RFID system for textile materials

Abstract

The present invention relates to the field of electronic devices, in particular to the field of data transmission and reception operating at radio frequencies, in particular to the field of tags operating with RFID technology. In particular, the present invention relates to a device for RFID communication, preferably applied or produced on a flexible or semi-flexible support, in particular a textile support.

Description

[Technical Field]

[0001] The present invention relates to the field of electronics, in particular to data transmission and reception technologies operating at radio frequencies, and more particularly to tags (TAGs) operating with RFID technology, and more particularly to RFID communication devices intended for use on flexible or semi-flexible substrates, in particular textiles.

[0002] The present invention aims to further improve and develop the invention described in Patent Application No. 102015000055504, filed by the applicant on September 25, 2015. Similar to the prior art, the present invention also relates to an innovative electronic system that can be integrally formed or attached to a flexible or semi-flexible substrate, particularly certain textile materials, and a method for manufacturing the same.

[0003] Let us now take a step back and briefly summarize the problem that the previous patent application sought to solve (and that this patent application solves even more elegantly and innovatively). As is well known, when referring to electronic devices fabricated on a textile support, radio frequency devices are usually considered. This technology typically uses electromagnetic signals at standardized frequencies between 125 KHz and 5.8 GHz (e.g., 860-960 MHz for UHF RFID coding) to exchange information contactlessly from a reader device to a tag. Since tags generally do not have their own power source, they are powered by a carrier wave coming from the reader, and therefore it is clear that a coupling of the energies of the two devices is essential.

[0004] Antennas typically used in RFID are sized proportionally to the theoretically estimable quantity, allowing for coupling of electromagnetic fields and mutual inductance between two devices, which is one of the reasons why RFID technology can operate over distances of several meters.

[0005] RFID is a standard radio frequency identification (RFID) technology that uses magnetic induction for medium-range contactless communication, making it popular for communication between electronic devices such as mobile phones.

[0006] This medium-range communication (average several meters) is an alternative to Wi-Fi and Bluetooth (registered trademark) and is used in mobile and fixed communication devices, automatic product identification, electronic keys, equipment identification and configuration services, and information management in logistics processes.

[0007] Today, products using RFID technology use rigid or semi-rigid materials. For example, RFID devices are typically mounted on a dielectric plastic support (PET and PU are the most commonly used). Currently available variations on this solution either replace the plastic support with a paper one, or attach it to a polymer support that is then bonded to the fabric (e.g., bonded tags, as in the case of smart labels).

[0008] However, it has become known that placing RFID devices on rigid or semi-flexible supports poses several problems, both during the realization stage and in the subsequent practical application stage, putting the brakes on projects using this technology, both for economic reasons and due to limited feasibility.

[0009] Several issues are of particular concern: Existing RFID devices are made by printing or bonding a spiral conductive layer onto a dielectric (or another support). To work, the antenna must be sized correctly to have an inductance that is sensitive to the transmission wavelength (860 MHz in this case). The result is a conductive antenna on which all measurements are calculated.

[0010] An electronic chip (die) is soldered or glued to the center of the antenna, but the conductive (wiring) pattern formed on a soft support has low resistance to bending (especially lateral bending), and damage to the chip's solder joints causes the tag to break. Pressure, pulling, creases, impacts, etc. on the fabric can cause cracks or breaks in the joints, ultimately causing the device to stop functioning.

[0011] Furthermore, due to the metal components used in the electronic circuitry and the method of bonding the chip, the device as a whole is extremely fragile, and if any of the metal components are damaged or tampered with, or if the chip becomes detached, the entire RFID system will become unusable, which has led to the abandonment of this technology in various fields.

[0012] Furthermore, the rigid or semi-flexible support on which the device is mounted limits its flexibility, narrowing the range of possible applications.

[0013] This is true not only for the present invention, but also for previous inventions that devise the realization of electronic devices for flexible or semi-flexible supports and methods for the realization of such devices.A further object of the present invention is to devise a reliable electronic device for a flexible or semi-flexible support.

[0014] Furthermore, one of the objectives of the present invention is to realize an electronic device for a flexible or semi-flexible support, which allows the device to be used in a wider range of applications. Another objective is to introduce an electronic device for a flexible or semi-flexible support, which solves the problems of the device by improving its method of realization and expanding its frequency of use. Therefore, it is an objective of the present invention to introduce a method or process for realizing an electronic device for a flexible or semi-flexible support, which makes it possible to solve the problems of the prior art and which brings about further application advantages.

[0015] The aim of the present invention is to present a method that, while preserving the above-mentioned advantages, in addition to advantages such as reduced manufacturing costs, technical simplicity and the possibility of expanding the frequency range of use, actually significantly improves their properties. This can be achieved by realizing electronic devices on flexible or semi-flexible supports. This method uses a new device, particularly useful for textiles, instead of a metallic coupling for inductive coupling, for the realization of devices operating at high frequencies. It utilizes the principle of flexible metals for the interference of magnetic fields generated by emitter systems such as RFID. This allows the realization of devices on textile materials.

[0016] [Summary of the Invention] An example of such a system incorporating the present device is described below, with particular reference to improvements in a previously filed patent filed by the applicant. The system comprises at least one support, preferably a flexible or semi-flexible surface, preferably fabric, and at least one layer of thermally adhesive dielectric material having a smooth surface, and according to one embodiment, at least one primary antenna of formed aluminum laminate or wire conductive material, a substantially rigid electrical module, a specially formed secondary antenna of ultra-flexible conductive material, e.g., conductive fabric, and a closure layer of adhesive or thermally adhesive dielectric material.

[0017] The RFID system for soft substrates such as textiles disclosed herein comprises an apparatus including:

[0018] - Dielectric base layer. - A secondary antenna made of conductive fibers. - At least one die electronic module. It is further characterized by the following: - Main antenna made of laminate or wire conductive material. - at least one dielectric closing layer;

[0019] The device is fixed to at least one flexible or ultra-flexible support. The RFID system is a UHF, HF, and / or NFC RFID system. A conductive fiber secondary antenna is positioned to reinforce the main antenna, which is made of a laminate or wire conductive material, and one or both are configured to refract the magnetic field emitted by the RFID / NFC reader. The secondary antennas are centered and overlapped with respect to the main antenna, allowing electrical conduction even if the main antenna is damaged. A magnetic field crosses the two conductive antennas, activating the electronic module and amplifying the signal emitted by the module. Dielectric and dielectric layers are coupled between them, the support layer, the module, and the main antenna, and the conductive fiber secondary antenna remains housed between the layers.

[0020] Also, in RFID systems for soft supports such as fabrics, the antenna of conductive fibers and the antenna of laminate or wire conductive material are equal or substantially equal in shape and dimensions to each other and are electrically connected on one or both sides to a rigid electronic module for the purpose of receiving induced radio frequencies according to a known frequency.

[0021] It should be noted that, especially, the main conductive antenna of laminate or wire material is made with an innovative and carefully studied shape, i.e. the main antenna and the secondary antenna have the same shape / geometry and are connected by direct contact through conduction. The fact of having the same geometry makes it possible not to modify the electrical and electronic properties of the laminate or wire main antenna, but to increase the life expectancy of the entire device with optimized reflection of the electromagnetic field.

[0022] Currently proposed main antennas have various shapes and thicknesses designed to optimize the electrical efficiency of the device itself. The generated magnetic field waves are completely intercepted by the entire antenna itself, enabling the reading of electronic tags. However, a drawback is that when mechanical stress is applied, microcracks or breaks occur along the metal structure of the main antenna, interrupting electrical conduction within the device. This is a typical fatigue failure, but in the present invention, this phenomenon does not occur due to the appropriate coupling of the two main and sub antennas.

[0023] By precisely overlaying the secondary antenna made of flexible conductive material with its antenna shape (the antenna selected is preferably the same or similar to, but not necessarily the same as, the underlying primary antenna), the device can maintain electrical continuity and continue to function even if the primary antenna breaks. Without the secondary antenna made of conductive fiber, the primary antenna made of laminate or wire material would break, effectively ceasing operation of the device.

[0024] In contrast, by utilizing the electrical conduction of the secondary antenna made of conductive fibers in the electromagnetic field, not only is there no disruption or interference during normal use, but it has also been confirmed that even if either the primary or secondary antenna is damaged, the signal consisting of the data transmitted from the module and the initial magnetic field refracted by the combined antennas (primary and secondary) can be amplified and reach the reader's antenna, making it possible to read the contents of the module's memory. This was not possible with prior art systems that only had one antenna, due to the small size of the remaining antenna connected to the rigid module in the event of a wire break.

[0025] Thus, compared to conventional amplification systems, in particular UHF and NFC RFID tags, the advantage is that the module can be read even when subjected to complex mechanical stresses.

[0026] A conventional RFID system consists of an electronic die (chip), a dipole antenna of any design made of conductive material in laminate or wire form, and coupled by electrowelding or inductive coupling. It covers all devices that respond to frequencies between 10 KHz and 2.4 GHz.

[0027] The present invention has the advantage that the combination of the primary and secondary antennas allows for a much more robust UHF and / or NFC RFID system in a variety of sizes than conventional UHF and / or NFC RFID systems.

[0028] The main antenna is preferably manufactured with variable length sides to suit the selected application, and is variable in size substantially greater than 5 mm, based on tests conducted to ensure consistent readings even with the smallest reader distances, and is not intended to limit the scope of the invention.

[0029] This example embodiment has been researched and combined to optimize not only the reader antenna's response to magnetic fields, but also the electrical coupling between the laminate or wire conductive material layer of the primary antenna and the flexible conductive material of the secondary antenna, which may be a fabric made with conductive, conductive / dielectric, or nanotechnology warp and weft yarns (created using various techniques to add conductive material to conventional yarns).

[0030] Conventional conductive materials, i.e. laminates or wires (in the case of the main antenna), refer to dipole antennas made from, for example, aluminum, steel, copper, brass, gold, or bronze, or any material that can conduct electricity but does not have a woven structure. "Woven structure" refers to the formation of a conductive layer obtained by weaving two threads together, for example at a 90-degree angle. Such threads can be both conductive or one conductive and the other non-conductive. This configuration can be a single thread or a composite thread, i.e. a thread of non-conductive fibers braided with conductive fibers.

[0031] A feature that is too thin may reduce the amount of material to adhere and complicate the bonding process, whereas a feature that is too large may result in suboptimal readability and increased manufacturing costs. Applicant's research has shown that foil thickness should not affect the functionality of the device.

[0032] Calculations performed on the design of some embodiments indicate that a suitable thickness should be approximately 30 microns (with a range substantially between 2.5 and 200 microns) for both conventional and flexible conductive materials.

[0033] Please note that if the thickness is too small, the device will not function due to its low permeability to magnetic fields. Therefore, the minimum measurement value that can be adopted is approximately 4-5 microns. On the other hand, if the thickness is too thick, the fabric structure will become significantly rigid. For example, signal amplification was detected even with a thickness of two 20-cent coins, i.e., 2 mm. Excellent results were obtained with 14-micron aluminum foil and 50-micron silver- or copper-based conductive fibers, which allowed for high flexibility and excellent reliability. Good results were also obtained with copper, brass, gold, and silver (more expensive solutions). Essentially, any conductive material is suitable for creating foil. Therefore, the secondary antenna not only prevents mechanical damage to laminated or wire-based conductive materials, but also amplifies their effectiveness in terms of, for example, read distance, flexibility in the fabric field, thickness, and mechanical resistance.

[0034] In another embodiment, the electronic chip is soldered to a small primary antenna 4. That is, the antenna (defined as a module in the figure legend) made of a flexible or rigid area is a 3 x 8 mm layered antenna that transmits at frequencies between 860 and 960 MHz for RFID devices and 13.56 MHz for NFC devices and is sized to generate sufficient impedance to generate a potential difference sufficient to power a memory-equipped chip. However, due to its small size, the primary micro-antenna alone is not capable of communicating with the reader (hence, amplification by a secondary antenna is required, as explained in more detail in the following figure). One relevant factor to consider in order to maximize the use of magnetic field reflection is that the primary and secondary antennas have identical (or substantially identical) geometries.

[0035] The shape used here is optimized for compatibility with a wide range of readers. If the surface area of ​​the aluminum main antenna is too small, it will significantly reduce the device's reading distance and may even hinder its operation. Conversely, if the shape is too large, it will tend to block the reader's radio waves, making data transfer impossible.

[0036] In this regard, it should be noted that a large number of RFID tags, particularly UHF, suitable for application to soft clothing products are known in the art. US2016 / 0019452 describes a UHF RFID tag that can remain attached to clothing during washing and other processing steps. In particular, the tag describes a hybrid slot-loop antenna structure combined with a particularly large surface area conductor in the form of a metal sheet.

[0037] Therefore, this antenna is a dipole antenna. Creating a UHF tag suitable for insertion into fabrics (amplified dipole antennas) was created using UHF rigid electronic components (Hitachi IM5-PK2525). Details here and various structural models show how the device is placed between two dielectric layers that cannot be heat-sealed.

[0038] Here, the device of US2016 / 0019452 shows that it is always related to the mechanical resistance of the antenna in conductive and non-conductive materials, and the concept of a hybrid combination of rigid and flexible materials is not mentioned. In case of damage to the panel, the tag will suffer a significant decrease in performance and will eventually become unusable.

[0039] It is worth noting that, generally speaking, amplification of the inductive signal generated by an RFID antenna can be achieved by inductively coupling an antenna of a size responsive to a known frequency (13.56 MHz in the case of NFC coding), but this increases the antenna's dimensions. This is the case for both dipole antennas (in the case of UHF RFID) and "loop" antennas. However, while this solution improves the efficiency and functionality of the tag in the specific case of the 13.56 MHz frequency, it does not solve the problem of the fragility and reliability of the conductive (wiring) pattern or the resistance of the wires from which this "loop" is created. Therefore, this solution was not used in the field of electronics in textiles until the introduction of this invention.

[0040] WO2014 / 204322 describes an RFID tag suitable for use on linens such as sheets. The tag is a UHF tag that can be thermally bonded to a textile support. The system is based on an antenna made of bipolar steel wire. Various antenna shapes are presented here. The material used is basically thermally adhesive, but the entire product is a standalone device suitable for connection to textiles. Also, in this case, an antenna is attached to the textile via a thread (its operation and performance are completely identical to the previously described document, it is a UHF tag, only the shape used is different). Furthermore, the manufacturing costs of the "steel wire" are much higher than creating a poly-coupling aluminum inlay using conductive fibers.

[0041] Furthermore, in both US2016 / 0019452 and WO2014 / 204322, the electronic chip is placed "outside" the amplified antenna, and the system operates through mutual induction. While this eliminates the issue of welding between the chip and the antenna, in various industrial applications such as laundry, industrial chemical finishing, milling, and carding, displacement of the rigid module occurs, interrupting the inductive conduction and causing the device to fail.

[0042] Furthermore, EP 1 605 397 mentions the use of a printed aluminum dipole antenna of a specific shape that can amplify the signal of an IC tag, but it is created in a polymer support and does not mention fabric or the like, and only generally describes an IC chip that is not soldered into the antenna shape presented.

[0043] The patent purports to present a series of antennas with electronic dies welded to them. This is a conventional UHF plastic tag. As is known, such tags can be used to remotely track products. In this structure, the tag has low mechanical strength and is therefore not suitable for application to textiles.

[0044] Finally, EP 1 739 597 describes a method for constructing a wireless IC tag. Specifically, it describes how to create UHF signals in a silicon system that includes two antennas suitable for amplifying the signal. The product is said to be waterproof and can be used on fabrics. This construction technique not only makes the device waterproof, but also protects it with a thick layer of silicon that makes it more resistant to bending (reducing its flexibility). However, it should be noted that the device is thick, inflexible, and has very different properties from fabrics.

[0045] Therefore, the fact that all devices have dipole antennas and that loop antennas (NFC) are not mentioned anywhere in the documents makes it clear that the above mentioned system / device / method is only suitable for the realization of UHF tags, since, as known to those skilled in the art, HF and NFC tags are readable at short distances (improving privacy), can be read even when in contact with liquids (unlike UHF tags) and, above all, allow interfacing with most smartphones available on the market.

[0046] However, the present invention aims at creating a high mechanical strength UHF RFID tag for production stage tracking, logistics management and retail management in the textile sector via a single device, by means of an innovative method as already explained and by combining a primary laminate or wire and a secondary textile antenna, as will be described in more detail below.

[0047] Of particular benefit, in the realization of the innovative device of the present invention, the process or method for conductive (wiring) patterns in the fabric is a fundamental part of the various functions that characterize the innovative fabric memory system described below. Reference is made to a patent application previously filed by the applicant, which is hereby incorporated by reference for the reasons explained above, regarding the principle of dual bonding between a wire or laminate conductive material and a flexible conductive material.

[0048] In principle, placing a metal element, i.e., a reflective element, under an RFID or NFC tag is completely unusual and not recommended. It should be noted that, in support of this thesis, there are RFID, NFC, and HF tags on the market that are shielded with ferromagnetic materials so that they work on metal products. Instead, by shaping a flexible metal sub-antenna in a functional way, many of the emitted waves are not reflected. This wave stresses the module, amplifying the overall signal and allowing it to pass through the device using refracted waves around it. This is completely new in the fields of RFID, NFC, and HF. All of this has already been described in a previous patent application that is currently being finalized.

[0049] With respect to the innovative process steps already described, the advantage of applying a laminate or wire (e.g., metal) antenna directly onto a fabric, or subsequently applying a dielectric and water-repellent material to said laminate or wire antenna, is that it creates a multi-layer structure that improves the overall properties of the device itself or makes the laminate or wire antenna more resistant to breakage on the fabric. Furthermore, the substrate formed by the base dielectric layer is fixed to the fabric on one side, leaving a smooth surface for the sheet to rest on, improving the adhesion of the metal layer on the fabric and reducing the rate of moisture penetration across the barrier formed by the layer, thereby extending the life of the device.

[0050] It should be noted that existing solutions have been proposed without a base, which has many drawbacks. Therefore, in this patent application, as will be made clearer below, a base is always present to give structure to the device. The base can be any material, such as a polymer.

[0051] Furthermore, the devices described in the prior inventions, unlike the conductive (wiring) patterns for the fabric described in the present invention, do not have welds because the basic components of the system and its devices are now fastened by a different method (i.e., dome welding, described in more detail below, which saves time and costs) that has solved the problem of breakage with welds.

[0052] While this improved patent application includes the improved features described above, the system also includes additional innovative features that improve the performance of the conductive (wiring) pattern in the fabric (in terms of cost reduction, applicability to standard production cycles, production complexity, etc.), and also solves problems that existed in the previous patent application.

[0053] Similarly, this improved patent application details a textile digitization method that offers even better performance and solves some of the problems encountered in the prior patent application. Thus, while the original method was advantageous, research and testing have enabled the creation of multiple innovative variations on the prior invention. Among other advantages, it includes an implementation method and related systems / apparatus, as well as one or more variations of the method and system / apparatus, and also includes examples of using textiles such as polyester / silver, polyester / copper, and nickel / copper. Because conductive fibers are the only mechanical element capable of maintaining constant electrical conduction, they must possess a specific characteristic, namely, controlled elongation. The secondary antenna utilizes this characteristic.

[0054] Indeed, if fabric is used as the base layer, the dielectric material used in the dielectric layer, or the primary antenna, for example, aluminum, would lack structural support and could stretch or deform, potentially causing damage to the electronic device. Therefore, the secondary antenna, made of a fibrous material (in this case, fabric) used as a reinforcement, must possess at least the above characteristics to provide support, structural integrity, and electrical conductivity. This secondary antenna would be part of the process in the innovative variant covered by this improvement patent.

[0055] In particular, the process of the present invention includes a better use of the dielectric element layer, preferably a material belonging to the group of thermoplastic polyurethanes or thermoplastic polyurethanes. Furthermore, the innovative approach is that the dielectric layer is fixed to the substrate (preferably fabric) by heat pressing or by applying heat with an adhesive. The best solution remains the heat pressing. This is because, for example, when using the device on a shirt, it has been observed that TPU causes numerous wrinkles and creases in the area where the device is fixed when the garment is washed and then ironed. By using the heat pressing instead, this problem is significantly reduced.

[0056] In the prior art patents, the dielectric layer was formed, for example, using the following method. - Screen printing technology: Applying the dielectric material in multiple layers has proven to produce good results. At first glance, it looks like paint, and more steps are required to achieve sufficient layers. However, more layers mean higher manufacturing costs, processing issues, and over time, the folds in the fabric can create cracks and not seal the device properly.

[0057] - Inkjet printing: This was a very slow process. The ink penetrated the fabric, which meant it was not possible to create a strong layer of dielectric material to effectively support the metal antenna. Unlike screen printing, where the material is "paste-like," inkjet printing deposits the dielectric material in liquid form. This liquid penetrates the warp and weft of the fabric to form a "structural" bottom surface, but it requires multiple layers, with sufficient drying time between layers.

[0058] - Flexographic printing: a technology similar to inkjet printing, without the speed problem, but with the drawback that the ink tends to penetrate the fabric and the holes between the warp and weft threads cannot be closed, making it impossible to provide a suitable support layer from a structural and waterproof point of view.

[0059] - Spray technique: tends to harden the fabric. - Coating technique: only useful for large-scale processes, it cannot be created in localized areas, but creates a uniform layer over the entire fabric.

[0060] - 3D printing technology: The processing time is long and the dielectric material is too hard for the fabric. - Tape extrusion technology. - Die cut in polymer material. Furthermore, it has been observed that using TPU with a thickness of approximately 85 microns (value range of 25 microns to 2 mm) further improves the problem of creases and wrinkles after ironing.

[0061] Please note that any thermo-adhesive polymer material, not necessarily polyurethane-based, may be suitable for the purpose, even thinner materials such as 25 micron thick PVC, providing sufficient adhesion and buoyancy to the fabric. Of course, thicker TPU can be used, but the device will be less flexible.

[0062] This category of material, namely TPU, is used in an innovative way, always at a constant thickness, to give the device structure and make it waterproof. Usable supports may also be semi-rigid, such as PET. It should be noted that, in general, any type of dielectric material may be suitable for the purpose. Here, we will mention those considered to be the best, without prejudice to the scope of protection of the present invention.

[0063] The TPUs that are the subject of the present invention have, among other properties that have not been mentioned previously and that are useful for the present invention, the property of having an adhesive on at least one side that penetrates the fabric, exhibits good adhesion, and leaves a substantially smooth layer on the opposite side of the fabric.

[0064] However, even if the components are not heat-sealed to the fabric, it is possible to obtain a technically sophisticated solution. In the present approach, as described here, it is advantageous to apply the antenna made of a flexible conductive material to a surface that does not penetrate the fabric. This smooth surface allows the material to slide slightly (in the order of microns) on the dielectric, which improves the device's response to bending while preserving readjustment margins between the elements, and in particular reduces the device's breakage in a better way.

[0065] Furthermore, by applying a TPU with the above properties and at a specific thickness (as mentioned above), the effect of wrinkles on the outer surface of the fabric is also reduced. The selected TPU provides the best compromise between flexibility and durability.

[0066] Tests with other materials have shown that even with intensive use of the device, it is not possible to remove creases from clothing. Essentially, greater thickness results in fewer aesthetic defects, but at the expense of the flexibility and "softness" of the device.

[0067] Unlike previous inventions, this one incorporates a flexible conductive layer with a soldered chip, which is further bonded to a metal conductive layer. This layer includes a dielectric sealing layer, preferably always made of TPU, more preferably a TPU element approximately 250 microns thick (ranging from 25 to 250 microns), applied by heat pressing. Other techniques described in previous patents do not guarantee a mechanical seal of the rigid electronic module at the designated locations, making them non-functional and unnecessary. The dielectric closure material may be non-thermoadhesive or preformed prior to application.

[0068] In a further, improved and innovative way, a dielectric base element is fabricated for the device of the system and method of the present invention, preferably having a surface higher than that of the dielectric encapsulation element. The reduction of the surface can be achieved in various ways suited to the purpose, for example, by giving the dielectric base element a specific shape. Essentially, regardless of the shape, the shape of the base element must advantageously allow free space between the fabric and the upper dielectric encapsulation layer. This allows the upper encapsulation layer to be welded to the fabric, advantageously improving the physical tightness of the entire device. Furthermore, the stiffness of the module is reduced, and even better, the welding minimizes areas that can become wet, improving the waterproofing of the electronic components.

[0069] It should be noted that this is a very important advantage over previous inventions, as the device is often applied to wearable or washable clothing, and increasing the waterproofing of electronic components increases the lifespan of the device.

[0070] Furthermore, compared to the prior art, the method and device described in this invention include an innovative modification in which the dielectric element is made of Kapton or PET, preferably 25 to 50 microns thick. In this case, an air gap is formed between the Kapton element and the fabric, so the Kapton is not glued to the fabric. A secondary antenna is attached to the flexible fabric, and a chip is resin-coated onto it to form a rigid electronic module. Finally, a closure layer, preferably made of TPU, is applied (details will be described later with reference to the accompanying drawings). The TPU closure layer encases all other elements, ensuring the device's compactness. This embodiment is particularly advantageous because the flexibility of the innovative electronic device is much greater than that of the basic electronic device. Meanwhile, the fabric cannot be ironed in the area where the device is attached, which creates primarily an aesthetic problem rather than a functional one. Therefore, this solution is advantageous when the device is located in an inconspicuous location. It should be noted that Kapton, in addition to its heat resistance and dielectric non-deformability, also offers excellent moisture resistance.

[0071] A better and more innovative variation of this method and related device is to punch a flexible metal layer into the TPU layer, i.e., the dielectric layer, which acts as the base, and then attach it to the fabric layer, which also acts as the base. This is particularly advantageous during the production phase, as it avoids the need for thin secondary antennas, which would be very difficult to handle and move during the assembly process of the entire device. This also makes it possible to keep pre-manufactured semi-finished products in stock and attach them directly to the fabric in a later process.

[0072] In this embodiment, the semi-finished product preferably consists of: - Base TPU layer. - A secondary antenna made of flexible conductive material (e.g. conductive fabric). - A chip with a main antenna made of conductive material in the form of a laminate or wire.

[0073] - Dielectric encapsulation layer. The manufacturing process includes the following steps: - Manufacturing of TPU semi-finished bases and sub-antennas made of flexible conductive material suitable for both hot and cold lamination.

[0074] - Assembling the chip with an antenna made of conventional conductive material (using the method below). - Encapsulate with a top dielectric layer.

[0075] Furthermore, as a further advantageous and innovative method, in one embodiment of the innovative fabric conductive (wiring) pattern process, part of the process for manufacturing the innovative electronic device is separated from the direct application of the conductive fabric to the secondary antenna during the realization stage. Thus, an assembly is essentially produced that includes at least one base dielectric layer, the primary antenna and its electronic module, which is bonded to a second assembly that includes an adhesive or thermally bonded dielectric material and a secondary antenna of conductive fabric.

[0076] The assembly can be advantageously applied in a single step to a base fabric to which a finished device with suitable properties for the purpose is applied in a single step of the process, thus advantageously significantly reducing application time and eliminating some application problems.

[0077] Therefore, the procedure involves the following steps: - Manufacturing of semi-finished electronic devices, including at least a basic dielectric layer and a main aluminum antenna with a rigid module.

[0078] - Manufacturing a second assembly comprising at least one secondary antenna and a conductive and dielectric fabric adhesive / thermal adhesive.

[0079] - Assembly with fabric (explained below). Having an assembly or already packaged innovative electronic device in stock can significantly reduce processing time, as the device can simply be attached to the fabric instead of creating each device on the fabric. Furthermore, considering that in many cases the fabric needs to be printed, colored, and / or customized according to the customer's requirements, if the device is already pre-packaged, the processing time upon order arrival is limited to customizing the fabric and installing the electronic device.

[0080] The fabric used must have the properties of being resistant to treatment at least at high temperatures (effectively up to 200 degrees Celsius).

[0081] The fabric memory system is completed by applying the electronic device, for example, in a heat press at 150-160 degrees Celsius for 15-20 seconds, or preferably by applying ultrasound for about 4 seconds.

[0082] In this case, the semi-finished products are prepared on line and assembled when the printed fabric arrives at the company, reducing overall production time.

[0083] The overall production process is sped up by saving various heat pressing steps (totaling approximately 60 seconds), which in some versions of the invention can be reduced to one step (totaling 20 seconds).

[0084] As a further advantage and innovation, the Applicant believes that it is preferable to use two types of TPU:

[0085] The first type of TPU, used for the base layer, is preferably a 90 micron TPU consisting of a layer of "adhesive" and a non-adhesive elastic liner. This material penetrates about two-thirds of the fabric thickness and remains lifted about 25 microns from the fabric.

[0086] The second type of TPU, used for the cover layer, is preferably a 250-micron TPU consisting of an adhesive layer and a non-adhesive elastic liner. This product consists of approximately 50 microns of adhesive that melts into the fabric and the lower layer of the device, while the remaining 200 microns securely fastens the main antenna and rigid module without tearing (the rigid module at the edge could cut through this material). Thinner (90 microns) but much more elastic materials have also been tested. Even better, these materials increase the overall flexibility of the device and, because they are more elastic, avoid cutting through the rigid module.

[0087] These and other advantages associated with this innovative fabric memory system and associated digitization process may be better understood by reference to the accompanying drawings. [Brief explanation of the drawings]

[0088] [Figure 1] 1a and 1b are exploded and plan views of a first embodiment of the system described herein. [Figure 2] 2a and 2b are exploded and plan views of a second embodiment of the system described herein. [Figure 3] 3a and 3b are exploded and plan views of a third embodiment of the system described herein. [Figure 4] 4a and 4b are exploded and plan views of a fourth embodiment of the system described herein. [Figure 5] 5a and 5b are exploded and plan views of a fifth embodiment of the system described herein. [Figure 6] 6a and 6b are exploded and plan views of a sixth embodiment of the system described herein.

[0089] [Detailed explanation of the figure] Referring to Figure 1 (Model 1), a basic model of the conductive pattern of the fabric described herein is shown in another perspective and exploded view. The system comprises at least one layer of adhesive or thermo-bondable dielectric material 11, a secondary antenna (here preferably "dipole" shaped) of conductive material within conductive fibers 2, a laminate or wire antenna of a primary shape including slots 4, at least one rigid electronic module 3, and at least one upper dielectric closure layer 5.

[0090] It should be noted here that the dielectric 11 can be a polymer, a thermo-adhesive material, a fabric and / or a polyurethane layer coated fabric, a non-woven fabric, TNT, and / or a naturally occurring material.

[0091] The advantages of the bonding between two conductive layers of textile antennas and other laminate or wire antenna types for use in devices with structural polymer shapes, i.e., the advantageous and innovative aspects of the conductive patterns in fabrics described herein, have been extensively described above, and now more attention will be paid to the innovative aspects of the textile digitization process described herein. In particular, this procedure for a Type 1 model system includes at least the following steps:

[0092] · Dielectric sizing or rolling of dielectric 11. The conductive fiber layer of the sub-antenna 2 (the model having the above-mentioned "adhesive surface") is formed in advance by punching, laser cutting, mechanical cutting, etc., to form a predetermined shape (conductive fiber layer) = (conventional conductive fiber layer).

[0093] The dielectric layer 11 is hot or cold pressed using a roller press, a flat press, a heat press (e.g., 55°C for 15 seconds), an ultrasonic system, or any other technique suitable for bonding two layers together.

[0094] Alternatively, the conductive fibers 2 of the sub-antenna are laminated to the adhesive / thermobondable dielectric 11 by conventional lamination.

[0095] Punch out half of the layer of the conductive fiber sub-antenna 2 without cutting the adhesive / thermo-adhesive dielectric 11 by punching, laser cutting, mechanical cutting, ultrasonic cutting, etc.

[0096] Scraping excess conductive material from the antenna 2 and then sizing the adhesive / thermobondable dielectric 11. Ultrasonic systems have the advantage of lowering the operating temperature of the whole process and shortening the process time (4 seconds at room temperature).

[0097] Pre-forming the main antenna 4 from conductive material 4, for example by stamping, laser cutting or machine cutting.

[0098] Using a control system such as a pick-and-place system, the main antenna 4 is placed at the center of the dielectric layer 5. (One example includes a process of heating and pressing the main antenna at 150°C for 1-2 seconds to ensure good adhesion to the thermal adhesive dielectric.)

[0099] · Bonding stage: The bonding points are created using a machine. Positioning the rigid electronic module 3 using a control system. · Connecting Assembly 1 and 2 with Assembly 3, 4 and 5 via the control system.

[0100] Closure device D can be heat sealed at 155°C for, say, 1 / 2 second. System 1 (and all subsequent systems manufactured in a similar manner) is then assembled from the dielectric encapsulant layer 5 side by heat welding, sewing, or other methods described below, so that "visually" System 1 (and all other embodiments) is mounted "backwards" relative to the drawing.

[0101] Thus, the device D is welded to the fabric and subsequently attached to the fabric at the stage of a conductive (wiring) pattern, allowing for the transfer of logos or patterns onto the fabric in a substantially inconspicuous manner. In this configuration, the system 1 is fabricated directly onto the base fabric, and the edges of the fabric are formed beyond the realization area of ​​the electronic device 1 by 5 mm, allowing for subsequent sewing onto clothing or other textile support.

[0102] A second preferred embodiment of the conductive pattern 10 of the fabric described herein is shown in Figure 2 (Model 2). In this embodiment, the system 10 further comprises a heat-sealable double-sided adhesive layer 80 above the closing dielectric layer 5 for adhering the system 10 to the fabric T. This double-sided adhesive layer 80 is for adhering the system 10 to the fabric T and is used to adhere the system 10 to the fabric T.

[0103] In this embodiment, an innovative method for conductive (wiring) patterns includes at least the following steps.

[0104] · Dielectric sizing or rolling of dielectric 11. · Preform the secondary antenna on the conductive material 2 (the model with the adhesive surface described above) by die cutting, laser cutting, machine cutting, etc., and construct the predetermined shape (fabric surface) = (conventional conductive surface).

[0105] The dielectric layer 11 is thermocompressed using a roller press, flat press, heat press (e.g., 55°C for 15 seconds), ultrasonic system, or any other technique suitable for bonding the two layers together.

[0106] Alternatively, the conductive fibers 2 can be laminated onto the adhesive / thermobondable dielectric 11 using a conventional lamination process as follows.

[0107] · Using a die cutting process, laser cutting, mechanical cutting, ultrasonic cutting, etc., half-die cut (half-cut) the layer of conductive fibers 2 without cutting away the adhesive / thermobondable dielectric 11.

[0108] Scrap off excess conductive material and then size the adhesive / thermo-adhesive dielectric 11.

[0109] Preforming the main antenna into a laminate or wire-shaped conductive material 4 by die cutting, laser cutting, machine cutting, etc.

[0110] Using a pick and place control system, the main antenna 4 is centered and positioned on the dielectric layer 5 (a variation includes heating and pressing at 150°C for 1-2 seconds to ensure good adhesion of the antenna to the thermo-adhesive dielectric).

[0111] Bonding stage: A machine is used to create the bonding points. A control system is used to position the rigid electronic module 3.

[0112] · The control system connects assemblies 1 and 2 with assemblies 3, 4 and 5. · Sizing or spreading an adhesive layer or a thermally adhesive dielectric layer and applying it to the assembly 11, 2, 3, 4, 5.

[0113] It should be noted that this is a special process, using a thermosetting PET film with adhesive on one side and a release agent. This film must hold the adhesive while simultaneously adhering the conductive (wiring) pattern to the fabric. Thanks to this film, the remaining solid adhesive is activated only when the system is heat-bonded to the garment (usually at 150-160°C for 15-20 seconds). Layer 80 melts completely, allowing the system to be integrally bonded to, for example, a shirt. It should be noted that the system cannot be attached directly to a shirt, as the shirt's fabric is highly stretchable and would not guarantee the mechanical structure required for the device.

[0114] 3a and 3b (Model 3) show a variant of the embodiment of Figures 1a and 1b, i.e., a further preferred embodiment of the conductive (wiring) pattern 100 of the fabric described in the present invention. In particular, in this embodiment, the system comprises a rigid protective part 600 made of a material suitable for protecting the welds of the conductive (wiring) pattern 100 of the fabric.

[0115] In this case, a rigid layer is placed between the secondary antenna 2, which is a layer of conductive material, and the primary antenna 4, which also incorporates rigid electronic components 3, to move the bending point of the system outside the weld. This rigid layer is formed with a minimum thickness and size that takes into account the technical effect, for example a thickness of 25 to 40 microns, but does not excessively impair the flexibility and flexibility of the entire system 100.

[0116] The flexibility of the system is not reduced and the appearance is clearly improved as the joints between the rigid electronic components 3 and the conductive antennas 2 and 4 are protected and covered.

[0117] In this embodiment, the process of fabric digitization includes at least the following steps: · Sizing or rolling of dielectric 5.

[0118] A main antenna of conductive material 4 is preformed by die cutting, laser cutting, machine cutting, etc.

[0119] Using a control system such as a pick-and-place, the main antenna is placed and positioned at the center of the dielectric layer 5. (One variation includes a step of applying heat and pressure at 150°C for 1-2 seconds to bond the antenna to the thermal adhesive dielectric.)

[0120] · Bonding stage: The bonding points are set by machine. Positioning the rigid electronic module 3 with the control system. The conductive layer 2 of the fabric (the model with the aforementioned "adhesive" surface) is preformed by die cutting, laser cutting, machine cutting, etc. to form a predetermined shape (fabric surface) = (conventional conductive surface).

[0121] Creation of hardened area 600 by applying resin coating, liquid curing, hard polymer layer, etc. via mechanical control, positioner, etc.

[0122] For resin coatings or liquid curing, use air, UV, chemical, oven, or laser polymerization processes.

[0123] The application of the dielectric layer 1 is carried out using roller pressing, flat pressing, hot pressing (for example 15 seconds at 55°C), ultrasonic systems, or any other technique suitable for bonding two layers.

[0124] The advantage of polymerization is that it only acts where it is truly needed, i.e., it only acts on the hardened material without changing the flexible state of the device. This makes the polymerization of the present invention much more durable than existing techniques and will be of particular interest to engineers in this field. The device maintains high flexibility and softness while also having high mechanical resistance to impacts and mechanical stress.

[0125] 4a and 4b (Model 4) show a preferred embodiment of a textile conductive pattern 101 of the present invention. In this example, the textile memory system includes a liner 102 instead of a protective rigid layer. The liner 102 is here a film (80 microns to 4 / 5 mm thick, e.g., PET or Kapton) that combines with the conventional conductive layer 4, base textile 2, and rigid electronic module 3 to provide structural support and allow for greater flexibility in the completed system 101.

[0126] In this example, the method for tracking fabric includes the following steps: Dielectric sizing or rolling the dielectric 5. Pre-forming the main antenna from conventional conductive material 4 by die cutting, laser cutting, machine cutting, etc.

[0127] Using a control system such as pick and place, place the antenna in the center of the dielectric layer 5 (you can apply heat pressure at 150°C for 1-2 seconds to bond the antenna to the thermal adhesive dielectric).

[0128] · Gluing. The glue points are specified by the machine. Positioning of the rigid electronic module 3 by the control system Pre-forming the secondary antenna in the conductive fabric layer 2 (the model with the "adhesive" surface described above) by die cutting, laser cutting, machine cutting, etc., and constructing it in a predetermined shape (fabric Sdie) = (conventional conductive Sdie).

[0129] Apply adhesive liner 102 via a rotary applicator, label feeder, etc. perpendicular to the direction of the system 101.

[0130] Applying the dielectric layer 1 using a roller press, flat press, hot press (for example 15 seconds at 55°C) or ultrasonic system, or any other type of technique suitable for bonding the two layers.

[0131] Please note that this model is particularly suited to making coils. We started with uniform width coils (we used 50cm wide coils), but longer coils (even 3m wide) would also work.

[0132] This liner is also available for narrower coils, in this case 5mm wide. The number of tracks for each individual coil will vary, and therefore the number of applicators used. Note that this also includes automatic length adjustment of the liner. The liner and device can be bonded with a heat press, or if the liner is made of heat-seal material, with a heated roller.

[0133] It's important to note that this TPU is a multi-layer polyurethane construction with different chemical and manufacturing structures. Each layer is designed to bond well with the product below. The first layer is primarily dark in color and typically activates at a temperature of around 80°C. Specifically, the first layer bonds immediately to the fabric, the second layer melts at a slightly higher temperature, and the fifth layer melts at 135°C. The top layer is slightly thicker, between 12 and 18 microns, and consists of the following: a high-temperature-resistant base polyurethane layer, a temperature-resistant polyurethane layer in the desired color, and a temperature-resistant protective layer.

[0134] It should be noted that it has been demonstrated that the chemical / physical shape of the support and the pressure of the heat press work together to cause the molten material to penetrate between the warp and weft yarns of the fabric. The penetration index is inversely proportional to the melting temperature of the layer (the first layer becomes almost liquid, the fifth layer remains semi-solid). Once saturated, the remaining thicker and "well-penetrated" layers of material "float" on the surface of the fabric.

[0135] The same is true for the dielectric closure layer 11. The temperature causes the upper layer to soften, allowing the melt layer to penetrate the base 5, and the melt layers of the closure layer 11 to "melt" together. This then causes the adhesive layers inside the fabric to saturate and become solid in their unmelted state, resulting in waterproofing.

[0136] A PET support is always required for removal of the TPU. This support film can remain attached to the TPU or can be removed for further processing. In the most preferred embodiment, the base TPU does not have a PET film attached to it, eliminating the need for a film removal step (which is performed manually, as this is not possible in an automated process). On the other hand, for the closure layer 11, the PET layer remains attached as a protective layer after the manufacturing process is complete, and is removed by the end customer.

[0137] Note that at this stage the conductive fiber layer can also be formed into a coil and bonded to a paper or dielectric structural liner. The fabric sections can be cut later with the laser, or the blank can be placed on top of already cut sections.

[0138] This embodiment also allows for the addition of a thermal dual adhesive (layer 80 of Model 2) or a crown at the end of the process.

[0139] It should be noted that this process can also be carried out in reverse, assembling the system in the reverse order: starting with the closure dielectric top layer 5, then placing the rigid module 3, and gluing (gluing) the aluminum laminate antenna or wire antenna 4. Finally, the rest of the system 102 is installed. The assembly order will vary depending on the heat seal properties desired for the device. Ideally, the closure layer 5 will have a surface area greater than the total surface area of ​​the devices 1, 10, 100, 101.

[0140] Cut the coil to create the base of Example 5, and make the shape (Sdie base) < (Sdie of closed Example 1).

[0141] - Remove scraps and residues (by laser or cutting plotter, the dielectric material will not affect the underlying support film).

[0142] This approach results in a preferred embodiment, where the dielectric layer or base TPU 5 does not necessarily need to have the same shape as the dielectric layer or top layer TPU 11 (dielectric layer or closure TPU 11) (Model 1). Note that in an alternative embodiment, the coil can be laser cut only once at the end of the process, in which case the shape of the base 11 of the closure 5 is the same and does not affect the operation of the system.

[0143] 5a and 5b (Model 5) show an embodiment of the conductive textile pattern 110 of the present invention, in particular in this variant, the conductive textile pattern 110 in this case comprises a dielectric layer 510 made of a dielectric material, a conductive main antenna of conductive material 410 and a rigid electronic element 3.

[0144] The present invention has the advantage that a conventional main antenna made of laminate or wire conductive material can be replaced by a secondary antenna made of conductive fabric 2, as it has properties suitable for providing radio frequency functionality to the device.

[0145] In this case, a further improvement is to remove the potentially stiffening layer, resulting in an extremely thin and flexible device. In this case, the innovative process for textile digitization according to the present invention comprises at least the following steps:

[0146] Sizing of the base dielectric (11) or rolling of the base dielectric (11) Pre-form the secondary antenna on the conductive fabric 2 (the model with the "adhesive" surface described above) by die cutting, laser cutting, machine cutting, etc., and build it into the desired shape (fiber Sdie) = (conventional conductive Sdie).

[0147] The dielectric layer (11) is attached by heating or cooling using a suitable type of technique to bond the two layers together, such as a roller press, flat press, heat press (e.g. 55°C for 15 seconds), ultrasonic system, etc.

[0148] Alternatively, the conductive fibers 2 are laminated onto the adhesive / thermobondable dielectric 1 by conventional lamination processes.

[0149] · Semi-die-cutting the layer of conductive fibers 2 without engraving the adhesive / thermal bond dielectric 1 by die-cutting process, laser cutting, mechanical cutting, ultrasonic cutting, etc.

[0150] Manage scraps of conductive sub-antenna 2 and manage the size of adhesive / thermal bonding dielectric 1.

[0151] · Pre-forming the main antenna in the conductive material 410, for example by die cutting, laser cutting, or machine cutting.

[0152] Using a control system such as pick and place, place the antenna in the center of the dielectric layer 510 (you can apply heat pressure at 150°C for 1-2 seconds to ensure the antenna adheres well to the thermal adhesive dielectric).

[0153] · Gluing. The glue points are specified by the machine. Positioning of the rigid electronic module 3 by the control system. · The control system combines the assembly formed by layers 11 and 2 with assemblies 3, 4 and 5.

[0154] Bonding of the closures resulting from the model formation or bonding of a possible layer of thermally bonded dielectric material 80.

[0155] In this way, a semi-finished product can always be formed, as in the embodiment of the fabric storage system 100. The bonding to the fabric can be achieved by using an overflow of the thermal adhesive layer 1, or an additional dielectric layer 80 of adhesive or thermal adhesive closure, as described in models 2 and 3.

[0156] Finally, Figures 6a and 6b (Model 6) show the steps of an innovative process for fabric conductive (wiring) patterns to realize a preferred embodiment. The fabric conductive (wiring) pattern system 120 described in this invention is manufactured by forming a rigid or semi-rigid protective layer near the assembly 410, 510, 3 with secondary antennas formed from conductive fiber 2. In particular, a semi-finished product is formed, including at least a dielectric layer 510, a main antenna 401, and a rigid electronic module 3. The secondary antennas are then bonded to the conductive fiber 2. This area is reinforced evenly from the top, bottom, or both sides with materials such as polymers or metals. Furthermore, the 410 / 510 assembly can be realized by creating rigid PCBs (printed circuit boards) (511) of various thicknesses. A particularly advantageous aspect of this semi-finished product is that it eliminates the need to individually manage the secondary antennas within the conductive fiber, which (as mentioned above) would be problematic because the structure is very flexible and therefore difficult to move and position. The semi-finished product realized here simplifies the movement of the main antenna 410.

[0157] The base polymer layer 1 can be bonded to layers or films, or to already sized layers or films, which are used solely to move the various semi-finished products during processing. Conversely, these layers cannot be transported, as they do not have a mechanical structure that allows for precise manipulation.

[0158] The processing phase begins with the following roles: Pre-form the secondary antenna on the conductive fabric 2 (the model with the "adhesive" surface described above) by die cutting, laser cutting, machine cutting, etc., and build it into the desired shape (fiber Sdie) = (conventional conductive Sdie).

[0159] · Pre-forming the main antenna 4 in the conductive material 410 by die cutting, laser cutting, machine cutting, etc.

[0160] Using a control system such as pick and place, place the main antenna 4 in the center of the dielectric layer 510 (you can also apply heat and pressure at 150°C for 1-2 seconds to ensure good adhesion of the antenna with the thermal adhesive dielectric).

[0161] · Gluing. The glue points are specified by the machine. Positioning of the rigid electronic module 3 by the control system. Coupling of sub-antennas in conductive fabric 2 and assemblies 410, 510, 3.

[0162] Forming hardened areas 620, 621 by resin coating, hardening of liquid, application of hard polymer layers using controlled machines, positioners, etc.

[0163] For resin coatings and liquid curing, use air, UV, chemical, oven, or laser polymerization processes.

[0164] · Sizing or rolling of dielectric 1. Applying dielectric 1 to the assembly 410, 510, 3, 2, 620, 621 by roller application, heat pressing, continuous application, sheet application, or the like.

[0165] Bonding of the closures or possible layers of thermally bonded dielectric material 80 resulting from the model being formed.

[0166] As mentioned above, the process described here provides a model that allows for the creation of devices that can be used robustly on soft or semi-soft substrates such as textiles. The steps can be mechanically structured and implemented in a different order than described, resulting in electronic devices that can function even under mechanical stress and chemical attack.

[0167] When using a die cutter, the cutting profile heights can be different, which allows different shapes to be formed in the two materials.

[0168] By removing the scrap from the base 1, the conductive tissue of the secondary antenna 2 is removed from the primary antenna 4. To remove this scrap, the roll of scrap material is unwound. This allows only the scrap portion to be wound up, and the sheet to assume a unique shape with the studied shape. Meanwhile, the dielectric 1 can be formed into the desired shape, for example, maintaining the top surface.

[0169] The rigid or semi-rigid structures (620, 621) can be made of a variety of materials, including rigid polymers (e.g., epoxy resin or polypropylene resin) and "softer" polymers such as silicone or expanded foam. Hybrid structures, combining stiffer and softer structures, are also possible. This solution allows for optimal solutions depending on the stress (e.g., fulling) required for the device, depending on the intended use of the invention.

[0170] It should be noted that even changes in the order of execution of the steps in the process described herein for the conductive (wiring) patterning of the fabric, or changes in the temperature or processing time, are merely alternative embodiments of the process described herein and should be considered as variations of the fabric storage system. Further variations, such as materials such as aluminum, copper, or other conductive materials used for the antenna, process steps, additional alternatives, processing formats, supports comprising the system, supports with suitable structures (not just fabric supports), etc., should all be considered variations of the present invention, as better described by the appended claims.

Claims

1. An RFID system (1, 10, 100) for soft substrates such as fabrics, comprising at least one device (D), which device (D) comprises at least: a dielectric base layer (11), - a secondary antenna (2) made of conductive fabric, at least one die (3) rigid electronic module, The present invention is characterized by comprising: Furthermore, the following: - a further main antenna (4) made from laminated or linear conductive material, - at least one layer of dielectric encapsulant (5), The present invention is characterized by comprising: The device (D) is fixed to at least one flexible or ultra-flexible support layer (0), and the RFID system is UHF, HF and / or NFC. The RFID system (1) includes a conductive fiber secondary antenna (2) configured to reinforce the main antenna (4) made of laminate or wire conductive material, one or both antennas (2, 4) configured to refract the magnetic field emitted by an RFID / NFC reader, the secondary antenna (2) is arranged overlapping the main antenna (4) to allow for distribution of electrical conduction even if the main antenna (4) is damaged, and the magnetic field crosses the two conductive antennas (2, 4) to activate an electronic module (3) and amplify the signal emitted by the module (3), the dielectric (11) and the dielectric layer (5) are bonded between them and with the support layer (0) by adhesive or fusion, and the module (3), the main antenna (4), and the secondary antenna are present in the conductive fiber (2) remaining between the layers (1) and (5).

2. 10. An RFID system (1) for a soft substrate such as a fabric according to claim 1, characterized in that the secondary antenna of the conductive fabric (2) and the primary antenna of the laminate or wire conductive material (4) have shapes and dimensions equal or substantially equal to each other for the purpose of inductive radio frequency reception according to a known frequency and are electrically connected, alternately or both, to a rigid electronic module (3).

3. An RFID system (10) for a soft substrate such as a fabric according to any of the previous claims, wherein said device (D) comprises a base dielectric layer (80) made to enhance the adhesion of said device (D) to the substrate (0) and the moisture resistance of the system (1, 10), said layer (80) being suitable for the support of the system (10), both adhesive and thermal adhesive being possible, and this base substrate (0) being compatible with the RFID system (10) having any degree of elasticity.

4. An RFID system (100) for a soft substrate such as a fabric according to any one of claims 1 to 3, characterized in that the device (D) comprising the secondary antenna of conductive textiles (2), the main antenna of laminate or wire conductive material (4), the rigid electronic module (3) and part or all of the base dielectric layer (11) or top layer (5) is protected by a layer (600) of rigid, semi-rigid or material combination.

5. 10. An RFID system (101) for a soft substrate such as a fabric according to claim 1, characterized in that the system (101) comprises, instead of a rigid or semi-rigid layer (600), a main antenna of laminate or wire material (4), a rigid electronic module die (3), an antenna of conductive material (2), and a layer of liner or film (102) bonded to a base layer of dielectric (11) to provide structural support to the system (101).

6. 10. An RFID system (110) for a soft substrate such as a fabric according to claim 1, characterized in that the system (110) is made as a blank including at least a dielectric layer (510) and a primary antenna in the form of a formed aluminum sheet (410), thereby simplifying the welding of a die-rigid electronic module (3) and the electrical coupling with the secondary antenna in the conductive fabric (2), wherein the secondary antenna (2) amplifies the signal.

7. A manufacturing method according to an RFID system (1, 10, 100) for soft substrates such as fabrics according to any of claims 1 to 4, said method or process comprising at least the following steps: - sizing the base dielectric (11) or rolling the base dielectric (11); - Preforming the fiber conductive layer or sub-antenna (2) (model with the "adhesive" surface) by die cutting, laser cutting, mechanical cutting, etc., to achieve a predetermined shape (fiber Sdie) = (laminate or wire conductive Sdie); hot or cold application of the base dielectric (11) using a roller press or a flat press or a heat press (for example 15 seconds at 55°C), an ultrasonic system or any other type of technique suitable for bonding the two layers; or Laminating the secondary antenna conductive fibers (2) onto the adhesive / thermobondable dielectric (11) by conventional lamination processes; semi-die-cutting the conductive fabric sub-antenna (2) layer without engraving the adhesive / thermo-bondable dielectric (11) by die-cutting, laser cutting, mechanical cutting, ultrasonic cutting, etc.; - Excess scraps of conductive material for the sub-antenna (2) and subsequent sizing of adhesive / thermobondable dielectric (11); Reshaping the sheet or laminate antenna or wire antenna (4) of conductive material by die cutting, laser cutting, mechanical cutting, etc.; Using a control system such as pick and place, place the antenna (4) in the center of the dielectric layer (5) (a variant includes applying heat and pressure at 150°C for 1-2 seconds to ensure good adhesion of the foil with the thermo-adhesive dielectric); Gluing: Specifying glue points with the machine; Positioning of the rigid electronic module (3) by the control system, - coupling, via a control system, an assembly made up of layers (11, 2) with an assembly made up of layers (3, 4, 5); the closure device (D) can be heat-sealed at 155°C, for example in 1 / 2 seconds; characterized in that it comprises Manufacturing method.

8. A manufacturing method with an RFID system for soft substrates such as fabrics (1, 10, 100) according to any one of claims 1 to 4, in which the basic dielectric layer (11) is bonded to a layer or film or is already sized, and in which various semi-finished products can be moved during the process, the processing steps starting from the rolls comprising at least the following steps: - Preforming the fiber conductive layer or sub-antenna (2) (model with the "adhesive" surface) by die cutting, laser cutting, mechanical cutting, etc., to achieve a predetermined shape (fiber Sdie) = (laminate or wire conductive Sdie); - preforming a laminated conductive material sheet or wire conductive material first antenna (410) by die cutting, laser cutting, or machine cutting; Using a control system such as pick and place, place the antenna (410) in the center of the dielectric layer (510) (an alternative is to pass it through a heat and pressure at 150°C for 1-2 seconds to ensure good adhesion of the sheet with the thermal adhesive dielectric); Gluing: Specifying glue points with the machine; Positioning of the rigid electronic module (3) by the control system, - gluing the assembly formed by (410, 510, 3) and the secondary antenna in the conductive fabric (2); Creating hardening areas (620, 621) by resin coating, liquid hardening, application of a rigid dielectric layer, etc. via control mechanisms, positioners, and others suitable for the purpose; - For resin coatings and liquid curing, use air, UV, chemicals, ovens, laser polymerization processes, etc. Dielectric sizing or dielectric rolling (11), applying a dielectric (11) to the assembly formed by (410, 510, 3, 2, 620, 621) by roller application, heat pressing, continuous application, sheet application, etc.; Adhesion of the closures or possible layers of thermally bonded dielectric material 80 resulting from the model being formed; A manufacturing method comprising:

9. 10. An RFID system (120) for a soft substrate such as a fabric according to claim 1, said system (120) being produced as a semi-finished product comprising at least one PCB formed by a dielectric layer (510) and a formed aluminum sheet main antenna (410) for welding a die rigid electronic module (3). An RFID system (120).

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