Sound assembly, digital speaker system and control method thereof

Abstract

Sound assembly, digital speaker system and control method thereof. [Solution] A digital speaker system includes N (N≧2) sound assemblies, a mounting base with a plurality of mounting grooves, each mounting groove capable of mounting one sound assembly, and a digital audio signal input PCB board for receiving an audio signal and converting the audio signal into a digital signal capable of driving the sound assembly to produce sound. Each sound assembly includes a bracket, a magnetic circuit system mounted on the bracket, a sound-producing diaphragm connected to the bracket, and a voice coil connected to the sound-producing diaphragm. The magnetic circuit system has a magnetic gap, and the voice coil is partially inserted into the magnetic gap. An inner cavity is formed between the sound-producing diaphragm and the magnetic circuit system. An airflow channel is formed between the inner surface of each bracket of the sound assembly and the outer surface of the magnetic circuit system. The mounting base further has an airflow cavity, and each of the inner cavities communicates with the airflow cavity via a corresponding airflow channel. The digital speaker system achieves pure digital input driving and can improve bass effect.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED ART APPLICATIONS) This application claims priority to Chinese patent applications filed on December 5, 2022, with application numbers CN2022115452773 and CN2022232407952.

[0002] The present disclosure belongs to the field of speakers, and in particular relates to a sound assembly, a digital speaker system, and a control method thereof, where the sound assembly is typically a small micro speaker module suitable for constituting a digital speaker system. [Background technology]

[0003] Speakers are the most common sound-generating devices. Traditional speakers consist of a bracket, a sound-generating diaphragm, a voice coil, a magnetic steel, a front piece, and a T-shaped or U-shaped iron. The bracket, magnetic steel, and front piece constitute a magnetic circuit system, while the sound-generating diaphragm and voice coil constitute a vibration system. The voice coil has its upper end connected to the underside of the sound-generating diaphragm and its lower end located in the magnetic gap of the magnetic circuit system. An audio signal is input to the voice coil, causing the sound-generating diaphragm to move up and down to generate sound. Currently, speakers and speaker systems are still driven by analog signals, which has fundamentally addressed issues such as low efficiency, high power consumption, and poor sound clarity. In recent years, with the rapid development of digital technology and products, Class D digital power amplifiers have become widely used. While Class D digital power amplifiers can meet the requirements for reduced power loss and heat dissipation, the output stage of Class D digital power amplifiers still requires a digital-to-analog conversion device, so speaker structures must still be driven by analog signals. Therefore, there is a demand for a digital speaker system that organically integrates and combines integrated circuit technology and electroacoustic products through technological innovation, and promotes electroacoustic products from the traditional unified approach to digitalization, modularization, and integration. Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure relates to a sound assembly, a digital speaker system, and a control method thereof. [Means for solving the problem]

[0005] One aspect of the present disclosure is N (N≧2) sound assemblies; a mounting seat having a plurality of mounting grooves, each of which can accommodate up to one of the sound assemblies; a digital audio signal input PCB board mounted on the mounting seat for receiving an audio signal and converting the audio signal into a digital signal capable of driving the sound assembly to produce sound; Each of the sound assemblies comprises a bracket, a magnetic circuit system provided on the bracket, a sound-producing diaphragm connected to the bracket, and a voice coil connected to the sound-producing diaphragm, the magnetic circuit system having a magnetic gap, a portion of the voice coil being inserted into the magnetic gap, and an inner cavity being formed between the sound-producing diaphragm and the magnetic circuit system; An airflow channel is formed between the inner surface of each bracket of the sound assembly and the outer surface of the magnetic circuit system, and the mounting seat further has an airflow cavity, and each of the inner cavities communicates with the airflow cavity via the corresponding airflow channel, thereby providing a digital speaker system.

[0006] In some embodiments, the airflow cavity is provided with a sound-absorbing material, which may be selected from porous materials, including but not limited to sponge, synthetic fiber, etc. The volume of the sound-absorbing material can be controlled to adjust the size of the airflow cavity, which in turn can adjust the performance of the product.

[0007] In some embodiments, there is one airflow cavity below each of the mounting grooves, and they communicate with each other.

[0008] In some embodiments, each of the mounting grooves has an annular bottom wall, and the bracket is disposed on the bottom wall.

[0009] In some embodiments, the magnetic circuit system includes a U-shaped iron, a magnetic steel and a front piece installed in the U-shaped iron, the bracket has a magnetic circuit slot open at both upper and lower ends, the magnetic circuit slot has side walls extending vertically and a top wall extending inward from the upper ends of the side walls, the U-shaped iron has a top surface connected to the top wall and a side surface connected to the side walls, and the airflow channel is formed by the airflow slots provided in the side walls and the top wall.

[0010] In some embodiments, the airflow channel has an inlet and an outlet, the inlet being bounded by the top wall and the top surface of the U-iron, and the outlet being bounded by the side wall and the side surface of the U-iron.

[0011] In some embodiments, the mounting seat, speaker carrier, diaphragm suspension, and acoustic focusing panel are each unitarily molded from plastic.

[0012] In some embodiments, the sound-producing diaphragm or reinforcing support plate is made of a material that is light in weight, has good damping elasticity and rigidity, is resistant to high and low temperatures, and is waterproof and mildew-resistant, preferably made of materials such as cloth, silk, or a metal composite.

[0013] In some embodiments, the bracket has a lead wire hole through which the lead wire of the voice coil is drawn out.

[0014] In some embodiments, the digital speaker system further comprises a connection plate, the connection plate is installed in the bracket, the connection plate has a signal input terminal and N sets of signal output terminals, the signal input terminal is electrically connected to the output end of the digital audio signal input PCB board through a conductor, and each set of the signal output terminal is electrically connected to the lead wire of one of the sound assemblies.

[0015] In some embodiments, the mounting seat has an upper surface and an annular connection flange extending upward from the edge of the upper surface, the mounting groove extends downward from the upper surface, the connection plate is disposed on the upper surface and is located within the connection flange, the connection plate has N through holes, and the sound assembly passes through corresponding ones of the through holes.

[0016] In some embodiments, the digital speaker system further comprises an acoustic focusing panel, the edge of which is fixedly connected to the connection flange of the mounting seat, the acoustic focusing panel having N acoustic focusing portions, one of which is positioned above each of the sound assemblies to cover it, the central portion of each of the acoustic focusing portions being raised upward, and one or more sound holes being provided in each of the acoustic focusing portions.

[0017] In some embodiments, a receiving groove is provided at the bottom of the mounting seat, the digital audio signal input PCB board is installed in the receiving groove, and the digital speaker system further includes a cover plate for closing the receiving groove, and the cover plate is fixed and connected to the bottom of the mounting seat.

[0018] In some embodiments, the bracket includes a diaphragm suspension and a speaker carrier, the magnetic circuit system is disposed within the speaker carrier, the diaphragm suspension is fixedly connected to the speaker carrier, the diaphragm is connected to the diaphragm suspension, and each sound assembly further includes a reinforcing support plate connected between the voice coil and the diaphragm suspension. The reinforcing support plate controls deflection of the voice coil as it moves up and down within the U-iron, improving stability during the voice coil's up and down movement. For low-power applications, the reinforcing support plate may be omitted, thereby reducing the height of the modular pure digital speaker system.

[0019] In some embodiments, an air vent is provided above the voice coil at a position higher than the reinforcing support plate.

[0020] In some embodiments, the reinforcing support plate comprises an ontology layer and a fabric layer covering the ontology layer, the material of the ontology layer being rubber or silicone. The reinforcing support plate has excellent strength and rigidity, improving the control effect on the deflection width of the voice coil. Furthermore, the fabric layer is cut into a desired shape and then placed in an injection mold to inject rubber or silicone to form the reinforcing support plate. The fabric layer is selected from one of cotton, silk, PC (polycarbonate), and Nomex.

[0021] In some embodiments, M (M≦N) sound assemblies produce sound at a given time, one or more of the N sound assemblies produce sound at a given time, and another one or more of the N sound assemblies produce sound at a given time. The output signal of the digital audio signal input PCB board is a binary digital signal. For example, the digital audio signal input PCB board generates a binary digit sequence of "0101" to realize the switching function, and a pure digital SOC encoding chip outputs switching signals to multiple pure digital power amplifier chips. Each digital power amplifier chip transfers an amplified power signal to each voice coil of the sound assembly, moving the voice coil up and down to stimulate the sound-generating diaphragm to generate sound, thereby achieving pure digital signal encoding, transfer, amplification, and digital-to-analog conversion, achieving pure digital sound reproduction and thereby improving the clarity of the reproduced sound. When multiple sound assemblies produce sound simultaneously, a spatial overlapping effect of sound waves occurs, improving the overall sound intensity.

[0022] In some embodiments, the maximum outer diameter of the sound assembly is 25 mm or less, and the N sound assemblies are arranged in a linear, rectangular, or circular array.

[0023] In some embodiments, the digital audio signal input PCB board comprises: a sound source input module for inputting an external sound source; a digital signal processing module for receiving an external sound source input to the sound source input module and executing a directional acoustic beam algorithm to output directional sound through the N sound assemblies; a digital encoding module for generating a pure digital switch switching signal based on the output of the digital signal processing module; one or more power amplification modules for driving one or more of the sound assemblies to produce sound based on the pure digital switch switching signal; At one time, one or more of the N sound assemblies will produce sound, and at another time, another one or more of the N sound assemblies will produce sound.

[0024] In some embodiments, the digital audio signal input PCB board includes a sound source input module, a digital signal processing module, a digital encoding module, N power amplification units, and a power supply module. The sound source input module specifically includes a Bluetooth module, a digital-to-analog conversion module, and an A2B bus module for inputting an external sound source. Specifically, the Bluetooth module can obtain the sound source through a Bluetooth communication method, and the Bluetooth module can 2 It is connected to the digital signal processing module via the S audio bus, and sends the acquired audio source to the digital signal processing module, and realizes wireless audio signal connection through Bluetooth pairing, realizes wireless signal transmission, and simplifies the direct playback mode after receiving the audio signal. The digital-to-analog conversion module is specifically a digital-to-analog conversion chip, which can be connected to a general audio input host or earphones, etc. to acquire the audio source. The digital-to-analog conversion module is I 2The A2B bus module is connected to the digital signal processing module via an S audio bus and sends the acquired sound source to the digital signal processing module. The A2B bus module is specifically an A2B bus chip, and the A2B bus module is connected to the digital signal processing module via a TDM bus and sends the acquired sound source to the digital signal processing module. Using the A2B bus chip reduces the number and length of signal cables connecting the sound assemblies and reduces cable costs. The digital signal processing module is specifically a DSP chip and executes a directional acoustic beam algorithm to realize the function of directional sound output by the N sound assemblies. The signal digital processing module is electrically connected to the digital encoding module and specifically executes TDM or I 2 The digital encoding module is specifically a pure digital SOC encoding chip, and is electrically connected to N power amplification units. Each power amplification unit includes one or more power amplification chips to drive the corresponding sound assembly. The power supply module supplies power to each of the above modules.

[0025] A second aspect of the present disclosure provides a method for controlling the digital speaker system, which includes the steps of executing a directional acoustic beam algorithm to generate a purely digital switch switching signal, and driving one or more of the sound assemblies to emit sound based on the purely digital switch switching signal using a power amplification module, wherein at one time, one or more of the N sound assemblies emit sound, and at another time, another one or more of the N sound assemblies emit sound.

[0026] A third aspect of the present disclosure is specifically a speaker module comprising: a bracket; a magnetic circuit system provided on the bracket; a sound-producing diaphragm connected to the bracket; and a voice coil connected to the sound-producing diaphragm, wherein the magnetic circuit system has a magnetic gap, a portion of the voice coil is inserted into the magnetic gap, and an inner cavity is formed between the sound-producing diaphragm and the magnetic circuit system, An airflow channel is formed between the inner surface of the bracket and the outer surface of the magnetic circuit system, and an airflow cavity is further formed within the bracket, and the inner cavity communicates with the airflow channel through the airflow cavity, thereby providing a sound assembly that is closed by the bracket.

[0027] In some embodiments, the magnetic circuit system includes a U-shaped iron, a magnetic steel and a front piece installed in the U-shaped iron, the bracket has a magnetic circuit slot open at both upper and lower ends, the magnetic circuit slot has side walls extending vertically and a top wall extending inward from the upper ends of the side walls, the U-shaped iron has a top surface connected to the top wall and a side surface connected to the side walls, and the airflow channel is formed by the airflow slots provided in the side walls and the top wall.

[0028] In some embodiments, the airflow channel has an inlet and an outlet, the inlet being bounded by the top wall and the top surface of the U-iron, and the outlet being bounded by the side wall and the side surface of the U-iron.

[0029] In some embodiments, the bracket has a lead wire hole through which the lead wire of the voice coil is drawn out.

[0030] In some embodiments, the bracket comprises a speaker carrier and a bottom cover that are fixedly connected to each other, the airflow cavity is formed in the bottom cover, and the magnetic circuit system is provided in the speaker carrier.

[0031] In some embodiments, the bottom cover has a protrusion that protrudes upward, and the magnetic circuit system contacts the protrusion.

[0032] In some embodiments, the airflow cavity is provided with a sound-absorbing material, which may be selected from porous materials, including but not limited to sponge, synthetic fiber, etc. The volume of the sound-absorbing material can be controlled to adjust the size of the airflow cavity, which in turn can adjust the performance of the product.

[0033] In some embodiments, the bracket further comprises a diaphragm suspension fixedly connected to an upper portion of the speaker carrier, the diaphragm connected to the diaphragm suspension, and the speaker module further comprises a reinforcing support plate connected between the voice coil and the diaphragm suspension. The reinforcing support plate prevents deflection of the voice coil when it moves up and down within the magnetic gap, increases the movement range of the voice coil within the magnetic gap, and improves the sound volume and power of the sound-producing diaphragm.

[0034] In some embodiments, an air vent is provided above the voice coil at a position higher than the reinforcing support plate.

[0035] In some embodiments, the reinforcing support plate comprises a first ontology layer and a first fiber layer covering the first ontology layer, the material of the first ontology layer being rubber or silicone. The reinforcing support plate has excellent strength and rigidity, improving the control effect on the deflection width of the voice coil. Furthermore, the fiber layer is cut into the first fiber layer of a desired shape, which is then placed in an injection mold and injected with rubber or silicone to form the reinforcing support plate. The first fiber layer is selected from one of cotton, silk, PC (polycarbonate), and Nomex.

[0036] In some embodiments, the sound-producing diaphragm includes a second ontology layer and a second fabric layer covering the second ontology layer, the second fabric layer being made of rubber or silicone. The sound-producing diaphragm can be controlled to suitably control the travel range and optimize sound production performance and sound quality. Preferably, the fabric layer is cut into the desired shape of the second fabric layer, which is then placed in an injection mold and injected with rubber or silicone to form the sound-producing diaphragm. The second fabric layer is selected from one of cloth, silk, PEI, and metal mesh.

[0037] In some embodiments, the maximum outer diameter of the speaker module is 25 mm or less. The speaker module is a small micro-speaker suitable for use in a digital speaker system, with a plurality of speaker modules arranged side by side to form a sound-producing array. [Effects of the Invention]

[0038] The present disclosure employs the above solution and has the following advantages.

[0039] The digital speaker system and control method disclosed herein realizes pure digital input drive by inputting digital signals to N sound assemblies, causing the sound diaphragms to vibrate and produce sound, contributing to improved sound production efficiency, reduced power consumption, improved clarity, and improved reproduction quality of the original sound. The entire system has a compact structure and small volume. The inner cavity of each sound assembly communicates with the airflow cavity in the mounting seat via an airflow channel. The airflow generated when the voice coil moves up and down can be discharged from the airflow channel to the airflow cavity. The inner cavity and the airflow cavity combine to form an airflow reflow cavity, and the volume of the airflow cavity can be adjusted to optimize speaker performance and improve bass effect. The multiple sound assemblies each emit sound in a corresponding frequency band (high frequency, mid frequency, or low frequency) based on a corresponding digital signal, and the sound waves of each sound assembly are overlapped to form a desired playback sound field.

[0040] To meet the requirements of digital speaker systems, there are several structural design proposals for micro speakers. However, the power and voice coil of these micro speakers have a small vibration amplitude in the magnetic circuit system, which limits the acoustic effect and quality, especially the bass effect. In the sound assembly disclosed in the present disclosure, the inner cavity communicates with the airflow cavity in the bracket through an airflow channel. The airflow generated when the voice coil moves up and down can be discharged from the airflow channel to the airflow cavity. The inner cavity and the airflow cavity are combined to form an airflow reflow cavity. By adjusting the volume of the airflow cavity, the speaker performance can be optimized and the bass effect can be improved. The structure is compact and the volume is small, making it suitable for use in digital speaker systems. [Brief explanation of the drawings]

[0041] In order to more clearly describe the technical solutions of the present disclosure, the following briefly describes the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art from these drawings without creative efforts.

[0042] [Figure 1] FIG. 1 is a configuration diagram of a speaker module according to an embodiment of the present disclosure. [Figure 2] 1 is a local cross-sectional view of a speaker module according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is an exploded schematic view of a speaker module according to an embodiment of the present disclosure. [Figure 4] FIG. 4 is a configuration diagram of the speaker carrier in FIG. 3. [Figure 5] FIG. 1 is a cross-sectional view of a reinforcing support plate according to an embodiment of the present disclosure. [Figure 6] 1 is a cross-sectional view of a sound-producing diaphragm according to an embodiment of the present disclosure. [Figure 7] 1 is a local cross-sectional view of a digital speaker according to an embodiment of the present disclosure. [Figure 8] 1 is an exploded schematic diagram of a digital speaker according to an embodiment of the present disclosure. [Figure 9] FIG. 10 is a block diagram of another sound assembly according to an embodiment of the present disclosure. [Figure 10] FIG. 10 is an exploded schematic view of the sound assembly shown in FIG. 9. [Figure 11] FIG. 1 is a module diagram of a digital audio signal input PCB board according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0043] In order to facilitate understanding of the advantages and features of the present disclosure by those skilled in the art, preferred embodiments of the present disclosure will be described in detail below with reference to the drawings. Note that the description of these embodiments contributes to understanding the present disclosure, but does not limit the present disclosure. Furthermore, the technical features of various embodiments of the present disclosure described below can be combined with each other as long as they are not inconsistent with each other.

[0044] In this disclosure, "inside" and "outside" are defined relative to the centerline of the voice coil of the speaker, with the side closer to the centerline of the voice coil being the inside and the opposite side being the outside. The directional terms "upper", "lower", and "horizontal" are used to help those skilled in the art understand the structure of the speaker system and are not used to limit the state of the speaker system after it is installed in a usage environment; the sound assembly can be installed on the top, bottom, vertical side, or inclined surface of a member in the usage environment, such as a room or a car.

[0045] 1 to 6 show a sound assembly 1 according to an embodiment of the present disclosure, specifically a miniature speaker module suitable for use as a sound generating unit in a digital speaker system, capable of converting digital audio signals into sound. Multiple speaker modules can form a sound generating array for the digital speaker system, such as a linear, rectangular, or circular array. As shown in FIGS. 1 to 3, the speaker module 1 has an overall cylindrical shape with a maximum outer diameter of 25 mm or less. The speaker module 1 includes a bracket, a magnetic circuit system 13 disposed within the bracket, a sound generating diaphragm 14 connected to the bracket, and a voice coil 15 connected to the sound generating diaphragm 14. The bracket specifically includes a bottom cover, a speaker carrier 11, and a diaphragm suspension 12. The magnetic circuit system 13 is disposed within the speaker carrier 11, the diaphragm suspension 12 is fixedly connected to the upper part of the speaker carrier 11, the sound generating diaphragm 14 is connected to the diaphragm suspension 12, and the bottom cover is fixedly connected to the lower part of the speaker carrier 11. As shown in FIG. 1 , the magnetic circuit system 13 has a magnetic gap 130, and a portion (e.g., a lower portion) of the voice coil 15 is inserted into the magnetic gap 130. An inner cavity 17 is formed between the sound-generating diaphragm 14 and the magnetic circuit system 13. An airflow channel 18 is formed between the inner surface of each speaker carrier 11 of the speaker module 1 and the outer surface of the magnetic circuit system 13. An airflow cavity 101 is formed in the bracket (specifically, the bottom cover 10). The inner cavity 17 communicates with the airflow cavity 101 through the corresponding airflow channel 18. The front, rear, left, right, and bottom sides of the airflow cavity 101 are all closed by the bottom cover 10, and the airflow cavity 101 communicates only with the upper airflow channel 18. A sound-absorbing material 102 is installed in the airflow cavity 101. The sound-absorbing material 102 may be selected from porous materials, including, but not limited to, sponge, synthetic fiber, etc. Controlling the volume of the sound absorbing material 102 adjusts the size of the airflow cavity 102, which in turn adjusts the performance of the product.

[0046] The magnetic circuit system 13 includes a U-shaped iron 131, a magnetic steel 132 and a front piece 133 installed in the U-shaped iron 131. In this embodiment, the magnetic steel 132 is made of neodymium magnetic steel and is laminated below the front piece 133. The magnetic gap 130 is formed between the U-shaped iron 131, the magnetic steel 132, and the front piece 133. As shown in FIGS. 2 to 4 , the speaker carrier 11 has a magnetic circuit slot 110 that is open at both the top and bottom ends. The magnetic circuit slot 110 has side walls 110a extending vertically and an upper wall 110b extending inward from the upper end of the side wall 110a. The distance that the upper wall 110b extends inward is shorter than the radius of the magnetic circuit slot 110, allowing the voice coil 15 to pass between the upper walls 110b and be inserted into the magnetic gap 130 below. The U-shaped iron 131 has its top surface fixedly connected to the top wall 110b (for example, by adhesive) and its side surface fixedly connected to the side wall 110a (for example, by adhesive). The airflow channel 18 is formed by airflow slots 110c provided in the side wall 110a and the top wall 110b. The airflow channel 18 has an inlet 181 and an outlet 182. The inlet 181 is surrounded by the top wall 110b and the top surface of the U-shaped iron 131, and the outlet 182 is surrounded by the side wall 110a and the side surface of the U-shaped iron 131.

[0047] As shown in FIG. 5, the sound-producing diaphragm 14 includes a second ontology layer 14a and a second fiber layer 14b covering the second ontology layer 14a. The second ontology layer 14a is made of rubber or silicone, and the second fiber layer 14b is made of a material selected from the group consisting of cloth, silk, PEI, and metal mesh. The sound-producing diaphragm 14 can be suitably controlled in terms of its travel range, optimizing its sound-producing performance and sound quality. Specifically, a fiber layer (e.g., cotton or silk) is cut into the desired shape of the second fiber layer 14b, which is then placed in an injection mold and injected with rubber or silicone to form the sound-producing diaphragm 14.

[0048] Furthermore, the sound-producing diaphragm 14 includes a ball top 141 located in the center and a yoke ring 142 extending outward from the outer edge of the ball top 141, the outer edge of which is fixedly connected to the diaphragm suspension 12. The ball top 141 is generally hemispherical with a central portion that protrudes upward, while the yoke ring 142 gradually protrudes upward between its inner and outer edges. Overall, the height of the yoke ring 142 is lower than the height of the ball top 141. The upper end of the voice coil 15 is fixedly connected to the outer edge of the diaphragm ball top 141 and / or the inner edge of the yoke ring 142.

[0049] Each speaker module 1 further includes a reinforcing support plate 16 connected between the voice coil 15 and the diaphragm suspension 12. Specifically, the reinforcing support plate 16 has a central hole, the voice coil 15 passes through the central hole, and the outer edge of the voice coil 15 is fixedly connected to the diaphragm suspension 12. An air vent (not shown) is provided in the upper part of the voice coil 15 (specifically, in the part higher than the reinforcing support plate 16) at a position higher than the reinforcing support plate 16, so that the closed cavity between the yoke ring 142 of the diaphragm and the positioning support plate communicates with the cavity below the ball top 141, thereby constituting the inner cavity 17 of the speaker module 1. The speaker carrier 11 is provided with a lead wire hole 111, through which the lead wire 151 of the voice coil 15 is drawn to the outside.

[0050] 6, the reinforcing support plate 16 includes a first ontology layer 16a and a first fiber layer 16b covering the first ontology layer 16a. The material of the first ontology layer 16a is rubber or silicone, and the material of the first fiber layer 16b is selected from the group consisting of cotton, silk, PC (polycarbonate), and Nomex. The reinforcing support plate 16 has excellent strength and rigidity, and improves the control effect on the deflection width of the voice coil 15. Furthermore, a fiber layer (e.g., cotton or silk) is cut into the first fiber layer 16b of a desired shape, which is then placed in an injection mold and injected with rubber or silicone to form the reinforcing support plate 16.

[0051] The inner wall of the speaker carrier 11 is provided with an airflow slot for exhaust, allowing the airflow generated when the voice coil 15 moves up and down to be discharged from the bottom. The inner cavity 17 of the speaker module 1 and the airflow cavity 101 of the bottom cover 10 are combined to form an airflow reflow cavity. By adjusting the volume within the airflow cavity 101 (specifically, by adjusting the volume of the sound-absorbing material 102), the performance of the specially designed speaker can be optimized and the bass effect can be improved. The sound-producing diaphragm 14 has a ball-top 141 with a folding ring shape, and a reinforcing support plate 16 is further installed to increase the movement amount, i.e., the vibration amplitude, of the sound-producing diaphragm 14. The sound-producing diaphragm 14 is tightly connected to the diaphragm suspension 12 via the reinforcing support plate 16, which can control the horizontal deviation of the voice coil 15 when it moves up and down within the U-shaped iron 131.

[0052] 7 and 8 show a digital speaker system capable of converting digital audio signals into sound according to an embodiment of the present disclosure. As shown in FIGS. 7 and 8, the digital speaker system includes a sound assembly 1, a mounting base 2, a digital audio signal input PCB board 3, a connection plate 4, an acoustic focusing panel 5, and a cover plate 6. The number of sound assemblies 1 is N (N≧2). For example, in the embodiment shown in FIGS. 7 and 8, there are three sound assemblies 1. The sound assemblies 1 may be the speaker modules shown in FIGS. 1 to 6, or other sound assemblies (shown in FIGS. 9 and 10) described below. The mounting base 2 has a plurality of mounting grooves 20, each of which accommodates up to one sound assembly 1. Preferably, the number of mounting grooves 20 is N, which is the same as the number of sound assemblies 1, and each mounting groove 20 accommodates one sound assembly 1. The digital audio signal input PCB board 3 is installed on the mounting base 2 to receive an audio signal and convert it into a digital signal that can drive the sound assemblies 1 to produce sound. At any one time, M (M≦N) sound assemblies 1 produce sound; at any one time, one or more of the N sound assemblies 1 produce sound; and at any other time, another one or more of the N sound assemblies 1 produce sound. The N sound assemblies 1 are arranged in a linear, rectangular, or circular array. In this embodiment, the sound assemblies 1 are arranged in a three-element linear array.

[0053] 9 and 10, another sound assembly 1 includes a bracket, a magnetic circuit system 13 provided in the bracket, a sound-producing diaphragm 14 connected to the bracket, and a voice coil 15 connected to the sound-producing diaphragm 14. The bracket specifically includes a diaphragm suspension 12 and a speaker carrier 11, the magnetic circuit system 13 is provided in the speaker carrier 11, the diaphragm suspension 12 is fixedly connected to the speaker carrier 11, and the sound-producing diaphragm 14 is connected to the diaphragm suspension 12. As shown in FIG. 7, the magnetic circuit system 13 has a magnetic gap 130, a portion of the voice coil 15 is inserted into the magnetic gap 130, and an inner cavity 17 is formed between the sound-producing diaphragm 14 and the magnetic circuit system 13. An airflow channel 18 is formed between the inner surface of each speaker carrier 11 of the sound assembly 1 and the outer surface of the magnetic circuit system 13. The mounting seat 2 further includes an airflow cavity 21, and each of the inner cavities 17 communicates with the airflow cavity 21 through the corresponding airflow channel 18. Furthermore, there is an airflow cavity 21 below each mounting groove 20, and they communicate with each other. The multiple airflow cavities 21 in the mounting seat 2 are independent of each other and do not communicate with each other. A sound-absorbing material 102 is installed in the airflow cavity 101. The sound-absorbing material 102 is selected from porous materials, including, but not limited to, sponge, synthetic fiber, etc. The size of the airflow cavity 102 can be adjusted by controlling the volume of the sound-absorbing material 102, thereby further adjusting the performance of the product.

[0054] Each mounting groove 20 has an annular bottom wall 20a, and the speaker carrier 11 is disposed on the bottom wall 20a. The speaker carrier 11 is fixedly connected to the annular side walls and bottom wall 20a of the mounting groove 20, for example by adhesive, and tightly attached. The magnetic circuit system 13 includes a U-shaped iron 131, and a magnetic steel 132 and a front piece 133 installed in the U-shaped iron 131. In this embodiment, two neodymium magnetic steel pieces 132 are used as the magnetic steel 132, one stacked on the upper side of the front piece 133 and the other stacked on the lower side of the front piece 133. The magnetic gap 130 is formed between the U-shaped iron 131 and the magnetic steel 132 and front piece 133. The speaker carrier 11 has a magnetic circuit slot 110 that is open at both the top and bottom ends. The magnetic circuit slot 110 has side walls 110a extending vertically and a top wall 110b extending inward from the upper end of the side walls 110a. The distance by which the top wall 110b extends inward is smaller than the radius of the magnetic circuit slot 110, allowing the voice coil 15 to pass through the gap between the top walls 110b and be inserted into the magnetic gap 130 below. The top surface of the U-shaped iron 131 is fixedly connected to the top wall 110b (for example, by adhesive) and its side surface is fixedly connected to the side wall 110a (for example, by adhesive). The airflow channel 18 is formed by airflow slots 110c provided in the side walls 110a and the top wall 110b. The airflow channel 18 has an inlet 181 and an outlet 182, the inlet 181 being surrounded by the top wall 110b and the top surface of the U-shaped iron 131, and the outlet 182 being surrounded by the side wall 110a and the side surface of the U-shaped iron 131.

[0055] The sound-producing diaphragm 14 includes a ball top 141 located in the center and a yoke ring 142 extending outward from the outer edge of the ball top 141, the outer edge of which is fixedly connected to the diaphragm suspension 12. The ball top 141 is generally hemispherical with a central portion that protrudes upward, while the yoke ring 142 gradually protrudes upward between its inner and outer edges. Overall, the height of the yoke ring 142 is lower than the height of the ball top 141. The upper end of the voice coil 15 is fixedly connected to the outer edge of the diaphragm ball top 141 and / or the inner edge of the yoke ring 142. The sound-producing diaphragm 14 further includes an ontology layer and a fabric layer covering the ontology layer. The material of the ontology layer is rubber or silicone, and the fabric layer is selected from one of cloth, silk, PEI, and metal mesh. The sound-producing diaphragm 14 can be suitably controlled in its travel range, optimizing its sound-producing performance and sound quality. Specifically, a fiber layer (e.g., cotton or silk) is cut into a desired shape, and then placed in an injection mold and injected with rubber or silicone to form the sound-producing diaphragm 14.

[0056] Each sound assembly 1 further includes a reinforcing support plate 16 connected between the voice coil 15 and the diaphragm suspension 12. Specifically, the reinforcing support plate 16 has a central hole, the voice coil 15 passes through the central hole, and the outer edge of the voice coil 15 is fixedly connected to the diaphragm suspension 12. An air vent (not shown) is provided in the upper part of the voice coil 15 (specifically, the part higher than the reinforcing support plate 16) at a position higher than the reinforcing support plate 16, so that the closed cavity between the yoke ring 142 of the diaphragm and the positioning support plate communicates with the cavity below the ball top 141, thereby constituting the inner cavity 17 of the sound assembly 1. A lead wire hole 111 is provided in the speaker carrier 11, and the lead wire 151 of the voice coil 15 is drawn out to the outside through the lead wire hole 111.

[0057] Furthermore, the reinforcing support plate 16 includes an ontology layer and a fiber layer covering the ontology layer. The material of the ontology layer is rubber or silicone, and the fiber layer is selected from one of cotton, silk, PC (polycarbonate), and Nomex. The reinforcing support plate 16 has excellent strength and rigidity, and improves the control effect on the deflection width of the voice coil 15. Furthermore, the fiber layer (e.g., cotton or silk) is cut into a first fiber layer of a desired shape, which is then placed in an injection mold and injected with rubber or silicone to form the reinforcing support plate 16.

[0058] The connecting plate 4 is installed in the bracket and has a signal input terminal and N sets of signal output terminals. The signal input terminal is electrically connected to the output end of the digital audio signal input PCB board 3 via a conductor 35, and each set of signal output terminal is electrically connected to the lead wire 151 of one sound assembly 1. Furthermore, there are also N sets of signal input terminals, which correspond one-to-one to the N sets of signal output terminals. Each set of signal input terminal is electrically connected to the corresponding set of signal output terminals (for example, by a conductive metal belt), thereby forming a signal transmission channel, each of which corresponds to one sound assembly 1 and is used to transmit an audio signal to the sound assembly 1. Specifically, the mounting base 2 has an upper surface and an annular connecting flange 22 extending upward from the edge of the upper surface. The mounting groove 20 extends downward from the upper surface. The connecting plate 4 is disposed on the upper surface and is located within the connecting flange 22. N through holes 40 are provided in the connecting plate 4, and the sound assemblies 1 pass through the corresponding through holes 40.

[0059] The edge of the sound-focusing panel 5 is fixedly connected to the connecting flange 22 of the mounting seat 2 and covers the N sound assemblies 1. The sound-focusing panel 5 has N sound-focusing sections 50, with one sound-focusing section 50 arranged above each sound assembly 1. The central sections of the sound-focusing sections 50 are raised upward, and one or more sound holes 501 are provided in the sound-focusing sections 50. Specifically, the sound-focusing sections 50 have multiple connecting ribs, and the sound holes 501 are formed between the connecting ribs, connecting the inner ends of the multiple connecting ribs. The connecting ribs are arc-shaped and extend from above the outer edge of the yoke ring 142 to above the ball top 141.

[0060] A receiving groove (not shown) is provided at the bottom of the mounting base 2, and the digital audio signal input PCB board 3 is placed in the receiving groove. A cover plate 6 is used to close the receiving groove, and the cover plate 6 is fixed to and connected to the bottom of the mounting base 2.

[0061] 11, the digital audio signal input PCB board 3 includes a sound source input module 30, a digital signal processing module 31, a digital encoding module 32, N power amplification units 33, and a power supply module 34. The sound source input module 30 specifically includes a Bluetooth module 301, a digital-to-analog conversion module, and an A2B bus module for inputting an external sound source. Specifically, the Bluetooth module 301 can acquire the sound source through a Bluetooth communication method. 2 The digital-to-analog conversion module 302 is connected to the digital signal processing module 31 via the S audio bus and sends the acquired sound source to the digital signal processing module 31. The digital-to-analog conversion module 302 is specifically a digital-to-analog conversion chip, which can be connected to a general audio input host or earphones, etc. to acquire the sound source. The digital-to-analog conversion module 302 is 2The A2B bus module 303 is connected to the digital signal processing module 31 via an S audio bus and sends the acquired sound source to the digital signal processing module 31. The A2B bus module 303 is specifically an A2B bus chip, and the A2B bus module 303 is connected to the digital signal processing module 31 via a TDM bus and sends the acquired sound source to the digital signal processing module 31. The digital signal processing module 31 is specifically a DSP chip and can execute a directional acoustic beam algorithm to realize the function of directional sound output by the N sound assemblies 1. The signal digital processing module is electrically connected to the digital encoding module 32 and specifically executes TDM or I 2 The digital encoding module 32 is specifically a pure digital SOC encoding chip, and is electrically connected to N power amplification units 33. Each power amplification unit 33 includes one or more power amplification chips to drive a corresponding sound assembly 1. A power supply module 34 supplies power to each of the above modules. The directional acoustic beam algorithm and the algorithm for converting an external sound source into digital signals to drive the N sound assemblies 1 are not the subject of this disclosure, and may be any known algorithm, such as the method disclosed in the applicant's patent CN102404672B.

[0062] The inner wall of the speaker carrier 11 is provided with an airflow slot that can be vented, allowing the airflow generated when the voice coil 15 moves up and down to be discharged from the bottom. After the sound assembly 1 is mounted in the mounting groove 20 of the mounting seat 2, the inner cavity 17 of the sound assembly 1 and the airflow cavity 21 of the mounting seat 2 combine to form an airflow reflow cavity. By adjusting the volume of the airflow cavity 21 (specifically, by adjusting the volume of the sound-absorbing material 102 added), the performance of the specially structured speaker can be optimized and the bass effect can be improved. After the positive and negative poles of the lead wires 151 of each voice coil 15 of the specially structured sound assembly 1 are connected to the connection terminals, the power amplification unit 33 and the lead wires 151 of the voice coils 15 can be correspondingly electrically connected. The pure digital SOC encoding chip in the digital audio signal input PCB board 3 outputs a pure digital switch switching signal of "0101", which is input to multiple pure digital power amplifier chips for amplification, and then input to the connecting plate 4 by the pure digital power amplifier chip, and then input to the voice coil 15 of the sound assembly 1, causing the voice coil 15 to move up and down and make the sound-producing diaphragm 14 produce sound. The multiple sound assemblies 1 each emit sounds of corresponding frequency bands (high frequency, medium frequency or low frequency) based on the corresponding digital signal, and the sound waves of each sound assembly 1 are superimposed to form the desired playback sound field, thereby realizing a modular digital speaker with pure digital signal input.

[0063] The sound-producing diaphragm 14 has a ball top 141 with a folding ring shape, and is further provided with a reinforcing support plate 16 to increase the movement amount, i.e., vibration amplitude, of the sound-producing diaphragm 14. The sound-producing diaphragm 14 is tightly coupled to the diaphragm suspension 12 via the reinforcing support plate 16, so that when the voice coil 15 moves up and down within the U-shaped iron 131, the horizontal deviation of the voice coil 15 when it moves up and down can be controlled.

[0064] In addition, the DSP chip executes a directional acoustic beam algorithm to achieve pure digital directional sound output. The airflow channel 18 and airflow cavity 21 are installed to adjust low-frequency frequencies and optimize low-frequency sound quality. This product's unique structural design and pure digitalization contribute to improved sound generation efficiency, reduced power consumption, improved clarity, and improved reproduction quality of the original sound.

[0065] As used in this specification and claims, the terms "comprise" and "include" merely indicate the inclusion of explicitly recited steps and elements, but these steps and elements do not constitute an exclusive list, and other steps or elements may also be included in the method or apparatus.

[0066] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms "a," "the," and "the" as used herein may include the plural. Additionally, it will be understood that "plurality" in this disclosure refers to two or more, and other quantifiers similar thereto.

[0067] Furthermore, while terms such as "first" and "second" are used to describe various pieces of information, it is understood that these pieces of information should not be limited to these terms. These terms are merely used to distinguish between pieces of information of the same type and do not imply any particular order or importance. Indeed, terms such as "first" and "second" can be used interchangeably. For example, first information can also be referred to as second information, and similarly, second information can also be referred to as first information, without departing from the scope of this disclosure.

[0068] In this disclosure, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include direct contact between the first and second features, or may include contact between the first and second features via other features between them rather than direct contact. Furthermore, a first feature being "above," "above," and "on the upper surface" of a second feature may include the first feature being directly above or diagonally above the second feature, or may simply indicate that the horizontal height of the first feature is higher than that of the second feature. A first feature being "below," "below," and "on the lower surface" of a second feature may include the first feature being directly below or diagonally below the second feature, or may simply indicate that the horizontal height of the first feature is lower than that of the second feature.

[0069] The above examples are merely intended to illustrate the technical ideas and features of the present disclosure and are preferred examples, with the objective of enabling a person skilled in the art to understand and practice the contents of the present disclosure, but do not limit the scope of protection of the present disclosure. [Explanation of symbols]

[0070] 1. Sound assembly (speaker module) 10. Bottom cover 101. Airflow cavity 102. Sound-absorbing materials 11. Speaker carrier 110, magnetic circuit slot 110a, side wall 110b, upper wall 110c, Airflow Slot 111, lead wire hole 12. Diaphragm suspension 13. Magnetic circuit system 130. Magnetic gap 131. U-shaped iron 132, magnetic steel 133, front piece 14. Sound-producing diaphragm 14a, second ontology layer 14b, second fiber layer 141, Ball Top 142 - York Ring 15. Voice coil 151, lead wire 16. Reinforcement support plate 16a, First Ontology Layer 16b, first fiber layer 17. Inner cavity 18. Airflow channel 181, entrance 182, exit 2. Mounting base 20. Mounting groove 20a, bottom wall 21. Airflow cavity 22. Connection flange 3. Digital audio signal input PCB board 30. Sound source input module 301, Bluetooth module 302, digital-to-analog conversion module 303, A2B bus module 31. Digital signal processing module 32. Digital encoding module 33. Power amplification unit 34. Power supply module 35, conductor 4. Connecting plate 40, through hole 5. Acoustic focusing panel 50, acoustic focusing section 501, sound hole 6. Cover plate

Claims

1. A digital speaker system, N (N≧2) sound assemblies; a mounting seat having a plurality of mounting grooves, each of which can accommodate up to one of the sound assemblies; a digital audio signal input PCB board mounted on the mounting seat for receiving an audio signal and converting the audio signal into a digital signal capable of driving the sound assembly to produce sound; Each of the sound assemblies comprises a bracket, a magnetic circuit system provided on the bracket, a sound-producing diaphragm connected to the bracket, and a voice coil connected to the sound-producing diaphragm, the magnetic circuit system having a magnetic gap, a portion of the voice coil being inserted into the magnetic gap, and an inner cavity being formed between the sound-producing diaphragm and the magnetic circuit system; An airflow channel is formed between the inner surface of each bracket of the sound assembly and the outer surface of the magnetic circuit system, and the mounting seat further has an airflow cavity, and each of the inner cavities communicates with the airflow cavity through the corresponding airflow channel. A digital speaker system characterized by:

2. An airflow cavity is provided below each of the mounting grooves, and each of the mounting grooves and each of the airflow cavities communicate with each other. A sound-absorbing material is installed in the airflow cavity.

2. The digital speaker system according to claim 1.

3. Each of the mounting grooves has an annular bottom wall, and the bracket is disposed on the bottom wall.

3. The digital speaker system according to claim 2.

4. The magnetic circuit system includes a U-shaped iron, a magnetic steel and a front piece installed in the U-shaped iron, the bracket having a magnetic circuit slot with both upper and lower ends open, the magnetic circuit slot having side walls extending vertically and a top wall extending inward from the upper ends of the side walls, the U-shaped iron having a top surface connected to the top wall and a side surface connected to the side walls, and the airflow channel formed by the airflow slots provided in the side walls and the top wall.

4. The digital speaker system according to claim 3.

5. The airflow channel has an inlet and an outlet, the inlet being bounded by the top wall and the top surface of the U-iron, and the outlet being bounded by the side wall and the side surface of the U-iron.

5. The digital speaker system according to claim 4.

6. The bracket is provided with a lead wire hole, and the lead wire of the voice coil is drawn out to the outside through the lead wire hole.

6. The digital speaker system according to claim 1, wherein the first and second inputs are connected to the first and second inputs.

7. The digital speaker system further includes a connection plate, the connection plate is installed in the bracket, and the connection plate has a signal input terminal and N sets of signal output terminals, the signal input terminal is electrically connected to the output end of the digital audio signal input PCB board through a conductor, and each set of the signal output terminals is electrically connected to the lead wire of one of the sound assemblies.

7. The digital speaker system according to claim 6.

8. The mounting seat has an upper surface and an annular connecting flange extending upward from the edge of the upper surface, the mounting groove extends downward from the upper surface, the connecting plate is disposed on the upper surface and is located within the connecting flange, and N through holes are provided in the connecting plate, and the sound assemblies pass through corresponding through holes.

8. The digital speaker system according to claim 7.

9. The digital speaker system further includes a sound-focusing panel, an edge of which is fixedly connected to the connection flange of the mounting seat, the sound-focusing panel having N sound-focusing sections, one of which is disposed above each of the sound assemblies so as to cover the sound assemblies, a central portion of each of the sound-focusing sections being raised upward, and one or more sound holes being provided in each of the sound-focusing sections.

9. The digital speaker system according to claim 8.

10. The mounting base has a bottom provided with a receiving groove, the digital audio signal input PCB board is installed in the receiving groove, and the digital speaker system further includes a cover plate for closing the receiving groove, the cover plate being fixedly connected to the bottom of the mounting base.

10. The digital speaker system according to claim 1.

11. The bracket includes a diaphragm suspension and a speaker carrier, the magnetic circuit system is provided in the speaker carrier, the diaphragm suspension is fixedly connected to the speaker carrier, the diaphragm is connected to the diaphragm suspension, and each of the sound assemblies further includes a reinforcing support plate connected between the voice coil and the diaphragm suspension.

11. The digital speaker system according to claim 1.

12. An air vent is provided above the voice coil at a position higher than the reinforcing support plate, and the reinforcing support plate includes an ontology layer and a fiber layer covering the ontology layer, and the material of the ontology layer is rubber or silicone.

12. The digital speaker system according to claim 11.

13. At a given time, M (M≦N) of the sound assemblies make sounds, at a given time, one or more of the N sound assemblies make sounds, and at another time, another one or more of the N sound assemblies make sounds.

13. A digital speaker system according to any one of claims 1 to 12.

14. The maximum outer diameter of the sound assembly is 25 mm or less, and the N sound assemblies are arranged in a linear, rectangular, or circular array.

14. A digital speaker system according to any one of claims 1 to 13.

15. The digital audio signal input PCB board includes: a sound source input module for inputting an external sound source; a digital signal processing module for receiving an external sound source input to the sound source input module and executing a directional acoustic beam algorithm to output directional sound through the N sound assemblies; a digital encoding module for generating a pure digital switch switching signal based on the output of the digital signal processing module; one or more power amplification modules for driving one or more of the sound assemblies to produce sound based on the pure digital switch switching signal; At one time, one or more of the N sound assemblies emits sound, and at another time, another one or more of the N sound assemblies emits sound.

15. A digital speaker system according to any one of claims 1 to 14.

16. 16. A method for controlling a digital speaker system according to claim 1, comprising the steps of: executing a directional acoustic beam algorithm to generate a purely digital switch switching signal; and driving one or more of the sound assemblies to emit sound based on the purely digital switch switching signal by a power amplification module, wherein at a certain time, one or more of the N sound assemblies emit sound, and at another time, another one or more of the N sound assemblies emit sound.

2. A method for controlling a digital speaker system, comprising:

17. 1. A sound assembly comprising: A bracket and a magnetic circuit system provided within the bracket and having a magnetic gap; a sound-generating diaphragm connected to the bracket; a voice coil connected to the sound-producing diaphragm and a portion of which is inserted into the magnetic gap; An inner cavity is formed between the sound-generating diaphragm and the magnetic circuit system, An airflow channel is formed between the inner surface of the bracket and the outer surface of the magnetic circuit system, and an airflow cavity is further formed within the bracket, and the inner cavity communicates with the airflow channel via the airflow cavity and is closed by the bracket. A sound assembly characterized by:

18. The magnetic circuit system includes a U-shaped iron, a magnetic steel and a front piece installed in the U-shaped iron, the bracket having a magnetic circuit slot with both upper and lower ends open, the magnetic circuit slot having side walls extending vertically and a top wall extending inward from the upper ends of the side walls, the U-shaped iron having a top surface connected to the top wall and a side surface connected to the side walls, and the airflow channel formed by the airflow slots provided in the side walls and the top wall.

18. A sound assembly according to claim 17.

19. The airflow channel has an inlet and an outlet, the inlet being bounded by the top wall and the top surface of the U-iron, and the outlet being bounded by the side wall and the side surface of the U-iron.

20. A sound assembly according to claim 18.

20. The bracket is provided with a lead wire hole, and the lead wire of the voice coil is drawn out to the outside through the lead wire hole.

20. A sound assembly according to claim 18.

21. The bracket includes a speaker carrier and a bottom cover connected to a lower end of the speaker carrier and closing the lower end of the speaker carrier, the airflow cavity being formed in the bottom cover, and the magnetic circuit system being provided in the speaker carrier.

20. A sound assembly according to claim 18.

22. The bottom cover has a protrusion protruding upward, the magnetic circuit system contacts the protrusion, and the airflow cavity is provided with a sound-absorbing material.

22. A sound assembly according to claim 21.

23. The bracket further includes a diaphragm suspension fixedly connected to an upper portion of the speaker carrier, the diaphragm being connected to the diaphragm suspension, and the speaker module further includes a reinforcing support plate connected between the voice coil and the diaphragm suspension.

22. A sound assembly according to claim 21.

24. An air vent is provided above the voice coil at a position higher than the reinforcing support plate, and the reinforcing support plate includes a first ontology layer and a first fiber layer covering the first ontology layer, and the material of the first ontology layer is rubber or silicone.

24. A sound assembly according to claim 23.

25. The sound-generating diaphragm includes a second ontology layer and a second fabric layer covering the second ontology layer, and the material of the second ontology layer is rubber or silicone.

20. A sound assembly according to claim 18.

26. The maximum outer diameter of the speaker module is 25 mm or less.

20. A sound assembly according to claim 18.

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