Card ring with non-contact near-field wireless communication function and its manufacturing method

Abstract

The present invention relates to a card ring. The card ring includes a control integrated circuit (IC chip) and a booster circuit module; a loop antenna; and a ring-shaped body on which the control integrated circuit and loop antenna are mounted. The body includes a slit formed by completely cutting out a portion of the body, an antenna groove, and an integrated circuit groove. The loop antenna is mounted by being wound multiple times along the antenna groove, and the control integrated circuit is mounted in the integrated circuit groove. The exposed slit, antenna groove, and integrated circuit groove of the body are filled with a curable epoxy. The booster circuit module is configured as a circuit with a predetermined capacitance, and the capacitance is determined according to the shape and size of the card ring's body, thereby adjusting the operating frequency of the integrated circuit.

Description

[Technical Field]

[0001] The present invention relates to a card ring having a contactless short-range wireless communication function and a manufacturing method thereof. More specifically, the present invention relates to a card ring having a single body portion, which is equipped with a control integrated circuit element (IC chip), a booster circuit module, and a loop antenna that enables contactless short-range wireless communication, and which is then configured to have contactless short-range wireless communication function by filling the exposed area of the body portion with curable epoxy, and a manufacturing method thereof. [Background technology]

[0002] Recently, not only is the use of credit cards on the rise, but transportation cards, debit cards, etc. are also widely used for small-amount payments. Depending on how cards are used, a wide variety of methods have been proposed to minimize the risk of losing a card while still being easy to use.

[0003] One example of such a method is a ring-shaped card. Korean Utility Model Patent No. 20-0294180 relates to a "ring incorporating an IC chip," and the publication discloses a ring incorporating an IC chip in an accessory such as a ring or watch, enabling it to perform various functions, such as credit cards, transportation cards, electronic currency (electronic money), parking cards, and department store cards. The ring incorporating an IC chip according to the aforementioned invention is structured so that a loop antenna connected to an IC chip that provides contactless short-range wireless communication functionality is wound around the ring body. The loop antenna connected to the IC chip communicates with an external device via contactless short-range wireless communication. Through contactless short-range wireless communication, the loop antenna generates an induced current and applies it to the IC chip, as well as transmitting and receiving data to and from the external device.

[0004] However, when a loop antenna is wrapped around a metal material, the metal material attenuates the strength of the signal received from an external terminal, resulting in the loop antenna not only being unable to generate an induced current but also making it difficult to transmit and receive data to and from an external terminal.

[0005] Therefore, in order to smoothly perform the contactless near field wireless communication function of the IC chip, the body of the ring must be made of an electrically insulating material that does not allow electricity to flow. Therefore, the ring according to the above-mentioned invention has a limitation in that it cannot be made of metallic or precious metal materials that allow electricity to flow, but must be made of insulating materials that do not allow electricity to flow, such as synthetic resins such as plastics, ceramics, etc.

[0006] To solve these problems, the inventor of this patent proposed Korean Patent No. 10-2070245. This patent relates to a "metallic jewelry having a non-contact short-range wireless communication function and a manufacturing method thereof," and is characterized by a configuration in which the body of the metallic jewelry is divided into a first body and a second body that can be connected to each other, with a control integrated circuit device and a loop antenna mounted between them. FIG. 1 is an exploded perspective view showing the structure of a metallic jewelry according to the prior art. However, as shown in FIG. 1, the two body parts of the metallic jewelry according to the patent require precise grooves to be formed along the inner periphery, which is not an easy process. Furthermore, the metallic jewelry according to the patent is manufactured by dividing the two body parts into two parts, mounting an antenna module and an integrated circuit device between them, and then connecting the two body parts to each other, resulting in a complex manufacturing process and a difficult joining process. This results in problems such as difficulty in mass production and high manufacturing costs. Summary of the Invention [Problem to be solved by the invention]

[0007] Therefore, the present invention has been made to solve the above problems, and its purpose is to provide a card ring that is easy to manufacture because it is composed of a single body part, and that can smoothly provide non-contact near-field wireless communication functionality, and a manufacturing method thereof. [Means for solving the problem]

[0008] In order to achieve the above technical object, a card finger ring according to a first aspect of the present invention comprises: a control integrated circuit (IC chip) capable of contactless short-range wireless communication with an external card reader; a loop antenna composed of a coated coil having a predetermined length, both ends of the coil connected to both ends of the control integrated circuit; and a body portion made of metal or a precious metal material and having a ring shape with a through hole formed in the center, on which the control integrated circuit and the loop antenna are mounted; the body portion comprises a slit formed by completely cutting out a portion of the body portion, an antenna groove formed along the outer peripheral surface of the body portion, and an integrated circuit groove formed in a predetermined region of the body portion, the loop antenna is mounted in a state of being wound multiple times along the antenna groove, and the control integrated circuit element is mounted in the integrated circuit element groove, and the exposed slit of the body portion, the antenna groove, and the integrated circuit element groove are filled with an electrically insulating filler material.

[0009] According to a second aspect of the present invention, there is provided a card finger ring comprising: a control integrated circuit (IC chip) capable of contactless short-range wireless communication with an external card reader; a loop antenna having a predetermined length and a coated coil, both ends of the coil connected to both ends of the control integrated circuit; and a ring-shaped body having a through hole formed in the center and mounting the control integrated circuit and loop antenna; the body comprising an antenna groove formed along the outer periphery of the body and an integrated circuit groove formed in a predetermined region of the body; the loop antenna mounted in a state of being wound multiple times along the antenna groove; the control integrated circuit mounted in the integrated circuit groove; and the exposed antenna groove and integrated circuit groove of the body being filled with an electrically insulating filler material.

[0010] In the card ring according to the first and second aspects, the filling material is preferably made of a hardened hardening epoxy or a mixture of a hardened hardening epoxy and a pigment.

[0011] The card ring according to the first and second aspects further includes a booster circuit module configured as a circuit having a predetermined capacitance and connected in parallel to the control integrated circuit element, and the booster circuit module is preferably configured to adjust the operating frequency to the highest matching frequency by adjusting the capacitance of the control integrated circuit element, and it is more preferable that the capacitance of the booster circuit module is determined according to the shape and size of the body of the card ring.

[0012] A method for manufacturing a card ring according to a third aspect of the present invention includes the steps of: (a) manufacturing a ring-shaped metal structure; (b) etching the outer periphery of the structure to a certain width and depth to form an antenna groove, and etching a predetermined area of the structure to a certain size and depth to form an integrated circuit element groove; (c) completely cutting open a portion of the structure to form a slit; (d) mounting a loop antenna in the antenna groove of the structure by winding it multiple times; (e) connecting both ends of the loop antenna to a control integrated circuit element (IC chip) capable of contactless short-range wireless communication with an external card reader, coating the control integrated circuit element with an insulating material, and then mounting it in the integrated circuit element groove of the structure; and (f) filling the antenna groove, integrated circuit element groove, and slit of the structure with a filling material including a curable epoxy and then curing it.

[0013] A method for manufacturing a card ring according to a fourth aspect of the present invention includes the steps of: (a) manufacturing a ring-shaped metal structure; (b) etching the outer periphery of the structure to a certain width and depth to form an antenna groove, and etching a predetermined area of the structure to a certain size and depth to form an integrated circuit element groove; (c) mounting a loop antenna in the antenna groove of the structure by winding it multiple times; (d) connecting both ends of the loop antenna to a control integrated circuit element (IC chip) capable of contactless short-range wireless communication with an external card reader, coating the control integrated circuit element with an insulating material, and then mounting it in the integrated circuit element groove of the structure; and (e) filling the antenna groove and the integrated circuit element groove of the structure with a filling material including a curable epoxy and then curing it.

[0014] It is preferable that the manufacturing method for a card ring according to the third and fourth features described above further comprises a step (g) of polishing the surface of the structure after the epoxy has hardened, and then plating or coating the surface.

[0015] In the manufacturing method for a card ring according to the third and fourth aspects, it is preferable to remove air bubbles in the curable epoxy at high temperature or pressure before filling the filling material containing the curable epoxy, and then fill the structure with the curable epoxy from which the air bubbles have been removed.

[0016] The manufacturing method for a card ring according to the third and fourth aspects preferably further includes the step of manufacturing a booster circuit module configured to have a predetermined capacitance and connecting the booster circuit module in parallel to the control integrated circuit element, and it is more preferable that the capacitance of the booster circuit module is determined according to the shape and size of the structure that will become the body of the card ring, which determines the diameter and length of the loop antenna. [Effects of the Invention]

[0017] The card finger ring of the present invention having the above-mentioned configuration is manufactured in a ring shape and is equipped with a control integrated circuit element and a loop antenna inside that enable contactless wireless communication, thereby providing the functions of a contactless credit card, transportation card, etc.

[0018] In addition, the card ring according to the present invention is made of a ring-shaped metal or precious metal material with a through hole formed in the center, and has a slit cut into a portion of the ring-shaped body, so that it can provide the functions of a contactless credit card or transportation card while maintaining the same external shape as a conventional precious metal ring.

[0019] Furthermore, the card ring according to the present invention is composed of a single-structure body, and is easy to manufacture by filling the grooves exposed for mounting the antenna and integrated circuit element with a filling material containing curable epoxy, curing it, and then polishing the surface.

[0020] Furthermore, the card ring of the present invention can maximize the recognition distance of the card ring by connecting a booster circuit module and adjusting the capacitance of the integrated circuit element to operate at the highest matching frequency. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 1 is an exploded perspective view showing the structure of a metal accessory according to the prior art. [Figure 2] 1A and 1B are front and rear perspective views showing a card ring having a contactless near field communication function according to a preferred embodiment of the present invention. [Figure 3] 1 is a schematic diagram showing a state in which a loop antenna, a control integrated circuit element, and a booster circuit module are electrically connected in a card ring having a non-contact short-range wireless communication function according to a preferred embodiment of the present invention. FIG. [Figure 4] 10A to 10C are diagrams illustrating various shapes of slits formed in the body of a card finger ring according to a preferred embodiment of the present invention. [Figure 5] 1 is a flowchart sequentially illustrating a method for manufacturing a finger ring for a card having a non-contact near-field wireless communication function according to a preferred embodiment of the present invention. [Figure 6] FIG. 1 is a perspective view illustrating an example of a structure in which an antenna groove, an integrated circuit element groove, and a slit are formed, i.e., a structure that will become the body of the ring, in a method for manufacturing a ring for cards according to a preferred embodiment of the present invention. [Figure 7] This is an oblique view showing an example of a state in which a loop antenna, a control integrated circuit element, and a booster circuit module are mounted on a structure that will become the body of the ring, in a method for manufacturing a ring for cards according to a preferred embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0022] The card ring with contactless near field wireless communication function according to the present invention is characterized by being conveniently usable as a credit card, etc., since an integrated circuit element and a loop antenna are mounted on a single-shaped body portion, enabling contactless near field wireless communication with an external terminal.

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the structure, operation, and manufacturing method of a finger ring for cards having a non-contact short-range wireless communication function according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0024] <Card Ring>

[0025] 2 is a front perspective view and a rear perspective view showing a card ring having a contactless near-field wireless communication function according to a preferred embodiment of the present invention. Referring to FIG. 2 and FIG. 3 described later, the card ring 1 according to the present invention includes a body 10, a control integrated circuit device 20, a booster circuit module 30, and a loop antenna 40.

[0026] The control integrated circuit device 20 is an integrated circuit device (IC chip) capable of contactless short-range wireless communication with an external terminal. It communicates with an external card reader via the loop antenna, receives an induced current due to an induced electromotive force, transmits and receives data, and uses the transmitted and received data to run a preset program. The control integrated circuit device may be configured as a contactless credit card IC chip, a payment IC chip, or a door lock IC chip. When the control integrated circuit device is a card IC chip, the card ring of the present invention can function as a credit card or transportation card, or as a payment card. When the control integrated circuit device is a door lock IC chip, the card ring of the present invention can function as a portable key for a door lock.

[0027] The card ring according to the present invention must be manufactured in various sizes according to ring sizes, and the length of the coil constituting the loop antenna and the diameter of the antenna vary depending on the ring size. Furthermore, structural differences in the body of the card ring, such as the size of the ring head and the width and thickness of the body, occur depending on the design of the card ring. This causes structural differences, which in turn cause the length of the coil constituting the loop antenna and the diameter of the antenna to vary depending on the design of the card ring. This causes a problem in that the internal capacitance (C) of the integrated circuit device mounted on the ring changes depending on the length and diameter of the loop antenna, which vary depending on the size and design of each card ring, resulting in a change in the operating frequency of the integrated circuit device, which is determined by the formula "operating frequency (F) = 1 / (2πRC)."

[0028] To solve this problem, in the card ring of the present invention, a booster circuit module is connected to the integrated circuit device. The booster circuit module 30 is configured as a circuit that provides a predetermined capacitance and is connected in parallel to both ends of the control integrated circuit device. The circuit that provides the predetermined capacitance may be configured with a capacitor or other semiconductor device. In the present invention, the booster circuit module is exemplified as one configured with one or more capacitors connected in series or parallel.

[0029] The capacitance of the booster circuit module can be determined by the size and design of the body, which determines the length and diameter of the loop antenna.

[0030] It is desirable to connect a booster circuit module in parallel with the control integrated circuit element and adjust the capacitance of the integrated circuit element to adjust the operating frequency so that the operating frequency of the integrated circuit element maintains its matching frequency. By maintaining the operating frequency of the integrated circuit element at the matching frequency in this way, the recognition distance of the card ring can be maximized.

[0031] The integrated circuit device and the booster circuit module are preferably electrically insulated by wrapping the surface with shrink tubing, high-temperature tape, etc., or coating the surface with an electrically insulating material. By electrically insulating the surface of the integrated circuit device and the booster circuit module in this way, it is possible to prevent short circuits due to contact with the metallic body.

[0032] The loop antenna 40 is an antenna configured by connecting a coil of a predetermined length, the surface of which is coated with an insulating material, to both ends of the control integrated circuit element and the booster circuit module, which are connected in parallel to each other, and is mounted inside the body together with the control integrated circuit element and the booster circuit module. The loop antenna 40 is preferably configured to be wound multiple times around the outer periphery of the ring-shaped body. In order to obtain the signal strength required for smooth data transmission and reception with an external terminal, the loop antenna is preferably configured to have a total length of approximately 700 mm or more.

[0033] 3 is a schematic diagram showing the electrically connected loop antenna, control integrated circuit element, and booster circuit module in a contactless near-field wireless communication function-equipped finger ring for cards according to a preferred embodiment of the present invention. Referring to FIG. 3, both ends of a loop antenna 40 wound multiple times around the outer periphery of the body of the finger ring are connected in parallel to both ends of a control integrated circuit element 20 and a booster circuit module 30.

[0034] The body 10 is formed in a ring shape with a through hole at the center, and is configured to mount the control integrated circuit device, booster circuit module, and loop antenna. The body 10 includes an antenna groove 100 formed along the outer periphery of the body, and an integrated circuit device groove 110 formed in a predetermined area of the body. A coil constituting the loop antenna is wound multiple times along the antenna groove and mounted, and the control integrated circuit device and booster circuit module, which are connected in parallel to each other, are mounted in the integrated circuit device groove.

[0035] Meanwhile, the body 10 may be made of various materials, such as non-metallic materials, metallic materials, and precious metal materials commonly used for rings. However, if the body is made of a metallic material having electrical conductivity, the metallic body may prevent the loop antenna from transmitting and receiving signals from an external card reader, which may result in the integrated circuit device, which should operate in a contactless manner, not operating properly. To solve this problem, the body may further include a slit 120 formed by completely cutting out a portion of the body. Since the body of the card ring has a slit, when the loop antenna is brought close to an external card reader, an induced current is generated in the loop antenna due to the induced electromotive force generated by the card reader. The induced current generated in the antenna is supplied to the contactless integrated circuit device, allowing the integrated circuit device to operate properly.

[0036] 4 is a diagram illustrating various shapes of slits formed in the body of a card ring according to a preferred embodiment of the present invention. Referring to FIG. 4, the slits are formed by cutting a part of the ring-shaped body, and the shapes may be various, such as curved, straight, diagonal, or geometric, or may be formed in a predetermined pattern.

[0037] The exposed areas of the slit of the body, the antenna groove in which the loop antenna is mounted, and the integrated circuit groove in which the integrated circuit device and the booster circuit module are mounted are filled with an electrically insulating resin material. The filling material is preferably made of a curable epoxy or a mixture of curable epoxy and a pigment. In particular, the exposed areas of the slit, the antenna groove, and the integrated circuit groove are filled with a mixture of curable epoxy and a predetermined pigment and then cured. After the mixture is cured, the hardened filling material polishes the exposed surface of the body, thereby forming a pattern with a specific color.

[0038] Hereinafter, the method for manufacturing a card-use ring according to the present invention will be described in detail with reference to Fig. 5. Fig. 5 is a flowchart sequentially explaining the method for manufacturing a card-use ring having a non-contact short-range wireless communication function according to a preferred embodiment of the present invention.

[0039] Referring to FIG. 5, in the method for manufacturing a card ring according to the present invention, first, a ring-shaped structure that will become the body of the card ring is manufactured (step 400).

[0040] Next, an antenna groove is formed by etching along the outer periphery of the ring-shaped structure to a certain width and depth, and an integrated circuit element groove is formed by etching in a predetermined area of the structure to a certain size and depth (step 410). Both ends of the antenna groove must be etched to connect with the integrated circuit element groove. The integrated circuit element groove is preferably formed on the back surface of the head of the ring.

[0041] Next, if the ring-shaped structure is a metal structure, a portion of the ring is cut open to form a slit (step 420). Figure 6 shows a front perspective view, a rear perspective view, and a front view exemplarily illustrating a structure 10 having an antenna groove 100, an integrated circuit element groove 110, and a slit 120 formed therein, i.e., a structure that will become the body of the ring, in a manufacturing method of a ring for cards according to a preferred embodiment of the present invention.

[0042] Next, a loop antenna is wound multiple times and mounted in the antenna groove of the structure (step 430).

[0043] Next, a booster circuit module is connected in parallel to both ends of the control integrated circuit element (step 440), and both ends of the loop antenna are connected to both ends of the control integrated circuit element (step 442). After that, an insulating material is applied to the surfaces of the control integrated circuit element and the booster circuit module, and they are mounted in the integrated circuit element groove of the structure (step 444). Figure 7 is a perspective view showing an example of a state in which the loop antenna, the control integrated circuit element, and the booster circuit module are mounted on the structure that will become the body of the ring in a manufacturing method for a ring for cards according to a preferred embodiment of the present invention.

[0044] Next, high temperature or pressure is applied to a filler material containing curable epoxy to remove any air bubbles in the epoxy, preparing the filler material (step 450). The exposed antenna groove, integrated circuit element groove, and slits formed by cutting a portion of the structure are filled with the filler material from which the air bubbles have been removed, and then the filler material is cured by exposing it to an ultraviolet (UV) lamp (step 460). The filler material may consist solely of curable epoxy or may be a mixture of curable epoxy and a pigment. By filling the antenna groove, integrated circuit element groove, and slits of the metal structure with the curable epoxy from which the air bubbles have been removed, the hardened epoxy structure is formed with a dense structure, enhancing the durability and aesthetic appeal of the ring.

[0045] Next, the surface of the structure with the cured epoxy is polished and then plated or coated (step 470).

[0046] Through the above steps, the manufacturing of the card ring capable of contactless wireless communication shown in FIG. 2 is completed.

[0047] While the present invention has been described above with reference to preferred embodiments thereof, these are merely examples and are not intended to limit the scope of the present invention, and those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the present invention without departing from the essential characteristics of the present invention. Differences related to such modifications and applications should be construed as being included within the scope of the present invention as defined in the claims.

Claims

1. a control integrated circuit element (IC chip) capable of contactless short-range wireless communication with an external card reader; a loop antenna formed of a coated coil having a predetermined length, both ends of which are connected to both ends of the control integrated circuit element; a ring-shaped body made of metal or precious metal material with a through hole formed in the center, the body having the control integrated circuit element and the loop antenna mounted thereon; Equipped with The body portion is a slit formed by completely cutting a portion of the body; an antenna groove formed along the outer circumferential surface of the body portion; a groove for an integrated circuit element formed in a predetermined region of the body portion, the loop antenna is mounted in a state where it is wound multiple times along the antenna groove, and the control integrated circuit element is mounted in the integrated circuit element groove; A card ring with a non-contact near-field wireless communication function, characterized in that the exposed slits, antenna grooves, and integrated circuit element grooves of the body are filled with an electrically insulating filling material.

2. The card ring with contactless near field communication function according to claim 1, wherein the filling material is a hardened hardening epoxy.

3. The card ring with non-contact near field communication function according to claim 1, wherein the filling material is a mixture of hardened curable epoxy and a pigment.

4. The card ring is a booster circuit module configured as a circuit having a predetermined capacitance and connected in parallel to the control integrated circuit element; The card ring with contactless near-field wireless communication function according to claim 1, wherein the booster circuit module is configured to adjust the operating frequency to the highest matching frequency by adjusting the capacitance of the control integrated circuit element.

5. The capacitance of the booster circuit module is The card ring with non-contact short-range wireless communication function according to claim 4, wherein the function is determined according to the shape and size of the body of the card ring.

6. a control integrated circuit element (IC chip) capable of contactless short-range wireless communication with an external card reader; a loop antenna formed of a coated coil having a predetermined length, both ends of which are connected to both ends of the control integrated circuit element; a ring-shaped body portion having a through-hole formed in the center and having the control integrated circuit element and the loop antenna mounted thereon; Equipped with The body portion is an antenna groove formed along the outer circumferential surface of the body portion; a groove for an integrated circuit element formed in a predetermined region of the body portion, the loop antenna is mounted in a state where it is wound multiple times along the antenna groove, and the control integrated circuit element is mounted in the integrated circuit element groove; A card ring with a non-contact near-field wireless communication function, characterized in that the exposed antenna groove and integrated circuit element groove of the body are filled with an electrically insulating filling material.

7. The card ring with contactless near field communication function according to claim 6, wherein the filling material is a hardened hardening epoxy.

8. The card ring with non-contact near field communication function according to claim 6, wherein the filling material is a mixture of hardened curable epoxy and a pigment.

9. The card ring is a booster circuit module configured as a circuit having a predetermined capacitance and connected in parallel to the control integrated circuit element; The card ring with contactless near-field wireless communication function according to claim 6, characterized in that the booster circuit module is configured to adjust the operating frequency to the highest matching frequency by adjusting the capacitance of the control integrated circuit element.

10. The capacitance of the booster circuit module is The card ring with non-contact short-range wireless communication function according to claim 9, wherein the function is determined according to the shape and size of the body of the card ring.

11. (a) manufacturing a ring-shaped metal structure; (b) etching a predetermined width and depth along the outer periphery of the structure to form a groove for an antenna, and etching a predetermined size and depth in a predetermined region of the structure to form a groove for an integrated circuit element; (c) completely cutting a region of the structure to form a slit; (d) mounting a loop antenna in the antenna groove of the structure by winding it multiple times; (e) connecting both ends of the loop antenna to a control integrated circuit element (IC chip) capable of contactless short-range wireless communication with an external card reader, and coating the control integrated circuit element with an insulating material and then mounting the control integrated circuit element in a groove for an integrated circuit element of the structure; (f) filling the antenna groove, the integrated circuit element groove, and the slits of the structure with a filler material including a curable epoxy, followed by curing; A method for manufacturing a card ring having a non-contact short-range wireless communication function, comprising:

12. The method for manufacturing the card ring includes: The method for manufacturing a card ring with contactless near-field wireless communication function according to claim 11, further comprising the step of (g) polishing the surface of the structure after the epoxy has hardened, and then plating or coating the surface.

13. 12. The method for manufacturing a card ring with a non-contact near field wireless communication function according to claim 11, characterized in that before filling the filling material containing the curable epoxy, air bubbles in the curable epoxy are removed at high temperature or pressure, and the curable epoxy from which the air bubbles have been removed is filled into the structure.

14. The method for manufacturing the card ring includes:

12. The method for manufacturing a card finger having contactless near-field wireless communication functionality according to claim 11, further comprising the steps of manufacturing a booster circuit module configured to have a predetermined capacitance and connecting the booster circuit module in parallel to the control integrated circuit element.

15. The capacitance of the booster circuit module is 15. The method for manufacturing a card ring having a non-contact near-field wireless communication function according to claim 14, characterized in that the manufacturing method is determined according to the shape and size of the structure that will become the body of the card ring.

16. (a) manufacturing a ring-shaped metal structure; (b) etching a predetermined width and depth along the outer periphery of the structure to form a groove for an antenna, and etching a predetermined size and depth in a predetermined region of the structure to form a groove for an integrated circuit element; (c) mounting a loop antenna in the antenna groove of the structure by winding it multiple times; (d) connecting both ends of the loop antenna to a control integrated circuit element (IC chip) capable of contactless short-range wireless communication with an external card reader, and coating the control integrated circuit element with an insulating material and then mounting the control integrated circuit element in a groove for an integrated circuit element of the structure; (e) filling the antenna groove and the integrated circuit device groove of the structure with a filler material including a curable epoxy, followed by curing; A method for manufacturing a card ring having a non-contact short-range wireless communication function, comprising:

17. The method for manufacturing the card ring includes: The method for manufacturing a card ring with contactless near-field wireless communication function according to claim 16, further comprising the step of (g) polishing the surface of the structure after the epoxy has hardened, and then plating or coating the surface.

18. 17. The method for manufacturing a card ring with a non-contact near field wireless communication function according to claim 16, characterized in that before filling the filling material containing the curable epoxy, air bubbles in the curable epoxy are removed at high temperature or high pressure, and the curable epoxy from which the air bubbles have been removed is filled into the structure.

19. The method for manufacturing the card ring includes:

17. The method for manufacturing a card finger having contactless near-field communication functionality according to claim 16, further comprising the steps of manufacturing a booster circuit module configured to have a predetermined capacitance and connecting the booster circuit module in parallel to the control integrated circuit element.

20. The capacitance of the booster circuit module is 20. The method for manufacturing a card ring having a non-contact near-field wireless communication function according to claim 19, characterized in that the manufacturing method is determined according to the shape and size of the structure that will become the body of the card ring.

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