Pressure Gauge Power Supply Unit

Abstract

One aspect of the present invention relates to a power supply unit (31) configured to be incorporated into a vacuum pressure gauge (1), the vacuum pressure gauge (1) including an ionization vacuum pressure sensor (3) having an anode (7) and a cathode (9). The power supply unit (31) includes a motherboard (55) and a daughterboard (65). The motherboard (55) has a first surface (57A) and a second surface (57B). A transformer (37) having a primary coil (W1) and a secondary coil (W2) is attached to the motherboard (55). The daughterboard (65) has one or more first electrical connectors (41-n) for supplying power to the ionization vacuum pressure sensor (3), the one or more first electrical connectors (41-n) including a high-voltage (HV) first electrical connector (41-1) electrically connected to the secondary coil (W2) of the transformer (37). The high voltage (HV) first electrical connector (41-1) is configured to connect to the anode (7) of the ionization vacuum pressure sensor (3). The daughter board (65) is attached to a first surface of the mother board (55), and one or more first electrical connectors (41-n) on the daughter board (65) are spaced apart from the first surface of the mother board (55). Aspects of the present invention relate to a vacuum pressure gauge (1) including a power supply unit (31), a mounting configuration for the power supply (31) to the vacuum pressure sensor (31), and a method for manufacturing the power supply unit (31).

Description

[Technical Field]

[0001] The present invention relates to a pressure gauge power supply unit. Aspects of the present invention relate to a power supply unit, a pressure gauge, and a method for manufacturing a pressure gauge. The pressure gauge is typically a vacuum pressure gauge for measuring vacuum pressure. [Background technology]

[0002] Pressure gauges are typically used to measure pressure in industrial systems. Pressure measurements can be used to ensure that the system has the appropriate pressure for its intended purpose. For example, a vacuum pressure gauge can be used in a vacuum system. If the measurement indicates that the pressure in the system is not low enough, this can be used to indicate and detect leaks or defects in the system and / or provide feedback to help control the vacuum pump that evacuates the system.

[0003] This specification generally refers to the pressure sensor of the vacuum pressure gauge assembly as a "pressure transducer," which is known to generate a signal (e.g., an electrical signal) as a function of pressure applied thereto. As will be appreciated by those skilled in the art, a wide variety of suitable pressure transducers and vacuum pressure gauge assemblies are known, and it should be understood that any such suitable type or combination of pressure transducer(s) and gauge assembly(ies) can benefit from, and are therefore within the scope of, the present disclosure.

[0004] Such types of gauge assemblies may include, for example, Pirani gauge assemblies, thermocouple gauge assemblies, ionization gauge assemblies (e.g., hot cathode gauge assemblies or cold cathode gauge assemblies (such as Penning gauge assemblies)), magnetic field gauge assemblies, reversed field gauge assemblies, wide range gauge assemblies, strain gauge assemblies, and the like.

[0005] The principles of operation of such vacuum pressure gauge assemblies and the pressure transducers (ie, pressure sensing elements) therein are readily known to those skilled in the art and will not be described in further detail herein. Summary of the Invention [Problem to be solved by the invention]

[0006] It is an object of the present invention to provide an improvement over known vacuum pressure gauges. [Means for solving the problem]

[0007] Aspects and embodiments of the present invention provide a power supply unit configured to be incorporated into a vacuum pressure gauge, the vacuum pressure gauge comprising an ionization vacuum pressure sensor having an anode and a cathode, the power supply unit comprising: a motherboard including a first surface and a second surface, the motherboard having a transformer mounted thereon, the transformer having a primary coil and a secondary coil; a daughter board including one or more first electrical connectors for supplying power to the ionization vacuum pressure sensor, the one or more first electrical connectors including a high voltage (HV) first electrical connector electrically connected to a secondary coil of the transformer, the high voltage (HV) first electrical connector configured to be connected to an anode of the ionization vacuum pressure sensor; Equipped with The daughterboard is mounted to a first surface of the motherboard, and one or more first electrical connectors on the daughterboard are spaced apart from the first surface of the motherboard. The one or more first electrical connectors are provided on the daughterboard to provide a large distance between the or each first electrical connector and an electrical component, such as a transformer, mounted on the motherboard. In at least certain embodiments, this can reduce the risk of electrical arcing. The power supply unit can be integrated with the vacuum pressure gauge to form a self-contained device. For example, the power supply unit and the vacuum pressure gauge can be disposed within a housing.

[0008] The transformer may include an auxiliary coil.

[0009] The power supply unit may include one or more voltage multipliers. The one or more voltage multipliers may be provided to increase the voltage output from the transformer. The transformer and the one or more voltage multipliers may be arranged in a flyback topology. In at least certain embodiments, the voltage multipliers may enable a relatively low response time of the vacuum pressure gauge. The one or more voltage multipliers may be provided on a motherboard.

[0010] The power supply unit may optionally include a step-down power supply, which may help reduce or eliminate the effect of input supply fluctuations on the output from the transformer. The step-down power supply may be a step-down converter, such as a buck converter.

[0011] The power supply unit may include one or more high voltage resistors. The high voltage resistors may be connected between the transformer and the output of the power supply unit. If the power supply unit includes one or more voltage multipliers, the high voltage resistors may be provided between the one or more voltage multipliers and the output from the power supply unit.

[0012] The daughterboard can be surface-mounted to a first surface of the motherboard. The daughterboard can be attached using a surface-mount assembly process, which can facilitate assembly of the power supply unit. For example, the daughterboard can be surface-mounted to the motherboard at the same time as other electrical components.

[0013] The one or more first electrical connectors may be surface mounted to the daughterboard. Alternatively, the one or more first electrical connectors may be through-hole mounted to the daughterboard. This may provide enhanced structural integrity for the one or more first electrical connectors.

[0014] The motherboard may include at least one control interface connector for connecting to the control unit. The at least one control interface connector may be located on a second surface of the motherboard. The at least one control interface connector may be surface-mounted on the second surface of the motherboard. The at least one control interface connector may comprise or consist of one or more input / output pins. The one or more input / output pins may extend perpendicular to the second surface of the motherboard. The at least one control interface connector may include a (pin) header electrical connector. The header electrical connector may be surface-mounted or through-hole mounted.

[0015] In at least certain embodiments, each of the one or more first electrical connectors can include a socket for receiving a connector pin to establish an electrical connection, and the or each socket can include a central axis extending substantially perpendicular to the first surface of the motherboard.

[0016] The daughterboard may include at least one groove to form a space between the motherboard and the daughterboard. The at least one groove may be formed in a second surface of the daughterboard that is positioned relative to the first surface of the motherboard. The at least one groove may, for example, be machined into the daughterboard. The at least one groove may extend at least partially around one of the first electrical connectors. For example, the at least one groove may extend at least partially around one of the first electrical connectors configured to supply high voltage (HV) to the ionization vacuum pressure sensor. The space between the motherboard and the daughterboard may be filled with an electrical potting compound.

[0017] The daughterboard can include a plurality of first electrical connectors. The plurality of first electrical connectors can include a first and second one of the first electrical connectors. The daughterboard can include a notch formed between the first and second one of the first electrical connectors. The first one of the first electrical connectors can be, for example, a high voltage (HV) electrical connector. The notch can extend through the daughterboard and can help electrically insulate the first and second one of the first electrical connectors from each other. The notch can be filled with an electrical potting compound.

[0018] An opening can be formed in the motherboard. The opening can extend through the motherboard. The transformer can be disposed in the opening. The transformer can be mounted to a second surface of the motherboard. The daughterboard can be contoured to extend around an outer periphery of the transformer. The outer periphery of the daughterboard can extend around an outer periphery of the transformer. The daughterboard can include a recess to accommodate the transformer.

[0019] The first surface of the motherboard may be the bottom surface of the motherboard.

[0020] The daughterboard can have a first surface and a second surface. The first electrical connector can be disposed on the first (upper) surface of the daughterboard. The second surface of the daughterboard can be disposed adjacent to the first surface of the motherboard, e.g., in a face-to-face mounting configuration. The second surface of the daughterboard can be attached to the first surface of the motherboard.

[0021] The first electrical wiring can be provided on a first surface of the motherboard. The second electrical wiring can be provided on a second surface of the daughterboard. An electrical connection can be established between the first and second electrical wiring. One or more first electrical connectors can be electrically connected to the second electrical wiring. For example, the one or more first electrical connectors can extend through the daughterboard and be electrically connected to the second electrical wiring.

[0022] The power supply unit can include an electrical potting compound. At least a portion of the first surface of the motherboard and at least a portion of the daughterboard can be encapsulated with the electrical potting compound. In at least certain embodiments, the electrical potting compound forms a permanent protective layer that forms an integral part of the power supply unit. The electrical potting compound can protect the electronic assembly and provide electrical insulation and / or high mechanical strength.

[0023] An electrical potting compound may be applied over at least a portion of the first surface of the daughterboard.

[0024] The first electrical connector is preferably not obstructed by the electrical potting compound, and the electrical potting compound is not applied over the first electrical connector.

[0025] The electrical potting compound is applied at least partially around the periphery of the daughterboard, and may be at least substantially flush with the first (upper) surface of the daughterboard.

[0026] A space formed between the motherboard and the daughterboard can be at least substantially filled with an electrical potting compound. A cutout formed in the daughterboard can be at least substantially filled with an electrical potting compound.

[0027] According to a further aspect of the present invention there is provided a vacuum pressure gauge comprising a power supply unit as described herein. The power supply unit may be integrated into the vacuum pressure gauge.

[0028] The vacuum pressure gauge may comprise a vacuum pressure sensor. The vacuum pressure sensor may include or consist of an ionization vacuum pressure sensor. The vacuum pressure sensor may include or consist of a hot cathode or cold cathode ionization vacuum pressure sensor.

[0029] Aspects and embodiments of the present invention provide a power supply unit configured to be incorporated into a vacuum pressure gauge comprising an ionization vacuum pressure sensor having an anode and a cathode, the power supply unit comprising: a motherboard including a first surface and a second surface, a transformer having a primary coil and a secondary coil mounted on the motherboard; An opening is formed in the motherboard, and the transformer is at least partially disposed in the opening in the motherboard.

[0030] The opening can extend through the motherboard, and the transformer can be a planar transformer disposed at least partially in the opening.

[0031] The transformer may have first and second opposing major surfaces, and the first major surface of the transformer may be substantially aligned with or protrude above the first surface of the motherboard.

[0032] The power supply unit can include a daughter board including one or more first electrical connectors for supplying power to the ionization vacuum pressure sensor, and the one or more first electrical connectors can include a high voltage (HV) first electrical connector electrically connected to a secondary coil of the transformer.

[0033] The daughterboard can be attached to a first surface of the motherboard. The daughterboard can be surface-mounted to the first surface of the motherboard. The daughterboard can be attached using a surface-mount assembly process, which can facilitate assembly of the power supply unit. For example, the daughterboard can be surface-mounted to the motherboard simultaneously with other electrical components. One or more first electrical connectors provided on the daughterboard can be spaced apart from the first surface of the motherboard.

[0034] The one or more first electrical connectors may be surface mounted to the daughterboard. Alternatively, the one or more first electrical connectors may be through-hole mounted to the daughterboard. This may provide enhanced structural integrity for the one or more first electrical connectors.

[0035] The daughterboard may have a contoured periphery that extends around the periphery of the transformer. The daughterboard may include a recess for receiving the transformer.

[0036] The transformer can be surface mounted on the surface of the motherboard. The transformer can be mounted on the first surface or the second surface of the motherboard.

[0037] The power supply unit may comprise one or more voltage multipliers, which may be provided on the motherboard.

[0038] The power supply unit may be removably attached to the ionizing vacuum pressure sensor.

[0039] According to a further aspect of the present invention there is provided a vacuum pressure gauge comprising a power supply unit as described herein. The power supply unit may be integrated into the vacuum pressure gauge.

[0040] The vacuum pressure gauge may comprise a vacuum pressure sensor. The vacuum pressure sensor may include or consist of an ionization vacuum pressure sensor. The vacuum pressure sensor may include or consist of a hot cathode or cold cathode ionization vacuum pressure sensor.

[0041] Any control unit or controller described herein may suitably comprise a computing device having one or more electronic processors. A system may include a single control unit or electronic controller, or various functions of a controller may be incorporated into or stored in various control units or controllers. As used herein, the term "controller" or "control unit" should be understood to include both a single control unit or controller and multiple control units or controllers that collectively operate to provide some specified control function. To configure a controller or control unit, a suitable set of instructions may be provided that, when executed, causes the control unit or computing device to implement the control techniques described herein. The instruction set may suitably be incorporated into the one or more electronic processors described above. Alternatively, the instruction set may be provided as software stored in one or more memories associated with the controller and executed on the computing device described above. A control unit or controller may be implemented as software running on one or more processors. One or more other control units or controllers may optionally be implemented as software running on the same processor or processors as the first controller. Other suitable configurations may also be used.

[0042] Within the scope of this application, the various aspects, embodiments, examples, and alternatives, particularly individual features thereof, described above, in the claims, and / or in the following description and drawings, are expressly intended to be construed independently or in any combination. That is, all embodiments and / or features of any embodiments may be combined in any manner and / or combination, unless incompatible. The applicant reserves the right to modify the originally filed claims or to submit new claims accordingly, including the right to amend the originally filed claims to depend on and / or incorporate other features of any other claims, even if not originally claimed as such.

[0043] One or more embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0044] [Figure 1] 1 shows a perspective view of a vacuum pressure gauge according to one embodiment of the present invention; [Figure 2] The circuit diagram of the power supply unit in the vacuum pressure gauge shown in Figure 1 is shown. [Figure 3] FIG. 1 shows a perspective view of a first side of a power supply unit without electrical potting compound. [Figure 4] FIG. 1 illustrates a perspective view of a first side of a power supply unit with an electrical potting compound. [Figure 5] FIG. 10 shows a perspective view of a second side of the power supply unit. [Figure 6] 1 shows a perspective view of a first side of a daughter board for attaching a first electrical connector to a power supply unit. [Figure 7] 7 illustrates a perspective view of a second side of the daughterboard shown in FIG. 6. [Figure 8] 1 illustrates a perspective view of an electrical connector provided on a vacuum pressure sensor for use in a vacuum pressure gauge according to an embodiment of the present invention. [Figure 9] 1 shows a schematic diagram of the controller of the TA control unit of the vacuum pressure gauge. [Figure 10] FIG. 1 shows a first perspective view of a control unit and power supply in a chassis for mounting to a vacuum pressure sensor. [Figure 11] FIG. 10 shows a second perspective view of the control unit and power supply in a chassis for mounting to the vacuum pressure sensor. [Figure 12] 1 shows a perspective view of a mold for forming electrical potting compound on a power supply unit. [Figure 13] FIG. 13 is a perspective view of a jig for supporting the multiple molds shown in FIG. 12. DETAILED DESCRIPTION OF THE INVENTION

[0045] A vacuum pressure gauge 1 according to an embodiment of the present invention will now be described with reference to the accompanying drawings. The vacuum pressure gauge 1 is used to measure the vacuum pressure of a Vacuum System Component (generally designated VSC). The vacuum system component VSC may be in the form of, for example, a vacuum pump.

[0046] FIG. 1 shows a perspective view of an assembled vacuum pressure gauge 1. The vacuum pressure gauge 1 includes an ionization vacuum pressure sensor 3. In this embodiment, the ionization vacuum pressure sensor 3 is a cold cathode ionization vacuum pressure sensor. The ionization vacuum pressure sensor 3 includes a cathode 5 and an anode 7 (shown schematically in FIG. 2). In use, a high voltage is applied to the anode 7, and negatively charged electrons leave the cathode 5 by field emission and migrate toward the anode 7. The electrons ionize neutral gas molecules, generating a gas discharge current that is measured to determine the vacuum pressure. The ionization vacuum pressure sensor 3 also includes a Pirani filament (not shown) and a Stryker filament (not shown). In a variant, the ionization vacuum pressure sensor 3 can be a hot cathode ionization vacuum pressure sensor. Other types of vacuum gauge sensors can be used in the vacuum pressure gauge 1.

[0047] The vacuum pressure gauge 1 comprises a base 9, a body 11, and an (upper) end member 13. The vacuum pressure gauge 1 includes a central longitudinal axis X. The body 11 is elongated along the central longitudinal axis X. In this embodiment, the body 11 is generally cylindrical in shape and has a circular cross-sectional outer shape. The body 11 comprises a housing 15 that surrounds the ionization vacuum pressure sensor 3. The housing 15 comprises a tubular sleeve having a right circular cylindrical shape. As described herein, the housing 15 is removable from the vacuum pressure gauge 1. The upper end of the housing 15 is closed by the end member 13. The end member 13 is provided with at least one external interface connector 17 for connecting to an external computer device (not shown). The vacuum pressure gauge 1 of this embodiment also comprises a status indicator 19. The status indicator 19 is annular in shape and extends around the circumference of the end member 13. In use, at least a portion of the status indicator 19 can be controllably illuminated to indicate the operating status of the vacuum pressure gauge 1 and / or the operating pressure measured by the ionization vacuum pressure sensor 3. The status indicator 19 can include one or more light-emitting devices (not shown), such as light-emitting diodes (LEDs). It should be understood that the body 11 of the vacuum pressure gauge 1 can have different shapes and / or contours. For example, the body 3 can have a cross-section in the form of a polygon or a rounded polygon.

[0048] Body 11 may be made of any suitable material, such as stainless steel or aluminum alloy, or a polymeric material (if operating conditions and temperatures permit), and may be made by any suitable manufacturing method, such as molding / casting, machining from a solid block, or 3D printing.

[0049] Base 9 is configured to be secured to a vacuum system component VSC, for example, using one or more mechanical fasteners. Flange 21 extends radially from base 9. In one example, flange 21 is NW25 specification, although any suitable size and shape flange can be used within the scope of this disclosure. Flange 21 includes a mating surface 23 for interconnecting with a vacuum system component VSC from which pressure will be measured. Optionally, mating surface 23 can include an annular recess (not shown) for receiving an O-ring to provide a seal between vacuum pressure gauge 1 and the vacuum system component VSC.

[0050] The flange 21 includes an inlet passage (not shown) for the chamber formed in the ionization vacuum pressure sensor 3. The inlet passage extends axially from the mating surface through the flange 21 to the chamber. The inlet passage is in fluid communication with the chamber, allowing the inflow and outflow of working gas (e.g., from the vacuum system component VSC) during use. A filter element (not shown) may be provided across the inlet passage to filter the working gas before it enters the chamber. The filter element helps prevent contaminants from entering the chamber. The filter element may comprise, for example, stainless steel (e.g., 316L) 30-2 mesh, although any other suitable type (e.g., membrane), material, and specifications of filter element may be used within the scope of the present disclosure.

[0051] "Working gas or process gas" means the gas or gases whose pressure the assembly is intended to measure. A "working gas" is typically the gas or gases that are in operation (e.g., the gas being exhausted from a vacuum system component VSC). The pressure of the gas in the chamber can provide an indication of the pressure in the vacuum system.

[0052] The vacuum pressure gauge 1 includes a power supply unit 31 and a control unit 35. The power supply unit 31 is configured to supply power to the ionization vacuum pressure sensor 3. In use, the power supply unit 31 outputs a high voltage to the anode 7 of the ionization vacuum pressure sensor 3. The power supply unit 31 is integrated into the vacuum pressure gauge 1. FIG. 2 shows a circuit diagram 200 for the power supply unit 31. The circuit diagram 200 includes a schematic diagram of the ionization vacuum pressure sensor 3. The power supply unit 31 includes a transformer 37 having a primary coil W1, an auxiliary coil W2, and a secondary coil W3. In this embodiment, the transformer 37 is a planar transformer, although other types of transformers can be used. The transformer 37 has first and second major surfaces 39A, 39B facing opposite directions. The secondary coil W3 is connected to the anode 7 of the ionization vacuum pressure sensor 3. The power supply unit 31 includes a plurality of first electrical connectors 41-n for connecting to the ionization vacuum pressure sensor 3. In this embodiment, each of the first electrical connectors 41-n includes an electrical socket.

[0053] As shown in FIG. 2 , the power supply unit 31 includes one or more voltage multipliers 43-n. In this embodiment, multiple voltage multipliers 43-n are provided. The voltage multipliers 43-n are provided to double the voltage output from the secondary coil W3 of the transformer 37. The voltage multipliers 43-n can generate a voltage of, for example, up to 5 kV. The transformer 37 and the voltage multipliers 43-n are arranged in a flyback topology with an operating frequency ranging from 10 to 100 KHz. Advantageously, the voltage multipliers 43-n can relatively shorten the response time of the vacuum pressure gauge 1. The output capacitance of the transformer 37 can be reduced. The voltage multipliers 43-n can be provided in a small area, thereby reducing the footprint of the power supply unit 31. Optionally, the power supply unit 31 includes a primary step-down power supply 45 to reduce or eliminate the effect of input supply fluctuations on the high voltage output from the transformer 37. The high voltage output can remain at least substantially unchanged regardless of the input supply. In this embodiment, the primary step-down power supply 45 is a buck converter (step-down converter).

[0054] The power supply unit 31 includes one or more high-voltage resistors 47-n connected between the voltage multiplier 43-n and the high-voltage output. The resistors 47-n limit the current and power from the power supply unit 31. The voltage applied to the ionization vacuum pressure sensor 3 may vary during ignition depending on the operating conditions. For example, ignition may occur more easily at high pressure than at low pressure. The resistors 47-n, for example, can limit the voltage applied to the ionization vacuum pressure sensor 3 during ignition. The resistors 47-n allow for a larger voltage at low vacuum pressures to aid in ignition of the ionization vacuum pressure sensor 3. The resistors 47-n can also provide secondary protection against user misuse.

[0055] The mounting configuration of the transformer 37 and the first electrical connector 41-n within the power supply unit 31 will be described in more detail below. The power supply unit 31 includes a first printed circuit board (PCB) 55 having a first (lower) surface 57A and a second (upper) surface 57B, and a second printed circuit board (PCB) 65 having a first (lower) surface 67A and a second (upper) surface 67B. The first printed circuit board 55 has a substantially circular outer shape to be positioned inside the body 11 of the vacuum pressure gauge. The first printed circuit board 55 may have a different outer shape. The second printed circuit board 65 is attached to the first surface 57A of the first printed circuit board 55 in a face-to-face arrangement. The second printed circuit board 65 has a thickness of approximately 4.5 mm. The thickness of the second printed circuit board 65 may be greater or less than 4.5 mm. In this embodiment, the second printed circuit board 65 is surface-mounted on the first printed circuit board 55. Other techniques can be used to mount the second printed circuit board 65 to the first printed circuit board 55. The first and second printed circuit boards 55, 65 include first and second electrical traces, respectively, to establish electrical connections. The first printed circuit board 55 is referred to herein as the motherboard 55, and the second printed circuit board 65 is referred to herein as the daughterboard 65.

[0056] As shown in FIGS. 3 and 5 , the motherboard 55 includes a through-opening 73 for accommodating the transformer 37. The transformer 37 is mounted on the second surface 57B of the motherboard 55 and is at least partially disposed within the through-opening 73. This mounting configuration reduces vertical packaging requirements for the transformer 37 within the body 11 of the vacuum pressure gauge 1. The first major surface 39A can be coincident with or offset from the first surface 57A of the motherboard 55. In this embodiment, the transformer 37 is mounted such that the first major surface 39A protrudes outward from the first surface 57A of the motherboard 55. The voltage multipliers 43-n and high-voltage resistors 47-n are mounted on the first surface 57A of the motherboard 55. The power supply unit 31 includes at least one control interface connector 59-n for communicating with the control unit 35, which is mounted on the second surface 57B of the motherboard 55. In this embodiment, the power supply unit 31 includes first and second control interface connectors 59-1 and 59-2. Each of the first and second control interface connectors 59-1 and 59-2 includes a plurality of input / output pins 61, such as general-purpose input / output (GPIO) pins. The input / output pins 61 may be provided, for example, in a header unit. The input / output pins 61 protrude substantially perpendicular to the second surface 57B. The input / output pins 61 are configured to be positioned in a complementary connector (not shown) provided on the control unit 35. The control unit 35 is mounted on the power supply unit 31 in a Hardware Attached on Top (HAT) configuration. At least one of the first and second control interface connectors 59-1 and 59-2 is configured to output a control signal from the control unit 35 to the power supply unit 31. The first and second control interface connectors 59-1 and 59-2 can also be used to supply power to the power supply unit 31.

[0057] As shown in FIGS. 3 and 4 , the power supply unit 31 includes a plurality of first electrical connectors 41-n. The first electrical connectors 41-n are mounted to a daughterboard 65. In this embodiment, the first electrical connectors 41-n are through-hole mounted to the daughterboard 65, although other mounting techniques can be utilized. This mounting configuration provides a vertical offset between the first electrical connectors 41-n and other components within the power supply unit 31, such as the transformer 37. This separation can reduce the risk of electrical arcing between components, for example, caused by high-voltage outputs. FIG. 6 shows a perspective view of a first surface 67A of the daughterboard 65 (separated from the motherboard 55), and FIG. 7 shows a perspective view of a second surface 67B of the daughterboard 65 (separated from the motherboard 55).

[0058] 8, the ionization vacuum pressure sensor 3 includes a plurality of second electrical connectors 71-n. The first electrical connectors 41-n and the second electrical connectors 71-n have complementary shapes. The first electrical connectors 41-n and the second electrical connectors 71-n are aligned with each other. In the assembled vacuum pressure gauge 1, the first electrical connectors 41-n and the second electrical connectors 71-n cooperate with each other to establish an electrical connection between the power supply unit 31 and the ionization vacuum pressure sensor 3.

[0059] In this embodiment, each of the first electrical connectors 41-n includes an electrical socket. Each of the electrical sockets has a central longitudinal axis Xn extending substantially parallel to the central longitudinal axis X of the vacuum pressure gauge 1. Each of the second electrical connectors 71-n includes an electrical pin. Each of the electrical pins has a central longitudinal axis Xn extending substantially parallel to the central longitudinal axis X of the vacuum pressure gauge 1. The vacuum pressure gauge 1 is assembled by aligning the first electrical connector 41-n and the second electrical connector 71-n and then moving the power supply unit 31 and the ionization vacuum pressure sensor 3 relative to each other in the axial direction (i.e., along the longitudinal axis X). Each of the second electrical connectors 71-n is positioned with the respective first electrical connector 41-n to establish an electrical connection. In a variant, each of the first electrical connectors 41-n can include an electrical pin, and each of the second electrical connectors 71-n can include an electrical socket. Other types and / or combinations of first electrical connectors 41-n and second electrical connectors 71-n may also be used.

[0060] The plurality of first electrical connectors 41-n includes a high-voltage first electrical connector 41-1 for connecting to the anode 7 of the ionization vacuum pressure sensor 3. The plurality of first electrical connectors 41-n also includes a chassis return first electrical connector 41-2, a high-voltage return first electrical connector 41-3, a first striker filament first electrical connector 41-4, a second striker filament first electrical connector 41-5, a Pirani filament A first electrical connector 41-6, a Pirani filament B first electrical connector 41-7, and a compensator first electrical connector 41-8. The plurality of second electrical connectors 71-n includes a high-voltage second electrical connector 71-1 for connecting to the high-voltage first electrical connector 41-1. The plurality of second electrical connectors 71-n also include a chassis return second electrical connector 71-2, a high-voltage return second electrical connector 71-3, a first striker filament second electrical connector 71-4, a second striker filament second electrical connector 71-5, a Pirani filament A second electrical connector 71-6, a Pirani filament B second electrical connector 71-7, and a compensator second electrical connector 71-8. It should be understood that one or more of the first and second electrical connectors 41-n, 71-n may be omitted. If the striker filament is omitted from the ionization vacuum pressure sensor 3, the first and second electrical connectors 41-4, 41-5, 71-4, 71-5 for the striker filament may be omitted. Alternatively or additionally, if the Pirani filaments A and B are omitted from the ionization vacuum pressure sensor 3, one or more of the first and second electrical connectors 41-6, 41-7, 71-6, 71-7 for the Pirani filaments A and B can be omitted.

[0061] As shown in FIG. 3, the daughterboard 65 has an exterior shape that includes a recess 77. The recess 77 is contoured to maintain a gap between the transformer 37 and the daughterboard 65. At least one channel 79 is formed in the second surface 67B of the daughterboard 65 to provide a space or gap between the motherboard 55 and the daughterboard 65. As shown in FIG. 7, the at least one channel 79 extends at least partially around the base of the high-voltage first electrical connector 41-1. In this embodiment, the at least one channel 79 is branched (generally Y-shaped), although other configurations are contemplated. The daughterboard 65 also includes at least one notch or opening 81. As shown in FIG. 6, the notch 81 may be formed between two or more first electrical connectors 41-n to improve electrical isolation. In this embodiment, the notch 81 is formed between the high voltage first electrical connector 41-1 and the Pirani filament A second electrical connector 71-6 and the compensator second electrical connector 71-8.

[0062] As shown in FIG. 4 , an electrical potting compound 83 is applied over the electrical components disposed on the first surface 67A of the daughterboard 65. The electrical potting compound 83 is applied to electrically insulate the components, for example, to prevent arcing between the high-voltage first electrical connector 41-1 and other components or connectors. The electrical potting compound 83 may also mechanically strengthen the power supply unit 31. At least a portion of the first surface 57A of the motherboard 55 is encapsulated in the electrical potting compound 83. In this embodiment, the electrical potting compound 83 is not applied to the second surface 57B of the motherboard 55. The electrical potting compound 83 may have a depth equal to or greater than the thickness of the daughterboard 65. In this embodiment, the electrical potting compound 83 is applied at least partially to the first surface 67A of the daughterboard 65. The electrical potting compound 83 is not applied to the first electrical connectors 41-n. The first electrical connectors 41-n may be sealed or covered, for example, when electrical potting compound 83 is applied. Electrical potting compound 83 is applied using a vacuum forming process, although other techniques may be utilized.

[0063] The control unit 35 is configured to control the operation of the ionization vacuum pressure sensor 3. As shown in FIG. 9 , the control unit 35 comprises a pressure sensor controller 91 including at least one electronic processor 93 and a memory (storage) device 95. A set of computational instructions is stored in the memory device 95. When executed, the computational instructions cause the at least one electronic processor 93 to control the ionization vacuum pressure sensor 3 according to the methods described herein. The at least one processor 93 comprises at least one electrical input 97-n for receiving an input signal ISS and at least one electrical output 99-n for outputting a control signal PSS. The input signal ISS may include, for example, a pressure measurement from the ionization vacuum pressure sensor 3. An external interface connector 17 is attached to the control unit 35 and supported on the end member 13 of the vacuum pressure gauge 1. The external interface connector 17 is in electrical communication with the at least one electronic processor 93 to receive power and / or communicate with an external user interface (not shown) during use. As such, external interface connector 17 can be connected by a cable to a power source and / or to an external user interface or device (e.g., a computer) for communicating with at least one electronic processor 93. In the illustrated configuration, interface connector 17 is a D-sub connector. Thus, interface connector 17 can be connected to a power source and / or an external user interface using a cable having a complementary D-sub connector. In other embodiments, other suitable connectors can be used, such as, for example, an RJ45 or USB connector.

[0064] As shown in FIGS. 10 and 11 , the power supply unit 31 and the control unit 35 are mounted on a chassis 101. The chassis 101 includes a set of diametrically opposed first and second fasteners 103A, 103B configured to engage edges of the power supply unit 31 and the control unit 35. The chassis 101 may include a single fastener or three or more fasteners. The first and second fasteners 103A, 103B are positioned in first and second positioning recesses 105A, 105B, respectively, formed on the outer periphery of the power supply unit 31. The first and second fasteners 103A, 103B are positioned in the first and second positioning recesses 105A, 105B to position the power supply unit 31 axially and / or angularly. The first and second fasteners 103A, 103B are also positioned in recesses (not shown) formed in the control unit 35 to position the control unit 35 axially and / or angularly. The chassis 101 includes opposing first and second resilient arms 107A, 107B. The chassis 101 can include a single resilient arm or three or more resilient arms. The first and second resilient arms 107A, 107B are configured to releasably engage the outer sidewalls of the ionization vacuum pressure sensor 3. As shown in FIG. XXX, an end member 13 is integrally formed with the chassis 101. First and second openings 109A, 109B are formed in the end member 13 to receive mechanical fasteners (not shown) that secure the control unit 35 to the chassis 101. Other techniques can be used to secure the control unit 35 and / or power supply unit 31 to the chassis 101. Optionally, an end plate 111 can be provided on the end member 13. The chassis 101 helps reduce or prevent relative movement of the power supply unit 31 and the control unit 35, thereby reducing mechanical loads on the first and second control interface connectors 59-1, 59-2. In an alternative embodiment, the chassis 101 can be omitted. For example, one or more mechanical fasteners can be used to secure the control unit 35 to the power supply unit 31 without a separate chassis 101. Optionally, the housing 15 can be fastened to the chassis 101.

[0065] The control unit 35 is attached to the power supply unit 31 to form a subassembly that can be removably attached to the ionizing vacuum pressure sensor 3. In this embodiment, the subassembly includes a chassis 101, although the chassis 101 can be omitted. As shown in FIG. 10 , the first electrical connectors 41-n are located on the bottom surface of the subassembly. The power supply unit 31 is adapted to move axially in a first direction toward the ionizing vacuum pressure sensor 3 to introduce each of the second electrical connectors 71-n into a respective one of the first electrical connectors 41-n. This allows the power supply unit 31 and the control unit 35 to be attached to the ionizing vacuum pressure sensor 3. The power supply unit 31 is removable from the ionizing vacuum pressure sensor 3. The power supply unit 31 is adapted to move axially in a second direction away from the ionizing vacuum pressure sensor 3 to move the second electrical connectors 71-n out of their respective first electrical connectors 41-n. In this embodiment, the power supply unit 31 and the control unit 35 are removed as a single unit including the chassis 101 and the housing 15. The housing 15 is secured in place and limits or prevents access to the power supply unit 31 .

[0066] As noted above, the ionizing vacuum pressure sensor 3 is secured to a base 9 that is secured to the vacuum system component VSC during use. In at least certain embodiments, the power supply unit 31 is removed, leaving the ionizing vacuum pressure sensor 3 and base 9 in place on the vacuum system component VSC.

[0067] The application of electrical potting compound 83 to power supply unit 31 is described below with reference to Figures 12 and 13. It is contemplated that this process may be performed simultaneously on multiple power supply units 31. However, for simplicity, the process will be described with reference to a single power supply unit 31.

[0068] The electrical components of the power supply unit 31 (including the transformer 37) and the daughterboard 65 are surface-mounted to the motherboard 55 to form a subassembly 121. An electrical potting compound 83 is applied to the subassembly 121. Specifically, the subassembly 121 is supported in a mold 125 that defines a mold cavity 123. In this embodiment, the mold 125 includes an annular wall 127 that forms the sidewall of the mold cavity 123. The mold 125 in this embodiment is configured to close or cover each of the first electrical connectors 41-n to prevent the electrical potting compound 83 from contaminating the contact surfaces. In this embodiment, the mold 125 includes a plurality of mold recesses 129 configured to receive ends of the first electrical connectors 41-n. The first electrical connectors 41-n are positioned in the mold recesses 129, thereby allowing the first surface 67A of the daughterboard 65 to contact the base of the mold cavity 123 in a face-to-face arrangement. The distal ends of the first electrical connectors 41-n may seat against the base of the mold cavity 123 or mold recess 129, preferably sealing each of the first electrical connectors 41-n. Alternatively or additionally, the mold cavity 123 may include one or more protrusions (not shown) for positioning the first electrical connectors 41-n. A mold release agent may be applied to the mold cavity 123 to facilitate removal of the power supply unit 31 after the electrical potting compound 83 has cured.

[0069] The subassembly 121 is positioned in the mold 125, with an outer portion of the first surface 57A of the motherboard 55 seated against the annular wall 127. The motherboard 55 at least substantially seals the mold cavity 123. The first surface 57A of the motherboard 55 faces into the mold cavity 123. A closure member 131 is attached to the mold 125 to secure the subassembly 121 in place. The closure member 131 includes an annular protrusion 133 for engaging the second surface 57B of the motherboard 55. A seal is formed between the motherboard 55 and the mold 125 and / or the closure member 131 to at least substantially seal the mold cavity 123. The seal may be formed between the outer edge of the motherboard 55 and a sidewall of the mold cavity 123. Alternatively or additionally, a seal may be formed between the second surface 57B of the motherboard 55 and the annular protrusion 133 of the closure member 131.

[0070] The electrical potting compound 83 is at least partially injected into the mold cavity 123 to encapsulate the daughterboard 65. The electrical potting compound 83 is dispensed around the periphery of the daughterboard 65. The depth of the electrical potting compound 83 (from the first surface 57A of the motherboard 55) can be less than the thickness of the daughterboard 65. However, preferably, the depth of the electrical potting compound 83 is equal to or greater than the thickness of the daughterboard 65. The electrical potting compound 83 can form a thin layer on the first surface 67A of the daughterboard 65. The electrical potting compound 83 fills the mold cavity 123 and encapsulates the electrical components located on the first surface 57A of the motherboard 55. In this embodiment, the electrical potting compound 83 is introduced under vacuum to enhance penetration. A mold recess 129 formed in the mold 125 prevents the electrical potting compound 83 from flowing into the first electrical connector 41-n.

[0071] The electrical potting compound 83 is allowed to harden within the mold cavity 123. The closure member 131 is removed and the power supply unit 31 is removed. The power supply unit 31 is then attached to the vacuum pressure gauge 1.

[0072] As shown in Figure 12, the mold 125 includes multiple mold cavities 123. In use, multiple subassemblies 121 are attached to the mold 125 and electrical potting compound 83 is simultaneously introduced into the mold cavities 123. As shown in Figure 13, multiple molds 125 can be processed simultaneously. A jig 135 is provided to support the multiple molds 125.

[0073] It should be understood that various changes and modifications can be made to the present invention without departing from the scope of the present application. In this embodiment, the power supply unit 31 and the control unit 35 are described as being provided on separate printed circuit boards (PCBs). In a variant, the power supply unit 31 and the control unit 35 can be provided on the same printed circuit board (PCB). [Explanation of symbols]

[0074] 1 vacuum pressure gauge 3 Vacuum pressure sensor 5 cathode 7 Anode 9 base 11 Main unit 13 End member 15 Housing 17 External interface connector 19 Status indicator 21 flange 23 Mating surface 31 Power supply unit 35 Control Unit 37 (planar) transformer 39A Transformer first main surface 39B Transformer second main surface 41-n First Electrical Connector 43-n voltage multiplier 45 Step-down power supply 47-n output resistor 55 First printed circuit board (motherboard) 57A (Motherboard) First Surface 57B (Motherboard) Second Surface 59-1, 59-2 First and second control interface controllers 65 Second Printed Circuit Board (Daughter Board) 67A (Daughter Board) First Surface 67B (Daughterboard) Second Surface 71-n Second Electrical Connector 73 (Motherboard) through opening 77 (Daughterboard) Recess 79 (Daughterboard) Groove 81 (Daughter board) notch 83 Electrical Potting Compound 91 Pressure Sensor Controller 93 Electronic Processor 95 Memory Devices 97 Electrical Input 99 Electrical Output 101 chassis 103A, 103B First and second fasteners 105A, 105B First and second positioning recesses 107A, 107B First and second elastic arms 109A, 109B (end members) first and second openings 111 End plate 121 (Production) Partial assembly 123 Mold cavity 125 mold 127 (Mold) Annular Wall 129 (mold) recess 131 (mold) closure member 133 (mold) annular protrusion 131 (Mold) Jig

Claims

1. A power supply unit (31) configured to be incorporated into a vacuum pressure gauge, the vacuum pressure gauge (1) comprising an ionization vacuum pressure sensor (3) having an anode (7) and a cathode (9), the power supply unit (31) comprising: a motherboard (55) including a first surface (57A) and a second surface (57B), and a transformer (37) having a primary coil (W1) and a secondary coil (W2) mounted on the motherboard (55); a daughter board (65) including one or more first electrical connectors (41-n) for supplying power to the ionization vacuum pressure sensor (3), the one or more first electrical connectors (41-n) including a high voltage (HV) first electrical connector (41-1) electrically connected to the secondary coil (W2) of the transformer (37), the high voltage (HV) first electrical connector (41-1) configured to be connected to the anode (7) of the ionization vacuum pressure sensor (3); Equipped with The daughterboard (65) has a first surface (67A) and a second surface (67B), the daughterboard (65) is attached to the first surface (57A) of the motherboard (55) such that the second surface of the daughterboard (65) is disposed adjacent to the first surface (57A) of the motherboard (55), and the one or more first electrical connectors (41-n) on the daughterboard (65) are disposed on the first surface (67A) of the daughterboard (65) and spaced apart from the first surface of the motherboard (55).

2. 2. The power supply unit (31) of claim 1, wherein the daughterboard (65) is surface mounted to the first surface (57A) of the motherboard (55).

3. 2. The power supply unit (31) according to claim 1, wherein the motherboard (55) comprises at least one control interface connector (59-1, 59-2) for connection to a control unit, the at least one control interface connector (59-1, 59-2) being attached to the second surface of the motherboard (55).

4. 4. The power supply unit (31) of claim 1, 2 or 3, wherein each of the one or more first electrical connectors (41-n) comprises a socket for receiving a connector pin to establish an electrical connection.

5. A power supply unit (31) according to claim 4, wherein the or each socket comprises a central axis (Xn) extending substantially perpendicular to the first surface (57A) of the motherboard (55).

6. 6. The power supply unit (31) of claim 1, wherein at least one groove (79) is formed in a surface of the daughterboard (65) to form a space between the motherboard (55) and the daughterboard (65), and the space between the motherboard (55) and the daughterboard (65) is optionally filled with an electrical potting compound.

7. 7. The power supply unit (31) of claim 1, wherein the daughter board (65) comprises a plurality of the first electrical connectors (41-n), and the daughter board (65) comprises a notch (81) formed between a first and a second of the first electrical connectors (41-n), the notch being optionally filled with an electrical potting compound.

8. 8. The power supply unit (31) according to claim 1, wherein an opening (73) is formed in the motherboard (55), and the transformer (37) is disposed within the opening (73).

9. 9. The power supply unit (31) of claim 1, wherein at least a portion of the first surface (57A) of the motherboard (55) and at least a portion of the daughterboard (65) are encapsulated in an electrical potting compound (83), and the first electrical connector (41-n) is not obstructed by the electrical potting compound (83).

10. 10. The power supply unit (31) of claim 9, wherein the electrical potting compound (83) is applied over at least a portion of the first surface (67A) of the daughter board (65).

11. 11. The power supply unit (31) of claim 9 or 10, wherein the electrical potting compound (83) is applied around the periphery of the daughter board (65).

12. 12. A power supply unit (31) according to any one of claims 9 to 11 when directly or indirectly dependent on claim 6, wherein the at least one groove (79) formed in the daughter board (65) is at least substantially filled with the electrical potting compound (83).

13. 12. A power supply unit (31) according to any one of claims 9 to 11 when directly or indirectly dependent on claim 7, wherein the cutout (81) is at least substantially filled with the electrical potting compound.

14. A vacuum pressure gauge (1) comprising a power supply unit (31) according to any one of claims 1 to 13.

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