Wirelessly communicating cell monitoring circuit and battery module including the same

Abstract

The present invention provides a top plate assembly for a battery module, the top plate assembly including a cell monitoring circuit capable of wirelessly communicating with a master-level battery control circuit, and a battery module including the top plate assembly. The top plate assembly includes a metal top plate; a substrate receiving hole provided in a portion of the top plate; a substrate received in the substrate receiving hole; a wireless communication antenna mounted on the substrate; and a non-metallic housing that receives the substrate and secures it to the top plate. The substrate receiving hole has a noise prevention groove cut into the metal top plate to ensure a predetermined distance from the wireless communication antenna. The housing includes a lower housing made of a resin material on the bottom surface of the top plate that supports a lower portion of the substrate, and an upper housing made of a resin material on the top surface of the top plate that covers the substrate and the substrate receiving hole.

Description

[Technical Field]

[0001] The present invention relates to a cell monitoring circuit, and more particularly to a cell monitoring circuit that is installed in a battery module and is capable of wireless communication with a master-level battery control circuit, and a battery module including the same. [Background technology]

[0002] In order to increase the travel distance of electric vehicles, the number of battery modules installed per vehicle must increase, and the energy density of the cells must be increased within a limited space.

[0003] As the number of battery modules installed in a vehicle increases, the number of modules that must be controlled by one battery control circuit also increases. However, if the battery control circuit is connected to each of the cell monitoring circuits installed in the multiple modules by wire, the wiring structure becomes more complex, and damage to the wiring can lead to fire. In other words, as the energy density of the cells increases, the risk to safety also increases.

[0004] Furthermore, in order to connect the cell monitoring circuit and the battery control circuit installed in the battery module by wire, connectors or terminals that are exposed to the outside of the casing must be formed on the casing of the battery module. However, when vent gas leaking from the cells is discharged to the outside through the connectors or terminals, it may ignite when exposed to the outside air.

[0005] Korean Patent Publication Nos. 2021-0058540, 2017-0117118, and 2021-0149482 disclose technologies for wirelessly connecting a battery control circuit and a cell monitoring circuit. However, these documents do not disclose any structure for preventing vent gas leaking from the cell from being discharged to the outside.

[0006] Furthermore, to protect the cells housed inside the battery module, the battery module casing is made of metal to ensure its strength, but these metal casings interfere with wireless communication between the cell monitoring circuit of the battery module and the battery control circuit. However, the above document does not propose any solution to these wireless communication problems. Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention has been devised to solve the above-mentioned problems, and aims to provide a cell monitoring circuit that wirelessly connects a cell monitoring circuit and a battery control circuit, eliminating the need for wiring between them, and a battery module equipped with the same.

[0008] Another object of the present invention is to provide a battery module that ensures the strength of the casing of the battery module while preventing any interference with wireless communication between the cell monitoring circuit and the battery control circuit.

[0009] Another object of the present invention is to provide a battery module having a structure that allows easy installation of a cell monitoring circuit.

[0010] Another object of the present invention is to provide a battery module in which the installation structure of the cell monitoring circuit prevents moisture from entering the interior.

[0011] The present invention also aims to provide a battery module equipped with a cell monitoring circuit for easy maintenance.

[0012] Another object of the present invention is to provide a battery module that can delay the propagation of flames to the maximum extent possible even if a fire occurs.

[0013] The technical object of the present invention is not limited to the above-mentioned objects, and other unmentioned objects and advantages of the present invention can be understood from the following description and can be more clearly understood from the embodiments of the present invention. Furthermore, it is clear that the objects and advantages of the present invention can be achieved by the means and combinations thereof set forth in the claims. [Means for solving the problem]

[0014] To solve the above-mentioned problems, the present invention provides a top plate assembly that covers the top of a battery module, and a circuit board on which a cell monitoring circuit (slave level) and a wireless communication antenna are mounted is installed. By disposing the wireless communication antenna on the top of the battery module, wireless communication between the cell monitoring circuit and the battery control circuit (master level) can be more easily performed.

[0015] The top plate assembly includes a metal top plate having a substrate receiving hole formed in a portion thereof, and when the top plate is made of a metal material, sufficient rigidity of the top plate can be ensured.

[0016] The substrate accommodating hole may be substantially rectangular having long and short sides. The top plate may also be rectangular having long and short sides. The substrate accommodating hole may be located in the center of the top plate, and the long and short sides of the substrate accommodating hole may be arranged so that the long and short sides correspond to the long and short sides of the top plate. This ensures a sufficient distance between the outer edge of the top plate and the inner edge of the top plate defined by the substrate accommodating hole, thereby preventing the rigidity of the top plate from being reduced.

[0017] The outer edge of the substrate and the inner edge of the top plate defining the substrate receiving hole may have substantially the same shape, thereby minimizing the size of the substrate receiving hole and ensuring sufficient rigidity of the top plate.

[0018] The substrate is accommodated in the substrate accommodating hole, thereby preventing the metallic top plate from interfering with wireless communication of the substrate.

[0019] The top plate assembly includes a housing that receives the substrate and secures it to the top plate.

[0020] The housing may be made of a material that accommodates and protects the board and does not affect radio signals generated by a wireless communication antenna mounted on the board.

[0021] The housing may include a non-metallic material.

[0022] The non-metallic material may be a resin material, specifically a synthetic resin material.

[0023] The housing may include a lower housing on the bottom surface of the top plate that supports a lower portion of the substrate, and an upper housing on the upper surface of the top plate that covers the substrate and the substrate receiving hole.

[0024] The substrate receiving hole has a noise prevention groove cut into the metal top plate so as to ensure a predetermined separation distance from the edge of the wireless communication antenna to a member constituting the top plate.

[0025] The position of the wireless communication antenna mounted on the board may be near the outer edge of the board, thereby minimizing the influence of radio waves for wireless communication on other elements on the board.

[0026] The wireless communication antenna may be mounted to an outer edge of the substrate and positioned closest to a first portion.

[0027] The noise prevention groove may be formed on an inner edge of the top plate at a position corresponding to a first portion of an edge of the substrate adjacent to the wireless communication antenna.

[0028] The noise prevention groove may be formed by recessing an inner edge of the top plate toward an outer edge of the top plate.

[0029] The noise prevention groove may be defined by a recessed portion of an inner edge of the top plate that further separates a portion of the inner edge of the top plate from a corresponding first portion of an outer edge of the substrate.

[0030] The noise prevention groove may be formed in a form that communicates with the substrate receiving hole.

[0031] The separation distance ensured by the noise prevention groove may be 10 mm or more. Ensuring a separation distance of 10 mm or more can significantly reduce the occurrence of noise caused by interference of wireless signals from the wireless communication antenna by metal members constituting the top plate, thereby facilitating wireless communication with the battery control circuit.

[0032] The separation distance ensured by the noise prevention groove may be 20 mm or less. If the separation distance exceeds 20 mm, there is little reduction in the noise generation phenomenon and the rigidity of the top plate is weakened.

[0033] The lower housing may cover a lower portion of the substrate receiving hole.

[0034] In addition, the lower housing may cover a lower portion of the noise prevention groove.

[0035] A board connector may be mounted on an edge of the board to be connected to a sensor for measuring the temperature of the battery module.

[0036] A connector receiving groove can be formed by cutting out the top plate at a location in the board receiving hole that corresponds to the edge of the board on which the board connector is mounted, thereby making it easier to access the board connector.

[0037] A top cable connecting the board connector and the sensor may be installed on the bottom surface of the top plate.

[0038] The top cable may include an fPCB cable arranged around the housing, i.e., the lower housing, and may be attached to the bottom surface of the top plate.

[0039] The lower housing may include a base member and an inner wall member extending upwardly from the base member.

[0040] The substrate can be housed in a space provided inside the inner wall member of the base member.

[0041] The inner wall member may have a loop shape corresponding to the substrate. The inner wall member may have a closed loop shape or a loop shape with a portion thereof removed.

[0042] The base member may be provided with an internal snap fit that extends upwardly from the base member and resiliently fastens to the outer periphery of the substrate.

[0043] A hook-shaped locking portion can be provided at an upper end of the internal snap fit, and the locking portion can protrude inward beyond the inner wall member to support an upper surface of an edge of a substrate accommodated inside the inner wall member.

[0044] The internal snap fit makes the assembly process more convenient by allowing the lower housing and board to be easily pre-assembled during the assembly process of the battery module top plate assembly. The snap fit structure also makes it easy to remove the board from the lower housing for subsequent maintenance of the cell monitoring circuit.

[0045] The inner wall member can penetrate the top plate through the substrate accommodating hole.

[0046] When the upper end of the inner wall member is positioned higher than the upper surface of the top plate, it is possible to effectively prevent the penetration of moisture that flows along the upper surface of the top plate and attempts to flow into the substrate.

[0047] The base member may be provided with an external snap fit extending upwardly from the base member for resiliently fastening to an inner edge of the top plate.

[0048] A locking shape provided at the upper end of the external snap fit can protrude outward beyond the inner wall member and support the upper surface of the top plate.

[0049] At least a portion of an outer portion of the base member provided outside the inner wall member may be in contact with or fixed to a bottom surface of the top plate.

[0050] Therefore, when the lower housing is inserted upward through the lower space of the board receiving hole of the top plate, the outer portion of the base member restricts the upward movement of the lower housing, and the hook-engaging shape at the upper end of the outer snap fit restricts the downward movement of the lower housing. As a result, the lower housing can be temporarily attached to the top plate, making the assembly and maintenance processes more convenient.

[0051] The outer portion of the base member may cover a lower portion of the noise prevention groove. Since the noise prevention groove is formed by removing a metal member to reduce noise generation in a wireless communication antenna signal, the corresponding portion may be covered with a lower housing made of a resin material instead.

[0052] The lower housing may have an exposure groove at a location corresponding to the connector receiving groove. The exposure groove may be formed by removing the base member and the inner wall member from the lower housing.

[0053] The upper housing may cover an upper portion of the substrate receiving hole.

[0054] The upper housing may cover an upper portion of the noise prevention groove.

[0055] The upper housing may cover an upper portion of the connector receiving groove.

[0056] The upper housing may include a mounting member attached to the upper surface of the top plate, an outer wall member extending upward from an inner portion of the mounting member and surrounding the inner wall member of the lower housing, and a cover member connected to an upper portion of the outer wall member and covering the board.

[0057] A downward step may be formed at the lower portion of the outer edge of the mounting member, thereby further improving the sealing ability between the edge of the upper housing and the upper surface of the top plate, and preventing external moisture penetration.

[0058] The upper surface region of the top plate located inside the downward step may have a stepped shape that protrudes slightly upward compared to the outer region, thereby further enhancing the effect of preventing external moisture penetration.

[0059] The outer wall member of the upper housing may be disposed outside the inner wall member of the lower housing.

[0060] The upper housing may be fixed to the top plate via fasteners.

[0061] The fastening members may pass through the mounting member and the top plate and be fixed to an outer portion of the base member that is provided outside the inner wall member. The assembly process may be simplified by assembling the lower housing using the fastening members as described above while the lower housing is temporarily attached to the top plate via an external snap fit. Furthermore, when accessing the board for maintenance is required, even if the fastening members are separated and the upper housing is removed, the lower housing remains temporarily attached to the top plate, further facilitating the work. [Effects of the Invention]

[0062] The connection structure between the cell monitoring circuit and the battery control circuit according to the present invention connects them wirelessly, eliminating the need for wiring, thereby simplifying the structure and assembly of the battery pack and preventing accidents that may occur due to damage to the wiring.

[0063] Furthermore, according to the present invention, by placing the cell monitoring circuit on top of the battery module and forming a noise prevention groove in the top plate, the casing of the battery module can be made of metal to ensure sufficient strength, while still allowing for wireless communication between the cell monitoring circuit and the battery control circuit without any problems.

[0064] In addition, according to the present invention, the cell monitoring circuit is installed on the plate that constitutes the casing of the battery module, making assembly and installation easy, and this installation structure can prevent external moisture from entering the interior.

[0065] Furthermore, according to the present invention, the cell monitoring circuit is installed on the top plate of the battery module with a simple structure, so that the components can be easily accessed and disassembled, facilitating maintenance.

[0066] Furthermore, according to the present invention, even though a board accommodation hole is formed in the top plate in order to install a cell monitoring circuit in the top plate of the battery module, the inside and outside of the casing are securely isolated, and even if a fire occurs inside the battery module, the spread of the flame is delayed to the maximum extent possible, ensuring sufficient time for passengers to escape.

[0067] The above-mentioned effects and specific effects of the present invention will be described in conjunction with the following description of the preferred embodiment of the invention. [Brief explanation of the drawings]

[0068] [Figure 1] 1 is a perspective view of a battery module to which a wirelessly communicating cell monitoring circuit according to the present invention is applied; [Figure 2] FIG. 2 is a perspective view of a top plate assembly of the battery module of FIG. 1. [Figure 3] FIG. 3 is an exploded perspective view of the top plate assembly of FIG. 2. [Figure 4] FIG. 3 is an exploded perspective view of the top plate assembly of FIG. 2. [Figure 5] 10 is an enlarged plan view showing a portion where a wireless communication antenna is located, with a lower housing accommodating a circuit board fastened to a top plate. FIG. [Figure 6] FIG. 10 is a plan view of a state in which a lower housing accommodating a substrate is fastened to a top plate. [Figure 7] 7 is an enlarged view of a top plate assembly taken along the line VII-VII in FIG. 1; DETAILED DESCRIPTION OF THE INVENTION

[0069] The above-mentioned objects, features, and advantages will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can easily implement the technical concept of the present invention. In describing the present invention, if a detailed description of known technologies relating to the present invention is deemed to obscure the gist of the present invention, the detailed description will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings are used to indicate the same or similar components.

[0070] Although terms such as "first" and "second" are used to describe various components, it is understood that these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless otherwise specified, a first component may also be a second component.

[0071] Throughout the specification, unless specifically stated to the contrary, each element may be singular or plural.

[0072] Hereinafter, when an arbitrary structure is arranged "on top (or bottom)" of a component or "above (or below)" a component, it means that the arbitrary structure is not only arranged in contact with the upper surface (or lower surface) of the component, but also that other structures may be interposed between the component and the arbitrary structure arranged above (or below) the component.

[0073] Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, it should be understood that the components may be directly coupled or connected to each other, but that other components may be "intervening" between the components, or that each component may be "coupled," "coupled," or "connected" via other components.

[0074] As used herein, singular expressions include plural expressions unless the context clearly dictates otherwise. Terms such as "comprise" or "include" in this application should not be interpreted as including all of the multiple components or multiple steps described in the specification, but should be interpreted as meaning that some of the components or some of the steps may not be included, or may include additional components or steps.

[0075] Throughout the specification, "A and / or B" means A, B, or A and B, unless otherwise specified, and "C to D" means greater than or equal to C and less than or equal to D, unless otherwise specified.

[0076] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0077] An embodiment of the present invention is a battery module 1 including a master-level battery control circuit (not shown) and a slave-level cell monitoring circuit capable of wireless communication. The cell monitoring circuit is embodied on a substrate 20 on which a wireless communication antenna 24 is mounted. The substrate 20 is installed on the upper surface of the battery module 1. This allows the cell monitoring circuit to smoothly communicate wirelessly with the battery control circuit.

[0078] The battery module 1 may have a rectangular parallelepiped shape in which the length in the front-rear direction (depth) is longer than the length in the left-right direction (width) and the length in the up-down direction (height) is shorter than the width. The battery module 1 may have a structure in which a plurality of cells (C) are housed inside the rectangular parallelepiped casing 10 as described above.

[0079] The casing 10 may include a base plate 11 made of a metal material (e.g., aluminum material) having a rectangular parallelepiped shape whose bottom and both side surfaces are integrally formed, a pair of end plates 13 covering the front and rear surfaces of the battery module 1, respectively, and a top plate 15 covering the top surface of the battery module 1.

[0080] The base plate 11 may be manufactured by bending a metal sheet. The end plate 13 may include a sensor for measuring the temperature of the battery. The top plate 15 may include the substrate 20. The substrate 20 and the sensor may be electrically connected via a top cable 18 attached to the bottom surface of the top plate 15.

[0081] The top plate 15 can form an assembly including the substrate 20 and housings 40 and 60 for accommodating the substrate 20 .

[0082] The top plate 15 is made of a metal sheet material to ensure the rigidity of the casing 10. Metal materials interfere with wireless communication and cause noise, so the top plate 15 is formed with a substrate receiving hole 16 for receiving the substrate 20.

[0083] In practice, the top plate 15 may be rectangular, having long sides extending in the front-rear direction and short sides extending in the left-right direction. The substrate accommodating hole 16 may also be rectangular, having long sides extending in the front-rear direction and short sides extending in the left-right direction. The substrate accommodating hole 16 is disposed in the center of the top plate 15, maximizing the distance between the inner periphery of the top plate 15 and the outer periphery of the top plate 15, which is defined by the substrate accommodating hole 16. This prevents or minimizes a reduction in the rigidity of the top plate 15 due to the substrate accommodating hole 16.

[0084] The substrate 20 may have a shape and size corresponding to the substrate accommodating hole 16. That is, the substrate 20 may be rectangular in shape having long sides extending in the front-rear direction and short sides extending in the left-right direction.

[0085] A wireless communication antenna 24 may be mounted on the long edge of the substrate 20. The wireless communication antenna 24 is mounted on the edge of the substrate 20 to minimize signal interference with other elements within the substrate.

[0086] The top plate 15 is made of a metal material and may cause noise in the signal of the wireless communication antenna 24. Therefore, a noise prevention groove 164, which is an enlarged substrate receiving hole 16, may be provided on the inner periphery of the top plate 15 adjacent to the wireless communication antenna 24 by cutting out the top plate 15.

[0087] The noise prevention groove 164 can prevent the metal members constituting the top plate 15 from being present within a space separated by a predetermined distance (d) from the wireless communication antenna 24 .

[0088] The separation distance (d) may be 10 mm or more. If the separation distance (d) is less than 10 mm, the metal material of the top plate 15 will cause noise in the wireless communication signal. In other words, ensuring the separation distance (d) to be 10 mm or more can significantly reduce the phenomenon in which the wireless signal of the wireless communication antenna 24 is interfered with by the metal material constituting the top plate 15, causing noise, and can facilitate wireless communication with the battery control circuit.

[0089] The separation distance (d) ensured by the noise prevention groove 164 may be 20 mm or less. If the separation distance (d) exceeds 20 mm, there is almost no reduction in the noise generation phenomenon, and only the rigidity of the top plate 15 is weakened.

[0090] The wireless communication antenna 24 is preferably provided on the edge of the long side of the substrate 20. This allows the four sides of the rectangular substrate accommodating hole 16 and the four sides of the substrate 20 to be adjacent to and face each other, making it possible to regulate the front-to-rear and left-to-right positions of the substrate 20 by the inner periphery of the top plate 15 that defines the substrate accommodating hole 16.

[0091] For example, if the wireless communication antenna 24 is provided on the short edge of the substrate 20, a noise prevention groove 164 must be formed on the short side of the substrate accommodating hole 16 to ensure a separation distance (d) from the wireless communication antenna 24. However, if the width of the noise prevention groove 164 is greater than the width of the short side of the substrate accommodating hole 16, the entire inner periphery of the top plate 15 corresponding to the short side of the substrate accommodating hole 16 will be cut away to form the noise prevention groove 164. As a result, the position of the short edge of the substrate 20 on which the wireless communication antenna 24 is mounted will no longer be restricted by the inner periphery of the top plate 15 corresponding to the short side of the substrate accommodating hole 16.

[0092] The substrate 20 is connected to a sensor that detects the temperature of the battery module 1. As described above, the sensor may be installed on the end plate 13. The sensor and the substrate 20 may be connected via a top cable 18. The top cable 18 may be, for example, a flexible printed circuit board (FPCB) that bypasses the substrate receiving hole 16 and is fixed to the bottom surface of the top plate 15.

[0093] The board 20 may include a board connector 22 that is connected to the top cable 18. The board connector 22 may be provided on an edge of the board 20, and the inlet of the board connector 22 may be positioned so as to face laterally away from the edge of the board 20.

[0094] A connector receiving groove 162 can be provided in the board receiving hole 16 at a location corresponding to the edge of the board 20 on which the board connector 22 is mounted, by further cutting away the inner periphery of the top plate 15. This makes it easier to connect the top cable 18 and the board connector 22.

[0095] Like the wireless communication antenna 24, the board connector 22 is preferably provided on the long side edge of the board 20. In this way, even though the connector accommodating groove 162 is formed, the four sides of the rectangular board accommodating hole 16 and the four sides of the board 20 are adjacent to and face each other, so that the front-rear and left-right positions of the board 20 can be regulated by the inner periphery of the top plate 15 that defines the board accommodating hole 16.

[0096] In order to fix the substrate 20 to the top plate 15 while it is placed in the substrate receiving hole 16, the top plate assembly further includes a lower housing 40 on the bottom surface of the top plate 15 to support the lower part of the substrate 20, and an upper housing 60 on the top surface of the top plate 15 to cover the substrate 20 and the substrate receiving hole 16. Since the substrate 20 must perform wireless communication, the lower housing 40 and the upper housing 60 may be made of a material that does not cause interference with wireless communication. For example, these materials may be a synthetic resin material.

[0097] The lower housing 40 and the upper housing 60 do not affect the radio signals generated by the wireless communication antenna 24 mounted on the substrate 20, and also accommodate the substrate 20, fix it to the top plate 15, and protect the substrate 20.

[0098] The lower housing 40 may cover the lower portion of the board receiving hole 16. Furthermore, the lower housing 40 may cover the lower portion of the noise prevention groove 164. Furthermore, the lower housing 40 may expose the lower portion of the connector receiving groove 162 without covering it.

[0099] The lower housing 40 may support the bottom surface of the substrate 20 and the edges of the substrate 20 .

[0100] The lower housing 40 may include a base member 41 and an inner wall member 43 extending upward from the base member 41. The inner wall member 43 may have a rectangular loop shape corresponding to the board 20. The inner wall member 43 may have a closed loop shape or a loop shape with a portion removed.

[0101] The substrate 20 can be accommodated in a space provided inside the inner wall member 43 of the base member 41. As a result, the base member 41 supports the bottom surface of the substrate 20, and the inner wall member 43 surrounds and supports the edge of the substrate 20.

[0102] The base member 41 may be provided with an internal snap fit 45 that extends upward from the base member 41 and elastically fastens to the outer circumferential surface of the substrate. At least a lower portion of the internal snap fit 45 may also be connected to the inner wall member 43.

[0103] A hook-shaped locking portion may be provided at the upper end of the internal snap fit 45. The locking portion protrudes further inward than the inner wall member 43. As a result, when the substrate 20 is inserted into the internal space of the inner wall member 43, the hook-shaped locking portion may elastically deform outward to accommodate the substrate 20. After accommodating the substrate 20, the locking portion may elastically restore its original shape and support the upper surface of the substrate 20 accommodated inside the inner wall member 43.

[0104] The internal snap fit 45 allows the lower housing 40 and the substrate 20 to be easily handled in a pre-assembled state, making the assembly process more convenient and facilitating removal of the substrate 20 from the lower housing 40 during maintenance.

[0105] During the process of installing the lower housing 40 on the top plate 15, the inner wall member 43 may penetrate the top plate 15 through the substrate accommodating hole 16. As a result, the inner wall member 43 may be interposed between the outer periphery of the substrate 20 and the inner periphery of the top plate 15 that defines the substrate accommodating hole 16. The inner wall member 43 prevents direct contact between the edge of the substrate 20 and the top plate 15. In addition, the upper end of the inner wall member 43 is positioned higher than the upper surface of the top plate 15, thereby effectively preventing the penetration of moisture that flows along the upper surface of the top plate 15 and attempts to flow into the substrate 20.

[0106] During assembly, when the inner wall member 43 of the lower housing 40 is inserted into the board receiving hole 16 of the top plate 15, the lower housing 40 can be temporarily fastened to the top plate 15. To this end, the base member 41 may be provided with an external snap fit 47 that extends upward from the base member 41 and elastically fastens to the inner periphery of the top plate 15 that defines the board receiving hole 16. A lower portion of the external snap fit 47 may also be connected to the inner wall member 43. The external snap fit 47 may be provided at a position that does not overlap with the internal snap fit 45 to prevent mutual interference.

[0107] The locking shapes provided at the upper ends of the external snap fits 47 protrude further outward than the inner wall member 43 and can be elastically deformed inward when the inner wall member 43 of the lower housing 40 is inserted into the board accommodating hole 16. After the inner wall member 43 has passed through the board accommodating hole 16, the locking shapes can elastically restore their original shape and support the upper surface of the top plate 15.

[0108] On the other hand, the portion (inner portion) of the base member 41 located inside the inner wall member 43 supports the lower part of the substrate 20, and the portion (outer portion) located outside the inner wall member 43 can be fixed to the bottom surface of the top plate 15.

[0109] That is, when the lower housing 40 is clamped upward below the substrate receiving hole 16 of the top plate 15, the outer part of the base member 41 restricts the upward movement of the lower housing 40, and the hook-locking shape at the upper end of the outer snap fit 47 restricts the downward movement of the lower housing 40. That is, the lower housing 40 is temporarily fixed to the top plate 15 before using a separate fastening member (B), which provides convenience in assembly and maintenance.

[0110] The outer portion of the base member 41 covers the lower portion of the noise prevention groove 164. The lower housing 40 made of a resin material does not interfere with wireless communication of the wireless communication antenna 24.

[0111] An accommodating groove exposing groove 49 is provided in a portion of the lower housing 40 corresponding to the connector accommodating groove 162, where the outer portion of the base member 41 and the inner wall member 43 are removed. That is, the accommodating groove exposing groove 49 exposes the lower portion of the connector accommodating groove 162 downward without covering it. This facilitates connection between the top cable 18 and the board connector 22.

[0112] The upper housing 60 covers the upper portion of the board receiving hole 16. The upper housing 60 also covers the upper portion of the noise prevention groove 164 and the upper portion of the connector receiving groove 162. That is, the upper housing 60 completely covers the hole portion of the top plate 15.

[0113] The upper housing 60 surrounds the board receiving hole 16 , the noise prevention groove 164 , and the connector receiving groove 162 , and includes a mounting member 61 that is attached to the upper surface of the top plate 15 .

[0114] The mounting member 61 is provided with a hole through which the fastening member (B) passes. A plate fastening hole 17 through which the fastening member (B) passes is also provided in a corresponding portion of the top plate 15. A housing fastening hole 41 for fastening with the fastening member (B) is provided in a corresponding outer portion of the lower housing 40. The fastening member (B) may be a bolt that passes through a hole in the mounting member 61 and the plate fastening hole 17 and is fastened to the housing fastening hole 41.

[0115] A downward step 612 is provided at the bottom of the outer edge of the mounting member 61. Therefore, when the fastening member (B) is tightened, the downward step 612 comes into close contact with the upper surface of the top plate 15. The downward step 612 forms a closed loop. This seals the edge of the upper housing 60 and the upper surface of the top plate 15, preventing external moisture from penetrating.

[0116] The upper housing 60 further includes an outer wall member 63 that extends upward from an inner portion of the mounting member 61 and surrounds the inner wall member 43 of the lower housing 40. The outer wall member 63 of the upper housing 60 is disposed further outward than the inner wall member 43 of the lower housing 40.

[0117] The upper housing 60 further includes a cover member 65 connected to the upper portion of the outer wall member 63 to cover the substrate 20 .

[0118] The upper housing 60 is fixed to the top plate 15 via fastening members (B). The lower housing 40, with the substrate 20 housed therein, is temporarily fixed to the top plate 15 via external snap fits 47. When the upper housing 60 on the top of the top plate 15 covers the lower housing 40 and fastens the fastening members (B), the lower housing 40 and the upper housing 60 come into close contact with each other via the top plate 15.

[0119] When performing maintenance on the board 20, the fastening member (B) is removed and the upper housing 60 is removed. Then, the lower housing 40 remains temporarily fastened to the top plate 15. In this state, it is possible to approach the board 20 and easily perform tasks such as replacing the board 20.

[0120] With the upper housing 60 and the lower housing 40 fastened to the top plate 15 and the top cable 18 attached to the bottom surface of the top plate 15, a heat dissipation member 19 made of an elastically deformable material may be attached to the bottom of the top plate 15.

[0121] 7, a plurality of pouch cells (C) may be housed vertically inside the casing 10, and leads extending upward from the cells (C) may be electrically connected to the bus bars. Finally, the top plate assembly may be covered to complete the assembly of the battery module 1.

[0122] These battery modules 1 allow the cell monitoring circuit and battery control circuit to be wirelessly connected, eliminating the need for complicated wiring connecting the battery module 1 to the battery pack. This simplifies the structure and assembly of the battery pack and prevents accidents that may occur due to damage to the wiring.

[0123] Furthermore, with these battery modules 1, by placing the substrate 20 on top of the battery module 1 and forming a noise prevention groove 164 in the top plate 15, wireless communication between the cell monitoring circuit and the battery control circuit is not affected in any way, while the casing of the battery module can be made of metal to ensure strength.

[0124] In addition, by installing the lower housing 40 and the upper housing 60 on the top plate 15, it is possible to prevent external moisture from flowing inside, and to prevent gas leaking from the battery cell (C) from coming into contact with the outside air and igniting, so that even if gas leaks from the battery cell (C), ignition can be delayed or prevented.

[0125] Furthermore, since the board 20 on which the cell monitoring circuit is implemented is installed with a simple structure on the top plate 15 of the battery module 1, the board 20 can be easily accessed and disassembled, facilitating maintenance.

[0126] It should be understood that the above-described embodiments are illustrative in all respects and are not limiting, and the scope of the present invention is defined by the following claims rather than the above detailed description. All modifications and variations within the meaning and scope of the following claims, as well as equivalent concepts, should be construed as being included within the scope of the present invention.

[0127] Although the present invention has been described above with reference to illustrative drawings, the present invention is not limited to the embodiments and drawings disclosed in this specification, and it is obvious to those skilled in the art that various modifications can be made within the scope of the technical concept of the present invention. Furthermore, even if the effects of the configuration of the present invention are not explicitly described and explained while describing the embodiments of the present invention, it is natural that the effects that can be predicted by the configuration should also be recognized. [Explanation of symbols]

[0128] 1 Battery Module 10 Casing 11 Base Plate 13 End plate 15 Top plate (metal, aluminum) 16. Substrate receiving hole 162 Connector receiving groove 164 Noise prevention groove 17 Plate fastening holes 18 Top cable (fPCB cable) 19 Heat dissipation material (elastic deformation material) 20 Substrate 22 PCB connector 24 Wireless communication antenna 40 Lower housing (synthetic resin) 41 Base member 412 Housing fastening hole 43 Inner wall members 45 Internal snap fit 47 External snap fit 49 Storage groove Exposed groove 60 Upper housing (synthetic resin) 61 Mounting material 612 Downward Step 63 Exterior wall components 65 Cover member d separation distance B Fastening member (bolt) C Cell

Claims

1. A top plate assembly that covers the top of the battery module, Metal top plate; a substrate receiving hole provided in a partial region of the top plate; a substrate to be accommodated in the substrate accommodating hole; a wireless communication antenna mounted on the substrate; and a housing made of a non-metallic material that accommodates the substrate and is fixed to the top plate; The substrate accommodating hole is a noise prevention groove cut into the metal top plate to ensure a predetermined separation distance from the wireless communication antenna; Top plate assembly.

2. the wireless communication antenna is mounted on an outer edge of the substrate and disposed closest to a first portion; The top plate assembly of claim 1 .

3. the noise prevention groove is defined by a recessed portion of an inner edge of the top plate, the second portion being adjacent to the first portion and defined by the substrate receiving hole, such that the second portion is further spaced from an outer edge of the substrate; The top plate assembly of claim 2 .

4. a shape of an outer edge of the substrate substantially corresponds to a shape of an inner edge of the top plate defined by the substrate receiving hole; The noise prevention groove is defined by a recessed portion of an inner edge of the top plate so as to be further spaced from a corresponding outer edge of the substrate. The top plate assembly of claim 1 .

5. The separation distance is 10 mm or more. The top plate assembly of claim 1 .

6. The housing includes: a lower housing made of a resin material on the bottom surface of the top plate, which supports the lower part of the substrate; and an upper housing made of a resin material on the upper surface of the top plate, the upper housing covering the substrate and the substrate receiving hole; The top plate assembly of claim 1 .

7. the lower housing covers a lower portion of the noise prevention groove; The upper housing covers the upper part of the noise prevention groove. The top plate assembly of claim 6.

8. The lower housing includes: a base member; and an inner wall member extending upward from the base member and penetrating the top plate through the substrate accommodating hole; The substrate is accommodated in a space provided inside the inner wall member of the base member. The top plate assembly of claim 6.

9. At least a part of an outer portion of the base member provided on the outer side of the inner wall member is fixed to a bottom surface of the top plate, and the outer portion covers a lower portion of the noise prevention groove. The top plate assembly of claim 8.

10. the base member is provided with an internal snap fit extending upwardly from the base member; A locking shape provided at an upper end of the internal snap fit protrudes inward beyond the inner wall member, The internal snap fit resiliently fastens to the outer edge of the substrate. The top plate assembly of claim 8.

11. the base member is provided with an external snap fit extending upwardly from the base member; a locking shape provided at an upper end of the outer snap fit protrudes outward beyond the inner wall member; the external snap fit resiliently fastens to an inner edge of the top plate defined by the substrate receiving hole; The top plate assembly of claim 8.

12. a board connector connected to a sensor for measuring the temperature of the battery module is mounted on an edge of the board; a connector accommodating groove cut out from the top plate at a location on the inner edge of the top plate defined by the board accommodating hole that corresponds to an edge portion of the board on which the board connector is mounted; The top plate assembly of claim 1 .

13. a top cable connecting the board connector and the sensor is attached to a bottom surface of the top plate; the top cable includes an fPCB cable arranged around the housing; The top plate assembly of claim 12.

14. The housing includes: a lower housing made of a resin material on the bottom surface of the top plate, which supports the lower part of the substrate; and an upper housing made of a resin material on the upper surface of the top plate, the upper housing covering the substrate and the substrate receiving hole; an accommodation groove exposing groove is provided at a portion of the lower housing corresponding to the connector accommodation groove; The upper housing covers an upper portion of the connector receiving groove. The top plate assembly of claim 12.

15. The lower housing includes: a base member; and an inner wall member extending upward from the base member and penetrating the top plate through the substrate accommodating hole; The housing groove exposure groove is formed by removing a portion of the base member and the inner wall member. The top plate assembly of claim 14.

16. The upper housing includes: a mounting member attached to an upper surface of the top plate; an outer wall member extending upwardly from an inner portion of the mounting member and surrounding the inner wall member of the lower housing; and a cover member connected to an upper portion of the outer wall member and covering the substrate and the substrate receiving hole; The top plate assembly of claim 8.

17. A downward step is formed at the lower part of the outer edge of the mounting member.

17. The top plate assembly of claim 16.

18. The outer wall member is disposed outside the inner wall member.

17. The top plate assembly of claim 16.

19. a fastening member passing through the mounting member and the top plate and fixed to an outer portion of the base member provided on the outer side of the inner wall member; 17. The top plate assembly of claim 16.

20. A top plate assembly that covers the top of the battery module, Metal top plate; a substrate receiving hole provided in a partial region of the top plate; a substrate to be accommodated in the substrate accommodating hole; a wireless communication antenna mounted on the substrate; and a housing made of a non-metallic material that accommodates the substrate and is fixed to the top plate; The housing includes: a lower housing made of a resin material on the bottom surface of the top plate, which supports the lower part of the substrate; and an upper housing made of a resin material on the upper surface of the top plate, the upper housing covering the substrate and the substrate receiving hole; The lower housing includes: a base member; and an inner wall member extending upward from the base member and penetrating the top plate through the substrate accommodating hole; the inner wall member protrudes above the upper surface of the top plate, The substrate is accommodated in a space provided inside the inner wall member of the base member. Top plate assembly.

21. the base member is provided with an internal snap fit extending upwardly from the base member; A locking shape provided at an upper end of the internal snap fit protrudes inward beyond the inner wall member, The internal snap fit resiliently fastens to the outer edge of the substrate.

21. The top plate assembly of claim 20.

22. the base member is provided with an external snap fit extending upwardly from the base member; a locking shape provided at an upper end of the outer snap fit protrudes outward beyond the inner wall member; the external snap fit resiliently fastens to an inner edge of the top plate defined by the substrate receiving hole; 21. The top plate assembly of claim 20.

23. At least a part of an outer portion of the base member of the lower housing, which is provided on the outer side of the inner wall member, contacts the bottom surface of the top plate.

23. The top plate assembly of claim 22.

24. The upper housing includes: a mounting member attached to an upper surface of the top plate; an outer wall member extending upwardly from an inner portion of the mounting member and surrounding the inner wall member of the lower housing; and a cover member connected to an upper portion of the outer wall member and covering an upper portion of the substrate; 21. The top plate assembly of claim 20.

25. A downward step is formed at the lower part of the outer edge of the mounting member.

25. The top plate assembly of claim 24.

26. The outer wall member is disposed outside the inner wall member.

25. The top plate assembly of claim 24.

27. a fastening member passing through the mounting member and the top plate and fixed to an outer portion of the base member provided on the outer side of the inner wall member; 25. The top plate assembly of claim 24.

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