4239. The FPC 4272 is electrically connected to each of the plurality of wirings 4237, the plurality of wirings 4238, and the plurality of wirings 4239. The FPC 4272 can be provided with an IC 4273.

[0123] Alternatively, a touch sensor may be provided between the substrate 11 and the substrate 12 of the display device 10. When a touch sensor is provided between the substrate 11 and the substrate 12, in addition to a capacitance type touch sensor, an optical type touch sensor using a photoelectric conversion element as a detection element may also be applied.

[0124] This embodiment can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0125] (Embodiment 2) In this embodiment, a structure of a transistor that can be used in a display device of one embodiment of the present invention will be described.

[0126] The display device of one embodiment of the present invention can be manufactured using various types of transistors such as bottom-gate transistors and top-gate transistors, etc. Therefore, the material of the semiconductor layer to be used, the transistor structure, and the like can be easily replaced in accordance with an existing manufacturing line.

[0127] [Bottom-gate transistor] 7A1 is a cross-sectional view of a channel protective transistor 810, which is a type of bottom-gate transistor. In FIG. 7A1, the transistor 810 is formed over a substrate 771. The transistor 810 also has an electrode 746 on the substrate 771 with an insulating layer 772 interposed therebetween. The transistor 810 also has a semiconductor layer 742 on the electrode 746 with an insulating layer 726 interposed therebetween. The electrode 746 can function as a gate electrode. The insulating layer 726 can function as a gate insulating layer.

[0128] The semiconductor device further includes an insulating layer 741 over a channel formation region of the semiconductor layer 742. An electrode 744a and an electrode 744b are provided over the insulating layer 741 and in contact with part of the semiconductor layer 742. The electrode 744a can function as one of a source electrode and a drain electrode. The electrode 744b can function as the other of the source electrode and the drain electrode. Part of the electrode 744a and part of the electrode 744b are formed over the insulating layer 741.

[0129] The insulating layer 741 can function as a channel protective layer. Providing the insulating layer 741 over the channel formation region can prevent the semiconductor layer 742 from being exposed when the electrodes 744a and 744b are formed. Therefore, the channel formation region of the semiconductor layer 742 can be prevented from being etched when the electrodes 744a and 744b are formed. According to one embodiment of the present invention, a transistor with favorable electrical characteristics can be provided.

[0130] The transistor 810 further includes an insulating layer 728 over the electrode 744 a, the electrode 744 b, and the insulating layer 741 , and an insulating layer 729 over the insulating layer 728 .

[0131] When an oxide semiconductor is used for the semiconductor layer 742, a material capable of removing oxygen from part of the semiconductor layer 742 and generating oxygen vacancies is preferably used for at least portions of the electrode 744a and the electrode 744b that are in contact with the semiconductor layer 742. The carrier concentration in the region where oxygen vacancies occur in the semiconductor layer 742 increases, and the region becomes n-type, forming an n-type region (n + Therefore, the region can function as a source region or a drain region. When an oxide semiconductor is used for the semiconductor layer 742, examples of a material that can remove oxygen from the semiconductor layer 742 and cause oxygen vacancies include tungsten and titanium.

[0132] The formation of the source and drain regions in the semiconductor layer 742 can reduce contact resistance between the semiconductor layer 742 and the electrodes 744a and 744b, and can improve the electrical characteristics of the transistor, such as field-effect mobility and threshold voltage.

[0133] When a semiconductor such as silicon is used for the semiconductor layer 742, a layer functioning as an n-type semiconductor or a p-type semiconductor is preferably provided between the semiconductor layer 742 and the electrode 744a and between the semiconductor layer 742 and the electrode 744b. The layer functioning as an n-type semiconductor or a p-type semiconductor can function as a source region or a drain region of a transistor.

[0134] The insulating layer 729 is preferably formed using a material that has a function of preventing or reducing diffusion of impurities into the transistor from the outside. Note that the insulating layer 729 can be omitted as necessary.

[0135] 7A2 differs from the transistor 810 in that an electrode 723 that can function as a backgate electrode is provided over an insulating layer 729. The electrode 723 can be formed using a material and a method similar to those of the electrode 746.

[0136] Generally, a back gate electrode is formed of a conductive layer and is arranged so that the gate electrode and the back gate electrode sandwich the channel formation region of the semiconductor layer. Therefore, the back gate electrode can function in the same way as a gate electrode. The potential of the back gate electrode may be the same as that of the gate electrode, may be the ground potential (GND potential), or may be any other potential. In addition, the threshold voltage of the transistor can be changed by changing the potential of the back gate electrode independently of the gate electrode.

[0137] The electrode 746 and the electrode 723 can both function as gate electrodes. Thus, the insulating layers 726, 728, and 729 can each function as a gate insulating layer. Note that the electrode 723 may be provided between the insulating layers 728 and 729.

[0138] Note that when one of the electrode 746 and the electrode 723 is referred to as a "gate electrode," the other is referred to as a "back gate electrode." For example, when the electrode 723 of the transistor 811 is referred to as a "gate electrode," the electrode 746 is referred to as a "back gate electrode." When the electrode 723 is used as a "gate electrode," the transistor 811 can be considered as a type of top-gate transistor. Furthermore, one of the electrode 746 and the electrode 723 may be referred to as a "first gate electrode," and the other may be referred to as a "second gate electrode."

[0139] By providing the electrode 746 and the electrode 723 with the semiconductor layer 742 therebetween and further by setting the electrode 746 and the electrode 723 to the same potential, the region through which carriers flow in the semiconductor layer 742 becomes larger in the film thickness direction, thereby increasing the amount of carrier movement. As a result, the on-state current and the field-effect mobility of the transistor 811 become larger.

[0140] Therefore, the transistor 811 has a large on-state current relative to its area occupied. That is, the area occupied by the transistor 811 can be reduced relative to the required on-state current. According to one embodiment of the present invention, the area occupied by the transistor can be reduced. Therefore, according to one embodiment of the present invention, a display device having fine pixels can be provided, and thus a high-resolution display device can be realized.

[0141] In addition, since the gate electrode and the back gate electrode are formed of conductive layers, they have the function of preventing an electric field generated outside the transistor from acting on the semiconductor layer in which the channel is formed (particularly, an electric field shielding function against static electricity, for example). Note that the electric field shielding function can be enhanced by forming the back gate electrode larger than the semiconductor layer and covering the semiconductor layer with the back gate electrode.

[0142] Furthermore, by forming the back gate electrode using a conductive film having a light-shielding property, it is possible to prevent light from entering the semiconductor layer from the back gate electrode side, thereby preventing light degradation of the semiconductor layer and deterioration of electrical characteristics such as a shift in the threshold voltage of the transistor.

[0143] According to one embodiment of the present invention, a highly reliable transistor and a highly reliable display device can be provided.

[0144] 7B1 shows a cross-sectional view of a channel protective transistor 820, which is a type of bottom-gate transistor. The transistor 820 has a structure similar to that of the transistor 810, except that an insulating layer 741 covers an edge portion of a semiconductor layer 742. The semiconductor layer 742 and an electrode 744a are electrically connected to each other through an opening formed by selectively removing a portion of the insulating layer 741 that overlaps with the semiconductor layer 742. The semiconductor layer 742 and an electrode 744b are electrically connected to each other through another opening formed by selectively removing a portion of the insulating layer 741 that overlaps with the semiconductor layer 742. The region of the insulating layer 741 that overlaps with the channel formation region can function as a channel protective layer.

[0145] A transistor 821 shown in FIG. 7B2 differs from the transistor 820 in that an electrode 723 that can function as a backgate electrode is provided over an insulating layer 729.

[0146] The insulating layer 741 can prevent the semiconductor layer 742 from being exposed when the electrodes 744a and 744b are formed. Therefore, the semiconductor layer 742 can be prevented from being thinned when the electrodes 744a and 744b are formed.

[0147] Furthermore, in the transistors 820 and 821, the distance between the electrode 744a and the electrode 746 and the distance between the electrode 744b and the electrode 746 are longer than in the transistors 810 and 811. Therefore, the parasitic capacitance generated between the electrode 744a and the electrode 746 can be reduced. Furthermore, the parasitic capacitance generated between the electrode 744b and the electrode 746 can be reduced. According to one embodiment of the present invention, a transistor with favorable electrical characteristics can be provided.

[0148] 7C1 is a channel-etched transistor, which is a type of bottom-gate transistor. In the transistor 825, the electrodes 744a and 744b are formed without using the insulating layer 741. Therefore, part of the semiconductor layer 742 that is exposed during the formation of the electrodes 744a and 744b may be etched. On the other hand, since the insulating layer 741 is not provided, productivity of the transistor can be improved.

[0149] A transistor 826 shown in FIG. 7C2 differs from transistor 820 in that it has an electrode 723 on an insulating layer 729 that can function as a back gate electrode.

[0150] [Top-gate transistor] 8A1 is a top-gate transistor. The transistor 842 differs from the transistors 810, 811, 820, 821, 825, and 826 in that the electrode 744a and the electrode 744b are formed after the insulating layer 729 is formed. The electrode 744a and the electrode 744b are electrically connected to the semiconductor layer 742 in openings formed in the insulating layers 728 and 729.

[0151] 8A2 differs from the transistor 842 in that it includes an electrode 723. The transistor 843 includes the electrode 723 formed over a substrate 771. The electrode 723 has a region overlapping with the semiconductor layer 742 with an insulating layer 772 interposed therebetween. The electrode 723 can function as a backgate electrode.

[0152] As shown in FIG. 8A3 , in the manufacturing process of the transistor 842, a portion of the insulating layer 726 that does not overlap with the electrode 746 is removed, and the electrode 746 and the remaining insulating layer 726 are used as masks to introduce an impurity 755 into the semiconductor layer 742, thereby forming an impurity region in a self-aligned manner in the semiconductor layer 742. The transistor 842 has a region in which the insulating layer 726 extends beyond the edge of the electrode 746. The impurity concentration in the region of the semiconductor layer 742 into which the impurity 755 is introduced via the insulating layer 726 is lower than that in the region into which the impurity 755 is introduced without the insulating layer 726. Therefore, a lightly doped drain (LDD) region is formed in the region of the semiconductor layer 742 that does not overlap with the electrode 746. The same applies to the transistor 843.

[0153] 8B1 and 845 shown in FIG. 8B2, the insulating layer 726 may be entirely removed from a region that does not overlap with the electrode 746. Alternatively, the insulating layer 726 may be left as in a transistor 846 shown in FIG. 8C1 and a transistor 847 shown in FIG. 8C2.

[0154] In the transistors 844 to 847, after the electrode 746 is formed, an impurity 755 is introduced into the semiconductor layer 742 using the electrode 746 as a mask, so that an impurity region can be formed in a self-aligned manner in the semiconductor layer 742. According to one embodiment of the present invention, a transistor with favorable electrical characteristics can be realized. Furthermore, according to one embodiment of the present invention, a high-resolution display device can be realized.

[0155] This embodiment can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0156] (Embodiment 3) In this embodiment, an example of a head-mounted display to which a display device is applied will be described as an example of an electronic device of one embodiment of the present invention.

[0157] 9A and 9B show the appearance of the head mounted display 8300.

[0158] The head mounted display 8300 includes a housing 8301, a display portion 8302, operation buttons 8303, and a band-shaped fixture 8304.

[0159] The operation button 8303 has a function as, for example, a power button. In addition to the operation button 8303, other buttons may be provided.

[0160] 9C, a lens 8305 may be provided between the display unit 8302 and the user's eyes. The lens 8305 allows the user to view an enlarged image of the display unit 8302, enhancing the sense of realism. In this case, as shown in FIG. 9C, a dial 8306 may be provided to change the position of the lens for diopter adjustment.

[0161] The display device of one embodiment of the present invention can be applied to the display portion 8302. The display device of one embodiment of the present invention has extremely high resolution; therefore, even when an image is enlarged using a lens 8305 as in FIG. 9C , pixels are not visible to a user, and more realistic images can be displayed.

[0162] 9A to 9C show an example in which one display portion 8302 is included. With such a configuration, the number of components can be reduced.

[0163] The display portion 8302 can display two images, one for the right eye and one for the left eye, side by side in two regions, left and right, respectively, thereby enabling display of a stereoscopic image using binocular parallax.

[0164] Alternatively, a single image that can be viewed with both eyes may be displayed across the entire area of ​​the display unit 8302. This allows a panoramic image to be displayed across both ends of the field of view, thereby enhancing the sense of reality.

[0165] Here, the head mounted display 8300 preferably has a mechanism for changing the curvature of the display portion 8302 to an appropriate value depending on the size of the user's head, the position of the user's eyes, etc. For example, the user may adjust the curvature of the display portion 8302 by operating a dial 8307 for adjusting the curvature of the display portion 8302. Alternatively, the head mounted display 8300 may have a mechanism for adjusting the curvature of the display portion 8302 based on detection data of a sensor (for example, a camera, a contact sensor, a non-contact sensor, or the like) provided in the housing 8301 that detects the size of the user's head, the position of the user's eyes, etc.

[0166] When the lens 8305 is used, it is preferable to provide a mechanism for adjusting the position and angle of the lens 8305 in synchronization with the curvature of the display portion 8302. Alternatively, the dial 8306 may have a function for adjusting the angle of the lens.

[0167] 9E and 9F show an example including a driver 8308 that controls the curvature of the display portion 8302. The driver 8308 is fixed to at least a part of the display portion 8302. The driver 8308 has a function of deforming the display portion 8302 by deforming or moving a part fixed to the display portion 8302.

[0168] 9E is a schematic diagram showing a case where a user 8310 with a relatively large head size is wearing the housing 8301. At this time, the shape of the display unit 8302 is adjusted by the driving unit 8308 so that the curvature is relatively small (the radius of curvature is large).

[0169] On the other hand, Fig. 9F shows a case where a user 8311, whose head is smaller than that of the user 8310, is wearing the housing 8301. Furthermore, the distance between the eyes of the user 8311 is narrower than that of the user 8310. In this case, the shape of the display unit 8302 is adjusted by the driving unit 8308 so that the curvature of the display unit 8302 is large (the radius of curvature is small). In Fig. 9F, the position and shape of the display unit 8302 in Fig. 9E are indicated by dashed lines.

[0170] In this way, the head mounted display 8300 has a mechanism for adjusting the curvature of the display portion 8302, and can provide an optimal display to various users, regardless of age or gender.

[0171] Furthermore, by changing the curvature of the display portion 8302 depending on the content displayed on the display portion 8302, a high sense of realism can be given to the user. For example, by vibrating the curvature of the display portion 8302, it is possible to express shaking. In this way, various effects can be produced according to the scene in the content, and a new experience can be provided to the user. Furthermore, by linking this with a vibration module provided in the housing 8301, a more realistic display can be achieved.

[0172] Note that the head mounted display 8300 may have two display units 8302 as shown in FIG. 9D.

[0173] By having two display units 8302, the user can view one display unit per eye. This allows high-resolution images to be displayed, even when performing 3D display using parallax, for example. Furthermore, the display unit 8302 is curved in an arc shape roughly centered on the user's eye. This allows the distance from the user's eye to the display surface of the display unit to be constant, allowing the user to view more natural images. Furthermore, even if the brightness and chromaticity of light from the display unit change depending on the viewing angle, this effect can be virtually ignored because the user's eyes are positioned in the normal direction to the display surface of the display unit. Therefore, the display unit 8302 can display more realistic images.

[0174] This embodiment can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0175] (Fourth embodiment) In this embodiment, a display module that can be manufactured using one embodiment of the present invention will be described.

[0176] A display module 6000 shown in FIG. 10A includes a display device 6006 connected by an FPC 6005, a frame 6009, a printed circuit board 6010, and a battery 6011 between an upper cover 6001 and a lower cover 6002.

[0177] For example, a display device manufactured using one embodiment of the present invention can be used as the display device 6006. The display device 6006 can provide a display module with extremely low power consumption.

[0178] The shape and dimensions of the upper cover 6001 and the lower cover 6002 can be changed appropriately to match the size of the display device 6006.

[0179] The display device 6006 may have a function as a touch panel.

[0180] The frame 6009 may have a function of protecting the display device 6006, a function of blocking electromagnetic waves generated by the operation of the printed circuit board 6010, a function as a heat sink, or the like.

[0181] The printed circuit board 6010 has a power supply circuit, a signal processing circuit for outputting video signals and clock signals, a battery control circuit, and the like.

[0182] FIG. 10B is a schematic cross-sectional view of a display module 6000 with an optical touch sensor.

[0183] The display module 6000 has a light emitting section 6015 and a light receiving section 6016 provided on a printed circuit board 6010. The display module 6000 also has a pair of light guiding sections (light guiding section 6017a, light guiding section 6017b) in an area surrounded by an upper cover 6001 and a lower cover 6002.

[0184] The display device 6006 is provided so as to overlap the printed circuit board 6010 and the battery 6011 with the frame 6009 interposed therebetween. The display device 6006 and the frame 6009 are fixed to the light guide portions 6017a and 6017b.

[0185] Light 6018 emitted from the light-emitting unit 6015 passes through the light-guiding unit 6017a, passes through the upper part of the display device 6006, and then passes through the light-guiding unit 6017b to reach the light-receiving unit 6016. For example, a touch operation can be detected when the light 6018 is blocked by a detectable object such as a finger or a stylus.

[0186] A plurality of light-emitting units 6015 are provided, for example, along two adjacent sides of the display device 6006. A plurality of light-receiving units 6016 are provided at positions facing the light-emitting units 6015. This makes it possible to obtain information about the position where a touch operation is performed.

[0187] The light-emitting unit 6015 may use a light source such as an LED element, and it is particularly preferable to use a light source that emits infrared light. The light-receiving unit 6016 may use a photoelectric conversion element that receives the light emitted by the light-emitting unit 6015 and converts it into an electrical signal. Preferably, a photodiode that can receive infrared light may be used.

[0188] The light guiding portion 6017a and the light guiding portion 6017b that transmit light 6018 allow the light emitting portion 6015 and the light receiving portion 6016 to be disposed below the display device 6006, thereby preventing external light from reaching the light receiving portion 6016 and causing the touch sensor to malfunction. In particular, using a resin that absorbs visible light and transmits infrared light can more effectively prevent the touch sensor from malfunctioning.

[0189] This embodiment can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0190] (Embodiment 5) In this embodiment, examples of electronic devices to which the display device of one embodiment of the present invention can be applied will be described.

[0191] Electronic device 6500 shown in FIG. 11A is a portable information terminal that can be used as a smartphone.

[0192] The electronic device 6500 includes a housing 6501, a display portion 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, and a light source 6508. The display portion 6502 has a touch panel function.

[0193] The display device of one embodiment of the present invention can be applied to the display portion 6502. Accordingly, a high-quality image can be displayed in the display portion 6502.

[0194] FIG. 11B is a schematic cross-sectional view including the end of the housing 6501 on the microphone 6506 side.

[0195] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and a display panel 6511, optical members 6512, a touch sensor panel 6513, a printed circuit board 6517, a battery 6518, etc. are arranged in the space surrounded by the housing 6501 and the protective member 6510.

[0196] A display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 by adhesive layers (not shown).

[0197] A part of the display panel 6511 is folded back in an area outside the display unit 6502. An FPC 6515 is connected to the folded back part. An IC 6516 is mounted on the FPC 6515. The FPC 6515 is also connected to a terminal provided on a printed circuit board 6517.

[0198] This embodiment can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0199] (Sixth embodiment) In this embodiment, electronic devices including a display device manufactured using one embodiment of the present invention will be described.

[0200] The electronic devices exemplified below each include a display device according to one embodiment of the present invention in a display portion. Therefore, the electronic devices can achieve high resolution. Furthermore, the electronic devices can also have both high resolution and a large screen.

[0201] One embodiment of the present invention includes a display device and at least one of an antenna, a battery, a housing, a camera, a speaker, a microphone, a touch sensor, and an operation button.

[0202] The electronic device of one embodiment of the present invention may include a secondary battery, and it is preferable that the secondary battery can be charged using contactless power transmission.

[0203] Examples of secondary batteries include lithium ion secondary batteries such as lithium polymer batteries (lithium ion polymer batteries) that use a gel electrolyte, nickel-metal hydride batteries, nickel-cadmium batteries, organic radical batteries, lead-acid batteries, air secondary batteries, nickel-zinc batteries, and silver-zinc batteries.

[0204] The electronic device of one embodiment of the present invention may include an antenna. By receiving a signal through the antenna, images, information, and the like can be displayed on a display portion. When the electronic device includes an antenna and a secondary battery, the antenna may be used for contactless power transmission.

[0205] The display portion of the electronic device according to one embodiment of the present invention can display images with a resolution of, for example, full high definition, 4K2K, 8K4K, 16K8K, or higher.

[0206] Examples of electronic devices include electronic devices with relatively large screens such as television devices, notebook personal computers, monitor devices, digital signage, pachinko machines, and game machines, as well as digital cameras, digital video cameras, digital photo frames, mobile phones, portable game consoles, personal digital assistants, and sound playback devices.

[0207] An electronic device to which one embodiment of the present invention is applied can be incorporated along a flat or curved surface of an inner or outer wall of a building such as a house or a building, or an interior or exterior surface of a car or the like.

[0208] FIG. 12A is a diagram showing the appearance of the camera 8000 with the viewfinder 8100 attached.

[0209] The camera 8000 includes a housing 8001, a display unit 8002, operation buttons 8003, and a shutter button 8004. The camera 8000 is also provided with a detachable lens 8006.

[0210] The camera 8000 may have the lens 8006 and the housing integrated together.

[0211] The camera 8000 can capture an image by pressing a shutter button 8004 or touching a display portion 8002 that functions as a touch panel.

[0212] The housing 8001 has a mount with electrodes, and can be connected to a finder 8100 as well as, for example, a strobe device.

[0213] The finder 8100 includes a housing 8101, a display portion 8102, a button 8103, and the like.

[0214] The housing 8101 is attached to the camera 8000 by a mount that engages with the mount of the camera 8000. The viewfinder 8100 can display an image received from the camera 8000 on a display unit 8102, for example.

[0215] The button 8103 has a function as, for example, a power button.

[0216] The display device of one embodiment of the present invention can be applied to a display portion 8002 of a camera 8000 and a display portion 8102 of a viewfinder 8100. This allows high-quality images to be displayed on the display portion 8002 and the display portion 8102. Note that the camera 8000 may have a built-in viewfinder.

[0217] FIG. 12B is a diagram showing the appearance of the head mounted display 8200.

[0218] The head-mounted display 8200 includes a mounting portion 8201, a lens 8202, a main body 8203, a display portion 8204, and a cable 8205. The mounting portion 8201 has a built-in battery 8206.

[0219] A cable 8205 supplies power from a battery 8206 to the main body 8203. The main body 8203 includes, for example, a wireless receiver, and can display received video information on a display portion 8204. The main body 8203 also includes a camera, and can use information on the movement of the user's eyeballs or eyelids as an input means.

[0220] The wearing unit 8201 may have a function of recognizing the line of sight by providing a plurality of electrodes at positions that come into contact with the user and capable of detecting a current that flows in accordance with the movement of the user's eyeballs. The wearing unit 8201 may also have a function of monitoring the user's pulse rate based on the current that flows through the electrodes. The wearing unit 8201 may also have various sensors such as a temperature sensor, a pressure sensor, and an acceleration sensor, and may have a function of displaying the user's biological information on the display unit 8204 and a function of changing the image displayed on the display unit 8204 in accordance with the movement of the user's head.

[0221] The display device of one embodiment of the present invention can be applied to the display portion 8204. Accordingly, a high-quality image can be displayed on the display portion 8204.

[0222] 12C, 12D, and 12E are diagrams illustrating the appearance of a head-mounted display 8300. The head-mounted display 8300 includes a housing 8301, a display portion 8302, a band-shaped fixture 8304, and a pair of lenses 8305.

[0223] A user can view the display on the display portion 8302 through the lens 8305. Note that it is preferable to arrange the display portion 8302 in a curved manner because the user can feel a high sense of presence. In addition, by viewing different images displayed in different regions of the display portion 8302 through the lens 8305, it is possible to perform, for example, three-dimensional display using parallax. Note that the present invention is not limited to a configuration in which one display portion 8302 is provided, and two display portions 8302 may be provided, with one display portion being provided for each eye of the user.

[0224] Note that the display device of one embodiment of the present invention can be applied to the display portion 8302. The display device including the semiconductor device of one embodiment of the present invention has extremely high definition; therefore, even when an image is enlarged using the lens 8305 as in FIG. 12E, pixels are not visible to a user, and more realistic images can be displayed.

[0225] The electronic device shown in Figures 13A to 13G has a housing 9000, a display unit 9001, a speaker 9003, operation keys 9005 (including a power switch or an operation switch), a connection terminal 9006, a sensor 9007 (including a function to measure force, displacement, position, speed, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared rays), a microphone 9008, etc.

[0226] 13A to 13G have various functions. For example, they may have a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, time, etc., a function to control processing using various software (programs), a wireless communication function, a function to read and process programs or data recorded on a recording medium, etc. Note that the functions of the electronic device are not limited to these, and the electronic device may have various other functions. The electronic device may have multiple display units. Furthermore, the electronic device may have a function to include a camera or the like to capture still images or videos and store them on a recording medium (external or built-in to the camera), a function to display the captured images on the display unit, etc.

[0227] The electronic device shown in FIGS. 13A to 13G will be described in detail below.

[0228] 13A is a perspective view showing a television device 9100. The television device 9100 can incorporate a display unit 9001 with a large screen, for example, 50 inches or more, or 100 inches or more.

[0229] FIG. 13B is a perspective view showing a mobile information terminal 9101. The mobile information terminal 9101 can be used as, for example, a smartphone. The mobile information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like. The mobile information terminal 9101 can display text, image information, and the like on multiple surfaces thereof. FIG. 13B shows an example in which three icons 9050 are displayed. Information 9051, indicated by a dashed rectangle, can also be displayed on another surface of the display unit 9001. Examples of the information 9051 include notifications of incoming emails, SNS messages, phone calls, etc., the title of the email or SNS message, the sender's name, the date and time, the remaining battery level, and the strength of antenna reception. Alternatively, the icon 9050 or the like may be displayed in the position where the information 9051 is displayed.

[0230] 13C is a perspective view showing a mobile information terminal 9102. The mobile information terminal 9102 has a function of displaying information on three or more sides of the display unit 9001. Here, an example is shown in which information 9052, information 9053, and information 9054 are displayed on different sides. For example, a user can check information 9053 displayed in a position that can be observed from above the mobile information terminal 9102 while the mobile information terminal 9102 is stored in a breast pocket of clothes. The user can check the display without taking the mobile information terminal 9102 out of the pocket and decide, for example, whether to answer a call.

[0231] FIG. 13D is a perspective view showing a wristwatch-type mobile information terminal 9200. The mobile information terminal 9200 can be used as, for example, a smart watch (registered trademark). The display surface of the display unit 9001 is curved, and display can be performed along the curved display surface. The mobile information terminal 9200 can also perform hands-free calling by communicating with, for example, a headset capable of wireless communication. The mobile information terminal 9200 can also perform data transmission and reception with another information terminal or charge itself via a connection terminal 9006. Note that charging may be performed by wireless power supply.

[0232] 13E, 13F, and 13G are perspective views showing a foldable mobile information terminal 9201. FIG. 13E shows the mobile information terminal 9201 in an unfolded state, FIG. 13G shows it in a folded state, and FIG. 13F is a perspective view showing a state in the process of changing from one of FIG. 13E and FIG. 13G to the other. The mobile information terminal 9201 is highly portable when folded, and has a seamless, wide display area when unfolded, providing excellent viewability of the display. A display unit 9001 of the mobile information terminal 9201 is supported by three housings 9000 connected by hinges 9055. For example, the display unit 9001 can be bent with a curvature radius of 1 mm or more and 150 mm or less.

[0233] 14A shows an example of a television device. A television device 7100 includes a display unit 7500 built into a housing 7101. Here, the housing 7101 is supported by a stand 7103.

[0234] 14A can be operated using operation switches provided on the housing 7101 or a separate remote control 7111. Alternatively, a touch panel may be applied to the display portion 7500, and the television 7100 may be operated by touching the touch panel. The remote control 7111 may have a display portion in addition to operation buttons.

[0235] The television device 7100 may also include a television broadcast receiver or a communication device for network connection.

[0236] 14B shows a laptop personal computer 7200. The laptop personal computer 7200 includes a housing 7211, a keyboard 7212, a pointing device 7213, and an external connection port 7214. A display portion 7500 is incorporated in the housing 7211.

[0237] 14C and 14D show an example of a digital signage.

[0238] 14C includes a housing 7301, a display unit 7500, and a speaker 7303. The digital signage 7300 may further include an LED lamp, operation keys (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.

[0239] 14D shows a digital signage 7400 attached to a cylindrical pillar 7401. The digital signage 7400 has a display unit 7500 provided along the curved surface of the pillar 7401.

[0240] The larger the display unit 7500, the more information can be provided at one time, and the larger the display unit 7500 is, the more easily it will catch people's attention, which will have the effect of increasing the advertising effectiveness of advertisements, for example.

[0241] It is preferable that a touch panel be applied to the display unit 7500 so that the user can operate it. This allows the display unit 7500 to be used not only for advertising purposes but also for providing users with information they require, such as route information, traffic information, or commercial facility guidance information.

[0242] 14C and 14D, the digital signage 7300 or the digital signage 7400 is preferably capable of wirelessly linking with an information terminal 7311 such as a smartphone carried by a user. For example, advertising information displayed on the display unit 7500 can be displayed on the screen of the information terminal 7311. Furthermore, the display on the display unit 7500 can be switched by operating the information terminal 7311.

[0243] Furthermore, a game using the information terminal device 7311 as an operation means (controller) can be executed on the digital signage 7300 or the digital signage 7400. This allows an unspecified number of users to simultaneously participate in and enjoy the game.

[0244] 14A to 14D can be applied to the display device of one embodiment of the present invention, whereby high-quality images can be displayed in the display area 7500.

[0245] Although the electronic devices in this embodiment have a display portion, one embodiment of the present invention can also be applied to electronic devices that do not have a display portion.

[0246] This embodiment can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification. [Explanation of symbols]

[0247] 10: display device, 11: substrate, 12: substrate, 13: insulating layer, 14: partition wall, 15B: pixel, 15G: pixel, 15R: pixel, 15: pixel, 21: insulating layer, 25B: colored layer, 25G: colored layer, 25R: colored layer, 29A: resist, 29B: resist mask, 29: lens, 30: light-emitting element, 31A: film, 31: light-emitting layer, 32a: end, 32b: end, 32: end, 33: adhesive layer, 42: conductive layer, 45: light-shielding layer, 52: transistor, 60A: film, 60: conductive layer, 63A: film, 63: insulating layer, 201: driving circuit, 215: display unit, 221: driving circuit, 231: driving driving circuit, 232: driving circuit, 241: driving circuit, 723: electrode, 726: insulating layer, 728: insulating layer, 729: insulating layer, 741: insulating layer, 742: semiconductor layer, 744a: electrode, 744b: electrode, 746: electrode, 755: impurity, 771: substrate, 772: insulating layer, 810: transistor, 811: transistor, 820: transistor, 821: transistor, 825: transistor, 826: transistor, 842: transistor, 843: transistor, 844: transistor, 845: transistor, 846: transistor, 847: transistor, 4 005: sealing material, 4011: transistor, 4014: wiring, 4015: electrode, 4017: electrode, 4018: FPC, 4019: anisotropic conductive layer, 4020: capacitor, 4021: electrode, 4041: printed circuit board, 4042: integrated circuit, 4102: insulating layer, 4103: insulating layer, 4110: insulating layer, 4111: insulating layer, 4112: insulating layer, 4200: input device, 4210: touch panel, 4227: electrode, 4228: electrode, 4237: wiring, 4238: wiring, 4239: wiring, 4263: substrate, 4272: FPC, 4273: IC, 6000: display module , 6001: upper cover, 6002: lower cover, 6005: FPC, 6006: display device, 6009: frame, 6010: printed circuit board, 6011: battery, 6015: light emitting unit, 6016: light receiving unit, 6017a: light guiding unit, 6017b: light guiding unit, 6018: light, 6500: electronic device, 6501: housing, 6502: display unit, 6503: power button, 6504: button, 6505: speaker, 6506: microphone, 6507: camera, 6508: light source, 6510: protective member, 6511: display panel, 6512: optical member, 6513: touch sensor panel,6515: FPC, 6516: IC, 6517: Printed circuit board, 6518: Battery, 7100: Television device, 7101: Housing, 7103: Stand, 7111: Remote control device, 7200: Notebook personal computer, 7211: Housing, 7212: Keyboard, 7213: Pointing device, 7214: External connection port, 7300: Digital signage, 7301 : Housing, 7303: Speaker, 7311: Information terminal, 7400: Digital signage, 7401: Pillar, 7500: Display, 8000: Camera, 8001: Housing, 8002: Display, 8003: Operation buttons, 8004: Shutter button, 8006: Lens, 8100: Viewfinder, 8101: Housing, 8102: Display, 8103: Button, 8200: Head-mounted display, 82 01: Mounting part, 8202: Lens, 8203: Main body, 8204: Display part, 8205: Cable, 8206: Battery, 8300: Head mounted display, 8301: Housing, 8302: Display part, 8303: Operation buttons, 8304: Fixture, 8305: Lens, 8306: Dial, 8307: Dial, 8308: Drive part, 8310: User, 8311: User, 9000: Housing ,9001: Display unit, 9003: Speaker, 9005: Operation keys, 9006: Connection terminal, 9007: Sensor, 9008: Microphone, 9050: Icon, 9051: Information, 9052: Information, 9053: Information, 9054: Information, 9055: Hinge, 9100: Television device, 9101: Portable information terminal, 9102: Portable information terminal, 9200: Portable information terminal, 9201: Portable information terminal,

Claims

1. The light-emitting device has an electrode, a light-emitting layer, a lens, and a colored layer, In a cross-sectional view, an edge of the lens has a region located outside an edge of the electrode and an edge of the light-emitting layer, The display device, wherein the electrode, the light-emitting layer, the lens, and the colored layer are arranged to have overlapping regions.

2. In claim 1, The lens comprises an acrylic resin.

3. In claim 1 or 2, an insulating layer and a partition wall, The display device, wherein the insulating layer covers the lens, the light-emitting layer, and the electrode, and is disposed so as to be in contact with the partition wall.

Images