Electroacoustic multifunction module and electroacoustic communication system

Abstract

The present invention provides an electroacoustic multifunction module (100) comprising a module body (1) having a first outer side (11) provided with an electrical interface (13) and a second outer side (12) provided with an acoustic interface (14), the multifunction module (100) being configured as a single unit that cannot be separated during normal operation and configured to have multiple functions including at least data transmission, energy transmission, and use on a transmitter side and a receiver side, one or more of which functions can be selected by a user-operable external circuit connection of the electrical interface (13). The present invention also provides an electroacoustic communication system (1000).

Description

[Technical Field]

[0001] The present invention provides an electroacoustic multifunction module and an electroacoustic communication system. [Background technology]

[0002] To connect electronic components on different sides of a wall, for example for the exchange of energy or data, it is known to use cables that penetrate the wall through holes. Alternatively, wireless connections are known. For example, communication technologies based on electromagnetic radiation, i.e., so-called RF connections (RF: radio frequency), can be used to transmit energy and data from one side of a wall to the other, but only if the wall is non-conductive or weakly conductive, or if the wall is conductive but very thin. However, depending on the specific thickness of the conductive wall, significant losses must be accepted. For identification applications, for example, so-called RFID tags (RF: radio-frequency identification) or other so-called NFC tags (NFC: near-field communication) are known, which can be used on, for example, metallic exterior surfaces.

[0003] WO 2021 / 197735 describes a transmission arrangement comprising a primary and a secondary piezoelectric transducer, by means of which an acoustic signal can be transmitted over a medium. WO 2022 / 101215 describes so-called ID tags in which a corresponding transponder chip is fixed directly to the piezoelectric transducer. To control such a piezoelectric transducer, it is necessary to provide other specially adapted electrical and electronic components that must be connected to form a complex and costly multi-component circuit connection arrangement that can only be used individually for the corresponding desired application. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2021 / 197735 [Patent Document 2] International Publication No. 2022 / 101215 Summary of the Invention

[0005] At least one object of some particular embodiments is to provide an electroacoustic multifunction module. At least another object of some particular embodiments is to provide an electroacoustic communication system.

[0006] These objects are achieved by the subject matter of the independent claims. Advantageous embodiments and refinements of these subject matters are characterized in the dependent claims and are further explained in the following description and drawings.

[0007] According to at least one embodiment, an electro-acoustic multifunction module comprises a module body having a first exterior with an electrical interface and a second exterior with an acoustic interface.

[0008] An electroacoustic multifunctional module, which may hereinafter be referred to as a multifunctional module or simply a module, may also be referred to as a monolithic device, since it forms a single unit that cannot be separated during normal operation. Therefore, here and below, a device that is provided and mounted as an integral part in normal and expected use is referred to as a module. In this sense, the term "module" therefore does not include a device formed from multiple parts that can be connected by a user or that can be easily separated from one another by a user, i.e., for example, by loosening a mechanical connection or releasing a welded connection using ordinary tools. Correspondingly, a module, in particular a module body, is referred to here and below as integral, since it cannot be disassembled into multiple parts under normal conditions without damage. An integral module body may be configured such that parts of the module body that are inaccessible from the outside under expected normal conditions cannot be accessed without damage.

[0009] Furthermore, the multi-function module is configured to have multiple functions. The multiple functions may include, among other things, data transmission and energy transmission, and the module can be used on both the transmitter side and the receiver side. One or more functions of the module can be selected, among other things, by an external circuit connection of the electrical interface that can be implemented by a user. In other words, the user can selectively use the same multi-function module on the transmitter side or the receiver side, or select and start operation of one or more functions of the multi-function module based solely on the external circuit connection implemented by the user.

[0010] According to another embodiment, an electroacoustic communication system comprises at least two electroacoustic multifunction modules for communication through walls, i.e. in particular for acoustic data and / or energy transmission through walls, which may hereinafter also be referred to simply as a communication system or system.

[0011] The features and embodiments described above and below are equally applicable to an electroacoustic multifunction module and to an electroacoustic communication system comprising at least two electroacoustic multifunction modules.

[0012] The communication system may include at least two identical multifunction modules, each having a different function that can be selected by a different external circuit connection of a corresponding electrical interface. Specifically, each identical multifunction module provides the same set of uniquely installed and provided functions. The functions required for each multifunction module and related to the desired application are selected by the different external circuit connections. Therefore, the communication system may include at least one first electroacoustic multifunction module of the at least two electroacoustic multifunction modules, which is attached to a first side of a wall. Specifically, the at least one first multifunction module with an acoustic interface is attached to the first side of the wall. The communication system may also include at least one other electroacoustic multifunction module of the at least two electroacoustic multifunction modules, which is attached to a second side of the wall opposite the first side. Specifically, the at least one other multifunction module with an acoustic interface is attached to the second side of the wall so that the acoustic interfaces face each other. Particularly preferably, the at least one first multifunction module and the at least one further multifunction module may be mounted on the wall so as to face each other.

[0013] During operation, sound waves generated by the acoustic interface of one multifunction module can be detected by the acoustic interface of another multifunction module through the wall, and the sound waves are propagated through the wall. Thus, the communication system forms a system that may also be referred to as an ADL (acoustic data link). One-way or two-way communication can be employed. In one-way operation, one of the multifunction modules is used as a transmitter to emit sound waves, and the other is used as a receiver to detect the sound waves. This allows, for example, energy transmission through the wall. Data can also be transmitted to the receiving multifunction module. In two-way operation, the roles of the transmitting and receiving multifunction modules are swapped. For example, the first receiving multifunction module can detect corresponding sound waves used for energy transmission and / or representing appropriate control signals, and then generate sound waves in response that are received by the first transmitting multifunction module. This allows, for example, data to be queried through the wall, either once or continuously.

[0014] At least one corresponding multi-function module on each side of the wall can be connected to an electrical and / or electronic component to select a corresponding function, and the multi-function module can also, for example, enable communication between the connected components on both sides of the wall.

[0015] Here and below, the term "wall" generally refers to a material that propagates sound waves. The wall may be a metal wall, particularly preferably. Other wall materials may also be used that have sufficient structure and strength to propagate sound waves. In order to achieve a good acoustic connection between the multifunctional modules and the wall, these multifunctional modules may be glued to the wall by an acoustic interface, for example, by an epoxy-based adhesive or other adhesive that is inelastic or slightly elastic in the cured state. Alternatively, the multifunctional modules may be attached to the metal wall by a magnetic material that can be glued to the acoustic interface of the multifunctional modules.

[0016] Also, a first plurality of electroacoustic multifunction modules may be mounted on a first side of the wall and another plurality of electroacoustic multifunction modules may be mounted on a second side of the wall, and in particular, for each multifunction module on the first side, there may be another multifunction module mounted on the second side.

[0017] It is particularly preferred that the multi-function modules of the communication system are all identically configured, in other words, by using multi-function modules with identical structures on both sides of the wall, the multi-function modules can be used as general-purpose components on each side of the wall, allowing the communication system to have a simple and low-cost structure.

[0018] Specifically, the electroacoustic multifunction module and the electroacoustic communication system can be installed and arranged to wirelessly operate electronic components, such as sensors, inside or outside the walled space from the other side, thereby realizing information and / or energy exchange. For this purpose, a corresponding first electronic component, such as a sensor, can be circuit-connected to at least one first multifunction module on one side, while another electronic component, forming a suitable control for the first electronic component, can be circuit-connected to at least one other multifunction module on the other side. Particularly preferably, the circuit connection of an electronic component to a multifunction module can mean that the electronic component is directly attached to the multifunction module, or that the multifunction module is directly attached to the electronic component. For this purpose, soldering can be used, in particular. The sensor can be, for example, an active sensor, i.e., a sensor with integrated signal processing, particularly preferably also equipped with a digital interface. Such components can perform their functions only when they receive at least a small amount of power, which can be provided by the multifunction module to which they are circuit-connected. Furthermore, the sensor can be based on MEMS technology (MEMS: Microelectromechanical Systems).

[0019] According to another embodiment, the acoustic interface of the multifunctional module includes a piezoelectric component, which is arranged and configured in particular to convert, for example, a voltage signal at a carrier frequency into a sound wave, preferably having the same signal waveform, or vice versa. Thus, the piezoelectric component can convert a voltage signal into a sound wave that is then emitted from the piezoelectric component, and conversely, sound waves incident on the piezoelectric component from the outside can be converted back into a voltage. Therefore, the piezoelectric component is an electro-acoustic transducer.

[0020] The piezoelectric component may preferably comprise a lead-free material. Alternatively, the piezoelectric component may comprise, for example, PZT (lead zirconate titanate). It is particularly preferred that the piezoelectric component be configured as a circular or polygonal disk attached to the second outer surface of the module body. In particular, the height of the piezoelectric component along the direction of arrangement of the piezoelectric component on the module body is smaller than the width and diameter of the piezoelectric component in a direction perpendicular to the arrangement direction.

[0021] The piezoelectric component may also have electrode layers, for example on at least two regions, preferably on at least two sides, for example on two opposite sides, that are installed and arranged to be electrically connected to the piezoelectric component. Particularly preferably, the piezoelectric component is configured as a disk having a lower side facing the module body and an upper side facing away from the module body and opposite the lower side, with the upper side provided with a first electrode layer and the lower side provided with a second electrode layer. The first electrode layer can extend to the lower side via the side edges of the disk, so that electrical contact with the piezoelectric component is only possible from the lower side.

[0022] According to another embodiment, the second outer side of the module body has a first area. The piezoelectric component may occupy a second area on the second outer side that is preferably at least 50%, at least 60%, or at least 70% of the first area. This allows for efficient use of the available space on the second outer side for the acoustic interface. If the piezoelectric component is configured as a circular disk, the diameter of this disk preferably corresponds approximately to the length of a side of the module body, or to at least 80% or at least 90% of the length of a side of the module body.

[0023] According to another embodiment, at least one area of ​​the exposed second outer surface, i.e., the portion not covered by the piezoelectric component, or the entire exposed portion, is covered with a protective layer. The piezoelectric component itself may not include a protective layer, at least on its upper side away from the module body. This protective layer can then surround the piezoelectric component on its sides. Alternatively, a protective layer may be applied to the piezoelectric component. In this case, the protective layer may be applied to the entire second outer surface. For example, the protective layer may be, for example, an epoxy resin-based protective varnish.

[0024] According to another embodiment, the module body is a cube, or configured as a cylinder with a circular base, or as a prism with a polygonal base. In particular, the module body may have a first main surface formed by a first outer surface and a second main surface formed by a second outer surface, connected by side surfaces. Preferably, the main surfaces each have an area larger than the respective side surfaces. This may also mean that the height of the module body perpendicular to the main surface is smaller than the length of the sides of the main surface. For example, the module body is configured as a cube with square main surfaces whose side lengths, i.e., length and width, are 3 mm or more, 4 mm or more, or 5 mm or more and 10 mm or less, 7 mm or less, or 5.5 mm or less, and whose height is 0.5 mm or more, 1 mm or more, and 3 mm or less, 2 mm or less, or 1.5 mm or less. Particularly preferably, the multifunctional module has a square main surface with a side length of 5 mm or more. 3 More than 300mm 3By having the following volumes, it is possible to have a very compact and small construction.

[0025] According to another embodiment, the module body has at least two, preferably exactly two, printed circuit boards, also called PCBs, stacked one on top of the other and connected by an intermediate layer. In particular, the module body may include a first printed circuit board having a first outer side provided with an electrical interface and a second printed circuit board having a second outer side provided with an acoustic interface. The first and second printed circuit boards are stacked one on top of the other with the intermediate layer sandwiched between them by the intermediate layer disposed between them. The side of the first printed circuit board away from the intermediate layer preferably constitutes the first outer side of the module body, and the side of the second printed circuit board away from the intermediate layer preferably constitutes the second outer side of the module body.

[0026] The module body may be manufactured as a composite, also called a panel. For this purpose, a first printed circuit board composite is provided, which has multiple areas that will each form one of the first printed circuit boards of the module body after subsequent singulation. These areas may be provided with wiring planes, i.e., in particular circuit and mounting areas, and may also be equipped with electrical and / or electronic components. After applying a material for the intermediate layer, preferably over a large area, in the form of a plastic material, for example a resin such as an epoxy resin, a second printed circuit board composite can be applied to the intermediate layer, which has multiple areas that will each form one of the second printed circuit boards of the module body after subsequent singulation. These areas have, in particular, electrode structures that can be formed by metallization, as described further below. The intermediate layer can form a connecting layer for connecting the first printed circuit board and the second printed circuit board in the form of a material bond. By singulation, for example by sawing, this composite can be separated into multiple module bodies. This may result in the module body having side surfaces bearing evidence of the singulation process, such as evidence of sawing, grinding, and / or polishing processes. Attachment of the piezoelectric components may be performed before or after singulation. Additionally, electrical vias protruding through the module body may be fabricated after the second printed circuit board composite is attached to the first printed circuit board composite.

[0027] According to another embodiment, the electrical interface has a plurality of electrical connection surfaces, which may hereinafter also be referred to simply as connection surfaces. The electrical connection surfaces are arranged on the first outer side. The connection surfaces may be formed by metallization of the first printed circuit board. In particular, the electrical interface may have at least a first connection surface, a second connection surface, and a third connection surface.

[0028] Particularly preferably, the first and second connection surfaces are directly electrically connected to the acoustic interface, in other words, the acoustic interface can be directly controlled and read from the outside by external contact of the first and second connection surfaces, and one electrical via extends from each of the first and second connection surfaces to the second outside through the module body.

[0029] The second outer surface may include a first electrode structure and a second electrode structure. The first electrode structure may be electrically connected to the first connection surface, for example, by the aforementioned electrical via. The second electrode structure may be electrically connected to the second connection surface, for example, by another aforementioned electrical via. The first connection surface may be electrically connected directly to the first electrode structure, and the second connection surface may be electrically connected directly to the second electrode structure, by the electrical via.

[0030] The piezoelectric component may be fixed to and electrically connected to the first and second electrode structures. In particular, the piezoelectric component may be soldered to the first and second electrode structures. The piezoelectric component may be glued to the first and second electrode structures, for example, by a conductive adhesive. In particular, the first electrode layer of the piezoelectric component may be fixed to the first electrode structure. The second electrode layer of the piezoelectric component may be fixed to the second electrode structure. The first and second electrode structures may each have a grid structure, so that they do not extend over the entire area of ​​the second outer surface. In this way, the piezoelectric component can be reliably fixed to the second outer surface while still providing good freedom of movement.

[0031] The third connection surface on the first outer side may also be electrically connected to a wiring plane on the inner side of the first printed circuit board opposite the first outer side. In other words, a wiring plane in the form of circuits and contacts is configured on the inner side of the first printed circuit board opposite the first outer side and therefore facing the intermediate layer. The other connection surfaces on the first outer side may also be electrically connected to the wiring plane. For example, the first connection surface may be electrically connected to the wiring plane. In particular, electrical vias extending from the first outer side to the inner side through the first printed circuit board may be provided to connect the connection surfaces and the wiring planes.

[0032] The contacts of the wiring plane may be located and arranged so that one or more electrical and / or electronic components can be attached thereto. For example, a semiconductor chip in the form of a near field communication transponder chip may be attached to the wiring plane, i.e., in particular to the contacts of the wiring plane. In particular, this semiconductor chip may have contacts soldered or conductively bonded to the contact areas. This semiconductor chip may be used for energy harvesting, I 2 It may be installed and arranged to provide at least one or more of the following functions: C interface, memory management, and encryption.

[0033] Furthermore, for example, the first connection surface may be connected to the third connection surface via an inductor, which may be attached to contacts provided for this purpose and wired with a circuit, and other connection surfaces and / or contacts may be connected by other electric or electronic components such as resistors, inductors and capacitors.

[0034] The electroacoustic multifunctional module described herein can form a sub-component of a communication system in the form of a monolithic component comprising an electrical interface and an acoustic interface. The acoustic interface can be particularly preferably formed by a piezoelectric component in the form of a piezoelectric transducer that is suitably acoustically coupled to one side of the wall, for example by gluing as described above. The electrical interface can particularly preferably be formed by electrical connection surfaces configured as so-called pads on an electrically insulating material, in particular the plastic material of a printed circuit board forming the first outer side. Such pads can be easily contacted by soldering or other electrical connection techniques and can therefore be connected, for example, to sensors or one or more other electronic components.

[0035] As described above, a first multifunction module can be mounted on, for example, the inside of a wall and acoustically coupled to it, while other multifunction modules can be mounted on, for example, the outside of the wall, facing the first multifunction module, and acoustically coupled to it. Electrical interfaces located on the sides of each multifunction module away from the wall allow for easy connection of conventional electronic components between the interior and exterior. The multifunction modules can convert sound waves into waves that can penetrate the wall. To ensure good transmission through the wall, the multifunction modules may use appropriate signals and protocols in addition to appropriate piezoelectric components. Each multifunction module may be operated analogically, i.e., through direct contact between the connected electronic components and the piezoelectric components, or digitally, i.e., through connection between the connected electronic components and a semiconductor chip located within the module body. The semiconductor chip can receive or provide signals and protocols, e.g., as electrical signals, from the piezoelectric components. Therefore, each multi-function module can operate with the NFC protocol and corresponding signals, for example, universal ID number and / or energy harvesting of regulated power supply voltage, testing the current capability of the channel, and / or digital I with master function. 2 It may provide a C interface, and / or memory management of fixed and / or volatile memory, and / or functionality such as encryption. [Brief explanation of the drawings]

[0036] Further advantages, advantageous embodiments and refinements will become apparent from the following description of exemplary embodiments with reference to the drawings.

[0037] [Figure 1] 1 is a schematic diagram of an electro-acoustic multi-function module according to one embodiment; [Figure 2A] FIG. 10 is a first schematic diagram of an electro-acoustic multifunction module according to another embodiment. [Figure 2B] FIG. 2 is a second schematic diagram of an electro-acoustic multifunction module according to another embodiment. [Figure 2C] FIG. 10 is a third schematic diagram of an electro-acoustic multi-function module according to another embodiment. [Figure 2D] FIG. 4 is a fourth schematic diagram of an electro-acoustic multi-function module according to another embodiment. [Figure 2E] FIG. 5 is a fifth schematic diagram of an electro-acoustic multifunction module according to another embodiment. [Figure 2F] FIG. 6 is a sixth schematic diagram of an electro-acoustic multi-function module according to another embodiment. [Figure 2G] FIG. 7 is a seventh schematic diagram of an electro-acoustic multifunction module according to another embodiment. [Figure 2H] FIG. 8 is a schematic diagram of an electro-acoustic multi-function module according to another embodiment. [Figure 2I] FIG. 9 is a ninth schematic diagram of an electro-acoustic multifunction module according to another embodiment. [Figure 2J] FIG. 10 is a schematic diagram of an electro-acoustic multi-function module according to another embodiment. [Figure 2K] FIG. 11 is an eleventh schematic diagram of an electro-acoustic multifunction module according to another embodiment. [Figure 2L] FIG. 12 is a twelfth schematic diagram of an electroacoustic multifunction module according to another embodiment. [Figure 2M] FIG. 13 is a schematic diagram of an electroacoustic multifunction module according to another embodiment. [Figure 3] FIG. 2 is a schematic diagram of an electroacoustic communication system according to another embodiment. [Figure 4] FIG. 2 is a schematic diagram of an electroacoustic communication system according to another embodiment. [Figure 5] FIG. 2 is a schematic diagram of an electroacoustic communication system according to another embodiment. [Figure 6] FIG. 2 is a schematic diagram of an electroacoustic communication system according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0038] In the examples and figures, elements that are identical, similar, or have the same function may be labeled with the same reference numerals. The elements shown and their relative sizes should not be considered to be to scale. Rather, individual elements, such as layers, members, components, and regions, may be shown exaggeratedly large for clarity and / or ease of understanding.

[0039] FIG. 1 illustrates an electroacoustic multifunction module 100 according to one embodiment. The multifunction module 100 includes a monolithic module body 1 having a first exterior 11 and a second exterior 12. The first exterior 11 includes an electrical interface 13. The second exterior 12 includes an acoustic interface 14 including a piezoelectric component 30. The multifunction module 100 is configured to provide an acoustic output signal at the acoustic interface 14, for example, based on an electrical input signal at the electrical interface 13. Simply put, the multifunction module 100 can directly or indirectly convert an electrical signal into an acoustic signal. The multifunction module 100 may be configured to provide an electrical signal at its internal circuitry and / or the electrical interface 13 based on an acoustic input signal at the acoustic interface 14. Simply put, the multifunction module 100 can directly or indirectly convert an acoustic signal into an electrical signal. In particular, the multifunction module 100 is configured to have multiple functions. The multiple functions may include, inter alia, data transmission and energy transmission, and the multifunction module 100 can be used on both the transmitter side and the receiver side of a communication system. In particular, one or more functions of multi-function module 100 may be selected by user-activatable external circuit connections of electrical interface 13. Other features and embodiments of multi-function module 100 are described with reference to Figures 2A-2M.

[0040] As will be explained in more detail with reference to FIGS. 3 to 6, at least two multi-function modules 100, in particular two identical multi-function modules 100, may be part of an electroacoustic communication system 1000.

[0041] 2A-2M, other embodiments of the multifunction module 100 are shown. In contrast, FIGS. 2A and 2B show three-dimensional views of the multifunction module 100 as seen from the acoustic interface 14 and the electrical interface 13. FIGS. 2C and 2D show schematic cross-sectional views of different technical variations of the multifunction module 100. FIGS. 2E-2M show other top views, cross-sectional views, and schematic diagrams of portions of the multifunction module 100 to illustrate various aspects and features. The following description applies to all of FIGS. 2A-2M.

[0042] 2A and 2B, the multifunction module 100 preferably comprises a compact, cubic-shaped module body 1. However, it may alternatively have other shapes, such as a cylindrical shape with a circular base or a prismatic shape with a polygonal base, such as a hexagonal shape. For example, if multiple multifunction modules 100 need to be installed side-by-side in close proximity to one another in a space-saving manner, a regular polygonal base, such as a rectangular, square, or hexagonal, may be advantageous.

[0043] The module body 1 has a first main surface formed by a first outer surface 11 having an electrical interface 13. The module body 1 further has a second main surface formed by a second outer surface 12 having an acoustic interface 14. These two main surfaces are connected by side surfaces. Preferably, as shown in the figure, each of the main surfaces has an area larger than the respective side surface, so that the height perpendicular to the main surface of the module body 1 is smaller than the length of the side of the main surface. For example, the module body 1 is configured as a cube having square main surfaces with side lengths, i.e., length and width, of 3 mm or more, 4 mm or more, or 5 mm or more and 10 mm or less, 7 mm or less, or 5.5 mm or less, and a height of 0.5 mm or more, 1 mm or more, and 3 mm or less, 2 mm or less, or 1.5 mm or less. Particularly preferably, the multifunctional module 100 has a square main surface with a side length of 5 mm or more, i.e., length and width, of 3 mm or more, 4 mm or more, or 5 mm or more and 10 mm or less, 7 mm or less, or 5.5 mm or less, and a height of 0.5 mm or more, 1 mm or more and 3 mm or less, 2 mm or less, or 1.5 mm or less. 3 More than 300mm 3It can have a very compact and small construction by having the following volumes: In the example shown, the multifunctional module 100 has a cubic module body 1 with dimensions of 5.1 mm x 5.1 mm x 1.2 mm (length x width x height).

[0044] The module body 1 includes two printed circuit boards 15, 16 stacked one on top of the other and connected by an intermediate layer 17, as shown by dashed lines in Figures 2A, 2C, and 2D. The module body 1 thus includes a first printed circuit board 15 having a first outer side 11 on which an electrical interface 13 is provided, and a second printed circuit board 16 having a second outer side 12 on which an acoustic interface 14 is provided. The first printed circuit board 15 and the second printed circuit board 16 are connected by the intermediate layer 17, thereby stacking the first printed circuit board 15 and the second printed circuit board 16 one on top of the other, sandwiching the intermediate layer 17 between them. The module body 1 is preferably manufactured as a composite, as described above in the general section. The side of the first printed circuit board 15 remote from the intermediate layer 17 constitutes the first outer side 11 of the module body 1, and the side of the second printed circuit board 16 remote from the intermediate layer 17 constitutes the second outer side 12 of the module body 1. The intermediate layer 17 is formed from a plastic material, for example a resin such as a resin containing epoxy or a resin consisting of epoxy, and completely covers the electrical and electronic components attached to the first printed circuit board 15, preferably without any voids, thereby embedding the entire area between the first printed circuit board 15 and the second printed circuit board 16, and the intermediate layer 17 can form a connecting layer for connecting the first printed circuit board 15 and the second printed circuit board 16 in a material bonding manner.

[0045] Before or after singulation of the module body composite, a piezoelectric component 30 is attached to the second outer surface 12 of the module body 1 as an acoustic interface 14. The piezoelectric component 30 is an electro-acoustic transducer and, as shown in the cross-sectional view of FIG. 2G, has a piezoelectric material 33 on which electrode layers 31, 32 for electrical contact are provided. Preferably, the piezoelectric component 30 comprises a lead-free material. Alternatively, the piezoelectric component 30 may comprise, for example, PZT. The piezoelectric component 30 is particularly preferably configured as a circular disk. Alternatively, the piezoelectric component 30 may be, for example, a polygonal disk. In particular, the height of the piezoelectric component 30 along the arrangement direction of the piezoelectric component 30 in the module body 1 is smaller than the width and diameter of the piezoelectric component 30 in a direction perpendicular to the arrangement direction.

[0046] As shown in FIGS. 2E and 2F , which are top views of the second outer side 12 of the second printed circuit board 16, and in the cross-sectional view of the second printed circuit board along the cut plane EE in FIG. 2E , the second printed circuit board 16 includes a first electrode structure 61 and a second electrode structure 62 on the second outer side 12 for mounting and electrically connecting the piezoelectric component 30, which are arranged on an area of ​​the second outer side 12. In FIG. 2E , dashed lines also indicate the position of the piezoelectric component 30 on the electrode structures 61 and 62. In particular, the first electrode structure 61 and the second electrode structure 62 formed by metallization of the second printed circuit board 16 each have a grid structure, and therefore are not arranged over the entire surface of a predetermined area of ​​the second outer side 12. In this way, the piezoelectric component 30 can be securely fixed to the second printed circuit board 16 while achieving good freedom of movement. The first electrode structure 61 is contacted by an electrical via 41 extending from the second outer side 12 to the first outer side 11 through the module body 1. The second electrode structure 62 is contacted by another electrical via 42 that extends through the module body 1 from the second outer side 12 to the first outer side 11 .

[0047] As shown in FIG. 2G, the piezoelectric component 30 is fixed to and electrically connected with the first electrode structure 61 and the second electrode structure 62. As shown in the figure, the piezoelectric component 30 can be soldered or glued to the first electrode structure 61 and the second electrode structure 62 by a suitable connection layer 70, which may be formed, in particular, of solder or adhesive. For this purpose, the piezoelectric component 30 comprises a first electrode layer 31 and a second electrode layer 32, the first electrode layer 31 of the piezoelectric component 30 being fixed to the first electrode structure 61. The second electrode layer 32 of the piezoelectric component 30 being fixed to the second electrode structure 62. As shown in FIG. 2G, the piezoelectric component 30 configured as a disk has a lower side facing the second printed circuit board 16 and thus facing the module body, and an upper side opposite the lower side, facing away from the second printed circuit board 12 and thus away from the module body. The upper side is provided with the first electrode layer 31, and the lower side is provided with the second electrode layer 32. To achieve the above-mentioned fixation from below, the first electrode layer 31 extends below through the side edge of the disk.

[0048] Particularly preferably, the piezoelectric component 30 is attached by reflow soldering, a conductive adhesive, or a non-conductive adhesive, in which case the stacked electrode structures 61, 62 and electrode layers 31, 32 are pressed together by shrinkage during hardening of the adhesive, forming a conductive contact.

[0049] In order to achieve a compact construction and an efficient operating method, it is advantageous for the piezoelectric component 30 to cover as much of the second outer surface 12 as possible. The second outer surface 12 of the module body 1 can have, for example, a first area, and the piezoelectric component 30 can occupy a second area on the second outer surface 12, which is preferably at least 50%, at least 60%, or at least 70% of the first area. If the piezoelectric component 30 is configured as a circular disk, as shown in the figures, the diameter of this disk preferably corresponds approximately to the length of a side of the module body 1, or to at least 80% or at least 90% of the length of a side of the module body 1.

[0050] 2A and 2C, the exposed portion of the second outer surface 12, i.e., the portion not covered by the piezoelectric component 30, is at least partially or completely covered with a protective layer 90. The piezoelectric component 30 itself may not include the protective layer 90 on its upper side, away from the module body 1. Alternatively, as shown in FIG. 2D, the protective layer 90 may be applied to the entire second outer surface 12 and thus to the piezoelectric component 30. Additionally or alternatively, the protective layer 90 may also be applied to a portion or the entire side surface and / or a portion or the entire first outer surface 11 (not shown in either case). The protective layer 90 may, in particular, be electrically insulating and may, for example, comprise or be a protective varnish. The protective varnish may, for example, comprise or be an epoxy resin.

[0051] On the first outer side 11, the module body 1, i.e. in particular the first printed circuit board 15 of the module body 1, has a plurality of electrical connection surfaces 21-28 as the electrical interface 13, as shown in particular in Figures 2B and 2H. The electrical connection surfaces 21-28 are arranged on the first outer side 11 and are particularly preferably configured as metallizations of the first printed circuit board 15.

[0052] 2I, the cross-sectional view of the module body 1 taken along the cutting plane HH in FIG. 2H shows that the first connection surface 21 is directly electrically connected to the first electrode structure 61 on the second outer side 12 through the module body 1 by the aforementioned via 41, and the second connection surface 22 is directly electrically connected to the second electrode structure 62 on the second outer side 12 through the module body 1 by the aforementioned other electrical via 42. In this way, the acoustic interface 14 can be directly controlled and read from the outside by external contact of the first connection surface 21 and the second connection surface 22, which corresponds to analog operation of the multifunction module 100.

[0053] In addition to the first connection surface 21 and the second connection surface 22, the first printed circuit board 15 further comprises other connection surfaces 23-28 on the first outer side 11 as the electrical interface 13. Also, on the inner side 18 of the first printed circuit board 15, which is opposite to the first outer side 11 and therefore faces the intermediate layer 17, a wiring plane 80 in the form of contacts 81 and circuits 82 is configured; see different top views of the inner side 18 in Figures 2J, 2K, and 2L. Figure 2L also shows the positions of the connection surfaces 21-28 on the first outer side 11. Figure 2M shows a schematic circuit diagram of the wiring plane 80 and the connection surfaces 21-28.

[0054] The contacts 81 of the wiring plane 80 may be located and arranged so that one or more electrical and / or electronic components can be attached thereto. In particular, a semiconductor chip 50 in the form of a near field communication transponder chip is attached by soldering or gluing to the wiring plane 80, i.e., on the contacts 81 provided therefor, as shown in FIG. 2K. This semiconductor chip 50 may be used for energy collection, 2 2M。 The design of the wiring plane 80 and the notation shown in the circuit diagram in Figure 2L, and particularly in Figure 2M, are merely exemplary for such semiconductor chips and do not constitute limitations.

[0055] At least one of the connection surfaces 21-28 is electrically connected to the wiring plane 80 through at least one electrical via 41-48. For example, the third connection surface 23 on the first outer side 11 is electrically connected to the wiring plane 80 on the inner side 18 of the first printed circuit board 15. The first connection surface 21 is also electrically connected to the wiring plane 80 through the aforementioned electrical via 41 that extends through the module body 1. The other connection surfaces on the first outer side may also be electrically connected to the wiring plane through electrical vias. In the illustrated embodiment, the connection surfaces 21, 23, 24, 25, 26, and 28 are each electrically connected to the wiring plane 80 through one of the electrical vias 41, 43, 44, 45, 46, and 48.

[0056] The connection surfaces and contacts may also be connected by other electrical or electronic components, such as resistors, inductors, and capacitors, as indicated by R1, R2, L1, and C1 in Figures 2L and 2M. For example, for certain applications, it may be particularly advantageous to use an inductor indicated by L1 between the first connection surface 21 and the third connection surface 23. For example, in combination with the illustrated semiconductor chip 50 of the NTAG series from NXP Semiconductors (which may specifically be the model number NTP53x2 series), an inductor with an inductance of 220 nH, a capacitor with a capacitance of 100 nF, and a resistor each with a resistance of 22 kOhm may be used.

[0057] External circuit connections on the second connection surface 22 and the third connection surface 23 allow the acoustic interface 14 to be connected to the semiconductor chip 50, thereby enabling digital operation of the acoustic interface 14.

[0058] The multi-function module 100 described herein is compact and limited, providing a well-defined range of functionality, which will be explained below with reference to other features and embodiments. Specifically, based on its structure, the multi-function module 100 has well-defined mechanical, electrical, and information technology characteristics that make it particularly suitable for use in electroacoustic communication systems 1000, different applications of which are described with reference to FIGS. 3-6.

[0059] As shown in FIG. 3, the electroacoustic communication system 1000 comprises at least two of the described electroacoustic multifunction modules 100 for communication through the wall portion 200, i.e., in particular for acoustic data transmission and / or energy transmission through the wall portion 200.

[0060] In particular, the communication system 1000 comprises at least two structurally identical multifunction modules 100, each having a different set of functions selectable by different external circuit connections of a corresponding electrical interface, as described above and below. Accordingly, the communication system 1000 particularly comprises at least one first electroacoustic multifunction module 100 of the at least two electroacoustic multifunction modules 100, which is mounted on a first side of the wall 200. Specifically, the at least one first multifunction module 100 having an acoustic interface is mounted on the first side of the wall 200. The communication system 1000 also comprises at least one other electroacoustic multifunction module 100 of the at least two electroacoustic multifunction modules 100, which is mounted on a second side of the wall 200 opposite the first side. Specifically, the at least one other multifunctional module 100 having an acoustic interface is attached to the second side of the wall 200 such that the acoustic interfaces of the two multifunctional modules 100 face each other. The at least one first multifunctional module 100 and the at least one other multifunctional module 100 may be particularly preferably attached to the wall 200 so as to face each other, as shown in the figure.

[0061] During operation, sound waves generated by the acoustic interface of one multifunction module 100 can be detected by the acoustic interface of another multifunction module 100 through the wall 200, and the sound waves propagate through the wall 200. Unidirectional or bidirectional operation can be employed. The wall 200 may be a metal wall, particularly preferably. Other wall materials with sufficient structure and strength to propagate sound waves may also be used. To achieve a good acoustic connection between the multifunction modules 100 and the wall 200, as shown in FIG. 3 , the multifunction modules 100 are bonded to the wall 200 by their acoustic interfaces using a connecting layer 300, for example, an epoxy-based adhesive or other adhesive that is preferably inelastic or slightly elastic in a cured state, as shown in FIG. 3 . Alternatively, each multifunction module 100 may be attached to the metal wall by a magnetic material that can be bonded to the acoustic interface of the corresponding multifunction module 100.

[0062] With reference to Figures 4 to 6, as shown in some specific application examples, on each side of the wall, at least one corresponding multi-function module is connected to an electrical and / or electronic component to select a corresponding function and realize communication between the electrical and / or electronic components on both sides of the wall.

[0063] Each multifunction module 100 is provided as an integrated device with all its components, existing as a structural unit that cannot be disassembled into multiple parts under normal conditions without damage. This applies in particular to the module body. The structure of the multifunction module utilizes the aforementioned technology, which may be called "embedded component PCB," which includes an electronic circuit with a near-field communication transponder chip in a miniaturized structure in the integrated module body. On the upper or front side of each multifunction module 100, i.e., the side coupled to the wall and forming the second outer side, an acoustic interface is formed by a piezoelectric component, as described above. On the lower or rear side of each multifunction module 100, i.e., the side away from the wall and forming the first outer side, a connection surface forming electrical connection pads allows electrical connection of other elements in the form of external components, such as sensors, analog-to-digital converters, etc. Specifically, the multifunction module 100 offers a number of different applications that can be realized without changing the corresponding internal architecture of the multifunction module.

[0064] Specifically, each multifunction module 100 includes a piezoelectric transducer in the form of a piezoelectric component highly suitable for electroacoustic transduction in a specific frequency range. This frequency range is particularly preferred, being between 9 MHz and 15 MHz, e.g., the 13.56 MHz frequency typically used for near-field communication. An electrical interface provides direct or indirect electrical contact from the outside to the piezoelectric component. For example, as shown on the left side of the wall in FIG. 4 , an electronic component 400, such as an NFC reader with an appropriate matching network, may be connected to one side of the multifunction module 100. For example, if this reader complies with the ISO / IEC 15693 standard or other applicable standards, acoustic transmission of energy and data through a wall 200, such as a metal wall, may be achieved.

[0065] Specifically, the functionality of an acoustic ID tag is realized in FIG. 4 . For this unique feature, each multifunction module 100 is a transponder and provides an electronic circuit in the form of a semiconductor chip, which can be formed, for example, by an integrated circuit (IC) from the NTAG series of NXP Semiconductors. As mentioned above, such a circuit can be connected at the input end to a piezoelectric component by an electrical interface. When addressed with an appropriate protocol and appropriate signals, such a multifunction module 100 shown on the right side of the wall in FIG. 4 responds according to the protocol and displays its universal ID number. Therefore, the unique ID number of the transponder formed by the semiconductor chip can be read by an acoustic channel without any additional external circuit arrangement, provided that all necessary framework conditions are met, e.g., the semiconductor chip obtains a voltage amplitude sufficient for its function. For example, the multifunction module 100 on the right side of the wall 200 in FIG. 4 can realize, in addition to the functionality of an acoustic ID tag, the functionality of a non-volatile data memory that can be read by the part of the communication system 1000 arranged on the left side of the wall 200. In the aforementioned case, as shown in FIG. 4, the electrical connection surfaces and / or other parts of the module described above are coated with an insulating protective layer 91.

[0066] Specifically, on the control side, i.e., on the left side of the wall in FIG. 4, only the electrical connection surfaces connected to the piezoelectric component, i.e., the first and second connection surfaces, may be used. In this case, external electronic devices, such as the aforementioned so-called reader, may be connected to the piezoelectric component as an electro-acoustic transducer. Even a multifunction module with a defective semiconductor chip can still be used for the above-mentioned purpose as long as the acoustic interface functions normally, thereby improving production yield. Another transponder or another circuit may be connected to the electrical interface. Furthermore, an external matching network may be connected, if necessary, to the second input of the integrated transponder circuit via the first connection surface. This allows, for example, a larger, and if necessary, more expensive, matching network to be used to improve efficiency.

[0067] As described above, an integrated transponder circuit in the form of a wiring plane with a semiconductor chip equipped with a piezoelectric component can be achieved, for example, by establishing an electrical connection between the third connection surface and the piezoelectric component, which is achieved by an electrical connection between the second and third connection surfaces. This can be achieved by short-circuiting the second and third connection surfaces, or directly by an external circuit arrangement, for example by adding an additional element suitable for impedance matching to the connection between the second and third connection surfaces. When the integrated semiconductor chip is connected to the piezoelectric component in this way, functions such as energy collection and digital interface can be provided. In this case, it may also be advantageous, depending on the application, for the remaining connection surfaces of the electrical interface of the multifunctional module to be used according to the transponder function, without being connected on the control side.

[0068] A corresponding application example is shown in Figure 5. As shown on the right side of the wall in Figure 5, other elements 401 in the form of circuits and / or electronic modules, e.g. MEMS components and / or sensors, can be electrically and / or mechanically connected to the electrical interface and thus to the multifunction module 100 in the form of a "modular system".

[0069] For example, if the framework conditions are appropriately selected, the harvested electrical energy will be available through the connection surfaces 24, 28, marked "GND" and "VCC" in FIG. 2M. Therefore, any electrical device that requires lower power consumption than the power provided by the semiconductor chip and that transmits acoustic signals through the wall can be connected to these connection surfaces. The output terminals can be turned on and off under the control of the aforementioned reader, which is connected to the multifunction module 100 on the left side of the wall, as previously described in FIG. 5. For example, the semiconductor chip can provide three different regulated voltages: 1.8V, 2.4V, and 3.0V, and can test the current capacity before disconnection.

[0070] For example, if the connected electronic components have a high power demand, two or more multifunction modules 100 can be connected in parallel, and circuit technical measures can be implemented as necessary. As shown in FIG. 6 , the communication system 1000 accordingly includes a first plurality of electroacoustic multifunction modules 100 on a first side of the wall 200 and another plurality of multifunction modules 100 on a second side of the wall 200, which are connected in parallel and connected to electronic components 401, such as sensors. Preferably, for each multifunction module 100 on the first side, another multifunction module 100 can be attached on the second side. Particularly preferably, all of the multifunction modules 100 in the communication system 1000 are identically configured. In other words, by using multifunction modules 100 with the same structure on each side of the wall 200, the multifunction modules 100 can be used as general-purpose components on each side of the wall, allowing the communication system 1000 to have a simple and low-cost structure. In addition to increasing the available power by connecting multiple multifunction modules 100 in parallel for energy collection, multiple corresponding multifunction modules 100 on each side of the wall 200 can increase transmission reliability.

[0071] In addition to the connection surfaces 24, 28 designated "GND" and "VCC" in FIG. 2M, the connection surfaces 25, 26 designated "SDA" and "SCL" allow I 22L and 2M, the multifunction module 100 includes a digital interface with master functionality according to the C standard. The digital interface can be located on the multifunction module 100 on the right side of the wall 200 and can be used to establish digital bidirectional communication with any component 401 electrically connected to the multifunction module 100 on the right side of the wall, for example, in the communication system of FIG. 5, by a reader connected thereto in the multifunction module 100 connected to the left side of the wall, or by transmitting an acoustic signal through the wall 200. The so-called "pull-up resistors" required for this purpose are present in the multifunction module 100 as resistors R1 and R2 in FIGS. 2L and 2M. The so-called "event detection" function is also provided by a semiconductor chip, and external pull-up resistors can be connected for this purpose as well.

[0072] The multifunctional modules described herein can be used as central elements in a modular system for constructing communication systems with acoustic energy transmission and / or data transmission. Different sensors can be connected by versatile electrical interfaces. These electrical interfaces can also conform to the compact construction format of the multifunctional modules. In this way, a variety of possible sensor functions can be obtained based on a single type of communication module in the form of the multifunctional modules described herein. This allows the production of a large number of identical components without the need for subsequent adaptation according to their use during the manufacturing process.

[0073] The features and embodiments described in relation to the figures can be combined with each other according to other embodiments, even if not all combinations are described in detail. Also, alternatively or additionally, the embodiments described in relation to the figures may have other features according to the description in the general part.

[0074] The present invention has been described with reference to the embodiments, but is not limited to these embodiments. On the contrary, any novel feature and any combination of features, particularly any combination of features in the claims, is intended to be included in the invention even if it is not itself explicitly recited in the claims or examples. [Explanation of symbols]

[0075] 1 Module body 11 First Outside 12 Second Outside 13 Electrical Interface 14 Acoustic Interface 15,16 Printed circuit board 17 Middle Class 18 Inside 21, 22, 23, 24, 25, 26, 27, 28 Connection surface 30 Piezoelectric Components 31,32 Electrode layer 33 Piezoelectric Materials 41, 42, 43, 44, 45, 46, 47, 48 via 50 semiconductor chips 61,62 Electrode structure 70 Connection Layer 80 Wiring Plane 81 Contacts 82 circuits 90,91 Protective layer 100 Electroacoustic Multifunction Module 200 Wall 300 Connection Layer 400,401 Materials 1000 Electroacoustic Communication System C1 capacitor L1 inductor R1,R2 resistor

Claims

1. An electroacoustic multifunction module (100) comprising a module body (1) having a first outer side (11) provided with an electrical interface (13) and a second outer side (12) provided with an acoustic interface (14), The multi-function module (100) is configured as a single unit that cannot be separated during normal operation and is arranged to have multiple functions including at least data transmission, energy transmission, and use on the transmitter side and receiver side, and one or more functions can be selected by external circuit connections of the electrical interface (13) that can be implemented by a user.

2. The volume of the electroacoustic multifunction module (100) is 5 mm 3 More than 300 mm 3 2. The electroacoustic multifunction module (100) of claim 1, wherein:

3. 3. The electroacoustic multifunction module (100) of claim 1 or 2, wherein the module body (1) comprises a first printed circuit board (15) having the first outer side (11) and a second printed circuit board (16) having the second outer side (12), and the first printed circuit board (15) and the second printed circuit board (16) are connected by an intermediate layer (17) disposed therebetween.

4. - said electrical interface (13) has a plurality of electrical connection surfaces (21-28) including at least a first connection surface (21), a second connection surface (22) and a third connection surface (23); - said first connection surface (21) and said second connection surface (22) are directly electrically connected to said acoustic interface (14); 4. An electroacoustic multifunction module (100) according to claim 1, wherein the third connection surface (23) is electrically connected to a wiring plane (80) on an inner side (18) opposite the first outer side (11) of the first printed circuit board (15).

5. 5. The electroacoustic multifunction module (100) according to claim 1, wherein a semiconductor chip (50) in the form of a short-range wireless communication transponder chip is mounted on the wiring plane (80) and arranged on the intermediate layer (17).

6. The semiconductor chip (50) - energy collection, -I 2 C interface, - memory management, - encryption, 6. The electroacoustic multifunction module (100) of claim 5, arranged to provide at least one or more of the following functions:

7. 7. The electroacoustic multifunction module (100) according to any one of claims 4 to 6, wherein the first connection surface (21) is electrically connected to the wiring plane (80).

8. 8. The electroacoustic multifunction module (100) according to claim 4, wherein the first connection surface (21) is connected to the third connection surface (23) via an inductor (L1) on the wiring plane.

9. 9. An electroacoustic multifunction module (100) according to any one of claims 4 to 8, wherein one electrical via (41, 42) extends from each of the first connection surface (21) and the second connection surface (22) through the module body (1) to the second outside (12).

10. 10. The electroacoustic multifunction module (100) of any one of claims 1 to 9, wherein the acoustic interface (14) comprises a piezoelectric component (30) fixed to the module body (1).

11. 11. The electroacoustic multifunction module (100) of claim 10, wherein the second outer side (12) has a first electrode structure (61) and a second electrode structure (62), and the piezoelectric component (30) is fixed to and electrically connected to the first electrode structure (61) and the second electrode structure (62).

12. 12. The electroacoustic multifunction module (100) of claim 11, wherein the piezoelectric component (30) is soldered or glued to the first electrode structure (61) and the second electrode structure (62).

13. An electroacoustic multifunctional module (100) according to claim 11 or 12, which is based on claim 4, wherein the first electrode structure (61) is electrically connected to the first connection surface (21) and the second electrode structure (62) is electrically connected to the second connection surface (42).

14. 14. An electroacoustic multifunction module (100) according to any one of claims 10 to 13, wherein the portion of the second outer side (12) that does not include the piezoelectric component (30) is at least partially covered with a protective layer (90).

15. 15. The electroacoustic multifunction module (100) of claim 14, wherein a protective layer (90) is applied to the entire second outer side (12).

16. 16. The electroacoustic multifunction module (100) of any one of claims 10 to 15, wherein the second outer side (12) has a first area, and the piezoelectric component (30) occupies a second area on the second outer side (12) that is 50% or more of the first area.

17. 1. An electroacoustic communication system (1000) for acoustic data and / or energy transmission through a wall (200), comprising: - comprising at least two electroacoustic multifunction modules (100) according to any one of claims 1 to 16, - at least one first electroacoustic multifunction module (100) of said at least two electroacoustic multifunction modules (100) is attached to a first side of said wall (200); - An electroacoustic communication system (1000), wherein at least one other electroacoustic multifunction module (100) of the at least two electroacoustic multifunction modules (100) is attached to a second side of the wall portion (200) opposite to the first side.

18. 18. The electroacoustic communication system (1000) of claim 17, wherein a first plurality of electroacoustic multifunction modules (100) are attached to the first side of the wall portion (200) and another plurality of electroacoustic multifunction modules (100) are attached to the second side of the wall portion (200).

19. 19. An electroacoustic communication system (1000) according to claim 17 or 18, wherein the electroacoustic multifunction modules (100) of the communication system (1000) are all identically constructed.

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