Apparatus and method for drying and / or cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or EUV lithography masks - Patents.com

Abstract

The invention relates to an apparatus 10 for drying and / or cleaning a pot-shaped hollow body 12, in particular a transport container for semiconductor wafers or for EUV lithography masks, the hollow body 12 having a hollow body wall 14 forming a hollow body inner surface 16 which defines a hollow body interior space 17, and a hollow body opening 18 surrounded by the hollow body wall 14, through which the hollow body interior space 17 is accessible, a first holding means 30 by means of which the apparatus 10 can interact to hold the hollow body wall 14, an exhaust device 60 for applying a vacuum in the hollow body interior space 17 and / or a conveying device 66 for conveying a cleaning fluid through the hollow body interior space 17, and a displacement member 48 which can be or has been introduced into the hollow body interior space 17 through the hollow body opening 18. The invention further relates to a corresponding method for drying and / or cleaning the pot-like hollow body 12.

Description

[Technical Field]

[0001] The present invention relates to an apparatus and a method for drying and / or cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or EUV lithography masks. [Background technology]

[0002] The production of highly integrated semiconductor circuits and other delicate semiconductor components is nowadays carried out in factories where so-called semiconductor wafers pass through numerous processing steps. Most of these processing steps take place in clean rooms, which are kept extremely clean and free of contaminants, especially particles. This complex process is necessary because particles that come into contact with the semiconductor material of the semiconductor wafers can affect, among other things, the material properties of the semiconductor wafers, potentially rendering the entire production batch unusable and requiring it to be scrapped.

[0003] As the integration density of semiconductor circuits increases, maintaining cleanliness becomes more important. The larger the clean room, the greater the effort required to maintain cleanliness. Therefore, semiconductor wafers are not transported in an "open" state from one processing station to the next. Instead, special transport containers (called FOUPs (front opening unified pods)) are used. These are box-shaped transport containers into which multiple semiconductor wafers are inserted. FOUPs are generally closed with a removable cover. Without the cover, a FOUP has a basic pot-like shape with a rectangular base. When the FOUP is closed with the cover, the inserted semiconductor wafers can be transported from one clean room to another while being protected from the environment. When the FOUP reaches the processing station, it is opened, and the semiconductor wafers are removed and processed there. After processing, the semiconductor wafers are returned to the FOUP and then transported to the next processing station.

[0004] Because contamination of semiconductor wafers can result in significant production downtime, it is necessary to occasionally clean the FOUP with a cleaning fluid. The FOUP is particularly susceptible to contamination from wear debris from semiconductor wafers during loading and unloading into the FOUP.

[0005] The same applies to shipping containers for EUV (extreme ultraviolet radiation) lithography masks, which are used to manufacture very small integrated circuits. Like semiconductors, EUV lithography masks also need to be shipped, and a similar situation arises. From this point on, when FOUPs are mentioned, the description applies equally to shipping containers for EUV lithography masks.

[0006] Apparatus for cleaning FOUPs are known, for example, from U.S. Pat. No. 5,238,703 (U.S.A.), U.S. Patent Application Publication No. 2002 / 0046760 (U.S.A.), U.S. Patent Application Publication No. 2003 / 0102015 (U.S.A.), WO 2005 / 001888 (WO,A2), and EP 1 899 084 (EP,B1).

[0007] With such a cleaning device, the FOUP is cleaned on both the inside and outside. FOUPs are generally more contaminated on the outside than on the inside. As a result, the cleaning fluid accumulates particles both originating from the outside and the inside during the cleaning process. Therefore, particles can be transported from the outside to the inside. However, satisfactory cleaning results are only achieved when the particle count drops below a certain value. To ensure sufficient particles are removed, the cleaning process must be carried out for a correspondingly long period of time.

[0008] Once the cleaning process is complete, a vacuum can be applied to the exterior and / or interior surfaces. The application of a sufficiently high vacuum helps to remove any residue of cleaning fluid remaining on the surfaces of the hollow bodies and covers as a result of cleaning the hollow bodies in the cleaning device. Also, moisture diffuses into the microscopic pores on the surfaces of the hollow bodies and covers by capillary action. This moisture can likewise be removed by the vacuum, and drying can also be achieved at a microscopic level. However, the application of a sufficiently high vacuum is a relatively energy-intensive and cumbersome process, making the cleaning process more expensive and prolonged. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] U.S. Patent No. 5,238,703 (US,A) [Patent Document 2] US Patent Application Publication No. 2002 / 0046760 (US, A1) [Patent Document 3] US Patent Application Publication No. 2003 / 0102015 (US, A1) [Patent Document 4] International Publication No. 2005 / 001888 (WO, A2) [Patent Document 5] European Patent No. 1899084 (EP,B1) Summary of the Invention [Problem to be solved by the invention]

[0010] It is an object of embodiments of the present invention to provide an apparatus for drying and / or cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or EUV lithography masks, which can address the above-mentioned drawbacks in a simple and inexpensive manner and in particular can enable cheaper and less time-consuming drying compared to processes known from the prior art.Furthermore, it is an object of embodiments of the present invention below to provide a method for operating such an apparatus.

[0011] This object is achieved by the features set forth in claims 1 and 10. Advantageous embodiments are the subject of the dependent claims. [Means for solving the problem]

[0012] An embodiment of the invention is an apparatus for drying and / or cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or EUV lithography masks, comprising: - the hollow body includes a hollow body wall forming an inner hollow body surface, the inner hollow body surface defining an inner hollow body space; - the hollow body has a hollow body opening surrounded by a hollow body wall, through which the hollow body interior space is accessible, The device, - first holding means with which the device can interact to hold the hollow body wall; an evacuation device for applying a vacuum to the interior space of the hollow body, and / or a conveying device for conveying a cleaning fluid through the interior space of the hollow body; a displacement element that can be introduced or has been introduced into the hollow body interior space through the hollow body opening; The present invention relates to an apparatus comprising:

[0013] The first retaining means serves to position the hollow body within the device during application of vacuum and / or delivery of cleaning fluid through the hollow body interior space. In the simplest case, the first retaining means may be a support surface.

[0014] A displacement element may be understood as an element that fills a volume so that a particular fluid cannot or is substantially unable to pass through it. The displacement element here does not necessarily have to be solid, but may allow a different fluid to pass through it, which is to be conducted separately from the particular fluid.

[0015] The displacement element is arranged to protrude into the interior space of the hollow body. The volume in which the vacuum is generated is reduced with the aid of the displacement element. As a result, the time to achieve the desired vacuum is reduced, accelerating the entire drying process, especially of the interior of the hollow body. At the same time, the energy required to apply the desired pressure is reduced.

[0016] The transfer of cleaning fluid can be carried out using the same device, alternatively or additionally to the application of vacuum. Nitrogen, for example, can be used as the cleaning fluid. However, so-called AMC (airborne molecular contamination) is removed from the hollow body interior by evaporation with the aid of the cleaning fluid. Such AMC include, among others, fluorine, metals, and radicals. The use of a displacement element reduces the volume of cleaning fluid required. Furthermore, the flow of cleaning fluid through the hollow body interior space is guided by the displacement element, which ensures that the cleaning fluid can reach even difficult-to-access surfaces where dead spots may form. Thus, the evaporation process described above can be carried out efficiently and thoroughly.

[0017] At this point, it should be pointed out again that the device can be used both for drying by vacuum and for cleaning using a cleaning fluid. The device only needs to be connected to a corresponding unit for this, such as an exhaust device or a reservoir for cleaning fluid. In this respect, the exhaust device may simultaneously take over the function of the transport device, or vice versa, and no separate unit is necessary. After the drying process is completed, the cleaning process can proceed without practical time loss by using correspondingly automated valve connections.

[0018] According to a further embodiment, the displacement element may have a through-hole that opens into the hollow body interior space when the displacement element is introduced into the hollow body interior space, through which a cleaning fluid can be delivered into the hollow body interior space and / or by which a vacuum can be applied into the hollow body interior space. In this embodiment, the valve body also serves to supply the cleaning fluid into the hollow body interior space. As a result, a targeted flow of the cleaning fluid in the hollow body interior space can be generated in a simple manner, and the cleaning effect can be improved.

[0019] In further expanded embodiments, the device may have a device wall and the displacement member may be releasably connectable to the device wall or may be formed in one piece with the device wall.

[0020] If the replacement element is releasably connected to the device wall, in the event of damage it can be replaced with another replacement element without much effort. Furthermore, it is possible to connect replacement elements of different shapes to the device wall. As a result, a given device can be quickly converted for hollow bodies of different shapes, increasing the flexibility of the device.

[0021] If the replacement member is formed in one piece with the device wall, mass production of the device can be simplified since parts can be saved. Furthermore, the joining step is omitted.

[0022] In a further embodiment, the device wall may have a first wall portion and a second wall portion that are releasably connectable to each other and that, in the connected state, enclose the device interior space. The first holding means includes a holding surface, and the first wall portion forms the holding surface that at least partially defines the device interior space. The holding surface serves to support the hollow body. Because the holding surface at least partially defines the device interior space, the holding surface faces into the device interior space. Thus, when the hollow body is placed on the holding surface, the hollow body is positioned within the device interior space. When the first wall portion and the second wall portion are connected to each other, the device interior space is a closed space. Because the first wall portion and the second wall portion can be released from each other, the hollow body can be introduced into and removed from the device interior space without any problems. Here, the device wall protects the hollow body from external influences, particularly during drying and cleaning. If practical, it is also possible for the holding surface to be formed by the second wall portion.

[0023] In a further embodiment, the hollow body wall may form the hollow body outer surface and the device may have at least one fluid conducting device by means of which a cleaning fluid may be conducted from the hollow body inner space to the hollow body outer space and / or by means of which a vacuum may be applied within the hollow body inner space and / or within the device inner space.

[0024] As mentioned above, semiconductor wafers are placed in the hollow body's largely closed interior space. Therefore, due to their spatial proximity, contamination of the semiconductor wafers is primarily caused by contamination originating from the hollow body's interior surface. Therefore, cleaning the interior of the hollow body is more important than cleaning the exterior of the hollow body. However, the exterior of the hollow body is generally more contaminated than the interior of the hollow body. In an open hollow body, particles can migrate into the hollow body's interior space and from there onto the semiconductor wafers, so cleaning the exterior of the hollow body also contributes to reducing the number of defective semiconductor wafers. In this embodiment, it is also possible to dry the exterior of the hollow body as a result of applying a vacuum and / or to clean the exterior of the hollow body by correspondingly passing a cleaning fluid through it. Both measures contribute to reducing contamination of the exterior of the hollow body.

[0025] As mentioned, the hollow body interior surface is generally cleaner than the hollow body exterior surface. In this embodiment, the cleaning fluid is first conducted from the fluid conducting device over the hollow body interior surface, then over the hollow body exterior surface. Thus, the cleaning fluid flows over the cleaner surface first, then over the dirtier surface. This prevents highly particle-laden cleaning fluid from being conducted over a relatively cleaner surface and resulting in less effective cleaning or even contamination.

[0026] A further developed embodiment may be characterized in that the hollow body has a cover by which the hollow body opening can be closed, and the device has a second holding means by which the cover can be releasably fastened to the device wall. As mentioned, the FOUP can be closed by a removable cover. In this embodiment, the cover can also be dried and cleaned in the device in the same way. A corresponding separate process for the cover alone is omitted.

[0027] According to a further embodiment, the cover may have an inner cover surface and an outer cover surface, and the device may comprise a gripping and moving device whereby the cover is connectable to the second holding means so that the outer cover surface faces the outer surface of the hollow body.

[0028] Simultaneous cleaning of the hollow body and the cover requires their separation before introduction into the device. The introduction into the device is carried out separately. In prior art gripping and transferring devices that would be suitable for such operations, it can happen that the inner surface of the cover, once separated from the hollow body, faces the outer surface of the hollow body. For the reasons further mentioned above, for example, efforts are made to keep the volume of the device's interior space as small as possible, so the distance between the outer surface of the hollow body and the inner surface of the cover is generally not very large. Therefore, if the outer space of the hollow body becomes dirty, a larger load of cleaning fluid will also flow over the inner surface of the cover, which may not be effectively cleaned or may even become dirty. The cleaning fluid must be supplied for a correspondingly long period of time. In this embodiment, since the cover is arranged in the device's interior space so that the outer surface of the cover faces the outer surface of the hollow body, this situation is avoided and the cleaning process is accelerated. Here, it can be assumed that the load of cleaning fluid increases as the distance from the surface to be cleaned decreases.

[0029] In a further embodiment, it may be appropriate for at least one flow rectifier to be arranged in the device's internal space, by means of which the flow of the cleaning fluid can be conducted into the device's internal space. The flow rectifier may include several baffles and / or partitions. The flow of the cleaning fluid can be conducted so that the more highly loaded cleaning fluid does not flow or only flows slightly over the cover's inner surface. This avoids the above-mentioned case where the more highly loaded cleaning fluid flows over the relatively clean cover's inner surface, potentially contaminating the cover's inner surface instead of cleaning it.

[0030] A further developed embodiment may be characterized in that the hollow body wall forms an edge surface surrounding the hollow body opening, and the first retaining means includes a locking device by which the hollow body can be sealingly coupled to the edge surface and releasably coupled to the retaining surface. Using the locking device, the hollow body can be reliably fixed and positioned during drying and cleaning, ensuring a desired flow. The edge surface separates the hollow body's inner surface from its outer surface. The fact that the hollow body's edge surface is sealingly positioned on the retaining surface prevents the cleaning fluid from flowing uncontrolled from the hollow body's inner space to the hollow body's outer space, or vice versa. Furthermore, this can be achieved only by permanently applying a vacuum within the hollow body's inner space.

[0031] A further embodiment is characterized in that the displacement element surrounds a hollow space accessible through the passage opening, and a heating device is disposed within the hollow space, so that the hollow body can be heated for drying. The heating device serves to heat the hollow body after cleaning to assist the drying process. Because the displacement element is introduced into the hollow body's interior space, the distance between the heating device and the hollow body wall is short, and effective heating can be performed. Due to the fact that the hollow space is open, atmospheric pressure exists within the hollow space. Therefore, no special measures need to be taken to protect the heating device from vacuum. Furthermore, the heating device is easily accessible through the passage opening, and assembly and repair can be performed without special measures.

[0032] A further developed embodiment may state that the heating device includes several infrared diodes and that the displacement element is made of or includes a material that is transparent to infrared radiation. Infrared diodes have the advantage that the infrared radiation they generate is in a precisely defined frequency range that can be optimized for the purification fluid used. Some of the infrared diodes are capable of generating infrared radiation with which the purification fluid is heated, while others are capable of generating infrared radiation with which the hollow body wall is heated. Residues of the purification fluid still remaining on the inner or outer surface of the hollow body are heated very effectively and removed in interaction with the vacuum.

[0033] An embodiment of the invention is a method for cleaning pot-like hollow bodies, in particular transport containers for semiconductor wafers or EUV lithography masks, using an apparatus according to one of the preceding claims, comprising: - having an interaction of the hollow body wall with the first holding means; - introducing a replacement element into the hollow body interior space; - applying a vacuum in the interior space of the hollow body by means of an evacuation device; and / or - conveying a cleaning fluid through the interior space of the hollow body by a conveying device; The present invention relates to a method, comprising:

[0034] The technical effects and advantages that can be achieved by the method proposed by the present invention correspond to those discussed with respect to the present device. In summary, it should be pointed out that the volume in which the vacuum is generated is reduced with the aid of the displacement element. As a result, the time until the desired vacuum is reached is reduced, and the entire drying process, especially of the hollow body interior, is accelerated. At the same time, the energy required to apply the desired pressure is reduced. Also, for the same reason, the volume of cleaning fluid required to clean the hollow body interior is kept small. Here, it seems practical to carry out the cleaning after the drying process.

[0035] In a further embodiment, it can be provided that the hollow body has a cover with an inner cover surface and an outer cover surface, by means of which the hollow body opening is closable, wherein the device has a device wall, a second holding means by means of which the cover is releasably fastenable to the device wall, and a gripping and moving device, and the method comprises: - releasably fastening the cover by the second holding means using the gripping and moving device so that the outer surface of the cover faces the outer surface of the hollow body. Includes:

[0036] If the inner surface of the cover faces the outer surface of the hollow body, contamination in the outer space of the hollow body would cause a large load of cleaning fluid to flow over the inner surface of the cover as well, which may not be effectively cleaned or may even become contaminated. In this embodiment, this situation is avoided because the cover is arranged in the inner space of the device so that the outer surface of the cover faces the outer surface of the hollow body.

[0037] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings, in which: FIG. [Brief explanation of the drawings]

[0038] [Figure 1A] FIG. 2 shows the steps of operating an apparatus according to a first embodiment of the invention. [Figure 1B] FIG. 2 shows the steps of operating an apparatus according to a first embodiment of the invention. [Figure 1C] FIG. 2 shows the steps of operating an apparatus according to a first embodiment of the invention. [Figure 1D] FIG. 2 shows the steps of operating an apparatus according to a first embodiment of the invention. [Figure 1E] FIG. 2 shows the steps of operating an apparatus according to a first embodiment of the invention. [Figure 1F] FIG. 2 shows the steps of operating an apparatus according to a first embodiment of the invention. [Figure 2] FIG. 2 shows a second embodiment of the device according to the invention. [Figure 3]FIG. 3 shows a third embodiment of the device according to the invention. [Figure 4] FIG. 4 shows a fourth embodiment of the device according to the invention. [Figure 5A] FIG. 10 is a cross-sectional view of a fifth embodiment of the device according to the invention. [Figure 5B] FIG. 5B is a plan view of the replacement member shown in FIG. 5A. [Figure 6A] FIG. 10 is a perspective view of a fifth embodiment of the device according to the invention. [Figure 6B] 6B is a cross-sectional view of the sixth embodiment of the device according to the invention shown in FIG. 6A; DETAILED DESCRIPTION OF THE INVENTION

[0039] A first embodiment of an apparatus 101 for drying and / or purifying a pot-shaped hollow body 12, in particular a transport container for semiconductor wafers or EUV lithography masks, according to the present invention is shown in FIGS. 1E and 1F with reference to a basic diagram. A cup-shaped hollow body 12, also referred to as a FOUP, is shown in FIGS. 1E and 1F and will be referred to hereinafter. The hollow body 12 includes a hollow body wall 14 forming a hollow body inner surface 16, which defines a hollow body interior space 17. The hollow body 12 further includes a hollow body opening 18 surrounded by the hollow body wall 14, through which the hollow body interior space 17 is accessible, for example, for loading semiconductor wafers into the hollow body 13. The hollow body wall 14 forms an edge surface 20 surrounding the hollow body opening 18.

[0040] The hollow body 12 further has an outer hollow body surface 22. An edge surface 20 separates the outer hollow body surface 22 from the inner hollow body surface 16.

[0041] 1E and 1F also show a cover 24, with which the hollow body opening 18 can be closed. The cover 24 forms an inner cover surface 26 and an outer cover surface 28. This relationship relates to the state, not shown, in which the hollow body opening 18 is closed by the cover 24. The inner cover surface 26 therefore faces towards the hollow body interior space 17, and the outer cover surface 28 faces outwards.

[0042] The device 101 has first retaining means 30 that can interact with the hollow body 12. In the embodiment shown, the first retaining means 30 comprises a retaining surface 32 against which the edge surface 20 of the hollow body 12 can rest. The first retaining means 30 further comprises a locking device 33 by means of which the hollow space 12 can be sealingly connected to the edge surface 20 and releasably connected to the retaining surface 32.

[0043] In the embodiment shown, the retaining surface 32 is formed by the device wall 34, which in turn includes a first wall portion 36 and a second wall portion 38. The first wall portion 36 and the second wall portion 38 can be connected to each other and can be separated from each other again. In this case, the retaining surface 32 is formed by the first wall portion 36. In the connected state, the first wall portion 36 and the second wall portion 38 enclose an interior space 40 of the device.

[0044] As can be seen from Figures 1E and 1F, the retaining surface 32 is arranged on a protrusion 42 of the first wall portion 36. A number of through channels 44 are arranged in the protrusion 42 and belong to a fluid conducting device 46, the function of which will be noted in more detail below.

[0045] The replacement element 481 according to the first embodiment is designed with a conical shape and is releasably fastened to the first wall portion 36. It is also conceivable to design the replacement element 481 in one piece with the first wall portion 36. When the hollow body 12 is placed on the support surface 32, as shown in FIGS. 1E and 1F, the replacement element 481 protrudes into the hollow body interior space 17, with a gap between the replacement element 481 and the hollow body wall 14. Here, the shape of the replacement element 481 is selected to generally correspond to the shape of the hollow body interior space 17. Thus, the gap has at least a generally constant width. A through-hole 50 passes through the replacement element 481 and opens into the hollow body interior space 17 when the hollow body 12 is placed on the support surface 32, as shown in FIGS. 1E and 1F.

[0046] As mentioned, the hollow body opening 18 may be closed by the cover 24. The cover 24 is connected to the second wall portion 38 by a second retaining means 52.

[0047] The device 101 according to the first embodiment can be operated as follows.

[0048] Before the steps described below are carried out, the hollow body 12 and the cover 24 are cleaned with a cleaning fluid in a manner not shown.

[0049] 1A, it can be seen that the first wall portion 36 is released from the second wall portion 38. The first wall portion 36 is not shown in FIG. 1A for illustrative purposes. The cover 24 is separated from the hollow body 12 by the gripping and moving device 54; this separation step is also not shown in FIG. 1A. It can only be seen that the cover 24 is connected to the gripping and moving device 54. The gripping and moving device 54 has a rotation device 56, by which the cover 24 can be rotated about the rotation axis R. Here, the cover 24 is rotated so that the cover inner surface 26 faces the second holding means 52. As soon as the cover 24 assumes the corresponding rotation position, the cover 24 is gripped by the displacement device 58 of the gripping and moving device 54 and moved into the hollow body interior space 17 so that the cover 24 can come into contact with and be held by the second holding means 52 (see FIG. 1B).

[0050] As can be seen in FIG. 1C, the edge surface 20 of the hollow body 12 is placed on the holding surface 32. The locking device 33 is then activated, so that the hollow body 12 is sealingly connected to the first wall portion 36. As can be seen in FIG. 1D, the first wall portion 36 and the second wall portion 38 are now connected to each other, likewise using the gripping and moving device 54. Referring to FIG. 1E, a vacuum is applied to the device interior space 40. For this purpose, the device 101 includes an exhaust device 60, which in the illustrated embodiment includes a vacuum pump 62. The exhaust device is connected to the device interior space 40 by a connecting valve 63. Upon activation of the vacuum pump 62, the fluid in the device interior space 40, typically air, is sucked out of the device interior space 40. To prevent inflow through the through hole 50, the through hole 50 is connected to a check valve 64, which is closed for this purpose. The flow of fluid in the device interior space 40 is indicated by arrows. It should be mentioned that the fluid can flow through the through channel 44 and thus the fluid in the hollow body inner space 17 can also be sucked out. Here, the locking device 33 is configured in such a way that the flow towards the vacuum pump 62 is not significantly obstructed.

[0051] As a result, a vacuum is formed on the hollow body inner surface 16, the hollow body outer surface 22, the cover inner surface 26, and the cover outer surface 28, thereby removing any residue of purification fluid remaining on the surfaces of the hollow body 12 and the cover 24 from a previous purification of the hollow body 12 in the purification device, thereby drying the hollow body inner surface 16, the hollow body outer surface 26, the cover inner surface 26, and the cover outer surface 28.

[0052] 1F, it can be seen that upon completion of the drying process, the through-hole 50 is connected to a fluid reservoir 65 in which a cleaning fluid, such as nitrogen, is placed. This can be done manually or by a corresponding valve connection; a check valve 64 can also be used and thus activated to open. The cleaning fluid is transported through the device 101 by a transport device 66, which has a transport pump 68. The exhaust device 66 is likewise connected to the device interior space 40 by the already mentioned connection valve 63. It should be pointed out at this point that the vacuum pump 62 can also be adapted to be used as the transport pump 68. To this extent, the vacuum pump 62 and the transport pump 68 can be formed by the same components.

[0053] If a vacuum is still applied in the device interior space 40 before the drying process, the cleaning fluid can also be conveyed into the device interior space 40 in the following manner: thanks to the check valve 64 and the fluid reservoir of a corresponding embodiment, the cleaning fluid can be sucked into the device interior space 40 as a result of opening the check valve 64. Active conveyance of the cleaning fluid by the conveying device 66 is not necessary, at least until complete pressure equilibrium has been achieved. Here, the connecting valve 63 and / or the check valve 64 can be adapted not only to release and block the flow of the cleaning fluid or another fluid, but also to set the volumetric flow. In particular, if a higher vacuum is present in the device interior space 40, it is sensible to initially keep the volumetric flow through the check valve 64 small in order to slowly achieve pressure equilibrium and avoid pressure surges.

[0054] The cleaning fluid flows along substantially the same direction as the fluid when a vacuum is applied, as described with respect to FIG. 1E. In FIG. 1F, the arrows also indicate the flow direction. Here, the unloaded cleaning fluid flows out of the fluid reservoir 65, through the through-holes 50, and then over the hollow-body inner surface 16. Due to evaporation assisted by the cleaning fluid, AMC (airborne molecular contamination) is removed from the hollow-body inner surface 16 and is thus captured and carried away by the cleaning fluid. The cleaning fluid then flows through the through-flow channels 44 before hitting the hollow-body outer surface 22. Again, the above-listed contaminants are removed.

[0055] The hollow body outer surface 16 is generally more contaminated than the hollow body inner surface 16, and as it flows over the hollow body outer surface 22, the loading of the cleaning fluid increases significantly. This portion of the cleaning fluid has the most loading here and flows directly over the hollow body outer surface 22. Because the distance between the cover 24 and the hollow body 12 in the device interior space 40 is not very large, the relatively heavily contaminated cleaning fluid also flows over the cover outer surface 28. The portion of the cleaning fluid that flows along the second wall portion 38 and is therefore less loaded flows over the cover inner surface 26. This prevents heavily loaded cleaning fluid from flowing over the relatively clean cover inner surface 26 and contaminating it instead of cleaning it. The cleaning fluid then exits the device 101 and can be stored in a container (not shown) for disposal or preparation.

[0056] A second embodiment of the device 102 according to the invention is similarly illustrated with reference to the basic diagram of FIG. 2. The basic design of the device 102 according to this second embodiment generally corresponds to that of the device 101 according to the first embodiment, and therefore only the main differences will be noted. The device 102 according to the second embodiment includes a flow rectifier 70 designed as a partition 72, which may be arranged in the device interior space 40 together with an adjustment device (not shown). The partition 72 divides the device interior space 40 into a first subsection 74 and a second subsection 76. The hollow body 12 is located in the first subsection 74, and the cover 24 is located in the second subsection 76. Therefore, an adjustment device is required to enable access to the second subsection 76, so that the cover 24 can be arranged therein and removed therefrom.

[0057] The device interior space 40 is connected to an additional fluid reservoir 78 in which an additional cleaning fluid identical to the cleaning fluid stored in the fluid reservoir 65 can be stored. The additional fluid reservoir 78 here communicates with the second sub-portion 76.

[0058] As already mentioned with respect to the first embodiment of the device 101, the cleaning fluid is transported through the device interior space 40 by the transport device 66. However, in the second embodiment of the device 102, additional cleaning fluid is also transported from the second fluid reservoir 78 to the second sub-portion 76, and the additional cleaning fluid, which has not yet been loaded, flows directly over the cover inner surface 26 and then over the cover outer surface 28. The additional cleaning fluid then leaves the second sub-portion 76 through the partition opening 80, where it merges with the cleaning fluid in the first sub-portion 74. As mentioned, the cleaning fluid can be conducted to a container (not shown) and disposed of or prepared for disposal. This ensures that the cover inner surface 26 is acted upon by an unloaded or only slightly loaded cleaning fluid, and effective cleaning of the cover inner surface 26 can be achieved.

[0059] In an embodiment not shown, the fluid conducting device 46 has several baffles that divide the cleaning fluid into two partial flows as soon as it flows through the through-flow channel 44. The outer partial flow is conducted along the second wall portion 38 to the cover 24, and the inner partial flow is conducted along the hollow body outer surface 22. Mixing of the outer and inner partial flows is largely avoided until the outer partial flow reaches the cover 24. This also prevents a large load of cleaning fluid from flowing over the cover inner surface 26. An additional fluid reservoir 78 is not necessary here.

[0060] A third embodiment of the device 103 according to the invention is similarly shown with reference to the basic diagram of Fig. 3. The first wall portion 36 forms a passage opening 82 which is substantially flush with the hollow body opening 18 when the hollow body 12 is placed in the first wall portion 36. Also in this embodiment, the fluid-conducting device 46 includes a passage channel 44. The first wall portion 36 divides the device interior space 40 into a first sub-portion 74 and a second sub-portion 76, whereby the hollow body 12 can be arranged in the first sub-portion 74 and the cover 24 can be arranged in the second sub-portion 76. The displacement element 48 protrudes from the second sub-portion 76 through the passage opening 82 into the first sub-portion 74 and into the hollow body interior space 17.

[0061] In the second sub-portion 76, the first wall portion 36 forms a wall opening 84. In the third embodiment, a second holding means 52, by which the cover 24 can be fixed in place, is arranged in the cover operating unit 86, whereby the cover 24 can be releasably coupled using the second holding means 52. The cover operating unit 86 is rotatably supported about a rotation axis in the first wall portion by a fastening device 88 and is movable between an open position in which the cover operating unit 86 releases the wall opening 84, thereby releasing access to the device interior space 40, and a closed position in which the wall opening 84 is closed. In FIG. 3, the cover operating unit 86 is in the closed position. It should be noted that the wall opening 84 is closed by the cover 24, and the cover inner surface 26 faces into the device interior space 40.

[0062] The main operational aspects of the device 103 according to this third embodiment correspond to those described with respect to the first and second embodiments. One of the main differences is the way in which the cover 24 is manipulated. After the cover 24 is separated from the hollow body 12 by the gripping and moving device 54 (not shown in FIG. 3), the cover 24 is placed in the second holding means 52. At this point, the cover manipulation unit 86 is in the open position and rotated 90° compared to the closed position shown in FIG. 3. The cover 24 is placed on the second holding means 52 from above, and the cover manipulation unit 86 is then rotated 90° to the closed position shown in FIG. 3. The cover 24 now closes the wall opening 84. The exhaust device 60 (not shown in FIG. 3) can then be activated so that a vacuum is applied to the device interior space 40. Residues of the cleaning fluid present on the hollow body inner surface 16, the cover inner surface 26, and the hollow body outer surface 22 are removed, and the hollow body 12 and cover 24 are dried. It should be noted that in this embodiment, no vacuum is applied to the cover exterior surface 28, and therefore residues of the cleaning fluid may still remain there.

[0063] After the drying process is completed, a transition to the cleaning process shown in Fig. 3 can be performed as a result of the corresponding valve connection. As mentioned for the other embodiments, the conveying pump 68 of the conveying device 66 is activated, the check valve 64 is opened, and the cleaning fluid is conveyed into the device interior space 40 through the passage hole 50, which is connected to the fluid reservoir 65 as a result of the valve connection. The cleaning fluid flows over the hollow body inner surface 16, the cover inner surface 26, and the hollow body outer surface 22, and can remove contaminants located there. It also applies here that the cleaning fluid does not reach the cover outer surface 28 and is not cleaned.

[0064] Referring now to the basic diagram of FIG. 4 , a fourth embodiment of the device 104 according to the present invention is shown. The basic design of this fourth embodiment of the device 104 generally corresponds to that of the device 101 according to the first embodiment, and therefore only the main differences will be noted. As in the first embodiment, the device wall 34 is divided into a first wall portion 36 and a second wall portion 38, but the separation zone extends differently. As can be seen from FIG. 4 , the first wall portion 36 is U-shaped, while the second wall portion is flat and substantially plate-shaped or disk-shaped. The first retaining means 30 is attached to the second wall portion 38 and interacts with the hollow body outer surface 22 by means of a retaining surface 32 such that the hollow body 12 is spaced apart from the device wall 34 within the device interior space 40. To this extent, in the fourth embodiment, the retaining surface 32 is formed by the second wall portion 38. Thus, in the fourth embodiment of the device 104, the hollow body 12 does not rest on a surface, but rather "floats" within the device interior space 40. The first retaining means 30 is configured such that a gap 90 remains between the edge surface 20 and the first wall portion 36, allowing the cleaning fluid to pass through and move from the hollow body inner surface 16 to the hollow body outer surface 22. In this respect, the first retaining means 30, the hollow body wall 14, and the device wall 34 form a fluid-conducting device 46, which takes over the function of the second embodiment. Here, the first retaining means 30 is designed so that the flow of cleaning fluid within the device interior space 40 is substantially unimpeded. Therefore, it is not necessary to provide the protrusions 42 and the through-flow channels 44. The locking device 33 may also be omitted.

[0065] Also arranged on the second wall portion 38 is a second retaining means 52 for fastening the cover 24 .

[0066] The replacement member 481 is formed integrally with the first wall portion 36 in the fourth embodiment of the device 104 .

[0067] The device 104 according to the fourth embodiment operates in substantially the same manner as described with respect to the other embodiments. However, it should be noted that the hollow body 12 and the cover 24 are first fastened to the second wall portion 38 using the gripping and moving device 54 before being connected to the first wall portion 36. In this respect, the gripping and moving device 54 grips at least one of the two wall portions 36, 38.

[0068] 5A and 5B show a replacement element 482 according to a second embodiment. While the replacement element 481 according to the first embodiment is formed as a solid body, the replacement element 482 according to the second embodiment encloses a hollow space 92 accessible through a passage opening 94 formed by the replacement element wall 96. The replacement element 482 is introduced into the device 105 according to the fifth embodiment, such that a vacuum can be applied to the outside of the replacement element wall 96 located in the device interior space 40, while atmospheric pressure exists within the hollow space 92. Only the second wall portion 38 of the device wall 34 is shown in the device 105 according to the fifth embodiment, which may, in principle, have exactly the same design as the devices 101 to 104 according to the previously described embodiments. Only the replacement element 482 is shown in FIG. 5B.

[0069] A receiving flange 104 is arranged in the second wall portion 38, which forms a flange opening 106, through which the replacement member 482 can be inserted and thus introduced into the device interior space 40 of the device 105. The receiving flange 104 may be designed as a separate component. At least one O-ring seal 108, here two O-ring seals 108, is arranged in the receiving flange 104, which seals the second wall portion 38 against the replacement member wall 96 when the replacement member 482 is inserted through the flange opening 106, as shown in FIG. 5A . This makes it possible to apply a vacuum inside the device 105. To prevent the replacement member 482 from being drawn into the device 105, the replacement member 482 has an enlarged diameter 110 at the passage opening.

[0070] A heating device 98 is arranged in the hollow space 92 and fastened to the replacement element wall 96 by a holder 100. The heating device 98 is accessible through the passage opening 94. Because atmospheric pressure exists in the hollow space 92, no special measures are required to protect the heating device 98 against a vacuum. The heating device 98 includes several infrared diodes 102 for generating infrared radiation. Two groups of infrared diodes 102 can be distinguished here. The first group of infrared diodes 102 emits infrared radiation primarily along the longitudinal axis L of the replacement element 482. This first group of infrared diodes 102 is located in the region of the closed end of the replacement element 482, located opposite the passage opening 94, in the upper region in FIG. 5A . The second group of infrared diodes 102 emits infrared radiation primarily perpendicular to the longitudinal axis and is located in the center. The replacement element wall 96 is made of a material transparent to infrared radiation, for example, glass.

[0071] As mentioned, the volume in which a vacuum can be generated is reduced with the aid of the displacement element 482. As also mentioned, the vacuum serves to remove any residues of the purification fluid from the hollow body inner surface 16 and / or on the hollow body outer surface 22. The removal can be assisted by the heating device 98. The infrared radiation generated by the infrared diodes 102 is in a precisely defined frequency range that can be optimized for the purification fluid used. Any residues of the purification fluid still remaining on the hollow body inner surface 16 or on the hollow body outer surface 22 are heated very effectively and removed in interaction with the vacuum.

[0072] As mentioned above, the displacement element 481 according to the first embodiment has through-holes 50 (see, e.g., FIGS. 1F and 2 ) through which, upon completion of the drying process, a cleaning fluid, such as nitrogen, can flow along the hollow-body inner surface 16 and / or the hollow-body outer surface 22 of the hollow body 12 (not shown in FIGS. 5A and 5B ). In contrast, the displacement element wall 96 of the displacement element 482 according to the second embodiment is closed, particularly due to the fact that it is made of glass. To still allow the cleaning fluid to be introduced into the device interior space 40 of the device 105, a plurality of connecting channels 112 are arranged in the receiving flange 104, distributed around the periphery of the receiving flange 104, and can be connected to check valves 64 and / or fluid reservoirs 65 (see, e.g., FIG. 2 ), as explained with respect to the through-holes 50. Only one check valve 65 is shown in FIG. 5A for illustrative purposes. In other respects, device 105 operates in the same manner as described with respect to the other embodiments of devices 101-104.

[0073] 6A and 6B, a sixth embodiment of the device 106 according to the present invention is shown. The device 106 includes a replacement element 483 according to the third embodiment. In this third embodiment, the replacement element 483 is designed as a parallelepiped and may be hollow or solid, but is closed, in contrast to the second embodiment of the replacement element 482 shown in FIGS. 5A and 5B. In this embodiment, the replacement element 483 is connected to a receiving flange 104 fastened to the second wall portion. The receiving flange 104 also has a connecting channel for introducing a cleaning fluid into the device interior space 40. The heating device 98 includes a total of four groups of infrared diodes 102 arranged outside the replacement element 483. In this case, a holder formed as a cross-shaped disk is fastened to the free end of the replacement element 483. The holder has respective receiving holes 114, one for each group of infrared diodes 102. Additionally, each group of infrared diodes 102 is coupled to a receiving flange 104 .

[0074] The infrared diode 102 is arranged to emit infrared radiation mainly perpendicular to the longitudinal axis of the replacement element 483, which is not shown in Figures 6A and 6B. Part of this infrared radiation therefore strikes the replacement element 483. The replacement element 483 has a reflective surface 116, so that infrared radiation incident on the replacement element 483 is reflected and can therefore be used to heat the hollow body 12 and is not lost. The reflective surface 116 can be provided, for example, by making the replacement element 483 from a metal, for example aluminum, and by providing it with a particularly small roughness, for example by polishing the area where the reflective surface 116 is to be arranged.

[0075] In other respects, the apparatus 106 according to the sixth embodiment operates substantially exactly as described with respect to the fifth embodiment of the apparatus 105 . [Explanation of symbols]

[0076] 10 equipment 101, 102, 103, 104, 105, 106 equipment 12 Hollow body 14 Hollow body wall 16. Inner surface of hollow body 17 Hollow body internal space 18 Hollow body opening 20 Edge surface 22 Hollow body outer surface 24 Cover 26 Inside of cover 28 Outer surface of cover 30 First holding means 32 Holding surface 33 Locking device 34 Equipment wall 36 First wall section 38 Second wall section 40 Equipment internal space 42 Protrusion 44 Passage 46 Fluid conduction device 48 Replacement parts 481, 482, 483 replacement parts 50 Passing hole 52 Second holding means 54 Gripping and moving device 56 Rotating Device 58 Displacement Device 60 Exhaust system 62 Vacuum pump 63 Connecting valve 64 Check valve 65 Fluid Reservoir 66 Transport equipment 68 Transfer pump 70 rectifier 72 Bulkhead 74 First subpart 76 Second subpart 78 Additional Fluid Reservoir 80 Bulkhead opening 82 Passage opening 84 Wall Opening 86 Cover operation unit 88 Fastening device 90 Gap 92 Hollow space 94 Passage opening 96 Replacement member wall 98 Heating device 100 holder 102 Infrared diode 104 Receiving flange 106 Flange opening 108 O-ring seal 110 Expanded diameter part 112 Connecting Channel 114 Receptacle 116 Reflective surface L Longitudinal axis R rotation axis

Claims

1. An apparatus (10) for drying and / or cleaning a pot-like hollow body (12), in particular a transport container for semiconductor wafers or for EUV lithography masks, comprising: - said hollow body (12) comprises a hollow body wall (14) forming a hollow body inner surface (16), said hollow body inner surface (16) defining a hollow body interior space (17); - said hollow body (12) has a hollow body opening (18) surrounded by said hollow body wall (14), through which said hollow body interior space (17) is accessible, The device (10), - first holding means (30) by means of which said device (10) can interact to hold said hollow body (12); an exhaust device (60) for applying a vacuum inside the hollow body interior space (17), and / or a conveying device (66) for conveying a cleaning fluid through the hollow body interior space (17); a displacement member (48) which can be or has been introduced into said hollow body interior space (17) through said hollow body opening (18).

2. The replacement member (48) is a through hole (50), - open into the hollow body interior space (17) when the displacement element (48) is introduced into said hollow body interior space (17), through which the cleaning fluid can be conveyed into the hollow body interior space (17) and / or by which a vacuum can be applied into the hollow body interior space (17), 2. The device (10) according to claim 1, characterized in that it has a through hole (50).

3. - said device (10) has a device wall (34); - device (10) according to claim 1 or 2, characterized in that said replacement member (48) is releasably connectable to said device wall (34) or is formed integrally with said device wall (34).

4. said device wall (34) comprises a first wall portion (36) and a second wall portion (38) which are releasably connectable to one another and which, in said connected state, enclose an internal displacement space (40); - said first retaining means (30) comprises a retaining surface (32); - device (10) according to any one of claims 1 to 3, characterized in that the first wall portion (36) forms the retaining surface (32) which at least partially defines the device interior space (40).

5. said hollow body wall (14) forming a hollow body outer surface (22); The device (10) according to claim 4, characterized in that the device (10) has at least one fluid conducting device (46) by means of which the cleaning fluid can be conducted from the hollow body interior space (17) to the hollow body outer surface (22) and / or by means of which a vacuum can be applied in the hollow body interior space (17) and / or in the device interior space (40).

6. the hollow body (12) having a cover (24) by means of which the hollow body opening (18) can be closed, and the device (10) having second retaining means (52) by means of which the cover (24) can be releasably fastened to the device wall (34); 6. Apparatus (10) according to claim 4 or 5, characterized in that

7. 7. The apparatus (10) of claim 6, characterized in that the cover (24) has an inner cover surface (26) and an outer cover surface (28), and the apparatus (10) comprises a gripping and moving device (54) by which the cover (24) can be connected to the second holding means (52) so that the outer cover surface (28) faces the hollow body outer surface (22).

8. At least one flow straightener (70) is arranged in the device internal space (40) by means of which the flow of the cleaning fluid can be conducted in the device internal space (40).

8. The device (10) according to any one of claims 4 to 7, characterized in that

9. - said hollow body wall (14) defines an edge surface (20) surrounding said hollow body opening (18); The device (10) according to any one of claims 4 to 8, characterized in that the first retaining means (30) comprise a locking device (33) by means of which the hollow body (12) is sealingly connectable to the edge surface (20) and releasably connectable to the retaining surface (32).

10. 10. The apparatus (10) according to any one of claims 1 to 9, characterized in that the displacement element (48) has a heating device (98) by means of which the hollow body (12) can be heated for drying.

11. 11. The apparatus (10) according to claim 10, characterized in that said heating device (98) comprises several infrared diodes (102).

12. The apparatus (10) of claim 11, wherein the displacement member (48) has a reflective surface that reflects infrared radiation emitted by the infrared diode.

13. said replacement member (48) enclosing a hollow space (92) accessible by a passage opening (94); - said heating device (98) is arranged in said hollow space, and a heating device (98) is arranged in said hollow space (92); 12. The device (10) according to any one of the preceding claims, characterized in that

14. 14. The apparatus (10) of claim 13, wherein the displacement member (48) is made of or includes a material that is transparent to infrared radiation.

15. 15. A method for cleaning a pot-like hollow body (12), in particular a transport container for semiconductor wafers or for EUV lithography masks, using an apparatus (10) according to any one of claims 1 to 14, comprising the steps of: - having an interaction of said hollow body wall (14) with said first retention means (30); - introducing said replacement element (48) into said hollow body interior space (17); applying a vacuum in the hollow body interior space (17) by means of an exhaust device (60), and / or - conveying a cleaning fluid through said hollow body interior space (17) by means of a conveying device (66).

16. - said hollow body (12) has a cover (24) by means of which said hollow body opening (18) can be closed, said cover having an inner cover surface (26) and an outer cover surface (28); said device (10) - an apparatus wall (34); - second retaining means (52) by means of which said cover (24) can be releasably fastened to said device wall (34); ・Gripping and holding device (54) having The method further comprising: - releasably fastening said cover by said second holding means (52) using said gripping and transferring device (54) so ​​that said cover outer surface (28) faces said hollow body outer surface (22).

16. The method of claim 15, comprising:

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