Indicating a substrate, a mold assembly, a bonding display module, and a display device

Abstract

The present invention provides a display substrate, a mold assembly, a bonded display module, and a display device. The display substrate includes a backplane, a plurality of light-emitting units, and a sealing layer. The backplane has opposing first and second main surfaces and a plurality of side surfaces connecting the first and second main surfaces. The plurality of light-emitting units are located on the first main surface. The sealing layer is at least partially located on the first main surface and covers the plurality of light-emitting units. The bonded display module includes a plurality of bonding units, the bonding unit includes a bonding frame and the display substrate, the display substrate is fixed to the bonding frame, the light-emitting unit is separated from the bonding frame, and the bonding frames of adjacent bonding units are joined to each other. The display device includes the display substrate or the bonded display module.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and particularly to a display substrate, a mold assembly, a bonded display module, and a display device.

Background Art

[0002] Mini-LED and Micro LED are new types of LED display technologies derived from small-pitch LEDs, also known as sub-millimeter light-emitting diodes. They are not only thin and light but also have a high display effect, with advantages such as a high contrast ratio and long lifespan, so the trend of use in the display field is becoming prominent.

Summary of the Invention

Means for Solving the Problems

[0003] The present invention provides a display substrate, a mold assembly for manufacturing the same, a manufacturing method, and a display device.

[0004] According to a first aspect of an embodiment of the present invention, a display substrate is provided. The display substrate includes a backplane having a first main surface and a second main surface facing each other, and a plurality of side surfaces connecting the first main surface and the second main surface, a plurality of light-emitting units located on the first main surface, and a sealing layer at least partially located on the first main surface and covering the plurality of light-emitting units.

[0005] In one embodiment, at least one of the plurality of side surfaces is a selected side surface, and the sealing layer includes a first sub-sealing portion covering the selected side surface.

[0006] In one embodiment, the first sub-sealing portion is integrally formed with a portion of the sealing layer located on the first main surface.

[0007] In one embodiment, the side surface of the first sub-sealing portion is an inclined surface, the angle formed between the inclined surface and the first main surface is an acute angle, or the side surface of the first sub-sealing portion is perpendicular to the first main surface.

[0008] In one embodiment, when the side surface of the sub-sealing portion is an inclined surface, the distance D1 from the light-emitting unit with the smallest distance from the side surface of the first sub-sealing portion to the edge of the first sub-sealing portion satisfies the following relational expression:

[0009]

Number

[0010] However, H is the thickness of the portion of the encapsulation layer located on the first main surface, n is the refractive index of the encapsulation layer, and θ is the angle formed between the inclined surface and the first main surface. When the side surface of the first sub-sealing portion is perpendicular to the first main surface, the distance D2 from the light-emitting unit with the smallest distance from the first sub-sealing portion to the edge of the first sub-sealing portion satisfies the following relational expression:

[0011]

Number

[0012] However, H is the thickness of the portion of the encapsulation layer located on the first main surface, and n is the refractive index of the encapsulation layer.

[0013] In one embodiment, when the side surface of the first sub-sealing portion is an inclined surface, the angle formed between the inclined surface and the first main surface is 85° or more.

[0014] In one embodiment, the display substrate further includes a plurality of electrodes provided on the first main surface, a connection lead at least partially provided on at least one of the selection side surfaces, and a driving circuit provided on the second main surface. The plurality of electrodes are electrically connected to the plurality of light-emitting units, and the connection lead electrically connects the driving circuit and the electrodes.

[0015] In one embodiment, the display substrate further includes a driving circuit provided in an edge region of the second main surface, and the encapsulation layer further includes a second sub-encapsulation portion that covers the driving circuit.

[0016] In one embodiment, the plurality of side surfaces are all selected side surfaces, the encapsulation layer includes a first sub-encapsulation portion that covers each of the selected side surfaces, and the second sub-encapsulation portion is annular.

[0017] In one embodiment, the color of the encapsulation layer is black.

[0018] According to a second aspect of an embodiment of the present invention, a mold assembly for manufacturing a display substrate is provided. The display substrate includes a backplane, a plurality of light-emitting units, and an encapsulation layer. The backplane has a first main surface and a second main surface facing each other, and a plurality of side surfaces connecting the first main surface and the second main surface. The plurality of light-emitting units are located on the first main surface, and the encapsulation layer is at least partially located on the first main surface and covers the plurality of light-emitting units. The mold assembly includes a first sub-mold and a second sub-mold. The first sub-mold includes a first mold body and an auxiliary structure. The auxiliary structure is provided on one side of the first mold body and is configured to fix the second main surface of the backplane to the first mold body. The second sub-mold includes a second mold body. An accommodation groove for accommodating a sealing material for manufacturing the encapsulation layer is provided in the second mold body. When the first sub-mold and the second sub-mold are clamped, an edge of the auxiliary structure abuts against the second mold body to close the accommodation groove.

[0019] In one embodiment, the auxiliary structure includes a release film, or the auxiliary structure is a rigid structure.

[0020] In one embodiment, the auxiliary structure includes a flat plate portion and a boss structure located on a side of the flat plate portion away from the first mold body. An edge of the boss structure is located inside an edge of the flat plate portion. A width of the flat plate portion is larger than a width of the accommodation groove, and a width of the boss structure is smaller than the width of the accommodation groove. When the first sub-mold and the second sub-mold are clamped, an edge portion of the flat plate portion abuts against the second mold body, and the boss structure enters the accommodation groove.

[0021] In one embodiment, a driving circuit is provided in an edge region of the second main surface, and a concave groove is provided in a surface edge region of the auxiliary structure away from the first mold body. The concave groove is configured such that a part of a sealing material for manufacturing the sealing layer enters between the concave groove and the second main surface of the backplane to form a second sub-sealing portion covering the driving circuit.

[0022] In one embodiment, the concave groove is an annular groove.

[0023] According to a third aspect of an embodiment of the present invention, a method for manufacturing a display substrate is provided. The method for manufacturing the display substrate is applied to the above mold assembly. A width of the backplane is smaller than a width of the accommodation groove. The manufacturing method includes fixing the second main surface of the backplane to a side of the auxiliary structure away from the first mold body, wherein a plurality of light-emitting units are provided on the first main surface of the backplane; filling a sealing material for manufacturing a sealing layer into the accommodation groove of the second sub-mold; clamping the first sub-mold and the second sub-mold, causing an edge portion of the auxiliary structure to abut against the second mold body so as to close the accommodation groove, and immersing the light-emitting unit in the sealing material for manufacturing the sealing layer; performing a vacuum pumping process on the accommodation groove, and then heating the first sub-mold and the second sub-mold to cure the sealing material for manufacturing the sealing layer by heat to form a sealing layer at least partially covering the light-emitting unit; Releasing the first sub-mold and the second sub-mold to obtain the display substrate, and the like.

[0024] According to a fourth aspect of an embodiment of the present invention, a bonded display module is provided. The bonded display module includes a plurality of bonding units. The bonding unit includes a bonding frame and the above-mentioned display substrate. The display substrate is fixed to the bonding frame. The light-emitting unit is separated from the bonding frame, and the bonding frames of adjacent bonding units are bonded to each other.

[0025] In one embodiment, the interval between adjacent light-emitting units on the display substrate is a first interval. In two adjacent bonding units, the interval between a light-emitting unit close to the edge of the display substrate in one bonding unit and the light-emitting unit with the smallest distance from the light-emitting unit in the other bonding unit is a second interval, and the first interval and the second interval are substantially the same.

[0026] In one embodiment, in the bonding unit, the edge of the sealing layer is located inside the edge of the bonding frame, and the edge of the backplane is located inside the edge of the sealing layer.

[0027] In one embodiment, the distance between two adjacent light-emitting units on the display substrate is a first distance. Among two adjacent bonding units, the light-emitting unit with the smallest distance from the other bonding unit in one of the bonding units is a first light-emitting unit, and the light-emitting unit with the smallest distance from the first light-emitting unit in the other bonding unit is a second light-emitting unit. The minimum distance between the first light-emitting unit and the edge of the backplane of the display substrate where the first light-emitting unit is located is a first distance. The minimum distance between the second light-emitting unit and the edge of the backplane of the display substrate where the second light-emitting unit is located is a second distance. In the display substrate where the first light-emitting unit is located, the minimum distance from the edge of the backplane with the smallest distance from the first light-emitting unit to the edge of the encapsulation layer is a third distance. In the display substrate where the second light-emitting unit is located, the minimum distance from the edge of the backplane with the smallest distance from the second light-emitting unit to the edge of the encapsulation layer is a fourth distance. In two adjacent bonding units, the dimension D of the seam between two adjacent side edges of the two encapsulation layers satisfies the following relational expression: D≧d1 - S1 - A1 - S2 - A2 - 2δ where d1 is the first distance, S1 is the first distance, S2 is the second distance, A1 is the third distance, A2 is the fourth distance, and δ is the maximum process positive deviation during the thinning process for the side portion of the encapsulation layer. Here, the first distance, the first distance, the second distance, the third distance, the fourth distance, and the dimension of the seam are all dimensions in the same direction.

[0028] According to a fifth aspect of an embodiment of the present invention, a display device is provided. The display device includes the above display substrate or the above bonding display module.

Brief Description of the Drawings

[0029]

Figure 1

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Figure 10

Best Mode for Carrying Out the Invention

[0030] Here, the exemplary embodiments shown in the drawings will be described in detail. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not mean all embodiments that conform to the present invention. On the contrary, these are merely examples of apparatuses and methods that conform to some aspects of the present invention, which are described in detail in the appended claims.

[0031] The terms used in the present invention are only for explaining specific embodiments and do not limit the present invention. The singular forms "a", "the" and "said" used in the specification of the present invention and the appended claims are intended to include plural forms unless the context clearly indicates otherwise. As understood, the term "and / or" used herein means any or all possible combinations of one or more related items.

[0032] In the present invention, terms such as "first", "second", "third", etc. are used to explain various information, but it should be understood that these information should not be limited to these terms. These terms are only used to distinguish the same type of information. For example, without departing from the scope of the present invention, the first information may be called the second information, and similarly, the second information may be called the first information. Depending on the context, the term "when..." used herein may be interpreted as "when...", "during...", or "at...".

[0033] Embodiments of the present invention provide a display substrate, a manufacturing method, a mould assembly, a spliced display module, and a display device. Hereinafter, with reference to the accompanying drawings, the display substrate, the manufacturing method, the mould assembly, the spliced display module, and the display device in the embodiments of the present invention will be described in detail. The features of the following embodiments can be complemented or combined with each other as long as they do not conflict.

[0034] Embodiments of the present invention provide a display substrate. As shown in FIGS. 1 to 4, the display substrate includes a backplane 10, a plurality of light-emitting units 20, and a sealing layer 30.

[0035] The backplane 10 has opposing first and second main surfaces 11 and 12, and a plurality of side surfaces 13 connecting the first main surface 11 and the second main surface 12. The plurality of light-emitting units 20 are located on the first main surface 11. The encapsulation layer 30 is at least partially located on the first main surface 11 and covers the plurality of light-emitting units 20.

[0036] In the display substrate according to the embodiment of the present invention, since the encapsulation layer 30 covers the plurality of light-emitting units 20, the encapsulation layer 30 can protect the light-emitting units 20, and also contributes to reducing the reflectance of ambient light incident on the display substrate and improving the display effect of the display substrate.

[0037] In one embodiment, the backplane 10 includes a substrate and a driving circuit layer provided on one side of the substrate. Here, the substrate may be a flexible substrate or a rigid substrate. The material of the flexible substrate may include one or more of polyimide, polyethylene terephthalate, polycarbonate, and organic resin materials, and the organic resin materials may include epoxy resin, triazine, silicone resin, or polyimide. Examples of the rigid substrate include any of a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a single-crystalline semiconductor substrate or a polycrystalline semiconductor substrate made of silicon or silicon carbide, a compound semiconductor substrate such as silicon germanium, and an SOI (Silicon On Insulator) substrate.

[0038] The driving circuit layer includes, for example, structures such as a plurality of pixel circuits and a plurality of signal lines. The plurality of pixel circuits correspond one-to-one with the plurality of light-emitting units 20. The pixel circuit is electrically connected to the corresponding light-emitting unit 20 and is configured to drive the corresponding light-emitting unit 20 to emit light.

[0039] In one embodiment, at least one side surface 13 of the plurality of side surfaces 13 of the backplane 10 is a selected side surface 131. As shown in FIG. 5, the display substrate further includes a plurality of electrodes 14 provided on the first main surface 11, a connection lead 15 at least a part of which is provided on at least one of the selected side surfaces 131, and a driving circuit (not shown) provided on the second main surface 12. The plurality of electrodes 14 are electrically connected to the plurality of light-emitting units 20, and the connection lead 15 electrically connects the driving circuit and the electrodes 14. The plurality of electrodes 14 are electrically connected to the plurality of light-emitting units 20 via a pixel circuit, and the plurality of electrodes 14 are electrically connected to a driving circuit provided on the second main surface 12 via the connection lead 15. The driving circuit may be a driving chip or a flexible circuit board. Here, the connection lead 15 may include three parts: a part located in the edge region of the first main surface 11 and connected to the electrode 14, a part located on the selected side surface 131, and a part located on the second main surface 12 and electrically connected to the driving circuit.

[0040] By providing the connection lead 15 at least partially on the selected side surface 131 of the backplane 10 and using the plurality of connection leads 15 to connect the plurality of electrodes located on the first main surface 11 of the backplane 10 to the second main surface of the backplane, the plurality of electrodes 14 can be electrically connected to a driving chip or a flexible circuit board provided on the second main surface 12 via the plurality of connection leads 15. In this way, it is not necessary to provide a bonding region at the edge of the display substrate, the frame of the display substrate becomes smaller, and a display substrate with an ultra-narrow frame can be obtained. Here, the flexible circuit board may be bonded to the second main surface 12 of the backplane 10 by a COG (Chip On Glass) process.

[0041] In one embodiment, as shown in FIG. 5, the display substrate includes a display area AA and a peripheral area BB located on at least one side of the display area AA. In the embodiment shown in FIG. 5, the peripheral area BB surrounds the display area AA. A plurality of light-emitting units 20 are provided in the display area AA of the display substrate, and a plurality of electrodes 14 are provided in the peripheral area BB of the display substrate. The edge area of the backplane 10 may be located in the peripheral area BB.

[0042] In one embodiment, the light-emitting unit 20 includes, but is not limited to, an Organic Light-Emitting Diode (abbreviated as OLED), a mini Organic Light-Emitting Diode (abbreviated as mini LED), a micro Organic Light-Emitting Diode (abbreviated as micro LED), etc.

[0043] In one embodiment, the plurality of light-emitting units 20 are divided into a plurality of pixel units, and each pixel unit includes light-emitting units 20 of at least three different emission colors. The light-emitting units 20 of at least three different emission colors include, for example, a light-emitting unit of a first color, a light-emitting unit of a second color, and a light-emitting unit of a third color. The first color, the second color, and the third color are the primary colors, and the primary colors are, for example, red, green, and blue.

[0044] In one embodiment, the shapes of the first main surface 11 and the second main surface 12 of the backplane 10 are, for example, rectangular, and the backplane 10 has four side surfaces 13. In other embodiments, the first main surface 11 and the second main surface 12 of the backplane 10 may be other shapes such as pentagons and hexagons.

[0045] In one embodiment, the portion of the encapsulation layer 30 located on the first main surface 11 covers the plurality of light-emitting units 20 and fills the gap regions between adjacent light-emitting units 20. In the portion of the encapsulation layer 30 located on the first main surface 11, the thickness of the portion covering the plurality of light-emitting units 20 may be smaller than the thickness of the portion filling the gap regions between adjacent light-emitting units 20, whereby the surfaces of various parts of the encapsulation layer 30 can be made substantially flush. Exemplarily, first, an encapsulant is applied to the first main surface 11 of the backplane 10, and then the surface of the encapsulant is polished to ensure that the surfaces of various parts of the obtained encapsulation layer 30 are substantially flush.

[0046] In one embodiment, as shown in FIGS. 1 to 4, at least one of the plurality of side surfaces 13 is a selected side surface 131, and the encapsulation layer 30 includes a first sub-encapsulation portion 31 that covers the selected side surface 131. The first sub-encapsulation portion 31 can protect the selected side surface 131 of the backplane 10. In the embodiment shown in FIGS. 1 to 4, each side surface 13 of the backplane 10 is a selected side surface 131, that is, the encapsulation layer 30 covers each side surface 13 of the backplane 10. The first sub-encapsulation portion 31 protects the portion of the connection lead 15 located on the selected side surface 131 and serves to provide electrical insulation and prevent corrosion by moisture and oxygen, so that problems such as damage, peeling, disconnection, and oxidation of the plurality of connection leads 15 from the outside can be avoided.

[0047] In one embodiment, the first sub-encapsulation portion 31 is integrally formed with the portion of the encapsulation layer 30 located on the first main surface 11. That is, each part of the encapsulation layer 30 is manufactured simultaneously with the same material, contributing to the simplification of the manufacturing process of the encapsulation layer 30.

[0048] In one embodiment, in the manufacturing process of the display substrate, after the manufacturing process of the sealing layer 30 is completed, if the thickness of the first sub-sealing portion 31 covering the backplane 10 (the dimension of the first sub-sealing portion 31 in the direction parallel to the first main surface 11) is too large, when the display substrate is used in a tiled display module, the dimension of the seam will be too large. In this case, a thinning process can be performed on the side portion of the first sub-sealing portion 31. In some embodiments, the thinning process can be performed on the first sub-sealing portion 31 by a laser cutting process, a polishing process, or a cutter wheel cutting method. After the thinning process is performed on the side portion of the first sub-sealing portion 31, the side surface of the first sub-sealing portion 31 may be perpendicular to the first main surface 11, or the side surface of the first sub-sealing portion 31 may be an inclined surface.

[0049] In one embodiment, as shown in FIGS. 1 and 3, the side surface of the first sub-sealing portion 31 is perpendicular to the first main surface 11.

[0050] When the side surface of the first sub-sealing portion 31 is perpendicular to the first main surface 11, the distance D2 from the light-emitting unit 20 with the smallest distance from the first sub-sealing portion 31 to the edge of the first sub-sealing portion 31 satisfies the following relational expression.

[0051]

Equation

[0052] However, H is the thickness of the portion of the sealing layer located on the first main surface, more precisely, the maximum thickness of the portion of the sealing layer located on the first main surface, and n is the refractive index of the sealing layer.

[0053] By doing so, the light rays emitted by the light-emitting unit 20 that is closest to the first sub-sealing portion 31 can all be emitted through the surface that is away from the first main surface 11 of the sealing layer 30, avoiding the emission of light rays from the side surface of the first sub-sealing portion 31. When the display substrate is used for a splicing screen, visual defects at the seam can be avoided.

[0054] In another embodiment, as shown in FIG. 4, the side surface of the first sub-sealing portion 31 is an inclined surface, and the angle θ formed between the inclined surface and the first main surface 11 is an acute angle.

[0055] When the side surface of the sub-sealing portion 31 is an inclined surface, the distance D1 from the light-emitting unit closest to the side surface of the first sub-sealing portion 31 to the edge of the first sub-sealing portion 31 satisfies the following relational expression.

[0056]

Equation

[0057] However, H is the thickness of the portion of the sealing layer located on the first main surface, n is the refractive index of the sealing layer, and θ is the angle formed between the inclined surface and the first main surface 11. The edge of the first sub-sealing portion 31 refers to the position where the distance between the first sub-sealing portion 31 and the backplane 10 is the largest.

[0058] By doing so, the light rays emitted by the light-emitting unit 20 that is closest to the first sub-sealing portion 31 can all be emitted through the surface that is away from the first main surface 11 of the sealing layer 30, avoiding the emission of light rays from the side surface of the first sub-sealing portion 31. When the display substrate is used for a bonded display module, visual defects at the seam can be avoided.

[0059] In one embodiment, when the thickness H, refractive index n of the sealing layer 30, and the angle θ formed between the side surface of the sub-sealing portion 31 and the first main surface 11 take different values, the minimum distance from the light-emitting unit with the smallest distance from the side surface of the first sub-sealing portion 31 to the edge of the first sub-sealing portion 31 is shown in Table 1 below.

[0060] [Table 1]

[0061] As can be seen from Table 1, when the thickness H and refractive index n of the sealing layer 30 are constant, the smaller the angle θ formed between the side surface of the sub-sealing portion 31 and the first main surface 11, the larger the minimum distance from the light-emitting unit with the smallest distance from the side surface of the first sub-sealing portion 31 to the edge of the first sub-sealing portion 31. When the refractive index n of the sealing layer 30 and the angle θ formed between the side surface of the sub-sealing portion 31 and the first main surface 11 are constant, the larger the thickness H of the sealing layer 30, the larger the minimum distance from the light-emitting unit with the smallest distance from the side surface of the first sub-sealing portion 31 to the edge of the first sub-sealing portion 31. When the thickness H of the sealing layer 30 and the angle θ formed between the side surface of the sub-sealing portion 31 and the first main surface 11 are constant, the larger the refractive index n of the sealing layer 30, the smaller the minimum distance from the light-emitting unit with the smallest distance from the side surface of the first sub-sealing portion 31 to the edge of the first sub-sealing portion 31.

[0062] In some embodiments, when the side surface of the first sub-sealing portion 31 is an inclined surface, the angle formed by the inclined surface and the first main surface 11 is 85° or more. By doing so, since the angle θ formed by the inclined surface of the first sub-sealing portion 31 and the first main surface 11 is too small, the distance D1 from the light-emitting unit with the smallest distance from the side surface of the first sub-sealing portion 31 to the edge of the first sub-sealing portion 31 is too large. When the display substrate is used for a splicing screen, the distance between adjacent light-emitting units of two adjacent display substrates becomes larger than the interval between adjacent light-emitting units inside the display substrate, and it is possible to avoid affecting the display effect at the joint of the splicing screen. In some embodiments, the angle θ between the inclined surface and the first main surface 11 is 85°, 86°, 87°, 88°, 89°, 90°, etc.

[0063] In one embodiment, as shown in FIG. 3, the encapsulation layer 30 further includes a second sub-encapsulation portion 32 that covers the driving circuit provided on the second main surface 12. The second sub-encapsulation portion 32 protects the driving circuit and serves to provide electrical insulation and prevent corrosion by moisture and oxygen, and it is possible to avoid problems such as damage, peeling, disconnection, and oxidation of the driving circuit from the outside.

[0064] In one embodiment, the first sub-encapsulation portion 31, the second sub-encapsulation portion 32, and the portion of the encapsulation layer 30 located on the first main surface 11 are integrally formed.

[0065] In one embodiment, the width of the second sub-encapsulation portion 32 is equal to or greater than the width of the driving circuit provided on the second main surface 12, whereby the protective effect of the second sub-encapsulation portion 32 on the driving circuit becomes better. Generally, the width of the driving circuit provided on the second main surface 12 is about 2 μm to 3 μm, and the width of the second sub-encapsulation portion 32 may be 3 μm or more.

[0066] In one embodiment, as shown in FIG. 3, all of the plurality of side surfaces 13 are selected side surfaces 131, the sealing layer 30 includes a first sub-sealing portion 31 covering each of the selected side surfaces 131, and the second sub-sealing portion 32 is annular. In the manufacturing process of the sealing layer 30, the sealing material for manufacturing the sealing layer 30 flows through the side surface 13 of the backplane 10 to the second main surface 12 of the backplane 10. The portion of the sealing material covering the side surface 13 forms the first sub-sealing portion 31, and the portion of the sealing material flowing to the second main surface 12 of the backplane 10 forms the second sub-sealing portion 32. When each side surface 13 of the backplane 10 is a selected side surface 131, the second sub-sealing portion 32 formed on the second main surface 12 of the backplane 10 is annular. When the display substrate is used in the bonding display module, the display substrate needs to be attached to the bonding frame. By providing the second sub-sealing portion 32 in an annular shape, when the display substrate is attached to the bonding frame, the second sub-sealing portion 32 contacts the bonding frame, ensuring that the display substrate is stably attached to the bonding frame and avoiding the inclination of the display substrate.

[0067] In one embodiment, the sealing layer 30 may be reused as a light ray adjusting layer for adjusting the transmittance of incident light and emitted light. Installed in this way, the sealing layer 30 can effectively reduce the reflectance of the ambient light incident on the display substrate and improve the display effect of the display substrate. In some embodiments, the color of the sealing layer 30 is black. For example, the material of the sealing layer 30 may be black silica gel or black resin. The maximum thickness of the sealing layer 30 may be 250 μm or more. The selection of the transmittance of the sealing layer 30 is to ensure that most of the light rays emitted from the light emitting unit 20 can pass through the sealing layer 30 when the display substrate is displaying, and after the external ambient light rays enter the display substrate when the display substrate is not displaying, a part of the light rays is absorbed by the sealing layer 30 to ensure that the reflectance of the ambient light is reduced.

[0068] In one embodiment, a plurality of alignment marks are provided on the second main surface 12 of the backplane 10. The plurality of alignment marks include marks for alignment in the COG process. The marks for alignment in the COG process may include a pre-pressure mark for alignment when fixing the anisotropic conductive adhesive to the second main surface 12 of the backplane 10 and a main-pressure mark for alignment when fixing the flexible circuit board to the anisotropic conductive adhesive. Thus, the flexible circuit board is bonded to the backplane via the anisotropic conductive adhesive.

[0069] The plurality of alignment marks may further include marks for alignment when performing a thinning process on the side portion of the sealing layer 30. The marks may be used for alignment when bonding a plurality of display substrates, that is, the same alignment marks are reused in different processes, and thus, the number of alignment marks can be reduced.

[0070] An embodiment of the present invention further provides a mold assembly for manufacturing a display substrate. The display substrate is the display substrate described in any of the above embodiments.

[0071] As shown in FIGS. 6 to 8, the mold assembly includes a first sub-mold 40 and a second sub-mold 50.

[0072] The first sub-mold 40 includes a first mold body 41 and an auxiliary structure 42. The auxiliary structure 42 is provided on one side of the first mold body 41 and is configured to fix the second main surface 12 of the backplane 10 to the first mold body 41. The second sub-mold 50 includes a second mold body 51. A receiving groove 511 is provided in the second mold body 51 and is used to receive a sealing material 301 for manufacturing the sealing layer 30. When the first sub-mold 40 and the second sub-mold 50 are clamped, the edge of the auxiliary structure 42 abuts against the second mold body 51 to close the receiving groove 511.

[0073] Embodiments of the present invention further provide a method for manufacturing a display substrate applied to the above mold assembly. The width of the backplane 10 is smaller than the width of the receiving groove 511. As shown in FIG. 9, the manufacturing method includes the following steps 110 to 150.

[0074] In step 110, the second main surface of the backplane is fixed to the side away from the first mold body of the auxiliary structure. A plurality of light-emitting units are provided on the first main surface of the backplane.

[0075] Before step 110, first, a plurality of light-emitting units 20 are installed on the first main surface of the backplane 10.

[0076] In this step, the second main surface 12 of the backplane 10 is fixed to the first sub-mold 40 via the auxiliary structure 42. The width of the auxiliary structure 42 is larger than the width of the backplane 10. After the backplane 10 is fixed to the auxiliary structure 42, the edge of the backplane 10 is located inside the edge of the auxiliary structure 42, and there is a certain distance between the edge of each part of the backplane 10 and the edge of the auxiliary structure 42.

[0077] In one embodiment, as shown in FIGS. 6 to 8, the auxiliary structure 42 is provided with a plurality of through holes 421 penetrating the auxiliary structure 42, and the first mold body 41 is provided with a plurality of through holes 411 penetrating the first sub-mold body 41, and the through holes 411 of the first sub-mold body 41 communicate with the through holes 421 of the auxiliary structure 42. By performing vacuum suction through the through holes 411, the auxiliary structure 42 is fixed to the surface away from the first mold body 41 of the auxiliary structure 42 by vacuum adsorption.

[0078] In one embodiment, the auxiliary structure 42 includes a release film. When the auxiliary structure 42 is a release film, after the manufacturing of the display substrate is completed, the release film can be separated from the first mold body 41 together with the display substrate. At this time, the first sub-mold 40 may be replaced with a new release film for the production of the next display substrate. The material of the release film may be a low-tack material in order to facilitate separation from the first mold body 41.

[0079] In another embodiment, the material of the auxiliary structure 42 may be a viscous material. The surface of the auxiliary structure 42 facing the first mold body 41 is fixed to the first mold body by vacuum adsorption, and the surface of the auxiliary structure 42 away from the first mold body is adhered to the second surface of the backplane 10, so that the backplane 10 is fixed to the first sub-mold 40.

[0080] In other embodiments, the auxiliary structure 42 is a rigid structure. When the auxiliary structure 42 is a rigid structure, the backplane 10 can be fixed to the first mold body 41 by vacuum adsorption, and after the manufacturing of the display substrate is completed, the auxiliary structure 42 can be reused.

[0081] In one embodiment, as shown in FIGS. 7 and 8, the auxiliary structure 42 includes a flat plate portion 422 and a boss structure 423 located on the side of the flat plate portion 422 away from the first mold body 41. The edge of the boss structure 423 is located inside the edge of the flat plate portion 422. The width of the flat plate portion 422 is larger than the width of the accommodation groove 511, and the width of the boss structure 423 is smaller than the width of the accommodation groove 511.

[0082] In step 120, a sealing material for manufacturing a sealing layer is filled into the accommodation groove of the second sub-mold.

[0083] In this step, the sealing material 301 for manufacturing the sealing layer may be in a liquid state. After filling the accommodating groove 511 with the sealing material 301 for manufacturing the sealing layer, the distance between the surface of the sealing material 301 for manufacturing the sealing layer and the bottom surface of the accommodating groove 511 is smaller than the depth of the accommodating groove 511, so that later, after immersing the backplane 10 and the light-emitting unit 20 in the sealing material 301 for manufacturing the sealing layer, the amount of the sealing material 301 for manufacturing the sealing layer overflowing from the accommodating groove 511 is small.

[0084] In step 130, by clamping the first sub-mold and the second sub-mold, the edge portion of the auxiliary structure is brought into contact with the second mold body so as to close the accommodating groove, and the light-emitting unit is immersed in the sealing material for manufacturing the sealing layer.

[0085] In this step, first, the first sub-mold 40 is placed above the second sub-mold 50, and the light-emitting unit 20 provided on the backplane 10 fixed to the first sub-mold 40 is directed toward the accommodating groove 511. Then, the first sub-mold 40 and the second sub-mold 50 are clamped, and the edge portion of the auxiliary structure 42 abuts against the edge portion surrounding the accommodating groove 511 of the second mold body 51, so that the three of the auxiliary structure 42, the backplane 10, and the second mold body 51 cooperate to close the accommodating groove 511. Since the width of the backplane 10 is smaller than the width of the accommodating groove 511, the backplane 10 can enter the sealing material 301 for manufacturing the sealing layer in the accommodating groove 511, and a part of the sealing material 301 for manufacturing the sealing layer is located on the side surface of the backplane 10.

[0086] In one embodiment, as shown in FIGS. 7 and 8, when the auxiliary structure 42 includes a flat plate portion 422 and a boss structure 423 located on the side of the flat plate portion 422 away from the first mold body 41, the width of the backplane 10 is smaller than the width of the boss structure 423. When the first sub-mold 40 and the second sub-mold 50 are clamped, the edge of the flat plate portion 422 abuts against the second mold body 51, and the boss structure 423 enters the receiving groove 511. A part of the sealing material 301 for manufacturing the sealing layer 30 is located in the region surrounding the backplane 10 of the boss structure 423, and the sealing material in this part forms the first sub-sealing portion 31 of the sealing layer 30 later. By including the flat plate portion 422 where the auxiliary structure 42 abuts against the second mold body 51 to realize the closure of the receiving groove 511 and the boss structure 423 that better collects some of the sealing material 301 on the side surface of the backplane 10, the formability of the first sub-sealing portion 31 formed on the side surface of the backplane is improved, which contributes to the protection of the connection leads on the side surface of the backplane.

[0087] In some embodiments, the distance range between the edge of the boss structure 423 and the edge of the backplane 10 may be 0.3 mm or more, so that the dimension in the direction parallel to the first main surface 11 of the portion of the formed sealing layer 30 located on the side surface of the backplane 10 is 0.3 mm or more. When performing a thinning process on the portion of the sealing layer 30 located on the side portion of the backplane 10, even if there are process variations, it is ensured that the connection leads provided on the side surface of the backplane are not damaged.

[0088] In one embodiment, as shown in FIG. 8, a concave groove 401 is provided in a surface edge region of the auxiliary structure 42 away from the first mold body 41. The concave groove 401 is configured such that a part of the sealing material 301 for manufacturing the sealing layer enters between the concave groove 401 and the second main surface 12 of the backplane 10 to form a second sub-sealing portion 32 covering the driving circuit. The outer edge of the concave groove 401 is located outside the edge of the backplane 10, and the inner edge of the concave groove 401 is located inside the edge of the backplane 10. After the backplane 10 is immersed in the sealing material 301 for manufacturing the sealing layer, a part of the sealing material enters the space between the concave groove 401 and the backplane 10, and the material of this part later forms the second sub-sealing portion 32. The second sub-sealing portion 32 covers the driving circuit provided on the second main surface 12 of the backplane 10.

[0089] In one embodiment, the concave groove 401 is an annular groove. When installed in this way, the second sub-sealing portion 32 of the sealing layer 30 is annular, and the annular second sub-sealing portion 32 is located in the edge region of the second main surface 12 of the backplane 10.

[0090] In one example, as shown in FIG. 8, when the auxiliary structure 42 includes a flat plate portion 422 and a boss structure 423, the concave groove 401 is provided in the edge region of the boss structure 423.

[0091] In step 140, a vacuum pumping process is performed on the accommodation groove, and then the first sub-mold and the second sub-mold are heated to cure the sealing material for manufacturing the sealing layer by heat, thereby forming a sealing layer that at least partially covers the light-emitting unit.

[0092] In this step, by performing a vacuum pumping process on the accommodation groove 511, most of the air in the accommodation groove 511 can be drawn out, preventing air from mixing into the sealing material 301 for manufacturing the sealing layer 30 and bubbles from existing in the finally formed sealing layer 30. When the light rays emitted from the light-emitting unit 20 pass through the bubbles of the sealing layer 30, the path changes, which can prevent the display effect of the display substrate from being affected.

[0093] In step 150, the first sub-mold and the second sub-mold are demolded to obtain the display substrate.

[0094] In one embodiment, as shown in FIGS. 6 to 8, the second sub-mold further includes a release film 52. The release film 52 is partially attached to the bottom surface and the side surface of the accommodation groove 511 and is partially located on the top of the second mold body 51. When the first sub-mold 40 and the second sub-mold 50 are clamped, the auxiliary structure 42 abuts against the portion of the release film 52 located on the top of the second mold body 51. The installation of the release film 52 facilitates the separation of the display substrate from the second sub-mold 50.

[0095] In one embodiment, after step 150, the method for manufacturing the display substrate further includes a step of thinning the portion of the sealing layer 30 located on the side of the backplane 10. In some embodiments, the thinning process can be performed by a laser cutting process, a polishing process, or a cutter wheel cutting method.

[0096] The embodiment of the present invention further provides a bonded display module including a plurality of bonding units 100 as shown in FIG. 10. The bonding unit 100 includes a bonding frame 60 and the display substrate described in any of the above embodiments. The display substrate is fixed to the bonding frame 60. The light-emitting unit 20 is separated from the bonding frame 60, and the bonding frames 60 of the adjacent bonding units 100 are bonded to each other.

[0097] In one embodiment, the distance between two adjacent light-emitting units 20 on the display substrate is a first distance d1. In two adjacent bonding units 100, the distance between the light-emitting unit 20 close to the edge of the display substrate in one bonding unit 100 and the light-emitting unit 20 with the smallest distance from the said light-emitting unit 20 in the other bonding unit 100 is a second distance d2, and the first distance d1 and the second distance d2 are substantially the same. Here, the distance between adjacent light-emitting units 20 may be the distance between the adjacent side surfaces of the two adjacent light-emitting units 20. That the first distance and the second distance are substantially the same means that the first distance and the second distance are the same, or the difference between the first distance and the second distance is very small, for example, within a predetermined numerical range. By setting the first distance and the second distance to be substantially the same, the display effects at each location of the bonded display module can be made more consistent, contributing to the improvement of the user experience.

[0098] In one embodiment, as shown in FIG. 10, in the bonding unit 100, the edge of the sealing layer 30 is located inside the edge of the bonding frame 60, and the edge of the backplane 10 is located inside the edge of the sealing layer 30. By installing the backplane 10 and the sealing layer 30 in such a way that the edge of the backplane 10 is located inside the edge of the sealing layer 30 and the edge of the sealing layer 30 is located inside the edge of the bonding frame 60, it is possible to avoid damaging the connection leads installed on the side surface of the backplane 10 due to process errors during the process of thinning the side part of the sealing layer, ensure that there is a gap between adjacent sealing layers 30 after joining adjacent bonding frames 60, and avoid the adjacent sealing layers 30 affecting each other. Also, since the edge of the backplane 10 is located inside the edge of the sealing layer 30 and the edge of the sealing layer 30 is located inside the edge of the bonding frame 60, in two adjacent bonding units 100, the distance between the two bonding frames 60 is smaller than the distance between the two sealing layers 30, and the distance between the two sealing layers 30 is smaller than the distance between the two backplanes 10.

[0099] In one embodiment, as shown in FIG. 10, the distance between adjacent light-emitting units 20 on the display substrate is a first distance d1. Among two adjacent bonding units 100, the light-emitting unit 20 with the smallest distance from the other bonding unit in one of the bonding units is a first light-emitting unit 21. The light-emitting unit with the smallest distance from the first light-emitting unit 21 in the other bonding unit 100 is a second light-emitting unit 22. The minimum distance between the first light-emitting unit 21 and the edge 132 of the backplane 10 of the display substrate where the first light-emitting unit 21 is located is a first distance S1. The minimum distance between the second light-emitting unit 22 and the edge 133 of the backplane 10 of the display substrate where the second light-emitting unit 22 is located is a second distance S2. On the display substrate where the first light-emitting unit 21 is located, the minimum distance from the edge 132 of the backplane 10 with the smallest distance from the first light-emitting unit 21 to the edge 33 of the encapsulation layer 30 is a third distance A1. On the display substrate where the second light-emitting unit 22 is located, the minimum distance from the edge 133 of the backplane 10 with the smallest distance from the second light-emitting unit 22 to the edge 34 of the encapsulation layer 30 is a fourth distance A2.

[0100] The dimension D of the seam between adjacent side edges of two encapsulation layers 30 in two adjacent bonding units 100 satisfies the following relational expression. D≧d1 - S1 - A1 - S2 - A2 - 2δ Here, d1 is the first distance, S1 is the first distance, S2 is the second distance, A1 is the third distance, A2 is the fourth distance, and δ is the maximum process positive deviation when a thinning process is performed on the side portion of the encapsulation layer. Here, the first distance, the first distance, the second distance, the third distance, the fourth distance, and the dimension of the seam are all dimensions in the same direction.

[0101] The embodiment of the present invention further provides a display device including the display substrate described in any of the above embodiments.

[0102] In one embodiment, the display device further includes a housing, and the display substrate is fitted into the housing.

[0103] The display device according to an embodiment of the present invention may be any suitable display device. For example, it includes, but is not limited to, any product or component having a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, an e-book, etc.

[0104] Embodiments of the present invention further provide another display device including the bonding display module described in any of the above embodiments.

[0105] In one embodiment, the display device further includes a housing, and the bonding display module is fitted into the housing.

[0106] The display device according to an embodiment of the present invention may be any suitable display device. For example, it includes, but is not limited to, any product or component having a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, an e-book, etc.

[0107] Note that in the accompanying drawings, for clarity, the sizes of layers and regions may be exaggerated. Also, when an element or layer is referred to as being "on" another element or layer, it may be directly positioned on the other element, or an intermediate layer may exist. Also, when an element or layer is referred to as being "under" another element or layer, it may be directly positioned under the other element, or one or more intermediate layers or elements may exist. Also, when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or one or more intermediate layers or elements may exist. Similar reference numerals indicate similar elements.

[0108] After considering the specification and implementing the content disclosed herein, those skilled in the art can easily conceive of other embodiments of the present invention. The present invention is intended to cover any modifications, uses, or adaptive changes of the present invention, and these modifications, uses, or adaptive changes follow the general principles of the present invention and include known knowledge or conventional technical means in the technical field not disclosed in the present invention. The specification and examples are merely illustrative, and the true scope and spirit of the present invention are indicated by the following claims.

[0109] It should be noted that the present invention is not limited to the exact structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Description of Reference Numerals

[0110] 10 Backplane 11 First Main Surface 12 Second Main Surface 13 Side Surface 14 Electrode 15 Connection Lead 20 Light-Emitting Unit 30 Encapsulation Layer 31 First Sub-Encapsulation Portion 32 Second Sub-Encapsulation Portion 131 Selective Side Surface

Claims

1. A backplane having opposing first and second main surfaces and a plurality of side surfaces connecting the first and second main surfaces; A plurality of light-emitting units located on the first main surface; A sealing layer at least partially located on the first main surface and covering the plurality of light-emitting units. A display substrate characterized by the above.

2. At least one of the plurality of side surfaces is a selected side surface, and the sealing layer includes a first sub-sealing portion covering the selected side surface. The display substrate according to claim 1, characterized by the above.

3. The first sub-sealing portion is integrally formed with a portion of the sealing layer located on the first main surface. The display substrate according to claim 2, characterized by the above.

4. The side surface of the first sub-sealing portion is an inclined surface, and the angle formed by the inclined surface and the first main surface is an acute angle, or the side surface of the first sub-sealing portion is perpendicular to the first main surface. The display substrate according to claim 2, characterized by the above.

5. When the side surface of the sub-sealing portion is an inclined surface, the distance D from the light-emitting unit with the smallest distance from the side surface of the first sub-sealing portion to the edge of the first sub-sealing portion １ satisfies the following relational expression: 【Number 1】 However, H is the thickness of the portion of the sealing layer located on the first main surface, n is the refractive index of the sealing layer, and θ is the angle formed by the inclined surface and the first main surface. When the side surface of the first sub-sealing portion is perpendicular to the first main surface, the distance D from the light-emitting unit having the smallest distance from the first sub-sealing portion to the edge of the first sub-sealing portion ２ satisfies the following relational expression: 【Number 2】 However, H is the thickness of the portion of the sealing layer located on the first main surface, and n is the refractive index of the sealing layer. The display substrate according to claim 4, characterized by the above.

6. When the side surface of the first sub-sealing portion is an inclined surface, the angle formed by the inclined surface and the first main surface is 85° or more. The display substrate according to claim 4, characterized by the above.

7. Further including a plurality of electrodes provided on the first main surface, a connection lead at least partially provided on at least one of the selected side surfaces, and a driving circuit provided on the second main surface, wherein the plurality of electrodes are electrically connected to the plurality of light-emitting units, and the connection lead electrically connects the driving circuit and the electrodes. The display substrate according to claim 2, characterized by the above.

8. The display substrate further includes a driving circuit provided in an edge region of the second main surface, and the sealing layer further includes a second sub-sealing portion covering the driving circuit. The display substrate according to claim 1, characterized by the above.

9. All of the plurality of side surfaces are selected side surfaces, the sealing layer includes a first sub-sealing portion covering each of the selected side surfaces, and the second sub-sealing portion is annular. The display substrate according to claim 8, characterized by the above.

10. The color of the sealing layer is black. The display substrate according to claim 1, characterized in that...

11. A mold assembly for manufacturing a display substrate, wherein the display substrate includes a backplane, a plurality of light-emitting units, and a sealing layer, the backplane has opposing first and second main surfaces and a plurality of side surfaces connecting the first and second main surfaces, the plurality of light-emitting units are located on the first main surface, the sealing layer is at least partially located on the first main surface and covers the plurality of light-emitting units. The mold assembly includes a first sub-mold and a second sub-mold. The first sub-mold includes a first mold body and an auxiliary structure, the auxiliary structure is provided on one side of the first mold body and is configured to fix the second main surface of the backplane to the first mold body. The second sub-mold includes a second mold body, and the second mold body is provided with a receiving groove for receiving a sealing material for manufacturing the sealing layer. When the first sub-mold and the second sub-mold are clamped, the edge of the auxiliary structure abuts against the second mold body to close the receiving groove. A mold assembly for manufacturing a display substrate, characterized in that...

12. The auxiliary structure includes a release film, or the auxiliary structure is a rigid structure. The mold assembly for manufacturing a display substrate according to claim 11, characterized in that...

13. The auxiliary structure includes a flat plate portion and a boss structure located on the side of the flat plate portion away from the first mold body. The edge of the boss structure is located inside the edge of the flat plate portion. The width of the flat plate portion is larger than the width of the receiving groove, and the width of the boss structure is smaller than the width of the receiving groove. When the first sub-mold and the second sub-mold are clamped, the edge portion of the flat plate portion abuts against the second mold body, and the boss structure enters the receiving groove. The mold assembly for manufacturing a display substrate according to claim 11, characterized in that...

14. A driving circuit is provided in the edge region of the second main surface, and a concave groove is provided in the surface edge region of the auxiliary structure away from the first mold body. The concave groove is configured such that a part of the sealing material for manufacturing the sealing layer enters between the concave groove and the second main surface of the backplane to form a second sub-sealing portion covering the driving circuit. The mold assembly for manufacturing a display substrate according to claim 11, characterized in that...

15. The concave groove is an annular groove. A mold assembly for manufacturing the display substrate according to claim 14, characterized in that.

16. A method for manufacturing a display substrate applied to the mold assembly according to any one of claims 11 to 15, wherein the width of the backplane is smaller than the width of the accommodation groove, and the manufacturing method comprises: Fixing the second main surface of the backplane to the side of the auxiliary structure away from the first mold body, wherein a plurality of light-emitting units are provided on the first main surface of the backplane; Filling a sealing material for manufacturing a sealing layer into the accommodation groove of the second sub-mold; By clamping the first sub-mold and the second sub-mold, bringing the edge portion of the auxiliary structure into contact with the second mold body so as to close the accommodation groove, and immersing the light-emitting unit in the sealing material for manufacturing the sealing layer; Performing a vacuum pumping process on the accommodation groove, and then heating the first sub-mold and the second sub-mold to cure the sealing material for manufacturing the sealing layer by heat, thereby forming a sealing layer that at least partially covers the light-emitting unit; Releasing the first sub-mold and the second sub-mold to obtain the display substrate. A method for manufacturing a display substrate, characterized in that.

17. A bonded display module including a plurality of bonding units, wherein the bonding unit includes a bonding frame and the display substrate according to any one of claims 1 to 10, the display substrate is fixed to the bonding frame, the light-emitting unit is away from the bonding frame, and the bonding frames of adjacent bonding units are bonded to each other. A bonded display module, characterized in that.

18. The distance between adjacent light-emitting units on the display substrate is a first distance, and in two adjacent bonding units, the distance between the light-emitting unit close to the edge of the display substrate in one bonding unit and the light-emitting unit with the smallest distance from the light-emitting unit in the other bonding unit is a second distance, and the first distance and the second distance are substantially the same. The bonded display module according to claim 17, characterized in that.

19. In the bonding unit, the edge of the sealing layer is located inside the edge of the bonding frame, and the edge of the backplane is located inside the edge of the sealing layer. The bonding display module according to claim 17, characterized in that...

20. The distance between two adjacent light-emitting units on the display substrate is a first distance. Among two adjacent bonding units, the light-emitting unit with the smallest distance from the other bonding unit in one of the bonding units is a first light-emitting unit, and the light-emitting unit with the smallest distance from the first light-emitting unit in the other bonding unit is a second light-emitting unit. The minimum distance between the first light-emitting unit and the edge of the backplane of the display substrate where the first light-emitting unit is located is a first distance. The minimum distance between the second light-emitting unit and the edge of the backplane of the display substrate where the second light-emitting unit is located is a second distance. In the display substrate where the first light-emitting unit is located, the minimum distance from the edge of the backplane with the smallest distance from the first light-emitting unit to the edge of the encapsulation layer is a third distance. In the display substrate where the second light-emitting unit is located, the minimum distance from the edge of the backplane with the smallest distance from the second light-emitting unit to the edge of the encapsulation layer is a fourth distance. The dimension D of the seam between the adjacent side edges of the two encapsulation layers in the two adjacent bonding units satisfies the following relational expression: D ≥ d １ -S １ -A １ -S ２ -A ２ -2δ However, d １ is the first interval, S １ is the first distance, S ２ is the second distance, A １ is the third distance, A ２ is the fourth distance, δ is the maximum process positive deviation when performing the thinning process on the side portion of the sealing layer, where the first interval, the first distance, the second distance, the third distance, the fourth distance, and the dimensions of the seam are all dimensions in the same direction. The bonding display module according to claim 19, characterized in that...

21. Comprising the display substrate according to any one of claims 1 to 10, or comprising the bonding display module according to any one of claims 17 to 20. The display device, characterized in that...

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