Measurement instruments based on combined 2D and 3D optical image capture methods

Abstract

A measurement instrument (100, 101, 102) also suitable for a manufacturing or inspection system, comprising a light source (500) for emitting an illumination light beam (520) and a reference light beam (510), and an imaging lens (800) for directing the measurement light (530) and the reference light (510) onto a 2D image sensor (200) and a 3D image sensor (300), wherein the measurement instrument (100) is configured to significantly reduce the intensity of the reference light (510) incident on the 2D image sensor (200) when operating in a 2D imaging mode.

Description

[Technical field]

[0001] Technical Field The present disclosure relates to a metrology instrument based on a hybrid 2D and 3D optical image capture method. The invention further relates to a manufacturing system and an inspection system respectively comprising such a metrology instrument. [Background technology]

[0002] State of the art Due to their non-contact and non-destructive measurement characteristics, various optical techniques for 3D image capture methods are used in industry.

[0003] In-line capable measurement methods are preferred for inspection purposes, since they allow a large percentage of objects to be inspected and allow rapid countermeasures to be taken if the system indicates that an error has occurred, e.g. in the form of a defect or a deviation from a nominal dimension. Such countermeasures include, for example, controlling set variables such as the pressure in the (epoxy) adhesive dosing process.

[0004] Some manufacturing systems, such as semiconductor pick-and-place systems, require machine-based vision processing for high throughput along with the associated high precision of component placement.

[0005] These techniques include point / profile measurements such as laser line triangulation, confocal scanning, and imaging methods such as light field cameras, fringe projection, structured light projection or focus variation, as well as time-of-flight cameras (TOF), white light interferometry, and parallel optical coherence tomography (pOCT).

[0006] Point / profile measurements typically use side-to-side scanning to generate a height map of the region of interest, but such scanning methods may be too slow for in-line measurements and may suffer from accuracy issues such as shadowing behind edges. Typically, the region of interest is the optical field of the imaging optics.

[0007] In this context, as well as in the context of the present disclosure generally, "in-line" means both "within the manufacturing process" and / or "integrated into the manufacturing system."

[0008] Imaging methods can be used to directly measure individual areas within the optical field or within several optical fields or to capture those measurements. Various axial and lateral (lateral) resolutions can be used, with the axial resolution in particular affecting the accuracy of the height measurement. Light field and time-of-flight cameras typically only provide an axial resolution of about 0.1 mm. Focusing variations with high axial resolution may require relatively short working distances (a few millimeters or less) due to the coupling between the axial and longitudinal resolutions. The process of so-called fringe projection also requires a relatively large assembly volume due to the two tilted cameras in addition to the projector required for projection.

[0009] White light interferometry is capable of sub-micron axial resolution, and high-speed smart pixel sensors are commercially available that can be configured to provide a 3D point cloud height map within about 300 milliseconds. However, the lateral resolution of these image sensors is severely limited by the number of possible pixels, which is about 280 x 292 pixels or about 512 x 560 pixels.

[0010] Detailed examples of such equipment are known from US 2011 / 0317169 A1 or JP 2016-102713 A, which describe an apparatus for capturing an interference-free image of a measurement object. In addition, a method for producing an image free of interference fringes, which also does not affect the reference beam path, is well known from US 2003 / 0197871 A1 or US 9719777 B1. Summary of the Invention [Problem to be solved by the invention]

[0011] technical challenges The object of the present invention is to provide a measuring instrument for in-line measurements which allows high image resolution and hence the measurement accuracy despite high measurement speeds in order to achieve a high throughput, and which, despite this high requirement, remains compact and therefore can be produced cost-effectively. [Means for solving the problem]

[0012] Description of the invention As a solution, a measurement instrument is provided that includes a light source for emitting an illumination light beam and a reference light beam, and an imaging lens for directing the measurement light and the reference light onto at least one 2D image sensor and at least one 3D image sensor, whereby the measurement instrument is configured to significantly reduce the intensity of the reference light incident on the 2D image sensor when operating in a 2D image capture mode.

[0013] By using an optical setup in which at least the aforementioned optical components are suitable both for 2D and 3D image capture, a smaller assembly volume can be used for all embodiments of the measuring device. The advantage is that the optical design can be accommodated in a single housing, even though there are several optical paths for both 2D and 3D image capture. Furthermore, a smaller measuring device can lead to more compact considerations for the manufacturing or inspection system. Compactness has the advantage of shorter path lengths for the moving axes of each system, which in turn leads to increased productivity.

[0014] Compactness also reduces mechanically induced interferences such as tolerance related deviations or part misalignment, which results in optimally matched measurement results from the sensor due to reduced setup related offsets.

[0015] Using the same light source and, to a large extent, the same optical elements not only reduces the amount of work involved in assembly and the costs of parts and production, but also has the positive effect of using the same optical properties, such as illumination or luminous intensity, for further mutual adjustment of measurement results, which also leads to better comparability and reproducibility of the measurement results.

[0016] In addition, the use of the same light source and nearly the same optical elements allows for faster switching between 2D and 3D image capture within a preset time than conventional systems, which is highly advantageous for in-line measurements.

[0017] The advantage is that data is provided for machine-based image processing to capture high resolution images, which in addition to the measurement accuracy that can be obtained, also has fast measurement speeds in both lateral and axial directions with high throughput, and associated high precision and fast part positioning, minimizing measurement errors related to the set-up of the measurement equipment itself.

[0018] "In-line," in the context of the present overall disclosure, means both "within the manufacturing process" and / or "integrated into a manufacturing system."

[0019] According to one aspect, the technical problem is solved by a measurement instrument including a first image sensor for capturing 2D images and a second image sensor for capturing 3D images, the measurement instrument including a light source configured and arranged to focus on a common area of ​​the object and configured and arranged in use to emit an illumination light beam on the common area, the light source also configured and arranged to emit a reference light beam on the second image sensor. Additionally, the measurement instrument includes at least one optical element and an imaging lens arranged in use such that light reflected by the common area as light to be measured in the form of a measurement light beam enters the imaging lens together with the reference light beam from the light source. The imaging lens is configured and arranged to direct and focus at least a portion of the measurement light beam on the first image sensor and the second image sensor, and to direct and focus at least a portion of the reference light beam on the second image sensor. Additionally, the measurement instrument is configured and arranged to reduce the intensity of the reference light beam received at the first image sensor relative to the intensity of the measurement light beam when operating in a 2D image capture mode.

[0020] The measurement instrument uses the same illumination optics and the same imaging optics, combining 2D and 3D image capture in a single optical setup.

[0021] In this way the measuring device preserves the advantages of optical measurements such as non-contact and / or non-destructive measurements. Furthermore, in 2D image capture data for images having a relatively high lateral resolution, i.e. in the micrometer range or below, is captured and made available, and in 3D image capture data for images having a relatively high axial resolution, i.e. in the micrometer range, is captured and made available, preferably for capturing 3D contour maps.

[0022] By significantly suppressing the reference light beam reaching the first image sensor while operating in 2D image capture mode, the dynamic measurement range can be increased and both the accuracy of the 2D image capture and the accuracy of the measurement results of the combined 2D and 3D image capture can be improved.

[0023] In addition, using the same optical setup for both 2D and 3D image capture allows for smaller overall dimensions, which may lead to various integration possibilities in manufacturing systems. By reducing the number of required parts, the average manufacturing cost of such measurement equipment can also be reduced.

[0024] Additionally, the measurement instrument can be constructed and arranged to quickly switch between 2D and 3D image capture modes, which is a great advantage for in-line measurements as it saves time.

[0025] An embodiment of the measurement instrument includes an image capture sensor specifically designed for 2D or 3D image capture. Any suitable image sensor may be used therefor, provided it is capable of providing suitable data in the 2D or 3D image capture mode. In some cases, an image sensor designed for 3D image capture may also be used in the 2D image capture mode. Practice has shown that it is particularly advantageous if the first image sensor is a 2D image sensor and the second image sensor is a 3D image sensor, or if the first image sensor is also a 3D image sensor, but is formed and arranged so that it can operate in the 2D image capture mode.

[0026] An embodiment of the measurement instrument includes a second image sensor suitable for white light interferometric imaging to capture a 3D height map with relatively high axial resolution as part of the 3D image capture.

[0027] An embodiment of the measurement instrument may further include a first optical splitter configured and arranged to transmit a majority of the reference light beam from the imaging lens towards the second image sensor when operating in a 3D image capture mode, and the measurement instrument may further include a first optical splitter configured and arranged to receive the measurement light beam from the imaging lens.

[0028] In addition, such an embodiment of the measurement instrument may be configured to direct a first portion of the measurement light beam onto a first image sensor and / or to direct a second portion of the measurement light beam onto a second image sensor.

[0029] It may be advantageous to provide a greater amount of shared optical elements for each optical path.

[0030] Not using these sensors may allow a reduction in the size of the measurement equipment within the assembly volume, since there may be limited space for further actuators, especially near the image sensors.

[0031] Additionally, reducing the need for elements that can significantly alter or perturb the optical path to the image sensor can increase the speed of switching between modes if measurement interference and / or settling time is reduced.

[0032] In addition, it is preferred to capture the same common area in both the 3D and 2D images, i.e. the 3D and 2D images show the same optical field and there are only slight deviations in the field of view shown in the images. This can be due to, for example, a slight shift in the optical field during capture. Capturing the same common area in this way can allow both an increased switching speed between the 2D and 3D image capture modes and a higher measurement accuracy, especially for volumetric measurements, since there is no axial displacement between the two image captures, i.e. no mechanical processes along the movement axis of the setup.

[0033] An embodiment of the measurement instrument is further configured and arranged such that the intensity of the reference light beam can be reduced along the optical path of the reference light beam. Advantageously, the reducing intensity can be achieved between the imaging lens and the light source, between the first or second light splitter and the image sensor, or at the light source itself.

[0034] By reducing the intensity of the reference light beam near the light source, more common optical elements can be provided in each optical path. In particular, the optical paths for measurements in 2D image acquisition mode or 3D image acquisition mode are approximately the same. This can further reduce the measurement interference and / or settling time. Additionally or alternatively, a measurement device with a smaller assembly volume can be provided.

[0035] It can be advantageous to have many common optical elements, as the increased speed of simple switching allows relatively fast measurements to be made, for example 1 Hz or faster, which is particularly advantageous for in-line measurements.

[0036] Embodiments of the measurement instrument include one or more of the following elements: one or more apertures, one or more shutters, one or more mechanical irises, one or more mirrors, one or more dichroic mirrors, one or more dielectric mirrors, one or more prisms, one or more corner cubes, one or more beam splitters, one or more lens elements, one or more coatings, one or more optical filters, one or more compensation plates, and / or any combination thereof, as additional elements, shaped and positioned to significantly reduce the intensity of the reference light beam received by the first image sensor during operation in the 2D image capture mode.

[0037] An embodiment of the measurement instrument includes a first light splitter that is shaped and positioned such that the measurement light beam can be received by the imaging lens and such that a first portion of the measurement light beam can be directed onto a first image sensor and / or such that a second portion of the measurement light beam can be directed onto a second image sensor.

[0038] In these embodiments of the measuring instrument, the first light splitter is preferably formed and positioned such that, when operating in a 3D image capture mode, the reference light beam can be received by the imaging lens and at least a portion of the reference light beam can be transmitted in the direction of the second image capture sensor.

[0039] Furthermore, in a preferred embodiment of the measurement instrument, the first light splitter includes one or more of a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner cube, a beam splitter, an optical element, a coating, an optical filter, a compensation plate, and / or any combination thereof.

[0040] Additionally, embodiments of the measurement instrument include an imaging lens that includes one or more compound lenses, and the imaging lens is preferably a telecentric imaging lens that is object-side, image-side, or double-telecentric.

[0041] Preferably, embodiments of the measurement device are configured and arranged to provide one or more views of a common area of ​​the object.

[0042] An embodiment of the measurement instrument further includes a second light splitter shaped and positioned such that, when operating in the 3D image capture mode, it can receive an incident light beam from the light source, direct at least a portion of the incident light beam onto the common area as an illumination light beam, and direct at least a portion of the incident light onto the imaging lens as a reference light beam.

[0043] It may be advantageous to provide more shared optical elements in each optical path, which reduces interference, especially during mode switching.

[0044] An embodiment of the measurement instrument is constructed and arranged to be operable in a 3D image capture mode, such as white light interferometry, optical coherence tomography (OCT), parallel optical coherence tomography (pOCT), or any combination thereof.

[0045] These and other possible measurement device embodiments allow for determination of the volume of a surface-dispensed media based on measurement data captured by lateral 2D image capture and measurement data captured by lateral axial 3D image capture.

[0046] These and other possible measurement instrument embodiments make it possible to perform topological surface measurements and roughness measurements of larger or coherent surfaces by combined 2D and 3D optical image capture based on measurement data captured by lateral 2D image capture and by lateral axial 3D image capture.

[0047] According to a further aspect, there is provided a manufacturing system for sorting objects and / or placing objects on a substrate, the system including one or more measurement devices, at least one placement head, each having at least one tool for holding an object in a releasable manner, a robotic system for creating relative movement between the pick and place head and the substrate, and an image capture system for capturing one or more common areas of the objects to be captured.

[0048] According to a further aspect, there is provided an inspection system including an image capture system having one or more measurement devices for capturing one or more fields of view of an inspection object, and a processor configured and arranged to derive one or more measurements of the inspection object from the one or more fields of view, the processor further being operable to determine whether the inspection object is suffering from a disturbance in the form of a defect or deviation from a nominal value from the one or more measurements.

[0049] Certain embodiments of these aspects as placement or inspection systems, including the embodiments of the metrology equipment described above, have the advantage that the use of metrology equipment with small assembly volumes and fast switching speeds allows for in-line measurements to be used during the production of components and / or assemblies, not just in the field of semiconductor equipment, but for any type of component and / or assembly.

[0050] In some cases where an image capture system including one or more measurement devices is moved, the reduced weight due to the reduced number of parts may also be an advantage.

[0051] BRIEF DESCRIPTION OF THE DRAWINGS Further advantages and features of the present invention will become apparent from the following drawings and detailed description. [Brief description of the drawings]

[0052] [Figure 1A] 1 shows a schematic of the measurement instrument setup in 2D image capture mode. [Figure 1B] 1 shows a schematic diagram of the measurement instrument setup in 3D image capture mode. [Figure 2A] 1 shows a schematic representation of part of the measurement instrument setup in 2D image capture mode. [Figure 2B] 2 shows a schematic representation of part of the structure of the measuring instrument in a 3D image capture mode. [Figure 3A] 1 shows a plan view of the structure of the measurement instrument in 2D image capture mode. [Figure 3B] 1 shows a top view of the structure of the measuring instrument in 3D image capture mode. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0053] Detailed Description In the following detailed description, numerous non-limiting specific details are set forth in order to provide a more thorough understanding.

[0054] 1A and 1B respectively show a schematic setup of an embodiment of a measuring instrument, here as a measuring instrument 100, operating in a 2D image capture mode as shown in 1A and in a 3D image capture mode as shown in 1B. The measuring instrument 100 is constructed and arranged to focus on an object 900, such as a part, in order to capture a 2D or 3D image of a common area 950 of the object 900. The measuring instrument 100 comprises at least two light-sensitive elements, shown diagrammatically in the form of two image sensors 200, 300. An arrangement of so-called "position-sensitive elements", also called photodiodes or PSD chips, has proven to be the preferred light-sensitive elements to be used as image sensors. Thereby, the use of CCD or CMOS photodetectors has also proven to be advantageous.

[0055] Preferably, in an embodiment of the measuring instrument both image sensors are constructed differently, so that one image sensor is constructed as an array of photodiodes or as a so-called "position sensitive device" or PSD chip, and the second image sensor is constructed as a CCD photodetector or a CMOS photodetector.

[0056] In measurement instrument embodiments, both image sensors may be of the same type, each may be an array of photodiodes or a position sensitive device (PSD) chip, or each may be a charge coupled device (CCD) photodetector or a complementary metal oxide semiconductor (CMOS) photodetector.

[0057] In particular, the measuring device 100 comprises a first image sensor 200 suitable for 2D image capture, for example a black and white or color image sensor with a relatively high resolution. Such an image sensor for 2D image capture, also called 2D image sensor, allows the measuring device to capture an image based on data from a common area 950 of the depth plane of the object that was in focus during the measurement. Such an image sensor also allows lateral measurements, i.e. measurements over the field of view, in an axial position along the axis of the illumination light beam 520 or along the Z axis of a Cartesian coordinate system, the X and Y axes extending into the plane adjacent to the common area 950. The field of view of the measuring device 100 is approximately perpendicular to the axis of the illumination light beam 520, and tests have shown that small angular deviations of up to 0.75° can be tolerated.

[0058] The measuring device 100 further comprises a second image sensor 300 suitable for 3D image capture. Such an image sensor for 3D image capture, also called 3D image sensor, allows the measuring device to capture data of the surface texture and provide it in the form of a 3D point cloud. For example, an image sensor comprising a plurality of pixels is suitable for this purpose and can generate such a 3D point cloud. Height information is generated from an image sequence based on white light interferometry, optical coherence tomography (OCT), parallel optical coherence tomography (pOCT), or any combination thereof.

[0059] A suitable 3D image sensor uses a process detector together with a pinned photodiode and preferably has a lateral resolution of at least 280x292 pixels. The row and column spacing is preferably 40 micrometers (μm) or less and the quantum efficiency η is ideally 20%-60% between 330nm and 400nm, preferably 60%-80% between 400 nanometers (nm) and 720nm, and particularly preferably 60%-20% between 720nm and 900nm. Ideally, a particularly suitable 3D image sensor is capable of capturing and processing more than 1 million images per second.

[0060] The measurement device 100 further comprises a light source 500 constructed and arranged, in use, to emit an illumination light beam 520 towards the common area 950. The illumination light beam 520 is indicated by a solid arrow. Preferably, the light source 500 is a low coherence light source 500 such as an LED, for example an LED light source having a wavelength of 650 nm and a bandwidth of ±20 nm. A low coherence light source is one whose spectral width (full width at half maximum (FWHM)) is greater than 1% of the mean wavelength.

[0061] The light source 500 is further constructed and arranged to emit a reference light beam 510 towards the second image sensor 300. The intensity of the reference light beam 510 is significantly reduced when the measurement instrument 100 is operating in a 2D image capture mode, and therefore the reference light beam 510 is not shown in Figure 1A. The reference light beam 510 is used when the measurement instrument 100 is operating in a 3D image capture mode, and therefore the reference light beam 510 is shown as a dashed arrow in Figure 1B.

[0062] The measurement device 100 further includes an imaging lens 800 including at least one optical element, preferably an imaging lens, arranged such that the light reflected from the common area 950 as the measurement light beam 530 and the reference light beam 510 from the light source 500 enter the imaging lens 800 together when used as light 540. The imaging lens 800 preferably includes one or more compound lenses. Additionally, the imaging lens 800 can be an object-side telecentric lens, an image-side telecentric lens, or a double-sided telecentric lens. This allows for reduced magnification changes when the vertical axial distance to the object along the Z axis changes.

[0063] The imaging lens 800 is configured and arranged to direct and focus at least a portion of the measurement light beam 530 onto the first image sensor 200 and the second image sensor 300, and to direct and focus at least a portion of the reference light beam 510 onto the second image sensor 300.

[0064] Furthermore, the measurement instrument 100 is constructed and arranged such that when operating in the 2D image capture mode of FIG. 1A, the intensity of the reference light beam 510 received at the first image sensor 200 is significantly reduced.

[0065] During operation in a 3D imaging mode as shown in Figure 1B, an illumination light beam 520 captured by light source 500, indicated by a solid arrow, is emitted in the direction of object 900 and focused onto a common area 950 (not shown in Figure 1). At least a portion of the illumination light beam 520 is reflected from the common area 950, which is reflective or optically transmissive to the light emitted by light source 500.

[0066] After measurement light beam 530 is reflected by object 900 , the reflected measurement light beam 530 , indicated by the solid arrow, enters imaging lens 800 , which directs and focuses measurement light beam 530 onto second image sensor 300 .

[0067] A reference light beam 510 captured by a light source 500 , indicated by a dashed arrow, is emitted towards an imaging lens 800 , which directs and focuses the reference light beam 510 onto the second image sensor 300 .

[0068] The second image sensor 300 is constructed and arranged to receive the measurement light beam 530 and the reference light beam 510 from the imaging lens 800 and to combine the measurement light beam 530 and the reference light beam 510 onto the second image sensor 300 .

[0069] The setup shown in Fig. 1A operating in 2D image capture mode is the same as the setup shown in Fig. 1B operating in 3D image capture mode, except for the first image sensor 200. Instead of the second image sensor 300 in Fig. 1B, in Fig. 1A the first image sensor 200 is configured and arranged to receive the measurement light beam 530 and the reference light beam 510 from the imaging lens 800. As shown diagrammatically, the measurement device 100 is configured and arranged such that the first image sensor 200 is aligned with the exit beam of the imaging lens 800. The first image sensor 200 and the second image sensor 300 can be housed in, for example, a suitably configured linear interchangeable head, a suitably configured rotating turret or the like. Furthermore, the measurement device 100 is configured and arranged such that the intensity of the reference light beam 510 received at the first image sensor 200 is significantly reduced.

[0070] In the context of the present disclosure, "significantly reduce" in relation to this embodiment and all further embodiments means reducing the intensity of the reference light beam 510 received at the first image sensor 200 by at least 80%, or preferably at least 90% or even 95%, particularly preferably at least 98% to 99%, compared to the reference light beam 510 reaching the second image sensor 300 in 3D image capture mode, or even eliminating the reference light beam 510.

[0071] Such reduction may preferably be achieved by one or more software controls that appropriately modify one or more operating parameters of light source 500 .

[0072] However, such reduction can also be achieved by some mechanical elements such as a beam intensity reducer 700 that blocks at least a portion of the reference light beam 510 between the light source 500 and the first image sensor 200, or a shutter and / or a mechanical iris and / or a mirror and / or a dichroic mirror and / or a dielectric mirror and / or a prism and / or a corner cube and / or a beam splitter and / or a lens element and / or a coating and / or an optical filter and / or a compensation plate. A person skilled in the art can also consider one or more optical elements such as a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner cube, or a beam splitter that deflects at least a portion of the reference light beam 510 from its optical path to capture a 3D image between the light source 500 and the first image capture sensor 200. A person skilled in the art can also consider one or more optical elements that change one or more optical properties of at least a portion of the reference light beam 510 between the light source 500 and the first image sensor 200, such as a lens element, a coating, an optical filter, or a compensation plate, and / or any combination thereof. For example, the beam intensity reducer 700 may be modified to be highly optically absorbing of the light emitted by the light source 500 .

[0073] In this embodiment, the above-mentioned means for significantly reducing intensity may be included in the first image sensor 200, may be located between the first image sensor 200 and the imaging lens 800, may be included in the imaging lens 800, may be located between the imaging lens 800 and the light source 500, may be included in the light source 500, or any combination thereof.

[0074] Preferably, the above-mentioned means are primarily employed at positions along the optical path between the imaging lens 800 and the light source 500 and / or included in the light source 500, since this increases the common optical path portion used in both the 2D and 3D image capture modes. This allows a high degree of component integration and reduces the assembly volume of the measurement device 101. Also, the reduced number of components may ultimately lead to reduced manufacturing costs.

[0075] One of the insights on which the present invention is based is that many conventional measurement instruments for 2D or 3D image capture allow a significant portion of the reference light beam to be directed or incident on the 2D image sensor. The inventors have recognized that in some configurations this can increase the total intensity of light that strikes the 2D image sensor, causing measurement offsets that can effectively reduce the dynamic range during measurements in 2D image capture mode. Additionally or alternatively, in some configurations, interference from this reference light beam can disturb the image and affect the measurement results, especially the accuracy of the measurement. By significantly suppressing the reference light beam 510 that reaches the first image sensor 200 during 2D image capture, both the dynamic range and accuracy of the 2D image capture and the dynamic range and accuracy of the results of the combined 2D and 3D image capture can be improved.

[0076] Additionally, the measurement device 100 can be constructed and arranged to quickly switch between 2D and 3D image capture modes, which is highly advantageous for in-line measurements.

[0077] The measuring device 100 is also constructed and arranged to image a wide range of axial positions (also called axial or Z-scan) during the 3D image capture process. Such imaging can be achieved, for example, by axially moving the object 900 towards and / or away from the exit opening of the measuring device 100. Such imaging can also be achieved, for example, by displacing one or more optical elements intersecting at least a portion of the reference light beam 510, the illumination light beam 520, the measurement light beam 530, or any combination thereof. Such imaging can also be achieved, for example, by changing one or more optical properties of elements intersecting at least a portion of the reference light beam 510, the illumination light beam 520, the measurement light beam 530, or any combination thereof. Such imaging can also be achieved, for example, by any combination of the above, i.e., by axially moving and / or shifting and / or modifying.

[0078] During the axial or Z scan, images are continuously captured by the 3D (second) image sensor 300 .

[0079] During capture of a 2D image, one or more images may be captured by the 2D (first) image sensor 200 at a fixed axial position. Thus, the captured image of the common area 950 is determined by the nominally focused field of view and adjacent axial positions that are also focused by the depth of field (DOF) of the measurement instrument 100.

[0080] Preferably, the device is constructed and arranged to allow 3D image capture by parallel optical coherence tomography (pOCT). pOCT is based on imaging white light interferometry and typically provides axial resolution in the sub-micrometer range. As described below, the light beam from the light source 500 is preferably split into an illumination light beam 520 and a reference light beam 510. After the measurement light beam 530 is reflected by the object 900, the reflected measurement light beam 530 and reference light beam 510 reach the second image sensor 300 simultaneously. Thereby, the individual differences in the flight times of light due to the difference in the optical path length of the common area 950 caused by the surface topology are measured. This difference in flight time modulates the interference signal on the second image sensor 300 and is laterally resolved by the sensor pixels.

[0081] A height map of the common area 950 can then be derived from this difference in the time of flight of light. Each pixel provides a modulated signal with a decaying envelope, and the signal is maximized when the optical path lengths or resulting time-of-flight differences of the reference light beam 510 and the sample light beam (illumination light beam 520+measurement light beam 530) are the same. This allows the height of the corresponding common area 950 to be determined.

[0082] For example, with a smart pixel sensor based camera setup, a series of images can be captured at several axial positions with a frequency of kHz and processed using embedded electronics. A 3D height map can then be provided within about 300 ms. Compared to conventional point / profile measurements, no time-consuming left-right scanning is required. The limited lateral resolution of smart pixel sensors, typically about 280x292 pixels, can be at least partially compensated by combined measurements with a higher lateral resolution, such as a 12 megapixel 2D image sensor with 3000x4000 pixels.

[0083] Further details on pOCT-based measurement procedures can be found in 'Parallel Optical Coherence Tomography (pOCT) for Industrial 3D Inspection', Patrick Lambelet, 'Optical Measurement Systems for Industrial Inspection VII', Proc. of SPIE Vol. 10.1117 / 12.889390.

[0084] An example of a measurement instrument configured and arranged for parallel optical coherence tomography imaging with dynamic focusing can be found in U.S. Patent Application Publication No. 2008 / 0024767 A1, particularly Figures 3, 4, and 5, along with corresponding portions of the description, which describe relevant examples of additional embodiments using pOCT.

[0085] 2A and 2B show, in each case, a part of a further embodiment of a measuring device operating in a 2D image capture mode or a 3D image capture mode, diagrammatically as measuring device 101. They show a part of the measuring device 101 including a first image sensor 200, a second image sensor 300 and a near portion of an imaging lens 800. They are the same as the embodiment shown in Figs. 1A and 1B, respectively, except that the first image sensor 200 and the second image sensor 300 are arranged in a substantially fixed position relative to the exit beam of the imaging lens 800. In other words, there is no significant correction to the arrangement of the first image sensor 200 and the second image sensor 300 when the measuring device 101 switches between the 2D image capture mode and the 3D image capture mode.

[0086] The measurement instrument 101 further includes a first light splitter 600 configured and arranged to receive the measurement light beam 530 from the imaging lens 800, to direct a first portion 530a of the measurement light beam 530 onto the first image sensor 200, and to direct a second portion 530b of the measurement light beam 530 onto the second image sensor 300.

[0087] In addition, the first beam splitter 600 is constructed and arranged to receive the reference light beam 510 from the imaging lens 800 and to transmit at least a significant portion 510 b of the reference light beam 510 to the second image sensor 300 .

[0088] The first light splitter 600 may be composed of one or more of the following elements: mirrors, dichroic mirrors, dielectric mirrors, prisms, corner cubes, beam splitters, optical elements, coatings, optical filters, compensation plates, and / or any combination thereof. To optimize the measurement light beam 530 reaching both the 2D and 3D image sensors, the beam is preferably split into a first portion 510a and a second portion 510b, and a first portion 530a and a second portion 530b, respectively, with an intensity ratio of about 50:50.

[0089] However, in some configurations it may be advantageous to use a light splitter providing an intensity ratio of the first portion 510a or 530a to the second portion 510b or 530b of 40:60, 30:70, 20:80 or 10:90. A significant portion in this context should be understood as more than 50% of the second portion 510b in standard applications with e.g. parts as measurement objects that are oxidized and therefore have little reflection, and e.g. about 10% of the second portion 510b in special system designs for reflective parts as measurement objects of the reference light beam 510 impinging on the first light splitter 600, especially in 3D image capture mode.

[0090] If no additional illumination is used other than the low-coherence light source 500, the first light splitter 600 preferably comprises a beam splitter. If an additional illumination source is used that emits light in a different spectral range than the low-coherence light source 500, e.g., a ring light source, the first light splitter 600 preferably comprises a dichroic mirror.

[0091] During operation in a 3D image capture mode as described above with respect to Figure 2B, the illumination light beam is captured and reflected to the imaging lens 800 in the same manner as described above with respect to Figure 1B. A returning measurement light beam 530, shown by solid arrows, converges on the first image sensor 200 and the second image sensor 300.

[0092] Additionally, a reference light beam 510 is captured and emitted towards the imaging lens 800 in the same manner as described above with respect to FIG. 1B.

[0093] The emitted reference light beam 510, indicated by the dashed arrows, converges on the first image sensor 200 and the second image sensor 300. The first light splitter 600 splits the measurement light beam 530 into a first portion 530a and a second portion 530b. The first light splitter 600 also splits the reference light beam 510 into a first portion 510a and a second portion 510b. As described above with respect to FIG. 1B, the second image sensor 300 is configured and arranged to receive the second portion 530b of the measurement light beam 530 and the second portion 510b of the reference light beam 510 from the imaging lens 800 and combine the second portion 530b of the measurement light beam 530 and the second portion 510b of the reference light beam 510 on the second image sensor 300. The first image sensor 200 is configured and arranged to receive the first portion 530a of the measurement light beam 530. The first beam splitter 600 also allows the first portion 510a of the reference light beam 510 from the imaging lens 800 to pass towards the first image sensor 200. This results from using the first beam splitter 600 to split the incoming light into two portions.

[0094] The operation in the 2D image capture mode shown in Fig. 2A is the same as the operation in the 3D image capture mode shown in Fig. 2B, except that the measurement device 101 is constructed and arranged to reduce the intensity of the first portion 510a of the reference light beam 510 received at the first image sensor 200, such that a significant reduction of at least 80% is selectively achievable for the first portion 510a of the reference light beam 510 reaching the first image sensor 200 in the 3D image detection mode. A reduction of at least 90%, or more preferably 95%, is particularly suitable. This can be implemented as described above with respect to Fig. 1A.

[0095] In this embodiment of the measuring instrument, the operating principle used to significantly reduce the intensity of the reference light beam 510 as described above with respect to Fig. 1 may be employed. The embodiment of the measuring instrument 101 shown in Figs. 2A and 2B allows for one or more beam intensity reducer elements for reducing the beam intensity to be placed at one or more positions, for example between the first image sensor 200 and the first light splitter 600, at the first light splitter 600 itself, between the first light splitter 600 and the imaging lens 800, and between the imaging lens 800 and a second light splitter 650 (not shown), or at any position along the optical path of the reference light beam 510 before it enters the imaging lens 800, respectively, and in case of more than one element for reducing the beam intensity, the placement of the elements is possible at all of these positions or only at some of these positions listed above.

[0096] As discussed above with respect to Fig. 1, the implementation of the significant reduction is preferably primarily inserted between the imaging lens 800 and the light source 500 and / or embedded in the light source 500. In particular, in the embodiment of Fig. 2, when the measurement instrument 101 is switched between the 2D image capture mode and the 3D image capture mode, the light path from the common area 950 to both the first image sensor 200 and the second image sensor 300 is not significantly altered or disturbed. This allows substantially the same field of view to be mapped in the 2D image capture mode and the 3D image capture mode, allowing a relatively fast switching speed between the two modes, e.g. 1 Hz or faster, which is particularly advantageous for in-line measurements.

[0097] 3A and 3B show a top view of an embodiment of the measurement instrument as a measurement instrument 102 operating in a 2D image capture mode or a 3D image capture mode, respectively. This embodiment 102 is similar to the embodiment of the measurement instrument shown in FIGS. 2A and 2B, except that the light emitted from the light source 500 first passes through an optional collimator 850 including at least one optical element. The collimator 850 is configured and arranged to provide a substantially parallel light beam 505 from the light source 500. In some configurations, the collimator can be omitted if the light emitted by the light source 500 is sufficiently parallel. The substantially parallel light beam 505 then passes through a focusing lens 860 including at least one optical element. The focusing lens 860 is configured and arranged to focus the substantially parallel light beam 505 onto a common area 950 of the object 900. As shown, an optional first beam deflector 400 is used to deflect the focused parallel light beam 505 onto a second light splitter 650. Generally, one or more beam deflectors, such as one or more mirrors, may be used to provide the proper optical path and / or alignment of the components. A second light splitter 650 configured and arranged to receive the focused parallel light beam 505 and split it into a reference light beam 510, indicated by a dashed arrow, and an illumination light beam 520, indicated by a solid arrow. In other words, the second light splitter 650 directs at least a portion of the incident light 505 to illuminate the common area 950 and directs at least another portion of the incident light 505 into the optical path of the reference light beam 510, which then enters the imaging lens 800.

[0098] The second light splitter 650 may include one or more of the following: mirrors, dichroic mirrors, dielectric mirrors, prisms, corner cubes, beam splitters, optical elements, coatings, optical filters, compensation plates, and any combination thereof. To optimize the interferometric light beam reaching the 3D image sensor 300, the beam 505 is preferably split into a reference light beam 510 and an illumination light beam 520 with an intensity ratio of about 50:50. However, in some configurations, it may be advantageous to use a light splitter providing an intensity ratio of 40:60, 30:70, 20:80, or 10:90.

[0099] Further, the second light splitter 650 is constructed and arranged to direct the illumination light beam 520 through an aperture into or onto a common area 950 of the object 900. Additionally or alternatively, one or more beam deflectors can be used to direct the illumination light beam 520.

[0100] The second beam splitter 650 is also constructed and arranged to direct the reference light beam 510 onto a reference mirror 420 for use in the instrument 102. Additionally or alternatively, one or more beam deflectors may be used to direct the reference light beam 510.

[0101] As shown, an optional second beam deflector 410 is used to deflect the reference light beam 510 onto a reference mirror 420. In general, one or more beam deflectors, such as one or more mirrors, can be used to provide a proper optical path and / or proper alignment of the components.

[0102] The reference mirror 420 is constructed and arranged to reflect the reference light beam 510 back towards the second light splitter 650. In addition, one or more beam deflectors can be used to redirect the reference light beam 510 again. As shown, an optional second beam deflector 410 is also used to redirect the reference light beam 510 back towards the second light splitter 650.

[0103] Further, the reference mirror 420 is constructed and arranged to be axially movable during the 3D image capture process such that the optical path length from the second optical splitter to the focal plane of the common area 950 is substantially equal to the optical path length from the second optical splitter 650 to the reference mirror 420.

[0104] This embodiment of the measurement instrument 102 includes a beam intensity reducer 700, such as a stop, a shutter, a mechanical iris, a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner cube, a beam splitter, a lens element, a coating, an optical filter, a compensation plate, and / or any combination thereof, configured and arranged to significantly reduce the intensity of the reference light beam 510. As shown in FIG. 3A, during 2D measurements, the beam intensity reducer 700 can be inserted in the optical path of the reference light beam 510 just before the reference mirror 420, thereby reducing or preventing reflection from the reference mirror 420 to the second light splitter 650. The beam intensity reducer 700 is preferably highly light absorbing for the light emitted by the light source 500. As shown in FIG. 3B, the beam intensity reducer 700 can be used outside the optical path of the reference light beam 510 during 3D image capture, thereby allowing reflection from the reference mirror 420 to the second light splitter 650.

[0105] The beam intensity reducer 700 may be included in, for example, a linear actuator, a rotary actuator (shown diagrammatically in FIGS. 3A and 3B), a rotary turret, or any combination thereof.

[0106] Additionally, the second beam splitter 650 is configured and arranged to direct the reference beam 510 reflected back from the reference mirror 420 into the imaging lens 800. The second beam splitter 650 is configured and arranged to direct the measurement beam 530 reflected back from the common area 950 into the imaging lens 800. Optionally, the second beam splitter 650 may also be configured and arranged to combine the reference beam 510 reflected by the reference mirror 420 and the measurement beam 530 reflected by the common area 950.

[0107] During operation in the 3D image capture mode shown in Figure 3B, the light emitted by the light source 500 is collimated by an optional collimator 850, preferably in the form of a lens, to provide a nearly parallel beam 505. The nearly parallel beam 505 is focused onto a common area 950 using a focusing lens 860. After passing through the focusing lens 860, the nearly parallel beam 505 is deflected onto the second light splitter 650 using the first beam deflector 400.

[0108] In this exemplary embodiment of the measurement instrument 102, the second light splitter 650 splits the substantially parallel beam 505 into an illumination light beam 520 that is also directed onto a common area 950 of the object, and a reference light beam 510 that is also directed onto a reference mirror 420 using the second beam deflector 410. The focused illumination light beam 520 is reflected from the common area 950 to the second light splitter 650 as a measurement light beam 530. In addition, an illumination source 570 for the object, such as one or more ring lights, may be provided. The reference light beam 510, shown by the dashed arrow, is deflected by the second beam deflector 410 onto the reference mirror 420 and reflected back by the second beam deflector 410 to the second light splitter 650. The beam intensity reducer 700 is shown in an open state so as not to substantially intersect the reference light beam 510 when it reaches the reference mirror 420 or when it reflects off the second light splitter 650.

[0109] When capturing a 3D image, the axial position of the reference mirror 420 is preset and / or controlled such that the optical path length from the second beam splitter to the focal plane of the common area 950 is substantially equal to the optical path length from the second beam splitter 650 to the reference mirror 420. Additionally, during axial or vertical scanning, additional axial movement of the reference mirror 420 may be required to substantially maintain the optical path length.

[0110] In this exemplary embodiment of the measurement instrument 102, the second optical splitter 650 combines the reference optical beam 510 and the return measurement optical beam 530 that are reflected back from the reference mirror 420. The combined beams are directed into the imaging lens 800. As described above with respect to FIG. 2B, the combined return measurement optical beam 530 (solid arrow) and reference optical beam 510 (dashed arrow) are focused and directed by iv800 and the first optical splitter 600 onto the first image sensor 200 and the second image sensor 300.

[0111] 3A is the same as the 3D image capture mode shown in FIG. 3B, except that the beam intensity reducer 700 is transitioned to a closed state, thereby significantly reducing the intensity of the first portion 510a of the reference light beam 510 received at the first image sensor 200. In particular, the intensity of the reference light beam 510 reaching the reference mirror 420 is significantly reduced, which in turn significantly reduces the reference light beam 510 reflected back towards the second beam splitter 650.

[0112] As a result, the light reaching the first image sensor 200 and the light reaching the second image sensor 300 comprises substantially the same measurement light beam 530 as in the 3D image capture mode and at least a significantly reduced reference light beam 510. Preferably, the intensity of the reference light beam 510 is reduced so as not to substantially affect the 2D image capture at the first image sensor 200, more preferably so as to be substantially undetectable at the first image sensor 200. By substantially not here we mean that the intensity of the reduced reference light beam 510 is below a possibly predetermined intensity value of the image sensor.

[0113] This specification should not be understood as prescribing a fixed order of passing through the steps of the methods described herein. Rather, the steps of the methods can be performed in any order that is practical. Similarly, the examples serve to explain the algorithms and are not intended to represent the only implementation forms of those algorithms. Those skilled in the art can think of many different ways to achieve the same functionality provided by these embodiments.

[0114] 2A and 2B may instead include a displaceable and / or rotatable mirror. The measurement instrument 101 may be constructed and arranged to utilize the first light splitter 600 in first and second configurations and / or rotations corresponding to orientations for directing light onto the first image sensor 200 and the second image sensor 300. For example, the first light splitter 600 may include a suitably configured linear actuator, rotary actuator, etc.

[0115] 3A and 3B, whereby the first light splitter 600 of the measurement device 102 may instead comprise a displaceable and / or rotatable mirror. The measurement device 102 may be constructed and arranged to utilize the first light splitter 600 in first and second configurations and / or rotations corresponding to the orientations for directing light onto the first image sensor 200 and the second image sensor 300. For example, the first light splitter 600 may include a suitably configured linear actuator, rotary actuator, etc.

[0116] For example, the second image sensor 300 in Figures 3A and 3B is shown in top view as being to the left of the first light splitter 600. Alternatively, the first light splitter 600 is shaped and positioned such that the second image sensor 300 is mounted behind, above, or in a lateral location, in this case to the right of the top view with respect to Figures 3A and 3B.

[0117] For example, to compensate to some extent for the low reflection from the common area 950, the intensity of the reference light beam 510 can be reduced when operating in the 3D image capture mode by modifying one or more of the measures implemented to significantly reduce the intensity during the 2D image capture mode. For example, a neutral density filter can be placed at an appropriate point in the optical path of the reference light beam 510.

[0118] These embodiments of the measurement instruments 100, 101, 102 according to the above discussion allow a relatively high measurement throughput in a relatively small assembly volume.

[0119] These embodiments of the measurement instruments 100, 101, 102 according to the above discussion may be part of an image capture system preferably used in in-line manufacturing.

[0120] Typically, such an image capture system is used in a manufacturing system for picking and placing an object 900 in the form of a part onto a substrate. Such a manufacturing system includes a pick-and-place head having at least one tool, such as a nozzle, that can preferably be exposed to a vacuum in order to grasp and / or hold the object 900 in a releasable manner.

[0121] Further, such a manufacturing system is configured with a robotic system for capturing the relative movement of a pick-and-place head between an object pick-up position for picking up an object 900 at the pick-up position with a pick-up device and a substrate on which the object to be picked up by the pick-up device can be placed.

[0122] Preferably, in such a manufacturing system, the image capture system is configured to capture at least one image of the position on the substrate where the object 900 is placed, and an image of the surface of the object 900 or any other common area 950 within one or more fields of view, and the image capture system includes one or more measurement devices 100, 101, 102 in accordance with the above discussion.

[0123] Thus, these embodiments of the measuring instruments 100, 101, 102 according to the present disclosure can also be part of an image capture system, preferably used in in-line inspection. Typically, such an image capture system is used in an inspection system to capture one or more fields of view of the inspection object 900 or one or more fields of view of the inspection substrate. Typically, in such an inspection system, the image capture system includes one or more measuring instruments 100, 101, 102 and a processor configured and arranged to determine and / or derive from the captured data one or more measurements of the inspection object 900 or the inspection substrate from one or more fields of view. Furthermore, the processor is configured to be able to determine from the one or more measurements whether there are defects in the inspection object 900 or substrate in the form of defects or deviations from a nominal value, thus also enabling a surface analysis of the substrate or object itself. Such defects can be, for example, surface damage in the form of chips, scratches, or imperfections, or damaged or misaligned parts.

[0124] Although the present invention has been described in the context of certain exemplary embodiments, it should be understood that various corrections, substitutions, and alterations apparent to those skilled in the art could be made to the disclosed embodiments without departing from the spirit and scope of the invention as set forth in the appended claims. [Explanation of symbols]

[0125] Reference Number List 100 Measuring device embodiment 101 Measuring device embodiment 102 Measuring Instrument Embodiments 200 The first image sensor for 2D measurement 300 Second image sensor for 3D measurements 400 First Beam Deflector 410 Second Beam Deflector 420 Reference Mirror 500 light sources 505 A nearly parallel light beam emitted by a light source 510 Reference light beam 510a First portion of beam 510b Second portion of the beam 520 Illumination Light Beam 530 Measurement light beam 530a First portion of beam 530b second portion of the beam 570 Lighting source 600 First optical splitter 650 Second Optical Splitter 700 Beam Intensity Reducer 800 Imaging Lens 850 Collimator 860 Focusing Lens 900 Objects in the form of parts 950 Common Area of ​​Objects

Claims

1. A measurement instrument (100, 101, 102) including a first image sensor (200) for 2D imaging and a second image sensor (300) for 3D imaging, the measurement instrument (100, 101, 102) constructed and arranged to focus on a common area (950) of an object (900); a light source (500) configured and arranged, in use, to emit an illumination light beam (520) onto said common area (950) and further configured and arranged to emit a reference light beam (510) onto said second image sensor (300); an imaging lens (800) comprising at least one optical element arranged such that, in use, the reference light beam (510) of the light source (500) enters the imaging lens (800) and light reflected from the common area (950) as a measurement light beam (530) enters the imaging lens (800), - directing and focusing at least a first portion (530a) of said measurement light beam (530) onto said first image sensor (200); and / or - directing and focusing at least a second portion (530b) of the measurement light beam (530) and a second portion (510b) of the reference light beam (510) onto the second image sensor (300); An imaging lens (800) further formed and arranged so as to Further comprising: configured and arranged to reduce or eliminate an intensity of a first portion (510a) of the reference light beam (510) receivable at the first image sensor (200) (510) when operating in a 2D imaging mode; Measuring equipment (100, 101, 102).

2. The measuring instrument (100, 101, 102) of claim 1, wherein the first image sensor (200) is a 2D image sensor and the second image sensor (300) is a 3D image sensor.

3. 2. The measurement instrument (100, 101, 102) of claim 1, wherein the first image sensor (200) is a 3D image sensor, the second image sensor (300) is a 3D image sensor, and the image sensor (200) is configured and arranged such that it is operable in a 2D imaging mode.

4. A measuring device (100, 101, 102) as described in any one of claims 1 to 3, further formed and arranged to transmit at least the second portion (510b) of the reference light beam (510) from the object iv (800) in a direction to the second image sensor (300) when the measuring device (100, 101, 102) operates in a 3D imaging mode.

5. A measuring instrument (100, 101, 102) according to any one of claims 1 to 4, which is formed and arranged such that the intensity of the reference light beam (510) is reducible along the optical path of the reference light beam (510), preferably between the imaging lens (800) and the light source (500).

6. The measuring instrument (100, 101, 102) according to any one of the preceding claims, which is formed and arranged such that the intensity of the reference light beam (510) at the light source (500) is reducible.

7. A measurement instrument (100, 101, 102) according to any one of claims 1 to 6, comprising a beam intensity reducer (700) taking the form of one or more of the following elements, each formed and arranged so as to reduce the intensity of the first portion (510a) of the reference light beam (510) receivable by the first image sensor (200) when operating in a 2D imaging mode: a diaphragm, a shutter, a mechanical iris, a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner cube, a beam splitter, a lens element, a coating, an optical filter, a compensation plate, or any combination thereof.

8. A measuring instrument (100, 101, 102) according to any one of claims 1 to 7, further comprising a first light splitter (600) formed and arranged so that the measurement light beam (530) can be received by an imaging lens (800) and so that the first portion (530a) of the measurement light beam (530) can be directed onto the first image sensor (200) and / or so that the second portion (530b) of the measurement light beam (530) can be directed onto the second image sensor (300).

9. The measurement instrument (100, 101, 102) of claim 7, further configured and positioned such that when operating in a 3D imaging mode, the reference light beam (510) can be received by the imaging lens (800) and at least the second portion (510b) of the reference light beam (510) can be transmitted in the direction of the second image sensor (300).

10. 9. The measurement instrument (100, 101, 102) of claim 7 or 8, wherein the first light splitter (600) comprises one or more of a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner cube, a beam splitter, an optical element, a coating, an optical filter, a compensation plate, and / or any combination thereof.

11. The measurement device (100, 101, 102) according to any one of the preceding claims, wherein the imaging lens (800) comprises one or more compound lenses.

12. The measuring instrument (100, 101, 102) according to any one of the preceding claims, wherein the imaging lens (800) is a telecentric imaging lens.

13. A measurement device (100, 101, 102) according to any one of the preceding claims, configured and arranged to provide one or more views of the common area (950) of the object (900).

14. The measurement instrument (100, 101, 102) of any one of claims 1 to 13, further comprising a second light splitter (650) formed and arranged such that, when operating in a 3D imaging mode, an incident light beam (505) from the light source (500) and at least a portion of the incident light beam (505) can be directed onto the common area (950) as an illumination light beam (520) and at least a portion of the incident light (505) can be directed onto the imaging lens (800) as a reference light beam (510).

15. 15. The measurement instrument (100, 101, 102) according to any one of claims 1 to 14, constructed and arranged to be operable in a 3D imaging mode, such as white light interferometry, optical coherence tomography (OCT), parallel optical coherence tomography (pOCT), or any combination thereof.

16. 1. A manufacturing system for sorting objects (900) and / or picking and placing objects (900) onto a substrate, comprising: at least one pick and place head, each having at least one tool for holding said object (900) in a releasable manner; - a robotic system for capturing the relative movements of said pick-and-place head between a receiving position of an object (900) and said substrate; an image capture system for capturing one or more common areas (950) of the object (900) to be captured, the image capture system comprising one or more measuring devices (100, 101, 102) according to any one of claims 1 to 13; A manufacturing system comprising:

17. - an image capture system for capturing one or more fields of view of the inspection object (900); a processor configured and arranged to derive one or more measurements of the inspection object (900) from said one or more fields of view, which can be used to determine from said one or more measurements whether the inspection object (900) is suffering from a disturbance in the form of a defect or a deviation from a nominal dimension; An inspection system comprising: An inspection system, wherein the image capture system comprises one or more measuring devices (100, 101, 102) according to any one of claims 1 to 14.

Images