Radiation imaging apparatus and radiation imaging system

Abstract

To provide a technique advantageous in improving discharge efficiency of heat generated in a radiation imaging apparatus.SOLUTION: A radiation imaging apparatus includes an exterior including an incident surface on which radiation is incident, a sensor unit including a radiation detection panel that detects radiation and housed in the exterior, and a heat transfer member, wherein the radiation detection panel is disposed to face a back surface of the incident surface in a space inside the exterior, the heat transfer member connects the sensor unit and the back surface, and has a thermal conductivity of 1W / mK or more.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a radiation imaging apparatus and a radiation imaging system. [Background technology]

[0002] Radiation imaging devices that irradiate an object with radiation and detect the intensity distribution of the radiation that has passed through the object to obtain a radiation image of the object are widely used in non-destructive testing, medical diagnosis, etc. In recent years, the performance of radiation imaging devices has improved, such as with higher resolution radiation images obtained by radiation imaging devices and faster video capture speeds, resulting in an increase in the amount of heat generated by integrated circuits mounted on the radiation imaging devices. Patent Document 1 discloses that heat from electronic components arranged in a radiation imaging device is transferred to the surface of the exterior housing opposite to the radiation incident surface, and heat from a flat panel radiation detector is transferred to the side of the exterior housing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-095708 Summary of the Invention [Problem to be solved by the invention]

[0004] As the performance of radiation imaging devices continues to improve, there is a possibility that the amount of heat generated within the radiation imaging devices will further increase.

[0005] An object of the present invention is to provide a technique that is advantageous in improving the efficiency of dissipating heat generated in a radiation imaging apparatus. [Means for solving the problem]

[0006] In view of the above problems, a radiation imaging device according to an embodiment of the present invention is a radiation imaging device including an exterior having an incident surface for irradiating radiation, a radiation detection panel for detecting radiation, a sensor unit housed in the exterior, and a heat transfer member, wherein the radiation detection panel is disposed in a space inside the exterior so as to face a back side of the incident surface, and the heat transfer member connects the sensor unit to the back side and has thermal conductivity of 1 W / mK or more. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technique that is advantageous in improving the efficiency of dissipating heat generated in a radiation imaging apparatus. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing an example of the arrangement of a radiation imaging apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view showing an example of the configuration of the radiation imaging apparatus of FIG. [Figure 3] 2A to 2C are diagrams for explaining the effect of the radiation imaging apparatus of FIG. 1; [Figure 4] 2A to 2C are diagrams for explaining the effect of the radiation imaging apparatus of FIG. 1; [Figure 5] FIG. 2 is a cross-sectional view showing an example of the configuration of the radiation imaging apparatus of FIG. [Figure 6] FIG. 2 is a cross-sectional view showing an example of the configuration of the radiation imaging apparatus of FIG. [Figure 7] FIG. 1 is a diagram showing an example of the configuration of a radiation imaging system using a radiation imaging apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] Furthermore, radiation in this disclosure may include alpha rays, beta rays, gamma rays, etc., which are beams created by particles (including photons) emitted by radioactive decay, as well as beams having the same or greater energy, such as X-rays, particle beams, and cosmic rays.

[0011] A radiation imaging apparatus according to an embodiment of the present disclosure will be described with reference to Figures 1(a) and 1(b) to 6. Figures 1(a) and 1(b) are a plan view and a side view showing an example of the configuration of a radiation imaging apparatus 100 according to this embodiment. Figure 2 is a cross-sectional view taken along line A-A' of the radiation imaging apparatus 100 in Figure 1(a). The structure of the radiation imaging apparatus 100 according to this embodiment will be described below with reference to Figure 2.

[0012] The radiation imaging device 100 includes a housing 110 having an incident surface 151 for emitting radiation 200, and a sensor unit 140 housed in the housing 110. The sensor unit 140 includes a support base 123 supported by the housing 110, and a radiation detection panel 129 placed on the support base 123 and configured to detect radiation. The radiation detection panel 129 includes a sensor panel 122 having a plurality of pixels arranged thereon, a scintillator 120 arranged on the sensor panel 122, and a sealing member 121 arranged to cover the scintillator 120. The sensor panel 122 includes an effective pixel area 130 configured by pixels that are capable of detecting light converted from radiation 200 by the scintillator 120. The radiation detection panel 129, or more specifically, the effective pixel area 130, is arranged in the space inside the housing 110 so as to face a back surface 152 of the incident surface 151 of the housing 110. The exterior 110 includes a housing 111 having an opening on an incident surface 151, and a top plate 112 that is arranged to cover the opening and transmits radiation 200.

[0013] Radiation 200, which is emitted from a radiation source and passes through top plate 112, is incident on scintillator 120, and scintillator 120 converts radiation 200 into light. Each of the plurality of pixels arranged on sensor panel 122 includes a photoelectric conversion element (sensor), and the plurality of pixels are arranged, for example, in a matrix. The plurality of pixels may include pixels arranged in effective pixel area 130 that can detect light emitted by scintillator 120 as described above, as well as pixels for detecting noise in a state where no light is incident. Sealing member 121 encases scintillator 120 together with sensor panel 122, and protects scintillator 120 from moisture in the atmosphere and the like.

[0014] The support base 123 supports and fixes the radiation detection panel 129 and other components, and suppresses the effects of deformation due to bending stress and vibration on these components. An electric board 124 is mounted on the support base 123. The electric board 124 can be mounted on the surface of the support base 123 opposite to the surface on which the radiation detection panel 129 is mounted. The electric board 124 is connected to the sensor panel 122 by electrical connection parts (not shown), and controls, for example, the operation of the sensor panel 122. The electric board 124 may also read out electrical signals output from multiple pixels arranged on the sensor panel 122 and convert them into image information. The electric board 124 is not limited to a single member as shown in FIG. 2, but may be divided into multiple members.

[0015] An integrated circuit 125 is provided on the electric board 124 on the side opposite to the sensor panel 122. The integrated circuit 125 is a circuit that controls the operation of the radiation imaging device 100, such as image processing and communication with external devices. The integrated circuit 125 is an example of a circuit that generates a large amount of heat among the circuits arranged on the electric board 124. Natural cooling of the integrated circuit 125 may not be sufficient. In this embodiment, as shown in FIG. 2, the integrated circuit 125 is cooled by connecting a heat transfer member 126 to the integrated circuit 125 and the side of the housing 111 opposite to the incident surface. Here, natural cooling is a cooling method that uses air as a cooling medium, and performs cooling by utilizing natural convection, radiation, and conduction.

[0016] 2 shows one each of the electric substrate 124, the integrated circuit 125, and the heat transfer member 126. However, this is not limiting, and for example, a plurality of electric substrates 124 may be provided, a plurality of integrated circuits 125 may be provided, or a plurality of heat transfer members 126 may be provided. Furthermore, for example, the electric substrate 124, the integrated circuit 125, and the heat transfer member 126 may each be divided into a plurality of pieces.

[0017] Heat generated in the integrated circuit 125 is transferred not only in the direction of arrow 300 through the heat transfer member 126, which is the main cooling path, but also in the direction of the electric board 124. Furthermore, heat generated in the integrated circuit 125 may be transferred from the electric board 124 to the sealing member 121 via the support base 123 and the radiation detection panel 129. If the temperature of the sealing member 121 exceeds its heat resistance temperature, particularly near the end portion 127, a gap may be formed between the sealing member 121 and the sensor panel 122. If moisture or the like from the atmosphere enters through the gap between the sealing member 121 and the sensor panel 122, the scintillator 120 may absorb the moisture and deteriorate. If the scintillator 120 deteriorates, the quality of the image obtained by the radiation imaging device 100 may deteriorate. For example, the user may feel uncomfortable with the obtained image.

[0018] Therefore, in this embodiment, the radiation imaging device 100 includes a heat transfer member 128 that connects the sensor unit 140 to a back surface 152 of the incident surface 151 of the exterior casing 110, through which the radiation 200 is incident. More specifically, the heat transfer member 128 is arranged to connect a surface 153 of the sensor unit 140 that faces the back surface 152 of the incident surface 151 of the exterior casing 110, to the back surface 152 of the incident surface 151 of the exterior casing 110. In the configuration shown in FIG. 2 , the heat transfer member 128 connects a surface of the radiation detection panel 129 of the sensor unit 140 that faces the back surface 152 of the incident surface 151 of the exterior casing 110, to the housing 111 that forms the back surface 152 of the incident surface 151 of the exterior casing 110.

[0019] The heat transfer member 128 may be, for example, a member made of heat-dissipating rubber or a phase-change material, with a thermal conductivity of 1 W / mK or higher. The thermal conductivity of the heat transfer member 128 may be 2 W / mK or higher, or 4 W / mK or higher. The heat-dissipating rubber used in the heat transfer member 128 may be, for example, a rubber member such as a silicone polymer containing alumina. A flame retardant, a pigment, or the like may be added to the silicone polymer. However, the heat-dissipating rubber is not limited to silicone polymer, and other materials may be used as long as they satisfy the following conditions in addition to the thermal conductivity. The phase-change material used in the heat transfer member 128 may be, for example, an organic material using paraffin or a fatty acid, or an inorganic salt. As with the heat-dissipating rubber, any suitable material may be used as the phase-change material as long as they satisfy the following conditions in addition to the thermal conductivity. However, the heat-transfer member 128 is not limited to heat-dissipating rubber or a phase-change material, and any suitable material may be used. Furthermore, for example, grease having the function of reducing contact thermal resistance may be applied to the interface between the heat transfer member 128 and the sensor unit 140 (radiation detection panel 129 in the configuration of FIG. 2). Similarly, grease having the function of reducing contact thermal resistance may be applied to the interface between the heat transfer member 128 and the back surface 152 of the incident surface 151 of the exterior casing 110 (housing 111 in the configuration of FIG. 2). Generally, in the case of natural cooling, the exterior casing 110 is often closer to the ambient temperature than the sensor panel 122, which is an internal component, and heat from the sensor panel 122 can be dissipated to the exterior casing 110.

[0020] 2, the heat transfer member 128 may be in contact with the sensor panel 122 and the sealing member 121 so as to cover the end portion 127 of the sealing member 121. As described above, if the temperature near the end portion 127 of the sealing member 121 exceeds the heat resistance temperature of the sealing member 121, a gap may be generated between the sealing member 121 and the sensor panel 122, which may result in deterioration of the scintillator 120. Therefore, the heat transfer member 128 is arranged so as to abut the end portion 127 of the sealing member 121. This makes it possible to effectively cool the end portion 127 of the sealing member 121 and prevent problems such as the sealing member 121 peeling off from the sensor panel 122.

[0021] FIG. 3 shows the results of a simulation of the effect of the heat transfer member 128 on the configuration of the radiation imaging device 100 shown in FIG. 2. In the simulation, the heat generation amount of the integrated circuit 125 was 10 W, the ambient temperature was 40°C, the support base 123 was made of aluminum alloy, the housing 111 was made of stainless steel, and the top plate 112 was made of carbon fiber reinforced plastic (CFRP). The outer dimensions of the housing 111 were 220 mm × 220 mm × 17 mm (the outer dimensions of the incident surface 151 were 220 mm × 220 mm, and the height of the side surfaces was 17 mm). Analysis was performed on cases where the heat transfer member 128 was not used, where a cushioning material was used as the heat transfer member 128, and where heat dissipation rubber was used as the heat transfer member 128. The thermal conductivity without the heat transfer member 128 was 0.024 W / mK (air), the thermal conductivity of the cushioning material was 0.066 W / mK, and the thermal conductivity of the heat dissipation rubber was 2.1 W / mK. The thermal conductivity of the heat dissipation rubber is 1 W / mK or more.

[0022] Under these conditions, the maximum temperatures of the sensor panel 122 were 78.4°C, 70.6°C, and 61.0°C, respectively, as shown in FIG. 2 . The temperature rises of the sensor panel 122 were 38.4°C, 30.6°C, and 21.0°C, respectively. If the temperature rise rate of the sensor panel 122 without the heat-transfer member 128 is 100%, the temperature rises when the cushioning material was used and the heat-dissipating rubber were 79.7% and 54.7%, respectively. It is known that the temperature of the sensor panel 122 at different ambient temperatures can be roughly estimated by adding the temperature rises under each condition to the ambient temperature. Therefore, it is considered appropriate to compare the effects of the design in terms of the temperature rises, as shown in FIG. 3 . From the above, it was confirmed that the maximum temperature of the sensor panel 122 can be effectively reduced by using the heat-transfer member 128. Furthermore, these results show that by setting the thermal conductivity of the heat transfer member 128 to, for example, about 1 W / mK or higher, heat can be efficiently transferred to the exterior casing 110, thereby suppressing the temperature rise of the sensor panel 122.

[0023] FIG. 4 shows the results of a simulation similar to that described with reference to FIG. 3 , performed on a case where the housing 111 was made of an aluminum alloy, to verify the effect of the heat transfer member 128. The simulation was performed under the same conditions as described above, except for the material of the housing 111. The maximum temperatures of the sensor panel 122 were 64.4°C, 61.6°C, and 56.8°C when the heat transfer member 128 was not used, when a cushioning material was used as the heat transfer member 128, and when a heat-dissipating rubber was used as the heat transfer member 128, respectively. The temperature rises of the sensor panel 122 were 24.4°C, 21.6°C, and 16.8°C, respectively. If the temperature rise of the sensor panel 122 without the heat transfer member 128 is set to 100%, the temperature rises when the cushioning material was used and the heat-dissipating rubber were 88.5% and 68.9%, respectively. From the above, it was confirmed that the maximum temperature of the sensor panel 122 can be effectively reduced by using the heat transfer member 128, even when the housing 111 is made of an aluminum alloy. It has also been found that by setting the thermal conductivity of the heat transfer member 128 to, for example, about 1 W / mK or more, heat is efficiently transferred to the exterior casing 110, and the temperature rise of the sensor panel 122 can be suppressed.

[0024] 3 and 4, it was confirmed that the provision of the heat transfer member 128 improves the efficiency of dissipating heat generated inside the radiation imaging device 100. Furthermore, the effect of the heat transfer member 128 was confirmed whether the material of the housing 111 was stainless steel, which has a relatively low thermal conductivity, or an aluminum alloy, which has a relatively high thermal conductivity.

[0025] 2, heat transfer member 128 is depicted as a single member that covers the outer edge of sensor unit 140 along the outer edge of sensor unit 140, but may be divided into multiple members. Heat transfer member 128 may cover the outer edge of sensor unit 140 continuously or may cover the outer edge of sensor unit 140 discontinuously. For example, heat transfer member 128 may cover the outer edges of two opposing sides of sensor unit 140 in orthogonal projection onto incident surface 151 of exterior casing 110, but may not cover the other two sides.

[0026] Furthermore, heat transfer member 128 may be composed of multiple members between sensor unit 140 and exterior casing 110. Heat transfer member 128 may include a first member in contact with sensor unit 140, a second member in contact with rear surface 152 of incident surface 151 of exterior casing 110, and a third member disposed between the first member and the second member. In this case, a member having a higher thermal conductivity than the first member and the second member is used for the third member. For example, from the viewpoint of hardness (described later), the first member and the second member may be a rubber member such as the heat-dissipating rubber described above, and the third member may be a metal member having a high thermal conductivity.

[0027] In addition to the thermal conductivity, the breakdown voltage and hardness of the heat transfer member 128 must also be considered. From the results shown in FIGS. 3 and 4, it is clear that using a member with higher thermal conductivity reduces the temperatures of the sensor panel 122 and the sealing member 121. On the other hand, if static electricity or the like is applied to the exterior casing 110, a low breakdown voltage of the heat transfer member 128 connecting internal components such as the sensor panel 122 to the exterior casing 110 could lead to damage to the internal components. Therefore, the breakdown voltage of the heat transfer member 128 may be 0.5 kV / mm or higher, 0.7 kV / mm or higher, or even 1.0 kV / mm or higher. In other words, even if the heat transfer member 128 has the layered structure described above, it must function as an insulator with a certain level of breakdown voltage as a whole. Therefore, when using heat-dissipating rubber as the heat transfer member 128, rubber materials containing carbon fiber may not be usable. Furthermore, when a phase change material is used as the heat transfer member 128, for example, an appropriate material may be selected for the package that encloses the phase change material.

[0028] Furthermore, assuming that an impact is applied to the exterior casing 110, it is considered appropriate for the heat transfer member 128 to have a low hardness. This is particularly important when a brittle material such as a glass substrate is used for the sensor panel 122 or when the radiation imaging device 100 is portable. For example, when a rubber member such as a heat-dissipating rubber is used as the heat transfer member 128 as described above, the heat transfer member 128 may have an Asker C hardness of 60 degrees or less. This makes it possible to suppress transmission of the impact to internal components when an impact is applied to the exterior casing 110. The Asker C hardness of the heat transfer member 128 may be, for example, 5 degrees or more, 10 degrees or more, 20 degrees or more, or even 30 degrees or more.

[0029] Furthermore, although the simulation was performed using stainless steel and aluminum alloy as the material for the housing 111, the material is not limited to these. For example, the housing 111 may be made of magnesium alloy, CFRP, resin, or the like.

[0030] FIG. 5 is a cross-sectional view of the radiation imaging device 100 taken along line A-A' in FIG. 1(a) and is a modified example of the cross-sectional view shown in FIG. 2. In the configuration shown in FIG. 5, in an orthogonal projection onto the incident surface 151 of the exterior casing 110 through which radiation 200 is incident, the heat transfer member 128 is disposed so as to straddle the portion of the exterior casing 110 where the top plate 112 is disposed and the portion where the top plate 112 is not disposed. In other words, in an orthogonal projection onto the incident surface 151 of the exterior casing 110, the heat transfer member 128 is disposed so as to straddle the portion of the exterior casing 110 where an opening provided in the housing 111 is disposed and the portion where no opening is disposed. In this case, as shown in FIG. 5, the heat transfer member 128 is in contact with both the housing 111 and the top plate 112. This allows heat from the sensor panel 122 to be transferred over a wider area than in the configuration shown in FIG. 2. As a result, the end 127 of the sealing member 121 can be cooled more effectively.

[0031] On the other hand, heat-dissipating rubber or the like used in heat-transfer member 128 has the property of absorbing radiation 200 to a certain extent. As described above, if heat-transfer member 128 is made by laminating a rubber member such as heat-dissipating rubber and a metal member with high thermal conductivity, the radiation absorption rate may be even higher. For this reason, in orthogonal projection onto incident surface 151 of exterior casing 110, heat-transfer member 128 may be disposed outside effective pixel area 130, which is constituted by pixels that, among the multiple pixels, can detect light converted from radiation by scintillator 120.

[0032] 5, when a rubber material such as heat dissipation rubber is used as the heat transfer member 128, a softer rubber material is more likely to conform to the step between the housing 111 and the top plate 112. Therefore, the Asker C hardness of the heat transfer member 128 may be 30 degrees or less, or may even be 20 degrees or less.

[0033] 6 is a cross-sectional view of the radiation imaging device 100 taken along line A-A' in FIG. 1(a), and is a modified example of the cross-sectional views shown in FIGS. 2 and 5. In the configuration shown in FIG. 6, the support base 123 has a portion that protrudes outward beyond the outer edge of the sensor panel 122 in an orthogonal projection onto the incident surface 151 of the exterior casing 110 through which radiation 200 is incident. In this case, the heat transfer member 128 may be in contact with a portion of the sensor unit 140 where the support base 123 protrudes beyond the sensor panel 122. The portion of the sensor unit 140 where the support base 123 protrudes beyond the sensor panel 122 is a part of a surface 153 of the sensor unit 140 that faces a back surface 152 of the incident surface 151 of the exterior casing 110.

[0034] As described above, the hardness of the heat transfer member 128 is required to be low so as not to transmit impact to internal components such as the sensor panel 122. However, it may not be possible to sufficiently reduce the hardness of the heat transfer member 128 due to the balance between thermal conductivity and breakdown voltage. In such cases, the sensor panel 122 can be protected from damage to internal components due to impact by abutting the heat transfer member 128 against the support base 123, which has higher durability.

[0035] 6, the heat transfer member 128 may be in contact not only with the back surface 152 of the incident surface 151 of the exterior casing 110, but also with the back surface 155 of the side surface 154. This allows the heat of the sensor panel 122 to be transferred over a wider range than in the configurations shown in FIGS. 2 and 5. As a result, the sensor unit 140 can be cooled more effectively.

[0036] As described above, by using the heat transfer member 128 of this embodiment, it is possible to realize the radiation imaging device 100 that can more efficiently discharge heat generated by the sensor unit 140, the electric board 124, the integrated circuit 125, etc. to the outside. Here, the various configurations described above may be combined separately. For example, in the configurations shown in FIGS. 2 and 5, the heat transfer member 128 may be in contact with the back surface 155 of the side surface 154 of the exterior casing 110. Furthermore, in the configuration shown in FIG. 6, the heat transfer member 128 may cover the end of the sealing member 121, or may be in contact with both the housing 111 and the top plate 112.

[0037] An exemplary radiation imaging system incorporating the radiation imaging apparatus 100 will now be described with reference to Fig. 7. X-rays 6060 generated by an X-ray tube 6050, which is a radiation source for irradiating the radiation imaging apparatus 100 with radiation, pass through a chest 6062 of a patient or subject 6061 and enter the radiation imaging apparatus 100. These incident X-rays contain information about the inside of the body of the patient or subject 6061. In the radiation imaging apparatus 100, the scintillator emits light in response to the incidence of the X-rays 6060, which is photoelectrically converted by the conversion element 20 to obtain electrical information. This information is converted into digital data and subjected to image processing by an image processor 6070 serving as a signal processing unit, and can be observed on a display 6080 serving as a display unit in a control room.

[0038] This information can also be transferred to a remote location via a transmission processing unit such as a telephone line 6090. This allows it to be displayed on a display 6081, which is a display unit in a doctor's room or the like at another location, and a doctor at a remote location can make a diagnosis. This information can also be recorded on a recording medium such as an optical disk, and can also be recorded on film 6110, which serves as a recording medium, by a film processor 6100.

[0039] The disclosure of the present specification includes the following radiation imaging apparatus and radiation imaging system.

[0040] (Item 1) an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the incident surface, The radiation imaging device, wherein the heat transfer member connects the sensor unit and the rear surface and has a thermal conductivity of 1 W / mK or more.

[0041] (Item 2) the radiation detection panel includes a sensor panel on which a plurality of pixels are arranged, a scintillator arranged on the sensor panel, and a sealing member arranged to cover the scintillator; 2. The radiation imaging device according to item 1, wherein the heat transfer member is in contact with the sensor panel and the sealing member so as to cover an end of the sealing member.

[0042] (Item 3) the sensor panel has an effective pixel area constituted by pixels among the plurality of pixels that can detect light converted from radiation by the scintillator, 3. The radiation imaging device according to item 2, wherein the heat transfer member is disposed outside the effective pixel area in an orthogonal projection onto the incident surface.

[0043] (Item 4) the sensor unit further includes a support base supported by the exterior, the radiation detection panel being placed on the support base; 2. The radiation imaging apparatus according to item 1, wherein the heat transfer member is in contact with the support base.

[0044] (Item 5) the exterior includes a housing having an opening on the incident surface, and a top plate that is disposed to cover the opening and transmits radiation, The radiation imaging device described in any one of items 1 to 4, characterized in that, in an orthogonal projection onto the incident surface, the heat transfer member is arranged so as to straddle a portion where the top plate is arranged and a portion where the top plate is not arranged.

[0045] (Item 6) 6. The radiation imaging device according to item 5, wherein, in an orthogonal projection onto the incident surface, the heat transfer member is arranged so as to straddle a portion where the opening is arranged and a portion where the opening is not arranged.

[0046] (Item 7) 7. The radiation imaging device according to item 5 or 6, wherein the heat transfer member is in contact with the housing and the top plate.

[0047] (Item 8) 8. The radiation imaging device according to any one of items 1 to 7, wherein the heat transfer member has a breakdown voltage of 0.5 kV / mm or more.

[0048] (Item 9) 9. The radiation imaging device according to any one of items 1 to 8, wherein the heat transfer member is further in contact with the rear surface of the side surface of the exterior.

[0049] (Item 10) 10. The radiation imaging device according to any one of items 1 to 9, wherein the heat transfer member is a rubber member containing silicone and alumina.

[0050] (Item 11) 11. The radiation imaging device according to any one of items 1 to 10, wherein the heat transfer member has an Asker C hardness of 10 degrees or more and 60 degrees or less.

[0051] (Item 12) the heat transfer member includes a first member in contact with the sensor unit, a second member in contact with the rear surface, and a third member disposed between the first member and the second member; 10. The radiation imaging device according to any one of items 1 to 9, wherein the third member has a higher thermal conductivity than the first member and the second member.

[0052] (Item 13) the first member and the second member are rubber members containing silicone and alumina, Item 13. The radiation imaging apparatus according to item 12, wherein the third member is a metal member.

[0053] (Item 14) 14. The radiation imaging device according to item 12 or 13, wherein the first member and the second member have an Asker C hardness of 10 degrees or more and 60 degrees or less.

[0054] (Item 15) an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in a space inside the exterior packaging so as to face a surface opposite to the incident surface of the exterior packaging, and includes a sensor panel having a plurality of pixels arranged thereon, a scintillator arranged on the sensor panel, and a sealing member arranged so as to cover the scintillator; The radiation imaging apparatus, wherein the heat transfer member connects the sensor unit to the rear surface and is in contact with the sensor panel and the sealing member so as to cover an end of the sealing member.

[0055] (Item 16) an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the exterior that is opposite the incident surface, the exterior includes a housing having an opening on the incident surface, and a top plate that is disposed to cover the opening and transmits radiation, The radiation imaging apparatus, wherein the heat transfer member connects the sensor unit to the rear surface and is in contact with the housing and the top plate.

[0056] (Item 17) an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior; A radiation imaging device comprising: the sensor unit includes a support base supported by the exterior, and a radiation detection panel placed on the support base and configured to detect radiation; the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the exterior that is opposite the incident surface, The radiation imaging apparatus is characterized in that the heat transfer member connects the support base and the rear surface.

[0057] (Item 18) an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the exterior that is opposite the incident surface, The radiation imaging apparatus, wherein the heat transfer member connects the sensor unit, the rear surface of the incident surface, and the rear surfaces of the side surfaces of the exterior.

[0058] (Item 19) A radiation imaging device according to any one of items 1 to 18, a signal processing unit that processes a signal output from the radiation imaging device; A radiation imaging system comprising:

[0059] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0060] 100: Radiation imaging device, 110: Exterior, 128: Heat transfer member, 129: Radiation detection panel, 140: Sensor unit, 151: Incident surface, 152: Rear surface

Claims

1. an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the incident surface, The radiation imaging apparatus is characterized in that the heat transfer member connects the sensor unit and the rear surface and has a thermal conductivity of 1 W / mK or more.

2. the radiation detection panel includes a sensor panel on which a plurality of pixels are arranged, a scintillator arranged on the sensor panel, and a sealing member arranged to cover the scintillator; 2. The radiation imaging apparatus according to claim 1, wherein the heat transfer member is in contact with the sensor panel and the sealing member so as to cover an end portion of the sealing member.

3. the sensor panel has an effective pixel area constituted by pixels among the plurality of pixels that can detect light converted from radiation by the scintillator, 3. The radiation imaging apparatus according to claim 2, wherein the heat transfer member is disposed outside the effective pixel area in an orthogonal projection onto the incident surface.

4. the sensor unit further includes a support base supported by the exterior, the radiation detection panel being placed on the support base; 2. The radiation imaging apparatus according to claim 1, wherein the heat transfer member is in contact with the support base.

5. the exterior includes a housing having an opening on the incident surface, and a top plate that is disposed to cover the opening and transmits radiation, 2. The radiation imaging device according to claim 1, wherein, in an orthogonal projection onto the incident surface, the heat transfer member is arranged so as to straddle a portion where the top plate is arranged and a portion where the top plate is not arranged.

6. 6. The radiation imaging device according to claim 5, wherein, in an orthogonal projection onto the incident surface, the heat transfer member is arranged so as to straddle a portion where the opening is arranged and a portion where the opening is not arranged.

7. 6. The radiation imaging apparatus according to claim 5, wherein the heat transfer member is in contact with the housing and the top plate.

8. 2. The radiation imaging apparatus according to claim 1, wherein the heat transfer member has a breakdown voltage of 0.5 kV / mm or more.

9. 2. The radiation imaging apparatus according to claim 1, wherein the heat transfer member is in contact with the rear surface of the side surface of the exterior.

10. 2. The radiation imaging apparatus according to claim 1, wherein the heat transfer member is a rubber member containing silicone and alumina.

11. 2. The radiation imaging apparatus according to claim 1, wherein the heat transfer member has an Asker C hardness of 10 degrees or more and 60 degrees or less.

12. the heat transfer member includes a first member in contact with the sensor unit, a second member in contact with the rear surface, and a third member disposed between the first member and the second member; 2. The radiation imaging apparatus according to claim 1, wherein the third member has a higher thermal conductivity than the first member and the second member.

13. the first member and the second member are rubber members containing silicone and alumina, 13. The radiation imaging apparatus according to claim 12, wherein the third member is a metal member.

14. 13. The radiation imaging apparatus according to claim 12, wherein the first member and the second member have an Asker C hardness of 10 degrees or more and 60 degrees or less.

15. an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in a space inside the exterior packaging so as to face a surface opposite to the incident surface of the exterior packaging, and includes a sensor panel having a plurality of pixels arranged thereon, a scintillator arranged on the sensor panel, and a sealing member arranged so as to cover the scintillator; The radiation imaging apparatus, wherein the heat transfer member connects the sensor unit to the rear surface and is in contact with the sensor panel and the sealing member so as to cover an end of the sealing member.

16. an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the exterior that is opposite the incident surface, the exterior includes a housing having an opening on the incident surface, and a top plate that is disposed to cover the opening and transmits radiation, The radiation imaging apparatus, wherein the heat transfer member connects the sensor unit to the rear surface and is in contact with the housing and the top plate.

17. an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior; A radiation imaging device comprising: the sensor unit includes a support base supported by the exterior, and a radiation detection panel placed on the support base and configured to detect radiation; the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the exterior that is opposite the incident surface, The radiation imaging apparatus is characterized in that the heat transfer member connects the support base and the rear surface.

18. an exterior having an incident surface for allowing radiation to enter; a sensor unit housed in the exterior, the sensor unit including a radiation detection panel for detecting radiation; A radiation imaging device comprising: the radiation detection panel is disposed in the space inside the exterior so as to face the rear surface of the exterior that is opposite the incident surface, The radiation imaging apparatus, wherein the heat transfer member connects the sensor unit, the rear surface of the incident surface, and the rear surfaces of the side surfaces of the exterior.

19. A radiation imaging device according to any one of claims 1 to 18; a signal processing unit that processes a signal output from the radiation imaging device; A radiation imaging system comprising:

Images