Liquid material dispensing apparatus

Abstract

To provide a liquid material dispensing device capable of improving the coating quality of a liquid material.SOLUTION: The liquid material dispensing apparatus includes a nozzle part (110) capable of discharging a liquid material, a liquid material storage part (120) containing the liquid material and connected to the nozzle part, a first temperature adjustment part (140) disposed in the nozzle part to adjust the temperature of the liquid material passing through the nozzle part, and a gas supply part (170) for supplying heated or cooled gas to a liquid material coating portion to control the temperature of the liquid material coating portion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a liquid material dispensing device, and more particularly to a liquid material dispensing device that can improve the quality of application of a liquid material by supplying a temperature-controlled gas toward a target area. [Background technology]

[0002] Generally, in the manufacturing process of electronic products, a process of applying a liquid substance to a target can be performed.

[0003] For example, liquid materials are dispensed as adhesives to bond semiconductor components, or applied to fixing portions of electronic components to perform an underfill process to fill gaps between the electronic component and the substrate.In the process of manufacturing LED devices, liquid materials in the form of fluorescent liquid, which is a mixture of fluorescent materials, are dispensed onto the LED chip to adjust the light characteristics of the LED device.

[0004] The underfill process is a process of filling the empty space between an electronic device and a substrate with a liquid filler after bonding the electronic device to prevent damage to the device caused by physical and chemical shocks and sudden temperature changes in various types of semiconductor packages such as flip-chip, BGA (Ball Grid Array), and CSP (Chip Scale Package).

[0005] Thus, the dispenser dispenses a wide variety of liquid materials, generally silicone or epoxy based liquid materials.

[0006] A conventional dispenser is composed of a head having a storage container for storing a liquid material and a nozzle for discharging the liquid material, and a moving device for moving the head horizontally and / or vertically relative to the target object. The head can use a pneumatic system that uses air pressure to pressurize the liquid material stored in a storage container located at the rear end of the nozzle toward the nozzle and controls the opening and closing of a valve located between the storage container and the nozzle to discharge the liquid material, or a piezoelectric system that selectively applies power to a piezoelectric actuator located at the rear end of the nozzle to induce physical deformation of the piezoelectric actuator to discharge the liquid material.

[0007] Such dispensers have a limit to the viscosity of the liquid material that can be dispensed by the ejection method, so the application performance of the liquid material can be improved by heating the liquid material to reduce its viscosity.

[0008] However, conventional dispensers employ a method of heating the liquid substance contained in a storage container to a predetermined temperature in order to reduce the viscosity of the liquid substance.

[0009] Because such conventional dispensers cannot heat the nozzle, the liquid material cools as it passes through the nozzle, and the liquid material discharged from the nozzle can be further cooled as it is dispensed and applied to a target. In particular, when such dispensers are used in an underfill process, the viscous liquid material can cool during the dispensing process, which can reduce the spread of the liquid material, resulting in a slower filling speed and incomplete filling of the lower gap of the electronic device. The incomplete filling can cause voids between the substrate and the electronic device, resulting in fatal defects. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Korean Patent Registration No. 10-2047025 Summary of the Invention [Problem to be solved by the invention]

[0011] Therefore, the object of the present invention is to solve these conventional problems and to provide a liquid material dispensing device that can improve the application quality of the liquid material by supplying temperature-controlled gas to the nozzle portion or the application target area. [Means for solving the problem]

[0012] The above object is achieved by the present invention by a liquid material dispensing device including a nozzle portion capable of ejecting a liquid material, a liquid material storage portion connected to the nozzle portion while containing the liquid material, a first temperature control portion disposed in the nozzle portion for adjusting the temperature of the liquid material passing through the nozzle portion, and a gas supply portion for supplying heated or cooled gas toward the liquid material application portion in order to control the temperature of the liquid material application portion.

[0013] Preferably, the heating device further includes a heat conduction block disposed between the first temperature control unit and the nozzle unit.

[0014] Preferably, the thermally conductive block includes a supply passage through which gas supplied via the gas supply unit can pass.

[0015] It is also preferable that the supply flow path includes a heat exchange flow path arranged in a direction aligned with the central axis of the nozzle portion, a gas supply port connected to the heat exchange flow path at the rear end side of the nozzle portion, and a gas discharge port connected to the heat exchange flow path at the front end side of the nozzle portion.

[0016] The gas outlet is preferably disposed in a manner that surrounds the nozzle portion at the front surface of the heat conduction block facing the target.

[0017] The gas outlet is preferably disposed at an angle with respect to the central axis of the nozzle portion so that the gas can be concentrated toward the liquid substance application site.

[0018] Preferably, the nozzle unit further includes an electric field forming unit capable of forming a potential difference between the liquid material and the target so that the liquid material can be discharged electro-hydraulically.

[0019] Preferably, the device further includes an electrical insulator disposed between the first temperature control unit and the thermal conduction block.

[0020] Furthermore, it is preferable that the nozzle portion is configured to eject the liquid material by at least one of a pneumatic method, a jet valve method, a screw pump method, and a syringe pump method.

[0021] It is also preferable that the liquid storage device further includes a second temperature adjusting unit disposed in the liquid material storage unit to adjust the temperature of the liquid material contained in the liquid material storage unit.

[0022] It is also preferable that the gas supply unit supplies gas outside the nozzle unit toward the upper surface of the liquid material application area.

[0023] Furthermore, it is preferable that the gas supply unit supplies gas from the outside of the nozzle unit in the direction of flow of the liquid material so that the liquid material applied to the target can flow in the desired direction. [Effects of the Invention]

[0024] According to the present invention, a liquid material dispensing device is provided that supplies gas controlled to a set temperature toward the area to which the liquid material is to be ejected, preventing the temperature of the viscous liquid material from changing during the process of being ejected through the nozzle, thereby improving the application quality of the liquid material. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a configuration diagram of a liquid material dispensing device according to a first embodiment of the present invention. [Figure 2] 2 is a cross-sectional view showing the liquid material dispensing device shown in FIG. 1 in use. FIG. [Figure 3] 2 is a cross-sectional view illustrating the operation of FIG. 1. FIG. [Figure 4] FIG. 4 is a cross-sectional view of a liquid material dispensing device according to a second embodiment of the present invention. [Figure 5] FIG. 10 is a cross-sectional view of a liquid material dispensing device according to a third embodiment of the present invention. [Figure 6] 1 is an image for explaining the function and effect of a gas supply unit according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0026] Before proceeding with the explanation, components having the same configuration in various embodiments will be described representatively in the first embodiment using the same symbols, and in other embodiments, configurations different from those in the first embodiment will be described.

[0027] Hereinafter, a liquid material dispensing device according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0028] Of the accompanying drawings, FIG. 1 is a configuration diagram of a liquid material dispensing device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the liquid material dispensing device shown in FIG. 1 in use.

[0029] The liquid material dispensing device of the present invention as shown in the drawings includes a nozzle unit 110, a liquid material reservoir unit 120, a thermally conductive block 130, a first temperature control unit 140, a second temperature control unit 160 and a gas supply unit 170.

[0030] The nozzle unit 110 may be formed in a tube shape for discharging the liquid material, and has a flow path formed therein through which the liquid material can pass, and a discharge hole formed at the front end facing the target.

[0031] The nozzle unit 110 may be configured to discharge the liquid material in various ways, such as air pressure, electrohydrodynamic (EHD), jet valve, screw pump, and syringe pump.

[0032] For example, in the case of an electrohydraulic method in which a liquid material is discharged using the force of an electric field, a potential difference with respect to the target can be formed using the electric field forming unit 180 .

[0033] The electric field generating unit 180 may be configured to apply a high voltage to the nozzle unit 110 to charge the liquid material being discharged from the nozzle unit 110, or may be configured to apply a high voltage to the target to form a potential difference between the liquid material and the target, or to apply high voltages having a potential difference to the nozzle unit 110 and the target. Also, in order to apply a high voltage to the target, a high voltage may be applied to a stage supporting the lower part of the target. Such an electrohydraulic discharge technology is known from Korean Patent Registration No. 10-2047025, and therefore a detailed description thereof will be omitted.

[0034] The electrohydraulic method can be combined with other dispensing methods in a hybrid form. For example, dispensing performance can be improved by applying a high voltage to the nozzle unit 110 that discharges liquid material using an existing pneumatic or piezoelectric method to charge the liquid material.

[0035] The liquid material reservoir 120 may have a barrel shape that forms a storage space capable of storing the liquid material therein and is connected to the rear end of the nozzle 110 to supply the liquid material to the nozzle 110.

[0036] Meanwhile, the liquid material reservoir 120 may be connected to a separate reservoir via a pipe or the like in order to continuously receive the liquid material.

[0037] The first temperature control unit 140 maintains the temperature of the liquid material passing through the nozzle unit 110 at a preset temperature, and may be disposed on a side edge of the nozzle unit 110 and may include a heat generating / heat absorbing element that can heat or cool the nozzle unit 110. The first temperature control unit 140 may be controlled to operate based on a measurement value of a temperature sensor that measures at least one of the temperature of the liquid material being discharged from the nozzle unit 110 and the temperature of the heat generating / heat absorbing element.

[0038] The second temperature control unit 160 controls the viscosity of the liquid material depending on the characteristics of the liquid material, the nature of the target, the working environment, or the working purpose, and may include a heat generating / heat absorbing element that can heat or cool the liquid material contained in the liquid material reservoir 120 to a preset temperature. The second temperature control unit 160 can be controlled to operate based on the temperature of the liquid material contained in the liquid material reservoir 120, preferably based on the measured value of a temperature sensor that measures at least one of the temperature of the liquid material supplied to the nozzle unit 110 and the temperature of the heat generating / heat absorbing element.

[0039] Specifically, the second temperature control unit 160 controls the temperature of the liquid material stored in the liquid material reservoir 120 so that the liquid material has a target viscosity, and the first temperature control unit 140 controls the temperature of the nozzle unit 110 so that the liquid material, whose temperature is controlled by the second temperature control unit 160, can maintain a constant temperature while passing through the nozzle unit 110. For example, when the temperature of the liquid material is increased through the second temperature control unit 160, the viscosity of the liquid material decreases and the fluidity increases.

[0040] The heat generating element may be a cartridge heater, a plate (ceramic) heater, a liquid heater, a rubber (or silicon) heater, a non-contact heater, etc., and the heat absorbing element may be a Peltier element, an air-cooled or water-cooled cooler using a cooling medium, etc.

[0041] Meanwhile, a thermal conduction block 130 may be disposed between the first temperature control unit 140 and the nozzle unit 110 so that the thermal energy provided by the first temperature control unit 140 can be effectively transferred to the nozzle unit 110.

[0042] The thermal conduction block 130 is made of a material with excellent thermal conductivity so as to effectively transfer thermal energy, and may be disposed in a shape surrounding the side edge of the nozzle part 110 .

[0043] An electrical insulator 150 may be disposed between the first temperature control unit 140 and the thermal conduction block 130 to electrically insulate the first temperature control unit 140 from the thermal conduction block 130. This prevents the first temperature control unit 140 from being affected by the high voltage applied by the electric field generating unit 180. It is also preferable that the liquid material reservoir 120 is made of an electrically insulating material so as not to be affected by the high voltage generated by the electric field generating unit 180.

[0044] The gas supply unit 170 can supply gas controlled to a set temperature toward the liquid material application area in order to control the temperature of the liquid material application area.

[0045] The gas supply unit 170 may include a gas pump 171 that supplies gas and a supply passage 172 that discharges the gas supplied by the gas pump 171 toward the liquid material application site. In the present embodiment, an example will be described in which the supply passage 172 is formed to pass through the inside of the thermal conduction block 130, and the temperature of the gas passing through the supply passage 172 can be adjusted by the first temperature adjustment unit 140.

[0046] The supply passage 172 includes a heat exchange passage 172a arranged inside the thermal conduction block 130 in a direction aligned with the central axis of the nozzle portion 110, a gas supply port 172b connected to the heat exchange passage 172a at the rear end side of the nozzle portion 110, and a gas discharge port 172c connected to the heat exchange passage 172a at the front end side of the nozzle portion 110 and discharging gas.

[0047] The heat exchange passage 172a is for heat exchange between the heat conduction block 130 and the gas, and may be in the form of a microchannel-based heat exchanger, and may be formed of a heat exchange structure such as a plate, a spiral, etc.

[0048] In the drawings of this embodiment, the heat exchange passage 172a is shown as being arranged inside the thermal conduction block 130, i.e., in the area between the nozzle portion 110 and the first temperature control portion 140, but this is not limited to this, and it is also possible to arrange it in a form that surrounds the outside of the thermal conduction block 130.

[0049] The gas outlet 172c is disposed on the front surface of the thermal conduction block 130 facing the target. The gas outlet 172c may be disposed on a circle concentric with the central axis of the nozzle unit 110 or may be formed in a ring shape concentric with the central axis of the nozzle unit 110, and may discharge gas in an oblique direction with respect to the central axis of the nozzle unit 110 so as to concentrate the gas at the application site of the liquid material.

[0050] In other words, the liquid substance discharged from the nozzle portion 110 and applied to the target area is applied to the target area in an atmosphere of a set temperature by gas arranged concentrically with the central axis of the nozzle portion 110 and surrounding the movement path of the liquid substance, which not only prevents the viscosity characteristics from changing due to cooling during the discharge process, but also prevents the application quality from changing due to the external environment.

[0051] The nozzle unit 110 is a device that ejects liquid material from a nozzle and impacts it on a target (a printing object) to form a predetermined pattern. In the present embodiment, the nozzle unit 110 has been described as using an electrohydrodynamic (EHD) method as an example, but is not limited thereto. The nozzle unit 110 may be configured to eject the liquid material using various methods such as air pressure, a jet valve, a screw pump, and a syringe pump.

[0052] The pneumatic method may include an air compressor that supplies compressed air, a regulator that adjusts the pressure of the compressed air, a storage container that stores the liquid material, a valve that adjusts the amount of liquid material that is discharged, a nozzle that discharges the liquid material, and a controller that controls the operation of the regulator and valve.

[0053] The jet valve system may include a storage container for storing the liquid material, an actuator for opening and closing the valve using a piezoelectric or solenoid system, a valve body including a spray passage connected to the actuator, a nozzle for spraying the liquid material at the end of the spray passage, and a control unit for controlling the operation of the actuator.

[0054] The screw pump system may include a storage container for storing the liquid material, a screw for extruding the liquid material by rotational motion, a motor for providing power to rotate the screw, a nozzle for discharging the liquid material, and a controller for controlling the rotation speed and direction of the screw.

[0055] The syringe pump method may include a syringe for storing a liquid material, a pump mechanism for precisely pushing and pulling a piston, a motor for providing power to drive the pump mechanism, a nozzle for discharging the liquid material, and a control unit for controlling the operation of the pump.

[0056] The nozzle portion 110 of this embodiment can use at least one of the electrohydraulic method, pneumatic method, jet valve method, screw pump method, and syringe pump method, as described above, depending on the characteristics of the liquid material to be ejected, the characteristics of the target, the working environment, etc., and the detailed configuration and operating principles of each method are well known technologies, so detailed explanations thereof will be omitted.

[0057] Meanwhile, although not shown in the drawings, the liquid material dispensing apparatus of this embodiment may include a moving unit that moves at least one of the nozzle unit 110 and the target to move the liquid material application site. The moving unit may be configured to move at least one of the nozzle unit 110 and the target in the X, Y, and Z directions. For example, the moving unit may be configured to move the nozzle unit 110 in the X, Y, and Z directions, or to move a stage supporting the target in the X, Y, and Z directions. Alternatively, the moving unit may be configured to move the stage in the Z direction and move the nozzle unit 110 in the X and Y directions, or to move the stage in the X and Y directions and move the nozzle unit 110 in the Z direction. The moving unit may also be configured to rotate the stage horizontally.

[0058] In addition, the device may include at least one of an inclination adjustment unit that can adjust the inclination of the nozzle unit 110, a distance sensor that measures the distance between the nozzle unit 110 and the target, and an image acquisition unit that acquires real-time image information of the liquid material application site.

[0059] In addition, the nozzle unit 110, the liquid material storage unit 120, the thermal conduction block 130, the first temperature control unit 140, the second temperature control unit 160 and the gas supply unit 170 may be provided in the form of a dispensing module 100 modularized into a single unit.

[0060] A plurality of such dispensing modules 100 may be provided, and the plurality of dispensing modules 100 may be arranged symmetrically around the image acquisition unit as shown in (a) of Fig. 2, or may be arranged in parallel with respect to the direction of application of the liquid material as shown in (b) of Fig. 2, or may be arranged in series with respect to the direction of application of the liquid material (arranged in a line spaced apart from each other along the application direction) as shown in (c) of Fig. 2. When the plurality of dispensing modules 100 are arranged symmetrically or in parallel, it is possible to apply the liquid material at different positions from each other, and when arranged in series, it is possible to apply the liquid material in an overlapping manner using the plurality of dispensing modules 100.

[0061] Preferably, the dispensing modules 100 are configured to independently dispense liquid materials, and the tilt and XYZ direction movement positions are individually controlled by the tilt adjusting unit and the transporting unit.

[0062] In this way, by configuring a plurality of dispensing modules 100 to respectively dispense liquid materials, the speed and productivity of the coating process can be further improved.

[0063] The operation of the first embodiment of the liquid material dispensing device described above will now be described.

[0064] As shown in FIG. 3, the nozzle unit 110 is supplied with liquid material from a liquid material reservoir 120 connected to the rear end thereof, and can eject the liquid material toward a target in front of it.

[0065] The second temperature adjusting unit 160 disposed in the liquid material storage unit 120 is controlled to adjust the temperature of the liquid material stored in the liquid material storage unit 120 in order to control the viscosity of the liquid material.

[0066] In addition, the first temperature control unit 140, which is arranged to surround the side edge of the nozzle unit 110, is controlled to adjust the temperature of the nozzle unit 110 so that the temperature does not change as the liquid material passes through the nozzle unit 110, and a thermal conduction block 130 is arranged between the second temperature control unit 160 and the nozzle unit 110 to effectively transfer thermal energy.

[0067] That is, the nozzle unit 110, whose temperature is controlled by the first temperature control unit 140, can maintain the set temperature of the liquid material as it is while passing the liquid material controlled to the set temperature in the liquid material storage unit 120, thereby minimizing the influence of the external environment during the liquid material application process and providing consistent application quality.

[0068] In addition, the gas supply unit 170 can supply temperature-controlled gas from the periphery of the nozzle unit 110 toward the liquid material application area.

[0069] The gas outlets 172c of the gas supply unit 170 may be arranged in multiple locations along a circumference concentric with the central axis of the nozzle unit 110, or may be arranged in a ring shape concentric with the central axis of the nozzle unit 110, and the gas discharge direction of the gas outlets 172c is set to concentrate the gas toward the liquid material application site.

[0070] That is, the gas discharged from the gas outlet 172c is discharged in a manner that surrounds the liquid material discharge path between the nozzle unit 110 and the target. At this time, the gas supplied to the liquid material application portion by the gas supply unit 170 is supplied at a predetermined temperature and can function as a barrier that blocks temperature changes due to the external environment, thereby preventing the temperature of the liquid material from changing due to the external environment while the liquid material is being dispensed and applied from the nozzle unit 110 to the target.

[0071] The gas supplied through the gas supply unit 170 can be controlled to a set temperature while passing through a supply passage 172 via a thermal conduction block 130 .

[0072] Specifically, gas supplied from the gas pump 171 is supplied to a heat exchange passage 172a formed inside the heat conduction block 130 through a gas supply port 172b formed on the rear end side of the heat conduction block 130, and the gas that has passed through the heat exchange passage 172a can be discharged toward the liquid material application site through a gas discharge port 172c formed on the front end of the heat conduction block 130, and can be controlled to a target temperature by exchanging heat with the heat conduction block 130 while passing through the heat exchange passage 172a.

[0073] That is, the gas discharged through the gas supply unit 170 exchanges heat with the thermal conduction block 130 surrounding the nozzle unit 110, and can be controlled to a temperature substantially the same as that of the liquid material discharged from the nozzle unit 110. As a result, the gas formed through the gas supply unit 170 sets the periphery of the liquid material discharge path between the nozzle unit 110 and the target to an atmosphere at the same temperature as that of the liquid material, so that the liquid material discharged from the nozzle unit 110 is not affected by the ambient temperature of the apparatus while being applied to the target, and the liquid material can be prevented from being cooled while being discharged through the nozzle unit 110, thereby preventing a decrease in spreadability.

[0074] Next, a liquid material dispensing device according to a second embodiment of the present invention will be described.

[0075] FIG. 4 is a cross-sectional view of a liquid material dispensing device according to a second embodiment of the present invention.

[0076] The liquid material dispensing device according to the second embodiment of the present invention differs in configuration from the first embodiment in that the gas supply unit 170' is configured separately from the thermal conduction block 130 and is configured to eject gas from the outside of the nozzle unit 110 toward the upper surface of the liquid material application area.

[0077] The gas supply unit 170′ may include a gas pump 171 that supplies gas at a predetermined pressure and a gas discharge unit 173 that is located adjacent to the nozzle unit 110 and discharges the gas delivered from the gas pump 171 toward the upper surface of the liquid material application site.

[0078] The temperature of the gas discharged from the gas supply unit 170′ can be controlled depending on the purpose of use, and for this purpose, a temperature control unit for controlling the temperature of the gas can be disposed between the gas pump 171 and the gas discharge unit 173. For example, the temperature control unit provided in the gas supply unit 170′ can control the temperature of the gas provided to the gas discharge unit 173 to be lower than the liquid material in order to shorten the hardening time of the liquid material applied to the target, or can control the temperature of the gas provided to the gas discharge unit 173 to be higher than the liquid material in order to delay the hardening time of the liquid material applied to the target or improve the fluidity of the liquid material.

[0079] In particular, when the gas temperature is controlled to be lower than the liquid material to shorten the hardening time of the applied liquid material, the liquid material applied to the target can be quickly hardened, which is effective in shortening the process time in the process of applying the liquid material to the target to generate a three-dimensional layered structure.

[0080] Next, a liquid material dispensing device according to a third embodiment of the present invention will be described.

[0081] FIG. 5 is a cross-sectional view of a liquid material dispensing device according to a third embodiment of the present invention, and FIG. 6 is an image for explaining the function and effect of a gas supply unit according to the present invention.

[0082] The liquid material dispensing device according to the third embodiment of the present invention differs from the second embodiment in that the gas supply unit 170' is configured to supply gas outside the nozzle unit 110 toward the side of the liquid material application site, i.e., in the direction of the capillary flow of the liquid material.

[0083] The gas supply unit 170' may include a gas pump 171 for supplying gas and a gas discharge unit 173 located close to a nozzle unit 110 for discharging the liquid material toward the liquid material application portion of the target, and discharging the gas transferred from the gas pump 171 toward the side of the liquid material application portion.

[0084] In this embodiment, the nozzle unit 110 may be configured to eject the liquid material using an electro-hydraulic method, and the gas supply unit 170' may be configured to face the flow direction of the liquid material applied to the target.

[0085] For example, when the liquid material dispensing apparatus of the present embodiment is applied to an underfill process for filling a gap between an electronic component and a substrate, a liquid material acting as a filler can be applied to the side surface of the electronic component through the nozzle unit 110. The liquid material applied to the target spreads into the space between the electronic component and the substrate by capillary force, filling the space between the electronic component and the substrate.

[0086] However, because the underfill method using capillary force determines the filling rate based on the relationship between the surface tension and viscosity between the electronic device and the substrate, the filling time can be long and the filling can be incomplete depending on the characteristics of the liquid material. In particular, as the bump height decreases, the surface area of ​​the filler liquid decreases, reducing the surface tension, but the viscosity acting on the surfaces of the electronic device and the substrate remains the same, which can lead to a decrease in the filling rate and incomplete filling. Incomplete filling can cause voids between the substrate and the electronic device, resulting in fatal defects.

[0087] That is, according to this embodiment, the temperature of the liquid material can be controlled through the first temperature control unit 140 and the second temperature control unit 160, thereby improving the fluidity of the viscous liquid material and preventing the liquid material from cooling during the dispensing process. In addition, a pressure is applied in the capillary flow direction of the applied liquid material using gas, improving the penetration of the liquid material, thereby minimizing the generation of voids between the electronic device and the substrate and shortening the underfill filling time.

[0088] FIG. 6 is a diagram showing the degree of filling of the liquid material between the electronic element and the substrate in the underfill process.

[0089] Specifically, (a) of Figure 6 shows the state in which a liquid material ejected by a pneumatic or piezoelectric method flows between an electronic element and a substrate, and (b) of Figure 6 shows the state in which a liquid material flows between an electronic element and a substrate when the liquid material is ejected by an electrohydraulic method and heated gas is supplied in the direction of the flow of the liquid material via the gas supply unit 170 at the same time.

[0090] That is, in Figure 6(b), the diffusion of the liquid material between the electronic device and the substrate is induced by electrocapillary force, thereby improving the diffusion of the liquid material compared to Figure 6(a), which relies solely on capillary force. Furthermore, the heated gas supplied to the discharged liquid material not only maintains the temperature of the liquid material constant, but also pressurizes the liquid material in the flow direction due to the gas discharge pressure, thereby further improving the diffusion of the liquid material between the electronic device and the substrate. Meanwhile, the effect of improving filling efficiency by controlling the wettability of the filler using an electric field is publicly known in Korean Patent Registration No. 10-2047025, and therefore a detailed description thereof will be omitted.

[0091] In addition, (c) and (d) of Figure 6 respectively show the state in which the liquid material is applied using the electrohydraulic method, and (c) of Figure 6 is an image showing the time it takes for the liquid material to completely fill the space between the electronic device and the substrate when no gas is supplied through the gas supply unit, and (d) of Figure 6 is an image showing the time it takes for the liquid material to completely fill the space between the electronic device and the substrate when heated gas is supplied in the flow direction of the liquid material through the gas supply unit 170.

[0092] When the gas supply unit 170' is not used as in Figure 6(c), it takes 61 seconds for the liquid material to be completely filled, whereas when gas is discharged in the direction of the liquid material flow through the gas supply unit 170' as in Figure 6(d), it takes 55 seconds for the liquid material to be completely filled. That is, when the liquid material is applied using the electro-hydraulic method and gas is discharged in the direction of the liquid material flow through the gas supply unit 170' as in Figure 6(d), the heated gas, along with the electro-hydraulic effect, maintains the temperature of the liquid material constant and pressurizes it in the filling direction, which more actively diffuses the liquid material in the filling direction, thereby effectively shortening the liquid material filling time in the underfill process.

[0093] Meanwhile, the gas supplied through the gas supply unit 170 can be heated to a temperature higher than the liquid material to be applied to the target and then ejected toward the nozzle or the liquid material application site, thereby more actively inducing the diffusion of the liquid material applied to the target.

[0094] The scope of the present invention is not limited to the above-described embodiments, but may be embodied in various forms within the scope of the appended claims. Any person having ordinary skill in the art to which the invention pertains may make modifications without departing from the gist of the present invention as defined in the claims. [Explanation of symbols]

[0095] 110: Nozzle section 120: Liquid substance storage section 130: Heat conduction block 140: First temperature control unit 150: Electrical insulation section 160: Second temperature control section 170: Gas supply unit 171: Gas pump 172: Supply flow path 172a: Heat exchange flow path 172b: Gas supply port 172c: Gas exhaust port 173: Gas exhaust section 180: Electric field forming section

Claims

1. a nozzle portion capable of discharging a liquid substance; a liquid material reservoir portion connected to the nozzle portion in a state where the liquid material is stored therein; a first temperature adjusting unit disposed in the nozzle unit to adjust the temperature of the liquid material passing through the nozzle unit; and A liquid material dispensing device including a gas supply unit that supplies heated or cooled gas toward a liquid material application site to control the temperature of the liquid material application site.

2. The liquid material dispensing device of claim 1 , further comprising a thermally conductive block disposed between the first temperature control unit and the nozzle unit.

3. The liquid material dispensing device according to claim 2 , wherein the thermally conductive block includes a supply passage through which gas supplied via a gas supply unit can pass.

4. The liquid material dispensing device of claim 3, wherein the supply flow path includes a heat exchange flow path arranged in a direction aligned with the central axis of the nozzle portion, a gas supply port connected to the heat exchange flow path at the rear end side of the nozzle portion, and a gas discharge port connected to the heat exchange flow path at the front end side of the nozzle portion.

5. The liquid material dispensing device according to claim 4 , wherein the gas outlet is disposed in a form surrounding the nozzle portion at a front portion of the thermal conduction block facing a target.

6. 6. The liquid material dispensing device according to claim 5, wherein the gas outlet is disposed at an angle with respect to the central axis of the nozzle portion so as to concentrate the gas toward the liquid material application site.

7. The liquid material dispensing apparatus according to claim 2 , further comprising an electric field generating unit capable of generating a potential difference between the liquid material and a target so that the nozzle unit can discharge the liquid material in an electrohydraulic manner.

8. The liquid material dispensing device according to claim 7 , further comprising an electrical insulator disposed between the first temperature control unit and the thermal conduction block.

9. The liquid material dispensing device according to any one of claims 1 to 6, wherein the nozzle portion is configured to eject the liquid material using at least one of an air pressure method, a jet valve method, a screw pump method, and a syringe pump method.

10. The liquid material dispensing device according to claim 1 , further comprising a second temperature adjusting unit disposed in the liquid material reservoir for adjusting the temperature of the liquid material contained in the liquid material reservoir.

11. The liquid material dispensing device according to claim 1 , wherein the gas supply unit supplies gas outside the nozzle unit toward an upper surface of a liquid material application portion.

12. The liquid material dispensing device according to claim 1 , wherein the gas supply unit supplies gas from the outside of the nozzle unit in a direction in which the liquid material flows so that the liquid material applied to the target can flow in a desired direction.

13. The liquid material dispensing device according to any one of claims 1 to 8 and claims 10 to 12, wherein the nozzle unit, the liquid material storage unit, the first temperature control unit and the gas supply unit are provided in a modular form.

14. The liquid material dispensing device according to claim 13, wherein a plurality of the modules are provided and arranged symmetrically or in series or parallel with respect to the direction of application of the liquid material.

Images