Thermal interface materials comprising oriented fibers and materials such as solders, alloys, and / or other metals

Abstract

The present disclosure relates generally to various thermally conductive materials for use in semiconductor devices or other applications. In some cases, the material may include oriented fibers (such as carbon fibers) (eg, those that make up the substrate) and metals (such as solder). In some cases, the metal may be present in a transition metal rich solder alloy, a conductive medium (such as a conductive ink), a thermal chemical vapor deposition solder, an oxide coated liquid metal, an oxide coated liquid metal transition metal rich solder alloy, etc. In certain embodiments, the melting temperature of the metal may be relatively low, and the metal may be sandwiched between or infiltrate the plurality of discontinuous fibers and / or may surround at least a portion of the fibers. In some cases, the metal may react with the carbon fibers, thereby forming metal carbides, and / or may diffuse into the carbon fibers, thereby promoting contact between the metal and the carbon fibers. Other aspects generally relate to devices that employ such compositions, methods of making such compositions, kits that include such compositions, and the like.

Description

[Technical Field]

[0001] (Related Applications) This application claims the benefit of U.S. Provisional Patent Application No. 63 / 398,190, filed August 15, 2022, entitled "Thermal Interface Materials Comprising Aligned Fibers and Materials Such As Solders, Alloys, and / or Other Metals," which is incorporated by reference in its entirety into this disclosure.

[0002] (Field) The present disclosure generally relates to various thermally conductive materials for use in semiconductor devices or other applications. In some cases, the material may comprise oriented fibers (e.g., carbon fibers) and a metal (e.g., solder). [Background technology]

[0003] (background) A thermal interface material is a material that has a relatively low thermal impedance and a relatively high thermal conductivity. For example, such materials can be used to transfer heat between a first location (e.g., a heat source) and a second location (e.g., a heat sink). Thus, thermal interface materials can be used to assist in thermal communication from a first location to a second location. One example of the use of thermal interface materials may be heat dissipation in electronic devices. For example, semiconductor devices in computers often generate significant amounts of heat, which can damage chips and other components. Thus, thermal interface materials may be used to assist in connecting semiconductor devices to suitable heat sinks (eg, cooling fins). Summary of the Invention [Problem to be solved by the invention]

[0004] However, many thermal interface materials are inadequate and do not have adequately high thermal conductivity (or thermal conductivity or thermal conductance or thermal conductivity). Therefore, improvements (or enhancements) are still needed. [Means for solving the problem]

[0005] (Abstract) The present disclosure relates generally to various thermally conductive materials for use in semiconductor devices or other applications. In some cases, such materials may comprise oriented fibers (e.g., carbon fibers) and metals (e.g., solder). In some cases, the material may include oriented fibers (e.g., carbon fibers) and metal (e.g., solder). The subject matter of the present disclosure encompasses, in some cases, related objects (or products), alternative solutions (or solutions) to a particular problem, and / or a number of different uses (or applications or uses) of one or more systems and / or articles (or articles).

[0006] In one aspect, the present disclosure relates to a composition. In one set of embodiments, the composition comprises a plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and a solder (or solder). The plurality (or plurality of) discontinuous fibers define (or constitute) a base (or substrate). The solder is in contact with (or contacts) the plurality (or plurality of) discontinuous fibers. In some cases, at least 30% by volume (30 vol%) of the discontinuous fibers are substantially oriented (or aligned) within the substrate.

[0007] In another set of embodiments, the composition comprises a plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and a metal (or metal). The plurality (or plurality of) discontinuous fibers define (or constitute) a substrate. The metal (or metal) is in contact with the plurality (or plurality of) discontinuous fibers. In some cases, the melting temperature (or melting temperature or melting temperature) of the metal is 265°C or less. In certain embodiments, at least 30 volume percent (30 vol%) of the discontinuous fibers are substantially oriented (or aligned) within the substrate.

[0008] In yet another set of embodiments, the composition comprises a plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and a metal (or metal). The plurality (or plurality of) discontinuous fibers define (or constitute) a substrate. The metal (or metal) is in contact with (or contacts) the plurality (or plurality of) discontinuous fibers. In certain cases, the discontinuous fibers are more thermally conductive than metals. In some embodiments, at least 30 volume percent (30 vol%) of the discontinuous fibers are substantially oriented (or aligned) within the substrate.

[0009] In yet another set of embodiments, the composition comprises a plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and a carbide (or carbide). The plurality (or plurality of) discontinuous fibers defines (or constitutes) a substrate. The carbide is in contact with (or contacts) the plurality (or plurality of) discontinuous fibers. In certain embodiments, at least 30 volume percent (30 vol%) of the discontinuous fibers are substantially oriented (or aligned) within the substrate.

[0010] In another set of embodiments, the composition comprises a plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and a metal (or metal). The plurality (or plurality of) discontinuous fibers (or non-continuous fibers) define (or constitute) a substrate. The metal (or metal) is in contact with (or contacts) the plurality (or plurality of) discontinuous fibers (or non-continuous fibers). In certain cases, the plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and the metal together have an internal void volume (or internal void capacity or internal void volume) of 20% or less. In some embodiments, at least 30 volume percent (30 vol%) of the discontinuous fibers (or non-continuous fibers) are substantially oriented (or aligned) within the substrate.

[0011] In another aspect, the present disclosure relates to a method. In one set of embodiments, the method includes providing a plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and exposing at least a portion of the plurality (or plurality of) discontinuous fibers to solder, the plurality (or plurality of) discontinuous fibers defining (or constituting) a base (or substrate). In some cases, at least 30 volume percent (30 vol%) of the discontinuous fibers are substantially oriented (or aligned) within the substrate.

[0012] In another set of embodiments, the method includes providing a plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and forcing solder between the plurality (or plurality of) discontinuous fibers under heat and / or pressure, the plurality (or plurality of) discontinuous fibers defining (or defining or constituting) a base (or substrate). In some embodiments, at least 30% by volume (vol %) of the discontinuous fibers are substantially oriented (or aligned) within the substrate.

[0013] In another aspect, the present disclosure encompasses methods of making one or more of the embodiments described in the present disclosure (e.g., methods of making oriented (or aligned) thermally conductive materials). In yet another aspect, the present disclosure encompasses methods of using one or more of the embodiments described in the present disclosure (e.g., methods of using oriented (or aligned or arranged) thermally conductive materials).

[0014] Other advantages and novel features of the present disclosure will become apparent from the following detailed description of various non-limiting embodiments of the present disclosure when considered in conjunction with the accompanying drawings.

[0015] Non-limiting embodiments of the present disclosure are described, by way of example, with reference to the accompanying drawings, which are schematic and are not intended to be drawn to scale. In the drawings, each illustrated identical or nearly identical component (or element or part or component) is typically represented by a single numeral. For purposes of clarity, not every component (or element or part or component) is labeled (or labeled) in every drawing, and not every component of each embodiment of the present disclosure is shown unless necessary to illustrate. Those skilled in the art will be able to understand the present disclosure. The drawings are as follows: [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic diagram illustrating a substrate comprising a plurality of substantially oriented fibers, according to one embodiment. [Figure 2] FIG. 2 is a schematic diagram illustrating, in another embodiment, a substrate comprising a plurality of fibers substantially oriented between metal plates. [Figure 3]FIG. 3 is a schematic diagram illustrating, in yet another embodiment, a substrate comprising a plurality of substantially oriented fibers and a void volume. [Figure 4] FIG. 4 is a photomicrograph showing carbon fibers that have been infiltrated with indium, in one embodiment. [Figure 5] FIG. 5 is a photomicrograph showing carbon fibers infiltrated with indium in another embodiment. [Figure 6A] FIG. 6A is a photomicrograph showing carbon fibers infiltrated with indium in yet another embodiment. [Figure 6B] FIG. 6B is a photomicrograph showing carbon fibers infiltrated with indium in yet another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] (Detailed explanation) The present disclosure relates generally to various thermally conductive materials for use in semiconductor devices or other applications. In some cases, the material may comprise a plurality of oriented fibers (e.g., carbon fibers) and a metal (e.g., solder). The plurality of oriented fibers may, for example, define a substrate. In some cases, the metal may be present in a transition metal rich solder alloy, a conductive medium (e.g., conductive ink), a thermal chemical vapor deposited solder, an oxide coated liquid metal, or an oxide coated liquid metal transition metal rich solder alloy. The metal may, in certain embodiments, have a relatively low melting temperature (or melting temperature or melting temperature). The metal may be sandwiched between or infiltrated by the plurality (or plurality of) discontinuous fibers (or non-continuous fibers) and / or the metal may surround at least a portion of the plurality (or plurality of) discontinuous fibers. In some cases, the metal may react with the carbon fibers, thereby forming metal carbides, and / or may diffuse into the carbon fibers, which may promote contact between the metal and the carbon fibers. Other aspects generally relate to devices (or apparatus) that use the compositions, methods of making the compositions, kits that include the compositions, and the like.

[0018] For example, as described in this disclosure, certain embodiments relate generally to thermal interface materials (TIMs) and thermal interface compositions. These may be used, for example, to transfer heat between a first location (e.g., a heat source) and a second location (e.g., a heat sink). Such a composition may be positioned (or disposed) between a semiconductor device (e.g., a heat source or heat generator) and a heat sink or cooling device (e.g., a heat emitter or heat dissipator). In some embodiments, thermally conductive carbon fibers can be used to transport heat quickly and efficiently through the material. Furthermore, in some embodiments, such compositions may be used to provide electromagnetic interference (EMI) shielding, for example, instead of or in addition to thermal transport.

[0019] In one set of embodiments, a composition (such as those described in this disclosure) may include a plurality (or a plurality of) discontinuous fibers (or non-continuous fibers), which may, in some cases, be substantially oriented (or aligned or aligned). It should be noted that such orientation (or sequence or alignment) need not be complete (or perfect), but within the composition, at least a portion of the fibers may exhibit an orientation (or sequence or alignment) that is generally within 45°, or within 20° or less, of the average orientation (or sequence or alignment) (or average alignment) of a plurality (or plurality) of fibers (e.g., as described herein). Furthermore, in some embodiments, such fibers may be substantially oriented (or aligned) (or undergo alignment) at a relatively large volume fraction (or volume fraction) or packing fraction (or packing fraction). For example, the fibers may be present within the composition such that at least 30% by volume (30 vol%), at least 40% by volume (40 vol%), at least 50% by volume (50 vol%), etc. of the composition comprises such fibers. Also, in other embodiments, larger volume fractions (or percentages) (or volume percentages) (or volume % or vol%) are possible, for example, as described below. Such fibers, for example, when substantially oriented, may be particularly effective at transporting heat from a first location to a second location due to, for example, the orientation and directionality of the fibers. Additionally, in some cases, the discontinuous fibers may be more thermally conductive than the metal. In contrast, many other compositions used in thermal interface materials have a fairly low fiber concentration or density, and typically any fibers that may be present are unable to transport significant amounts of heat, for example, due to the low fiber concentration.

[0020] In some embodiments, materials (eg, metals or solders) may be used within the composition. In one set of embodiments, such compositions may be used to ensure good thermal contact between a first location and a second location (e.g., between a heat source and a heat sink or cooling device). In some cases, the metal (or metals) may be selected to have a relatively low melting temperature. For example, in one embodiment, the solder may include indium. Examples of solder alloys include InAg, InCr, InNi, InCo, etc. Other examples of solder alloys include SnAgCu alloys (e.g., 96.5% Sn / 3.0% Ag / 0.5% Cu (i.e., SAC305)), reclaimed (or recycled) solder alloys, etc. In some cases, such materials can provide different characteristics in composition, such as assembly process temperature, thermomechanical properties, mechanical properties, coefficient of thermal expansion (CTE), thermal conductivity, thermal resistance, compressive strength, handling, environmental impact, and solderability. In some cases, solder flux may also be present, for example, coated onto the fibers. Solder flux may be useful in some embodiments to promote a bond between the material and the fibers.

[0021] Such material may be in contact with at least a portion of the fiber, for example, the material may surround at least a portion of the fiber and / or may be sandwiched or interpenetrated between multiple (plural) fibers. For example, such materials may be infused (or impregnated) into the substrate or between multiple fibers (strands), using techniques such as application of pressure, gravity, capillary action, etc., as described in more detail in this disclosure. Surprisingly, as described herein, certain materials and methods (as described herein) can cause the metal (e.g., solder) to "wet out" the fibers, e.g., at least partially coating or surrounding the fibers. In some cases, this may result in a relatively small void volume (or void capacity or void capacity or void volume) (eg, as described in this disclosure). Additionally, in some cases, additional materials may be coated onto the substrate.

[0022] In some embodiments, the presence of substantially oriented (or aligned or arranged) discontinuous (or non-continuous) fibers can reduce or inhibit the flow of metal (or metals) from the composition when, for example, heated to a temperature above the melting temperature of the metal (or metals). Without wishing to be bound by theory, it is believed that the discontinuous fibers may act as a physical barrier that reduces or inhibits the migration of metal from the composition. Additionally, as described in this disclosure, the metal can partially "wet out" (or "wet") the fibers. Additionally, in some cases, the fibers may be substantially incompressible, for example, when subjected to force or weight, thereby inhibiting or reducing the ability of such force or weight to cause movement of the metal. For example, in some cases, the fibers can reduce or prevent metal from being extruded, squeezed, or leached out of the fibers, e.g., during assembly or use of the composition.

[0023] As a non-limiting example, a schematic diagram of one such composition, according to certain embodiments as described in this disclosure, can be seen in Figure 1. In Figure 1, a substrate 10 includes a plurality of fibers 15 and a material 20. The fibers 15 are substantially oriented. The material 20 surrounds the fibers 15 and is sandwiched between the fibers 15. For example, the fibers 15 may include carbon fibers and / or the material 20 may be a metal (e.g., a solder (e.g., a solder containing indium)). Additionally, in some embodiments, the composition may be included between metal plates (e.g., those comprising copper or other metals) that can transfer heat from a first location (e.g., a heat source) to a second location (e.g., a heat sink or cooling device), for example, as part of a thermal interface material. In some cases, the metal plates may be substantially parallel. This can be shown diagrammatically as plate 30 in the example of FIG. The plate 30 may be, for example, a lid, a die, or other element (or part or component), for example, another element (or part or component) within a device (or apparatus).

[0024] Furthermore, it should be understood that in some embodiments, the material may not be completely sandwiched between the fibers, for example, there may be some void volume formed (or generated) between the material and a plurality (or plurality of) discontinuous fibers (or non-continuous fibers). This is shown diagrammatically in FIG. 3 as void volume (or void capacity or void volume) 40 . However, as described herein, in some embodiments, the internal void volume (or internal void volume or internal void capacity or internal void volume) may be 40% or less, 30% or less, 20% or less, etc., because in certain cases, a relatively large amount of interfiber penetration (or infiltration) by the material may be achieved, for example, as described herein. Such compositions may further exhibit relatively high thermal conductivity (or thermal conductivity or thermal conductivity) due to, for example, the presence of a plurality of discontinuous fibers passing through the void volume (or void capacity or void volume) and / or due to the presence of a relatively small void volume (or void capacity or void volume).

[0025] The above descriptions are non-limiting examples of specific embodiments of the present invention that can be used to produce specific oriented (or aligned or ordered) thermally conductive materials. However, other embodiments are possible. Thus, the invention in various aspects more generally relates to various systems and methods for orienting (or arranging or aligning) materials.

[0026] For example, some embodiments generally relate to compositions capable of transferring heat between a first location (e.g., a heat source) and a second location (e.g., a heat sink). In certain cases, such compositions may be used as thermal interface materials that can be used to assist in thermal communication from a first location to a second location. In one set of embodiments, for example, compositions as described in this disclosure may have relatively high thermal conductivity (or thermal conductivity or thermal conductance or thermal conductivity). For example, the composition may have a total thermal conductivity (or total thermal conductivity or total thermal conductivity or overall heat conductivity) of at least 3 W / m K, at least 5 W / m K, at least 10 W / m K, at least 20 W / m K, at least 25 W / m K, at least 30 W / m K, at least 35 W / m K, at least 40 W / m K, at least 45 W / m K, at least 50 W / m K, at least 60 W / m K, at least 75 W / m K, at least 100 W / m K, at least 200 W / m K, at least 250 W / m K, at least 300 W / m K, at least 350 W / m K, at least 400 W / m K, at least 450 W / m K, at least 500 W / m K, at least 600 W / m K, at least 750 W / m K, etc.

[0027] In some embodiments, the composition may include a plurality (or multiple) of discontinuous fibers and a solder or other metal in contact with at least a portion of the discontinuous fibers. The discontinuous fibers may include carbon fibers and / or other fibers formed using materials such as those described in this disclosure. In some cases, the plurality of discontinuous fibers may be substantially oriented, which surprisingly allows for significantly improved heat transport, for example, along the direction of orientation or through-thickness. Such compositions may, in certain embodiments, provide improved heat transport due to the close packing of the discontinuous fibers. For example, at least 30% by volume (or other proportions (or percentages (%)) as described herein) of the fibers may be substantially oriented (or aligned), which may result in improved heat transport within the composition. Additionally, the material may, in some embodiments, exhibit anisotropic thermal conductivity (or thermal conductivity or thermal conductivity) (or anisotropic heat conductivity).

[0028] Furthermore, in certain embodiments, the compositions may be useful as a shield against electromagnetic interference instead of, or in addition to, heat transport. In some cases, by increasing the bulk electrical conductivity of a material, for example by using a metal (e.g., solder), the material may be able to absorb electromagnetic waves, thereby forming a shield against electromagnetic interference. The electromagnetic shield may be partial or complete, depending on the application. In some cases, shielding can reduce the coupling of radio waves, electromagnetic fields, electrostatic fields, etc., resulting from, for example, conductive elements (e.g., carbon fibers or other fibers, such as those described in this disclosure) within the composition. Furthermore, in some embodiments, increased thermal conductivity of the composition may also correspond to increased electrical conductivity and / or increased shielding against electromagnetic interference.

[0029] Thus, one embodiment described in this disclosure generally relates to a plurality (or multiple) of discontinuous fibers (or non-continuous fibers). In some embodiments, a relatively large amount (or number) of discontinuous fibers (or non-continuous fibers) may be present, such as to define (or constitute) a substrate (or base material or substrate). The discontinuous fibers (or non-continuous fibers) may constitute (or form) a relatively large proportion (or percentage (%)) of the substrate (or base material or substrate). For example, at least 20% by volume, at least 30% by volume, at least 40% by volume, at least 50% by volume, at least 60% by volume, at least 70% by volume, at least 80% by volume, at least 90% by volume, at least 95% by volume, at least 97% by volume, or at least 99% by volume (vol%) of the substrate may be composed of (or formed from) discontinuous (or non-continuous) fibers.

[0030] Furthermore, in certain embodiments, some or all of the discrete fibers (or non-continuous fibers) may be substantially oriented (or aligned). Methods for orienting (or arranging or aligning) discrete (or non-continuous) fibers are described in more detail below. However, it should be understood that the orientation (or sequence or alignment) need not be complete (or perfect). For example, in some cases, such as those described herein, in a substrate or composite, at least 5% or more of the fibers may exhibit an orientation within 45° or less of the average orientation of the fibers. Further embodiments are described below.

[0031] In addition to the discontinuous fibers, metals (e.g., solder) or other materials may also be present within the composition, according to certain embodiments. In one set of embodiments, such materials may be particularly useful because they can form good thermal contact between them and other elements of a device (e.g., a heat source, a heat sink, a cooling device, etc.). In some cases, such materials may partially or completely soften or liquefy when exposed to relatively warm temperatures, which may, for example, improve thermal contact with such elements (or parts or components). For example, in one set of embodiments, the composition may include a metal that begins to soften or liquefy when the device in which it is contained is used (e.g., when heat is generated). As a non-limiting example, a device (or apparatus) may include a semiconductor microchip (e.g., included within a computer), and such a microchip may be heated during use to temperatures up to 40°C-80°C, 50°C-70°C, etc. In some embodiments, even higher temperatures may be possible. In some cases, at such high temperatures, the metal or other material may soften or liquefy, which may improve thermal contact with the semiconductor microchip, e.g., facilitate the transport of heat away therefrom.

[0032] Any of a wide variety of materials can be used. In some cases, such materials may undergo a phase transition (or change) due to heat (e.g., heat from a heat source). For example, such materials may at least partially soften or at least partially undergo a solid to liquid phase transition (or phase change). Without wishing to be bound by theory, it is believed that certain materials may be useful in certain cases because, when heated, such materials may be able to at least partially flow, e.g., to seal cracks or poor connections, and / or because such materials absorb thermal energy rather than increasing in temperature (e.g., thermal energy affects a phase transition). In certain embodiments, one or more materials (eg, metals) may be present.

[0033] The plurality (or plurality of) discontinuous fibers (or non-continuous fibers) may be in partial or complete contact with such material. For example, in one embodiment, a plurality of discontinuous fibers may be fully embedded within such a material. In another embodiment, a plurality of discontinuous fibers (or fibers that are not continuous) may be in contact with such material, which may be in contact at a first end of the fibers and not in contact at a second end of the fibers. For example, the second end may be in contact with a variety of materials, or may be free in some embodiments. In some cases, at least a portion of the material may be sandwiched between a plurality (or multiple) of discontinuous fibers (or non-continuous fibers) and / or at least a portion of the material may surround some or all of a plurality (or multiple) of discontinuous fibers (or non-continuous fibers). For example, in one embodiment, the material may cover at least a first side of a substrate that is defined by a plurality of discontinuous fibers. For example, the material may include a metal (eg, solder) or other metals or materials (as described in this disclosure).

[0034] In one set of embodiments, the melting temperature of the metal is 265° C. or less. In some cases, the melting temperature (or melting temperature) of the metal (or metals) may be 300°C or less, 290°C or less, 280°C or less, 270°C or less, 260°C or less, 250°C or less, 240°C or less, 230°C or less, 220°C or less, 210°C or less, 200°C or less, 190°C or less, 180°C or less, 170°C or less, 160°C or less, 150°C or less, 140°C or less, 130°C or less, 120°C or less, 110°C or less, 100°C or less, etc. Furthermore, in certain embodiments, the melting temperature (or melting temperature) of the metal (or metals) may be at least 50°C, at least 60°C, at least 70°C, at least 80°C, at least 90°C, at least 100°C, at least 110°C, at least 120°C, at least 130°C, at least 140°C, at least 150°C, at least 160°C, at least 170°C, at least 180°C, at least 190°C, at least 200°C, at least 210°C, at least 220°C, at least 230°C, at least 240°C, at least 250°C, at least 260°C, at least 270°C, at least 280°C, at least 290°C, etc. Any combination of these ranges is also possible. For example, the melting temperature of the metal may be 200°C to 265°C, 220°C to 265°C, 180°C to 190°C, or 150°C to 170°C.

[0035] In some embodiments, the metal may be selected to be capable of reacting with carbon, for example, to form carbides or other intermetallic compounds. For example, a metal may react with discontinuous fibers, such as carbon fibers, to form carbides when treated as described in this disclosure. Without wishing to be bound by theory, it is believed that the presence of carbides may facilitate interaction between the metal and the discontinuous fibers. For example, such carbides may enhance the ability of the metal to "wet out" (or "wet") the fibers, e.g., to coat (or encase) or surround the fibers. In some cases, this may result in a composition having a relatively small void volume (e.g., as described herein).

[0036] The metal may, in one embodiment, include indium. The melting point of indium is about 157° C., and in certain cases, indium may be alloyed with other metals (for example, as a solder). The indium may be present in any suitable concentration. For example, at least 25%, at least 30%, at least 35%, at least 40%, at least 45%, at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90% or at least 95% (by mass) of the metal may be indium. However, in some embodiments, up to 95%, up to 90%, up to 85%, up to 80%, up to 75%, up to 70%, up to 65%, up to 60%, up to 55%, up to 50%, up to 45%, up to 40%, up to 35%, or up to 30% of the metal can be indium. In other embodiments, any combination of these ranges is possible.

[0037] However, other metals may also be present, for example in addition to or instead of indium. Non-limiting examples include nickel, chromium, cobalt, tin, and the like. In some cases, the metal may include a transition metal, such as any of the transition metals described in this disclosure. For example, the metal may be present in a transition metal rich solder alloy, an oxide coated liquid metal, an oxide coated liquid metal transition metal rich solder alloy, a thermal chemical vapor deposited metal, or a conductive medium (e.g., a conductive ink). The conductive ink may include, for example, silver, copper, carbon, graphene, and the like. One or more metals may be present, for example to form a metal alloy. Non-limiting examples include solder (such as those described in this disclosure). Other non-limiting examples of metals include: Indium + 1%~5% Ag + 0.1%~2% Ni Indium + 1%~5% Ag + 0.1%~2% Cu + 0.1%~2% Ni (All percentages are percent by weight.) Additionally, in some cases, as explained above, a metal may diffuse, deposit, or react in carbon (e.g., carbon fiber) to form carbides, such as indium carbide, nickel carbide, chromium carbide, cobalt carbide, tin carbide, or various transition metal carbides. Furthermore, in some cases, one or more such carbides may be present, or none at all.

[0038] In one embodiment, the metal may be, for example, any of those described in this disclosure, and may include solder. The solder may be a metal or a metal alloy. As explained above, the solder may be in partial or complete contact with a plurality of discontinuous fibers. For example, the plurality (or plurality of) discontinuous fibers (or non-continuous fibers) may be fully or partially embedded within the solder, and / or the solder may be sandwiched between the plurality (or plurality of) discontinuous fibers (or non-continuous fibers). In some cases, the solder may be capable of physically and / or chemically joining (or bonding) a plurality (or plurality of) discontinuous fibers (or non-continuous fibers). For example, in some embodiments, the solder may react with carbon and form carbides, which may facilitate bonding. Additionally, in some cases, a solder flux or another organic material may be used to improve the bond, for example by removing any oxides (e.g., metal oxides) that may be present or by interacting with any oxides (e.g., metal oxides) that may be present and / or the carbon fibers themselves.

[0039] In one set of embodiments, the solder may be a low melting point solder. For example, the melting temperature (or melting temperature or melting temperature) of the solder may be at least 100°C, at least 110°C, at least 120°C, at least 130°C, at least 140°C, at least 150°C, at least 160°C, at least 170°C, at least 180°C, at least 190°C, at least 200°C, at least 210°C, at least 220°C, at least 230°C, at least 240°C, at least 250°C, at least 260°C, at least 270°C, at least 280°C, at least 290°C, etc. and / or may be 300°C or less, 290°C or less, 280°C or less, 270°C or less, 260°C or less, 250°C or less, 240°C or less, 230°C or less, 220°C or less, 210°C or less, 200°C or less, 190°C or less, 180°C or less, 170°C or less, 160°C or less, 150°C or less, 140°C or less, 130°C or less, 120°C or less, 110°C or less, 100°C or less, or other melting temperature (or melting temperature or melting temperature) (e.g., as described in this disclosure). A variety of low melting point solders are commercially available.

[0040] Examples of metals that may be present in the solder include indium, tin, bismuth, lead, and antimony. In some cases, more than one of such metals may be present. For example, the solder may be an indium-tin alloy, a tin-bismuth alloy, and / or may include other metals as well (including any of the metals described in this disclosure). Non-limiting examples include SnAgCu solder (eg, 96.5% Sn / 3.0% Ag / 0.5% Cu), InAg solder, InSn solder, InCr solder, and the like. In one set of embodiments, the solder may include a low melting point metal.

[0041] Additionally, in certain embodiments, the solder may include a transition metal (e.g., a transition metal-rich solder alloy (or a solder alloy rich in a transition metal or a transition metal-rich solder alloy or a transition metal-rich solder alloy)). In some cases, at least 0.1%, at least 0.2%, at least 0.5%, at least 1%, at least 5%, at least 10%, at least 15%, at least 20%, at least 30%, at least 50%, at least 60%, at least 70%, at least 80%, or at least 90% (by weight) of the solder may comprise one or more transition metals. Non-limiting examples of suitable transition metals include nickel, chromium or cobalt. Other examples of transition metals include, but are not limited to, cadmium, zinc, copper, and silver.

[0042] In certain cases, the discontinuous fibers (or non-continuous fibers) may include carbon fibers (or carbon fibers). In some cases, the carbon may be capable of wetting, spreading, or thermal chemical vapor deposition of the solder, or may react with such transition metals to produce (or form or manufacture) a carbide. Non-limiting examples of carbides include indium carbide (or indium carbide), nickel carbide (or nickel carbide), chromium carbide (or chromium carbide), cobalt carbide (or cobalt carbide), tin carbide (or tin carbide), and the like. Without wishing to be bound by theory, it is believed that the carbide may facilitate the ability of the solder to "wet out" (or "wet") the fibers, e.g., the solder may be sandwiched between and / or at least partially surround the fiber(s).

[0043] Additionally, in some cases, the transition metal-rich solder alloy (or transition metal-rich solder alloy or transition metal-rich solder alloy or transition metal-rich solder alloy) may include an oxide-coated liquid metal (or oxide-coated liquid metal (or liquid metal)) or an oxide-coated liquid metal-transition metal-rich solder alloy. These may, in certain embodiments, comprise a liquid metal core surrounded by an oxide shell. The liquid metal, in some cases, may include a solder, such as SAC305 (96.5% tin, 3% silver, and 0.5% copper), or other solders (e.g., any of those described in this disclosure). The oxide may be formed (or generated) from an oxide such as, for example, tin oxide, indium oxide, or the like. Such compositions are commercially available, for example, from SAFI-Tech Corporation.

[0044] In certain embodiments, the metal may be included in a conductive medium, such as a conductive ink. In some cases, the conductive medium may include a dispersion of conductive particles in a flowable medium (e.g., a polymer, gel, solvent, etc.). The particles may include, for example, metals (e.g., silver, copper, gold, etc.), carbon particles, carbon nanotubes, graphene particles, etc., or may include particles that essentially consist of these. In some cases, more than one type of particle may be present in the medium. The particles may also be conductive in some cases. For example, at least 5×10 3 S / cm, at least 1 × 10 4 S / cm, at least 3 × 10 4 S / cm, at least 5 × 10 4 S / cm, at least 1 × 10 5 S / cm, at least 3 × 10 5 S / cm or at least 5 × 10 5 The conductivity (or conductivity or conductance or conductivity) may be in s / cm or the like. In some cases, the average size (or mean diameter) of the particles may be less than 10 micrometers (μm), less than 5 micrometers (μm), less than 1 micrometer (μm), less than 1000 nm, less than 500 nm, less than 300 nm, less than 100 nm, less than 50 nm, etc. Additionally, the particles may have the same or different sizes (or dimensions) and / or may be spherical or non-spherical (e.g., flakes or other shapes). Examples of vehicles (or media) that may be present include, but are not limited to, alcohols (e.g., methanol, ethanol, isopropanol, butanol), glycerol (e.g., ethylene glycol, glycerin, glycol ethers, etc.), acetates (e.g., ethyl acetate, butyl acetate, carbitol acetate, etc.), ethers (e.g., diethyl ether, tetrahydrofuran, dioxane, etc.), ketones (e.g., methyl ethyl ketone, acetone, etc.), hydrocarbons (e.g., pentane, hexane, heptane, etc.), aromatics (e.g., xylene, benzene, toluene, etc.), halogenated solvents (e.g., chloroform, methylene chloride, carbon tetrachloride, etc.), and the like. In some cases, the solvent may be allowed to evaporate after use (eg, after being introduced into the composition). Additionally, optionally, a binder may be present. Examples of binders include, but are not limited to, acrylics (e.g., polyacrylic acid, polyacrylic esters, etc.), celluloses (e.g., ethyl cellulose, cellulose esters, cellulose nitrate, etc.), aliphatic or copolymer polyesters, vinyls (e.g., polyvinyl butyral, polyvinyl acetate, polyvinyl pyrrolidone, etc.), polyamides, polyurethanes, polyethers, ureas, alkyds, silicones, fluorines, olefins (e.g., polyethylene, polystyrene, etc.), thermoplastics (or thermoplastics or thermoplastics) (e.g., petroleum, rosin, etc.), epoxies, phenolics, silicones (e.g., silicone epoxies, silicone polyesters, etc.), thermosets (or thermosets or thermosets) (e.g., melamine), and the like. Conductive media, such as conductive inks, are commercially available.

[0045] In certain embodiments, the composition may include a solder flux. The solder flux may include a chemical cleaning agent, a flowing agent, and / or a purifying agent. In some cases, the solder flux may include an acid (eg, an organic acid). Without wishing to be bound by theory, it is believed that in some embodiments, the solder flux may react with oxides, for example, in the solder and / or discontinuous fibers. And, in some embodiments, removing or neutralizing such oxides is believed to facilitate contact between, for example, the solder and the discontinuous fibers. Non-limiting examples of solder fluxes include rosin, sodium carbonate, potash, charcoal, coke, borax, lime, lead sulfide, and the like. Further non-limiting examples include acids (eg, citric acid, lactic acid, stearic acid, hydrochloric acid), zinc chloride, and ammonium chloride. In some cases, a solvent such as isopropyl alcohol or water may be present.

[0046] According to certain embodiments, for example, other materials may be present instead of and / or in addition to a metal (eg, solder). For example, in one embodiment, the material may include a phase change material. Non-limiting examples of phase change materials include silicones, acrylics, thermoplastics (or thermoplastics or thermoplastics), and the like. Further examples include trimethylolethane, lithium nitrate, manganese nitrate, manganese chloride, and the like. See also U.S. Patent Application No. 63 / 314,808, entitled "Thermally Conductive Aligned Materials and Methods of Making and Use Thereof," which is incorporated herein by reference in its entirety.

[0047] As another example, in one set of embodiments, the phase change material may include wax. Waxes may comprise alkanes and / or lipids and may be natural or synthetic. In some cases, the wax is substantially water-insoluble (or non-water-soluble). In some cases, the melting temperature (or melting temperature or melting temperature) of the wax (or wax) may be at least 40° C. or other phase transition temperature (such as any of those described in this disclosure). Non-limiting examples of waxes include paraffin wax, polyethylene wax, hydrocarbon wax, beeswax, cetyl palmitate, vegetable wax, montan wax, lauric acid, and the like.

[0048] As yet another example, the phase change material may include a salt hydrate. Non-limiting examples of salt hydrates include potassium fluoride tetrahydrate, manganese nitrate hexahydrate, calcium chloride hexahydrate, calcium bromide hexahydrate, lithium nitrate hexahydrate, sodium sulfate decahydrate, sodium carbonate decahydrate, sodium orthophosphate dodecahydrate, zinc nitrate hexahydrate, sodium sulfate decahydrate, and the like. For example, in one embodiment, the salt hydrate may have the formula: NaCl·Na 2 SO 4 ·10H 2 O.

[0049] As yet another example, the phase change material may include a eutectic. Typically, a eutectic is a mixture of two or more substances that has a melting point lower than the melting point of any of the substances that form the eutectic. For example, the eutectic melting temperature may be between 0° C. and 80° C. or other phase transition temperatures (eg, those described in this disclosure). As a non-limiting example, the eutectic can be an organic-organic eutectic or an organic-inorganic eutectic. Specific non-limiting examples include myristic acid and stearic acid, Mg(NO3)2·6H2O and glutaric acid, ethylene glycol distearate, and the like.

[0050] Thus, as described, according to certain embodiments, a metal (e.g., solder) may contact a plurality of discontinuous fibers. The metal may be sandwiched between or infiltrated by a plurality of discontinuous fibers, and / or may, in some embodiments, surround at least some of the discontinuous fibers or surround all of the discontinuous fibers. In some cases, carbides, solder flux, and / or other materials may be present to facilitate contact or "wetting out" of the metal to the fibers. However, it should be understood that in certain cases, such contact may not be perfect, and void volume may exist. Void volume may exist, for example, where the fibers are not in contact with the metal.

[0051] For example, in certain embodiments, on average, at least 30% of the length of the discontinuous fibers may be in contact with the metal (e.g., solder). Additionally, in some cases, at least 40%, at least 50%, at least 60%, at least 70%, at least 80%, or at least 90% of the length of the discontinuous fibers (or non-continuous fibers) may be in contact with the metal (e.g., solder). In certain cases, 90% or less, 80% or less, 70% or less, 60% or less, 50% or less, 40% or less, etc., of the length of the discontinuous fibers (or non-continuous fibers) may be in contact with metal (e.g., solder). Also, combinations of these ranges are possible according to particular embodiments.

[0052] In some cases, the combination of metal and discontinuous fibers may define or constitute a void volume within the composition. The void volume is not exposed to the environment outside the composition. For example, the void volume is completely enclosed. For example, void volume may exist as trapped gas or air pockets within the composition. In certain embodiments, for example, the plurality of discontinuous fibers and the metal together have an internal void volume of 50% or less, 40% or less, 30% or less, 20% or less, 10% or less, or 5% or less of the composition. In some cases, surprisingly low void volumes may be achieved due to, for example, the ability of metal or solder to flow along the fibers and fill the spaces during the formation of the composition.

[0053] Additionally, in certain embodiments, the plurality (or plurality of) discontinuous fibers (or non-continuous fibers) may be more thermally conductive compared to metal. Thus, the composition may further exhibit heat transfer despite the optional presence of void volume, because heat can be transferred through such void volume via the plurality of discontinuous fibers.

[0054] As noted, the composition may, in various embodiments, include a plurality (or multiple) of discontinuous fibers (or non-continuous fibers). In some cases, the discontinuous fibers (or non-continuous fibers) may be substantially oriented (or arranged or aligned) and, for example, may define (or constitute) a substrate (or base material or substrate). In some embodiments, at least 20% by volume, at least 30% by volume, at least 40% by volume, at least 50% by volume, at least 60% by volume, at least 70% by volume, at least 80% by volume, at least 90% by volume, at least 95% by volume, at least 97% by volume, at least 99% by volume (vol%), etc. of the substrate (or base material or substrate) may comprise discontinuous fibers (or non-continuous fibers). Furthermore, at least 20% by volume, at least 30% by volume, at least 40% by volume, at least 50% by volume, at least 60% by volume, at least 70% by volume, at least 80% by volume, at least 90% by volume, at least 95% by volume, at least 97% by volume, or at least 99% by volume of the substrate may be formed (or produced) from discontinuous (or non-continuous) fibers.

[0055] The discontinuous fibers (or non-continuous fibers) may be formed (or produced) from or include any of a wide variety of materials, and one or more materials may be present. For example, the discontinuous fibers may include materials such as carbon (e.g., carbon fiber), basalt, silicon carbide, silicon nitride, aramid, zirconia, nylon, boron, alumina, silica, borosilicate, mullite, nitride, boron nitride, graphite, glass, and polymers (including those described herein). The discontinuous fibers (or non-continuous fibers) may comprise any natural and / or any synthetic material, and may be magnetic and / or non-magnetic.

[0056] Additionally, in some cases, the discontinuous fibers (or non-continuous fibers) may be formed (or produced) from a material (or material) having a relatively high thermal conductivity (or thermal conductivity or thermal conductivity). For example, in various embodiments, the thermal conductivity (or thermal conductance or thermal conductivity) of the discontinuous fibers (or non-continuous fibers) can be at least 5 W / mK, at least 10 W / mK, at least 100 W / mK, at least 200 W / mK, at least 250 W / mK, at least 300 W / mK, at least 350 W / mK, at least 400 W / mK, at least 450 W / mK, at least 500 W / mK, at least 600 W / mK, at least 750 W / mK, at least 900 W / mK, etc. In some cases, discontinuous fibers may be more thermally conductive than metals.

[0057] The discontinuous fibers (or non-continuous fibers) may, in some embodiments, be at least substantially oriented (or aligned or aligned). Methods for orienting (or arranging or aligning) discrete (or non-continuous) fibers are described in more detail in this disclosure. Various orientations (or sequences or alignments) are possible, and in some cases can be determined optically or microscopically. Thus, for example, in some cases, orientation (or sequence or alignments) can be determined qualitatively. However, it should be understood that the orientation (or sequence or alignment) need not be complete (or perfect). In some cases, at least 5%, at least 10%, at least 25%, at least 30%, at least 35%, at least 40%, at least 45%, at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, or at least 95% (e.g., by volume or number) of the fibers within a substrate may be substantially oriented, or may exhibit an orientation within 45°, 40°, 35°, 30°, 25°, 20°, 15°, 10°, or 5° of the average orientation of a plurality of fibers within a sample of the substrate.

[0058] Furthermore, in some cases, the average orientation (or average alignment) of the fibers may be oriented (or oriented or oriented) to be at least 45°, at least 60°, at least 65°, at least 70°, at least 75°, at least 85°, or at least 87° relative to the plane of the substrate (or base material or substrate) at that position (or location). Without wishing to be bound by theory, it is believed that the orientation (or arrangement or alignment) of discontinuous fibers (or non-continuous fibers) within the composition substantially perpendicular to the substrate may serve to provide structural reinforcement (or reinforcement) to the substrate and / or the ability to transfer heat, preferably in a direction along the direction of the discontinuous fibers (or non-continuous fibers). This may result in such compositions exhibiting anisotropic thermal conductivity, for example. For example, the thermal conductivity (or thermal conductance or thermal conductivity or heat conductance) of the composition may exhibit, in one direction (or one direction), a thermal conductivity of at least 3 W / m K, at least 5 W / m K, at least 10 W / m K, at least 30 W / m K, at least 50 W / m K, at least 100 W / m K, at least 250 W / m K, at least 500 W / m K, at least 750 W / m K, etc. For example, this may be a direction defined by the average orientation of the discontinuous fibers, or it may be a direction through the thickness of the substrate (e.g., a direction substantially perpendicular to the plane of the substrate). In some embodiments, this can improve the transfer of heat, for example, from a heat source.

[0059] Although it has been proposed to pack fibers into substrates, for example in thermal interface materials, it has been thought that larger fiber volume fractions have not been achievable to date. Without wishing to be bound by theory, it is believed that this may be due to greater electrostatic interactions (which cause fiber association) and / or greater viscosity of the polymer resin (which can inhibit consistent dispersion). Accordingly, certain embodiments as described herein generally relate to fiber volume fractions (or fiber volume fractions) of at least 40% (fiber volume), at least 45% (fiber volume), at least 50% (fiber volume), at least 55% (fiber volume), at least 60% (fiber volume), at least 65% (fiber volume), at least 70% (fiber volume), etc. (e.g., fiber volume fractions of substantially oriented fibers (e.g., as described herein)).

[0060] Various techniques may be used to orient (or arrange or align) the discrete (or non-continuous) fibers in various embodiments, including magnetic fields, shear flow, etc., as described in more detail in this disclosure. As a non-limiting example, magnetic particles (including those described in this disclosure) can be attached to the fibers, and then a magnetic field can be used to manipulate the magnetic particles. For example, a magnetic field can be used to move magnetic particles to a substrate and / or to orient (or arrange or align) discontinuous fibers (or non-continuous fibers). The magnetic field may be constant or may vary over time (eg, oscillate) (eg, as described in this disclosure). For example, the frequency (or oscillation frequency) of the applied magnetic field may be 1 Hz to 500 Hz, and the amplitude may be 0.01T to 10T. Other examples of magnetic fields are discussed in more detail below.

[0061] In some cases, the discontinuous fibers (or non-continuous fibers) may have an average length or characteristic dimension (or size or dimension) that may be at least 1 nm, at least 3 nm, at least 5 nm, at least 10 nm, at least 30 nm, at least 50 nm, at least 100 nm, at least 300 nm, at least 500 nm, at least 1 micrometer (μm), at least 3 micrometers (μm), at least 5 micrometers (μm), at least 10 micrometers (μm), at least 20 micrometers (μm), at least 30 micrometers (μm), at least 50 micrometers (μm), at least 100 micrometers (μm), at least 200 micrometers (μm), at least 300 micrometers (μm), at least 500 micrometers (μm), at least 1 mm, at least 2 mm, at least 3 mm, at least 5 mm, at least 10 mm, at least 15 mm, etc. In certain embodiments, the discontinuous fibers (or non-continuous fibers) may have an average length or characteristic dimension (or size or dimension) that may be 5 cm or less, 3 cm or less, 2 cm or less, 1.5 cm or less, 1 cm or less, 5 mm or less, 3 mm or less, 2 mm or less, 1 mm or less, 500 micrometers (μm) or less, 300 micrometers (μm) or less, 200 micrometers (μm) or less, 100 micrometers (μm) or less, 50 micrometers (μm) or less, 30 micrometers (μm) or less, 20 micrometers (μm) or less, 10 micrometers (μm) or less, 5 micrometers (μm) or less, 3 micrometers (μm) or less, 1 micrometer (μm) or less, 500 nm or less, 300 nm or less, 100 nm or less, 50 nm or less, 30 nm or less, 10 nm or less, 5 nm or less, etc. Any combination of these ranges is also possible. For example, the plurality of discontinuous fibers may have an average length between 1 mm and 5 mm.

[0062] Additionally, the discontinuous fibers (or non-continuous fibers) may have any suitable average diameter (or mean diameter or average diameter). For example, the average diameter (or mean diameter) of the discontinuous fibers (or non-continuous fibers) can be at least 5 micrometers (μm), at least 10 micrometers (μm), at least 20 micrometers (μm), at least 30 micrometers (μm), at least 50 micrometers (μm), at least 100 micrometers (μm), at least 200 micrometers (μm), at least 300 micrometers (μm), at least 500 micrometers (μm), at least 1 mm, at least 2 mm, at least 3 mm, at least 5 mm, at least 1 cm, at least 2 cm, at least 3 cm, at least 5 cm, at least 10 cm, etc. In certain embodiments, the average diameter (or mean diameter or average diameter) of the discontinuous fibers (or non-continuous fibers) can be 10 cm or less, 5 cm or less, 3 cm or less, 2 cm or less, 1 cm or less, 5 mm or less, 3 mm or less, 2 mm or less, 1 mm or less, 500 micrometers (μm) or less, 300 micrometers (μm) or less, 200 micrometers (μm) or less, 100 micrometers (μm) or less, 50 micrometers (μm) or less, 30 micrometers (μm) or less, 20 micrometers (μm) or less, 10 micrometers (μm) or less, 5 micrometers (μm) or less, etc. Any combination of these ranges is also possible. For example, the average diameter (or mean diameter) of the discontinuous fibers (or non-continuous fibers) may be 5 micrometers (μm) to 50 micrometers (μm), 10 micrometers (μm) to 100 micrometers (μm), 50 micrometers (μm) to 500 micrometers (μm), 100 micrometers (μm) to 5 mm, etc.

[0063] In certain embodiments, the length of the discontinuous fibers may be, on average, at least 10 times or at least 50 times the thickness or diameter of the fibers. In some cases, the average aspect ratio of the fibers (ratio of the average fiber length to diameter or thickness) may be at least 3, at least 5, at least 10, at least 30, at least 50, at least 100, at least 300, at least 500, at least 1000, at least 3000, at least 5000, at least 10000, at least 30000, at least 50000, or at least 100000. In some cases, the average aspect ratio may be less than 100,000, less than 50,000, less than 30,000, less than 10,000, less than 5,000, less than 3,000, less than 1,000, less than 500, less than 300, less than 100, less than 50, less than 30, less than 10, less than 5, etc. In some cases, any combination of these ranges is possible. For example, the aspect ratio may be between 5 and 100,000.

[0064] At least some of the discontinuous fibers (or non-continuous fibers) may be uncoated (or uncovered). However, in some cases, some or all of the discontinuous fibers may be coated. For example, a coating may be used to facilitate adsorption or binding of particles (eg, magnetic particles) to the fibers, or for other reasons. As one non-limiting example, at least a portion of the discontinuous fibers (or non-continuous fibers) are coated (or covered) with a sizing agent (or sizing). Some examples of coatings or sizing agents include, but are not limited to, polypropylene, polyurethane, polyamide, phenoxy, polyimide, epoxy, and the like. These can be introduced, for example, as a solution, a dispersion, an emulsion, or the like. As other examples, the fibers may be coated (or covered) with surfactants, silane coupling agents, epoxies, glycerin, polyurethanes, organometallic coupling agents, and the like. Non-limiting examples of surfactants include oleic acid, sodium dodecyl sulfate, sodium lauryl sulfate, and the like. Non-limiting examples of silane coupling agents include amino-, benzylamino-, chloropropyl-, disulfide-, epoxy-, epoxy / melamine-, mercapto-, methacrylate-, tertasulfido-based, ureido-, vinyl-, isocyanate-, and vinyl-benzyl-amino-based silane coupling agents. Non-limiting examples of organometallic coupling agents include aryl-based and vinyl-based organometallic coupling agents.

[0065] As noted, in one set of embodiments, at least some of the discontinuous fibers (or non-continuous fibers) may be carbon fibers (or carbon fibers). Carbon fibers may be oriented (or aligned) in a magnetic field, either directly or indirectly, using, for example, magnetic particles or other techniques (such as those described in this disclosure). For example, some types of carbon fibers are diamagnetic and can be moved directly using an applied magnetic field. Thus, certain embodiments relate to fibers that are substantially free of paramagnetic or ferromagnetic materials, and such fibers can be oriented (or aligned or ordered or ordered) using an external magnetic field. For example, if paramagnetic or ferromagnetic materials are present, they may form (or constitute) less than 5%, less than 1%, less than 0.5%, less than 0.3%, less than 0.1%, less than 0.05%, less than 0.03%, less than 0.01%, less than 0.005%, less than 0.003%, or less than 0.001% (by mass) of the material.

[0066] A variety of carbon fibers are commercially available, including diamagnetic carbon fibers. In some cases, carbon fibers can be made from polymer precursors, such as polyacrylonitrile (PAN), nylon, pitch, and the like. In some cases, carbon fibers can be spun into filament yarns. For example, chemical or mechanical processes can be used to first align the polymer atoms in a way that enhances the final physical properties of the finished carbon fiber. The precursor compositions and mechanical processes used during spinning of the filament yarns may be varied. After drawing or spinning, the polymer filament yarn may be heated to remove non-carbon atoms (carbonization or pyrolization) and produce (or create or form) the final carbon fiber. In some embodiments, such techniques may be used to produce carbon fibers having a relatively high carbon content (e.g., at least 90%) or other content as described herein.

[0067] Non-limiting examples of carbon fibers include, for example, pitch-based and / or polymer-based (e.g., ex-PAN or ex-Rayon) variants, including those commercially available. In some cases, these may include intermediate / standard modulus (200 GPa or greater) carbon fibers, high modulus (300 GPa or greater) carbon fibers, or ultra-high modulus (500 GPa or greater) carbon fibers.

[0068] In one set of embodiments, the carbon content of the carbon fibers is relatively high. Without wishing to be bound by theory, it is believed that such fibers can exhibit diamagnetic properties that allow the fibers to be oriented in a low-energy magnetic field. Generally, diamagnetism is the repulsion of a material to an applied magnetic field, which results in the generation of an induced magnetic field, which is a magnetic field of the opposite direction to the applied magnetic field. A material is typically classified as diamagnetic if there is no significant paramagnetic or ferromagnetic contribution to the overall magnetic response. In many cases, the magnetic response of diamagnetic materials is very weak and can be ignored. However, in such diamagnetic materials, a relatively strong magnetic field can induce a significant physical response.

[0069] Thus, in some cases, carbon fibers exhibiting a relatively highly oriented molecular structure may exhibit anisotropic (or anisotropic) high-diamagnetic properties. These diamagnetic properties allow the carbon fibers to be oriented in a relatively weak magnetic field (such as those described in this disclosure). For example, in one set of embodiments, the applied magnetic field may generate a strong induced magnetic field in the C-C bonds of the carbon fibers, such an induced magnetic field being in the opposite direction to the applied magnetic field. Certain types of carbon fibers may have a high degree of C-C bonding parallel to the in-fiber direction, which can create an anisotropic diamagnetic response. Such carbon fibers can therefore be subjected to a magnetic torque (or magnetic torque or magnetic force torque), which is neutralized when the carbon fibers are perfectly parallel oriented (or aligned or aligned) with respect to an applied magnetic field. Thus, by applying an appropriate magnetic field, carbon fibers can be oriented (or aligned or aligned) (or undergo alignment) due to their diamagnetic properties. Such a response may be sufficient to overcome gravity, viscosity and / or steric effects between particles.

[0070] For example, in certain embodiments, the carbon content of the carbon fibers may be greater than 80%, greater than 90%, greater than 92%, greater than 94%, greater than 95%, greater than 96%, greater than 97%, greater than 98%, greater than 99%, or greater than 99.5% (by mass). Such carbon fibers are, in some cases, commercially available. For example, carbon fibers can be produced pyrolytically, e.g., by "burning" or "oxidizing" other elements (or components) that can be removed (e.g., by converting them to gases (or gases)), leaving carbon fibers with a relatively high carbon content. Other methods of making carbon fibers are also possible, for example, as described in detail in this disclosure.

[0071] Carbon fibers may, in some instances, also exhibit a substantial orientation (or sequence or alignment) of C—C bonds within the carbon fiber. For example, at least 50%, at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90% or at least 95% of the carbon fibers may exhibit substantial orientation (or alignment) of C-C bonds. Such orientation (or sequence or alignment) can be determined, for example, using wide angle x-ray diffraction (WAXD) or other techniques known to those skilled in the art.

[0072] In one set of embodiments, the carbon fibers (or other discontinuous fibers (or non-continuous fibers)) may have a relatively high modulus (tensile modulus (or tensile modulus), which is a measure of hardness (or rigidity or stiffness)). Typically, higher modulus fibers are stiffer and lighter than lower modulus fibers. Carbon fibers typically have a higher modulus when the force is applied parallel to the fiber, i.e., they are anisotropic. In some embodiments, the modulus of a carbon fiber (or other discontinuous or non-continuous fiber) (e.g., when a force is applied parallel to the fiber) can be at least 100 GPa, at least 200 GPa, at least 300 GPa, at least 400 GPa, at least 500 GPa, at least 600 GPa, at least 700 GPa, etc. It is believed that more flexible carbon fibers may exhibit less orientation. That is, carbon fibers with a lower modulus may have a finer physical response to a magnetic field. Alternatively, they may not respond, rather than orient, to an applied magnetic field.

[0073] In one set of embodiments, when free-floating in a liquid (e.g., water, oil, polymer resin, polymer melt, metal melt, alcohol (e.g., ethanol), or another volatile organic compound) and subjected to a magnetic field, carbon fibers (or other discontinuous fibers) may exhibit an anisotropic diamagnetic response. For example, in some cases, upon application of an appropriate magnetic field, carbon fibers may become oriented (or aligned or aligned) (i.e., an indicator of a diamagnetic response). In some cases, the magnetic field may be at least 100 mT, at least 200 mT, at least 300 mT, at least 500 mT, at least 750 mT, at least 1 T, at least 1.5 T, at least 2 T, at least 3 T, at least 4 T, at least 5 T, at least 10 T, etc. In some cases, upon application of an appropriate magnetic field, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, at least 80%, or at least 90% of the free-floating carbon fibers in the liquid may exhibit orientation.

[0074] Typically, a fiber has a shape such that one orthogonal dimension (eg, its length) is substantially greater than the other two orthogonal dimensions (eg, its width or thickness). The fibers may, in some cases, be substantially cylindrical (or cylindrical). As noted, carbon fibers may be relatively stiff in some cases, but they need not be perfectly straight (e.g., their length may be determined along the fiber itself, even if it is curved).

[0075] As noted, in one set of embodiments, particles such as magnetic particles can be added, for example, to orient (or align or arrange) discontinuous (or non-continuous) fibers or for other uses (or applications). Such particles may be adsorbed (or absorbed) or otherwise attached (or bonded) to at least a portion of the discrete (or non-continuous) fibers. In some cases, the particles may coat (or cover) some or all of the discontinuous fibers (or non-continuous fibers) and / or the continuous fibers (or continuous fibers). This may be facilitated by a coating of material as described in this disclosure, although a coating is not necessary to facilitate particle adsorption.

[0076] If the particles are magnetic, they may comprise any of a wide range of magnetically susceptible materials. For example, the magnetic material may include one or more ferromagnetic materials, such as iron, nickel, cobalt, alnico, iron oxide, nickel oxide, cobalt oxide, rare earth metals (or rare earth metal oxides), or may include alloys (including two or more of these), and / or other suitable ferromagnetic materials. In some cases, the relative permeability (or relative permeability) of the magnetic particles may be at least 2, at least 5, at least 10, at least 20, at least 40, at least 100, at least 200, at least 500, at least 1000, at least 2000, at least 5000, or at least 10000.

[0077] However, it should be understood that not all of the particles are necessarily magnetic. In some cases, for example, non-magnetic particles (or particles that are not magnetic) may be used in addition to and / or in place of magnetic particles. Non-limiting examples of non-magnetic particles (or non-magnetic particles) include glass (or glasses), polymers, metals, and the like. Additionally, in some embodiments, there are no particles present.

[0078] The particles, if present, may or may not be spherical and may have any suitable shape or size. The particles may be relatively monodisperse (or monodisperse), or may range in size (or dimension). In some cases, the characteristic size (or size or dimension) (or characteristic size or characteristic dimension) of the particles may be, on average (or average), at least 10 micrometers (μm), at least 20 micrometers (μm), at least 30 micrometers (μm), at least 50 micrometers (μm), at least 100 micrometers (μm), at least 200 micrometers (μm), at least 300 micrometers (μm), at least 500 micrometers (μm), at least 1 mm, at least 2 mm, at least 3 mm, at least 5 mm, at least 1 cm, at least 1.5 cm, at least 2 cm, at least 3 cm, at least 5 cm, at least 10 cm, etc. Also, the mean (or average) characteristic size (or size or dimension) (or characteristic size or characteristic dimension) of the particles may be 10 cm or less, 5 cm or less, 3 cm or less, 2 cm or less, 1.5 cm or less, 1 cm or less, 5 mm or less, 3 mm or less, 2 mm or less, 1 mm or less, 500 micrometers (μm) or less, 300 micrometers (μm) or less, 200 micrometers (μm) or less, 100 micrometers (μm) or less, 50 micrometers (μm) or less, 30 micrometers (μm) or less, 20 micrometers (μm) or less, 10 micrometers (μm) or less, etc. Any combination of these ranges is also possible. For example, the characteristic size (or size or dimension) (or characteristic size or characteristic dimension) of the particle may exhibit a size between 100 micrometers (μm) and 1 mm, between 10 micrometers (μm) and 10 micrometers, etc. The characteristic size (or size or dimension) of a non-spherical particle (or non-spherical particle) may be calculated as the diameter (or diameter) of a perfect sphere (or perfect sphere) having the same volume (or capacity or capacity or volume) as the non-spherical particle (or non-spherical particle).

[0079] Additionally, in some embodiments, the substrate may further comprise, for example, fillers or additional materials in addition to the discontinuous fibers. For example, in one set of example embodiments, the substrate comprises a plurality of continuous fibers. A continuous fiber (or continuous fiber) may have a length that is, on average, substantially greater than the cross-sectional size (or size or dimension) of a discontinuous fiber (or non-continuous fiber). For example, the average length of the continuous fibers may be at least about 0.5 cm, at least 1 cm, at least 2 cm, at least 3 cm, at least 5 cm, at least 10 cm, etc. In certain embodiments, the average diameter (or mean diameter or average diameter) of the continuous fibers (or continuous fibers) may be 10 cm or less, 5 cm or less, 3 cm or less, 2 cm or less, 1 cm or less, 0.5 cm or less, etc. Any combination of these ranges is also possible. For example, the average length of the continuous fibers (or continuous fibers) may be 1 cm to 10 cm, or 10 cm to 100 cm, or the like. Also, in some cases, larger average lengths are possible.

[0080] The continuous fibers (or continuous fibers) may both be woven (or woven) (e.g., bidirectional, multidirectional, quasi-isotropic, etc.) and / or non-woven (e.g., unidirectional, veil, mat, etc.). In certain embodiments, at least a portion of the continuous fibers are oriented substantially parallel and / or perpendicular to one another, although other configurations of the continuous fibers are possible. In certain embodiments, continuous fibers (or continuous fibers) together may define (or define or constitute) a fabric (or cloth) or other substrate (e.g., textile, tow, filament, yarn, strand, etc.). In some cases, a substrate may have one orthogonal dimension that is substantially smaller than the other orthogonal dimension, i.e., the substrate may have a thickness. Furthermore, the continuous fibers may comprise any of a wide variety of materials. The substrate may include one or more types of fibers. Non-limiting examples include carbon, basalt, silicon carbide, aramid, zirconia, nylon, boron, alumina, silica, borosilicate, mullite, cotton, or any other natural or synthetic fiber.

[0081] In some cases, continuous fibers may comprise a relatively large portion of a composite. For example, in certain embodiments, the continuous fibers may comprise at least 1%, at least 2%, at least 3%, at least 4%, at least 5%, at least 7%, at least 10%, at least 15%, at least 20%, at least 25%, at least 30%, at least 35%, at least 40%, at least 45%, at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, or at least 97% (by mass or volume) of the composite. In some cases, the continuous fibers comprise 97% or less, 95% or less, 90% or less, 85% or less, 80% or less, 70% or less, 60% or less, 50% or less, 40% or less, 30% or less, 20% or less, or 10% or less (by mass or volume) of the composite. Any combination of these ranges is also possible.

[0082] In some cases, one or more fillers may be present in the base (or substrate). For example, in certain embodiments, the substrate may further comprise one or more ceramics (eg, boron nitride, alumina, titania, etc.). Additionally, in some embodiments, the base (or substrate) may further comprise one or more metals (eg, aluminum, copper, silver, tin, gold, etc.). Furthermore, in one embodiment, such a material is present in a substrate, and can be formed by, for example, fusing particles together during the formation of the substrate. Also, other materials may, in some cases, be present in the base (or substrate) as well.

[0083] As noted, certain embodiments generally relate to compositions that include, for example, a plurality of discontinuous fibers and a metal (e.g., solder) or other material (e.g., as described in this disclosure). In some cases, the composition may be generally planar and / or include one (or more than one) substrate (or base material or substrate). However, it should be understood that the substrate or composition need not be a mathematically perfect, planar structure, although, for example, the substrate or composition may be deformable, curved, bent, folded, rolled, creased, etc. For example, the substrate (or base material or substrate) may have a mean (or average) thickness of at least about 0.1 micrometer (μm), at least about 0.2 micrometer (μm), at least about 0.3 micrometer (μm), at least about 0.5 micrometer (μm), at least about 1 micrometer (μm), at least about 2 micrometers (μm), at least about 3 micrometers (μm), at least about 5 micrometers (μm), at least about 10 micrometers (μm), at least about 30 micrometers (μm), at least about 50 micrometers (μm), at least about 100 micrometers (μm), at least about 300 micrometers (μm), at least about 500 micrometers (μm), at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 5 mm, at least about 1 cm, at least about 3 cm, at least about 5 cm, at least about 10 cm, at least about 30 cm, at least about 50 cm, at least about 100 cm, etc. In certain cases, the mean (or average) thickness of the substrate (or base material or substrate) may be less than 100 cm, less than 50 cm, less than 30 cm, less than 10 cm, less than 5 cm, less than 3 cm, less than 1 cm, less than 5 mm, less than 2 mm, less than 3 mm, less than 1 mm, less than 500 micrometers (μm), less than 300 micrometers (μm), less than 100 micrometers (μm), less than 50 micrometers (μm), less than 30 micrometers (μm), less than 10 micrometers (μm), less than 5 micrometers (μm), less than 3 micrometers (μm), less than 1 micrometer (μm), less than 0.5 micrometers (μm), less than 0.3 micrometers (μm), or less than 0.1 micrometers (μm). In certain embodiments, any combination of these ranges is possible. For example, the average thickness may be 0.1 to 5000 microns (μm), 10 to 2000 microns (μm), or 50 to 1000 microns (μm). The thickness may be uniform or non-uniform (or may not be uniform) across the substrate. The substrate (or base or substrate) may also be deformable in some cases.

[0084] In certain embodiments, the basis weight (or area weight) of the composition is at least 50 g / m 2 of the composition. 2 In some embodiments, the amount of the composition may be at least 100 g / m 2 , at least 150g / m 2 , at least 200g / m 2 , at least 250g / m 2 , at least 300g / m 2 , at least 400g / m 2 , at least 500g / m 2 , at least 750g / m 2 , at least 1000g / m 2It may be. Those skilled in the art will understand that the area refers to the bulk or overall area of ​​the composition, and not the individual areas of any discrete fibers (or non-continuous fibers) that may be present.

[0085] The composition (or composition or composition) may in some cases include, for example, additional layers or materials in addition to these. For example, the substrate may be one of several layers within the composition. Other layers within the composition may include polymers, composites, metals, ceramics, and the like. For example, the composition may be combined with another layer to form a composite structure.

[0086] Certain embodiments generally relate to systems and methods for producing compositions such as those described in this disclosure. In one set of embodiments, such compositions can be prepared from a liquid. The liquid may be, for example, a slurry, a solution, an emulsion, or the like. The liquid may include discontinuous fibers (or non-continuous fibers) (such as those described in this disclosure). The fibers may then be oriented (or arranged or aligned) (as described in this disclosure), and the liquid may then be removed to, for example, create (or form or produce or manufacture) a fiber-containing substrate. After orientation (or arrangement or alignment), the final composition may be formed (or produced or manufactured), for example, by applying heat and / or pressure to remove the liquid.

[0087] In one set of embodiments, the liquid can neutralize electrostatic interactions between the discontinuous fibers, for example, using an aqueous liquid. Such liquids may be useful, for example, to disperse discontinuous fibers at relatively high fiber volumes without agglomeration. In some cases, surfactants and / or alcohols can be introduced into the slurry to reduce electrostatic interactions (or electrostatic interactions or electrostatic interactions) between the fibers. High shear mixing and flow may also be helpful in certain cases to reduce agglomeration / coagulation.

[0088] In some embodiments, the liquid phase may include, for example, a thermoplastic or a thermoset (e.g., a thermoplastic solution, a thermoplastic melt, a thermoset, a volatile organic compound, water, or an oil). Non-limiting examples of thermosets (or thermosetting materials or thermosets or thermosets) include phenolics, epoxies, bismaleimides, cyanate esters, polyimides, and the like. Non-limiting examples of elastomers include silicone rubber and styrene-butadiene rubber. Non-limiting examples of thermoplastics (or thermoplastics or thermoplastics or thermoplastics) include epoxies, polyesters, vinyl esters, polycarbonates, polyamides (e.g., nylon, PA-6, PA-12, etc.), polyphenylene sulfides, polyetherimides, polyetheretherketones, polyetherketoneketones, etc. Non-limiting examples of ceramic monomers include siloxanes, silazanes, or carbosilanes. In some cases, for example, one or more of these may be added to aid in the homogeneous dispersion of discontinuous fibers in a liquid. Examples of volatile organic compounds include, but are not limited to, isopropanol, butanol, ethanol, acetone, toluene, or xylene.

[0089] Any suitable amount of discontinuous fibers (or non-continuous fibers) may be present in the slurry or other liquid (or fluid). For example, at least 10%, at least 15%, at least 20%, at least 25%, at least 30%, at least 35%, at least 40%, at least 45%, at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, or at least 80% (by volume) of the slurry can be discontinuous fibers (or non-continuous fibers). In some cases, up to 85%, up to 80%, up to 75%, up to 70%, up to 65%, up to 60%, up to 55%, up to 50%, up to 45%, up to 40%, up to 35%, up to 30%, up to 25%, up to 20%, up to 15%, or up to 10% may be discontinuous (or non-continuous) fibers. Also, in some cases, any combination of these ranges is possible. For example, the slurry or other liquid may contain 70% to 80%, 75% to 85%, 50% to 90%, etc., discontinuous fibers.

[0090] For example, after preparing (or manufacturing) a slurry or other liquid, the slurry or other liquid can be applied (or spread) or exposed to a surface, for example, to form (or produce) a substrate. Any suitable method may be used to apply the slurry or other liquid to the surface. By way of non-limiting example, the liquid may be poured, coated, sprayed, or painted onto a surface, or the surface may be partially or completely immersed in the liquid. A liquid may be used to wet, cover, coat, and / or surround a surface.

[0091] A magnetic field may be applied to directly or indirectly manipulate discontinuous fibers (or non-continuous fibers) according to one set of embodiments, as described in this disclosure. Any suitable magnetic field may be applied. In some cases, the magnetic field is a constant magnetic field (or a constant magnetic field or a constant magnetic field or a constant magnetic field). In other cases, the magnetic field may change (or fluctuate or vary) over time. For example, the magnetic field may oscillate or be periodically varied in amplitude and / or direction to facilitate the manipulation of discrete components. The vibration (or oscillation) may be a sine wave (or sinusoidal wave) or another repeating waveform (eg, a square wave or a sawtooth wave). The frequency (or vibration frequency) may be, for example, at least 0.1 Hz, at least 0.3 Hz, at least 0.5 Hz, at least 1 Hz, at least 3 Hz, at least 5 Hz, at least 10 Hz, at least 30 Hz, at least 50 Hz, at least 100 Hz, at least 300 Hz, at least 500 Hz, and / or 1000 Hz or less, 500 Hz or less, 300 Hz or less, 100 Hz or less, 50 Hz or less, 30 Hz or less, 10 Hz or less, 5 Hz or less, 3 Hz or less, etc. For example, the frequency (or vibration frequency) may be 1 Hz to 500 Hz, 10 Hz to 30 Hz, 50 Hz to Hz, or the like. Furthermore, the frequency (or oscillation frequency) may be maintained substantially constant, or the frequency (or oscillation frequency) may, in some cases, vary.

[0092] The magnetic field may be constant or oscillating and may have any suitable amplitude. For example, the amplitude may be at least 0.001T, at least 0.003T, at least 0.005T, at least 0.01T, at least 0.03T, at least 0.05T, at least 0.1T, at least 0.3T, at least 0.5T, at least 1T, at least 3T, at least 5T, at least 10T, etc. The amplitude may, in some cases, be 20T or less, 10T or less, 5T or less, 3T or less, 1T or less, 0.5T or less, 0.3T or less, 0.1T or less, 0.05T or less, 0.03T or less, 0.01T or less, 0.005T or less, 0.003T or less, etc. The amplitude may also be within any combination of these values. For example, the amplitude may be 0.01T to 10T, 1T to 3T, 0.5T to 1T, or the like. The amplitude may be substantially constant, or may vary in certain embodiments, for example, within any range of these values.

[0093] In some embodiments, the direction of the magnetic field (i.e., the direction of maximum amplitude) may vary by + / -90°, + / -85°, + / -80°, + / -75°, + / -70°, + / -65°, + / -60°, + / -55°, + / -50°, + / -45°, + / -40°, + / -35°, + / -30°, + / -25°, + / -20°, + / -15°, + / -10°, or + / -5° about the average direction (or mean direction).

[0094] Many different devices are commercially available for generating suitable magnetic fields, including permanent magnets or electromagnets. In some cases, an oscillating magnetic field can be created (or generated or produced) by attaching a magnet to a rotating disk (or wheel) and rotating the disk at an appropriate speed or frequency (or vibration frequency). Non-limiting examples of permanent magnets include iron magnets, alnico magnets, rare earth magnets, and the like.

[0095] In one set of embodiments, shear flow may be used to orient (or align) or manipulate (or manipulate) discontinuous fibers (or non-continuous fibers). For example, a shear fluid may be applied to a substrate, thereby causing at least some of the discrete components to orient (e.g., in the direction of shear flow). Examples of shear fluids that can be used include water or another liquid, such as oil, alcohol (e.g., ethanol), organic solvents (e.g., isopropanol, butanol, ethanol, acetone, toluene, or xylene), etc. In certain embodiments, the shear fluid may have a viscosity (or viscosity) of at least 1 cP. Additionally, in some cases, the shear fluid may be a gas (eg, air). The linear flow rate of the shear fluid may be, for example, at least 10 mm / min, at least 20 mm / min, at least 30 mm / min, at least 50 mm / min, at least 100 mm / min, at least 200 mm / min, at least 300 mm / min, etc.

[0096] For example, in one set of embodiments, fibers may be added to a liquid (including alcohol, solvent, or resin) to form a slurry. In some cases, the slurry can be flowed to orient (or arrange or align) the fibers, for example, by using the slurry as a shear fluid (or shear fluid). However, in other cases, the slurry may first be applied to a substrate, and then a shear fluid may be used to orient the fibers.

[0097] Additionally, in some embodiments, for example, mechanical vibration may be used in addition to and / or in place of magnetic manipulation and / or shear fluid to manipulate discontinuous fibers. For example, mechanical vibration may be used to move discontinuous fibers into or on a substrate and / or to at least substantially orient (or arrange or align) discontinuous components, for example, into pores or holes in the substrate and / or within the substrate (e.g., as described herein). In one set of embodiments, application of mechanical vibration may cause movement of discontinuous fibers (or non-continuous fibers) of at least 1 micrometer (μm), at least 2 micrometers (μm), at least 3 micrometers (μm), at least 5 micrometers (μm), at least 10 micrometers (μm), at least 20 micrometers (μm), at least 30 micrometers (μm), at least 50 micrometers (μm), at least 100 micrometers (μm), at least 200 micrometers (μm), at least 300 micrometers (μm), at least 500 micrometers (μm), at least 1000 micrometers (μm), at least 2000 micrometers (μm), at least 3000 micrometers (μm), at least 5000 micrometers (μm), or at least 10000 micrometers (μm).

[0098] Furthermore, in some cases, the mechanical vibrations may change (or fluctuate or vary) over time. For example, the mechanical vibration may be periodically varied in amplitude and / or direction to facilitate manipulation of discontinuous fibers. The vibration (or oscillation) may be a sine wave or another repeating waveform (eg, a square wave or a sawtooth wave). The frequency (or vibration frequency) may be, for example, at least 0.1 Hz, at least 0.3 Hz, at least 0.5 Hz, at least 1 Hz, at least 3 Hz, at least 5 Hz, at least 10 Hz, at least 30 Hz, at least 50 Hz, at least 100 Hz, at least 300 Hz, at least 500 Hz, and / or 1000 Hz or less, 500 Hz or less, 300 Hz or less, 100 Hz or less, 50 Hz or less, 30 Hz or less, 10 Hz or less, 5 Hz or less, 3 Hz or less, etc. For example, the frequency (or vibration frequency) may be 1 Hz to 500 Hz, 10 Hz to 30 Hz, 50 Hz to Hz, or the like. Furthermore, the frequency (or oscillation frequency) may be maintained substantially constant, or the frequency (or oscillation frequency) may be varied (or changed or altered) in some cases. When applied in combination with an oscillating magnetic field, the frequencies (or oscillation frequencies) may independently be the same or different.

[0099] For example, in one set of embodiments, the discontinuous fibers (or non-continuous fibers) may be fixed (or set) or anchored (or fixed) during and / or after orientation (or arrangement or alignment) in some embodiments to inhibit or limit subsequent movement of the discontinuous fibers (or non-continuous fibers). Non-limiting examples of techniques include, but are not limited to, solidifying, curing, gelling, melting, heating, evaporating, freezing, lyophilizing or pressurizing a liquid or slurry.

[0100] In some cases, the liquid may contain relatively volatile solvents that can be removed by heating and / or evaporation (e.g., by waiting a suitable length of time or by allowing the solvent to evaporate in a fume hood or other ventilated area). Non-limiting examples of volatile solvents include isopropanol, butanol, ethanol, acetone, toluene, or xylene. Other examples of methods for removing the solvent include vacuum treatment, freeze-drying, mechanical shaking (or shaking or agitation), and the like.

[0101] In one set of embodiments, heat may be applied to the discontinuous fibers, for example, to dry the liquid or to remove some of the solvent. For example, discontinuous fibers (or non-continuous fibers) may be heated to a temperature of at least about 30°C, at least about 35°C, at least about 40°C, at least about 45°C, at least about 50°C, at least about 55°C, at least about 60°C, at least about 65°C, at least about 70°C, at least about 75°C, at least about 80°C, at least about 90°C, at least about 100°C, at least about 125°C, at least about 150°C, at least about 175°C, at least about 200°C, at least about 250°C, at least about 300°C, at least about 350°C, at least about 400°C, at least about 450°C, at least about 500°C, etc. Any suitable method for applying (or imparting) heat may be used (e.g., a thermoelectric transducer, an Ohmic heater, a Peltier device, a combustion heater, etc.). In some cases, the viscosity of a liquid can be reduced as a result of heating. For example, heating can be applied (or provided) before, during or after application of the magnetic field and / or mechanical vibration.

[0102] Thus, in one set of embodiments, the first coating may be applied to a plurality of discontinuous fibers, which may be substantially oriented or aligned as described in this disclosure. The first coating (or covering) may be applied (or coated) as a coating (or covering) and / or film (or membrane) to at least one surface or internal surface (or plane) of a plurality (or plurality of) discontinuous fibers (or non-continuous fibers), etc. The coating may include, for example, a phase change material, a polymer, or the like (eg, as described in this disclosure). In some cases, the coating may include a filler (e.g., ceramic, metal, etc.) (e.g., as described in this disclosure). For example, the coating (or covering) may be applied (or coated) to a plurality (or plurality of) discontinuous fibers (as described in this disclosure) using gravity, capillary action, heat, pressure, or the like.

[0103] Additionally, in some embodiments, a second coating may be applied to at least one surface of the composition (eg, a coating and / or film). The second coating material may comprise the same material as the first coating or a different material. The coatings can be applied as described in this disclosure, for example, by gravity, capillary action, heat, pressure, etc., and may use the same or different techniques.

[0104] Additionally, in some embodiments, materials such as metals (e.g., solder) or other materials (e.g., those described in this disclosure) may be added to the discontinuous fibers (or non-continuous fibers). A variety of techniques (eg, techniques) may be used to apply such materials. Non-limiting examples include lamination, material baths, application of heat and / or pressure, and the like. The material may be applied at any suitable time (e.g., before, during and / or after the formation (or production or manufacture) or orientation (or arrangement or alignment) of discontinuous fibers (or non-continuous fibers) to form (or produce or manufacture) a substrate. In some cases, the material may be applied as a liquid and then cured after application to the discontinuous fibers. In certain cases, at least a portion of the discontinuous fibers (or non-continuous fibers) are infiltrated or sandwiched with a material. The material may also surround at least a portion of the fibers. In some cases, at least some or all of the fibers may be embedded within the material. For example, in some embodiments, either or both ends of the fibers may be embedded within the material. Furthermore, in certain embodiments, the material may coat (or cover) at least a first side (or lateral surface or side) of a substrate (or base material or substrate) that is defined (or constituted) by discontinuous fibers (or non-continuous fibers).

[0105] Non-limiting examples of permeation techniques include those that use gravity and capillary force, whereby pressure is applied to the material to force it through discontinuous fibers, etc. Additionally, in some embodiments, heat may be applied. Further examples include, but are not limited to, hot pressing (molding), calendaring (molding), or vacuum infusion (or reduced pressure or vacuum infusion). Other techniques can also be used to apply the material. For example, in one set of embodiments, the discontinuous fibers may be immersed in a bath of material (e.g., a bath of metal or solder). Also, in some cases, the bath may be heated, for example, to a temperature such as those described in this disclosure.

[0106] However, in some cases, such materials are used to cover (or coat) all of the discontinuous (or non-continuous) fibers, or only a portion of the discontinuous (or non-continuous) fibers, e.g., it is not necessary to completely immerse or embed the discontinuous (or non-continuous) fibers within such materials (although this may be achieved in yet other embodiments). For example, in certain embodiments, at least 10%, at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, at least 80%, or at least 90% of the length of the discontinuous fibers (or non-continuous fibers) may not be in contact with the material.

[0107] In some embodiments, pressure may be applied to facilitate application of the material. Examples include, but are not limited to, hot pressing (molding), calendaring (molding), vacuum infusion (or reduced pressure or vacuum infusion), and pressure infiltration. For example, one or more air or mechanical platens may be used to apply pressure to the materials. (Furthermore, in some cases, heat may also be applied using such platens.) The applied pressure may be, for example, at least 15 psi (gauge), at least 30 psi, at least 45 psi, etc. (1 psi = 6895 Pa). In some embodiments, the pressure may be at least 100 kPa, at least 200 kPa, at least 300 kPa, at least 400 kPa, at least 500 kPa, and the like. Additionally, in some cases, pressure may be used to remove liquid from the discontinuous fibers.

[0108] In some embodiments, heat may be applied to facilitate the application of the materials. Such may be useful, for example, to partially or completely liquefy or soften the material, or to promote its flow or permeation, or to surround discontinuous or non-continuous fibers. In some cases, the material may be heated to a temperature above the melting point of the material, which may allow the material to flow around and / or permeate the discontinuous (or non-continuous) fibers.

[0109] For example, in one set of embodiments, the material may be heated to a temperature of at least 30°C, at least 40°C, at least 50°C, at least 60°C, at least 70°C, at least 80°C, at least 90°C, at least 100°C, at least 110°C, at least 120°C, at least 130°C, at least 140°C, at least 150°C, at least 160°C, at least 170°C, at least 180°C, at least 190°C, at least 200°C, at least 210°C, at least 220°C, at least 230°C, at least 240°C, at least 250°C, etc.

[0110] Additionally, in certain embodiments, for example, the materials may be surrounded by an inert gas (e.g., nitrogen, argon, etc.) when applying heat and / or pressure.

[0111] In another set of embodiments, the metal may be added using a vapor deposition process (e.g., chemical vapor deposition, physical vapor deposition, thermal chemical vapor deposition, electrothermal induced deposition, etc.). In some cases, heat may be applied, for example, by current-induced Joule heating.

[0112] In one embodiment, for example, the compositions described in this disclosure can be used to transfer heat between a first location (e.g., a heat source) and a second location (e.g., a heat sink or cooling device). The heat source may be any suitable source of heat. For example, in one embodiment, the heat source may be a semiconductor device (e.g., a semiconductor device for use in a computer or other electronic device). The semiconductor device may be, for example, a CPU, a GPU, a RAM module, a power transistor, a laser, a light emitting diode, a solar cell (or a photovoltaic cell), or the like. In some embodiments, other heat sources may be used as well. For example, in one embodiment, the heat source may include a chemical reaction or an electrical system (eg, resistive heating).

[0113] A heat sink or cooling device (or cooling device) may be any device capable of dissipating heat. By way of non-limiting example, the heat sink may include a fluid medium (e.g., air or a liquid). For example, the heat sink may include a fan to blow air to cool the device, or a pump to apply a liquid coolant. In some cases, the heat sink may include fins that allow a fluid to pass through them, thereby transferring heat to the fluid (which can occur in the heat sink). The fins may have any shape, including, for example, pin-like fins, straight fins, flared fins, slanted fins, and the like. The fins may have any suitable cross-section, including cylindrical, elliptical, square, etc. cross-sections. The heat sink may comprise a material such as copper, aluminum, or other metals having a relatively high thermal conductivity.

[0114] As described, the composition can be used to assist in thermal communication from a first location to a second location. The composition may be placed (or positioned) in direct physical contact with either or both of a heat source and a cooling device, and / or other materials may be present that help facilitate the transport of heat from the heat source to the cooling device. Non-limiting examples include thermal tape (e.g., polyimide, graphite, aluminum, etc.), epoxy, grease, solder, silicone coated fabric, or other thermal interface material.

[0115] The following documents are incorporated by reference in their entirety into this disclosure: International Publication WO2018 / 175134, Title: "Fiber-Reinforced Composites, Methods Therefore And Articles Comprising The Same" International Publication WO2020 / 123334, Title: "Systems and Methods for Carbon Fiber Alignment and Fiber-Reinforced Composites" International Publication WO2021 / 007381, titled "Systems and Methods for Forming Short-Fiber Films, Composites Comprising Thermosets, and Other Composites" International Publication WO2021 / 007389, titled "Compositions and Methods for Carbon Fiber-Metal Composites" U.S. Patent Application No. 63 / 314,808, entitled "Thermally Conductive Aligned Materials and Methods of Making and Use Thereof" Additionally, U.S. Provisional Patent Application No. 63 / 398,190, filed August 15, 2022, entitled "Thermal Interface Materials Comprising Aligned Fibers and Materials Such As Solders, Alloys, and / or Other Metals," is incorporated by reference in its entirety into this disclosure.

[0116] The following examples are intended to illustrate certain embodiments of the present disclosure, but do not exemplify the full scope of the disclosure. [Example]

[0117] Example 1 In this example, we demonstrate the infiltration of carbon fiber with indium. 2-inch x 2-inch (5 cm x 5 cm) sheets of indium alloy were scraped with a steel razor blade and cleaned with isopropyl alcohol. Using a static press machine, sheets of indium (0.01 inch thick (0.254 mm thick)) were pressed together with a substrate made of oriented (or aligned) carbon fibers at 200°C for 1 hour under a reduced pressure of 120 mbar. The material was then cooled to a temperature of 45°C and then depressurized.

[0118] Infiltration of the substrate was found, with indium present along both sides of the substrate. Cross-sectional images showed at least 10% impregnation throughout the fiber, as shown in Figure 4.

[0119] Example 2 This example shows the application of a low-temperature lead-free solder flux to an indium sheet on a substrate formed from oriented (or aligned) carbon fibers, thereby demonstrating that the indium solder was able to wet the carbon fibers. A substrate formed from oriented carbon fibers was infiltrated with 0.01 inch (0.254 mm) thick indium sheets with solder flux obtained from Alpha Metals. Such infiltration is shown in FIG. 5. A nitrogen environment and static pressure (or static press) were used. The press itself had side barriers that prevented the indium from spreading. Such penetration is shown in Figures 6A and 6B.

[0120] While several embodiments of the present disclosure have been described and illustrated in this disclosure, those skilled in the art can readily envision various other means and / or structures for performing the functions and / or obtaining the results and / or one or more advantages described in the present disclosure, and each such variation and / or modification is deemed to be within the scope of the present disclosure. More generally, those skilled in the art will readily understand that all parameters, dimensions, materials, and configurations described in this disclosure are meant to be exemplary, and that the actual parameters, dimensions, materials, and / or configurations will depend on the particular use(s) for which the teaching(s) of the present disclosure are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific embodiments of the disclosure described herein. It is therefore to be understood that the above-described embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereof, the disclosure may be practiced otherwise than as specifically described and claimed. The present disclosure relates to each individual feature, system, article, material, kit, and / or method described in this disclosure. Furthermore, any combination of two or more such features, systems, articles, materials, kits and / or methods, if such features, systems, articles, materials, kits and / or methods are not mutually inconsistent, is included within the scope of the present disclosure.

[0121] In cases where the present specification and a document incorporated by reference include conflicting and / or inconsistent disclosure, the present specification shall control. If two or more documents incorporated by reference include conflicting and / or inconsistent disclosure with respect to each other, then the document having the later publication date shall control.

[0122] All definitions (or definitions or constructions) (as defined (or defined or constructed) and used in this disclosure) should be understood to take precedence over dictionary definitions (or definitions), definitions (or definitions) in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0123] As used in this disclosure, in this specification and in the claims, the indefinite articles "a" and "an" should be understood to mean "at least one," unless expressly indicated to the contrary.

[0124] As used in this disclosure, in the specification and claims, the term "and / or" should be understood to mean "either or both" of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with "and / or" should be construed in the same manner, i.e., to refer to "one or more" of the elements so conjoined. Other elements than those specifically indicated by the phrase "and / or" may optionally be present, whether related to the specifically indicated element(s). Thus, as a non-limiting example, "A and / or B," when used in conjunction with open-ended language such as "comprising," means: In one embodiment, only A (which may optionally include elements other than B), In another embodiment, only B (which may optionally contain elements other than A), In yet another embodiment, both A and B (which may optionally include other elements) It can mean, etc.

[0125] As used in this disclosure, in the specification and claims, "or" should be understood to have the same meaning as "and / or," as defined above. For example, when separating enumerated items (or items within a list), "or" or "and / or" shall be construed as inclusive, i.e., including at least one, but also one or more, of the number of elements or enumeration (or list) of elements, and further, optionally, including additional, unenumerated items. Only terms clearly indicating the contrary, such as "only one of" or "exactly one of," or "consisting of" (when used in the claims), refer to the inclusion of exactly one element of a number of elements or enumeration (or list) of elements. In general, the term "or," as used in this disclosure, when preceded by exclusive terms (such as "any of," "one of," "only one of," or "exactly one of"), shall only be construed as including exclusive alternative terms (i.e., one or the other but not both).

[0126] As used in this disclosure, in the specification and claims, the phrase "at least one" (in reference to a list of one or more elements) should be understood to mean at least one element selected from any one or more elements in the list of elements, but not necessarily including at least one of each and every element specifically listed in the list of elements, and does not exclude any combination of elements in the list of elements. Such a provision (or definition) also allows that other elements may optionally be present than those specifically indicated in the enumeration (or list) of elements (or elements) followed by the expression "at least one," whether related to the specifically indicated element (or elements). Thus, as a non-limiting example, "at least one of A and B" (or, equivalently, "at least one of A or B" or, equivalently, "at least one of A and / or B") means: In one embodiment, at least one, optionally one or more A's are included, but no B's are included (and may optionally include elements other than B's), In another embodiment, at least one, optionally one or more Bs are included, but no A is present (and may optionally include elements other than A), In yet another embodiment, the compound may include at least one, and optionally one or more, A's, and at least one, and optionally one or more, B's (and may optionally include other elements). It can mean, etc.

[0127] In this disclosure, when the word "about" is used in connection with a number, it should be understood that further embodiments of the present disclosure include the number not modified by the presence of the word "about."

[0128] It is also to be understood that, unless expressly indicated to the contrary, in any method claimed in the present disclosure comprising one or more steps or acts, the order of the steps or acts of the method is not necessarily limited to the order in which the steps or acts of the method are described.

[0129] As in the foregoing specification, in the claims, transitional phrases such as, for example, "comprising," "including," "carrying," "having," "containing," "involving," "holding," "composed of," and the like, are all to be understood as open-ended, i.e., to mean including but not limited to. As set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03, transitional phrases such as "consisting of" and "consisting essentially of" shall be closed or semi-closed transitional phrases, respectively.

Claims

1. A composition comprising a plurality of discontinuous fibers and a solder, the plurality of discontinuous fibers defining a substrate, wherein at least 30% by volume of the plurality of discontinuous fibers are substantially oriented in the substrate; The composition, wherein the solder is in contact with the plurality of discontinuous fibers.

2. The composition of claim 1 , wherein at least a portion of the solder is sandwiched between the plurality of discontinuous fibers.

3. The composition of claim 1 or 2, wherein at least a portion of the solder coats a first side of the substrate.

4. The composition of any one of claims 1 to 3, wherein at least a portion of the solder surrounds the plurality of discontinuous fibers.

5. The composition according to any one of claims 1 to 4, wherein the melting temperature of the solder is 265°C or less.

6. The composition according to any one of claims 1 to 5, wherein the melting temperature of the solder is 200°C or less.

7. The composition of any one of claims 1 to 6, wherein the solder comprises indium.

8. The composition of any one of claims 1 to 7, wherein the solder comprises a transition metal.

9. 9. The composition of claim 8, wherein the transition metal is present at least 0.1% by weight of the solder.

10. The composition of any one of claims 1 to 9, wherein the solder comprises silver.

11. The composition of any one of claims 1 to 10, wherein the solder comprises nickel.

12. The composition of any one of claims 1 to 11, wherein the transition metal comprises copper.

13. The composition of any one of claims 1 to 12, wherein the solder comprises chromium.

14. The composition of any one of claims 1 to 13, wherein the solder comprises cobalt.

15. The composition of any preceding claim, wherein the solder comprises a transition metal rich solder alloy.

16. The composition of any preceding claim, wherein the solder comprises an oxide-coated liquid metal.

17. The composition of any preceding claim, wherein the solder comprises an oxide-coated liquid metal transition metal rich solder alloy.

18. The composition of any preceding claim, wherein the solder comprises a thermal chemical vapor deposition solder.

19. The composition of any one of claims 1 to 18, further comprising a solder flux in contact with the solder.

20. The composition of any one of claims 1 to 19, wherein the plurality of discontinuous fibers comprises carbon fibers.

21. 21. The composition of claim 20, wherein the carbon content of the carbon fibers is greater than 94% and the modulus of the carbon fibers is at least 200 GPa.

22. The composition of any one of claims 1 to 21, further comprising a carbide in contact with the solder.

23. 23. The composition of claim 22, wherein the carbide comprises a transition metal rich solder alloy carbide.

24. 24. The composition of claim 22 or 23, wherein the carbide comprises nickel carbide.

25. The composition of any one of claims 22 to 24, wherein the carbide comprises chromium carbide.

26. The composition of any one of claims 22 to 25, wherein the carbide comprises cobalt carbide.

27. The composition of any one of claims 1 to 26, wherein at least 30% of the length of the discontinuous fibers is in contact with the solder.

28. The composition of any one of claims 1 to 27, wherein at least 50% of the length of the discontinuous fibers is in contact with the solder.

29. The composition of any one of claims 1 to 28, wherein at least 70% of the length of the discontinuous fibers is in contact with the solder.

30. The composition of any one of claims 1 to 29, wherein at least 50% by volume of the discontinuous fibers in the substrate are substantially oriented.

31. The composition of any one of claims 1 to 30, wherein at least 80% by volume of the discontinuous fibers in the substrate are substantially oriented.

32. 32. The composition of any one of claims 1 to 31, wherein the orientation of the at least 50 volume percent of the discontinuous fibers is within 45 degrees of the average orientation of the plurality of discontinuous fibers.

33. 33. The composition of any one of claims 1 to 32, wherein the orientation of the at least 50 volume percent of the discontinuous fibers is within 20 degrees of the average orientation of the plurality of discontinuous fibers.

34. 34. The composition of any one of claims 1 to 33, wherein the orientation of the at least 50 volume percent of the discontinuous fibers is within 10 degrees of the average orientation of the plurality of discontinuous fibers.

35. 35. The composition of any one of claims 1 to 34, wherein the orientation of the at least 50 volume percent of the discontinuous fibers is within 5 degrees of the average orientation of the plurality of discontinuous fibers.

36. The composition of any one of claims 1 to 35, having an overall thermal conductivity of at least 30 W / mK.

37. The composition of any one of claims 1 to 36, having an overall thermal conductivity of at least 50 W / mK.

38. The composition of any one of claims 1 to 37, having an overall thermal conductivity of at least 100 W / mK.

39. The composition of any one of claims 1 to 38, having an overall thermal conductivity of at least 500 W / mK.

40. The composition of any one of claims 1 to 39, having an overall thermal conductivity of at least 750 W / mK.

41. The composition of any one of claims 1 to 40, which exhibits anisotropic thermal conductivity.

42. The composition of any one of claims 1 to 41, wherein the substrate further comprises a thermoplastic.

43. The composition of any one of claims 1 to 42, wherein the substrate further comprises a thermosetting material.

44. The composition of any one of claims 1 to 43, wherein the substrate further comprises a plurality of continuous fibers.

45. The composition of any one of claims 1 to 44, wherein the substrate further comprises a ceramic.

46. The composition of any one of claims 1 to 45, wherein the substrate further comprises boron nitride.

47. The composition of any one of claims 1 to 46, wherein the substrate further comprises alumina.

48. The composition of any one of claims 1 to 47, wherein the substrate further comprises titania.

49. The composition of any one of claims 1 to 48, wherein the substrate further comprises a substrate metal.

50. 50. The composition of claim 49, wherein the substrate metal comprises aluminum.

51. 51. The composition of claim 49 or 50, wherein the substrate metal comprises copper.

52. The composition of any one of claims 49 to 51, wherein the substrate metal comprises silver.

53. The composition of any one of claims 49 to 52, wherein the substrate metal comprises tin.

54. The composition of any one of claims 49 to 53, wherein the substrate metal comprises gold.

55. The composition of any one of claims 1 to 54, wherein the plurality of discontinuous fibers comprises polymeric fibers.

56. 56. The composition of any one of the preceding claims, wherein the plurality of discontinuous fibers comprises one or more of basalt, silicon carbide, aramid, zirconia, nylon, boron, alumina, silica, borosilicate, and / or mullite fibers.

57. The composition of any one of claims 1 to 56, wherein the plurality of discontinuous fibers comprises natural fibers.

58. 58. The composition of any one of claims 1 to 57, wherein the plurality of discontinuous fibers have an average length of at least 20 micrometers.

59. 59. The composition of any one of claims 1 to 58, wherein the plurality of discontinuous fibers have an average length:diameter aspect ratio of at least 5.

60. 60. The composition of any one of claims 1 to 59, wherein at least a portion of the discontinuous fibers are covered with a coating.

61. 61. The composition of claim 60, wherein the coating comprises a surfactant, a silane coupling agent, an epoxy, a glycerin, a polyurethane, and / or an organometallic coupling agent.

62. The composition of any one of claims 1 to 61, wherein at least a portion of the discontinuous fibers are coated with a sizing agent.

63. 63. The composition of any one of claims 1 to 62, wherein at least some of the discontinuous fibers exhibit a physical response to a magnetic field strength of 10 T.

64. 64. The composition of any one of claims 1 to 63, wherein at least a portion of the plurality of discontinuous fibers comprises a plurality of magnetic particles, the magnetic particles being adsorbed to the fibers.

65. 65. The composition of any one of claims 1 to 64, wherein the plurality of discontinuous fibers does not include magnetic particles.

66. 66. The composition of any one of claims 1 to 65, which is substantially free of paramagnetic or ferromagnetic materials.

67. The basis weight of the composition is at least 100 g / m ２ The composition of any one of claims 1 to 66, wherein

68. 68. A device comprising the composition of any one of claims 1 to 67, said composition being in thermal communication with a heat source and a cooling device.

69. A composition comprising a plurality of discontinuous fibers and a metal, the plurality of discontinuous fibers defining a substrate, wherein at least 30% by volume of the plurality of discontinuous fibers are substantially oriented in the substrate; The composition, wherein the metal is in contact with the plurality of discontinuous fibers, and the melting temperature of the metal is 265°C or less.

70. 70. The composition of claim 69, wherein the metal comprises a solder.

71. 71. The composition of claim 70, wherein the solder comprises a transition metal rich solder alloy.

72. 72. The composition of claim 70 or 71, wherein the solder comprises an oxide-coated liquid metal.

73. 73. The composition of any one of claims 70 to 72, wherein the solder comprises an oxide-coated liquid metal transition metal rich solder alloy.

74. The composition of any one of claims 69 to 73, wherein the metal comprises a thermal chemical vapor deposited metal.

75. 75. The composition of any one of claims 69 to 74, wherein the metal is contained in a conductive medium.

76. 76. The composition of any one of claims 69 to 75, wherein at least a portion of the metal is sandwiched between the plurality of discontinuous fibers.

77. 77. The composition of any one of claims 69 to 76, wherein at least a portion of the metal coats a first side of the substrate.

78. 78. The composition of any one of claims 69 to 77, wherein at least a portion of the metal surrounds the plurality of discontinuous fibers.

79. The composition according to any one of claims 69 to 78, wherein the melting temperature of the metal is 200°C or less.

80. The composition of any one of claims 69 to 79, wherein the metal comprises a transition metal rich solder alloy.

81. 81. The composition of any one of claims 69 to 80, wherein the metal comprises nickel.

82. 82. The composition of any one of claims 69 to 81, wherein the metal comprises chromium.

83. 83. The composition of any one of claims 69 to 82, wherein the metal comprises cobalt.

84. The composition of any one of claims 69 to 83, further comprising a solder flux in contact with the metal.

85. 85. The composition of any one of claims 69 to 84, wherein the plurality of discontinuous fibers comprises carbon fibers.

86. 86. The composition of claim 85, wherein the carbon content of the carbon fibers is greater than 94% and the modulus of the carbon fibers is at least 200 GPa.

87. 87. The composition of any one of claims 69 to 86, further comprising a carbide in contact with the metal.

88. 88. The composition of claim 87, wherein the carbide comprises a transition metal carbide.

89. 89. The composition of claim 87 or 88, wherein the carbide comprises nickel carbide.

90. 90. The composition of any one of claims 87 to 89, wherein the carbide comprises chromium carbide.

91. 91. The composition of any one of claims 87 to 90, wherein the carbide comprises cobalt carbide.

92. 92. The composition of any one of claims 69 to 91, wherein at least 30% of the length of the discontinuous fibers is in contact with the metal.

93. 93. The composition of any one of claims 69 to 92, wherein at least 50% of the length of the discontinuous fibers is in contact with the metal.

94. 94. The composition of any one of claims 69 to 93, wherein at least 70% of the length of the discontinuous fibers is in contact with the metal.

95. 95. The composition of any one of claims 69 to 94, wherein at least 50% by volume of the fibers in the substrate are substantially oriented.

96. 96. The composition of any one of claims 69 to 95, wherein an orientation of the at least 50 volume percent of the discontinuous fibers is within 45 degrees of an average orientation of the plurality of discontinuous fibers.

97. 97. The composition of any one of claims 69 to 96, having an overall thermal conductivity of at least 30 W / mK.

98. The composition of any one of claims 69 to 97, exhibiting anisotropic thermal conductivity.

99. 99. A device comprising the composition of any one of claims 69 to 98, said composition being in thermal communication with a heat source and a cooling device.

100. A composition comprising a plurality of discontinuous fibers and a metal, the plurality of discontinuous fibers defining a substrate, wherein at least 30% by volume of the plurality of discontinuous fibers are substantially oriented in the substrate; The composition, wherein the metal is in contact with the plurality of discontinuous fibers, and the plurality of discontinuous fibers are more thermally conductive than the metal.

101. 101. The composition of claim 100, wherein the metal comprises a solder.

102. 102. The composition of claim 101, wherein the solder comprises a transition metal rich solder alloy.

103. 103. The composition of claim 101 or 102, wherein the solder comprises an oxide-coated liquid metal.

104. The composition of any one of claims 101 to 103, wherein the solder comprises an oxide-coated liquid metal transition metal rich solder alloy.

105. The composition of any one of claims 100 to 104, wherein the metal comprises a thermal chemical vapor deposited metal.

106. The composition of any one of claims 100 to 105, wherein the metal is contained in a conductive medium.

107. 107. The composition of any one of claims 100 to 106, wherein at least a portion of the metal is sandwiched between the plurality of discontinuous fibers.

108. The composition of any one of claims 100 to 107, wherein at least a portion of the metal coats a first side of the substrate.

109. 109. The composition of any one of claims 100-108, wherein at least a portion of the metal surrounds the plurality of discontinuous fibers.

110. The composition according to any one of claims 100 to 109, wherein the melting temperature of the metal is 265°C or less.

111. The composition according to any one of claims 100 to 110, wherein the melting temperature of the metal is 200°C or less.

112. The composition of any one of claims 100 to 111, wherein the metal comprises nickel.

113. 113. The composition of any one of claims 100 to 112, wherein the metal comprises chromium.

114. The composition of any one of claims 100 to 113, wherein the metal comprises cobalt.

115. The composition of any one of claims 100 to 114, further comprising a solder flux in contact with the metal.

116. 116. The composition of any one of claims 100-115, wherein the plurality of discontinuous fibers comprises carbon fibers.

117. 117. The composition of claim 116, wherein the carbon content of the carbon fibers is greater than 94% and the modulus of the carbon fibers is at least 200 GPa.

118. 118. The composition of any one of claims 100 to 117, further comprising a carbide in contact with the metal.

119. 119. The composition of claim 118, wherein the carbide comprises a transition metal carbide.

120. 120. The composition of claim 118 or 119, wherein the carbide comprises nickel carbide.

121. The composition of any one of claims 118 to 120, wherein the carbide comprises chromium carbide.

122. 122. The composition of any one of claims 118 to 121, wherein the carbide comprises cobalt carbide.

123. 123. The composition of any one of claims 100 to 122, wherein at least 30% of the length of the discontinuous fibers is in contact with the metal.

124. 124. The composition of any one of claims 100 to 123, wherein at least 50% of the length of the discontinuous fibers is in contact with the metal.

125. 125. The composition of any one of claims 100 to 124, wherein at least 70% of the length of the discontinuous fibers is in contact with the metal.

126. 126. The composition of any one of claims 100 to 125, wherein at least 50% by volume of the fibers in the substrate are substantially oriented.

127. 127. The composition of any one of claims 100-126, wherein the orientation of at least 50 volume percent of the discontinuous fibers is within 45 degrees of the average orientation of the plurality of discontinuous fibers.

128. 128. The composition of any one of claims 100 to 127, having an overall thermal conductivity of at least 30 W / mK.

129. The composition of any one of claims 100 to 128, which exhibits anisotropic thermal conductivity.

130. 130. A device comprising the composition of any one of claims 100-129, said composition being in thermal communication with a heat source and a cooling device.

131. A composition comprising a plurality of discontinuous fibers and a carbide, the plurality of discontinuous fibers defining a substrate, wherein at least 30% by volume of the discontinuous fibers in the substrate are substantially oriented; The composition, wherein the carbide is in contact with the plurality of discontinuous fibers.

132. 132. The composition of claim 131, wherein the carbide comprises a metal carbide.

133. 133. The composition of claim 131 or 132, wherein the carbide comprises a transition metal carbide.

134. The composition of any one of claims 131 to 133, wherein the carbide comprises nickel carbide.

135. The composition of any one of claims 131 to 134, wherein the carbide comprises chromium carbide.

136. 136. The composition of any one of claims 131 to 135, wherein the carbide comprises cobalt carbide.

137. 137. The composition of any one of claims 131 to 136, wherein the plurality of discontinuous fibers comprises carbon fibers.

138. 138. The composition of claim 137, wherein the carbon content of the carbon fibers is greater than 94% and the modulus of the carbon fibers is at least 200 GPa.

139. The composition of any one of claims 131 to 138, wherein the carbide is adjacent to a metal.

140. 140. The composition of claim 139, wherein the metal comprises solder.

141. 141. The composition of claim 140, wherein the solder comprises a transition metal-rich solder alloy.

142. The composition of any one of claims 140 to 141, wherein the solder comprises an oxide-coated liquid metal.

143. The composition of any one of claims 140 to 142, wherein the solder comprises an oxide-coated liquid metal transition metal rich solder alloy.

144. The composition of any one of claims 139 to 143, wherein the metal comprises a thermal chemical vapor deposited metal.

145. The composition of any one of claims 139 to 144, wherein the metal is contained in a conductive medium.

146. 146. The composition of any one of claims 131 to 145, wherein at least 50% by volume of the fibers in the substrate are substantially oriented.

147. 147. The composition of any one of claims 131 to 146, wherein the orientation of at least 50 volume percent of the discontinuous fibers is within 45 degrees of the average orientation of the plurality of discontinuous fibers.

148. 148. The composition of any one of claims 131 to 147, having an overall thermal conductivity of at least 30 W / mK.

149. The composition of any one of claims 131 to 148, exhibiting anisotropic thermal conductivity.

150. 150. A device comprising the composition of any one of claims 131-149, said composition being in thermal communication with a heat source and a cooling device.

151. A composition comprising a plurality of discontinuous fibers and a metal, the plurality of discontinuous fibers defining a substrate, wherein at least 30% by volume of the discontinuous fibers in the substrate are substantially oriented; The composition, wherein the metal is in contact with the plurality of discontinuous fibers, and the plurality of discontinuous fibers and the metal together have an internal void volume of 20% or less.

152. 152. The composition of claim 151, wherein the metal comprises solder.

153. 153. The composition of claim 152, wherein the solder comprises a transition metal rich solder alloy.

154. 154. The composition of claim 152 or 153, wherein the solder comprises an oxide-coated liquid metal.

155. The composition of any one of claims 152 to 154, wherein the solder comprises an oxide-coated liquid metal transition metal rich solder alloy.

156. The composition of any one of claims 151 to 155, wherein the metal comprises a thermal chemical vapor deposited metal.

157. 157. The composition of any one of claims 151 to 156, wherein the metal is contained in a conductive medium.

158. 158. The composition of any one of claims 151 to 157, wherein at least a portion of the metal is sandwiched between the plurality of discontinuous fibers.

159. The composition of any one of claims 151 to 158, wherein at least a portion of the metal coats a first side of the substrate.

160. 160. The composition of any one of claims 151 to 159, wherein at least a portion of the metal surrounds the plurality of discontinuous fibers.

161. The composition of any one of claims 151 to 160, wherein the melting temperature of the metal is 265°C or less.

162. The composition of any one of claims 151 to 161, wherein the melting temperature of the metal is 200°C or less.

163. 163. The composition of any one of claims 151 to 162, wherein the metal comprises nickel.

164. 164. The composition of any one of claims 151 to 163, wherein the metal comprises chromium.

165. 165. The composition of any one of claims 151 to 164, wherein the metal comprises cobalt.

166. The composition of any one of claims 151 to 165, further comprising a solder flux in contact with the metal.

167. 167. The composition of any one of claims 151 to 166, wherein the plurality of discontinuous fibers comprises carbon fibers.

168. 168. The composition of claim 167, wherein the carbon content of the carbon fibers is greater than 94% and the modulus of the carbon fibers is at least 200 GPa.

169. 169. The composition of any one of claims 151 to 168, further comprising a carbide in contact with the metal.

170. 170. The composition of claim 169, wherein the carbide comprises a transition metal carbide.

171. 171. The composition of claim 169 or 170, wherein the carbide comprises nickel carbide.

172. 172. The composition of any one of claims 169 to 171, wherein the carbide comprises chromium carbide.

173. 173. The composition of any one of claims 169 to 172, wherein the carbide comprises cobalt carbide.

174. 174. The composition of any one of claims 151 to 173, wherein at least 30% of the length of the discontinuous fibers is in contact with the metal.

175. 175. The composition of any one of claims 151 to 174, wherein at least 50% of the length of the discontinuous fibers is in contact with the metal.

176. 176. The composition of any one of claims 151 to 175, wherein at least 70% of the length of the discontinuous fibers is in contact with the metal.

177. 177. The composition of any one of claims 151 to 176, wherein at least 50% by volume of the fibers in the substrate are substantially oriented.

178. 178. The composition of any one of claims 151 to 177, wherein the orientation of at least 50 volume percent of the discontinuous fibers is within 45 degrees of the average orientation of the plurality of discontinuous fibers.

179. 179. The composition of any one of claims 151 to 178, having an overall thermal conductivity of at least 30 W / mK.

180. 180. The composition of any one of claims 151 to 179, exhibiting anisotropic thermal conductivity.

181. 181. A device comprising the composition of any one of claims 151-180, wherein the composition is in thermal communication with a heat source and a cooling device.

182. 1. A method, comprising the steps of: providing a plurality of discontinuous fibers, the discontinuous fibers defining a substrate, wherein at least 30% by volume of the discontinuous fibers are substantially oriented in the substrate; exposing at least a portion of the discontinuous fibers to solder; A method comprising:

183. 183. The method of claim 182, wherein the solder comprises a transition metal rich solder alloy.

184. 184. The method of claim 182 or 183, wherein the solder comprises an oxide-coated liquid metal.

185. The method of any one of claims 182 to 184, wherein the solder comprises an oxide-coated liquid metal transition metal rich solder alloy.

186. 186. The method of any one of claims 182 to 185, wherein exposing at least a portion of the discontinuous fibers to solder comprises forcing the solder between the plurality of discontinuous fibers.

187. 187. The method of any one of claims 182 to 186, comprising forcing the solder between the plurality of discontinuous fibers.

188. 188. The method of claim 187, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 30°C.

189. 189. The method of claim 187 or 188, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 50°C.

190. 190. The method of any one of claims 187 to 189, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 100°C.

191. 191. The method of any one of claims 187 to 190, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 200°C.

192. 192. The method of any one of claims 187 to 191, comprising forcing the solder between the plurality of discontinuous fibers with a pressure of at least 100 kPa.

193. 193. The method of any one of claims 187 to 192, comprising forcing the solder between the plurality of discontinuous fibers with a pressure of at least 200 kPa.

194. The method of any one of claims 182 to 193, comprising coating a first side of the substrate with the solder.

195. 195. The method of any one of claims 182 to 194, comprising at least partially surrounding the plurality of discontinuous fibers with solder.

196. A method according to any one of claims 182 to 195, wherein the melting temperature of the solder is 265°C or less.

197. A method according to any one of claims 182 to 196, wherein the melting temperature of the solder is 200°C or less.

198. 198. The method of any one of claims 182 to 197, wherein the metal comprises indium.

199. 200. The method of any one of claims 182 to 198, wherein the metal comprises nickel.

200. 200. The method of any one of claims 182 to 199, wherein the metal comprises chromium.

201. The method of any one of claims 182 to 200, wherein the metal comprises cobalt.

202. 202. The method of any one of claims 182 to 201, wherein the plurality of discontinuous fibers comprises carbon fibers.

203. 203. The method of claim 202, wherein the carbon content of the carbon fibers is greater than 94% and the modulus of the carbon fibers is at least 200 GPa.

204. 204. The method of claim 202 or 203, wherein the solder reacts with the carbon fibers to form carbide.

205. The method of any one of claims 202 to 204, wherein the carbide comprises a transition metal carbide.

206. The method of any one of claims 202 to 205, wherein the carbide comprises nickel carbide.

207. The method of any one of claims 202 to 206, wherein the carbide comprises chromium carbide.

208. The method of any one of claims 202 to 207, wherein the carbide comprises cobalt carbide.

209. 1. A method, comprising the steps of: providing a plurality of discontinuous fibers, the discontinuous fibers defining a substrate, wherein at least 30% by volume of the discontinuous fibers are substantially oriented in the substrate; forcing solder between the plurality of discontinuous fibers under heat and / or pressure; A method comprising:

210. 210. The method of claim 209, wherein the solder comprises a transition metal rich solder alloy.

211. 211. The method of claim 209 or 210, wherein the solder comprises an oxide-coated liquid metal.

212. The method of any one of claims 209 to 211, wherein the solder comprises an oxide-coated liquid metal transition metal rich solder alloy.

213. 213. The method of any one of claims 209 to 212, wherein exposing at least a portion of the discontinuous fibers to solder comprises forcing the solder between the plurality of discontinuous fibers.

214. 214. The method of claim 213, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 30°C.

215. 215. The method of claim 213 or 214, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 50°C.

216. 216. The method of any one of claims 213 to 215, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 100°C.

217. 217. The method of any one of claims 213 to 216, comprising forcing the solder between the plurality of discontinuous fibers at a temperature of at least 200°C.

218. 218. The method of any one of claims 213 to 217, comprising forcing the solder between the plurality of discontinuous fibers with a pressure of at least 100 kPa.

219. 219. The method of any one of claims 213 to 218, comprising forcing the solder between the plurality of discontinuous fibers with a pressure of at least 200 kPa.

220. 220. The method of any one of claims 209 to 219, comprising coating a first side of the substrate with the solder.

221. 221. The method of any one of claims 209 to 220, comprising at least partially surrounding the plurality of discontinuous fibers with the solder.

222. A method according to any one of claims 209 to 221, wherein the melting temperature of the solder is 265°C or less.

223. A method according to any one of claims 209 to 222, wherein the melting temperature of the solder is 200°C or less.

224. The method of any one of claims 209 to 223, wherein the metal comprises indium.

225. The method of any one of claims 209 to 224, wherein the metal comprises nickel.

226. The method of any one of claims 209 to 225, wherein the metal comprises chromium.

227. The method of any one of claims 209 to 226, wherein the metal comprises cobalt.

228. 228. The method of any one of claims 209 to 227, wherein the plurality of discontinuous fibers comprises carbon fibers.

229. 229. The method of claim 228, wherein the carbon content of the carbon fibers is greater than 94% and the modulus of the carbon fibers is at least 200 GPa.

230. 230. The method of claim 228 or 229, wherein the solder reacts with the carbon fibers to form carbide.

231. 231. The method of any one of claims 228 to 230, wherein the carbide comprises a transition metal carbide.

232. 232. The method of any one of claims 228 to 231, wherein the carbide comprises nickel carbide.

233. The method of any one of claims 228 to 232, wherein the carbide comprises chromium carbide.

234. The method of any one of claims 228 to 233, wherein the carbide comprises cobalt carbide.

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