Connector

Abstract

To provide a connector which radiates heat mainly by heat conduction.SOLUTION: A connector of the present disclosure includes a socket mounted on a substrate, a plug connected to the socket, a cable connected to the plug, a socket heat sink covering the socket and fixed to the substrate, and a plug heat sink attached to the plug, connected to the socket heat sink, and in contact with a braided wire of the cable.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to connectors. [Background technology]

[0002] An example of a conventional connector designed to suppress temperature rise in electronic devices is the connector disclosed in Patent Document 1. The connector in Patent Document 1 aims to promote heat dissipation from a heat-generating element to prevent electromagnetic interference, and its connector socket has a shielding case that covers an IC mounted nearby on the same board, thereby dissipating heat from the IC and providing electromagnetic shielding. The connector plug also has a plug portion and a plug shield that is exposed on the outside of the connector plug. The plug shield is crimped to the braided shield of the connector cable by caulking.

[0003] Another conventional example is the connectorized cable disclosed in Patent Document 2. The connectorized cable of Patent Document 2 aims to suppress temperature rise in an electronic device without affecting the size and weight reduction of the connected electronic device, and is a connectorized cable that includes a connector to be connected to an electronic device and a cable to be connected to the connector, and the connector includes heat absorption means for absorbing heat generated within the electronic device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-150033 [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-324207 Summary of the Invention [Problem to be solved by the invention]

[0005] Heat dissipation is achieved through three methods: thermal convection, thermal conduction, and thermal radiation. Conventional heat sinks (hereafter referred to as HS) are attached directly to heat-generating components such as ICs, and conduct heat from the component to the HS, dissipating it through convection. Convection heat dissipation requires a larger HS surface area, which means that the HS and heat-dissipation-related components must occupy a larger volume within the mounting case. An example of a heat-dissipation-related component is a cooling fin. Furthermore, because heat sinks must be attached to or around the heat-generating components themselves, there are limitations on the board and case structure.

[0006] Therefore, an object of the present disclosure is to provide a connector that dissipates heat primarily through thermal conduction. [Means for solving the problem]

[0007] The connector of the present disclosure includes a socket, a plug, a cable, a socket heat sink, and a plug heat sink.

[0008] The socket is mounted on the board. The plug is connected to the socket. The cable is connected to the plug. The socket heat sink covers the socket and is fixed to the board. The plug heat sink is attached to the plug, connected to the socket heat sink, and makes contact with the braided wire of the cable. [Effects of the Invention]

[0009] The connector of the present disclosure dissipates heat primarily through thermal conduction. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a perspective view showing the structure of the socket and the socket heat sink according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing the structure of the plug and plug heat sink of the first embodiment. [Figure 3] FIG. 1 is a perspective view showing the structure of a connector according to a first embodiment. [Figure 4] FIG. 1 is a perspective view showing a cross-sectional structure of a connector according to a first embodiment. [Figure 5]FIG. 2 is a cross-sectional view of the connector of the first embodiment. [Figure 6] FIG. 2 is a cross-sectional view (partially enlarged) of the connector of the first embodiment. [Figure 7] FIG. 2 is a schematic cross-sectional view showing the relationship between the plug heat sink, braided wire, and copper foil of the connector of the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present disclosure will be described in detail. Note that components having the same functions are assigned the same numbers, and redundant explanations will be omitted. [Example]

[0012] The structure of the connector of this embodiment will be described below with reference to Figures 1 to 7. As shown in Figures 1 to 7, the connector of the present disclosure includes a socket 1, a plug 2, a cable 3, a socket heat sink 4, and a plug heat sink 5.

[0013] 1-7, the axis of the insertion / removal direction of plug 2 into socket 1 is the y-axis, the insertion direction of plug 2 into socket 1 is the +y-direction, the removal direction of plug 2 from socket 1 is the -y-direction, the east-west direction when the +y-direction is north is the x-axis, the east direction when the +y-direction is north is the +x-direction, the west direction when the +y-direction is north is the -x-direction, the axis perpendicular to both the x-axis and y-axis is the z-axis, one direction of the z-axis is the +z-direction, and the other direction of the z-axis is the -z-direction. In this embodiment, the connector is arranged so that the xy plane is parallel to the horizontal, the +z-direction is vertically upward, and the -z-direction is vertically downward. Therefore, in this specification, when terms such as front, back, top, bottom, side, upper, and lower are used, all of these meanings are based on the connector arrangement conditions described above.

[0014] As shown in Fig. 1, socket 1 of this embodiment is formed in a substantially rectangular parallelepiped shape including connection portion 11 that opens in the -y direction, and the surface (back surface) on the -z direction side is mounted on substrate 9 shown in Fig. 3. As shown in Fig. 2, plug 2 is formed in a substantially rectangular parallelepiped shape, including connection portion 21 that protrudes in the +y direction and fits into connection portion 11 to be connected to socket 1. As shown in Fig. 3, cable 3 is connected to the -y direction side of plug 2.

[0015] As shown in FIG. 1 , the socket heat sink 4 includes a hood-shaped socket housing 41 that covers the socket 1, and the socket housing 41 is open in the −y and −z directions (the opening in the −y direction is referred to as opening 42). The −y direction end of the socket 1 and the connection portion 11 are exposed from opening 42. The +x direction end and −x direction end of opening 42 extend in the +x direction and −x direction, respectively, to form wall portion 43. Recesses 431 recessed in the +y direction are formed on the −y direction surfaces of the +x direction wall portion 43 and the −x direction wall portion 43. The −z direction ends (lower ends) of wall portion 43 each extend in the +y direction like a thin plate to form board connection portion 44. As shown in FIG. 3 , board connection portion 44 is fixed to board 9.

[0016] Generally, the closer a heat sink is to a heat source, the better its heat absorption ability, so a higher heat dissipation effect can be achieved by positioning the heat-generating components on board 9 closer to board connection portion 44. Alternatively, the heat dissipation effect can be improved by extending board connection portion 44 as close to the heat source as possible.

[0017] As shown in FIG. 2 , the plug heat sink 5 includes a plug accommodating section 51 in the shape of a housing (box) attached to the plug 2, and the plug accommodating section 51 is open in the +y and +z directions (the opening in the +y direction is referred to as opening 52). The +y-direction end of the plug 2 and the connection section 21 are exposed from opening 52. The +x-direction end and −x-direction end of opening 52 extend in the +x and −x directions, respectively, and are both bent in the +y direction and further extended, respectively, to form a crank portion 53. The +y-direction tip 531 of crank portion 53 fits into the recess 431 described above (see FIG. 3 ). This connects the plug heat sink 5 to the socket heat sink 4.

[0018] By applying a predetermined pressure in the +y direction to contact and fix the plug heat sink 5 to the socket heat sink 4, the crank portion 53 is slightly elastically deformed in the -y direction. The restoring force of the crank portion 53 in the +y direction maintains good contact between the plug heat sink 5 and the socket heat sink 4. The plug heat sink 5 also makes contact with the braided wire of the cable 3, as will be described in more detail later.

[0019] As shown in FIG. 3, a cable insertion hole 54 is provided on the side surface of the plug accommodating portion 51 on the −y direction side, and the cable 3 is inserted through the cable insertion hole 54 .

[0020] FIG. 4 is a perspective view showing the cross-sectional structure of the connector and substrate 9 cut along a plane parallel to the yz plane so as to cut the −x-direction ends of wall portion 43 and substrate connection portion 44, and FIG. 5 is a cross-sectional view thereof. As shown in FIG. 4, it is preferable that a filler 6 having a predetermined compressibility and a predetermined thermal conductivity is fixed between the −z-direction surface (rear surface) of substrate connection portion 44 and the +z-direction surface (front surface) of substrate 9. It is also preferable that a similar filler 6 is fixed between recess 431 of socket heat sink 4 and tip portion 531 of plug heat sink 5, as shown in FIG. 5. The filler 6 may be, for example, a thermal interface material (TIM).

[0021] As shown in Figures 6 and 7, cable 3 includes a core wire 32, a braided wire 31 covering core wire 32, and an outer sheath 30 covering braided wire 31, and braided wire 31 is folded (wrapped) around the entire circumference of cable 3 from the +y-direction end in the -y-direction and extended along outer sheath 30.

[0022] The surface of the folded braided wire 31 on the +z side comes into contact with the shield cover 8 located on the +z side near the folding position. The braided wire 31 is fixed by crimping together with the shield cover 8, the outer sheath 30, and the core wire 32 by the clamper 9 near the folding position.

[0023] Copper foil 7 is wrapped around the folded braided wire 31. The copper foil 7 is in contact with the entire inner surface of the cable insertion hole 54.

[0024] More specifically, at a predetermined position extending in the −y direction from the folded-back position of the braided wire 31, the braided wire 31 in the +z direction comes into contact with the copper foil 7 on the +z direction side, and the braided wire 31 in the −z direction comes into contact with the copper foil 7 on the −z direction side. The copper foil 7 on the +z direction side comes into contact with the inner surface of the cable insertion hole 54 on the +z direction side, and the copper foil 7 on the −z direction side comes into contact with the inner surface of the cable insertion hole 54 on the −z direction side. In this example, the braided wire 31 is folded back in the −y direction, but the braided wire 31 may be exposed and brought into contact with the copper foil 7 by removing a portion of the outer sheath 30 without folding back the braided wire 31.

[0025] In this embodiment, the braided wire 31 is used as the heat dissipation path, but it is not limited to the braided wire 31. Any conductor of the cable 3, such as the core wire 32 of the cable 3, can be used as the heat dissipation path.

[0026] Furthermore, in this embodiment, copper foil 7 is used for the heat dissipation path, but it is not limited to copper foil 7. Any electrically conductive material (conductive material) can be used as the heat dissipation path. An example of a conductive material is conductive tape. If a metal part (clamper or ferrule) is to be crimped and brought into contact, the material does not have to be in the form of tape.

[0027] Furthermore, the heat dissipation path is not limited to conductive materials, and it is also possible to use heat conductive materials such as core wire coatings. An example of a heat conductive material is the heat conductive tape described in Reference Non-Patent Document 1.

[0028] (Reference Non-Patent Document 1: 3M, "3M Thermally Conductive Tape," [online], [searched July 9, 2024], Internet <URL: https: / / www.3mcompany.jp / 3M / ja_JP / p / c / electronics-components / electronics-films-tapes / thermally-conductive-tapes / >) <Effects> According to the connector of the present disclosure, heat is dissipated mainly by thermal conduction, and therefore the volume of the mounting housing that is involved in heat dissipation can be reduced.

[0029] Furthermore, according to the connector of the present disclosure, heat is dissipated mainly by thermal conduction, so there is no need to attach it to the heat-generating component itself or around the heat-generating component, which increases the options for board configuration.

[0030] Furthermore, the socket heat sink 4 of the present disclosure absorbs heat from the board 9 by coming into direct contact with the board 9 .

[0031] Furthermore, the plug heat sink 5 of the present disclosure is in contact with the copper foil 7 covering the braided wire 31 , thereby ensuring a heat dissipation path to the braided wire 31 .

[0032] That is, the heat sink assembly in which the two components of the socket heat sink 4 and the plug heat sink 5 of the present disclosure are fitted (connected) together can conduct heat from the substrate 9 and dissipate it to the outside via the braided wire 31 of the cable 3.

[0033] Furthermore, since the socket heat sink 4 and plug heat sink 5 disclosed herein dissipate heat through thermal conduction, there is no need to significantly increase the surface area of ​​the heat sink, and an attachment method can be used to attach it to the connector, thereby minimizing the impact on the component mounting area.

[0034] Furthermore, the connector of the present disclosure uses a filler 6 (e.g., a TIM material) having a predetermined compressibility and a predetermined thermal conductivity, thereby enabling surface contact between the substrate 9 and the HS, and between the HSs themselves, thereby improving thermal conductivity.

[0035] Furthermore, the filler 6 of the present disclosure absorbs rattles that occur when the socket heat sink 4 and the plug heat sink 5 are mated (connected), reducing the load on the connector board.

Claims

1. a socket mounted on the board; a plug connected to the socket; a cable connected to the plug; a socket heat sink that covers the socket and is fixed to the substrate; a plug heat sink attached to the plug, connected to the socket heat sink, and in contact with the braided wire of the cable; connector.

2. 2. The connector of claim 1, A filler having a predetermined compressibility and a predetermined thermal conductivity is included between the socket heat sink and the substrate. connector.

3. 2. The connector of claim 1, A filler having a predetermined compressibility and a predetermined thermal conductivity is included between the socket heat sink and the plug heat sink. connector.

4. 4. The connector according to claim 2 or 3, The filler is a TIM (Thermal Interface Material) material. connector.

5. 2. The connector of claim 1, The plug heat sink comprises: Contacting a conductive member that contacts the conductor of the cable connector.

6. 2. The connector of claim 1, The plug heat sink comprises: Contacting the heat conducting member which is in contact with the conductor of the cable connector.

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