Drawing apparatus

Abstract

To provide a drawing device capable of varying force for pressing a conductive pin for connecting a material to a reference potential against the material.SOLUTION: The drawing apparatus for drawing a pattern on a material by irradiating the material with a charged particle beam includes a stage for supporting the material 2, a first conductive pin 16 for connecting the material 2 to a reference potential, and a first actuator 12 for moving the first conductive pin 16.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a drawing device. [Background technology]

[0002] A lithography system is a device that uses a charged particle beam such as an electron beam to draw fine patterns such as semiconductor integrated circuit patterns on materials such as mask blanks and semiconductor substrates.

[0003] In such a lithography system, the material is connected to a reference potential to prevent charging of the material due to irradiation with a charged particle beam. The reference potential may be the ground level (0 V) or a specific potential.

[0004] For example, Patent Document 1 discloses a lithography device equipped with a needle that breaks through the resist on the top surface of a mask blank and connects the conductive film underneath the resist to earth. The force that presses the needle against the resist is applied by a spring. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Utility Model Application Publication No. 61-151332 Summary of the Invention [Problem to be solved by the invention]

[0006] There are various types of mask blanks, and the thickness of the resist varies. In the lithography device disclosed in Patent Document 1, the force with which the needle presses against the resist is constant. Therefore, for example, if the resist is thick, the needle may not be able to penetrate the resist and connect to ground. Also, if the resist is thin, the needle may deeply scratch the surface of the mask blank, resulting in the generation of a large amount of dust. [Means for solving the problem]

[0007] One aspect of the drawing device according to the present invention is A drawing apparatus that draws a pattern on a material by irradiating the material with a charged particle beam, a stage for supporting the material; a first conductive pin for connecting the material to a reference potential; a first actuator that moves the first conductive pin; Includes:

[0008] In such a drawing apparatus, the first actuator can move the first conductive pin, and therefore the force with which the first conductive pin is pressed against the material can be made variable. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing the arrangement of a rendering device according to a first embodiment. [Figure 2] FIG. [Figure 3] FIG. 3 is a diagram schematically showing a first contact portion. [Figure 4] FIG. 3 is a diagram schematically showing a first contact portion and a second contact portion. [Figure 5] 5A and 5B are diagrams for explaining the operation of the first contact portion. [Figure 6] 5A and 5B are diagrams for explaining the operation of the first contact portion. [Figure 7] 5A and 5B are diagrams for explaining the operation of the first contact portion. [Figure 8] FIG. 4 is a diagram illustrating the function of an elastic member. [Figure 9] FIG. 10 is a diagram schematically showing a modified example of the first contact portion. [Figure 10] 10A and 10B are diagrams schematically showing modified examples of the first contact portion and the second contact portion. [Figure 11] 10A and 10B are diagrams schematically showing modified examples of the first contact portion and the second contact portion. [Figure 12] FIG. 10 is a diagram showing the arrangement of a rendering apparatus according to a second embodiment. [Figure 13]1 is a flowchart illustrating an example of a process for connecting a material to a reference potential. [Figure 14] FIG. 10 is a diagram showing the arrangement of a rendering apparatus according to a third embodiment. [Figure 15] 1 is a flowchart illustrating an example of a process for connecting a material to a reference potential. [Figure 16] FIG. 10 is a diagram showing the arrangement of a rendering apparatus according to a fourth embodiment. [Figure 17] FIG. 3 is a diagram schematically showing a first contact portion and a second contact portion. [Figure 18] FIG. 4 is a diagram schematically showing a second contact portion and a third contact portion. [Figure 19] FIG. 4 is a diagram schematically showing a third contact portion and a first contact portion. [Figure 20] 1 is a flowchart illustrating an example of a process for connecting a material to a reference potential. [Figure 21] FIG. 11 is a diagram schematically showing a first contact portion of the imaging device according to the fifth embodiment. [Figure 22] 5A and 5B are diagrams for explaining the operation of the first contact portion. [Figure 23] 5A and 5B are diagrams for explaining the operation of the first contact portion. DETAILED DESCRIPTION OF THE INVENTION

[0010] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. Note that the embodiments described below do not unduly limit the content of the present invention as defined in the claims. Furthermore, not all of the configurations described below are necessarily essential components of the present invention.

[0011] 1. First embodiment 1.1. Drawing device configuration First, a drawing device according to the first embodiment will be described with reference to the drawings. Fig. 1 is a diagram showing the configuration of a drawing device 100 according to the first embodiment.

[0012] The drawing apparatus 100 is an apparatus that draws a pattern on the material 2 by irradiating the material 2 with an electron beam. The drawing apparatus 100 draws, for example, a fine pattern such as a semiconductor integrated circuit pattern on the material 2. Here, the material 2 is, for example, a semiconductor substrate, a mask blank, or the like. The mask blank is a material for a photomask.

[0013] As shown in FIG. 1, the drawing apparatus 100 includes an electron optical system 110 and a stage 120.

[0014] The electron optical system 110 includes an electron gun 111, a blanker 112, an illumination lens 113, a first slit 114a, a shaping deflector 115, a shaping lens 116, a second slit 114b, a reduction lens 117, an objective lens 118, and a positioning deflector 119. The electron optical system 110 is housed in a lens barrel maintained in a vacuum state.

[0015] The electron gun 111 generates an electron beam. The blanker 112 deflects the electron beam emitted from the electron gun 111 to adjust the time for the electron beam to pass through the first slit 114a. In other words, the blanker 112 can adjust the dose of the electron beam irradiated onto the material 2. The electron beam that has passed through the blanker 112 is irradiated onto the first slit 114a via the irradiation lens 113.

[0016] The first slit 114a, shaping deflector 115, shaping lens 116, and second slit 114b shape the electron beam. An image formed by the electron beam passing through the first slit 114a is focused on the second slit 114b by the shaping lens 116. At this time, by deflecting the electron beam with the shaping deflector 115, the position of the image formed by the first slit 114a on the second slit 114b can be changed. This allows the electron beam to be shaped. By controlling the deflection direction and deflection amount of the electron beam with the shaping deflector 115, the electron beam can be shaped into any shape.

[0017] The reduction lens 117 reduces the image formed by the first slit 114a, the shaping deflector 115, the shaping lens 116, and the second slit 114b. The objective lens 118 forms the image reduced by the reduction lens 117 on the material 2. The positioning deflector 119 deflects the electron beam that has passed through the objective lens 118. This makes it possible to change the irradiation position of the electron beam on the material 2. In other words, the positioning deflector 119 can determine the position on the material 2 of the image formed by the first slit 114a, etc.

[0018] The stage 120 supports the material 2. The stage 120 is provided with a movement mechanism for moving the material 2. The stage 120 is housed in a sample chamber maintained in a vacuum state.

[0019] In the drawing apparatus 100, the first slit 114a, the shaping deflector 115, the shaping lens 116, and the second slit 114b are used to shape the electron beam, thereby controlling the cross-sectional shape of the electron beam irradiated onto the material 2, i.e., the shot shape and shot size. In addition, the blanker 112 is used to control the time during which the electron beam is irradiated onto the material 2, i.e., the shot time. In addition, the positioning deflector 119 is used to control the position of the electron beam irradiated onto the material 2, i.e., the shot position. In the drawing apparatus 100, a pattern is drawn on the material 2 by irradiating the material 2 with an electron beam shaped based on pattern data.

[0020] Although the above description has been given of a case where an electron beam is used to draw on the material 2, a charged particle beam other than an electron beam, such as an ion beam, may also be used to draw on the material 2.

[0021] FIG. 2 is a plan view schematically showing the stage 120. As shown in FIG.

[0022] As shown in FIG. 2, the drawing apparatus 100 includes a first contact portion 10 and a second contact portion 20. The first contact portion 10 and the second contact portion 20 connect the material 2 to a reference potential. The reference potential is, for example, a potential that serves as a reference for the drawing apparatus 100. The reference potential may be the ground level (0 V) or a specific potential. Connecting the material 2 to the reference potential can prevent the material 2 from being charged by irradiation with the electron beam.

[0023] The stage 120 is provided with a plurality of clamps 122. The material 2 is fixed to the stage 120 by the plurality of clamps 122. In the example shown in the figure, the material 2 is fixed to the stage 120 by three clamps 122. The material 2 supported by the stage 120 is fixed at a predetermined height.

[0024] The first contact portion 10 and the second contact portion 20 are arranged near the clamp 122. In a plan view, the clamp 122 is arranged between the first contact portion 10 and the second contact portion 20. The positions of the first contact portion 10 and the second contact portion 20 are not particularly limited.

[0025] FIG. 3 is a diagram showing a schematic view of the first contact portion 10. As shown in FIG.

[0026] As shown in FIG. 3, the first contact portion 10 includes a height adjustment screw 11, a first actuator 12, a base 13, a first seesaw member 14, an elastic member 15, a first conductive pin 16, an insulating member 17, and an elastic member 18.

[0027] The first actuator 12 moves the first conductive pin 16. The first actuator 12 is a linear actuator that extends and retracts a rod 12a. The first actuator 12 is, for example, a device that converts the rotational motion of a motor into linear motion. The first actuator 12 may be a piezoelectric actuator powered by a piezoelectric element. The first actuator 12 is not particularly limited as long as it is an actuator that can operate in a vacuum. The first actuator 12 may be placed outside a sample chamber maintained in a vacuum state, and the first actuator 12 and the first seesaw member 14 may be connected via a link mechanism. This allows the first actuator 12 to move the first seesaw member 14 without placing the first actuator 12 in a vacuum.

[0028] The first actuator 12 moves the second end 14b of the first seesaw member 14 in the up and down direction by extending and retracting the rod 12a. The first actuator 12 moves the second end 14b via a height adjustment screw 11. The height adjustment screw 11 allows adjustment of the relationship between the height of the rod 12a of the first actuator 12 and the height of the first conductive pin 16.

[0029] The base 13 is placed on a stage 120. By placing the first seesaw member 14 on the base 13, the heights of the first conductive pin 16 and the material 2 can be aligned.

[0030] The first seesaw member 14 is disposed on the base 13. The first seesaw member 14 has a first end 14a and a second end 14b. The first seesaw member 14 has a fulcrum O between the first end 14a and the second end 14b. The first seesaw member 14 is configured to be capable of seesaw motion. When the first actuator 12 moves the second end 14b, the first seesaw member 14 rotates (seesaws) around the fulcrum O as the axis of rotation. This causes the first conductive pin 16 connected to the first end 14a to move. A bearing, for example, is used for the fulcrum O.

[0031] Elastic member 15 connects first end 14a of first seesaw member 14 and first conduction pin 16. Elastic member 15 is, for example, a leaf spring. Insulating member 17 is provided at first end 14a of first seesaw member 14, and elastic member 15 is connected to insulating member 17. This allows first conduction pin 16 and elastic member 15 to be electrically insulated from first seesaw member 14. Note that there are no particular limitations on the location where insulating member 17 is provided, as long as first conduction pin 16 can be connected to a reference potential.

[0032] The first conduction pin 16 connects the material 2 to a reference potential. The first conduction pin 16 is connected to the first end 14a of the first seesaw member 14. In the illustrated example, the first conduction pin 16 is connected to the first end 14a via the elastic member 15. The first conduction pin 16 is connected to the reference potential. The material of the first conduction pin 16 is, for example, diamond.

[0033] The elastic member 18 is connected between the first end 14a of the first seesaw member 14 and the fulcrum O. One end of the elastic member 18 is fixed to the base 13, and the other end of the elastic member 18 is fixed to the first seesaw member 14. The elastic member 18 is a compression spring. Therefore, a force pushing up the first end 14a of the first seesaw member 14 is applied by the elastic member 18. Note that the elastic member 18 is not particularly limited as long as it is an elastic body that generates a force similar to that of a compression spring, and may be a leaf spring or the like.

[0034] 4 is a diagram schematically showing the first contact portion 10 and the second contact portion 20. Note that Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 2.

[0035] 4, the second contact portion 20 includes a height adjustment screw 21, a second actuator 22, a base 23, a second seesaw member 24, an elastic member 25, a second conduction pin 26, an insulating member 27, and an elastic member 28. The configuration of the second contact portion 20 is similar to that of the first contact portion 10 described above. That is, the second seesaw member 24 has a first end 24a and a second end 24b, and has a fulcrum O between the first end 24a and the second end 24b. In addition, the second conduction pin 26 is connected to the first end 24a, and when the second actuator 22 moves the second end 24b, the second seesaw member 24 rotates and the second conduction pin 26 moves.

[0036] Although the above description has been given of the case where the imaging device 100 has two contact portions, the number of contact portions is not particularly limited.

[0037] 1.2. Operation 5, 6, and 7 are diagrams for explaining the operation of the first contact portion 10. FIG.

[0038] 5, when the first actuator 12 retracts the rod 12a, the first end 14a of the first seesaw member 14 can be positioned above the second end 14b due to the elastic force of the elastic member 18. This prevents the first conductive pin 16 from contacting the material 2.

[0039] When the first actuator 12 extends the rod 12a from the state shown in Fig. 5, the first seesaw member 14 rotates clockwise, and the first end 14a of the first seesaw member 14 can be moved below the second end 14b, as shown in Fig. 6. This causes the first conduction pin 16 to move downward, and the first conduction pin 16 can be brought into contact with the material 2.

[0040] Here, the load of the first conduction pin 16, i.e., the force with which the first conduction pin 16 is pressed against the material 2, changes depending on the height of the first conduction pin 16. Specifically, the lower the height of the first conduction pin 16, the greater the force with which the first conduction pin 16 is pressed against the material 2. Therefore, by controlling the height of the first conduction pin 16 with the first actuator 12, the force with which the first conduction pin 16 is pressed against the material 2 can be controlled.

[0041] When the first actuator 12 further extends the rod 12a from the state shown in Fig. 6, the first seesaw member 14 further rotates clockwise as shown in Fig. 7. This increases the force pressing the first conductive pin 16 against the material 2 compared to the case shown in Fig. 6. As a result, the first conductive pin 16 breaks through the resist 2c, and the first conductive pin 16 comes into contact with the conductive layer 2b.

[0042] The material 2 includes, for example, a substrate 2a, a conductive layer 2b formed on the substrate 2a, and a resist 2c provided on the conductive layer 2b. The first conductive pin 16 penetrates the insulating resist 2c and is electrically connected to the conductive layer 2b. The first conductive pin 16 is connected to a reference potential. Therefore, by bringing the first conductive pin 16 into contact with the conductive layer 2b, the conductive layer 2b can be connected to the reference potential.

[0043] 6, when the first actuator 12 retracts the rod 12a, the first seesaw member 14 rotates counterclockwise due to the elastic force of the elastic member 18, and the first end 14a of the first seesaw member 14 can be moved above the second end 14b, as shown in FIG. 5. This causes the first conduction pin 16 to move upward, and the first conduction pin 16 can be separated from the material 2.

[0044] In this way, the height of the first conductive pin 16 can be changed by the first actuator 12, and by changing the height of the first conductive pin 16, it is possible to control the force with which the first conductive pin 16 is pressed against the material 2. Furthermore, by changing the height of the first conductive pin 16, it is possible to retract the first conductive pin 16 to a position where it does not come into contact with the material 2 supported by the stage 120.

[0045] In the above, with the material 2 fixed to the stage 120, the first actuator 12 moves the first conduction pin 16 to bring the first conduction pin 16 into contact with the conductive layer 2b. Alternatively, before the material 2 is fixed to the stage 120, the height of the first conduction pin 16 may be adjusted to a height at which the first conduction pin 16 comes into contact with the conductive layer 2b, as shown in FIG. 7 . In this way, by fixing the material 2 to the stage 120, the first conduction pin 16 can be brought into contact with the conductive layer 2b.

[0046] The operation of the second contact portion 20 is the same as that of the first contact portion 10 described above, and therefore a description thereof will be omitted.

[0047] 1.3. Elastic Members 8 is a diagram for explaining the function of the elastic member 15. FIG. 8 shows the movement of the elastic member 15 when the first conductive pin 16 comes into contact with the material 2.

[0048] 8A shows the first seesaw member 14 in a horizontal state. When the first seesaw member 14 is horizontal, the first conductive pin 16 is in contact with the surface of the material 2. The first seesaw member 14 rotates around point O1, which is the position of the fulcrum O of the first seesaw member 14.

[0049] Figure 8(B) shows the movement of the elastic member 15 when there is no material 2, and Figure 8(C) shows the movement of the elastic member 15 when the first conductive pin 16 comes into contact with the material 2. In Figure 8(B) and Figure 8(C), the first seesaw member 14 is tilted by the same angle.

[0050] When the first seesaw member 14 is rotated clockwise from the horizontal state shown in Fig. 8(A), the position of the tip of the first conductive pin 16 moves downward and in the first direction A, as shown in Fig. 8(B). The first direction A is a direction perpendicular to the up-down direction.

[0051] When the first conduction pin 16 comes into contact with the material 2, if the first seesaw member 14 is rotated clockwise from the horizontal state shown in Fig. 8(A), the first conduction pin 16 comes into contact with the material 2 and the elastic member 15 is elastically deformed to bend at point O2 as a bending point, as shown in Fig. 8(C). The bending of the elastic member 15 tilts the first conduction pin 16, and the position of the tip of the first conduction pin 16 moves in the second direction B.

[0052] On the surface of the material 2, first direction A, which is the direction in which the tip of first conduction pin 16 moves due to the rotation of first seesaw member 14, and second direction B, which is the direction in which first conduction pin 16 moves due to the elastic deformation of elastic member 15, are opposite to each other. This makes it possible to reduce the horizontal movement amount of the tip of first conduction pin 16 on the surface of material 2. This therefore makes it possible to reduce scratches on the surface of material 2 formed by first conduction pin 16 coming into contact with material 2, thereby reducing the generation of waste.

[0053] Furthermore, by adjusting the relationship between the positions of points O1 and O2 and the position of the tip of first conduction pin 16, it is possible to make the amount of movement of the tip of first conduction pin 16 due to the rotation of first seesaw member 14 equal to the amount of movement of first conduction pin 16 due to the elastic deformation of elastic member 15. As a result, on the surface of material 2, the movement of the tip of first conduction pin 16 due to the rotation of first seesaw member 14 can be canceled out by the movement of first conduction pin 16 due to the elastic deformation of elastic member 15. Therefore, the amount of horizontal movement of first conduction pin 16 on the surface of material 2 can be made extremely small. Therefore, scratches on the surface of material 2 formed by the first conduction pin 16 coming into contact with material 2 can be made smaller, and dust can be further reduced.

[0054] 8A, it is desirable that the first conduction pin 16 contact the material 2 when the first seesaw member 14 is in a horizontal state. When the first seesaw member 14 is rotated by an angle θ while the first seesaw member 14 is in a horizontal state, the horizontal movement of the position of the tip of the first conduction pin 16 is smaller than when the first seesaw member 14 is rotated by an angle θ while the inclination of the first seesaw member 14 is large. Therefore, by having the first conduction pin 16 contact the material 2 while the first seesaw member 14 is in a horizontal state, scratches on the surface of the material 2 formed by the first conduction pin 16 contacting the material 2 can be made smaller than when the first conduction pin 16 contacts the material 2 while the inclination of the first seesaw member 14 is large.

[0055] The function of the elastic member 15 shown in FIG. 3 has been described above, but the function of the elastic member 25 shown in FIG. 4 is similar, and therefore the description thereof will be omitted.

[0056] Effects The imaging apparatus 100 includes a stage 120 that supports the material 2, a first conduction pin 16 for connecting the material 2 to a reference potential, and a first actuator 12 that moves the first conduction pin 16. Therefore, in the imaging apparatus 100, the first conduction pin 16 can be moved by the first actuator 12. Here, the force that presses the first conduction pin 16 against the material 2 increases as the height of the first conduction pin 16 decreases. Therefore, in the imaging apparatus 100, the force that presses the first conduction pin 16 against the material 2 can be varied.

[0057] For example, when the resist 2c of the material 2 is thick, the force with which the first conduction pin 16 is pressed against the material 2 can be increased to ensure that the first conduction pin 16 is in contact with the conductive layer 2b. When the resist 2c of the material 2 is thin, the force with which the first conduction pin 16 is pressed against the material 2 can be decreased to ensure that the first conduction pin 16 is in contact with the conductive layer 2b, while reducing the generation of dust.

[0058] In the imaging apparatus 100, the first actuator 12 moves the first conduction pin 16 between a position where the material 2 supported by the stage 120 contacts the first conduction pin 16 and a position where the material 2 supported by the stage 120 does not contact the first conduction pin 16. Therefore, in the imaging apparatus 100, when the material 2 is not connected to the reference potential, the first conduction pin 16 can be placed at a position where the first conduction pin 16 does not contact the material 2. This reduces the generation of dust.

[0059] In the imaging device 100, a first conduction pin 16 is connected to a first end 14a of the first seesaw member 14, and when the first actuator 12 moves a second end 14b of the first seesaw member 14, the first seesaw member 14 rotates and moves the first conduction pin 16. Therefore, in the imaging device 100, the linear motion of the first actuator 12 can be converted into rotational motion to move the first conduction pin 16.

[0060] The imaging device 100 includes an elastic member 15 that connects the first end 14a and the first conductive pin 16, and when the first actuator 12 rotates the first seesaw member 14 and the first conductive pin 16 comes into contact with the material 2, the elastic member 15 is bent by elastic deformation. Therefore, in the imaging device 100, scratches on the surface of the material 2 that are formed when the first conductive pin 16 comes into contact with the material 2 can be made smaller, and the generation of dust can be reduced.

[0061] 1.5. Variations 1.5.1. First variant FIG. 9 is a diagram schematically showing a modified example of the first contact portion 10. In FIG.

[0062] In the first contact portion 10 shown in FIG. 3 described above, the elastic member 18 is connected between the first end 14a of the first seesaw member 14 and the fulcrum O. However, as shown in FIG. 9, the elastic member 18 may be connected between the second end 14b of the first seesaw member 14 and the fulcrum O. One end of the elastic member 18 is fixed to the base 13, and the other end of the elastic member 18 is fixed to the first seesaw member 14. The elastic member 18 is a tension spring. Therefore, a force pressing down the second end 14b of the first seesaw member 14 is applied by the elastic member 18.

[0063] The elastic member 18 is not particularly limited as long as it is an elastic body that generates a force similar to that of a tension spring, and may be a leaf spring or the like.

[0064] The operation of the first contact portion 10 shown in FIG. 9 is similar to the operation of the first contact portion 10 shown in FIGS. 5, 6, and 7 described above, and therefore a description thereof will be omitted.

[0065] Although not shown, the second contact portion 20 may also have the same configuration as the first contact portion 10 shown in FIG.

[0066] 1.5.2. Second Variant FIG. 10 is a diagram schematically showing a modified example of the first contact portion 10 and the second contact portion 20. In FIG.

[0067] As shown in FIG. 10 , the first seesaw member 14 and the second seesaw member 24 may be moved by a single actuator. That is, the first actuator 12 may also serve as the second actuator 22. For example, the imaging device 100 includes a connecting portion that connects the first seesaw member 14 and the second seesaw member 24. By moving the connecting portion with a single actuator, the first seesaw member 14 and the second seesaw member 24 can be caused to rotate. In this way, the first contact portion 10 and the second contact portion 20 may share the same actuator.

[0068] In the imaging device 100 according to the second modification, the first seesaw member 14 and the second seesaw member 24 are rotated by one actuator, so that the number of parts can be reduced.

[0069] FIG. 11 is a diagram schematically showing a modified example of the first contact portion 10 and the second contact portion 20. In FIG.

[0070] As shown in Fig. 11, a plurality of pairs of the first contact portion 10 and the second contact portion 20 that share the actuator may be provided. In the example shown in Fig. 11, two pairs of the first contact portion 10 and the second contact portion 20 that share the actuator are provided.

[0071] 2. Second embodiment 2.1. Drawing device Next, a drawing device according to a second embodiment will be described with reference to the drawings. Fig. 12 is a diagram showing the configuration of a drawing device 200 according to the second embodiment. In the drawing device 200 according to the second embodiment, components having the same functions as those of the drawing device 100 according to the first embodiment will be given the same reference numerals, and detailed description thereof will be omitted.

[0072] As shown in FIG. 12, the imaging device 200 differs from the imaging device 100 shown in FIG. 4 in that it includes a control unit 210 that controls the first actuator 12 and the second actuator 22.

[0073] The control unit 210 controls the first actuator 12 and the second actuator 22. The control unit 210 includes, for example, a processor such as a CPU (Central Processing Unit) and a storage device (memory) such as a RAM (Random Access Memory) and a ROM (Read Only Memory). The storage device stores programs and data for performing various controls. The functions of the control unit 210 can be realized by the processor executing the programs. The control unit 210 may be realized, for example, by a general-purpose circuit such as a microcontroller or microprocessor that operates according to a program, or by a dedicated circuit such as an ASIC (Application Specific Integrated Circuit).

[0074] 2.2. Control section processing The control unit 210 controls the first actuator 12 and the second actuator 22 based on the information on the material 2. Fig. 13 is a flowchart showing an example of processing by the control unit 210 to connect the material 2 to the reference potential.

[0075] The control unit 210 receives information on the material 2 (S100).

[0076] The information on material 2 is, for example, information on the film thickness of resist 2c. The information on material 2 may also include, for example, information on the material of resist 2c. If material 2 has multiple layers, the information on material 2 may also include information on the layer structure of material 2.

[0077] For example, the user inputs information about ingredient 2 by operating a GUI (Graphical User Interface) or an input device such as a keyboard, mouse, button, or touch panel. The control unit 210 accepts the information about ingredient 2 input by the user.

[0078] The control unit 210 sets the movement amount of the first actuator 12 and the movement amount of the second actuator 22 based on the information on the material 2 (S102).

[0079] A table or relational expression associating the film thickness of the resist 2c with the movement amount of the actuator is stored in advance in the storage unit of the control unit 210. The control unit 210 obtains the movement amount of the actuator corresponding to the film thickness of the resist 2c from the table or relational expression stored in the storage unit.

[0080] Furthermore, a table or relational expression associating the material (hardness) of the resist 2c with the movement amount of the actuator is stored in advance in the storage unit of the control unit 210. The control unit 210 obtains the movement amount of the actuator corresponding to the material of the resist 2c from the table or relational expression stored in the storage unit.

[0081] For example, if the resist 2c is made of a hard material, the amount of movement of the actuator is set so that the force pressing the first conduction pin 16 against the material 2 is large. On the other hand, if the resist 2c is made of a soft material, the amount of movement of the actuator is set so that the force pressing the first conduction pin 16 against the material 2 is small. The force pressing the first conduction pin 16 against the material 2 increases as the height of the conduction pin decreases.

[0082] When the operation amount set based on the film thickness and the operation amount set based on the material differ, the control unit 210 adopts the larger operation amount.

[0083] The control unit 210 operates the first actuator 12 and the second actuator 22 by the set operation amount (S104). As a result, the first actuator 12 operates by the set operation amount. Similarly, the second actuator 22 operates by the set operation amount. This allows the first conduction pin 16 and the second conduction pin 26 to be pressed against the material 2 with an appropriate force. As a result, the first conduction pin 16 and the second conduction pin 26 come into contact with the conductive layer 2b, and the material 2 can be connected to the reference potential.

[0084] After operating the first actuator 12 and the second actuator 22, the control unit 210 ends the process.

[0085] In the above, we have described a case where the control unit 210 operates the first actuator 12 and the second actuator 22 based on information about the material 2, but the control unit 210 may also control the first actuator 12 and the second actuator 22 based on information about the force pressing the first conductive pin 16 against the material 2.

[0086] For example, the user inputs information about the force required to break through the resist 2c. The force required to break through the resist 2c corresponds to the force with which the conductive pin is pressed against the material. A table or relational expression indicating the relationship between the force with which the conductive pin is pressed against the material and the height of the conductive pin is stored in advance in the memory unit of the control unit 210. The control unit 210 determines the amount of actuator movement corresponding to the input force from the table or relational expression stored in the memory unit. The control unit 210 operates the first actuator 12 and the second actuator 22 by the determined amount of movement. This allows the first conductive pin 16 and the second conductive pin 26 to be pressed against the material 2 with the desired force.

[0087] Effects The drawing apparatus 200 includes a control unit 210 that controls the first actuator 12. The control unit 210 controls the first actuator 12 based on information about the material 2. Therefore, in the drawing apparatus 200, the first conductive pin 16 can be pressed against the material 2 with an appropriate force according to the film thickness and material of the resist 2c. Therefore, in the drawing apparatus 200, the material 2 can be reliably connected to the reference potential and the generation of dust can be reduced.

[0088] In the drawing apparatus 200, the information on the material 2 is information on the film thickness of the material 2. For example, the information on the film thickness of the material 2 is information on the film thickness of the resist 2c. Therefore, in the drawing apparatus 200, the first actuator 12 can be operated according to the film thickness of the resist 2c, and the first conductive pin 16 can be pressed against the material 2 with an appropriate force according to the film thickness of the resist 2c.

[0089] 3. Third embodiment 3.1. Drawing device Next, a drawing device according to a third embodiment will be described with reference to the drawings. Fig. 14 is a diagram showing the configuration of a drawing device 300 according to the third embodiment. In the drawing device 300 according to the third embodiment, components having the same functions as those of the drawing device 100 according to the first embodiment and the drawing device 200 according to the second embodiment will be denoted by the same reference numerals, and detailed description thereof will be omitted.

[0090] The imaging device 300 includes a resistance measurement circuit 310 as shown in FIG.

[0091] The resistance measurement circuit 310 measures the resistance between the first conduction pin 16 and the second conduction pin 26. The resistance measurement circuit 310 is switchable between a state in which the resistance between the first conduction pin 16 and the second conduction pin 26 can be measured and a state in which the first conduction pin 16 and the second conduction pin 26 are connected to a reference potential. The resistance measurement circuit 310 outputs the measurement result of the resistance between the first conduction pin 16 and the second conduction pin 26.

[0092] 3.2. Control section processing The control unit 210 controls the first actuator 12 and the second actuator 22 based on the resistance value between the first conduction pin 16 and the second conduction pin 26. Fig. 15 is a flowchart showing an example of a process performed by the control unit 210 to connect the material 2 to the reference potential.

[0093] When the control unit 210 is instructed to start the process of connecting the material 2 to the reference potential, it operates the first actuator 12 and the second actuator 22 by a preset initial operation amount (S200). This causes the first conduction pin 16 and the second conduction pin 26 to contact the material 2.

[0094] Next, the control unit 210 acquires information on the resistance value between the first conduction pin 16 and the second conduction pin 26 from the resistance measurement circuit 310 (S202).

[0095] The resistance measurement circuit 310 is in a state where it can measure the resistance value between the first conduction pin 16 and the second conduction pin 26. The resistance measurement circuit 310 outputs information about the resistance value. The information about the resistance value is sent to the control unit 210.

[0096] The control unit 210 determines whether the resistance value between the first conduction pin 16 and the second conduction pin 26 is equal to or less than a threshold value (S204).

[0097] The threshold value is the resistance value when the first conduction pin 16 and the second conduction pin 26 are in secure contact with the conductive layer 2b. This makes it possible to determine whether the first conduction pin 16 and the second conduction pin 26 are in secure contact with the conductive layer 2b from the resistance value between the first conduction pin 16 and the second conduction pin 26.

[0098] When the control unit 210 determines that the resistance value is not equal to or less than the threshold value (No in S204), that is, when the control unit 210 determines that the resistance value is greater than the threshold value, it operates the first actuator 12 and the second actuator 22 (S206). Specifically, the control unit 210 operates the first actuator 12 and the second actuator 22 by a preset operating amount. As a result, the height of the first conductive pin 16 is lowered by the operating amount of the first actuator 12, and the force pressing the first conductive pin 16 against the material 2 is increased. Similarly, the height of the second conductive pin 26 is lowered by the operating amount of the second actuator 22, and the force pressing the second conductive pin 26 against the material 2 is increased.

[0099] After operating the first actuator 12 and the second actuator 22 (after step S206), the control unit 210 returns to step S202 and acquires information on the resistance value between the first conduction pin 16 and the second conduction pin 26 from the resistance measurement circuit 310 (S202). The control unit 210 determines whether the resistance value between the first conduction pin 16 and the second conduction pin 26 is equal to or less than a threshold value (S204), and if it determines that the resistance value is not equal to or less than the threshold value (No in S204), it operates the first actuator 12 and the second actuator 22 (S206).

[0100] In this way, the control unit 210 repeats the process S202 of acquiring resistance value information, the process S204 of determining whether the resistance value is below a threshold value, and the process S206 of operating the first actuator 12 and the second actuator 22 until it is determined that the resistance value is below the threshold value.

[0101] When the control unit 210 determines that the resistance value is equal to or less than the threshold value (Yes in S206), the control unit 210 connects the first conduction pin 16 and the second conduction pin 26 to the reference potential (S208).

[0102] The control unit 210 switches the resistance measurement circuit 310 from a state in which the resistance value between the first conduction pin 16 and the second conduction pin 26 can be measured to a state in which the first conduction pin 16 and the second conduction pin 26 are connected to the reference potential. This allows the material 2 to be connected to the reference potential. Because the resistance value between the first conduction pin 16 and the second conduction pin 26 is below the threshold, the material 2 is reliably connected to the reference potential. After connecting the first conduction pin 16 and the second conduction pin 26 to the reference potential, the control unit 210 ends the process.

[0103] Effects In the imaging device 300, the control unit 210 controls the first actuator 12 and the second actuator 22 based on the resistance value between the first conduction pin 16 and the second conduction pin 26. Therefore, in the imaging device 300, the material 2 can be reliably connected to the reference potential. Furthermore, since the force with which the first conduction pin 16 and the second conduction pin 26 are pressed against the material 2 can be gradually increased, the generation of dust can be reduced.

[0104] In the imaging device 300, the control unit 210 repeats the process of determining whether the resistance value between the first conduction pin 16 and the second conduction pin 26 is equal to or less than a threshold value, and if it determines that the resistance value is not equal to or less than the threshold value, operating the first actuator 12 and the second actuator 22, until it determines that the resistance value is equal to or less than the threshold value. Therefore, in the imaging device 300, the material 2 can be reliably connected to the reference potential and the generation of dust can be reduced.

[0105] 4. Fourth embodiment 4.1. Drawing device Next, a drawing device according to a fourth embodiment will be described with reference to the drawings. Fig. 16 is a diagram showing the configuration of a drawing device 400 according to the fourth embodiment. Hereinafter, in the drawing device 400 according to the fourth embodiment, components having the same functions as those of the drawing device 100 according to the first embodiment, the drawing device 200 according to the second embodiment, and the drawing device 300 according to the third embodiment will be given the same reference numerals, and detailed description thereof will be omitted.

[0106] The drawing device 400 includes a third contact portion 30 as shown in FIG.

[0107] Fig. 17 is a diagram schematically showing the first contact portion 10 and the second contact portion 20. Fig. 18 is a diagram schematically showing the second contact portion 20 and the third contact portion 30. Fig. 19 is a diagram schematically showing the third contact portion 30 and the first contact portion 10.

[0108] 18 , the third contact portion 30 includes a height adjustment screw 31, a third actuator 32, a base 33, a third seesaw member 34, an elastic member 35, a third conduction pin 36, an insulating member 37, and an elastic member 38. The configuration of the third contact portion 30 is similar to the configurations of the first contact portion 10 and the second contact portion 20 described above. That is, the third seesaw member 34 has a first end portion 34a and a second end portion 34b, and has a fulcrum O between the first end portion 34a and the second end portion 34b. The third conduction pin 36 is connected to the first end portion 34a, and when the third actuator 32 moves the second end portion 34b, the third seesaw member 34 rotates and the third conduction pin 36 moves.

[0109] The resistance measurement circuit 310 can measure the resistance between the first conduction pin 16 and the second conduction pin 26, the resistance between the second conduction pin 26 and the third conduction pin 36, and the resistance between the third conduction pin 36 and the first conduction pin 16.

[0110] From the resistance value between the first conductive pin 16 and the second conductive pin 26, the resistance value between the second conductive pin 26 and the third conductive pin 36, and the resistance value between the third conductive pin 36 and the first conductive pin 16, it is possible to identify which of the first conductive pin 16, the second conductive pin 26, and the third conductive pin 36 is not in contact with the conductive layer 2b.

[0111] For example, when the first conductive pin 16 is not in contact with the conductive layer 2b, and the second conductive pin 26 and the third conductive pin 36 are in contact with the conductive layer 2b, the resistance value between the first conductive pin 16 and the second conductive pin 26 and the resistance value between the third conductive pin 36 and the first conductive pin 16 will be greater than the resistance value between the second conductive pin 26 and the third conductive pin 36.

[0112] The resistance measurement circuit 310 is configured to be switchable between a state in which the resistance value between the first conduction pin 16 and the second conduction pin 26, the resistance value between the second conduction pin 26 and the third conduction pin 36, and the resistance value between the third conduction pin 36 and the first conduction pin 16 can be measured, and a state in which the first conduction pin 16, the second conduction pin 26, and the third conduction pin 36 are connected to a reference potential.

[0113] 4.2. Control section processing The control unit 210 controls the first actuator 12, the second actuator 22, and the third actuator 32 based on the resistance value between the first conduction pin 16 and the second conduction pin 26, the resistance value between the second conduction pin 26 and the third conduction pin 36, and the resistance value between the third conduction pin 36 and the first conduction pin 16. Fig. 20 is a flowchart showing an example of a process performed by the control unit 210 to connect the material 2 to the reference potential.

[0114] When the control unit 210 is instructed to start the process of connecting the material 2 to the reference potential, it operates the first actuator 12, the second actuator 22, and the third actuator 32 by a preset initial operation amount (S300). This causes the first conduction pin 16, the second conduction pin 26, and the third conduction pin 36 to come into contact with the material 2.

[0115] Next, the control unit 210 acquires information on the first resistance value between the first conduction pin 16 and the second conduction pin 26, the second resistance value between the second conduction pin 26 and the third conduction pin 36, and the third resistance value between the third conduction pin 36 and the first conduction pin 16 from the resistance measurement circuit 310 (S302).

[0116] Next, the control unit 210 determines whether the first resistance value, the second resistance value, and the third resistance value are equal to or less than a threshold value (S304). The threshold value is the resistance value when the two conductive pins are in secure contact with the conductive layer 2b.

[0117] If the control unit 210 determines that the first resistance value, the second resistance value, and the third resistance value are not all equal to or less than the threshold value (No in S304), it identifies the actuator to be operated based on the first resistance value, the second resistance value, and the third resistance value (S306).

[0118] For example, the control unit 210 determines whether each of the first resistance value, the second resistance value, and the third resistance value is equal to or less than a threshold value, and identifies the actuator to be operated. For example, if the first resistance value, the second resistance value, and the third resistance value are all greater than the threshold value, the control unit 210 operates the first actuator 12, the second actuator 22, and the third actuator 32. For example, if the first resistance value is equal to or less than the threshold value and the second resistance value and the third resistance value are greater than the threshold value, the control unit 210 operates the third actuator 32. In this way, the control unit 210 identifies the actuator to be operated.

[0119] Next, the control unit 210 operates the identified actuator (S308). For example, if the identified actuator is the third actuator 32, the control unit 210 operates the third actuator 32 by a preset operating amount. As a result, the height of the third conductive pin 36 is lowered by the operating amount of the third actuator 32, and the force pressing the third conductive pin 36 against the material 2 is increased.

[0120] After operating the identified actuator (after S308), the control unit 210 returns to process S302 and acquires information on the first resistance value, the second resistance value, and the third resistance value from the resistance measurement circuit 310 (S302). The control unit 210 determines whether the first resistance value, the second resistance value, and the third resistance value are equal to or less than a threshold value (S304), and if it determines that all of the resistance values ​​are not equal to or less than the threshold value (No in S304), it identifies the actuator to be operated (S306) and operates the identified actuator (S308).

[0121] In this way, the control unit 210 repeats the steps of process S302 of acquiring information on the first resistance value, second resistance value, and third resistance value, process S304 of determining whether all resistance values ​​are below the threshold value, process S306 of identifying the actuator to be operated, and process S308 of operating the identified actuator, until it is determined that all resistance values ​​are below the threshold value.

[0122] If the control unit 210 determines that all resistance values ​​are equal to or less than the threshold value (Yes in S304), it connects the first conduction pin 16, the second conduction pin 26, and the third conduction pin 36 to the reference potential (S310). After connecting the first conduction pin 16, the second conduction pin 26, and the third conduction pin 36 to the reference potential, the control unit 210 ends the process.

[0123] 20, step S304 is performed to determine whether all resistance values ​​are equal to or less than a threshold value, but step S304 may instead determine whether at least one of the first resistance value, the second resistance value, and the third resistance value is equal to or less than a threshold value, thereby allowing at least one conductive pin to contact the conductive layer 2b.

[0124] Furthermore, although the above description has been given of the case where the drawing device 400 has three contact parts, the drawing device 400 may have three or more contact parts.

[0125] Effects The imaging device 400 includes a resistance measurement circuit 310 that measures the resistance between the first conduction pin 16 and the second conduction pin 26, the resistance between the second conduction pin 26 and the third conduction pin 36, and the resistance between the third conduction pin 36 and the first conduction pin 16, and a control unit 210 that controls the first actuator 12, the second actuator 22, and the third actuator 32. The control unit 210 also controls the first actuator 12, the second actuator 22, and the third actuator 32 based on the resistance between the first conduction pin 16 and the second conduction pin 26, the resistance between the second conduction pin 26 and the third conduction pin 36, and the resistance between the third conduction pin 36 and the first conduction pin 16.

[0126] In this way, the drawing apparatus 400 has three conductive pins, and therefore can more reliably connect the material 2 to the reference potential than, for example, a case in which only two conductive pins are used. Also, since the drawing apparatus 400 has three conductive pins, it is possible to identify conductive pins that are not in contact with the conductive layer 2b. Furthermore, similar to the drawing apparatus 300, the drawing apparatus 400 can reliably connect the material 2 to the reference potential and reduce the generation of dust.

[0127] 5. Fifth embodiment Next, a drawing apparatus according to a fifth embodiment will be described with reference to the drawings. Fig. 21 is a diagram schematically showing a first contact portion 10 of the drawing apparatus according to the fifth embodiment. Hereinafter, in the drawing apparatus according to the fifth embodiment, components having the same functions as those of the drawing apparatus 100 according to the first embodiment will be given the same reference numerals, and detailed description thereof will be omitted.

[0128] In the first contact unit 10 shown in Fig. 3, the first actuator 12 moves linearly to rotate the first seesaw member 14, thereby moving the first conductive pin 16. In contrast, in the first contact unit 10 of the imaging device according to the fifth embodiment shown in Fig. 21, the linear motion of the first actuator 12 is not converted into rotational motion, but the first conductive pin 16 is moved directly.

[0129] As shown in FIG. 21, the first contact portion 10 includes a first actuator 12, a base 13, a support member 140, an elastic member 15, a first conductive pin 16, and an insulating member 17.

[0130] The support member 140 supports the first conduction pin 16. The support member 140 is a rod-shaped member extending horizontally. The support member 140 connects the first actuator 12 and the first conduction pin 16. The first conduction pin 16 is connected to a first end 140a of the support member 140 via an elastic member 15. The rod 12a is connected to a second end 140b of the support member 140. The second end 140b and the rod 12a are fixed together.

[0131] 22 and 23 are diagrams for explaining the operation of the first contact portion 10. FIG.

[0132] As shown in FIG. 22, when the first actuator 12 extends the rod 12a, the support member 140 moves upward, and the first conduction pin 16 moves upward. By moving the first conduction pin 16 upward, the first conduction pin 16 can be put out of contact with the material 2. Also, as shown in FIG. 23, when the first actuator 12 is retracted, the support member 140 moves downward, and the first conduction pin 16 moves downward. By moving the first conduction pin 16 downward, the first conduction pin 16 can be pressed against the material 2.

[0133] The drawing device according to the fifth embodiment can also achieve the same effects as the drawing device 100 according to the first embodiment described above.

[0134] The above-described embodiment and modifications are merely examples, and the present invention is not limited to these. For example, the embodiments and modifications can be combined as appropriate.

[0135] The present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the present invention includes configurations that are substantially identical to the configurations described in the embodiments. A substantially identical configuration means, for example, a configuration with the same function, method, and result, or a configuration with the same purpose and effect. The present invention also includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. The present invention also includes configurations that achieve the same effects or purposes as the configurations described in the embodiments. The present invention also includes configurations in which publicly known technology is added to the configurations described in the embodiments. [Explanation of symbols]

[0136] 2...material, 2a...substrate, 2b...conductive layer, 2c...resist, 10...first contact portion, 11...height adjustment screw, 12...first actuator, 12a...rod, 13...base, 14...first seesaw member, 14a...first end, 14b...second end, 15...elastic member, 16...first conductive pin, 17...insulating member, 18...elastic member, 20...second contact portion, 21...height adjustment screw, 22...second actuator, 23...base, 24...second seesaw member, 24a...first end, 24b...second end, 25...elastic member, 26...second conductive pin, 27...insulating member, 28...elastic member, 30...third contact portion, 31...height adjustment screw, 32...third actuator, 33... Base, 34...third seesaw member, 34a...first end, 34b...second end, 35...elastic member, 36...third conductive pin, 37...insulating member, 38...elastic member, 100...drawing device, 110...electron optical system, 111...electron gun, 112...blanker, 113...illumination lens, 114a...first slit, 114b...second slit, 115...shaping deflector, 116...shaping lens, 117...reduction lens, 118...objective lens, 119...positioning deflector, 120...stage, 122...clamp, 140...support member, 140a...first end, 140b...second end, 200...drawing device, 210...control unit, 300...drawing device, 310...resistance measurement circuit, 400...drawing device,

Claims

1. A drawing apparatus that draws a pattern on a material by irradiating the material with a charged particle beam, a stage for supporting the material; a first conductive pin for connecting the material to a reference potential; a first actuator that moves the first conductive pin; 1. A drawing device comprising:

2. In claim 1, a control unit that controls the first actuator; The control unit controls the first actuator based on the information about the material.

3. In claim 2, The information about the material is information about the film thickness of the material.

4. In claim 1, a second conductive pin for connecting the material to a reference potential; a second actuator that moves the second conductive pin; a resistance measurement circuit that measures a resistance value between the first conduction pin and the second conduction pin; a control unit that controls the first actuator and the second actuator; Including, The control unit controls the first actuator and the second actuator based on the resistance value.

5. In claim 4, The control unit a process of determining whether the resistance value is equal to or less than a threshold value; a process of operating the first actuator and the second actuator when it is determined that the resistance value is not equal to or less than the threshold value; and repeating the steps until the resistance value is determined to be equal to or less than the threshold value.

6. In claim 1, a second conductive pin for connecting the material to a reference potential; a second actuator that moves the second conductive pin; a third conductive pin for connecting the material to a reference potential; a third actuator that moves the third conductive pin; a resistance measurement circuit that measures a resistance value between the first conduction pin and the second conduction pin, a resistance value between the second conduction pin and the third conduction pin, and a resistance value between the third conduction pin and the first conduction pin; a control unit that controls the first actuator, the second actuator, and the third actuator; Including, the control unit controls the first actuator, the second actuator, and the third actuator based on a resistance value between the first conductive pin and the second conductive pin, a resistance value between the second conductive pin and the third conductive pin, and a resistance value between the third conductive pin and the first conductive pin.

7. In claim 1, the first actuator moves the first conductive pin between a position where the material supported by the stage comes into contact with the first conductive pin and a position where the material supported by the stage does not come into contact with the first conductive pin.

8. In any one of claims 1 to 7, a seesaw member having a first end and a second end, the seesaw member having a fulcrum between the first end and the second end; the first end is connected to the first conductive pin, The drawing apparatus, wherein the first actuator moves the second end, causing the seesaw member to rotate and moving the first conductive pin.

9. In claim 8, an elastic member connecting the first end and the first conductive pin; When the first actuator rotates the seesaw member and the first conductive pin comes into contact with the material, the elastic member is bent by elastic deformation.

Images