Method, processing apparatus, and storage medium

Abstract

To appropriately calculate a heat load of a building.SOLUTION: A method of calculating a heat load in a building having therein a heat supply unit that supplies heat, the method comprising: modeling the heat supply unit by a first element; setting all of a reflectance of light, a transmittance of light, and a coefficient of overall heat transmission in the first element to zero; and setting a heat quantity generated by the first element to a same value as a heat quantity generated by the heat supply unit.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method, a processing device or a program. [Background technology]

[0002] As prior art, devices, programs, etc. for performing dynamic heat load calculations are known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-101880 [Non-patent literature]

[0004] [Non-Patent Document 1] "HASP (Building Services and Building Engineering Society)"<URL: https: / / www.jabmee.or.jp / hasp / > (Retrieved June 6, 2024) Summary of the Invention [Problem to be solved by the invention]

[0005] In the prior art, if a building uses a heat source such as a radiant panel, it is difficult to properly perform a heat load calculation for the building. [Means for solving the problem]

[0006] In view of the above problems, one aspect of the present invention provides a method for calculating the heat load in a building having a heat supply unit therein that supplies heat, the method including the steps of: modeling the heat supply unit using a first element; setting the light reflectance, light transmittance, and overall heat transmittance of the first element to zero; and setting the amount of heat generated by the first element to the same value as the amount of heat generated by the heat supply unit.

[0007] In addition, one aspect of the present invention provides a processing device that executes this method, and a program that causes the processing device to execute the method. [Effects of the Invention]

[0008] According to the present invention, the heat load of a building can be calculated appropriately. [Brief explanation of the drawings]

[0009] [Figure 1] 1A and 1B are diagrams illustrating a hardware configuration and a functional configuration (software configuration) of an information processing device according to an embodiment. [Figure 2] FIG. 1 is a schematic diagram of a building according to an embodiment. [Figure 3] 1A is a diagram showing a building model in an embodiment, and FIG. 1B is a diagram showing a heat balance equation based on the model. [Figure 4] FIG. 2 is an explanatory diagram of a building model according to an embodiment. [Figure 5] 1 is a flowchart illustrating a process according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] 〔composition〕 1(a) shows the configuration of an information processing device 100 according to one embodiment of the present invention. The information processing device 100 is used for calculating the dynamic heat load of a building.

[0011] 1(a), an information processing device 100 includes a processor 101, a main memory device 102, an auxiliary memory device 103, an input device 104, an output device 105, and a communication device 106. These are connected to each other so as to be able to communicate with each other via communication means such as a bus (not shown).

[0012] It should be noted that the information processing device 100 does not necessarily have to be entirely realized by hardware, and all or part of the configuration may be realized by virtual resources such as a cloud server of a cloud system. Also, the information processing device 100 does not necessarily have to be configured by a single device.

[0013] The processor 101 is configured using a CPU (Central Processing Unit), an MPU (Micro Processing Unit), etc. The processor 101 reads and executes a program stored in a main memory device 102, thereby realizing the functions of the server 10 and the terminal 20.

[0014] The main storage device 102 is a device that stores programs and data, and is a ROM (Read Only Memory), a RAM (Random Access Memory), a non-volatile semiconductor memory (NVRAM (Non-Volatile RAM)), etc. The auxiliary storage device 103 is various non-volatile memories (NVRAMs) such as an SSD (Solid State Drive) or an SD memory card, a hard disk drive, an optical storage device (CD (Compact Disc), DVD (Digital Versatile Disc), etc.), a storage area of ​​a cloud server, etc.

[0015] The input device 104 is an interface that accepts input of information, and is, for example, a keyboard, a mouse, a touch panel, a card reader, a voice input device (such as a microphone), a voice recognition device, etc. The information processing device 100 may be configured to accept input of information between itself and another device via the communication device 106.

[0016] The output device 105 is an interface that outputs various types of information, and is, for example, a screen display device (such as a liquid crystal monitor, LCD (Liquid Crystal Display), or graphic card), a printer, an audio output device (such as a speaker), or an audio synthesizer. The information processing device 100 may be configured to output information to and from other devices via the communication device 106. The output device 105 corresponds to the display unit of the present invention.

[0017] The communication device 106 is a wired or wireless communication interface that enables communication with other devices via the network 5, such as a NIC (Network Interface Card), a wireless communication module, a USB (Universal Serial Interface) module, a serial communication module, etc.

[0018] [Functional configuration] 1B shows the main functional configuration of the information processing device 100. As shown in the figure, the information processing device 100 includes a storage unit 110 and a management unit 120.

[0019] The management unit 120 includes a first management unit 121 and a second management unit 122. The first management unit 121 and the second management unit 122 are functional units activated by different programs.

[0020] Specific examples of the program that activates the first management unit 121 include HASP and New HASP, which are programs provided by the Japan Association of Building Mechanical Engineers (Non-Patent Document 1). In the embodiment, the first management unit 121 calculates the heat gain of each element that constitutes a building, and calculates the annual heat load of the building.

[0021] The second management unit 122 is a functional unit for performing detailed calculations of elements used in heat load calculations, unlike the first management unit 121. For example, it is used to consider nonlinearity of the thermophysical properties of elements, detailed physical properties that cannot be considered by the first management unit 121, and / or to analyze and calculate heat balance equations.

[0022] The memory unit 110 has a function of storing the calculation results, correction values, and the like obtained by the first management unit 121 and the second management unit 122. The first management unit 121 and the second management unit 122 can exchange the calculation results, correction values, and the like with each other via a data file F stored in the memory unit 110. The data stored in the data file F includes input values, correction values, and calculation values ​​required for heat load calculation, including heat gain and heat removal weighting coefficients.

[0023] [Computational model] (thermal balance formula) The information processing device 100 having the above configuration is mainly used for dynamic heat load calculation of a building B having a heat supply unit G such as a radiant panel or a floor heating device. An example of the building B is shown in FIG.

[0024] Building B has a heat supply unit G and rooms R2 and R3, which are partitioned by the heat supply unit G. The heat supply unit G is a component that constitutes the ceiling or floor of the living room, and supplies heat (including cold) to room R3, functioning as a heating and cooling device for room R3. Note that the heat supply unit G is not limited to a floor or ceiling, and may also be a component such as a wall or window.

[0025] In the information processing device 100, a building B (FIG. 2) having a heat supply unit G is converted into a model MB for heat load calculation, and a heat load calculation is performed. As shown in FIG. 3(a), the model MB includes an element 1 that models the heat supply unit G, and rooms 2 and 3 (corresponding to rooms R2 and R3) partitioned by the element 1.

[0026] As shown in Figure 3(b), each element constituting the model MB can be represented by nodes (nodes) indicated by black circles in the figure and edges (branches) connecting the nodes. Each edge is assigned a thermal conductivity α based on the air temperature and radiation temperature of rooms 2 and 3, and the physical properties of the heat supply part G (element 1). r0 ~α r1 , heat transfer coefficient α c0 ~α c1are assigned. Each edge has the function of transferring or conducting heat between nodes according to the assigned thermal conductivity or thermal transfer coefficient. Note that model MB is merely an example of modeling for building B, and various other modeling methods are possible.

[0027] In model MB, heat q given to element 1 p is the same as the amount of heat input to the heat supply section G. Also, the surface temperature t p is the same surface temperature as the heat supply section G.

[0028] Furthermore, the average radiant temperature t r0 , t r1 , and air temperature t a0 , t a1 Taking this into consideration, the heat balance equations can be set as equations (1) to (6) in Figure 3(b) for the node corresponding to element 1. By solving these equations, it is possible to calculate the heat gains in rooms 2 and 3.

[0029] (Modeling) When performing heat load calculations using HASP or New HASP, i.e., the functions of the first management unit 121, it is desirable to perform modeling as shown in Fig. 4. Specifically, in model MB, element 1 is set as a composite of two window elements 11A and 11B and two interior wall elements 12A and 12B. In other words, the performance of element 11 is set as a composite of the performance of multiple elements, namely, the interior wall elements 12A and 12B and the window elements 11A and 11B.

[0030] Window element 11A is an element arranged on the non-air-conditioned side (room 2 side), and window element 11B is an element arranged on the air-conditioned side (room 3 side). Similarly, inner wall element 12A is an element arranged on the non-air-conditioned side (room 2 side), and inner wall element 12B is an element arranged on the air-conditioned side (room 3 side).

[0031] Window elements 11A and 11B are set as elements that only acquire and generate heat. Therefore, the thermal transmittance of window elements 11A and 11B is set to 0 (zero). The solar transmittance and reflectance of window elements 11A and 11B are also set to zero.

[0032] The heat gain of the window element 11A is set to a value equal to the amount of heat generated on the side of the room R2 by the heat supply unit G. The heat gain of the window element 11B is set to a value equal to the amount of heat generated on the side of the room R3 by the heat supply unit G.

[0033] The inner wall elements 12A and 12B are set as elements that only transmit heat. Therefore, the inner wall elements 12A and 12B are set as elements that do not gain or generate heat. Furthermore, the inner wall elements 12A and 12B are set as elements that do not transmit solar radiation, i.e., elements with a solar radiation transmittance of zero.

[0034] The respective heat transmission coefficients of the inner wall elements 12A and 12B are set to values ​​equal to the actual heat transmission coefficient of the heat supply section G. In other words, the heat transmission coefficient of the inner wall element 12A is equal to the heat transmission coefficient on the chamber R2 side of the heat supply section G. Also, the heat transmission coefficient of the inner wall element 12B is equal to the heat transmission coefficient on the chamber R3 side of the heat supply section G.

[0035] By implementing this modeling, it is possible to carry out heat load calculations by directly using elements such as windows and interior walls that have traditionally been used in HASP and New HASP.

[0036] [Calculation processing] An example of heat load calculation using the model MB configured as above will be described below with reference to the flow chart of FIG.

[0037] The second management unit 122 calculates the heat gain of the element 1 and the rooms 2 and 3 based on the thermal properties of the element 1 (window elements 11A and 11B) (S1).

[0038] More specifically, the second management unit 122 calculates the heat gain in room 2 based on equations (3) and (4). Furthermore, the second management unit 122 calculates the heat gain in room 3 based on equations (5) and (6). When explained in relation to the model of Fig. 4, this is equivalent to calculating the heat gain in rooms 2 and 3 caused by the window elements 11A and 11B, which are responsible for heat gain and generation.

[0039] In addition, the second management unit 122 calculates (S3) the heat removal weighting coefficients of the inner wall elements 12A and 12B relative to the heat removal weighting coefficients relative to room temperature fluctuations in each of the rooms 2 and 3. Specifically, the second management unit 122 calculates (S3) the heat removal weighting coefficients relative to room temperature fluctuations in the rooms 2 and 3 in which the inner wall elements 12A and 12B are arranged at the position of the heat supply unit G.

[0040] The second management unit 122 transfers the necessary calculation parameters, correction values, and calculation values, including the heat gain and heat removal weighting coefficients, to the first management unit 121 via the data file F stored in the storage unit 110 (S5). Specifically, the second management unit 122 saves the calculation results in the data file F, and the first management unit 121 reads the data file F, thereby executing the transfer of the calculation results.

[0041] In the next process S7, the first management unit 121 calculates the thermal load of element 1 and rooms 2 and 3 that make up the model MB using input values ​​required for thermal load calculation, such as HASP-type weather data, as well as correction values ​​and calculation values ​​such as heat gain and heat removal weighting coefficients received via the data file F.

[0042] Specifically, the first management unit 121 replaces the heat gains of rooms 2 and 3 used in the internal calculations with the heat gains of rooms 2 and 3 calculated by the second management unit 122. By performing this process, it becomes possible to calculate the heat load based on heat gains calculated in detail using the heat balance equation. Explaining this in relation to the model in Figure 4, this is the same as calculating the heat gains of rooms 2 and 3 as heat gains caused by window elements 11A and 11B, respectively.

[0043] In addition, the first management unit 121 reads the weighting coefficients of heat removal amount for room temperature fluctuations from the data file F and corrects the weighting coefficients of heat removal amount for room temperature fluctuations in rooms 2 and 3. The first management unit 121 calculates the heat transmission through the interior wall elements 12A and 12B using the corrected weighting coefficients of heat removal amount and the heat gains of rooms 2 and 3.

[0044] No heat flows through window elements 11A and 11B, which have a thermal conductivity of zero. On the other hand, interior wall elements 12A and 12B are set to have a thermal conductivity equal to that of heat supply section G. Therefore, the thermal load flowing through the area around element 1 (heat supply section G) can be calculated appropriately using interior wall elements 12A and 12B.

[0045] It should be noted that the average radiation temperature and air temperature may require repeated calculations because they are affected by the heat generated in the past by element 1. In this case, the heat load calculation results are used again as the input conditions for step S1, and the processes of S1 to S7 are repeated until they converge at each time.

[0046] By carrying out the above-mentioned calculations, the first management unit 121 and the second management unit 122 calculate the annual heat load for each time of day in the model MB, and output the obtained calculation results.

[0047] 〔effect〕 (Aspect 1) In the above embodiment, a method for calculating the heat load in a building B having a heat supply unit G therein that supplies heat is shown, which includes a process of modeling the heat supply unit G using window elements 11A and 11B (corresponding to the first element), a process of setting the light reflectance, transmittance, and heat transmittance of the window elements 11A and 11B to zero, and a process of setting the amount of heat generated by the window elements 11A and 11B to the same value as the amount of heat generated by the heat supply unit G.

[0048] In this way, the heat load calculation is performed by modeling the heat supply section G using the window elements 11A and 11B, and setting the reflectance, transmittance, and heat quantity as described above. As a result, the heat load calculation using the model MB is performed appropriately, and the heat load in the building B can be properly simulated.

[0049] (Aspect 2) The method of aspect 1 further includes a process (S1, corresponding to the first calculation process) of calculating the heat gain in model MB (i.e., building B) by elements 11A and 11B by solving the heat balance equations (1)-(6), and a process (S7, corresponding to the second calculation process) of calculating the heat load in model MB or building B using this heat gain.

[0050] By solving the heat balance equation as in the above configuration, it is possible to accurately calculate the heat gain by element 1. Using the obtained heat gain, an accurate heat load calculation is possible.

[0051] (Mode 3) In any of the methods of modes 1 and 2, in step S7, the heat supply section G is modeled using inner wall elements 12A and 12B in addition to the window elements 11A and 11B, and is defined as element 1. The thermal conductivity of the inner wall elements 12A and 12B is set to the same value as the thermal conductivity of the heat supply section G.

[0052] As in the above configuration, by modeling the heat supply section G as a composite element 1 of the inner wall elements 12A, 12B and the window elements 11A, 11B, it is possible to calculate the detailed heat gain and also accurately simulate the heat transfer in the heat supply section G.

[0053] Furthermore, with the above configuration, it is possible to directly use elements such as windows and interior walls that have been used in programs such as HASP to perform heat load calculations.

[0054] (Embodiment 4) In any of the methods of embodiments 1 to 3, in step S7, the heat load is calculated by further taking into account the heat transfer in the inner wall elements 12A and 12B.

[0055] As in the above configuration, by modeling the heat supply section G as a composite element 1 of the inner wall elements 12A, 12B and the window elements 11A, 11B, it is possible to calculate the detailed heat gain and also accurately simulate the heat transfer in the heat supply section G.

[0056] (Aspect 5, Aspect 6) The above embodiment presents the information processing device 100 that implements the method of any one of aspects 1 to 4, and a program that the information processing device 100 executes.

[0057] [Modification] It is possible to set additional functions and performance for the heat supply unit G. For example, if the heat supply unit G is an air-permeable member such as an openable window, it is possible to give the interior wall elements 12A, 12B or the window elements 11A, 11B the ability to transmit air, and to add the effects of air permeation and the resulting heat transfer to the heat load calculation. [Explanation of symbols]

[0058] Element 1, window elements 11A and 11B, inner wall elements 12A and 12B Building B, rooms R2, R3 Model MB, Room 2, Room 3 Information processing device 100

Claims

1. A method for calculating the heat load in a building having a heat supply unit therein that supplies heat, modeling the heat supply unit by a first element; A process for reducing the light reflectance, light transmittance, and heat transmittance of the first element to zero; A process of setting the amount of heat generated by the first element to be equal to the amount of heat generated by the heat supply unit; A method comprising:

2. a first calculation process for solving a heat balance equation in the building to calculate heat gain in the building due to the first element; a second calculation process for calculating a heat load in the building using the heat gain; The method of claim 1 further comprising:

3. The second calculation process includes: a process of modeling the heat supply unit by further adding a second element different from the first element; A process of making the heat transmission coefficient of the second element the same as the heat transmission coefficient of the heat supply part; A treatment to set the heat transmittance of the first element to zero; The method of claim 2 , comprising:

4. The second calculation process includes: Calculating the heat load by further using the heat flux of the second element. The method of claim 3.

5. A processing device for carrying out the method according to any one of claims 1 to 4.

6. A program for causing a processing device to execute the method according to any one of claims 1 to 4.

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