Optical processing method and optical processing system

Abstract

To provide an optical processing method capable of reducing a space for installing a light source for curing a curable resin, and an optical processing system in which the space is reduced.SOLUTION: An optical processing method includes (a) supplying a curable resin to a main surface of a base material to be processed, (b) irradiating the main surface of the base material being conveyed at a first speed by a conveying unit with ultraviolet light from a first light source before or after step (a) is performed, and (c) changing a conveying speed of the base material by the conveying unit to a second speed slower than the first speed after step (b) is performed. And a step (d) of curing the curable resin by irradiating the main surface of the substrate being conveyed at the second speed by the conveyance unit with ultraviolet light from a second light source disposed downstream of the first light source.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light processing method and a light processing system, and more particularly to a light processing method and a light processing system for curing a curable resin on a substrate. [Background technology]

[0002] Protective materials known as decorative materials and decorative sheets have been used to protect articles such as building interior materials (walls, ceilings, floors, etc.), housing equipment and furniture, and vehicle interior and exterior materials. Decorative materials and decorative sheets are required to have design properties in addition to surface properties such as scratch resistance, stain resistance, and weather resistance, as well as physical and mechanical properties required for protective materials, such as processability.

[0003] In order to improve the design of decorative materials and decorative sheets, methods of imparting a matte effect to the surfaces of decorative materials and decorative sheets are known. By imparting a matte effect to the surfaces of decorative materials and decorative sheets, the texture of the decorative materials and decorative sheets can be improved.

[0004] The present inventors have been investigating a method for imparting a matte effect to the surface of a decorative material or the like, in which a resin layer made of a curable resin is formed on a substrate, and then the resin layer is irradiated with ultraviolet light to form fine irregularities on the surface of the resin layer.

[0005] For example, by using the optical treatment device disclosed in the following Patent Document 1, it is possible to form fine irregularities on the surface of a resin layer formed on a substrate. The optical treatment device described in Patent Document 1 is an optical treatment device for manufacturing semiconductors or liquid crystal elements, and includes a light source that irradiates ultraviolet rays onto the surface of a treatment object transported along a transport path, and an optical treatment chamber that can form a space in an inert gas atmosphere in which the ultraviolet rays are irradiated onto the treatment object. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2019-018164 Summary of the Invention [Problem to be solved by the invention]

[0007] After forming fine irregularities on the surface of a resin layer by irradiation with ultraviolet light, the resin layer is cured to stabilize the shape of the resin layer. This allows for the production of a decorative material or the like with a matte finish. Therefore, the inventors considered providing an additional light source for irradiating ultraviolet light in order to cure the resin layer with the fine irregularities formed on its surface. However, the inventors realized that while a large amount of irradiation (cumulative light amount) is not required to form fine irregularities on the surface of a resin layer, a large amount of irradiation (cumulative light amount) of ultraviolet light is required to cure the resin layer, and simply installing an additional light source would require a huge amount of space for the light source.

[0008] When hardening a resin layer having an uneven surface, a huge amount of space is required to install a light source that irradiates the required ultraviolet light, which is not a realistic method for obtaining decorative materials, etc., with a matte finish.

[0009] Furthermore, as will be described in detail later, this also applies when the surface of a substrate is modified with ultraviolet light, and then a resin layer made of a curable resin is formed on the substrate and the resin layer is cured.

[0010] In view of the above circumstances, an object of the present invention is to provide a light processing method that can reduce the space required for installing a light source that cures a curable resin, and a light processing system that reduces the space required. [Means for solving the problem]

[0011] The light treatment method according to the present invention comprises: Step (a) of supplying a curable resin to a main surface of a substrate to be treated; a step (b) of irradiating ultraviolet light from a first light source toward a main surface of the substrate being transported at a first speed before or after the step (a); a step (c) of changing the conveying speed of the substrate to a second speed slower than the first speed after the step (b) is performed; and (d) irradiating ultraviolet light from a second light source disposed after the first light source in the transport direction of the substrate toward the main surface of the substrate transported at the second speed, thereby curing the curable resin.

[0012] In this specification, the term "main surface" refers to a surface that is much larger in area than the other surfaces of a plate-like or sheet-like object.

[0013] According to the above method, the second speed at which the substrate is irradiated with ultraviolet light emitted from the second light source is at least slower than the first speed at which the substrate is irradiated with ultraviolet light emitted from the first light source, thereby increasing the integrated amount of ultraviolet light emitted from the second light source for curing the curable resin and reducing the space required for installing the second light source.

[0014] In other words, in order to increase the cumulative amount of ultraviolet light emitted by the secondary light source, it is possible to install a large number of secondary light sources or use a large secondary light source, but with the above method, it is possible to increase the cumulative amount of ultraviolet light emitted by the secondary light source while reducing the number of secondary light sources or the size of the secondary light sources compared to when the first speed and the second speed are equal, for example.

[0015] In the above-mentioned light treatment method, The step (b) may be a step that is carried out after the step (a) and roughens the curable resin on the main surface of the substrate.

[0016] Hereinafter, the process of forming fine irregularities on the surface of the curable resin will be referred to as the "roughening process," and the process of curing the curable resin after the roughening process will be referred to as the "curing process." In the roughening process, the curable resin in a liquid state is irradiated with ultraviolet light to cause it to shrink, thereby forming fine irregularities on the surface of the curable resin. In other words, the surface layer of the curable resin becomes semi-cured. Then, in the curing process, the entire curable resin is cured. Since the roughening process shrinks the surface layer of the curable resin, there is no need to increase the integrated light amount, but in the curing process, it becomes necessary to increase the integrated light amount in order to cure the entire curable resin. Therefore, the integrated light amount of ultraviolet light irradiated on the curable resin in the curing process is higher than the integrated light amount of ultraviolet light in the roughening process.

[0017] In contrast, by transporting the substrate at a second speed slower than the first speed, the integrated amount of ultraviolet light emitted by the second light source can be easily increased to be greater than the integrated amount of ultraviolet light emitted by the first light source. In other words, according to the above method, it is possible to obtain a decorative material or the like imparted with a matte effect while reducing the space required for installing the second light source that cures the curable resin.

[0018] More specifically, the first speed is typically determined based on the cumulative light amount required to form fine irregularities on the surface of the curable resin. This is because if the cumulative light amount becomes excessive, it becomes difficult to form the fine irregularities. Here, if the substrate is transported at a speed equal to the first speed during the curing process, it becomes difficult to increase the cumulative light amount of ultraviolet light during the curing process, which would require, for example, the installation of multiple light sources. In contrast, by making the transport speed of the substrate during the curing process (second speed) slower than the first speed, it becomes possible to increase the cumulative light amount of ultraviolet light during the curing process while reducing the space required for installing the light sources during the curing process.

[0019] In addition, in the above-mentioned light processing method, The step (b) may be a step carried out before the step (a) to modify the main surface of the substrate.

[0020] While a large cumulative light dose is not required when modifying the main surface of a substrate, a large cumulative light dose is typically required to harden a curable resin. This is because modifying the main surface of a substrate is merely a reaction that oxidizes the surface of the substrate. In other words, the same discussion as in roughening a substrate applies to the point that the first speed is determined based on the cumulative light dose required to modify the substrate. Furthermore, by transporting the substrate at a second speed slower than the first speed, the cumulative light dose of ultraviolet light emitted by the second light source can be easily increased to be greater than the cumulative light dose of ultraviolet light emitted by the first light source. Therefore, according to the above method, even when supplying a curable resin to a substrate after modifying the surface of the substrate with ultraviolet light, the space required for installing the second light source that hardens the curable resin can be reduced.

[0021] The light treatment method includes: After carrying out the step (d), the method may include a step of conveying the substrate at a third speed slower than the second speed, and then stopping the conveyance of the substrate.

[0022] Preferably, the substrate, after the curing step of the curable resin, is stopped at a predetermined position on the transport unit that transports the substrate and collected. Here, the second speed of the substrate may differ for each sample. In this case, stopping the substrate at the predetermined position requires stopping the transport unit at a timing that takes into account the speed of each substrate. In contrast, according to the above method, after the curing step, the substrate is transported at a third speed slower than the second speed. This makes it easy to stop the substrate at the predetermined position even when the second speed differs for each substrate.

[0023] In addition, in the above-mentioned light processing method, The step (b) creating an inert gas atmosphere in a light treatment space where the first light source is located; a step of exhausting gas originating from the light treatment space to the outside from an exhaust space partitioned from the light treatment space, The light treatment method may include a step of exhausting gas originating from the light treatment space to the outside through an exhaust chamber located upstream or downstream of a light treatment chamber having the light treatment space and the exhaust space and spaced apart from the light treatment chamber.

[0024] According to the above method, the oxygen concentration in the light treatment space is reduced, and the ultraviolet light emitted by the first light source can be efficiently irradiated onto the substrate. Here, as will be described in detail in the "Embodiment for Carrying Out the Invention" section, it is expected that gas originating from the light treatment space will leak to the outside from the periphery of the light treatment chamber when the substrate conveying speed is changed. In contrast, according to the above method, it is possible to prevent gas originating from the light treatment space from leaking to the outside while maintaining a low oxygen concentration, thereby minimizing the impact on workers who may be present around the light treatment chamber.

[0025] The optical processing system according to the present invention comprises: a transport unit that transports a substrate to be processed; a supply unit that supplies a curable resin to a main surface of the substrate; a first light source that irradiates ultraviolet light toward a main surface of the substrate on the conveying unit; a second light source that is disposed downstream of the supply unit and the first light source with respect to the transport direction of the transport unit and that irradiates ultraviolet light toward the main surface of the substrate on the transport unit; a detection unit that detects a position of the substrate in the conveying direction; The transport unit is characterized by being provided with a control unit that controls the transporting unit to reduce the transport speed of the substrate located after the first light source and before the second light source in the transport direction based on a signal from the detection unit.

[0026] According to the above configuration, the second speed at which the substrate is irradiated with ultraviolet light emitted by the second light source can be made slower than the first speed at which the substrate is irradiated with ultraviolet light emitted by the first light source. Therefore, even when the integrated amount of ultraviolet light emitted by the second light source needs to be greater than the integrated amount of ultraviolet light emitted by the first light source to cure the curable resin, the space required to install the second light source can be reduced.

[0027] In the optical processing system, The supply unit may be disposed before the first light source in the transport direction, or may be disposed after the first light source in the transport direction.

[0028] In addition, in the optical processing system, The control unit may be configured to stop the transport unit after reducing the transport speed of the substrate located downstream of the second light source in the transport direction based on a signal from the detection unit.

[0029] The above configuration is preferable because it is easy to stop the substrate at a predetermined position even when the second speed of the substrate is made different for each sample.

[0030] Furthermore, the optical processing system includes: a light processing chamber having a light processing space in which the first light source is located and an exhaust space that is partitioned from the light processing space and that exhausts gas from the light processing space; An exhaust chamber may be provided at a position upstream or downstream of the light processing chamber in the transport direction, the exhaust chamber being spaced apart from the light processing chamber and configured to exhaust gas originating from the light processing space to the outside.

[0031] For example, when the transport speed of the substrate is changed, it is expected that gas originating from the light treatment space will leak around the light treatment chamber. In contrast, the above configuration can prevent the gas from leaking to the outside while maintaining a low oxygen concentration. In other words, the above configuration is preferable because it can reduce the impact on workers who may be around the light treatment chamber.

[0032] The optical processing system includes: There may be a plurality of exhaust chambers provided both upstream and downstream of the optical processing chamber in the transport direction. [Effects of the Invention]

[0033] According to the present invention, there are provided a light processing method that can reduce the space required for installing a light source that cures a curable resin, and a light processing system that reduces the space required. [Brief explanation of the drawings]

[0034] [Figure 1] 1 is a diagram schematically illustrating an example of the configuration of an optical processing system according to the present invention. [Figure 2] FIG. 1 is a block diagram partially showing the configuration of an optical processing system. [Figure 3] 1 is a diagram schematically illustrating an example of the transition of the transport speed of a substrate. [Figure 4] FIG. 1 is a flow diagram illustrating an example of a light processing method performed by a light processing system. [Figure 5A] 10 is a diagram schematically illustrating the configuration of the substrate after a supplying step is performed. [Figure 5B] 1 is a diagram schematically illustrating the configuration of a substrate after an ultraviolet irradiation step is performed. [Figure 6] 1, and is a diagram schematically showing the configuration of an optical processing system according to a second embodiment. [Figure 7] FIG. 10 is a flowchart showing an example of a processing method executed by the optical processing system according to the second embodiment. [Figure 8] FIG. 7 is an enlarged view of the supply unit in FIG. 6. [Figure 9] 10 is a diagram schematically illustrating the configuration of the substrate after a supplying step is performed. [Figure 10] 10 is a diagram partially showing the configuration of an optical processing system according to a third embodiment. [Figure 11] FIG. 3 is a diagram schematically illustrating the configuration of a control unit, following FIG. 2. [Figure 12] 1 is a diagram schematically illustrating an example of the transition of the transport speed of a substrate. [Figure 13A] 10 is a diagram partially illustrating the configuration of an optical processing system according to a fourth embodiment. [Figure 13B] 13B is an enlarged view of a portion of FIG. 13A. [Figure 14A] 10 is a diagram showing another example of the configuration of the optical processing system. [Figure 14B] 14B is an enlarged view of a portion of FIG. 14A. [Figure 15] 10 is a diagram showing another example of the configuration of the control unit. [Figure 16] 10 is a diagram showing yet another example of the configuration of the control unit. DETAILED DESCRIPTION OF THE INVENTION

[0035] Hereinafter, embodiments of the optical processing method and the optical processing system according to the present invention will be described with reference to the drawings as appropriate. Note that the drawings are all schematic illustrations, and the dimensional ratios and numbers in the drawings do not necessarily correspond to the actual dimensional ratios and numbers.

[0036] [First embodiment] Fig. 1 is a diagram schematically illustrating an example of the configuration of an optical processing system according to the present invention. Fig. 1 shows a block diagram of some elements of the optical processing system 1. Below, the configuration of the optical processing system 1 will be described with reference to Fig. 1, and then an optical processing method executed by the optical processing system 1 will be described.

[0037] As shown in FIG. 1, the optical processing system 1 includes a transport unit 3 that transports a substrate W1 to be processed, a supply unit 5 that supplies a curable resin 6 to the main surface of the substrate W1, an optical processing chamber 10, a light source 21, a control unit 30, and a detection unit 31.

[0038] In the following drawings, the XYZ coordinate system will be referred to as appropriate, in which the conveying direction of the substrate W1 is the X direction and the plane perpendicular to the X direction is the YZ plane. The Z direction is typically the vertical direction.

[0039] In the following description, when a positive or negative direction is to be distinguished from the positive or negative direction, the direction is described with a positive or negative sign, such as "+X direction" and "-X direction." When a direction is to be described without distinguishing between positive and negative directions, the direction is simply described as "X direction." In other words, in this specification, when simply described as "X direction," both the "+X direction" and the "-X direction" are included. The same applies to the Y direction and the Z direction.

[0040] (Transport unit 3) 1, the transport unit 3 supports the substrate W1 to be processed and transports the substrate W1 in the +X direction. As an example, the transport unit 3 includes pulleys (3a, 3b) and a belt 3c.

[0041] The pulleys (3a, 3b) are, for example, shaped like a rotating body with an axis extending in the Y direction as its center. The belt 3c is, for example, shaped like a sheet and is wound around the pulleys 3a and 3b. The substrate W1 on the belt 3c is transported due to the rotation of the pulleys (3a, 3b).

[0042] The width (dimension in the Y direction) of the pulleys (3a, 3b) is preferably larger than the width of the belt 3c. Furthermore, the width (dimension in the Y direction) of the belt 3c is preferably larger than the dimension in the Y direction of the base material W1. As an example, the width of the belt 3c is 500 mm or more and 560 mm or less. Furthermore, the thickness (dimension in the Z direction) of the belt 3c is preferably 0.1 mm or more and 2.0 mm or less, from the viewpoint of suppressing deflection of the belt 3c and facilitating smooth movement.

[0043] The belt 3c is made of a resin material such as polyurethane or polytetrafluoroethylene (PTFE). Considering that ultraviolet rays (L1, L2), which will be described later, can generate active substances such as ozone and hydroxyl radicals when applied to oxygen or water in the air, the belt 3c is preferably made of a fluorine-based resin material such as PTFE.

[0044] In addition, from the viewpoint of facilitating the change of the conveying speed, which will be described later, it is preferable that the belt 3c is configured to be continuous in the X direction.

[0045] (Supply Unit 5) The supply unit 5 supplies the curable resin 6 to the main surface of the substrate W1. A conventionally known configuration can be used to supply the curable resin 6 to the substrate W1. Specifically, examples of the method for supplying the curable resin 6 include die coating, bar coating, spray coating, and curtain coating.

[0046] The curable resin 6 is a photocurable resin that is cured by irradiation with ultraviolet light. For example, the photocurable resin is a bifunctional acrylate UV-curable resin. The photocurable resin includes a precursor of an acrylic resin, a photopolymerization initiator that polymerizes the precursor, and a solvent. The precursor of the acrylic resin is composed of a monomer or oligomer having an acrylic group, or both a monomer and an oligomer having an acrylic group. Instead of the precursor of the acrylic resin, a precursor of another resin (e.g., an epoxy resin) may be used.

[0047] (Optical processing chamber 10) 1, the light processing chamber 10 includes an ultraviolet irradiation unit 11, a purge unit 14, and exhaust units (16, 17). The light processing chamber 10 has a partition wall 10a, and the ultraviolet irradiation unit 11, the purge unit 14, and the exhaust units (16, 17) in the light processing chamber 10 are partitioned by the partition wall 10a. In this embodiment, the light processing chamber 10 is located after the supply unit 5, i.e., on the +X side.

[0048] The ultraviolet irradiation unit 11 has a box shape with an opening in the −Z direction. As shown in Fig. 1, the ultraviolet irradiation unit 11 has a light source 11a therein and forms a light processing space A1.

[0049] The light source 11a irradiates ultraviolet light L1 toward the main surface of the substrate W1 being transported by the transport unit 3. The ultraviolet light L1 is vacuum ultraviolet light, i.e., light that exhibits light intensity in a wavelength band of at least 205 nm or less. In this specification, "exhibiting light intensity in a wavelength band of at least 205 nm or less" refers to light that exhibits emission intensity at least at 205 nm or less in the emission spectrum of the light source 11a. Examples of such light include: (1) light that exhibits intensity over a broad wavelength band and exhibits an emission spectrum in which the peak emission wavelength showing the maximum intensity is 205 nm or less; (2) light that exhibits an emission spectrum with multiple maximum intensities (multiple peaks), with any of the multiple peaks falling within the wavelength range of 205 nm or less; and (3) light in which light at 205 nm or less exhibits an integrated intensity of at least 30% or more of the total integrated intensity in the emission spectrum.

[0050] As an example, the light source 11a is configured as a xenon excimer lamp, and emits ultraviolet light L1 whose peak emission wavelength showing maximum intensity is located around 172 nm. The number of light sources 11a in the ultraviolet irradiation unit 11 is arbitrary. Note that the light source 11a may be configured as a solid-state light source such as an LED. The light source 11a corresponds to the "first light source."

[0051] 1, the ultraviolet irradiation unit 11 has gas inlets (12a, 12b). The gas inlets (12a, 12b) are connected to a gas source (not shown) and introduce an inert gas G1 into the ultraviolet irradiation unit 11. By introducing the inert gas G1 into the ultraviolet irradiation unit 11, the light treatment space A1 becomes an inert gas atmosphere. This reduces the oxygen concentration in the light treatment space A1, making it easier to irradiate the substrate W1 with ultraviolet light L1.

[0052] As the inert gas G1, for example, nitrogen gas can be used. Note that, from the viewpoint of easily creating an inert gas atmosphere in the light treatment space A1, it is preferable that the gas inlet ports (12a, 12b) inject the inert gas G1 along an XY plane including the transport direction of the substrate W1.

[0053] In this specification, the term "inert gas atmosphere" may refer to an atmosphere in which the inert gas G1 occupies 90 vol% or more of the total in the light treatment space A1. This is preferable because the oxygen concentration in the light treatment space A1 is less than 10 vol%. For example, when 172 nm ultraviolet light travels 4 mm through a space with an oxygen concentration of less than 10%, a light intensity of 50% or more can be ensured. It is preferable that the inert gas G1 occupies 95 vol% or more in the light treatment space A1. In this case, the oxygen concentration in the light treatment space A1 is reliably less than 5%. For example, when 172 nm ultraviolet light travels 4 mm through a space with an oxygen concentration of 5% or less, a light intensity of 70% or more can be ensured. It is even more preferable that the inert gas concentration in the light treatment space A1 is 98 vol% or more.

[0054] The purge unit 14 has a box shape with an opening in the -Z direction. The purge unit 14 also has a nozzle 14a, as shown in Fig. 1. The nozzle 14a is connected to a gas source (not shown) and sprays a purge gas G2 made of an inert gas.

[0055] When the substrate W1 transported by the transport unit 3 is transported to a region facing the light processing chamber 10, an air layer originating from the space outside the light processing chamber 10 may remain on the main surface of the substrate W1. In response to this, by injecting the purge gas G2 from the nozzle 14a toward the substrate W1, the air layer is reduced and oxygen is prevented from entering the light processing chamber 10. In the present invention, it is optional whether the light processing chamber 10 has a purge unit 14.

[0056] The exhaust units (16, 17) are box-shaped with an opening in the −Z direction. The exhaust unit 16 has an exhaust port 16a, and defines an exhaust space B1 on the −X side of the purge unit 14, through which gas g1 leaking from the ultraviolet irradiation unit 11 and the purge unit 14 is exhausted.

[0057] The exhaust unit 17 has an exhaust port 17a, and on the +X side of the ultraviolet irradiation unit 11, forms an exhaust space B2 for exhausting gas g2 leaking from the ultraviolet irradiation unit 11.

[0058] The gas g1 is a gas originating from the light processing space A1 and includes an inert gas G1 and a purge gas G2. Similarly to the gas g1, the gas g2 is also originating from the light processing space A1 and includes the inert gas G1. By exhausting the gas g1 and the gas g2 using the exhaust units (16, 17), it is possible to prevent the inert gas G1 and the purge gas G2 from leaking to the periphery of the light processing system 1. Considering the possibility that an operator may be present around the light processing system 1, it is preferable that the light processing chamber 10 include the exhaust units (16, 17).

[0059] (Light source 21) As shown in FIG. 1, the light source 21 is disposed downstream of the light processing chamber 10. The light source 21 irradiates ultraviolet light L2 toward the main surface of the substrate W1 being transported by the transport unit 3. This hardens the curable resin 6 supplied to the substrate W1 by the supply unit 5. As an example, the light source 21 includes a plurality of solid-state light sources such as LEDs. The ultraviolet light L2 exhibits a light intensity in a wavelength range of 250 nm or more and 500 nm or less. The light source 21 may be formed, for example, from a high-pressure mercury lamp. The light source 21 corresponds to the "second light source."

[0060] (Detection Unit 31) The detection unit 31 is a detection means for detecting the position of the substrate W1 in the X direction in the transport unit 3. As an example, the detection unit 31 includes a sensor 31a arranged at a position subsequent to the light processing chamber 10 and prior to the light source 21, and detects the position of the substrate W1 by an infrared method. In FIG. 1, as an example, an example is shown in which the sensor 31a is installed on the outer wall surface of the light processing chamber 10.

[0061] The detection unit 31 detects that the substrate W1 is positioned downstream of the light processing chamber 10, and transmits a signal d1 to the control unit 30. Note that the method for detecting the position of the substrate W1 by the detection unit 31 is arbitrary, and any conventionally known technology can be used.

[0062] (Control unit 30) Next, we will explain the configuration of the control unit 30 and the control of the transport unit 3 by the control unit 30. The control unit 30 is a control means that transmits control signals to the transport unit 3, and is configured to include a processor such as a CPU, for example.

[0063] Fig. 2 is a block diagram partially illustrating the configuration of the optical processing system 1. As shown in Fig. 2, the control unit 30 has a receiving unit 30a and a transmitting unit 30b. The control unit 30 is configured to be able to receive a signal d1 from the detection unit 31 via the receiving unit 30a (see also Fig. 1).

[0064] Then, based on receiving the signal d1 from the detection unit 31, the control unit 30 transmits a signal d2 to the transport unit 3 and changes the transport speed of the transport unit 3. Specifically, based on receiving the signal d1, the control unit 30 reduces the transport speed of the substrate W1 by the transport unit 3.

[0065] 3 is a diagram schematically illustrating an example of the transition of the conveying speed of the substrate W1. FIG. 3 shows the conveying speed of the substrate W1 relative to the position of the substrate W1 in the X direction. In FIG. 3, region C1 corresponds to the region facing the ultraviolet irradiation unit 11 in the Z direction (see FIG. 1). Region C2 corresponds to the region facing the light source 21 (see FIG. 1).

[0066] 3, after conveyance of the substrate W1 starts at speed sp1, the substrate W1 passes through the region C1 at the same speed. Thereafter, at a timing when the substrate W1 is positioned at least in front of the region C2, the control unit 30 sends a signal d2 to the conveying unit 3, and the conveying speed of the substrate W1 is changed to speed sp2. As a result, the substrate W1 passes through the region C2 at speed sp2. Speed ​​sp1 corresponds to the "first speed," and speed sp2 corresponds to the "second speed."

[0067] For example, the speed sp1 is equal to or greater than 10 m / min and less than 150 m / min. The speed sp2 is, for example, equal to or greater than 3 m / min and less than 10 m / min, and is slower than the speed sp1.

[0068] Next, a description will be given of a light processing method executed by the light processing system 1. Fig. 4 is a flow chart showing an example of a light processing method 1a executed by the light processing system 1.

[0069] (Substrate W1 preparation step S1) As shown in Fig. 4, first, a substrate W1 is prepared. As an example, the substrate W1 may be a plate-shaped member made of resin, steel, or wood. The substrate W1 may also be in the form of a sheet. Once the substrate W1 is prepared, transportation of the substrate W1 begins.

[0070] (Curing resin supply process S2) Next, the supply unit 5 supplies the curable resin 6 onto the main surface of the substrate W1. Fig. 5A is a diagram schematically showing the configuration of the substrate W1 after the supply step S2 is performed. As a result of the supply step S2, a resin layer P1 made of the curable resin 6 is formed on the main surface of the substrate W1, as shown in Fig. 5A.

[0071] Step S2 of supplying the curable resin 6 onto the main surface of the substrate W1 corresponds to step (a).

[0072] (Ultraviolet light L1 irradiation step S3) Then, ultraviolet rays L1 are irradiated toward the base material W1, more specifically, toward the resin layer P1 on the base material W1 (ultraviolet ray irradiation step S3). Fig. 5B is a diagram schematically illustrating the configuration of the base material W1 after the ultraviolet ray irradiation step S3 has been performed.

[0073] As mentioned above, the ultraviolet light L1 exhibits light intensity at least in a wavelength band of 205 nm or less. By irradiating the resin layer P1 with the ultraviolet light L1, double bonds in the molecules constituting the resin layer P1 are cleaved, and the cleaved portions react with other molecules. This causes the volume of the resin layer P1 to decrease and shrink, resulting in the formation of an uneven region P1a on the surface of the resin layer P1, which includes fine irregularities that scatter visible light (see FIG. 5B). In other words, the irradiation of the ultraviolet light L1 roughens the surface of the resin layer P1, imparting a matte finish to the substrate W1.

[0074] During the ultraviolet irradiation step S3, the substrate W1 is transported at a speed sp1 (see FIG. 3).

[0075] Furthermore, in order to efficiently irradiate the substrate W1 with the ultraviolet rays L1, the oxygen concentration in the light treatment space A1 is made low by introducing the inert gas G1 (see FIG. 1). That is, the light treatment method 1a includes a step of filling the light treatment space A1 with an inert gas atmosphere when irradiating the substrate W1 with the ultraviolet rays L1.

[0076] Furthermore, as mentioned above, in view of the presence of workers around the optical processing system 1, it is preferable to perform a process of exhausting gases (g1, g2) originating from the optical processing space A1 from the exhaust spaces (B1, B2) of the optical processing chamber 10 during the process of creating an inert gas atmosphere in the optical processing space A1.

[0077] Thus, the step S3 of irradiating the substrate W1 with ultraviolet light L1 corresponds to step (b). In this embodiment, the ultraviolet light irradiation step S3 is a step of roughening the surface of the resin layer P1.

[0078] At this stage, only the resin layer P1 is shrunk, and the entire resin layer P1 is in an uncured state.

[0079] (Transport speed reduction process S4) Next, as shown in Fig. 4, after the ultraviolet irradiation step S3 is performed, a step S4 is performed in which the conveying speed of the substrate W1 is reduced. The manner in which the conveying speed is changed is as described with reference to Fig. 3. The step S4 corresponds to the step (c).

[0080] (Step S5 of curing the resin layer P1) Then, in the curing step S5, the resin layer P1 on the substrate W1 is irradiated with ultraviolet light L2 emitted by the light source 21. As described above, the ultraviolet light L2 has a light intensity in the wavelength range of 250 nm or more and 500 nm or less. As a result, the ultraviolet light L2 acts on the photopolymerization initiator in the resin layer P1, causing a polymerization reaction of the curable resin 6 that constitutes the resin layer P1 to proceed, and the resin layer P1 is cured.

[0081] In this way, the step S5 of irradiating the resin layer P1 on the base material W1 with ultraviolet light L2 to harden the resin layer P1 corresponds to the step (d).

[0082] Thereafter, the conveyance of the substrate W1 is stopped at a predetermined position downstream of the light source 21, and the substrate W1 is removed (post-process).

[0083] In the ultraviolet irradiation step S3, the resin layer P1 made of the curable resin 6 in a liquid state is irradiated with ultraviolet light L1, causing it to shrink, thereby forming fine irregularities on the surface of the resin layer P1. Meanwhile, in the curing step S5, the resin layer P1 is irradiated with ultraviolet light L2, causing the entire resin layer P1 to be cured. Therefore, the integrated light amount of the ultraviolet light L2 in the curing step S5 is set to the integrated light amount required to cure the entire resin layer P1. In other words, the integrated light amount of the ultraviolet light L2 is set to be higher than the integrated light amount of the ultraviolet light L1 in the ultraviolet irradiation step S3.

[0084] As described above, the conveying speed of the base material W1 during the curing step S5 is set to speed sp2, which is slower than speed sp1 (see FIG. 3). This makes it easy to increase the integrated light amount of the ultraviolet light L2 irradiated onto the resin layer P1 to be greater than the integrated light amount of the ultraviolet light L1 irradiated onto the resin layer P1. In other words, according to the light treatment method 1a, it is possible to obtain a decorative material or the like that has a matte finish while reducing the space required to install the light source 21 that cures the resin layer P1.

[0085] [Second embodiment] Next, a second embodiment of the optical processing system 1 will be described, focusing on differences from the first embodiment. Fig. 6 is a diagram schematically showing the configuration of the optical processing system 1 according to the second embodiment, following Fig. 1. Fig. 7 is a flow chart showing an example of an optical processing method 1a executed by the optical processing system 1 according to the second embodiment.

[0086] 6 differs from the first embodiment in that the supply unit 5 that supplies the curable resin 7 to the substrate W1 is located after the light processing chamber 10 and before the light source 21 in the X direction. That is, as shown in FIG. 7, in this embodiment, the ultraviolet irradiation step S3 is performed before the supply step S2. An example of the configuration of the supply unit 5 will be described later with reference to FIG. 8.

[0087] In this embodiment, ultraviolet light L1 emitted by the light source 11a is directly irradiated onto the main surface of the substrate W1 (ultraviolet light irradiation step S3). This makes the main surface of the substrate W1 hydrophilic. This hydrophilization process occurs because the irradiation of ultraviolet light L1 oxidizes the main surface of the substrate W1, increasing the number of polar molecules, such as hydroxyl groups (-OH groups), on the main surface. In addition, the irradiation of ultraviolet light L1 is expected to have the effect of decomposing organic molecules present on the main surface of the substrate W1.

[0088] In this embodiment, the oxygen concentration in the light treatment space A1 when irradiating with ultraviolet light L1 is set to, for example, 1% to 10%, which allows an active substance such as ozone to be generated from the oxygen present in the light treatment space A1 and used to treat the surface of the substrate W1.

[0089] 7, after the ultraviolet irradiation step S3 is performed and before the curing step S5 is performed, a step S4 of reducing the conveying speed of the base material W1 is performed (see also FIG. 3). Note that, although an example in which the conveying speed of the base material W1 is reduced before the supplying step S2 is performed is shown in FIG. 7, the conveying speed of the base material W1 may be reduced after the supplying step S2 is performed.

[0090] Fig. 8 is an enlarged view of the supply unit 5 in Fig. 6. As shown in Fig. 8, the supply unit 5 includes a plurality of rollers 5a, and supplies the sheet-shaped curable resin 7 to the main surface of the substrate W1 by feeding the curable resin 7 (supply step S2).

[0091] In this embodiment, the curable resin 7 exhibits adhesive properties. The curable resin 7 has spacers (7a, 7b) on both sides, and the supply unit 5 supplies the curable resin 7 to the substrate W1 while peeling off the spacer 7b on the substrate W1 side. FIG. 9 is a diagram schematically showing the configuration of the substrate W1 after the supply step S2 is performed. As shown in FIG. 9, by performing the supply step S2, a resin layer P1 is formed on the main surface of the substrate W1. In this embodiment, the resin layer P1 has a spacer 7a on the side opposite to the main surface of the substrate W1.

[0092] By performing the ultraviolet irradiation process S3, the hydrophilicity of the main surface of the substrate W1 is improved, and then the curable resin 7 is supplied to the substrate W1, which is preferable as it improves the adhesive strength between the substrate W1 and the resin layer P1.

[0093] Next, the light source 21 irradiates the resin layer P1 with ultraviolet light L2 through the spacer 7a (curing step S5). As a result, the ultraviolet light L2 acts on the photopolymerization initiator in the resin layer P1, causing a polymerization reaction of the curable resin 7 that constitutes the resin layer P1 to proceed, and the resin layer P1 is cured.

[0094] Here, similar to the first embodiment, the curing step S5 requires a large integrated light amount of ultraviolet light L2, whereas the ultraviolet light irradiation step S3 does not require a large integrated light amount of ultraviolet light L1, because the ultraviolet light irradiation step S3 is merely a step of oxidizing the surface of the base material W1.

[0095] In contrast, in this embodiment, as in the first embodiment, the conveying speed of the substrate W1 during the curing step S5 is set to speed sp2, which is slower than speed sp1 (see also FIG. 3). This makes it easy to make the integrated light amount of ultraviolet light L2 irradiated onto the resin layer P1 greater than the integrated light amount of ultraviolet light L1 irradiated onto the main surface of the substrate W1. In other words, the light processing method 1a according to this embodiment makes it possible to obtain an adhesive laminate material while reducing the space required for installing the light source 21 that cures the resin layer P1. The laminate material can be adhered to a desired location by peeling off the spacer 7a.

[0096] In this embodiment, the adhesive curable resin 7 may be supplied in any manner.

[0097] [Third embodiment] Next, a third embodiment of the optical processing system 1 will be described, focusing on the differences from the first embodiment. Fig. 10 is a diagram partially illustrating the configuration of the optical processing system 1 according to the third embodiment. Fig. 10 illustrates the configuration of the rear stage of the light source 21 in the optical processing system 1. Note that in this embodiment, the configuration of the front stage of the light source 21 is the same as in the first embodiment.

[0098] 10 also shows a planned stop area E1 where the transport of the substrate W1 is stopped after the ultraviolet light L2 is irradiated onto the substrate W1 (curing step S5). After the transport of the substrate W1 is stopped in the planned stop area E1, the substrate W1 is collected. As an example, the planned stop area E1 corresponds to the position of an opening / closing part for removing the substrate W1 in a chamber (not shown) that houses the transport unit 3.

[0099] Here, it is conceivable to vary the speed sp2 of the substrate W1 for each sample. In this case, to stop the substrate W1 in the planned stop area E1, it becomes necessary to stop the transport unit 3 at a timing that takes into account each speed sp2. In other words, if the transport unit 3 is stopped when the substrate W1 reaches a predetermined position, regardless of the speed sp2, the stop position of the substrate W1 will fluctuate depending on the speed sp2. Furthermore, it is conceivable that, depending on the speed sp2, it may be difficult to suddenly stop the substrate W1 in the planned stop area E1.

[0100] 10, a sensor 31b may be disposed after the light source 21. The sensor 31b detects that the substrate W1 is located after the light source 21, and transmits a signal d3 to the control unit 30.

[0101] Fig. 11 is a diagram schematically illustrating the configuration of the control unit 30, following Fig. 2. As shown in Fig. 11, when the control unit 30 receives a signal d3 from the detection unit 31, it transmits a signal d4 to the transport unit 3 to reduce the transport speed of the transport unit 3.

[0102] 12 is a diagram schematically illustrating an example of the transition of the conveying speed of the substrate W1 in this embodiment. As shown in FIG. 12, the control unit 30 transmits a signal d4 to the conveying unit 3 to control the conveying speed of the substrate W1 to change from speed sp2 to speed sp3. Speed ​​sp3 is preferably set to be slower than speed sp2.

[0103] Furthermore, by setting the speed sp3 to a predetermined speed, even when the speed sp2 is changed, it is possible to stop the substrate W1 in the intended stopping area E1 without changing the position where the operation to stop the transport unit 3 is performed. In other words, when the control unit 30 sends a signal dx to the transport unit 3 to stop the transport unit 3 (see FIG. 12), it is no longer necessary to change the timing of sending the signal dx depending on the speed sp2.

[0104] Therefore, the light processing method 1a preferably includes a step of conveying the substrate W1 at a speed sp3 slower than the speed sp2 after the resin layer P1 is cured (curing step S5), and then stopping the conveyance of the substrate W1. The speed sp3 corresponds to the "third speed."

[0105] As an example, the speed sp3 is preferably equal to or greater than 1 m / min and less than 3 m / min, and more preferably equal to or greater than 2 m / min and less than 3 m / min.

[0106] In this embodiment, similar to the first embodiment, the control unit 30 sends a signal d2 to the conveying unit 3 based on a signal d1 from the detection unit 31, and changes the conveying speed of the substrate W1 from speed sp1 to speed sp2.

[0107] The configuration according to this embodiment can be realized in combination with the second embodiment.

[0108] [Fourth embodiment] Next, a fourth embodiment of the optical processing system 1 will be described, focusing on the differences from the first embodiment.

[0109] 13A is a diagram partially illustrating the configuration of the optical processing system 1 according to the fourth embodiment. As shown in Fig. 13A, the optical processing system 1 may have an exhaust chamber 24 located upstream of the optical processing chamber 10 and spaced apart from the optical processing chamber 10 in the X direction. The exhaust chamber 24 is box-shaped with an opening in the -Z direction and has an exhaust port 24a.

[0110] As described above, the exhaust unit 16 exhausts the gas g1 leaking from the ultraviolet irradiation unit 11 and the purge unit 14. When the conveying speed of the substrate W1 is constant, as shown in Fig. 13A, the pressure of the gas g1 sucked in by the exhaust unit 16 from the +X side and the pressure of the gas g3 sucked in from the -X side are balanced, and a mixed gas of the gas g1 and the gas g3 is exhausted from the exhaust port 16a.

[0111] However, when the conveying speed of the substrate W1 is reduced from speed sp1 to speed sp2, the rotation speed of the belt 3c is reduced, which is thought to disrupt the balance between the pressures of the gases g1 and g3. Fig. 13B is an enlarged view of a portion of Fig. 13A, and Fig. 13B schematically shows the relationship between the pressures of the gases g1 and g3 at the time when the conveying speed of the substrate W1 is reduced. In other words, as shown in Fig. 13B, it is thought that when the conveying speed of the substrate W1 is reduced, the pressure of the gas g1 temporarily exceeds that of the gas g3, causing the gas g1 to leak out from the -X side of the exhaust unit 16.

[0112] The gas g1 is a gas originating from the light treatment space A1. Therefore, the gas g1 contains an inert gas G1 and a purge gas G2, and has a lower oxygen concentration than air. Since it is expected that workers may be present around the light treatment system 1, it is preferable to prevent the gas g1 from leaking to the outside when the oxygen concentration of the gas g1 is low. Furthermore, as described with reference to the second embodiment, when the oxygen concentration of the light treatment space A1 is, for example, 1% or more and 10% or less, it is expected that the gas g1 may contain ozone.

[0113] In contrast, by providing the exhaust chamber 24 at a position spaced apart from the light processing chamber 10 on the -X side of the light processing chamber 10, even if the gas g1 locally leaks to the -X side of the light processing chamber 10 (see FIG. 13B), a part of the gas g1 is drawn into the exhaust chamber 24 by the gas flow f1 generated by exhausting the exhaust chamber 24. Also, although a part of the gas g1 may leak out from between the light processing chamber 10 and the exhaust chamber 24, the gas flow f1 mixes the gas g1 with the air surrounding the exhaust chamber 24, and as a result, it is possible to prevent the gas g1 from leaking to the outside while maintaining a low oxygen concentration.

[0114] If the exhaust chamber 24 were installed adjacent to the light processing chamber 10, it is expected that the gas g1 would leak from a position on the -X side of the exhaust chamber 24. In view of this, it is preferable that the exhaust chamber 24 be arranged at a distance in the X direction from the light processing chamber 10. As an example, the distance D1 in the X direction between the light processing chamber 10 and the exhaust chamber 24 is 1 mm or more and 100 mm or less, and preferably 5 mm or more and 20 mm or less. The distance D1 can be designed appropriately depending on the transport speed (sp1, sp2) of the substrate W1.

[0115] 14A is a diagram showing another example of the configuration of the optical processing system 1. As shown in Fig. 14A, the optical processing system 1 may have an exhaust chamber 25 at a position downstream of the optical processing chamber 10, spaced apart from the optical processing chamber 10 in the X direction. The configuration of the exhaust chamber 25 is similar to that of the exhaust chamber 24.

[0116] The exhaust unit 17 exhausts the gas g2 originating from the light processing space A1, similar to the exhaust unit 16. Here, when the substrate W1 (belt 3c) is stopped or the conveying speed of the substrate W1 is constant, the pressure of the gas g2 sucked in by the exhaust unit 17 from the -X side and the pressure of the gas g4 sucked in from the +X side are balanced. However, for example, when the substrate W1 starts to be conveyed after being placed on the conveying unit 3, the rotation speed of the belt 3c is increased from the stopped state to a speed sp1 (see FIG. 3).

[0117] That is, as shown in Figure 14B, when the rotation speed of the belt 3c is increased, the balance of the pressures of the gases g2 and g4 is thought to be lost. Figure 14B is an enlarged view of a portion of Figure 14A, and Figure 14B shows a schematic diagram of the relationship between the pressures of the gases g2 and g4 when the rotation speed of the belt 3c is increased. That is, when the rotation speed of the belt 3c is increased, the pressure of the gas g2 temporarily exceeds that of the gas g4, and it is assumed that the gas g2 containing the inert gas G1 in the light processing chamber 10 leaks out from the +X side of the light processing chamber 10.

[0118] As with gas g1, it is preferable to prevent gas g2 from leaking to the outside. By providing an exhaust chamber 25 at a position spaced apart from the +X side of the light processing chamber 10 on the +X side of the light processing chamber 10, even if gas g2 locally leaks to the +X side of the light processing chamber 10, a gas flow f2 generated by exhaust from the exhaust chamber 25 draws a portion of the gas g2 into the exhaust chamber 25. Although a portion of the gas g2 may leak out from between the light processing chamber 10 and the exhaust chamber 25, the gas flow f2 mixes the gas g2 with the air surrounding the exhaust chamber 25, thereby preventing the gas g2 from leaking to the outside while maintaining a low oxygen concentration.

[0119] If the exhaust chamber 25 were installed adjacent to the light processing chamber 10, it is expected that gas g2 would leak from a position on the +X side of the exhaust chamber 25. In view of this, it is preferable that the exhaust chamber 25 be arranged at a distance in the X direction from the light processing chamber 10. As an example, the distance D2 in the X direction between the light processing chamber 10 and the exhaust chamber 25 is 1 mm or more and 100 mm or less, and preferably 5 mm or more and 20 mm or less. The distance D2 can be designed appropriately depending on the transport speed (sp1, sp2) of the substrate W1.

[0120] As described above, in the optical processing system 1 according to the fourth embodiment, a process of exhausting gas g1 originating from the optical processing space A1 from the exhaust chamber 24 is carried out in the upstream of the optical processing chamber 10 (see FIG. 13B). This makes it possible to prevent the gas g1 from leaking to the outside while still having a low oxygen concentration. Similarly, a process of exhausting gas g2 originating from the optical processing space A1 from the exhaust chamber 25 is carried out in the downstream of the optical processing chamber 10 (see FIG. 14B). This makes it possible to prevent the gas g2 from leaking to the outside while still having a low oxygen concentration. According to this embodiment, even if the gases (g1, g2) leak around the optical processing system 1, it is possible to prevent the impact on workers who may be around the optical processing system 1, which is preferable.

[0121] 14A, the optical processing system 1 has been described as having both the exhaust chamber 24 and the exhaust chamber 25. However, the optical processing system 1 may have either the exhaust chamber 24 or the exhaust chamber 25.

[0122] Considering that the substrate W1 is transported in the X direction, it is considered that the gas g2 is more likely to leak out of the light processing chamber 10 than the gas g1. In view of this, it is preferable that the light processing system 1 has at least an exhaust chamber 25.

[0123] [Variations] Below, a modification of the optical processing system 1 will be described.

[0124] <1> In the above description, the curable resin (6, 7) is supplied to the substrate W1 in a conveying state. However, the present invention is not limited to this. Specifically, for example, in the first embodiment, the supply unit 5 configured separately from the conveying unit 3 may supply the curable resin 6 to the substrate W1. In other words, the conveying of the substrate W1 may start after the resin layer P1 is formed on the main surface of the substrate W1.

[0125] <2> In the above, the installation positions of the sensors 31a and 31b are arbitrary.

[0126] <3> In the above description, the detection unit 31 is described as including the sensors (31a, 31b), but the present invention is not limited to this example. Fig. 15 is a diagram showing another configuration example of the control unit 30. For example, as shown in Fig. 15, the control unit 30 may include the detection unit 31. The detection unit 31 may be configured to include, for example, an encoder, and may be configured to be able to detect the position of the substrate W1 in the X direction based on the rotation speed of the pulley 3a and the time when conveyance of the substrate W1 starts.

[0127] 16 is a diagram showing yet another example of the configuration of the control unit 30. As shown in Fig. 16, the control unit 30 may be incorporated into the transport unit 3. In other words, it is optional whether the control unit 30 has a receiving unit 30a.

[0128] <4> The signals d1 to d4 may be wireless signals or wired signals. The same applies to the signal dx.

[0129] <5> It is optional whether or not the optical processing chamber 10 of the optical processing system 1 has the exhaust units (16, 17). When there are no workers around the optical processing system 1 or when there is an exhaust facility that does not belong to the optical processing system 1, the optical processing system 1 does not need to have the exhaust units (16, 17).

[0130] This also applies to the exhaust chambers (24, 25) described with reference to the fourth embodiment. In other words, it is optional whether the optical processing system 1 has the exhaust chambers (24, 25).

[0131] <6> Furthermore, the present invention is not limited to whether the light processing chamber 10 has a purge unit 14. When the substrate W1 is irradiated with ultraviolet light L1, if the influence of the air layer above the substrate W1 is negligible, the light processing system 1 does not need to have the purge unit 14.

[0132] <7> The configuration of the optical processing system 1 described above is merely an example, and the present invention is not limited to the illustrated configurations. The above configurations can be realized by combining them appropriately. [Explanation of symbols]

[0133] 1: Optical processing system 1a: Light treatment method 3: Transport unit 3a, 3b: Pulley 3c: Belt 5: Supply unit 5a: Laura 6,7 : Curing resin 7a, 7b: Spacer 10: Optical processing chamber 10a : Bulkhead 11: UV irradiation unit 11a: Light source 12a, 12b: Gas inlet 14: Purge unit 14a: Nozzle 16,17: Exhaust unit 16a, 17a: Exhaust port 21 : Light source 24,25: Exhaust chamber 24a, 25a: Exhaust port 30: Control unit 30a: Receiver 30b: Transmitter 31: Detection unit 31a, 31b: Sensor

Claims

1. Step (a) of supplying a curable resin to a main surface of a substrate to be treated; a step (b) of irradiating ultraviolet light from a first light source toward a main surface of the substrate being transported at a first speed before or after the step (a); a step (c) of changing the conveying speed of the substrate to a second speed that is slower than the first speed after the step (b) is performed; and (d) irradiating ultraviolet light from a second light source disposed downstream of the first light source with respect to the transport direction of the substrate toward the main surface of the substrate being transported at the second speed, thereby curing the curable resin.

2. 2. The light processing method according to claim 1, wherein the step (b) is performed after the step (a) and is a step of roughening the curable resin on the main surface of the base material.

3. The light processing method according to claim 1 , wherein the step (b) is carried out before the step (a) and is a step of modifying the main surface of the base material.

4. 4. The light processing method according to claim 1, further comprising the step of: after performing the step (d), conveying the substrate at a third speed that is slower than the second speed, and then stopping the conveyance of the substrate.

5. The step (b) creating an inert gas atmosphere in a light treatment space where the first light source is located; a step of exhausting gas originating from the light treatment space to the outside from an exhaust space partitioned from the light treatment space, The light processing method according to any one of claims 1 to 3, characterized in that it comprises a step of exhausting gas originating from the light processing space to the outside through an exhaust chamber disposed at a position upstream or downstream of a light processing chamber having the light processing space and the exhaust space and spaced apart from the light processing chamber.

6. a transport unit that transports a substrate to be processed; a supply unit that supplies a curable resin to a main surface of the substrate; a first light source that irradiates ultraviolet light toward a main surface of the substrate on the conveying unit; a second light source that is disposed downstream of the supply unit and the first light source with respect to the transport direction of the transport unit and that irradiates ultraviolet light toward the main surface of the substrate on the transport unit; a detection unit that detects a position of the substrate in the conveying direction; An optical processing system characterized by comprising a control unit that controls the transport unit to reduce the transport speed of the substrate located after the first light source and before the second light source in the transport direction based on a signal from the detection unit.

7. The light processing system according to claim 6 , wherein the supply unit is disposed in front of the first light source in the transport direction.

8. The light processing system according to claim 6 , wherein the supply unit is disposed downstream of the first light source in the transport direction.

9. The optical processing system according to any one of claims 6 to 8, characterized in that the control unit is configured to stop the transport unit after reducing the transport speed of the substrate located downstream of the second light source in the transport direction based on a signal from the detection unit.

10. a light processing chamber having a light processing space in which the first light source is located and an exhaust space that is partitioned from the light processing space and that exhausts gas from the light processing space; The optical processing system according to any one of claims 6 to 8, characterized in that it has an exhaust chamber that is arranged at a position upstream or downstream of the optical processing chamber in relation to the transport direction, spaced apart from the optical processing chamber, and exhausts gas originating from the optical processing space to the outside.

11. 11. The optical processing system according to claim 10, further comprising a plurality of exhaust chambers provided both upstream and downstream of the optical processing chamber in the transport direction.

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