Tape sticking apparatus and tape sticking method

Abstract

To provide a novel configuration of a tape sticking device for sticking a plate-like object to a tape.SOLUTION: According to an aspect of the present invention, there is provided a tape attaching apparatus for forming a frame unit in which a plate-shaped object is placed inside an opening of a ring frame and a tape is attached to the ring frame and the plate-shaped object, the tape attaching apparatus including at least a holding unit capable of placing the ring frame and the plate-shaped object thereon and an attaching unit for attaching the tape to the ring frame and the plate-shaped object. Preferably, the tape attaching apparatus further includes a first accommodating section for accommodating the first plate-shaped member, a first transfer unit for transferring the first plate-shaped member from the first accommodating section to the holding unit, a second accommodating section for accommodating the second plate-shaped member, and a second transfer unit for transferring the second plate-shaped member from the second accommodating section to the holding unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a tape application device and a tape application method for applying tape to a workpiece. [Background technology]

[0002] Silicon wafers, which have multiple IC, LSI, and other devices formed on their surface, have their backsides ground to a specified thickness, and then are separated into individual devices using a cutting machine for use in electrical equipment such as mobile phones and personal computers.

[0003] In a cutting device that divides a wafer, which is the workpiece, into individual devices, a frame unit is formed by integrating the wafer and a metal ring frame by attaching them to adhesive tape, and the frame unit is stored in a specified cassette and transported.The frame unit is then removed from the cassette as appropriate and cutting processing is performed (see, for example, Patent Document 1).

[0004] Also, a tape application device for automatically forming a frame unit is known (see, for example, Patent Document 2).

[0005] On the other hand, for cutting work, various cutting blades are used, such as electroformed blades made of diamond abrasive grains and the like solidified with nickel plating, resin blades made of diamond abrasive grains and the like solidified with a binder such as a resin bond or metal bond, and the blades are selected and used appropriately depending on the characteristics of the workpiece.

[0006] Here, after the cutting blade is attached to the cutting device, a so-called dressing process is carried out in which a dresser board is used to cut the cutting blade into the dresser board in order to make the cutting blade perfectly round and to protrude (sharpen) the abrasive grains before actual processing (see, for example, Patent Document 3). [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 10-242083 [Patent Document 2] Japanese Patent Publication No. 2022-15202 [Patent Document 3] Japanese Patent Application Publication No. 2023-25889 Summary of the Invention [Problem to be solved by the invention]

[0008] As disclosed in Patent Document 3, similar to the frame unit described above, the dresser board is attached to adhesive tape exposed in the opening of the annular ring frame, and is held in the ring frame and handled.

[0009] However, the task of attaching the dresser board to the adhesive tape is performed manually by an operator, and there has been a demand for automation of this process.

[0010] Furthermore, when the work is done manually by an operator, there is variation in the position where the dresser board is attached, resulting in unused areas on the dresser board that are not cut, which can cause problems such as the dresser board not being used to its full potential.

[0011] It has also been considered to construct a dedicated device for attaching the dresser board, but this would increase manufacturing costs and require installation space.

[0012] SUMMARY OF THE INVENTION In view of the above problems, the present invention proposes a new configuration for a tape application device for applying tape to a plate-like object. [Means for solving the problem]

[0013] The problem to be solved by the present invention is as described above, and the means for solving this problem will now be described.

[0014] According to one aspect of the present invention, a tape application device is provided that places a plate-shaped object inside the opening of a ring frame and applies tape to the ring frame and the plate-shaped object to form an integrated frame unit, and that includes at least a holding unit on which the ring frame and the plate-shaped object can be placed, and an application unit that applies tape to the ring frame and the plate-shaped object, and the holding unit is configured to be able to selectively place at least two or more types of plate-shaped objects, including different types of first and second plate-shaped objects, at the position of the opening of the ring frame, and the tape application device is also provided with a first storage section that stores the first plate-shaped object, a first transport unit that transports the first plate-shaped object from the first storage section to the holding unit, a second storage section that stores the second plate-shaped object, and a second transport unit that transports the second plate-shaped object from the second storage section to the holding unit.

[0015] According to one aspect of the present invention, the second plate-like object is a dresser board used for dressing a processing tool.

[0016] According to one aspect of the present invention, the first plate-like object is a workpiece to be machined by the machining tool.

[0017] Furthermore, according to one aspect of the present invention, the holding unit is provided with at least a first area for holding the first plate-like object and a second area for holding the second plate-like object.

[0018] According to one aspect of the present invention, there is provided a tape application method comprising a frame placement step of placing a ring frame on a holding unit, a plate-like object placement step of selectively placing one of a first plate-like object and a second plate-like object of different types in the opening of the ring frame, and an application step of applying tape to the ring frame placed on the holding unit and the first plate-like object or the second plate-like object, wherein the holding unit is provided with at least a first area for holding the first plate-like object and a second area for holding the second plate-like object. [Effects of the Invention]

[0019] The present invention provides the following effects. That is, according to one aspect of the present invention, a single device can selectively apply tape to two different types of plate-like objects.

[0020] According to another aspect of the present invention, a dresser unit can be formed by automatically applying tape to a dresser board.

[0021] According to one aspect of the present invention, when the dresser board is transported to the holding unit, the dresser board can be placed in a specified position, the dresser board is positioned relative to the ring frame, and variations in the attachment position of the dresser board can be reduced. Furthermore, the formation of unused areas where no cuts are made in the dresser board can be prevented, and the dresser board can be used effectively. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view schematically showing a tape application device. [Figure 2] FIG. 2 is a perspective view schematically showing a frame unit. [Figure 3] 3A and 3B are diagrams illustrating the configurations of a holding unit and a tape application unit. [Figure 4] FIG. 2 is a perspective view schematically showing a movement mechanism. [Figure 5] FIG. 10 is a perspective view schematically showing how a ring frame and a wafer are placed on a holding unit. [Figure 6] 10A and 10B are cross-sectional views schematically showing how adhesive tape is adhered to a ring frame and a wafer. [Figure 7] FIG. 2 is a perspective view schematically showing a dresser board unit. [Figure 8] FIG. 10 is a perspective view schematically showing a state in which the ring frame and the dresser board are placed on the holding unit. [Figure 9] 10A and 10B are cross-sectional views schematically showing how adhesive tape is attached to a ring frame and a dresser board. DETAILED DESCRIPTION OF THE INVENTION

[0023] An embodiment of the present invention will be described with reference to the accompanying drawings. The tape application device 1 according to this embodiment shown in Fig. 1 is a device that applies tape 5 to a plate-like object (wafer 10) that will be processed by a processing device such as a cutting device or a laser processing device, and to a ring frame 3 having an opening large enough to accommodate the plate-like object, thereby forming a frame unit 11. Each movable part included in the tape application device 1 is automatically controlled by a control unit 2, and is configured to be able to continuously form the frame unit 11 and the dresser unit 80.

[0024] 2 is a schematic diagram of a frame unit 11, in which a wafer 10 and a ring frame 3 are integrated with a tape 5. The wafer 10 is a wafer formed from a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. Alternatively, the wafer 10 is a substantially circular plate-like object made of a material such as sapphire, glass, or quartz. The glass may be, for example, alkali glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, or quartz glass.

[0025] A grid-like dividing line is set on the surface 10a of the wafer 10, and a plurality of devices 9 such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in the areas defined by the dividing lines. The wafer 10 is divided along the grid-like dividing lines by a processing device such as a cutting device or a laser processing device, thereby forming individual device chips.

[0026] The tape 5 is configured by providing an adhesive layer (glue layer) on one side of a flexible film-like base layer, for example.

[0027] The adhesive layers are formed of ultraviolet-curable silicone rubber, acrylic material, epoxy material, etc. The exposed surface of this adhesive layer becomes the adhesive surface 5a, which is attached to the back surface 10b of the wafer 10. By attaching the tape 5 to the wafer 10, it is possible to mitigate impacts on the wafer 10 during processing, transportation, etc., and reduce damage to the wafer 10.

[0028] A ring frame 3 made of a metal such as aluminum or stainless steel is attached to the tape 5. The ring frame 3 has an opening 3c with a diameter larger than that of the wafer 10, and has a flat front surface 3a and a flat back surface 3b. As will be described in detail later, a frame unit 11 is formed by attaching the tape 5 to the back surface 10b of the wafer 10 and the back surface 3b of the ring frame 3 with the wafer 10 positioned approximately in the center of the opening 3c of the ring frame 3.

[0029] 1, the tape application device 1 includes a base 4 that supports each of the components. At the front end of the base 4, cassette mounting stages 6a, 6b, and 6c are arranged side by side along the Y-axis direction. For example, the wafer 10 is carried into the tape application device 1 while being accommodated in a cassette 8a placed on the cassette mounting stage 6a, and the ring frame 3 is carried into the tape application device 1 while being accommodated in a cassette 8b placed on the cassette mounting stage 6b.

[0030] A frame unit 11 formed by the tape application device 1 is housed in a cassette 8c placed on a cassette mounting table 6c. When the cassette 8c is removed, the frame units 11 formed by the tape application device 1 are carried out from the tape application device 1. In Fig. 1, the items housed in the cassettes 8a, 8b, 8c are indicated by dashed lines, and the combinations of the cassette mounting tables 6a, 6b, 6c and the cassettes 8a, 8b, 8c form first to third housing sections for housing the items.

[0031] An opening 4a that is long in the Y-axis direction is formed in the base 4 at a position adjacent to the cassette mounting stages 6a, 6b, and 6c. A frame transport unit 12f that transports the ring frame 3 and the frame unit 11, and a first transport unit 12a that transports the wafer 10 are disposed in the opening 4a so as to be movable along the Y-axis direction.

[0032] The frame transport unit 12f includes a moving support part 14f that is movable along the Y-axis direction, an arm part 16f having one end rotatably fixed to the moving support part 14f, and a support part 18f provided at the other end of the arm part 16f. The frame transport unit 12f is an articulated robot that can extend, retract, and rotate the arm part 16f to move the support part 18f.

[0033] The frame transport unit 12f supports the ring frame 3 housed in the cassette 8b placed on the cassette mounting table 6b with the support portion 18f, and carries the ring frame 3 out of the cassette 8b and places it on the holding unit 24 described below. The frame transport unit 12f also supports the formed frame unit 11 placed on the holding unit 24 with the support portion 18f, and transports it to the cassette 8c placed on the cassette mounting table 6c.

[0034] The first transfer unit 12a includes a moving support part 14a that is movable along the Y-axis direction, an arm part 16a rotatably fixed at one end to the moving support part 14a, and a support part 18a provided at the other end of the arm part 16a. The first transfer unit 12a is an articulated robot that can extend, retract, and rotate the arm part 16a to move the support part 18a. The first transfer unit 12a supports the wafers 10 stored in a cassette 8a placed on the cassette mounting table 6a with the support part 18a, and then transfers the wafers 10 from the cassette 8a and places them on a holding unit 24 (described later).

[0035] A moving unit 20 that moves the holding unit 24 along the X-axis direction perpendicular to the Y-axis direction, and the holding unit 24 supported by the moving unit 20 are provided at a position adjacent to the opening 4a of the base 4. The moving unit 20 has a pair of guide rails 22a that extend along the X-axis direction. The holding unit 24 is supported by the guide rails 22a so as to be movable along the X-axis direction.

[0036] The moving unit 20 includes a ball screw 22b parallel to the guide rail 22a and a pulse motor 22c connected to one end of the ball screw 22b. The holding unit 24 moves along the X-axis direction as the pulse motor 22c rotates the ball screw 22b.

[0037] The moving unit 20 moves the holding unit 24 between a front loading / unloading area where the cassettes are placed and a rear tape application area on the opposite side. In the loading / unloading area, the wafers 10 and the ring frame 3 are loaded into the holding unit 24, and the frame unit 11 is unloaded. In the tape application area, the tape 5 is applied by an application unit 44, which will be described later.

[0038] On the rear side of the base 4, beside the moving unit 20, there are provided a stocker 84 capable of accommodating a plurality of dresser boards 82, and a second transport unit 12b for transporting the dresser boards 82 to the holding unit 24. In this embodiment, the dresser board 82 is a second plate-like object, and the stocker 84 functions as a second storage section.

[0039] The second conveying unit 12b is configured to have an arm portion 16b that is rotatable and movable up and down relative to the base 4 by a motor not shown, and a support portion 18b that is provided at the tip of the arm portion 16b, and is configured to pick up the dresser boards 82 stored in the stocker 84 one by one and place them on the holding unit 24.

[0040] FIG. 3 is a perspective view schematically showing the holding unit 24 and the tape applying unit 44 that have moved to the tape applying area.

[0041] The holding unit 24 has a plate-shaped frame holding part 26 that holds the ring frame 3, and a plate-shaped object holding part 30 that holds the wafer 10. The plate-shaped object holding part 30 is disposed at the center of the frame holding part 26.

[0042] The frame holding portion 26 includes a first fixing portion 36 that protrudes from an upper surface 26a of the frame holding portion 26 and restricts movement of the ring frame 3 in a first direction (e.g., the X-axis direction) parallel to the upper surface 26a. The first fixing portion 36 is formed, for example, in an elongated shape along a second direction (e.g., the Y-axis direction) perpendicular to the first direction, and restricts movement of the ring frame 3 that hits it from the first direction.

[0043] The frame holding part 26 includes a first movable part 34 that protrudes from the upper surface 26a of the frame holding part 26, faces the first fixed part 36, and moves back and forth in the first direction to sandwich the ring frame 3 between itself and the first fixed part 36. The first movable part 34 is provided at a position facing the first fixed part 36 with the plate-like object holding part 30 in between, and includes, for example, two pins 32 protruding from the upper surface 26a of the frame holding part 26.

[0044] Two holes shaped along the first direction are formed in the upper surface 26a of the frame holding part 26, and each pin 32 protrudes upward from this hole. The holding unit 24 includes therein a movement mechanism 72 (FIG. 4) that moves the pin 32 along the hole.

[0045] 4, the movement mechanism 72 includes a support portion 58 along the second direction that supports the two pins 32 below the upper surface 26a of the frame holding portion 26, and a moving body 60 connected to one end of the support portion 58. The movement mechanism 72 also includes an air cylinder 66 that includes a piston rod 64 whose tip is connected to the moving body 60 and a cylinder tube 62 that houses the base end side of the piston rod 64. The air cylinder 66 moves the piston rod 64, the moving body 60, and the support portion 58 along the first direction, and the pins 32 advance and retreat along the first direction.

[0046] 3, the frame holding part 26 is provided with a second fixing part 42 that restricts movement of the ring frame 3 in a second direction (for example, the Y-axis direction). The second fixing part 42 can be configured in the same manner as the first fixing part 41 described above.

[0047] The frame holding part 26 also includes a second movable part 40 that protrudes from the upper surface 26a of the frame holding part 26, faces the second fixed part 42, and has two pins 38 that move forward and backward in the second direction to sandwich the ring frame 3 between the second fixed part 42 and the second movable part 40. The second movable part 40 can be configured in the same manner as the first movable part 34 described above.

[0048] When adjusting the position of the ring frame 3 placed on the upper surface 26a of the frame holding part 26, first, the two pins 32 of the first movable part 34 are moved in a first direction so as to abut against the side surfaces of the ring frame 3, and the ring frame 3 is sandwiched between the first fixed part 36 and the first movable part 34. Next, the two pins 38 of the second movable part 40 are moved in a second direction so as to abut against the side surfaces of the ring frame 3, and the ring frame 3 is sandwiched between the second fixed part 42 and the second movable part 40. At this time, the ring frame 3 is moved by the first movable part 34 and the second movable part 40.

[0049] In this manner, in the frame holding portion 26, the ring frame 3 can be positioned at a predetermined position suitable for adhering the tape 5.

[0050] As shown in Fig. 5, the wafer 10 and ring frame 3 are placed on the holding unit 24. In the example of Fig. 5, the back surface 3b of the ring frame 3 and the back surface 10b of the wafer 10 are each directed upward (toward the adhesive tape), the front surface 3a of the ring frame 3 is placed on the upper surface 26a of the frame holding part 26, and the front surface 10a of the wafer 10 is placed on the plate-like object holding part 30. Note that the ring frame 3 and the wafer 10 may be placed upside down.

[0051] Then, as shown in FIG. 6, the tape 5 is adhered to the ring frame 3 and the wafer 10 by the adhering unit 44.

[0052] 6, the application unit 44 includes a tape supply roller 46 on which a plurality of tapes 5 attached to a release sheet 7 are wound and stored, and a take-up roller 56 that winds up and collects the release sheet 7 from which the tapes 5 have been peeled off. The tapes 5 are supported so as to be attached to the release sheet 7 in a state cut into a predetermined shape that closes the opening 3c of the ring frame 3. Here, the diameter of the tape 5 is larger than the opening 3c of the ring frame 3 and smaller than the outer diameter of the ring frame 3.

[0053] The bonding unit 44 further includes a guide roller 48 that guides the release sheet 7 drawn out from the tape supply roller 46, and a peeling section 52 that folds the release sheet 7 guided by the guide roller 48 and peels it off from the tape 5. The bonding unit 44 also includes a guide roller 54 that guides the release sheet 7 peeled off from the tape 5 by the peeling section 52.

[0054] The bonding unit 44 further includes a pressure roller 50 that can be raised and lowered above the holding unit 24 and presses the tape 5 peeled from the release sheet 7 in the peeling section 52 from above to bond the tape 5 to the object. Here, the pressure roller 50 presses the tape 5 by raising and lowering the bonding unit 44. Alternatively, the holding unit 24 may be raised and lowered, and the pressure roller 50 may press the tape 5 from above as the holding unit 24 is raised.

[0055] The application unit 44 includes a take-up roller 56 that takes up and collects the release sheet 7 from which the tape 5 has been peeled. The application unit 44 rotates the tape supply roller 46, the guide rollers 48 and 54, and the take-up roller 56 in conjunction with one another, and provides the tape 5 to the object while transferring the release sheet 7 from the tape supply roller 46 to the take-up roller 56.

[0056] In the above configuration, the procedure for adhering the tape 5 to the ring frame 3 and the wafer 10 will be described. As shown in Figures 4 to 6, first, the moving unit 20 is operated to position the ring frame 3 and the holding unit 24 on which the wafer 10 is placed in the tape application area, and the end of the ring frame 3 is positioned below the pressure roller 50 of the application unit 44.

[0057] Next, the application unit 44 is lowered to a predetermined height, and the take-up roller 56 and the like are rotated, causing the release sheet 7 to be peeled off from the tape 5 at the peeling section 52. Thereafter, the tape 5 is adhered to the ring frame 3 with the exposed adhesive surface 5a of the tape 5 facing the back surface 3b of the ring frame 3. Furthermore, while the pressure roller 50 presses the portion of the tape 5 adhered to the ring frame 3 from above, the holding unit 24 is moved by the moving unit 20 to the front side of the tape application device 1 (rear side in the direction of travel).

[0058] Then, from one end of the ring frame 3 to the other, the adhesive surface 5a of the tape 5 successively comes into contact with the back surface 3b of the ring frame 3, and the tape 5 is successively pressed by the pressure roller 50, so that the tape 5 is gradually adhered to the ring frame 3. At this time, when the back surface 10b of the wafer 10 comes under the pressure roller 50, the tape 5 is also adhered to the back surface 10b of the wafer 10.

[0059] To prevent wrinkles or the like from forming on the tape 5, the moving speed of each part of the release sheet 7 moving from the tape supply roller 46 to the take-up roller 56 is made to match the moving speed of the holding unit 24 moved by the moving unit 20. Then, when the pressing roller 50 reaches the other end of the ring frame 3, the attachment of the tape 5 to the ring frame 3 and the wafer 10 is completed.

[0060] When the tape 5 is stuck to the ring frame 3 and the wafer 10 while being pressed by the pressure roller 50, no air bubbles get in between the tape 5 and the ring frame 3 and the wafer 10, and no wrinkles are generated in the tape 5.

[0061] It should be noted that the release sheet 7 does not have to be used in the adhering unit 44. For example, a long strip of tape 5 is wound around the tape supply roller 46, and after being adhered to the ring frame 3 and the wafer 10, the tape is cut all around between the inner and outer peripheral edges of the ring frame 3. In this case, the adhering unit 44 is provided with a cutter that can cut the tape 5 on the back surface 3b of the ring frame 3.

[0062] After the wafer 10, ring frame 3, and tape 5 are integrated to form the frame unit 11, the moving unit 20 is operated to move the holding unit 24 to the loading / unloading area. Then, the frame transport unit 12f transports the frame unit 11 from the holding unit 24 to the cassette 8c placed on the cassette mounting table 6c.

[0063] In the same manner as in the case of forming the frame unit described above, a dresser unit 80 to be used during dressing is formed as shown in FIG.

[0064] Specifically, as shown in Figure 8, the ring frame 3 is placed on the holding unit 24 sent to the loading / unloading area by the frame transport unit 12f (Figure 1), and the dresser board 82 is placed on the holding unit 24 sent to the tape application area by the second transport unit 12b (Figure 1), so that the dresser board 82 is positioned within the opening 3c of the ring frame 3.

[0065] Here, at least a first region R1 for holding the wafer 10 (FIG. 5) as the first plate-like object and a second region R2 for holding the dresser board 82 as the second plate-like object are set in the plate-like object holding portion 30 of the holding unit 24. In this embodiment, the second region R2 is configured to be disposed inside the first region R1.

[0066] As a result, when the second transport unit 12b (FIG. 1) transports the dresser board 82 to the holding unit 24, the dresser board 82 can be placed in a specified position, the dresser board 82 is positioned relative to the ring frame 3, and variations in the attachment position of the dresser board can be reduced. Furthermore, it is possible to prevent the formation of unused areas in the dresser board 82 where no cuts are made, and it is possible to use the dresser board 82 effectively.

[0067] The second region R2 may be configured, for example, as a rectangular recess for shallowly fitting the rectangular dresser board 82 into the horizontal surface of the plate-like object holder 30, or may be configured as a line displayed on the horizontal surface of the plate-like object holder 30. In the example of Fig. 8, the first region R1 and the second region R2 are displayed by dotted lines, and the first region R1 is displayed according to the outline of the wafer 10 (Fig. 5). The first region R1 may also be configured as a circular recess for shallowly fitting the wafer 10 (Fig. 5).

[0068] Then, as shown in Figure 9, as in the case of the frame unit described above, the tape 5 is adhered to the ring frame 3 and the dresser board 82 while being pressed by the pressure roller 50, thereby forming a dresser unit 80 (Figure 7) that integrates the tape 5, the ring frame 3, and the dresser board 82.

[0069] The dresser board 82 is a plate-shaped member manufactured by kneading, for example, green carborundum (GC) abrasive grains made of silicon carbide (SiC) or white alundum (WA) abrasive grains made of aluminum oxide (Al2O3) with a binder made of resin and then firing the mixture, and is used to dress cutting blades, which are processing tools that form cutting grooves in wafers, and grinding wheels, which are processing tools that grind the back surface of wafers.

[0070] In this manner, the tape adhering device shown in FIG. 1 can realize a configuration in which the wafer 10 and the dresser board 82 can be selectively adhered to the tape. That is, the tape application device 1 is configured to place a plate-like object inside the opening 3c of the ring frame 3 and apply tape 5 to the ring frame 3 and the plate-like object to form an integrated frame unit 11, and includes at least a holding unit 24 on which the ring frame 3 and the plate-like object can be placed, and an application unit 44 that applies tape 5 to the ring frame 3 and the plate-like object (wafer 10 or dresser board 82). The holding unit 24 is configured to place a wafer 10 as a first plate-like object of a different type at the position of the opening 3a of the ring frame 3. The tape application device 1 is configured to be able to selectively place at least two or more types of plate-like objects including a cassette 8a serving as a first storage section for storing the first plate-like object, a first transport unit 12a for transporting the wafer 10 from the cassette 8a to the holding unit 24, a stocker 84 serving as a second storage section for storing the second plate-like object, and a second transport unit 12b for transporting the dresser board 82 from the stocker 84 to the holding unit 24.

[0071] The tape application device 1 having the above configuration can carry out the following method. That is, in the configuration of Figure 1, this is a tape application method having a frame placement step of placing the ring frame 3 on the holding unit 24, a plate-like object placement step of selectively placing one of different types of plate-like object, a first plate-like object (wafer 10) or a second plate-like object (dresser board 82), in the opening 3a of the ring frame 3, and an application step of applying tape 5 to the ring frame 3 placed on the holding unit 24 and the plate-like object, and as shown in Figures 5 and 8, the holding unit 24 is provided with at least a first region R1 for holding the first plate-like object and a second region R2 for holding the second plate-like object.

[0072] More specifically, the frame placing step is a step in which the ring frame 3 is placed on the holding unit 24 by the frame transport unit 12f.

[0073] The plate-like object placing step is a step of placing the wafer 10 on the holding unit 24 by the first transfer unit 12a, or a step of placing the dresser board 82 on the holding unit 24 by the second transfer unit 12b.

[0074] The adhering step is a step of adhering the tape 5 to the ring frame 3 placed on the holding unit 24 and the wafer 10 or the dresser board 82.

[0075] 1, tape can be applied to two different types of plate-like objects, namely, the wafer 10 and the dresser board 82. For example, when forming a frame unit 11 in the tape application device 1, the operation of supplying the wafer 10 from the cassette 8a to the holding unit 24 and storing the frame unit 11 formed by applying tape into the cassette 8c is repeated in sequence, and a plurality of frame units 11 are continuously formed.

[0076] On the other hand, when forming the dresser unit 80, the dresser board 82 is supplied from the stocker 84 to the holding unit 24, and after tape is attached, it is stored in the cassette 8c. The formation of the dresser unit 80 may be carried out continuously so that a plurality of dresser units 80 are formed, or may be carried out in a single operation so that only one dresser unit is formed. Also, the dresser unit 80 may be stored in a separate dedicated cassette instead of being stored in the cassette 8c for the frame unit.

[0077] In the above embodiment, an example of attaching the wafer 10 to the dresser board 82 has been described, but for example, different types of wafers may be stored in the stocker 84 (FIG. 1) instead of the dresser board 82, and two types of frame units may be formed by attaching tape to two different types of wafers. Furthermore, the number of stockers 84 (FIG. 1) and second transport units 12b (FIG. 1) may be increased to enable attachment of tape to a greater variety of plate-like objects. [Explanation of symbols]

[0078] 1 Tape application device 2. Control Unit 3 ring frame 3a surface 3a opening 3b back side 3c opening 5 adhesive tape 5a Adhesive side 6a Cassette stand 7 Peel-off sheet 8a cassette 10 wafers 10a surface 10b back side 11 Frame Unit 12a First transport unit 12b Second transport unit 12f Frame transport unit 24 holding unit 26 Frame holder 26a Top side 30 Plate-shaped object holding part 44 Adhesion unit 80 Dresser Unit 82 Dresser Board 84 Stocker R1 1st area R2 2nd area

Claims

1. A tape application device that places a plate-like object inside an opening of a ring frame and applies tape to the ring frame and the plate-like object to form an integrated frame unit, a holding unit on which the ring frame and the plate-like object can be placed; an adhering unit that adheres tape to the ring frame and the plate-like object; At least the holding unit is configured to be able to selectively place at least two or more types of plate-like objects, including a first plate-like object and a second plate-like object, which are different types, at the position of the opening of the ring frame; The tape application device comprises: a first storage section that stores the first plate-like object; a first conveying unit that conveys the first plate-like object from the first storage section to the holding unit; a second storage section that stores the second plate-like object; a second conveying unit that conveys the second plate-like object from the second storage section to the holding unit; A tape application device comprising:

2. The second plate-shaped object is a dresser board used for dressing a processing tool.

2. The tape application device according to claim 1.

3. The first plate-like object is a workpiece to be processed by the processing tool.

3. The tape application device according to claim 2.

4. The holding unit is provided with at least a first area for holding the first plate-like object and a second area for holding the second plate-like object.

4. The tape application device according to claim 1, wherein the tape application device is a tape application device.

5. a frame placing step of placing the ring frame on the holding unit; a plate-like object placing step of selectively placing one of a first plate-like object and a second plate-like object of different types in the opening of the ring frame; a sticking step of sticking tape to the ring frame placed on the holding unit and the first plate-like object or the second plate-like object; A tape application method comprising: In the tape applying method, the holding unit is provided with at least a first area for holding the first plate-like object and a second area for holding the second plate-like object.

6. The second plate-shaped object is a dresser board used for dressing a processing tool.

6. The tape application method according to claim 5.

7. The first plate-like object is a workpiece to be processed by the processing tool.

7. The tape application method according to claim 6.

Images