Disc-shaped substrate manufacturing apparatus and disc-shaped substrate manufacturing method

Abstract

To provide a manufacturing device of a disk-like substrate and a manufacturing method of the disk-like substrate, capable of restraining reduction in processing accuracy of the disk-like substrate.SOLUTION: A disk-shaped substrate manufacturing apparatus includes a lower surface plate on which a disk-shaped substrate is placed, an upper surface plate that rotates with the disk-shaped substrate interposed between the lower surface plate and the upper surface plate and polishes or grinds the disk-shaped substrate, a shaft portion that is provided above the upper surface plate and extends in a vertical direction, a flange that protrudes in a radial direction at a lower portion of the shaft portion and in which a plurality of through-holes penetrating in the vertical direction are arranged in the radial direction, and a fastening member that fastens the flange to the upper surface plate through the through-holes and is replaceable with the plurality of through-holes.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method. [Background technology]

[0002] Known disk-shaped substrate manufacturing devices include a lower surface plate and an upper surface plate, as disclosed in Patent Documents 1 and 2. In the manufacturing devices disclosed in Patent Documents 1 and 2, a shaft extending in the vertical direction is provided above the upper surface plate. A flange extending in the radial direction is provided at the lower end of this shaft. A number of pulleys are attached to each of the flange and upper surface plate. A single wire is stretched across the pulleys. The shape of the upper surface plate is corrected by adjusting the tension of the wire. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-216492 [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-150507 Summary of the Invention [Problem to be solved by the invention]

[0004] In the manufacturing devices disclosed in Patent Documents 1 and 2, the upper surface plate is suspended from the flange by wires, supports, etc., so the weight of the upper surface plate can cause deformation of the flange itself. If the flange is deformed, the shape of the upper surface plate cannot be corrected with high precision. As a result, a discrepancy occurs in the flatness between the lower surface of the upper surface plate and the upper surface of the lower surface plate, reducing the processing accuracy of the disk-shaped substrate.

[0005] Therefore, an object of the present disclosure is to provide a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method that can suppress a decrease in the processing accuracy of the disk-shaped substrate. [Means for solving the problem]

[0006] The present disclosure includes the following aspects. <1> a lower surface plate on which a disk-shaped substrate is placed; an upper surface plate that rotates with the disk-shaped substrate sandwiched between it and the lower surface plate and that polishes or grinds the disk-shaped substrate; a shaft portion provided above the upper surface plate and extending in the vertical direction; a flange extending radially from a lower portion of the shaft portion, the flange having a plurality of through holes extending vertically and arranged radially; a fastening member that fastens the flange to the upper surface plate through the through hole and is replaceable in the plurality of through holes; An apparatus for manufacturing a disk-shaped substrate comprising: <2> The plurality of through holes are arranged in the circumferential direction of the flange. <1> The disk-shaped substrate manufacturing apparatus according to claim 1. <3> a first step in which an upper surface plate rotates with a disk-shaped substrate sandwiched between it and a lower surface plate to polish or grind the disk-shaped substrate; a second step of changing the fastening position of the fastening member depending on the flatness of the lower surface of the upper surface plate; Equipped with The fastening member fastens the flange to the upper surface plate through the through hole, The flange is a flange that protrudes in a radial direction from a lower portion of the shaft portion, and a plurality of the through holes that penetrate in a vertical direction are arranged in the radial direction, The shaft portion is provided above the upper surface plate and extends in the vertical direction. A method for manufacturing a disk-shaped substrate. [Effects of the Invention]

[0007] According to the present disclosure, there are provided a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method that can suppress a decrease in the processing accuracy of the disk-shaped substrate. [Brief explanation of the drawings]

[0008] [Figure 1]FIG. 1 is a perspective view illustrating a manufacturing apparatus according to an embodiment of the present disclosure. [Figure 2] FIG. 1 is a side cross-sectional view showing a manufacturing apparatus according to an embodiment of the present disclosure. [Figure 3] FIG. 2 is a plan view illustrating an upper platen and a flange according to an embodiment of the present disclosure. [Figure 4] FIG. 1 is a flow diagram of a manufacturing method according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components are not essential unless otherwise specified. When embodiments are described with reference to the drawings in this disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of components in each drawing are conceptual. Therefore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component, and the front-to-back, left-to-right, and top-to-bottom dimensional ratios between components, are not limited to the illustrated dimensional ratios. Furthermore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component may differ from the actual dimensional ratios. Furthermore, unless otherwise specified in this disclosure, the number of each component element of this disclosure is not limited to one, and may be present in plural. Note that in the following description of the drawings, similar parts are denoted by similar reference numerals.

[0010] <Manufacturing equipment 10> The manufacturing apparatus 10 according to this embodiment will be described with reference to the drawings. Note that the manufacturing apparatus for the disk-shaped substrate of the present disclosure is not limited to the manufacturing apparatus 10. As an example, the manufacturing apparatus 10 is an apparatus that polishes a disk-shaped substrate 100 to manufacture a disk-shaped substrate 200. The disk-shaped substrate 200 is a processed disk-shaped substrate obtained by performing a polishing process on the disk-shaped substrate 100.

[0011] As shown in Figures 1 and 2, the manufacturing apparatus 10 includes a lower surface plate 12, an upper surface plate 20, a shaft portion 28, a flange 29, a fastening member 34, a sun gear 40, an internal gear 42, and a carrier 44. The following describes the disk-shaped substrate 100, each part of the manufacturing apparatus 10, modified examples of the manufacturing apparatus 10, a manufacturing method for the disk-shaped substrate 200, and modified examples of the manufacturing method.

[0012] <Disc-shaped substrate 100> The disk-shaped substrate 100 is a substrate formed in a disk shape. Specifically, the disk-shaped substrate 100 is formed in an annular shape having holes in a plan view. Note that the plan view here refers to the case where the disk-shaped substrate 100 is viewed from one side in the thickness direction of the disk-shaped substrate 100. The disk-shaped substrate 100 is a substrate before a polishing process is performed.

[0013] The disk-shaped substrate 100 may be, for example, a substrate for a magnetic recording medium. Furthermore, the disk-shaped substrate 100 may be a substrate made of a metal material such as aluminum or an aluminum alloy substrate, or glass. Hereinafter, aluminum substrates, aluminum alloy substrates, glass substrates, etc. will also be collectively referred to as "substrates." Hereinafter, aluminum substrates and aluminum alloy substrates will also be collectively referred to as "aluminum substrates." A plating layer may be formed on the surface of the aluminum substrate. The use, material, type, shape, etc. of the disk-shaped substrate 100 are not limited to those described above, and various disk-shaped substrates can be used as the disk-shaped substrate 100.

[0014] <Lower surface plate 12> As shown in Figures 1 and 2, the lower surface plate 12 is a disk-shaped member. The lower surface plate 12 has a circular, horizontal upper surface. A polishing cloth 14 is disposed on the upper surface of the lower surface plate 12. A disk-shaped substrate 100 is placed on this polishing cloth 14. The lower surface plate 12 is supported by a support portion (not shown) so as to be rotatable about a vertical axis VA. The lower surface plate 12 receives a rotational force from a drive portion 16 and rotates.

[0015] <Upper surface plate 20, shaft portion 28, flange 29, and fastening member 34> As shown in Figures 1 and 2, the upper surface plate 20 is a disk-shaped member. The upper surface plate 20 has a circular, horizontal lower surface. A polishing cloth 24 is disposed on the lower surface of the upper surface plate 20. The position of the polishing cloth 24 disposed on the upper surface plate 20 is opposite the position of the polishing cloth 14 disposed on the lower surface plate 12. The shaft portion 28 is provided above the upper surface plate 20 and extends vertically along the vertical axis VA. The flange 29 protrudes radially from a lower portion of the shaft portion 28. The flange 29 is formed in a disk shape. The outer diameter of the flange 29 is, for example, 50% or more and less than 100% of the outer diameter of the upper surface plate 20. The flange 29 and the shaft portion are connected by a connecting portion 27. The connecting portion 27 is configured by, for example, a universal joint that allows the angle of the flange 29 relative to the shaft portion to be changed.

[0016] A plurality of through holes 32 that penetrate in the up-down direction are formed in the flange 29. The plurality of through holes 32 are arranged in the radial direction of the flange 29, as shown in Figures 1, 2, and 3. Hereinafter, the plurality of through holes 32 arranged in the radial direction of the flange 29 will be referred to as a hole group 33. In this embodiment, the hole group 33 is composed of three through holes 32 arranged in a row in the radial direction of the flange 29. A plurality of hole groups 33 are arranged in the circumferential direction of the flange 29. In this embodiment, four sets of hole groups 33 are arranged at equal angular intervals in the circumferential direction of the flange 29. In other words, the hole groups 33 are arranged at 90-degree intervals in the circumferential direction of the flange 29.

[0017] The fastening members 34 fasten the flange 29 to the upper surface plate 20 through the through holes 32. In this embodiment, the fastening members 34 inserted into the through holes 32 fasten the upper surface plate 20 and the flange 29 together in a state where the lower surface of the flange 29 is in contact with the upper surface of the upper surface plate 20. In this way, the positions where the through holes 32 are arranged are the fastening positions by the fastening members 34. Nuts 35 forming internal threads are provided at positions corresponding to the through holes 32 in the upper surface plate 20. The fastening members 34 are screwed onto the nuts 35. The fastening member 34 can be replaced with any of the through holes 32 in the hole group 33. In the example shown in Figures 1 and 2, the fastening member 34 fastens the flange 29 to the upper surface plate 20 at the innermost through hole 32 in the hole group 33. The fastening member 34 can be replaced with any of the through holes 32 on the outer periphery.

[0018] The upper surface plate 20 is supported by the support portion 22 via a flange 29 and a shaft portion 28 so as to be rotatable about a vertical axis VA. The upper surface plate 20 rotates by receiving a rotational force from the drive portion 26. In this embodiment, the upper surface plate 20 rotates with the disk-shaped substrate 100 sandwiched between it and the lower surface plate 12, and polishes the disk-shaped substrate 100. The support portion 22 is supported by the elevator portion 23 so that the upper surface plate 20 can be raised and lowered along the vertical axis VA. The support portion 22 and the upper surface plate 20 are raised and lowered by driving the elevator portion 23. The upper surface plate 20 approaches and moves away from the lower surface plate 12 by being raised and lowered.

[0019] <Sun gear 40, internal gear 42, and carrier 44> 1 and 2, the sun gear 40 is provided at the center of the lower surface plate 12. The sun gear 40 rotates about a vertical axis VA by being driven by a drive unit 41. The sun gear 40 may be a spur gear, a pin gear, or the like, with a row of teeth integrally formed on the side surface.

[0020] The internal gear 42 is disposed concentrically with the sun gear 40. The internal gear 42 has an annular cylindrical body 49. Internal teeth are formed on the inner peripheral surface of the cylindrical body 49. The internal gear 42 in this embodiment is held non-rotatably by a holding member (not shown). Alternatively, a drive unit that rotates the internal gear 42 may be provided, and the internal gear 42 may be rotated about the vertical axis VA. When the internal gear 42 is rotated, the sun gear 40 may be held non-rotatably. Furthermore, the internal gear 42 may be a pin gear or the like in addition to a spur gear.

[0021] The carrier 44 is a thin, disk-shaped member. External teeth are formed on the outer circumferential surface of the carrier 44. As shown in FIG. 1, the carrier 44 has a plurality of holding holes 46 formed therein. The holding holes 46 hold the disk-shaped substrates 100.

[0022] A plurality of carriers 44 are arranged on the lower surface plate 12. The carriers 44 mesh with the sun gear 40 and the internal gear 42, and rotate around the sun gear 40 while revolving around the sun gear 40 in response to the rotation of at least one of the sun gear 40 and the internal gear 42.

[0023] In this embodiment, the upper surface plate 20 contacts the upper surface of the disk-shaped substrate 100 held by the carrier 44, and the lower surface plate 12 contacts the lower surface of the disk-shaped substrate 100. By revolving and rotating the carrier 44 in this state, both the upper and lower surfaces of the disk-shaped substrate 100 are polished by the polishing cloths 14, 24.

[0024] <Modification of the manufacturing apparatus 10> In the above embodiment, the hole group 33 is configured by three through holes 32, but the number of through holes 32 in the hole group 33 is not limited to three, and may be any number as long as it is plural. In the above-described embodiment, the hole groups 33 are arranged at 90-degree intervals around the circumferential direction of the flange 29, but this is not limiting. The hole groups 33 may be arranged at intervals of, for example, 30 degrees, 45 degrees, 60 degrees, 180 degrees, etc. Furthermore, the hole groups 33 may not be arranged at equal angular intervals.

[0025] The manufacturing apparatus 10 in the above-described embodiment is an apparatus for polishing the disk-shaped substrate 100, but is not limited to this. The manufacturing apparatus 10 may also be an apparatus for grinding the disk-shaped substrate 100. The manufacturing apparatus 10 of the above-described embodiment may further include one or more other devices, such as a storage rack for storing the disk-shaped substrates 100 before processing or the disk-shaped substrates 200 after processing, a cleaning device for cleaning the disk-shaped substrates 200, a drying device for drying the disk-shaped substrates 200, etc.

[0026] <Method of manufacturing the disk-shaped substrate 200> An example of the method for manufacturing a disk-shaped substrate according to the present disclosure will be described below with reference to the drawings. However, the method for manufacturing a disk-shaped substrate according to the present disclosure is not limited to the following example. The manufacturing method of this embodiment is a method for manufacturing a disk-shaped substrate 200. The manufacturing method of this embodiment is carried out using a manufacturing apparatus 10, for example.

[0027] For example, when the disk-shaped substrate 100 is an aluminum substrate, the method for manufacturing the disk-shaped substrate 200 includes the following steps as shown in FIG. Blank substrate preparation step: An aluminum substrate of desired dimensions is prepared. The aluminum substrate of desired dimensions can be obtained, for example, by rolling an aluminum alloy ingot to obtain an aluminum alloy plate material with a thickness of approximately 2 mm or less, and then punching the obtained aluminum alloy plate material into a disk shape. Cutting step: The prepared aluminum substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding process: Grinding is performed on both main surfaces of the aluminum substrate after cutting using a grindstone. The grinding process can reduce, for example, the surface roughness and waviness of the aluminum substrate after cutting. Plating process: After grinding, the surface of the aluminum substrate is plated with NiP or other plating. Plating can, for example, harden the surface and reduce surface defects. Polishing step: Both main surfaces of the aluminum substrate on which the plating film has been formed are polished. In the polishing step, the upper surface plate 20 rotates with the disk-shaped substrate 100 sandwiched between it and the lower surface plate 12, and the surface of the disk-shaped substrate 100 is polished.

[0028] When the disk-shaped substrate 100 is a glass substrate, the manufacturing method for the disk-shaped substrate 200 includes, for example, the following steps: Note that when the disk-shaped substrate 100 is a glass substrate, the manufacturing method differs from when the disk-shaped substrate 100 is an aluminum substrate in that it does not include a cutting step. Manufacturing equipment preparation step: A manufacturing equipment 10 is prepared. Blank substrate preparation process: A glass blank substrate of the desired dimensions is prepared. The glass blank substrate of the desired dimensions is prepared, for example, by press molding a glass blank, which is the material for a plate-shaped glass substrate for a magnetic recording medium having a pair of main surfaces, and forming a circular hole in the center of the glass blank to form a ring shape. Next, the glass blank is shaped to obtain a glass substrate with a chamfered surface. The inner and outer peripheral end surfaces of the shaped glass substrate are ground and polished. Grinding process: The main surfaces of the glass substrate after edge polishing are ground using fixed abrasive grains. Polishing step: The main surfaces of the glass substrate after the grinding step are polished with a predetermined abrasive. During the polishing step, the glass substrate may be subjected to a chemical strengthening treatment. In the polishing step, the upper surface plate 20 rotates with the disk-shaped substrate 100 sandwiched between it and the lower surface plate 12, and the surface of the disk-shaped substrate 100 is polished.

[0029] Furthermore, the manufacturing method of this embodiment includes a measuring step and a changing step, as shown in Fig. 4. The measuring step and the changing step are performed, for example, after the polishing step is performed. The measuring step and the changing step may be performed each time the polishing step is performed, or may be performed after the polishing step is performed multiple times. Furthermore, the measuring step and the changing step can be performed at any time after the manufacturing apparatus 10 is prepared, as long as the upper surface plate 20 and the lower surface plate 12 are not in use. The manufacturing equipment preparation step described above is an example of a first step. The polishing step described above is an example of a second step. The measuring step is an example of a third step. The changing step is an example of a fourth step.

[0030] <Measurement process> In the measurement step, the flatness of the lower surface of the upper surface plate 20 is measured. The flatness of the upper surface plate 20 is measured, for example, by a measurement sensor attached to the upper surface plate 20. As the measurement sensor, a strain sensor, a displacement sensor, or the like can be used.

[0031] <Change process> In the changing step, the fastening positions of the fastening members 34 are changed according to the flatness of the upper surface plate 20 measured in the measuring step. For example, if downward bending occurs on the outer periphery side of the upper surface plate 20, it is possible to change the fastening positions to the outer periphery side by replacing the fastening members 34 with the through holes 32 on the outer periphery side in the hole group 33. The fastening positions of each hole group 33 do not have to be the same in the circumferential direction of the flange 29. That is, each hole group 33 may be fastened at different positions in the circumferential direction of the flange 29. Furthermore, each hole group 33 may be fastened at multiple fastening positions. Furthermore, if the flatness measured in the measurement step is within the allowable range, the execution of the modification step is optional. That is, in the manufacturing method of this embodiment, the modification step may be executed if the flatness exceeds the allowable range.

[0032] In the changing step, the fastening positions of the fastening members 34 are changed in accordance with the flatness of the upper surface plate 20 measured in the measuring step, but this is not limiting. For example, in the changing step, the fastening positions may be changed periodically regardless of the measurement results of the flatness. In addition, the quality of the processed disk-shaped substrate 200 (edge ​​droop, etc.) may be changed. 、 The fastening position may be changed based on the measurement results of the flatness (flatness, minute waviness, etc.) of the upper surface plate 20, assuming that the flatness of the upper surface plate 20 has deteriorated. In this way, when the fastening position is changed regardless of the measurement results of the flatness, the measurement step may be omitted. In other words, the measurement step is optional in the manufacturing method of the present disclosure.

[0033] As described above, in this embodiment, the fastening members 34 can be replaced with the multiple through holes 32, and therefore the fastening positions of the fastening members 34 can be changed depending on the flatness of the upper surface plate 20. As a result, the difference in flatness between the lower surface of the upper surface plate 20 and the upper surface of the lower surface plate 12 can be eliminated, and the reduction in the processing accuracy of the disk-shaped substrate 100 can be suppressed. In this embodiment, as described above, a plurality of hole groups 33 are arranged in the circumferential direction of the flange 29, so that the load acting on the upper surface plate 20 can be changed at each portion in the circumferential direction of the flange 29. As a result, the flatness of the lower surface of the upper surface plate 20 can be corrected with high precision. This makes it possible to suppress a decrease in the processing precision of polishing or grinding by the upper surface plate 20 and the lower surface plate 12. Furthermore, it becomes possible to realize high-precision processing by the manufacturing apparatus for a long period of time.

[0034] <Modification of manufacturing method> The method for manufacturing a disk-shaped substrate according to the present disclosure is not limited to the above-mentioned example, and may be any method that includes at least a measuring step and a modifying step. The manufacturing method of this embodiment is performed using the manufacturing apparatus 10 described above, but may be performed without using the manufacturing apparatus 10 described above. In the present disclosure, the method for manufacturing the disk-shaped substrate 200 may include one or more other commonly known processes depending on the type of the disk-shaped substrate 200. In the manufacturing method of this embodiment, the polishing step is performed using the manufacturing apparatus 10, but this is not limited to this. A grinding step may also be performed using the manufacturing apparatus 10. In this embodiment, for example, either the grinding step or the polishing step may be performed using the manufacturing apparatus 10, or both may be performed. [Explanation of symbols]

[0035] 10 Manufacturing equipment 12 Lower surface plate 20 Upper surface plate 28 Shaft 29 Flange 32 Through hole 100 disc-shaped substrate

Claims

1. a lower surface plate on which a disk-shaped substrate is placed; an upper surface plate that rotates with the disk-shaped substrate sandwiched between it and the lower surface plate and that polishes or grinds the disk-shaped substrate; a shaft portion provided above the upper surface plate and extending in the vertical direction; a flange extending radially from a lower portion of the shaft portion, the flange having a plurality of through holes extending vertically and arranged radially; a fastening member that fastens the flange to the upper surface plate through the through hole and is replaceable in the plurality of through holes; An apparatus for manufacturing a disk-shaped substrate comprising:

2. The plurality of through holes are arranged in the circumferential direction of the flange. The apparatus for manufacturing a disk-shaped substrate according to claim 1 .

3. a first step in which an upper surface plate rotates with a disk-shaped substrate sandwiched between it and a lower surface plate to polish or grind the disk-shaped substrate; a second step of changing the fastening position of the fastening member depending on the flatness of the lower surface of the upper surface plate; Equipped with The fastening member fastens the flange to the upper surface plate through the through hole, The flange is a flange that protrudes in a radial direction from a lower portion of the shaft portion, and a plurality of the through holes that penetrate in a vertical direction are arranged in the radial direction, The shaft portion is provided above the upper surface plate and extends in the vertical direction. A method for manufacturing a disk-shaped substrate.

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