Determination method, information processing apparatus, exposure apparatus, exposure method, and article manufacturing method

Abstract

To provide a technique advantageous for determining a baseline correction amount.SOLUTION: A method of determining a baseline correction amount of a baseline representing a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate and an optical axis of a second scope that detects the mark without passing through the projection optical system, the method comprising: Provided is a determination method including: a second step of acquiring a baseline (Mn) from the results of detection performed by the first scope and the second scope a second number of times smaller than the first number of times; and a third step of determining a baseline correction amount (Xn) to be used in the n-th lot on the basis of the reference baseline acquired in the first step and the baseline (Mn) acquired in the second step.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a determination method, an information processing device, an exposure apparatus, an exposure method, and a method for manufacturing an article. [Background technology]

[0002] One type of lithography equipment used in the manufacturing process of devices such as semiconductor elements and liquid crystal panels is an exposure apparatus that transfers a pattern from a master onto a substrate. To transfer the pattern from the master onto the substrate with high precision, it is necessary to align the master and the substrate. Therefore, before exposing the substrate, alignment measurements are performed to detect (image) the alignment marks provided on both the master and the substrate and measure the positions of the alignment marks.

[0003] There are roughly two types of alignment measurement. One is the through-the-mirror method, which detects the alignment marks on the original and substrate via a projection optical system. The other is the off-axis method, which detects only the alignment mark on the substrate without going through a projection optical system. Exposure tools are generally equipped with alignment scopes that perform alignment measurements using these methods, and each is used for its own purpose.

[0004] In order to perform alignment measurement using the off-axis method, alignment measurement using the through-the-mirror method must be performed in advance. This is because a baseline, i.e., the relative positional relationship between the detection position obtained by alignment measurement using the through-the-mirror method (projection position of the pattern on the original) and the detection position obtained by alignment measurement using off-axis measurement, is required. Specifically, in alignment measurement using the off-axis method, the baseline must be used to correct the detection position obtained by alignment measurement. The baseline can be measured with high accuracy by performing mark detection using the through-the-mirror method and mark detection using the off-axis method multiple times.

[0005] On the other hand, it is known that in exposure tools, the baseline fluctuates and is not a constant value due to the effects of heat generated by the exposure light and stage movement, which cause errors over time in the relationship between the original coordinate system and the substrate coordinate system. Therefore, if the same baseline is used continuously, it will cause a decrease in exposure accuracy, including overlay accuracy, (baseline drift), so it is necessary to remeasure the baseline at regular intervals.

[0006] Although exposure accuracy can be maintained by re-measuring the baseline, productivity decreases. Therefore, in order to maintain exposure accuracy while maintaining productivity (i.e., to achieve both exposure accuracy and productivity), techniques for devising the timing of updating the baseline have been proposed (see Patent Documents 1 and 2). Patent Document 1 discloses a technique for updating the baseline by performing mark detection using a through-the-mirror method and mark detection using an off-axis method separately at the required timing. Patent Document 2 discloses a technique for updating the baseline only when the baseline fluctuates, based on the correlation between heat generated by exposure light and the baseline.

[0007] Also known is a technique for measuring the baseline that selectively uses high-precision measurement using multiple mark detections and high-speed measurement using fewer mark detections. For example, high-precision measurement is first performed to obtain a baseline and generate reference data. At subsequent measurement timings, only high-speed measurement is performed, and if a difference between the baseline data and the high-precision measurement exceeds the tolerance, correction is performed using the reference data. On the other hand, if a difference exceeds the tolerance, it is determined that the baseline has significantly shifted (changes over time), and the reference data is regenerated using high-precision measurement. This technique allows high-precision measurement to be performed when the baseline has significantly shifted, and high-speed measurement to be performed otherwise, thereby achieving both high exposure accuracy and productivity. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-344739 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-64371 Summary of the Invention [Problem to be solved by the invention]

[0009] However, it is known that the reproducibility of measurement results obtained by an alignment scope cannot be guaranteed, and for example, even when the same mark is detected, the measurement results will vary.

[0010] In a technique that selectively uses high-precision measurement and high-speed measurement for baseline measurement, the reproducibility of the measurement results obtained by the alignment scope significantly affects exposure accuracy. With this technique, if the difference between the reference data and the measurement results obtained by high-speed measurement is small, it is possible to maintain exposure accuracy by performing correction using the reference data. However, because the measurement results obtained by high-speed measurement vary, there is a possibility that the difference between the reference data and the actual measurement result may be erroneously recognized as small, even if it is actually large. In this case, the correction is performed using the original reference data without regenerating the reference data, resulting in a decrease in exposure accuracy.

[0011] The present invention has been made in view of the above problems of the conventional technology, and has an exemplary object to provide a technology that is advantageous for determining the amount of baseline correction. [Means for solving the problem]

[0012] In order to achieve the above object, one aspect of the present invention provides a determination method for determining a baseline correction amount of a baseline that represents a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without using the projection optical system, the determination method including: a first step of acquiring a reference baseline from a first number of detection results by the first scope and the second scope; and a second step of acquiring a baseline M for an n-th lot (n is an integer of 1 or more) from a second number of detection results by the first scope and the second scope that is less than the first number of detections. n a second step of acquiring the reference baseline acquired in the first step and the baseline M acquired in the second step; n and the amount of baseline correction X to be used in the n-th lot based on n and a third step of determining:

[0013] Further objects and other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0014] According to the present invention, for example, it is possible to provide a technique that is advantageous for determining the amount of baseline correction. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a schematic diagram showing the configuration of an exposure apparatus according to one aspect of the present invention. [Figure 2] 5 is a flowchart illustrating a method for determining a baseline correction amount in the first embodiment. [Figure 3] 10 is a flowchart illustrating a method for determining a baseline correction amount in the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0017] FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus 100 according to one aspect of the present invention. The exposure apparatus 100 is a lithography apparatus used in a lithography process, which is a process for manufacturing articles including devices, and forms a pattern on a substrate (wafer or plate) by exposing the substrate via an original (reticle or mask). In this embodiment, the exposure apparatus 100 is embodied as an exposure apparatus for manufacturing flat panel displays (FPDs). The exposure apparatus 100 projects the pattern of the original onto the substrate via a projection optical system, and transfers the pattern of the original onto the substrate.

[0018] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which the direction perpendicular to the surface of the substrate (vertical direction) is defined as the Z axis, and two directions parallel to a plane perpendicular to the Z axis and perpendicular to each other are defined as the X axis and the Y axis. Furthermore, the directions parallel to the X axis, Y axis, and Z axis in the XYZ coordinate system are defined as the X direction, Y direction, and Z direction, respectively.

[0019] As shown in FIG. 1, the exposure apparatus 100 includes an illumination optical system 1, an alignment scope 2, a projection optical system 4, an original stage 9, a substrate stage 10, a control unit 11, and an off-axis scope 12.

[0020] The illumination optical system 1 includes optical elements such as lenses and mirrors, and illuminates the original 3 with light from a light source unit (not shown). The light source unit includes, for example, a mercury lamp and an elliptical mirror. In this embodiment, the illumination optical system 1 forms an illumination area of ​​a predetermined shape and illuminates a part of the original 3.

[0021] The projection optical system 4 projects (an image of) the pattern of the original 3 illuminated by the illumination optical system 1 onto the substrate 8. The projection optical system 4 may be configured as any of an equal-magnification imaging optical system, an enlarged imaging optical system, or a reduced imaging optical system. The original 3 is positioned at the object plane of the projection optical system 4, and the substrate 8 is positioned at the image plane of the projection optical system 4.

[0022] In this embodiment, the projection optical system 4 is configured as a reflective optical system including a concave mirror 5, a mirror 6, and a convex mirror 7. Light from the original 3 illuminated by the projection optical system 4 (an image of the pattern on the original 3) passes through mirror 6, concave mirror 5, convex mirror 7, concave mirror 5, and mirror 6 in the projection optical system 4, and is imaged at equal magnification on the substrate 8. The projection optical system 4 may be configured as a refractive optical system mainly using lenses, or as a catadioptric optical system using lenses and mirrors, or as a plurality of imaging optical systems.

[0023] The original stage 9 includes an original holding mechanism for holding the original 3, a position adjustment mechanism for adjusting the position of the original 3 in the X and Y directions, and a rotation adjustment mechanism for adjusting the rotation angle of the original 3 around the X and Y axes.

[0024] The substrate stage 10 includes a substrate holding mechanism for holding the substrate 8, a position adjustment mechanism for adjusting the position of the substrate 8 in the X, Y, and Z directions, and a rotation adjustment mechanism for adjusting the rotation angle of the substrate 8 around the X, Y, and Z axes.

[0025] The alignment scope 2 is a scope (first scope) for performing alignment measurement using the through-the-mirror method. The alignment scope 2 detects (images) alignment marks provided on the original 3 and the substrate 8 via the projection optical system 4, and measures the positions of the alignment marks.

[0026] The off-axis scope 12 is a scope (second scope) for performing alignment measurement by the off-axis method. The off-axis scope 12 detects (images) alignment marks provided on the substrate 8 without going through the projection optical system 4, and measures the positions of the alignment marks.

[0027] The control unit 11 is configured, for example, by a computer (information processing device) including a CPU, memory, etc. The control unit 11 comprehensively controls each unit of the exposure apparatus 100 in accordance with a program stored in a storage unit, etc., to operate the exposure apparatus 100. The control unit 11 controls the exposure process for transferring the pattern of the original 3 onto the substrate 8, and various processes related to the exposure process.

[0028] For example, the control unit 11 indirectly controls the positions and angles of the original 3 and the substrate 8 by driving the original stage 9 and the substrate stage 10 based on the positions and angles measured by position measuring devices such as interferometers and encoders. The control unit 11 also calculates a baseline that represents the positional relationship between the alignment scope 2 and the off-axis scope 12 based on the results of alignment mark detection by the alignment scope 2 and the results of alignment mark detection by the off-axis scope 12. The control unit 11 then calculates the amount of correction for the position of the substrate stage 10 using the baseline, and transfers the pattern of the original 3 onto the substrate 8 while synchronously moving the original 3 and the substrate 8 in a predetermined direction.

[0029] Here, the baseline refers to the movement distance of the same mark (movement distance of the substrate stage 10) required to detect the same mark and obtain the same detection result with each of the alignment scope 2 and the off-axis scope 12. Therefore, in this embodiment, the baseline is defined as the distance between the optical axis of the alignment scope 2 and the optical axis of the off-axis scope 12.

[0030] In exposure apparatus 100, the baseline fluctuates due to heat generated by exposure light, driving of substrate stage 10, and the like. Therefore, if the same baseline is continuously used, it will cause a decrease in exposure accuracy, including overlay accuracy (baseline drift). Therefore, it is necessary to find the amount of baseline correction in accordance with the baseline fluctuation, that is, to determine the amount of baseline correction. Therefore, a method for determining the amount of baseline correction will be described below.

[0031] First Embodiment 2 is a flowchart for explaining a method for determining the amount of baseline correction in the first embodiment. This method is executed by the control unit 11 comprehensively controlling each unit of the exposure apparatus 100. In this way, in this embodiment, the control unit 11 functions as a processing unit that performs processing to determine the amount of baseline correction.

[0032] In S11, the control unit 11 determines whether the job being executed is the first job. If the job being executed is not the first job, that is, if the job has been executed once, the baseline reference value M base (reference baseline) is required. Therefore, the baseline reference value M base It is possible to determine whether the job being executed is the first job or not by checking whether the job being executed is the first job. If the job being executed is the first job, the process proceeds to S12, and if the job being executed is not the first job, the process proceeds to S13.

[0033] In S12, the control unit 11 causes the alignment scope 2 and the off-axis scope 12 to perform high-precision measurements, and calculates the baseline reference value M base Specifically, the alignment marks are detected by the alignment scope 2 and the off-axis scope 12 a number of times (a first number of times including a plurality of times), for example, 16 times, and the respective detection results are obtained. Then, the baseline reference value M is calculated from the 16 detection results by the alignment scope 2 and the off-axis scope 12.base In this embodiment, the average value of 16 detection results obtained by the alignment scope 2 and the off-axis scope 12 is used as the baseline reference value M base In this way, by averaging the detection results multiple times, the measurement errors of the alignment scope 2 and the off-axis scope 12 are smoothed out, and the baseline reference value M base However, the baseline reference value M base In order to calculate the baseline reference value M base As long as it is possible to bring the value closer to the true value, it is not limited to averaging the results of multiple detections. For example, by using statistical processing (statistical method), the statistical value of 16 detection results by the alignment scope 2 and the off-axis scope 12 can be calculated as the baseline reference value M base Alternatively, a baseline reference value M may be calculated from 16 detection results by the alignment scope 2 and the off-axis scope 12 using a method that uses standard deviation. base You may ask for:

[0034] In S13, the control unit 11 determines whether the substrate 8 to be aligned is the first (first) substrate in a lot. A lot is a unit (manufacturing unit) for processing substrates 8. Substrates from the same lot are stored in the same environment at the manufacturing site and tend to have the same characteristics. Therefore, in this embodiment, the same baseline correction amount is used to correct the baseline for substrates from the same lot before exposure. If the substrate 8 is the first substrate in the lot, the process proceeds to S14; if the substrate 8 is not the first substrate in the lot, the process proceeds to S17.

[0035] In S14, the control unit 11 causes the alignment scope 2 and the off-axis scope 12 to perform high-speed measurement and acquire a baseline measurement value. Specifically, the alignment mark detection by the alignment scope 2 and the alignment mark detection by the off-axis scope 12 are performed a small number of times (a second number of times less than the first number of times), for example, once, and the detection result is acquired. Then, the baseline measurement value is obtained from the single detection result by the alignment scope 2 and the off-axis scope 12. Here, the baseline measurement value acquired for the nth (n is an integer equal to or greater than 1) lot is referred to as the baseline measurement value M n (Baseline M n ) is written as

[0036] In this embodiment, the number of times the alignment mark is detected in the high-speed measurement (S14) is one, but the purpose of the high-speed measurement is to measure faster than the high-precision measurement (S12). Therefore, the number of times the alignment mark is detected in the high-speed measurement (second number) may be less than the number of times the alignment mark is detected in the high-precision measurement (first number). For example, the number of times the alignment mark is detected in the high-speed measurement may be one or more times or multiple times. Note that when the alignment mark is detected multiple times in the high-speed measurement, the baseline reference value M base Similarly, the average value obtained by averaging multiple detection results or the statistical processing of multiple detection results are used as the baseline measurement value M n It may also be possible to use the following.

[0037] In S15, the control unit 11 calculates the baseline reference value M obtained in S12. base and the baseline measurement value M obtained in S14 n and determine whether the difference exceeds the allowable range according to the following formula (1). In formula (1), Tol is the baseline reference value M base and the baseline measurement M n Difference M base -M n This represents the tolerance range (allowable amount of detection error).

[0038]

number

[0039] The amount of baseline correction is the baseline reference value M base The baseline reference value M base and the baseline measurement M n If the difference between the actual baseline and the baseline reference value M exceeds the tolerance, base Therefore, after the baseline shift, the baseline reference value M base If correction is performed using the baseline correction amount calculated using the baseline reference value M base and the baseline measurement M n If the difference exceeds the allowable range, that is, if the difference is large, it is necessary to obtain the baseline reference value after the baseline shift.

[0040] In S16, the control unit 11 causes the alignment scope 2 and the off-axis scope 12 to perform high-precision measurements, and calculates the baseline reference value M base Specifically, similar to S12, the alignment marks are detected by the alignment scope 2 and the off-axis scope 12 multiple times (first number of times), for example, 16 times, and the respective detection results are acquired. Then, a new baseline reference value M is calculated from the new 16 detection results by the alignment scope 2 and the off-axis scope 12. base In this way, the baseline reference value M base By updating, it is possible to correspond to the baseline after the fluctuation. Also, since the high-precision measurement in S16 is performed for the nth lot, the baseline measurement value M n The baseline reference value M base Update it with the same value.

[0041] In S17, the control unit 11 calculates the baseline reference value M base and the baseline measurement M n The baseline correction amount to be used for the nth lot is determined (calculated) based on the baseline reference value M base is highly reliable because it is measured with high accuracy. n is measured on the current lot, so it is excellent in terms of quick response. Therefore, the baseline reference value M base and the baseline measurement M n By combining the above, it becomes possible to determine a baseline correction amount that is closer to the true value than before.

[0042] The baseline reference value M used to determine the baseline correction amount base If S16 has not been performed, the baseline reference value M obtained in S12 base If S16 has been passed, the baseline reference value M base Similarly, the baseline measurement value M used to determine the baseline correction amount n If S16 has not been performed, the baseline measurement value M obtained in S14 n If S16 has been passed, the baseline reference value M updated in S16 base is equivalent to

[0043] Here, an example of a specific method for determining the baseline correction amount in S17 will be described. In this embodiment, the baseline reference value M base and baseline measurement value M n By assigning weights to each of the i For example, determine the baseline measurement M n If the weight given to is W, the baseline reference value M base The weight (1-W) is assigned to the baseline correction amount X i and the baseline measurement M n and the baseline reference value M baseThe relationship between these two can be formulated as follows:

[0044]

number

[0045] In equation (2), i represents the elapsed time from the start of measurement, and can be converted to the lot number n, which represents periodic measurement. i represents the baseline measurement obtained by fast measurement at time i, and X i represents the amount of baseline correction after i hours have elapsed, and W represents the weight (weighting ratio) given to the baseline measurement value obtained by performing high-speed measurement.

[0046] Referring to equation (2), the baseline measurement M i and baseline reference value M base are actual measurements, and the baseline correction amount X is calculated by multiplying them by weights W and (1-W). i is determined. Also, the baseline measurement value M i is a measurement value obtained by performing high-speed measurement, i.e., under low-precision conditions, and therefore contains variations. In other words, the baseline measurement value M i is a value that reflects the measurement repeatability of each of the alignment scope 2 and the off-axis scope 12. Therefore, as shown in equation (2), the baseline measurement value M i Baseline correction amount X including i It will also be distributed in terms of.

[0047] In exposure apparatus 100, the baseline fluctuation caused by continuous exposure is expressed by the following equation (3).

[0048]

number

[0049] In equation (3), i represents the elapsed time from the start of measurement, and Mtrue (i) represents the baseline (experimental value), A(i) represents the change in the baseline over time, and M base0 represents the initial measurement value of the baseline. Equation (3) roughly represents the baseline (variation) and is formulated by statistical processing from values ​​obtained in experiments.

[0050] Here, the baseline correction amount X shown in equation (2) i is the baseline M shown in Equation (3). true This is the value for correcting (i). Therefore, the baseline correction amount X i and baseline M true It is preferable that the difference from (i) is small. i The standard deviation S is expressed by the following equation (4):

[0051]

number

[0052] Referring to equation (4), when the standard deviation S is sufficiently small, the baseline correction amount X i The distribution of the baseline M true (i) is close to the correct value. Also, as shown in equation (2), the baseline correction amount X i is determined by the weight W, so when the standard deviation S is sufficiently small, the weight W is also correct.

[0053] Therefore, in this embodiment, the weight W is calculated according to the following equation (5): Equation (5) can be obtained by substituting equations (2) and (3) into equation (4).

[0054]

number

[0055] The weight W is assigned in the range of 0 to 1 so that the standard deviation S shown in equation (5) is minimized. The weight W when the standard deviation S is minimized is considered to be closest to the true value, so the baseline measurement value M n As the weight to be given to the baseline measurement value M, the weight W is adopted when the standard deviation S is minimized. i is a value reflecting the measurement repeatability of each of the alignment scope 2 and the off-axis scope 12, and the amount of baseline change over time A(i) is a value reflecting the change in the baseline over time. In this way, the weight W is calculated (determined) based on the reliability of the detection results obtained by each of the alignment scope 2 and the off-axis scope 12, and more specifically, is calculated based on the measurement repeatability of each scope and the change in the baseline over time.

[0056] In addition, the weight W can be temporarily changed (increased or decreased) depending on the number of times (first number and second number) that the alignment scope 2 and the off-axis scope 12 detect the alignment mark, thereby reflecting the reliability of each alignment measurement value.

[0057] Second Embodiment 3 is a flowchart for explaining a method for determining the amount of baseline correction in the second embodiment. This method is executed by the control unit 11 comprehensively controlling each unit of the exposure apparatus 100. In this way, in this embodiment, the control unit 11 functions as a processing unit that performs processing to determine the amount of baseline correction.

[0058] In this embodiment, as shown in FIG. 3, S21 is provided instead of S17 in the first embodiment, that is, determining the amount of baseline correction according to equation (2).

[0059] In S21, the control unit 11 calculates the baseline measurement value M obtained in the nth (n is an integer of 2 or more) lot. n and the baseline correction amount X for the (n-1)th lot n-1 The amount of baseline correction to be used in the nth lot is X based onn In this manner, in this embodiment, the baseline measurement value M obtained by causing the alignment scope 2 and the off-axis scope 12 to perform high-speed measurement is determined. n and the baseline correction amount of the previous lot X n-1 From this, the baseline correction amount for this lot X n The baseline correction amount X n-1 is the baseline reference value M obtained in S12 base , and the baseline measurement values ​​M1 to M of each lot up to the (n-1)th lot obtained in S14 n-1 (Baseline M1~M n-1 ) is determined based on the

[0060] Here, an example of a specific method for determining the baseline correction amount in S21 will be described. For the first lot, since there is no baseline correction amount for the previous lot, the baseline correction amount X1 is determined according to the following formula (6), as in the first embodiment.

[0061]

number

[0062] For the second lot, the baseline correction amount X2 is determined using the baseline correction amount X1 according to the following formula (7).

[0063]

number

[0064] Generalizing equation (7), the baseline correction amount X used in the nth lot is n can be expressed by the following equation (8).

[0065]

number

[0066] In this manner, in this embodiment, the (n-1)th baseline correction amount X n-1 and the baseline measurement M n By combining these, the baseline correction amount X used in the nth lot is calculated. n In this case, the baseline correction amount X is determined in the same manner as in the first embodiment. n-1 and baseline measurement value M n Specifically, the baseline measurement M n If the weight given to is W, the baseline correction amount X n-1 It is preferable to give a weight (1-W) to the weight W. Note that the calculation of the weight W is the same as in the first embodiment, and therefore a detailed description thereof will be omitted here.

[0067] Comparing equation (8) with equation (2), equation (8) includes information about the baseline measurement value obtained in the high-speed measurement performed on the previous lot. Therefore, in equation (8), the baseline measurement value M n-1 is the baseline measurement value M n The baseline correction amount X n It is also possible to determine the baseline correction amount X n Since the total number of samples of the baseline measurement values ​​used when determining the alignment scope 2 and the off-axis scope 12 increases, the influence of the measurement repeatability of each of the alignment scope 2 and the off-axis scope 12 can be suppressed.

[0068] In this embodiment, the baseline reference value M base and the baseline measurement M n If the difference between the baseline and the reference value M exceeds the allowable range, high-precision measurement is performed. base and baseline measurement value M n The reacquired baseline measurement value M n is the baseline measurement value M obtained by high-speed measurement n It is superior in terms of reliability and reproducibility compared to

[0069] The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program. It can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0070] The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays, liquid crystal display elements, semiconductor elements, and MEMS. This manufacturing method includes the steps of exposing a substrate coated with a photosensitive agent using the exposure apparatus 100 (exposure process) described above and developing the exposed photosensitive agent. The developed photosensitive agent pattern is then used as a mask to perform etching and ion implantation processes on the substrate, forming a circuit pattern on the substrate. These exposure, development, etching, and other processes are repeated to form a circuit pattern consisting of multiple layers on the substrate. In subsequent processes, the substrate on which the circuit pattern has been formed is diced (processed), followed by chip mounting, bonding, and inspection. This manufacturing method may also include other well-known processes (e.g., oxidation, film formation, vapor deposition, doping, planarization, resist stripping, etc.). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0071] The disclosure of this specification includes the following determination method, information processing device, exposure apparatus, exposure method, and article manufacturing method.

[0072] (Item 1) 1. A method for determining a baseline correction amount of a baseline representing a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, comprising: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer equal to or greater than 1), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n a second step of obtaining The reference baseline obtained in the first step and the baseline M obtained in the second step n and the amount of baseline correction X to be used in the n-th lot based on n and a third step of determining A method for determining whether a parameter is a parameter that is a function of a parameter.

[0073] (Item 2) 1. A method for determining a baseline correction amount of a baseline representing a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, comprising: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n a second step of obtaining The reference baseline acquired in the first step and the baselines M1 to M2 of each lot up to the (n-1)th lot acquired from the second detection results by the first scope and the second scope n-1 The baseline correction amount X for the (n-1)th lot determined based on n-1 and the baseline M obtained in the second step. n and the amount of baseline correction X to be used in the nth lot based on n and a third step of determining A method for determining whether a parameter is a parameter that is a function of a parameter.

[0074] (Item 3) In the third step, the reference baseline obtained in the first step and the baseline M obtained in the second step are nBy combining these, the baseline correction amount X used in the nth lot is n 2. The method according to item 1, wherein the

[0075] (Item 4) In the third step, the reference baseline obtained in the first step and the baseline M obtained in the second step are n By assigning a weight to each of the above, the baseline correction amount X used in the nth lot is calculated. n 4. The method according to item 3, wherein the above formula (I) is determined.

[0076] (Item 5) In the third step, a weight (1-W) is assigned to the reference baseline acquired in the first step, and the baseline M acquired in the second step is n By assigning a weight W to the n-th lot, the baseline correction amount X n 5. The method according to item 4, wherein the

[0077] (Item 6) In the third step, the (n-1)th baseline correction amount X n-1 and the baseline M obtained in the second step. n By combining these, the baseline correction amount X used in the nth lot is n 3. The method according to item 2, wherein the above formula (I) is determined.

[0078] (Item 7) In the third step, the (n-1)th baseline correction amount X n-1 , and the baseline M obtained in the second step n By assigning a weight to each of the above, the baseline correction amount X used in the nth lot is calculated. n 7. The method according to item 6, wherein the above formula (I) is determined.

[0079] (Item 8) In the third step, the (n-1)th baseline correction amount X n-1 A weight (1-W) is assigned to the baseline M obtained in the second step. n By assigning a weight W to the n-th lot, the baseline correction amount X n 8. The method according to item 7, wherein the above formula (I) is determined.

[0080] (Item 9) The determination method according to any one of items 4, 5, 7 and 8, characterized in that the weight is determined based on the reliability of the detection results obtained by each of the first scope and the second scope.

[0081] (Item 10) The method of determining the weights described in any one of items 4, 5, 7, and 8, characterized in that the weights are determined based on the measurement repeatability of the first scope, the measurement repeatability of the second scope, and changes in the baseline over time.

[0082] (Item 11) 9. The method according to any one of items 4, 5, 7, and 8, wherein the weight is changed depending on the first number of times and the second number of times.

[0083] (Item 12) The reference baseline obtained in the first step and the baseline M obtained in the second step n a fourth step of determining whether the difference between the a fifth step of determining a new reference baseline from a first number of detection results obtained by the first scope and the second scope when the difference exceeds the allowable range; 12. The method according to any one of items 1 to 11, further comprising:

[0084] (Item 13) 13. The method according to any one of items 1 to 12, wherein the first number of times includes a plurality of times.

[0085] (Item 14) Item 14. The determination method according to item 13, wherein in the first step, the reference baseline is determined from an average value or a statistical value of the detection results of the first number of times.

[0086] (Item 15) 15. The method according to any one of items 1 to 14, wherein the second number of times includes one or more times.

[0087] (Item 16) 15. The method according to any one of items 1 to 14, wherein the second number of times includes a plurality of times.

[0088] (Item 17) In the second step, the baseline M is calculated from the average or statistical value of the second detection results. n Item 17. The method for determining the above item 16, further comprising:

[0089] (Item 18) An information processing device, a processing unit that performs processing to determine a baseline correction amount of a baseline that represents a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer equal to or greater than 1), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n Get The reference baseline and the baseline M n and the amount of baseline correction X to be used in the n-th lot based on n Determine 1. An information processing device comprising:

[0090] (Item 19) An information processing device, a processing unit that performs processing to determine a baseline correction amount of a baseline that represents a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n Get The reference baseline and the baselines M1 to M2 of each lot up to the (n-1)th lot determined from the second detection results by the first scope and the second scope n-1 The baseline correction amount X for the (n-1)th lot determined based on n-1 and the baseline M n and the amount of baseline correction X to be used in the nth lot based on n Determine 1. An information processing device comprising:

[0091] (Item 20) An exposure apparatus that exposes a substrate through an original, a projection optical system that projects light from the original onto the substrate; a first scope for detecting a mark via the projection optical system; a second scope for detecting the mark without using the projection optical system; a processing unit that performs processing to determine a baseline correction amount of a baseline that represents the distance between the optical axis of the first scope and the optical axis of the second scope; and The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer equal to or greater than 1), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n Get The reference baseline and the baseline M n and the amount of baseline correction X to be used in the n-th lot based on n Determine An exposure apparatus characterized by:

[0092] (Item 21) An exposure apparatus that exposes a substrate through an original, a projection optical system that projects light from the original onto the substrate; a first scope for detecting a mark via the projection optical system; a second scope for detecting the mark without using the projection optical system; a processing unit that performs processing to determine a baseline correction amount of a baseline that represents the distance between the optical axis of the first scope and the optical axis of the second scope; and The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n Get The reference baseline and the baselines M1 to M2 of each lot up to the (n-1)th lot determined from the second detection results by the first scope and the second scope n-1 The baseline correction amount X for the (n-1)th lot determined based on n-1 and the baseline M n and the amount of baseline correction X to be used in the nth lot based on n Determine An exposure apparatus characterized by:

[0093] (Item 22) An exposure method for exposing a substrate through an original, comprising: determining a baseline correction amount of a baseline that represents a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from the original onto the substrate, and an optical axis of a second scope that detects the mark without via the projection optical system; exposing the substrate by correcting the baseline fluctuation amount using the baseline correction amount determined in the determining step; and The determining step includes: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer equal to or greater than 1), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n a second step of obtaining The reference baseline obtained in the first step and the baseline M obtained in the second step n and the amount of baseline correction X to be used in the n-th lot based on n and a third step of determining Including, An exposure method characterized by:

[0094] (Item 23) An exposure method for exposing a substrate through an original, comprising: determining a baseline correction amount of a baseline that represents a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from the original onto the substrate, and an optical axis of a second scope that detects the mark without via the projection optical system; exposing the substrate by correcting the baseline fluctuation amount using the baseline correction amount determined in the determining step; and The determining step includes: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. n a second step of obtaining The reference baseline acquired in the first step and the baselines M1 to M2 of each lot up to the (n-1)th lot acquired from the second detection results by the first scope and the second scope n-1 The baseline correction amount X for the (n-1)th lot determined based on n-1 and the baseline M obtained in the second step. n and the amount of baseline correction X to be used in the nth lot based on n and a third step of determining Including, An exposure method characterized by:

[0095] (Item 24) Item 20 or 21, exposing a substrate using the exposure apparatus; developing the exposed substrate; manufacturing an article from the developed substrate; A method for manufacturing an article, comprising:

[0096] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0097] 100: exposure device 2: alignment scope 3: original 4: projection optical system 8: substrate 11: control unit 12: off-axis scope

Claims

1. 1. A method for determining a baseline correction amount of a baseline representing a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, comprising: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer of 1 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ a second step of obtaining The reference baseline acquired in the first step and the baseline M acquired in the second step ｎ Based on this, the baseline correction amount X to be used in the n-th lot is calculated. ｎ a third step of determining A method for determining whether a parameter is a parameter that is a function of a parameter.

2. 1. A method for determining a baseline correction amount of a baseline representing a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, comprising: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ a second step of obtaining The reference baseline acquired in the first step and the (n-1)th baselines M of each lot acquired from the second detection results by the first scope and the second scope １ ~M ｎ－１ The baseline correction amount X of the (n-1)th lot determined based on ｎ－１ and the baseline M obtained in the second step. ｎ Based on this, the baseline correction amount X to be used in the nth lot is ｎ a third step of determining A method for determining whether a parameter is a parameter that is a function of a parameter.

3. In the third step, the reference baseline acquired in the first step and the baseline M acquired in the second step are ｎ By combining these, the baseline correction amount X used in the n-th lot is ｎ 2. The method of claim 1, further comprising: determining:

4. In the third step, the reference baseline acquired in the first step and the baseline M acquired in the second step are ｎ By assigning a weight to each of the above, the baseline correction amount X used in the n-th lot is calculated. ｎ 4. The method according to claim 3, further comprising determining:

5. In the third step, a weight (1-W) is assigned to the reference baseline acquired in the first step, and the baseline M acquired in the second step is ｎ By assigning a weight W to the n-th lot, the baseline correction amount X ｎ 5. The method according to claim 4, further comprising determining:

6. In the third step, the (n-1)th baseline correction amount X ｎ－１ and the baseline M obtained in the second step. ｎ By combining these, the baseline correction amount X used in the n-th lot is ｎ 3. The method according to claim 2, further comprising determining:

7. In the third step, the (n-1)th baseline correction amount X ｎ－１ , and the baseline M obtained in the second step ｎ By assigning a weight to each of the above, the baseline correction amount X used in the n-th lot is calculated. ｎ 7. The method of claim 6, further comprising determining:

8. In the third step, the (n-1)th baseline correction amount X ｎ－１ and assign a weight (1-W) to the baseline M obtained in the second step. ｎ By assigning a weight W to the n-th lot, the baseline correction amount X ｎ 8. The method of claim 7, further comprising determining:

9. 8. The method according to claim 4, wherein the weight is determined based on the reliability of the detection results obtained by the first scope and the second scope.

10. 8. The determination method according to claim 4, wherein the weight is determined based on the measurement repeatability of the first scope, the measurement repeatability of the second scope, and a change in the baseline over time.

11. 8. The method according to claim 4, wherein the weight is changed depending on the first number of times and the second number of times.

12. The reference baseline acquired in the first step and the baseline M acquired in the second step ｎ a fourth step of determining whether the difference between the a fifth step of determining a new reference baseline from a first number of detection results obtained by the first scope and the second scope when the difference exceeds the allowable range; 3. The method according to claim 1, further comprising:

13. The method according to claim 1 or 2, wherein the first number of times includes a plurality of times.

14. 14. The method according to claim 13, wherein in the first step, the reference baseline is determined from an average value or a statistical value of the first number of detection results.

15. The method according to claim 1 or 2, wherein the second number of times includes one or more times.

16. The method according to claim 1 or 2, wherein the second number of times includes a plurality of times.

17. In the second step, the baseline M is calculated from the average or statistical value of the second detection results. ｎ 17. The method of claim 16, further comprising determining:

18. An information processing device, a processing unit that performs processing to determine a baseline correction amount of a baseline that represents a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer of 1 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ Get The reference baseline and the baseline M ｎ Based on this, the baseline correction amount X to be used in the n-th lot is calculated. ｎ Determine 1. An information processing device comprising:

19. An information processing device, a processing unit that performs processing to determine a baseline correction amount of a baseline that represents a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from an original onto a substrate, and an optical axis of a second scope that detects the mark without via the projection optical system, The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ Get The reference baseline and the baselines M of the first to (n-1)th lots obtained from the second detection results by the first scope and the second scope １ ~M ｎ－１ The baseline correction amount X of the (n-1)th lot determined based on ｎ－１ and the baseline M ｎ Based on this, the baseline correction amount X to be used in the nth lot is ｎ Determine 1. An information processing device comprising:

20. An exposure apparatus that exposes a substrate through an original, a projection optical system that projects light from the original onto the substrate; a first scope for detecting a mark via the projection optical system; a second scope for detecting the mark without passing through the projection optical system; a processing unit that performs processing to determine a baseline correction amount of a baseline that represents a distance between an optical axis of the first scope and an optical axis of the second scope; and The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer of 1 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ Get The reference baseline and the baseline M ｎ Based on this, the baseline correction amount X to be used in the n-th lot is calculated. ｎ Determine An exposure apparatus characterized by:

21. An exposure apparatus that exposes a substrate through an original, a projection optical system that projects light from the original onto the substrate; a first scope for detecting a mark via the projection optical system; a second scope for detecting the mark without passing through the projection optical system; a processing unit that performs processing to determine a baseline correction amount of a baseline that represents a distance between an optical axis of the first scope and an optical axis of the second scope; and The processing unit obtaining a reference baseline from a first number of detection results by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ Get The reference baseline and the baselines M of the first to (n-1)th lots obtained from the second detection results by the first scope and the second scope １ ~M ｎ－１ The baseline correction amount X of the (n-1)th lot determined based on ｎ－１ and the baseline M ｎ Based on this, the baseline correction amount X to be used in the nth lot is ｎ Determine An exposure apparatus characterized by:

22. An exposure method for exposing a substrate through an original, comprising: determining a baseline correction amount of a baseline representing a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from the original onto the substrate, and an optical axis of a second scope that detects the mark without via the projection optical system; exposing the substrate by correcting the baseline fluctuation amount using the baseline correction amount determined in the determining step; and The determining step includes: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer of 1 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ a second step of obtaining The reference baseline acquired in the first step and the baseline M acquired in the second step ｎ Based on this, the baseline correction amount X to be used in the n-th lot is calculated. ｎ a third step of determining Including, An exposure method characterized by:

23. An exposure method for exposing a substrate through an original, comprising: determining a baseline correction amount of a baseline representing a distance between an optical axis of a first scope that detects a mark via a projection optical system that projects light from the original onto the substrate, and an optical axis of a second scope that detects the mark without via the projection optical system; exposing the substrate by correcting the baseline fluctuation amount using the baseline correction amount determined in the determining step; and The determining step includes: a first step of acquiring a reference baseline from detection results of a first number of times by the first scope and the second scope; For the n-th lot (n is an integer of 2 or more), a baseline M is calculated from the detection results of a second number of times, which is less than the first number of times, by the first scope and the second scope. ｎ a second step of obtaining The reference baseline acquired in the first step and the (n-1)th baselines M of each lot acquired from the second detection results by the first scope and the second scope １ ~M ｎ－１ The baseline correction amount X of the (n-1)th lot determined based on ｎ－１ and the baseline M obtained in the second step. ｎ Based on this, the baseline correction amount X to be used in the nth lot is ｎ a third step of determining Including, An exposure method characterized by:

24. exposing a substrate using the exposure apparatus according to claim 20 or 21; developing the exposed substrate; manufacturing an article from the developed substrate; A method for manufacturing an article, comprising:

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