Display device and manufacturing method thereof

Abstract

The display device includes a film alignment pad arranged on the bottom of the connecting film and having a base lead extending in a first direction and an alignment lead protruding from the base lead in a second direction intersecting the first direction, and a substrate alignment pad arranged on the top of the printed circuit board and having a base land extending in the first direction and an alignment land protruding from the base land in the second direction.

Description

[Technical field]

[0001] The present invention relates to a display device and a method for manufacturing the same. [Background technology]

[0002] The display device includes a display panel, a connection film, and a printed circuit board. The printed circuit board generates signals and / or voltages for driving the display panel, and the connection film transmits the signals and / or voltages to the display panel. To connect the connection film and the printed circuit board to each other, film pads are disposed on the lower part of the connection film, and board pads are disposed on the upper part of the printed circuit board.

[0003] In order to improve the quality of the display device (eg, improve the resolution, increase the frequency, etc.), research has been conducted in recent years to reduce the spacing between the film pads and the spacing between the substrate pads. Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a display device.

[0005] Another object of the present invention is to provide a method for manufacturing the display device.

[0006] However, the object of the present invention is not limited to the above-mentioned object, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Means for solving the problem]

[0007] In order to achieve the object of the present invention, a display device according to one embodiment of the present invention is characterized in that it includes a film alignment pad arranged at the bottom of a connection film connected to a display panel, the film alignment pad having a base lead extending in a first direction and an alignment lead protruding from the base lead in a second direction intersecting the first direction, and a substrate alignment pad arranged at the top of a printed circuit board connected to the connection film, the substrate alignment pad having a base land extending in the first direction and an alignment land protruding from the base land in the second direction.

[0008] The alignment leads completely overlap the alignment lands, and the alignment lands partially overlap the alignment leads.

[0009] The length of the alignment lead in the first direction is smaller than the length of the alignment land in the first direction.

[0010] The length of the alignment lead in the second direction is the same as the length of the alignment land in the second direction.

[0011] The alignment leads and the alignment lands do not overlap each other.

[0012] The length of the alignment lead in the second direction is the same as the length of the alignment land in the second direction.

[0013] The alignment leads overlap the alignment lands and the alignment lands overlap the alignment leads.

[0014] The length of the alignment lead in the first direction is greater than the length of the alignment land in the first direction.

[0015] The length of the alignment lead in the second direction is smaller than the length of the alignment land in the second direction.

[0016] The display device further includes a film pad disposed on the lower portion of the connecting film and aligned in the second direction, and the film alignment pad is aligned in the second direction together with the film pad.

[0017] The display device further includes substrate pads disposed on the upper portion of the printed circuit board and arranged in the second direction, and the substrate alignment pads are arranged in the second direction together with the substrate pads.

[0018] In order to achieve another object of the present invention, a manufacturing method of a display device according to one embodiment of the present invention includes aligning an alignment lead arranged at the bottom of a connection film with an alignment land arranged at the top of a printed circuit board, measuring a first distance in a first direction between a first end of the alignment lead and a first end of the alignment land, measuring a second distance in the first direction between a second end of the alignment lead and a second end of the alignment land, and realigning the connection film and the printed circuit board in the first direction so that the measured value between the first distance and the second distance is equal to a predetermined target value.

[0019] The target value is set by the curvature of the connecting film.

[0020] The splice film is provided from a reel.

[0021] The curvature of the connection film located on the outer diameter of the reel is different from the curvature of the connection film located on the inner diameter of the reel.

[0022] In the step of realigning the connecting film and the printed circuit board in the first direction, the printed circuit board is fixed in the first direction, and the connecting film is moved in the first direction.

[0023] The measurement is the difference between the first distance and the second distance.

[0024] The alignment lead is disposed on the lower portion of the connection film and protrudes from a base lead extending in the first direction in a second direction intersecting the first direction.

[0025] The alignment land is disposed on the top of the printed circuit board and protrudes in the second direction from a base land extending in the first direction.

[0026] The manufacturing method further includes a step of compression bonding the connecting film and the printed circuit board after the step of realigning the connecting film and the printed circuit board in the first direction. Effect of the Invention

[0027] A display device according to an embodiment of the present invention includes a film alignment pad disposed under a connection film and a substrate alignment pad disposed over a printed circuit board, the film alignment pad including a base lead and an alignment lead protruding from the base lead, and the substrate alignment pad including a base land and an alignment land protruding from the base land.

[0028] In the method for manufacturing the display device, a first distance between a first end of an alignment lead and a first end of an alignment land is measured, a second distance between a second end of the alignment lead and a second end of the alignment land is measured, and a measurement value between the first distance and the second distance is calculated. The connection film is realigned in a first direction so that the measurement value is equal to a target value set according to a curvature of the connection film. Thus, even if the connection films have different curvatures, the film pads and the substrate pads can be pressed more precisely and contact each other with a constant contact area.

[0029] However, the effects of the present invention are not limited to the effects described above, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Brief description of the drawings]

[0030] [Figure 1] 1 is a plan view illustrating a display device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view showing an enlarged area A of FIG. [Diagram 3] FIG. 2 is an enlarged plan view of region A in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line II' in FIG. [Diagram 5] 2 is a cross-sectional view illustrating a display panel included in the display device of FIG. 1. [Figure 6] FIG. 13 is a diagram for explaining a reel that provides a connection film. [Figure 7] 1 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present invention. [Figure 8] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a first curvature by the manufacturing method in FIG. 7. FIG. [Figure 9] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a first curvature by the manufacturing method in FIG. 7. FIG. [Figure 10] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a first curvature by the manufacturing method in FIG. 7. FIG. [Figure 11] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a first curvature by the manufacturing method in FIG. 7. FIG. [Figure 12] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a first curvature by the manufacturing method in FIG. 7. FIG. [Figure 13] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a first curvature by the manufacturing method in FIG. 7. FIG. [Figure 14] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a second curvature by the manufacturing method in FIG. 7. FIG. [Figure 15] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a second curvature by the manufacturing method in FIG. 7. FIG. [Figure 16] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a second curvature by the manufacturing method in FIG. 7. FIG. [Figure 17] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a second curvature by the manufacturing method in FIG. 7. FIG. [Figure 18] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a second curvature by the manufacturing method in FIG. 7. FIG. [Figure 19] 8 is a diagram for explaining a method for manufacturing a display device including a connecting film having a second curvature by the manufacturing method in FIG. 7. FIG. [Figure 20] FIG. 11 is a plan view illustrating a display device according to another embodiment of the present invention. [Figure 21] FIG. 21 is an enlarged plan view of region B in FIG. 20. [Figure 22] FIG. 22 is a plan view for explaining the printed circuit board in FIG. 21. [Diagram 23] 22 is a plan view for explaining the connecting film in FIG. 21. FIG. [Figure 24] FIG. 13 is a plan view illustrating a display device according to still another embodiment of the present invention. [Diagram 25] FIG. 25 is an enlarged plan view of region C in FIG. 24. [Figure 26] FIG. 26 is a plan view for explaining the printed circuit board in FIG. 25. [Figure 27] 26 is a plan view for explaining the connection film in FIG. 25. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The same components in the drawings are designated by the same reference numerals, and duplicated descriptions of the same components will be omitted.

[0032] FIG. 1 is a plan view illustrating a display device according to an embodiment of the present invention.

[0033] As shown in FIG. 1, a display device 1000 according to an embodiment of the present invention includes a display panel (PNL), at least one connection film (CF), and at least one printed circuit board (PCB).

[0034] The display panel (PNL) is connected to the connection film (CF). At least one pixel (PX) is arranged on the display panel (PNL). The pixel (PX) generates a drive current using a signal and / or a voltage provided via the connection film (CF). The pixel (PX) also emits light corresponding to the drive current. The light emitted from the pixel (PX) causes the display panel (PNL) to display an image.

[0035] Further, the display panel (PNL) is provided with data lines (DL) extending in a first direction (D1). The data lines (DL) are connected to the connection film (CF) and the pixels (PX) to provide data voltages to the pixels (PX).

[0036] The connecting film (CF) is connected to the display panel (PNL) and the printed circuit board (PCB). The connecting film (CF) electrically connects the display panel (PNL) and the printed circuit board (PCB). For example, a film pad (e.g., film pad (FP) in FIG. 2) and a film alignment pad (e.g., first film alignment pad (FAP1) in FIG. 2) are disposed on the lower part of the connecting film (CF). The film pad and the film alignment pad connect the connecting film (CF) to the printed circuit board (PCB).

[0037] In one embodiment, the connection film (CF) is disposed on one side of the display panel (PNL) and aligned in a second direction (D2) intersecting the first direction (D1).

[0038] The printed circuit board (PCB) is connected to the connecting film (CF). The printed circuit board (PCB) is electrically connected to the display panel (PNL) through the connecting film (CF). For example, a board pad (e.g., board pad (BP) in FIG. 2) and a board alignment pad (e.g., first board alignment pad (BAP1) in FIG. 2) are disposed on the top of the printed circuit board (PCB). The board pad and the board alignment pad connect the printed circuit board (PCB) to the connecting film (CF).

[0039] In one embodiment, the printed circuit boards (PCBs) are disposed on one side of the connection film (CF) and are arranged side by side in the second direction (D2).

[0040] 2 is an exploded perspective view in which a region A in FIG. 1 is enlarged, FIG. 3 is a plan view in which a region A in FIG. 1 is enlarged, and FIG. 4 is a cross-sectional view taken along line II' in FIG.

[0041] 2, a first film alignment pad (FAP1), a film pad (FP), and a second film alignment pad (FAP2) are disposed on the bottom of the connection film (CF), and a first board alignment pad (BAP1), a board pad (BP), and a second board alignment pad (BAP2) are disposed on the top of the printed circuit board (PCB).

[0042] The second film alignment pad (FAP2), the film pad (FP), and the first film alignment pad (FAP1) are arranged side by side in the second direction (D2). The film pad (FP) is disposed between the first film alignment pad (FAP1) and the second film alignment pad (FAP2).

[0043] The first film alignment pad (FAP1) includes a first base lead (BE1) and a first alignment lead (AE1). The first base lead (BE1) extends in the first direction (D1). The first alignment lead (AE1) protrudes from the first base lead (BE1) in the second direction (D2).

[0044] The film pads (FP) are arranged side by side in the second direction (D2). Each of the film pads (FP) extends in the first direction (D1). For example, the shape of each of the film pads (FP) is substantially the same as the shape of the first base lead (BE1).

[0045] The second film alignment pad (FAP2) includes a second base lead (BE2) and a second alignment lead (AE2). The second base lead (BE2) extends in the first direction (D1). The second alignment lead (AE2) protrudes from the second base lead (BE2) in a direction opposite to the second direction (D2).

[0046] The second substrate alignment pad (BAP2), the substrate pad (BP), and the first substrate alignment pad (BAP1) are arranged side by side in the second direction (D2). The substrate pad (BP) is disposed between the first substrate alignment pad (BAP1) and the second substrate alignment pad (BAP2).

[0047] The first substrate alignment pad (BAP1) includes a first base land (BA1) and a first alignment land (AA1). The first base land (BA1) extends in the first direction (D1). The first alignment land (AA1) protrudes from the first base land (BA1) in the second direction (D2).

[0048] The substrate pads (BP) are arranged side by side in the second direction (D2). Each of the substrate pads (BP) extends in the first direction (D1). For example, the shape of each of the substrate pads (BP) is substantially the same as the shape of the first base land (BA1).

[0049] The second substrate alignment pad (BAP2) includes a second base land (BA2) and a second alignment land (AA2). The second base land (BA2) extends in the first direction (D1). The second alignment land (AA2) protrudes from the second base land (BA2) in a direction opposite to the second direction (D2).

[0050] As shown in Fig. 3, the first base lead (BE1) overlaps the first base land (BA1). The first alignment lead (AE1) overlaps the first alignment land (AA1). The film pads (FP) overlap the substrate pads (BP), respectively. The second base lead (BE2) overlaps the second base land (BA2). The second alignment lead (AE2) overlaps the second alignment land (AA2).

[0051] In one embodiment, the first alignment lead (AE1) completely overlaps the first alignment land (AA1), and the first alignment land (AA1) partially overlaps the first alignment lead (AE1).

[0052] For example, the length of the first alignment lead (AE1) in the first direction (D1) is smaller than the length of the first alignment land (AA1) in the first direction (D1), and the length of the first alignment lead (AE1) in the second direction (D2) is substantially the same as the length of the first alignment land (AA1) in the second direction (D2).

[0053] In one embodiment, the second alignment lead (AE2) completely overlaps the second alignment land (AA2), and the second alignment land (AA2) partially overlaps the second alignment lead (AE2).

[0054] For example, the length of the second alignment lead (AE2) in the first direction (D1) is smaller than the length of the second alignment land (AA2) in the first direction (D1), and the length of the second alignment lead (AE2) in the second direction (D2) is substantially the same as the length of the second alignment land (AA2) in the second direction (D2).

[0055] As shown in FIG. 4, the first base lead (BE1) contacts the first base land (BA1). The first alignment lead (AE1) contacts the first alignment land (AA1). The film pads (FP) contact the substrate pads (BP), respectively. The second base lead (BE2) contacts the second base land (BA2). The second alignment lead (AE2) contacts the second alignment land (AA2).

[0056] FIG. 5 is a cross-sectional view illustrating a display panel included in the display device of FIG.

[0057] As shown in FIG. 5, the display panel (PNL) includes a substrate (SUB), a lower conductive pattern (ML1), a first insulating layer (IL1), an active pattern (ACT), a second insulating layer (IL2), a gate electrode (GAT), a third insulating layer (IL3), a first upper conductive pattern (ML2), a second upper conductive pattern (ML3), a fourth insulating layer (IL4), a first electrode (ADE), a pixel defining layer (PDL), a light emitting layer (EL), a second electrode (CTE), and an encapsulation layer (ENC).

[0058] The substrate (SUB) may comprise a transparent or opaque material. In one embodiment, materials used as the substrate (SUB) include glass, quartz, plastic, etc. These may be used alone or in combination with each other.

[0059] The lower conductive pattern (ML1) is disposed on the substrate (SUB). In an embodiment, the lower conductive pattern (ML1) is formed of a metal, an alloy, a conductive metal oxide, a transparent conductive material, or the like. Materials used as the lower conductive pattern (ML1) include silver (Ag), an alloy containing silver, molybdenum (Mo), an alloy containing molybdenum, aluminum (Al), an alloy containing aluminum, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (ITO), indium zinc oxide (IZO), and the like. These may be used alone or in combination with each other. The lower conductive pattern (ML1) may be formed of a single layer or a multilayer.

[0060] The first insulating layer (IL1) is disposed on the lower conductive pattern (ML1). In one embodiment, the first insulating layer (IL1) is made of an insulating material. The insulating material used for the first insulating layer (IL1) includes silicon oxide, silicon nitride, silicon oxynitride, etc., which can be used alone or in combination with each other. The first insulating layer (IL1) can be composed of a single layer or multiple layers.

[0061] The active pattern (ACT) is disposed on the first insulating layer (IL1). In one embodiment, the active pattern (ACT) is formed of a silicon semiconductor material or an oxide semiconductor material. The silicon semiconductor material used as the active pattern (ACT) includes amorphous silicon and polycrystalline silicon. The oxide semiconductor material used as the active pattern (ACT) includes IGZO (InGaZnO) and ITZO (InSnZnO). The oxide semiconductor material further includes indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). These may be used alone or in combination with each other.

[0062] The second insulating layer (IL2) is disposed on the active pattern (ACT). In one embodiment, the second insulating layer (IL2) is made of an insulating material. The insulating material used for the second insulating layer (IL2) includes silicon oxide, silicon nitride, silicon oxynitride, etc., which can be used alone or in combination with each other. The second insulating layer (IL2) can be composed of a single layer or multiple layers.

[0063] The gate electrode (GAT) is disposed on the second insulating layer (IL2). In one embodiment, the gate electrode (GAT) is formed of a metal, an alloy, a conductive metal oxide, a transparent conductive material, or the like. Materials used as the gate electrode (GAT) include silver (Ag), a silver-containing alloy, molybdenum (Mo), a molybdenum-containing alloy, aluminum (Al), an aluminum-containing alloy, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (ITO), indium zinc oxide (IZO), and the like. These may be used alone or in combination with each other. The gate electrode (GAT) may be formed of a single layer or multiple layers.

[0064] The third insulating layer (IL3) is disposed on the gate electrode (GAT). In one embodiment, the third insulating layer (IL3) is made of an insulating material. The insulating material used for the third insulating layer (IL3) includes silicon oxide, silicon nitride, silicon oxynitride, etc. These may be used alone or in combination with each other. The third insulating layer (IL3) may be composed of a single layer or multiple layers.

[0065] The first upper conductive pattern (ML2) and the second upper conductive pattern (ML3) are disposed on the third insulating layer (IL3). The first upper conductive pattern (ML2) and the second upper conductive pattern (ML3) are formed together and include the same material.

[0066] In an embodiment, the first upper conductive pattern (ML2) and the second upper conductive pattern (ML3) are formed of a metal, an alloy, a conductive metal oxide, a transparent conductive material, etc. Materials used for the first upper conductive pattern (ML2) and the second upper conductive pattern (ML3) include silver (Ag), an alloy containing silver, molybdenum (Mo), an alloy containing molybdenum, aluminum (Al), an alloy containing aluminum, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (ITO), indium zinc oxide (IZO), etc. These may be used alone or in combination with each other. In addition, the first upper conductive pattern (ML2) and the second upper conductive pattern (ML3) are formed of a single layer or a multilayer.

[0067] The first upper conductive pattern (ML2) contacts the first lower conductive pattern (ML1) and the active pattern (ACT). The second upper conductive pattern (ML3) contacts the active pattern (ACT).

[0068] The fourth insulating layer (IL4) is disposed on the first and second upper conductive patterns (ML2, ML3). In one embodiment, the fourth insulating layer (IL4) is formed of an organic insulating material and / or an inorganic insulating material. Organic insulating materials used for the fourth insulating layer (IL4) include photoresist, polyacrylic resin, polyimide resin, acrylic resin, etc. Inorganic insulating materials used for the fourth insulating layer (IL4) include silicon oxide, silicon nitride, silicon oxynitride, etc. These may be used alone or in combination with each other. The fourth insulating layer (IL4) may be formed of a single layer or multiple layers.

[0069] The first electrode (ADE) is disposed on the fourth insulating layer (IL4). In one embodiment, the first electrode (ADE) is formed of a metal, an alloy, a conductive metal oxide, a transparent conductive material, or the like. Materials used as the first electrode (ADE) include silver (Ag), an alloy containing silver, molybdenum (Mo), an alloy containing molybdenum, aluminum (Al), an alloy containing aluminum, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (ITO), indium zinc oxide (IZO), and the like. These may be used alone or in combination with each other. The first electrode (ADE) may be formed of a single layer or a multilayer.

[0070] The pixel definition layer (PDL) is disposed on the fourth insulating layer (IL4). The pixel definition layer (PDL) has an opening that exposes the first electrode (ADE).

[0071] The light emitting layer (EL) is disposed on the first electrode (ADE) within the opening, and emits light in response to the driving current.

[0072] The second electrode (CTE) is disposed on the light-emitting layer (EL).

[0073] The encapsulation layer (ENC) is disposed on the second electrode (CTE). The encapsulation layer (ENC) includes at least one inorganic layer and at least one organic layer and can prevent the penetration of air and / or moisture.

[0074] FIG. 6 is a diagram for explaining a reel that provides a connection film.

[0075] As shown in Fig. 6, a reel (RL) provides the connection film (CF) included in the display device 1000 of Fig. 1. The connection film (CF) is provided on the reel (RL) in a rolled shape.

[0076] The connecting films (CF) have different curvatures depending on the length of the connecting films (CF) held from the center of the reel (RL). For example, a first curvature (CV1) of a first connecting film (CF1) located on the outer diameter of the reel (RL) is different from a second curvature (CV2) of a second connecting film (CF2) located on the inner diameter of the reel (RL).

[0077] In the manufacturing method of the display device according to the embodiment of the present invention, the connection film (CF) and the printed circuit board (PCB) are realigned in the first direction (D1) according to the curvature of the connection film (CF), so that the connection film (CF) is aligned with the printed circuit board (PCB) in the first direction (D1) with high accuracy.

[0078] FIG. 7 is a flowchart illustrating a method for manufacturing a display device according to one embodiment of the present invention, and FIGS. 8 to 13 are views illustrating a method for manufacturing a display device including a connecting film having a first curvature by the manufacturing method of FIG. 7.

[0079] 7 and 8, in a method (100) for manufacturing a display device according to an embodiment of the present invention, the display panel (PNL) on which the first connection film (CF1) is disposed and the printed circuit board (PCB) are aligned, whereby the first alignment lead (AE1) and the first alignment land (AA1) are aligned (S110).

[0080] 7 and 9, a first distance (Y1') in the first direction (D1) between a first end of the first alignment lead (AE1) and a first end of the first alignment land (AA1) is measured (S120). For example, the first end of the first alignment lead (AE1) and the first end of the first alignment land (AA1) are adjacent to each other.

[0081] Also, a second distance (Y2') in the first direction (D1) between a second end of the first alignment lead (AE1) and a second end of the first alignment land (AA1) is measured (S130). For example, the second end of the first alignment lead (AE1) and the second end of the first alignment land (AA1) are adjacent to each other.

[0082] A measurement between the first distance (Y1') and the second distance (Y2') is calculated (S140). In one embodiment, the measurement is the difference between the first distance (Y1') and the second distance (Y2'). For example, as shown in FIG. 9, the measurement is the difference (Y1'-Y2') between the first distance (Y1') and the second distance (Y2'), which is approximately 2 um. In this case, the film pad (FP) and the substrate pad (BP) overlap while being shifted from each other in the first direction (D1).

[0083] As shown in Figures 7, 10, 11 and 12, the first connecting film (CF1) is realigned in the first direction (D1) so that the measured value is equal to a target value (S150). In this case, the printed circuit board (PCB) is fixed in the first direction (D1) and the first connecting film (CF1) is moved in the first direction (D1).

[0084] In one embodiment, the target value is preset by the first curvature (CV1) of the first connecting film (CF1), in other words, the target value is set by the curvature of the connecting film.

[0085] For example, as shown in Figures 10 and 11, when the first connecting film (CF1) has the first curvature (CV1), the target value is approximately 0 um. The first connecting film (CF1) is moved in the first direction (D1) so that the measured value (e.g., 2 um) is equal to the target value (e.g., 0 um). This allows the first connecting film (CF1) to be aligned with the printed circuit board (PCB) in the first direction (D1) with high precision.

[0086] 7 and 13, the first connection film (CF1) and the printed circuit board (PCB) are compression bonded (S160). As a result, the film pads (FP) contact the board pads (BP), respectively. Also, the first film alignment pad (FAP1) contacts the first board alignment pad (BAP1), and the second film alignment pad (FAP2) contacts the second board alignment pad (BAP2).

[0087] 14 to 19 are diagrams for explaining a method for manufacturing a display device including a connecting film having a second curvature by the manufacturing method of FIG.

[0088] 7 and 14, in a manufacturing method (S100) of a display device according to an embodiment of the present invention, the display panel (PNL) on which the second connection film (CF2) is disposed and the printed circuit board (PCB) are aligned, whereby the first alignment lead (AE1) and the first alignment land (AA1) are aligned (S110).

[0089] 7 and 15, a first distance (Y3') in the first direction (D1) between a first end of the first alignment lead (AE1) and a first end of the first alignment land (AA1) is measured (S120). For example, the first end of the first alignment lead (AE1) and the first end of the first alignment land (AA1) are adjacent to each other.

[0090] Also, a second distance (Y4') in the first direction (D1) between a second end of the first alignment lead (AE1) and a second end of the first alignment land (AA1) is measured (S130). For example, the second end of the first alignment lead (AE1) and the second end of the first alignment land (AA1) are adjacent to each other.

[0091] A measurement between the first distance (Y3') and the second distance (Y4') is calculated (S140). In one embodiment, the measurement is the difference between the first distance (Y3') and the second distance (Y4'). For example, as shown in FIG. 15, the measurement is the difference (Y3'-Y4') between the first distance (Y3') and the second distance (Y4'), which is approximately -2um. In this case, the film pad (FP) and the substrate pad (BP) overlap while being shifted from each other in the first direction (D1).

[0092] As shown in Figures 7, 16, 17 and 18, the second connecting film (CF2) is realigned in the first direction (D1) so that the measured value is equal to a target value (S150), in which the printed circuit board (PCB) is fixed in the first direction (D1) and the second connecting film (CF2) is moved in a direction opposite to the first direction (D1).

[0093] In one embodiment, the target value is preset by the second curvature (CV2) of the second connecting film (CF2), in other words, the target value is set by the curvature of the connecting film.

[0094] For example, as shown in Figures 16 and 17, when the second connecting film (CF2) has the second curvature (CV2), the target value is approximately -1um. The second connecting film (CF2) is moved in the opposite direction to the first direction (D1) so that the measured value (e.g., -2um) is equal to the target value (e.g., -1um). This allows the second connecting film (CF2) to be aligned with the printed circuit board (PCB) in the first direction (D1) with high precision.

[0095] 7 and 19, the second connection film (CF2) and the printed circuit board (PCB) are compression bonded (S160). As a result, the film pads (FP) contact the board pads (BP), respectively. Also, the first film alignment pad (FAP1) contacts the first board alignment pad (BAP1), and the second film alignment pad (FAP2) contacts the second board alignment pad (BAP2).

[0096] In the manufacturing method (S100) according to an embodiment of the present invention, a first distance between a first end of an alignment lead and a first end of an alignment land is measured, a second distance between a second end of the alignment lead and a second end of the alignment land is measured, and a measurement value between the first distance and the second distance is calculated. The connection film is realigned in a first direction so that the measurement value is equal to a target value set according to the curvature of the connection film. Thus, even if the connection films have different curvatures, the film pads and the board pads can contact each other with a constant contact area in the first direction.

[0097] Fig. 20 is a plan view for explaining a display device according to another embodiment of the present invention, Fig. 21 is an enlarged plan view of region B in Fig. 20, Fig. 22 is a plan view for explaining the printed circuit board in Fig. 21, and Fig. 23 is a plan view for explaining the connection film in Fig. 21. It will be understood that any component shown in Fig. 20 can be substituted and combined with any component shown in Fig. 1.

[0098] As shown in FIG. 20, a display device 2000 according to another embodiment of the present invention includes a display panel (PNL), at least one connecting film (CF), and at least one printed circuit board (PCB).

[0099] 21, a first film alignment pad (FAP1), a film pad (FP), and a second film alignment pad (FAP2) are disposed on the bottom of the connection film (CF), and a first substrate alignment pad (BAP1'), a substrate pad (BP), and a second substrate alignment pad (BAP2') are disposed on the top of the printed circuit board (PCB).

[0100] However, the display device 2000 is similar to the display device 1000 described in FIG. 1, except for the first substrate alignment pad (BAP1') and the second substrate alignment pad (BAP2').

[0101] 22, the first substrate alignment pad (BAP1'), the substrate pad (BP), and the second substrate alignment pad (BAP2') are arranged side by side in the second direction (D2). The substrate pad (BP) is disposed between the first substrate alignment pad (BAP1') and the second substrate alignment pad (BAP2').

[0102] The first substrate alignment pad (BAP1') includes a first base land (BA1'), a first alignment land (AA11'), and a second alignment land (AA12'). The first base land (BA1') extends in the first direction (D1). The first alignment land (AA11') and the second alignment land (AA12') protrude from the first base land (BA1') in the second direction (D2). The first alignment land (AA11') and the second alignment land (AA12') are spaced apart from each other in the first direction (D1).

[0103] The substrate pads (BP) are arranged side by side in the second direction (D2). Each of the substrate pads (BP) extends in the first direction (D1). For example, the shape of each of the substrate pads (BP) is substantially the same as the shape of the first base land (BA1').

[0104] The second substrate alignment pad (BAP2') includes a second base land (BA2'), a third alignment land (AA21'), and a fourth alignment land (AA22'). The second base land (BA2') extends in the first direction (D1). The third alignment land (AA21') and the fourth alignment land (AA22') protrude from the second base land (BA2') in a direction opposite to the second direction (D2). The third alignment land (AA21') and the fourth alignment land (AA22') are spaced apart from each other in the first direction (D1).

[0105] 23, the second film alignment pad (FAP2), the film pad (FP), and the first film alignment pad (FAP1) are arranged side by side in the second direction (D2). The film pad (FP) is disposed between the first film alignment pad (FAP1) and the second film alignment pad (FAP2).

[0106] The first film alignment pad (FAP1) includes a first base lead (BE1) and a first alignment lead (AE1). The first base lead (BE1) extends in the first direction (D1). The first alignment lead (AE1) protrudes from the first base lead (BE1) in the second direction (D2).

[0107] The film pads (FP) are arranged side by side in the second direction (D2). Each of the film pads (FP) extends in the first direction (D1). For example, the shape of each of the film pads (FP) is substantially the same as the shape of the first base lead (BE1).

[0108] The second film alignment pad (FAP2) includes a second base lead (BE2) and a second alignment lead (AE2). The second base lead (BE2) extends in the first direction (D1). The second alignment lead (AE2) protrudes from the second base lead (BE2) in a direction opposite to the second direction (D2).

[0109] 21, in one embodiment, the first alignment lead (AE1) and the first alignment land (AA11') do not overlap each other, and the first alignment lead (AE1) and the second alignment land (AA12') do not overlap each other.

[0110] The length of the first alignment lead (AE1) in the second direction (D2) is substantially the same as the length of the first alignment land (AA11') in the second direction (D2) and the length of the second alignment land (AA12') in the second direction (D2).

[0111] Measurement values ​​between a first distance (Y1) between a first end of the first alignment lead (AE1) and a first end of the first alignment land (AA11') and a second distance (Y2) between a second end of the first alignment lead (AE1) and a second end of the second alignment land (AA12') are calculated, and the measurements are applied to the manufacturing method (S100) described in FIG. 7, thereby aligning the film pad (FP) and the substrate pad (BP) with high precision.

[0112] Fig. 24 is a plan view for explaining a display device according to still another embodiment of the present invention, Fig. 25 is an enlarged plan view of region C in Fig. 24, Fig. 26 is a plan view for explaining the printed circuit board in Fig. 25, and Fig. 27 is a plan view for explaining the connection film in Fig. 25. It will be understood that any component shown in Fig. 24 can be substituted and combined with any component shown in Fig. 1 and / or Fig. 20.

[0113] As shown in FIG. 24, a display device 3000 according to yet another embodiment of the present invention includes a display panel (PNL), at least one connection film (CF), and at least one printed circuit board (PCB).

[0114] As shown in FIG. 25, a first film alignment pad (FAP1"), a film pad (FP), and a second film alignment pad (FAP2") are disposed on the bottom of the connecting film (CF). A first board alignment pad (BAP1"), a board pad (BP), and a second board alignment pad (BAP2") are disposed on the top of the printed circuit board (PCB).

[0115] As shown in FIG. 26, the first substrate alignment pad (BAP1"), the substrate pad (BP), and the second substrate alignment pad (BAP2") are arranged side by side in the second direction (D2). The substrate pad (BP) is disposed between the first substrate alignment pad (BAP1") and the second substrate alignment pad (BAP2").

[0116] The first substrate alignment pad (BAP1") includes a first base land (BA1") and a first alignment land (AA1"). The first base land (BA1") extends in the first direction (D1). The first alignment land (AA1") protrudes from the first base land (BA1") in the second direction (D2).

[0117] The substrate pads (BP) are arranged side by side in the second direction (D2). Each of the substrate pads (BP) extends in the first direction (D1). For example, a shape of each of the substrate pads (BP) is substantially the same as a shape of the first base land (BA1″).

[0118] The second substrate alignment pad (BAP2") includes a second base land (BA2") and a second alignment land (AA2"). The second base land (BA2") extends in the first direction (D1). The second alignment land (AA2") protrudes from the second base land (BA2") in a direction opposite to the second direction (D2).

[0119] As shown in FIG. 27, the second film alignment pad (FAP2"), the film pad (FP), and the first film alignment pad (FAP1") are arranged side by side in the second direction (D2). The film pad (FP) is disposed between the first film alignment pad (FAP1") and the second film alignment pad (FAP2").

[0120] The first film alignment pad (FAP1") includes a first base lead (BE1") and a first alignment lead (AE1"). The first base lead (BE1") extends in the first direction (D1). The first alignment lead (AE1") protrudes from the first base lead (BE1") in the second direction (D2).

[0121] The film pads (FP) are arranged side by side in the second direction (D2). Each of the film pads (FP) extends in the first direction (D1). For example, a shape of each of the film pads (FP) is substantially the same as a shape of the first base lead (BE1″).

[0122] The second film alignment pad (FAP2") includes a second base lead (BE2") and a second alignment lead (AE2"). The second base lead (BE2") extends in the first direction (D1). The second alignment lead (AE2") protrudes from the second base lead (BE2") in a direction opposite to the second direction (D2).

[0123] Referring again to FIG. 25, in one embodiment, the first alignment lead (AE1") overlaps the first alignment land (AA1"), and the first alignment land (AA1") overlaps the first alignment lead (AE1").

[0124] The length of the first alignment lead (AE1") in the first direction (D1) is greater than the length of the first alignment land (AA1") in the first direction (D1). Also, the length of the first alignment lead (AE1") in the second direction (D2) is less than the length of the first alignment land (AA1") in the second direction (D2).

[0125] A measurement value between a first distance (Y1) between a first end of the first alignment lead (AE1") and a first end of the first alignment land (AA1") and a second distance (Y2) between a second end of the first alignment lead (AE1") and a second end of the first alignment land (AA1") is calculated, and the measurement value is applied to the manufacturing method (S100) described in FIG. 7, thereby aligning the film pad (FP) and the substrate pad (BP) with high precision.

[0126] Although the present invention has been described with reference to exemplary embodiments thereof, those having ordinary skill in the art will appreciate that various modifications and variations of the present invention may be made without departing from the spirit and scope of the present invention as set forth in the following claims. [Industrial Applicability]

[0127] The present invention is applicable to display devices, such as high-resolution smartphones, mobile phones, smart pads, smart watches, tablet PCs, vehicle navigation systems, televisions, computer monitors, and notebook computers. [Explanation of symbols]

[0128] 1000, 2000, 3000: Display device PNL: Display panel CF: Connecting film PCB: Printed Circuit Board FAP1: First film alignment pad FP: Film pad BAP1: First board alignment pad BP: PCB pad BE1: 1st bass lead AE1: First matching lead BA1: First baseland AA1: First Aligned Land

Claims

1. a film alignment pad disposed under a connection film connected to a display panel, the film alignment pad including a base lead extending in a first direction and an alignment lead protruding from the base lead in a second direction intersecting the first direction; a substrate alignment pad disposed on an upper portion of a printed circuit board connected to the connection film and having a base land extending in the first direction and an alignment land protruding from the base land in the second direction.

2. the alignment leads completely overlap the alignment lands; The display device according to claim 1 , wherein the alignment lands partially overlap the alignment leads.

3. 3. The display device according to claim 2, wherein the length of the alignment lead in the first direction is smaller than the length of the alignment land in the first direction.

4. 3. The display device according to claim 2, wherein the length of the alignment lead in the second direction is the same as the length of the alignment land in the second direction.

5. 2. The display device according to claim 1, wherein the alignment leads and the alignment lands do not overlap each other.

6. 6. The display device according to claim 5, wherein the length of the alignment lead in the second direction is the same as the length of the alignment land in the second direction.

7. 2. The display device according to claim 1, wherein the alignment leads partially overlap the alignment lands, and the alignment lands partially overlap the alignment leads.

8. 8. The display device according to claim 7, wherein the length of the alignment lead in the first direction is greater than the length of the alignment land in the first direction.

9. 8. The display device according to claim 7, wherein the length of the alignment lead in the second direction is smaller than the length of the alignment land in the second direction.

10. The connecting film further includes a film pad disposed on the lower portion of the connecting film and arranged in the second direction, The display device according to claim 1 , wherein the film alignment pad is aligned with the film pad in the second direction.

11. further comprising board pads disposed on the top of the printed circuit board and arranged in the second direction; The display device according to claim 1 , wherein the substrate alignment pads are aligned in the second direction together with the substrate pads.

12. Aligning matching leads disposed on the bottom of the connection film with matching lands disposed on the top of the printed circuit board; measuring a first distance in a first direction between a first end of the alignment lead and a first end of the alignment land; measuring a second distance in the first direction between a second end of the alignment lead and a second end of the alignment land; and realigning the connecting film and the printed circuit board in the first direction so that a measurement between the first distance and the second distance is identical to a predetermined target value.

13. The method for manufacturing a display device according to claim 12 , wherein the target value is set according to a curvature of the connection film.

14. The method of claim 12, wherein the connection film is provided from a reel.

15. 15. The method of claim 14, wherein a curvature of the connection film located on the outer diameter of the reel is different from a curvature of the connection film located on the inner diameter of the reel.

16. In the step of realigning the connecting film and the printed circuit board in the first direction, the printed circuit board is fixed in the first direction; The method for manufacturing a display device according to claim 12 , wherein the connection film is moved in the first direction.

17. 13. The method of claim 12, wherein the measurement value is a difference between the first distance and the second distance.

18. The method for manufacturing a display device according to claim 12 , wherein the alignment lead is disposed on the lower portion of the connection film and protrudes from a base lead extending in the first direction in a second direction intersecting the first direction.

19. 20. The method of claim 18, wherein the alignment land is disposed on the upper portion of the printed circuit board and protrudes in the second direction from a base land extending in the first direction.

20. 13. The method of claim 12, further comprising the step of compression bonding the connection film and the printed circuit board after the step of realigning the connection film and the printed circuit board in the first direction.

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