Fluid Routing of Vacuum Pump System

Abstract

The fluid routing module (104) for a vacuum pump system (100) includes a first fluid inlet (110a); a first fluid outlet (114a); a first fluid line (200) coupled between the first fluid inlet (110a) and the fluid outlet (114a); and a restrictor module (212) disposed along the first fluid line (200) between the first fluid inlet (110a) and the first fluid outlet (114a), wherein the restrictor module (212) is configured to variably restrict the flow of fluid between the first fluid inlet (110a) and the first fluid outlet (114a).

Description

Technical Field

[0001] The present invention relates to fluid routing for use with a vacuum pump system, including, but not limited to, a vacuum system for pumping fluid from a semiconductor processing tool.

Background Art

[0002] Semiconductor manufacturing facilities manufacture integrated circuit chips. In the manufacture of such devices, wafers are processed through a number of different processing stations, including, for example, stations where the wafers undergo chemical vapor deposition, physical vapor deposition, implant, etching, and lithography processes. Many of these processes involve the use of a gaseous environment and often require the use of high vacuum and reduced gas pressure.

[0003] Vacuum pumps are used to provide this reduced gas pressure within the process chamber, to provide evacuation of the chamber, and to maintain the flow of process gases.

Summary of the Invention

Means for Solving the Problems

[0004] When the pressure within the chamber of a semiconductor processing tool is not the operating vacuum, for example, after the process chamber has been vented to atmospheric pressure to allow for servicing or maintenance, a so-called "pump-down event" is performed to establish the required reduced gas pressure within the chamber. The pump-down event includes pumping gas from the chamber to reduce the pressure within the chamber to the required level.

[0005] Similarly, when the pressure within the pumping chamber of a vacuum pump (e.g., a turbopump) is atmospheric pressure, for example, after the vacuum pump has been stopped to allow for servicing or maintenance, a pump-down event is performed to establish the reduced gas pressure within the pumping chamber of that vacuum pump.

[0006] Vacuum and pressure reduction systems may be used to pump gas simultaneously from a plurality of process chambers of a semiconductor processing tool using a common pump via a common manifold. The inventors have noticed that in such systems, since a plurality of chambers and / or a plurality of turbo pumps may be fluidly coupled to a common manifold, performing a pump-down event on one of those chambers and / or turbo pumps may affect the state within other chambers of those chambers. For example, performing a pump-down event on one chamber may cause highly undesirable fluctuations in other chambers coupled to the same manifold.

[0007] Aspects of the present invention provide a valve module for controlling fluid from a plurality of chambers of a semiconductor processing tool in a manner that reduces or eliminates such drawbacks.

[0008] In a first aspect, a fluid routing module for a vacuum pump system is provided. The fluid routing module includes a first fluid inlet; a first fluid outlet; a first fluid line coupled between the first fluid inlet and the fluid outlet; and a restrictor module disposed along the first fluid line between the first fluid inlet and the first fluid outlet, the restrictor module being configured to variably restrict the flow of fluid between the first fluid inlet and the first fluid outlet.

[0009] The restrictor module can comprise a plurality of restrictors arranged along a first fluid line between a first fluid inlet and a fluid outlet, the plurality of restrictors being arranged in parallel with each other, and each restrictor of the plurality of restrictors being configured to restrict the flow of fluid therethrough. The fluid routing module can further comprise means configured to selectively direct the flow of fluid through one or more selected restrictors of the plurality of restrictors while preventing the flow of fluid through other restrictors of the plurality of restrictors. The means configured to selectively direct the flow of fluid through one or more selected restrictors can comprise a plurality of valves, each valve of the plurality of valves being arranged in series with a respective one of the plurality of restrictors. The fluid routing module is arranged in parallel with the restrictor module and thereby further comprises a bypass line enabling a flow of fluid to bypass the plurality of restrictors, and one or more further valves configured to selectively direct the flow of fluid through either the bypass line or the plurality of restrictors. The fluid routing module can further comprise a valve controller configured to control the operation of the valves. Each restrictor of the plurality of restrictors can be configured to restrict the flow of fluid therethrough to a different extent. Each restrictor of the plurality of restrictors can comprise a flow restriction orifice having a different respective diameter.

[0010] The fluid routing module can further comprise a vacuum pump arranged along a first fluid line between a first fluid inlet and the restrictor module. The vacuum pump can be a turbo pump.

[0011] The fluid routing module can further comprise a second fluid inlet; a second fluid outlet; a second fluid line coupled between the second fluid inlet and the fluid outlet; and one or more valves arranged along the second fluid line.

[0012] In a further aspect, a semiconductor processing tool including a process chamber; a fluid routing module in any of the above aspects, wherein a first fluid inlet is fluidly coupled to the process chamber; and a vacuum pump operatively coupled to a first fluid outlet; is provided.

[0013] The semiconductor processing tool can further include one or more additional process chambers. The system can further include one or more additional fluid routing modules, each of the additional fluid routing modules being a fluid routing module according to any of the above aspects, and a first fluid inlet of each of the additional fluid routing modules being fluidly coupled to a respective additional process chamber. The system can further include a fluid line manifold, and a first fluid outlet of each of the fluid routing module and the additional fluid routing modules can be fluidly coupled to the fluid line manifold. The vacuum pump can be operatively coupled to the fluid line manifold.

[0014] A second fluid inlet can be fluidly coupled to the process chamber. The system can further include a vacuum pump operatively coupled to a second fluid outlet.

[0015] In a further aspect, a method of routing fluid through a fluid routing module is provided. The fluid routing module can be of any of the above aspects. The method includes receiving a fluid flow at a first fluid inlet, variably restricting the fluid passing through a restrictor module by the restrictor module, and then the fluid flowing out from the first fluid outlet.

[0016] The fluid routing module can further include a vacuum pump disposed along a first fluid line between a first fluid inlet and a restrictor module, a bypass line disposed to enable fluid flow to a flow restriction portion of the restrictor module, and means configured to selectively direct the fluid flow through the bypass line. The method can further include controlling additional means to cause the fluid to flow through the bypass line in response to one or more conditions being satisfied, thereby bypassing the flow restriction portion of the restrictor module. The one or more conditions include the condition that the pressure in the pumping chamber of the vacuum pump is less than a threshold pressure.

[0017] In some of the above aspects, there may be a plurality of fluid routing modules, i.e., there may be a plurality of first fluid inlets, a plurality of first fluid lines, and a plurality of first fluid outlets. Further, there may be a fluid line manifold. The plurality of first fluid outlets of the plurality of fluid routing modules may be fluidly coupled to the fluid line manifold.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Best Mode for Carrying Out the Invention

[0019] FIG. 1 is a schematic view of semiconductor manufacturing equipment 100 according to an embodiment (not to scale).

[0020] The semiconductor manufacturing equipment 100 includes a semiconductor processing tool 102, a fluid routing module 104, a first vacuum pump 106, and a second vacuum pump 107.

[0021] The semiconductor processing tool 102 includes a plurality of process chambers 108 in which semiconductor wafers undergo respective processes. Examples of such processes include, but are not limited to, chemical vapor deposition, physical vapor deposition, implant, etching, and lithography processes.

[0022] The first vacuum pump 106 is configured to pump fluid (i.e., process gas) out from the process chamber 108 of the semiconductor processing tool 102 through the fluid routing module 104.

[0023] The second vacuum pump 107 is configured to pump fluid (i.e., process gas) out from the process chamber 108 of the semiconductor processing tool 102 through the fluid routing module 104.

[0024] The fluid routing module 104 includes a plurality of fluid inlets (specifically, a plurality of first fluid inlets 110a and a plurality of second fluid inlets 110b), a plurality of pumping modules 112, a plurality of fluid outlets (specifically, a plurality of first fluid outlets 114a and a plurality of second fluid outlets 114b), a first fluid line manifold 116, and a second fluid line manifold 122.

[0025] Each pair of the first and second fluid inlets 110a, 110b is fluidly coupled between the respective process chamber 108 and the respective pumping module 112, and fluid can flow from the process chamber 108 to the pumping module 112 through either or both of the first and second fluid inlets 110a, 110b.

[0026] The pumping module 112 will be described in more detail below with reference to FIG. 2.

[0027] Each pumping module 112 is fluidly coupled to the first fluid line manifold 116 by a respective first fluid outlet 114a, and fluid can flow from the pumping module 112 to the first fluid line manifold 116. Each pumping module 112 is fluidly coupled to the second fluid line manifold 122 by a respective second fluid outlet 114b, and fluid can flow from the pumping module 112 to the second fluid line manifold 122.

[0028] The first fluid line manifold 116 is fluidly coupled between the plurality of first fluid outlets 114a and the first vacuum pump 106.

[0029] The second fluid line manifold 122 is fluidly coupled between the plurality of second fluid outlets 114b and the second vacuum pump 107.

[0030] The fluid routing module 104 further includes a valve controller 118.

[0031] The valve controller 118 is operably coupled to each of a plurality of valves included in the pumping module 112 via respective pneumatic lines and / or electrical couplings (not shown). These valves are described in more detail below with reference to FIG. 2. As described in more detail below with reference to FIG. 4, the valve controller 118 is configured to control the operation of the valves of the pumping module 112, for example, by transmitting an air fluid thereto via a pneumatic line.

[0032] FIG. 2 is a schematic diagram (not to scale) showing further details of the pumping module 112. In this embodiment, the pumping modules 112 of the fluid routing module 104 are substantially the same as each other.

[0033] In this embodiment, the first fluid inlet 110a and the second fluid inlet 110b are fluid inlets of the pumping module 112. Also, the first fluid outlet 114a and the second fluid outlet 114b are fluid outlets of the pumping module 112.

[0034] The pumping module 112 includes a first fluid line 200 coupled between the first fluid inlet 110a and the first fluid outlet 114a, and a second fluid line 202 coupled between the second fluid inlet 110b and the second fluid outlet 114b.

[0035] The pumping module 112 includes an automatic pressure control (APC) module 208, a turbo pump 210, a limiter module 212, a pressure sensor 214, and a valve 216.

[0036] The APC module 208, the turbo pump 210, the limiter module 212, and the pressure sensor 214 are arranged along the first fluid line 200. The APC module 208 is arranged between the first fluid inlet 110a and the turbo pump 210. The turbo pump 210 is arranged between the APC module 208 and the limiter module 212. The limiter module 212 is arranged between the turbo pump 210 and the pressure sensor 214. The pressure sensor 214 is arranged between the limiter module 212 and the first fluid outlet 114a.

[0037] A valve 216, which may be considered a chamber evacuation valve, is arranged along the second fluid line 202 and is arranged between the second fluid inlet 110b and the second fluid outlet 114b.

[0038] The APC module 208 is configured to control the flow of fluid therethrough. The APC module 208 can include a movable valve with a controller. The movable valve of the APC module 208 includes a moving pendulum that can be controlled by the controller of the APC module 208 and can increase or decrease the size of the orifice of the chamber evacuation path. The APC module 208 can receive a pressure setpoint and an actual pressure measurement of the pressure within the process chamber 108. Next, the controller of the APC module 208 can control the pendulum according to a control algorithm until the actual pressure measurement matches the setpoint. In some embodiments, the valve of the APC module 208 can be controlled by the valve controller 118.

[0039] The turbo pump 210 is coupled to each process chamber 108 via the first fluid inlet 110a. The turbo pump 210 is configured to pump exhaust gas out from the process chamber 108, through the first fluid line 200, and out through the first fluid outlet 114a.

[0040] The limiter module 212 will be described in more detail below with reference to FIG. 3.

[0041] The pressure sensor 214 is configured to measure the pressure of the fluid in the first fluid line 200 flowing out from the limiter module 212. The pressure sensor 214 can be operatively coupled to the valve controller 118, and the pressure measurement value obtained by the pressure sensor 214 can be received by the valve controller 118.

[0042] The valve 216 is configured to control the flow of fluid therethrough. Specifically, in this embodiment, the valve 216 is configured to be controlled by the valve controller 118 to selectively permit or block the flow of fluid therethrough.

[0043] FIG. 3 is a schematic diagram (not to scale) showing further details of the limiter module 212. In this embodiment, each limiter module 212 of the pumping module 112 is substantially the same as each other.

[0044] The limiter module 212 includes a plurality of limiters. Specifically, the limiter module 212 includes a first limiter 301, a second limiter 302, a third limiter 303, a fourth limiter 304, and a fifth limiter 305. The limiters 301-305 are arranged along the first fluid line 200. The limiters 301-305 are arranged in parallel with each other.

[0045] Each limiter 301-305 is configured to limit the flow of fluid therethrough. Specifically, in this embodiment, each limiter 301-305 includes a flow restriction orifice.

[0046] In this embodiment, each of the restrictors 301-305 is configured to restrict the flow of fluid passing therethrough to different sizes. Each of the restrictors 301-305 includes a flow restriction orifice having a different respective diameter. That is, the diameters of the flow restriction orifices of the restrictors 301-305 are of different sizes from each other. The diameters of the flow restriction orifices of the restrictors 301-305 can be of some appropriate sizes, for example, sizes selected from the group consisting of 0.5 mm, 0.6 mm, 0.75 mm, 1 mm, and 2 mm. In this embodiment, the first restrictor 301 has a diameter of 0.5 mm, the second restrictor 302 has a diameter of 0.6 mm, the third restrictor 303 has a diameter of 0.75 mm, the fourth restrictor 304 has a diameter of 1 mm, and the fifth restrictor 305 has a diameter of 2 mm.

[0047] The restrictor module 212 further includes means configured to selectively direct the flow of fluid through one or more selected ones of the restrictors 301-305 while preventing the flow of fluid through the other ones of the restrictors 301-305. In this embodiment, the above means for selectively directing the flow of fluid through one or more selected ones of the restrictors 301-305 includes a plurality of valves hereinafter referred to as "restrictor valves". Specifically, the restrictor module 212 includes a first restrictor valve 311, a second restrictor valve 312, a third restrictor valve 313, a fourth restrictor valve 314, and a fifth restrictor valve 315. Each of the restrictor valves 311-315 is fluidly coupled in series with a respective one of the restrictors 301-305. Specifically, the first restrictor valve 311 is coupled in series with the first restrictor 301, the second restrictor valve 312 is coupled in series with the second restrictor 302, the third restrictor valve 313 is coupled in series with the third restrictor 303, the fourth restrictor valve 314 is coupled in series with the fourth restrictor 304, and the fifth restrictor valve 315 is coupled in series with the fifth restrictor 305. The pairs of restrictors and restrictor valves coupled in series are coupled in parallel with each other.

[0048] Each restrictor valve 311 - 315 is configured to control the flow of fluid therethrough. Specifically, in this embodiment, each restrictor valve 311 - 315 is configured to be controlled by valve controller 118 to selectively permit or block the flow of fluid therethrough. Accordingly, each restrictor valve 311 - 315 can selectively permit or block the flow of fluid through each respective restrictor 301 - 305 coupled in series therewith.

[0049] In this embodiment, the restrictor module 212 further comprises a bypass line 320. The bypass line 320 is arranged in parallel with the plurality of restrictors 301 - 305 (and restrictor valves 311 - 315). The bypass line 320 is arranged to enable the flow of fluid to bypass the plurality of restrictors 301 - 305. The bypass line 320 enables the flow of fluid to avoid the plurality of restrictors 301 - 305 and flow relatively unconstrained between the turbopump 210 and the first fluid outlet 114a.

[0050] In this embodiment, the restrictor module 212 further comprises a valve hereinafter referred to as the "bypass valve 322". The bypass valve 322 is arranged along the bypass line 320. The bypass valve 322 is configured to control the flow of fluid therethrough. Specifically, in this embodiment, the bypass valve 322 is configured to be controlled by valve controller 118 to selectively permit or block the flow of fluid therethrough. Accordingly, the bypass valve 322 can selectively permit or block the flow of fluid through the bypass line 320.

[0051] The restrictor module 212 can be oriented in the vertical direction, i.e., such that the process fluid flows vertically downward through the restrictors. This orientation and arrangement of the restrictor module 212 tends to prevent clogging of the restrictors 301 - 305, for example, by liquid that can flow out of the restrictors 301 - 305 under gravity.

[0052] An apparatus including a valve controller 118 for implementing the above-described configuration and executing the method steps described below can be provided by configuring or adapting any suitable apparatus, such as one or more computers or other processing devices or processors, and / or by providing additional modules. The apparatus can comprise a computer, a network of computers, or one or more processors for executing instructions and using data, including instructions and data in the form of one or more computer programs stored in a computer memory, a computer disk, a machine-readable storage medium such as ROM, PROM, or any combination thereof or other storage media.

[0053] The system described above can receive a pump-down event to evacuate gas from one or more of the process chambers 108 that can be at atmospheric pressure and reduce the pressure therein to a level suitable for semiconductor manufacturing processes. The pump-down event can be executed to evacuate gas from the pump feed chambers of the turbo pumps of one or more pumping modules.

[0054] Hereinafter, with reference to FIGS. 4-6, a process of pumping gas in a semiconductor manufacturing facility 100 including a pump-down event will be described.

[0055] It should be noted that some of the process steps shown in the flowcharts of FIGS. 4 and 5 and described below can be omitted, or such process steps can be executed in an order different from that presented below and shown in FIGS. 4 and 5. Further, although all process steps are shown as individual temporally consecutive steps for convenience and ease of understanding, nevertheless, some of the process steps can actually be executed simultaneously or at least to some extent temporally overlapping.

[0056] FIG. 4 is a process flowchart showing specific steps of a process 400 of pumping and feeding gas in a semiconductor manufacturing facility 100 including a pump-down event.

[0057] In step s402, a semiconductor manufacturing process is executed within the process chamber 108. These semiconductor manufacturing processes generate process gas.

[0058] In this embodiment, at this stage, for each of the pumping modules 112, the valve 216 is closed, the restrictor valves 311 - 315 are closed, and the bypass valve 322 is open. Thus, in step s402, the first vacuum pump 106 pumps the process gas from the process chamber 108 through the relatively unrestricted first fluid line 200 of the pumping module 112 to the first fluid line manifold 116.

[0059] In step s404, one of the process chambers 108 (hereinafter referred to as the "first process chamber 108" for convenience) is stopped for inspection, maintenance, repair, or servicing. In this embodiment, the stop of the first process chamber 108 includes stopping the pumping of gas from the first process chamber 108. In this embodiment, this is achieved by closing the bypass valve 322 of the pumping module 112 associated with the first process chamber 108. The turbo pump 210 of the pumping module 112 associated with the first process chamber 108 is also stopped. In this embodiment, the stop of the first process chamber 108 further includes raising the pressure within the first process chamber 108 to approximately atmospheric pressure. This can be achieved by opening the valve coupled to the first process chamber 108, thereby allowing air to flow into the first process chamber 108. Additionally, in this embodiment, the pressure within the pump chamber of the turbo pump 210 of the pumping module 112 associated with the first process chamber 108 also rises to approximately atmospheric pressure.

[0060] In step s406, a human operator inspects, services, repairs, or maintains the first process chamber 108. Alternatively or additionally, the inspection, service, repair, or maintenance can be performed on one or two components of the pumping module 112 associated with the first process chamber 108.

[0061] After the inspection, service, repair, or maintenance, a low gas pressure environment is reconstructed within the first process chamber 108, and the semiconductor manufacturing process can be executed therein.

[0062] Accordingly, in step s408, the valve 216 of the pumping module 112 associated with the first process chamber 108 is opened by the valve controller 118.

[0063] In step s410, with the valve 216 open, the second vacuum pump 107 pumps gas from the first process chamber 108 along the second fluid line 202 to the second fluid line manifold 122.

[0064] Accordingly, the first process chamber 108 is "pumped down". This gas flow from the first process chamber 108 is independent of the gas flow through the first fluid line manifold 116. Advantageously, this separation of flows tends to reduce or eliminate the pumping down of the first process chamber 108 that would otherwise negatively affect the state within the parallel process chamber 108.

[0065] In step s412, in response to the completion of the pumping down of the first process chamber 108, the valve controller 118 closes the valve 216 of the pumping module 112 associated with the first process chamber 108.

[0066] The completion of the pumping down of the first process chamber 108 can be detected by any suitable means. For example, the valve controller 118 can determine that the pumping down of the first process chamber 108 is complete in response to the measured pressure in the first process chamber 108 being below a first threshold value and / or the calculated rate of decrease of the measured pressure associated with the first process chamber 108 being below a second threshold value. The first threshold value can be any suitable threshold value. The second threshold value can be any suitable threshold value.

[0067] In step s414, in response to the completion of the pumping down of the first process chamber 108, the valve controller 118 controls the restrictor valves 311-315 to open in a preset order. Thus, in step s414, the restrictor valves 311-315 are opened and closed in a preset pattern.

[0068] In some embodiments, in step s414, the valve controller 118 can also control the APC module 208 to prevent or counteract the flow of fluid therethrough.

[0069] FIG. 5 is a process flow chart showing specific steps of a process 500 for operating the restrictor valves 311-315 that can be performed in step s414. FIG. 6 is a schematic diagram showing the operation of the restrictor valves 311-315 (not to scale). The remaining steps of FIG. 4 will be described in more detail below after the description of FIGS. 5 and 6.

[0070] In step s502, the first restrictor valve 311 is opened. In step s502, the remaining restrictor valves 312 - 315 and the bypass valve 322 are closed. With the first restrictor valve 311 open, the fluid flow is directed through the first restrictor 301, which has the smallest diameter in this embodiment, and its diameter is 0.5 mm. The fluid does not flow through the other restrictors 302 - 305 or the bypass line 320. Accordingly, in step s502, the first vacuum pump 106 pumps gas along the first fluid line 200 from the pumping chamber of the turbo pump 210, through the first restrictor 301, and into the first fluid line manifold 116.

[0071] In step s504, the first restrictor valve 311 is closed and the second restrictor valve 312 is opened. In step s504, the first and the third to fifth restrictor valves 311, 313 - 315, and the bypass valve 322 are closed. With the second restrictor valve 312 open, the fluid flow is directed through the second restrictor 302, which has a larger diameter than the first restrictor 301 in this embodiment, and its diameter is 0.6 mm. The fluid does not flow through the other restrictors 301, 303 - 305 or the bypass line 320. Accordingly, in step s504, the first vacuum pump 106 pumps gas along the first fluid line 200 from the pumping chamber of the turbo pump 210, through the second restrictor 302, and into the first fluid line manifold 116.

[0072] In step s506, the second restrictor valve 312 is closed and the third restrictor valve 313 is opened. In step s506, the first, second, fourth, and fifth restrictor valves 311, 312, 314, 315 and the bypass valve 322 are closed. With the third restrictor valve 313 open, the fluid flow is directed in this embodiment through a third restrictor 303 having a diameter larger than that of the second restrictor 302, which diameter is 0.75 mm. The fluid does not flow through the other restrictors 301, 303, 304, 305 or the bypass line 320. Accordingly, in step s506, the first vacuum pump 106 pumps gas along the first fluid line 200 from the pumping chamber of the turbo pump 210, through the third restrictor 303, to the first fluid line manifold 116.

[0073] In step s508, the third restrictor valve 313 is closed and the fourth restrictor valve 314 is opened. In step s508, the first through third, and fifth restrictor valves 311 - 313, 315, and the bypass valve 322 are closed. With the fourth restrictor valve 314 open, the fluid flow is directed in this embodiment through a fourth restrictor 304 having a diameter larger than that of the third restrictor 303, which diameter is 1 mm. The fluid does not flow through the other restrictors 301 - 303, 305 or the bypass line 320. Accordingly, in step s508, the first vacuum pump 106 pumps gas along the first fluid line 200 from the pumping chamber of the turbo pump 210, through the fourth restrictor 304, to the first fluid line manifold 116.

[0074] In step s510, the fourth restrictor valve 314 is closed and the fifth restrictor valve 315 is opened. In step s510, the first to fourth restrictor valves 311 - 314 and the bypass valve 322 are closed. With the fifth restrictor valve 315 open, the fluid flow is directed, in this embodiment, through a fifth restrictor 305 having a diameter larger than that of the fourth restrictor 304, which has a diameter of 2 mm. The fluid does not flow through the other restrictors 301 - 304 or the bypass line 320. Thus, in step s510, the first vacuum pump 106 pumps gas along the first fluid line 200 from the pumping chamber of the turbo pump 210, through the fifth restrictor 305, to the first fluid line manifold 116.

[0075] FIG. 6 is a schematic view (not to scale) showing a graph 600 related to the process of FIG. 5.

[0076] The x - axis 602 of the graph 600 indicates time, with the unit being seconds (s).

[0077] The primary y - axis 604 of the graph 600 indicates pressure (i.e., the pressure inside the turbo pump), with the unit being mbar.

[0078] The secondary y - axis 605 of the graph 600 indicates gas flow rate, with the unit being standard liters per minute (slm).

[0079] The graph 600 includes two plot lines, namely a first line 606 and a second line 608. The first line 606 is a solid line. The second line 608 is a dashed line. The first line 606 indicates the chamber pressure inside the pumping chamber of the turbo pump 210. The second line 608 indicates the pressure inside the foreline of the pump system, i.e., inside the first fluid inlet 110a.

[0080] The x - axis 602 of the graph 600 is divided or partitioned into five time intervals, namely a first time interval 611, a second time interval 612, a third time interval 613, a fourth time interval 614, and a fifth time interval 615.

[0081] In this embodiment, each time interval is about 190 seconds. However, in other embodiments, one or more of the time intervals can have respective durations different from 190 s.

[0082] The first time interval 611 corresponds to step s502. Accordingly, during the first time interval 611, the first limiter valve 311 is open and the other limiter valves 312 - 315 and the bypass valve 322 are closed. Accordingly, the fluid flows from the pumping chamber of the turbopump 210 through the first limiter 301.

[0083] At the end of the first time interval 611, the second time interval 612 begins. Also, at the end of the first time interval 611 / at the start of the second time interval 612, the first limiter valve 311 is closed and the second limiter valve 312 is opened.

[0084] The second time interval 612 corresponds to step s504. Accordingly, during the second time interval 612, the second limiter valve 312 is open and the other limiter valves 311, 313 - 315 and the bypass valve 322 are closed. Accordingly, the fluid flows from the pumping chamber of the turbopump 210 through the second limiter 302.

[0085] At the end of the second time interval 612, the third time interval 613 begins. Also, at the end of the second time interval 612 / at the start of the third time interval 613, the second limiter valve 312 is closed and the third limiter valve 313 is opened.

[0086] The third time interval 613 corresponds to step s506. Accordingly, during the third time interval 613, the third limiter valve 313 is open and the other limiter valves 311, 312, 314, 315 and the bypass valve 322 are closed. Accordingly, the fluid flows from the pumping chamber of the turbopump 210 through the third limiter 303.

[0087] At the end of the third time interval 613, the fourth time interval 614 starts. Also, at the end of the third time interval 613 / at the start of the fourth time interval 614, the third limiter valve 313 is closed and the fourth limiter valve 314 is opened.

[0088] The fourth time interval 614 corresponds to step s508. Accordingly, during the fourth time interval 614, the fourth limiter valve 314 is open and the other limiter valves 311 - 313, 315 and the bypass valve 322 are closed. Accordingly, the fluid flows from the pumping chamber of the turbopump 210 through the fourth limiter 304.

[0089] At the end of the fourth time interval 614, the fifth time interval 615 starts. Also, at the end of the fourth time interval 614 / at the start of the fifth time interval 615, the fourth limiter valve 314 is closed and the fifth limiter valve 315 is opened.

[0090] The fifth time interval 615 corresponds to step s510. Accordingly, during the fifth time interval 615, the fifth limiter valve 315 is open and the other limiter valves 311 - 314 and the bypass valve 322 are closed. Accordingly, the fluid flows from the pumping chamber of the turbopump 210 through the fifth limiter 305.

[0091] At the end of the fifth time interval 615, the fifth limiter valve 315 is closed.

[0092] At the end of the fifth time interval 615, the pressure in the pumping chamber of the turbopump 210 tends to be below a threshold value, for example, 2 mbar, 3 mbar, 4 mbar, 5 mbar, 6 mbar, 7 mbar, 8 mbar, 9 mbar, or 10 mbar.

[0093] Accordingly, the pumping chamber of the turbopump 210 is "pumped down". This gas flow from the pumping chamber of the turbopump 210 is sequentially restricted by the first to fifth restrictors 301-305. Advantageously, this restriction of the flow by the restrictors 301-305 tends to reduce or eliminate the pumping down of the pumping chamber of the turbopump 210 that adversely affects the state within the parallel process chamber 108. In addition, the pumping down of the pumping chamber of the turbopump 210 advantageously provides a faster pumping down of the pumping chamber as compared to the case where a single restrictor of a fixed size is used, by sequentially passing through restrictors of increasing size.

[0094] In this embodiment, as shown in graph 600, the process flow through each chamber 108 is limited to 2 slm (maximum). This tends to prevent a single vacuum pump from becoming overloaded and being unable to provide the vacuum conditions necessary to maintain the proper functioning of all the turbopumps 210. The restrictors are sized to ensure that the turbopump down from the atmosphere does not exceed the 2 slm chamber flow rate limit. The restrictors are preferably sized to reduce the pressure as quickly as possible. In other embodiments, different process flow maximum values other than 2 slm can be implemented.

[0095] At the end of the fifth time interval 615, i.e., after step s510 of the process of FIG. 5, step s414 ends and the process of FIG. 4 proceeds to step s416.

[0096] Returning to the description of FIG. 4, at step s416, in response to the completion of the pumping down of the pumping chamber of the turbopump 210, the valve controller 118 controls the fifth restrictor valve 315 to close and the bypass valve 322 to open. Accordingly, the fluid flow is directed through the bypass line 320 and not through the flow restriction portions 301-305 of the restrictor module 212.

[0097] In some embodiments, in step s416, the valve controller 118 can also control the APC module 208 to allow fluid flow therethrough.

[0098] The completion of the pumping down of the pumping chamber of the turbo pump 210 can be detected by any suitable means. For example, the valve controller 118 can determine that the pumping down of the pumping chamber of the turbo pump 210 is complete in response to the measured pressure in the pumping chamber of the turbo pump 210 being below a threshold pressure value and / or the calculated rate of decrease of the measured pressure associated with the pumping chamber of the turbo pump 210 being below a threshold rate value. The threshold pressure value can be any suitable threshold, such as, for example, 2 mbar, 3 mbar, 4 mbar, 5 mbar, 6 mbar, 7 mbar, 8 mbar, 9 mbar, or 10 mbar. The threshold rate value can be any suitable threshold. The valve controller 118 can determine that the pumping down of the pumping chamber of the turbo pump 210 is complete based on the measurement values obtained by the pressure sensor 214 and / or any other pressure sensor (e.g., a pressure sensor arranged to measure the pressure in the pumping chamber of the turbo pump 210).

[0099] In step s418, following the bypass valve 322 being controlled to direct fluid flow through the bypass line 320, the semiconductor manufacturing process can be executed within the first process chamber 108. These semiconductor manufacturing processes generate process gases.

[0100] In step s420, the first vacuum pump 106 pumps gas out of the first process chamber 108 through the relatively unrestricted first fluid line 200 of its associated pumping module 112 and pumps it to the first fluid line manifold 116.

[0101] Accordingly, a process 400 is provided for pumping gases within a semiconductor manufacturing facility 100.

[0102] The above-described systems and methods advantageously tend to reduce or eliminate pump-down events that adversely affect the conditions within parallel process chambers. This is accomplished by pumping the pump-down gas through a restrictor, i.e., a restricted conduit or small-diameter orifice.

[0103] Advantageously, the pump-down can be performed relatively quickly by pumping the pump-down gas sequentially through restrictors of increasing diameter.

[0104] Advantageously, pump-down events and the end of pump-down events tend to be automatically detected and mitigated.

[0105] Advantageously, the above-described fluid routing module can be integrated inline with a horizontal manifold that couples a semiconductor processing tool to a vacuum pump.

[0106] Advantageously, the above-described fluid routing module tends to be robust. The vacuum module can be fully assembled, leak-tested, and pre-tested, for example, off-site prior to being brought into a semiconductor manufacturing facility or upon being brought in. This tends to simplify the installation process and shorten the installation time.

[0107] Advantageously, the above-described fluid routing module tends to be modular and expandable.

[0108] Advantageously, the components of the gas flow path of the fluid routing module tend to be easy to service, repair, and replace.

[0109] Advantageously, the condition and operating state of the system can be easily monitored, for example, via a human-machine interface of a valve module or remotely.

[0110] Advantageously, each fluid routing module within the system tends to be easily controllable by a system controller using a communication protocol such as, for example, EtherCAT or Ethernet.

[0111] Advantageously, the fluid routing module described above allows for multiple mounting options. For example, the fluid routing module can be suspended from the ceiling of a semiconductor manufacturing facility, which provides the advantage of not consuming floor space. Alternatively, the fluid routing module can be mounted on a stationary rack or other equipment.

[0112] In the above embodiment, the fluid routing module is implemented in semiconductor manufacturing equipment to route pumped process gas. However, in other embodiments, the fluid routing module can be implemented in different systems and used to route different types of fluids.

[0113] In the above embodiment, there is a single semiconductor processing tool with six process chambers. However, in other embodiments, there are two or more semiconductor processing tools. One or more of the semiconductor processing tools can have a different number of process chambers other than six.

[0114] In the above embodiment, there is a single fluid routing module with six pumping modules. However, in other embodiments, there may be a different number of fluid routing modules, i.e., multiple fluid routing modules. In some embodiments, one or more of the fluid routing modules can be composed of a different number of pumping modules other than six.

[0115] In the above-described embodiment, the pumping module includes two inlets coupled to two outlets. However, in other embodiments, one or more of the pumping modules include a different number (other than two) of inlets and a different number (other than two) of outlets. As an example, a pumping module can include two inlets coupled to a single common outlet.

[0116] In the above-described embodiment, each pumping module includes a restrictor module having a plurality of restrictors disposed along a first fluid line between a first fluid inlet and a fluid outlet. The restrictors are arranged in parallel with each other. Thereby, the above-described functions are provided. However, in other embodiments, the restrictor module is configured to variably restrict the flow of fluid between the first fluid inlet and the first fluid outlet in a different manner. For example, in some embodiments, the restrictor module includes one or more variable restrictors, i.e., one or more restrictors that can each be controlled to vary the degree to which the flow of fluid therethrough is restricted.

[0117] In the above-described embodiment, each of the plurality of restrictors is coupled in series to a respective restrictor valve. Additionally, a bypass valve is disposed in parallel with the restrictor valve. However, in other embodiments, one or more of the restrictor valves and / or the bypass valve can be replaced by a different arrangement or configuration of valves that provide the above-described functions. For example, in some embodiments, the plurality of valves (i.e., the restrictor valves and / or the bypass valve) can be replaced by a multi-way valve disposed at a junction of the corresponding fluid lines. This multi-way valve can be configured to direct fluid along one or more selected ones of the corresponding fluid lines.

[0118] In the above embodiment, the pumping chamber of the turbopump is pumped down via a limiter module. However, in other embodiments, instead of or in addition to the pumping chamber of the turbopump, a different entity (e.g., a process chamber) is pumped down via the limiter module.

[0119] In the above embodiment, the pumping chamber of the turbopump is pumped down using a restrictor orifice of monotonically increasing size. However, in other embodiments, the restrictor orifice is not of monotonically increasing size, and for example, the restrictor orifice can decrease in size in response to some criterion being met, such as the impact on a parallel process chamber.

[0120] In the above embodiment, the fluid flow is switched while passing through different restrictors in response to the passage of a time interval (e.g., 190 seconds). However, in other embodiments, the fluid flow is switched while passing through different restrictors in response to different criteria being met, for example, in response to the measured pressure or the rate of change of the measured pressure (e.g., decrease) in the pumping chamber satisfying a predetermined threshold. The switch to a larger restrictor size can be controlled by time and / or vacuum diagnostics of the turbopump. The optimization process can be performed to manage the maximum throughput versus the minimum time for pump-down.

[0121] In some embodiments, the APC module can be omitted or replaced by one or more valves.

Description of Reference Numerals

[0122] 100 Semiconductor manufacturing equipment 102 Semiconductor processing tool 104 Fluid routing module 106 First vacuum pump 107 Second vacuum pump 108 Process chamber 110a First fluid inlet Second fluid inlet of 110b Pumping module 112 First fluid outlet 114a Second fluid outlet 114b First fluid line manifold 116 Valve controller 118 Second fluid line manifold 122 First fluid line 200 Second fluid line 202 APC module 208 Turbo pump 210 Limiter module 212 Pressure sensor 214 Valve 216 First limiter 301 Second limiter 302 Third limiter 303 Fourth limiter 304 Fifth limiter 305 First limiter valve 311 Second limiter valve 312 Third limiter valve 313 Fourth limiter valve 314 Fifth limiter valve 315 Bypass line 320 Bypass valve 322 Process 400 Step S402 - 420 Process 500 Steps S502 - S510 Graph 600 x - axis 602 y - axis 604 First line 606 Second line 608 First time interval 611 Second time interval 612 Third time interval 613 Fourth time interval 614 Fifth time interval 615

Claims

1. A fluid routing module for a vacuum pump system, comprising: a first fluid inlet; a first fluid outlet; a first fluid line coupled between the first fluid inlet and the first fluid outlet; a restrictor module disposed along the first fluid line between the first fluid inlet and the first fluid outlet; wherein the restrictor module is configured to variably restrict the flow of fluid between the first fluid inlet and the first fluid outlet. A fluid routing module as claimed in claim 1.

2. The restrictor module comprises a plurality of restrictors disposed along the first fluid line between the first fluid inlet and the fluid outlet, the plurality of restrictors being arranged in parallel with each other, each of the plurality of restrictors being configured to restrict the flow of fluid through the respective restrictor, the fluid routing module further comprising means configured to selectively direct the flow of fluid through one or more selected ones of the plurality of restrictors while preventing the flow of fluid through the other restrictors of the plurality of restrictors.

3. The means configured to selectively direct the flow of fluid through one or more selected ones of the plurality of restrictors comprises a plurality of valves, each of the plurality of valves being arranged in series with a respective one of the plurality of restrictors.

4. a bypass line disposed in parallel with the restrictor module and enabling the flow of fluid to bypass the plurality of restrictors; one or more further valves configured to selectively direct the flow of fluid through either the bypass line or the plurality of restrictors; A fluid routing module as claimed in claim 2 or 3, further comprising the above.

5. A fluid routing module as claimed in claim 3 or 4, further comprising a valve controller configured to control the operation of the valves.

6. A fluid routing module as claimed in any one of claims 2 to 5, wherein each of the plurality of restrictors is configured to restrict the flow of fluid through the respective restrictor to a different extent.

7. A fluid routing module as claimed in claim 6, wherein each of the plurality of restrictors comprises a flow restriction orifice having a different respective diameter.

8. The fluid routing module according to any one of claims 1 to 7, further comprising a vacuum pump disposed along the first fluid line between the first fluid inlet and the restrictor module.

9. The fluid routing module according to claim 8, wherein the vacuum pump is a turbo pump.

10. A second fluid inlet, A second fluid outlet A second fluid line coupled between the second fluid inlet and the second fluid outlet, One or more valves disposed along the second fluid line, The fluid routing module according to any one of claims 1 to 9, further comprising.

11. A semiconductor processing tool including a process chamber, A fluid routing module according to any one of claims 1 to 10, wherein the first fluid inlet is fluidly coupled to the process chamber, A vacuum pump operatively coupled to the first fluid outlet, A system comprising.

12. The semiconductor processing tool further comprises one or more additional process chambers, The system further comprises one or more additional fluid routing modules, Each of the additional fluid routing modules is a fluid routing module according to any one of claims 1 to 10, and the first fluid inlet of each of the additional fluid routing modules is fluidly coupled to a respective additional process chamber, The system further comprises a fluid line manifold, and the first fluid outlet of each of the fluid routing module and the additional fluid routing modules is fluidly coupled to the fluid line manifold, The system according to claim 11, wherein the vacuum pump is operatively coupled to the fluid line manifold.

13. The fluid routing module is as described in claim 10, The second fluid inlet is fluidly coupled to the process chamber, The system according to claim 11 or 12, further comprising a vacuum pump operatively coupled to a second fluid outlet.

14. A method of routing a fluid through a fluid routing module, the fluid routing module being as described in any one of claims 1 to 10, the method comprising Receiving a fluid flow at a first fluid inlet; Variably restricting the fluid passing through the restrictor module by the restrictor module; Subsequently, the step of the fluid flowing out from the first fluid outlet. A method comprising.

15. The fluid routing module, A vacuum pump disposed along the first fluid line between the first fluid inlet and the restrictor module; A bypass line arranged to allow fluid flow to the flow restriction portion of the restrictor module; Means configured to selectively direct the fluid flow through the bypass line; Further comprising, The method further includes controlling the further means in response to one or more conditions being satisfied such that the fluid flows through the bypass line, thereby bypassing the flow restriction portion of the restrictor module. The method according to claim 14, wherein the one or more conditions include a condition that the pressure in the pumping chamber of the vacuum pump is less than a threshold pressure.

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