Disc-shaped substrate manufacturing apparatus and disc-shaped substrate manufacturing method

Abstract

The present disclosure provides a disc-shaped substrate manufacturing apparatus and a disc-shaped substrate manufacturing method capable of positioning an upper surface plate at a set position set in advance.SOLUTION: An apparatus for manufacturing a disc-shaped substrate includes a lower plate on which a disc-shaped substrate is placed, an upper plate that rotates together with the lower plate with the disc-shaped substrate interposed therebetween and polishes or grinds the disc-shaped substrate, a detection unit that detects a rotation position of the upper plate, a control unit that controls driving of the upper plate based on the rotation position detected by the detection unit and stops rotation of the upper plate, and a pair of rotating bodies rotatably provided on one of the upper plate and an apparatus body. And an insertion unit that is provided in the other of the upper turn table and the device main body, is inserted into the insertion space of the inserted unit, and positions the upper turn table at a set position set in advance in a rotation direction and a radial direction of the upper turn table.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method. [Background technology]

[0002] Known disk-shaped substrate manufacturing devices include, for example, a manufacturing device equipped with a lower surface plate and an upper surface plate, as disclosed in Patent Document 1. In the manufacturing device of Patent Document 1, a disk-shaped substrate is placed between the lower surface plate and the upper surface plate. Then, both surfaces of the disk-shaped substrate are polished by rotating the lower surface plate and the upper surface plate. In this manufacturing apparatus, the disk-shaped substrate may adhere to the upper surface plate after polishing, preventing the disk-shaped substrate from being separated from the upper surface plate. To solve this problem, a separation fluid such as air or water is supplied to the disk-shaped substrate through a supply hole provided in the upper surface plate, causing the disk-shaped substrate to be separated from the upper surface plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-283457 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, when a structure in which a reducer is provided between the drive motor and the upper surface plate is used as the structure for driving and rotating the upper surface plate, the upper surface plate is driven to rotate by the drive motor via the reducer, so even if the drive motor is controlled to stop the rotation of the upper surface plate, the upper surface plate may not stop at a preset position. This may result in a misalignment between the supply holes provided in the upper surface plate and the disk-shaped substrate, which may result in poor separation of the disk-shaped substrate.

[0005] Therefore, an object of the present disclosure is to provide a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method that can position an upper surface plate at a preset position. [Means for solving the problem]

[0006] The present disclosure includes the following aspects. <1> a lower surface plate on which a disk-shaped substrate is placed; an upper surface plate that rotates together with the lower surface plate while sandwiching the disk-shaped substrate therebetween and polishes or grinds the disk-shaped substrate; a detection unit for detecting a rotational position of the upper surface plate; a control unit that controls the drive of the upper surface plate based on the rotation position detected by the detection unit and stops the rotation of the upper surface plate; a pair of rotors rotatably provided on one of the upper surface plate and the device main body, the pair of rotors having grooves formed on their outer circumferential surfaces along the rotation direction of the rotors, the grooves facing each other to form an insertion space between the pair of rotors; an inserting section that is provided on the other of the upper surface plate and the device body, and is inserted into the insertion space of the inserted section to position the upper surface plate at a preset position in the rotational direction and radial direction of the upper surface plate; An apparatus for manufacturing a disk-shaped substrate comprising: <2> The upper surface plate is rotated by a drive motor via a reducer, The range between the axes of the pair of rotating bodies is set to a range wider than the maximum dimension of the range in which the insertion portion is displaced from the insertion space when the rotation of the upper surface plate is stopped. <1> The disk-shaped substrate manufacturing apparatus according to claim 1. <3> the upper surface plate further includes a supply hole through which a separation fluid passes to separate the disk-shaped substrate from the upper surface plate; <1> The disk-shaped substrate manufacturing apparatus according to claim 1. <4> the apparatus body includes a support portion disposed above the upper surface plate and configured to rotatably support the upper surface plate, the inserted portion is provided on the upper surface of the upper surface plate, The insertion portion is provided on the support portion and is lowered and inserted into the insertion portion. <1> ~ <3> 10. The apparatus for manufacturing a disk-shaped substrate according to claim 9, wherein the first and second substrates are made of a polycrystalline silicon. <5> a first step of sandwiching a disk-shaped substrate between an upper surface plate and a lower surface plate, rotating the upper surface plate and the lower surface plate, and polishing or grinding the disk-shaped substrate; a second step of controlling the drive of the upper surface plate based on the rotation position detected by a detection unit that detects the rotation position of the upper surface plate, and stopping the rotation of the upper surface plate; a third step of inserting an inserting portion provided on one of the upper surface plate and the device main body into an inserting portion provided on the other of the upper surface plate and the device main body after the upper surface plate has stopped rotating, thereby positioning the upper surface plate at a preset position in the rotation direction; Equipped with the inserted portion has a pair of rotating bodies rotatably provided on one of the upper surface plate and the device main body, the pair of rotating bodies having grooves formed on their outer circumferential surfaces along the rotation direction of the rotating bodies, the grooves facing each other to form an insertion space between the pair of rotating bodies, In a third step, the inserting portion is inserted into the insertion space of the inserted portion, and the upper surface plate is positioned at a preset position in the rotational direction and radial direction of the upper surface plate. A method for manufacturing a disk-shaped substrate. <6> The upper surface plate is rotated by a drive motor via a reducer, The range between the axes of the pair of rotating bodies is set to a range wider than the maximum dimension of the range in which the insertion portion is displaced from the insertion space when the rotation of the upper surface plate is stopped. <5> 10. A method for producing the disk-shaped substrate according to claim 1 . <7> the upper surface plate further includes a supply hole through which a separation fluid passes to separate the disk-shaped substrate from the upper surface plate; the set position is set as a position where the supply hole faces the disk-shaped substrate, In the third step, the insertion part is inserted into the inserted part after the upper platen stops rotating and before the release fluid is supplied through the supply hole. <5> or <6> 10. A method for producing the disk-shaped substrate according to claim 1 . [Effects of the Invention]

[0007] According to the present disclosure, there is provided a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method that can position an upper surface plate at a preset position. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view illustrating a manufacturing apparatus according to an embodiment of the present disclosure. [Figure 2] FIG. 10 is a side cross-sectional view showing a positioning portion according to an embodiment of the present disclosure. [Figure 3] FIG. 2 is a side view showing an inserted portion and an inserting portion according to an embodiment of the present disclosure. [Figure 4] 4A is a plan cross-sectional view (cross-sectional view taken along line 4A-4A in FIG. 3) showing an inserted portion and an inserting portion according to an embodiment of the present disclosure. [Figure 5] FIG. 1 is a flow diagram illustrating a manufacturing method according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components are not essential unless otherwise specified. When embodiments are described with reference to the drawings in this disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of components in each drawing are conceptual. Therefore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component, and the front-to-back, left-to-right, and top-to-bottom dimensional ratios between components, are not limited to the illustrated dimensional ratios. Furthermore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component may differ from the actual dimensional ratios. Furthermore, unless otherwise specified in this disclosure, the number of each component element of this disclosure is not limited to one, and may be present in plural. Note that in the following description of the drawings, similar parts are denoted by similar reference numerals.

[0010] <Manufacturing equipment 10> The manufacturing apparatus 10 according to this embodiment will be described with reference to the drawings. Note that the manufacturing apparatus for the disk-shaped substrate of the present disclosure is not limited to the manufacturing apparatus 10. As an example, the manufacturing apparatus 10 is an apparatus that polishes a disk-shaped substrate 100 to manufacture a disk-shaped substrate 200. The disk-shaped substrate 200 is a processed disk-shaped substrate obtained by performing at least a polishing process on the disk-shaped substrate 100.

[0011] Specifically, as shown in Figures 1 and 2, the manufacturing apparatus 10 includes a lower surface plate 12, an upper surface plate 20, a sun gear 40, an internal gear 42, a carrier 44, an encoder 32, a control unit 34, a supply unit 50, and a positioning mechanism 80. The following describes the disk-shaped substrate 100, each part of the manufacturing apparatus 10, modified examples of the manufacturing apparatus 10, a manufacturing method for the disk-shaped substrate 200, and modified examples of the manufacturing method.

[0012] <Disc-shaped substrate 100> The disk-shaped substrate 100 is a substrate formed in a disk shape. Specifically, the disk-shaped substrate 100 is formed in an annular shape having holes in a plan view. Note that the plan view here refers to the case where the disk-shaped substrate 100 is viewed from one side in the thickness direction of the disk-shaped substrate 100. The disk-shaped substrate 100 is a substrate before a polishing process is performed.

[0013] The disk-shaped substrate 100 may be, for example, a substrate for a magnetic recording medium. Furthermore, the disk-shaped substrate 100 may be a substrate made of a metal material such as aluminum or an aluminum alloy substrate, or glass. Hereinafter, aluminum substrates, aluminum alloy substrates, glass substrates, etc. will also be collectively referred to as "substrates." Hereinafter, aluminum substrates and aluminum alloy substrates will also be collectively referred to as "aluminum substrates." A plating layer may be formed on the surface of the aluminum substrate. The use, material, type, shape, etc. of the disk-shaped substrate 100 are not limited to those described above, and various disk-shaped substrates can be used as the disk-shaped substrate 100.

[0014] <Lower surface plate 12> As shown in Figures 1 and 2, the lower surface plate 12 is a disk-shaped member. The lower surface plate 12 has a circular, horizontal upper surface. A polishing cloth 14 is disposed on the upper surface of the lower surface plate 12. A disk-shaped substrate 100 is placed on this polishing cloth 14. The lower surface plate 12 is supported by a support unit (not shown) so as to be rotatable about a vertical axis VA. The lower surface plate 12 rotates upon receiving a rotational force from a drive unit 16. The drive unit 16 has, for example, a drive motor that drives the lower surface plate 12 to rotate.

[0015] <Upper surface plate 20> As shown in FIGS. 1 and 2, the upper surface plate 20 is a disk-shaped member. The upper surface plate 20 has a horizontal, annular lower surface. A polishing cloth 24 is disposed on the lower surface of the upper surface plate 20. The polishing cloth 24 disposed on the upper surface plate 20 is positioned opposite the polishing cloth 14 disposed on the lower surface plate 12. The upper surface plate 20 is supported by a support unit 22 so as to be rotatable about a vertical axis VA. The upper surface plate 20 rotates by receiving a rotational force from a drive unit 26. Specifically, the drive unit 26 has, for example, a drive motor and a reducer disposed between the drive motor and the upper surface plate 20. The drive unit 26 drives the upper surface plate 20 to rotate via the reducer using the drive motor. The reducer has the function of increasing the rotational torque of the upper surface plate 20. In this embodiment, the disk-shaped substrate 100 is sandwiched between the upper surface plate 20 and the lower surface plate 12 and rotated to polish the disk-shaped substrate 100.

[0016] The support part 22 is disposed above the upper surface plate 20. The support part 22 is supported by the lifting part 23 so that the upper surface plate 20 can be raised and lowered along the vertical axis VA. The support part 22 and the upper surface plate 20 are raised and lowered by driving the lifting part 23. The upper surface plate 20 approaches and moves away from the lower surface plate 12 by being raised and lowered. The support portion 22 is provided in the device main body 21. Here, the device main body 21 refers to the components other than the upper surface plate 20, and refers to the components that do not rotate together with the upper surface plate 20. The upper surface plate 20 is formed with a plurality of supply holes 28 through which a separation fluid passes to separate the disk-shaped substrate 100 from the upper surface plate 20. The supply holes 28 penetrate the upper surface plate 20 and the polishing cloth 24 in the vertical direction.

[0017] <Sun gear 40, internal gear 42, and carrier 44> As shown in Figures 1 and 2, the sun gear 40 is provided at the center of the lower surface plate 12. The sun gear 40 rotates about a vertical axis VA by being driven by a drive unit 41. The sun gear 40 may be a spur gear or a pin gear having a row of teeth integrally formed on its side surface. The drive unit 41 has, for example, a drive motor that drives the sun gear 40 to rotate.

[0018] The internal gear 42 is disposed concentrically with the sun gear 40. The internal gear 42 has an annular cylindrical body 49. Internal teeth are formed on the inner peripheral surface of the cylindrical body 49. The internal gear 42 in this embodiment is held non-rotatably by a holding member (not shown). Alternatively, a drive unit that rotates the internal gear 42 may be provided, and the internal gear 42 may be rotated about the vertical axis VA. When the internal gear 42 is rotated, the sun gear 40 may be held non-rotatably. Furthermore, the internal gear 42 may be a pin gear or the like in addition to a spur gear.

[0019] The carrier 44 is a thin, disk-shaped member. External teeth are formed on the outer circumferential surface of the carrier 44. As shown in FIG. 1, the carrier 44 has a plurality of holding holes 46 formed therein. The holding holes 46 hold the disk-shaped substrates 100.

[0020] A plurality of carriers 44 are arranged on the lower surface plate 12. The carriers 44 mesh with the sun gear 40 and the internal gear 42, and rotate around the sun gear 40 while revolving around the sun gear 40 in response to the rotation of at least one of the sun gear 40 and the internal gear 42.

[0021] In this embodiment, the upper surface plate 20 contacts the upper surface of the disk-shaped substrate 100 held by the carrier 44, and the lower surface plate 12 contacts the lower surface of the disk-shaped substrate 100. By revolving and rotating the carrier 44 in this state, both the upper and lower surfaces of the disk-shaped substrate 100 are polished by the polishing cloths 14, 24.

[0022] <Encoder 32 and control unit 34> The encoder 32 detects the rotational position of the upper surface plate 20. The encoder 32 detects the rotational position of the upper surface plate 20 by, for example, using a sensor to detect a mark such as a slit or mark provided on a rotating body that rotates as the upper surface plate 20 rotates. The mark may also be provided on the upper surface plate 20 itself. For example, a reflective or transmissive optical sensor is used as the sensor. The encoder 32 is an example of a detector. The detector of the present disclosure is not limited to the encoder 32 and may be any element capable of detecting the rotational position of the upper surface plate 20.

[0023] The control unit 34 controls the drive unit 16, the drive unit 41, and the drive unit 26. The control unit 34 controls the drive unit 16 to rotate and stop the rotation of the lower surface plate 12. The control unit 34 controls the drive unit 41 to rotate and stop the rotation of the sun gear 40 and the carrier 44. The control unit 34 controls the drive motor of the drive unit 26 to rotate and stop the rotation of the upper surface plate 20. The control unit 34 controls the drive of the upper surface plate 20 based on the rotation position detected by the encoder 32, and stops the rotation of the upper surface plate 20. Note that in this embodiment, the drive unit 26 drives the upper surface plate 20 to rotate using the drive motor via a reducer. Therefore, even if the drive motor is controlled to stop the rotation of the upper surface plate 20, the upper surface plate 20 may stop at a position deviated from a preset position.

[0024] The control unit 34 includes, for example, a processor, a memory, a storage, etc. The storage stores a control program that controls the drive units 16, 41, and 26. In the control unit 34, for example, a processor reads the control program stored in the storage into memory and executes the control program using the memory as a work area. This controls the drive units 16, 41, and 26. The control unit of the present disclosure may be any element that controls the drive of the upper surface plate 20, and is not limited to having the above configuration.

[0025] <Supply section 50> 2, the supply unit 50 has a pipe 52 connected to the supply hole 28 formed in the upper surface plate 20. The supply unit 50 supplies a peeling fluid to the disk-shaped substrate 100 that has been polished through the pipe 52 and the supply hole 28. As the peeling fluid, for example, a known liquid such as pure water or a known gas such as air can be appropriately used.

[0026] <Positioning mechanism 80> The positioning mechanism 80 is a mechanism that positions the upper surface plate 20 at a preset position in the rotational direction and radial direction of the upper surface plate 20. Specifically, the positioning mechanism 80 has an inserted portion 81, an inserting portion 82, and a driving portion 83, as shown in FIGS.

[0027] The inserted portion 81 is a component into which the inserting portion 82 is inserted. Specifically, as shown in FIGS. 1, 3, and 4, the inserted portion 81 has a pair of rolling bearings 81A rotatably mounted on the upper surface of ...

[0028] 3 and 4, each of the pair of rolling bearings 81A has a groove 81C formed on its outer circumferential surface along the direction of rotation of the rolling bearing 81A. As shown in Fig. 4, the groove 81C is, for example, a U-shaped groove. The grooves 81C of the pair of rolling bearings 81A face each other, forming an insertion space 81B between the pair of rolling bearings 81A. The insertion space 81B is a space into which the insertion portion 82 is inserted. The pair of rolling bearings 81A rotate when the insertion portions 82 are inserted into the insertion spaces 81B, and guide the insertion portions 82 into the insertion spaces 81B.

[0029] The inserting portion 82 is a component that is inserted into the inserted portion 81. Specifically, the inserting portion 82 is configured as a rod-shaped pin that extends downward from the support portion 22. The tip portion (i.e., the lower end portion) of the inserting portion 82 is formed in a hemispherical shape. The driving unit 83 is a component that drives the inserting unit 82 to insert it into the inserted unit 81. Specifically, the driving unit 83 is composed of an air cylinder that moves the inserting unit 82 up and down. The driving unit 83 is fixed to the side surface 22A of the support unit 22. When the driving unit 83 lowers the inserting unit 82, the inserting unit 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A.

[0030] When the insertion portion 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A, it comes into contact with the inner surfaces of the pair of groove portions 81C, thereby restricting the movement of the upper surface plate 20 in the rotational and radial directions. This allows the upper surface plate 20 to be positioned at a set position in the rotational and radial directions of the upper surface plate 20. The set position is set, for example, as a position where the supply hole 28 faces the disk-shaped substrate 100 stored in the carrier 44. In this embodiment, the insertion portion 82 is inserted into the inserted portion 81 after the upper surface plate 20 stops rotating and before the supply portion 50 supplies the peeling fluid through the supply hole 28. The driving unit 83 raises the insertion unit 82, thereby removing the insertion unit 82 from the insertion space 81B between the pair of rolling bearings 81A. This allows the upper surface plate 20 to rotate. The insertion unit 82 is raised after the supply unit 50 supplies the peeling fluid.

[0031] In the present embodiment, as described above, when the drive motor of the drive unit 26 is controlled to stop the rotation of the upper surface plate 20, the upper surface plate 20 may stop deviating from a preset position. Therefore, the insertion portion 82 may be positioned at a position deviating from the insertion space 81B. In the present embodiment, the range GA (FIGS. 3 and 4) between the axes of the pair of rolling bearings 81A is set to a range wider than the maximum dimension of the range by which the insertion portion 82 deviates from the insertion space 81B when the rotation of the upper surface plate 20 is stopped. Therefore, when the drive motor of the drive unit 26 is controlled to stop the rotation of the upper surface plate 20, the insertion portion 82 is positioned within the range GA between the axes of the pair of rolling bearings 81A. In the inserted portion 81, the insertion portion 82 descends within the range GA between the axes of the pair of rolling bearings 81A, causing the pair of rolling bearings 81A to rotate and guide the insertion portion 82 into the insertion space 81B.

[0032] <Modification of the manufacturing apparatus 10> In the above-described embodiment, the inserting portion 82 is configured as a rod-shaped pin, but is not limited to this. The inserting portion 82 may be, for example, plate-shaped, and may be any component that can be inserted into the inserted portion 81. In the above-described embodiment, the inserted portion 81 is configured by a pair of rolling bearings 81A, but is not limited to this. The inserted portion 81 may be, for example, a tapered cylinder whose diameter decreases downward, and may be any component into which the inserting portion 82 is inserted. In the above-described embodiment, the driving unit 83 is configured as an air cylinder, but is not limited to this. Other actuators such as a hydraulic cylinder may be used as the driving unit 83, and any component that drives the inserting portion 82 to insert it into the inserted portion 81 may be used.

[0033] In the manufacturing apparatus 10 of the above-described embodiment, the inserted portion 81 is provided on the upper surface of the upper surface plate 20, but this is not limited to this. For example, the inserted portion 81 may be provided on the side surface of the upper surface plate 20, and the inserting portion 82 may be inserted into the inserted portion 81 from the side of the upper surface plate 20. In the manufacturing apparatus 10 of the above-described embodiment, the inserting portion 82 is provided on the support portion 22, and the inserted portion 81 is provided on the upper surface plate 20, but this is not limiting. The inserted portion 81 may be provided on the support portion 22, and the inserting portion 82 may be provided on the upper surface plate 20. In this case, for example, the inserted portion 81 is moved up and down by the drive portion 83, whereby the inserting portion 82 is inserted into the inserted portion 81.

[0034] Although the manufacturing apparatus 10 in the above-described embodiment is a polishing apparatus that polishes the disk-shaped substrate 100, the present invention is not limited to this. The manufacturing apparatus 10 may also be an apparatus that grinds the disk-shaped substrate 100. The manufacturing apparatus 10 of the above-described embodiment may further include one or more other devices, such as a storage rack for storing the disk-shaped substrates 100 before processing or the disk-shaped substrates 200 after processing, a cleaning device for cleaning the disk-shaped substrates 200, a drying device for drying the disk-shaped substrates 200, etc.

[0035] <Method of manufacturing the disk-shaped substrate 200> An example of the method for manufacturing a disk-shaped substrate according to the present disclosure will be described below with reference to the drawings. However, the method for manufacturing a disk-shaped substrate according to the present disclosure is not limited to the following example. The manufacturing method of this embodiment is a method for manufacturing a disk-shaped substrate 200. The manufacturing method of this embodiment is carried out using a manufacturing apparatus 10, for example.

[0036] For example, when the disk-shaped substrate 100 is an aluminum substrate, the method for manufacturing the disk-shaped substrate 200 includes the following steps as shown in FIG. Blank substrate preparation step: An aluminum substrate of desired dimensions is prepared. The aluminum substrate of desired dimensions can be obtained, for example, by rolling an aluminum alloy ingot to obtain an aluminum alloy plate material with a thickness of approximately 2 mm or less, and then punching the obtained aluminum alloy plate material into a disk shape. Cutting step: The prepared aluminum substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding process: Grinding is performed on both main surfaces of the aluminum substrate after cutting using a grindstone. The grinding process can reduce, for example, the surface roughness and waviness of the aluminum substrate after cutting. Plating process: After grinding, the surface of the aluminum substrate is plated with NiP or other plating. Plating can, for example, harden the surface and reduce surface defects. Polishing step: Both main surfaces of the aluminum substrate on which the plating film has been formed are polished.

[0037] When the disk-shaped substrate 100 is a glass substrate, the manufacturing method for the disk-shaped substrate 200 includes, for example, the following steps: Note that when the disk-shaped substrate 100 is a glass substrate, the manufacturing method differs from when the disk-shaped substrate 100 is an aluminum substrate in that it does not include a cutting step. Manufacturing equipment preparation step: A manufacturing equipment 10 is prepared. Blank substrate preparation process: A glass blank substrate of the desired dimensions is prepared. The glass blank substrate of the desired dimensions is prepared, for example, by press molding a glass blank, which is the material for a plate-shaped glass substrate for a magnetic recording medium having a pair of main surfaces, and forming a circular hole in the center of the glass blank to form a ring shape. Next, the glass blank is shaped to obtain a glass substrate with a chamfered surface. The inner and outer peripheral end surfaces of the shaped glass substrate are ground and polished. Grinding process: The main surfaces of the glass substrate after edge polishing are ground using fixed abrasive grains. Polishing step: The main surfaces of the glass substrate after the grinding step are polished with a predetermined abrasive. During the polishing step, the glass substrate may be subjected to a chemical strengthening treatment.

[0038] The polishing step according to this embodiment will be described in detail below. As shown in Fig. 5, the polishing process includes a rotating process, a stopping process, a positioning process, and a peeling process. The rotating process is an example of a first process, the stopping process is an example of a second process, and the positioning process is an example of a third process.

[0039] <Rotation process> In the rotation process, the disk-shaped substrate 100 is sandwiched between the upper surface plate 20 and the lower surface plate 12, and the upper surface plate 20 and the lower surface plate 12 are rotated. Specifically, with the lower surface plate 12 and the upper surface plate 20 in contact with the disk-shaped substrate 100, the sun gear 40, the lower surface plate 12, and the upper surface plate 20 are rotated by the drive units 16, 41, and 26. As a result, the surface of the disk-shaped substrate 100 is polished by the lower surface plate 12 and the upper surface plate 20. In this embodiment, the sun gear 40, the lower surface plate 12, and the upper surface plate 20 are rotated while a polishing liquid is supplied between the lower surface plate 12 and the upper surface plate 20. The polishing liquid used when polishing an aluminum substrate is not particularly limited as long as it is a commonly used one, and examples thereof include slurries containing aluminum oxide, colloidal silica, etc. The polishing liquid used when polishing a glass substrate is not particularly limited as long as it is a commonly used one, and examples thereof include slurries containing cerium oxide, zirconia, colloidal silica, etc.

[0040] <Stopping process> In the stopping step, the control unit 34 controls the driving of the drive unit 16 and the drive unit 41 to stop the rotation of the lower surface plate 12, the sun gear 40, and the carrier 44. The control unit 34 also controls the drive motor of the drive unit 26 based on the rotation position detected by the encoder 32 to stop the rotation of the upper surface plate 20. In this embodiment, the range GA (FIGS. 3 and 4) between the axes of the pair of rolling bearings 81A is set to a range wider than the maximum dimension GB (FIGS. 3 and 4) of the range over which the insertion portion 82 deviates from the insertion space 81B when the upper surface plate 20 is stopped. Therefore, the rotation of the upper surface plate 20 stops at a position where the insertion portion 82 is located within the range GA between the axes of the pair of rolling bearings 81A.

[0041] <Positioning process> In the positioning step, after the rotation of the upper surface plate 20 has stopped, the drive unit 83 lowers the insertion unit 82, whereby the insertion unit 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A. Since the carrier 44 is engaged with the sun gear 40 and the internal gear 42, it is possible to stop the carrier 44 at a set position by controlling the driving of the driving unit 16 and the driving unit 41.

[0042] As described above, in the positioning step, the insertion portion 82 is inserted into the insertion space 81B between the pair of rolling bearings 81A, so that the upper surface plate 20 can be positioned at a set position in the rotational direction and radial direction of the upper surface plate 20. Specifically, the set position is a position where the supply hole 28 faces the disk-shaped substrate 100 stored in the carrier 44. In the positioning step, the inserting portion 82 is inserted into the inserted portion 81 after the upper surface plate 20 has stopped rotating, so that improper insertion of the inserting portion 82 is suppressed. In this embodiment, the inserted portion 81 is provided on the upper surface of the upper surface plate 20. On the other hand, the inserting portion 82 is provided on the support portion 22, and is lowered and inserted into the inserted portion 81. It is not necessary to secure a space to the side of the upper surface plate 20 for arranging the inserting portion 82. In this way, the positioning step is a step of mechanically or physically positioning the upper surface plate 20, whereas the stopping step is a step of electrically positioning the upper surface plate 20. Furthermore, the stopping step is a step of roughly positioning the rotational position of the upper surface plate 20 prior to the positioning step.

[0043] <Peeling process> The peeling process is a process of peeling the disk-shaped substrate 100 from the upper surface plate 20. In the peeling process, the supply unit 50 supplies a peeling fluid to the disk-shaped substrate 100 that has been polished through the piping 52 and the supply hole 28. Furthermore, the lifting unit 23 lifts the support unit 22 and the upper surface plate 20, and separates the upper surface plate 20 from the lower surface plate 12. The timing for supplying the release fluid may be before or after the upper platen 20 starts to rise. The present disclosure does not exclude the case where the release fluid is supplied without the process of raising the upper platen 20.

[0044] In this embodiment, before the peeling fluid is supplied through the supply hole 28, the inserting portion 82 is inserted into the inserted portion 81, and the upper surface plate 20 is positioned so that the supply hole 28 faces the disk-shaped substrate 100. As a result, the peeling fluid is supplied from the supply hole 28 toward the opposing disk-shaped substrate 100, thereby suppressing peeling defects of the disk-shaped substrate 100.

[0045] <Modification of manufacturing method> The method for manufacturing a disk-shaped substrate according to the present disclosure is not limited to the above-mentioned example, and may be any method that includes at least a rotation step and a positioning step. The manufacturing method of this embodiment is performed using the manufacturing apparatus 10 described above, but may be performed without using the manufacturing apparatus 10 described above. In the present disclosure, the method for manufacturing the disk-shaped substrate 200 may include one or more other commonly known processes depending on the type of the disk-shaped substrate 200. In the manufacturing method of this embodiment, the polishing step is performed using the manufacturing apparatus 10, but this is not limited to this. A grinding step may also be performed using the manufacturing apparatus 10. In this embodiment, for example, either the grinding step or the polishing step may be performed using the manufacturing apparatus 10, or both may be performed. [Explanation of symbols]

[0046] 10 Manufacturing equipment 12 Lower surface plate 20 Upper surface plate 22 Support part 32 Encoder 34 Control Unit 50 Supply section 81 Inserted part 81A Rolling bearing (an example of a rotating body) 81B Insertion space 81C Groove 82 Insertion section 100 disc-shaped substrate

Claims

1. a lower surface plate on which a disk-shaped substrate is placed; an upper surface plate that rotates together with the lower surface plate while sandwiching the disk-shaped substrate therebetween and polishes or grinds the disk-shaped substrate; a detection unit for detecting a rotational position of the upper surface plate; a control unit that controls the drive of the upper surface plate based on the rotation position detected by the detection unit and stops the rotation of the upper surface plate; a pair of rotors rotatably mounted on one of the upper surface plate and the device main body, the pair of rotors having grooves formed on their outer circumferential surfaces along the rotation direction of the rotors, the grooves facing each other to form an insertion space between the pair of rotors; an inserting section that is provided on the other of the upper surface plate and the device body, that is inserted into the insertion space of the inserted section, and that positions the upper surface plate at a preset position in the rotational direction and radial direction of the upper surface plate; An apparatus for manufacturing a disk-shaped substrate comprising:

2. The upper surface plate is rotated by a drive motor via a reducer, The range between the axes of the pair of rotating bodies is set to a range wider than the maximum dimension of the range in which the insertion portion is displaced from the insertion space when the rotation of the upper surface plate is stopped. The apparatus for manufacturing a disk-shaped substrate according to claim 1 .

3. the upper surface plate further includes a supply hole through which a separation fluid passes to separate the disk-shaped substrate from the upper surface plate; The apparatus for manufacturing a disk-shaped substrate according to claim 1 .

4. the apparatus body includes a support portion disposed above the upper surface plate and configured to rotatably support the upper surface plate, the inserted portion is provided on the upper surface of the upper surface plate, The insertion portion is provided on the support portion and is lowered to be inserted into the insertion space of the inserted portion. The apparatus for manufacturing a disk-shaped substrate according to any one of claims 1 to 3.

5. a first step of sandwiching a disk-shaped substrate between an upper surface plate and a lower surface plate, rotating the upper surface plate and the lower surface plate, and polishing or grinding the disk-shaped substrate; a second step of controlling the drive of the upper surface plate based on the rotation position detected by a detection unit that detects the rotation position of the upper surface plate, and stopping the rotation of the upper surface plate; a third step of inserting an inserting portion provided on one of the upper surface plate and the device main body into an inserting portion provided on the other of the upper surface plate and the device main body after the upper surface plate has stopped rotating, thereby positioning the upper surface plate at a preset position in the rotation direction; Equipped with the inserted portion has a pair of rotating bodies rotatably provided on one of the upper surface plate and the device main body, the pair of rotating bodies having grooves formed on their outer circumferential surfaces along the rotation direction of the rotating bodies, the grooves facing each other to form an insertion space between the pair of rotating bodies, In a third step, the inserting portion is inserted into the insertion space of the inserted portion, and the upper surface plate is positioned at a preset position in the rotational direction and radial direction of the upper surface plate. A method for manufacturing a disk-shaped substrate.

6. The upper surface plate is rotated by a drive motor via a reducer, The range between the axes of the pair of rotating bodies is set to a range wider than the maximum dimension of the range in which the insertion portion is displaced from the insertion space when the rotation of the upper surface plate is stopped. The method for producing the disk-shaped substrate according to claim 5 .

7. the upper surface plate further includes a supply hole through which a separation fluid passes to separate the disk-shaped substrate from the upper surface plate; the set position is set as a position where the supply hole faces the disk-shaped substrate, In the third step, the inserting portion is inserted into the inserted portion after the upper platen stops rotating and before the release fluid is supplied through the supply hole. The method for producing the disk-shaped substrate according to claim 5 or 6.

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