Edge ring system and corresponding middle ring, edge ring, moving ring, stationary ring and bottom ring

Abstract

An edge ring system for a substrate processing chamber has a middle ring configured to be disposed around a substrate support. The edge ring system has an outer ring portion, an inner ring portion, N arcuate openings disposed between the outer ring portion and the inner ring portion, where N is an integer greater than 1, N bridges connecting the outer ring portion and the inner ring portion between the N arcuate openings, and an annular recess disposed on a radially inner surface of the outer ring portion. A cover ring is disposed within the annular recess. A top edge ring is disposed above the middle ring between the cover ring and the inner ring portion and above the N arcuate openings and the N bridges of the middle ring.

Description

Cross - reference to related applications

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 342,826, filed May 17, 2022, and U.S. Provisional Patent Application No. 63 / 458,542, filed Apr. 11, 2023. The entire disclosures of the above applications are hereby incorporated by reference herein each in its entirety.

Technical Field

[0002] This disclosure relates to a self - centering edge ring for a substrate processing system.

Background Art

[0003] The background description provided here is for the purpose of generally presenting the content of the present disclosure. Within the scope described in this background art section, research by the inventors named at the present time, as well as aspects of the description that cannot be separately regarded as prior art at the time of filing, are not admitted as prior art against the present disclosure, whether explicitly or implicitly.

[0004] A substrate processing system performs processing on a substrate such as a semiconductor wafer. Examples of substrate processing include deposition, ashing, etching, cleaning, and / or other processes. The substrate can be processed by supplying a process gas mixture to a processing chamber. A chemical reaction can be promoted by igniting the gas using plasma.

[0005] The substrate is disposed on a substrate support during processing. An edge ring having an annular body is disposed around and adjacent to the radially outer edge of the substrate. By using the edge ring, plasma can be shaped or focused on the substrate.

Summary of the Invention

[0006] An edge ring system for a substrate processing chamber includes a middle ring having an outer ring portion and an inner ring portion, and an edge ring configured to be supported on the middle ring between the outer ring portion and the inner ring portion. The outer diameter of the lower surface of the edge ring has a first chamfer (chamfered surface) that forms a surface chamfered facing downward and outward. The inner diameter of the outer ring portion has a second chamfer (chamfered surface) that forms a surface chamfered facing upward and inward. At least one of the first chamfer and the second chamfer is configured to align the edge ring within the ranges of the outer ring portion and the inner ring portion of the middle ring.

[0007] In other features, the middle ring is further configured to center the edge ring with respect to a substrate being processed in the substrate processing chamber by aligning the edge ring with a moving ring. The inner ring portion of the middle ring has a substantially "L" shape and has a ledge extending radially outward toward the outer ring portion. The edge ring is configured to be at least partially supported on the ledge of the inner ring portion. The edge ring includes a rim extending downward from the lower surface at the inner diameter of the edge ring, and the rim is configured to be supported on the ledge of the inner ring portion. The inner ring portion is configured to push the edge ring into a centered position with respect to the middle ring. An interface between the edge ring and the inner ring portion forms a serpentine path.

[0008] In other features, the edge ring is fully supported within the range of the inner diameter and outer diameter of the middle ring. The middle ring has a plurality of bridges connecting the inner ring portion to the outer ring portion. The middle ring has six bridges. The middle ring has a plurality of gaps formed between the plurality of bridges. The edge ring system further includes a moving ring configured to be raised and lowered with respect to the middle ring. The moving ring is configured to contact the lower surface of the edge ring through the plurality of gaps. The moving ring has a raised portion that extends upward through the plurality of gaps and contacts the lower surface of the edge ring. The moving ring includes a stationary ring portion and a moving ring portion located radially inward of the stationary ring portion, and the moving ring portion is configured to be raised and lowered.

[0009] In other features, the lower surface of the outer ring portion of the middle ring has an annular groove. The edge ring system further includes a bottom ring. The middle ring is supported on the bottom ring. The bottom ring has an annular rim that extends upward from the upper surface of the bottom ring into the annular groove.

[0010] The edge ring system for a substrate processing chamber includes a middle ring having an outer ring portion and an inner ring portion, and an edge ring supported on the middle ring between the outer ring portion and the inner ring portion. The edge ring is fully supported within the range of the inner diameter and outer diameter of the middle ring, and at least one of the outer ring portion and the inner ring portion is configured to push the edge ring into a centered position with respect to the middle ring. The moving ring is disposed below the middle ring. The moving ring is configured to be raised and lowered to contact the edge ring and selectively raise and lower the edge ring.

[0011] In other features, the middle ring has a plurality of bridges connecting the inner ring portion to the outer ring portion, and a plurality of gaps formed between the plurality of bridges. The moving ring is configured to contact the lower surface of the edge ring through the plurality of gaps. The moving ring has a raised portion that contacts the lower surface of the edge ring by extending upward through the plurality of gaps.

[0012] The edge ring system for a substrate processing chamber includes a middle ring configured to be disposed around a substrate support. The middle ring has an outer ring portion, an inner ring portion, N arcuate openings disposed between the outer ring portion and the inner ring portion, where N is an integer greater than 1, N bridges connecting the outer ring portion and the inner ring portion between the N arcuate openings, and an annular recess disposed on a radially inner surface of the outer ring portion. The cover ring is disposed within the annular recess. The top edge ring is disposed above the middle ring between the cover ring and the inner ring portion, and above the N arcuate openings and the N bridges of the middle ring.

[0013] In other features, the moving ring has N upper arcuate portions configured to be aligned with and pass through the N arcuate openings. The top edge ring is placed on the N upper portions. The N upper portions of the moving ring are configured to bias the bottom surface of the top edge ring through the N arcuate openings of the middle ring to raise the top edge ring relative to the cover ring.

[0014] In other features, the first lift pin is configured to selectively raise the moving ring and the top edge ring upward relative to the cover ring and the middle ring. The second lift pin is configured to selectively bias the middle ring, the top edge ring, and the cover ring relative to the moving ring.

[0015] In other features, the top edge ring has a "C"-shaped cross-section forming a downwardly extending inner annular convex portion, a downwardly extending outer annular convex portion, and a recess disposed between the inner annular convex portion and the outer annular convex portion. The N bridges have convex portions extending upwardly toward the lower surface of the top edge ring. The cover ring has an inverted "L"-shaped cross-section.

[0016] In other features, the radially inner side of the cover ring has a radially inner surface and an arcuate surface. The radially inner surface of the cover ring is located radially inner of the radially outer surface of the upper portion of the moving ring. The radially outer surface of the top edge ring is disposed below and radially outer of the radially inner surface of the cover ring. The upper and radially outer edge of the top edge ring has an arc corresponding to the arcuate surface of the cover ring.

[0017] In other features, at least one of the N bridges of the middle ring includes one of a convex portion and a concave portion, and the radially inner edge of the outer annular convex portion of the top edge ring has the other of the concave portion and the convex portion. One of the convex portion and the concave portion in at least one of the N bridges of the middle ring is received within the other of the concave portion and the convex portion on the radially inner edge of the outer annular convex portion of the top edge ring. The stationary ring is configured to be disposed around the substrate support below the middle ring.

[0018] In other features, the stationary ring has a convex portion extending radially inward from the lower portion of the radially inner surface of the stationary ring. The moving ring is disposed above the convex portion of the stationary ring and radially inner of the stationary ring. In other features, the moving ring has a first plurality of convex portions extending radially outward from the moving ring. The bottom surfaces of the first plurality of convex portions have grooves having inclined surfaces extending radially and facing each other.

[0019] In other features, the moving ring has a second plurality of convex portions extending radially outward from the moving ring, and holes extending axially through the second plurality of convex portions. The stationary ring has a first plurality of concave portions. The first plurality of concave portions extend radially inward from the radially inner surface of the stationary ring and are configured to provide clearance for the first plurality of convex portions of the moving ring. The stationary ring has a second plurality of concave portions. The second plurality of concave portions extend radially inward from the radially inner surface of the stationary ring and are configured to provide clearance for the second plurality of convex portions of the moving ring. The bottom edge ring has a first annular rim extending inward from the radially inner surface of the bottom edge ring and an annular body disposed around the stationary ring.

[0020] In other features, the bottom edge ring further has a second annular rim extending upward from the upper surface of the bottom edge ring. The middle ring has an annular groove configured to receive the second annular rim of the bottom edge ring. A gap is formed between the bottom surface of the middle ring and the upper surface of the bottom edge ring. The bottom surface of the first annular rim is placed on the stationary ring. The first annular rim has a first plurality of depressions. The first plurality of depressions extend radially inward to provide clearance for the first plurality of convex portions of the moving ring. The first annular rim has a second plurality of concave portions. The second plurality of concave portions extend radially inward from the radially inner surface of the stationary ring and are configured to provide clearance for the second plurality of convex portions of the moving ring.

[0021] In other features, the middle ring contains quartz. The covering contains quartz. The top edge ring contains silicon carbide. The moving ring has a silicon substrate with an electroplated aluminum outer layer. The stationary ring has a silicon substrate having either a coating containing perfluoroalkoxy alkane (PFA) or an electroplated aluminum outer layer.

[0022] The middle ring for the substrate processing chamber includes an outer ring portion, an inner ring portion, and N bridges connecting the outer ring portion to the inner ring portion, where N is an integer greater than 1, and N arcuate openings each disposed between the N bridges and between the outer ring portion and the inner ring portion.

[0023] In other features, the annular recess is disposed on the upper radial inner surface of the outer ring portion. At least one of the N bridges has one of a convex portion and a concave portion configured to orient the middle ring with respect to another edge ring. One of the convex portion and the concave portion is disposed on the outer radial surface of at least one of the N bridges. The middle ring includes quartz. The G alignment portions are disposed on the bottom surface of the outer ring portion, where G is an integer greater than 2. The G alignment portions have a plane disposed between radially extending opposing inclined surfaces.

[0024] In other features, the G alignment portions are configured to self - center the middle ring on lift pins. Opposing ends of the N arcuate openings are curved. The circumferential side surfaces of the N bridges are curved to form the curved ends of the N arcuate openings. The annular groove is disposed on the bottom surface of the outer ring portion.

[0025] In other features, the G alignment portions are disposed on the bottom surface of the outer ring portion and include a plane disposed between radially outwardly extending opposing inclined surfaces, where G is an integer greater than 2. The annular groove is disposed on the bottom surface of the outer ring portion and is located radially outside the G alignment portions. The middle ring includes quartz.

[0026] The top edge ring for the substrate processing system includes an annular body having a "C" - shaped cross - section. The inner annular convex portion extends downward from the inner radial surface of the annular body. The outer annular convex portion extends downward from the inner radial surface of the annular body. The recess is disposed between the inner annular convex portion and the outer annular convex portion.

[0027] In other features, the top edge ring contains silicon carbide. The convex portion is disposed on one of the radially inner surface of the outer annular convex portion and the radially outer surface of the inner annular convex portion. The convex portion is configured to orient the top edge ring with respect to another edge ring.

[0028] In other features, the convex portion has a semi-circular shape. The concave portion is disposed on one of the radially inner surface of the outer annular convex portion and the radially outer surface of the inner annular convex portion. The concave portion is configured to orient the top edge ring with respect to another edge ring. The concave portion has a semi-circular shape.

[0029] In other features, the top edge ring contains silicon carbide.

[0030] The moving ring for the substrate processing system includes an annular body, N upper portions disposed on the top end of the annular body and having an arcuate shape, N gaps disposed between the N upper portions, P first convex portions disposed on the radially outer surface of the annular body, where P is an integer greater than 2, and P grooves disposed on the bottom surfaces of the P first convex portions, the P grooves being configured to self-center the moving ring when the P self-centering portions are biased by P lift pins.

[0031] In other features, the P first convex portions have a "V" shape. The P grooves have a "V" shape extending radially and having opposing inclined surfaces. R first convex portions are disposed on the outer surface, where R is an integer greater than 2. R holes penetrate through R of the N upper portions and the R first convex portions. The opposing circumferential ends of the N upper portions are curved. The moving ring has a silicon substrate with an electroplated aluminum outer layer.

[0032] The stationary ring for the edge ring system of a substrate processing system includes an annular body, an annular rim extending radially inwards from the lower end of the annular body, P first recesses arranged on the radially inner surface of the annular body, where P is an integer greater than 2, and P holes penetrating the annular rim within the P first recesses.

[0033] In other features, the P first recesses have a curved "V" shape. R second recesses are arranged on the radially inner surface of the annular body, where R is an integer greater than 2. The R second recesses have a curved "V" shape. P = 3, and the P first recesses are spaced apart at 120° intervals.

[0034] The R second recesses are arranged on the radially inner surface of the annular body, where R is an integer greater than 2. The R second recesses are arranged between the P first recesses. P = 3, R = 3, the P first recesses are spaced apart at 120° intervals, the R second recesses are spaced apart at 120° intervals and are equally spaced between the P first recesses. S recesses extend axially within the bottom surface of the annular body, where S is an integer greater than 2. S plugs are arranged within the S recesses. The stationary ring has a silicon substrate with one of a coating containing perfluoroalkoxy alkane (PFA) and an electroplated aluminum outer layer.

[0035] The bottom edge ring for the edge ring system of a substrate processing system includes an annular body, an annular rim extending radially inwards from the upper end of the annular body, and P first depressions arranged on the radially inner edge of the annular rim, where P is an integer greater than 2.

[0036] In other features, the P first depressions are spaced at intervals of 360° / P and have a curved "V" shape. The R second depressions are arranged on the radially inner edge of the annular rim, where R is an integer greater than 2. The R second depressions are spaced at intervals of 360° / R and have a curved "V" shape. P = 3, and the P first depressions are spaced 120° apart. The R second depressions are arranged on the radially inner surface of the annular body, where R is an integer greater than 2. The R second depressions are arranged between the P first depressions. P = 3, R = 3, the P first depressions are spaced 120° apart, the R second depressions are spaced 120° apart and are equally spaced between the P first depressions.

[0037] In other features, S holes extend axially through the annular body, where S is an integer greater than 2. T holes extend axially within the annular body, where T is an integer greater than 2. T plugs are arranged within the T holes.

[0038] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Brief Description of the Drawings

[0039] The present disclosure will be more fully understood from the detailed description and the accompanying drawings.

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Figure 1

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[0072] In the drawings, reference numbers may be reused to refer to similar and / or identical elements.

DETAILED DESCRIPTION OF THE INVENTION

[0073] During substrate processing, the substrate is placed on a pedestal such as an electrostatic chuck (ESC), and a process gas is supplied to generate plasma in the processing chamber. In some examples, an edge ring is placed around the radially outer edge of the substrate to shape the plasma. During operation, the exposed surfaces of the substrate and the edge ring are etched by the plasma. As a result, the edge ring wears, and the effect of the edge ring on the plasma changes, which can adversely affect uniformity. For example, due to wear, the exposed surface of the edge ring may have a different height relative to the substrate. Thus, in some substrate processing systems, worn edge rings are periodically replaced.

[0074] In some embodiments, the edge ring may correspond to a top edge ring in an edge ring system or edge ring assembly. The edge ring system or edge ring assembly further has a bottom ring and / or a middle ring. For example, the edge ring may be supported on the middle ring or the bottom ring. In some embodiments, the edge ring is configured to be transported through the same opening (e.g., a slot valve) as the substrate, both inside and outside the processing chamber. This approach reduces the chamber downtime by eliminating vacuum breaks and potential sources of contamination. In a system having a middle ring, the edge ring may be transported with the middle ring (e.g., using a transfer robot under vacuum) and / or installed on the middle ring within the processing chamber.

[0075] The edge ring can be reliably centered with respect to the substrate by being centered with respect to the middle ring. For example, the accuracy of the process can depend on the concentric relationship between the edge ring and the substrate. In some embodiments, the edge ring and the middle ring are manually centered (e.g., using shims). In embodiments where the edge ring is transported using a transfer robot, accurate centering depends on the installation accuracy by the transfer robot and the manufacturing tolerances of various components and gaps. When the edge ring (e.g., the top edge ring) and the middle ring are transported as a single unit, the edge ring can shift with respect to the middle ring during transportation and installation (e.g., due to vibrations of the robot). Embodiments of the present disclosure reduce / minimize the shift of the edge ring during robot transportation and optimize the centering of the edge ring.

[0076] The self - centering edge ring system and method according to the present disclosure improve the alignment and centering of the edge ring and the middle ring under vacuum. In one embodiment, the outer diameter of the lower surface of the edge ring has a chamfer that contacts the middle ring. In other words, the lower surface of the edge ring is conical. Conversely, the upper surface of the middle ring may have a chamfer that contacts the chamfer of the edge ring (i.e., at least a part of the upper surface of the middle ring may be conical). The chamfered surface maintains the concentricity of the edge ring with respect to the middle ring during transportation and installation. For example, the downward force of the chamfer of the edge ring with respect to the middle ring mechanically resists displacement caused by vibrations and other lateral forces.

[0077] When the edge ring and the middle ring are lowered onto the substrate support, the edge ring may be supported on another ring (e.g., an inner ring or a bottom ring) and does not contact the middle ring. After installation, the edge ring and the middle ring may be raised and lowered separately. In some embodiments, the edge ring may be periodically re-centered by bringing the middle ring into contact with the edge ring by raising the middle ring (or lowering the edge ring). The complementary conical surfaces of the middle ring and the edge ring, and the upward force of the raised middle ring, push the edge ring into a concentric position centered with respect to the middle ring.

[0078] By aligning the edge ring with respect to the middle ring in such a manner, the edge ring is centered with respect to the substrate support and thus centered with respect to the substrate disposed on the substrate support. For example, by using complementary conical surfaces to align the edge ring with respect to the middle ring, a substantially concentric relationship is provided between the edge ring and the middle ring, as well as between the edge ring and the substrate.

[0079] Referring now to FIG. 1, an example of a substrate processing system 100 that performs plasma processing and has an exchangeable edge ring system according to a particular embodiment of the present disclosure is shown. The substrate processing system 100 includes a coil drive circuit 104. In some examples, the coil drive circuit 104 includes an RF source 108, a pulse circuit 112, and a tuning circuit 114. The pulse circuit 112 controls the TCP envelope of the RF signal during operation and changes the duty cycle of the TCP envelope (e.g., between 1% and 99%). As can be appreciated, the pulse circuit 112 and the RF source 108 can be coupled or separated.

[0080] The tuning circuit 114 may be directly connected to one or more induction coils 116. The tuning circuit 114 adjusts the output of the RF source 108 to a desired frequency and / or a desired phase, matches the impedance of the induction coil 116, and / or divides power among the induction coils 116. Although an example with multiple coils is shown, a single coil with a single conductor or multiple conductors can be used.

[0081] The dielectric window 120 is disposed along one side of the processing chamber 122. The processing chamber 122 further includes a substrate support (or pedestal) 124 for supporting the substrate 128. The substrate support 124 may include an electrostatic chuck (ESC), a mechanical chuck, or other types of chucks. A process gas is supplied to the processing chamber 122, and a plasma 132 is generated within the processing chamber 122. Ion energy may be controlled by supplying an RF bias to the substrate support 124 during operation using an RF bias drive circuit 136. The RF bias drive circuit 136 may include an RF source and an impedance matching circuit (not shown).

[0082] In some embodiments, a plenum 140 is disposed adjacent to the dielectric window 120 (e.g., above as shown). A gas delivery system 144 may be used to deliver gas from a gas source 146 through a valve 148 to the plenum 140. The gas may include a cooling gas (air) used to cool the induction coils 116 and the dielectric window 120.

[0083] A gas delivery system 156 may be used to supply a process gas mixture to the processing chamber 122. The gas delivery system 156 may include a gas source 158 (e.g., a precursor, a vapor, one or more other gases, an inert gas), a gas metering system 160 (e.g., valves and mass flow controllers), and a manifold 162. A gas injector (not shown) may be disposed at the center (or other location) of the dielectric window 120 and is used to inject the gas mixture into the processing chamber 122 from the gas delivery system 156.

[0084] The substrate support 124 may be heated / cooled to a predetermined temperature using the heater / cooler 164. The exhaust system 166 controls the pressure within the processing chamber 122 and / or removes reactants from the processing chamber 122 by purge or evacuation by having a valve 168 and a pump 170.

[0085] The process may be controlled using the system controller 172. The system controller 172 monitors system parameters and controls the delivery of the gas mixture, the generation, maintenance, and extinction of the plasma, the removal of reactants, the supply of the cooling gas, etc.

[0086] The substrate support 124 may include an edge ring assembly or an edge ring system having a top edge ring 174. As shown, the top edge ring 174 is disposed above the middle ring 176 and the bottom ring 178. As will be described in more detail below, the outer diameter of the lower surface of the top edge ring 174 may have a chamfer that contacts the middle ring 176 during transfer. Correspondingly, the upper surface of the middle ring may have a chamfer that contacts the chamfer of the edge ring during transfer. The chamfered surface maintains the concentricity of the top edge ring 174 with respect to the middle ring 176 during transfer and installation.

[0087] For example, system controller 172 delivers the substrate and / or edge ring to process chamber 122 by controlling robot 180. System controller 172 also selectively raises and lowers top edge ring 174 and / or middle ring 176 by controlling one or more actuators 182 that move lift pins (not shown in FIG. 1), thereby facilitating the loading and unloading of top edge ring 174 relative to substrate support 124. When top edge ring 174 and middle ring 176 are lowered onto substrate support 124, top edge ring 174 may be supported on bottom ring 178 and not contact middle ring 176. In other words, the lowering of top edge ring 174 and middle ring 176 causes bottom ring 178 to contact top edge ring 174 and top edge ring 174 to move away from middle ring 176. Although shown as a single ring, in some embodiments, bottom ring 178 may include two or more concentric rings, such as an outer bottom ring (e.g., a stationary ring configured to support middle ring 176), and an inner ring (e.g., a moving or lift ring configured to raise and lower top edge ring 174).

[0088] System controller 172 may also receive an output from one or more sensors 184 used to detect the height of the edge ring. Non-limiting examples of sensors include optical sensors, physical sensors, piezoelectric sensors, ultrasonic sensors, and the like.

[0089] Cross-sectional views of an edge ring system 200 having an edge ring 204 and a middle ring 208 are shown in FIGS. 2A, 2B, and 2C, and an isometric view of the middle ring 208 is shown in FIG. 2D. A plan view of the middle ring 208 is shown in FIG. 2E. A plan view of the moving ring 232 is shown in FIG. 2F. Isometric views of the bottom of the edge ring 204 are shown in FIGS. 2G and 2H. As shown in FIGS. 2A and 2B, the edge ring 204 is supported on the middle ring 208 during conveyance (i.e., during conveyance to the substrate support 124 and before installation on the bottom ring 212).

[0090] The outer diameter of the lower surface 216 of the edge ring 204 has a chamfer 218 (i.e., a surface chamfered to face downward and outward). The chamfer 218 contacts the middle ring 208 during conveyance and is supported on the middle ring 208. In other words, the lower surface 216 of the edge ring 204 is conical. The inner diameter of the outer ring portion 220 of the middle ring 208 may have a complementary chamfer 222 (i.e., a surface chamfered to face upward and inward). The chamfer 222 contacts the chamfer 218 of the edge ring 204 (i.e., at least a part of the upper surface of the middle ring 208 may be conical). In other words, the inner diameter of the outer ring portion 220 has a chamfered angle (or inclined surface) located between the upper surface of the bridge 228 and the inner diameter surface of the outer ring portion 220. In some embodiments, the chamfer 222 may be larger than the angle so that the inclination can extend from the upper surface of the bridge 228 to the upper surface of the outer ring portion 220. The chamfers 218 and 222 maintain the concentricity of the edge ring 204 with respect to the middle ring 208 during conveyance and installation.

[0091] As shown in FIGS. 2D and 2E, the middle ring 208 has an outer ring portion 220 and an inner ring portion 224. The inner ring portion 224 is connected to the outer ring portion 220 via two or more bridges 228. FIG. 2A is a cross-sectional view taken at one location of one of the bridges 228. In contrast, FIG. 2B is a cross-sectional view taken at one location of a plurality of gaps 230 between the bridges 228. As shown, the edge ring 204 does not contact the bridge 228 during conveyance.

[0092] In FIG. 2D, only two of the bridges 228 are visible, but the middle ring 208 may include any number of bridges. In some embodiments, the middle ring 208 has six or more bridges 228. In some embodiments, each bridge has a width of about 8-12 mm. The width of the bridge 228 may vary depending on the number of bridges. As the number of bridges 228 increases, the width of the bridge 228 may decrease, and vice versa. In this way, the overall area of the gap 230 may be maintained at a desired value. For example, the edge ring 204 is lifted by the moving ring 232 during processing and is supported on the moving ring 232. In some embodiments, all of the bridges 228 have the same width (or substantially the same width). In some embodiments, a subset of the bridges 228 has a different width from another subset of the bridges 228. One subset of the bridges may include one or more bridges.

[0093] A plan view of the moving ring 232 is shown in FIG. 2F. The raised portion 234 of the moving ring 232 extends through the gap 230 so as to contact the edge ring 204. For example, the upper surface of the moving ring 232 has a plurality of raised portions 234 alternating with slots or grooves 236. FIGS. 2A-2C are cross-sectional views taken at one location of one of the raised portions 234 with the moving ring in the lowered position (FIGS. 2A and 2B) and the raised position (FIG. 2C), so the grooves 236 are not visible in FIGS. 2A-2C.

[0094] Accordingly, the edge ring 204 is capacitively coupled to the moving ring 232. Since the size of the gap 230 determines the contact surface area between the edge ring 204 and the moving ring 232, the width of the bridge 228 and the size of the corresponding gap 230 are selected such that the capacitive coupling between the edge ring 204 and the moving ring 232 is maximized. In other words, as the overall area of the bridge 228 increases, the overall area of the raised portion 234 decreases, and the overall contact surface area between the raised portion 234 and the bottom surface of the edge ring 204 decreases.

[0095] Conversely, as the overall area of the bridge 228 decreases, the overall area of the raised portion 234 increases, and the overall contact surface area between the raised portion 234 and the bottom surface of the edge ring 204 increases. However, as the overall area (and respective width) of the bridge 228 decreases, the mechanical stability, strength, etc. of the bridge 228 decrease. Accordingly, the overall area and respective width of the bridge 228 are selected to maintain the mechanical strength of the bridge 228 during the life of the edge ring system 200 while maximizing the capacitive coupling with the moving ring 232.

[0096] In some embodiments, the contact area of the moving ring 232 (i.e., the overall area of the raised portion 234) contacts approximately 72 - 76% of the bottom surface of the edge ring 204. In some embodiments, the contact area is approximately 74 - 75% of the bottom surface of the edge ring 204. Conversely, the portion of the bottom surface of the edge ring 204 that does not contact the raised portion 234 overlaps with the bridge 228. In some embodiments, approximately 24 - 28% of the edge ring 204 overlaps with the bridge 228. In some embodiments, the surface area of the edge ring 204 that overlaps with the bridge is approximately 25 - 26%. In these embodiments, the range ratio of the contact / overlap area allows for a sufficient bridge surface area for stable robotic conveyance while maximizing the surface contact area of the bottom surface of the edge ring 204 for coupling strength.

[0097] In some embodiments, the robotic transport module is configured to contact a portion of the bridge 228 when transporting the edge ring assembly (having the edge ring 204 and the middle ring 208). In some embodiments, the middle ring is configured to have fewer bridges (less than six but more than two bridges as shown in FIG. 2E), thereby increasing the contact surface percentage between the moving ring 232 and the bottom surface of the edge ring 204 to exceed 76%. However, regardless of the number of bridges, the bridges are designed to be mechanically stable and support the inner and outer portions of the middle ring at the end of the life cycle.

[0098] In one embodiment, one or more tabs or protrusions 238 may extend radially outward from the outer periphery of the moving ring 232. The protrusions 238 are aligned with corresponding lift pins (not shown in FIGS. 2A - 2F) that extend upward outside the outer periphery of the moving ring 232. In this way, the lift pins raise and lower the moving ring 232, and as a result, raise and lower the edge ring 204.

[0099] As shown in FIGS. 2A - 2C, the inner ring portion 224 has a generally "L" - shaped cross - section. For example, the inner ring portion 224 has a ledge 240 that extends radially outward toward the outer ring portion 220. Conversely, the inner diameter of the lower surface 216 of the edge ring 204 has a rim 242 that extends downward toward the ledge 240. During transportation, the rim 242 may contact the ledge 240. In other words, the edge ring 204 may be at least partially supported on the inner ring portion 224 during transportation. The edge ring 204 as shown is fully supported within the inner and outer diameter ranges of the middle ring 208. In an embodiment, the edge ring 204 is partially supported on the ledge 240, on the middle ring 208 (e.g., on the chamfer 222), or on both the ledge 240 and the middle ring 208. In one embodiment, the edge ring 204 is supported only on the ledge 240.

[0100] In some embodiments, one or both of the chamfers 218 and 222 may be omitted. For example, the inner ring portion 224 and the rim 242 may be configured to provide centering functionality. In other words, as shown, the engagement between the inner ring portion 224 and the rim 242 prevents lateral movement of the edge ring 204 relative to the middle ring 208. Further, in the raised position shown in FIG. 2C, the rim 242 extends downwardly below the plane defined by the upper end of the inner ring portion 224. In other words, the interface 244 between the edge ring 204 and the inner ring portion 224, the bridge 228, and the moving ring 232 forms a serpentine path. Thus, a direct line of sight between the plasma volume above the edge ring system 200 and the lower surface of the rim 242, the ledge 240, the bridge 228, and the inner diameter of the moving ring 232 is blocked. In addition to preventing portions of the middle ring 208 and the moving ring 232 from being directly exposed to the processing environment, the rim 242 also improves capacitive coupling between the edge ring 204 and the moving ring 232.

[0101] In an embodiment, the thickness or height H1 of the edge ring 204 at the inner diameter (i.e., the position corresponding to the rim 242) is between 3.0 and 4.0 mm. In one embodiment, the height H1 is approximately (e.g., within + / - 5%) 3.5 mm. The thickness or height H2 of the edge ring 204 at a position radially outside the rim 242 is between 2.0 and 2.5 mm. In one embodiment, the height H2 is approximately (e.g., within + / - 5%) 2.2 mm. In one embodiment, H2 is approximately (e.g., within + / - 5%) 62% of H1. The maximum thickness or height H3 of the middle ring is between 7.0 and 8.0 mm. In one embodiment, the height H3 is approximately (e.g., within + / - 5%) 7.5 mm and is greater than twice H1. In one embodiment, the height H3 is approximately (e.g., within + / - 5%) 210% of H1.

[0102] In some embodiments, the middle ring 208 and / or the bottom ring 212 have one or more centering or alignment features. As shown, an annular groove 250 is formed in the lower surface of the middle ring 208, and an annular rim 252 extends upwardly from the upper surface of the bottom ring 212. The annular groove 250 is configured to receive the annular rim 252 when the middle ring 208 is lowered onto the bottom ring 212. The annular groove 250 and the annular rim 252 prevent a direct line of sight by forming a meandering path between the middle ring 208 and the bottom ring 212. In this way, plasma and other process materials are prevented from passing between the middle ring 208 and the bottom ring 212.

[0103] In some embodiments, the outer diameter of the middle ring 208 has a protrusion 254 that extends radially outwardly from the middle ring 208. The protrusion 254 is configured to extend above one or more other structures of the processing chamber (e.g., the upper end of a chamber liner not shown) to protect the structure from erosion caused by exposure to plasma.

[0104] In one embodiment, the bottom ring 212 is configured to surround the moving ring 232 and, as a result, surround the ESC (e.g., the substrate support 124). The moving ring 232 may be supported on the substrate support 124. In one embodiment, the raised portions 234 on the upper surface of the moving ring 232 are aligned with the gaps 230 between the bridges 228 of the middle ring 208. Conversely, the grooves 236 between the raised portions 234 are aligned with the bridges 228. Thus, when the moving ring 232 is raised, the raised portions 234 pass through the gaps 230 and contact the edge ring 204. In this way, when the edge ring 204 is centered, the edge ring 204 is supported within the inner and outer diameter ranges of the middle ring 208 and is also movable (i.e., configured to be raised and lowered) by the moving ring 232 located below the middle ring 208.

[0105] Further, when the edge ring 204 is in the raised position (as shown in FIG. 2C) during processing, the edge ring 204 may be periodically re-centered (e.g., during a process or processing step) by lowering the moving ring portion 232-1 to bring the chamfer 218 into contact with the chamfer 222. In some embodiments, alternatively, the middle ring 208 may be raised to bring the chamfer 222 into contact with the chamfer 218. In either example, the contact between the chamfer 218 and the chamfer 222 (and / or between the ledge 240 and the rim 242) forces the edge ring 204 into a centered and concentric position relative to the middle ring 208.

[0106] FIGS. 3A and 3B show a first cross-sectional view and a second cross-sectional view of an edge ring system 300 having an edge ring 304, a middle ring 308, a bottom ring 312, and a moving ring assembly 316. The moving ring assembly 316 has a moving ring portion 316-1 and a stationary ring portion 316-2 (collectively referred to as the moving ring assembly 316). The stationary ring portion 316-2 is supported on the outer ring portion of the ESC 320. The lift pin 324 shown in FIG. 3A extends through the ESC 320 and engages the moving ring portion 316-1. FIG. 3A is a cross-sectional view of the edge ring system 300 taken at the location of the lift pin 324. For example, the lift pin 324 engages a protrusion 326 that extends radially outward from the outer periphery of the moving ring portion 316-1. Thus, the moving ring portion 316-1 is raised and lowered by the raising and lowering of the lift pin 324.

[0107] For example, a controller (e.g., system controller 172) is configured to raise and lower the lift pin 324 by controlling an actuator, thereby raising and lowering the moving ring portion 316-1, and as a result, raising and lowering the edge ring 304. By raising the moving ring portion 316-1 during processing, the edge ring 304 may be raised to a desired height. In some embodiments, the position of the edge ring 304 can be adjusted during processing, such as between processing steps, to finely tune the processing performance. Conversely, the moving ring portion 316-1 can be lowered to lower the edge ring 304 and recenter it as described above, or to place the edge ring 304 on the middle ring 308 for conveyance or the like.

[0108] Similarly, the lift pin 328 shown in FIG. 3B (e.g., a cross-sectional view taken at the location of the lift pin 328) extends through the bottom ring 312 and engages the middle ring 308. FIG. 3B is a cross-sectional view of the edge ring system 300 taken at the location of the lift pin 328. The system controller 172 is configured to raise and lower the middle ring 308 by controlling an actuator to raise and lower the lift pin 328. For example, the middle ring 308 may be raised together with the edge ring 304 to facilitate movement of the middle ring 308 and the edge ring 304 by a robot.

[0109] Referring now to FIGS. 4A and 4B, the edge ring system 400 is disposed around a substrate support having a base plate 410 and a top plate 412. The substrate 414 is disposed on the top plate 412 during processing. The stationary ring 420 is disposed radially outside the base plate 410 and is disposed on and above a lower convex portion 413 that extends radially outside the base plate 410. The stationary ring 420 has an annular body and a radially inward convex portion 424.

[0110] The bottom edge ring 430 has an annular body that is disposed radially outside the stationary ring 420 and extends below the stationary ring 420. The bottom edge ring 430 has a radially inward annular rim 432 that extends from the upper surface of the annular body of the bottom edge ring 430. The bottom edge ring 430 has an annular rim 434 that extends upwardly from the upper surface of the annular body of the bottom edge ring 430. In some examples, the stationary ring 420 is disposed around the base plate 410 prior to the attachment of the bottom edge ring 430. The lower surface of the radially inward annular rim 432 is placed on and contacts the upper surface of the stationary ring 420 during attachment.

[0111] The middle ring 440 has an annular body having an outer ring portion 442 and an inner ring portion 444. The bottom surface of the outer ring portion 442 has an annular groove 446 configured to receive and couple with the annular rim 434. The annular groove 446 and the annular rim 434 form a meandering path. The meandering path reduces arcing by preventing a direct line of sight between the plasma and the conductive components of the base plate. The meandering path can also reduce the ingress of particles that occur when arcing occurs.

[0112] In some examples, the annular recess 449 is located below and radially outside the lower side of the middle ring 440. The radially outer edge 441 of the middle ring 440 extends above the radially outer edge 433 of the bottom edge ring 430. The overlap provided by the radially outer edge 441 reduces the erosion of the bottom edge ring 430, and as a result, reduces the generation of particles and the wear of the bottom edge ring. The annular recess 449 allows clearance for other equipment located radially outside the middle ring 440 and the bottom edge ring 430 within the processing chamber by reducing the vertical height of the middle ring 440.

[0113] The outer ring portion 442 receives the covering 470 as further described below by forming an annular recess 447 on its upper and radially inner surface. The outer ring portion 442 has a radially projecting portion 448. The radially projecting portion 448 extends radially inwards and is connected to the inner ring portion 444 by a bridge as further described below. In some examples, the inner ring portion 442 has an "L"-shaped cross-section.

[0114] The top edge ring 450 is disposed above the moving ring 460. In some examples, the top edge ring 450 includes an annular body and has a "C"-shaped cross-section. The top edge ring 450 forms a recess 456 on its bottom surface between the outer annular projection 452 and the inner annular projection 454. The outer annular projection 452 and the inner annular projection 454 extend axially or downwardly towards the moving ring 460. At this radial position, the moving ring 460 has a "T"-shaped cross-section. The moving ring 460 includes one or more (N) upper arcuate portions 462 and a lower annular portion 464, where N is an integer greater than zero. The N upper portions 462 are located between the inner ring portion 444 of the middle ring 440 and the radially projecting portion 448 of the middle ring 440, and below and / or inside the recess 456 of the top edge ring 450.

[0115] Covering 470 is disposed above the radial protrusion 448 of the middle ring 440 and between the top edge ring 450 and the radial inner surface of the outer ring portion 442 of the middle ring (e.g., within the annular recess 447 of the middle ring 440). In some examples, covering 470 has an inverted "L" shaped cross-section. In some examples, the radial inner surface 472 of covering 470 is located along the same vertical plane as (in top view) the radial outer edge of the N upper portions 462 of the moving ring or radially inside the radial outer edge of the N upper portions 462 of the moving ring, thereby preventing a direct line of sight to the plasma. The arcuate surface 476 is disposed below the radial inner surface 472 of covering 470. In some examples, the arcuate surface 458 on the upper and radial outer surface of the top edge ring 450 has a curvature similar to the arcuate surface 458 of the top edge ring 450. Thereby, the top edge ring 450 can move upward relative to the covering 470 below the radial inner surface 472. In some examples, the arcuate surface 476 reduces or eliminates the possibility of arching between the arcuate surface 458 and the covering 470.

[0116] In FIG. 4A, the top edge ring 450 and the moving ring 460 are shown in the lowered position. In FIG. 4B, the top edge ring 450 and the moving ring 460 are shown in the raised position. The arcuate surface 458 of the top edge ring 450 is fitted into the arcuate surface 476 of the covering 470.

[0117] In some examples, the bottom surface of the stationary ring 420 is placed on the lower protrusion 413 of the base plate 410. The bottom surface of the radially inward annular rim 432 of the bottom edge ring 430 is placed on the upper surface of the stationary ring 420. A gap is formed between the bottom surface of the middle ring 440 and the upper surface of the bottom edge ring 430. The bottom surface of the top edge ring 450 is placed on the N upper portions 462 of the moving ring 460. The top edge ring 450 is spaced apart from the middle ring 440. The bottom surface of the inner ring portion 444 is placed on the top plate 412.

[0118] Referring now to FIGS. 5A and 5B, the edge ring system 400 is shown in another radial cross-section. The bottom edge ring 430 has a hole 510 extending vertically through the annular body of the bottom edge ring 430 and a lift pin 512 disposed within the hole 510. The bottom surface of the outer ring portion 442 of the middle ring 440 has an alignment portion 518 that is aligned with the lift pin 512. In some embodiments, the alignment portion 518 is within the bottom surface of the middle ring 440 and radially inward of the annular groove 446. In some examples, the alignment portion 518 self-centers the middle ring 440 by having a plane 521 between radially extending opposing inclined surfaces 519.

[0119] In FIG. 5B, an actuator (not shown) raises the middle ring 440, the top edge ring 450, and the cover ring 470 by selectively biasing the lift pin 512 into the alignment portion 518, enabling delivery or replacement of the middle ring 440, the top edge ring 450, and the cover ring 470. By using a robot, the middle ring 440, the top edge ring 450, and the cover ring 470 can be moved in and out of the processing chamber without opening the processing chamber. The robot arm may lift all three rings from the bottom surface of the middle ring 440 and transport all three rings (in and out) at once. The stacking relationship shown in FIG. 5B prevents excessive lateral movement of the top edge ring 450 and the cover ring 470 that could cause the rings to drop during transport. This configuration reduces the time required to replace this ring assembly (e.g., compared to transporting each ring one at a time) and enables proper alignment of all three rings upon installation. In some examples, the middle ring 440, the top edge ring 450, and the cover ring 470 have a durability time exceeding 500 RF hours between successive replacements. In some examples, the middle ring 440, the top edge ring 450, and the cover ring 470 have a durability time exceeding 1000 RF hours between successive replacements.

[0120] Referring now to FIGS. 6A and 6B, edge ring system 400 is shown in another radial cross-section. In FIG. 6A, one of the N bridges 480 of middle ring 440 is shown. Middle ring 440 has N bridges 480 that extend between outer ring portion 442 and inner ring portion 444. The N bridges 480 have axial protrusions 482 that extend axially upward from the N bridges 480. In some examples, axial protrusion 482 is received within recess 456 of top edge ring 450 to facilitate alignment between top edge ring 450 and middle ring 440. Gap 483 is formed between the upper surface of axial protrusion 482 and the bottom surface of top edge ring 450. Gap 483 ensures that top edge ring 450 is placed on the N upper portions 462 of moving ring 460. Thereby, an electrical contact is surely present between the bottom surface of top edge ring 450 and the upper surfaces of the N upper portions 462 of moving ring 460. In some examples, moving ring 460 is formed of quartz and is non-conductive. Axial protrusion 482 reduces the stray plasma by filling the open space within this region.

[0121] In FIG. 6B, moving ring 460 includes a gap (shown below in FIGS. 10A and 10B) between the N upper portions 462 and does not include any of the N upper portions 462. Moving ring 460 biases top edge ring 450 vertically up and down. The lower annular portion 464 of moving ring 460 moves towards the N bridges 480 to reduce the gap. In some embodiments, some or all of the N bridges 480 do not include axial protrusions 482.

[0122] Referring now to FIGS. 7A and 7B, edge ring system 400 is shown in another radial cross-section. Moving ring 460 has a protrusion 550 that extends radially outward. A self-centering feature (e.g., groove 560) is disposed on the lower surface of protrusion 550. In some examples, groove 560 enables self-alignment of moving ring 460 by extending radially. Radially outward protrusion 413 of base plate 410 forms a vertical hole 574, and radially inward protrusion 424 of stationary ring 420 forms a hole 576 to receive lift pin 572. In this radial cross-section, as further described below, stationary ring 420 receives protrusion 550 of moving ring 460 by forming a recess. In FIG. 7B, lift pin 572 is biased into groove 560 by an actuator (not shown) to lift and / or center moving ring 460 and top edge ring 450.

[0123] Referring now to FIGS. 8A and 8B, middle ring 440 is shown in more detail. FIG. 8A shows a top view of middle ring 440 without the other rings. Outer ring portion 442 of middle ring 440 is connected to inner ring portion 444 by N bridges 480. In some examples, one or more of the N bridges 480 form a protrusion 616 (or slot 617 of FIG. 9C). Protrusion 616 (or slot 617 of FIG. 9C) extends radially outward (inward) from the radial outer side of one or more of the N bridges 480. In some examples, protrusion 616 and / or slot 617 are mating surfaces such as semi-circular or curved triangular convex and concave surfaces.

[0124] In some examples, only one of the N bridges 480 has the protrusion 616 or slot 617. When assembled with other rings, the top edge ring 450 and the cover ring 470 are disposed between the outer ring portion 442 and the inner ring portion 444 of the middle ring 440. FIG. 8B shows a bottom view of the middle ring 440. In FIG. 8B, the bottom surface of the middle ring 440 has one or more grooves 630 for receiving one or more lift pins (such as lift pin 512 in FIG. 5B). The one or more grooves 630 are located radially inward of the annular groove 446. In some examples, the groove 630 is a "V"-shaped groove and self-centers the middle ring 440 by having radially aligned opposing included surfaces.

[0125] Referring now to FIGS. 9A-9D, the top edge ring 450 is angularly or circumferentially positioned relative to the middle ring 440 during processing. In FIG. 9B, the bottom surface of the top edge ring 450 has a slot 650 (or protrusion 651 in FIG. 9D) that extends radially outward (inward) on the radially inner edge of the outer annular protrusion 452. In FIG. 9A, the protrusion 616 (or slot 617 in FIG. 9C) on the top surface of the middle ring 440 is received in the slot 650 (or protrusion 651) on the bottom surface of the top edge ring 450 to properly orient the rotational direction position of the top edge ring 450 relative to the middle ring 440. The top edge ring 450 is also angularly positioned relative to a ring identification mark 653 such as a QR code (registered trademark), radio frequency identification (RFID) code, bar code, etc. By controlling the rotational direction position of the top edge ring 450 relative to the ring identification mark 653, consistent thickness measurements are ensured at the same position around the top edge ring 450 relative to the processing chamber, enabling consistent metrics and / or diagnostics of process issues.

[0126] In FIG. 9A, the middle ring 440 has N arcuate openings 610 for receiving N upper portions 462 of the moving ring 460, as can be seen in FIGS. 10A and 10B below. In some examples, N is 6 and / or the N arcuate openings have curved ends. The curved ends 463 of the N arcuate openings 610 reduce the likelihood of interference as the N upper portions 462 of the moving ring 460 move up and down relative to the middle ring 440.

[0127] In FIG. 9E, the top edge ring 450 and the middle ring 440 are shown in a radial cross-section at a position away from the slot 650 on the top edge ring 450 and the protrusion 616 on the middle ring 440. FIG. 9F shows a radial cross-section through the protrusion 616 on the middle ring 440 and the slot 650 on the top edge ring 450. The combined width of the axial protrusion 482 and the protrusion 616 forms a larger local radial width by the protrusion 616. The top edge ring 450 forms a locally smaller radial width by the slot 650.

[0128] As can be appreciated, the middle ring 440 may include slots and the top edge ring 450 may include protrusions. The slot 650 is disposed on the radially inner surface of the outer annular protrusion 452 of the top edge ring 450, but the slot (or protrusion) may be disposed on the radially outer surface of the inner annular protrusion 454. Similarly, the protrusion (or slot) is shown on the radially outer edge of the N bridges 480, but the protrusion may be disposed on the radially inner edge of the N bridges 480.

[0129] Referring now to FIGS. 10A and 10B, the movable ring 460 is shown in more detail. In some examples, the movable ring 460 includes a plurality of protrusions 550 spaced apart from each other, and the number of the protrusions 550 can be represented by "P", where P is an integer greater than 2. In some examples, as shown in FIG. 10A, the protrusions 550 (e.g., P = 3) (and the grooves 560) are spaced at an angle of P / 360° (e.g., 120°). Thereby, when the movable ring 460 is biased by the lift pins 572 to adjust the height of the top edge ring 450 during operation (as shown in FIG. 7B), the movable ring 460 is self-centered and / or the weight of the movable ring 460 is uniformly supported. Similarly, the protrusions 670 (and the holes 672) are spaced at an angle of P / 360° (P is the number of the protrusions 670), so as to uniformly support the movable ring 460 on the rack during coating.

[0130] In some examples, the protrusions 550 have a "V"-shaped cross-section extending from the radially outer side of the movable ring 460. The grooves 560 are disposed on the bottom surfaces of the protrusions 550. In some examples, the grooves 560 have a "V" shape having opposing inclined surfaces aligned radially.

[0131] The grooves 560 on the protrusions 550 enable the movable ring 460 to be self-centered when the movable ring 460 is vertically moved by the lift pins 572. By this self-centering function, when the movable ring 460 and the top edge ring 450 are moved, the movable ring 460 and the top edge ring 450 are reliably centered with respect to the base plate 410 and the substrate 414. In some examples, the movable ring 460 is self-centered by repeatedly raising and lowering the lift pins 572. In some examples, the N upper portions 462 are arcuate with curved ends. The curved ends of the N upper portions 462 reduce the interference with the movement with respect to the middle ring 440 that may occur when the movable ring 460 is raised and lowered. The gap 656 is located between adjacent upper portions 462 of the N upper portions 462 of the movable ring 460.

[0132] In some examples, the radially outer surface of the moving ring 460 has a protrusion 670 and a hole 672. The hole 672 extends through the protrusion 670 from the upper surface of the moving ring 460 (e.g., on a part of one of the N upper portions 462) to the bottom surface of the moving ring 460. In some examples, the hole 672 is used to mount the moving ring 460 on a rack during coating of the moving ring 460 during manufacturing and prior to use. In other words, the hole 672 receives a pin or another type of fastener for positioning and holding the moving ring 460 on the rack during coating of the moving ring 460, and minimizes the outer surface area of the moving ring 460 that would otherwise be obstructed during coating in the absence of the hole 672. In some examples, after the coating of the moving ring 460 is complete, the hole 672 is plugged with a plug (shown in FIG. 10F). In some embodiments, the moving ring 460 does not have the hole 672, and the coating can be performed using conventional methods.

[0133] In some examples, the additional material used for the protrusion 550 and the protrusion 670 increases the structural strength of the ring to withstand lifting weights, thermal cycles, and / or breakage during mounting or use, as compared to the moving ring 460 without the protrusion 550 and the protrusion 670.

[0134] Referring now to FIGS. 10C-10F, cross-sectional views are shown of the moving ring 460 cut along various cross-sections shown in FIG. 10A. In FIG. 10C, the moving ring 460 is shown along the cross-section line 10C-10C of FIG. 10A. At this location, the moving ring 460 has a "T" shaped cross-section having one of the N upper portions 462 and an annular portion 464 extending from that one of the N upper portions 462.

[0135] In FIG. 10D, the moving ring 460 is shown along the cross-section line 10D-10D of FIG. 10A. In this cross-section, the moving ring 460 has an "I" shaped cross-section having the annular portion 464.

[0136] In FIG. 10E, the moving ring 460 is shown along the section line 10E-10E of FIG. 10A. In this section, the moving ring 460 has one of the N upper portions 462, an annular portion 464 extending from that one of the N upper portions 462, and a convex portion 550 extending radially outward from the annular portion 464. The bottom-facing portion 465 in the convex portion 550 forms a groove 560 extending radially and having opposing inclined surfaces.

[0137] In FIG. 10F, the moving ring 460 is shown along the section line 10F-10F of FIG. 10A. The moving ring 460 has one of the N upper portions 462 and an annular portion 464 extending from that one of the N upper portions 462. The convex portion 670 extends radially outward from the annular portion 464. The hole 672 extends through the moving ring 460 and is used to position the moving ring 460 on the rack during coating. In some examples, the first fastener 675 and the second fastener 677 are disposed within the hole 672. The ends of the first fastener 675 and the ends of the second fastener 677 each have mating threaded ends 679 and 681 that connect the first fastener 675 and the second fastener 677 within the hole 672. The upper radially outer portion of the head 683 of the first fastener 675 is shown including an annular recess 685, thereby receiving an "O" ring 679 to prevent arcing and / or particle intrusion.

[0138] Referring now to FIG. 10G, a top perspective view of an example of an adjacent pair of the N upper portions 462 of the moving ring 460 is shown. In some examples, the circumferentially opposing ends 490 of the N upper portions 462 are curved, thereby reducing the likelihood of interference as the moving ring 460 is raised and lowered and the N upper portions 462 pass through the N arcuate openings 610 in the middle ring 440. In some examples, chamfering the edges 492 of the N upper portions 462 of the moving ring 460 and the edges 494 of the gap 656 reduces the likelihood of interference.

[0139] Referring now to FIG. 10H, a bottom perspective view of an example of the moving ring 460 at the convex portion 550 is shown. In some examples, the groove 560 has a "V" shape and extends radially across the bottom surface 561 of the moving ring 460 to have opposing inclined surfaces 563, thereby assisting in self-centering when the moving ring 460 is raised and lowered. In some examples, the edge 565 is chamfered, thereby reducing the possibility of movement being hindered.

[0140] Referring now to FIGS. 11A and 11B, the stationary ring 420 has a first recess 710 configured to provide clearance for the convex portion 550 of the moving ring 460. In some examples, the stationary ring 420 also has a second recess 720 configured to provide clearance for the convex portion 670 of the moving ring 460. In some examples, the first recess 710 and the second recess 720 have a "V" shape. In some examples, the second recess 720 is spaced at 120° intervals and is located generally centrally between two of the first recesses 710. The first recess 710 and the second recess 720 are each spaced at 120° intervals in accordance with the spacing of the convex portions 550 and 670 of the moving ring 460 and to provide clearance for the convex portions 550 and 670. The moving ring 460 moves axially when the top edge ring 450 is biased. In some examples, there are three of the first recesses 710 and three of the second recesses 720, and at least one of the three first recesses 710 is located at about 60° from one of the three second recesses 720. In an example, each of the three first recesses 710 is about 60° away from one of the three second recesses 720. By evenly dispersing the first recess 710 and / or the second recess 720 around the circumference, the weight distribution of the ring is also improved.

[0141] In some examples, the stationary ring 420 further has one or more holes 680 that extend axially from the bottom surface of the stationary ring 420 into the annular body. The one or more holes 680 can be used to position the stationary ring 420 on a rack during coating of the stationary ring 420.

[0142] Referring now to FIGS. 11C to 11F, cross-sectional views of examples of the stationary ring 420 cut along various cross-sections shown in FIGS. 11A and 11B are shown. In FIG. 11A, the stationary ring 420 is shown along the cross-section line 11C-11C of FIG. 11A. The stationary ring 420 has an annular body 421 and a radially inwardly protruding portion 424. The radially inwardly protruding portion 424 extends from the side surface 721 of the annular body 421 at the lower edge of the annular body 421.

[0143] In FIG. 11D, the stationary ring 420 is shown along the cross-section line 11D-11D of FIG. 11A. The stationary ring 420 has an annular body 421 that is thinner in the radial direction than the cross-section of FIG. 11C due to the first recess 710 extending radially outward from the side surface 721 of the stationary ring 420. In some examples, the first recess 710 has a curved "V" shape. The radially inwardly protruding portion 424 extends further from the annular body 421 than in the cross-section of FIG. 11C due to the first recess 710. The hole 572 is formed vertically through the radially inwardly protruding portion 424, enabling the lift pin 572 to pass through the stationary ring 420 (FIG. 7B).

[0144] In FIG. 11E, the stationary ring 420 is shown along the cross-section line 11E-11E of FIG. 11A. The stationary ring 420 has an annular body 421 that is thinner in the radial direction than the cross-section of FIG. 11C due to the second recess 720 extending radially outward within the side surface 721 of the stationary ring 420. In some examples, the second recess 720 has a curved "V" shape. The radially inwardly protruding portion 424 extends further from the annular body 421 at this position (compared to FIG. 11C) due to the second recess 720.

[0145] In Fig. 11F, the stationary ring 420 has a hole 680 extending into the bottom surface of the annular body 421, which enables the stationary ring 420 to be supported on the rack within the coating of the stationary ring 420. After the coating is completed, the hole 680 can be plugged with a plug 425 or other filler such as a threaded fastener. In some examples, the hole 680 is not required, thus Fig. 11F shows a solid body 420 without the hole 680.

[0146] Referring now to Fig. 11G, a top perspective view of the first recess 710 of the stationary ring 420 is shown. The radial depth of the first recess 710 provides clearance for the protrusion 550 of the moving ring 460. In some examples, movement of the stationary ring 420 during attachment and detachment is less likely to be impeded by chamfering one or more of the respective edges 713, 715, and 719 between the top surface 711 and the side surface 721, between the side surface 721 and the bottom surface 717, and between the bottom surface 717 and the bottom face 723.

[0147] Referring now to Fig. 11H, a top perspective view of the second recess 720 of the stationary ring 420 is shown. The radial depth of the second recess 720 provides clearance for the protrusion 670 of the moving ring 460. In some examples, the radial depth of the first recess 710 is greater than the radial depth of the second recess 720. In some examples, movement of the stationary ring 420 during attachment and detachment is less likely to be impeded by chamfering the edge 725.

[0148] Referring now to FIGS. 12A and 12B, bottom edge ring 430 includes depressions 750 and 752 within annular rim 434 configured to provide clearance for projections 550 and 670 of moving ring 460. In some examples, the positions of depressions 750 and / or 752 are different from those shown, depending on the clearance space required by moving ring 460. In some examples, depressions 750 and 752 have a "V" shape to conform to the shapes of projections 550 and 670. In some examples, depressions 752 are spaced 120° apart and are located generally centrally between depressions 750, in accordance with the spacing of projections 550 and 670. In some examples, bottom edge ring 430 further includes one or more holes 770 extending axially into annular body 431 from the bottom surface of bottom edge ring 430. The one or more holes 770 can be used to position bottom edge ring 430 on a rack during coating of bottom edge ring 430. In some examples, bottom ring 430 does not have one or more holes 770.

[0149] Referring now to FIGS. 12C - 12F, cross-sectional views of examples of bottom edge ring 430 taken in various cross-sections shown in FIGS. 12A and 12B are shown. In FIG. 12C, bottom edge ring 430 is shown along section line 12C - 12C of FIG. 12A. Bottom edge ring 430 has an annular body 431 and an inward annular rim 432. Inward annular rim 432 is widest at this position (when measured horizontally) because there are no depressions 750 and 752.

[0150] In FIG. 12D, bottom edge ring 430 is shown along section line 12D - 12D of FIG. 12A. Bottom edge ring 430 has an annular body 431 and an inward annular rim 432. Inward annular rim 432 at this position has an intermediate width at this position (compared to inward annular rims 432 of FIGS. 12C and 12E) due to depression 752.

[0151] In FIG. 12E, the bottom edge ring 430 is shown along the section line 12E-12E of FIG. 12A. The bottom edge ring 430 has an annular body 431 and an inward annular rim 432. The inward annular rim 432 has a narrow width at this position due to the recess 750 (compared with FIGS. 12C and 12D).

[0152] In FIG. 12F, the bottom edge ring 430 is shown along the section line 12F-12F of FIG. 12B. The hole 770 is used for plugging and can be plugged with other fillers such as a plug 771 or a fastener after coating. In some examples, the hole 770 is not required, so FIG. 12F has a solid body 430 without the hole 770.

[0153] In some examples, the top edge ring 450 is formed of silicon carbide or other plasma-resistant materials. In some examples, the covering 470 and the middle ring 440 are formed of quartz or other plasma-resistant materials. In some examples, the moving ring 460 has a silicon substrate with an aluminum electroplating. In some examples, the stationary ring 420 is formed of a silicon substrate having a coating such as a perfluoroalkoxy alkane (PFA) coating or an aluminum electroplating.

[0154] In some examples, the top edge ring 450, the covering 470, and the middle ring 440 are movable from the processing chamber without opening the processing chamber. In some examples, the top edge ring 450, the covering 470, and the middle ring 440 are durable for more than 500 or 1000 RF hours until replacement is required. The remaining rings having the stationary ring 420, the moving ring 460, and the bottom edge ring 430 are less exposed to the plasma and can last longer. In some examples, the stationary ring 420, the moving ring 460, and the bottom edge ring 430 have an average time of more than one year until the next cleaning (MBTC).

[0155] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or its use. The broad teachings of the disclosure can be implemented in a variety of forms. Accordingly, while the disclosure includes specific examples, other variations will become apparent upon review of the drawings, the specification, and the following claims, and the true scope of the disclosure should not be limited to such examples. It should be understood that one or more steps in a method may be performed in a different order (or simultaneously) without changing the principles of the disclosure. Further, although each embodiment has been described above as having certain features, any one or more of these features described with respect to any embodiment of the disclosure can be implemented in any of the other embodiments and / or combined with any of the features of any of the other embodiments (even if such combinations are not explicitly described). In other words, the described embodiments are not mutually exclusive, and swapping one or more embodiments with each other is within the scope of the disclosure.

[0156] Spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.) are described using various terms such as "connected," "engaged," "coupled," "adjacent," "next to," "on," "above," "below," and "disposed." When a relationship between a first element and a second element is described in the above disclosure, unless explicitly described as "direct," the relationship can be a direct relationship with no other intervening elements between the first element and the second element, but there can also be an indirect relationship with one or more intervening elements (spatially or functionally) between the first element and the second element. As used herein, the expression "at least one of A, B, and C" should be interpreted in the sense of a logical (A or B or C) using non-exclusive logical OR and should not be interpreted in the sense of "at least one of A, at least one of B, and at least one of C."

[0157] In some implementations, the controller is part of a system, and the system may be part of the above examples. Such a system may include semiconductor processing equipment having one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (such as wafer pedestals, gas flow systems, etc.). These systems may be integrated with the electronic device to control the operation of the electronic device before, during, and after the processing of the semiconductor wafer or substrate. The electronic device may be referred to as a "controller" that can control various components or sub-components of one or more systems. The controller may be programmed to control any of the processes disclosed herein, depending on the processing requirements and / or the type of system. Such processes include, for example, delivery of process gases, temperature setting (e.g., heating and / or cooling), pressure setting, vacuum setting, power setting, radio frequency (RF) generator setting, RF matching circuit setting, frequency setting, flow rate setting, fluid delivery setting, position and motion setting, loading and unloading of wafers to and from the tool, and loading and unloading of wafers to and from other transfer tools and / or load locks connected or coupled to a particular system.

[0158] Generally, a controller may be defined as an electronic device having, for example, various integrated circuits, logic, memory, and / or software that receive commands, issue commands, control operations, enable cleaning operations, and enable endpoint measurements. The integrated circuits may include chips in the form of firmware that stores program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). The program instructions may be instructions transmitted to the controller in the form of various individual settings (or program files), defining operating parameters for performing a particular process on a semiconductor wafer or for a semiconductor wafer, or for a system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to achieve one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0159] In some implementations, the controller may be part of a computer integrated with, coupled to, or otherwise network-connected to the system, or may be coupled to such a computer, or may be a combination thereof. For example, the controller may be within a "cloud" or may be all or part of a fab host computer system, thereby enabling remote access to wafer processing. The computer may monitor the current progress of the fabrication operation, verify the history of past fabrication operations, verify trends or performance criteria from multiple fabrication operations, change the parameters of the current process, set the process steps following the current process, or initiate a new process by enabling remote access to the system. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system through a network that may include a local network or the Internet. The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify the parameters of each process step to be executed during one or more operations. It should be understood that the parameters may be specific to the type of process being executed and the type of tool that the controller is configured to couple to or control. Thus, as described above, the controller may be distributed, such as by having one or more separate controllers network-connected to each other and working towards a common purpose such as the processes and controls described herein. Examples of controllers distributed for such purposes include one or more integrated circuits on a chamber that communicate with one or more integrated circuits located remotely (e.g., at the platform level or as part of a remote computer) to collaboratively control the process on the chamber.

[0160] Exemplary systems include, but are not limited to, a plasma etching chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etching chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etching (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system associated with or that can be used in the fabrication and / or manufacture of semiconductor wafers.

[0161] As described above, depending on one or more process steps performed by the tool, the controller can communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, the main computer, another controller, or tools used for material transport that move the wafer container into and out of the tool position and / or load port within a semiconductor manufacturing facility.

Claims

1. An edge ringing system for a substrate processing chamber, A middle ring configured to be positioned around a substrate support, The outer ring part, The inner ring part, N arc-shaped openings are arranged between the outer ring portion and the inner ring portion, where N is an integer greater than 1. N bridges connecting the outer ring portion and the inner ring portion between the N arc-shaped openings, A middle ring having an annular recess disposed on the radially inner surface of the outer ring portion, A covering ring disposed within the annular recess, A top edge ring is positioned above the middle ring between the covering ring and the inner ring portion, and above the N arch-shaped openings and N bridges of the middle ring, An edge ring system equipped with this feature.

2. The edge ring system according to claim 1, A movable ring further comprising a movable ring having N upper parts of an arc shape that are aligned with the N arc-shaped openings and are configured to pass through the N arc-shaped openings, The top edge ring is placed on the N upper portions, An edge ring system in which the N upper portions of the movable ring are configured to bias the bottom surface of the top edge ring through the N arc-shaped openings of the middle ring in order to raise the top edge ring relative to the covering ring.

3. The edge ring system according to claim 2, A first lift pin, configured to selectively raise the moving ring and the top edge ring upward relative to the covering ring and the middle ring, A second lift pin, configured to selectively bias the middle ring, the top edge ring, and the covering ring relative to the moving ring, The edge ring system further enhances this feature.

4. The edge ring system according to claim 1, The top edge ring is an edge ring system having a "C"-shaped cross-section that forms an inner annular projection extending downward, an outer annular projection extending downward, and a recess positioned between the inner annular projection and the outer annular projection.

5. The edge ring system according to claim 1, The N bridges are an edge ring system having protrusions that extend upward toward the lower surface of the top edge ring.

6. The edge ring system according to claim 2, The covering is an edge ring system having an inverted "L" shaped cross-section.

7. The edge ring system according to claim 6, The radially inner surface of the covering has a radially inner surface and an arched surface. An edge ring system in which the radial inner surface of the covering is located radially inward from the radial outer surface of the upper portion of the moving ring.

8. The edge ring system according to claim 6, The radially inner surface of the covering has a radially inner surface and an arched surface. An edge ring system in which the radially outer surface of the top edge ring is positioned below and radially outward from the radially inner surface of the covering ring.

9. The edge ring system according to claim 6, The radially inner surface of the covering has a radially inner surface and an arched surface. An edge ring system wherein the upper and radially outer edge of the top edge ring has an arch shape corresponding to the arched surface of the covering ring.

10. The edge ring system according to claim 4, At least one of the N bridges of the middle ring includes either a convex portion or a concave portion, and the radial inner edge of the outer annular convex portion of the top edge ring includes the other of the concave portion or convex portion. An edge ring system in which one of the protrusions and recesses in at least one of the N bridges of the middle ring is received within the other of the recess and protrusion on the radially inner edge of the outer annular protrusion of the top edge ring.

11. The edge ring system according to claim 2, An edge ring system further comprising a stationary ring configured to be positioned below the middle ring and around the substrate support.

12. The edge ring system according to claim 11, The stationary ring includes a protrusion extending radially inward from the lower portion of the radially inner surface of the stationary ring, An edge ring system in which the moving ring is positioned above the protrusion of the stationary ring and radially inward of the stationary ring.

13. The edge ring system according to claim 11, The edge ring system comprises a moving ring having a plurality of first protrusions extending radially outward from the moving ring.

14. The edge ring system according to claim 13, The bottom surface of the first plurality of protrusions has a groove that extends radially and has opposing inclined surfaces, forming an edge ring system.

15. The edge ring system according to claim 13, The edge ring system comprises a moving ring having a plurality of second protrusions extending radially outward from the moving ring and a hole extending axially through the plurality of second protrusions.

16. The edge ring system according to claim 11, The stationary ring includes a first plurality of recesses, An edge ring system in which the first plurality of recesses extend radially inward from the radially inner surface of the stationary ring and are configured to provide clearance for the first plurality of protrusions of the movable ring.

17. The edge ring system according to claim 16, The stationary ring includes a second plurality of recesses, An edge ring system in which the second plurality of recesses extend radially inward from the radially inner surface of the stationary ring and are configured to provide clearance for the second plurality of protrusions of the movable ring.

18. The edge ring system according to claim 11, It also features a bottom edge ring, The bottom edge ring system comprises a first annular rim extending inward from the radially inner surface of the bottom edge ring and an annular body disposed around the stationary ring.

19. The edge ring system according to claim 18, The bottom edge ring system further comprises a second annular rim extending upward from the upper surface of the bottom edge ring.

20. The edge ring system according to claim 19, The edge ring system wherein the middle ring has an annular groove configured to receive the second annular rim of the bottom edge ring.

21. The edge ring system according to claim 18, An edge ring system in which a gap is formed between the bottom surface of the middle ring and the top surface of the bottom edge ring.

22. The edge ring system according to claim 18, The bottom surface of the first annular rim is placed on the stationary ring, forming an edge ring system.

23. The edge ring system according to claim 18, The first annular rim includes a first plurality of recesses, An edge ring system in which the first plurality of recesses extend radially inward to provide clearance for the first plurality of protrusions of the moving ring.

24. The edge ring system according to claim 18, The first annular rim includes a second plurality of recesses, An edge ring system in which the second plurality of recesses extend radially inward from the radially inner surface of the stationary ring and are configured to provide clearance for the second plurality of protrusions of the movable ring.

25. The edge ring system according to claim 1, An edge ring system comprising at least one of the following: the middle ring contains quartz, the covering ring contains quartz, and the top edge ring contains silicon carbide.

26. The edge ring system according to claim 2, The aforementioned moving ring is an edge ring system having a silicon substrate with an electroplated aluminum outer layer.

27. The edge ring system according to claim 11, The stationary ring is an edge ring system having a silicon substrate having either a coating containing perfluoroalkoxyalkane (PFA) or an electroplated aluminum outer layer.

28. A middle ring for a substrate processing chamber, The outer ring part, The inner ring part, N bridges connecting the outer ring portion to the inner ring portion, where N is an integer greater than 1, Each of the N arch-shaped openings is positioned between the N bridges and between the outer ring portion and the inner ring portion, A middle ring equipped with this feature.

29. A middle ring according to claim 28, A middle ring further comprising an annular recess located on the radially inner surface of the upper part of the outer ring portion.

30. A middle ring according to claim 28, A middle ring having at least one of the N bridges having either a convex portion or a concave portion configured to orient the middle ring relative to another edge ring.

31. A middle ring according to claim 28, The aforementioned middle ring is a middle ring containing quartz.

32. A middle ring according to claim 28, A middle ring further comprising G alignment portions arranged on the bottom surface of the outer ring portion, where G is an integer greater than 2.

33. A middle ring according to claim 28, A middle ring further comprising an annular groove located on the bottom surface of the outer ring portion.

34. A middle ring according to claim 28, G alignment portions are arranged on the bottom surface of the outer ring portion, and each G alignment portion includes a plane that extends radially outward and is positioned between opposing inclined surfaces, where G is an integer greater than 2. An annular groove is positioned on the bottom surface of the outer ring portion and is located radially outward of the G alignment portions, A middle ring that offers even more features.

35. A middle ring according to claim 28, The aforementioned middle ring is a middle ring containing quartz.

36. A top edge ring for a substrate processing system, An annular body having a "C"-shaped cross-section, An inner annular projection extending downward from the radially inner surface of the annular body, An outer annular projection extending downward from the radially inner surface of the annular body, A recess is disposed between the inner annular projection and the outer annular projection, The system comprises a projection disposed on one of the radial inner surface of the outer annular projection and the radial outer surface of the inner annular projection, The aforementioned protrusion is configured to orient the top edge ring relative to another edge ring, and is a top edge ring.

37. The top edge ring according to claim 36, The aforementioned top edge ring is a top edge ring containing silicon carbide.

38. The top edge ring according to claim 36, The system further comprises a recess located on one of the radial inner surface of the outer annular protrusion and the radial outer surface of the inner annular protrusion, The recess is configured to orient the top edge ring relative to another edge ring, and this is a top edge ring.

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