Manufacturing System and Manufacturing Method for Producing a Flexible Circuit Board by Laser Cutting

Abstract

An object of the present invention is to provide a manufacturing system and a manufacturing method for manufacturing a flexible printed circuit board by laser cutting. 【Solution means】The present invention discloses a manufacturing system and a manufacturing method for manufacturing a flexible printed circuit board by laser cutting, belonging to the field of new energy / semiconductors, including steps of: inputting raw materials, adding a protective layer, introducing a copper foil base layer, and laminating protective layers on the upper and lower surfaces of the copper foil base layer in step S1; cutting out a circuit structure on the semi-finished product processed in step S1 by laser in step S2; performing residue discharge treatment on the semi-finished product processed in step S2, performing activation treatment on the copper foil surface, and performing washing, temporary lamination and temporary hot pressing in step S3; performing combined hot pressing on the semi-finished product processed in step S3 in step S4; performing opening window processing on the semi-finished product processed in step S4 in step S5; and inspecting and marking the semi-finished product processed in step S5 in step S6. The manufacturing system and the manufacturing method for manufacturing a flexible printed circuit board by laser cutting disclosed by the present invention can manufacture a flexible printed circuit board by a laser processing method, make the processing of the flexible printed circuit board more convenient and pollution-free while ensuring quality and lifespan, and reduce energy consumption.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy semiconductors, and particularly to a manufacturing system and a manufacturing method for manufacturing a flexible circuit board by laser cutting, and particularly to a flexible circuit board (Laser Direct Circurt, LDC) by a laser direct structuring method.

Background Art

[0002] A flexible circuit board (Laser Direct Circurt, LDC) by a laser direct structuring method, also called a flexible board or a flexible printed board, is very popular due to its excellent characteristics such as lightweight, thinness, and the ability to be freely bent. A flexible circuit board is a printed circuit with excellent reliability and flexibility. By embedding a circuit design in a flexible thin plastic sheet, a large number of precision components can be embedded in a narrow and limited space to form a flexible circuit. A flexible circuit board can be freely bent or folded, is lightweight, small in size, has excellent heat dissipation, is convenient for installation, and breaks through the conventional interconnection technology. In the structure of a flexible circuit, the materials are an insulating film, a conductor, and an adhesive.

[0003] The main processes in the manufacture of conventional flexible circuit boards are the development-etching-stripping process. In the development process, the coverlay on the non-circuit area of the copper foil flexible circuit board is removed, and the coverlay on the circuit area is exposed. Then, the copper foil in the non-circuit area is etched with an etching solution to reactively remove unnecessary copper. After that, it is processed into a predetermined circuit on the flexible circuit board. Finally, the coverlay is stripped, and the etched flexible circuit board is washed and dried. For example, in Patent Document 1 (Chinese Patent Application No. 201711203417.8), a method for manufacturing an FPC flexible wireless charging transmission coil module is disclosed, which includes a step S1 of preparing a pure copper foil for processing and cleaning the copper foil processing surface, a step S2 of engraving grooves on the surface of the copper foil prepared in step S1 using laser etching, a channel etching step S3 of engraving channels on the copper foil processing surface after the groove processing in step S2 is completed, a step S4 of pretreating the copper foil after the processing in step S3 is completed, a step S5 of laminating a base material on the copper foil surface, and a step S6 of further performing an etching process on the opposite surface of the copper foil facing the base material after the lamination is completed.

[0004] However, in such a processing method, during etching, the copper foil in the FPC reacts chemically with the etching solution, generating etching waste liquid. If it is discharged as it is, heavy metal pollution will occur, and the metals in the etching waste liquid will be wasted. However, to recycle metals from the etching waste liquid, high costs are required for recycling and treating pollutant emissions, increasing the manufacturing cost.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In order to overcome the above problems in the prior art, the present invention provides a manufacturing system and a manufacturing method for manufacturing a flexible circuit board by laser cutting, which can manufacture a flexible circuit board by a laser processing method, optimize the convenience and environmental performance of the processing of the flexible circuit board, and improve the product performance and lifespan of the flexible circuit board.

Means for Solving the Problems

[0007] To achieve the above object, the technical means adopted by the present invention is a manufacturing method for manufacturing a flexible circuit board by laser cutting, comprising: a step S1 of feeding raw materials, adding a protective layer, introducing a copper foil base layer, and laminating protective layers on the upper and lower surfaces of the copper foil base layer; a step S2 of laser cutting a circuit structure on the semi-finished product processed in step S1; a step S3 of performing residue discharge treatment, activation and cleaning, temporary lamination and temporary hot pressing on the semi-finished product processed in step S2; a step S4 of performing combined hot pressing on the semi-finished product processed in step S3; and a step S5 of performing opening window processing on the semi-finished product processed in step S4 to expose the solder joints of the copper foil base layer.

[0008] In a preferred embodiment of the present invention, in step S1, the protective layer includes a matte film, a two-layer protective film, or a single-layer protective film. Using a two-layer protective film as a base material, laminating a copper foil base layer on the upper surface of the two-layer protective film, then laminating a matte film on the copper foil base layer, and laminating a single-layer protective film on the lower side of the two-layer protective film.

[0009] In a preferred embodiment of the present invention, in step S3, peeling off the matte film of the semi-finished product processed in step S2, removing the residue of the copper foil, peeling off the single-layer protective film, then activating and cleaning the outer surface of the copper foil base layer in the semi-finished product, laminating an upper coverlay and an upper layer protective film on the upper surface of the copper foil base layer from the inside to the outside in sequence, and then performing temporary hot pressing on the lower layer of the semi-finished product, and the temperature range of the temporary hot pressing is 60~130°C.

[0010] In a preferred embodiment of the present invention, in step S3, the two-layer protective film on the lower layer of the semi-finished product after the temporary hot press is peeled off. Next, the lower surface of the copper foil base layer in the semi-finished product is activated and cleaned, and the lower coverlay and the lower-layer protective film are sequentially laminated on the lower surface of the copper foil base layer from the inside to the outside. Then, a temporary hot press is applied to the upper layer of the semi-finished product, and the temperature range of the temporary hot press is 60 to 130 °C.

[0011] In a preferred embodiment of the present invention, in step S3, both upper and lower sides of the semi-finished product with the upper coverlay and the upper-layer protective film and the lower coverlay and the lower-layer protective film respectively attached to both sides are hot pressed, and the temperature range of the hot press is 60 to 130 °C.

[0012] In a preferred embodiment of the present invention, in step S4, the upper-layer protective film and the lower-layer protective film of the semi-finished product processed in step S3 are peeled off. Next, the upper hot press auxiliary film and the lower hot press auxiliary film are respectively laminated on both upper and lower sides and then hot press processing is performed. The upper hot press auxiliary film and the lower hot press auxiliary film on the semi-finished product after the hot press processing are peeled off. The temperature range of the hot press is 120 to 200 °C, the pressure range is 70 to 150 kg, and the time is 120 to 180 seconds.

[0013] In a preferred embodiment of the present invention, after step S5, the semi-finished product processed in step S5 is photographed and transmitted to an image mechanism for inspection. Next, step S6 of marking and discharging the finished product after inspection is further included.

[0014] In a preferred embodiment of the present invention, a manufacturing system for a flexible circuit board by a laser direct structuring method is used, which includes a raw material input and film temporary sticking module, a laser etching module, a residue discharge, temporary sticking and hot press module, a combined hot press module, a laser opening window processing module, and a residue discharge, marking, inspection and discharging module, which are sequentially arranged according to the process. After introducing the copper foil base layer into the raw material input and film temporary sticking module, the operation of step S1 is carried out. The semi-finished product processed in step S1 is derived from the raw material input and film temporary pasting module, transferred to the laser etching module, and the operation of step S2 is carried out. Next, the semi-finished product processed in step S1 is derived from the laser etching module, transferred to the residue discharge, temporary pasting and hot pressing module, and the operation of step S3 is carried out. Next, the semi-finished product processed in step S3 is derived from the residue discharge, temporary pasting and hot pressing module, transferred to the combined hot pressing module, and the operation of step S4 is carried out. Next, the semi-finished product processed in step S4 is derived from the combined hot pressing module, transferred to the laser opening window processing module, and the operation of step S5 is carried out. Next, the semi-finished product processed in step S5 is derived from the laser opening window processing module, transferred to the residue discharge, marking, inspection and dispensing module, and the operation of step S6 is carried out.

[0015] In a preferred embodiment of the present invention, the raw material input and film temporary pasting module includes a first conveying path, a plurality of first discharge rollers and a first film peeling roller corresponding to the first conveying path, and a first suction mechanism is further provided on the first conveying path. Or / and, the laser etching module includes a second conveying path provided with a first suction transmission table, and a corresponding laser etching device is provided on the first suction transmission table. Or / and, the residue discharge, temporary pasting and hot pressing module includes a third conveying path, a plurality of third discharge rollers and a third film peeling roller corresponding to the third conveying path, a lower layer hot pressing roller group for realizing lower layer temporary hot pressing, an upper layer hot pressing roller group for realizing upper layer temporary hot pressing, and a both sides hot pressing roller group for realizing the hot pressing described in step S3 on both upper and lower sides. Or / and, the combined hot pressing module includes a fourth conveying path, a plurality of fourth discharge rollers and a fourth film peeling roller corresponding to the fourth conveying path, and a split type finished product hot pressing mechanism for realizing the hot pressing described in step S4. Alternatively, and / or, the opening window processing module using the laser includes a fifth conveyance path and a laser opening window processing machine corresponding to the fifth conveyance path. Alternatively, and / or, the residue discharging, marking, inspecting, and dispensing module includes a sixth conveyance path and an image mechanism, an inspection mechanism, a marking mechanism, and a plurality of sixth residue discharging rollers corresponding to the sixth conveyance path.

[0016] In a preferred embodiment of the present invention, the matte film includes a polyester film, a heat insulating base film is provided on the polyester film, and a heat resistant adhesive layer is provided between the polyester film and the heat insulating base film. And / or, the two-layer protective film includes a base film and a polyester film, and a heat resistant adhesive layer is provided between the base film and the polyester film. And / or, the lower coverlay and the upper coverlay use a heat sensitive adhesive film layer. And / or, the lower protective film, the upper protective film, and the single-layer protective film are based on a polyester film, and an acrylic adhesive layer is applied on one side. And / or, the upper thermal press auxiliary film and the lower thermal press auxiliary film are based on a polyester film, and a release agent layer is applied on both sides.

Advantages of the Invention

[0017] The present invention solves the defects existing in the background art. The manufacturing system and manufacturing method for manufacturing a flexible circuit board by laser cutting disclosed in the present invention particularly relate to a flexible circuit board (Laser Direct Circurt, LDC) by a laser direct structuring method. The present invention can manufacture a flexible circuit board by a laser processing method, optimize the convenience and environmental performance of the processing of the flexible circuit board, and improve the product performance and lifespan of the flexible circuit board.

[0018] Hereinafter, the present invention will be further described with reference to the drawings and embodiments.

Brief Description of the Drawings

[0019]

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Figure 10

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Figure 14

Modes for Carrying Out the Invention

[0020] The present invention will be described in more detail below with reference to the drawings and embodiments. Since these drawings are simplified schematic diagrams that only schematically show the basic structure of the present invention, only the configurations related to the present invention are shown.

[0021] (Embodiment 1) As shown in FIGS. 1 to 7, a manufacturing method for manufacturing a flexible printed circuit board by laser cutting includes the following steps.

[0022] Step S1: Input raw materials, add a protective layer, introduce a copper foil base layer, and bond protective layers to the upper and lower surfaces of the copper foil base layer. In Step S1, the protective layer includes a matte film, a two-layer protective film, or a single-layer protective film. Specifically, use a two-layer protective film as the base material, bond the copper foil base layer to the upper surface of the two-layer protective film, then bond the matte film on the copper foil base layer, and bond the single-layer protective film to the lower side of the two-layer protective film.

[0023] Step S2: Laser cut the circuit structure on the semi-finished product processed in Step S1.

[0024] Step S3: Perform residue discharge treatment, activation / washing, temporary bonding / temporary hot pressing on the semi-finished product processed in Step S2.

[0025] Specifically, peel the matte film of the semi-finished product processed in step S2, remove the residue of the copper foil, peel the single-layer protective film, then activate and clean the outer surface of the copper foil base layer in the semi-finished product, and sequentially laminate the upper coverlay and the upper protective film on the upper surface of the copper foil base layer from the inside to the outside. Then, perform temporary hot pressing on the lower layer of the semi-finished product. The temperature range of the temporary hot pressing on the lower layer is 60 - 130°C, and the other side is at normal temperature and low pressure. After the temporary hot pressing on the lower layer, peel the two-layer protective film on the lower layer of the semi-finished product, then activate and clean the lower surface of the copper foil base layer in the semi-finished product, and sequentially laminate the lower coverlay and the lower protective film on the lower surface of the copper foil base layer from the inside to the outside. Then, perform temporary hot pressing on the upper layer of the semi-finished product. The temperature range of the temporary hot pressing on the upper layer is 60 - 130°C, and the other side is at normal temperature and low pressure. Hot press the upper and lower sides of the semi-finished product with the upper coverlay and the upper protective film and the lower coverlay and the lower protective film laminated on both sides respectively. The temperature range of the hot pressing on both the upper and lower sides is 60 - 130°C. Also, plasma cleaning is used for activation and cleaning. The process operation in step S2 makes it easier to remove the bubbles in the semi-finished product.

[0026] Step S4. Perform combined hot pressing on the semi-finished product processed in step S3. In step S4, peel the upper protective film and the lower protective film of the semi-finished product processed in step S3, then laminate the upper hot pressing auxiliary film and the lower hot pressing auxiliary film on the upper and lower sides respectively, and then perform hot pressing. After the hot pressing, peel the upper hot pressing auxiliary film and the lower hot pressing auxiliary film on the semi-finished product. The temperature range of the hot pressing is 120 - 200°C, and the pressure range is 70 - 150 kg.

[0027] Step S5. Perform opening window processing on the semi-finished product processed in step S4 to expose the solder joint of the copper foil base layer.

[0028] After step S5, take a photo of the semi-finished product processed in step S5, send it to the image mechanism for inspection, and then there is further step S6 of marking and delivering the finished product after inspection. The inspection content implemented by the image mechanism includes the appearance inspection of the product by comparing or observing the images.

[0029] (Embodiment 2) According to Embodiment 1, the mat film includes a polyester film, a heat insulation base film is provided on the polyester film, and a heat-resistant adhesive layer is provided between the polyester film and the heat insulation base film.

[0030] And / or, the two-layer protective film includes a base film and a polyester film, and a heat-resistant adhesive layer is provided between the base film and the polyester film. It is used as a carrier for transporting the copper foil base layer, helps apply force to the laminate in the lamination and bubble removal process, increases the hardness of the copper foil base layer in the manufacturing process, and protects the surface of the product from the risk of scratching and dirt.

[0031] The lower coverlay and the upper coverlay use a heat-sensitive adhesive film layer. Also, the heat-sensitive adhesive film layer can use the heat-sensitive adhesive film products in the prior art as they are. After combining and thermally pressing the lower coverlay and the upper coverlay, a CVL layer covering the outside of the copper foil base layer is formed.

[0032] And / or, the lower protective film, the upper protective film, and the single-layer protective film are based on a polyester film, and an acrylic adhesive layer is coated on one side. The role of the lower protective film and the upper protective film is to increase the hardness of the product in the manufacturing process and protect the surface of the product from the risk of scratching and dirt.

[0033] And / or, the upper hot press auxiliary film and the lower hot press auxiliary film are based on a polyester film, and a release agent layer is coated on both sides. The upper hot press auxiliary film and the lower hot press auxiliary film have non-adhesiveness and can prevent the product after hot pressing from adhering to the laminate plate of the laminating device.

[0034] (Embodiment 3) As shown in FIGS. 1 to 7, according to Embodiment 1 or Embodiment 2, a manufacturing system for a flexible printed circuit board by a laser direct structuring method is used, which includes a raw material input and film temporary bonding module 1, a laser etching module 2, a residue discharge, temporary bonding, and hot press module 3, a combined hot press module 4, an opening window processing module 5 by laser, and a residue discharge, marking, inspection, and dispensing module 6, which are sequentially arranged according to the process.

[0035] The raw material input and film temporary bonding module 1 includes a first conveyance path, a plurality of first discharge rollers and first film peeling rollers corresponding to the first conveyance path, and a first suction mechanism is further provided on the first conveyance path. After introducing the copper foil base layer into the raw material input and film temporary bonding module 1, the operation of Step S1 is carried out.

[0036] Specifically, the plurality of first discharge rollers include a copper foil base layer discharge roller 13 located above the first conveyance path and arranged in order according to the transmission order, a matte film discharge roller 14, a two-layer protective film discharge roller 11 located on the supply side of the first conveyance path, and a single-layer protective film discharge roller 16 located below the first conveyance path. The plurality of first film peeling rollers are respectively used for removing residues on the two-layer protective film and removing residues on the matte film. With such an arrangement, the copper foil base layer can always be placed on the protective layer and transferred to the next process, improving the smoothness and convenience of processing.

[0037] The laser etching module 2 includes a second conveyance path provided with a first suction transmission table, and a corresponding laser etching device is provided on the first suction transmission table. The semi-finished product processed in Step S1 is derived from the raw material input and film temporary bonding module and transferred to the laser etching module 2, and the operation of Step S2 is carried out.

[0038] The residue discharge, temporary pasting, and hot press module 3 includes a third conveyance path, a plurality of third discharge rollers and third film peeling rollers corresponding to the third conveyance path, a lower layer hot press roller group for realizing a lower layer temporary hot press, an upper layer hot press roller group for realizing an upper layer temporary hot press, and a both-side hot press roller group for realizing hot press on both upper and lower sides. The semi-finished product processed in step S1 is derived from the laser etching module 2 and transferred to the residue discharge, temporary pasting, and hot press module 3, and the operation of step S3 is carried out.

[0039] Specifically, the plurality of third discharge rollers and the plurality of third film peeling rollers include a mat film waste removing roller 311, a tape waste discharging roller 31, a product waste removing roller 32, an upper coverlay discharging roller 33, an upper layer protective film discharging roller 35, which are located above the fourth conveyance path respectively, and a single layer protective film waste removing roller 310, a two-layer protective film waste removing roller 39, a lower coverlay discharging roller 38, a lower layer protective film discharging roller 37, which are located below the fourth conveyance path. The upper layer hot press roller group is an upper roller and a lower roller that are arranged side by side vertically and can be pressed against each other, and the upper roller has a heating function. The lower layer hot press roller group is an upper roller and a lower roller that are arranged side by side vertically and can be pressed against each other, and the lower roller has a heating function.

[0040] The combined hot press module 4 includes a fourth conveyance path, a plurality of fourth discharge rollers and fourth film peeling rollers corresponding to the fourth conveyance path, and a die-completed product hot press mechanism for step S4 to realize the hot press of the finished product. The semi-finished product processed in step S3 is derived from the residue discharge, temporary pasting, and hot press module and transferred to the combined hot press module, and the operation of step S4 is carried out.

[0041] Specifically, the plurality of fourth film peeling rollers and fourth discharge rollers include an upper layer protective film waste removing roller 41, an upper part hot press auxiliary film discharging roller 44, an upper part hot press auxiliary film removing roller 45, which are provided above the fourth conveyance path respectively, and a lower layer protective film waste removing roller 42, a lower part hot press auxiliary film discharging roller 43, a lower part hot press auxiliary film removing roller 46, which are provided below the fourth conveyance path.

[0042] The laser aperture window processing module 5 includes a fifth conveying path and a laser aperture window processing machine corresponding to the fifth conveying path. The semi-finished product processed in step S4 is derived from the combined thermal pressing module 4 and transferred to the laser aperture window processing module, and the operation of step S5 is carried out. During the aperture window processing, the solder joint of the copper foil base layer is exposed by a laser etching method.

[0043] The residue discharging, marking, inspecting, and dispensing module 6 includes a sixth conveying path and an image mechanism, an inspection mechanism, a marking mechanism, and a plurality of sixth residue discharging rollers corresponding to the sixth conveying path. The semi-finished product processed in step S5 is derived from the laser aperture window processing module 5 and transferred to the residue discharging, marking, inspecting, and dispensing module 6, and the operation of step S6 is carried out.

[0044] Operating principle As shown in FIGS. 1 to 7, a manufacturing system and a manufacturing method for manufacturing a flexible printed circuit board by laser cutting, particularly relating to a flexible printed circuit board (Laser Direct Circuit, LDC) by a laser direct structuring method. The present invention can manufacture a flexible printed circuit board by a laser processing method, optimize the convenience and environmental performance of the processing of the flexible printed circuit board, and improve the product performance and lifespan of the flexible printed circuit board. In the manufacturing process of the present invention, in the conveying process from step S1 to step S2, using a matte film, a two-layer protective film, and a single-layer protective film as carriers, a copper foil base layer between the two-layer protective film and the matte film is placed and conveyed together to the positions of step S2 and step S3. In step S3, after peeling off the matte film and the single-layer protective film, an upper coverlay and an upper protective film are pasted, and then after peeling off the two-layer protective film, a lower coverlay and a lower protective film are pasted, which facilitates the conveyance of processing. At the same time, the lower protective film and the upper protective film increase the hardness of the product in the manufacturing process and can protect the surface of the product from the risk of scratching and contamination. During the subsequent hot pressing, an upper hot pressing auxiliary film and a lower hot pressing auxiliary film are bonded to the outside of the upper coverlay and the lower coverlay. The upper hot pressing auxiliary film and the lower hot pressing auxiliary film have non-adhesiveness and can prevent the product after hot pressing from adhering to the laminate board. At the same time, the upper coverlay and the lower coverlay outside the copper foil base layer after hot pressing are heated to form a CVL layer (CVL (Coverlay, abbreviated as "CVL")) adhering to the outside of the copper foil base layer. The product manufactured by the technical means of the present invention includes a copper foil base layer and a CVL layer adhered to the outside of the copper foil base layer, and the solder joint of the copper foil base layer in the product exposes the CVL layer.

[0045] As shown in FIG. 8, the appearance of the preferred embodiment of the present invention has no missing or blackened line ends, no metal particles on the surface, and is clear and smooth compared to a flexible printed circuit board processed by the prior art. However, in the prior art of die-cutting with a round blade, a fuse cannot be die-cut and formed, there are indentations and edge collapses at the ends of the lines, and as a result of the cross-section analysis, there is a risk of piercing.

[0046] The peel performance of the product manufactured by the technical means of the present invention is shown in Fig. 9. The CVL layer and the copper foil base layer of the product manufactured by the technical means of the present application were subjected to a 180-degree peel test with a tensile testing machine, that is, the CVL layer was peeled off from the copper foil base layer in a U-shaped peeling direction for the peel test. From the test table shown in Fig. 9 and the corresponding graph of the peel performance shown in Fig. 10, the test criterion > 1000 gf / cm, and the actual average value was 1514 gf / cm, and it was found that it conforms to the peel resistance test standard of the flexible printed circuit board.

[0047] The conduction performance of the product manufactured by the technical means of the present invention was tested through a constant current source as shown in the conduction performance test table of Fig. 11. The constant current sources of the current in the test parameters used 1 A and 7 A, and the fuse melting state of the copper foil base layer in the product was judged. The longest melting time at 7 A current was 0.72 seconds, and the overcurrent time at 1 A current was 300 seconds or more.

[0048] The state photos of each stage of the solder float test performed on the product manufactured by the technical means of the present invention are shown in Fig. 12. The product was put into a lead-free solder pot at a temperature of 260 ± 5 °C, and the product was immersed for 10 ± 1 seconds. Then, the test article was tested. After the test, the circuit of the copper foil substrate and the CVL layer of the product were not peeled off or bubbled, were well bonded, and the solder coverage rate at the pad position was 95% or more.

[0049] The flexural resistance test was carried out on the product manufactured by the technical means of the present invention. The number of bending times was 5000 times and the angle was ±135°. The circuit of the copper foil substrate and the CVL of the product manufactured according to the present invention were not peeled off, cracked, or open-circuited, were well bonded, and the conduction after bending was normal, and the change in the resistance value was less than 20%.

[0050] A thermal shock test was conducted on the product manufactured by the technical means of the present invention. The product manufactured by the present invention was placed in a thermal shock test chamber. The test conditions were: low temperature exposure at -40°C for 45 minutes, high temperature exposure at 125°C for 45 minutes, and the number of cycles was 100 cycles. For the product manufactured by the present invention, the circuit and CVL of the copper foil substrate were not peeled off, cracked, or open-circuited, were well bonded, and the conduction after bending was normal, and the change in resistance value was less than 20%.

[0051] A constant temperature and humidity test was conducted on the product manufactured by the technical means of the present invention. The product manufactured by the present invention was placed in a constant temperature and humidity test chamber. The test conditions were: temperature 85 ± 2°C, humidity 85 ± 2%RH, and duration 1008 hours. For the product manufactured by the present invention, the circuit and CVL of the copper foil substrate were not peeled off, cracked, or open-circuited, were well bonded, and the conduction after bending was normal, and the change in resistance value was less than 20%.

[0052] A salt spray test was conducted on the product manufactured by the technical means of the present invention. The product manufactured by the present invention was placed in a salt spray tester (model: AOS - 108). The test conditions were: temperature 35 ± 2°C, saturator temperature 47 ± 2°C, solution concentration 50g / L ± 5g / L of NaCl, pH value of the solution 6.5 - 7.2, spray volume 1 - 2ml / 80CM 2 / h, and test time 48 hours. The circuit conduction of the product after the test was normal.

[0053] Through the suggestion of the ideal embodiment of the present invention and the above description, those skilled in the art can make various improvements and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content described in the specification, but should be determined based on the description of the claims.

[0054] (Supplementary Note) (Supplementary Note 1) A manufacturing method for manufacturing a flexible circuit board by laser cutting, comprising: a step S1 of inputting raw materials, adding a protective layer, introducing a copper foil base layer, and laminating protective layers on the upper and lower surfaces of the copper foil base layer; Step S2 of laser cutting a circuit structure on the semi-finished product processed in the previous step S1; Step S3 of performing residue discharge treatment, activation / washing, temporary pasting / temporary hot pressing on the semi-finished product processed in the previous step S2; Step S4 of performing combined hot pressing on the semi-finished product processed in the previous step S3; Step S5 of performing opening window processing on the semi-finished product processed in the previous step S4 to expose the solder joint of the copper foil base layer; A manufacturing method for manufacturing a flexible circuit board by laser cutting, characterized by including the above steps.

[0055] (Appendix 2) In the previous step S1, the protective layer includes a matte film, a two-layer protective film, or a single-layer protective film. Using the two-layer protective film as a base material, laminating the copper foil base layer on the upper surface of the two-layer protective film, then laminating the matte film on the copper foil base layer, and laminating the single-layer protective film on the lower side of the two-layer protective film. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Appendix 1, characterized by the above.

[0056] (Appendix 3) In the previous step S3, peeling off the matte film of the semi-finished product processed in the previous step S2, removing the residue of the copper foil, peeling off the single-layer protective film, then activating / washing the outer surface of the copper foil base layer inside the semi-finished product, laminating an upper coverlay and an upper protective film on the upper surface of the copper foil base layer in sequence from the inside to the outside, and then performing temporary hot pressing on the lower layer of the semi-finished product. The temperature range of the temporary hot pressing is 60 - 130 °C. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Appendix 2, characterized by the above.

[0057] (Appendix 4) In the step S3, the two-layer protective film on the lower layer of the semi-finished product after the temporary hot pressing is peeled off. Next, the lower surface of the copper foil base layer in the semi-finished product is activated and cleaned. The lower coverlay and the lower protective film are sequentially laminated on the lower surface of the copper foil base layer from the inside to the outside. Then, temporary hot pressing is performed on the upper layer of the semi-finished product. The temperature range of the temporary hot pressing is 60-130°C. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Appendix 2, characterized in that:

[0058] (Appendix 5) In the step S3, both upper and lower sides of the semi-finished product with the upper coverlay and the upper protective film and the lower coverlay and the lower protective film respectively attached to both sides are hot pressed. The temperature range of the hot pressing is 60-130°C. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Appendix 2, characterized in that:

[0059] (Appendix 6) In the step S4, the upper protective film and the lower protective film of the semi-finished product processed in the step S3 are peeled off. Next, the upper hot pressing auxiliary film and the lower hot pressing auxiliary film are respectively laminated on both upper and lower sides and then hot pressing is performed. The upper hot pressing auxiliary film and the lower hot pressing auxiliary film on the semi-finished product after the hot pressing are peeled off. The temperature range of the hot pressing is 120-200°C, the pressure range is 70-150 kg, and the time is 120-180 seconds. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Appendix 2, characterized in that:

[0060] (Appendix 7) A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Appendix 4, further comprising a step S6 of photographing the semi-finished product processed in the step S5 after the step S5, transmitting it to an image mechanism for inspection, and then marking and delivering the finished product after the inspection.

[0061] (Appendix 8) Using a manufacturing system for a flexible printed circuit board by a laser direct structuring method, which includes a raw material input and film temporary bonding module, a laser etching module, a residue discharge, temporary bonding, and hot press module, a combined hot press module, a laser opening window processing module, and a residue discharge, marking, inspection, and dispensing module, arranged sequentially according to the process, After introducing the copper foil base layer into the raw material input and film temporary bonding module, perform the operation of step S1. Derive the semi-finished product processed in step S1 from the raw material input and film temporary bonding module, transfer it to the laser etching module, and perform the operation of step S2. Next, derive the semi-finished product processed in step S1 from the laser etching module, transfer it to the residue discharge, temporary bonding, and hot press module, and perform the operation of step S3. Next, derive the semi-finished product processed in step S3 from the residue discharge, temporary bonding, and hot press module, transfer it to the combined hot press module, and perform the operation of step S4. Next, derive the semi-finished product processed in step S4 from the combined hot press module, transfer it to the laser opening window processing module, and perform the operation of step S5. Next, derive the semi-finished product processed in step S5 from the laser opening window processing module, transfer it to the residue discharge, marking, inspection, and dispensing module, and perform the operation of step S6. A manufacturing method for manufacturing a flexible printed circuit board by laser cutting, as described in appended claim 4, characterized by the above.

[0062] (Appended claim 9) The raw material input and film temporary bonding module includes a first conveyance path, a plurality of first discharge rollers and first film peeling rollers corresponding to the first conveyance path, and a first suction mechanism is further provided on the first conveyance path. Or / and, the laser etching module includes a second conveyance path provided with a first suction transfer table, and a corresponding laser etching device is provided on the first suction transfer table. Or / and, the residue discharging, temporary sticking, and hot pressing module includes a third conveyance path, a plurality of third discharge rollers and third film peeling rollers corresponding to the third conveyance path, a lower layer hot pressing roller group for realizing lower layer temporary hot pressing, an upper layer hot pressing roller group for realizing upper layer temporary hot pressing, and a both sides hot pressing roller group for realizing hot pressing on both upper and lower sides, Or / and, the combined hot pressing module includes a fourth conveyance path, a plurality of fourth discharge rollers and fourth film peeling rollers corresponding to the fourth conveyance path, and a die type finished product hot pressing mechanism for realizing hot pressing of the finished product, Or / and, the laser opening window processing module includes a fifth conveyance path and a laser opening window processing machine corresponding to the fifth conveyance path, Or / and, the residue discharging, marking, inspecting, and dispensing module includes a sixth conveyance path, an image mechanism, an inspecting mechanism, a marking mechanism, and a plurality of sixth residue discharge rollers corresponding to the sixth conveyance path, A manufacturing method for manufacturing a flexible printed circuit board by laser cutting according to appended claim 8, characterized in that.

[0063] (Appended claim 10) The matte film includes a polyester film, a heat insulating base film is provided on the polyester film, and a heat resistant adhesive layer is provided between the polyester film and the heat insulating base film, And / or, the two-layer protective film includes a base film and a polyester film, and a heat resistant adhesive layer is provided between the base film and the polyester film, And / or, the lower coverlay and the upper coverlay use a heat sensitive adhesive film layer, And / or, the lower protective film, the upper protective film, and the single-layer protective film are based on a polyester film, and an acrylic adhesive layer is coated on one side, And / or, the upper hot pressing auxiliary film and the lower hot pressing auxiliary film are based on a polyester film, and a release agent layer is coated on both sides, A manufacturing method for manufacturing a flexible printed circuit board by laser cutting as claimed in appended claim 6, characterized in that:

Explanation of Signs

[0064] 1 Raw material input and film temporary bonding module 11 Two-layer protective film discharge roller 13 Copper foil base layer discharge roller 14 Matt film discharge roller 16 Single-layer protective film discharge roller 2 Laser etching module 3 Residue discharge, temporary bonding and hot pressing module 31 Tape waste discharge roller 310 Single-layer protective film waste removal roller 311 Matt film waste removal roller 32 Product waste removal roller 33 Upper coverlay discharge roller 35 Upper protective film discharge roller 37 Lower protective film discharge roller 38 Lower coverlay discharge roller 39 Two-layer protective film waste removal roller 4 Combined hot pressing module 41 Upper protective film waste removal roller 42 Lower protective film waste removal roller 43 Lower hot pressing auxiliary film discharge roller 44 Upper hot pressing auxiliary film discharge roller 45 Upper hot pressing auxiliary film removal roller 46 Lower hot pressing auxiliary film removal roller 5 Laser opening window processing module 6 Residue discharge, marking, inspection and dispensing module a Copper foil base layer b CVL layer

Claims

1. A manufacturing method for manufacturing a flexible circuit board by laser cutting, comprising: a step S1 of inputting raw materials, adding a protective layer, introducing a copper foil base layer, and laminating protective layers on the upper and lower surfaces of the copper foil base layer; a step S2 of laser cutting a circuit structure on the semi-finished product processed in the step S1; a step S3 of performing residue discharge treatment, activation / washing, temporary lamination / temporary heat pressing on the semi-finished product processed in the step S2; a step S4 of performing combined heat pressing on the semi-finished product processed in the step S3; a step S5 of performing opening window processing on the semi-finished product processed in the step S4 to expose the solder joints of the copper foil base layer; A manufacturing method for manufacturing a flexible circuit board by laser cutting, characterized by including the above steps.

2. In the step S1, the protective layer includes a matte film, a two-layer protective film, or a single-layer protective film. When using the two-layer protective film as a base material, the copper foil base layer is laminated on the upper surface of the two-layer protective film, then the matte film is laminated on the copper foil base layer, and the single-layer protective film is laminated on the lower side of the two-layer protective film. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Claim 1, characterized by the above.

3. In the step S3, the matte film of the semi-finished product processed in the step S2 is peeled off, residues of the copper foil are removed, the single-layer protective film is peeled off, then the outer surface of the copper foil base layer in the semi-finished product is activated / washed, an upper coverlay and an upper protective film are sequentially laminated on the upper surface of the copper foil base layer from the inside to the outside, and then temporary heat pressing is performed on the lower layer of the semi-finished product. The temperature range of the temporary heat pressing is 60 to 130 °C. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Claim 2, characterized by the above.

4. In the step S3, after the temporary heat pressing, the two-layer protective film on the lower layer of the semi-finished product is peeled off, then the lower surface of the copper foil base layer in the semi-finished product is activated / washed, a lower coverlay and a lower protective film are sequentially laminated on the lower surface of the copper foil base layer from the inside to the outside, and then temporary heat pressing is performed on the upper layer of the semi-finished product. The temperature range of the temporary heat pressing is 60 to 130 °C. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to Claim 2, characterized by the above.

5. ​ In the step S3, heat pressing is performed on the upper and lower sides of the semi-finished product with an upper cover lay and an upper layer protective film, and a lower cover lay and a lower layer protective film respectively attached to both sides, and the temperature range of the heat pressing is 60 to 130 °C. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to claim 2, characterized in that.

6. In the step S4, the upper layer protective film and the lower layer protective film of the semi-finished product processed in the step S3 are peeled off, and then an upper heat pressing auxiliary film and a lower heat pressing auxiliary film are respectively attached to the upper and lower sides and then heat pressing is performed. After that, the upper heat pressing auxiliary film and the lower heat pressing auxiliary film on the semi-finished product after the heat pressing are peeled off. The temperature range of the heat pressing is 120 to 200 °C, the pressure range is 70 to 150 kg, and the time is 120 to 180 seconds. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to claim 2, characterized in that.

7. The manufacturing method for manufacturing a flexible circuit board by laser cutting according to claim 4, further comprising a step S6 of photographing the semi-finished product processed in the step S5 after the step S5, transmitting it to an image mechanism for inspection, and then marking and discharging the finished product after the inspection.

8. Using a manufacturing system for a flexible circuit board by a laser direct structuring method, comprising a raw material input and film temporary sticking module, a laser etching module, a residue discharge, temporary sticking and heat pressing module, a combined heat pressing module, an opening window processing module by laser, and a residue discharge, marking, inspection and discharging module, which are sequentially arranged according to the process. After introducing the copper foil base layer into the raw material input and film temporary sticking module, the operation of the step S1 is performed. The semi-finished product processed in the step S1 is derived from the raw material input and film temporary sticking module and transferred to the laser etching module to perform the operation of the step S2. Next, the semi-finished product processed in the step S1 is derived from the laser etching module and transferred to the residue discharge, temporary sticking and heat pressing module to perform the operation of the step S3. Next, the semi-finished product processed in the step S3 is derived from the residue discharge, temporary sticking and heat pressing module and transferred to the combined heat pressing module to perform the operation of the step S4. Next, the semi-finished product processed in the step S4 is led out from the combined hot press module and transferred to the laser opening window processing module to perform the operation of the step S5. Next, the semi-finished product processed in the step S5 is led out from the laser opening window processing module and transferred to the residue discharging, marking, inspecting, and dispensing module to perform the operation of the step S6. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to claim 4, characterized in that.

9. The raw material input and film temporary sticking module includes a first conveyance path, a plurality of first discharge rollers and first film peeling rollers corresponding to the first conveyance path, and a first suction mechanism is further provided on the first conveyance path. Or / and, the laser etching module includes a second conveyance path provided with a first suction transmission table, and a corresponding laser etching device is provided on the first suction transmission table. Or / and, the residue discharging, temporary sticking, and hot press module includes a third conveyance path, a plurality of third discharge rollers and third film peeling rollers corresponding to the third conveyance path, a lower layer hot press roller group for realizing lower layer temporary hot press, an upper layer hot press roller group for realizing upper layer temporary hot press, and a both sides hot press roller group for realizing hot press on both upper and lower sides. Or / and, the combined hot press module includes a fourth conveyance path, a plurality of fourth discharge rollers and fourth film peeling rollers corresponding to the fourth conveyance path, and a die-type finished product hot press mechanism for realizing hot press of the finished product. Or / and, the laser opening window processing module includes a fifth conveyance path and a laser opening window processing machine corresponding to the fifth conveyance path. Or / and, the residue discharging, marking, inspecting, and dispensing module includes a sixth conveyance path, an image mechanism, an inspection mechanism, a marking mechanism, and a plurality of sixth residue discharge rollers corresponding to the sixth conveyance path. A manufacturing method for manufacturing a flexible circuit board by laser cutting according to claim 8, characterized in that.

10. The matte film includes a polyester film, a heat insulating base film is provided on the polyester film, and a heat resistant adhesive layer is provided between the polyester film and the heat insulating base film. And / or, the two-layer protective film includes a base film and a polyester film, and a heat-resistant adhesive layer is provided between the base film and the polyester film. And / or, the lower coverlay and the upper coverlay use a heat-sensitive adhesive film layer. And / or, the lower protective film, the upper protective film, and the single-layer protective film are based on a polyester film, and an acrylic adhesive layer is applied to one side. And / or, the upper hot press auxiliary film and the lower hot press auxiliary film are based on a polyester film, and a release agent layer is applied to both sides. The manufacturing method for manufacturing a flexible circuit board by laser cutting according to claim 6, characterized by the above.

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