A package structure for an optical sensor that enables sensing by receiving light in the ultraviolet wavelength band and converts ultraviolet signals into digital signals, and a manufacturing method thereof

Abstract

The present invention provides a package structure for an optical sensor that enables sensing through reception of light in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, and a method for manufacturing the same. [Solution] The present invention relates to a package structure for an optical sensor that enables sensing through reception of light in the ultraviolet wavelength band and converts ultraviolet signals into digital signals, and a manufacturing method thereof. The package structure is attached to a PCB substrate on which a light-sensing element unit is mounted, and is configured to surround the element unit, exposing the light-receiving portion of the element unit that receives light, and is made of a light-blocking agent made of a material that can block visible light that enters the side of the element unit excluding the light-receiving portion; and a diffusing agent that is attached to the light-receiving portion of the element unit, allows light to diffuse while transmitting it, and is made of a material containing silicon dioxide.

Description

[Technical Field]

[0001] The present invention relates to a packaging structure for an optical sensor that enables sensing by receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, and a method for manufacturing the same. More particularly, the present invention relates to a packaging structure for an optical sensor that enables sensing by receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, and has an improved structure that reduces measurement deviation due to the angle of incidence of ultraviolet light incident on the optical sensor and minimizes changes in sensing sensitivity due to changes in the angle of incidence, and a method for manufacturing the same. [Background technology]

[0002] A COB (chip on board) type optical sensor, in which an optical sensor chip is mounted on the upper surface of a printed circuit board, generally has electrode pads formed on the lower surface to be electrically connected to a main board, and the printed circuit on the upper surface and the electrode pad on the lower surface are electrically connected through through holes. The electrical connection through the through holes is achieved by holes that penetrate the printed circuit on the upper surface and the electrode pad on the lower surface, and the inside of the holes is plated to electrically connect the printed circuit on the upper surface and the electrode pad on the lower surface.

[0003] Such optical sensors are configured with a package to shield them from external light and ensure the reliability of semiconductor characteristics. Conventional optical sensors have problems such as measurement deviation depending on the angle of incidence of light, changes in sensing sensitivity depending on the angle of incidence, a decrease in the absolute amount of light incident on the optical sensor due to an increase in reflectivity on the lens surface of the optical sensor, and noise generation due to ambient light and external humidity.

[0004] Prior art includes Korean Patent Publication No. 10-2016-0073451. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been devised to solve the above problems, and an object of the present invention is to provide a packaging structure for an optical sensor, which reduces measurement deviation due to the angle of incidence of ultraviolet light incident on the optical sensor, minimizes changes in sensing sensitivity due to changes in the angle of incidence, prevents a decrease in the absolute amount of light incident on the optical sensor, and blocks external disturbance light and moisture, enables sensing by receiving light in the ultraviolet wavelength band, and converts an ultraviolet signal into a digital signal, and a method for manufacturing the same.

[0006] The problems to be solved by the present invention are not limited to those described above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0007] To achieve the above object, the present invention provides a packaging structure for an optical sensor that enables sensing through reception of light in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal. The package structure is provided on a PCB substrate having a light-sensing element unit mounted thereon, and includes a light-blocking agent that surrounds the element unit, exposing a light-receiving portion of the element unit that receives light, and that is made of a material that can block visible light that enters the side of the element unit excluding the light-receiving portion; and a diffusing agent that is provided on the light-receiving portion of the element unit, allows the light to diffuse while transmitting it, and is made of a material containing silicon dioxide (SiO2).

[0008] It is preferable that the present invention further includes a filter unit including: a filter portion laminated on the diffusing agent and made of a material that transmits light of a specific wavelength; and a pad portion provided on the filter portion, arranged in a portion facing the light receiving portion of the element portion, and relatively reducing the amount of direct light incident on the light receiving portion.

[0009] The pad portion of the filter unit faces the center of the light receiving portion, has an area smaller than the area of ​​the light receiving portion, and may be made of a light-blocking material.

[0010] Preferably, the present invention further includes a package dam portion that is provided between the filter portion of the filter unit and the PCB substrate, has a structure that surrounds the sides of the light blocking agent and the diffusing agent, and blocks light that enters the sides of the diffusing agent.

[0011] In addition, a method for manufacturing an optical sensor package structure according to the present invention, which enables sensing through reception of light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, may include: a dam forming step in which a mold unit forms a package dam portion on a frame portion of a PCB substrate on which a light-sensing element portion is mounted by a molding process, thereby forming an arrangement space with one side open on the PCB substrate in which the element portion is disposed; a light-shielding agent forming step in which a mask unit is placed on the package dam portion to cover the arrangement space, and a light-shielding material is poured into the arrangement space through an inlet slit formed in the mask unit to form a light-shielding agent that surrounds a side of the element portion; a coating step in which the mask unit is separated from the package dam portion, and a light-transmitting material is poured into the arrangement space to laminate a diffusing agent on a light-receiving portion of the element portion; and a filter mounting step in which a filter unit that transmits light of a specific wavelength and reduces the amount of direct light incident on the light-receiving portion is provided on the package dam portion, and the filter unit is laminated on the diffusing agent. [Effects of the Invention]

[0012] The optical sensor package structure and manufacturing method thereof, which enable sensing through reception of light in the ultraviolet wavelength band and convert an ultraviolet signal into a digital signal, according to the present invention, has a structure in which a light-blocking agent surrounds the side of an element unit mounted on a PCB substrate to block the inflow of light and moisture to the side of the element unit, and a diffusing agent, which is made of a material that transmits ultraviolet light and is provided in the light-receiving portion of the element unit, to transmit and diffuse the ultraviolet light incident on the light-receiving portion. This reduces measurement deviation due to the incident angle of ultraviolet light incident on the optical sensor, minimizes changes in sensing sensitivity due to changes in the incident angle, prevents a decrease in the absolute amount of light incident on the optical sensor, and has the effect of blocking external disturbance light and moisture from entering from the outside.

[0013] The effects of the present invention are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a cross-sectional view illustrating a packaging structure for an optical sensor that enables sensing by receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention; [Figure 2] FIG. 1 is a plan view of an embodiment of the present invention. [Figure 3] 1 is a block diagram illustrating a method for manufacturing a packaging structure for an optical sensor that enables sensing by receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention. [Figure 4] 1 is a conceptual diagram illustrating a manufacturing method according to an embodiment of the present invention. [Figure 5] 1 is a view illustrating a mask unit for forming a light blocking agent in a manufacturing method according to an embodiment of the present invention; [Figure 6] 1 is a view illustrating a mask unit for forming a light blocking agent in a manufacturing method according to an embodiment of the present invention; [Figure 7]10 is a view illustrating an extension rib adopted in a mask unit used to form a light blocking agent in a manufacturing method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] In the following description, in order to clarify the understanding of the present invention, a description of known techniques for the features of the present invention will be omitted. It should be understood that the following embodiments are detailed descriptions to facilitate understanding of the present invention and do not limit the scope of the present invention. Therefore, equivalent inventions that perform the same functions as the present invention also fall within the scope of the present invention.

[0016] In the following description, the same identification symbols refer to the same configurations, and unnecessary redundant explanations and explanations of well-known technologies will be omitted. Also, explanations of the following embodiments of the present invention that overlap with the description of the technology that forms the background of the invention will be omitted.

[0017] Hereinafter, a package structure for an optical sensor that enables sensing by receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0018] FIG. 1 is a cross-sectional view illustrating a packaging structure for an optical sensor that enables sensing through receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to an embodiment of the present invention, and FIG. 2 is a plan view of one embodiment of the present invention.

[0019] As shown in FIGS. 1 and 2, a package structure for an optical sensor according to one embodiment of the present invention, which enables sensing by receiving light in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, comprises a light-blocking agent 100 and a diffusing agent 200.

[0020] The light blocking agent 100 is provided on a PCB board on which a light-sensing element unit is mounted, and surrounds the element unit 10 while exposing a light-receiving portion 11 that receives light in the element unit 10. The light blocking agent 100 is made of a material that blocks visible light, and can block light entering the side of the element unit 10 except for the light-receiving portion 11.

[0021] The light blocking agent 100 is made of a material such as an opaque liquid resin capable of blocking visible light, and is applied to the upper surface of the light receiving portion 11 of the device unit with a diffusing agent disposed on the light receiving portion to cover the light receiving portion. The light blocking agent 100 prevents visible light and moisture from entering the outside of the device unit 10, thereby preventing a decrease in the sensing sensitivity of the device unit and preventing errors during light sensing. Here, the light sensed by the device unit refers to ultraviolet light.

[0022] 1, the diffusing agent 200 has a structure laminated on the light receiving portion 11 of the device unit 10 that receives ultraviolet light, and may be made of a material containing silicon dioxide (SiO2) that can transmit and diffuse ultraviolet light and transmit light containing ultraviolet light. When light containing ultraviolet light is incident, the diffusing agent 200 diffuses the light and transmits it to the light receiving portion, thereby reducing measurement deviation due to the incident angle of ultraviolet light incident on the optical sensor and minimizing changes in sensing sensitivity due to changes in the incident angle.

[0023] The diffusing agent 200 is made of various materials that can transmit light, such as epoxy resin, silicone resin, or liquid resin for optical waveguides, for transmitting and diffusing ultraviolet rays, and can prevent a decrease in the absolute amount of ultraviolet rays incident on the light receiving part.

[0024] The optical sensor package structure according to one embodiment of the present invention, which enables sensing through reception of light in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, has a structure in which a light-blocking agent 100 surrounds the side of an element unit mounted on a PCB substrate to block the inflow of light and moisture to the side of the element unit 10, and a diffusing agent 200 made of a material that transmits ultraviolet light and is provided in a light-receiving portion 11 of the element unit 10 to transmit and diffuse the ultraviolet light incident on the light-receiving portion. This reduces measurement deviation due to the angle of incidence of ultraviolet light incident on the optical sensor, minimizes changes in sensing sensitivity due to changes in the angle of incidence, prevents a decrease in the absolute amount of light incident on the optical sensor, and has the effect of blocking external disturbance light and moisture from entering from the outside.

[0025] Meanwhile, this embodiment preferably further includes a filter unit 300 and a package dam part 400 .

[0026] 1, the filter unit 300 transmits light of a specific wavelength and adjusts the amount of direct light, and may include a filter part 310 and a pad part 320. The filter part 310 of the filter unit 300 is made of a material that can transmit light of a specific wavelength, i.e., ultraviolet light, and is laminated on the upper surface of the diffusing agent 200, allowing only ultraviolet light to enter the diffusing agent 200.

[0027] The filter unit 310 is connected to the pad unit 320, and the pad unit 320 is disposed in a portion that contacts the diffusing agent 200. The filter unit 310 allows the light receiving portion 11 of the device unit to receive only ultraviolet light, and scatters the ultraviolet light through the diffusing agent 200. The light of a specific wavelength that is transmitted to the diffusing agent 200 by the filter unit 310 may vary depending on the type of filter unit.

[0028] The pad part 320 of the filter unit 300 is provided on the filter part 310 and is disposed at a portion facing the light receiving portion of the device part 10. The pad part 320 relatively reduces the amount of direct light incident on the light receiving portion, thereby minimizing measurement deviation of the optical sensor and minimizing changes in sensing sensitivity, thereby deriving the advantage of preventing errors when the sensor is operated. The pad part 320 is made of various materials that can block light, and is also made of plated materials to reduce the amount of light.

[0029] The pad portion 320 is arranged so as to face the center of the light receiving portion 11 at a position opposite the element portion 100, and has an area smaller than the area of ​​the light receiving portion, thereby reducing the amount of direct light while maintaining sensing sensitivity.

[0030] The package dam part 400 is installed between the filter part 310 of the filter unit 300 and the PCB board 200, and has a structure surrounding the sides of the light blocking agent 100 and the diffusing agent 200. By blocking light entering the sides of the diffusing agent 200, the package dam part 400 can ensure the structural stability of the optical sensor, improve reliability during sensing, and prevent sensing sensitivity and errors caused by the inflow of ambient light and moisture.

[0031] The package dam portion 400 is configured to support the filter portion 310 and has the filter portion 310 disposed at its upper end (see FIG. 1(b)), or may have an insertion opening 401 at its upper end so that the filter portion 310 can be inserted (see FIG. 1(a)).

[0032] As described above, the light-blocking agent 100 employed in this embodiment has a structure that surrounds the side of the element part 10 excluding the light-receiving part 11, and it is desirable that the height from the PCB substrate is formed to be lower than the height from the PCB substrate 20 to the top surface of the element part, so that ultraviolet light that has passed through the filter part 310 and is scattered by the diffusing agent 200 is smoothly incident only on the light-receiving part 11 of the element part.

[0033] The packaging structure for an optical sensor that enables sensing by receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention has been described above. Hereinafter, a method for manufacturing the packaging structure for an optical sensor that enables sensing by receiving light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention will be described.

[0034] FIG. 3 is a block diagram illustrating a method for manufacturing a packaging structure for an optical sensor that enables sensing through receiving light in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention; FIG. 4 is a conceptual diagram illustrating a manufacturing method according to one embodiment of the present invention; FIGS. 5 and 6 are views illustrating a mask unit for forming a light-blocking agent in a manufacturing method according to one embodiment of the present invention; and FIG. 7 is a view illustrating an extension rib adopted in a mask unit used for forming a light-blocking agent in a manufacturing method according to one embodiment of the present invention.

[0035] As shown in FIG. 3, a method for manufacturing a packaging structure for an optical sensor that enables sensing through receiving light in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal according to one embodiment of the present invention includes a dam forming step (step S100), a light blocking agent forming step (step S200), a coating step (step S300), and a filter mounting step (step S400).

[0036] In the dam forming step (step S100), a package dam part 400 is formed by a molding process using a mold unit. In the dam forming step (step S100), the package dam part 400 is formed by a molding process on a frame part of a PCB substrate 20 on which a light-sensing device part 10 is mounted, thereby forming an arrangement space with one side open and in which the device part 10 is arranged on the PCB substrate. In the dam forming step (step S100), the package dam part 400 is realized using epoxy resin or the like. Here, a circuit pattern provided on the PCB substrate and electrically connected to the device part is arranged in the arrangement space together with the device part.

[0037] In the light-blocking agent forming step (step S200), a mask unit 500 is placed on the package dam portion 400 in a shape that covers the placement space, and a light-blocking material is injected into the placement space through an inlet slit 501 formed in the mask unit 500 to form a light-blocking agent 100 that surrounds the side of the element portion.

[0038] 4, the light-blocking agent forming step (step S200) uses the mask unit 500 to inject a light-blocking material into the filling space so that the height of the light-blocking agent 200 from the PCB substrate 20 is lower than the height to the upper surface of the element unit 100, so that the light-blocking agent 100 does not invade the electric wires connecting the upper surface of the element unit 100 to the circuit pattern. Also, the light-blocking agent forming step (step S200) may further include a curing step of curing the light-blocking agent 100 made of the light-blocking material in a curing machine at a predetermined temperature for a predetermined time so that the light-blocking agent 100 surrounds the side surfaces of the element unit 100 and is stably provided on the PCB substrate.

[0039] The coating step (step S300) separates the mask unit 500 from the package dam part 400, and injects a light-transmitting material into the placement space to deposit a diffusing agent 200 on the light-receiving part 11 of the element part 10. In the coating step (step S300), the light-transmitting material is injected into the placement space to form the diffusing agent 200. The diffusing agent is formed at the same height as or lower than the package dam part 400, so that ultraviolet light passes through the diffusing agent and is scattered, thereby transmitting to the light-receiving part of the element part. The light-transmitting material injected into the placement space in the coating step (step S300) may be a liquid resin for an optical waveguide, and the process may further include a resin curing step of curing the liquid resin for an optical waveguide injected into the placement space to form a diffusing agent.

[0040] The filter mounting step (step S400) installs a filter unit 300 on the package dam 400, which transmits light of a specific wavelength and reduces the amount of direct light incident on the light receiving part. The filter unit 310 is then stacked on a diffusing agent, so that the element receives only the ultraviolet light scattered by the diffusing agent after passing through the filter unit, enabling sensing.

[0041] Meanwhile, the mask unit 500 for forming the light blocking agent in the light blocking agent forming step (step S200) preferably includes a base plate part 510, a cover part 520, and a connecting rib 530, as shown in Figures 5 and 6. The base plate part 510 is placed on the package dam part 400 by a pulling device, and has through holes to allow the light blocking material to flow into the arrangement space where the light blocking agent is formed.

[0042] The cover portion 520 has a size corresponding to the light receiving portion 11 of the element portion, is arranged in the through hole of the base plate portion 510, forms an inflow slit 501 between it and the base plate portion 510, and protrudes toward the light receiving portion 11 to cover the light receiving portion 11, thereby allowing the light blocking material to flow into the arrangement space through the inflow slit 501 in a form that surrounds the outside of the element portion 10, and prevents the application of a light blocking agent to the light receiving portion 11.

[0043] The connecting rib 530 connects the base plate part 510 and the cover part 520 and maintains the shape of the inlet slit 501 for the inflow of the light-blocking material in the arrangement space, thereby enabling the light-blocking material to smoothly inflow into the arrangement space and stably positioning the cover part 520 on the upper side of the element part 10.

[0044] Meanwhile, the cover part 520 may have a cover groove 521 for preventing the exposure of the electric wire 30 so as to prevent the electric wire 30 from being coated with the light-blocking material when the light-blocking material is introduced. The cover groove 521 is preferably provided in a portion facing the electric wire and has a groove shape.

[0045] 7, the cover part 520 may have the cover groove formed therein and an extension rib 522 extending toward the PCB board 20 to define the cover groove. The extension rib 522 is provided on the outer side of the cover part so that the electric wires are not exposed to the arrangement space when inserted into the cover groove 521. The extension rib 522 is formed with an inclination toward the inside of the package dam part, so that when a light-blocking material flows into the arrangement space to form the light-blocking agent, the light-blocking material does not apply to the electric wires but flows only to the side of the device part.

[0046] The dam forming step (step S100), the light blocking agent forming step (step S200), the coating step (step S300), and the filter mounting step (step S400) are performed by a mold unit, a drawing device, a liquid material injection device, and a molding device, and are controlled by a controller (not shown) having a program for driving each device. The controller can be implemented as a computer having a program or a dedicated terminal.

[0047] Various embodiments of the present invention have been described above, but these embodiments and the drawings attached to this specification only clearly illustrate a portion of the technical ideas contained in the present invention, and it is obvious that all modifications and specific embodiments that can be easily inferred by a person skilled in the art within the scope of the technical ideas contained in the specification and drawings of the present invention are included in the scope of the present invention.

Claims

1. a light-blocking agent that is provided on a PCB substrate on which a light-sensing element unit is mounted, and that surrounds the element unit, exposes a light-receiving portion of the element unit that receives light, and is made of a material that can block visible light that enters a side of the element unit excluding the light-receiving portion; a diffusing agent provided in a light receiving portion of the element portion, which allows the light to be transmitted while diffusing, and which is made of a material containing silicon dioxide; A packaging structure for an optical sensor, which enables sensing through reception of light in an ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, comprising:

2. 10. The optical sensor packaging structure according to claim 1, further comprising: a filter unit including: a filter portion laminated on the diffusing agent and made of a material that transmits light of a specific wavelength; and a pad portion provided on the filter portion, the pad portion being disposed opposite the light receiving portion of the element portion and relatively reducing the amount of direct light incident on the light receiving portion.

3. The pad portion of the filter unit is 3. The optical sensor package structure according to claim 2, which enables sensing through reception of light in the ultraviolet wavelength band and converts an ultraviolet signal into a digital signal, characterized in that the package structure faces the center of the light receiving portion, has an area smaller than the area of ​​the light receiving portion, and is made of a light-blocking material.

4. 3. The optical sensor packaging structure according to claim 2, further comprising a package dam portion disposed between the filter portion of the filter unit and the PCB substrate, the package dam portion having a structure surrounding sides of the light blocking agent and the diffusing agent and blocking light entering the sides of the diffusing agent.

5. a dam forming step in which a molding unit forms a package dam portion on a frame portion of a PCB substrate on which a light-sensing element portion is mounted by a molding process, thereby forming an arrangement space in which the element portion is disposed on the PCB substrate and one side of which is open; a light-blocking agent forming step of placing a mask unit on the package dam portion in a shape that covers the placement space, and injecting a light-blocking material into the placement space through an inlet slit formed in the mask unit to form a light-blocking agent in a shape that surrounds a side surface of the device portion; a coating step of separating a mask unit from the package dam and injecting a light-transmitting material into the placement space to deposit a diffusing agent on the light-receiving portion of the device unit; a filter mounting step of providing a filter unit in the package dam portion, the filter unit transmitting light of a specific wavelength and reducing the amount of direct light incident on the light receiving portion, and laminating the filter unit on a diffusing agent; 1. A method for manufacturing a packaging structure for an optical sensor, the packaging structure comprising:

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