Thermoplastic compositions, methods for making same, and articles containing said compositions

Abstract

The molded article comprises a composition having specific amounts of polyamide, polyphenylene ether, and polyetheresteramide. The molded article can be an automotive component. Methods of making the composition and articles made from the composition are also disclosed.

Description

[Technical Field]

[0001] The present invention relates to thermoplastic compositions, methods for making same, and articles comprising said compositions.

[0002] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to and the benefit of European Patent Application No. 22200306.3, filed October 7, 2022, the contents of which are incorporated herein by reference in their entirety. [Background technology]

[0003] Dielectric performance is one of the considerations when selecting plastic materials suitable for use in electronics and communications applications. It is desirable to provide materials suitable for exposure to high frequency environments (e.g., in the 10 GHz to 100 GHz range). Polymer materials with higher dielectric constants (Dk) and dissipation factors (Df) will absorb significantly more electromagnetic energy, thereby affecting the intensity and phase of the electromagnetic waves.

[0004] However, in addition to dielectric performance, plastics used in such components should also possess certain mechanical performance properties, including high modulus and high impact strength. The addition of fillers, such as glass fiber, carbon fiber, and ceramic, can impart improved mechanical performance to polymeric materials. However, typical fillers tend to enhance dielectric performance (Dk and Df) properties. Summary of the Invention [Problem to be solved by the invention]

[0005] Therefore, there is a continuing need for new compositions that can address the above technical limitations. Specifically, it would be particularly useful to provide compositions that have good dielectric performance while also maintaining good mechanical properties and color. Such compositions would be particularly well suited for automotive applications. [Means for solving the problem]

[0006] A molded article comprises a composition comprising 25 weight percent to 77 weight percent polyamide, 20 weight percent to 45 weight percent polyphenylene ether, and 3 weight percent to 30 weight percent polyetheresteramide, wherein the weight percent of each component is based on the total weight of the composition, wherein the molded article is an automotive component, and the molded article has a heat deflection temperature of 120°C or greater as determined in accordance with ASTM D648, a heat deflection temperature of 100°C or greater as determined in accordance with ASTM D257, and a heat deflection temperature of 120°C or greater as determined in accordance with ASTM D257. 8 Ohms / square ~10 13 It exhibits a surface resistivity in ohms / square, a dielectric constant of less than 4 as determined using a QWED split post dielectric resonator and an Agilent PNA network analyzer, a flexural modulus of greater than 1200 MPa as determined according to ASTM D790, and a parasitic capacitance of less than 0.2 pF as determined using a capacitor signal detector at 100 kHz and 1 volt.

[0007] These and other features are exemplified by the following detailed description. DETAILED DESCRIPTION OF THE INVENTION

[0008] The present inventors have discovered that compositions comprising specific amounts of a compatibilized blend of polyamide, polyphenylene ether, and polyetheresteramide can advantageously provide a desirable combination of light color, low surface resistance, low volume resistance, and good mechanical properties, and are therefore particularly useful for preparing molded articles. Exemplary molded articles include various automotive components. The compositions of the present disclosure may further comprise a continuous phase comprising a polyamide and a polyetheresteramide, and a dispersed phase comprising a polyphenylene ether.

[0009] Accordingly, one aspect of the present disclosure is a molded article comprising a composition comprising a polyamide, a polyphenylene ether, and a polyetheresteramide.

[0010] Polyamides, also known as nylons, are characterized by the presence of multiple amide (-C(O)NH-) groups and are described in U.S. Pat. No. 4,970,272 to Gallucci. Polyamides can include aliphatic polyamides, aromatic polyamides, semi-aromatic polyamides, polyamide elastomers, and mixtures thereof. In one embodiment, the polyamide comprises an aromatic polyamide. In one embodiment, the polyamide comprises a poly(C 1~12alkylene dicarboxylates). Specific polyamides include polyamide 6, polyamide-6,6, polyamide-4, polyamide-4,6, polyamide-12, polyamide-6,10, polyamide-6,9, polyamide-6,12, amorphous polyamides, polyamide 6 / 6T and polyamide 6,6 / 6T having a triamine content below 0.5 weight percent, polyamide-9T, polyamide-10,10, polyphthalamide, and combinations thereof. In one embodiment, the polyamide comprises polyamide-6, polyamide-6,6, or a mixture thereof. In one embodiment, the polyamide comprises polyamide-6,6. In one embodiment, the polyamide comprises polyamide-6. In one embodiment, the polyamide comprises polyamide-6 and polyamide-6,6. Polyamides are commercially available from a variety of sources.

[0011] The polyamide may have a glass transition temperature (Tg) of greater than or equal to 30°C, or greater than or equal to 35°C. Within this range, the Tg may be from 30°C to 60°C. The polyphthalamide may also have a melting temperature (Tm) of from 170°C to 330°C. Within this range, the Tm may be greater than or equal to 175°C. Also within this range, the Tm may be less than or equal to 300°C.

[0012] In one embodiment, the polyamide comprises a polyphthalamide, which has the formula [ka] (In the formula, Q 1 is, independently in each occurrence, a branched or unbranched alicyclic C 4~8 In one embodiment, Q comprises a repeat unit having a repeat group 1is, independently in each occurrence, a 1,6-hexyl group. Polyphthalamides are condensation products of terephthalic acid and an amine, isophthalic acid and an amine, or a combination of terephthalic acid, isophthalic acid, and an amine. When two or more diamines are used, the ratio of the diamines can affect some of the physical properties of the resulting polymer, such as the melting temperature. When two or more acids are used, the ratio of the acids can also affect some of the physical properties of the resulting polymer. The ratio of diamine to dicarboxylic acid is typically equimolar, although an excess of one or the other can be used to determine the end-group functionality. Additionally, the reaction may further include a monoamine and a monocarboxylic acid, which function as chain terminators and at least partially determine the end-group functionality. In some embodiments, it is preferred to have an amine end-group content of about 30 milliequivalents per gram (meq / g) or greater, or more specifically, about 40 meq / g or greater.

[0013] In one embodiment, the polyphthalamide has the formula [ka] (In the formula, Q 2 and Q 3 is, independently in each occurrence, a branched or unbranched alicyclic C 4~12 The copolymer may be a block copolymer or a random copolymer further comprising units of Q, Q being an alkyl group. 2 and Q 3 are the same or different alicyclic C 4~12 It may be an alkyl group.

[0014] When the polyamide is a polyphthalamide, the glass transition temperature (Tg) can be greater than or equal to 80°C, or greater than or equal to 100°C, or greater than or equal to 120°C. The polyphthalamide can also have a melting temperature (Tm) of 290°C to 330°C. Within this range, Tm can be greater than or equal to 300°C. Also within this range, Tm can be less than or equal to 325°C.

[0015] The polyamide may be present in an amount from 25 to 77 weight percent, based on the total weight of the composition. Within this range, the polyamide amount may be greater than or equal to 27 weight percent, or greater than or equal to 30 weight percent. Also within this range, the polyamide amount may be less than or equal to 75 weight percent, or less than or equal to 65 weight percent, or less than or equal to 60 weight percent, or less than or equal to 55 weight percent, or less than or equal to 50 weight percent. In one embodiment, the polyamide may be present in an amount from 30 to 60 weight percent, or from 40 to 60 weight percent, or from 35 to 45 weight percent, or from 35 to 42 weight percent, or from 30 to 55 weight percent, or from 30 to 50 weight percent, or from 35 to 50 weight percent, or from 40 to 50 weight percent.

[0016] In addition to the polyamide, the composition includes a polyphenylene ether. Suitable polyphenylene ethers include those of the formula [ka] (In the formula, Z 1 is, in each occurrence, independently a halogen, an unsubstituted or substituted C 1~12 hydrocarbyl (provided that the hydrocarbyl group is not a tertiary hydrocarbyl), C 1~12 Hydrocarbylthio, C 1~12 Hydrocarbyloxy, or C 2~12 halohydrocarbyloxy (wherein at least two carbon atoms separate the halogen atom and the oxygen atom), and Z 2 is, in each occurrence, independently hydrogen, halogen, unsubstituted or substituted C 1~12 hydrocarbyl (provided that the hydrocarbyl group is not a tertiary hydrocarbyl), C 1~12 Hydrocarbylthio, C 1~12 Hydrocarbyloxy, or C 2~12Examples include those containing repeating structural units having halohydrocarbyloxy (wherein at least two carbon atoms separate the halogen atom and the oxygen atom). 1 may be a di-n-butylaminomethyl group formed by reaction of a terminal 3,5-dimethyl-1,4-phenyl group with the di-n-butylamine component of an oxidative polymerization catalyst.

[0017] Polyphenylene ethers can include molecules with aminoalkyl-containing end groups, typically positioned ortho to the hydroxyl groups. Tetramethyldiphenoquinone (TMDQ) end groups are also frequently present, typically obtained from 2,6-dimethylphenol-containing reaction mixtures in which tetramethyldiphenoquinone by-product is present. Polyphenylene ethers can be in the form of homopolymers, copolymers, graft copolymers, ionomers, or block copolymers, as well as combinations thereof.

[0018] In one embodiment, the polyphenylene ether can have an intrinsic viscosity of 0.25 deciliters / gram to 1 deciliter / gram as measured by an Ubbelohde viscometer in chloroform at 25° C. Within this range, the intrinsic viscosity of the polyphenylene ether can be 0.3 deciliters / gram to 0.65 deciliters / gram, more specifically 0.35 deciliters / gram to 0.5 deciliters / gram, and even more specifically 0.4 deciliters / gram to 0.5 deciliters / gram.

[0019] In one embodiment, the polyphenylene ether can include a homopolymer or copolymer of a monomer selected from the group consisting of 2,6-dimethylphenol, 2,3,6-trimethylphenol, and combinations thereof. In one embodiment, the polyphenylene ether can include poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity, measured in chloroform at 25° C., of 0.35 deciliters / gram to 0.5 deciliters / gram, specifically 0.4 deciliters / gram to 0.5 deciliters / gram. Suitable polyphenylene ether homopolymers are commercially available, for example, as PPO™ 640 and PPO™ 646 from SABIC and XYRON™ S201A and XYRON™ S202A from Asahi Kasei Chemicals Corporation.

[0020] Polyphenylene ethers can be prepared by the oxidative coupling of monohydroxyaromatic compound(s), such as 2,6-xylenol and / or 2,3,6-trimethylphenol. Such coupling typically employs a catalyst system, which may include heavy metal compound(s), such as copper, manganese, or cobalt compounds, usually in combination with various other materials, such as secondary amines, tertiary amines, halides, or combinations of two or more of the foregoing.

[0021] The polyphenylene ether may have a number average molecular weight of 3,000 grams per mole (g / mol) to 40,000 g / mol and a weight average molecular weight of 5,000 g / mol to 80,000 g / mol as determined by gel permeation chromatography using monodisperse polystyrene standards, i.e., styrene divinylbenzene gel, at 40° C. and a sample having a concentration of 1 milligram per milliliter in chloroform.

[0022] The composition may include polyphenylene ether in an amount from 20 to 45 weight percent, based on the total weight of the composition. Within this range, the polyphenylene ether amount may be from 23 to 40 weight percent, or from 23 to 35 weight percent, or from 35 to 45 weight percent, or from 25 to 35 weight percent.

[0023] In addition to the polyamide and polyphenylene ether, the composition further comprises a polyetheresteramide. Without wishing to be bound by theory, it is believed that the polyetheresteramide can function as a polymeric antistatic agent and can unexpectedly provide the composition with electrical conductivity equivalent to that achieved when a conductive filler (e.g., a conductive carbon filler) is used.

[0024] Suitable polyetheresteramides may be polyamide elastomers comprising hard and soft segments. The hard segments may comprise polyamides, such as those described above. The soft segments may comprise polyalkylene oxides, such as polyalkylene glycols. Suitable polyalkylene glycol moieties may include, for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and the like. In a specific embodiment, the polyetheresteramide may comprise polyamide 6 segments and poly(ethylene oxide) segments. Suitable polyetheresteramides include those commercially available under the trade names PELESTAT (e.g., PELESTAT 6500) or PELECTRON (e.g., PELECTRON AS), each available from Sanyo Chemical Industries, Ltd.; PEBAX MH1657 available from Atofina; and IRGASTAT P18 and IRGASTAT P22 available from Ciba-Geigy.

[0025] The polyetheresteramide may be present in the composition in an amount of 3 to 30 weight percent, based on the total weight of the composition. Within this range, the polyetheresteramide may be present in an amount of 5 to 30 weight percent, or 5 to 25 weight percent, or 5 to 20 weight percent, or 5 to 15 weight percent, or 8 to 30 weight percent, or 8 to 25 weight percent, or 8 to 20 weight percent, or 9 to 30 weight percent, or 9 to 25 weight percent, or 9 to 20 weight percent, or 10 to 30 weight percent, or 10 to 25 weight percent, or 10 to 20 weight percent, or 12 to 20 weight percent, or 10 to 25 weight percent, or 12 to 25 weight percent, based on the total weight of the composition, respectively.

[0026] In one embodiment, the composition can include 30 to 70 weight percent polyamide, 27 to 40 weight percent polyphenylene ether, and 3 to 18 weight percent polyetheresteramide. In one embodiment, the composition can include 40 to 60 weight percent polyamide, 35 to 45 weight percent polyphenylene ether, and 5 to 17 weight percent polyetheresteramide.

[0027] The composition may further contain various additives typically incorporated into this type of polymer composition, provided that the additive(s) are selected so as not to significantly adversely affect the desired properties of the thermoplastic composition. Such additives may be incorporated at an appropriate time during the mixing of the components to form the composition. Additives include impact modifiers, fillers, reinforcing agents, antioxidants, heat stabilizers, light stabilizers, ultraviolet (UV) light stabilizers, plasticizers, lubricants, mold release agents, antistatic agents, colorants such as titanium dioxide, carbon black, and organic dyes, surface effect additives, radiation stabilizers, flame retardants, and anti-drip agents. Generally, additives are used in amounts generally known to be effective. For example, the total amount of additives (excluding any impact modifiers, fillers, or reinforcing agents) may be 0.01% to 5% by weight based on the total weight of the polycarbonate composition.

[0028] In one embodiment, the composition may include one or more of a reinforcing filler, a compatibilizer, and an antioxidant.

[0029] Possible fillers or reinforcing agents include, for example, silica and silica powders, such as aluminum silicate (mullite), synthetic calcium silicate, zirconium silicate, fused silica, crystalline silica graphite, natural silica sand, etc., boron powders, such as boron nitride powders, borosilicate powders, etc., oxides, such as TiO2, aluminum oxide, magnesium oxide, etc., calcium sulfate (its anhydride, dihydrate, or trihydrate), calcium carbonate, such as chalk, limestone, marble, synthetic precipitated calcium carbonate, etc., fibrous talc, modular talc.talc), talc, including needle-shaped talc, layered talc, and the like; wollastonite, surface-treated wollastonite; glass spheres, e.g., hollow and solid glass spheres; silicate spheres, cenospheres, aluminosilicates (almospheres), and the like; kaolin, including hard kaolin, soft kaolin, calcined kaolin, kaolin with various coatings known in the art to enhance compatibility with polymer matrices, and the like; single crystal fibers or "whiskers," e.g., silicon carbide, alumina, boron carbide, iron, nickel, copper, and the like; fibers; Fibers (including continuous fibers and chopped fibers), such as asbestos, carbon fibers, glass fibers, such as E-glass, A-glass, C-glass, ECR-glass, R-glass, S-glass, D-glass, or NE-glass, sulfides, such as molybdenum sulfide and zinc sulfide, barium compounds, such as barium titanate, barium ferrite, barium sulfate, barite, metals and metal oxides, such as granular or fibrous aluminum, bronze, zinc, copper, and nickel, flake fillers, such as glass flakes, flaked silicon carbide, etc. fibrous fillers, such as inorganic short fibers obtained from blends containing at least one of aluminum silicate, aluminum oxide, magnesium oxide, and calcium sulfate hemihydrate; natural fillers and reinforcing materials, such as wood flour obtained by pulverizing wood; fibrous products, such as cellulose, cotton, sisal, jute, starch, cork powder, lignin, peanut shells, corn, rice husks; organic fillers, such as polytetrafluoroethylene, which form fibers; and organic fiber reinforcing fillers formed from organic polymers such as poly(ether ketone), polyimide, polybenzoxazole, poly(phenylene sulfide), polyester, polyethylene, aromatic polyamide, aromatic polyimide, polyetherimide, polytetrafluoroethylene, acrylic polymer, poly(vinyl alcohol), and the like, as well as additional fillers and reinforcing agents such as mica, clay, feldspar, flue dust, phyllite, quartz, quartzite, perlite, tripolysilane, diatomaceous earth, carbon black, and the like, or combinations thereof.

[0030] Fillers and reinforcing agents can be coated with a layer of metallic material to enhance electrical conductivity or surface-treated with silane to improve adhesion and dispersibility in the polymer matrix. Furthermore, reinforcing fillers can be provided in the form of monofilament or multifilament fibers and can be used individually or in combination with other types of fibers, for example, through co-woven or core / sheath, side-by-side, orange, or matrix and fibril structures, or by other methods known to those skilled in the art of fiber manufacturing. Examples of co-woven structures include glass fiber-carbon fiber, carbon fiber-aromatic polyimide (aramid) fiber, and aromatic polyimide fiber-glass fiber. Fibrous fillers can be provided in the form of, for example, roving, woven fiber reinforcement, such as 0-90° woven fabrics, nonwoven fiber reinforcement, such as continuous strand mat, chopped strand mat, tissue, paper, and felt, or three-dimensional reinforcement, such as braids.

[0031] In one embodiment, the reinforcing filler can include glass fibers. In one embodiment, the glass fibers can include E-glass, S-glass, AR-glass, T-glass, D-glass, or R-glass. The glass fibers can be made, for example, by steam or air blowing, flame blowing, and mechanical pulling. The glass fibers can be sized or unsized. Sized glass fibers can be coated on their surfaces with a sizing composition selected for compatibility with the compositions of the present disclosure. While not wishing to be bound by theory, it is believed that the sizing composition enhances wetting of the polyamide and polyphenylene ether on the fiber strand and aids in achieving the desired physical properties in the composition. In one embodiment, the glass fibers can be sized with a coating agent. For example, the coating agent can be present in an amount of 0.1 wt. % to 5 wt. % based on the weight of the glass fiber, or 0.1 wt. % to 2 wt. % based on the weight of the glass fiber. In preparing the glass fibers, multiple filaments can be simultaneously formed, sized with a coating agent, and then bundled into strands. Alternatively, the strands themselves can be initially formed from filaments and then sized. The amount of size material used can be sufficient to bind the glass filaments into a continuous strand, and can be, for example, 0.1% to 5% by weight, or 0.1% to 5% by weight, or 0.1% to 2% by weight, or 0.1% to 2% by weight, respectively, based on the weight of the glass fiber.

[0032] The glass fibers can be continuous fibers or chopped fibers. In one embodiment, the glass fibers can be chopped fibers. The glass fibers in the form of chopped strands can have a length of, for example, 0.3 millimeters (mm) to 10 centimeters (cm), or 0.5 mm to 5 cm, or 0.5 mm to 5 cm, or 1.0 mm to 2.5 cm, or 0.2 mm to 20 mm, or 0.2 mm to 10 mm, or 0.7 mm to 7 mm, or 0.7 mm to 7 mm.

[0033] The glass fibers can have a round (or circular) cross section, a flat cross section, or an irregular cross section. In one embodiment, the glass fibers can have a circular cross section. In one embodiment, the diameter of the glass fibers can be 1 micrometer (micron, μm) to 20 μm, or 4 μm to 15 μm, or 1 μm to 15 μm, or 7 μm to 15 μm.

[0034] When present, the reinforcing filler may be included in the composition in an amount up to 30 weight percent, for example, 5 weight percent to 30 weight percent, based on the total weight of the composition. Within this range, the filler may be included in an amount of 5 weight percent to 25 weight percent, or 7 weight percent to 23 weight percent, or 8 weight percent to 22 weight percent, or 10 weight percent to 20 weight percent, each based on the total weight of the composition.

[0035] In one embodiment, the composition can include 30 weight percent to 60 weight percent polyamide, 23 weight percent to 35 weight percent polyphenylene ether, 10 weight percent to 25 weight percent polyetheresteramide, and 5 weight percent to 25 weight percent reinforcing filler.

[0036] In one embodiment, the composition can include 30 weight percent to 70 weight percent polyamide, 25 weight percent to 40 weight percent polyphenylene ether, 5 weight percent to 20 weight percent polyetheresteramide, and optionally 5 weight percent to 25 weight percent reinforcing filler.

[0037] The composition may further comprise a compatibilizer, also known as a compatibilizer. Without intending to be bound by theory, the compatibilizer can improve the miscibility between the polyamide and polyphenylene ether phases of the composition. As used herein, the term "compatibilizer" refers to a multifunctional compound that can interact with polyphenylene ether, polyamide, or both. This interaction can be chemical (e.g., grafting) or physical (e.g., affecting the surface properties of the dispersed phase). The resulting compatibilized composition can exhibit improved compatibility, particularly as evidenced by improved impact strength, mold knit line strength, or elongation. In one embodiment, the composition of the present disclosure is a compatibilized composition that has been physically and / or chemically compatibilized with a compatibilizer.

[0038] In one embodiment, the compatibilizer may include a polyfunctional compound having both a carbon-carbon double bond and at least one carboxylic acid, anhydride, epoxy, imide, amide, or ester group, or functional equivalents thereof. Examples of such polyfunctional compounds include maleic acid, maleic anhydride, fumaric acid, maleic hydrazide, dichloromaleic anhydride, and unsaturated dicarboxylic acids (e.g., acrylic acid, butenoic acid, methacrylic acid, t-ethylacrylic acid, pentenoic acid, etc.).

[0039] In one embodiment, the compatibilizer comprises a group of formula (OR) where R is hydrogen or C 1~12 Alkyl group, C 6~20 Aryl group, C 2~12 Examples of compatibilizers of this type may include polyfunctional compounds having both a carboxylic acid, an acyl group, or a carbonyldioxy group, and at least two groups, each of which may be the same or different, selected from carboxylic acid, acid halide, anhydride, acid halide anhydride, ester, orthoester, amide, imide, amino, and salts thereof. I O) m R(COOR II ) n (CONR III R IV )s In the formula, R is a linear or branched saturated C 2~20 is an aliphatic hydrocarbon, R I is hydrogen or C 1~10 Alkyl group, C 6~20 Aryl group, C 2~10 acyl group or carbonyldioxy group, and each R II are independently hydrogen or C 1~10 Alkyl group or C 6~20 is an aryl group, and each R III and R IV are independently hydrogen or C 1~10 Alkyl group or C 6~20 An aryl group, wherein m is equal to 1, and (n+s) is 2 or greater, or more specifically 2 or 3, and n and s are each 0 or greater, and (OR) is alpha or beta to the carbonyl groups, and at least two carbonyl groups are separated by 2 to 6 carbon atoms.

[0040] Suitable polycarboxylic acids include, for example, citric acid, malic acid, agaricic acid (including various commercially available forms thereof, for example, anhydrous and hydrated acids), and combinations comprising one or more of the foregoing. In one embodiment, the functionalizing agent comprises citric acid. Exemplary esters useful herein include, for example, acetyl citrate, monostearyl citrate, and / or distearyl citrate. Suitable amides useful herein include, for example, N,N-diethylcitric acid amide, N-phenylcitric acid amide, N-dodecyl citric acid amide, N,N-didodecyl citric acid amide, and N-dodecyl malic acid. Derivatives include salts with amines and their salts, including alkali salts and alkali metal salts. Exemplary suitable salts include calcium malate, calcium citrate, potassium malate, and potassium citrate.

[0041] The above-mentioned compatibilizers can be added directly to the melt blend or pre-reacted with one or more of the components of the composition (e.g., the polyphenylene ether and / or polyamide). In one embodiment, at least a portion of the compatibilizer can be pre-reacted with all or a portion of the polyphenylene ether either in the melt or in solution in a suitable solvent. It is believed that such pre-reaction allows the compatibilizer to react with the polymer, thereby functionalizing the polyphenylene ether. For example, polyphenylene ether can be pre-reacted with maleic anhydride, fumaric acid, or citric acid to form an anhydride- or acid-functionalized polyphenylene ether that may have improved compatibility with polyamides compared to the corresponding unfunctionalized polyphenylene ether.

[0042] The amount of compatibilizer used can depend on the particular compatibilizer selected and the particular polymer system to which it is added. In one embodiment, the compatibilizer can be present in the composition in an amount of 0.05 to 2.0 weight percent, based on the total weight of the composition. Within this range, the amount of compatibilizer can be greater than or equal to 0.1 weight percent, or, more specifically, greater than or equal to 0.2 weight percent, or, more specifically, greater than or equal to 0.3 weight percent. Also within this range, the amount of compatibilizer can be less than or equal to 1.85 weight percent, or, more specifically, less than or equal to 1.5 weight percent, or, more specifically, less than or equal to 0.9 weight percent.

[0043] Antioxidant additives include organic phosphites such as tris(nonylphenyl)phosphite, tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, alkylated monophenols or polyphenols, alkylation reaction products of polyphenols with dienes such as tetrakis[methylene(3,5-di-tert-butyl-4-hydroxyhydrocinnamate)]methane, butylation reaction products of para-cresol or dicyclopentadiene, alkylated hydroquinones, hydroxylated thiodiphenyl ethers, alkylidene-bisphenols, benzyl compounds, β-(3,5-di-tert-butyl-4-hydroxyhydrocinnamate), methyl ... Antioxidants include esters of β-(5-tert-butyl-4-hydroxyphenyl)propionic acid with monohydric or polyhydric alcohols, esters of β-(5-tert-butyl-4-hydroxy-3-methylphenyl)propionic acid with monohydric or polyhydric alcohols, esters of thioalkyl or thioaryl compounds, such as distearyl thiopropionate, dilauryl thiopropionate, ditridecyl thiodipropionate, octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, pentaerythrityl-tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], amides of β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid, or combinations thereof. Antioxidants may be used in amounts of 0.01 to 0.1 parts by weight, based on 100 parts by weight of the total composition excluding any fillers.

[0044] The composition may further comprise an impact modifier. The impact modifier is preferably a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene. For brevity, this component is referred to as a "hydrogenated block copolymer." The hydrogenated block copolymer may have a poly(alkenyl aromatic) content of 10 to 90 weight percent and a hydrogenated poly(conjugated diene) content of 90 to 10 weight percent, based on the weight of the hydrogenated block copolymer. In one embodiment, the hydrogenated block copolymer may be a low poly(alkenyl aromatic) content hydrogenated block copolymer, the poly(alkenyl aromatic) content of which is 10 to less than 40 weight percent, or 20 to 35 weight percent, or 25 to 35 weight percent, or 30 to 35 weight percent, all based on the weight of the low poly(alkenyl aromatic) content hydrogenated block copolymer. In one embodiment, the hydrogenated block copolymer can be a high poly(alkenyl aromatic) content hydrogenated block copolymer, wherein the poly(alkenyl aromatic) content is from 40 weight percent to 90 weight percent, or from 50 weight percent to 80 weight percent, or from 60 weight percent to 70 weight percent, all based on the weight of the high poly(alkenyl aromatic) content hydrogenated block copolymer.

[0045] In one embodiment, the hydrogenated block copolymer can have a weight average molecular weight of 40,000 g / mol to 400,000 g / mol. Number average molecular weight and weight average molecular weight can be determined by gel permeation chromatography based on comparison to polystyrene standards. In one embodiment, the hydrogenated block copolymer can have a weight average molecular weight of 200,000 g / mol to 400,000 g / mol, or 220,000 g / mol to 350,000 g / mol. In one embodiment, the hydrogenated block copolymer can have a weight average molecular weight of 40,000 g / mol to 200,000 g / mol, or 40,000 g / mol to 180,000 g / mol, or 40,000 g / mol to 150,000 g / mol.

[0046] The alkenyl aromatic monomers used to prepare the hydrogenated block copolymers have the structure [ka] (In the formula, R 1 and 2 are each independently a hydrogen atom, C 1~8 Alkyl group or C 2~8 represents an alkenyl group, and R 3 and R 7 are each independently a hydrogen atom, C 1~8 represents an alkyl group, a chlorine atom, or a bromine atom, and R 4 , R 5 , and R 6 are each independently a hydrogen atom, C 1~8 Alkyl group or C 2~8 represents an alkenyl group, or R 4 and R 5 together with the central aromatic ring to form a naphthyl group, or R 5 and R 6 together with the central aromatic ring form a naphthyl group. Specific alkenyl aromatic monomers include, for example, styrene, chlorostyrenes such as p-chlorostyrene, methylstyrenes such as α-methylstyrene and p-methylstyrene, and t-butylstyrenes such as 3-t-butylstyrene and 4-t-butylstyrene. In some embodiments, the alkenyl aromatic monomer is styrene.

[0047] The conjugated dienes used to prepare the hydrogenated block copolymers are C 4~20The conjugated diene may be a conjugated diene. Suitable conjugated dienes include, for example, 1,3-butadiene, 2-methyl-1,3-butadiene, 2-chloro-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene, and the like, and combinations thereof. In one aspect, the conjugated diene is 1,3-butadiene, 2-methyl-1,3-butadiene, or a combination thereof. In some embodiments, the conjugated diene is 1,3-butadiene.

[0048] The hydrogenated block copolymer can be a copolymer comprising (A) at least one block derived from an alkenyl aromatic compound and (B) at least one block derived from a conjugated diene, wherein the aliphatic unsaturation content in block (B) has been at least partially reduced by hydrogenation. In one embodiment, the aliphatic unsaturation in the (B) block is reduced by at least 50 percent, or at least 70 percent. Arrangements of block (A) and block (B) include linear structures, grafted structures, and radial teleblock structures with or without branching. Linear block copolymers include tapered linear structures and non-tapered linear structures. In one embodiment, the hydrogenated block copolymer has a tapered linear structure. In one embodiment, the hydrogenated block copolymer has a non-tapered linear structure. In one embodiment, the hydrogenated block copolymer comprises a (B) block comprising random incorporation of alkenyl aromatic monomers. Linear block copolymer structures include diblock (AB block) structures, triblock (ABA block or BAB block) structures, tetrablock (ABAB block) structures, and pentablock (ABABA block or BABAB block) structures, as well as linear structures containing a total of six or more (A) and (B) blocks, wherein the molecular weight of each (A) block may be the same or different from the molecular weight of the other (A) blocks, and the molecular weight of each (B) block may be the same or different from the molecular weight of the other (B) blocks. In one embodiment, the hydrogenated block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof.

[0049] In one aspect, the hydrogenated block copolymer excludes residues of monomers other than alkenyl aromatic compounds and conjugated dienes. In some embodiments, the hydrogenated block copolymer comprises blocks derived from alkenyl aromatic compounds and conjugated dienes. The hydrogenated block copolymer does not contain grafts formed from these or any other monomers. The hydrogenated block copolymer also comprises carbon and hydrogen atoms, thus excluding heteroatoms. In one aspect, the hydrogenated block copolymer comprises residues of one or more acid functionalizing agents, such as maleic anhydride. In one aspect, the hydrogenated block copolymer comprises a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer, a polystyrene-poly(ethylene-propylene) diblock copolymer, or a combination thereof.

[0050] In one embodiment, the hydrogenated block copolymer is a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer having a polystyrene content of 25 to 35 weight percent based on the weight of the polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer. In one embodiment, the hydrogenated block copolymer is a polystyrene-poly(ethylene-propylene) diblock copolymer having a polystyrene content of 35 to 55 weight percent based on the weight of the polystyrene-poly(ethylene-propylene) diblock copolymer.

[0051] Methods for preparing hydrogenated block copolymers are known in the art, and many hydrogenated block copolymers are commercially available. Exemplary commercially available hydrogenated block copolymers include polystyrene-poly(ethylene-propylene) diblock copolymers available from Kraton Performance Polymers Inc. as KRATON G1701 (having 37 weight percent polystyrene) and KRATON G1702 (having 28 weight percent polystyrene), polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymers available from Kraton Performance Polymers Inc. as KRATON G1641 (having 33 weight percent polystyrene), KRATON G1650 (having 30 weight percent polystyrene), KRATON G1651 (having 33 weight percent polystyrene), and KRATON G1654 (having 31 weight percent polystyrene), and polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymers available from Kuraray as SEPTON S4044, SEPTON S4055, SEPTON S4077, and SEPTON S4080 from Kuraray. and a polystyrene-poly(ethylene-ethylene / propylene)-polystyrene triblock copolymer available as S4099.Additional commercially available hydrogenated block copolymers include polystyrene-poly(ethylene-butylene)-polystyrene (SEBS) triblock copolymers available from Dynasol as CALPRENE H6140 (having 31 weight percent polystyrene), CALPRENE H6170 (having 33 weight percent polystyrene), CALPRENE H6171 (having 33 weight percent polystyrene), and CALPRENE H6174 (having 33 weight percent polystyrene) and from Kuraray as SEPTON 8006 (having 33 weight percent polystyrene) and SEPTON 8007 (having 30 weight percent polystyrene), and from Kuraray as SEPTON 2006 (having 35 weight percent polystyrene) and SEPTON Examples of suitable hydrogenated block copolymers include polystyrene-poly(ethylene-propylene)-polystyrene (SEPS) copolymers available as KRATON G4607 (30 weight percent polystyrene), and oil-extended compounds of these hydrogenated block copolymers available from Kraton Performance Polymers, Inc. as KRATON G4609 (45% mineral oil, and the SEBS has 33 weight percent polystyrene) and KRATON G4610 (31% mineral oil, and the SEBS has 33 weight percent polystyrene), and from Asahi Kasei Chemicals, Inc. as TUFTEC H1272 (36% oil, and the SEBS has 35 weight percent polystyrene). Mixtures of two or more hydrogenated block copolymers can be used. In some embodiments, the hydrogenated block copolymer comprises a polystyrene poly(ethylene-butylene)-polystyrene triblock copolymer having a weight average molecular weight of at least 100,000 grams / mole, or from 200,000 grams / mole to 400,000 grams / mole.

[0052] When present, the composition comprises the hydrogenated block copolymer in an amount from 0.1 to 10 weight percent, based on the total weight of the composition. Within this range, the hydrogenated block copolymer amount can be from 0.5 to 10 weight percent, or from 1 to 9 weight percent.

[0053] The composition may optionally minimize or exclude any components not specifically disclosed herein. For example, the composition may optionally minimize or exclude thermoplastic polymers other than polyamides, polyphenylene ethers, and polyetheresteramides. For example, the composition may include or exclude less than 10 weight percent, less than 5 weight percent, less than 1 weight percent, or less than 0.1 weight percent of thermoplastic polymers other than polyamides, polyphenylene ethers, and polyetheresteramides. In one embodiment, the composition may minimize or exclude reinforcing fillers. For example, the composition may include or exclude less than 10 weight percent, less than 5 weight percent, less than 1 weight percent, or less than 0.1 weight percent of reinforcing fillers. The composition may exclude reinforcing fillers other than glass fibers. In one embodiment, when a reinforcing filler is included in the composition, the impact modifier may be minimized or excluded from the composition (e.g., present in an amount less than 5 weight percent, or less than 1 weight percent, or less than 0.1 weight percent, or excluding the impact modifier). In contrast, in one embodiment, when an impact modifier is present in the composition, the reinforcing filler may be minimized or excluded from the composition (e.g., present in an amount less than 5 weight percent, or less than 1 weight percent, or less than 0.1 weight percent, or excluding the reinforcing filler). In one embodiment, the composition may minimize or exclude conductive fillers, such as conductive carbon fillers, e.g., conductive carbon black. In one embodiment, the composition may minimize or exclude monomeric or polymeric antistatic agents other than polyetheresteramides. In a specific embodiment, the composition may exclude vinyl polymers containing carboxyl groups, epoxy groups, amino groups, hydroxyl groups, polyalkylene oxide groups, oxazoline groups, or combinations thereof.

[0054] Molded articles comprising the compositions of the present disclosure may exhibit one or more desirable properties. For example, the molded articles may exhibit a heat deflection temperature of 120°C or greater or 150°C or greater as determined according to ASTM D648. The molded articles may exhibit a heat deflection temperature of 10°C or greater as determined according to ASTM D257. 8 Ohms / square ~10 13 Ohms / square or 10 9 Ohms / square ~10 13 The composition may exhibit a surface resistivity of ohms / square. The composition may exhibit good dielectric properties. For example, the molded article may exhibit a dielectric constant of less than 4 as determined using a QWED split-post dielectric resonator and an Agilent PNA network analyzer, as further described in the Examples below. The molded article may exhibit a parasitic capacitance of 0.2 pF or less as determined using a capacitor signal detector (e.g., Model CAN11) at 100 kHz and 1 volt. The molded article may advantageously exhibit a light color. As used herein, the term "light color" refers to a molded article having an L of greater than 50 units, preferably greater than 70 units. * In contrast, the term "dark color" means that the article has an L value of less than 50 units. * It means that it has a value. * is for the CIELAB color scale, where L * represents the lightness of the color, and L * = 0 is black, and L * = 100 is white. * The value may be determined using a 10 degree observer and a D65 photometric illuminant and in accordance with ASTM D2244. In one embodiment, the molded article may have a desired white color without the use of colorants or pigments. In one embodiment, the molded article may have a heat deflection temperature of 150°C or greater as determined in accordance with ASTM D648 and be capable of withstanding online electrostatic painting.

[0055] Mechanical and processing properties of interest include, but are not limited to, notched and unnotched Izod impact strength (tested according to ASTM D256), flexural modulus and flexural strength (tested according to ASTM D790), and tensile modulus / tensile strength / tensile elongation (tested according to ASTM D638), as further described in the examples below. For example, the composition may exhibit a flexural modulus of 1200 MPa or greater as determined according to ASTM D790. A molded article may exhibit a notched Izod impact strength of 30 J / m or greater as determined according to ASTM D256 at 23°C. One or more of the above-mentioned properties may be exhibited by molded specimens of the composition. In one embodiment, the molded article has a heat deflection temperature of 120°C or greater as determined according to ASTM D648, a heat deflection temperature of 100°C or greater as determined according to ASTM D257, and a heat deflection temperature of 100°C or greater as determined according to ASTM D257. 8 Ohms / square ~10 13 In one embodiment, the molded article exhibits a surface resistivity of ohms / square, a dielectric constant of less than 4 as determined using a QWED split post dielectric resonator and an Agilent PNA network analyzer, a flexural modulus of 1200 MPa or greater as determined in accordance with ASTM D790, and a parasitic capacitance of 0.2 pF or less as determined using a capacitor signal detector at 100 kHz and 1 volt. In one embodiment, the molded article exhibits a heat deflection temperature of 160°C or greater as determined in accordance with ASTM D648, a heat deflection temperature of 10 pF or greater as determined in accordance with ASTM D257, and a parasitic capacitance of 0.2 pF or less as determined in accordance with ASTM D257. 9 Ohms / square ~10 13 It has a surface resistivity of ohms / square, a dielectric constant of 2.5 to 3.5 as determined using a QWED split post dielectric resonator and an Agilent PNA network analyzer, a flexural modulus of 1500 MPa or greater as determined in accordance with ASTM D790, a parasitic capacitance of 0.2 pF or less as determined using a capacitor signal detector at 100 kHz and 1 volt, may exhibit light color, and can withstand online electrostatic coating.

[0056] In a specific embodiment, a molded article comprises a composition comprising 30 weight percent to 70 weight percent polyamide, 25 weight percent to 40 weight percent polyphenylene ether, 5 weight percent to 20 weight percent polyetheresteramide, and optionally 5 weight percent to 25 weight percent reinforcing filler, wherein the molded article has a heat deflection temperature of 160° C. or greater as determined according to ASTM D648, a heat deflection temperature of 100° C. or greater as determined according to ASTM D257, and a heat deflection temperature of 100° C. or greater as determined according to ASTM D257. 9 Ohms / square ~10 13 The composite exhibits a surface resistivity of ohms / square, a dielectric constant of 2.5 to 3.5 as determined using a QWED split-post dielectric resonator and an Agilent PNA network analyzer, a flexural modulus of 1500 MPa or greater as determined in accordance with ASTM D790, a parasitic capacitance of 0.2 pF or less as determined using a capacitor signal detector at 100 kHz and 1 volt, light color, and is capable of withstanding online electrostatic coating. In one embodiment, the polyamide comprises polyamide 6, polyamide 6,6, or a combination thereof, the polyphenylene ether comprises repeat units derived from 2,6-dimethylphenol, the polyetheresteramide comprises polyamide 6 segments and poly(ethylene oxide) segments, and the reinforcing filler, if present, comprises glass fiber.

[0057] The composition can be prepared by melt-blending or melt-kneading the components of the composition. Melt-blending or melt-kneading can be carried out using common equipment, such as a ribbon blender, a HENSCHEL™ mixer, a BANBURY™ mixer, a drum tumbler, a single-screw extruder, a twin-screw extruder, a multi-screw extruder, a co-kneader, etc. For example, the composition can be prepared by melt-blending the components in a twin-screw extruder at a temperature of 245°C to 310°C, 260°C to 310°C, or 280°C to 300°C. Exemplary methods are further described in the following examples.

[0058] Molded articles comprising the compositions include automotive components, electrical components, and electronic components. In one embodiment, the molded article is a component of a consumer electronic device. In one embodiment, the molded article is an automotive component. Suitable methods for forming such articles include single and multi-layer sheet extrusion, injection molding, blow molding, film extrusion, profile extrusion, pultrusion, compression molding, thermoforming, pressure forming, hydroforming, vacuum forming, and the like. Combinations of the above-mentioned methods for fabricating articles can be used.

[0059] In a specific embodiment, the article is an automotive component, such as an automotive exterior component. As used herein, an automotive exterior component refers to an automotive component that provides a desired appearance or significantly contributes to the vehicle's appearance. For example, exemplary automotive components can include door covers, exterior trim, charger flaps, or fenders. Non-automotive applications are also contemplated, including both interior and exterior appliance wall panels for appliances, including refrigerators and freezers, handles for appliances, appliances, or other items, trays for refrigerators, freezers, or other items, and storage boxes or shelves. [Example]

[0060] The present disclosure is further illustrated by the following non-limiting examples.

[0061] The materials used in the following examples are listed in Table 1.

[0062] [Table 1]

[0063] The compositions were compounded using a TEM-37BS compounder. All ingredients except the polyamide, glass fiber, and GMA were added at the feed throat, which were added downstream using a side feeder. The processing parameters used are summarized in Table 2.

[0064] [Table 2]

[0065] Parts were molded using a UH1000-110 injection molding machine with a temperature setting of 270°C-275°C-275°C-275°C (feed port to nozzle) and a mold temperature of 75°C. The pellets were pre-dried at 110°C for 2 to 4 hours before molding.

[0066] The properties of the molded parts were tested according to the following standards.

[0067] Surface and volume resistivity were determined according to ASTM D257 using 68 mm x 68 mm x 3 mm specimens and a charge of 100V.

[0068] The dielectric constant (Dk) and dissipation factor (Df) were tested at 1.1 GHz using a QWED split post dielectric resonator and an Agilent PNA network analyzer with a sample size of 150 mm x 150 mm x 1.5 mm.

[0069] Heat deflection temperature (HDT) was determined according to ASTM D648 standard using the flat side of a 3.2 mm thick ASTM bar and a load of 0.45 MPa.

[0070] Notched Izod impact strength (NII) (expressed in joules / meter) was measured according to ASTM D256 at 23°C and -30°C using a 5.5 joule hammer and a 3.2 millimeter test bar.

[0071] Flexural properties were measured according to ASTM D790 on molded samples having a thickness of 3.2 mm.

[0072] Tensile properties were determined according to ASTM D638. Tensile stress at break (expressed in units of megapascals (MPa)), tensile strain at break (expressed in units of percent), and modulus of elasticity (expressed in units of MPa) were measured using a test speed of 5 millimeters per minute at 23°C.

[0073] Shrinkage performance was determined by measuring the shrinkage from the mold cavity dimensions to the molded part dimensions using injection-molded discs with a diameter of 100 mm and a thickness of 3.2 mm. After conditioning at room temperature in the laboratory for 24 hours, cross-flow (perpendicular to the flow) shrinkage and in-flow (parallel to the flow) shrinkage were measured on five discs. The average shrinkage is reported.

[0074] Water absorption was determined according to ISO 62.

[0075] The appearance of each molded part was further evaluated by visual inspection (eg, with the naked eye).

[0076] Capacitor signal transfer was evaluated by parasitic capacitance. If the composition achieved a parasitic capacitance of 0.2 picofarads (pF) or less, the sample was rated "pass." If the composition achieved a parasitic capacitance of more than 0.2 pF, the sample was rated "fail." Parasitic capacitance was determined using a capacitor signal detector model CAN11 at 100 kHz and 1 volt.

[0077] Molded samples of the compositions were also tested for their ability to withstand online electrostatic painting. A sample was rated "pass" if it achieved a rating of 5B or higher in the Crosshatch Adhesion Test according to ASTM 3359 and exhibited an HDT of at least 150°C as determined by ASTM D648. Testing was performed using the flat side of a 3.2 mm thick ASTM bar and a load of 0.45 MPa. A sample was rated "fail" if it failed to achieve a rating of at least 5B in the Crosshatch Adhesion Test according to ASTM 3359 or if it exhibited an HDT of less than 150°C as determined by ASTM D648.

[0078] The compositions and properties are summarized in Table 3. The amount of each component is given in weight percent based on the total weight of the composition.

[0079] [Table 3]

[0080] As shown in Table 3, each of Examples E1-E5 exhibited similar electrical conductivity compared to the composition of Comparative Example CE1, which contained carbon black. As further shown in Table 3, the addition of a reinforcing filler, such as glass fiber, could further improve the heat resistance and mechanical strength of the compositions. Furthermore, each of Examples E1-E12 achieved a parasitic capacitance of 0.2 pF or less. In a further advantageous feature, each of the compositions of Examples E2-E6 and E12 exhibited an HDT greater than 150°C and achieved a rating of at least 5B in the crosshatch adhesion test, thereby being able to withstand the online electrostatic coating process (i.e., rated "pass" in Table 3). Thus, the present disclosure provides significant improvements.

[0081] The present disclosure further includes the following aspects.

[0082] Aspect 1: A molded article comprising a composition comprising 25 weight percent to 77 weight percent polyamide, 20 weight percent to 45 weight percent polyphenylene ether, and 3 weight percent to 30 weight percent polyetheresteramide, wherein the weight percent of each component is based on the total weight of the composition, wherein the molded article is an automotive component, and the molded article has a heat deflection temperature of 120°C or greater as determined in accordance with ASTM D648, a heat deflection temperature of 100°C or greater as determined in accordance with ASTM D257, and a heat deflection temperature of 100°C or greater as determined in accordance with ASTM D257. 8 Ohms / square ~10 13 Molded articles exhibiting a surface resistivity of ohms / square, a dielectric constant of less than 4 as determined using a QWED split post dielectric resonator and an Agilent PNA network analyzer, a flexural modulus of greater than or equal to 1200 MPa as determined in accordance with ASTM D790, and a parasitic capacitance of less than or equal to 0.2 pF as determined using a capacitor signal detector at 100 kHz and 1 volt.

[0083] Aspect 2: The molded article has a light color, preferably the molded article has a CIE lightness value L of greater than 50 units, or greater than 70 units, determined according to ASTM D2244 using a 10 degree observer and a D65 photometric illuminant. * 2. The article of embodiment 1, wherein the shaped article exhibits a tensile strength of 1.5 MPa.

[0084] Aspect 3: The molded article of Aspect 1 or 2, wherein the molded article has a heat deflection temperature of 150°C or greater, as determined in accordance with ASTM D648, and is capable of withstanding an online electrostatic painting process at a temperature of 150°C or greater.

[0085] Aspect 4: The molded article of any one of Aspects 1 to 3, wherein the polyamide comprises polyamide 6, polyamide 6,6, polyamide 6,10, polyamide 10,10, polyamide 9T, polyamide 6T, polyamide 10T, polyamide 6I, polyamide MXD6, or a combination thereof.

[0086] Aspect 5: The molded article according to any one of Aspects 1 to 4, wherein the polyphenylene ether includes a repeating unit derived from 2,6-dimethylphenol.

[0087] Aspect 6: The molded article of any one of Aspects 1 to 5, wherein the polyetheresteramide comprises a hard segment comprising a polyamide and a soft segment comprising a polyalkylene oxide, and preferably the polyetheresteramide comprises a polyamide 6 segment and a poly(ethylene oxide) segment.

[0088] Aspect 7: The molded article of any of Aspects 1-6, wherein the composition further comprises 5 weight percent to 30 weight percent of a reinforcing filler, preferably wherein the reinforcing filler comprises glass fiber.

[0089] Aspect 8: The shaped article of any of Aspects 1-7, wherein the composition further comprises an additive composition, preferably the additive composition comprises a compatibilizer, an antioxidant, or a combination thereof.

[0090] Aspect 9: The molded article of any one of Aspects 1 to 8, wherein the composition comprises 40 weight percent to 60 weight percent polyamide, 35 weight percent to 45 weight percent polyphenylene ether, and 5 weight percent to 17 weight percent polyetheresteramide.

[0091] Aspect 10: The molded article of any one of Aspects 1-8, wherein the composition comprises 30 weight percent to 60 weight percent polyamide, 25 weight percent to 35 weight percent polyphenylene ether, 10 weight percent to 25 weight percent polyetheresteramide, and 5 weight percent to 25 weight percent reinforcing filler.

[0092] Embodiment 11: A composition comprises 30 weight percent to 70 weight percent polyamide, 25 weight percent to 40 weight percent polyphenylene ether, 5 weight percent to 20 weight percent polyetheresteramide, and optionally 5 weight percent to 25 weight percent reinforcing filler, wherein a molded article has a heat deflection temperature of 160° C. or greater, as determined according to ASTM D648, a heat deflection temperature of 100° C. or greater, as determined according to ASTM D257, and a reinforcing filler. 9Ohms / square ~10 13 a surface resistivity in ohms / square, a dielectric constant between 2.5 and 3.5 determined using a QWED split-post dielectric resonator and an Agilent PNA network analyzer, a flexural modulus greater than 1500 MPa determined in accordance with ASTM D790, a parasitic capacitance less than 0.2 pF determined using a capacitor signal detector at 100 kHz and 1 volt, and a CIE lightness value L greater than 50 units or greater than 70 units determined in accordance with ASTM D2244 using a 10 degree observer and a D65 photometric illuminant. * A molded article according to any one of aspects 1 to 8, wherein the molded article exhibits a value of 0.015% or less and is capable of withstanding an online electrostatic painting process at a temperature of 150°C or greater.

[0093] Aspect 12: The molded article of aspect 11, wherein the polyamide comprises polyamide 6, polyamide 6,6, or a combination thereof, the polyphenylene ether comprises repeating units derived from 2,6-dimethylphenol, the polyetheresteramide comprises polyamide 6 segments and poly(ethylene oxide) segments, and the reinforcing filler, if present, comprises glass fiber.

[0094] Embodiment 13: The molded article of any of embodiments 1-12, wherein conductive fillers are excluded from the composition, and preferably carbon black is excluded from the composition.

[0095] Aspect 14: The shaped article of any one of Aspects 1 to 13, wherein the composition comprises a continuous phase comprising a polyamide and a polyetheresteramide, and a dispersed phase comprising a polyphenylene ether.

[0096] Aspect 15: The molded article according to any one of Aspects 1 to 14, wherein the automobile component is a door cover, a charger flap, or a fender.

[0097] The compositions, methods, and articles may alternatively comprise, consist of, or consist essentially of any suitable materials, steps, or components disclosed herein. The compositions, methods, and articles may additionally or alternatively be formulated to be devoid of, or substantially free of, any materials (or chemical species), steps, or components that are not specifically required to achieve the function or purpose of the compositions, methods, and articles.

[0098] All ranges disclosed herein are inclusive of endpoints, and the endpoints are independently combinable with each other. A "combination" includes blends, mixtures, alloys, reaction products, and the like. Terms such as "first," "second," and the like are used to distinguish one element from another rather than to denote any order, quantity, or importance. The terms "a," "an," and "the" do not denote limitations of quantity and should be construed as inclusive of both the singular and the plural unless otherwise indicated herein or clearly contradicted by context. "Or" means "and / or" unless otherwise specified. References throughout this specification to "one embodiment" mean that the particular element described in connection with that embodiment is included in at least one embodiment described herein and may or may not be present in other embodiments. As used herein, the term "combinations thereof" is open-ended, including one or more of the listed elements and permitting the presence of one or more similar elements not named. It should further be understood that the listed elements can be combined in any suitable manner in the various embodiments.

[0099] Unless otherwise specified herein, all test standards are the latest standards in effect as of the filing date of this application, or, if priority is claimed, as of the filing date of the earliest priority application in which the test standards appear.

[0100] Unless otherwise specified, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. All cited patents, patent applications, and other references are incorporated herein by reference in their entirety. However, if a term in this application contradicts or conflicts with a term in an incorporated reference, the term from this application shall take precedence over the conflicting term from the incorporated reference.

[0101] Compounds are described using standard nomenclature. For example, any position not substituted by any indicated group is understood to have its valency satisfied by the indicated bond or hydrogen atom. A dash ("-") that is not between two letters or symbols is used to indicate a point of attachment for a substituent. For example, -CHO is attached through the carbon of a carbonyl group.

[0102] As used herein, the term "hydrocarbyl," whether used alone or as a prefix, suffix, or moiety of another term, refers to a residue containing only carbon and hydrogen. The residue may be aliphatic or aromatic, linear, cyclic, bicyclic, branched, saturated, or unsaturated. The residue may also contain a combination of aliphatic, aromatic, linear, cyclic, bicyclic, branched, saturated, and unsaturated hydrocarbon moieties. However, when a hydrocarbyl residue is described as substituted, the hydrocarbyl residue may optionally contain heteroatoms in addition to the carbon and hydrogen members of the substituent residue. Thus, when specifically described as substituted, the hydrocarbyl residue may contain one or more carbonyl groups, amino groups, hydroxyl groups, etc., or may contain heteroatoms within the backbone of the hydrocarbyl residue. The term "alkyl" refers to a branched or straight-chain saturated aliphatic hydrocarbon group, e.g., methyl, ethyl, n-propyl, i-propyl, n-butyl, s-butyl, t-butyl, n-pentyl, s-pentyl, and n-hexyl and s-hexyl. "Alkenyl" refers to a straight-chain or branched monovalent hydrocarbon group having at least one carbon-carbon double bond, e.g., ethenyl (-HC=CH). "Alkoxy" refers to an alkyl group linked through oxygen (i.e., alkyl-O-), e.g., methoxy, ethoxy, and sec-butyloxy. "Alkylene" refers to a straight-chain or branched saturated divalent aliphatic hydrocarbon group, e.g., methylene (-CH-) or propylene (-(CH)-). "Cycloalkylene" refers to a divalent cyclic alkylene group, i.e., -C n H 2n-xwhere x is the number of hydrogens replaced by the cyclization(s). "Cycloalkenyl" refers to a monovalent group having one or more rings and one or more carbon-carbon double bonds within the ring, where all of the ring members are carbon (e.g., cyclopentyl and cyclohexyl). "Aryl" refers to an aromatic hydrocarbon group containing a specified number of carbon atoms, such as phenyl, tropone, indanyl, or naphthyl. "Arylene" refers to a divalent aryl group. "Alkylarylene" refers to an arylene group substituted with an alkyl group. "Arylalkylene" refers to an alkylene group substituted with an aryl group (e.g., benzyl). The prefix "halo" refers to a group or compound containing one or more fluoro, chloro, bromo, or iodo substituents. Combinations of different halo atoms (e.g., bromine and fluorine) or only chlorine atoms may be present. The prefix "hetero" means that the compound or group contains at least one ring member that is a heteroatom (e.g., 1, 2, or 3 heteroatoms), where the heteroatom(s) are each independently N, O, S, Si, or P. "Substituted" means that the compound or group contains, each independently, a C, C, or C in place of a hydrogen, provided that the primary valence of the substituted atom is not exceeded. 1~9 Alkoxy, C 1~9 Haloalkoxy, nitro (-NO2), cyano (-CN), C 1~6 Alkylsulfonyl (-S(=O)2-alkyl), C 6~12 Arylsulfonyl (-S(=O)2-aryl), thiol (-SH), thiocyano (-SCN), tosyl (CH3C6H4SO2-), C 3~12 Cycloalkyl, C 2~12 Alkenyl, C 5~12 Cycloalkenyl, C 6~12 Aryl, C 7~13 Aryl alkylene, C 4~12 Heterocycloalkyl, and C 3~12It means that the group is substituted with at least one (e.g., one, two, three, or four) substituents, which may be heteroaryl. The number of carbon atoms listed in the group is exclusive of any substituents. For example, -CHCHCN is a C alkyl group substituted with a nitrile.

[0103] While particular embodiments have been described, alternatives, modifications, variations, improvements, and substantial equivalents may occur that are not foreseen or presently unforeseeable by applicant or others skilled in the art. It is therefore intended that the appended claims shall embrace all such alternatives, modifications, variations, improvements, and substantial equivalents as filed and as they may be amended.

Claims

1. 25 weight percent to 77 weight percent polyamide; 20 weight percent to 45 weight percent polyphenylene ether; 3 weight percent to 30 weight percent polyetheresteramide; (wherein the weight percent of each component is based on the total weight of the composition), The molded article is an automobile component, and The molded article is Heat deflection temperature of 120°C or greater, determined in accordance with ASTM D648; 10 determined according to ASTM D257 ８ Ohm / square to 10 １３ Surface resistivity in ohms / square, a dielectric constant of less than 4 as determined using a QWED split post dielectric resonator and an Agilent PNA network analyzer; a flexural modulus of 1200 MPa or greater, determined in accordance with ASTM D790; and Parasitic capacitance of less than 0.2 pF as determined using a capacitor signal detector at 100 kHz and 1 volt; Showing, molded article.

2. The molded article has a light color, and preferably the molded article has a CIE lightness value of L greater than 50 units, or greater than 70 units, determined according to ASTM D2244 using a 10 degree observer and a D65 photometric illuminant. ＊ The molded article of claim 1 , wherein the molded article exhibits a value.

3. The molded article is having a heat deflection temperature of 150°C or greater as determined in accordance with ASTM D648; and 3. The molded article according to claim 1 or 2, which can withstand an online electrostatic painting process at a temperature of 150°C or higher.

4. The molded article of any one of claims 1 to 3, wherein the polyamide comprises polyamide 6, polyamide 6,6, polyamide 6,10, polyamide 10,10, polyamide 9T, polyamide 6T, polyamide 10T, polyamide 6I, polyamide MXD6, or a combination thereof.

5. The molded article according to any one of claims 1 to 4, wherein the polyphenylene ether contains a repeating unit derived from 2,6-dimethylphenol.

6. The molded article according to any one of claims 1 to 5, wherein the polyetheresteramide comprises a hard segment comprising a polyamide and a soft segment comprising a polyalkylene oxide, and preferably the polyetheresteramide comprises a polyamide 6 segment and a poly(ethylene oxide) segment.

7. 7. The molded article of any one of claims 1 to 6, wherein the composition further comprises 5 to 30 percent by weight of a reinforcing filler, preferably the reinforcing filler comprises glass fibers.

8. The molded article of any one of claims 1 to 7, wherein the composition further comprises an additive composition, preferably the additive composition comprises a compatibilizer, an antioxidant, or a combination thereof.

9. The composition comprises: 40 weight percent to 60 weight percent of said polyamide; 35 to 45 weight percent of said polyphenylene ether; 5 weight percent to 17 weight percent of the polyetheresteramide; The molded article according to any one of claims 1 to 8, comprising:

10. The composition comprises: 30 weight percent to 60 weight percent of said polyamide; 25 to 35 weight percent of said polyphenylene ether; 10 to 25 weight percent of said polyetheresteramide; 5 weight percent to 25 weight percent of a reinforcing filler; The molded article according to any one of claims 1 to 8, comprising:

11. The composition comprises: 30 weight percent to 70 weight percent of said polyamide; 25 to 40 weight percent of said polyphenylene ether; 5 to 20 weight percent of said polyetheresteramide; optionally 5 to 25 weight percent of a reinforcing filler; wherein the molded article comprises: Heat deflection temperature of 160°C or greater as determined in accordance with ASTM D648; 10 determined according to ASTM D257 ９ Ohm / square to 10 １３ Surface resistivity in ohms / square, a dielectric constant of 2.5-3.5 determined using a QWED split post dielectric resonator and an Agilent PNA network analyzer; a flexural modulus of 1500 MPa or greater, determined according to ASTM D790; Parasitic capacitance of less than 0.2 pF as determined using a capacitor signal detector at 100 kHz and 1 volt; L of CIE lightness values ​​greater than 50 units or greater than 70 units determined according to ASTM D2244 using a 10 degree observer and a D65 photometric illuminant. ＊ value, and 9. The molded article according to any one of claims 1 to 8, which is capable of withstanding an online electrostatic painting process at a temperature of 150°C or higher.

12. the polyamide comprises polyamide 6, polyamide 6,6, or a combination thereof; The polyphenylene ether contains repeating units derived from 2,6-dimethylphenol, the polyetheresteramide comprises polyamide 6 segments and poly(ethylene oxide) segments; and 12. The molded article of claim 11, wherein the reinforcing filler, if present, comprises glass fiber.

13. A moulded article according to any one of claims 1 to 12, wherein conductive fillers are excluded from the composition, preferably carbon black is excluded from the composition.

14. The molded article according to any one of claims 1 to 13, wherein the composition comprises a continuous phase comprising the polyamide and the polyetheresteramide, and a dispersed phase comprising the polyphenylene ether.

15. The molded article according to any one of claims 1 to 14, wherein the automobile component is a door cover, a charger flap, or a fender.

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