Adhesive-imparting resin and method for producing the same

Abstract

The present invention relates to a tackifying resin containing repeating units (a) derived from petroleum resin monomers and repeating units (b) derived from phenolic monomers, wherein an ethylenically unsaturated compound containing an epoxy group is bonded to the repeating units (b). Since the tackifying resin has many residual double bonds, the heat resistance of an acrylic pressure-sensitive adhesive containing the same can be improved.

Description

Technical Field

[0001] The present invention relates to an adhesion - imparting resin and a method for producing the same.

Background Art

[0002] Adhesives are used as materials for fixing members in various fields such as automobiles, electronic and electrical products, and building materials.

[0003] For example, at an automobile manufacturing site, adhesives are used when fixing automobile interior members inside the automobile. Also, at manufacturing sites of electronic devices such as mobile phones and liquid crystal displays, adhesives are used for fixing cushioning materials provided inside electronic products to protect them from impact, fixing exterior members of electronic products, and fixing members constituting image display devices such as liquid crystal display devices, organic EL display devices, and PDPs.

[0004] From the viewpoint of reducing the environmental load, the conversion from solvent - based adhesives to water - based adhesives is progressing for the adhesives. Recently, water - based acrylic adhesives in which acrylic polymers and the like are dispersed in an aqueous medium are preferably used.

[0005] In general, for the acrylic adhesives, from the viewpoint of further improving adhesiveness such as adhesive strength and holding force under a constant load, an adhesion - imparting resin is often used in combination.

[0006] However, in the case of adhesion - imparting resins, the reactivity with acrylic polymers contained in acrylic adhesives is low, and the softening point is low, which may lead to deterioration of heat resistance.

[0007] Therefore, the need for an adhesion - imparting resin that can improve the heat resistance of acrylic adhesives is increasing.

Summary of the Invention

Problems to be Solved by the Invention

[0008] The technical problem to be solved by the present invention is to provide an adhesion - promoting resin that is excellent in reactivity with an acrylic polymer and improves the heat resistance of an acrylic pressure - sensitive adhesive, and a method for producing the same.

Means for Solving the Problem

[0009] One aspect of the present invention relates to an adhesion - promoting resin containing a repeating unit (a) derived from a petroleum - resin - based monomer and a repeating unit (b) derived from a phenol - based monomer, wherein an ethylenically unsaturated compound containing an epoxy group is bonded to the repeating unit (b).

[0010] Another aspect of the present invention relates to a method for producing an adhesion - promoting resin, which includes a step of producing a primary polymer from a first reaction composition containing a petroleum - resin - based monomer and a phenol - based monomer, and a step of producing an adhesion - promoting resin from the primary polymer and a second reaction composition containing an ethylenically unsaturated compound containing an epoxy group.

Effects of the Invention

[0011] The adhesion - promoting resin according to the present invention can have improved reactivity in relation to an acrylic polymer.

[0012] Also, the adhesion - promoting resin according to the present invention is excellent in reactivity with the acrylic polymer, and the heat resistance of an acrylic pressure - sensitive adhesive containing the acrylic polymer and the adhesion - promoting resin can be improved.

Modes for Carrying Out the Invention

[0013] Hereinafter, many aspects and various embodiments of the present invention will be described more specifically.

[0014] Terms and words used in this specification and the claims should not be construed as being limited to their ordinary or dictionary meanings. Based on the principle that the inventor can preferably define the concept of terms in order to explain his invention in the best way, they must be construed as meanings and concepts that conform to the technical idea of the present invention.

[0015] The terms used in the present invention are merely for explaining specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless clearly stated otherwise in the context. In the present invention, terms such as "comprising" or "having" are for specifying the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and it should be understood that they do not preclude in advance the possibility of the existence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0016] Specifically, one aspect of the present invention relates to a tackifying resin containing repeating unit (a) derived from a petroleum resin monomer and repeating unit (b) derived from a phenolic monomer, wherein an ethylenically unsaturated compound containing an epoxy group is bonded to the repeating unit (b).

[0017] For example, the petroleum resin monomer contains an ethylenically unsaturated group or an aromatic group.

[0018] For example, the tackifying resin contains repeating unit (a) derived from the petroleum resin monomer, repeating unit (b) derived from the phenolic monomer, and a structure in which an ethylenically unsaturated compound containing an epoxy group is bonded to the repeating unit (b), and the proportion of residual double bonds in the tackifying resin increases. Thereby, the reactivity of the tackifying resin with an acrylic polymer described later is improved. Thereby, the heat resistance of the pressure-sensitive adhesive containing the tackifying resin is improved.

[0019] For example, the tackifying resin contains an ethylenically unsaturated compound containing an epoxy group bonded to the repeating unit (b), and the proportion of residual double bonds further increases, thereby improving the reactivity between the tackifying resin and an acrylic polymer described later.

[0020] According to one embodiment, the repeating unit (b) can contain a hydroxyl group. For example, when the petroleum resin monomer and the phenol monomer are catalytically polymerized, the hydroxyl group remains even after the polymerization reaction, and thus the repeating unit (b) contains a hydroxyl group.

[0021] According to one embodiment, the bond between the hydroxyl group contained in the repeating unit (b) and the ethylenically unsaturated compound containing an epoxy group can be formed by the reaction of the hydroxyl group contained in the repeating unit (b) and the epoxy group contained in the ethylenically unsaturated compound.

[0022] For example, the reaction between the hydroxyl group contained in the repeating unit (b) and the epoxy group contained in the ethylenically unsaturated compound is carried out according to the following Reaction Formula 1. In this case, by the ring-opening reaction of the epoxy group contained in the ethylenically unsaturated compound by the hydroxyl group contained in the repeating unit (b), the bond between the hydroxyl group contained in the repeating unit (b) and the ethylenically unsaturated compound containing an epoxy group can be formed.

[0023] <Reaction Formula 1> JPEG2025521033000001.jpg37148

[0024] According to one embodiment, the petroleum resin monomer can contain a liquid C5 to C20 fraction, diolefin, or dicyclopentadiene that can be put into practical use.

[0025] According to another embodiment, the petroleum resin monomer can contain a C5 fraction monomer, a C9 fraction monomer, diolefin, or dicyclopentadiene.

[0026] For example, the C5 fraction monomer includes 1-pentene, 2-methyl-2-butene, n-pentane, propadiene, cyclopentadiene, piperylene, isoprene, cyclopentene, and the like.

[0027] For example, the C9 fraction-based monomer includes a styrene-based monomer, dicyclopentadiene, indene, trans-β-methylstyrene, methylindene, benzene / toluene / xylene (BTX), or the like.

[0028] For example, the diolefin includes propadiene, dicyclopentadiene, cyclopentene, or the like.

[0029] According to one embodiment, the petroleum resin-based monomer can include a C9 fraction-based monomer.

[0030] The C9 oil fraction-based monomer can include two or more styrene-based monomers represented by the following Chemical Formula 1.

[0031] For example, the styrene-based monomer is represented by the following Chemical Formula 1.

[0032] <Chemical Formula 1> JPEG2025521033000002.jpg7159

[0033] In the Chemical Formula 1, a11 is an integer from 0 to 5, R 11 and R 12 are, independently of each other, hydrogen, deuterium, -F, -Cl, -Br, -I, a cyano group or a nitro group; or deuterium, -F, -Cl, -Br, -I, a cyano group, a C6-C 20 aryl group or a C1-C 20 alkyl group or a C1-C 20 alkoxy group, which is substituted or unsubstituted with these; or deuterium, -F, -Cl, -Br, -I, a cyano group, a C1-C 20 alkyl group, a C1-C 20 alkoxy group or a C6-C 20 aryl group, which is substituted or unsubstituted with these.

[0034] According to one embodiment, R 11 and R12 are, independently of one another, hydrogen, deuterium, -F, -Cl, -Br, -I, a cyano group or a nitro group; or, deuterium, -F, -Cl, -Br, -I, a cyano group, C6-C 20 a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, isobutyl group, tert-butyl group, n-pentyl group, tert-pentyl group, neopentyl group, isopentyl group, sec-pentyl group, 3-pentyl group, sec-isopentyl group, n-hexyl group, isohexyl group, sec-hexyl group, tert-hexyl group, n-heptyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, n-nonyl group, isononyl group, sec-nonyl group, tert-nonyl group, n-decyl group, isodecyl group, sec-decyl group, tert-decyl group, a methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, isobutoxy group, tert-butoxy group, n-pentoxy group, tert-pentoxy group, neopentoxy group, isopentoxy group, sec-pentoxy group, 3-pentoxy group, sec-isopentoxy group, n-hexoxy group, isohexoxy group, sec-hexoxy group, tert-hexoxy group, n-heptoxy group, isoheptoxy group, sec-heptoxy group, tert-heptoxy group, n-octoxy group, isooctoxy group, sec-octoxy group, tert-octoxy group, n-nonoxy group, isononoxy group, sec-nonoxy group, tert-nonoxy group, n-desoxy group, isodesoxy group, sec-desoxy group or tert-desoxy group; which is substituted or unsubstituted with; or, deuterium, -F, -Cl, -Br, -I, a cyano group, C1-C 20 an alkyl group, C6-C 20 an aryl group or a phenyl group, naphthyl group, anthracenyl group, phenanthrenyl group or pyrenyl group which is substituted or unsubstituted with any combination thereof.

[0035] According to one embodiment, R 11 and R12 may be, independently of each other, hydrogen, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group, a tert-butyl group, an n-pentyl group, a tert-pentyl group, a neopentyl group, an isopentyl group, a sec-pentyl group, a 3-pentyl group, a sec-isopentyl group, an n-hexyl group, an isohexyl group, a sec-hexyl group or a tert-hexyl group.

[0036] According to one embodiment, R 12 may be hydrogen or a methyl group.

[0037] According to one embodiment, the C9 oil-based monomer may include a styrene monomer and an α-methylstyrene monomer.

[0038] According to one embodiment, among the C9 oil-based monomers, the content ratio of the α-methylstyrene monomer to the styrene monomer may be from 0.25 to 2.

[0039] For example, the ratio of the content of the repeating unit (b) derived from the phenolic monomer to the content of the repeating unit (a) derived from the petroleum resin-based monomer is 0.5 to 2 or less, 0.5 to 1.8, 0.75 to 2, 0.75 to 1.8, 1 and 2, 1 to 1.8, 1.2 to 2, 1.4 to 2, 1.2 to 1.8 or 1.4 to 1.8.

[0040] According to one embodiment, the phenolic monomer may be represented by the following Chemical Formula 2.

[0041] <Chemical Formula 2> JPEG2025521033000003.jpg6450

[0042] In Chemical Formula 2, a21 is an integer from 0 to 5, and R 21 is hydrogen, deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group or a nitro group; or Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C6-C 20 An aryl group or a C1-C optionally substituted or unsubstituted with any combination of these 20 An alkyl group or C1-C 20 An alkoxy group; or, Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C1-C 20 An alkyl group, C1-C 20 An alkoxy group or a C6-C optionally substituted or unsubstituted with any combination of these 20 Is an aryl group.

[0043] According to one embodiment, R 21 Is hydrogen, deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group or nitro group; or, Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C6-C 20A methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, isobutyl group, tert-butyl group, n-pentyl group, tert-pentyl group, neopentyl group, isopentyl group, sec-pentyl group, 3-pentyl group, sec-isopentyl group, n-hexyl group, isohexyl group, sec-hexyl group, tert-hexyl group, n-heptyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, n-nonyl group, isononyl group, sec-nonyl group, tert-nonyl group, n-decyl group, isodecyl group, sec-decyl group, tert-decyl group, methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, isobutoxy group, tert-butoxy group, n-pentoxy group, tert-pentoxy group, neopentoxy group, isopentoxy group, sec-pentoxy group, 3-pentoxy group, sec-isopentoxy group, n-hexoxy group, isohexoxy group, sec-hexoxy group, tert-hexoxy group, n-heptoxy group, isoheptoxy group, sec-heptoxy group, tert-heptoxy group, n-octoxy group, isooctoxy group, sec-octoxy group, tert-octoxy group, n-nonoxy group, isononoxy group, sec-nonoxy group, tert-nonoxy group, n-desoxy group, isodesoxy group, sec-desoxy group or tert-desoxy group; or, Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C1-C 20 Alkyl group, C6-C 20 It may be a phenyl group, naphthyl group, anthracenyl group, phenanthrenyl group or pyrenyl group which is substituted or unsubstituted with an aryl group or any combination thereof.

[0044] According to one embodiment, R 21It can be hydrogen, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group, a tert-butyl group, an n-pentyl group, a tert-pentyl group, a neopentyl group, an isopentyl group, a sec-pentyl group, a 3-pentyl group, a sec-isopentyl group, an n-hexyl group, an isohexyl group, a sec-hexyl group or a tert-hexyl group.

[0045] According to one embodiment, the (meth)acrylic monomer can include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, or any combination thereof.

[0046] According to one embodiment, the phenolic monomer can include phenol.

[0047] According to one embodiment, the content ratio of the repeating unit (b) derived from the phenolic monomer to the repeating unit (a) derived from the petroleum resin monomer can be from 0.15 to 1.

[0048] For example, the content ratio of the repeating unit (b) derived from the phenolic monomer to the repeating unit (a) derived from the petroleum resin monomer is from 0.2 to 1, from 0.2 to 0.8, from 0.2 to 0.6, from 0.2 to 0.5, from 0.2 to 0.45, from 0.22 to 1, from 0.23 to 1, or from 0.23 to 0.5.

[0049] According to one embodiment, the ethylenically unsaturated monomer containing an epoxy group can include a vinyl group, an allyl group or an acryloyl group.

[0050] According to one embodiment, the ethylenically unsaturated monomer containing an epoxy group can be a compound represented by the following Chemical Formula 3.

[0051] <Chemical Formula 3> JPEG2025521033000004.jpg39114

[0052] In the chemical formula 3, L 31 can be *-C(=O)-*’, *-C(=S)-*’, *-C(=O)-O-*’, *-O-*’ or *-S-*’.

[0053] According to one embodiment, L 31 is also *-C(=O)-*’, *-C(=O)-O-*’ or *-O-*. According to another embodiment, L 31 is also *-C(=O)-O-*’ or *-O-*.

[0054] Said * and *’ respectively represent the bonding sites with adjacent atoms.

[0055] n31 and n32 can be independently integers from 0 to 5 with respect to each other.

[0056] According to one embodiment, n31 and n32 can be independently integers from 0 to 3 with respect to each other.

[0057] According to another embodiment, n31 is also an integer from 0 to 2. Also, n32 can be an integer from 1 to 3.

[0058] R 31 to R 34 are independently of each other hydrogen, deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group or a nitro group; or deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group, a C6-C 20 aryl group or a C1-C 20 alkyl group or a C1-C 20 alkoxy group which is substituted or unsubstituted with any combination of these; or deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group, a C1-C 20 alkyl group, a C1-C 20An aryl group which is substituted with an alkoxy group or any combination thereof, or unsubstituted C6-C 20 is.

[0059] According to one embodiment, in Chemical Formula 3, R 31 and R 34 are, independently of each other, hydrogen, deuterium, -F, -Cl, -Br, -I, a cyano group or a nitro group; or deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group, C6-C 20 an aryl group or a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, isobutyl group, tert-butyl group, n-pentyl group, tert-pentyl group, neopentyl group, isopentyl group, sec-pentyl group, 3-pentyl group, sec-isopentyl group, n-hexyl group, isohexyl group, sec-hexyl group, tert-hexyl group, n-heptyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, n-nonyl group, isononyl group, sec-nonyl group, tert-nonyl group, n-decyl group, isodecyl group, sec-decyl group, tert-decyl group, methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, isobutoxy group, tert-butoxy group, n-pentoxy group, tert-pentoxy group, neopentoxy group, isopentoxy group, sec-pentoxy group, 3-pentoxy group, sec-isopentoxy group, n-hexoxy group, isohexoxy group, sec-hexoxy group, tert-hexoxy group, n-heptoxy group, isoheptoxy group, sec-heptoxy group, tert-heptoxy group, n-octoxy group, isooctoxy group, sec-octoxy group, tert-octoxy group, n-nonoxy group, isononoxy group, sec-nonoxy group, tert-nonoxy group, n-decyloxy (n-decyl oxy) group, isodecyloxy group, sec-decyloxy group or tert-decyloxy group; or Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C1-C 20 alkyl group, C6-C 20 It may be a phenyl group, naphthyl group, anthracenyl group, phenanthrenyl group or pyrenyl group which is substituted or unsubstituted with deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C1-C alkyl group, C6-C aryl group or any combination thereof.

[0060] According to one embodiment, in the chemical formula 3, R 31 and R 34 are, independently of each other, hydrogen, deuterium, -F, -Cl, -Br, -I, cyano group or nitro group; or deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C6-C 20A methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, isobutyl group, tert-butyl group, n-pentyl group, tert-pentyl group, neopentyl group, isopentyl group, sec-pentyl group, 3-pentyl group, sec-isopentyl group, n-hexyl group, isohexyl group, sec-hexyl group, tert-hexyl group, n-heptyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, n-nonyl group, isononyl group, sec-nonyl group, tert-nonyl group, n-decyl group, isodecyl group, sec-decyl group, tert-decyl group, methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, isobutoxy group, tert-butoxy group, n-pentoxy group, tert-pentoxy group, neopentoxy group, isopentoxy group, sec-pentoxy group, 3-pentoxy group, sec-isopentoxy group, n-hexoxy group, isohexoxy group, sec-hexoxy group, tert-hexoxy group, n-heptoxy group, isoheptoxy group, sec-heptoxy group, tert-heptoxy group, n-octoxy group, isooctoxy group, sec-octoxy group, tert-octoxy group, n-nonoxy group, isononoxy group, sec-nonoxy group, tert-nonoxy group, n-decyloxy group, isodecyloxy group, sec-decyloxy group or tert-decyloxy group, which may be substituted or unsubstituted with an aryl group or any combination thereof.

[0061] According to one embodiment, in Formula 3 above, R 31 to R 34are, independently of each other, hydrogen, deuterium, -F, -Cl, -Br, -I, a cyano group or a nitro group; or a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group, a tert-butyl group, an n-pentyl group, a tert-pentyl group, a neopentyl group, an isopentyl group, a sec-pentyl group, a 3-pentyl group, a sec-isopentyl group, an n-hexyl group, an isohexyl group, a sec-hexyl group, a tert-hexyl group, an n-heptyl group, an isoheptyl group, a sec-heptyl group, a tert-heptyl group, an n-octyl group, an isooctyl group, a sec-octyl group, a tert-octyl group, an n-nonyl group, an isononyl group, a sec-nonyl group, a tert-nonyl group, an n-decyl group, an isodecyl group, a sec-decyl group, or a tert-decyl group.

[0062] According to another embodiment, in Formula 3 above, R 31 to R 34 are, independently of each other, hydrogen, deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group, a nitro group, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group or a tert-butyl group.

[0063] According to one embodiment, the ethylenically unsaturated monomer containing an epoxy group may be a compound represented by the following Chemical Formula 3-1.

[0064] <Chemical Formula 3-1> JPEG2025521033000005.jpg49112

[0065] In Chemical Formula 3-1 above, R 31 to R 34 For the description regarding n32, refer to the description in this specification.

[0066] According to another embodiment, the ethylenically unsaturated monomer containing an epoxy group may be a compound represented by the following Chemical Formula 3-2.

[0067] <Chemical 3-2> JPEG2025521033000006.jpg4791

[0068] According to one embodiment, the content of the repeating unit (a) derived from the petroleum resin monomer is 40 to 70% by weight based on the total weight of the total tackifier resin, and the content of the repeating unit (b) derived from the phenolic monomer is 10 to 40% by weight based on the total weight of the total tackifier resin. The content of the ethylenically unsaturated compound containing an epoxy group bonded to the repeating unit (b) can be 10 to 40% by weight based on the total weight of the total tackifier resin.

[0069] For example, the content of the repeating unit (a) derived from the petroleum resin monomer can be 45 to 70% by weight, 50 to 70% by weight, 40 to 69% by weight, 40 to 68% by weight, or 45 to 69% by weight based on the total weight of the total tackifier resin.

[0070] For example, the content of the repeating unit (b) derived from the phenolic monomer can be 12 to 30% by weight, 14 to 30% by weight, 15 to 30% by weight, 10 to 28% by weight, 10 to 26% by weight, 10 to 25% by weight, or 14 to 26% by weight based on the total weight of the total tackifier resin.

[0071] For example, the content of the ethylenically unsaturated compound containing an epoxy group bonded to the repeating unit (b) can be 15 to 40% by weight, 19 to 40% by weight, 20 to 40% by weight, 21 to 40% by weight, 22 to 40% by weight, 10 to 30% by weight, 10 to 28% by weight, 10 to 27% by weight, or 19 to 28% by weight based on the total weight of the tackifier resin.

[0072] According to one embodiment, 1 The content of the double bonds of the tackifier resin measured via 1H-NMR is also 2 to 10 mol%.

[0073] For example, 1The content of double bonds in the tackifying resin measured via 1H-NMR can be 2 to 5 mol%, 2 to 4.5 mol%, 2 to 4.4 mol%, 2.2 to 5 mol%, 2.7 to 5 mol%, 2.8 to 5 mol%, 3.0 to 5 mol%, 2.2 to 4.5 mol%, 2.7 to 4.5 mol%, 2.8 to 4.5 mol%, 3.0 to 4.5 mol%, 2.2 to 4.4 mol%, 2.7 to 4.4 mol%, 2.8 to 4.4 mol%, or 3.0 to 4.4 mol%.

[0074] The double bond content (mol%) of the tackifying resin can be measured by dissolving the tackifying resin in a CDCl3 solvent to a concentration of 10% and then measuring this using 1H-NMR at 400 MHz. 1 For example, the double bond content (mol%) of the tackifying resin can be measured by measuring the NMR peaks in the entire range (9.0 to 0.0 ppm) using 1H-NMR and then calculating the ratio of the integral value in the double bond range (6.2 to 5.1 ppm) to the integral value in the entire range (9.0 to 0.0 ppm). 1 After measuring the NMR peaks in the entire range (9.0 to 0.0 ppm) using 1H-NMR, the double bond content (mol%) of the tackifying resin is measured by calculating the ratio of the integral value in the double bond range (6.2 to 5.1 ppm) to the integral value in the entire range (9.0 to 0.0 ppm).

[0075] According to one embodiment, the weight average molecular weight (Mw) of the tackifying resin can be 400 g / mol to 3,000 g / mol.

[0076] For example, the weight average molecular weight (Mw) of the tackifying resin is 800 to 3,000 g / mol, 1,200 to 3,000 g / mol, 1,700 to 3,000 g / mol, 1,800 to 3,000 g / mol, 1,900 to 3,000 g / mol, 400 to 2,800 g / mol, 800 to 2,800 g / mol, 1,200 to 2,800 g / mol, 1,200 to 2,600 g / mol, or 1,700 to 2,600 g / mol.

[0077] According to another embodiment, the weight average molecular weight (Mw) of the tackifying resin can be 400 to 600 g / mol, 400 to 580 g / mol, or 400 to 550 g / mol.

[0078] According to one embodiment, the number average molecular weight (Mn) of the tackifying resin may be from 400 g / mol to 6,000 g / mol.

[0079] For example, the number average molecular weight (Mn) of the tackifying resin is from 500 g / mol to 6,000 g / mol, from 600 g / mol to 6,000 g / mol, from 700 g / mol to 6,000 g / mol, from 800 g / mol to 6,000 g / mol, from 500 g / mol to 5,000 g / mol, from 600 g / mol to 5,000 g / mol, from 700 g / mol to 5,000 g / mol, from 800 g / mol to 5,000 g / mol, from 500 g / mol to 4,500 g / mol, from 600 g / mol to 4,500 g / mol, from 700 g / mol to 4,500 g / mol, or from 800 g / mol to 4,500 g / mol.

[0080] According to one embodiment, the Z average molecular weight (Mz) of the tackifying resin may be from 30,000 g / mol to 120,000 g / mol.

[0081] For example, the Z average molecular weight of the tackifying resin is from 33,000 g / mol to 120,000 g / mol, from 35,000 g / mol to 120,000 g / mol, from 30,000 g / mol to 110,000 g / mol, from 33,000 g / mol to 110,000 g / mol, from 35,000 g / mol to 110,000 g / mol, from 30,000 g / mol to 80,000 g / mol, from 33,000 g / mol to 80,000 g / mol, from 35,000 g / mol to 80,000 g / mol, from 30,000 g / mol to 70,000 g / mol, from 33,000 g / mol to 70,000 g / mol, from 35,000 g / mol to 70,000 g / mol, from 30,000 g / mol to 65,000 g / mol, from 33,000 g / mol to 65,000 g / mol, from 35,000 g / mol to 65,000 g / mol, or from 35,000 g / mol to 63,000 g / mol.

[0082] According to one embodiment, the dispersity (PDI) of the tackifier resin may be from 2 to 10. For example, the dispersity (PDI) of the tackifier resin may be from 2 to 9, from 2 to 8.5, from 2 to 8, from 2 to 5, from 2 to 4, from 2 to 3.6, from 2 to 3, or from 2.1 to 3.

[0083] For example, when the average molecular weight value and the dispersity of the tackifier resin satisfy the above range, the reactivity with the acrylic polymer is further improved.

[0084] According to one embodiment, the softening point of the tackifier resin may be 100 °C or lower.

[0085] For example, the softening point of the tackifier resin may be from 20 to 100 °C, from 20 to 80 °C, from 20 to 70 °C, from 20 to 65 °C, from 30 to 100 °C, from 35 to 100 °C, from 40 to 100 °C, from 42 to 100 °C, from 45 to 100 °C, or from 20 to 68 °C.

[0086] Still another aspect of the present invention can provide a method for producing a tackifier resin, including: producing a primary polymer from a first reaction composition containing a petroleum resin monomer and a phenolic monomer; and producing a tackifier resin from a second reaction composition containing the primary polymer and an ethylenically unsaturated compound containing an epoxy group.

[0087] For example, for the types, physical properties, contents of the petroleum resin monomer, the phenolic monomer, and the ethylenically unsaturated compound containing an epoxy group, and the physical properties of the tackifier resin, refer to the foregoing description.

[0088] According to one embodiment, in the first reaction composition, the ratio of the content of the phenolic monomer to the petroleum resin monomer may be from 0.15 to 1.

[0089] For example, among the first reaction composition, the ratio of the content of the phenolic monomer to the petroleum resin monomer is 0.2 to 0.8, 0.2 to 0.6, 0.2 to 0.5, 0.2 to 0.45, 0.22 to 1, 0.23 to 1, or 0.23 to 0.5.

[0090] For example, the monomer in the first reaction composition means the remaining composition excluding the solvent among the components included in the first reaction composition.

[0091] According to one embodiment, the first reaction composition can further include a solvent.

[0092] For example, the solvent includes xylene.

[0093] According to one embodiment, the content of the solvent in the first reaction composition can be 30 to 70% by weight based on the total weight of the first reaction composition.

[0094] According to one embodiment, the ratio of the total weight of the monomers to the weight of the solvent in the first reaction composition can be 0.5 to 2.

[0095] According to one embodiment, the first reaction composition can further include a solvent.

[0096] For example, the catalyst includes an acid catalyst. For example, the acid catalyst can include a BF3 catalyst and an AlCl3 catalyst.

[0097] According to one embodiment, the content of the catalyst in the first reaction composition can be 0.05 to 0.3% by weight based on the total content of the monomers.

[0098] For example, the content of the catalyst in the first reaction composition is 0.1 to 0.3% by weight, 0.15 to 0.3% by weight, 0.16 to 0.3% by weight, 0.05 to 0.25% by weight, or 0.05 to 0.2% by weight based on the total content of the monomers.

[0099] According to an embodiment, the step of manufacturing the primary polymer may include a step of performing catalytic polymerization to manufacture the primary polymer from the first reaction composition.

[0100] According to an embodiment, the catalytic polymerization may be performed at a temperature of 100 °C or lower. For example, the catalytic polymerization is performed in a temperature range of 80 °C or lower, 60 °C or lower, 50 °C or lower, or -20 °C to 60 °C.

[0101] According to an embodiment, the step of manufacturing the primary polymer may include a step of performing a first degassing reaction after the catalytic polymerization to manufacture the primary polymer.

[0102] For example, the first degassing reaction is performed at a temperature of 150 °C to 300 °C and a pressure of 1 mbar to 50 mbar for 1 minute to 20 minutes.

[0103] According to another embodiment, the first degassing reaction may be performed at a temperature of 220 °C to 280 °C and a pressure of 5 mbar to 25 mbar for 5 minutes to 15 minutes or at a temperature of 240 °C to 260 °C and a pressure of 5 mbar to 15 mbar for 8 minutes to 12 minutes.

[0104] For example, in the step of manufacturing the primary polymer, catalytic polymerization is performed, and the manufactured primary polymer may contain a hydroxyl group. For example, the hydroxyl group contained in the primary polymer can undergo a bonding reaction with an ethylenically unsaturated compound containing an epoxy group described later.

[0105] According to an embodiment, the step of manufacturing the tackifying resin from the second reaction composition may be performed by performing a bonding reaction between the hydroxyl group in the primary polymer contained in the first reaction composition and the epoxy group in the ethylenically unsaturated compound to manufacture the tackifying resin.

[0106] For example, the bonding reaction between the hydroxyl group contained in the primary polymer and the epoxy group contained in the ethylenically unsaturated compound may be performed according to the following Reaction Formula 1.

[0107] <Reaction Formula 1> JPEG2025521033000007.jpg37148

[0108] According to an embodiment, the step of manufacturing the tackifier resin may include a step of thermally polymerizing the second reaction composition to manufacture the tackifier resin.

[0109] For example, the bonding reaction between the hydroxyl group in the primary polymer and the epoxy group in the ethylenically unsaturated compound is carried out by thermal polymerization.

[0110] According to an embodiment, the thermal polymerization can be carried out in a temperature range of 150 to 300 °C. For example, the thermal polymerization is carried out in a temperature range of 160 to 300 °C, 180 to 300 °C, 150 to 260 °C, 150 to 220 °C, or 160 to 220 °C.

[0111] According to an embodiment, the second reaction composition may contain a solvent. For example, the catalyst contained in the second reaction composition includes a base catalyst.

[0112] According to an embodiment, the base catalyst includes NaOH or KOH.

[0113] According to an embodiment, when the second reaction composition contains a catalyst, the thermal polymerization can be carried out in a temperature range of 50 to 120 °C. For example, the thermal polymerization for the second reaction composition is carried out in a temperature range of 60 to 120 °C, 70 to 120 °C, 50 to 110 °C, 50 to 100 °C, or 50 to 95 °C.

[0114] According to an embodiment, the step of manufacturing the tackifier resin may include a step of performing a second degassing reaction after the thermal polymerization to manufacture the tackifier resin.

[0115] For example, the second degassing reaction is carried out at a temperature of 120 °C to 250 °C and a pressure of 1 mbar to 50 mbar for 1 minute to 20 minutes.

[0116] According to another embodiment, the degassing reaction may be carried out at a temperature of 150°C to 250°C and a pressure of 5 mbar to 25 mbar for 5 to 15 minutes, or at a temperature of 180°C to 220°C and a pressure of 5 mbar to 15 mbar for 8 to 12 minutes.

[0117] According to one embodiment, the above-described tackifier resin can be applied to an adhesive. According to another embodiment, the above-described tackifier resin can be applied to an acrylic adhesive.

[0118] Still another aspect of the present invention can provide an adhesive containing the above-described tackifier resin. For example, the tackifier resin can impart adhesive strength to the adhesive.

[0119] According to one embodiment, the adhesive can be an acrylic adhesive containing the tackifier resin and an acrylic polymer. For example, since the tackifier resin has excellent reactivity with the acrylic polymer, the heat resistance of the acrylic adhesive can be improved. For example, since the content of residual double bonds of the tackifier resin increases, the tackifier resin has excellent reactivity with the acrylic polymer, and thus the heat resistance of the acrylic adhesive can be excellent.

[0120] According to one embodiment, the acrylic adhesive can be a photocurable acrylic adhesive.

[0121] For example, the acrylic adhesive may further contain a crosslinking agent, a polymerization initiator catalyst, a curing accelerator, etc., other than the tackifier and the acrylic polymer.

[0122] According to one embodiment, among the acrylic adhesives, the content of the tackifier resin can be 5% by weight or more based on the total weight of the acrylic adhesive.

[0123] According to another embodiment, among the acrylic adhesives, the content of the tackifier resin may be 5 to 30% by weight, 5 to 25% by weight, or 5 to 20% by weight based on the total weight of the acrylic adhesive.

[0124] According to one embodiment, the acrylic adhesive may be excellent in heat resistance and transparent. In this case, light can uniformly penetrate the inside of the acrylic adhesive, and the photocuring reaction can proceed uniformly. As a result, the heat resistance of the acrylic adhesive can be further improved.

[0125] [Definition of Terms] In this specification, C1-C 20 The alkyl group means a monovalent group of a linear or branched aliphatic hydrocarbon having 1 to 20 carbon atoms. Specific examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, isobutyl group, tert-butyl group, n-pentyl group, tert-pentyl group, neopentyl group, isopentyl group, sec-pentyl group, 3-pentyl group, sec-isopentyl group, n-hexyl group, isohexyl group, sec-hexyl group, tert-hexyl group, n-heptyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, n-nonyl group, isononyl group, sec-nonyl group, tert-nonyl group, n-decyl group, isodecyl group, sec-decyl group, tert-decyl group, etc. are included. In this specification, C1-C 20 The alkylene group means a divalent group having the same structure as the C1-C 20 alkyl group.

[0126] In this specification, C1-C 20 The alkoxy group is -OA 101 (where A 101 is the C1-C 20 alkyl group) and means a monovalent group having the chemical formula thereof. Specific examples thereof include methoxy group, ethoxy group, isopropyloxy group, etc. are included.

[0127] In this specification, C6-C 20 An aryl group means a monovalent group having a carbocyclic aromatic system with 6 to 20 carbon atoms, and includes a phenyl group, a naphthyl group, an anthracenyl group, a phenanthrenyl group, a pyrenyl group, and the like. The C6-C 20 When the aryl group contains two or more rings, the two or more rings may be linked to each other.

[0128] Hereinafter, the present invention will be described in more detail with reference to Examples. These Examples are for further specifically explaining the present invention, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these Examples.

[0129] <Example 1. Production of Tackifying Resin> Into a 1000 ml kettle, monomers (ASM: α-methylstyrene, ST: styrene, phenol) were injected according to the compounding amounts (weight %) shown in Table 1 below, and 375 g of xylene as a solvent was added to produce a first reaction composition.

[0130] After adding 3.46 g (0.24% by weight based on the total weight of the monomers) of the catalyst BF3-Phenolate (BF3 26%) to the first reaction composition, polymerization was carried out at 0 °C for 120 minutes. Then, a first degassing reaction was carried out at a temperature of 250 °C and a pressure of 10 mbar for 10 minutes to produce a primary polymer.

[0131] Next, the primary polymer and an ethylenically unsaturated compound containing an epoxy group (GMA: glycidyl methacrylate) were mixed according to the compounding amounts (weight %) shown in Table 1 below to produce a second reaction composition.

[0132] The second reaction composition was thermally polymerized at 210 °C for 1 hour. Then, a second degassing reaction was carried out at a temperature of 210 °C and a pressure of 10 mbar for 10 minutes to produce a tackifying resin.

[0133] <Examples 2 to 7 and Comparative Example 1> The tackifying resin was produced in the same manner as in Example 1, except that the contents of the monomer, catalyst, and ethylenically unsaturated compound and the reaction conditions were changed as shown in Table 1 below.

[0134] Comparative Example 1 was produced in the same manner as Example 1 for the tackifying resin, except that the bonding reaction of the ethylenically unsaturated compound was not carried out as shown in Table 1 below.

[0135] <Comparative Example 2> Into a 1000 ml chemical reactor equipped with a stirrer, reflux condenser, thermometer, and nitrogen injection device, 180 g of α-methylstyrene, 120 g of styrene, 75 g of phenol, and 75 g of glycidyl methacrylate were injected, and 450 g of xylene as a solvent was added to produce a first reaction composition.

[0136] After adding 3.46 g of catalyst BF3 (0.24% by weight based on the total weight of the monomers) to the first reaction composition, polymerization was carried out at 0°C for 120 minutes. Then, a first degassing reaction was carried out at a temperature of 250°C and a pressure of 10 mbar for 10 minutes to produce a tackifying resin.

[0137]

Table 1

[0138] <Evaluation Example 1. Measurement of molecular weight> Using gel permeation chromatography (GPC, a product of Hewlett Packard, model HP-1100), the weight average molecular weight (Mw), number average molecular weight (Mn), Z average molecular weight (Mz), and PDI (Polymer density index) of the tackifying resins produced in Examples 1 to 7 and Comparative Examples 1 and 2 were measured.

[0139] The measurement of the weight average molecular weight (Mw), number average molecular weight (Mn), Z average molecular weight (Mz), and PDI (Polymer density index) of the tackifier resin was carried out by dissolving each of the tackifier resins produced in Examples 1 to 7 and Comparative Examples 1 and 2 in tetrahydrofuran to a concentration of 4000 ppm, injecting 100 μl into GPC, using tetrahydrofuran as the mobile phase of GPC, flowing in at a flow rate of 1.0 mL / min, and performing the measurement at 30°C. As the column, three Agilent PIgel (1,000 + 500 + 100 Å) were connected in series. As the detector, an RI detector (product of Hewlett Packard, HP-1047A) was used for measurement at 30°C. The measurement results are shown in Table 2 below.

[0140] <Evaluation Example 2-1. GMA content (mol%) in the resin> Regarding the tackifier resins produced in Examples 1 to 7 and Comparative Examples 1 and 2, the number of moles of GMA (glycidyl methacrylate) added during the production of the tackifier resin was subtracted from the number of moles of unreacted GMA remaining after production to calculate the number of moles of GMA participating in the reaction.

[0141] The ratio of the number of moles of the primary polymer added during the production of the tackifier resin to the number of moles of GMA participating in the reaction was calculated to calculate the mol% of GMA. The results are shown in Table 2 below.

[0142] <Evaluation Example 2-2. Measurement of the double bond content (mol%) in the resin> The tackifier resins produced in Examples 1 to 7 and Comparative Examples 1 and 2 were added to a CDCl3 solvent to prepare samples with a concentration of 10% each. For each of the above samples, using a 400Mhz NMR apparatus, 1 The 1H-NMR spectrum was measured from 0.0 to 9.0 ppm. Among them, after integrating the peak values in the range of 6.2 to 5.1 ppm, this was calculated as the ratio to the integral value of the entire range to calculate the double bond content (mol%). The results are shown in Table 2 below.

[0143] <Evaluation Example 3. Measurement of softening point> The softening points of the tackifier resins produced in Examples 1 to 7 and Comparative Examples 1 and 2 were measured using the Ring and ball softening method (ASTM E 28). The tackifier resins produced in Examples 1 to 7 and Comparative Examples 1 and 2 were each melted and poured into a circular mold, and then placed in a beaker containing glycerin. After that, a ball was placed on the ring containing each resin, and the temperature was increased by 2.5 °C per minute. The temperature (softening point) at which the resin melted and the ball fell was measured.

[0144]

Table 2

[0145] <Production of Acrylic Adhesive> 15% by weight of the tackifier resins of Examples 1 to 7 and Comparative Examples 1 and 2 were each mixed with 85% by weight of an acrylic polymer to produce acrylic adhesives.

[0146] <Evaluation Example 4. Evaluation of Heat Resistance> The heat resistance of the acrylic adhesives containing the tackifier resins of Examples 1 to 7 and Comparative Examples 1 and 2 was evaluated by the ASTM D3654 method. Acrylic adhesives containing the tackifier resins of Examples 1 to 7 and Comparative Examples 1 and 2 were each applied to a PET film to a thickness of 50 μm to produce tapes. Each of the produced tapes was irradiated with UV through an exposure device, and then the tape was cut into pieces about 1 inch × 6 inches to produce test pieces.

[0147] The manufactured test pieces were each attached to a cleaned SUS 304 steel plate. At this time, for the test pieces that were not attached, the necessary parts for measurement were crimped by reciprocating the roll once using a roll-down device manufactured by Cheminstruments. Next, the test pieces that were not attached to the SUS 304 steel plate were cut with scissors so that they would be about 3 inches long. The test pieces that were not attached to the SUS 304 steel plate were sandwiched in a ring for measuring cohesion. Two fixing adhesive tapes were attached to the horizontal ends of the ring for measuring cohesion in which the test pieces were sandwiched, parallel to each other and front and back, and two of them were taken and fixed in parallel between the ring for measuring cohesion and the SUS 304 steel plate with a stapler. The test pieces were cut so that they could be attached to the SUS 304 steel plate in a size of 1 inch in width and 1 inch in height.

[0148] The SUS 304 steel plate with the test pieces attached was placed on the SUS steel plate stand in the shear test oven. A 1 kg weight was suspended from the ring for measuring the holding power attached to the test pieces. Then, the oven temperature was raised at a rate of 0.5 °C / min, and the temperature at which the weight fell was recorded in Table 3 below.

[0149]

Table 3

[0150] As shown in Table 3 above, when comparing the heat resistance and adhesive strength of the acrylic adhesives of Examples 1 to 7 and Comparative Examples 1 and 2, Examples 1 to 7 are excellent in heat resistance.

[0151] The above-described examples and comparative examples are illustrative for explaining the present invention, and the present invention is not limited thereto. Those skilled in the art can implement the present invention in more diverse variations, so the technical protection scope of the present invention will have to be determined by the appended claims.

Claims

1. A repeating unit (a) derived from a petroleum resin monomer; and A repeating unit (b) derived from a phenolic monomer; comprising An adhesion - imparting resin, wherein an ethylenically unsaturated compound containing an epoxy group is bonded to the repeating unit (b).

2. The bond between the repeating unit (b) and the ethylenically unsaturated compound containing an epoxy group is formed by the reaction of a hydroxyl group contained in the repeating unit (b) and an epoxy group contained in the ethylenically unsaturated compound. The adhesion - imparting resin according to Claim 1.

3. The petroleum resin monomer contains a C9 fraction - based monomer. The adhesion - imparting resin according to Claim 1.

4. The C9 oil - based monomer contains two or more styrene - based monomers represented by the following Chemical Formula 1. The adhesion - imparting resin according to Claim 3: <Chemical Formula 1> In the Chemical Formula 1, a11 is an integer from 0 to 5. R １１ and R １２ are, independently of one another, hydrogen, deuterium, -F, -Cl, -Br, -I, a cyano group or a nitro group; or, Deuterium, -F, -Cl, -Br, -I, cyano group, C ６ -C ２０ C substituted or unsubstituted with an aryl group or any combination thereof １ -C ２０ alkyl group or C １ -C ２０ alkoxy group; or, Deuterium, -F, -Cl, -Br, -I, cyano group, C １ -C ２０ alkyl group, C １ -C ２０ substituted with an alkoxy group or any combination thereof, or unsubstituted C ６ -C ２０ is an aryl group.

5. The C9 oil - based monomer contains a styrene monomer and an α - methylstyrene monomer. The adhesion - imparting resin according to Claim 3.

6. In the C9 oil - based monomer, the ratio of the content of the α - methylstyrene monomer to the styrene monomer is from 0.25 to 2. The adhesion - imparting resin according to Claim 5.

7. The phenolic monomer is represented by the following Chemical Formula 2. The adhesion - imparting resin according to Claim 1: <Chemical Formula 2> In the Chemical Formula 2, a21 is an integer from 0 to 5. R ２１ is hydrogen, deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group or a nitro group; or, Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C ６ -C ２０ C substituted or unsubstituted with an aryl group or any combination thereof １ -C ２０ alkyl group or C １ -C ２０ alkoxy group; or, Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C １ -C ２０ alkyl group, C １ -C ２０ substituted with an alkoxy group or any combination thereof, or unsubstituted C ６ -C ２０ aryl group.

8. The weight ratio of the repeating unit (b) derived from the phenolic monomer to the repeating unit (a) derived from the petroleum resin monomer is from 0.15 to 1. The adhesion - imparting resin according to Claim 1.

9. The ethylenically unsaturated compound containing an epoxy group contains a vinyl group, an allyl group or an acryloyl group. The adhesion - imparting resin according to Claim 1.

10. The ethylenically unsaturated compound containing an epoxy group is represented by the following Chemical Formula 3. The adhesion - imparting resin according to Claim 1: <Chemical Formula 3> In the Chemical Formula 3, L ３１ is *-C(=O)-*', *-C(=S)-*', *-C(=O)-O-*', *-O-*' or *-S-*', n31 and n32 are independently integers from 0 to 5. R ３１ or R ３４ is, independently of one another, hydrogen, deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group or a nitro group; or, Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C ６ -C ２０ A C substituted or unsubstituted with an aryl group or any combination thereof １ -C ２０ An alkyl group or C １ -C ２０ An alkoxy group; or, Deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, C １ -C ２０ alkyl group, C １ -C ２０ substituted or unsubstituted C with an alkoxy group or any combination thereof ６ -C ２０ is an aryl group.

11. The content of the repeating unit (a) derived from the petroleum resin monomer is from 40 to 70% by weight based on the total weight of the entire adhesion - imparting resin, The content of the repeating unit (b) derived from the phenolic monomer is from 10 to 40% by weight based on the total weight of the entire adhesion - imparting resin. The content of the ethylenically unsaturated compound containing an epoxy group bonded to the repeating unit (b) is 10 to 40% by weight based on the total weight of the tackifier resin, the tackifier resin according to claim 1.

12. １ The content of the double bonds of the tackifier resin measured via H-NMR is 2 to 10 mol%, and the tackifier resin according to claim 1.

13. The weight average molecular weight (Mw) of the tackifier resin is 400 g / mol to 3,000 g / mol, The number average molecular weight (Mn) of the tackifier resin is 400 g / mol to 6,000 g / mol, The Z-average molecular weight (Mz) of the tackifier resin is 30,000 g / mol to 120,000 g / mol, The PDI (Polymer Dispersity Index) of the tackifier resin is 2 to 10, the tackifier resin according to claim 1.

14. The softening point of the tackifier resin is 100 °C or lower, the tackifier resin according to claim 1.

15. Manufacturing a primary polymer from a first reaction composition containing a petroleum resin monomer and a phenolic monomer, Manufacturing a tackifier resin from the second reaction composition containing the primary polymer and an ethylenically unsaturated compound containing an epoxy group, a method for manufacturing a tackifier resin.

16. The first reaction composition further contains a solvent, The step of manufacturing the primary polymer includes a step of performing catalytic polymerization to manufacture the primary polymer from the first reaction composition, the method for manufacturing a tackifier resin according to claim 15.

17. The catalytic polymerization is performed at a temperature condition of 100 °C or lower in the presence of an acid catalyst, the method for manufacturing a tackifier resin according to claim 16.

18. The step of manufacturing a tackifier resin from the second reaction composition includes a step of performing a bonding reaction between the hydroxyl group in the primary polymer and the epoxy group in the ethylenically unsaturated compound to manufacture a tackifier resin, the method for manufacturing a tackifier resin according to claim 15.

19. The step of performing a bonding reaction between the hydroxyl group in the primary polymer and the epoxy group in the ethylenically unsaturated compound to manufacture a tackifier resin includes a step of performing thermal polymerization at a temperature condition of 150 to 300 °C, the method for manufacturing a tackifier resin according to claim 18.

20. The second reaction composition contains a base catalyst, The bonding reaction between the hydroxyl group in the primary polymer and the epoxy group in the ethylenically unsaturated compound is performed at a temperature condition of 50 to 120 °C in the presence of the base catalyst, the method for manufacturing a tackifier resin according to claim 18.

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