Case, temperature sensor unit, temperature sensor system, and infrared sensor

The case with a monitoring hole and fluid supply system effectively prevents dust from adhering to the infrared sensor's light receiving window, ensuring reliable flame detection.

JP2026012974APending Publication Date: 2026-01-28NOHMI BOSAI LTD
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Patent Information

Application Number
JP2024113071
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-07-16
Publication Date
2026-01-28

AI Technical Summary

Technical Problem

Dust adherence to the light receiving window of an infrared sensor reduces flame detection performance in existing flame detectors.

Method used

A case with a monitoring hole and a fluid supply system that forms a flow path to spray fluid, preventing dust from adhering to the light receiving window.

Benefits of technology

Prevents dust from adhering to the light receiving window, maintaining effective flame detection performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

To prevent dust from adhering to the light receiving window of an infrared sensor.SOLUTION: A case for housing an infrared sensor, comprising: a monitoring hole formed so that a light receiving portion of the housed infrared sensor can be seen; and a first supply port to which a tube for supplying a fluid into the case is connected, wherein a flow path for ejecting the fluid supplied from the tube from the monitoring hole is formed between the case and the housed infrared sensor.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present invention relates to a case, a temperature sensor unit, a temperature sensor system, and an infrared sensor. [Background technology]

[0002] Patent document 1 relates to a flame detector that detects flames by capturing light of a wavelength specific to the flame, and in particular describes a flame detector that has a function for detecting dirt on the protective glass that covers the light-receiving window in front of the light-receiving element that detects the flame. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-51523 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned flame detector, if dust adheres to the protective glass covering the light receiving window, the flame detection performance will be reduced. The present invention has been made in view of the above circumstances, and has as its object to prevent dust from adhering to the light receiving window of an infrared sensor. [Means for solving the problem]

[0005] In order to solve the above problems, the case of the present invention is a case for housing an infrared sensor, and has a monitoring hole formed so that the light receiving part of the housed infrared sensor can be seen through, and a first supply port to which a tube for supplying fluid into the case is connected, and a flow path is formed between the housed infrared sensor and the monitoring hole for spraying the fluid supplied from the tube out of the monitoring hole. [Effects of the Invention]

[0006] According to the present invention, it is possible to prevent dust from adhering to the light receiving window of the infrared sensor. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a front view of an example of a temperature sensor unit 100. As shown in FIG. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a schematic diagram showing an example of the appearance of the temperature sensor 201. As shown in FIG. [Figure 5] FIG. 5 shows an example of a mechanism for measuring the degree of contamination of the light receiving window 404. In FIG. [Figure 6] FIG. 6 is a front view of an example of a temperature sensor 600. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. [Figure 9] FIG. 9 is a schematic diagram showing an example of the external appearance of the internal board box 701. As shown in FIG. [Figure 10] FIG. 10 shows an example of the configuration of a temperature sensor system 1000. [Figure 11] FIG. 11 is a front view of an example of the temperature sensor unit 1001. As shown in FIG. [Figure 12] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. [Figure 13] FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. [Figure 14] FIG. 14 shows an example of the configuration of the control panel 1002. DETAILED DESCRIPTION OF THE INVENTION

[0008] An embodiment of the present invention will be described with reference to the drawings. 1. First Example 1 to 3 are schematic diagrams showing an example of the configuration of the temperature sensor unit 100. Fig. 1 is a front view of the temperature sensor unit 100, Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1, and Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Note that in Figs. 2 and 3, cross-sectional lines are drawn only for the box 101.

[0009] The temperature sensor unit 100 is generally composed of a box 101, a temperature sensor 201 housed in the box 101, and a wiring box 202.

[0010] Box 101 has a rectangular parallelepiped shape and is a case that houses temperature sensor 201. Box 101 has a circular monitoring hole 102 approximately in the center of its front panel. Monitoring hole 102 is formed so that light receiving portion 208 of temperature sensor 201 can be seen through it.

[0011] The box 101 also has, on its side panel, an opening 107 (not shown) for inserting the wiring 103 extending from the temperature sensor 201, and an opening 108 (not shown) which is a supply port for connecting a resin tube 106 to the box 101. A cable gland 104 is attached to the opening 107.

[0012] On the other hand, one end of a speed controller 105 is attached to the opening 108. This speed controller 105 is a manual speed control valve, and the other end of the speed controller 105 is connected to a tube 106. This tube 106 is a pipe for supplying a fluid (air in this embodiment as an example) into the box 101. Note that the installation of the speed controller 105 is not essential.

[0013] The temperature sensor 201 is an infrared radiation type temperature sensor having a substantially rectangular parallelepiped shape. The temperature sensor 201 is an example of an infrared sensor for detecting fires. The detailed configuration of the temperature sensor 201 will be described later.

[0014] The wiring box 202 has a rectangular parallelepiped shape and accommodates the wiring 103 extending from the back surface of the temperature sensor 201. The wiring box 202 is attached to the back panel of the temperature sensor 201.

[0015] The wiring box 202 has an opening 204 (not shown) in its side wall for inserting the wiring 103. A cable gland 203 is attached to this opening 204. The wiring 103 inserted into this opening 204 is further inserted into an opening 107 of the box 101 and is drawn out to the outside of the temperature sensor unit 100. The wiring 103 drawn out to the outside is connected to, for example, an alarm panel.

[0016] The rear panel of wiring box 202 is attached to mounting base 206 via a plurality of columnar spacers 205. Mounting base 206 is a rectangular plate and is attached to the rear panel of box 101. Therefore, wiring box 202 and temperature sensor 201 attached to it are fixed in position within box 101.

[0017] A flow path 207 for air supplied from the tube 106 is formed between the front plate of the temperature sensor 201, which is fixed in position, and the front plate of the box 101. This flow path 207 is a flow path for blowing out the air supplied from the tube 106 from the monitoring hole 102.

[0018] Next, a description will be given of the configuration of temperature sensor 201. Figure 4 is a schematic diagram showing an example of the appearance of temperature sensor 201.

[0019] The temperature sensor 201 is composed of a rectangular parallelepiped housing 401 and a temperature sensor substrate 402 (not shown) housed in the housing 401.

[0020] Housing 401 has a circular opening 403 at approximately the center of its front panel. This opening 403 is formed so that light receiving unit 208 of temperature sensor substrate 402 can be seen through it. In addition, this opening 403 is closed by a light receiving window 404 made of silicon glass. This light receiving window 404 is a transparent flat plate that transmits infrared light, and protects light receiving unit 208 from being directly exposed to the outside and becoming dirty or damaged. The material of the light receiving window 404 may be other than silicon glass (for example, sapphire glass, borosilicate glass, quartz glass, etc.).

[0021] The temperature sensor board 402 is equipped with a processor, memory, an infrared array sensor, a transmittance measurement module, etc. (all not shown). Of these, the transmittance measurement module is a means for measuring the light transmittance (in other words, the degree of contamination) of the light receiving window 404. This module is composed of a light source 501 and a light receiving element 502.

[0022] 5 shows an example of a mechanism for measuring the degree of contamination of the light receiving window 404. The mechanism shown in the figure is composed of the light receiving window 404, a light source 501, a light receiving element 502, and a reflector 503.

[0023] In this configuration, light emitted from light source 501 passes through light receiving window 404, is reflected by reflector 503, and is received by light receiving element 502. Light receiving element 502 outputs a voltage value corresponding to the reflected light it receives. This voltage value reflects the light transmittance of light receiving window 404 (in other words, the degree of contamination).

[0024] Next, the functions realized by the processor will be described. The processor executes the programs stored in the memory to realize the abnormal temperature detection function and the contamination detection function. Of these, the abnormal temperature detection function is a function that detects abnormal temperatures based on the voltage value output from the infrared array sensor. On the other hand, the contamination detection function is a function that detects contamination based on the voltage value output from the light receiving element 502. The detection results of both functions are output via wiring 103 to, for example, an alarm panel. The above is a description of the configuration of the temperature sensor unit 100.

[0025] As mentioned above, the temperature sensor unit 100 described above has the speed controller 105. The other end of this speed controller 105 is connected to a tube 106, and air is supplied into the box 101 through this tube 106. As a result, the inside of the box 101 becomes positive pressure.

[0026] The air supplied into the box 101 passes through a flow path 207 formed between the box 101 and the temperature sensor 201 and is ejected to the outside through the monitoring hole 102 (see the arrows in FIGS. 2 and 3). As a result, the intrusion of external dust into the box 101 is prevented, and external dust can be prevented from adhering to the light receiving window 404.

[0027] 2. Second Example In the first embodiment, an air flow path 207 is formed between the box 101 and the temperature sensor 201. Alternatively, an air flow path may be formed between the housing of the temperature sensor 201 and an internal substrate box housed in the housing. In this embodiment, costs can be reduced because the box 101 and the temperature sensor 201 can be integrated. This embodiment will be described below.

[0028] Figures 6 to 8 are schematic diagrams showing an example of the configuration of temperature sensor 600. Figure 6 is a front view of temperature sensor 600, Figure 7 is a cross-sectional view taken along line VII-VII in Figure 6, and Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 6. Note that in Figures 7 and 8, cross-sectional lines are drawn only for housing 601.

[0029] The temperature sensor 600 is an infrared radiation type temperature sensor having a substantially rectangular parallelepiped shape. The temperature sensor 600 is an example of an infrared sensor for fire detection. The temperature sensor 600 is generally composed of a housing 601 and an internal board box 701 housed in the housing 601.

[0030] The housing 601 has a rectangular parallelepiped shape and is a case that houses the internal board box 701. The housing 601 has a circular monitoring hole 602 in approximately the center of its front panel. The monitoring hole 602 is formed so that the light receiving unit 706 of the internal board box 701 can be seen through it.

[0031] Furthermore, the housing 601 has an opening 703 on its rear panel for passing through a wire 702 extending from the internal board box 701. The wire 702 passed through this opening 703 is connected to, for example, an alarm panel via a wiring box (not shown).

[0032] Furthermore, the housing 601 has an opening 604 (not shown) on its side panel, which is a supply port for connecting a resin tube 605 to the housing 601. One end of a speed controller 603 is attached to this opening 604. The speed controller 603 is a manual speed control valve, and the other end is connected to a tube 605. The tube 605 is a pipe for supplying a fluid (air in this embodiment as an example) into the housing 601. Note that the installation of the speed controller 603 is not essential.

[0033] The internal board box 701 has a rectangular parallelepiped shape and is a case that houses a temperature sensor board 902. This temperature sensor board 902 is an example of an infrared sensor board. The rear plate of the internal substrate box 701 is attached to the rear plate of the housing 601 via a plurality of columnar spacers 704. This fixes the position of the internal substrate box 701 within the housing 601.

[0034] A flow path 705 for air supplied from tube 605 is formed between the front plate of internal substrate box 701, which is fixed in position, and the front plate of housing 601. This flow path 705 is a flow path for blowing out the air supplied from tube 605 from monitoring hole 602.

[0035] Next, a description will be given of the configuration of the internal board box 701. Fig. 9 is a schematic diagram showing an example of the external appearance of the internal board box 701.

[0036] The internal board box 701 is composed of a rectangular parallelepiped box 901 and a temperature sensor board 902 (not shown) housed in the box 901.

[0037] Box 901 has a circular opening 903 approximately in the center of its front panel. This opening 903 is formed so that light receiving unit 706 of temperature sensor substrate 902 can be seen through it. In addition, this opening 903 is closed by a light receiving window 904 made of silicon glass. This light receiving window 904 is a transparent flat plate that transmits infrared light, and protects light receiving unit 706 from being directly exposed to the outside and becoming dirty or damaged. The material of the light receiving window 904 may be other than silicon glass (for example, sapphire glass, borosilicate glass, quartz glass, etc.).

[0038] The temperature sensor board 902 is equipped with a processor, memory, an infrared array sensor, a transmittance measurement module, etc. (all not shown). Of these, the transmittance measurement module is a means for measuring the light transmittance (in other words, the degree of contamination) of the light receiving window 904. This module is composed of a light source 501 and a light receiving element 502.

[0039] The mechanism for measuring the degree of contamination of the light receiving window 904 will be described with reference again to FIG. Light emitted from light source 501 passes through light receiving window 904, is reflected by reflector 503, and is received by light receiving element 502. Light receiving element 502 outputs a voltage value corresponding to the reflected light it receives. This voltage value reflects the light transmittance of light receiving window 904 (in other words, the degree of contamination).

[0040] Next, the functions realized by the processor will be described. The processor executes the programs stored in the memory to realize the abnormal temperature detection function and the contamination detection function. Of these, the abnormal temperature detection function detects abnormal temperatures based on the voltage value output from the infrared array sensor. On the other hand, the contamination detection function detects contamination based on the voltage value output from the light receiving element 502. The detection results of both functions are output via wiring 702 to, for example, an alarm panel. The above is a description of the configuration of the temperature sensor 600.

[0041] As mentioned above, the temperature sensor 600 described above has the speed controller 603. The other end of this speed controller 603 is connected to a tube 605, and air is supplied into the housing 601 via this tube 605. As a result, the inside of the housing 601 becomes positive pressure.

[0042] The air supplied into the housing 601 passes through a flow path 705 formed between the housing 601 and the internal substrate box 701 and is ejected to the outside through the monitoring hole 602 (see the arrows in FIGS. 7 and 8). As a result, external dust is prevented from entering the housing 601, and external dust can be prevented from adhering to the light receiving window 904.

[0043] 3. Third Example The temperature sensor unit 100 according to the first embodiment has an opening 108 for supplying air into the box 101. This allows air to be supplied into the box 101 and for the air to be sprayed out from the monitoring hole 102. In addition to this opening 108, an opening for supplying water may be further provided. This allows the light receiving window 404 to be cleaned with the supplied water. In addition, the type and flow rate of fluid supplied into the box 101 may be controlled depending on the degree of contamination of the light receiving window 404. An embodiment that realizes such a function will be described below.

[0044] 10 shows an example of the configuration of a temperature sensor system 1000. The temperature sensor system 1000 is made up of a temperature sensor unit 1001, a control panel 1002, an air supply device 1003, a water supply device 1004, and solenoid valves 1005 and 1006.

[0045] The temperature sensor unit 1001 is connected to a control panel 1002 via wiring 103. The temperature sensor unit 1001 is also connected to an air supply device 1003 via a tube 106 and an electromagnetic valve 1005. The temperature sensor unit 1001 is also connected to a water supply device 1004 via a tube 1103 and an electromagnetic valve 1006. The control panel 1002 is connected to the solenoid valves 1005 and 1006 by wiring so as to be controllable. The temperature sensor unit 1001 and the control panel 1002 will be described in detail below.

[0046] Figures 11 to 13 are schematic diagrams showing an example of the configuration of the temperature sensor unit 1001. Figure 11 is a front view of the temperature sensor unit 1001, Figure 12 is a cross-sectional view taken along line XII-XII in Figure 11, and Figure 13 is a cross-sectional view taken along line XIII-XIII in Figure 11. Note that in Figures 12 and 13, cross-sectional lines are drawn only for the box 101.

[0047] The temperature sensor unit 1001 differs from the temperature sensor unit 100 of the first embodiment in that it has a configuration for supplying water into the box 101 and a guide part 1104. Of these, the configuration for supplying water into the box 101 specifically consists of an opening 1101, a speed controller 1102, and a tube 1103.

[0048] Of these, opening 1101 (not shown) is an opening formed in a side panel of box 101, and is a supply port for connecting a resin tube 1103 to box 101. One end of a speed controller 1102 is attached to this opening 1101. This speed controller 1102 is a manual speed control valve, and the other end is connected to tube 1103. This tube 1103 is a pipe for supplying liquid (water as an example in this embodiment) into box 101.

[0049] Guide portion 1104 is a portion formed around monitoring hole 102 for guiding the fluid. This guide portion 1104 is formed, for example, by bending the periphery of monitoring hole 102 inward. This guide portion 1104 causes the fluid supplied from tube 106 or 1103 to collide with light-receiving window 404 before being ejected from monitoring hole 102. As a result, dust adhering to light-receiving window 404 can be removed. In addition, the fluid that has collided with light-receiving window 404 is ejected from monitoring hole 102, thereby preventing dust from adhering to light-receiving window 404.

[0050] Next, the control panel 1002 will be described. The control panel 1002 is a device for controlling the type and flow rate of the fluid supplied to the temperature sensor unit 1001 .

[0051] 14 shows an example of the configuration of the control panel 1002. The control panel 1002 includes a main memory device 1401, an auxiliary memory device 1402, a processor 1403, an input device 1404, an output device 1405, and a communication control unit 1406. Of these, the main memory device 1401 stores programs called an alarm module 1410 and a fluid control module 1411. The processor 1403 executes these programs to realize an alarm function and a fluid control function.

[0052] Of these, the alarm function is a function that receives an abnormal temperature signal output from the temperature sensor unit 1001 and outputs an alarm.

[0053] On the other hand, the fluid control function is a function for controlling the type and flow rate of fluid supplied to the temperature sensor unit 100 based on the light transmittance output from the temperature sensor unit 100 (in other words, the degree of contamination of the light receiving window 404). The type and flow rate of this supplied fluid are controlled by controlling the opening and closing of the solenoid valves 1005 and 1006.

[0054] First, this function normally supplies only air at a first flow rate to the temperature sensor unit 1001. This prevents dust from adhering to the light receiving window 404.

[0055] Thereafter, if the light transmittance falls below the first threshold, it is determined that the monitoring environment has deteriorated, and air is supplied to the temperature sensor unit 1001 at a second flow rate that is greater than the first flow rate. If the light transmittance still falls below a second threshold that is lower than the first threshold, the function stops the supply of air and supplies water to the temperature sensor unit 1001. This cleans the light receiving window 404.

[0056] After supplying water for a certain period of time, this function again supplies only air at the first flow rate to the temperature sensor unit 100. This dries the light receiving window 404 and prevents dust from adhering again. The temperature sensor system 1000 has been described above.

[0057] According to the temperature sensor system 1000 described above, the type and flow rate of the supplied fluid can be controlled depending on the degree of contamination of the light receiving window 404.

[0058] 2. Variations The above embodiment may be modified as follows: The following modifications may be combined with each other. (1) Case shape The box 101 in the first embodiment has a rectangular parallelepiped shape. However, this shape is merely an example. The shape of the box 101 may be other shapes (for example, cylindrical) as long as the monitoring hole 102 is formed. The same applies to the housing 601 in the second embodiment.

[0059] (2) Shape of the monitoring hole The monitoring hole 102 in the first embodiment has a circular shape. However, this shape is merely an example. The shape of the monitoring hole 102 may be other shapes (for example, rectangular) as long as the light receiving portion 208 of the temperature sensor 201 can be seen through the monitoring hole 102. The same applies to the monitoring hole 602 in the second embodiment.

[0060] (3) Pipe material The tube 106 in the first embodiment is made of resin. However, this material is merely an example. The tube 106 may be made of other materials (for example, metal) as long as it is capable of supplying fluid into the box 101. This also applies to the tube 605 in the second embodiment and the tube 1103 in the third embodiment.

[0061] (4) Supply port location In the first embodiment, the opening 108 to which the speed controller 105 is attached is formed in the side panel of the box 101. However, this formation position is merely one example. The opening 108 may be formed in another position (for example, on the back panel) as long as it is a position where fluid can be supplied into the box 101. This also applies to the opening 604 in the second embodiment and the opening 1101 in the third embodiment.

[0062] (5) Guide Angle The angle of the guide portion 1104 in the third embodiment is not limited to the example shown in Figures 12 and 13. The angle of the guide portion 1104 (i.e., the angle of the guide portion 1104 with respect to the front plate of the box 101) may be any other angle as long as it directs the fluid supplied from the tube 106 toward the light receiving portion 208. The guide portion 1104 of the third embodiment may be formed around the monitoring hole 602 of the second embodiment.

[0063] (6) Flow control The flow rate control method performed by the fluid control function in the third embodiment is merely an example. Other control methods based on light transmittance (for example, control that reduces the air flow rate as the light transmittance increases) may also be performed.

[0064] (7) Control of fluid type The method of controlling the type of fluid performed by the fluid control function in the third embodiment is merely an example. Any other control method based on light transmittance (for example, control to switch the type of fluid from water to air as the light transmittance increases) may be executed.

[0065] (8) Fixing method of temperature sensor 201 The temperature sensor 201 in the first embodiment is fixed to the rear panel of the box 101 via a spacer 205 or the like. However, this fixing method is merely one example. The temperature sensor 201 may be fixed in a different way. For example, it may be fixed to the front panel or side panel of the box 101 via a spacer 205. This is also true for the internal board box 701 in the second embodiment.

[0066] (9) Control target In the third embodiment, the controlled object is a temperature sensor unit 1001, which is a modification of the temperature sensor unit 100 of the first embodiment. Instead of this temperature sensor unit 1001, a modified version of the temperature sensor 600 of the second embodiment may also be used as the controlled object. Note that the modification referred to here means that the temperature sensor 600 of the second embodiment is provided with components equivalent to the opening 1101, speed controller 1102, tube 1103, and guide portion 1104.

[0067] (10) Types of infrared sensors In the first embodiment, the temperature sensor 201 is housed in the box 101. This temperature sensor 201 may be changed to a flame detector. The flame detector referred to here is a flame detector such as a single-wavelength infrared type, a two-wavelength infrared type, a three-wavelength infrared type, an ultraviolet type, or a combined ultraviolet and infrared type. These flame detectors are examples of infrared sensors for fire detection. Even when these flame detectors are housed in the box 101, the advantage of being able to prevent dust from adhering to the light receiving window can be enjoyed.

[0068] Similarly, in the second embodiment, the temperature sensor 600 may be changed to a flame detector. In this case, a flow path is formed between the front plate of the flame detector housing and the front plate of the internal substrate box housed in the housing. The internal board box houses a sensor board for the flame detector, and this sensor board is an example of an infrared sensor board.

[0069] (11) Other variations The present invention is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the described configurations. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace part of the configuration of each embodiment with other configurations.

[0070] Furthermore, the above-described configurations, functions, processing units, processing means, etc. may be partially or entirely implemented in hardware, for example, by designing them as integrated circuits. The above-described configurations, functions, etc. may also be implemented in software, with a processor interpreting and executing a program that implements each function. Information such as the programs, tables, and files that implement each function can be stored in a memory, a recording device such as a hard disk or SSD (Solid State Drive), or a recording medium such as an IC card, SD card, or DVD.

[0071] In addition, the control lines and information lines shown are those that are considered necessary for the explanation, and do not necessarily show all the control lines and information lines in the product. In reality, it can be assumed that almost all components are interconnected. The above-described embodiments disclose at least the configurations described in the claims. [Explanation of symbols]

[0072] 100...Temperature sensor unit, 101...Box, 102...Monitoring hole, 103...Wiring, 104...Cable gland, 105...Speed ​​controller, 106...Tube, 107...Opening, 108...Opening, 201...Temperature sensor, 202...Wiring box, 203...Cable gland, 204...Opening, 205...Spacer, 206...Mounting base, 207...Flow path, 208...Light receiving unit, 401...Housing, 402...Temperature sensor board, 403...Opening, 404...Light receiving window, 501...light source, 502...light receiving element, 503...reflector, 600...temperature sensor, 601...casing, 602...monitoring hole, 603...speed controller, 604...opening, 605...tube, 701...internal board box, 702...wiring, 703...opening, 704...spacer, 705...flow path, 901...box, 902...temperature sensor board, 903...opening, 904...light receiving window, 1000...temperature sensor system, 1001...temperature sensor unit 1002...control panel, 1003...air supply device, 1004...water supply device, 1005...solenoid valve, 1006...solenoid valve, 1101...opening, 1102...speed controller, 1103...tube, 1104...guiding section, 1401...main memory device, 1402...auxiliary memory device, 1403...processor, 1404...input device, 1405...output device, 1406...communication control section, 1410...alarm module, 1411...fluid control module

Claims

1. A case for housing an infrared sensor, a monitoring hole formed so that the light receiving portion of the housed infrared sensor can be seen through; a first supply port to which a pipe for supplying a fluid into the case is connected; and A flow path is formed between the pipe and the housed infrared sensor to eject the fluid supplied from the pipe from the monitoring hole.

2. The case of claim 1, further comprising a guide portion formed around the monitoring hole, which guides the fluid supplied from the pipe toward the light receiving portion before it sprays out of the monitoring hole.

3. The case according to claim 1 , further comprising a second supply port to which a pipe is connected for supplying a liquid into the case.

4. A case according to any one of claims 1 to 3; the infrared sensor; A temperature sensor unit comprising:

5. A case according to any one of claims 1 to 3; the infrared sensor; a measuring means for measuring the degree of contamination of a light receiving window covering the light receiving unit; a control means for controlling the flow rate of the fluid supplied into the case based on the degree of contamination measured by the measuring means; A temperature sensor system comprising:

6. The case according to claim 3; the infrared sensor; a measuring means for measuring the degree of contamination of a light receiving window covering the light receiving unit; a control means for controlling the type of fluid to be supplied into the case based on the degree of contamination measured by the measuring means; A temperature sensor system comprising:

7. An infrared sensor, The housing and an infrared sensor substrate housed in the housing; Equipped with The housing includes: a monitoring hole formed so that the light receiving portion of the infrared sensor substrate can be seen through; a supply port to which a pipe for supplying a fluid into the housing is connected; a flow path formed between the pipe and the infrared sensor substrate for causing the fluid supplied from the pipe to be ejected from the monitoring hole; An infrared sensor comprising:

Citation Information

Patent Citations

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    JP2021051523A